Non-evaporative getter coated component, non-evaporative getter coated container, method for manufacturing the same, and manufacturing apparatus.

Abstract

To suppress the decline in exhaust performance. [Solution] The non-evaporative getter coated component 100 includes a non-evaporative getter material layer 102 and a noble metal layer 103 formed on top of the non-evaporative getter material layer 102, and includes a barrier layer 104 between the substrate 101 and the non-evaporative getter material layer 102. The non-evaporative getter material layer 102 is, for example, a Ti layer. The noble metal layer 103 is, for example, a Pd layer. The barrier layer 104 is a film of either an oxide film 104a of the non-evaporative getter material or a nitride film 104b of the non-evaporative getter material. The oxide film 104a of the non-evaporative getter material is, for example, a TiO2 layer. The nitride film 104b of the evaporative getter material is, for example, a TiN layer.

Description

Technical Field

[0001] The present invention relates to a non-evaporable getter coating component, a non-evaporable getter coating container, a manufacturing method thereof, and a manufacturing apparatus.

Background Art

[0002] An ultra-high vacuum environment is an essential technology for the development and manufacturing of devices such as semiconductor manufacturing equipment, ultra-fine analysis instruments, and particle accelerators. The ultra-high vacuum environment is realized by combining multiple vacuum pumps. For example, in order to generate an ultra-high vacuum, a non-evaporable getter (NEG) pump that exhausts using a getter action may be used. When the getter action reaches saturation, the NEG material is heated to restore the getter action.

[0003] As prior art, for example, there are non-evaporable getter coating components and containers including a non-evaporable getter material layer in which the total amount of occluded carbon atoms, nitrogen atoms, and oxygen atoms is 20 mol% or less, and / or a noble metal layer in which the total amount of occluded carbon atoms, nitrogen atoms, and oxygen atoms is 20 mol% or less (see Patent Document 1 below).

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0005] However, in the prior art, there is a problem that when heating for restoring the getter action is repeated, the exhaust performance of the non-evaporable getter pump deteriorates due to diffusion of contaminants remaining on the base material.

[0006] In one aspect, the present invention aims to provide a non-evaporative getter coating component that suppresses a decrease in exhaust performance, a method for manufacturing a non-evaporative getter coating component, an apparatus for manufacturing a non-evaporative getter coating component, a non-evaporative getter coating container, a method for manufacturing a non-evaporative getter coating container, and an apparatus for manufacturing a non-evaporative getter coating container. [Means for solving the problem]

[0007] To solve the above-mentioned problems and achieve the objective, the non-evaporative getter coating component according to this invention is a non-evaporative getter coating component comprising a non-evaporative getter material layer and a noble metal layer formed on top of the non-evaporative getter material layer, characterized in that a film of either an oxide film of the non-evaporative getter material or a nitride film of the non-evaporative getter material is included between the substrate and the non-evaporative getter material layer.

[0008] Furthermore, the non-evaporative getter coating component according to the present invention is characterized in that it comprises at least a first layer of any of the films formed on top of the substrate, a second layer of the non-evaporative getter material formed on top of the first layer, and a third layer of noble metal formed on the second layer.

[0009] Furthermore, the non-evaporative getter coating component according to the present invention is characterized in that it comprises at least a first layer of the non-evaporative getter material formed on top of the substrate, a second layer of either an oxide film or a nitride film formed on the surface of the first layer, a third layer of the non-evaporative getter material formed on top of the second layer, and a fourth layer of a noble metal formed on the third layer.

[0010] Furthermore, the non-evaporative getter coating component according to the present invention is characterized in that it comprises at least: a first layer of the non-evaporative getter material formed on top of the substrate; a second layer of either an oxide film or a nitride film formed on the surface of the first layer; a third layer of noble metal formed on top of the second layer; a fourth layer of the non-evaporative getter material formed on top of the third layer; and a fifth layer of noble metal formed on the fourth layer.

[0011] Furthermore, the non-evaporating getter coating component according to this invention is characterized in that, in the above invention, the noble metal is a platinum group element.

[0012] Furthermore, the non-evaporating getter coating component according to this invention is characterized in that, in the above invention, the platinum group element is palladium.

[0013] Furthermore, the non-evaporative getter coating component according to this invention is characterized in that, in the above invention, the thickness of the oxide film is 10 nm or more.

[0014] Furthermore, the non-evaporative getter coating container according to this invention is a non-evaporative getter coating container that includes a non-evaporative getter material layer on the inner surface of a vacuum container and a noble metal layer formed on top of the non-evaporative getter material layer, characterized in that a film of either an oxide film of the non-evaporative getter material or a nitride film of the non-evaporative getter material is included between the inner surface of the vacuum container and the non-evaporative getter material layer.

[0015] Furthermore, the method for manufacturing a non-evaporative getter coated component according to this invention is a method for manufacturing a non-evaporative getter coated component comprising a non-evaporative getter material layer and a noble metal layer formed on top of the non-evaporative getter material layer, characterized in that it includes a step of forming a film of either an oxide film of the non-evaporative getter material or a nitride film of the non-evaporative getter material between a substrate and the non-evaporative getter material layer in a vacuum state.

[0016] Furthermore, the method for manufacturing non-evaporative getter coating components according to this invention is as follows: -3 A first step of forming a first layer of an oxide or nitride film of the non-evaporative getter material on the surface of the substrate by oxidizing or nitriding the non-evaporative getter material attached to the surface of the substrate in a vacuum state of Pa or less, and 10 -6 A second step is to form a second layer of the non-evaporative getter material on the first layer by depositing the non-evaporative getter material onto the first layer formed in the first step under a vacuum of Pa or less, and 10 -6 The method is characterized by comprising a third step of forming a third layer of the noble metal on the second layer by depositing the noble metal onto the second layer formed in the second step under a vacuum of Pa or less.

[0017] Furthermore, the method for manufacturing non-evaporative getter coating components according to this invention is as follows: -3 A first step is to form a first layer of the non-evaporative getter material on the surface of the substrate by adhering the non-evaporative getter material to the surface of the substrate in a vacuum state of Pa or less, and 10 -3 A second step involves oxidizing or nitriding the surface layer of the first layer formed in the first step under a vacuum of Pa or less, thereby forming a second layer of oxide or nitride film of the non-evaporative getter material on the surface layer of the first layer, and 10 -6 A third step in which, under a vacuum of Pa or less, the non-evaporative getter material is attached to the second layer formed in the second step, thereby forming a third layer of the non-evaporative getter material on the second layer, and 10 -6 The method is characterized by including a fourth step of forming a fourth layer of the noble metal on the third layer by depositing the noble metal onto the third layer formed in the third step under a vacuum of Pa or less.

[0018] Furthermore, the method for manufacturing non-evaporative getter coating components according to this invention is as follows: -3A first step of forming a first layer of the non-evaporable getter material on the surface of the substrate by attaching the non-evaporable getter material to the surface of the substrate in a vacuum state of Pa or less; 10 -3 A second step of forming a second layer of an oxide film or a nitride film of the non-evaporable getter material on the surface layer of the first layer by oxidizing or nitriding the surface layer of the first layer formed in the first step in a vacuum state of Pa or less; 10 -3 A third step of forming a third layer of the noble metal on the second layer by attaching the noble metal to the second layer formed in the second step in a vacuum state of Pa or less; 10 -6 A fourth step of forming a fourth layer of the non-evaporable getter material on the third layer by attaching the non-evaporable getter material to the third layer formed in the third step in a vacuum state of Pa or less; 10 -6 A fifth step of forming a fifth layer of the noble metal on the fourth layer by attaching the noble metal to the fourth layer formed in the fourth step in a vacuum state of Pa or less, characterized by including the above steps.

[0019] Further, the method for manufacturing a non-evaporable getter coating component according to this invention is characterized in that, in the above invention, the noble metal is a platinum group element.

[0020] Further, the method for manufacturing a non-evaporable getter coating component according to this invention is characterized in that, in the above invention, the platinum group element is palladium.

[0021] Further, the method for manufacturing a non-evaporable getter coating component according to this invention is characterized in that, in the above invention, the film thickness of the oxide film is 10 nm or more.

[0022] Furthermore, the method for manufacturing a non-evaporative getter coated container according to this invention is a method for manufacturing a non-evaporative getter coated container that includes a non-evaporative getter material layer on the inner surface of a vacuum container and a noble metal layer formed on top of the non-evaporative getter material layer, characterized in that it includes a step of forming a film of either an oxide film of the non-evaporative getter material or a nitride film of the non-evaporative getter material between the inner surface of the vacuum container and the non-evaporative getter material layer in a vacuum state.

[0023] Furthermore, the apparatus for manufacturing non-evaporative getter-coated parts according to this invention comprises a substrate, a first deposition source having a non-evaporative getter material filament, a second deposition source having a noble metal filament, and a current terminal, wherein the first and second deposition sources can be switched and used while maintaining a vacuum state inside the apparatus, and the other deposition source can be retracted while one deposition source is in use so that material from the first deposition source does not adhere to the filament of the other deposition source.

