Electronic device including shielding structure for electronic components

Abstract

An electronic device according to one embodiment may include an electronic component and a shield can having an opening facing the electronic component. The electronic device may include a shielding structure on the shield can covering the opening, and a heat conductive member mounted on the electronic component and in contact with the shielding structure through the opening between the electronic component and the shielding structure. The electronic device may include a metal plate on the shielding structure and at least one heat dissipation member attached to the metal plate. The shielding structure may include a first shielding member mounted on the shield can and a second shielding member mounted on the first shielding member. The density of the first shielding member may be less than the density of the second shielding member.

Description

Technical Field

[0001] The various embodiments described below relate to an electronic device including a shielding structure for electronic components.

Background Art

[0002] Small electronic devices such as a smart phone or a tablet personal computer can include electronic components within the electronic device in order to realize various functions of the electronic device. In order to reduce a decrease in performance of the electronic components due to radio waves generated when the electronic components operate, the electronic device can include a structure for shielding the electronic components.

[0003] The foregoing information may be provided as related art for the purpose of assisting in the understanding of the present disclosure. No claim or determination is made as to whether any of the foregoing content can be applied as prior art related to the present disclosure.

Summary of the Invention

Means for Solving the Problems

[0004] An electronic device according to one embodiment may include a printed circuit board, electronic components coupled on the printed circuit board, and a shield can on the printed circuit board that surrounds the electronic components and includes an opening facing the electronic components. The electronic device may include a shielding structure on the shield can that covers the opening, and a heat conductive member mounted on the electronic components and in contact with the shielding structure through the opening between the electronic components and the shielding structure. The electronic device may include a metal plate on the shielding structure and at least one heat dissipation member mounted on the metal plate and configured to transfer at least a portion of the heat emitted from the electronic components via the heat conductive member. The shielding structure may include a first shielding member mounted on the shield can, a first adhesive member interposed between the first shielding member and the shield can for attaching the first shielding member to the shield can, a second shielding member mounted on the first shielding member, and a second adhesive member interposed between the first shielding member and the second shielding member for attaching the second shielding member to the first shielding member. The density of the first shielding member may be less than the density of the second shielding member.

[0005] An electronic device according to one embodiment may include a printed circuit board, electronic components coupled on the printed circuit board, and a shield can on the printed circuit board that surrounds the electronic components and includes an opening facing the electronic components. The electronic device may include a shielding structure on the shield can that covers the opening, and a heat conductive member attached to the electronic components and in contact with the shielding structure through the opening between the electronic components and the shielding structure. The electronic device may include a metal plate on the shielding structure, and at least one heat dissipation member attached to the metal plate and configured to transfer at least a portion of the heat emitted from the electronic components via the heat conductive member. The shielding structure may include a first shielding member mounted on the shield can, a first adhesive member interposed between the first shielding member and the shield can for attaching the first shielding member to the shield can, a second shielding member mounted on the first shielding member, a second adhesive member interposed between the first shielding member and the second shielding member for attaching the second shielding member to the first shielding member, a protective member disposed on the second shielding member, and a groove recessed from the opening toward the metal plate to accommodate the heat conductive member penetrating the opening. The density of the first shielding member may be less than the density of the second shielding member. [Brief explanation of the drawing]

[0006] [Figure 1] This is a block diagram of an electronic device in a network environment according to one embodiment. [Figure 2a] This figure shows an electronic device according to one embodiment. [Figure 2b] This is an exploded perspective view of an electronic device according to one embodiment. [Figure 3a] This is a partial cross-sectional view of an exemplary electronic device. [Figure 3b] This shows some of the electronic components of an exemplary electronic device. [Figure 3c] This shows the shielding structure of electronic components in an exemplary electronic device. [Figure 4a] This is a partial cross-sectional view of an exemplary electronic device. [Figure 4b] This is a partial cross-sectional view of an exemplary electronic device. [Figure 4c] This is a partial cross-sectional view of an exemplary electronic device. [Figure 4d] This is a partial cross-sectional view of an exemplary electronic device. [Figure 4e] This is a partial cross-sectional view of an exemplary electronic device. [Figure 5a] This is a partial cross-sectional view of an exemplary electronic device. [Figure 5b] This is a partial cross-sectional view of an exemplary electronic device. [Figure 6] This is a partial cross-sectional view of an exemplary electronic device. [Figure 7] This shows the lamination process for a shielding structure of an exemplary electronic device. [Figure 8a] An example of an unfolded state of an exemplary electronic device according to one embodiment is shown. [Figure 8b] An example of the folding state of an exemplary electronic device according to one embodiment is shown. [Figure 8c] This is an exploded view of an exemplary electronic device according to one embodiment. [Modes for carrying out the invention]

[0007] Figure 1 is a block diagram of an electronic device in a network environment according to one embodiment.

[0008] Referring to Figure 1, in the network environment 100, the electronic device 101 can communicate with the electronic device 102 via a first network 198 (e.g., a short-range wireless communication network), or with the electronic device 104 or the server 108 via a second network 199 (e.g., a long-range wireless communication network). According to one embodiment, the electronic device 101 can communicate with the electronic device 104 via the server 108. According to one embodiment, the electronic device 101 may include a processor 120, memory 130, input module 150, acoustic output module 155, display module 160, audio module 170, sensor module 176, interface 177, connection terminal 178, tactile module 179, camera module 180, power management module 188, battery 189, communication module 190, subscriber identification module 196, or antenna module 197. According to one embodiment, the electronic device 101 may omit at least one of these components (e.g., connection terminal 178), or may have one or more other components added. According to one embodiment, some of these components (e.g., sensor module 176, camera module 180, or antenna module 197) can be integrated into a single component (e.g., display module 160).

[0009] The processor 120 can, for example, execute software (e.g., program 140) to control at least one other component (e.g., hardware or software component) of the electronic device 101 connected to the processor 120, and perform various data processing or calculations. According to one embodiment, as at least part of the data processing or calculation, the processor 120 can store instructions or data received from other components (e.g., sensor module 176 or communication module 190) in volatile memory 132, process the instructions or data stored in volatile memory 132, and store the resulting data in non-volatile memory 134. According to one embodiment, the processor 120 may include a main processor 121 (e.g., central processing unit or application processor) or an auxiliary processor 123 (e.g., graphics processing unit, neural network processing unit (NPU), image signal processor, sensor hub processor, or communication processor) that can operate independently or together with it. For example, if the electronic device 101 includes a main processor 121 and an auxiliary processor 123, the auxiliary processor 123 may use lower power than the main processor 121, or it may be configured to specialize in a specified function. The auxiliary processor 123 can be implemented separately from or as part of the main processor 121.

[0010] The auxiliary processor 123 can, for example, control at least a portion of the functions or states related to at least one component of the electronic device 101 (e.g., display module 160, sensor module 176, or communication module 190) on behalf of the main processor 121 while the main processor 121 is inactive (e.g., sleep), or together with the main processor 121 while the main processor 121 is active (e.g., running an application). According to one embodiment, the auxiliary processor 123 (e.g., image signal processor or communication processor) can be implemented as part of another functionally related component (e.g., camera module 180 or communication module 190). According to one embodiment, the auxiliary processor 123 (e.g., neural network processing unit) can include hardware structures specialized for processing artificial intelligence models. Artificial intelligence models can be generated through machine learning. Such learning may be performed, for example, on the electronic device 101 itself on which the artificial intelligence model is executed, or via a separate server (e.g., server 108). Learning algorithms may include, but are not limited to, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning. Artificial intelligence models may include multiple artificial neural network layers.The artificial neural network may be one of a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), deep Q-networks, or a combination of two or more of the above, but is not limited to the above examples. The artificial intelligence model can include additional or alternative software structures in addition to the hardware structure.

[0011] The memory 130 can store various data used by at least one component of the electronic device 101 (e.g., the processor 120 or the sensor module 176). The data can include, for example, software (e.g., the program 140), and input data or output data for related instructions. The memory 130 can include a volatile memory 132 or a non-volatile memory 134.

[0012] The program 140 can be stored as software in the memory 130 and can include, for example, an operating system 142, middleware 144, or an application 146.

[0013] The input module 150 can receive instructions or data used by a component of the electronic device 101 (e.g., the processor 120) from outside the electronic device 101 (e.g., a user). The input module 150 can include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0014] The audio output module 155 can output an audio signal to the outside of the electronic device 101. The audio output module 155 can include, for example, a speaker or a receiver. The speaker can be used for general purposes such as multimedia playback and recording playback. The receiver can be used to receive an incoming call. According to one embodiment, the receiver can be implemented separately from the speaker or as a part thereof.

[0015] The display module 160 can visually provide information to the outside (e.g., the user) of the electronic device 101. The display module 160 can include, for example, a display, a hologram device, or a projector and a control circuit for controlling the corresponding device. According to one embodiment, the display module 160 can include a touch sensor set to sense a touch or a pressure sensor set to measure the intensity of the force generated by the touch.

[0016] The audio module 170 can convert sound into an electrical signal or, conversely, convert an electrical signal into sound. According to one embodiment, the audio module 170 can acquire sound via the input module 150 or output sound via the audio output module 155 or an external electronic device (e.g., the electronic device 102) (e.g., a speaker or headphones) directly or wirelessly connected to the electronic device 101.

[0017] The sensor module 176 can sense the operating state (e.g., power or temperature) of the electronic device 101 or the external environmental state (e.g., the user state) and generate an electrical signal or a data value corresponding to the sensed state. According to one embodiment, the sensor module 176 can include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biological sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0018] Interface 177 can support one or more designated protocols that can be used for the electronic device 101 to connect directly or wirelessly to an external electronic device (e.g., electronic device 102). According to one embodiment, interface 177 may include, for example, HDMI® (high definition multimedia interface), USB (universal serial bus) interface, SD (secure digital) card interface, or audio interface.

[0019] The connection terminal 178 may include a connector through which the electronic device 101 can be physically connected to an external electronic device (e.g., electronic device 102). According to one embodiment, the connection terminal 178 may include, for example, an HDMI® connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0020] The tactile module 179 can convert electrical signals into mechanical stimuli (e.g., vibration or movement) or electrical stimuli that the user can perceive through touch or kinesthetic sense. According to one embodiment, the tactile module 179 may include, for example, a motor, a piezoelectric element, or an electrical stimulator.

[0021] The camera module 180 can capture still images and videos. According to one embodiment, the camera module 180 may include one or more lenses, an image sensor, an image signal processor, or a flash.

[0022] The power management module 188 can manage the power supplied to the electronic device 101. According to one embodiment, the power management module 188 can be implemented, for example, as at least part of a PMIC (power management integrated circuit).

[0023] The battery 189 can supply power to at least one component of the electronic device 101. According to one embodiment, the battery 189 may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0024] The communication module 190 can support the establishment of a direct (e.g., wired) or wireless communication channel between the electronic device 101 and an external electronic device (e.g., electronic device 102, electronic device 104, or server 108), and the execution of communication over the established communication channel. The communication module 190 operates independently of the processor 120 (e.g., the application processor) and may include one or more communication processors that support direct (e.g., wired) or wireless communication. According to one embodiment, the communication module 190 may include a wireless communication module 192 (e.g., a cellular communication module, a near-field wireless communication module, or a GNSS (global navigation satellite system) communication module) or a wired communication module 194 (e.g., a LAN (local area network) communication module, or a power line communication module). Of these communication modules, the corresponding communication module can communicate with an external electronic device 104 via a first network 198 (e.g., a short-range communication network such as Bluetooth, WiFi (Wireless Fidelity) Direct, or IrDA (Infrared Data Association)) or a second network 199 (e.g., a long-range communication network such as a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., LAN or WAN)). Some of these types of communication modules may be integrated into a single component (e.g., a single chip) or implemented in multiple separate components (e.g., multiple chips). The wireless communication module 192 can verify or authenticate the electronic device 101 within a communication network such as the first network 198 or the second network 199 using subscriber information (e.g., International Mobile Subscriber Identifier (IMSI)) stored in the subscriber identification module 196.

[0025] The wireless communication module 192 can support 5G networks following 4G networks and next-generation communication technologies, such as NR connection technology (new radio access technology). NR connection technology can support high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimization of terminal power and connection of multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low-latency communications)). For example, the wireless communication module 192 can support high-frequency bands (e.g., mmWave bands) to achieve high data rates. The wireless communication module 192 can support various technologies to ensure performance in high-frequency bands, such as beamforming, massive array multiplexing and multiple-output (massive MIMO (multiple-input and multiple-output)), full-dimensional multiplexing and multiplexing (FD-MIMO (full-dimensional MIMO)), array antennas, analog beamforming, or large-scale antennas. The wireless communication module 192 can support various requirements specified by the electronic device 101, external electronic devices (e.g., electronic device 104), or network system (e.g., second network 199). According to one embodiment, the wireless communication module 192 can support a peak data rate (e.g., 20 Gbps or more) for eMBB realization, loss coverage (e.g., 164 dB or less) for mMTC realization, or U-plane latency (e.g., downlink (DL) and uplink (UL) each of 0.5 ms or less, or round trip of 1 ms or less) for URLLC realization.

[0026] The antenna module 197 may transmit or receive signals or power to an external device (e.g., an external electronic device). According to one embodiment, the antenna module 197 may include an antenna comprising a radiator consisting of a conductor or conductive pattern formed on a substrate (e.g., a PCB). According to one embodiment, the antenna module 197 may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication scheme used in a communication network, such as a first network 198 or a second network 199, can be selected from the plurality of antennas, for example, by a communication module 190. Signals or power can be transmitted or received between the communication module 190 and an external electronic device via the selected at least one antenna. According to one embodiment, in addition to the radiator, other components (e.g., an RFIC (radio frequency integrated circuit)) may be further formed as part of the antenna module 197.

[0027] According to one embodiment, the antenna module 197 can form an mmWave antenna module. According to one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent to one side of the printed circuit board (e.g., the bottom surface) and capable of supporting a specified high-frequency band (e.g., the mmWave band), and a plurality of antennas (e.g., array antennas) disposed on or adjacent to another side of the printed circuit board (e.g., the top or side surface) and capable of transmitting or receiving signals in the specified high-frequency band.

[0028] At least some of the aforementioned components are connected to each other via a peripheral device communication method (e.g., bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)) and can exchange signals (e.g., instructions or data) with each other.

[0029] According to one embodiment, commands or data can be transmitted to or received between the electronic device 101 and an external electronic device 104 via a server 108 connected to a second network 199. The external electronic devices 102 or 104 may be the same type of device as or different from the electronic device 101. According to one embodiment, all or part of the operations performed by the electronic device 101 can be performed by one or more of the external electronic devices 102, 104, or 108. For example, if the electronic device 101 needs to perform some function or service automatically or in response to a request from a user or another device, the electronic device 101 may, instead of performing the function or service itself, or additionally, request one or more external electronic devices to perform at least part of that function or service. One or more external electronic devices that receive the request may perform at least part of the requested function or service, or additional functions or services related to the request, and communicate the results of the execution to the electronic device 101. The electronic device 101 can provide the results as they are, or with additional processing, as at least part of the response to the request. For this purpose, for example, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology can be used. The electronic device 101 can provide ultra-low latency services, for example, using distributed computing or mobile edge computing. According to one embodiment, the external electronic device 104 may include IoT (Internet of Things) devices. The server 108 may be an intelligent server using machine learning and / or neural networks. According to one embodiment, the external electronic device 104 or the server 108 may be included in the second network 199. The electronic device 101 can be applied to intelligent services (e.g., smart homes, smart cities, smart cars, or healthcare) based on 5G communication technology and IoT-related technologies.

[0030] Figure 2a shows an electronic device according to one embodiment.

[0031] Referring to Figure 2a, an electronic device 101 according to one embodiment may include a housing 210 that forms the external appearance of the electronic device 101. For example, the housing 210 may include a front 200A, a rear 200B, and a side 200C that surrounds the space between the front 200A and the rear 200B. According to one embodiment, the housing 210 may refer to a structure that forms at least a portion of the front 200A, the rear 200B, and / or the side 200C.

