Printing apparatus

Abstract

This prevents solder adhering to the squeegee from falling onto the screen mask. [Solution] A printing apparatus for printing solder paste onto a substrate using a mask comprises a squeegee that slides on the mask and prints the solder paste onto the substrate through an opening in the mask, a cover that catches the solder paste that adheres to the squeegee, a control unit that controls the movement of the cover between a retracted position, which is a position that does not hinder the sliding of the squeegee on the mask, and a receiving position, which is a position that catches the solder paste that adheres to the squeegee, and a solder paste recovery device that recovers the solder paste on the mask, wherein the retracted position is between the receiving position and the solder paste recovery device.

Description

Technical Field

[0001] This disclosure relates to a printing apparatus.

Background Art

[0002] There is known a screen printing apparatus provided with a mechanism for preventing solder adhering to a squeegee from falling onto a screen mask. Patent Document 1 discloses a screen printing apparatus provided with a cleaning unit having a contact member along the end face of the squeegee under the screen mask, and after retracting the screen mask, wiping off the solder adhering to the end face of the squeegee using the contact member of the cleaning unit to prevent the solder adhering to the squeegee from falling.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] However, in the configuration disclosed in Patent Document 1, if the solder adhering to the squeegee falls before the screen mask is retracted, it cannot prevent the solder from falling onto the screen mask.

[0005] An object of this disclosure is to provide a printing apparatus capable of preventing solder adhering to a squeegee from falling onto a screen mask.

Means for Solving the Problems

[0006] The printing apparatus according to this disclosure is a printing apparatus for printing solder paste onto a substrate using a mask, comprising: a squeegee that slides on the mask and prints the solder paste onto the substrate through an opening provided in the mask; a cover that catches the solder paste that adheres to the squeegee as it falls; a control unit that controls the movement of the cover between a retracted position, which is a position that does not hinder the sliding of the squeegee on the mask, and a receiving position, which is a position that catches the solder paste that adheres to the squeegee as it falls; and a solder paste recovery device that recovers the solder paste on the mask, wherein the retracted position is between the receiving position and the solder paste recovery device. [Effects of the Invention]

[0007] According to this disclosure, it is possible to prevent solder adhering to the squeegee from falling onto the screen mask. [Brief explanation of the drawing]

[0008] [Figure 1] Perspective view showing the screen printing apparatus in this embodiment [Figure 2] Side view showing the screen printing apparatus in this embodiment [Figure 3A] Side view showing the squeegee head when the cover of the solder fall prevention mechanism is in the retracted position in this embodiment. [Figure 3B] Side view showing the squeegee head when the cover of the solder fall prevention mechanism is in the receiving position in this embodiment. [Figure 4A] This is a perspective view showing the area around the squeegee when the cover of the solder fall prevention mechanism is in the retracted position in this embodiment. [Figure 4B] This is a perspective view showing the area around the squeegee when the cover of the solder fall prevention mechanism is in the receiving position in this embodiment. [Figure 5A] This is a perspective view showing the solder fall prevention mechanism when the cover is in the retracted position in this embodiment. [Figure 5B]This is a perspective view showing the solder fall prevention mechanism when the cover is in the receiving position in this embodiment. [Figure 6] This figure illustrates the attachment and detachment of the flat plate constituting the cover in this embodiment. [Figure 7] Block diagram showing the control system of the screen printing apparatus in this embodiment. [Figure 8] A flowchart illustrating an example of the processing performed by the control device in this embodiment when the printing operation is completed. [Figure 9] A flowchart showing an example of the processing performed by the control device in this embodiment when the printing operation starts. [Figure 10A] Figure 1 illustrates the operation of the squeegee and cover at the end of the printing process in this embodiment. [Figure 10B] Figure 2 illustrates the operation of the squeegee and cover at the end of the printing process in this embodiment. [Figure 10C] Figure 3 illustrates the operation of the squeegee and cover at the end of the printing process in this embodiment. [Figure 10D] Figure 4 illustrates the operation of the squeegee and cover at the end of the printing process in this embodiment. [Figure 10E] Figure 5 illustrates the operation of the squeegee and cover at the end of the printing process in this embodiment. [Figure 10F] Figure 6 illustrates the operation of the squeegee and cover at the end of the printing process in this embodiment. [Figure 10G] Figure 7 illustrates the operation of the squeegee and cover at the end of the printing process in this embodiment. [Figure 10H] Figure 8 illustrates the operation of the squeegee and cover at the end of the printing process in this embodiment. [Figure 10I] Figure 9 illustrates the operation of the squeegee and cover at the end of the printing process in this embodiment. [Figure 10J] Figure 10 illustrates the operation of the squeegee and cover at the end of the printing process in this embodiment. [Figure 11]Figure showing the configuration of the solder drop prevention mechanism as a modification in the present embodiment

Embodiments for Carrying Out the Invention

[0009] Hereinafter, embodiments of the present disclosure will be described in detail with appropriate reference to the drawings. However, a more detailed description than necessary may be omitted. For example, detailed descriptions of well-known matters and duplicate descriptions for substantially the same configurations may be omitted. This is to avoid making the following description unnecessarily redundant and to facilitate understanding by those skilled in the art. The attached drawings and the following description are provided for those skilled in the art to fully understand the present disclosure, and are not intended to limit the subject matter described in the claims.

[0010] (This embodiment) <Configuration of the screen printing device> Referring to FIGS. 1 and 2, the configuration of the screen printing device 1 will be described. FIG. 1 is a perspective view showing the screen printing device 1 in the present embodiment. FIG. 2 is a side view showing the screen printing device 1 in the present embodiment.