[0024] Furthermore, the apparatus for manufacturing a non-evaporative getter-coated container according to this invention comprises a vacuum vessel, a first deposition source having a non-evaporative getter material filament, a second deposition source having a noble metal filament, and a current terminal, wherein the first and second deposition sources can be switched and used while maintaining a vacuum state inside the apparatus, and the other deposition source can be retracted while one deposition source is in use so that material from the first deposition source does not adhere to the filament of the other deposition source. [Effects of the Invention]

[0025] According to one aspect of the present invention, it has the effect of suppressing the deterioration of exhaust performance. [Brief explanation of the drawing]

[0026] [Figure 1] Figure 1 is an explanatory diagram showing a non-evaporative getter coating component according to an embodiment. [Figure 2]Figure 2 is an explanatory diagram showing the condition of a conventional non-evaporative getter pump after repeated use. [Figure 3] Figure 3 is an explanatory diagram showing a first embodiment of a non-evaporative getter-coated component. [Figure 4] Figure 4 is an explanatory diagram showing a second embodiment of a non-evaporative getter-coated component. [Figure 5] Figure 5 is an explanatory diagram showing a third embodiment of a non-evaporative getter-coated component. [Figure 6] Figure 6 is an external view showing an example of a vapor deposition apparatus. [Figure 7] Figure 7 is a cross-sectional view (part 1) showing an example of a vapor deposition apparatus. [Figure 8] Figure 8 is a cross-sectional view (part 2) showing an example of a vapor deposition apparatus. [Figure 9] Figure 9 is an explanatory diagram showing an example of the configuration of a vapor deposition source device. [Figure 10] Figure 10 is an explanatory diagram showing a first method for manufacturing a non-evaporative getter-coated component. [Figure 11] Figure 11 is an explanatory diagram showing a second method for manufacturing a non-evaporative getter-coated component. [Figure 12A] Figure 12A is an explanatory diagram (part 1) showing a third method for manufacturing non-evaporative getter-coated components. [Figure 12B] Figure 12B is an explanatory diagram (part 2) showing a third method for manufacturing non-evaporative getter-coated components. [Figure 13A] Figure 13A is an explanatory diagram (part 1) showing a fourth method for manufacturing non-evaporative getter-coated components. [Figure 13B] Figure 13B is an explanatory diagram (part 2) showing a fourth method for manufacturing non-evaporative getter-coated components. [Figure 14] Figure 14 is an external view showing an example of an NEG pump. [Figure 15] Figure 15 is an external view showing an example of a blank flange. [Figure 16] Figure 16 is an external view showing an example of an NEG bellows. [Figure 17] Figure 17 is an explanatory diagram showing an example of the cross-sectional shape of a non-evaporative getter coating component. [Figure 18] Figure 18 is a flowchart showing an example of the manufacturing procedure for non-evaporative getter coated parts. [Figure 19] Figure 19 is an explanatory diagram showing an example of power changes in a vapor deposition apparatus. [Figure 20] Figure 20 is an explanatory diagram showing an example of pressure changes in a vapor deposition apparatus. [Figure 21] Figure 21 is a flowchart showing an example of the procedure for using the non-evaporative getter-coated component 100. [Figure 22] Figure 22 is a cross-sectional view showing an example of another deposition apparatus. [Figure 23] Figure 23 is an explanatory diagram showing another example configuration of the evaporation source device. [Figure 24] Figure 24 is an explanatory diagram showing an example of filament arrangement. [Modes for carrying out the invention]

[0027] Embodiments of the non-evaporative getter-coated component, non-evaporative getter-coated container, manufacturing method thereof, and manufacturing apparatus according to the present invention will be described in detail below with reference to the drawings.

[0028] (Embodiment) Figure 1 is an explanatory diagram showing a non-evaporative getter coated component according to an embodiment. In Figure 1, the non-evaporative getter coated component 100 is a component that forms a non-evaporative getter (NEG) pump. The non-evaporative getter coated component 100 is, for example, a flange, bellows, or piping, and is used as part of an ultra-high vacuum system.

[0029] To evacuate the gas from inside the container and reduce the pressure, several types of vacuum pumps are used depending on the pressure. For example, 10 -5To create pressure conditions below Pa, ultra-high vacuum pumps are used. Non-evaporative getter pumps are a type of ultra-high vacuum pump and are classified as reservoir pumps.

[0030] In non-evaporative getter pumps, as gas accumulates in the getter material, the pumping speed gradually decreases, eventually making it impossible to pump gas. After prolonged use, the getter material can be heated to release the absorbed gas, then pumped out using another ultra-high vacuum pump. Cooling the pump reactivates it, allowing it to pump gas again.

[0031] Conventionally, there are non-evaporative getter pumps in which a Ti (titanium) layer and a Pd (palladium) layer are laminated on the surface of a substrate (see, for example, Patent Document 1). Ti is one of the non-evaporative getter materials. In this non-evaporative getter pump, for example, CO is adsorbed on the surface of the Pd layer, and hydrogen atoms generated by the dissociation of hydrogen molecules on the Pd surface diffuse through the Pd layer and accumulate in the Ti layer. Furthermore, when heated, hydrogen and CO are released into the vacuum, so after exhausting with another ultra-high vacuum pump, the gas is exhausted again when cooled to room temperature.

[0032] However, conventional non-evaporative getter pumps have a problem in that their exhaust performance deteriorates when heating is repeated. For example, repeated heating causes contaminants remaining on the substrate (e.g., carbon atoms derived from cutting oil) to diffuse into the getter material, or the surface shape to flatten, resulting in a decrease in the exhaust performance of the non-evaporative getter pump.

[0033] Here, using Figure 2, we will explain the condition of a conventional non-evaporative getter pump after repeated use.

[0034] Figure 2 is an explanatory diagram showing the state of a conventional non-evaporative getter pump after repeated use. In Figure 2, the NEG pump 200 is a non-evaporative getter pump in which a Ti layer 202 and a Pd layer 203 are laminated on the surface of a substrate 201.

[0035] In the initial cross-sectional state, the NEG pump 200 does not have any contaminants remaining on the surface of the substrate 201 diffused into the Ti layer 202. Also, in the initial surface state, the surface of the NEG pump 200 has an uneven shape, resulting in a larger surface area compared to a flat shape.

[0036] In contrast, if the NEG pump 200 is used repeatedly (for example, dozens of times), contaminants remaining on the surface of the substrate 201 diffuse into the Ti layer 202, hindering the exhaust function and reducing the exhaust performance of the NEG pump 200 (abnormal cross-sectional state). Furthermore, heating causes the titanium in the Ti layer 202 to diffuse and change shape, which in turn flattens the surface shape of the Pd layer 203. As a result, the surface area of ​​the portion exposed to the space decreases, reducing the exhaust performance of the NEG pump 200 (abnormal surface state).

[0037] Therefore, in this embodiment, the non-evaporative getter coating component 100 includes a non-evaporative getter material layer 102 and a noble metal layer 103 formed on top of the non-evaporative getter material layer 102, and includes a barrier layer 104 between the substrate 101 and the non-evaporative getter material layer 102 to prevent the diffusion of contaminants, thereby suppressing a decrease in exhaust performance when used repeatedly.

[0038] Here, the base material 101 is the material that forms the basis of the non-evaporative getter-coated part 100, and is, for example, stainless steel, aluminum alloy, or silicon. Stainless steel is useful as a material for ultra-high vacuum applications because it has high corrosion resistance, pitting corrosion resistance, and strength, as well as excellent workability and weldability, and is inexpensive.

[0039] The non-evaporative getter material layer 102 is a layer of non-evaporative getter material. Examples of non-evaporative getter materials include titanium (Ti), zirconium (Zr), vanadium (V), hafnium (Hf), niobium (Nb), and tantalum (Ta). Specifically, for example, the non-evaporative getter material layer 102 may be a layer of titanium (Ti). Titanium is chemically highly reactive and readily reacts with gases. Titanium has superior gas release characteristics when heated compared to other metals, making it useful as a material for ultra-high vacuum applications.

[0040] The precious metal layer 103 is a layer of precious metals. The precious metals are one of the following: gold (Au), silver (Ag), platinum (Pt), palladium (Pd), rhodium (Rh), iridium (Ir), ruthenium (Ru), or osmium (Os).

[0041] For example, the precious metal layer 103 may be a layer of platinum group elements. Platinum group elements are any of platinum (Pt), palladium (Pd), rhodium (Rh), iridium (Ir), ruthenium (Ru), or osmium (Os). Specifically, for example, the precious metal layer 103 may be a layer of palladium (Pd).

[0042] Palladium has the property of adsorbing molecules such as CO while preventing the diffusion of atoms other than hydrogen atoms. Therefore, the non-evaporative getter material layer 102 can be prevented from being oxidized by gases in the atmosphere (e.g., H2O). Hydrogen atoms generated by the dissociation of hydrogen molecules on the Pd surface diffuse through the noble metal layer 103 (Pd layer) and accumulate in the non-evaporative getter material layer 102.

[0043] The barrier layer 104 is either an oxide film 104a of the non-evaporative getter material or a nitride film 104b of the non-evaporative getter material. The materials of the oxide film 104a and nitride film 104b of the non-evaporative getter material are, for example, the same as those of the non-evaporative getter material layer 102. The barrier layer 104 is formed between the substrate 101 and the non-evaporative getter material layer 102 under vacuum conditions when manufacturing the non-evaporative getter coated part 100. The thickness of the barrier layer 104 is, for example, 10 nm or more.

[0044] Here, when the non-evaporative getter material is oxidized or nitrided, its heat resistance increases and its atoms become less likely to diffuse. The oxide film 104a of the non-evaporative getter material may be a titanium oxide (TiO2) layer. The nitride film 104b of the evaporative getter material may be a titanium nitride (TiN) layer. Titanium oxide and titanium nitride have a dense structure and can maintain their shape relatively well even when exposed to high temperatures. In addition, since titanium oxide and titanium nitride do not have the ability to adsorb gas molecules, they have the property of being less likely to cause the diffusion of contaminants.

[0045] Thus, with the non-evaporative getter coating component 100, the barrier layer 104 prevents contaminants remaining on the surface of the substrate 101 from diffusing into the non-evaporative getter material layer 102. Furthermore, with the non-evaporative getter coating component 100, the barrier layer 104 prevents the shape of the non-evaporative getter material layer 102 from changing even when heated, thereby preventing the surface shape of the precious metal layer 103 from becoming flattened. As a result, even with repeated use of the non-evaporative getter coating component 100, the deterioration of exhaust performance can be suppressed.

