Module for flipping substrates in a vacuum

Abstract

Provided herein are apparatus and methods for flipping a substrate in a vacuum between PVD sputtering of each side to improve throughput. In some embodiments disclosed herein, a processing system module for flipping a substrate in a vacuum is provided. The module includes a clamp assembly for clamping the substrate, a motor assembly coupled to the substrate clamp assembly for rotating the clamp assembly, a lift pin assembly, and a lift pin actuator for raising and lowering the lift pin assembly.

Description

[Technical Field]

[0001] FIELD OF THE DISCLOSURE Embodiments of the present disclosure generally relate to apparatus and methods for processing substrates in electronic device manufacturing systems, and more particularly to apparatus and methods for inverting a substrate in a vacuum between deposition processes performed on both sides of the substrate. [Background technology]

[0002] Substrate processing in electronic device manufacturing often involves performing deposition processes on both sides of a substrate. However, process chambers are typically designed to deposit material on only one surface at a time, such as the top or bottom surface of a substrate. Therefore, it is often necessary to flip or reorient the substrate relative to the chamber between deposition processes.

[0003] This is particularly challenging when processing some large-area substrates, such as panels. For example, a typical panel size may be 600 mm x 600 mm. Common panel materials can include Ajinomoto Build-up Film (ABF), Copper Clad Laminate (CCL), polymer-topped panels, glass, etc. Due to the large surface area of ​​the polymer material on the panel, the panel absorbs a large amount of moisture. Therefore, highly efficient degassing is required to remove all outgassing and remove contamination from the panel to achieve good contact resistance.

[0004] To perform PVD sputtering on both sides of a substrate / panel, conventional designs require the substrate / panel to be removed from vacuum and inverted in air. When the substrate / panel is removed from vacuum, an additional degassing operation is required to remove moisture absorbed on the substrate / panel. Because degassing can take tens of minutes, such as approximately 40 minutes in some cases, this additional degassing operation has a significant negative impact on panel throughput.

[0005] Attempts have been made to hold the substrate / panel vertically in the PVD chamber to allow simultaneous sputtering from both sides, but this approach lacks active cooling of the substrate / panel and can result in undesirable arcing, which can damage the panel.

[0006] Therefore, there is a need in the art for an apparatus and method for flipping a substrate in a vacuum between deposition steps performed on each side of a panel. Summary of the Invention

[0007] FIELD OF THE INVENTION The embodiments described herein generally relate to double-sided physical vapor deposition (PVD) sputtering of a substrate in an electronic device manufacturing process. More specifically, the embodiments described herein provide an apparatus and method for flipping a substrate in a vacuum between PVD sputtering of each side.

[0008] In one embodiment, a processing system module includes a clamp assembly capable of clamping a substrate. The clamp assembly includes a first plate and a second plate parallel to the first plate. The second plate is coupled to the first plate for movement in a direction perpendicular to a major plane of the first plate. The clamp assembly also includes a plurality of guide blocks, a plurality of finger stock assemblies coupled to the guide blocks, a motor assembly coupled to the clamp assembly, an actuator coupled to the lift pin plate, and a plurality of sensors.

[0009] In another embodiment, a processing system includes a deposition chamber, a transfer chamber coupled to the deposition chamber, and a load lock chamber coupled to the transfer chamber. The load lock chamber includes a module. The module includes a clamp assembly. The clamp assembly includes a first plate, a second plate parallel to the first plate and coupled to the first plate for movement in a direction perpendicular to a major plane of the first plate, a plurality of guide blocks, and a plurality of finger stock assemblies coupled to the plurality of guide blocks. The clamp assembly also includes a backstop and a plurality of sensors.

[0010] In yet another embodiment, a method for rotating a substrate includes raising a lift pin plate to open a clamp assembly and receive a substrate, the lift pin plate coupled to an actuator; receiving the substrate on a plurality of lift pins, the plurality of lift pins coupled to the lift pin plate; sensing the substrate with one of a plurality of sensors; lowering the lift pin plate to close the clamp assembly; rotating the substrate in a vacuum; raising the lift pin plate to open the clamp assembly and supporting the substrate on the lift pins.

[0011] So that the above-mentioned features of the present disclosure can be understood in detail, a more particular description of the present disclosure briefly summarized above can be had by reference to embodiments, some of which are illustrated in the accompanying drawings. It should be noted, however, that the accompanying drawings illustrate only exemplary embodiments and therefore should not be considered as limiting the scope thereof, as other equally effective embodiments may be recognized. [Brief explanation of the drawings]

[0012] [Figure 1] 1 is a schematic top view of an exemplary substrate processing system, in accordance with certain embodiments. [Figure 2] 10A-10C illustrate a method for flipping a substrate in a vacuum using a flipper module, according to certain embodiments. [Figure 3A] 2 is a schematic top isometric view of a portion of the substrate processing system of FIG. 1 including a flipper module, in accordance with certain embodiments. [Figure 3B] 2 is a schematic top isometric view of a portion of the substrate processing system of FIG. 1 including a flipper module, in accordance with certain embodiments. [Figure 4A] FIG. 10 is a partial cross-sectional side view of a flipper module in a closed position, according to certain embodiments. [Figure 4B] FIG. 1 is a partial cross-sectional side view of a flipper module in a closed position, according to certain embodiments. [Figure 5A] FIG. 10 is a partial cross-sectional side view of a flipper module in an open position, according to certain embodiments. [Figure 5B] FIG. 10 is a partial exploded view of a clamping assembly in accordance with certain embodiments. [Figure 5C] 1 is a cross-sectional view of a clamping assembly according to certain embodiments. [Figure 6A] FIG. 2 is a detailed perspective view of a substrate supported by lift pins, according to certain embodiments. [Figure 6B] FIG. 10 is a detailed perspective view of a guide block and a substrate support element according to certain embodiments. [Figure 6C] FIG. 10 is a detailed perspective view of a guide block and substrate support element that holds a substrate, according to certain embodiments. [Figure 6D] FIG. 10 is a top view of a clamp assembly contacting a backstop, according to certain embodiments. DETAILED DESCRIPTION OF THE INVENTION

[0013] For ease of understanding, wherever possible, like reference numerals have been used to designate like elements common to the figures. It is contemplated that elements and features of one embodiment may be beneficially incorporated in other embodiments without further recitation.