[0032] An electronic device 101 according to one embodiment may include a substantially transparent front plate 202. According to one embodiment, the front plate 202 may form at least a portion of the front surface 200A. According to one embodiment, the front plate 202 may include, but is not limited to, a glass plate or a polymer plate containing various coating layers.

[0033] An electronic device 101 according to one embodiment may include a substantially opaque back plate 211. According to one embodiment, the back plate 211 can form at least a portion of the back surface 200B. According to one embodiment, the back plate 211 may be formed of a coating or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the above materials.

[0034] An electronic device 101 according to one embodiment may include a side bezel structure (or side member) 218. According to one embodiment, the side bezel structure 218 can be coupled with a front plate 202 and / or a rear plate 211 to form at least a portion of the side surface 200C of the electronic device 101. For example, the side bezel structure 218 can form the entire side surface 200C of the electronic device 101, and in another example, the side bezel structure 218 can form the side surface 200C of the electronic device 101 together with the front plate 202 and / or the rear plate 211.

[0035] Unlike the illustrated embodiment, if the side surface 200C of the electronic device 101 is partially formed by the front plate 202 and / or the rear plate 211, the front plate 202 and / or the rear plate 211 may include areas that curve from their edges toward the rear plate 211 and / or the front plate 202 and extend seamlessly. The extended areas of the front plate 202 and / or the rear plate 211 may be located, for example, at both ends of the long edge of the electronic device 101, but are not limited to the above example.

[0036] According to one embodiment, the side bezel structure 218 may include metal and / or polymer. According to one embodiment, the back plate 211 and the side bezel structure 218 may be formed integrally and may, but are not limited to, the same material (e.g., a metallic material such as aluminum). For example, the back plate 211 and the side bezel structure 218 may be formed as separate components and / or may contain different materials from each other.

[0037] According to one embodiment, the electronic device 101 may include at least one of the following: a display 201 (e.g., display module 160 in Figure 1), audio modules 203, 204, 207 (e.g., audio module 170 in Figure 1), a sensor module (not shown) (e.g., sensor module 176 in Figure 1), camera modules 205, 212 (e.g., camera module 180 in Figure 1), a key input device 217 (e.g., input module 150 in Figure 1), a light-emitting element (not shown), and / or a connector hole 208. According to one embodiment, the electronic device 101 may omit at least one of the above components (e.g., a key input device 217 or a light-emitting element (not shown)), and may further include other components.

[0038] According to one embodiment, the display 201 can be visually exposed through a substantial portion of the front plate 202. For example, at least a portion of the display 201 can be viewed through the front plate 202 forming the front 200A. According to one embodiment, the display 201 may be located behind the front plate 202.

[0039] According to one embodiment, the outer shape of the display 201 may be formed to be substantially the same as the outer shape of the front plate 202 adjacent to the display 201. According to one embodiment, in order to expand the area in which the display 201 is visually exposed, the distance between the outer shape of the display 201 and the outer shape of the front plate 202 may be formed to be substantially the same.

[0040] According to one embodiment, the display 201 (or the front surface 200A of the electronic device 101) may include a screen display area 201A. According to one embodiment, the display 201 can provide visual information to the user through the screen display area 201A. In the illustrated embodiment, when the front surface 200A is viewed from the front, the screen display area 201A is shown to be separated from the outer casing of the front surface 200A and located inside the front surface 200A, but is not limited thereto. In another embodiment, when the front surface 200A is viewed from the front, at least a portion of the edge of the screen display area 201A may substantially coincide with the edge of the front surface 200A (or front plate 202).

[0041] According to one embodiment, the screen display area 201A may include a sensing area 201B configured to acquire the user's biometric information. Here, "the screen display area 201A includes the sensing area 201B" can be understood as at least a portion of the sensing area 201B being overlapped with the screen display area 201A. For example, the sensing area 201B may mean an area that, like other areas of the screen display area 201A, can display visual information by the display 201 and can also acquire the user's biometric information (e.g., fingerprints). According to one embodiment, the sensing area 201B may be formed in the key input device 217.

[0042] According to one embodiment, the display 201 may include an area where a first camera 205 is located. According to one embodiment, an opening may be formed in the area of ​​the display 201, and the first camera 205 (e.g., a punch-hole camera) may be at least partially positioned within the opening so as to face the front surface 200A. In this case, the screen display area 201A may surround at least a portion of the edge of the opening. According to one embodiment, the first camera 205 (e.g., an under display camera (UDC)) may be positioned below the display 201 so as to overlap with the area of ​​the display 201. In this case, the display 201 may provide visual information to the user through the area, and the first camera 205 may acquire an image through the area of ​​the display 201 corresponding to the direction toward the front surface 200A.

[0043] According to one embodiment, the display 201 may be coupled to or adjacent to a touch sensing circuit, a pressure sensor capable of measuring the intensity (pressure) of a touch, and / or a digitizer for detecting a magnetic field type stylus pen.

[0044] According to one embodiment, the audio modules 203, 204, and 207 may include microphone holes 203, 204 and speaker hole 207.

[0045] According to one embodiment, the microphone holes 203 and 204 may include a first microphone hole 203 formed in a portion of the side surface 200C and a second microphone hole 204 formed in a portion of the back surface 200B. Microphones (not shown) for obtaining external sounds may be placed inside the microphone holes 203 and 204. The microphones may include multiple microphones so as to be able to sense the direction of sound.

[0046] According to one embodiment, a second microphone hole 204 formed in a portion of the rear surface 200B may be positioned adjacent to camera modules 205 and 212. For example, the second microphone hole 204 can acquire sound in response to the operation of camera modules 205 and 212. However, it is not limited to this.

[0047] According to one embodiment, the speaker hole 207 may include an external speaker hole 207 and a call receiver hole (not shown). The external speaker hole 207 may be formed in a portion of the side surface 200C of the electronic device 101. According to one embodiment, the external speaker hole 207 may be implemented as a single hole with the microphone hole 203. Although not shown, the call receiver hole (not shown) may be formed in another portion of the side surface 200C. For example, the call receiver hole may be formed on the side surface 200C opposite to the external speaker hole 207. For example, with reference to the illustration in Figure 2a, the external speaker hole 207 may be formed on the side surface 200C corresponding to the lower end of the electronic device 101, and the call receiver hole may be formed on the side surface 200C corresponding to the upper end of the electronic device 101. However, it is not limited thereto, and according to one embodiment, the call receiver hole may be formed at a location other than the side surface 200C. For example, the call receiver hole may be formed by a spaced-out area between the front plate 202 (or display 201) and the side bezel structure 218.

[0048] According to one embodiment, the electronic device 101 may include at least one speaker (not shown) configured to output sound to the outside of the housing through an external speaker hole 207 and / or a telephone receiver hole (not shown). For example, the speaker may be a piezo speaker configured to output sound by vibrating a diaphragm inside the speaker using a piezoelectric element. However, it is not limited thereto.

[0049] According to one embodiment, a sensor module (not shown) can generate electrical signals or data values ​​corresponding to the internal operating state of the electronic device 101 or the external environmental state. For example, the sensor module may include at least one of the following: a proximity sensor, an HRM (heart rate monitor) sensor, a fingerprint sensor, a gesture sensor, a gyroscope sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an IR (infrared) sensor, a biosensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0050] According to one embodiment, the camera modules 205 and 212 may include a first camera 205 positioned to face the front 200A of the electronic device 101 and a second camera 212 positioned to face the rear 200B.

[0051] According to one embodiment, the second camera 212 may include multiple cameras (e.g., a dual camera, a triple camera, or a quad camera). However, the second camera 212 is not necessarily limited to including multiple cameras, and may include only one camera.

[0052] According to one embodiment, the first camera 205 and the second camera 212 may include one or more lenses, an image sensor, and / or an image signal processor.

[0053] In one embodiment, the electronic device 101 may include a flash 213 positioned facing the rear surface 200B. According to one embodiment, the flash 213 may include, for example, a light-emitting diode or a xenon lamp. According to one embodiment, two or more lenses (infrared camera, wide-angle and telephoto lenses) and an image sensor may be arranged on one side of the electronic device 101.

[0054] According to one embodiment, the key input device 217 may be located on the side surface 200C of the electronic device 101. According to one embodiment, the electronic device 101 does not have to include some or all of the key input device 217, and the not included key input device 217 may be implemented in other forms, such as soft keys, on the display 201.

[0055] According to one embodiment, a connector hole 208 may be formed on the side surface 200C of the electronic device 101 so as to accommodate a connector for an external device. A connection terminal (e.g., connection terminal 178 in Figure 1) that is electrically connected to the connector for the external device may be located within the connector hole 208. The electronic device 101 according to one embodiment may include an interface module (e.g., interface 177 in Figure 1) for processing electrical signals transmitted and received through the connection terminal.

[0056] According to one embodiment, the electronic device 101 may include a light-emitting element (not shown). For example, the light-emitting element (not shown) may be located on the front surface 200A of the housing. The light-emitting element (not shown) can provide state information of the electronic device 101 in the form of light. According to one embodiment, the light-emitting element (not shown) can provide a light source that is synchronized with the operation of the first camera 205. For example, the light-emitting element (not shown) may include an LED, an IR LED, and / or a xenon lamp.

[0057] Figure 2b is an exploded perspective view of an electronic device according to one embodiment.

[0058] In the following sections, redundant explanations will be omitted for configurations that have the same reference numerals as those described above.

[0059] Referring to Figure 2b, an electronic device 101 according to one embodiment may include a display 201, a front plate 202, a back plate 211, a frame structure 240, a first printed circuit board 250, a second printed circuit board 252, a cover plate 260, and a battery 270 (for example, battery 189 in Figure 1).

[0060] According to one embodiment, the frame structure 240 may include a side bezel structure 218 that forms the exterior of the electronic device 101 (e.g., side 200C in Figure 2a) and a support structure 243 that extends inward from the side bezel structure 218. According to one embodiment, the frame structure 240 may be positioned between the display 201 and the back plate 211. According to one embodiment, the side bezel structure 218 of the frame structure 240 may enclose the space between the back plate 211 and the front plate 202 (and / or display 201), and the support structure 243 of the frame structure 240 may extend from the side bezel structure 218 within the space.

[0061] According to one embodiment, the frame structure 240 can support or accommodate other components included in the electronic device 101. For example, a display 201 may be positioned on one side of the frame structure 240 facing in one direction (e.g., the +z direction), and the display 201 may be supported by a support structure 243 of the frame structure 240. For example, a first printed circuit board 250, a second printed circuit board 252, a battery 270, and a second camera 212 may be positioned on the other side of the frame structure 240 facing in the opposite direction (e.g., the -z direction). The first printed circuit board 250, the second printed circuit board 252, the battery 270, and the second camera 212 may be seated in recesses defined by the side bezel structure 218 and / or support structure 243 of the frame structure 240.

[0062] According to one embodiment, the first printed circuit board 250, the second printed circuit board 252, and the battery 270 can each be coupled to the frame structure 240. For example, the first printed circuit board 250 and the second printed circuit board 252 can be fixedly attached to the frame structure 240 via coupling members such as screws. For example, the battery 270 can be fixedly attached to the frame structure 240 via adhesive members (e.g., double-sided tape). However, the embodiment is not limited to the above examples.

[0063] According to one embodiment, the cover plate 260 may be placed between the first printed circuit board 250 and the back plate 211. According to one embodiment, the cover plate 260 may be placed on the first printed circuit board 250. For example, the cover plate 260 may be placed on the surface of the first printed circuit board 250 facing the -z direction.

[0064] According to one embodiment, the cover plate 260 can be at least partially superimposed on the first printed circuit board 250 with respect to the z-axis. According to one embodiment, the cover plate 260 can cover at least a portion of the first printed circuit board 250. This allows the cover plate 260 to protect the first printed circuit board 250 from physical impact or to prevent connectors coupled to the first printed circuit board 250 from becoming detached.

[0065] According to one embodiment, the cover plate 260 may be fixedly positioned on the first printed circuit board 250 via a connecting member (for example, a screw), or it may be coupled to the frame structure 240 together with the first printed circuit board 250 via the connecting member.

[0066] According to one embodiment, the display 201 may be positioned between the frame structure 240 and the front plate 202. For example, the front plate 202 may be positioned on one side of the display 201 (e.g., in the +z direction), and the frame structure 240 may be positioned on the other side (e.g., in the -z direction).

[0067] According to one embodiment, the front plate 202 can be coupled to the display 201. For example, the front plate 202 and the display 201 can be bonded to each other via an optical adhesive (e.g., optically clear adhesive (OCA) or optically clear resin (OCR)) interposed between them.

[0068] According to one embodiment, the front plate 202 can be coupled to the frame structure 240. For example, the front plate 202 may include an outer casing that extends outward from the display 201 when viewed in the z-axis direction, and may be bonded to the frame structure 240 via an adhesive member (e.g., double-sided tape) placed between the outer casing of the front plate 202 and the frame structure 240 (e.g., a side bezel structure 218). However, the invention is not limited to the examples described above.

[0069] According to one embodiment, the first printed circuit board 250 and / or the second printed circuit board 252 may be equipped with a processor (e.g., processor 120 in Figure 1), memory (e.g., memory 130 in Figure 1), and / or an interface (e.g., interface 177 in Figure 1). The processor may include, for example, one or more of a central processing unit, application processor, graphics processing unit, image signal processor, sensor hub processor, or communication processor. The memory may include, for example, volatile memory (e.g., volatile memory 132 in Figure 1) or non-volatile memory (e.g., non-volatile memory 134 in Figure 1). The interface may include, for example, HDMI® (high definition multimedia interface), USB (universal serial bus) interface, SD card interface, and / or audio interface. The interface may allow the electronic device 101 to be electrically or physically connected to an external electronic device and may include a USB connector, an SD card / MMC (multimedia card) connector, or an audio connector. According to one embodiment, the first printed circuit board 250 and the second printed circuit board 252 can be operationally or electrically connected to each other via a connecting member (for example, a flexible printed circuit board).

[0070] According to one embodiment, the battery 270 can supply power to at least one component of the electronic device 101. For example, the battery 270 may include a rechargeable secondary battery or a fuel cell. At least a portion of the battery 270 may be arranged substantially coplanar with the first printed circuit board 250 and / or the second printed circuit board 252.

[0071] An electronic device 101 according to one embodiment may include an antenna module (not shown). According to one embodiment, the antenna module may be located between the back plate 211 and the battery 270. The antenna module may include, for example, an NFC (near-field communication) antenna, a wireless charging antenna, and / or an MST (magnetic secure transmission) antenna. The antenna module may, for example, communicate with an external device or transmit and receive power wirelessly with an external device.

[0072] According to one embodiment, a first camera 205 (e.g., a front camera) may be positioned in at least a portion of the frame structure 240 (e.g., a support structure 243) such that the lens can receive external light through a portion of the front plate 202 (e.g., the front surface 200A in Figure 1) (e.g., a camera area 237).

[0073] According to one embodiment, a second camera 212 (e.g., a rear camera) may be positioned between the frame structure 240 and the rear plate 211. According to one embodiment, the second camera 212 may be electrically connected to the first printed circuit board 250 via a connecting member (e.g., a connector). According to one embodiment, the second camera 212 may be positioned so that its lens can receive external light through the camera area 284 of the rear plate 211 of the electronic device 101.

[0074] According to one embodiment, the camera region 284 may be formed on the surface of the back plate 211 (for example, the back surface 200B in Figure 1). According to one embodiment, the camera region 284 may be formed to be at least partially transparent so that external light can enter the lens of the second camera 212. According to one embodiment, at least a portion of the camera region 284 may protrude to a predetermined height from the surface of the back plate 211. However, without limiting this, in another embodiment, the camera region 284 may also form a plane substantially the same as the surface of the back plate 211.

[0075] According to one embodiment, the housing of the electronic device 101 (for example, the housing 210 in Figure 2a) can mean a configuration or structure that forms at least a part of the external appearance of the electronic device 101. In this regard, at least a part of the front plate 202, frame structure 240, and / or rear plate 211 that form the external appearance of the electronic device 101 can be referred to as the housing 210 of the electronic device 101.