[0046] Although this description uses a non-evaporative getter-coated component 100 as an example, this embodiment is also applicable to non-evaporative getter-coated containers. A non-evaporative getter-coated container is a component that serves as a non-evaporative getter (NEG) pump and has internal volume; for example, it can be used as part of an ultra-high vacuum system.

[0047] The non-evaporative getter coated container according to this embodiment includes a non-evaporative getter material layer (for example, corresponding to non-evaporative getter material layer 102) on the inner surface of the vacuum container and a noble metal layer (for example, corresponding to noble metal layer 103) formed on top of the non-evaporative getter material layer. Furthermore, the non-evaporative getter coated container according to this embodiment includes a barrier layer (for example, corresponding to barrier layer 104) between the inner surface of the vacuum container and the non-evaporative getter material layer. The barrier layer is formed between the inner surface of the vacuum container and the non-evaporative getter material layer under vacuum conditions when manufacturing the non-evaporative getter coated container.

[0048] In the following explanation, unless otherwise specified, a non-evaporative getter coated component 100 will be used as an example. Furthermore, the non-evaporative getter material will be defined as "titanium (Ti)" and the noble metal as "palladium (Pd)". Additionally, a "titanium (Ti) oxide film" will be used as an example for the barrier layer 104.

[0049] (Examples) Next, an example of the non-evaporative getter-coated component 100 will be described. First, using Figure 3, the case in which the non-evaporative getter-coated component 100 has a three-layer film structure will be described.

[0050] Figure 3 is an explanatory diagram showing a first embodiment of a non-evaporative getter coated component. In Figure 3, the non-evaporative getter coated component 300 is an embodiment of the non-evaporative getter coated component 100. The non-evaporative getter coated component 300 includes a substrate 301, a TiO2 layer 302 (first layer) formed on the surface of the substrate 301, a Ti layer 303 (second layer) formed on the TiO2 layer 302, and a Pd layer 304 (third layer) formed on the Ti layer 303.

[0051] The base material 301 is the material that forms the basis of the non-evaporative getter-coated component 300. The base material 301 corresponds to the base material 101 shown in Figure 1. The TiO2 layer 302 is a titanium (Ti) oxide film that serves as a barrier layer. The TiO2 layer 302 corresponds to the barrier layer 104 shown in Figure 1. When titanium (Ti) is oxidized, its heat resistance increases and its molecules become less likely to diffuse.

[0052] The TiO2 layer 302 can maintain its shape even when exposed to high temperatures (for example, around 150°C), and because it does not have the ability to adsorb gas molecules, it has the property of preventing the diffusion of contaminants. The Ti layer 303 is a titanium (Ti) layer. The Ti layer 303 corresponds to the non-evaporative getter material layer 102 shown in Figure 1.

[0053] The Pd layer 304 is a layer of palladium (Pd). The Pd layer 304 has the property of not allowing atoms other than hydrogen to diffuse. Therefore, the Ti layer 303 can be prevented from being oxidized by gases in the atmosphere (e.g., H2O). Hydrogen atoms diffuse through the Pd layer 304 and accumulate in the Ti layer 303. The Pd layer 304 corresponds to the noble metal layer 103 shown in Figure 1.

[0054] In the non-evaporative getter coating component 300, by providing a TiO2 layer 302 between the substrate 301 and the Ti layer 303, it is possible to suppress the diffusion of contaminants remaining on the surface of the substrate 301 into the Ti layer 303 even after repeated heating. Furthermore, by providing a TiO2 layer 302 that can maintain its shape even when exposed to high temperatures, the shape of the Ti layer 303 does not change, thereby suppressing the flattening of the surface shape of the Pd layer 304 and the reduction of its surface area. As a result, the performance degradation of the non-evaporative getter coating component 300 after reactivation can be suppressed.

[0055] In this description, the TiO2 layer 302 (first layer) is formed on the surface of the substrate 301, but this is not limited to this configuration. For example, the TiO2 layer 302 may be formed above the substrate 301, and another film (intervening layer) may exist between the substrate 301 and the TiO2 layer 302.

[0056] Furthermore, although the Ti layer 303 (second layer) is formed on the TiO2 layer 302 (first layer), it is not limited to this. For example, the Ti layer 303 only needs to be formed above the TiO2 layer 302, and another film (intervening layer) may exist between the TiO2 layer 302 and the Ti layer 303.

[0057] Furthermore, while a TiO2 layer 302 is used as a barrier layer here, this is not the only option. For example, a TiN layer may be used instead of the TiO2 layer 302. The TiN layer is a titanium (Ti) nitride film.

[0058] Furthermore, while a TiO2 layer 302 is used as the barrier layer here, this is not the only option. For example, a Pd layer may be used instead of the TiO2 layer 302.

[0059] Furthermore, in the case of non-evaporative getter-coated containers, forming a three-layer film structure similar to that of the non-evaporative getter-coated component 300 on the inner surface of the vacuum container can prevent the diffusion of contaminants and flattening of the surface shape, thereby suppressing performance degradation after reactivation.

[0060] Next, using Figure 4, we will explain the case where the non-evaporative getter coating component 100 has a four-layer film structure.

[0061] Figure 4 is an explanatory diagram showing a second embodiment of a non-evaporative getter coated component. In Figure 4, the non-evaporative getter coated component 400 is an embodiment of the non-evaporative getter coated component 100. The non-evaporative getter coated component 400 includes a substrate 401, a Ti layer 402 (first layer) formed on the surface of the substrate 401, a TiO2 layer 403 (second layer) formed on the surface of the Ti layer 402, a Ti layer 404 (third layer) formed on the TiO2 layer 403, and a Pd layer 405 (fourth layer) formed on the Ti layer 404.

[0062] The substrate 401 is the base material for the non-evaporative getter-coated component 400. The substrate 401 corresponds to the substrate 101 shown in Figure 1. The Ti layer 402 is a titanium (Ti) layer. The TiO2 layer 403 is a titanium (Ti) oxide film that serves as a barrier layer. The TiO2 layer 403 corresponds to the barrier layer 104 shown in Figure 1.

[0063] The Ti layer 404 is a titanium (Ti) layer. The Ti layer 404 corresponds to the non-evaporative getter material layer 102 shown in Figure 1. The Pd layer 405 is a palladium (Pd) layer. The Pd layer 405 corresponds to the noble metal layer 103 shown in Figure 1.

[0064] In the non-evaporative getter coating component 400, by providing a TiO2 layer 403 between the substrate 401 and the Ti layer 404, it is possible to suppress the diffusion of contaminants remaining on the surface of the substrate 401 into the Ti layer 404 even after repeated heating. Furthermore, by providing a TiO2 layer 403 that can maintain its shape even when exposed to high temperatures, the shape of the Ti layer 404 does not change, thereby suppressing the flattening of the surface shape of the Pd layer 405 and the reduction of its surface area. As a result, the performance degradation of the non-evaporative getter coating component 400 after reactivation can be suppressed.

[0065] In this description, the Ti layer 402 (first layer) is formed on the surface of the substrate 401, but this is not limited to this. For example, the Ti layer 402 may be formed above the substrate 401, and another film (intervening layer) may exist between the substrate 401 and the Ti layer 402.

[0066] Furthermore, although the Ti layer 404 (third layer) is formed on the TiO2 layer 403 (second layer), it is not limited to this. For example, the Ti layer 404 only needs to be formed above the TiO2 layer 403, and another film (intervening layer) may exist between the TiO2 layer 403 and the Ti layer 404.

[0067] Furthermore, while a TiO2 layer 403 is used as the barrier layer here, this is not the only option. For example, a TiN layer may be used instead of the TiO2 layer 403.

[0068] Furthermore, in the case of non-evaporative getter-coated containers, forming a four-layer film structure similar to that of the non-evaporative getter-coated component 400 on the inner surface of the vacuum container can prevent the diffusion of contaminants and flattening of the surface shape, thereby suppressing performance degradation after reactivation.

[0069] Next, using Figure 5, we will explain the case where the non-evaporative getter coating component 100 has a five-layer film structure.

[0070] Figure 5 is an explanatory diagram showing a third embodiment of a non-evaporative getter coated component. In Figure 5, the non-evaporative getter coated component 500 is an embodiment of the non-evaporative getter coated component 100. The non-evaporative getter coated component 500 includes a substrate 501, a Ti layer 502 (first layer) formed on the surface of the substrate 501, a TiO2 layer 503 (second layer) formed on the surface of the Ti layer 502, a Pd layer 504 (third layer) formed on the TiO2 layer 503, a Ti layer 505 (fourth layer) formed on the Pd layer 504, and a Pd layer 506 (fifth layer) formed on the Ti layer 505.

[0071] The substrate 501 is the base material for the non-evaporative getter-coated component 500. The substrate 501 corresponds to the substrate 101 shown in Figure 1. The Ti layer 502 is a titanium (Ti) layer. The TiO2 layer 503 is a titanium (Ti) oxide film that serves as a barrier layer. The TiO2 layer 503 corresponds to the barrier layer 104 shown in Figure 1.

[0072] The Pd layer 504 is a noble metal film of palladium (Pd) that serves as a barrier layer. The Ti layer 505 is a titanium (Ti) layer. The Ti layer 505 corresponds to the non-evaporating getter material layer 102 shown in Figure 1. The Pd layer 506 is a palladium (Pd) layer. The Pd layer 506 corresponds to the noble metal layer 103 shown in Figure 1.

[0073] In the non-evaporative getter coating component 500, by providing a TiO2 layer 503 and a Pd layer 504 between the substrate 501 and the Ti layer 505, it is possible to suppress the diffusion of contaminants remaining on the surface of the substrate 501 into the Ti layer 505 even after repeated heating. For example, compared to the four-layer film structure shown in Figure 4, the non-evaporative getter coating component 500 can further strengthen the barrier layer and suppress the diffusion of contaminants by further providing the Pd layer 504.