[0014] FIELD OF THE INVENTION The embodiments described herein generally relate to double-sided physical vapor deposition (PVD) processes performed on substrates in electronic device manufacturing systems. More specifically, the embodiments described herein provide an apparatus and method for flipping a substrate in a vacuum between PVD processes, such as sputtering, on each side of the substrate.

[0015] The embodiments described herein enable the ability to deposit material on both sides of a substrate without removing the substrate from vacuum, as opposed to the conventional approach of removing the substrate from vacuum and inverting it in atmosphere. By performing this process in vacuum, additional degassing operations are eliminated, improving throughput.

[0016] The embodiments described herein have the ability to deposit material on both sides of a substrate without holding the substrate vertically. Performing the sputtering process on a substrate positioned flat and horizontally on a substrate support allows for active cooling and prevents undesirable arcing.

[0017] The embodiments described herein provide an apparatus for inverting substrates in a vacuum within a load lock chamber without increasing the footprint of an existing or new processing system. The embodiments described herein enable inversion of large area substrates in vacuum in addition to conventional substrates.

[0018] Exemplary Substrate Processing System FIG. 1 is a schematic top view of an exemplary substrate processing system 100 (also referred to as a “processing platform”) in accordance with certain embodiments. In certain embodiments, the substrate processing system 100 is configured, among other things, to process large-area substrates. As used herein, the term “panel” may refer to a large-area substrate that may be used in forming a device package or a large-panel display. In some device packaging examples, a “panel” may include a large surface area substrate that includes a polymer material disposed on a structural core. The substrate processing system 100 generally includes an equipment front-end module (EFEM) 102 for loading substrates into the processing system 100, a first load lock chamber 104 coupled to the EFEM 102, a transfer chamber 106 coupled to the first load lock chamber 104, and multiple other chambers coupled to the transfer chamber 106, as described in more detail below. Proceeding counterclockwise from the first load lock chamber 104 around the transfer chamber 106, the processing system 100 includes a first dedicated degassing chamber 108, a first pre-cleaning chamber 110, a first deposition chamber 112, a second pre-cleaning chamber 114, a second deposition chamber 116, a second dedicated degassing chamber 118, and a second load lock chamber 120. The second load lock chamber 120 includes a flipper module for flipping substrates in a vacuum, as described in more detail below. In certain embodiments, the vacuum is generated using a turbomolecular pump coupled to the second load lock chamber 120. However, other types of vacuum pumps are also contemplated. In certain embodiments, the transfer chamber 106 and each chamber coupled to the transfer chamber 106 are under vacuum. As used herein, the term "vacuum" refers to a vacuum of approximately 10 -2 However, in some high vacuum systems, the pressure can be as low as 10 -7 It may operate at less than Pa.

[0019] In certain embodiments, the system controller 126, also referred to herein as a processing chamber controller, includes a central processing unit (CPU) 127, memory 128, and support circuits 129. The system controller 126 is used to control the process sequence for processing the substrate 122, including the substrate transfer and substrate flip methods described herein. The CPU 127 is a general-purpose computer processor configured for use in an industrial environment to control the processing system 100 and its associated sub-processors. The memory 128 described herein, which is generally non-volatile memory, can include random access memory, read-only memory, floppy or hard disk drives, or other suitable forms of local or remote digital storage. The support circuits 129 are conventionally coupled to the CPU 127 and can include cache, clock circuits, input / output subsystems, power supplies, etc., and combinations thereof. Software instructions (i.e., software programs) and data can be coded and stored in the memory 128 to instruct the processor within the CPU 127. Software programs readable by the CPU 127 in the system controller 126 determine which tasks are executable by the components of the processing system 100. Typically, a software program readable by the CPU 127 in the system controller 126 includes code that, when executed by the processor (CPU 127), performs tasks associated with the processing and substrate transfer schemes described herein. The software program may include instructions used to control various hardware and electrical components within the processing system 100 so that the methods described herein may be performed. In one embodiment, the program includes instructions used to perform one or more of the methods for flipping a substrate described herein.

[0020] In certain embodiments, substrates are loaded into the processing system 100 through a door (also referred to as a "slit valve") of the first load lock chamber 104 and unloaded from the processing system 100 through a door of the second load lock chamber 120. In certain embodiments, a stack of substrates is supported in a cassette disposed in the first load lock chamber 104. When the first load lock chamber 104 is pumped down, one substrate at a time is removed from the cassette using a robot located in the transfer chamber 106. In one embodiment, the second load lock chamber 120 receives a single substrate after processing has been performed on each side and unloads the processed substrate into the EFEM 102. The second load lock chamber 120 may be a dual chamber including an upper chamber 125 (FIG. 3A) for receiving a substrate after both sides have been processed and unloading the substrate into the EFEM 102, and a lower chamber including a flipper module 130 (FIG. 3A) for flipping a substrate that has been processed on one side for processing on the other side. However, other loading and unloading configurations are contemplated.

