Radiator and method for manufacturing the same
The radiator design with a base frame and heat dissipation member, using die casting and advanced manufacturing processes, addresses the challenges of high heat dissipation and cost-effectiveness, ensuring easy manufacturing and efficient thermal conductivity.
Patent Information
- Authority / Receiving Office
- JP · JP
- Patent Type
- Applications
- Current Assignee / Owner
- TIGER TECH PRECISION PARTS(HUIZHUO) CO LTD
- Filing Date
- 2025-01-24
- Publication Date
- 2026-05-07
AI Technical Summary
Conventional radiator manufacturing methods face challenges in achieving high heat dissipation efficiency, structural complexity, and cost-effectiveness, particularly with increasing size and complexity, as they either incur high costs, have low pass rates, or are limited in structure and processing efficiency.
A radiator design comprising a base frame with a cavity and stepped groove, incorporating a heat dissipation member with heat transfer bumps and heat sinks, sealed and connected to enhance thermal conductivity, using die casting for the base frame and advanced manufacturing processes for the heat dissipation member.
The design facilitates easy manufacturing, high pass rates, and efficient mass production with superior thermal conductivity, while maintaining structural integrity and reducing manufacturing difficulties.
Smart Images

Figure 2026075026000001_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to the technical field of radiators, and particularly to radiators and manufacturing methods thereof.
Background Art
[0002] A radiator is a type of device specifically designed to assist in the heat dissipation of heat-generating components such as electronic devices. It is usually composed of a series of heat sinks arranged vertically or horizontally, which can increase the contact area with the surrounding air, thereby accelerating the heat transfer rate from the heat source to the air. The purpose of the heat sink design is to maximize the heat dissipation efficiency while maintaining the structural stability, light weight, and convenience.
[0003] Conventional radiators are mainly manufactured by methods such as aluminum extrusion, die casting, machining, skiving (also called skiving radiators), etc. However, as the size of the radiator continues to increase and the structure of the radiator becomes more complex and the heat sinks become taller in order to adapt well to heat-generating components such as electronic devices and improve the heat dissipation efficiency. In aluminum extrusion, the required special structure cannot be achieved. In integrally formed die casting, with the increase in the size of the radiator, due to its structural characteristics, the cost increases significantly, and since the heat sink becomes longer, the strength during die extraction of the mold increases, and the height of the heat sink is restricted. The radiator obtained by integrally formed die casting has relatively low heat dissipation efficiency due to the material, and the qualified rate of die casting is also relatively low. In machining, a radiator with the required shape can be cut out, but the processing efficiency decreases and the cost in the case of mass production becomes high. In skiving, high heat dissipation efficiency can be achieved, but it cannot be used for components with complex structures. In view of this, in order to solve the above problems, the radiator and its manufacturing method of the present application have been proposed.
Summary of the Invention
Problems to be Solved by the Invention
[0004] The objective of the present invention is to provide a radiator and a method for manufacturing the same that are easy to manufacture, have a high pass rate, are easy to mass-produce, and have superior heat transfer properties, thereby solving the shortcomings of the prior art. [Means for solving the problem]
[0005] The object of the present invention is achieved by the following technical solutions.
[0006] It is a radiator, A base frame having a cavity on one side for housing a heat dissipation member, a stepped groove further opened on the side away from the cavity, and a cavity opening communicating with the cavity opened in the inner bottom wall of the stepped groove, The heat dissipation member includes a heat transfer plate, heat transfer bumps, and several heat sinks, each of which is spaced apart on the same side of the heat transfer plate, the heat transfer bumps are provided on the side of the heat transfer plate away from the heat sinks, the heat transfer plate is fitted and housed in the stepped groove, and the heat transfer bumps are provided penetrating the cavity opening, with the outer wall of the heat transfer bump and the inner wall of the cavity opening being sealed and connected.
[0007] Optionally, the outer wall of the heat transfer bump and the inner wall of the cavity opening are welded together.
[0008] Optionally, the outer wall of the heat transfer bump and the inner wall of the cavity opening are welded by friction stir welding.
[0009] Optionally, the base frame includes a frame body and two fence sections, wherein the cavity, the stepped groove, and the cavity opening are all located on the frame body, the two fence sections are both provided on the side of the frame body near the stepped groove, and the two fence sections are located on opposite sides of the stepped groove.
[0010] Optionally, the outer wall of the frame body is provided with two external tabs distributed at intervals.
[0011] Optionally, the frame body, the fence section, and the external tab are integrally molded to the base frame by die casting.
[0012] Optionally, the frame body may be provided with a closed sealing groove surrounding the cavity.