[0074] Furthermore, with the non-evaporative getter-coated component 500, by providing a TiO2 layer 503 that can maintain its shape even when exposed to high temperatures, the shape of the Ti layer 505 does not change, and the flattening of the surface shape of the Pd layer 506 and the reduction in surface area can be suppressed. This makes it possible to suppress the performance degradation of the non-evaporative getter-coated component 500 after reactivation.

[0075] In this description, the Ti layer 502 (first layer) is formed on the surface of the substrate 501, but this is not limited to this. For example, the Ti layer 502 may be formed above the substrate 501, and another film (intervening layer) may exist between the substrate 501 and the Ti layer 502.

[0076] Furthermore, although the Pd layer 504 (third layer) is formed on the TiO2 layer 503 (second layer), it is not limited to this. For example, the Pd layer 504 only needs to be formed above the TiO2 layer 503, and another film (intervening layer) may exist between the TiO2 layer 503 and the Pd layer 504.

[0077] Furthermore, although the Ti layer 505 (fourth layer) is formed on the Pd layer 504 (third layer), it is not limited to this. For example, the Ti layer 505 only needs to be formed above the Pd layer 504, and another film (intervening layer) may exist between the Pd layer 504 and the Ti layer 505.

[0078] Furthermore, while a TiO2 layer 503 is used as the barrier layer here, this is not the only option. For example, a TiN layer may be used instead of the TiO2 layer 503.

[0079] Furthermore, in the case of non-evaporative getter-coated containers, forming a five-layer film structure similar to that of the non-evaporative getter-coated component 500 on the inner surface of the vacuum container prevents the diffusion of contaminants and flattening of the surface shape, thereby suppressing performance degradation after reactivation.

[0080] (Example configuration of a manufacturing apparatus for non-evaporative getter-coated parts 100) Next, an example of the configuration of a manufacturing apparatus used for manufacturing non-evaporative getter-coated parts 100 will be described.

[0081] In manufacturing the non-evaporative getter-coated component 100, various methods for depositing materials (e.g., Ti, Pd) can be used, such as vapor deposition, sputtering, CVD (chemical vapor deposition), and MBE (molecular beam epitaxy).

[0082] The following explanation will use the vapor deposition method as an example of a method for depositing various materials. Compared to other methods, the vapor deposition method is expected to reduce manufacturing costs because the equipment configuration for maintaining an ultra-high vacuum state is simpler. As for the vapor deposition method, vacuum deposition (for example, vacuum deposition using resistance heating of a metal filament) which can reduce impurities such as oxygen is preferred. Specifically, for example, a non-evaporative getter coated part 100 can be manufactured using a vapor deposition apparatus 600 as shown in Figures 6 to 8.

[0083] Here, we will describe the vapor deposition apparatus 600 used in the manufacture of the non-evaporative getter-coated component 100. First, we will describe the appearance of the vapor deposition apparatus 600 using Figure 6.

[0084] Figure 6 is an external view showing an example of a vapor deposition apparatus. In Figure 6, the vapor deposition apparatus 600 has a vapor deposition chamber 601 and a lower chamber 602. The vapor deposition chamber 601 is a chamber for depositing various materials onto an object to be deposited and is located above the lower chamber 602. The object to be deposited is, for example, a non-evaporative getter coated part 100 before coating.

[0085] The deposition chamber 601 is a hexagonal tube with inlets and outlets on six sides. The upper tube of the deposition chamber 601 is fitted with a deposition source device 603 (first deposition source) and a deposition source device 604 (second deposition source). The two deposition source devices 603 and 604 have filaments made of different materials. An example configuration of the deposition source devices 603 and 604 will be described later with reference to Figure 9.

[0086] The tubes in the four directions of the deposition chamber 601, excluding the upper and lower tubes, can be fitted with objects to be deposited. In the example shown in Figure 6, samples 605a to 605d are fitted as objects to be deposited. Samples 605a to 605d correspond to non-evaporative getter-coated parts 100 before coating, such as an NEG pump and a blank flange. The lower tube of the deposition chamber 601 is connected to the lower chamber 602. The lower chamber 602 is provided with a vacuum gauge mounting section 606 and a vent port 607.

[0087] Next, a cross-section of the deposition apparatus 600 will be described using Figures 7 and 8.

[0088] Figures 7 and 8 are cross-sectional views showing an example of a vapor deposition apparatus. In Figure 7, a turbomolecular pump 701 is provided in the lower chamber 602 of the vapor deposition apparatus 600. The turbomolecular pump 701 is used, for example, to exhaust gas from inside the apparatus.

[0089] Furthermore, a BA vacuum gauge 702 is mounted on the vacuum gauge mounting section 606 of the lower chamber 602. The BA vacuum gauge 702 is a measuring instrument for measuring the pressure inside the device. A vent valve 703 is provided at the vent port 607 of the lower chamber 602. By opening the vent valve 703, gas (for example, air, oxygen gas, nitrogen gas, etc.) can be introduced into the device through the vent port 607.

[0090] The two evaporation source devices 603 and 604, mounted in the evaporation chamber 601, can be switched between and used while maintaining the vacuum state inside the evaporation apparatus 600. Furthermore, the two evaporation source devices 603 and 604 allow for the retraction of one evaporation source (e.g., evaporation source device 603) while the other evaporation source (e.g., evaporation source device 604) is in use, preventing material from one source from adhering to the filament of the other evaporation source.

[0091] In the example shown in Figure 8, the state when using the evaporation source device 603 is indicated. Here, by retracting the evaporation source device 604 upwards, material from the evaporation source device 603 is prevented from adhering to the filament of the evaporation source device 604 while the evaporation source device 603 is in use. The evaporation source device 604 (or evaporation source device 603) can be retracted by inserting and removing it, or by rotating it around the upper end of the evaporation source device 604 as a pivot point.

[0092] Here, we will explain an example configuration of the evaporation source devices 603 and 604 using Figure 9.

[0093] Figure 9 is an explanatory diagram showing an example configuration of a vapor deposition source device. In Figure 9, the vapor deposition source device 603 (or vapor deposition source device 604) has a filament 901, an electrode 902 (current terminal), and an insulating plate 903. The filament 901 is fixed to the vapor deposition source device 603 by a filament fixing device 904.

[0094] As a filament 901, for example, four windings of the material metal can be attached. For example, the deposition source device 603 (first deposition source) is equipped with a Ti filament 901, which is the material. The deposition source device 604 (second deposition source) is equipped with a Pd filament 901, which is the material.

[0095] The deposition apparatus 600 maintains a vacuum inside the apparatus and heats the deposition source device 603 (or deposition source device 604) located in the deposition chamber 601 to evaporate the material of the filament 901, thereby depositing the material onto the object to be deposited (for example, samples 605a to 605d).

[0096] Specifically, for example, the deposition apparatus 600 applies current to the filament 901 from the electrode 902 (current terminal) to deposit a metal (Ti, Pd, etc.). The filament current value is, for example, about 10A to 100A. Preferably, the filament current value is 20A to 60A. Alternatively, the deposition apparatus 600 may be equipped with a rotary introduction device and perform metal deposition while rotating the filament 901 at a constant speed along with the current introduction.

[0097] Furthermore, when manufacturing the non-evaporative getter-coated container according to this embodiment, the same manufacturing apparatus as the deposition apparatus 600 can be used. In the case of a non-evaporative getter-coated container, for example, a vacuum container with a shape like the deposition chamber 601 may be used as the non-evaporative getter-coated container before coating.

[0098] (Manufacturing method for non-evaporative getter-coated component 100) Next, a method for manufacturing the non-evaporative getter-coated component 100 will be described.

[0099] ·3-layer membrane structure First, using Figure 10, we will explain the manufacturing method when the non-evaporative getter coating component 100 has a three-layer film structure.

[0100] Figure 10 is an explanatory diagram showing a first method for manufacturing a non-evaporative getter-coated component. In Figure 10, (10-1)10 -3 The substrate 301 is shown under a vacuum of Pa or less. The substrate 301 is a cleaned substrate. However, even after cleaning, some contaminants that could not be completely removed may remain on the surface of the substrate 301.

[0101] (10-2)10 -3 A Ti layer 1001 is formed by depositing Ti (a non-evaporative getter material) onto the surface of the substrate 301 under a vacuum of less than Pa. The thickness of the Ti layer 1001 is, for example, about 10 nm to 100 nm. The vacuum state is 10 -5 It is more preferable that the value be less than or equal to Pa.

[0102] (10-3)10 -3 In a vacuum state of less than Pa, the Ti layer 1001 (Ti) is oxidized to form a TiO2 layer 302 (first layer) on the surface of the substrate 301 (first step). Oxidation is carried out, for example, by introducing a gas containing O2 (oxygen) (e.g., oxygen gas or air) and leaving it for a long period of time (e.g., half a day). The vacuum state is 10 -5 It is more preferable that the value be less than or equal to Pa.

[0103] Furthermore, if a TiN layer (Ti nitride film) is provided instead of the TiO2 layer 302 as the barrier layer, 10 -3 A TiN layer is formed on the surface of the substrate 301 by nitriding the Ti layer 1001 under a vacuum of less than Pa. Nitriding is carried out, for example, by introducing a gas containing N2 (nitrogen) (e.g., nitrogen gas) and leaving it for a long time. In this case as well, the vacuum state is 10 -5It is more preferable that the value be less than or equal to Pa.

[0104] (10-4)10 -6 In a vacuum state of less than Pa, Ti is deposited onto the formed TiO2 layer 302 to form a Ti layer 303 (second layer) on the TiO2 layer 302 (second step). The thickness of the Ti layer 303 is, for example, about 1 μm. The vacuum state is 10 -8 It is more preferable that the value be less than or equal to Pa.