[0021] Pre-cleaning of substrates is important for removing impurities, such as oxides, from the substrate surface so that the metal film deposited in the deposition chamber is not electrically isolated from the substrate. By performing pre-cleaning in the first and second pre-cleaning chambers 110, 114, which share the same vacuum environment as the first and second deposition chambers 112, 116, the substrate can be transferred from the cleaning chambers to the deposition chambers without exposure to the atmosphere. This prevents impurities from forming on the substrate during transfer. Additionally, vacuum is maintained within the substrate processing system 100 while transferring the cleaned substrate to the deposition chamber, reducing vacuum pump-down cycles.

[0022] In certain embodiments, only one substrate is processed at a time in each precleaning chamber and deposition chamber. Alternatively, multiple substrates, such as four to six substrates, may be processed at once. In such embodiments, the substrates may be placed on a rotatable pedestal within each chamber. In certain embodiments, the first and second precleaning chambers 110, 114 are precleaning etch chambers for etching the substrate surface. However, other types of precleaning chambers are also contemplated. In certain embodiments, one or both of the precleaning chambers are replaced with a deposition chamber for performing a reactive sputtering process, such as the deposition of silicon nitride, aluminum oxide, or other materials by reactive sputtering. In an inductively coupled plasma (ICP) chamber, a coil at the top of the chamber is energized by an external RF source, creating an excitation field within the chamber. Argon gas flows through the chamber from the external gas source. Argon atoms within the chamber are ionized (charged) by the RF energy. The substrate is biased by a DC bias source coupled to the aluminum pedestal on which the substrate rests. The charged atoms are attracted to the substrate, resulting in etching of the substrate surface. Other gases besides argon may be used depending on the desired etch rate and the material being etched. In contrast to processes for etching features into the substrate surface, etching as part of a cleaning process may require relatively low ionization energy levels. The low energy avoids damaging circuit devices and features already formed on the substrate.

[0023] In certain embodiments, the first and second deposition chambers 112, 116 are PVD chambers. In such embodiments, the PVD chambers may be configured to deposit copper, titanium, aluminum, gold, nickel, nickel vanadium, silver, and / or tantalum. However, other types of deposition processes and materials are also contemplated. In a PVD chamber, the entire backside of the substrate is in electrical and thermal contact with the pedestal. Controlling the temperature of the substrate during the sputtering process is important to obtain predictable and reliable thin films. The coolant system includes an external cooling source that supplies fluid to cooling lines within the pedestal. The cooling source may be replaced or augmented with a heating source to increase the temperature of the workpiece independently of the sputtering process.

[0024] In certain embodiments, an RF bias source is electrically coupled to the pedestal to energize the pedestal, and thus the substrate, during the sputtering process. Substrate bias (RF bias) can be used, for example, when the substrate / panel has characteristics that require good step coverage. Alternatively, the pedestal can be grounded, floating, or biased with only a DC voltage source.

[0025] During operation, the PVD deposition chamber is evacuated and refilled with argon gas. The gas is excited with a DC source and couples with electromagnetic fields within the PVD deposition chamber to excite a sustained, high-density plasma near the target surface. The plasma, confined near the target surface, contains positive ions (such as Ar+) and free electrons. The ions in the plasma bombard the target surface, sputtering material from the target. The substrate receives the sputtered material and forms a deposition layer on the substrate surface. In one example, as much as 20 kilowatts of DC power can be supplied to the target, allowing the target to deposit approximately 1 micron of material per minute on the substrate.

[0026] PVD deposition chambers use a magnetron assembly outside the vacuum to further control the bombardment of the target by ions formed in the plasma. In certain embodiments, a stationary permanent magnet is placed behind the target (which acts as the deposition source) to confine the plasma to the target region. In other cases, a magnet is scanned across the backside of the target to distribute the magnetic field evenly across the target, promoting more uniform target erosion. The resulting magnetic field forms a closed-loop annular path that acts as an electron trap, reshaping the trajectory of secondary electrons emitted from the target into a cycloidal path, significantly increasing the probability of ionization of the sputtering gas within the confinement zone. Inert gases such as argon are typically used as sputtering gases because they do not tend to react with the target material or combine with the process gas, and their high molecular weight results in higher sputtering and deposition rates. Positively charged argon ions from the plasma are accelerated toward the negatively biased target and collide with it, resulting in material being sputtered from the target surface.

[0027] The chamber walls are typically electrically grounded during processing operations. A bias voltage relative to the substrate can drive a flux of charged species (Ar+ and / or atoms sputtered from the target) onto the substrate. The flux can modify properties such as film density of the sputtered material deposited on the surface of the substrate.

[0028] 2 illustrates a method 200 for flipping a substrate 122 in a vacuum using the flipper module 130 of the second load lock chamber 120, according to certain embodiments. As described below, the process of flipping the substrate may be performed between deposition processes performed on both sides of the substrate. Thus, by sandwiching a flipping step between deposition steps on both sides of the substrate, a first side of the substrate can receive deposited material, while an opposite second side of the substrate, opposite the side receiving the deposited material, is supported, actively cooled, and / or biased by elements within a substrate support member of the deposition chamber.

[0029] Description of an Exemplary Flipper Module 3A is a schematic top isometric view of a portion of the substrate processing system 100 shown in FIG. 1, in accordance with certain embodiments. As shown, the load lock chamber 120 is configured to receive and unload a substrate 122 during processing and includes an upper chamber 125 and a flipper module 130 configured to receive a substrate 122 that has been processed, e.g., against the front side 122a, and flip the substrate 122 for processing against the back side 122b.