[0013] Optionally, the frame body may also have several locking holes that are spaced apart.
[0014] Optionally, a protective layer is provided on the surface of the radiator.
[0015] A method for manufacturing the above-mentioned radiator, Step S10 for manufacturing a base frame by die casting, wherein a cavity is opened on one side of the base frame, a stepped groove is opened on the other side, and a cavity opening communicating with the cavity is further opened in the inner bottom wall of the stepped groove, Step S20 is to obtain a heat dissipation member, wherein the heat dissipation member includes a heat transfer plate, heat transfer bumps, and several heat sinks, wherein the heat transfer bumps are located on one side of the heat transfer plate, and each of the heat sinks is located on the other side of the heat transfer plate, Step S30 involves positioning the heat dissipation member on the base frame such that the heat transfer plate fits into the stepped groove and the heat transfer bump penetrates the cavity opening. The process includes step S40, which involves sealing and connecting the outer wall of the heat transfer bump to the inner wall of the cavity opening to obtain a radiator. [Effects of the Invention]
[0016] Compared to the prior art, the present invention has at least the following advantages.
[0017] The present invention provides a radiator and a method for manufacturing the same, wherein the radiator includes a base frame and a heat dissipation member, wherein a cavity for housing the heat dissipation member is opened on one side of the base frame, a stepped groove is further opened on the side of the base frame away from the cavity, and a cavity opening communicating with the cavity is opened in the inner bottom wall of the stepped groove, the heat dissipation member includes a heat transfer plate, heat transfer bumps and several heat sinks, each heat sink is provided at intervals on the same side of the heat transfer plate, the heat transfer bumps are provided on the side of the heat transfer plate away from the heat sinks, the heat transfer plate is fitted and housed in the stepped groove, the heat transfer bumps are provided penetrating the cavity opening, and the outer wall of the heat transfer bump and the inner wall of the cavity opening are sealed and connected. Thus, the radiator is constructed by combining a base frame and a heat dissipation component. The heat dissipation component is manufactured by processes such as aluminum extrusion, machining of copper or aluminum, skiving, and die casting of highly heat-conductive materials. The base frame is manufactured by die casting. Therefore, even if the base frame is designed with a special structure, the difficulty of manufacturing the radiator is significantly reduced, the pass rate of the radiator is effectively improved, mass production is facilitated, and the assembled radiator is effectively ensured to have excellent thermal conductivity and heat dissipation. [Brief explanation of the drawing]
[0018] To more clearly explain the technical solutions of the embodiments of the present invention, the drawings necessary for the embodiments will be briefly described below. However, these drawings are merely illustrations of some embodiments of the present invention and should not be considered limiting in scope. Those skilled in the art should understand that other relevant drawings can be obtained based on these drawings without expending any creative effort. [Figure 1] This is a schematic diagram of the structure of a radiator according to one embodiment of the present invention. [Figure 2] Figure 1 is an exploded view of the radiator. [Figure 3] It is an exploded view of the radiator shown in FIG. 1 from another angle. [Figure 4] It is a schematic cross-sectional structure diagram of the radiator shown in FIG. 1. [Figure 5] It is a flow block diagram of the manufacturing method of the radiator shown in FIG. 1.
Embodiments for Carrying out the Invention
[0019] To facilitate the understanding of the present invention, the present invention will be described in more detail below with reference to the related drawings. Preferred embodiments of the present invention are shown in the drawings.
[0020] In the description of the embodiments of the present invention, the orientation or positional relationship indicated by terms such as "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings, and is for facilitating the description of the embodiments of the present invention and simplifying the description, and does not indicate or imply that the shown device or element must have a specific orientation or be configured and operate in a specific orientation, and thus does not limit the present invention.
[0021] Furthermore, the terms "first" and "second" are for the purpose of description only, and it cannot be understood that they indicate or imply relative importance or imply the number of the shown technical features. Therefore, the features limited by "first" and "second" may explicitly or implicitly include one or more of such features. In the description of the embodiments of the present invention, "a plurality" means two or more unless specifically specified otherwise.
[0022] In embodiments of the present invention, unless explicitly defined and limited, terms such as "attach," "connect," "join," and "fix" should be understood in a broad sense. For example, these may be fixed connections, detachable connections, mechanical connections, electrical connections, direct connections, indirect connections via an intermediate medium, internal communication between two elements, or interaction relationships between two elements. The specific meanings of these terms in embodiments of the present invention can be understood by those skilled in the art depending on the context.