[0105] (10-5)10 -6 In a vacuum state of less than Pa, a Pd (precious metal) layer is deposited onto the formed Ti layer 303 to form a Pd layer 304 (third layer) on the Ti layer 303 (third step). The thickness of the Pd layer 304 is, for example, about 10 nm to 1 μm. The vacuum state is 10 -8 It is more preferable that the value be less than or equal to Pa.

[0106] In this way, by forming multiple types of films on the substrate 301 while maintaining a vacuum, a non-evaporative getter-coated component 300 with a three-layer film structure can be manufactured.

[0107] In addition, the non-evaporative getter-coated container according to this embodiment can also be manufactured by forming a three-layer film structure on the inner surface of the vacuum container using the same manufacturing method as the non-evaporative getter-coated component 300. In the case of the non-evaporative getter-coated container, the vacuum container corresponds to the base material 301, and Ti (non-evaporative getter material) is deposited on the inner surface of the vacuum container. Even after cleaning, contaminants that cannot be completely removed may remain on the inside of the vacuum container.

[0108] ·4-layer membrane structure Next, using Figure 11, we will explain the manufacturing method when the non-evaporative getter coating component 100 has a four-layer film structure.

[0109] Figure 11 is an explanatory diagram showing a second method for manufacturing a non-evaporative getter-coated component. In Figure 11, (11-1)10 -3The substrate 401 is shown under a vacuum of Pa or less. The substrate 401 is a cleaned substrate. However, even after cleaning, contaminants may remain on the surface of the substrate 401.

[0110] (11-2)10 -3 In a vacuum state of Pa or less, a Ti layer 402 (first layer) is formed by depositing Ti (non-evaporative getter material) onto the surface of the substrate 401 (first step). The vacuum state is 10 -5 It is more preferable that the value be less than or equal to Pa.

[0111] (11-3)10 -3 In a vacuum state of less than Pa, the surface of the Ti layer 402 is oxidized to form a TiO2 layer 403 (second layer) on the surface of the Ti layer 402 (second step). The vacuum state is 10 -5 It is more preferable that the value be less than or equal to Pa.

[0112] Furthermore, if a TiN layer is provided instead of the TiO2 layer 403 as the barrier layer, 10 -3 In a vacuum state of less than Pa, the surface of the Ti layer 402 is nitrided to form a TiN layer on the surface of the Ti layer 402. In this case as well, the vacuum state is 10 -5 It is more preferable that the value be less than or equal to Pa.

[0113] (11-4)10 -6 In a vacuum state below Pa, Ti is deposited to form a Ti layer 404 (third layer) on the TiO2 layer 403 (third step). The vacuum state is 10 -8 It is more preferable that the value be less than or equal to Pa.

[0114] (11-5)10 -6 In a vacuum state of less than Pa, Pd (precious metal) is deposited onto the Ti layer 404 to form a Pd layer 405 (fourth layer) on the Ti layer 404 (fourth step). The vacuum state is 10 -8 It is more preferable that the value be less than or equal to Pa.

[0115] In this way, by forming multiple types of films on the substrate 401 while maintaining a vacuum, a non-evaporative getter-coated component 400 with a four-layer film structure can be manufactured.

[0116] In addition, the non-evaporative getter-coated container according to this embodiment can also be manufactured by forming a four-layer film structure on the inner surface of the vacuum container using the same manufacturing method as the non-evaporative getter-coated component 400. In the case of the non-evaporative getter-coated container, the vacuum container corresponds to the base material 401, and Ti (non-evaporative getter material) is deposited on the inner surface of the vacuum container.

[0117] ·5-layer membrane structure Next, a manufacturing method for the non-evaporative getter coating component 100 when it has a five-layer film structure will be described using Figures 12A and 12B.

[0118] Figures 12A and 12B are explanatory diagrams showing a third method for manufacturing non-evaporative getter coated components. In Figure 12A, (12-1)10 -3 The substrate 501 is shown under a vacuum of Pa or less. The substrate 501 is a cleaned substrate. However, even after cleaning, contaminants may remain on the surface of the substrate 501.

[0119] (12-2)10 -3 In a vacuum state of Pa or less, a Ti layer 502 (first layer) is formed by depositing Ti (non-evaporative getter material) onto the surface of the substrate 501 (first step). The vacuum state is 10 -5 It is more preferable that the value be less than or equal to Pa.

[0120] (12-3)10 -3 In a vacuum state of less than Pa, the surface of the Ti layer 502 is oxidized to form a TiO2 layer 503 (second layer) on the surface of the Ti layer 502 (second step). The vacuum state is 10 -5 It is more preferable that the value be less than or equal to Pa.

[0121] Furthermore, if a TiN layer is provided instead of the TiO2 layer 503 as the barrier layer, 10-3 In a vacuum state of less than Pa, the surface of the Ti layer 502 is nitrided to form a TiN layer on the surface of the Ti layer 502. In this case as well, the vacuum state is 10 -5 It is more preferable that the value be less than or equal to Pa.

[0122] In Figure 12B, (12-4)10 -3 In a vacuum state below Pa, a Pd (precious metal) layer 504 (third layer) is formed on the TiO2 layer 503 by depositing Pd (precious metal) (third step). The vacuum state is 10 -5 It is more preferable that the value be less than or equal to Pa.

[0123] (12-5)10 -6 In a vacuum state of less than Pa, Ti is deposited to form a Ti layer 505 (fourth layer) on the Pd layer 504 (fourth step). The vacuum state is 10 -8 It is more preferable that the value be less than or equal to Pa.

[0124] (12-6)10 -6 In a vacuum state of less than Pa, a Pd (precious metal) layer 506 (fifth layer) is formed on the Ti layer 505 by depositing Pd (fifth step). The vacuum state is 10 -8 It is more preferable that the value be less than or equal to Pa.

[0125] In this way, by forming multiple types of films on the substrate 501 while maintaining a vacuum, a non-evaporative getter-coated component 500 with a five-layer film structure can be manufactured.

[0126] In addition, the non-evaporative getter-coated container according to this embodiment can also be manufactured by forming a five-layer film structure on the inner surface of the vacuum container using the same manufacturing method as the non-evaporative getter-coated component 500. In the case of the non-evaporative getter-coated container, the vacuum container corresponds to the base material 501, and Ti (non-evaporative getter material) is deposited on the inner surface of the vacuum container.

[0127] ·8-layer membrane structure Next, a manufacturing method for the non-evaporative getter coating component 100 when it has an 8-layer film structure will be described using Figures 13A and 13B.

[0128] Figures 13A and 13B are explanatory diagrams showing a fourth method for manufacturing non-evaporative getter coated components. In Figure 13A, (13-1)10 -3 The substrate 1301 is shown under a vacuum of Pa or less. The substrate 1301 is a cleaned substrate. However, even after cleaning, contaminants may remain on the surface of the substrate 1301.

[0129] (13-2)10 -3 Under a vacuum of less than Pa, Ti (non-evaporative getter material) is deposited onto the surface of the substrate 1301 to form a Ti layer 1302 (first layer). The vacuum state is 10 -5 It is more preferable that the value be less than or equal to Pa.

[0130] (13-3)10 -3 In a vacuum state below Pa, the surface of the Ti layer 1302 is oxidized to form a TiO2 layer 1303 (second layer) on the surface of the Ti layer 1302. The vacuum state is 10 -5 It is more preferable that the value be less than or equal to Pa.

[0131] Furthermore, if a TiN layer is provided instead of the TiO2 layer 1303 as the barrier layer, 10 -3 In a vacuum state of less than Pa, the surface of the Ti layer 1302 is nitrided to form a TiN layer on the surface of the Ti layer 1302. In this case as well, the vacuum state is 10 -5 It is more preferable that the value be less than or equal to Pa.

[0132] (13-4)10 -3 By depositing Pd (a precious metal) under a vacuum of less than Pa, a Pd layer 1304 (third layer) is formed on the TiO2 layer 1303. The vacuum state is 10 -5 It is more preferable that the value be less than or equal to Pa.

[0133] In Figure 13B, (13-5)10 -6By depositing Ti under a vacuum of Pa or less, a Ti layer 1305 (fourth layer) is formed on the Pd layer 1304. Furthermore, 10 -6 In a vacuum state below Pa, the surface of the Ti layer 1305 is oxidized to form a TiO2 layer 1306 (fifth layer) on the surface of the Ti layer 1305. The vacuum state is 10 -8 It is more preferable that the value be less than or equal to Pa.

[0134] (13-6)10 -6 By depositing Pd (a precious metal) under a vacuum of less than Pa, a Pd layer 1307 (the sixth layer) is formed on the TiO2 layer 1306. The vacuum state is 10 -8 It is more preferable that the value be less than or equal to Pa.

[0135] (13-7)10 -6 By depositing Ti under a vacuum of Pa or less, a Ti layer 1308 (7th layer) is formed on the Pd layer 1307. Furthermore, 10 -6 By depositing Pd (a precious metal) under a vacuum of less than Pa, a Pd layer 1309 (the 8th layer) is formed on the Ti layer 1308. The vacuum state is 10 -8 It is more preferable that the value be less than or equal to Pa.

[0136] In this way, by forming multiple types of films on the substrate 1301 while maintaining a vacuum, an 8-layer non-evaporative getter-coated component 1300 can be manufactured.

[0137] In addition, the non-evaporative getter-coated container according to this embodiment can also be manufactured by forming an 8-layer film structure on the inner surface of the vacuum container using the same manufacturing method as the non-evaporative getter-coated component 1300. In the case of the non-evaporative getter-coated container, the vacuum container corresponds to the base material 1301, and Ti (non-evaporative getter material) is deposited on the inner surface of the vacuum container.

[0138] (Examples of applications for non-evaporative getter-coated parts 100) Next, examples of applications of the non-evaporative getter coated component 100 will be explained using Figures 14 to 16. In the following explanation, the films of various materials laminated on the substrate 101 of the non-evaporative getter coated component 100 may be referred to as "NEG films".