[0030] As shown in FIG. 3A, the substrate 122 is positioned within the transfer chamber 106. Note that in FIG. 3A, for clarity, only the transfer chamber 106 and the flipper module 130 of the second load lock chamber 120 are shown. The edge 122c of the substrate is in contact with the end effector of the transfer robot 124. The substrate 122 and the end effector of the transfer robot 124 are aligned with the door of the flipper module 130 of the load lock chamber 120. In some embodiments, the front side 122a of the substrate 122 faces upward, and the back side 122b faces downward. The substrate 122 can have a thickness ranging from about 0.1 mm to about 4 mm, for example, from about 0.2 mm to about 3.2 mm. In this example, the substrate 122 is a panel (also referred to herein as "substrate").

[0031] 3A further illustrates how the load lock chamber 120 can also include multiple sensors 180, 182, 184, 186. Each of the multiple sensors 180, 182, 184, 186 is an optical sensor, but may also be a proximity sensor, a pressure sensor, a rotation sensor, a temperature sensor, other sensors, or any combination thereof, for analyzing characteristics of the chamber 120 and the substrate 122. According to some embodiments, the panel or substrate presence sensor 180 reads whether the substrate 122 is positioned within the chamber 120 or the flipper module 130. The panel or substrate transfer sensor 182 reads whether the substrate 122 has been released by the transfer robot 124. The panel or substrate rotation sensor 184 reads how much the substrate 122 has rotated during a flip process, such as the flip process of FIG. 2 (described below). For context, the amount that the substrate 122 has rotated can indicate whether the module 130 is ready to perform another step in the flipping operation. The clamp position sensor 186 reads whether the substrate 122 is currently secured by the flipper module 130 during the flipping process. The substrate is unsecured when the clamp assembly is in the open position, as shown in FIG. 4A, and the substrate 122 is secured when the clamp assembly is in the closed position, as shown in FIG. 5A. As shown in FIG. 3A, the sensors 180, 182, 184, and 186 are positioned outside the chamber 120, but in some embodiments, they may be located within the chamber 120. According to some embodiments, the sensors 180, 182, 184, and 186 may be connected to the controller 126 to monitor and control the module 130.

[0032] FIG. 3B shows the substrate 122 after the transfer robot 124 transfers it from the transfer chamber 106 to the flipper module 130. Note that in FIG. 3B, for clarity, only the transfer chamber 106 and flipper module 130 of the second load lock chamber 120 are shown. Also, note that the top of the load lock chamber has been omitted to show the interior of each respective chamber. As shown in FIG. 3B, the transfer robot 124 is moving the substrate 122 from the transfer chamber 106 into the housing 131 of the flipper module 130. Once the substrate is inside the flipper module 130, the transfer robot releases the substrate 122, allowing the flipper module 130 to support the substrate 122.

[0033] FIG. 4A shows a schematic diagram of the flipper module 130, including the clamp assembly 140, motor assembly 134, and lift pin plate assembly 420, in a closed position (also referred to as a "clamped position") for rotation, according to some embodiments. FIG. 4B shows the lift pin plate assembly 420 in a lowered position, according to some embodiments. FIG. 5A shows a schematic diagram of the flipper module 130 in an open position for receiving or removing a substrate 122 from the flipper module 130. FIG. 5B shows an exploded perspective view of a portion of the clamp assembly 140, according to some embodiments. FIG. 5C is an enlarged view of a portion of the clamp assembly 140 in the open position shown in FIG. 5A. FIG. 6A is a detailed perspective view of a portion of the clamp assembly 140 in the open position, according to some embodiments, with the substrate 122 positioned and supported by a plurality of lift pins 402. Figure 6B shows a detailed view of multiple finger stocks 610a, 610b that hold the substrate 122 when the clamp assembly 140 closes against the substrate 122, according to some embodiments. Figure 6C shows an enlarged view of multiple substrate support elements 606a, 606b shown in Figure 6A.

[0034] Clamp position As shown in FIG. 4A , flipper module 130 shows clamp assembly 140 held within vacuum environment 131a along with lift pin plate assembly 420, while motor assembly 134 is disposed outside module housing 131 rather than within vacuum environment 131a. According to some embodiments, motor assembly 134 includes housing 132, motor 133, and shaft and seal assembly 156. Motor 133 is configured to rotate clamp assembly 140 about first axis A1. In the clamped position, lift pin plate assembly 420 is out of the rotational path of clamp assembly 140. The rotational path of clamp assembly 140 is formed about first axis A1 by use of motor assembly 134.

[0035] As shown in FIGS. 4A-5B, the clamp assembly 140 includes a first clamp assembly 148a, a second clamp assembly 148b, at least one of two or more clamp sliders 410, and at least one of two or more spring-loaded connectors 174. The first clamp assembly 148a includes a first plate 142, and the second clamp assembly 148b includes a second plate 144. The first and second plates 142, 144 are held parallel to one another by the clamp sliders 410. The one or more clamp sliders 410 are intended to link the first plate 142 and the second plate 144 to help maintain them parallel and to enable the mechanical biasing force provided by one of the two or more spring-loaded connectors 174.

[0036] As shown in FIG. 4A , the motor assembly 134 is connected to the clamp assembly 140 by a shaft and seal assembly 156. The shaft and seal assembly 156 is connected to at least one or more clamp sliders 410 through the module housing 131. A bearing 146 is coupled to the clamp slider 410, connected to the interior of the housing 131 on the side of the clamp assembly 140 opposite the motor assembly 134. The bearing 146 is aligned with a first axis A1 and supports the clamp assembly 140. The shaft and seal 156 allows rotational motion to be transferred from the motor 133 to the clamp assembly 140 while maintaining a vacuum environment within the process system 100. As shown in FIG. 4A , the first axis A1 is parallel to the X-axis. The motor 133 may include programmed stops every 180° and may be an electric, gear-driven, or belt-driven motor assembly, although other types are contemplated.