[0011] The screen printing device 1 receives the substrate 2 input from the upstream process side, repeatedly executes a screen printing operation of screen printing the solder paste 9 on each electrode 2d of the substrate 2, and delivers it to the device on the downstream process side. The screen printing device 1 may be read as a printing device. The substrate 2 may be read as a circuit board. The solder paste 9 may be read as solder or paste. As an example of the device on the downstream process side, a component mounting device (not shown) can be mentioned.

[0012] For the sake of explanation, the left-right direction as seen from operator 8 will be defined as the X-axis direction, with the left being the upstream process side and the right being the downstream process side. The forward direction will be defined as the direction approaching operator 8, and the backward direction as the direction away from operator 8, with the forward-backward direction being defined as the Y-axis direction, and the up-down direction as the Z-axis direction. For the sake of explanation, the negative direction of the X-axis may be referred to as "left," the positive direction of the X-axis as "right," the negative direction of the Y-axis as "forward," the positive direction of the Y-axis as "backward," the positive direction of the Z-axis as "up," and the negative direction of the Z-axis as "down." These directional expressions are used for the sake of explanation and are not intended to limit the orientation of the structure during actual use.

[0013] The screen printing apparatus 1 includes a substrate holding and moving mechanism 12 on a base 11. The substrate holding and moving mechanism 12 includes a mechanism for holding and moving the substrate 2 to be printed. The substrate holding and moving mechanism 12 may be interpreted as a table. A screen mask 13 is provided above the substrate holding and moving mechanism 12. The screen mask 13 may be interpreted as a mask.

[0014] To the left of the substrate holding and moving mechanism 12 is an input conveyor 14 that receives substrates 2 fed from the upstream process side of the screen printing apparatus 1 and transports them to the substrate holding and moving mechanism 12. To the right of the substrate holding and moving mechanism 12 is an output conveyor (not shown) that receives substrates 2 from the substrate holding and moving mechanism 12 and transports them to the downstream process side.

[0015] A camera 16 is movably mounted in the lower region of the screen mask 13. A squeegee head 17 is movably mounted in the upper region of the screen mask 13.

[0016] As shown in Figure 2, the substrate holding and moving mechanism 12 has a substrate holding section 21 and a moving table section 22.

[0017] The substrate holding unit 21 comprises a positioning conveyor 31, a lower support unit 32, and a pair of front and rear clampers 33. The positioning conveyor 31 positions the substrate 2 received from the input conveyor 14 at a predetermined clamping position. The lower support unit 32 supports the substrate 2 positioned at the clamping position by the positioning conveyor 31 from below. The clampers 33 clamp and hold the substrate 2 from the side (in the Y-axis direction). Of the two clampers 33 of the substrate holding unit 21, the one located on the operator 8's side is referred to as the front clamper 33F, and the one located on the opposite side from the operator 8 is referred to as the rear clamper 33R. Note that operator 8 may be read as worker.

[0018] The movable table section 22 consists of an XYθ table mechanism in which multiple table mechanisms are stacked in multiple stages, and moves the substrate holding section 21 in the horizontal plane and in the vertical direction.

[0019] The screen mask 13 is constructed of a rectangular, flat metal member extending in the XY plane. Pattern openings (not shown) are provided in the screen mask 13, corresponding to the arrangement of electrodes 2d on the substrate 2. The term "pattern openings" may be read as "openings." The screen mask 13 is framed and supported by a substantially rectangular frame member 13W.

[0020] As shown in Figure 1, above the substrate holding and moving mechanism 12, L-shaped rail-shaped mask support sections 19 are provided opposite each other, supporting the left and right sides of the frame member 13W. The screen mask 13 and the frame member 13W are positioned on the rails of the mask support sections 19 and are movable in the front-rear direction.

[0021] As shown in Figure 2, the camera 16 has an upward imaging unit 16a with an upward imaging field of view and a downward imaging unit 16b with a downward imaging field of view. The camera 16 is driven by a camera movement mechanism 16K which uses a ball screw mechanism as an actuator and is movable in the XY plane.

[0022] <Squeegee head configuration> The configuration of the squeegee head 17 will be described with reference to Figures 1, 2, 3A, and 3B. Figure 3A is a side view of the squeegee head 17 when the cover 210 of the solder fall prevention mechanism 200 is in the retracted position P1 in this embodiment. Figure 3B is a side view of the squeegee head 17 when the cover 210 of the solder fall prevention mechanism 200 is in the receiving position P2 in this embodiment.

[0023] The squeegee head 17 comprises a movable base 41, two squeegees 42, and two squeegee lifting cylinders 43.

[0024] The movable base 41 is a member that extends in the left-right direction. The movable base 41 moves in the front-rear direction, driven by the print head moving mechanism 17K, which uses a ball screw mechanism as an actuator.

[0025] The two squeegees 42 are arranged opposite each other on the moving base 41, one in front of the other. The two squeegees 42 move together in the front-to-back direction as the moving base 41 moves in the front-to-back direction. Of the two squeegees 42, the one located in front (right side of Figure 2) is called the front squeegee 42F, and the one located behind (left side of Figure 2) is called the rear squeegee 42R.

[0026] The front squeegee 42F and the rear squeegee 42R each consist of a spatula-shaped member extending in the left-right direction, and extend diagonally downwards in a manner that spreads downwards from one another. For the front squeegee 42F, the rear surface is the paste scraping surface, and for the rear squeegee 42R, the front surface is the paste scraping surface.