[0139] Figure 14 is an external view showing an example of an NEG pump. In Figure 14, the NEG pump 1400 has fins 1401, grooves 1402, a He leak groove 1403, fastening holes 1404, and a seal portion 1405. The edge portion 1406 represents the end portion of the seal portion 1405.

[0140] The fins 1401 (grooves 1402) correspond to NEG films formed on the substrate 1410 and coated with various materials. Specifically, for example, the fins 1401 (grooves 1402) are formed by this manufacturing method with NEG films of one of the following structures: a 3-layer film structure, a 4-layer film structure, a 5-layer film structure, or an 8-layer film structure, as shown in Figures 10 to 13B.

[0141] The NEG pump 1400 is installed in a vacuum container, for example, by passing a screw through the fastening hole 1404, and is used to evacuate the inside of the container. The NEG pump 1400 has grooves machined into the surface of the base material 1410 to form fins 1401, which increases the area on which the vapor-deposited film is formed compared to when the surface is flat, and also increases the surface area of ​​the part exposed to the inside of the container (vacuum side).

[0142] Figure 15 is an external view showing an example of a blank flange. In Figure 15, the blank flange 1500 has an NEG film 1501, a He leak groove 1502, fastening holes 1503, a sealing edge portion 1504, and a sealing portion 1505. The edge portion 1506 represents the end portion of the sealing portion 1505. In the blank flange 1500, the NEG film 1501 is on the vacuum side, and the heating surface 1507 is on the atmospheric side.

[0143] The NEG film 1501 corresponds to an NEG film in which various materials are coated on the surface of a substrate. As the NEG film 1501, for example, by this manufacturing method, one of the following NEG films is formed: a 3-layer film structure, a 4-layer film structure, a 5-layer film structure, or an 8-layer film structure, as shown in Figures 10 to 13B. The blank flange 1500 is installed in a pipe or the like by passing a screw through the fastening hole 1503, for example, to exhaust air from the inside.

[0144] Figure 16 is an external view showing an example of an NEG bellows. In Figure 16, the NEG bellows 1600 has a flange portion 1601, a bellows portion 1602, and a sealing portion 1603. The edge portion 1604 represents the end portion of the sealing portion 1603. In the NEG bellows 1600, an NEG film 1605 is formed on the inner wall of the bellows portion 1602.

[0145] The NEG film 1605 corresponds to an NEG film in which various materials are coated on the surface of a substrate. As the NEG film 1605, for example, by this manufacturing method, an NEG film with one of the following structures is formed: a 3-layer film structure, a 4-layer film structure, a 5-layer film structure, or an 8-layer film structure, as shown in Figures 10 to 13B. The NEG bellows 1600 is used, for example, as a sealing material for a transport section that shields against air and vacuum.

[0146] (Cross-sectional shape of non-evaporative getter coated part 100) Next, the cross-sectional shape of the non-evaporative getter coated component 100 will be described. Here, the cross-sectional shape of the non-evaporative getter coated component 500 will be described using the example of a case where the non-evaporative getter coated component 100 has a five-layer film structure.

[0147] Figure 17 is an explanatory diagram showing an example of the cross-sectional shape of a non-evaporative getter coated component. In Figure 17, a Ti layer 502 (first layer), a TiO2 layer 503 (second layer), a Pd layer 504 (third layer), a Ti layer 505 (fourth layer), and a Pd layer 506 (fifth layer) are laminated on the substrate 501 of the non-evaporative getter coated component 500.

[0148] The non-evaporative getter coated component 500 has an uneven surface, resulting in a larger surface area compared to a flat surface. Furthermore, even with repeated use, the TiO2 layer 503 and Pd layer 504 act as barrier layers in the non-evaporative getter coated component 500, which, for example, makes it difficult for titanium in the Ti layer 505 to diffuse, thereby suppressing the flattening of the surface shape.

[0149] Furthermore, in the case of the non-evaporative getter-coated container according to this embodiment, similar to the non-evaporative getter-coated component 500, the surface of the inner wall of the vacuum container has an uneven shape, resulting in a larger surface area compared to the case with a flat shape.

[0150] (Manufacturing procedure for non-evaporative getter coated component 100) Next, the manufacturing procedure for the non-evaporative getter coated part 100 will be described. Here, the manufacturing procedure for the non-evaporative getter coated part 500 will be described using the example of a non-evaporative getter coated part 100 having a five-layer film structure. The manufacturing procedure for the non-evaporative getter coated part 500 is carried out, for example, by an operator operating the deposition apparatus 600 (see, for example, Figures 6 to 8). The deposition source apparatus 603 is fitted with a Ti filament 901, which will be the material. The deposition source apparatus 604 is fitted with a Pd filament 901, which will be the material.

[0151] Figure 18 is a flowchart illustrating an example of the manufacturing procedure for a non-evaporative getter-coated part. In the flowchart of Figure 18, first, the inside of the deposition apparatus 600 is evacuated (step S1801). Then, after retracting the deposition source device 604 of the deposition apparatus 600, Ti deposition is performed on the surface of the substrate 501 of the non-evaporative getter-coated part 500 using the deposition source device 603 (step S1802). This forms a Ti layer 502 (see, for example, Figure 5) on the surface of the substrate 501.

[0152] Next, Ti oxidation is performed to oxidize the surface layer of the Ti layer 502 (step S1803). Ti oxidation is carried out, for example, by introducing oxygen gas into the apparatus and leaving it for a long period of time. As a result, a TiO2 layer 503 (see, for example, Figure 5) is formed on the surface layer of the Ti layer 502.

[0153] Next, the deposition source device 603 of the deposition apparatus 600 is retracted and switched to the deposition source device 604, and then Pd deposition is performed on the TiO2 layer 503 using the deposition source device 604 (step S1804). This forms a Pd layer 504 (see, for example, Figure 5) on the TiO2 layer 503. Then, the deposition source device 604 of the deposition apparatus 600 is retracted and switched to the deposition source device 603, and then Ti deposition is performed on the Pd layer 504 using the deposition source device 603 (step S1805). This Ti deposition is performed, for example, by gradually increasing the current and heating the Ti deposition source. This causes the Ti deposition source to evaporate, and a Ti layer 505 (see, for example, Figure 5) is formed on the Pd layer 504.

[0154] Then, the deposition source device 603 of the deposition apparatus 600 is retracted and switched to the deposition source device 604, and Pd deposition is performed on the Ti layer 505 using the deposition source device 604 (step S1806). As a result, a Pd layer 506 (see, for example, Figure 5) is formed on the i layer 505. As a result, a non-evaporative getter coated component 500 with a 5-layer film structure is manufactured.

[0155] (Power and pressure changes of the vapor deposition apparatus 600) Next, we will explain the power and pressure changes of the deposition apparatus 600 when manufacturing the non-evaporative getter-coated part 500 using the manufacturing procedure shown in Figure 18. Here, we assume that the deposition source device 603 (first deposition source) is equipped with a Ti filament 901, which is the material to be deposited. We also assume that the deposition source device 604 (second deposition source) is equipped with a Pd filament 901, which is the material to be deposited. The deposition apparatus 600 can control the amount of Ti and Pd deposited (film thickness) by changing the power (current value) applied to the filaments 901 of each deposition source device 603 and 604, and the time for which the power is applied.

[0156] Figure 19 is an explanatory diagram showing an example of power changes in a vapor deposition apparatus. In Figure 19, graph 1900 shows the time change of power supplied to the vapor deposition apparatus 600 when manufacturing a non-evaporative getter-coated part 500. In Figure 19, power A represents the power supplied to the vapor deposition source device 603 of the vapor deposition apparatus 600. Power B represents the power supplied to the vapor deposition source device 604 of the vapor deposition apparatus 600.

[0157] Point groups 1901-1908 correspond to graph 1900 and show the time variation of the power supplied to the deposition apparatus 600 when manufacturing the non-evaporative getter coated component 500.

[0158] Point group 1901 shows the time variation of the power supplied during the first Ti deposition on day 1 (corresponding to step S1802 in Figure 18). At this time, the current value passed through the filament 901 of the deposition source device 603 was, for example, 20A. After this, Ti oxidation occurs by leaving the device for a long period of time, such as by introducing oxygen gas into the deposition source device 603, and day 1 ends.

[0159] Point group 1902 shows the time variation of the power supplied during the first Pd deposition on the second day (corresponding to step S1804 in Figure 18). At this time, the current value passed through the filament 901 of the deposition source device 604 was, for example, 30A.

[0160] Point groups 1903 to 1907 show the time variation of the power supplied during the second Ti deposition on the second day (corresponding to step S1805 in Figure 18). For example, the current value passed through the filament 901 of the deposition source device 603 during the time period corresponding to point group 1903 is 20A. For example, the current value passed through the filament 901 of the deposition source device 603 during the time period corresponding to point group 1904 is 44A. For example, the current value passed through the filament 901 of the deposition source device 603 during the time period corresponding to point group 1905 is 43.5A. For example, the current value passed through the filament 901 of the deposition source device 603 during the time period corresponding to point group 1906 is 43A. For example, the current value passed through the filament 901 of the deposition source device 603 during the time period corresponding to point group 1907 is 42.5A.

[0161] Point group 1908 shows the time variation of the power supplied during the second Pd deposition on the second day (corresponding to step S1806 in Figure 18). At this time, the current value passed through the filament 901 of the deposition source device 604 was, for example, 30A.

[0162] Figure 20 is an explanatory diagram showing an example of pressure changes in a vapor deposition apparatus. In Figure 20, graph 2000 shows the time change in the internal pressure (container pressure) of the vapor deposition apparatus 600 when manufacturing a non-evaporative getter-coated part 500.