[0023] As shown in Figures 1 to 4, the radiator 10 includes a base frame 100 and a heat dissipation member 200. A cavity 111 for housing the heat dissipation member is opened on one side of the base frame 100, and a stepped groove 112 is further provided on the side of the base frame 100 away from the cavity 111. A cavity opening 113 communicating with the cavity 111 is opened in the inner bottom wall of the stepped groove 112, and the heat dissipation member 200 includes a heat transfer plate 210 and a heat transfer The heat transfer plate 210 includes bumps 220 and several heat sinks 230, each heat sink 230 being spaced apart on the same side of the heat transfer plate 210, the heat transfer bumps 220 being provided on the side of the heat transfer plate 210 away from the heat sinks 230, the heat transfer plate 210 being fitted and housed in a stepped groove 112, and the heat transfer bumps 220 being provided through a cavity opening 113, with the outer wall of the heat transfer bumps 220 and the inner wall of the cavity opening 113 being sealed and connected.
[0024] Furthermore, the heat dissipation components for electronic equipment and the like are mounted inside the cavity 111, thereby ensuring sufficient contact between the heat dissipation components and the radiator 10. A stepped groove 112 is provided on the other side of the base frame 100, and a cavity opening 113 communicating with the cavity 111 is provided in the inner bottom wall of the stepped groove 112. In addition, the heat transfer bumps 220 are located on one side of the heat transfer plate 210, and each heat sink 230 is located on the other side of the heat transfer plate 210, and the heat sinks 230 are distributed with spacing between them. Thus, the heat dissipation components 200 and the base frame 100 are independent structures and can be processed and manufactured individually. After manufacturing the base frame 100 and the heat dissipation member 200, the heat dissipation member 200 is installed inside the base frame 100. Specifically, the heat transfer bumps 220 penetrate the cavity opening 113, and the heat transfer plates 210 are fitted into the stepped grooves 112 so that the surface of the heat transfer bumps 220 is flush with the inner bottom wall of the cavity 111. Then, the outer wall of the heat transfer bumps 220 and the inner wall of the cavity opening 113 are sealed and connected to obtain the combined structure of the radiator 10. In this way, the radiator 10 is configured by installing the base frame 100 and the heat dissipation member 200 together. Of these, the heat dissipation member 200 functions as the heat dissipation body, and a material with high heat conductivity is used to improve heat dissipation efficiency. The heat dissipation member 200 can be manufactured by processes such as aluminum extrusion, machining of copper or aluminum, skiving, or die casting of a highly heat-conductive material. The base frame 100 connects the heat dissipation member 200 to the main body of the equipment, ensuring their relative position and structural accuracy. Therefore, since the base frame 100 requires a lower heat dissipation efficiency compared to the heat dissipation member 200, it can be manufactured by die casting using a material that is easy to die cast. Thus, even if the structure of the base frame 100 is specially designed to suit the location where it is installed, the difficulty of manufacturing the radiator 10 is significantly reduced, the pass rate of the radiator 10 is effectively improved, mass production is facilitated, and the assembled radiator 10 is ensured to have excellent heat transfer and heat dissipation capabilities.
[0025] In one embodiment, when the heat dissipation member 200 is a skiving fin, the heat sink 230 is particularly tall, dense, and thin. Therefore, to avoid deformation or breakage, a breathable protective cover can be provided on the heat dissipation member 200, and the heat sink 230 can be protected by the protective cover.
[0026] In one embodiment, the heat transfer bumps 220, the outer wall, and the cavity opening 113 may be adhered with a heat-transferring adhesive, thereby sealing and attaching the heat transfer bumps 220 and the base frame 100 while ensuring that heat can be stably transferred from the base frame 100 to the heat dissipation member 200.
[0027] Furthermore, in one embodiment, the heat dissipation member 200 and the base frame 100 may be locked and connected with fasteners such as bolts, in which case the heat dissipation member 200 and the base frame 100 are sealed and connected through a sealing ring.
[0028] Furthermore, in one embodiment, the outer wall of the heat transfer bump 220 and the inner wall of the cavity opening 113 are welded together, thereby ensuring good sealing between the heat transfer bump 220 and the base frame 100, as well as ensuring heat transfer efficiency between the base frame 100 and the heat transfer bump 220. For example, the heat transfer bump 220 and the inner wall of the cavity opening 113 may be welded using one of the following methods: arc welding, laser welding, electron beam welding, resistance welding, gas welding, friction welding, or friction stir welding. In particular, friction stir welding is preferred for sealing and connecting the heat transfer bump 220 and the base frame 100 because it provides stable weld quality, is free from defects such as porosity and cracking commonly seen in welding, has excellent sealing properties, and can effectively improve the mechanical properties between the heat transfer bump 220 and the base frame 100.