[0027] Two squeegee lifting cylinders 43 are mounted on the moving base 41, side by side in the front-to-back direction. The front squeegee lifting cylinder 43 raises and lowers the front squeegee 42F, and the rear squeegee lifting cylinder 43 raises and lowers the rear squeegee 42R.

[0028] The squeegee lifting cylinder 43 can raise and lower the squeegee 42 between a standby height position (see squeegee 42 shown in Figure 2) where the lower end of the squeegee 42 is separated from the upper surface of the screen mask 13 by a predetermined distance, and a contact height position where the lower end of the squeegee 42 is in contact with the screen mask 13.

[0029] The squeegee head 17 is equipped with an automatic mask positioning unit 91 and a solder paste recovery device 71.

[0030] The automatic mask positioning unit 91 moves the screen mask 13 by moving the frame member 13W of the screen mask 13, thereby positioning the screen mask 13. At this time, the automatic mask positioning unit 91 may move even further back than the frame member 13W. This moved position becomes the rearmost position of the squeegee head 17.

[0031] The solder paste recovery device 71 is a device for recovering excess solder paste 9 on the screen mask 13. The solder paste recovery device 71 may be installed between the squeegee head 17 and the automatic mask positioning unit 91. This ensures that even when the squeegee head 17 moves to its rearmost position, it does not interfere with the equipment frame 113.

[0032] The solder paste recovery device 71 is detachably attached to the solder recovery and mounting unit 93 of the automatic mask positioning unit 91. Next, the configuration of the solder recovery and mounting unit 93 will be described in detail.

[0033] The solder recovery and mounting unit 93 includes a rod 97 for mask positioning, a cylinder 99 for driving the rod 97 vertically, and a recovery unit support rod 105 for supporting the solder paste recovery device 71. Multiple cylinders 99 are arranged along the left-right direction and are mounted on the housing of the solder recovery and mounting unit 93.

[0034] Furthermore, in the solder recovery mounting unit 93, a recovery unit support rod 105 is provided between the multiple cylinders 99. A lifting cylinder and a lifting rod for raising and lowering the solder paste recovery device 71 are attached to the recovery unit support rod 105. The solder paste recovery device 71 is attached to the lifting rod.

[0035] The solder paste recovery device 71 has a contact portion 73 that contacts the screen mask 13 and holds the recovered solder paste 9.

[0036] The contact portion 73 consists of a strip-shaped thin plate that extends along the longitudinal direction of the squeegee 42. One long side of the contact portion 73 is fixed to the housing 89 of the solder paste recovery device 71, and the other long side is mounted at an inclination downward.

[0037] When a printing operation is completed, the solder paste recovery device 71 moves its contact portion 73 forward, bringing it into contact with the screen mask 13, and recovers any excess solder paste 9 on the screen mask 13. When the screen mask 13 is replaced with one to be used for the next printing operation, the solder paste recovery device 71 supplies the recovered solder paste 9 onto the replacement screen mask 13.

[0038] The squeegee head 17 is equipped with a solder fall prevention mechanism 200, which prevents solder paste 9 adhering to the squeegee 42 from falling onto the screen mask 13. The solder fall prevention mechanism 200 consists of a cover 210 and a cover movement mechanism 220. The cover 210 catches the solder paste 9 that adheres to the squeegee 42 when it is raised. The cover movement mechanism 220 is a mechanism that moves the cover 210 between a retracted position P1, which is a position that does not hinder the sliding of the squeegee 42 on the screen mask 13, and a receiving position P2, which is a position that catches the solder paste 9 that has adhered to the squeegee 42. Next, the solder fall prevention mechanism 200 will be described in detail.

[0039] <Details of the solder fall prevention mechanism> The configuration of the solder fall prevention mechanism 200 will be described in detail with reference to Figures 3A, 3B, 4A, 4B, 5A, 5B, and 6. Figure 4A is a perspective view showing the vicinity of the squeegee 42 when the cover 210 of the solder fall prevention mechanism 200 is in the retracted position P1 in this embodiment. Figure 4B is a perspective view showing the vicinity of the squeegee 42 when the cover 210 of the solder fall prevention mechanism 200 is in the receiving position P2 in this embodiment. Figure 5A is a perspective view showing the solder fall prevention mechanism 200 when the cover 210 is in the retracted position P1 in this embodiment. Figure 5B is a perspective view showing the solder fall prevention mechanism 200 when the cover 210 is in the receiving position P2 in this embodiment. Figure 6 is a diagram for explaining the attachment and detachment of the flat plate 212 that constitutes the cover 210 in this embodiment.

[0040] As described above, the solder fall prevention mechanism 200 is comprised of a cover 210 and a cover movement mechanism 220.

[0041] The length of the cover 210 in the left-right direction is longer than the length of the squeegee 42 in the left-right direction. In addition, the length of the cover 210 in the front-rear direction is longer than the distance between the lower end of the front squeegee 42F and the lower end of the rear squeegee 42R when viewed from the side. As a result, when the cover 210 is positioned at the receiving position P2 below the front squeegee 42F and the rear squeegee 42R, it can also receive solder paste 9 that falls from either the front squeegee 42F or the rear squeegee 42R.

[0042] The cover movement mechanism 220 has a mechanism for moving the cover 210 between a retracted position P1 and a receiving position P2. For example, the cover movement mechanism 220 is composed of two fixed parts 221, two first arms 222, two second arms 223, and two air cylinders 224.