[0037] As shown in FIG. 4B , the lift pin plate assembly 420 includes a lift pin plate 406 coupled to an actuator 135 by an actuator shaft 137. The actuator 135 is coupled to the housing 131 of the flipper module 130. The actuator 135 extends and retracts the lift pin plate assembly 420 along a first direction D1 parallel to the Z axis. The axis of the actuator is parallel to the Z direction in the coordinate system of FIG. 4A . The lift pin plate assembly 420 includes a plurality of lift pins 402 extending from a lift pin plate surface 408 and a plurality of clamp assembly pins 404 extending from the lift pin plate surface 408. Additionally, the lift pin plate assembly 420 can include a plurality of clamp alignment pins 460 extending from the lift pin plate surface 408 along the first direction D1.

[0038] Lift pin plate assembly 420 includes a plurality of lift pins 402 aligned in a first direction D1, a plurality of clamp assembly pins 404, and a plurality of clamp alignment pins 460. During an inversion operation, lift pin plate 406 is lowered out of the rotational path of clamp assembly 140 by actuator 135. In some embodiments, the actuator is outside of housing 131 at standard pressure, while actuator shaft 137 is located within housing 131, and actuator 135 and actuator shaft 137 are sealed using a bellows assembly to prevent loss of vacuum pressure.

[0039] The plurality of lift pins 402 are configured to support and receive the substrate 122 when the actuator 135 extends the lift pin plate assembly 420 into the clamp assembly 140. As shown in FIG. 5A, the clamp assembly pins 404 are configured to contact and hold the clamp assembly 140 open when the actuator 135 extends the lift pin plate assembly 420 into the clamp assembly 140, as described in more detail below. The clamp alignment pins 460 are configured to align the clamp assembly 140 when the clamp alignment pins 460 pass through the alignment apertures 436a-b, as seen in FIG. 5B. The clamp alignment pins 460 pass through the clamp assembly alignment apertures 436a-b perpendicular to the first plane P1.

[0040] As shown in FIG. 4A , a spring-loaded connector 174 mechanically biases the first and second plates 142, 144 of the clamp assembly toward a closed position. The spring-loaded connector 174 is coupled to the first and second clamp assemblies 148a, 148b. At least one or more clamp sliders 410 are coupled to the clamp assembly 140. The clamp sliders 410 are coupled to the motor assembly 134, such that the motor 133 transfers rotational energy to the clamp assembly 140 via the clamp sliders 410. Another clamp slider 410 is positioned on the left side of FIG. 4A opposite the clamp slider 410 near the motor assembly 134 and is coupled to a bearing 146 for supporting the clamp assembly 140 during rotation as part of the execution of the method 200. The bearing is coupled to the interior of the flipper module 130.

[0041] The finger stocks 610a, 610b of the substrate support element 606 contact the substrate 122 when the clamp assembly 140 closes after the plurality of guide blocks 608a, 608b align the substrate 122 with respect to the center of the clamp assembly 140. The guide blocks 608a, 608b may remain in contact with the substrate during rotation. The finger stocks 610a, 610b are coupled to the plurality of guide blocks 608a, 608b by a finger stock plate 612, as seen in FIG. 6B. The substrate support surfaces 614a, 614b of the finger stocks 610a, 610b, respectively, are aligned in a parallel orientation with respect to a first plane P1, as shown in FIG. 5B. The finger stocks 610a, 610b are coupled to the finger stock plate 612 by a clip geometry, although other coupling methods are contemplated. In one example, the clip geometry of the fingerstock 610a, 610b includes a flexible alloy member that includes a "snap" feature that engages or "snaps" onto a support component or body. The fingerstock plate 612 can include one or more metals, such as aluminum, aluminum alloy, steel, stainless steel, alloys thereof, or any combination thereof. The fingerstock 610a, 610b includes a flexible copper alloy, although other materials may be used for the fingerstock 610a, 610b. For example, the fingerstock 610a, 610b may include beryllium copper with a nickel-tin coating or other similar metal coating. As shown in FIG. 6B, the fingerstock 610a, 610b have a triangular shape, although other embodiments are contemplated. Each of the fingerstocks 610a, 610b can include a flexible member of any shape that, when used in combination with the other fingerstock 610a, 610b, can contact, support, and / or hold the substrate 122. The substrate 122 is held in position between the first plate 142 and the second plate 144 such that the clamping assembly 140 in the clamped position can rotate the substrate 122 without moving the substrate 122.

[0042] According to some embodiments, as shown in FIG. 6B , the fingerstock contact surfaces 614 are configured to deflect when a force provided by the spring-loaded connectors 174 causes the first and second plates 142, 144 of the clamp assembly 140 to contact the substrate 122. The fingerstock 610 is positioned to contact the substrate 122 only in specific 10 millimeter (mm) wide, predefined zones. The predefined zones may be limited to portions of the substrate surfaces 122a-b 10 mm from the substrate edges 122c and to 10 mm wide strips extending across the substrate surfaces 122a-b in the form of a cross. Other predefined zones and zone dimensions are also contemplated. These predefined zones may minimize damage to the substrate surfaces 122a-b and maximize yield.