[0163] Point groups 2001-2008 correspond to graph 2000 and show the time change of the pressure inside the apparatus when manufacturing the non-evaporative getter-coated part 500. Point group 2001 shows the time change of the pressure inside the apparatus during the first Ti deposition on day 1 (corresponding to step S1802 in Figure 18).

[0164] Point group 2002 shows the time change of the pressure inside the apparatus during the first Pd deposition on the second day (corresponding to step S1804 in Figure 18). Point groups 2003 to 2007 show the time change of the pressure inside the apparatus during the second Ti deposition on the second day (corresponding to step S1805 in Figure 18). Point group 2008 shows the time change of the pressure inside the apparatus during the second Pd deposition on the second day (corresponding to step S1806 in Figure 18).

[0165] Furthermore, the non-evaporative getter-coated container according to this embodiment can also be manufactured using the same procedure as the non-evaporative getter-coated component 500.

[0166] (Instructions for using the non-evaporative getter-coated component 100) Next, the procedure for using the non-evaporative getter-coated component 100 will be described. The procedure for using the non-evaporative getter-coated component 100 is performed, for example, by an operator operating a vacuum device.

[0167] Figure 21 is a flowchart illustrating an example of the procedure for using the non-evaporative getter-coated component 100. In the flowchart of Figure 21, first, the non-evaporative getter-coated component 100 (NEG pump) is installed in the vacuum apparatus (step S2101). At this time, the heater (thermometer) is also installed in the vacuum apparatus.

[0168] Next, the vacuum apparatus is roughly evacuated (step S2102). The vacuum apparatus is, for example, an ultra-high vacuum system, which is achieved by combining multiple vacuum pumps. For rough evacuation, for example, a combination of the vacuum apparatus's dry pump and turbomolecular pump is used to create a high vacuum (e.g., 10 -5 Exhaust the air down to below Pa.

[0169] Next, the vacuum apparatus is uniformly heated (baked) (step S2103). During baking, for example, the chamber (container) of the vacuum apparatus is heated (150°C) to exhaust water vapor, etc. This causes the gas inside the non-evaporative getter coating component 100 (NEG pump) to be discharged and reactivated (adsorbable).

[0170] Next, the vacuum apparatus is cooled (step S2104). During cooling, the heating of the vacuum apparatus chamber is stopped and it is cooled to room temperature. Then, the target pressure (for example, 10) is reached. -7 Pa~10 -10Use the vacuum device at Pa (step S2105). The vacuum device will be used, for example, for a few hours to a year.

[0171] When the vacuum device is no longer in use, it is vented (step S2106). During venting, nitrogen is introduced into the vacuum device to return the internal pressure to atmospheric pressure. Then, the non-evaporative getter-coated component 100 (NEG pump) is removed from the vacuum device (step S2107).

[0172] Furthermore, the non-evaporative getter-coated container according to this embodiment can also be used in the same procedure as the non-evaporative getter-coated component 100.

[0173] (Other examples of manufacturing equipment configurations) Next, other configuration examples of the manufacturing apparatus used for manufacturing non-evaporative getter-coated parts 100 will be described. In the deposition apparatus 600 shown in Figure 6, two deposition source devices 603 and 604 are provided, but this is not the only configuration. For example, one deposition source device may be used, with filaments of different materials attached to the deposition source device and a partition plate provided.

[0174] Figure 22 is a cross-sectional view showing an example of another deposition apparatus. In Figure 22, the deposition apparatus 2200 has a deposition chamber 2201 and a lower chamber 2202. The deposition chamber 2201 is a hexagonal tube with inlets and outlets on six sides. A deposition source device 2203 is mounted on the upper tube of the deposition chamber 2201.

[0175] The evaporation source device 2203 has filaments made of different materials. The evaporation source device 2203 can be used while maintaining the vacuum state inside the evaporation apparatus 2200. An example of the configuration of the evaporation source device 2203 will be described later with reference to Figure 23.

[0176] The tubes in all four directions of the deposition chamber 2201, excluding the upper and lower tubes, can be fitted with materials to be deposited. In the example shown in Figure 22, sample 2204 is fitted as the material to be deposited. The lower chamber 2202 is connected to the lower tube of the deposition chamber 2201.

[0177] The lower chamber 2202 is equipped with a turbomolecular pump 2205, a BA vacuum gauge 2206, and a vent port 2207. By opening the vent valve 2208, gas can be introduced into the device through the vent port 2207.

[0178] Here, we will explain an example of the configuration of the evaporation source device 2203 using Figure 23.

[0179] Figure 23 is an explanatory diagram showing another configuration example of the evaporation source device. In Figure 23, the evaporation source device 2203 includes a filament 2301, an electrode 2302 (current terminal), an insulating plate 2303, and a partition plate 2304. The filament 2301 is fixed to the evaporation source device 2203 by a filament fixing device 2305.

[0180] As filament 2301, for example, four windings of the material metal can be mounted. For example, the deposition source device 2203 is equipped with filament 2301 consisting of two windings of Ti and two windings of Pd. The windings can be made by twisting together two to four single filament wires. Alternatively, they can be made by winding single filament wires around a core material (not shown). Here, an example of the arrangement of filament 2301 in the deposition device 2200 will be described.

[0181] Figure 24 is an explanatory diagram showing an example of filament arrangement. As shown in Figure 24, in the deposition apparatus 2200 (see Figure 22), the Ti windings 2401 and 2402 (NEG material filaments) and the Pd windings 2403 and 2404 (precious metal filaments) of the filament 2301 are arranged opposite the sample 2204, separated from each other by a partition plate 2304.

[0182] The deposition apparatus 2200 maintains a vacuum inside the apparatus and heats the deposition source device 2203 located in the deposition chamber 2201 to evaporate the material of the filament 2301, thereby depositing the material onto the sample 2204.

[0183] Specifically, for example, the deposition apparatus 2200 performs metal (Ti, Pd) deposition by supplying current to the filament 2301 from the electrode 2302 (current terminal). Alternatively, the deposition apparatus 2200 may be equipped with a rotary introduction mechanism and perform metal deposition while rotating the filament 2301 at a constant speed along with the current introduction.

[0184] The vapor deposition apparatus 2200 can prevent alloying by providing a partition plate 2304, which prevents Ti (NEG material) from being deposited onto the noble metal filaments (Pd windings 2403, 2404) or Pd (noble metal) from being deposited onto the NEG material filaments (Ti windings 2401, 2402).

[0185] However, the presence of the partition plate 2304 obstructs the deposition of each filament (Ti windings 2401, 2402, Pd windings 2403, 2404) onto the sample 2204 placed via the partition plate 2304. This reduces the deposition efficiency of various metals, leading to increased manufacturing time for the non-evaporative getter coated parts 100 and waste of deposition material. Therefore, for the manufacture of the non-evaporative getter coated parts 100, it is preferable to use a deposition apparatus 600 that can switch between two deposition source devices 603 and 604, as shown in Figures 6 to 8.

[0186] As described above, the non-evaporative getter coated component 100 according to the embodiment includes a non-evaporative getter material layer 102 and a noble metal layer 103 formed on top of the non-evaporative getter material layer 102, and includes a barrier layer 104 between the substrate 101 and the non-evaporative getter material layer 102. The barrier layer 104 is either an oxide film 104a of the non-evaporative getter material or a nitride film 104b of the non-evaporative getter material. The non-evaporative getter material layer 102 is, for example, a titanium (Ti) layer. The noble metal layer 103 is, for example, a palladium (Pd) layer.

[0187] As a result, the non-evaporative getter coating component 100, by providing a barrier layer 104, prevents contaminants remaining on the substrate 101 from diffusing into the non-evaporative getter material layer 102, and also prevents the surface shape of the precious metal layer 103 from becoming flattened and reducing its surface area. Therefore, even if the non-evaporative getter coating component 100 is used repeatedly, the deterioration of its performance after reactivation can be suppressed.

[0188] For example, the non-evaporative getter coating component 300 includes a TiO2 layer 302 (first layer) formed on the surface of the substrate 301, a Ti layer 303 (second layer) formed on the TiO2 layer 302, and a Pd layer 304 (third layer) formed on the Ti layer 303. This allows the non-evaporative getter coating component 300 to prevent contaminants remaining on the surface of the substrate 301 from diffusing into the Ti layer 303 even after repeated heating for activation, and also prevents the surface shape of the Pd layer 304 from becoming flattened. For example, the TiO2 layer 302 does not have the ability to adsorb gas molecules such as oxygen and nitrogen molecules. By providing the TiO2 layer 302, which does not have the ability to adsorb gas molecules, as a barrier layer, the diffusion of contaminants can be prevented. Similarly, by providing a Pd layer between the substrate 301 and the Ti layer 303, since only hydrogen atoms can diffuse within the Pd layer, it is possible to prevent contaminants remaining on the surface of the substrate 301 from diffusing into the Ti layer 303.

[0189] Furthermore, the non-evaporative getter coating component 400 includes a Ti layer 402 (first layer) formed on the surface of the substrate 401, a TiO2 layer 403 (second layer) formed on the surface of the Ti layer 402, a Ti layer 404 (third layer) formed on the TiO2 layer 403, and a Pd layer 405 (fourth layer) formed on the Ti layer 404. As a result, by providing the TiO2 layer 403, the non-evaporative getter coating component 400 prevents contaminants remaining on the substrate 401 from diffusing into the Ti layer 404 even when heating for activation is repeatedly performed, and also prevents the surface shape of the Pd layer 405 from becoming flattened.