[0043] The two fixing parts 221 are fixed to the left and right sides of the squeegee head 17, respectively.

[0044] The two air cylinders 224 are an example of actuators that drive the cover 210. The two air cylinders 224 are fixed to the left fixed part 221 and the right fixed part 221, respectively. The air cylinders 224 slide the rod 225 in the front-rear direction by intake and exhaust. Note that other types of actuators, such as hydraulic cylinders, may be used instead of the air cylinders 224.

[0045] One first arm 222 is connected at one end to the short left side of the cover 210 by a rotating shaft 231, and at the other end to the rod 225 of the left air cylinder 224 by a rotating shaft 232. In addition, one first arm 222 is connected to the left fixed part 221 by a rotating shaft 233 midway between the two ends. The other first arm 222 is connected at one end to the short right side of the cover 210 by a rotating shaft 231, and at the other end to the rod 225 of the right air cylinder 224 by a rotating shaft 232. In addition, the other first arm 222 is connected to the right fixed part 221 by a rotating shaft 233 midway between the two ends.

[0046] One second arm 223 is positioned approximately parallel to the left first arm 222, with one end connected to the left short side of the cover 210 by a pivot shaft 234 and the other end connected to the left fixing part 221 by a pivot shaft 235. The other second arm 223 is positioned approximately parallel to the right first arm 222, with one end connected to the right short side of the cover 210 by a pivot shaft 234 and the other end connected to the right fixing part 221 by a pivot shaft 235.

[0047] When moving the cover 210 to the retracted position P1, the air cylinder 224 operates as follows: The air cylinder 224 slides the rod 225 backward, as shown in Figures 4A and 5A. As a result, the other end of the first arm 222 moves backward and downward by the rod 225, and the pivot shaft 233 connecting the first arm 222 and the fixed part 221 acts as a fulcrum, causing one end of the first arm 222 to move forward and upward. Consequently, the cover 210 connected to one end of the first arm 222 also moves forward and upward. As a result, the cover 210 moves to the retracted position P1.

[0048] When moving the cover 210 to the receiving position P2, the air cylinder 224 operates as follows: The air cylinder 224 slides the rod 225 forward, as shown in Figures 4B and 5B. As a result, the other end of the first arm 222 moves forward and upward by the rod 225, and the pivot shaft 233 connecting the first arm 222 and the fixed part 221 acts as a fulcrum, causing one end of the first arm 222 to move backward and downward. Consequently, the cover 210 connected to one end of the first arm 222 also moves backward and downward. As a result, the cover 210 moves to the receiving position P2. Here, the receiving position P2 is below the squeegee 42. That is, the lengths of the first arm 222 and the second arm 223, and the sliding distance of the rod 225 of the air cylinder 224, etc., may be designed so that the cover 210 is located below the squeegee 42, which is the receiving position P2.

[0049] The cover movement mechanism 220 is configured to maintain the horizontal position of the cover 210 while it moves between the retracted position P1 and the receiving position P2. This prevents the solder paste 9 that the cover 210 has received from sliding off the cover 210 while the cover moves between the retracted position P1 and the receiving position P2.

[0050] As shown in Figure 6, the cover 210 is composed of a support plate 211 and a flat plate 212. The support plate 211 is made of a thin, roughly rectangular plate. The flat plate 212 is made of a thin, roughly rectangular plate that can be placed on top of the support plate 211.

[0051] The flat plate 212 is configured to be detachably attached to the support plate 211. For example, a protrusion 213 is formed on one short side of the flat plate 212, and this protrusion 213 can engage with a recess 214 formed on one short side of the support plate 211. In addition, the other short side of the flat plate 212 and the other short side of the support plate 211 can be fixed by a knurled screw 216. As a result, as shown in Figure 6, the operator 8 can easily remove the flat plate 212 from the support plate 211 by removing the knurled screw 216, lifting the other short side of the flat plate 212, and disengaging the protrusion 213 on one short side of the flat plate 212 from the recess 214 of the support plate 211.

[0052] Therefore, even if the flat plate 212 becomes contaminated with solder paste 9 that has fallen from the squeegee 42, the operator 8 can replace it with a clean flat plate 212 and immediately resume printing. Thus, compared to interrupting the printing process to clean the contaminated cover 210, the printing efficiency is improved. The contaminated flat plate 212 can be cleaned and reused during the external setup.

[0053] A rib 215 extending upward along the long front edge of the support plate 211 may be provided. This prevents the support plate 211 from bending. On the other hand, a rib does not need to be provided on the long rear edge of the support plate 211. If a rib is provided on the long rear edge of the support plate 211, there is a risk that solder paste 9 dripping from the squeegee 42 will adhere to the rib when the cover 210 is moved to the receiving position P2.

[0054] Furthermore, when the cover 210 is in the receiving position P2, the distance between the cover 210 and the lower end of the squeegee 42 may be longer than the distance between the cover 210 and the screen mask 13. By increasing the distance between the cover 210 and the lower end of the squeegee 42, the possibility of solder paste 9 dripping from the squeegee 42 coming into contact with the rear long edge of the cover 210 when the cover 210 is moved to the receiving position P2 can be reduced.

[0055] <Control System Configuration> The control system of the screen printing apparatus 1 will be explained with reference to Figure 7. Figure 7 is a block diagram showing the control system of the screen printing apparatus 1 in this embodiment.