[0076] Figure 3a is a partial cross-sectional view of an exemplary electronic device. Figure 3b shows a part of the exemplary electronic device. Figure 3c shows the shielding structure of the electronic components of the exemplary electronic device.

[0077] Referring to Figures 3a, 3b, and 3c, the electronic device 101 may include a printed circuit board 310 (for example, the first printed circuit board 250 and the second printed circuit board 252 in Figure 2b), electronic components 301, a shielding can 320, a shielding structure 330, a heat conductive member 340, a metal plate 350, and / or at least one heat dissipation member 360. Hereinafter, the combination of the metal plate 350 and at least one heat dissipation member 360 may be referred to as a heat dissipation structure. That is, the electronic device 101 may include a printed circuit board 310 (for example, the first printed circuit board 250 and the second printed circuit board 252 in Figure 2b), electronic components 301, a shielding can 320, a shielding structure 330, a heat conductive member 340, and a heat dissipation structure. The heat dissipation structure may include a metal plate 350 and / or at least one heat dissipation member 360.

[0078] According to one embodiment, the electronic component 301 may be coupled to a printed circuit board 310. For example, the electronic component 301 may be placed on the printed circuit board 310. For example, the electronic component 301 may be mounted on the printed circuit board 310. For example, the electronic component 301 may be electrically connected to the printed circuit board 310. For example, the electronic component 301 may be placed on one side of the printed circuit board 310 facing the display (e.g., the display 201 in Figure 2a). For convenience of explanation, the side on which the printed circuit board 310 is placed may be referred to as the upper surface of the printed circuit board 310. For example, the electronic component 301 may be powered via the printed circuit board 310 from the power management module (e.g., the power management module 188 in Figure 1) and / or battery (e.g., the battery 189 in Figure 1) of the electronic device 101.

[0079] For example, electronic component 301 may be referred to as the processor of the electronic device 101 (e.g., processor 120 in Figure 1). The electronic component 301 may dissipate heat during the operation of the electronic device 101. The electronic component 301 may emit electromagnetic waves while the electronic device 101 is operating. The electronic device 101 may be required to have a structure that reduces the effect of the heat and / or electromagnetic waves emitted from the electronic component 301 on causing other electronic components around the electronic component 301 to malfunction or degrade the performance of those other electronic components. While electronic component 301 has been described as being the processor 120 of the electronic device 101, it is not limited to this. The electronic component 301 may be referred to as a heating element within the electronic device 101 that is configured to dissipate heat or emit electromagnetic waves while the electronic device 101 is operating. That is, electronic component 301 may be any component that emits electromagnetic radiation and / or heat.

[0080] According to one embodiment, the shield can 320 may be placed on a printed circuit board 310. The shield can 320 may surround (or enclose) an electronic component 301. The shield can 320 may include an opening 325 facing the electronic component 301. That is, the shield can 320 may surround or enclose the electronic component 301, except for the opening 325. For example, the shield can 320 may be coupled to the printed circuit board 310. For example, the shield can 320 may be connected to the printed circuit board 310. For example, the shield can 320 may be attached to the printed circuit board 310. For example, the shield can 320 may be mounted on the printed circuit board 310 via at least one component (e.g., solder) between the shield can 320 and the printed circuit board 310. For example, the shield can 320 may be welded onto the printed circuit board 310.

[0081] For example, the shield can 320 may be placed on one side (e.g., the top surface) of the printed circuit board 310 on which the electronic component 301 is arranged. For example, the shield can 320 can shield at least a portion of the electronic component 301. For example, the shield can 320 can cover at least a portion of the electronic component 301. For example, the shield can 320 can surround at least a portion of the electronic component 301. For example, the shield can 320 can separate the electronic component 301 from other electronic components 302 surrounding the electronic component 301 that are mounted on the printed circuit board 310.

[0082] Although the shielding can 320 has been described as enclosing an electronic component 301, it is not limited to this. The shielding can 320 can enclose multiple electronic components, including the electronic component 301. By enclosing the multiple electronic components, the shielding can 320 can be distinguished from the multiple electronic components and separate multiple other electronic components, including other electronic components 302 surrounding the electronic component 301, from the multiple electronic components.

[0083] For example, the shielding can 320 may be connected to the ground within the electronic device 101. For example, the shielding can 320 may be electrically connected to the ground of the electronic device 101 via a printed circuit board 310. By being connected to the ground, the shielding can 320 can emit electromagnetic waves from the electronic component 301 to the ground. That is, electromagnetic waves (or noise) emitted from the electronic component 301 can be transmitted to the ground via the shielding can 320. By emitting the electromagnetic waves to the ground, the shielding can 320 can reduce the performance degradation of other electronic components 302 around the electronic component 301 due to the electromagnetic waves. That is, the shielding can 320 can prevent electromagnetic waves (or noise) emitted from the electronic component from reaching other electronic components 302.

[0084] For example, the opening 325 can penetrate the shield can 320. That is, the opening 325 may be an opening in the plane of the shield can 320 that is substantially parallel to the plane of the printed circuit board 310. For example, the opening 325 may face the printed circuit board 310. For example, the opening 325 may be formed in a portion of the shield can 320 that faces the electronic component 301. For example, the opening 325 may overlap the electronic component 301 when the printed circuit board 310 is viewed from above (for example, from the -z direction). That is, the opening 325 may overlap the electronic component 301 in a direction perpendicular to the upper surface of the printed circuit board 310. For example, the opening 325 can allow a heat conductive member 340 mounted on the electronic component 301 to pass through. That is, the heat conductive member 340 mounted on the electronic component 301 may be positioned and configured so that at least a portion of the heat conductive member 340 passes through the opening 325 in the shield can 320. For example, the opening 325 may be a pathway through which at least some of the heat emitted from the electronic component 301 is released via a heat conduction member 340 mounted on the electronic component 301. That is, the heat emitted from the electronic component 301 can be transferred to the outside of the space enclosed by the shielding can 320 via the heat conduction member 340 located in the opening 325. Because the shielding can 320 includes the opening 325 for releasing the heat from the electronic component 301, the shielding can 320 may require a structure for shielding electromagnetic waves emitted from the electronic component 301 and passing through the opening 325. That is, by including the opening 325 in the shielding can 320 to transfer heat to the outside of the space enclosed by the shielding can 320, the efficiency of the shielding can 320 in shielding other electronic components 302 from electromagnetic waves (or noise) emitted by the electronic component 301 may be reduced. Therefore, a shielding structure 330 may be further included.

[0085] According to one embodiment, the shielding structure 330 may be placed on the shielding can 320. The shielding structure 330 can cover the opening 325 of the shielding can 320. For example, the shielding structure 330 may be mounted on the shielding can 320. For example, the shielding structure 330 may be electrically connected to the shielding can 320. For example, at least a portion of the shielding structure 330 may be in contact with the shielding can 320. For example, the shielding structure 330 may be placed between the shielding can 320 and the metal plate 350.

[0086] For example, at least a portion of the shielding structure 330 may overlap with the opening 325 of the shielding can 320 when the shielding structure 330 is viewed from above (for example, from the -z direction). That is, at least a portion of the shielding structure 330 may overlap with the opening 325 in a direction perpendicular to the upper surface of the printed circuit board 310. For example, at least a portion of the shielding structure 330 may face the opening of the shielding can 320. For example, at least a portion of the shielding structure 330 may come into contact with the heat conductive member 340 that has passed through the opening of the shielding can 320. That is, one end (or surface) of the heat conductive member 340 may be attached to the electronic component 301, and the other end (or surface) on the opposite side may be attached to the electronic component 301 by passing through the opening 325. For example, at least a portion of the shielding structure 330 may face the electronic component 301 through the opening 325 of the shielding can 320. For example, at least a portion of the shielding structure 330 can face at least a portion of the printed circuit board 310 through the opening 325 of the shielding can 320. For example, the shielding structure 330 can seal the space between the shielding can 320 and the printed circuit board 310 by covering the opening 325 of the shielding can 320. That is, the coupling of the shielding can 320 and the shielding structure 330 can completely enclose the space around the electronic component 301. For example, the shielding structure 330 may contain a conductive material. By the shielding structure 330 covering the opening 325 of the shielding can 320, electromagnetic waves emitted from the electronic component 301 through the opening 325 can be reflected by the shielding structure 330 or transmitted through the shielding structure 330 to the shielding can 320 in contact with the shielding structure 330. The electromagnetic waves transmitted to the shield can 320 via the shielding structure 330 can be discharged to the ground of the electronic device 101 connected to the shield can 320. The electronic device 101, by including the shielding structure 330 covering the opening 325, can provide a heat transfer path for heat dissipation of the electronic component 301 and shield electromagnetic waves passing through the opening 325.

[0087] According to one embodiment, the heat conduction member 340 can be mounted on an electronic component 301. The heat conduction member 340 can be positioned between the electronic component 301 and a shielding structure 330. The heat conduction member 340 can be in contact with the shielding structure 330 through an opening 325 in the shielding can 320. For example, the heat conduction member 340 can be mounted on an electronic component 301. For example, the heat conduction member 340 can be in contact with the electronic component 301 and the shielding structure 330. For example, the heat conduction member 340 can transfer at least a portion of the heat emitted from the electronic component 301 to the shielding structure 330. For example, the heat conduction member 340 can transfer at least a portion of the heat emitted from the electronic component 301 to the shielding structure 330 and / or metal plate 350 on the heat conduction member 340 via conduction heat transfer. For example, the heat conduction member 340 can be supported by the electronic component 301. For example, the heat conductive member 340 can be fastened between the shielding structure 330 and the electronic component 301 by being attached to the shielding structure 330.

[0088] For example, the heat conduction member 340 can penetrate at least a portion of the opening 325 of the shield can 320. For example, the heat conduction member 340 can be attached to a shielding structure 330 that covers the opening 325 by passing through the opening 325. For example, the heat conduction member 340 can provide a path for heat emitted from the electronic component 301 to be transferred to the shielding structure 330 through the opening 325. For example, the heat conduction member 340 can extend from the electronic component 301 through the opening 325 to the shielding structure 330. For example, the heat conduction member 340 can include a material having relatively high thermal conductivity. The heat conduction member 340 can be referred to as a TIM (thermal interface material) in that it interposes between the electronic component 301 and the shielding structure 330, but is not limited thereto. The electronic device 101 includes a heat conductive member 340 configured to dissipate at least a portion of the heat emitted from the electronic component 301 through the opening 325 of the shield can 320 to the shielding structure 330 and / or metal plate 350, thereby reducing the performance degradation of the electronic component 301 surrounded by the shield can 320 due to the heat emitted from the electronic component 301.

[0089] According to one embodiment, the heat dissipation structure may be arranged on the shielding structure 330. For example, a metal plate 350 or at least one heat dissipation member 360 may be arranged on the shielding structure 330 (for example, in the z-axis direction). For example, the metal plate 350 may be attached to the shielding structure 330. For example, the metal plate 350 may be attached to the shielding can 320 via the shielding structure 330. For example, the metal plate 350 can support the shielding structure 330. For example, the metal plate 350 can support the shielding can 320 via the shielding structure 330. For example, by supporting the shielding structure 330 and / or the shielding can 320, the metal plate 350 can support the printed circuit board 310 and / or electronic component 301 on which the shielding can 320 is arranged. For example, the metal plate 350 can transfer at least a portion of the heat emitted from the electronic component 301 via the heat conduction member 340 and the shielding structure 330. The metal plate 350 can reduce the performance degradation of the electronic component 301 and / or the display 201 on the metal plate 350 due to the heat by diffusing at least a portion of the transferred heat. According to one embodiment, the metal plate 350 may be referred to as a structure (e.g., support structure 243 in Figure 2b) that forms at least a portion of a frame structure (e.g., frame structure 240 in Figure 2b) for supporting the display 201 of the electronic device 101. For example, referring together with Figure 2b, the metal plate 350 may be a structure (e.g., cover plate 260) that supports the back plate 211 on the opposite side of the display 201. The electronic component 301, shield can 320, and shielding structure 330 may be arranged on one side of the printed circuit board 310 facing the back plate 211. Heat released from the electronic component 301 may be transferred to the metal plate 350 supporting the back plate 211 via the heat conduction member 340 and the shielding structure 330.

[0090] For example, the metal plate 350 may include a first surface 351 facing the shield can 320 and a second surface 352 opposite to the first surface 351. For example, the second surface 352 may be the surface facing the display 201 of the electronic device 101. For example, the first surface 351 may be the surface that pressurizes the shielding structure 330 toward the shield can 320. By including the metal plate 350, the electronic device 101 can reduce the detachment of the shielding structure 330 from the shield can 320 and reduce the degradation of the performance of the electronic component 301 and / or the display 201 due to heat emitted from the electronic component 301.

[0091] According to one embodiment, at least one heat dissipation member 360 can be attached to the metal plate 350. The at least one heat dissipation member 360 can be configured to transfer at least a portion of the heat emitted from the electronic component 301 via the heat conduction member 340. For example, the at least one heat dissipation member 360 can cover at least a portion of the metal plate 350. For example, the at least one heat dissipation member 360 can be in contact with the metal plate 350. For example, the at least one heat dissipation member 360 can be attached to the second surface 352 of the metal plate 350. By dissipating at least a portion of the heat emitted from the electronic component 301 together with the metal plate 350, the at least one heat dissipation member 360 can reduce the performance degradation of the display 201 on the electronic component 301 and / or the at least one heat dissipation member 360 due to the heat.

[0092] According to one embodiment, the electronic device 101 may further include a thermal insulation member 370. The thermal insulation member 370 may be attached to a metal plate 350. The thermal insulation member 370 may be superimposed on the electronic component 301 when the metal plate 350 is viewed from above (for example, from the -z direction). That is, the thermal insulation member 370 may be superimposed on the electronic component 301 in a first direction perpendicular to the upper surface of the printed circuit board 310. For example, the thermal insulation member 370 may be placed on the electronic component 301. For example, by including the thermal insulation member 370, which is placed on the electronic component 301 and has relatively low thermal conductivity, the electronic device 101 can reduce the degradation of the performance of the display 201, which is placed on the metal plate 350, due to heat emitted from the electronic component 301. According to one embodiment, the thermal insulation member 370 may be surrounded by at least one heat dissipation member 360. The at least one heat dissipation member 360 and the heat insulating member 370 for dissipating heat emitted from the electronic component 301 and for heat insulation will be described later in Figures 4a to 6.

[0093] According to one embodiment, the shielding structure 330 may include a first shielding member 331, a second shielding member 332, a first adhesive member 333, and a second adhesive member 334. The first shielding member 331 may be mounted on the shielding can 320. The first adhesive member 333 may be interposed between the first shielding member 331 and the shielding can 320 in order to mount the first shielding member 331 to the shielding can 320. The second shielding member 332 may be mounted on the first shielding member 331. The second adhesive member 334 may be interposed between the first shielding member 331 and the second shielding member 332 in order to mount the second shielding member 332 to the first shielding member 331. In one embodiment, the density d1 of the first shielding member 331 may be less than the density d2 of the second shielding member 332.

[0094] For example, the first shielding member 331 may be positioned between the shield can 320 and the second shielding member 332. For example, the first shielding member 331 may be interposed between the shield can 320 and the second shielding member 332. For example, the first shielding member 331 may be attached to the shield can 320 via the first adhesive member 333. For example, the first shielding member 331 may be fastened to the shield can 320 by the first adhesive member 333. For example, as shown in Figure 3c, the first shielding member 331 may include a third surface 331a facing the shield can 320 and a fourth surface 331b opposite to the third surface 331a. The third surface 331a may be in contact with the first adhesive member 333. The fourth surface 331b may be in contact with the second adhesive member 334. For example, the third surface 331a of the first shielding member 331 may be covered (or partially covered) by the first adhesive member 333. The fourth surface 331b opposite to the third surface 331a may be covered (or partially covered) by the second adhesive member 334. For example, the first adhesive member 333 may be applied to the third surface 331a of the first shielding member 331. The second adhesive member 334 may be applied to the fourth surface 331b opposite to the third surface 331a.