[0043] As shown in Figures 6A, 6B, and 6C, the first plate 142 and the second plate 144 each include a plurality of substrate support elements 606 and a plurality of guide blocks 608. The plurality of guide blocks 608 can be coupled to the first and second plates 142, 144 using mechanical fasteners, although other methods are contemplated. According to some embodiments, the substrate support element 606 includes a finger stock plate 612 (also referred to as a "finger stock base") and finger stocks 610a, 610b coupled to the finger stock plate 612. The finger stock plate 612 can include one or more metals, such as aluminum, aluminum alloy, steel, stainless steel, alloys thereof, polymer, or ceramic, or any combination thereof. The substrate support element 606 can also be directly coupled to the first and second plates 142, 144. Guide blocks 608 are coupled to the first plate 142 and the second plate 144 and are used to help align and position the substrate 122 within the clamp assembly 140. Each guide block 608 also includes an alignment surface 604. The guide blocks 608 may be made from a material or metal, such as aluminum, aluminum alloy, steel, stainless steel, alloys thereof, or any combination thereof. Polymers are also contemplated. As the clamp assembly 140 closes on the substrate 122, any misalignment of the substrate 122 in the XY plane can be corrected by the guide blocks 608. The outer edge 122c of the misaligned substrate contacts the alignment surface 604, and the substrate 122 slides into alignment within the clamp assembly 140. Before flipping the substrate 122, as the clamp assembly 140 approaches the substrate 122, the edge 122c of the substrate contacts and follows the contour of the guide block alignment surface 604, thereby correcting any misalignment of the substrate 122 within the clamp assembly 140, and thus, as the multiple lift pins 402 lower the substrate 122 to a position where it rests on the multiple finger stocks 610, gravity moves the substrate 122 into the appropriate location.In some embodiments, the guide blocks 608 can compensate for up to 7 mm of offset, for example 4 mm off center, to a position at least 2 mm away from the predetermined location.

[0044] Open position When the clamp assembly 140 is in the open position, as shown in FIG. 5A, the module is properly oriented to receive a substrate or is ready to remove a substrate from the clamp assembly 140.

[0045] When the clamp assembly pins 404 of the lift pin plate assembly 420 contact the opposing plates of the clamp assembly 140, the clamp assembly 140 is in an open position. As shown in FIG. 5A, the clamp assembly pins 404 act against the biasing force of the spring-loaded connectors 174 to separate the opposing plates of the clamp assembly 140 from the substrate 122. The clamp assembly pins 404 contact the first plate 142 on the opposite side of the clamp assembly 140 and therefore pass through the second plate 144 when the clamp assembly 140 is positioned in this orientation. As shown in FIG. 5A, a plurality of lift pins 402 pass through the first plate 142 or the second plate 144 to contact and support the substrate 122. The first and second plates 142, 144 further include a plurality of apertures 432a-b, 434a-b, 436a-b, as seen in FIG. 5B. When in the open position, the clamp assembly pin 404 passes through apertures 432a-b, 434a-b, depending on whether the first plate 142 or the second plate 144 is closer to the lift pin plate assembly 420 due to the inverted orientation (e.g., which plate is on the top or bottom of the clamp assembly 140). Generally, the first and second plate apertures 432a-b, 434a-b are configured so that the clamp assembly pin 404 only contacts the plate on the opposite side of the lift pin plate assembly 420. The plate apertures 432a-b, 434a-b in the plate closer to the lift pin plate assembly 420 allow the clamp assembly pin 404 to pass therethrough.

[0046] 5A and 5C , when the lift pin plate assembly 420 is extended to place the clamp assembly 140 in an open position, the substrate 122 can be removed from or placed into the clamp assembly 140. When the substrate 122 is positioned within the clamp assembly 140 in the open position, the substrate is supported by the plurality of lift pins 402. According to some embodiments, when the substrate 122 is positioned within the flipper module 130, the presence sensor 180 can be used to indicate that the substrate 122 is no longer moving and is in the correct position within the clamp assembly 140. Additionally, the transfer sensor 182 can be used to indicate that the transfer robot 124 has released the substrate 122 and that the substrate 122 is now supported only by the plurality of lift pins 402.

[0047] As shown in FIG. 5B , the substrate 122 is positioned between the first plate 142 and the second plate 144 according to several orientations. The first and second plates 142, 144 have openings that allow multiple substrate support elements 606 a, 606 b to be positioned within the confines of the first and second plates 142, 144. The multiple substrate support elements 606, such as the substrate support elements 606 a, 606 b shown in FIG. 5B , are configured to contact the substrate 122 when the clamp assembly 140 is closed, as shown in FIGS. 4A and 6B . As described above, the area where the finger stocks 610 a, 610 b ( FIG. 6B ) of the substrate support elements 606 a, 606 b ( FIG. 5B ) contact the substrate 122 may be predetermined to minimize contact between the clamp assembly 140 and the substrate 122, thereby increasing the usable area of ​​the substrate 122.

[0048] 5A and 5C, the clamp assembly 140 is held open against the bias of the spring-loaded connector 174 by the clamp assembly pin 404 pressing against the first plate 142. A clamp alignment pin 460 passes through a plurality of clamp alignment apertures 436a, 436b, thereby restricting movement of the clamp assembly 140 to a first direction D1 and aligning a first plane P1 perpendicular to the first direction D1.

[0049] 6A shows a corner of the clamp assembly 140 in an open position, according to some embodiments. As can be seen in FIGS. 6A and 6C, in the open position, the plurality of guide blocks 608 do not support the substrate 122. Instead, in the open position, only the lift pins 402 are in contact with the substrate 122.

[0050] FIG. 6D is a top view of the flipper module 130 showing the backstop assembly. The backstop assembly includes one or more backstop plates 450 and one or more backstop modules 452. A backstop plate 450 is coupled to the first plate 142, and another backstop plate 450 is coupled to the second plate 144 (hidden beneath the first plate 142). The backstop plates 450 are configured to contact the backstop modules 452 as the clamp assembly 140 rotates. In some embodiments, the clamp assembly 140 first rotates 180° clockwise about the axis of the motor 133 (as shown in FIG. 4A ) to flip a first substrate, and then rotates 180° counterclockwise about the axis of the motor 133 to flip a next substrate. The clamp assembly 140 stops rotating after each flip when the backstop plate 450 contacts the backstop module 452. Backstop plate 450 and backstop module 452 are configured to stop rotation of clamp assembly 140 and prevent over-travel of clamp assembly 140. According to some embodiments, sensor 184 (shown in FIG. 3A ) is configured to monitor when backstop plate 450 contacts backstop module 452.