[0056] The screen printing apparatus 1 has a control device 60 that controls the operation of each device in the screen printing apparatus 1. The control device 60 may be interpreted as a control unit, controller, processor, or CPU (Central Processing Unit). The control device 60 may also include memory (e.g., ROM (Read-Only Memory) and RAM (Random Access Memory)) for storing data and computer programs used for control.

[0057] The control device 60 controls the operation of transporting the substrate 2 by the input conveyor 14, holding and moving the substrate 2 by the substrate holding and moving mechanism 12, and transporting the substrate 2 by the output conveyor (not shown). The control device 60 controls the operation of moving the camera 16 by the camera moving mechanism 16K and taking images with the camera 16, moving the squeegee head 17 by the print head moving mechanism 17K, and raising and lowering each squeegee 42 by the squeegee lifting cylinder 43. The control device 60 controls the operation of collecting and supplying solder paste 9 by the solder paste collection device 71.

[0058] The control device 60 controls the movement of the cover 210 by the cover movement mechanism 220. Details of the control of the movement of the cover 210 will be described later. The control device 60 also controls the solder cutting operation of the squeegee 42. Details of the solder cutting operation of the squeegee 42 will be described later.

[0059] Image data obtained by the camera 16 is sent to the control device 60, where image recognition is performed in the image processing unit 60a of the control device 60.

[0060] In the screen printing apparatus 1 of this embodiment, necessary inputs are received from an input device 61 connected to a control device 60. This allows the contact points of each of the front and rear pair of squeegees 42 to be set arbitrarily.

[0061] Furthermore, by receiving the necessary input from the input device 61, the sliding speed of the squeegee 42 on the screen mask 13 and the printing pressure of the squeegee 42 on the screen mask 13 can be arbitrarily set.

[0062] Furthermore, the screen printing device 1 can arbitrarily set the printing start position and printing end position based on input from the input device 61. The input device 61 may arbitrarily select either the front or rear side for the printing start position. The input device 61 may arbitrarily select either the front or rear side for the printing end position. The input device 61 may notify the control device 60 of the selected printing start position and / or printing end position. The input device 61 may consist of input devices such as a touch panel, push buttons, and switches.

[0063] The control device 60 may set the solder paste collection position according to the printing end position. The control device 60 may set the solder paste supply position according to the printing start position.

[0064] <Details of cover movement control> The movement control of the cover 210 by the control device 60 will be explained in detail with reference to Figures 8 and 9.

[0065] Figure 8 is a flowchart showing an example of the processing performed by the control device 60 at the end of a printing operation in this embodiment. The control device 60 may start the processing when it detects the end of the printing operation. For example, the control device 60 starts the processing when the operator 8 presses the production end button. For example, the control device 60 starts the processing when a preset amount of production has been completed. For example, the control device 60 starts the processing when switching production models. For example, the control device 60 starts the processing when replacing the solder supply unit 190 (see Figures 10A to 10J). The solder supply unit 190 is a unit (device) that automatically supplies solder paste 9 onto the screen mask 13. For example, the control device 60 starts the processing when a squeegee 42 rise control is required. For example, the control device 60 starts the processing after stopping the sliding of the squeegee 42 on the screen mask 13.

[0066] As S101, the control device 60 performs a solder cutting operation on the squeegee 42. Details of the solder cutting operation will be described later, but as a result of the solder cutting operation, at least a portion of the solder paste 9 that has dripped down from the squeegee 42 adheres to (transfers) to the screen mask 13. Note that the solder cutting operation of the squeegee 42 is performed if printing has been performed immediately before, but does not need to be performed if printing has not been performed immediately before. This is because if printing has not been performed immediately before, there is no solder paste 9 dripping down onto the squeegee 42.

[0067] As S102, the control device 60 raises the squeegee 42.

[0068] In step S103, the control device 60 releases the lock on the cover 210 to move. This allows the cover 210 to move.

[0069] In S104, the control device 60 drives the cover moving mechanism 220 to move the cover 210 from the retracted position P1 to the receiving position P2.

[0070] In step S105, the control device 60 sets a lock on the movement of the cover 210. This fixes the cover 210 in the receiving position P2.

[0071] Figure 9 is a flowchart showing an example of the processing performed by the control device 60 at the start of printing in this embodiment. The control device 60 may start the processing when it detects the start of printing. For example, the control device 60 starts the processing when the operator 8 presses the start (or restart) production button. For example, the control device 60 starts the processing when the replacement of the squeegee 42 is completed. For example, the control device 60 starts the processing when a downward control of the squeegee 42 occurs. For example, the control device 60 starts the processing before the squeegee 42 starts sliding on the screen mask 13.

[0072] As S201, the control device 60 releases the movement lock on the cover 210. This allows the cover 210 to move.

[0073] In S202, the control device 60 drives the cover moving mechanism 220 to move the cover 210 from the receiving position P2 to the retracted position P1.

[0074] As S203, the control device 60 sets a movement lock for the cover 210. This fixes the cover 210 in the retracted position P1.

[0075] In step S204, the control device 60 lowers the squeegee 42 and starts printing. Note that the lowering of the squeegee 42 is performed when printing is to be started, but does not need to be performed when printing is not to be started.

[0076] <Details of the squeegee and cover operation at the end of the printing process> Referring to Figures 10A to 10J, an example of the operation of the squeegee 42 and cover 210 at the end of the printing process will be described in detail. Figures 10A to 10J are diagrams illustrating the operation of the squeegee 42 and cover 210 at the end of the printing process in this embodiment. Note that the operation described in Figures 10A to 10J may be controlled by the control device 60. Also, although Figures 10A to 10J show an example in which the solder supply unit 190 is connected to the squeegee head 17, the solder supply unit 190 does not have to be connected.