[0095] For example, the second shielding member 332 may be positioned between the first shielding member 331 and the metal plate 350. For example, the second shielding member 332 may be attached to the first shielding member 331 via a second adhesive member 334. For example, the second shielding member 332 may be fixed to the first shielding member 331 via a second adhesive member 334.

[0096] For example, the shielding members 331 and 332 may contain conductive material. By including conductive material in the shielding members 331 and 332, the shielding structure 330 may be configured to discharge electromagnetic waves emitted from the electronic component 301 through the opening 325 of the shielding can 320 to the ground of the electronic device 101 via the shielding can 320 attached to the shielding structure 330. That is, electromagnetic radiation (or noise) emitted from the electronic component 301 to the opening 325 can be transmitted to ground via the connection between the shielding structure 330 and the shielding can 320.

[0097] For example, the shielding members 331 and 332 may contain voids. For example, the porosity of the first shielding member 331 may be greater than that of the second shielding member 332. For example, the yarn thickness of the first shielding member 331 may be less than that of the second shielding member 332. For example, the air permeability of the first shielding member 331 may be greater than that of the second shielding member 332. However, it is not limited thereto. The density d1 of the first shielding member 331 being less than the density d2 of the second shielding member 332 can provide space within the first shielding member 331 for adhesive material from the first adhesive member 333 and the second adhesive member 334 that are in contact with the first shielding member 331.

[0098] According to one embodiment, the first shielding member 331 may include a first region 331c containing adhesive material from a first adhesive member 333 and a second region 331d containing adhesive material from a second adhesive member 334. At least a portion of the fourth surface 331b of the first shielding member 331 facing the second shielding member 332 may be in contact with the second shielding member 332.

[0099] For example, the first shielding member 331 may include voids within the first shielding member 331. For example, the first adhesive member 333 may be pressurized toward the first shielding member 331 by the shield can 320. At least a portion of the adhesive material of the first adhesive member 333 may flow into the voids within the first shielding member 331 through the third surface 331a of the first shielding member 331 due to the pressurization by the shield can 320. The first region 331c of the first shielding member 331 may be a region containing the adhesive material that has flowed from the first adhesive member 333 into the first shielding member 331. For example, the second adhesive member 334 may be pressurized toward the first shielding member 331 by the metal plate 350. At least a portion of the adhesive material of the second adhesive member 334 may flow into the void within the first shielding member 331 via the fourth surface 331b of the first shielding member 331 due to the pressing by the metal plate 350. The second region 331d of the first shielding member 331 may be a region containing the adhesive material that has flowed from the second adhesive member 334 into the first shielding member 331.

[0100] For example, the fourth surface 331b of the first shielding member 331 and / or the surface of the second shielding member 332 may be configured such that at least a portion of the fourth surface 331b of the first shielding member 331 is in direct contact with the surface of the second shielding member 332. For example, at least a portion of the adhesive material of the second adhesive member 334 may flow into the second region 331d via the fourth surface 331b of the first shielding member 331 (e.g., through the gap in the fourth surface 331b) so that at least a portion of the fourth surface 331b toward the second shielding member 332 is in contact with the second shielding member 332. For example, the shielding structure 330 may include points P1, P2, P3 where the fourth surface 331b of the first shielding member 331 is in contact with the second shielding member 332. The shielding structure 330 can increase its shielding performance for shielding electromagnetic waves emitted from the electronic component 301 through the opening of the shield can 320 by having at least a portion of the fourth surface 331b in contact with the second shielding member 332.

[0101] The shielding structure 330 has been described as including, but is not limited to, points P1, P2, and P3 where the fourth surface 331b contacts the second shielding member 332. The shielding structure 330 may include other points where the third surface 331a opposite to the fourth surface 331b contacts the shield can 320. For example, the third surface 331a of the first shielding member 331 and / or the surface of the shield can 320 may be configured such that at least a portion of the third surface 331a of the first shielding member 331 directly contacts the surface of the shield can 320. For example, at least a portion of the adhesive material of the first adhesive member 333 may flow into the first region 331c via the third surface 331a of the first shielding member 331 (e.g., through the gap in the third surface 331a) so that at least a portion of the third surface 331a toward the shield can 320 can come into contact with the shield can 320. The shielding structure 330 can increase its shielding performance for shielding electromagnetic waves emitted from the electronic component 301 through the opening of the shielding can 320 by having at least a portion of the third surface 331a in contact with the shielding can 320. The shielding structure 330 can increase the structural stability of structures on the shielding structure 330 (e.g., metal plate 350 and / or display 201) by including regions 331c, 331d configured to contain adhesive material.

[0102] According to one embodiment, the thickness t1 of the first shielding member 331 may be located within the range of approximately 70 μm to 80 μm. The thickness t2 of the second shielding member 332 may be located within the range of approximately 10 μm to 20 μm. By having the thickness t1 of the first shielding member 331 located within the range of approximately 70 μm to 80 μm, and the thickness t2 of the second shielding member 332 located within the range of approximately 10 μm to 20 μm, the shielding structure 330 can increase its shielding performance for shielding the electronic component 301 and enhance the structural stability of the structure on the shielding structure 330 (e.g., the metal plate 350 and / or the display 201).

[0103] According to one embodiment, the thickness t3 of the first adhesive member 333 and the first thickness t4 and second thickness t5 of the second adhesive member 334 can each be located within a range of approximately 1 μm to 15 μm. For example, since at least a portion of the second adhesive member 334 is in contact with the heat conductive member 340 through the groove 330a of the shielding structure 330, the first thickness t4 of the portion of the second adhesive member 334 that is located between the first shielding member 331 and the second shielding member 332 may be smaller than the second thickness t5 of the portion that is located between the second shielding member 332 and the heat conductive member 340. The second thickness t5 can be located within a range of approximately 1 μm to 15 μm. By having the thickness t3 of the first adhesive member 333 and the first thickness t4 and second thickness t5 of the second adhesive member 334 each located within a range of approximately 1 μm to 15 μm, the shielding structure 330 can increase the shielding performance of the shielding structure 330 for shielding the electronic component 301 and enhance the structural stability of the structure on the shielding structure 330 (for example, the metal plate 350 and / or the display 201).

[0104] According to one embodiment, the heat conductive member 340 may include at least one of rubber, paraffin wax, and oil. By including at least one of rubber, paraffin wax, and oil in the heat conductive member 340, the heat conductive member 340 can reduce the repulsive force against a structure on the heat conductive member 340 that pressurizes the heat conductive member 340 (e.g., a shielding structure 330, a metal plate 350, or a display 201). By reducing the repulsive force against the structure, the heat conductive member 340 can enhance the structural safety of the structure.

[0105] According to one embodiment, the shielding structure 330 may further include a groove 330a recessed from the opening 325 toward the metal plate 350 to accommodate a heat conduction member 340 that penetrates at least a portion of the opening 325. That is, the shielding structure 330 may include an indented portion on the surface facing the heat conduction member 340 to accommodate a portion of the heat conduction member 340. For example, the groove 330a may extend from the opening 325 to accommodate at least a portion of the heat conduction member 340 that penetrates the opening 325 of the shielding can 320. The groove 330a may be connected to the opening 325. For example, the depth of the groove 330a may be substantially the same as the length of the heat conduction member 340 that protrudes from the opening 325 toward the shielding structure 330 for mounting the heat conduction member 340 to the shielding structure 330. For example, the edge of the groove 330a may be aligned with the edge of the opening 325. For example, the inner surface of the groove 330a can be in contact with the heat conductive member 340. By including the groove 330a, the shielding structure 330 can provide space for the heat conductive member 340 protruding through the opening 325 of the shield can 320.

[0106] According to one embodiment, the first shielding member 331 can surround at least a portion of the heat conductive member 340 that has passed through the opening 325. The second shielding member 332 can be attached to the heat conductive member 340 via a second adhesive member 334. For example, the first shielding member 331 can surround the heat conductive member 340 that protrudes from the opening 325 toward the shielding structure 330. For example, at least a portion of the first shielding member 331 can face a portion of the heat conductive member 340 that has passed through the opening 325. For example, the second shielding member 332 can cover the opening 325. By covering the opening 325, the second shielding member 332 can shield the space surrounded by the printed circuit board 310, the shield can 320, and the shielding structure 330. The second shielding member 332 can be attached to the heat conductive member 340 that has passed through the opening 325 via the second adhesive member 334.

[0107] For example, a groove 330a for accommodating a heat conduction member 340 protruding from the shield can 320 through the opening 325 may be formed by a first shielding member 331, a first adhesive member 333, and a second adhesive member 334 of the shielding structure 330. For example, the groove 330a may be formed by the first shielding member 331 and the first adhesive member 333. The first shielding member 331 and the first adhesive member 333 can surround the heat conduction member 340 that has passed through the opening 325. The second adhesive member 334 can come into contact with the heat conduction member 340 by covering the heat conduction member 340 that has passed through the opening 325. By coming into contact with the heat conduction member 340, the second adhesive member 334 can attach the heat conduction member 340 to the second shielding member 332. The heat conductive member 340 may be configured to transfer at least a portion of the heat emitted from the electronic component 301 to the shielding structure 330 by being in contact with the shielding structure 330.

[0108] According to one embodiment, the shielding structure 330 may further include a protective member 335. For example, the protective member 335 may be positioned on a surface of the shielding structure 330 opposite to the surface of the shielding structure 330 that is in contact with the heat conductive member 340. The protective member 335 may be positioned on the second shielding member 332. For example, the protective member 335 may be laminated on the second shielding member 332. For example, the protective member 335 may be laminated onto the second shielding member 332. For example, the protective member 335 may be attached on the second shielding member 332. For example, the protective member 335 may be positioned on a surface of the second shielding member 332 opposite to the surface of the second shielding member 332 that is in contact with the second adhesive member 334. For example, the protective member 335 may be interposed between the second shielding member 332 and the metal plate 350. For example, the protective member 335 may, but is not limited to, polyurethane. By including the protective member 335, the shielding structure 330 can reduce the degradation of its performance caused by structures on the shielding structure 330 (e.g., metal plate 350).

[0109] The electronic device 101 according to the above-described embodiment can reduce the performance degradation of other electronic components (e.g., other electronic components 302) around the electronic component 301 due to electromagnetic waves emitted from the electronic component 301 by including a shielding can 320. The electronic device 101 can reduce the performance degradation of the electronic component 301 due to heat emitted from the electronic component 301 by including a heat conductive member 340 that passes through the opening 325 of the shielding can 320 and is attached to the electronic component 301. The electronic device 101 can reduce the performance degradation of other electronic components around the electronic component 301 due to electromagnetic waves emitted from the electronic component 301 through the opening 325 by including a shielding structure 330 that covers the opening 325. The shielding structure 330 can improve the shielding performance of the shielding structure 330 for electromagnetic waves emitted from the electronic component 301 through the opening 325, by having a density d1 of the first shielding member 331 attached to the shield can 320 that is lower than the density d2 of the second shielding member 332 attached on the first shielding member 331. The electronic device 101 can reduce the degradation of the performance of the electronic device 101 due to heat emitted from the electronic component 301 by including a metal plate 350 disposed on the shielding structure 330 and at least one heat dissipation member 360.

[0110] Figures 4a, 4b, 4c, 4d, and 4e are partial cross-sectional views of an exemplary electronic device.

[0111] Referring to Figures 4a, 4b, 4c, 4d, and 4e, the electronic device 101 may include a printed circuit board 310 (for example, a first printed circuit board 250 and a second printed circuit board 252 in Figure 2b), an electronic component 301 coupled on the printed circuit board 310, and a shield can 320 on the printed circuit board 310 that surrounds the electronic component 301 and includes an opening 325 facing the electronic component 301. The electronic device 101 may also include a shielding structure 330 on the shield can 320 that covers the opening 325, and a heat conductive member 340 mounted on the electronic component 301 and in contact with the shielding structure 330 via the opening 325 between the electronic component 301 and the shielding structure 430. The electronic device 101 may include a metal plate 350 on the shielding structure 330, and at least one heat dissipation member 360 attached to the metal plate 350 and configured to transfer at least a portion of the heat emitted from the electronic components via the heat conductive member 340. In one embodiment, the shielding structure 330 may include a first shielding member 331 mounted on the shield can 320, a first adhesive member (for example, the first adhesive member 333 in Figure 3c) interposed between the first shielding member 331 and the shield can 320 for attaching the first shielding member 331 to the shield can 320, a second shielding member 332 mounted on the first shielding member 331, and a second adhesive member (for example, the second adhesive member 334 in Figure 3c) interposed between the first shielding member 331 and the second shielding member 332 for attaching the second shielding member 332 to the first shielding member 331. For example, the density d1 of the first shielding member 331 may be less than the density d2 of the second shielding member 332. According to one embodiment, the shielding structure 330 may further include a groove 330a recessed from the opening 325 toward the metal plate 350 in order to accommodate the heat conductive member 340 that penetrates at least a portion of the opening 325.

[0112] In the following, redundant explanations of the configurations described in Figures 3a to 3c will be omitted. The features above described in Figures 3a to 3c (for example, the protective member 335, the first region 331c, the second region 331d, etc.) can be combined with embodiments described later, even if they are not shown in Figures 4a, 4b, 4c, 4d, and 4e.

[0113] According to one embodiment, the metal plate 350 may include a heat dissipation portion 350a positioned above the electronic component 301. For example, the heat dissipation portion 350a may overlap the electronic component 301 when the metal plate 350 is viewed from above (for example, from the -z direction). For example, the heat dissipation portion 350a may be configured to overlap at least a portion of the electronic component 301 in a first direction perpendicular to the upper surface of the printed circuit board 310. For example, the heat dissipation portion 350a may be located on a heat conductive member 340. For example, the heat dissipation portion 350a may overlap the opening 325 of the shield can 320 when the metal plate 350 is viewed from above (for example, from the -y direction). For example, the heat dissipation portion 350a may be located on a portion of a shielding structure 330 that covers the opening 325 of the shield can 320. In order to reduce the performance degradation of the electronic device 101 due to heat emitted from the electronic component 301, the electronic device 101 may require a structure for dissipating the heat transferred from the electronic component 301 to the heat dissipation portion 350a of the metal plate 350 via the heat conductive member 340 and the shielding structure 330.

[0114] According to one embodiment, the at least one heat dissipation member 360 may include at least one of a vapor chamber, a heat pipe, graphite, and graphene. By including at least one of the vapor chamber, heat pipe, graphite, and graphene in the at least one heat dissipation member 360 attached to the metal plate 350, the at least one heat dissipation member 360 can dissipate the heat transferred from the electronic component 301 to the metal plate 350. By dissipating the heat, the at least one heat dissipation member 360 can reduce the performance degradation of the electronic device 101 due to the heat.

[0115] Referring to Figures 4a, 4b, and 4c, the metal plate 350 may include recesses or through-holes, the recesses or through-holes may be configured to at least partially overlap the electronic component 301 and the upper surface of the printed circuit board 310 in a first direction perpendicular to the upper surface of the printed circuit board 310. At least one heat dissipation member 360 may be placed within the recesses or through-holes. For example, a groove may be formed on the first surface 351 of the metal plate 350 facing the shield can 320, or a groove may be formed on the second surface 352 of the metal plate 350 opposite to the first surface 351. For example, a through-hole may extend from the first surface 351 of the metal plate 350 to the second surface 352 of the metal plate 350.

[0116] Referring to Figure 4a, in one embodiment, the metal plate 350 may include a recess 355 extending toward the heat conduction member 340 from a second surface 352 of the metal plate 350, opposite to the first surface 351 facing the shield can 320. That is, the metal plate 350 may include a recessed portion on the second surface 352 (i.e., the surface opposite to the surface facing the shielding structure 330). At least one heat dissipation member 360 may be placed within the recess 355 so that it is superimposed on the electronic component 301 when the metal plate 350 is viewed from above (for example, from the -z direction).