[0029] As shown in Figures 1 to 4, in one embodiment, the base frame 100 includes a frame body 110 and two fence sections 120, where the cavity 111, the stepped groove 112, and the cavity opening 113 are all located on the frame body 110, and the two fence sections 120 are both provided on the side of the frame body 110 closest to the stepped groove 112, and the two fence sections 120 are located on opposite sides of the stepped groove 112.
[0030] The fence section 120 is located on the side of the frame body 110 closest to the stepped groove 112. In this way, when the heat dissipation member 200 is installed in the stepped groove 112, the two fence sections 120 are located on both sides of each heat sink 230. Furthermore, the longitudinal extension lines of the fence section 120 and the longitudinal extension lines of the heat sink 230 are parallel to each other. By protecting each heat sink 230 with the fence section 120 in this way, deformation of the fence section 120 due to collision can be prevented. In addition, in one embodiment, the thickness of the fence section 120 decreases as it moves away from the frame body 110. In this way, when the base frame 100 is manufactured by die casting, the release of the fence section 120 becomes easier. In one embodiment, the minimum thickness of the fence section 120 is greater than the thickness of the heat sink 230. In this way, the fence section 120 can effectively protect the heat sink 230.
[0031] As shown in Figure 1, in one embodiment, the outer wall of the frame body 110 is provided with two external tabs 130 that are spaced apart from each other.
[0032] Furthermore, since the cavity 111 is used to house a large volume heat dissipation member, two external tabs 130, spaced apart, are provided on the outer wall of the frame body 110 to facilitate the attachment and detachment of the radiator 10 and the heat dissipation member. In this way, the frame body 110 and the heat dissipation member may be attached by hinges using the external tabs 130 to facilitate the snapping of the frame body 110 to the heat dissipation member and the removal of the heat dissipation member.
[0033] Furthermore, in one embodiment, the frame body 110, the fence section 120, and the external tab 130 are integrally molded to the base frame 100 by die casting. In this way, sufficient structural strength is achieved between the base frame 100, frame body 110, fence section 120, and external tab 130, which are manufactured by die casting.
[0034] As shown in Figures 3 and 4, in one embodiment, the frame body 110 is provided with a closed seal groove 114 surrounding the cavity 111.
[0035] Thus, when the radiator 10 is used attached to a heat dissipation component, a good sealing environment can be maintained within the cavity 111 by installing a seal ring in the seal groove 114.
[0036] As shown in Figure 1, in one embodiment, the frame body 110 has several locking holes 115 that are spaced apart. This makes it easy to attach the base frame 100 by inserting screws through the locking holes 115.
[0037] In one embodiment, a protective layer is provided on the surface of the radiator 10. For example, the surface of the heat sink 10 may be subjected to anodizing, sandblasting, spraying, nickel plating or chromium plating, chemical conversion coating, wire drawing, etc., to form a protective layer. In this application, it is preferable to form a protective layer on the surface of the radiator 10 using spraying, which further improves the heat dissipation efficiency, corrosion resistance, and wear resistance of the entire radiator 10.
[0038] As shown in Figure 5, the method for manufacturing a radiator is: Step S10 for manufacturing a base frame by die casting, wherein a cavity is opened on one side of the base frame, a stepped groove is opened on the other side, and a cavity opening communicating with the cavity is further opened in the inner bottom wall of the stepped groove, Step S20 is to obtain a heat dissipation member, wherein the heat dissipation member includes a heat transfer plate, heat transfer bumps, and several heat sinks, the heat transfer bumps being located on one side of the heat transfer plate, and each heat sink being located on the other side of the heat transfer plate, Step S30 involves arranging the heat dissipation member on the base frame such that the heat transfer plate fits into the stepped groove and the heat transfer bump penetrates the cavity opening, The process includes step S40, which involves sealing and connecting the outer wall of the heat transfer bump to the inner wall of the cavity opening to obtain a radiator.
[0039] Furthermore, by integrally molding the base frame by die casting, the manufacturing efficiency of the base frame is increased, while effectively ensuring the size and overall structural strength of the base frame. For example, the base frame may be manufactured by die casting using ADC12 aluminum material, thereby providing good casting performance, high mechanical strength, and the ability to withstand a predetermined load. In this way, the individual heat dissipation members and the base frame are sealed and assembled to form an integrated radiator. The base frame may be designed with any special structure according to the heat dissipation members, thereby effectively ensuring the heat dissipation efficiency of the radiator while reducing the difficulty of manufacturing the radiator.
[0040] Furthermore, in one embodiment, obtaining the heat dissipation member in step S20 specifically means manufacturing the heat dissipation member by one of the following processes: aluminum extrusion, machining of copper or aluminum, skiving, or die casting of a highly heat-conductive material.