[0077] First, as shown in Figure 10A, the front squeegee 42F moves from front to back while lowering itself, scraping the solder paste 9 on the screen mask 13. At this time, the rear squeegee 42R is in an elevated position. As a result, the solder paste 9 is printed onto the substrate 2 through the pattern openings provided in the screen mask 13. The front squeegee 42F then stops at the printing completion position.

[0078] Next, as shown in Figure 10B, the substrate holding and moving mechanism 12 lowers the substrate 2 on which the solder paste 9 is printed. This separates the substrate 2 from the screen mask 13.

[0079] Next, as shown in Figure 10C, the substrate holding and moving mechanism 12 moves the substrate 2 to the discharge conveyor (not shown). At this point, if the control device 60 detects the end of the printing operation, the front squeegee 42F rises, as shown in Figure 10D.

[0080] Next, as shown in Figures 10E and 10F, the rear squeegee 42R performs a solder cutting operation at a predetermined solder cutting position Q. That is, as part of the solder cutting operation, the rear squeegee 42R descends once at the solder cutting position Q and then rises. The descended rear squeegee 42R may or may not come into contact with the screen mask 13. Furthermore, the descending and rising movements of the rear squeegee 42R due to the solder cutting operation may occur once or multiple times. As a result, at least a portion of the solder paste 9 that was hanging down from the rear squeegee 42R adheres (transfers) to the screen mask 13, and the amount of solder paste 9 hanging down from the rear squeegee 42R is shortened. Note that the solder cutting position Q may be the same as or near the printing end position of the squeegee 42.

[0081] Next, as shown in Figure 10G, the front squeegee 42F moves to the solder cutting position Q. Then, as shown in Figures 10G and 10H, the front squeegee 42F performs a solder cutting operation at the solder cutting position Q. That is, as part of the solder cutting operation, the front squeegee 42F descends once at the solder cutting position Q and then rises. The descended front squeegee 42F may or may not come into contact with the screen mask 13. Also, the descending and rising movements of the front squeegee 42F due to the solder cutting operation may occur once or multiple times. As a result, at least a portion of the solder paste 9 that was hanging down from the front squeegee 42F adheres (transfers) to the screen mask 13, and the amount of solder paste 9 hanging down from the front squeegee 42F is shortened.

[0082] Furthermore, the solder paste 9 that adheres to the screen mask 13 side due to the solder cutting operation described in Figures 10E, 10F, 10G, and 10H may be recovered by the solder paste recovery device 71 and reused. This reduces the amount of solder paste 9 wasted and improves the efficiency of resource utilization.

[0083] Furthermore, in the solder cutting operation described in Figures 10E, 10F, 10G, and 10H, since the printing end position is at the rear (far from operator 8), after the rear squeegee 42R performs the solder cutting operation at solder cutting position Q, the front squeegee 42F moves to solder cutting position Q and performs the solder cutting operation. This allows for efficient solder cutting operations of the rear squeegee 42R and front squeegee 42F without having to move the squeegee head 17 forward while it is moving backward. However, if the printing end position is at the front (closer to operator 8), the front squeegee 42F may perform the solder cutting operation at solder cutting position Q, and then the rear squeegee 42R may move to solder cutting position Q and perform the solder cutting operation. This allows for efficient solder cutting operations of the front squeegee 42F and rear squeegee 42R without having to move the squeegee head 17 backward while it is moving forward. Furthermore, both the front squeegee 42F and the rear squeegee 42R may perform the desoldering operation simultaneously at the end of printing. In this case, although there will be two desoldering positions Q, the time required for the desoldering operation can be reduced.

[0084] Next, as shown in Figure 10I, the cover 210 moves from the retracted position P1 to the receiving position P2 while maintaining a horizontal position. Here, as described above, the squeegee 42 has already performed a solder cutting operation, so it is avoided that the cover 210, moving from the retracted position P1 to the receiving position P2, will come into contact with the solder paste 9 hanging down from the squeegee 42. If the solder cutting operation is not performed and the solder paste 9 is hanging down a long distance from the squeegee 42, and the cover 210 moves from the retracted position P1 to the receiving position P2 as shown in Figure 10I, the following situation may occur. That is, the cover 210 cuts the solder paste 9 that is hanging down a long distance from the squeegee 42, and the cut solder paste 9 falls onto the screen mask 13 or into the inside of the device.

[0085] Next, as shown in Figure 10J, while maintaining the position of the cover 210 at the receiving position P2, the squeegee head 17 moves forward (towards the operator 8). During this movement, the solder paste 9 that falls from the squeegee 42 is caught by the cover 210 and does not reach the screen mask 13.

[0086] After the squeegee head 17 has finished moving forward, the operator 8 performs a predetermined task. For example, the operator 8 supplies solder paste 9 to the solder supply unit 190. For example, the operator 8 replaces the screen mask 13. For example, the operator 8 sets the lower support unit 32. For example, the operator 8 replaces the flat plate 212 of the cover 210. Note that when the operator 8 replaces the flat plate 212 of the cover 210, the cover 210 may be moved to the retracted position P1. This brings the cover 210 closer to the operator 8, making it easier to replace the flat plate 212.

[0087] <Variation> Figure 11 shows the configuration of a solder fall prevention mechanism 300 as a modified example in this embodiment. As shown in Figure 11, the solder fall prevention mechanism 300 includes a cover 310 and a pole 320.