[0051] Example Flipper Usage 2 illustrates a method for flipping a substrate. In operation 202, as seen in FIG. 3B, the substrate 122 is transferred from the transfer chamber 106 into the flipper module 130. During operation 202, the process system 100 moves the substrate 122 to a position for the clamp assembly 140 to receive the substrate 122 (FIG. 3A).

[0052] Operation 204 begins with the clamp assembly 140 in an open position, as seen in FIG. 5A . The lift pin plate assembly 420 is positioned to contact and hold the clamp assembly 140 open so that the substrate is received on the plurality of lift pins 402. In other embodiments, the clamp assembly 140 is raised from a lowered position prior to operation 202. The clamp assembly pins 404 of the clamp assembly contact the opposite plates 142, 144 of the lift pin plate assembly 420, holding the clamp assembly 140 open against the biasing force of the spring-loaded connectors 174. Once the substrate 122 is received on the plurality of lift pins 402, the actuator 135 retracts the lift pin plate assembly 420, at which point the plurality of lift pins 402 position the substrate on the fingerstock contact surface 614 so that the substrate lift pins 402 no longer support the substrate 122. 4B, as the lift pin plate assembly 420 continues to move away from the clamp assembly 140 and toward the bottom of the module housing 131, the clamp assembly pins 404 disengage from the plates 142 of the clamp assembly 140, and the spring-loaded connectors 174 bias the first and second plates 142, 144 to the closed position, as shown by FIGS. 4A and 6B. In the closed position, the plurality of substrate support elements 606 a and 606 b contact the substrate 122 on both the substrate first or front side 122 a and the substrate second or back side 122 b, respectively, as shown in FIG.

[0053] In operation 206, the lift pin plate 406 is lowered to get out of the way of the rotation of the clamp assembly 140. The clamp assembly 140 is then rotated approximately 180° by the motor 133. The orientation of the clamp assembly 140 and the substrate 122 secured therein is then considered "flipped" after the clamp assembly 140 has rotated approximately 180°. For example, after rotation, the top surface 122a of the substrate is oriented downward, and the backside 122b of the substrate 122 is oriented upward. The clamp assembly 140 remains closed around the substrate 122 due to the bias applied by the spring-loaded connector 174, so that during rotation, the top side 122a remains in contact with the substrate support element 606a of the first assembly 148a, and the backside 122b remains in contact with the substrate support element 606b of the second assembly 148b. The clamp assembly 140 stops rotating when the backstop assembly plate 150 contacts the backstop 452. In other embodiments, the method of determining rotation may include an encoder attached to the motor 133 and a sensor that indicates when the desired rotation has been reached.

[0054] In operation 208, the lift pin plate once again rises, opening the clamp assembly 140 to an orientation similar to that shown in FIG. 5A. However, in operation 208, the first plate 142 and the second plate 144 have swapped positions such that the second plate 144 is positioned above the first plate 142. The actuator 135 extends the lift pin plate assembly 420 to contact the clamp assembly 140, and the clamp assembly pins 404 contact the plates 142, 144 opposite the lift pin plate assembly 420, holding the clamp assembly 140 open. The clamp assembly pins 404 pass through the apertures 432a, 434a in the first plate 142 and contact the second plate 144. The spring-loaded connectors 174 no longer secure the substrate 122 within the clamp assembly 140, and the substrate 122 rests on the lift pins 402.

[0055] In operation 210, the substrate 122 is transferred out of the flipper module 130. Transfer out of the flipper module can be accomplished using the transfer robot 124, although other means are contemplated. In some embodiments, the transfer robot 124 removes the inverted substrate 122 from the lift pins 402 and the flipper module 130 and transfers the inverted substrate 122 into the transfer chamber 106. Once the substrate 122 is returned to the transfer chamber 106 after inversion, a pre-cleaning and / or deposition process can be performed on the unprocessed side. As described above, the substrate 122 is maintained in vacuum during each operation of the method 200. Therefore, there is no need to degas the substrate 122 before performing a subsequent pre-cleaning and / or deposition process on the backside 122b when returning the substrate 122 to the transfer chamber 106. This significantly reduces the time required for double-sided processing, thereby improving throughput.

[0056] While the forgoing is directed to embodiments of the present disclosure, other and further embodiments of the disclosure may be devised without departing from the basic scope thereof, the scope of which is determined by the claims that follow.

Claims

1. 1. A substrate clamping assembly comprising: a first plate assembly; a first plate, and a plurality of substrate support elements coupled to the first plate, each substrate support element having a substrate support surface; a first plate assembly comprising: a second plate assembly; a second plate, and a plurality of substrate support elements coupled to the second plate, each substrate support element having a substrate support surface; a second plate assembly comprising: Equipped with the substrate support surfaces of the substrate support elements of the first plate assembly and the second plate assembly are aligned in a parallel orientation with respect to a first plane; a substrate clamping assembly; a motor assembly coupled to the substrate clamp assembly and configured to rotate the substrate clamp assembly about a first axis parallel to the first plane to orient the substrate support surfaces of the substrate support elements of the first plate assembly and the second plate assembly in a first orientation; 1. A lift pin plate assembly comprising: a plurality of clamp assembly pins; and a plurality of lift pins, the plurality of lift pins and the plurality of clamp assembly pins extending in a first direction; a lift pin plate assembly comprising: a lift pin actuator configured to position the plurality of lift pins in the first direction and within openings formed in the first plate when the substrate support surface is disposed in the first orientation; and 1. A module of a processing system comprising:

2. 10. The module of claim 1, further comprising one or more backstop plates coupled to the first plate or the second plate of the substrate clamp assembly, the backstop plates positioned to contact a backstop module disposed within the module and positioned at a fixed distance from the first axis.