[0117] For example, the recess 355 may be recessed from the second surface 352 of the metal plate 350 toward the first surface 351 opposite to the second surface 352. For example, the recess 355 may overlap with the electronic component 301 when the metal plate 350 is viewed from above (for example, from the -z direction). For example, the recess 355 may be configured to overlap with the electronic component 301 at least partially in a first direction perpendicular to the upper surface of the printed circuit board 310. For example, the recess 355 may be formed within the heat dissipation portion 350a of the metal plate 350. For example, the recess 355 may be positioned to overlap with the heat conduction member 340. For example, the recess 355 can accommodate at least one heat dissipation member 360. For example, at least one heat dissipation member 360 may be mounted on the heat conduction member 340 by being positioned within the recess 355. The metal plate 350 includes a recess 355 for accommodating at least one heat dissipation member 360, thereby reducing the performance degradation of the electronic device 101 due to heat emitted from the electronic component 301.

[0118] According to one embodiment, the electronic device 101 may further include other heat conductive members 410, distinct from the heat conductive member 340, which is positioned in a recess 355 of the metal plate 350 toward the electronic component 301 and attached to the electronic component 301. For example, the other heat conductive member 410 may be positioned between the inner surface of the recess 355 and at least one heat dissipation member 360. By further including the other heat conductive member 410 in contact with the metal plate 350 and the at least one heat dissipation member 360, the electronic device 101 can reduce the performance degradation of the electronic device 101 due to heat emitted from the electronic component 301. According to one embodiment, the heat conductive member 340 attached to the electronic component 301 may have a pad shape. The other heat conductive member 410 positioned in the recess 355 may be positioned, unlike the heat conductive member 340, to be applied to at least a portion of the inner surface of the recess 355. However, it is not limited thereto.

[0119] According to one embodiment, the electronic device 101 may further include a thermal insulation member 370 covering a recess 355 in which at least one heat dissipation member 360 is located. The thermal insulation member 370 may be attached to the at least one heat dissipation member 360. For example, the thermal insulation member 370 may be supported by the at least one heat dissipation member 360. By including a thermal insulation structure covering the recess 355, the electronic device 101 can reduce the degradation of the performance of the display of the electronic device 101 (e.g., the display 201 in Figure 2a) located on the thermal insulation member 370 due to heat transferred from the electronic component 301 to the at least one heat conduction member 360 in the recess 355.

[0120] Referring to Figure 4b, in one embodiment, unlike in Figure 4a, the recess 355 of the metal plate 350 may be recessed from a first surface 351 facing the shield can 320 toward a second surface 352 opposite to the first surface 351. That is, the metal plate 350 may include a recessed portion toward the first surface 351 (i.e., the surface facing the shielding structure 330). At least one heat dissipation member 360 may be located within the recess 355. According to one embodiment, the electronic device 101 may further include other heat conduction members 410, which are located within the recess 355 and are distinguished from the heat conduction member 340 attached to the electronic component 301. The other heat conduction member 410 may be located between at least one heat dissipation member 360 and the shielding structure 330. The other heat conductive member 410, by contacting the shielding structure 330 and the at least one heat dissipation member 360, can reduce the performance degradation of the electronic device 101 due to heat emitted from the electronic component 301.

[0121] According to one embodiment, the thermal insulation member 370 may be mounted on a second surface 352 opposite to the first surface 351 on which the recess 355 is formed. The metal plate 350 may include other recesses that are recessed from the second surface 352 toward the first surface 351, for example, to accommodate the thermal insulation member 370. That is, the metal plate 350 may also include recessed portions on the second surface 352 (i.e., the surface opposite to the surface facing the shielding structure 330). For example, the thermal insulation member 370 may be superimposed on the recess 355 for accommodating at least one heat dissipation member 360 when viewed from above (e.g., from the -z direction). For example, the thermal insulation member 370 may be positioned above at least one heat dissipation member 360. By including the thermal insulation member 370 mounted on the second surface 352, the electronic device 101 can reduce the degradation of the performance of the electronic device 101 due to heat emitted from the electronic components 301.

[0122] Referring to Figure 4c, in one embodiment, unlike Figures 4a and 4b, the metal plate 350 may further include a through hole 356 formed within the heat dissipation portion 350a. For example, the through hole 356 may extend from a first surface 351 of the metal plate 350 facing the shield can 320 to a second surface 352 opposite to the first surface 351. For example, the through hole 356 may overlap with the electronic component 301 when the metal plate 350 is viewed from above (for example, from the -z direction). For example, the through hole 356 may be configured to overlap with the electronic component 301 at least partially in a first direction perpendicular to the upper surface of the printed circuit board 310.

[0123] According to one embodiment, at least one heat dissipation member 360 may be located inside the through-hole 356. The electronic device 101 may further include other heat conductive members 410, which are located inside the through-hole 356 and are distinct from the heat conductive member 340 attached to the electronic component 301. The other heat conductive member 410 may be located between at least one heat dissipation member 360 and the shielding structure 330.

[0124] According to one embodiment, the electronic device 101 may further include a heat insulating member 370 that covers the through hole 356. The heat insulating member 370 can be in contact with at least one heat dissipation member 360 disposed within the through hole 356. By including the heat insulating member 370 that covers the through hole 356, the electronic device 101 can reduce the performance degradation of the electronic device 101 due to heat emitted from the electronic component 301.

[0125] Referring to Figure 4d, in one embodiment, at least one heat dissipation member 360 may include a first heat dissipation member 361 that covers at least a portion of the second surface 352 of the metal plate 350, opposite to the first surface 351 of the metal plate 350 facing the shield can 320. For example, the electronic device 101 may further include an insulating member 370 disposed on the heat dissipation portion 350a of the metal plate 350 and at least a portion surrounded by the first heat dissipation member 361. For example, the first heat dissipation member 361 may be mounted on the second surface 352 of the metal plate 350. The insulating member 370 may be surrounded by the first heat dissipation member 361 mounted on the second surface 352 and disposed above the heat dissipation portion 350a of the metal plate 350. That is, the insulating member 370 may be configured such that at least a portion overlaps the heat dissipation portion 350a in a first direction perpendicular to the upper surface of the printed circuit board 310. The first heat dissipation member 361 can surround at least a portion of the heat insulating member 370. For example, the heat insulating member 370 can be in contact with the first heat dissipation member 361. For example, at least a portion of the first heat dissipation member 361 can be interposed between the heat insulating member 370 and the heat dissipation portion 350a of the metal plate 350. For example, the heat insulating member 370 can be attached to (or superimposed on) the heat dissipation portion 350a located on the electronic component 301 to reduce heat transfer from the electronic device 101 toward the heat dissipation portion 350a (e.g., in the +z direction). By reducing the heat transfer, the heat insulating member 370 can reduce the degradation of the performance of components of the electronic device 101 (e.g., the display 201) located on the heat insulating member 370. The electronic device 101 includes a first heat dissipation member 361 on the second surface 352 of the metal plate 350, and a heat insulating member 370 at least partially surrounded by the first heat dissipation member 361, thereby reducing the degradation of the performance of the electronic device 101 due to heat emitted from the electronic component 301.

[0126] According to one embodiment, at least one heat dissipation member 360 may further include a first heat dissipation member 361 and a second heat dissipation member 362 disposed on and covering the heat insulating member 370. For example, the second heat dissipation member 362 may cover the heat insulating member 370 and at least a portion of the first heat dissipation member 361. For example, the second heat dissipation member 362 may be in contact with the heat insulating member 370. By including the second heat dissipation member 362, the electronic device 101 can dissipate heat transferred from the electronic component 301 to the heat insulating member 370 and / or the first heat dissipation member 361 via the metal plate 350. By dissipating the heat, the second heat dissipation member 362 can reduce the performance degradation of the electronic device 101 due to the heat.

[0127] Referring to Figure 4e, at least one heat dissipation member 360 may further include a stepped structure 360a for housing an insulating member 370. For example, the insulating member 370 may be positioned on the stepped structure 360a. The stepped structure 360a may be formed above the heat dissipation portion 350a of the metal plate 350. The insulating member 370 may be superimposed on the heat dissipation portion 350a when the metal plate 350 is viewed from above (for example, from the -z direction). By including the stepped structure 360a, the at least one heat dissipation member 360 can provide space for the insulating member 370 to be positioned for heat released from the electronic component 301 to the heat dissipation portion 350a.

[0128] According to one embodiment, at least one heat dissipation member 360 may include a first heat dissipation member 361 and a second heat dissipation member 362 mounted on the first heat dissipation member 361 to form a stepped structure 360a. For example, the length of the second heat dissipation member 362 positioned on the first heat dissipation member 361 may be shorter than the length of the first heat dissipation member 361. By making the length of the second heat dissipation member 362 shorter than the length of the first heat dissipation member 361, at least one heat dissipation member 360 can provide a stepped structure 360a for which a heat insulating member 370 is positioned.

[0129] The electronic device 101 according to the above-described embodiment can reduce heat transfer from the electronic component 301 toward the heat dissipation portion 350a (for example, in the +z direction) by including a heat insulating member 370 placed on (or superimposed on) the heat dissipation portion 350a of the metal plate 350. The electronic device 101 can dissipate heat emitted from the electronic component 301 by including at least one heat dissipation member 360 around the heat insulating member 370. The electronic device 101 can reduce the performance degradation of the electronic device 101 due to heat emitted from the electronic component 301 by including the at least one heat dissipation member 360 and the heat insulating member 370.

[0130] Figures 5a and 5b are partial cross-sectional views of an exemplary electronic device.

[0131] Referring to Figures 5a and 5b, the electronic device 101 may include a printed circuit board 310 (for example, the first printed circuit board 250 and the second printed circuit board 252 in Figure 2b), an electronic component 301, a shielding can 320, a shielding structure 330, a heat conductive member 340, a metal plate 350, and at least one heat dissipation member 360. According to one embodiment, the metal plate 350 may include a heat dissipation portion 350a positioned above the electronic component 301. That is, the heat dissipation portion 350a may be configured such that at least a portion overlaps the electronic component 301 in a first direction perpendicular to the upper surface of the printed circuit board 310.

[0132] According to one embodiment, the heat dissipation member 360 may include at least one of a vapor chamber, a heat pipe, graphite, and graphene.

[0133] The following explanation will omit redundant descriptions of the configurations shown in Figures 3a to 3c. The features described above (e.g., protective member 335, first region 331c, second region 331d, etc.) related to Figures 3a to 3c are not shown in Figures 5a and 5b, but can be combined with embodiments described later.

[0134] Referring to Figure 5a, at least one heat dissipation member 360 may include a third heat dissipation member 363 attached to the shielding structure 330, covering at least a portion of the first surface 351 of the metal plate 350 facing the shield can 320. For example, the third heat dissipation member 363 may be positioned between the shielding structure 330 and the metal plate 350. For example, the third heat dissipation member 363 may be attached on the first surface 351 of the metal plate 350. The third heat dissipation member 363 can reduce the degradation of the performance of the electronic device 101 due to the heat transferred to the third heat dissipation member 363 by dissipating the heat transferred from the electronic component 301 to the third heat dissipation member 363 via the heat conduction member 340.

[0135] Referring to Figure 5b, the electronic device 101 may further include an insulating member 370 which is at least partially surrounded by a third heat dissipation member 363. The insulating member 370 may be attached to the heat dissipation portion 350a of the metal plate 350. At least one heat dissipation member 360 may further include the third heat dissipation member 363 and a fourth heat dissipation member 364 which is positioned on and covers the insulating member 370.

[0136] For example, the heat insulating member 370 may be placed on the first surface 351 of the metal plate 350 and attached to the heat dissipation portion 350a of the metal plate 350. The third heat dissipation member 363 may surround at least a portion of the heat insulating member 370. For example, the heat insulating member 370 may be in contact with the third heat dissipation member 363. For example, at least a portion of the third heat dissipation member 363 may be interposed between the heat insulating member 370 and the fourth heat dissipation member 364. For example, by attaching the heat insulating member 370 to the heat dissipation portion 350a placed on the electronic component 301, heat transfer from the electronic component 301 to the electronic device 101 in the direction toward the heat dissipation portion 350a (e.g., the +z direction) can be reduced. By reducing the heat transfer, the heat insulating member 370 can reduce the degradation of the performance of components of the electronic device 101 (e.g., the display 201) placed on the heat insulating member 370. The electronic device 101 includes a third heat dissipation member 363 on the first surface 351 of the metal plate 350, and a heat insulating member 370 at least partially surrounded by the third heat dissipation member 363, thereby reducing the degradation of the performance of the electronic device 101 due to heat emitted from the electronic component 301.

[0137] For example, the fourth heat dissipation member 364 can cover at least a portion of the third heat dissipation member 363. For example, although not shown, the fourth heat dissipation member 364 can be in contact with the heat insulating member 370 and the shielding structure 330. By including the fourth heat dissipation member 364, the electronic device 101 can dissipate the heat transferred from the electronic components 301 to the fourth heat dissipation member 364 via the shielding structure 330. By dissipating the heat, the fourth heat dissipation member 364 can reduce the performance degradation of the electronic device 101 due to the heat.

[0138] According to one embodiment, the third heat dissipation member 363 and the fourth heat dissipation member 364 may be formed integrally. The heat insulating member 370 may be surrounded by the heat dissipation member 360 on the integrally formed first surface 351. The heat insulating member 370 may be covered by a metal plate 350, but is not limited thereto. According to one embodiment, unlike that shown in Figure 5b, the fourth heat dissipation member 364 may be omitted. The third heat dissipation member 363 may be attached to the shielding structure 330.

[0139] The electronic device 101 according to the above-described embodiment can reduce heat transfer from the electronic component 301 toward the heat dissipation portion 350a (for example, in the +y direction) by including a heat insulating member 370 attached to the heat dissipation portion 350a of the metal plate 350. The electronic device 101 can dissipate heat emitted from the electronic component 301 by including at least one heat dissipation member 360 around the heat insulating member 370. The electronic device 101 can reduce the performance degradation of the electronic device 101 due to heat emitted from the electronic component 301 by including the at least one heat dissipation member 360 and the heat insulating member 370.

[0140] Figure 6 is a partial cross-sectional view of an exemplary electronic device.

[0141] Referring to Figure 6, the electronic device 101 may include a printed circuit board 310 (for example, the first printed circuit board 250 and the second printed circuit board 252 in Figure 2b), an electronic component 301, a shielding can 320, a shielding structure 330, a heat conductive member 340, a metal plate 350, and at least one heat dissipation member 360. According to one embodiment, the metal plate 350 may include a heat dissipation portion 350a that is placed on (or above) the electronic component 301. That is, the heat dissipation portion 350a may be configured such that at least a portion of it overlaps with the electronic component 301 in a first direction perpendicular to the upper surface of the printed circuit board 310. Hereinafter, redundant explanations of the configurations described in Figures 3a to 3c will be omitted. The features described above (for example, the protective member 335, the first region 331c, the second region 331d, etc.) related to Figures 3a to 3c can be combined with embodiments described later, even if they are not shown in Figure 6.

[0142] According to one embodiment, the heat dissipation member 360 may include at least one of a vapor chamber, a heat pipe, graphite, and graphene.

[0143] According to one embodiment, the heat insulating member 370 may include a first heat insulating member 371 and a second heat insulating member 372. At least one heat dissipation member 360 may include a first heat dissipation member 361, a second heat dissipation member 362, a third heat dissipation member 363, and / or a fourth heat dissipation member 364.

[0144] For example, the first heat insulating member 371 may be positioned on the second surface 352 of the metal plate 350 facing the display (for example, the display 201 in Figure 2a). For example, the first heat insulating member 371 may be positioned above the second surface 352. For example, the first heat insulating member 371 may be configured such that at least a portion of it overlaps with the electronic component 301 in a first direction perpendicular to the upper surface of the printed circuit board 310. At least a portion of the first heat insulating member 371 may be surrounded by the first heat dissipation member 361. For example, the first heat insulating member 371 may be attached to the heat dissipation portion 350a of the metal plate 350, although this is not shown. For example, at least a portion of the first heat dissipation member 361 may be interposed between the first heat insulating member 371 and the heat dissipation portion 350a. The second heat dissipation member 362 may be attached on the first heat dissipation member 361 and the first heat insulating member 371. The second heat dissipation member 362 may be positioned between the first heat dissipation member 361 and the display 201. The second heat dissipation member 362 may cover the first heat insulating member 371.