[0041] In this embodiment, the heat dissipation member is manufactured by methods such as aluminum extrusion, machining of copper or aluminum, skiving, and die casting of a highly heat-conductive material. For example, the heat dissipation member is manufactured using A6063 aluminum and copper. These materials have excellent extrusion performance, good corrosion resistance and weldability, and their strength can be improved by heat treatment.
[0042] Furthermore, in one embodiment, in step S40, sealing and connecting the outer wall of the heat transfer bump and the inner wall of the cavity opening specifically means sealing and connecting the outer wall of the heat transfer bump and the inner wall of the cavity opening by friction stir welding.
[0043] Furthermore, by welding and fixing the heat transfer bumps and base frame using a friction stir welding process, sufficient sealing is maintained between the heat dissipation member and the base frame, while enabling heat from the base frame to be quickly transferred to the heat dissipation member for heat dissipation.
[0044] The above embodiments are merely examples of some embodiments of the present invention, and although the description is relatively specific and detailed, it should not be understood as limiting the scope of the patent. Here, "attaching / fixing / providing" as described in the present invention includes, but is not limited to, locking by screws or welding, unless otherwise defined. It should be understood that several modifications and improvements are possible for those skilled in the art without departing from the concept of the present invention, and all of these fall within the scope of protection of the present invention. Therefore, the scope of patent protection for the present invention should be in accordance with the appended claims. [Explanation of symbols]
[0045] 10 Radiator 100 Base Frame 200 Heat dissipation components 111 Cavity 112 Step groove 113 Cavity opening 210 Heat transfer plate 220 Heat transfer bump 230 Heatsink 110 Frame Body 120 Fence section 130 External Tabs 114 Seal groove 115 lock holes
Claims
1. It is a radiator, A base frame having a cavity on one side for housing a heat dissipation member, a stepped groove further opened on the side away from the cavity, and a cavity opening communicating with the cavity opened in the inner bottom wall of the stepped groove, A heat dissipation member comprising a heat transfer plate, heat transfer bumps, and several heat sinks, wherein each heat sink is provided at intervals on the same side surface of the heat transfer plate, the heat transfer bumps are provided on the side surface of the heat transfer plate away from the heat sinks, the heat transfer plate is fitted and housed within the stepped groove, and the heat transfer bumps are provided penetrating the cavity opening, and the outer wall of the heat transfer bump and the inner wall of the cavity opening are sealed and connected. A radiator characterized by including the following.
2. The radiator according to claim 1, characterized in that the outer wall of the heat transfer bump and the inner wall of the cavity opening are welded together.
3. The radiator according to claim 2, characterized in that the outer wall of the heat transfer bump and the inner wall of the cavity opening are welded by friction stir welding.
4. The radiator according to claim 3, wherein the base frame includes a frame body and two fence sections, the cavity, the stepped groove, and the cavity opening are all located on the frame body, the two fence sections are both provided on the side of the frame body near the stepped groove, and the two fence sections are located on opposite sides of the stepped groove.
5. The radiator according to claim 4, characterized in that two external tabs distributed at intervals are provided on the outer wall of the frame body.
6. The radiator according to claim 5, characterized in that the frame body, the fence portion, and the external tab are integrally molded to the base frame by die casting.
7. The radiator according to claim 6, characterized in that a closed seal groove is provided in the frame body surrounding the cavity.
8. The radiator according to claim 6, further characterized in that the frame body has several locking holes distributed at intervals.
9. The radiator according to claim 6, characterized in that a protective layer is provided on the surface of the radiator.
10. A method for manufacturing a radiator according to any one of claims 6 to 9, Step S10 for manufacturing a base frame by die casting, wherein a cavity is opened on one side of the base frame, a stepped groove is opened on the other side, and a cavity opening communicating with the cavity is further opened in the inner bottom wall of the stepped groove, Step S20 is to obtain a heat dissipation member, wherein the heat dissipation member includes a heat transfer plate, heat transfer bumps, and several heat sinks, wherein the heat transfer bumps are located on one side of the heat transfer plate, and each of the heat sinks is located on the other side of the heat transfer plate, Step S30 involves arranging the heat dissipation member on the base frame such that the heat transfer plate fits into the stepped groove and the heat transfer bump penetrates the cavity opening. A method for manufacturing a radiator, comprising step S40, which involves sealing and connecting the outer wall of the heat transfer bump and the inner wall of the cavity opening to obtain a radiator.
Citation Information
Patent Citations
On-vehicle electronic apparatus
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