[0088] The cover 310 is fixed to one end of the pole 320. The other end of the pole 320 is connected to the squeegee head 17 by a pivot shaft 311. This allows the cover 310 and the pole 320 to pivot about the pivot shaft 321 connected to the squeegee head 17.

[0089] The solder fall prevention mechanism 300 may be configured such that when the pole 320 is facing downwards, the cover 310 is positioned at the receiving position P2 (position of the solid line), and when the pole 320 is facing diagonally downwards, the cover 310 is positioned at the retracted position P1 (position of the dashed line). This allows the cover 310 to be moved between the receiving position P2 and the retracted position P1 by rotating the pole 320.

[0090] However, in the configuration shown in Figure 11, when the cover 310 is moved to the retracted position P1, the cover 310 tilts, which may cause the solder paste 9 that has fallen onto the cover 310 to slide off.

[0091] In contrast, the solder fall prevention mechanism 200 shown in Figures 3A and 3B has the advantage that the horizontal position of the cover 210 is maintained even while the cover 210 moves to the retracted position P1, so that the solder paste 9 that has fallen onto the cover 210 does not slide off the cover 210.

[0092] Furthermore, if the solder supply unit 190 is connected in front of the squeegee head 17, the configuration shown in Figure 11 makes it impossible to set the retracted position P1 of the cover 310 to the front (closer to the operator 8), and the retracted position P1 of the cover 310 must be set to the rear (further away from the operator 8). In this case, it becomes difficult for the operator 8 to clean the cover 310 located at the retracted position P1.

[0093] In contrast, the solder fall prevention mechanism 200 shown in Figures 3A and 3B allows the retraction position P1 of the cover 210 to be positioned forward (closer to the operator 8), even when the solder supply unit 190 is connected in front of the squeegee head 17. Therefore, when the printing operation is finished, the operator 8 can easily clean the cover 210 by moving it to the forward retraction position P1.

[0094] (Summary of this disclosure A) The printing apparatus 1 described above in this disclosure can be expressed as follows:

[0095] (Expression A1) The printing apparatus 1 for printing solder paste 9 onto a substrate 2 using a mask 13 according to this disclosure comprises a squeegee 42 that slides on the mask 13 and prints solder paste 9 onto the substrate 2 through an opening provided in the mask 13, a cover 210 that catches the solder paste 9 that adheres to the squeegee 42, and a control unit 60 that controls the movement of the cover 210 between a retracted position P1, which is a position that does not hinder the sliding of the squeegee 42 on the mask 13, and a receiving position P2, which is a position that catches the solder paste 9 that adheres to the squeegee 42.

[0096] As a result, any solder paste 9 adhering to the squeegee 42 that falls is caught by the cover 210 located in the retracted position P1, thus preventing the solder paste 9 adhering to the squeegee 42 from falling into the mask 13 or the inside of the device 1.

[0097] (Expression A2) In the above representation A1, the cover 210 is configured to include a horizontal flat plate 212 that catches the solder paste 9 that falls from the squeegee 42, and may move between the retracted position P1 and the receiving position P2 while maintaining the horizontal orientation of the flat plate 212.

[0098] As a result, the horizontal position of the cover 210 is maintained while it moves between the retracted position P1 and the receiving position P2, thus preventing the solder paste 9 on the cover 210 from sliding off.

[0099] (Expression A3) In the above expression A2, the flat plate 212 of the cover 210 may be detachable.

[0100] This allows the flat plate 212 that received the solder paste 9 to be replaced, and production to be resumed immediately.

[0101] (Expression A4) In any one of the above expressions A1 to A3, the control unit 60 may, after stopping the sliding of the squeegee 42 on the mask 13, raise the squeegee 42 and move the cover 210 from the retracted position P1 to the receiving position P2.

[0102] As a result, when the printing process is completed (or interrupted), the cover 210 automatically moves to the receiving position P2.

[0103] (Expression A5) In any one of the above expressions A1 to A4, the control unit 60 may move the cover 210 from the receiving position P2 to the retracted position P1 and lower the squeegee 42 before starting the sliding of the squeegee 42 on the mask 13.

[0104] As a result, when printing starts (or resumes), the cover 210 automatically moves to the retracted position P1.

[0105] (Expression A6) In any one of the above expressions A1 to A5, the retraction position P1 may be closer to the operator 8 of the printing device 1 than the receiving position P2.

[0106] This allows operator 8 to easily clean the cover 210 located in the retracted position P1.

[0107] (Summary of this disclosure B) Furthermore, the printing apparatus relating to the present disclosure described above can be expressed as follows:

[0108] (Expression B1) The printing apparatus 1 for printing solder paste 9 onto a substrate using a mask 13 according to this disclosure comprises a squeegee 42 that slides on the mask 13 and prints solder paste 9 onto the substrate 2 through an opening provided in the mask 13, and a control unit 60 that controls a solder cutting operation, which is the operation of lowering the squeegee 42 in order to transfer at least a portion of the solder paste 9 attached to the squeegee 42 to the mask 13 side.

[0109] As a result, the solder paste 9 that has adhered to the squeegee 42 due to the solder cutting operation adheres (transfers) to the mask 13 side, and the solder paste 9 that has adhered to the mask 13 side can be recovered and reused.

[0110] (Expression B2) In the above expression B1, the printing apparatus 1 further includes a cover 210 that catches the falling solder paste 9 attached to the squeegee 42, and the control unit 60 may perform a solder cutting operation of the squeegee 42 and move the cover 210 from a retracted position P1, which is a position that does not obstruct the sliding of the squeegee 42 on the mask 13, to a receiving position P2, which is a position that catches the falling solder paste 9 attached to the squeegee 42.