[0145] For example, the third heat dissipation member 363 may be positioned on the first surface 351 of the metal plate 350 facing the shield can 320. The second heat insulating member 372 may be positioned on the first surface 351. The second heat insulating member 372 may be at least partially surrounded by the third heat dissipation member 363. The second heat insulating member 372 may be attached to the heat dissipation portion 350a of the metal plate 350. The fourth heat dissipation member 364 may be attached on the third heat dissipation member 363 and the second heat insulating member 372. For example, at least a portion of the third heat dissipation member 363 may be interposed between the second heat insulating member 372 and the fourth heat dissipation member 364. The fourth heat dissipation member 364 may be positioned between the third heat dissipation member 363 and the shielding structure 330. The second heat insulating member 372 may be covered by the metal plate 350.

[0146] The electronic device 101 according to the above-described embodiment can reduce heat transfer from the electronic component 301 toward the heat dissipation portion 350a (for example, in the +y direction) by including a heat insulating member 370 disposed in the heat dissipation portion 350a of the metal plate 350. The electronic device 101 can dissipate heat emitted from the electronic component 301 by including at least one heat dissipation member 360 around the heat insulating member 370. The electronic device 101 can reduce the performance degradation of the electronic device 101 due to heat emitted from the electronic component 301 by including the at least one heat dissipation member 360 and the heat insulating member 370.

[0147] Figure 7 shows the lamination process for an exemplary shielding structure of an electronic device.

[0148] Referring to Figure 7, the electronic device (for example, the electronic device 101 in Figure 1) may include a printed circuit board 310 (for example, the first printed circuit board 250 and the second printed circuit board 252 in Figure 2b), an electronic component 301 coupled on the printed circuit board 310, and a shield can 320 on the printed circuit board 310 that surrounds the electronic component 301 and includes an opening 325 facing the electronic component 301. The electronic device 101 may also include a shielding structure 330 on the shield can 320 that covers the opening 325, and a heat conductive member 340 mounted on the electronic component 301 and in contact with the shielding structure 330 via the opening 325 between the electronic component 301 and the shielding structure 330. The shielding structure 330 may include a first shielding member 331 mounted on the shield can 320, a first adhesive member 333 interposed between the first shielding member 331 and the shield can 320 for attaching the first shielding member 331 to the shield can 320, a second shielding member 332 mounted on the first shielding member 331, and a second adhesive member 334 interposed between the first shielding member 331 and the second shielding member 332 for attaching the second shielding member 332 to the first shielding member 331. For example, the density d1 of the first shielding member 331 may be smaller than the density d2 of the second shielding member 332. According to one embodiment, the shielding structure 330 may further include a groove 330a recessed from the opening 325 toward the metal plate 350 in order to accommodate the heat conductive member 340 that penetrates at least a portion of the opening 325.

[0149] Referring to step 700a, the shielding structure 330 can be mounted on the shield can 320. The members 331, 332, 333, 334, and 335 within the shielding structure 330 can be laminated to each other within the shielding structure 330. For example, the first shielding member 331 can be laminated on the first adhesive member 333. The second adhesive member 334 can be laminated on the first shielding member 331. The second shielding member 332 can be laminated on the second adhesive member 334. The protective member 335 can be laminated on the second shielding member 332. The first shielding member 331 can be mounted on the shield can 320 by laminating it on the first adhesive member 333. The second shielding member 332 can be mounted on the first shielding member 331 by laminating it on the second adhesive member 334.

[0150] Referring to step 700b, the shielding structure 330 may be pressurized in the direction toward the printed circuit board 310 (e.g., the -z direction). The shielding structure 330 may be pressurized toward the shield can 320 by a metal plate (e.g., the metal plate 350 in Figure 3a). For example, since the first shielding member 331 contains a void, at least a portion of the first adhesive member 333 between the first shielding member 331 and the shield can 320 may flow into the void within the first shielding member 331 via the third surface 331a of the first shielding member 331 toward the shield can 320. The first region 331c of the first shielding member 331 may be formed by the inflow of adhesive material into the first shielding member 331 due to the pressurization applied from the first adhesive member 333 to the shielding structure 330. At least a portion of the third surface 331a of the first shielding member 331 can come into contact with the shield can 320. For example, since the first shielding member 331 contains voids and the density d1 of the first shielding member 331 is less than the density d2 of the second shielding member 332, at least a portion of the second adhesive member 334 between the first shielding member 331 and the second shielding member 332 can flow into the voids within the first shielding member 331 via the fourth surface 331b of the first shielding member 331 facing the second shielding member 332. The second region 331d of the first shielding member 331 can be formed by the inflow of adhesive material from the second adhesive member 334 into the first shielding member 331 due to pressure applied to the shielding structure 330. At least a portion of the fourth surface 331b of the first shielding member 331 can be in contact with the second shielding member 332. At least a portion of the second adhesive member 334 can be moved toward the printed circuit board 310 together with the second shielding member 332 by the pressure applied. The second adhesive member 340 that has moved toward the printed circuit board 310 can be attached to the heat conductive member 340. That is, the shielding structure 330 and the shield can 320 are pressed together, causing the second adhesive member 334 to come into contact with the heat conductive member 340, thereby allowing it to be attached to the heat conductive member 340.

[0151] In the embodiment described above, the shielding structure 330 enhances the shielding performance of the shielding structure 330 for electromagnetic waves emitted from the electronic component 301 through the opening 325, and enhances the structural stability of the structure on the shielding structure 330 (for example, the metal plate 350 and / or the display 201 in Figure 2a), because the density d1 of the first shielding member 331 attached to the shielding can 320 is lower than the density d2 of the second shielding member 332 attached on the first shielding member 331.

[0152] Figure 8a shows an example of the unfolded state of an electronic device according to one embodiment. Figure 8b shows an example of the folded state of an electronic device according to one embodiment. Figure 8c is an exploded view of an electronic device according to one embodiment.

[0153] Referring to Figures 8a, 8b, and 8c, the electronic device 101 may include a housing 210 including a first housing 810 and a second housing 820, a display 201, at least one camera 840 (e.g., camera module 180 in Figure 1), a hinge structure 850, and / or at least one electronic component 860 (e.g., electronic component 301 in Figure 3a).

[0154] The first housing 810 and the second housing 820 can form at least a portion of the outer surface of the electronic device 101 that can be gripped by a user. At least a portion of the outer surface of the electronic device 101 defined by the first housing 810 and the second housing 820 can come into contact with a part of the user's body when the electronic device 101 is used by a user. According to one embodiment, the first housing 810 may include a first front surface 811, a first rear surface 812 facing the first front surface 811 and spaced apart from the first front surface 811, and a first side surface 813 surrounding at least a portion of the first front surface 811 and the first rear surface 812. The first side surface 813 can connect the periphery of the first front surface 811 and the periphery of the first rear surface 812. The first front 811, the first rear 812, and the first side 813 can define the internal space of the first housing 810. According to one embodiment, the first housing 810 can provide the space formed by the first front 811, the first rear 812, and the first side 813 as a space for arranging the components of the electronic device 101.

[0155] According to one embodiment, the second housing 820 may include a second front surface 821, a second rear surface 822 facing the second front surface 821 and spaced apart from it, and a second side surface 823 surrounding at least a portion of the second front surface 821 and the second rear surface 822. The second side surface 823 can connect the periphery of the second front surface 821 to the periphery of the second rear surface 822. The second front surface 821, the second rear surface 822, and the second side surface 823 can define the internal space of the second housing 820. According to one embodiment, the second housing 820 can provide the space formed by the second front surface 821, the second rear surface 822, and the second side surface 823 surrounding at least a portion of the second front surface 821 and the second rear surface 822 as a space for mounting components of the electronic device 101. According to one embodiment, the second housing 820 may be rotatably coupled to the first housing 810.

[0156] According to one embodiment, each of the first housing 810 and the second housing 820 may include a first protective member 814 and a second protective member 824, respectively. The first protective member 814 and the second protective member 824 may be positioned on the first front 811 and the second front 821 along the periphery of the display 201. According to one embodiment, the first protective member 814 and the second protective member 824 can prevent foreign matter (e.g., dust or moisture) from entering through the gap between the display 201 and the first housing 810 and the second housing 820. For example, the first protective member 814 may surround the periphery of the first display area 831 of the display 201, and the second protective member 824 may surround the periphery of the second display area 832 of the display 201. The first protective member 814 may be attached to the first side surface 813 of the first housing 810, or it may be formed integrally with the first side surface 813. The second protective member 824 may be attached to the second side surface 823 of the second housing 820, or it may be formed integrally with the second side surface 823.

[0157] According to one embodiment, the first side 813 and the second side 823 may include a conductive material, a non-conductive material, or a combination thereof. For example, the second side 823 may include at least one conductive portion 825 and at least one non-conductive portion 826. The at least one conductive portion 825 may include a plurality of conductive portions spaced apart from each other. The at least one non-conductive portion 826 may be positioned between the plurality of conductive portions. The plurality of conductive portions may be separated from each other by the at least one non-conductive portion 826 positioned between the plurality of conductive portions. According to one embodiment, the plurality of conductive portions and the plurality of non-conductive portions may together form an antenna radiator. The electronic device 101 may be able to communicate with an external electronic device via the antenna radiator formed by the plurality of conductive portions and the plurality of non-conductive portions.

[0158] The display 201 may be configured to display visual information. According to one embodiment, the display 201 may be positioned across the hinge structure 850 on the first front 811 of the first housing 810 and the second front 821 of the second housing 820. For example, the display 201 may include a first display area 831 positioned on the first front 811 of the first housing, a second display area 832 positioned on the second front 821 of the second housing, and a third display area 833 positioned between the first and second display areas 831 and 832. The first, second, and third display areas 831 and 833 may form the front of the display 201. According to one embodiment, the display 201 may further include a sub-display panel 835 positioned on the second rear 822 of the second housing 820. For example, the display 201 may be referred to as a flexible display. According to one embodiment, the display 201 may include a window exposed to the outside of the electronic device 101. The window protects the surface of the display 201 and includes a substantially transparent material that can transmit the visual information provided by the display 201 to the outside of the electronic device 101. For example, the window may include, but is not limited to, glass (e.g., UTG, ultra-thin glass) and / or polymer (e.g., PI, polyimide). According to one embodiment, the display 201 may be placed on a metal plate (e.g., metal plate 350 in Figure 3a).

[0159] According to one embodiment, the second display area 832 may be separated from the first display area 831. The third display area 833 may connect the first display area 831 and the second display area 832 and be foldable with respect to a folding axis f. The first housing 810 can support the first display area 831. The second housing 820 can support the second display area 832.

[0160] At least one camera 840 may be configured to acquire an image based on receiving light from an object outside the electronic device 101. According to one embodiment, at least one camera 840 may include a third camera 841, a fourth camera 842, and / or a fifth camera 843. The third camera 841 may be located in the first housing 810. For example, the third camera 841 may be located inside the first housing 810 and at least a portion of it may be visible through the first rear surface 812 of the first housing 810. The third camera 841 may be supported by a bracket (not shown) within the first housing 810. The first housing 810 may include at least one aperture 841a that overlaps the third camera 841 when the first rear surface 812 is viewed from above. The third camera 841 can acquire an image based on receiving light from outside the electronic device 101 through at least one aperture 841a.

[0161] According to one embodiment, a fourth camera 842 may be located in the second housing 820. For example, the fourth camera 842 may be located inside the second housing 820 and visible via a sub-display panel 835. The second housing 820 may include at least one aperture 842a that overlaps the fourth camera 842 when viewed from above on the second rear surface 822. The fourth camera 842 can acquire an image based on receiving light from outside the electronic device 101 through at least one aperture 842a.

[0162] In one embodiment, a fifth camera 843 may be located in the first housing 810. For example, the fifth camera 843 may be located inside the first housing 810 and at least a portion of it may be visible through the first front surface 811 of the first housing 810. In another example, the fifth camera 843 may be located inside the first housing 810 and at least a portion of it may be visible through a first display area 831 of the display 201. The first display area 831 of the display 201 may include at least one aperture (not shown) that overlaps the fifth camera 843 when the display 201 is viewed from above. The fifth camera 843 may acquire an image based on receiving light from outside the display 201 through at least one aperture.

[0163] According to one embodiment, the fourth camera 842 and the fifth camera 843 may be positioned below the display 201 (for example, in a direction toward the inside of the first housing 810 or the inside of the second housing 820). For example, the fourth camera 842 and the fifth camera 843 may be under-display cameras (UDCs). If the fourth camera 842 and the fifth camera 843 are under-display cameras, a region of the display 201 corresponding to the respective positions of the fourth camera 842 and the fifth camera 843 may not be an inactive region. For example, if the fourth camera 842 and the fifth camera 843 are under-display cameras, a region of the display 201 corresponding to the respective positions of the fourth camera 842 and the fifth camera 843 may have a lower pixel density than the pixel density of other regions of the display 201. An inactive region of the display 201 may mean a region of the display 201 that does not contain pixels or emit light to the outside of the electronic device 101. In another example, the fourth camera 842 and the fifth camera 843 may be punch-hole cameras. If the fourth camera 842 and the fifth camera 843 are punch-hole cameras, then a region of the display 201 corresponding to the respective positions of the fourth camera 842 and the fifth camera 843 may be an inactive region. For example, if the fourth camera 842 and the fifth camera 843 are punch-hole cameras, then a region of the display 201 corresponding to the respective positions of the fourth camera 842 and the fifth camera 843 may include an aperture that does not contain pixels.

[0164] According to one embodiment, a hinge structure 850 can rotatably connect a first housing 810 and a second housing 820. The hinge structure 850 may be positioned between the first housing 810 and the second housing 820 of the electronic device 101 so that the electronic device 101 can be bent, flexed, or folded. For example, the hinge structure 850 may be positioned between a portion of a first side surface 813 and a portion of a second side surface 823 that are facing each other. The hinge structure 850 may be able to change the direction in which the electronic device 101 faces the first front surface 811 of the first housing 810 and the second front surface 821 of the second housing 820, so that they are substantially the same unfolding state or a folding state in which the first front surface 811 and the second front surface 821 face each other. When the electronic device 101 is in a folded state, the first housing 810 and the second housing 820 can be superimposed or overlapped by facing each other.

[0165] According to one embodiment, the hinge structure 850 may be configured to deform the third display area 833 of the display 201 by rotatably connecting the first housing 810 and the second housing 820.

[0166] According to one embodiment, when the electronic device 101 is in a folded state, the direction in which the first front surface 811 faces and the direction in which the second front surface 821 faces may be different from each other. For example, when the electronic device 101 is in a folded state, the direction in which the first front surface 811 faces and the direction in which the second front surface 821 faces may be opposite to each other. In another example, when the electronic device 101 is in a folded state, the direction in which the first front surface 811 faces and the direction in which the second front surface 821 faces may be inclined relative to each other. If the direction in which the first front surface 811 faces is inclined relative to the direction in which the second front surface 821 faces, the first housing 810 may be inclined relative to the second housing 820. However, it is not limited thereto. For example, in the folded state of the electronic device 101, the first rear surface 812 of the first housing 810 may face the second rear surface 822 of the second housing 820. When the first rear panel 812 and the second rear panel 822 face each other in the folded state of the electronic device 101, the direction in which the first front panel 811 faces and the direction in which the second front panel 821 faces may be opposite to each other. When the first rear panel 812 and the second rear panel 822 face each other in the folded state of the electronic device 101, the display 201 may be directly exposed to the outside in the folded state of the electronic device 101.