3. a plurality of spring-loaded connectors coupled to the board clamp assembly; The module of claim 1 further comprising:

4. a plurality of guide blocks coupled to the first plate, wherein each substrate support element of the plurality of substrate support elements is coupled to a respective guide block of the plurality of guide blocks; a plurality of spring-loaded connectors coupled to each of the first plate and the second plate; The module of claim 1 further comprising:

5. 2. The module of claim 1, further comprising a plurality of guide blocks coupled to the first plate, the plurality of guide blocks comprising alignment surfaces, and each substrate support element of the plurality of substrate support elements extending from a respective guide block of the plurality of guide blocks in a direction perpendicular to a major plane of the first plate.

6. further comprising a plurality of sensors coupled to the chamber; the substrate clamp assembly and the lift pin plate are disposed within the chamber; At least one sensor of the plurality of sensors Clamp position sensor, Board presence sensor, Substrate transfer sensor, or Substrate rotation sensor, The module of claim 1 , comprising:

7. the lift pin plate assembly The module of claim 1 , further comprising a plurality of clamp alignment pins coupled to a lift pin plate, said plurality of clamp alignment pins extending in said first direction.

8. The module of claim 1 , wherein the plurality of substrate support elements are each configured to receive a substrate having a thickness within a range of about 0.2 mm to about 3.2 mm.

9. a deposition chamber; and a transfer chamber coupled to the deposition chamber; a load lock chamber coupled to the transfer chamber and including a module; wherein the module comprises:

1. A clamp assembly comprising: A first plate, a second plate parallel to the first plate and coupled to the first plate for movement in a direction perpendicular to a major plane of the first plate; a first plurality of guide blocks coupled to the first plate; a second plurality of guide blocks coupled to the second plate; a first plurality of substrate support elements coupled to the first plate; and a second plurality of substrate support elements coupled to the second plate; a clamp assembly comprising: a lift pin assembly disposed within the load lock chamber; one or more backstop plates coupled to the clamp assembly; a plurality of sensors in communication with said module; A processing system comprising:

10. The module: an actuator coupled to the module; a motor assembly coupled to the module, the clamp assembly being coupled to the motor assembly; Furthermore, the lift pin assembly a lift pin plate coupled to the actuator, the actuator configured to move the lift pin plate in a first direction to configure the clamp assembly in an open position; a plurality of clamp assembly pins coupled to the lift pin plate; and a plurality of lift pins coupled to the lift pin plate; The processing system of claim 9 further comprising:

11. The load lock chamber 10. The processing system of claim 9, further comprising one or more backstops coupled to the load lock chamber, one or more of the backstops configured to prevent excessive movement during rotation of the clamp assembly.

12. The processing system of claim 9 , wherein the plurality of sensors are optical sensors.

13. 10. The processing system of claim 9, wherein said first plurality of substrate support elements and said second plurality of substrate support elements each comprise an individual finger stock and finger stock base.

14. 14. The processing system of claim 13, wherein each finger stock comprises a triangular shape and has a contact surface configured to receive the substrate.

15. 1. A method of rotating a substrate in a processing system, comprising: moving a lift pin plate assembly into contact with a clamp assembly, the lift pin plate assembly positioning the clamp assembly in an open position, the lift pin plate assembly Lift pin plate, a plurality of clamp assembly pins coupled to the lift pin plate; and a plurality of lift pins coupled to the lift pin plate, the lift pin assembly being coupled to an actuator, the clamp assembly opening when the plurality of clamp assembly pins contact the clamp assembly; and receiving the substrate from a robot when the clamping assembly is in the open position; receiving the substrate onto the lift pin plate assembly within the clamp assembly, the substrate being received on the plurality of lift pins; sensing that the substrate is in a correct position, wherein a plurality of sensors sense the state of the substrate; lowering the lift pin plate assembly, lowering the lift pin assembly thereby allowing the clamp assembly to close; rotating the substrate in a vacuum; opening the clamp assembly and extending the lift pin assembly to support the substrate on the lift pins; A method comprising:

16. When the actuator retracts the lift pin plate assembly, the substrate is supported by the clamp assembly, and the clamp assembly a first plate assembly, a first plate having a mounting surface; a plurality of guide blocks coupled to the first plate; and a plurality of substrate support elements coupled to the mounting surface of the first plate, each substrate support element having a substrate support surface; a first plate assembly comprising: a second plate assembly, a second plate having a mounting surface; a plurality of guide blocks coupled to the second plate; and a plurality of substrate support elements coupled to the mounting surface of the second plate, each substrate support element having a substrate support surface; a second plate assembly comprising: Equipped with The method of claim 15 , wherein the substrate support surfaces of the substrate support elements of the first plate assembly and the second plate assembly are aligned in a parallel orientation relative to a first plane.

17. the lift pin plate assembly a plurality of clamp assembly pins extending from the lift pin plate, the clamp assembly pins configured to contact the clamp assembly and hold the clamp assembly open; 17. The method of claim 16, comprising:

18. 17. The method of claim 16, wherein the clamp assembly further comprises one or more backstop plates, and wherein rotation of the clamp assembly stops when the one or more backstop plates contact one or more backstop modules.

19. The method of claim 16 , wherein one of the plurality of sensors detects that the substrate is in the proper location for closing the clamp assembly.

20. 17. The method of claim 16, wherein the plurality of substrate support elements each comprise an individual finger stock and a finger stock base, the finger stock comprising a triangular shape and having a contact surface configured to receive the substrate.

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