[0190] Furthermore, the non-evaporative getter coating component 500 includes a Ti layer 502 (first layer) formed on the surface of the substrate 501, a TiO2 layer 503 (second layer) formed on the surface of the Ti layer 502, a Pd layer 504 (third layer) formed on the TiO2 layer 503, a Ti layer 505 (fourth layer) formed on the Pd layer 504, and a Pd layer 506 (fifth layer) formed on the Ti layer 505. As a result, by providing the TiO2 layer 503 and the Pd layer 504, the non-evaporative getter coating component 500 can prevent contaminants remaining on the substrate 501 from diffusing into the Ti layer 505 even when heating for activation is repeatedly performed, and can also prevent the surface shape of the Pd layer 506 from becoming flattened. For example, in a non-evaporative getter-coated component 500, the Ti layer 505 is sandwiched between the Pd layer 504 and the Pd layer 506, preventing the oxidation of the Ti layer 505 by preventing H2O in the atmosphere from diffusing through the Pd layer 506, while also strengthening the barrier layer and further suppressing the diffusion of contaminants (e.g., carbon atoms derived from cutting oil) remaining on the substrate surface.

[0191] Based on these findings, the non-evaporative getter coating component 100 according to this embodiment can suppress a decrease in exhaust performance even when the non-evaporative getter coating component 100 is used repeatedly. For example, even when the non-evaporative getter coating component 100 is used repeatedly, it has the effect of having a higher exhaust speed immediately after activation compared to the conventional NEG pump 200 shown in Figure 2, and the rate at which the exhaust speed decreases as the accumulated exhaust volume increases is more gradual. [Industrial applicability]

[0192] As described above, the non-evaporative getter coated component, the method and apparatus for manufacturing the non-evaporative getter coated component, the non-evaporative getter coated container, and the method and apparatus for manufacturing the non-evaporative getter coated container according to this invention are useful for vacuum pumps that realize an ultra-high vacuum environment, and are particularly suitable for the development and manufacture of devices such as semiconductor manufacturing equipment, ultrafine analytical instruments, and particle accelerators. [Explanation of symbols]

[0193] 100, 300, 400, 500, 1300 Non-evaporative getter coating parts 101,201,301,401,501,1301,1410 Base material 102 Non-evaporative getter material layer 103 Precious metal layer 104 Barrier layer 104a Oxide film of non-evaporative getter material 104b Nitride film of non-evaporative getter material 200,1400 NEG pump 202,303,402,404,502,505,1001,1302,1305,1308 Ti layer 203,304,405,504,506,1304,1307,1309 Pd layer 302,403,503,1303,1306 TiO2 layer 600,2200 Vapor deposition equipment 601,2201 Evaporation chamber 602,2202 Lower Chamber 603,604,2203 Vapor deposition source equipment 605a, 605b, 605c, 605d, 2204 samples 606 Vacuum gauge mounting section 607,2207 Ventport 701,2205 Turbomolecular pump 702,2206 BA vacuum gauge 703,2208 Vent Valve 901,2301 filaments 902,2302 Electrode 903,2303 Insulating board 904,2305 Filament holder 1401 Finn 1402 Groove 1403, 1502 He Leak Groove 1404, 1503 fastening holes 1405, 1505, 1603 Seal part 1406, 1506, 1604 Edge section 1500 Blank Flange 1501,1605 NEG membrane 1504 Sealing edge 1507 Heating surface 1600 NEG bellows 1601 Flange section 1602 Bellows section 1900,2000 graph 1901,1902,1903,1904,1905,1906,1907,1908,2001,2002,2003,2004,2005,2006,2007,2008 point cloud 2304 Partition Plate Windings for 2401 and 2402 Ti Windings for 2403 and 2404 Pd

Claims

1. A non-evaporative getter coating component comprising a non-evaporative getter material layer and a noble metal layer formed on top of the non-evaporative getter material layer, A non-evaporative getter coating component characterized by including a film of either an oxide film of the non-evaporative getter material or a nitride film of the non-evaporative getter material between the substrate and the non-evaporative getter material layer.

2. The first layer of any of the films formed on top of the substrate, A second layer of the non-evaporative getter material formed above the first layer, A third layer of precious metal formed on the second layer, A non-evaporative getter coating component according to claim 1, characterized by comprising at least the following.

3. The first layer of the non-evaporative getter material formed on top of the substrate, A second layer of either an oxide film or a nitride film formed on the surface of the first layer, A third layer of the non-evaporative getter material formed above the second layer, A fourth layer of precious metal formed on the third layer, A non-evaporative getter coating component according to claim 1, characterized by comprising at least the following.

4. The first layer of the non-evaporative getter material formed on top of the substrate, A second layer of either an oxide film or a nitride film formed on the surface of the first layer, A third layer of precious metal formed above the second layer, A fourth layer of the non-evaporative getter material formed above the third layer, The fifth layer of the precious metal formed on the fourth layer, A non-evaporative getter coating component according to claim 1, characterized by comprising at least the following.

5. The non-evaporable getter coating component according to any one of claims 2 to 4, characterized in that the aforementioned precious metal is a platinum group element.

6. The non-evaporative getter coating component according to claim 5, characterized in that the platinum group element is palladium.

7. The non-evaporative getter coating component according to any one of claims 1 to 4, characterized in that the thickness of the oxide film is 10 nm or more.

8. A non-evaporative getter coated container comprising a non-evaporative getter material layer on the inner surface of the vacuum container and a noble metal layer formed on top of the non-evaporative getter material layer, A non-evaporative getter coated container characterized in that a film of either an oxide film of the non-evaporative getter material or a nitride film of the non-evaporative getter material is included between the inner surface of the vacuum container and the non-evaporative getter material layer.

9. A method for manufacturing a non-evaporative getter coated component, comprising a non-evaporative getter material layer and a noble metal layer formed on top of the non-evaporative getter material layer, A method for manufacturing a non-evaporative getter coated component, characterized by including a step of forming a film of either an oxide film of the non-evaporative getter material or a nitride film of the non-evaporative getter material between a substrate and the non-evaporative getter material layer in a vacuum state.

10. 10 -3 A first step is to form a first layer of an oxide film or nitride film of the non-evaporative getter material on the surface of the substrate by oxidizing or nitriding the non-evaporative getter material attached to the surface of the substrate in a vacuum state of Pa or less, 10 -6 A second step involves forming a second layer of the non-evaporative getter material on the first layer by depositing the non-evaporative getter material onto the first layer formed in the first step under a vacuum state of Pa or less, 10 -6 A third step is to form a third layer of the noble metal on the second layer by depositing the noble metal onto the second layer formed in the second step under a vacuum state of Pa or less, A method for manufacturing a non-evaporating getter coating component according to claim 9, characterized by including the following:

11. 10 -3 A first step is to form a first layer of the non-evaporative getter material on the surface of the substrate by depositing the non-evaporative getter material onto the surface of the substrate in a vacuum state of Pa or less, 10 -3 A second step involves oxidizing or nitriding the surface layer of the first layer formed in the first step under a vacuum of Pa or less, thereby forming a second layer of the non-evaporative getter material oxide film or nitride film on the surface layer of the first layer. 10 -6 A third step involves forming a third layer of the non-evaporative getter material on the second layer by depositing the non-evaporative getter material onto the second layer formed in the second step under a vacuum of Pa or less, 10 -6 A fourth step is to form a fourth layer of the noble metal on the third layer by depositing the noble metal onto the third layer formed in the third step under a vacuum of Pa or less, A method for manufacturing a non-evaporating getter coating component according to claim 9, characterized by including the following:

12. 10 -3 A first step is to form a first layer of the non-evaporative getter material on the surface of the substrate by depositing the non-evaporative getter material onto the surface of the substrate in a vacuum state of Pa or less, 10 -3 A second step of forming a second layer of an oxide film or a nitride film of the non-evaporable getter material on the surface layer of the first layer by oxidizing or nitriding the surface layer of the first layer formed in the first step in a vacuum state of Pa or less; 10 -3 A third step is to form a third layer of the noble metal on the second layer by depositing the noble metal onto the second layer formed in the second step under a vacuum state of Pa or less, 10 -6 A fourth step is to form a fourth layer of the non-evaporative getter material on the third layer by depositing the non-evaporative getter material onto the third layer formed in the third step under a vacuum of Pa or less, 10 -6 A fifth step is to form a fifth layer of the precious metal on the fourth layer by depositing the precious metal onto the fourth layer formed in the fourth step under a vacuum of Pa or less, A method for manufacturing a non-evaporating getter coating component according to claim 9, characterized by including the following:

13. The method for manufacturing a non-evaporable getter coating component according to any one of claims 10 to 12, characterized in that the aforementioned precious metal is a platinum group element.

14. The method for manufacturing a non-evaporable getter coating component according to claim 13, characterized in that the platinum group element is palladium.

15. A method for manufacturing a non-evaporative getter coating component according to any one of 9 to 12, characterized in that the thickness of the oxide film is 10 nm or more.

16. A method for manufacturing a non-evaporative getter coated container, which includes a non-evaporative getter material layer on the inner surface of the vacuum container and a noble metal layer formed on top of the non-evaporative getter material layer, A method for manufacturing a non-evaporative getter coated container, characterized by including a step of forming a film of either an oxide film of the non-evaporative getter material or a nitride film of the non-evaporative getter material between the inner surface of the vacuum container and the non-evaporative getter material layer in a vacuum state.

17. The device comprises a substrate, a first deposition source having a non-evaporative getter material filament, a second deposition source having a noble metal filament, and a current terminal. The first and second deposition sources can be switched and used while maintaining a vacuum state inside the apparatus, and the other deposition source can be retracted while one deposition source is in use so that material from the first deposition source does not adhere to the filament of the other deposition source. A manufacturing apparatus for non-evaporation type getter coated parts, characterized by the following features.

18. The system comprises a vacuum vessel, a first deposition source having a non-evaporative getter material filament, a second deposition source having a noble metal filament, and a current terminal. The first and second deposition sources can be switched and used while maintaining a vacuum state inside the apparatus, and the other deposition source can be retracted while one deposition source is in use so that material from the first deposition source does not adhere to the filament of the other deposition source. A manufacturing apparatus for non-evaporative getter-coated containers, characterized by the following features.

Images