[0167] According to one embodiment, the electronic device 101 may be foldable with respect to a folding axis f. The folding axis f may mean, but is not limited to, a hypothetical line extending through the hinge cover 851 in a direction substantially parallel to the longitudinal direction of the electronic device 101. For example, the folding axis f may be a hypothetical line extending in a direction substantially perpendicular to the longitudinal direction of the electronic device 101. If the folding axis f extends in a direction substantially perpendicular to the longitudinal direction of the electronic device 101, the hinge structure 850 may extend in a direction parallel to the folding axis f to connect the first housing 810 and the second housing 820. The first housing 810 and the second housing 820 may be rotatable by the hinge structure 850 extending in a direction substantially perpendicular to the longitudinal direction of the electronic device 101.

[0168] According to one embodiment, the hinge structure 850 may include a hinge cover 851, a first hinge plate 852, a second hinge plate 853, and a hinge module 854. The hinge cover 851 may surround the internal components of the hinge structure 850 and form the outer surface of the hinge structure 850. According to one embodiment, when the electronic device 101 is in a folded state, at least a portion of the hinge cover 851 surrounding the hinge structure 850 may be exposed to the outside of the electronic device 101 through the gap between the first housing 810 and the second housing 820. According to another embodiment, when the electronic device 101 is in an unfolded state, the hinge cover 851 may be covered by the first housing 810 and the second housing 820 and not exposed to the outside of the electronic device 101.

[0169] According to one embodiment, the first hinge plate 852 and the second hinge plate 853 can be coupled to the first housing 810 and the second housing 820, respectively, thereby rotatably connecting the first housing 810 and the second housing 820. For example, the first hinge plate 852 may be coupled to the first front bracket 815 of the first housing 810, and the second hinge plate 853 may be coupled to the second front bracket 827 of the second housing 820. As the first hinge plate 852 and the second hinge plate 853 are coupled to the first front bracket 815 and the second front bracket 827, respectively, the first housing 810 and the second housing 820 may be rotatable by the rotation of the first hinge plate 852 and the second hinge plate 853.

[0170] The hinge module 854 can rotate the first hinge plate 852 and the second hinge plate 853. For example, the hinge module 854 includes gears that mesh with each other and are rotatable, allowing the first hinge plate 852 and the second hinge plate 853 to rotate with respect to the folding axis f. According to one embodiment, there may be multiple hinge modules 854. For example, multiple hinge modules 854 may be positioned spaced apart from each other at both ends of the first hinge plate 852 and the second hinge plate 853.

[0171] According to one embodiment, the first housing 810 includes a first front bracket 815 and a first rear bracket 816, and the second housing 820 includes a second front bracket 827 and a second rear bracket 828. The first front bracket 815 and the first rear bracket 816 can support components of the electronic device 101. The first front bracket 815 can define the first housing 810 by being coupled with the first rear bracket 816. The first rear bracket 816 can define a portion of the outer surface of the first housing 810. The second front bracket 827 and the second rear bracket 828 can support components of the electronic device 101. The second front bracket 827 can define the second housing 820 by being coupled with the second rear bracket 828. The second rear bracket 828 can define a portion of the outer surface of the second housing 820. For example, the display 201 may be positioned on one side of the first front bracket 815 and on one side of the second front bracket 827. The first rear bracket 816 may be positioned on the other side of the first front bracket 815 opposite to the side of the first front bracket 815. The second rear bracket 828 may be positioned on the other side of the second front bracket 827 opposite to the side of the second front bracket 827. The sub-display panel 835 may be positioned between the second front bracket 827 and the second rear bracket 828.

[0172] In one embodiment, a portion of the first front bracket 815 may be surrounded by the first side surface 813, and a portion of the second front bracket 827 may be surrounded by the second side surface 823. For example, the first front bracket 815 may be formed integrally with the first side surface 813, and the second front bracket 827 may be formed integrally with the second side surface 823. In another example, the first front bracket 815 may be formed separately from the first side surface 813, and the second front bracket 827 may be formed separately from the second side surface 823.

[0173] At least one electronic component 860 can implement various functions to be provided to the user. According to one embodiment, at least one electronic component 860 may include a first printed circuit board 861 (e.g., the first printed circuit board 250 in Figure 2b), a second printed circuit board 862 (e.g., the second printed circuit board 252 in Figure 2b), a flexible printed circuit board 863, a battery 864 (e.g., the battery 189 in Figure 1), and / or an antenna 865 (e.g., the antenna module 197 in Figure 1). The first printed circuit board 861 and the second printed circuit board 862 can each form electrical connections for components within the electronic device 101. For example, the first printed circuit board 861 may contain components for realizing the overall function of the electronic device 101 (e.g., the processor 120 in Figure 1), and the second printed circuit board 862 may contain electronic components for realizing some of the functions of the first printed circuit board 861. As another example, the second printed circuit board 862 may contain components for operating the sub-display panel 835 located on the second rear panel 822.

[0174] According to one embodiment, the first printed circuit board 861 may be located within the first housing 810. For example, the first printed circuit board 861 may be located on one surface of the first front bracket 815. According to one embodiment, the second printed circuit board 862 may be located within the second housing 820. For example, the second printed circuit board 862 may be located separately from the first printed circuit board 861 and on one surface of the second front bracket 827. A flexible printed circuit board 863 can connect the first printed circuit board 861 and the second printed circuit board 862. For example, the flexible printed circuit board 863 may extend from the first printed circuit board 861 to the second printed circuit board 862.

[0175] The battery 864 is a device for supplying power to at least one component of the electronic device 101 and may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell. At least a portion of the battery 864 may be arranged substantially coplanar with the first printed circuit board 861 or the second printed circuit board 862.

[0176] Antenna 865 may be configured to receive power or signals from outside the electronic device 101. According to one embodiment, antenna 865 may be positioned between the first rear bracket 816 and the battery 864. Antenna 865 may include, for example, an NFC (near-field communication) antenna, an antenna module, and / or an MST (magnetic secure transmission) antenna. Antenna 865 may, for example, communicate with an external device over short distances or wirelessly transmit and receive power necessary for charging.

[0177] The following is a list of embodiments and examples. This disclosure may include any combination of the following embodiments, examples, and features, unless such combination would cause a conflict.

[0178] The electronic device according to the above-described embodiment (electronic device 101 in Figure 1) may include a printed circuit board (for example, the first printed circuit board 250 in Figure 2b, the second printed circuit board 252, and the printed circuit board 310 in Figure 3a), electronic components coupled on the printed circuit board (for example, the processor 120 in Figure 1 and the electronic component 301 in Figure 3a), and a shield can on the printed circuit board that surrounds the electronic component and includes an opening (for example, the opening 325 in Figure 3a) facing the electronic component (for example, the shield can 320 in Figure 3a). The electronic device may also include a shielding structure on the shield can that covers the opening (for example, the shielding structure 330 in Figure 3a), and a heat conductive member (for example, the heat conductive member 340 in Figure 3a) mounted on the electronic component and in contact with the shielding structure through the opening between the electronic component and the shielding structure. The electronic device may include a metal plate on the shielding structure (for example, the metal plate 350 in Figure 3a), and at least one heat dissipation member (for example, the at least one heat dissipation member 360 in Figure 3a) attached to the metal plate and configured to transfer at least a portion of the heat emitted from the electronic components via the heat conductive member. The shielding structure may include a first shielding member mounted on the shield can (for example, the first shielding member 331 in Figure 3a), a first adhesive member interposed between the first shielding member and the shield can for attaching the first shielding member to the shield can (for example, the first adhesive member 333 in Figure 3c), a second shielding member mounted on the first shielding member (for example, the second shielding member 332 in Figure 3a), and a second adhesive member interposed between the first shielding member and the second shielding member for attaching the second shielding member to the first shielding member (for example, the second adhesive member 334 in Figure 3a). The density of the first shielding member (for example, d1 in Figure 3c) may be less than the density of the second shielding member (for example, d2 in Figure 3c). According to the embodiments described above, the electronic device, by including the shielding can, can reduce the degradation of the performance of other electronic components around the electronic component due to electromagnetic waves emitted from the electronic component.The electronic device, by including the heat conductive member, can reduce the performance degradation of the electronic component due to heat emitted from the electronic component. The electronic device, by including a shielding structure covering the opening, can shield electromagnetic waves emitted from the electronic component through the opening. The shielding structure can improve the shielding performance of the shielding structure for electromagnetic waves emitted from the electronic component through the opening by having a density of the first shielding member less than the density of the second shielding member. The electronic device, by including the metal plate and the at least one heat dissipation member, can reduce the performance degradation of the electronic device due to heat emitted from the electronic component. The embodiments described above can have a variety of effects, including the effects described above.

[0179] According to one embodiment, the shielding structure may include a groove (for example, groove 330a in Figure 3a) recessed from the opening toward the metal plate to accommodate the heat conductive member that penetrates at least a portion of the opening. According to the embodiment described above, the shielding structure can provide space for the heat conductive member by including the groove. The embodiment described above may have a variety of effects, including the effects described above.

[0180] According to one embodiment, the first shielding member can surround at least a portion of the heat conducting member that has passed through the opening. The second shielding member can be attached to the heat conducting member via the second adhesive member. According to the embodiment, the shielding structure, by being attached to the heat conducting member, can transfer at least a portion of the heat emitted from the electronic component through the heat conducting member. The embodiments described above can have a variety of effects, including those described above.

[0181] According to one embodiment, the metal plate may include a heat dissipation portion (e.g., heat dissipation portion 350a in Figure 4a) positioned on the electronic component. The at least one heat dissipation member may include a first heat dissipation member (e.g., first heat dissipation member 361 in Figure 4b) that covers at least a portion of a second surface of the metal plate (e.g., second surface 352 in Figure 3a) opposite to a first surface of the metal plate facing the shield can (e.g., first surface 351 in Figure 3a). The electronic device may further include an insulating member (e.g., insulating member 370 in Figure 3a) attached to the heat dissipation portion and at least a portion of which is surrounded by the first heat dissipation member. According to the embodiments described above, the electronic device can reduce the degradation of the performance of the electronic device due to heat emitted from the electronic component by including the insulating member and the first heat dissipation member. The embodiments described above may have a variety of effects, including those described above.

[0182] According to one embodiment, the at least one heat dissipation member may further include a second heat dissipation member (for example, the second heat dissipation member 362 in Figure 4d) disposed on and covering the first heat dissipation member and the heat insulating member. According to the embodiment described above, the electronic device can reduce the degradation of the performance of the electronic device due to heat emitted from the electronic components by including the second heat dissipation member. The embodiment described above may have a variety of effects, including the effects described above.

[0183] According to one embodiment, the first shielding member 331 may include a first region (e.g., the first region 331c in Figure 3c) containing adhesive material from the first adhesive member, and a second region (e.g., the second region 331d in Figure 3c) containing adhesive material from the second adhesive member. At least a portion (e.g., points p1, p2, p3) of one surface of the first shielding member facing the second shielding member (e.g., the fourth surface 331b in Figure 3c) can be in contact with the second shielding member. According to the embodiments described above, the first shielding member can improve the shielding performance of the shielding structure for electromagnetic waves emitted from the electronic component through the opening by being in contact with the second shielding member in at least a portion of it. The embodiments described above may have a variety of effects, including the effects described above.

[0184] According to one embodiment, the thickness of the first shielding member (e.g., t1 in Figure 3c) can be in the range of 70 μm to 80 μm. The thickness of the second shielding member (e.g., t2 in Figure 3c) can be in the range of 10 μm to 20 μm. According to the embodiments described above, the shielding structure can improve the shielding performance of the shielding structure for electromagnetic waves emitted from the electronic component through the opening. The embodiments described above can have various effects, including the effects described above.

[0185] According to one embodiment, the heat conduction member may include at least one of rubber, paraffin wax, and oil. According to the embodiment described above, the heat conduction member can provide structural stability to the structure on the heat conduction member by reducing the repulsive force against the structure on the heat conduction member that pressurizes the heat conduction member. The embodiment described above may have a variety of effects, including the effects described above.

[0186] According to one embodiment, the metal plate may include a recess (e.g., recess 355 in Figure 4a) extending toward the heat conduction member from a second surface of the metal plate opposite to the first surface of the metal plate facing the shield can. The at least one heat dissipation member may be placed in the recess so that it can be superimposed on the electronic component when the metal plate is viewed from above. According to the embodiment described above, the metal plate can reduce the degradation of the performance of the electronic device due to heat emitted from the electronic component by including the recess that accommodates the at least one heat dissipation member. The embodiment described above may have a variety of effects, including the effects described above.

[0187] According to one embodiment, the at least one heat dissipation member may include a third heat dissipation member (e.g., the third heat dissipation member 363 in Figure 5a) attached to the shielding structure, covering at least a portion of the first surface of the metal plate facing the shield can. According to the embodiment described above, the electronic device can reduce the degradation of the performance of the electronic device due to heat emitted from the electronic components by including the third heat dissipation member. The embodiment described above may have a variety of effects, including the effects described above.

[0188] An electronic device according to one embodiment may further include an insulating member that is at least partially surrounded by the third heat dissipation member. The metal plate may be disposed on the electronic component and may include a heat dissipation portion to which the insulating member is attached. The at least one heat dissipation member may further include a fourth heat dissipation member (e.g., the fourth heat dissipation member 364 in Figure 5b) disposed on the third heat dissipation member and the insulating member and covering the insulating member. According to the embodiments described above, the electronic device can reduce the degradation of the performance of the electronic device due to heat emitted from the electronic component by including the fourth heat dissipation member and the insulating member. The embodiments described above may have a variety of effects, including the effects described above.

[0189] According to one embodiment, the at least one heat dissipation member may include at least one of a vapor chamber, a heat pipe, graphite, and graphene. According to the embodiment described above, the at least one heat dissipation member can reduce the degradation of the performance of the electronic device due to the heat emitted from the electronic component. The embodiment described above may have a variety of effects, including the effects described above.

[0190] According to one embodiment, the thickness of the first adhesive member (e.g., t3 in Figure 3c) and the thickness of the second adhesive member (e.g., t4, t5 in Figure 3c) can each be located within a range of 1 μm to 15 μm. According to the embodiment described above, the shielding structure can improve the shielding performance of the shielding structure for electromagnetic waves emitted from the electronic component through the opening. The embodiment described above can have various effects, including the effects described above.

[0191] According to one embodiment, the shielding structure may further include a protective member (for example, the protective member 335 in Figure 3c) disposed on the second shielding member. According to the embodiment described above, by including the protective member, the shielding structure can reduce the degradation of its performance due to external impacts. The embodiment described above may have various effects, including those described above.

[0192] An electronic device according to one embodiment may include a display on a metal plate (e.g., display 201 in Figure 2a) which includes a first display area (e.g., first display area 831 in Figure 8a), a second display area separated from the first display area (e.g., second display area 832 in Figure 8a), and a third display area (e.g., third display area 833 in Figure 8a) connecting the first and second display areas and foldable with respect to a folding axis. The electronic device may further include a first housing supporting the first display area (e.g., first housing 810 in Figure 8a), a second housing supporting the second display area (e.g., second housing 820 in Figure 8a), and a hinge structure (e.g., hinge structure 850 in Figure 8b) configured to deform the third display area by rotatably coupling the first and second housings. According to the embodiments described above, the electronic device can provide a variety of user experiences to the user by including the hinge structure that rotatably connects the first housing and the second housing. The embodiments described above can have a variety of effects, including the effects described above.