[0111] As a result, the solder paste 9 that has adhered to the squeegee 42 due to the solder cutting operation adheres (transfers) to the mask 13 side, and the amount of solder paste 9 hanging down from the squeegee 42 becomes shorter, thus preventing the cover 210, which moves from the retracted position P1 to the receiving position P2, from coming into contact with the solder paste 9 hanging down from the squeegee 42.

[0112] (Expression B3) In the above expression B1 or B2, the control unit 60 may perform a solder cutting operation on the squeegee 42 at the printing completion position of the squeegee 42.

[0113] As a result, excess solder paste 9 from printing and solder paste 9 that adheres to the mask 13 due to the solder cutting operation accumulate together at the end of printing. Therefore, it becomes easier to collect the excess solder paste 9.

[0114] (Expression B4) In the above expression B3, the squeegee 42 includes a first squeegee 42F on the side closer to the operator 8 of the printing device 1, and a second squeegee 42R on the side further from the operator 8. If the printing end position is on the side closer to the operator 8, after performing the desoldering operation of the first squeegee 42F at the printing end position, the second squeegee 42R may be moved to the printing end position and the desoldering operation of the second squeegee 42R may be performed.

[0115] This allows for efficient solder cutting operations of the first squeegee 42F and the second squeegee 42R while moving the squeegee 42 toward the operator 8.

[0116] (Expression B5) In the above expression B3, the squeegee 42 includes a first squeegee 42F on the side closer to the operator 8 of the printing device 1, and a second squeegee 42R on the side further from the operator 8. If the printing end position is on the side further from the operator 8, the solder desoldering operation of the second squeegee 42R may be performed at the printing end position, and then the first squeegee 42F may be moved to the printing end position and the solder desoldering operation of the first squeegee 42F may be performed.

[0117] This allows for efficient solder cutting operations of the second squeegee 42R and the first squeegee 42F while moving the squeegee 42 away from the operator 8.

[0118] While embodiments have been described above with reference to the attached drawings, this disclosure is not limited to such examples. It is clear to those skilled in the art that various modifications, alterations, substitutions, additions, deletions, and equivalents can be conceived within the scope of the claims, and these are also understood to fall within the technical scope of this disclosure. Furthermore, the components of the embodiments described above can be combined in any way without departing from the spirit of the invention.

[0119] This application is based on the Japanese Patent Application No. 2020-175458 filed on October 19, 2020, and its contents are incorporated herein by reference. [Industrial applicability]

[0120] The technology disclosed herein is useful for printing apparatus that uses solder. [Explanation of Symbols]

[0121] 1. Screen printing device 2 circuit boards 2d electrode 8 Operators 9 Solder paste 11 Base 12. Substrate holding and moving mechanism 13 Screen Masks 13W Frame component 14. Incoming conveyor 16 cameras 16K Camera Movement Mechanism 16a Upper imaging section 16b Lower imaging section 17 Squeegee Head 17K Printhead Movement Mechanism 19 Mask support section 21 Board holding part 22 Mobile Table Section 31 Conveyor 32 Lower support section 33 Clamper 33F Front Clamper 33R Rear Clamper 41 Mobile base 42 squeegee 42F Front squeegee 42R Rear Squeegee 43 Squeegee Lifting Cylinder 60 Control device 60a Image Processing Unit 61 Input device 71 Solder paste recovery device 73 Contact part 89 cabinets 91 Automatic Mask Positioning Unit 93 Solder Recovery and Installation Unit 97 Rod 99 cubic centimeters 105 Recovery unit support rod 113. Framework 190 Solder supply unit 200 Solder Drop Prevention Mechanism 210 Cover 211 Support plate 212 Plane plate 213 Convex part 214 recess 215 Rib 216 Knurled Screw 220 Cover movement mechanism 221 Fixed part 222 First Arm 223 Second Arm 224 Air Cylinder 225 Rod 231, 232, 233, 234, 235 Rotation axis 300 Solder Drop Prevention Mechanism 310 Cover 311 Rotation axis 320 poles P1 Evacuation position P2 receiving position Q Solder cutting position

Claims

1. A printing apparatus for printing solder paste onto a circuit board using a mask, A squeegee slides on the mask and prints the solder paste onto the substrate through an opening provided in the mask, A cover that catches the solder paste that has fallen from the squeegee, A control unit controls the movement of the cover between a retracted position, which is a position that does not hinder the sliding of the squeegee on the mask, and a receiving position, which is a position that receives the falling solder paste attached to the squeegee. The system includes a solder paste recovery device for recovering the solder paste on the mask, The aforementioned retraction position is between the receiving position and the solder paste recovery device. Printing device.

2. The cover is configured to include a horizontal flat plate that catches the solder paste that falls from the squeegee, and moves between the retracted position and the receiving position while maintaining the horizontal orientation of the flat plate. The printing apparatus according to claim 1.

3. The flat plate of the cover is detachable. The printing apparatus according to claim 2.

4. After stopping the sliding of the squeegee on the mask, the control unit raises the squeegee and moves the cover from the retracted position to the receiving position. A printing apparatus according to any one of claims 1 to 3.

5. Before the squeegee begins to slide on the mask, the control unit moves the cover from the receiving position to the retracted position and lowers the squeegee. A printing apparatus according to any one of claims 1 to 3.

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