[0193] An electronic device according to one embodiment may include a printed circuit board, electronic components coupled on the printed circuit board, and a shield can on the printed circuit board that surrounds the electronic components and includes an opening facing the electronic components. The electronic device may include a shielding structure on the shield can that covers the opening, and a heat conductive member mounted on the electronic components and in contact with the shielding structure through the opening between the electronic components and the shielding structure. The electronic device may include a metal plate on the shielding structure and at least one heat dissipation member mounted on the metal plate and configured to transfer at least a portion of the heat emitted from the electronic components via the heat conductive member. The shielding structure may include a first shielding member mounted on the shielding can, a first adhesive member interposed between the first shielding member and the shielding can for attaching the first shielding member to the shielding can, a second shielding member mounted on the first shielding member, a second adhesive member interposed between the first shielding member and the second shielding member for attaching the second shielding member to the first shielding member, a protective member disposed on the second shielding member, and a groove recessed from the opening toward the metal plate for accommodating the heat conductive member that penetrates the opening. The density of the first shielding member may be less than the density of the second shielding member. According to the embodiments described above, the electronic device, by including the shielding can, can reduce the degradation of the performance of other electronic components around the electronic component due to electromagnetic waves emitted from the electronic component. The electronic device, by including the heat conductive member, can reduce the degradation of the performance of the electronic component due to heat emitted from the electronic component. The electronic device can shield electromagnetic waves emitted from the electronic component through the opening by including a shielding structure that covers the opening. The shielding structure can improve the shielding performance of the shielding structure for electromagnetic waves emitted from the electronic component through the opening by having a density of the first shielding member that is lower than the density of the second shielding member.The electronic device, by including the metal plate and the at least one heat dissipation member, can reduce the performance degradation of the electronic device due to heat emitted from the electronic components. The embodiments described above can have various effects, including those described above.

[0194] According to one embodiment, the first shielding member may include a first region containing an adhesive material by the first adhesive member and a second region containing an adhesive material by the second adhesive member. At least a portion of one surface of the first shielding member facing the second shielding member may be in contact with the second shielding member. According to the embodiment described above, the first shielding member can improve the shielding performance of the shielding structure for electromagnetic waves emitted from the electronic component through the opening by at least a portion of it being in contact with the second shielding member. The embodiment described above may have a variety of effects, including the effects described above.

[0195] According to one embodiment, the heat conduction member may comprise at least one of rubber, paraffin wax, and oil. According to the embodiment described above, the heat conduction member can provide structural stability to the structure on the heat conduction member by reducing the repulsive force against the structure on the heat conduction member that pressurizes the heat conduction member. The embodiment described above may have a variety of effects, including those described above.

[0196] According to one embodiment, the metal plate may include a heat dissipation portion disposed on the electronic component. The at least one heat dissipation member may include a first heat dissipation member covering at least a portion of a second surface of the metal plate opposite to the first surface of the metal plate facing the shield can. The electronic device may further include an insulating member attached to the heat dissipation portion and at least a portion of which is surrounded by the first heat dissipation member. According to the embodiments described above, the electronic device can reduce the degradation of the performance of the electronic device due to heat emitted from the electronic component by including the insulating member and the first heat dissipation member. The embodiments described above may have a variety of effects, including the effects described above.

[0197] According to one embodiment, the at least one heat dissipation member may further include the first heat dissipation member and a second heat dissipation member disposed on and covering the heat insulating member. According to the embodiment described above, the electronic device can reduce the degradation of the performance of the electronic device due to heat emitted from the electronic components by including the second heat dissipation member. The embodiment described above may have a variety of effects, including the effects described above.

[0198] In the first example, an electronic device is provided that includes: a printed circuit board; electronic components disposed on the upper surface of the printed circuit board; a shield can disposed on the printed circuit board and configured to surround the electronic components, the shield can including an opening facing the electronic components; a shielding structure disposed on the shield can and configured to cover the opening; a heat conductive member disposed between the electronic components and the shielding structure, the heat conductive member being attached to the electronic components and configured to contact the shielding structure through the opening; and a heat dissipation structure disposed on the shielding structure, the heat dissipation structure including a metal plate and at least one heat dissipation member attached to the metal plate, the at least one heat The thermal member is configured to transfer at least a portion of the heat emitted from the electronic component via the thermal conductive member; and the shielding structure includes: a first shielding member mounted on the shield can; a first adhesive member interposed between the first shielding member and the shield can for attaching the first shielding member to the shield can; a second shielding member mounted on the first shielding member; and a second adhesive member interposed between the first shielding member and the second shielding member for attaching the second shielding member to the first shielding member; wherein the density of the first shielding member is less than the density of the second shielding member.

[0199] In a second example, the electronic device of the first example is provided, wherein the shielding structure further includes a groove recessed from the opening toward the metal plate for accommodating the heat conductive member that penetrates at least a portion of the opening.

[0200] In a third example, the electronic device of the first or second example is provided, wherein the first shielding member surrounds at least a portion of the heat conducting member passing through the opening, and the second shielding member is attached to the heat conducting member by a second adhesive member.

[0201] In a fourth example, the electronic device according to any of the first to third examples is provided, wherein the metal plate includes a heat dissipation portion that overlaps with at least a portion of the electronic components in a first direction perpendicular to the upper surface of the printed circuit board, the at least one heat dissipation member includes a first heat dissipation member that covers at least a portion of a second surface of the metal plate opposite to a first surface of the metal plate facing the shield can, and the electronic device further includes a heat insulating member that at least partially overlaps with the heat dissipation portion in the first direction.

[0202] In the fifth example, the heat insulating member is at least partially surrounded by the first heat dissipation member, and the at least one heat dissipation member further comprises the first heat dissipation member and a second heat dissipation member disposed on the heat insulating member and covering the heat insulating member, thereby providing the electronic device according to any of the first to fourth examples.

[0203] In the sixth example, the electronic device described in any of the first to fifth examples is provided, wherein the first shielding member includes a first region containing adhesive material from the first adhesive member; and a second region containing adhesive material from the second adhesive member, and at least a portion of one surface of the first shielding member facing the second shielding member is in contact with the second shielding member.

[0204] In the seventh example, the electronic device described in any of the first to sixth examples is provided, wherein the thickness of the first shielding member is in the range of 70 μm or more and 80 μm or less, and the thickness of the second shielding member is in the range of 10 μm or more and 20 μm or less.

[0205] In the eighth example, the electronic device according to any of the first to seventh examples is provided, wherein the heat conductive member comprises at least one of rubber, paraffin wax, and oil.

[0206] In the ninth example, the metal plate includes a recess or a through-hole, the recess or the through-hole is configured to at least partially overlap the electronic component in a first direction perpendicular to the upper surface of the printed circuit board, the at least one heat dissipation member is positioned in the recess or the through-hole, the recess is formed on a first surface of the metal plate facing the shield can, or the recess is formed on a second surface of the metal plate opposite to the first surface, or the through-hole extends from the first surface of the metal plate to the second surface of the metal plate, the electronic device described in any of the first to eighth examples is provided.

[0207] In the tenth example, the electronic device according to any of the first to ninth examples is provided, wherein the at least one heat dissipation member further comprises a third heat dissipation member that covers at least a portion of the first surface of the metal plate facing the shield can.

[0208] The electronic device described in any of the first to tenth examples is provided, further comprising an insulating member at least partially surrounded by the third heat dissipation member, wherein the metal plate includes a heat dissipation portion to which the insulating member is attached, at least partially superimposed with the electronic components in a first direction perpendicular to the upper surface of the printed circuit board, and the at least one heat dissipation member further comprises a fourth heat dissipation member disposed on the third heat dissipation member.

[0209] In the twelfth example, the electronic device described in any of the first to eleventh examples is provided, wherein the at least one heat dissipation member includes at least one of a vapor chamber, a heat pipe, graphite, and graphene.

[0210] In the 13th example, the electronic device described in any of the first to 12 examples is provided, wherein the thickness of the first adhesive member and the thickness of the second adhesive member are each in the range of 1 μm or more and 15 μm or less.

[0211] In the 14th example, the shielding structure further includes a protective member disposed on the second shielding member, thereby providing the electronic device according to any of the first to 13 examples.

[0212] In the 15th example, the electronic device described in any of the first to 14th examples is provided, further comprising: a display disposed on the metal plate, the display including a first display area, a second display area separated from the first display area, and a third display area connecting the first and second display areas and foldable about a folding axis; a first housing supporting the first display area; a second housing supporting the second display area; and a hinge structure configured to rotatably connect the first and second housings to deform the third display area.

[0213] The electronic devices according to the various embodiments disclosed herein may be of various forms. These electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, electronic devices, or consumer electronics. The electronic devices according to the embodiments of this disclosure are not limited to the aforementioned devices.

[0214] The various embodiments and the terminology used herein should be understood as not intended to limit the technical features described herein to any particular embodiment, but rather to include various modifications, equivalents, or substitutions of those embodiments. In the description of the drawings, similar or related components may be given the same reference number. The singular form of a noun corresponding to an item may include one or more of the items unless otherwise clearly indicated in the context. In this specification, each of the phrases such as “A or B,” “A and B at least one,” “A or B at least one,” “A, B or C,” “A, B and C at least one,” and “A, B, or C at least one” may include any of the items listed together in the corresponding phrase, or any possible combination thereof. Terms such as “first,” “second,” or “first,” or “second” may be used simply to distinguish a component from other corresponding components and not to limit the component to other aspects (e.g., importance or order). When a component (for example, a first component) is referred to as "coupled" or "connected" to another component (for example, a second component), either in combination with or without such terms, it means that the first component may be connected to the other component directly (for example, by wire), wirelessly, or via a third component.

[0215] As used in various embodiments of this specification, the term “module” may include units implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit. A module may be a component configured as a whole, or the smallest unit or part thereof of such component that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an ASIC (application-specific integrated circuit).

[0216] Various embodiments of this specification can be implemented as software (e.g., program 140) containing one or more instructions stored in a storage medium (e.g., internal memory 136 or external memory 138) readable by a machine (e.g., electronic device 101). For example, the processor (e.g., processor 120) of the machine (e.g., electronic device 101) can call and execute at least one of the one or more instructions stored in the storage medium. This allows the machine to operate to perform at least one function in accordance with the at least one called instruction. The one or more instructions may include code generated by a compiler or code that can be executed by an interpreter. The storage medium readable by the machine may be provided in the form of a non-transitory storage medium. Here, “non-transitory” simply means that the storage medium is a tangible device and does not contain signals (e.g., electromagnetic waves), and this term does not distinguish between cases where data is stored semi-permanently and cases where it is stored temporarily.

[0217] According to one embodiment, the methods according to the various embodiments disclosed herein may be provided in a computer program product. The computer program product can be traded as a commodity between a seller and a buyer. The computer program product may be distributed in the form of a device-readable storage medium (e.g., a CD-ROM (compact disc read-only memory)) or through an application store (e.g., Play Store). TMThe computer program product may be distributed online (e.g., downloaded or uploaded) via a network or directly between two user devices (e.g., smartphones). In the case of online distribution, at least a portion of the computer program product may be temporarily stored or temporarily generated on a storage medium readable by equipment such as the memory of the manufacturer's server, the application store's server, or an intermediary server.

[0218] According to various embodiments, each component of the aforementioned components (e.g., a module or program) may include one or more individuals, and some of the individuals may be separated and arranged in different components. According to various embodiments, one or more of the aforementioned components or operations may be omitted, or one or more other components or operations may be added. Alternatively or additionally, multiple components (e.g., a module or program) may be integrated into a single component. In this case, the integrated component may perform one or more functions of each of the multiple components in the same or similar manner as they were performed by the respective components before integration. According to various embodiments, operations performed by a module, program, or other component may be performed sequentially, in parallel, repeatedly, or empirically, or one or more of the operations may be performed in a different order or omitted, or one or more other operations may be added. [Explanation of Symbols]

[0219] 100 Network Environment 101 Electronic equipment 102, 104 Electronic equipment 108 servers 120 processors 121 Main Processor 123 Auxiliary processors 130 memory 132 Volatile memory 134 Non-volatile memory 136 internal memory 138 External memory 140 programs 142 Operating Systems 144 Middleware 146 applications 150 Input Modules 155 Audio Output Module 160 display modules 170 Audio Modules 176 Sensor Modules 177 Interface 178 Connection terminals 179 Tactile Module 180 Camera Module 188 Power Management Modules 189 batteries 190 Communication Module 192 Wireless Communication Module 194 Wired communication module 196 Subscriber Identification Module 197 Antenna Module 198 The First Network 199 The Second Network 200A front 200B back 200C side 201 Display 201A Screen display area 201B Sensing area 202 Front Plate 203, 204, 207 Audio Modules 205, 212 Camera Modules 208 connector holes 210 Housing 211 Back plate 213 Flash 217 Key Input Device 218 Side bezel structure (or side component) 237 Camera area 240 frame structure 243 Support structure 250 First Printed Circuit Board 252 Second Printed Circuit Board 260 Cover Plate 270 batteries 284 Camera area 301 Electronic Components 302 Electronic Components 310 Printed Circuit Board 320 Shield Can 325 Aperture 330 Shielding structure 330a groove 331 First shielding member 331a 3rd page 331b 4th page 331c First area 331d Second area 332 Second shielding member 333 First adhesive member 334 Second adhesive member 335 Protective component 340 Heat Conducting Material 350 Metal Plates 350a heat dissipation part 351 Metal Plate 352 Second surface 355 recess 356 Through hole 360 Heat conduction members, heat dissipation members 360a Step structure 361 First heat dissipation member 362 Second heat dissipation component 363 Third heat dissipation component 364 Fourth heat dissipation component 370 Insulation material 371 First insulating member 372 Second insulation member 410 Heat conductive material 430 Shielding structure 810 First Housing 811 First front 812 First rear view 813 First Aspect 814 First protective member 815 First front bracket 816 First rear bracket 820 Second Housing 821 Second front 822 Second rear view 823 Second Aspect 824 Second protective member 825 Conductive part 826 Non-conductive parts 827 Second front bracket 828 Second rear bracket 831 First display area 832 Second display area 833 Third display area 835 Sub-display panel 840 Camera 841 The third camera 841a aperture 842 The fourth camera 842a aperture 843 The fifth camera 850 Hinge structure 851 Hinge Cover 852 First hinge plate 853 Second hinge plate 853 Second hinge plate 854 Hinge Module 860 Electronic Components 861 First printed circuit board 862 Second printed circuit board 863 Flexible Printed Circuit Board 864 Battery 865 Antenna

Claims

1. In the electronic device 101, Printed circuit board 310; Electronic component 301 arranged on the printed circuit board 310; A shield can 320 configured to surround the electronic component 301 and placed on the printed circuit board 310, wherein the shield can 320 includes an opening 325 facing the electronic component 301; A shielding structure 330 configured to cover the opening 325 and positioned on the shield can 320; A heat conduction member 340 disposed between the electronic component 301 and the shielding structure 330, wherein the heat conduction member 340 is mounted on the electronic component 301 and configured to be in contact with the shielding structure 330 through the opening 325; and A heat dissipation structure disposed on the shielding structure 330; Includes, The aforementioned heat dissipation structure is Metal plate 350 and At least one heat dissipation member 360 is attached to the metal plate 350 and configured to transfer at least a portion of the heat emitted from the electronic component 301 via the heat conductive member 340, Includes, The shielding structure 330 is, A first shielding member 331 is mounted on the shield can 320; A first adhesive member 333 is interposed between the first shielding member 331 and the shielding can 320 in order to attach the first shielding member 331 to the shielding can 320; A second shielding member 332 mounted on the first shielding member 331; and A second adhesive member 334 interposed between the first shielding member 331 and the second shielding member 332 in order to attach the second shielding member 332 to the first shielding member 331; Includes, The density d1 of the first shielding member 331 is less than the density d2 of the second shielding member 332 in the electronic device 101.

2. The shielding structure 330 is, The electronic device 101 according to claim 1, further comprising an indented groove 330a extending from the opening 325 toward the metal plate 350 for accommodating the heat conductive member 340 that penetrates at least a portion of the opening 325.

3. The first shielding member 331 is, At least a portion of the heat conductive member 340 that has passed through the opening 325 is surrounded, The second shielding member 332 is, The electronic device 101 according to claim 1, which is attached to the heat conductive member 340 by the second adhesive member 334.

4. The aforementioned metal plate 350 is In a first direction perpendicular to the upper surface of the printed circuit board 310 on which the electronic component 301 is arranged, the heat dissipation portion 350a overlaps with the electronic component 301 in at least a portion thereof. The at least one heat dissipation member 360 is The first heat dissipation member 361 covers at least a portion of the second surface 352 of the metal plate 350, which is opposite to the first surface 351 of the metal plate 350 facing the shield can 320. The aforementioned electronic device 101 is The electronic device 101 according to claim 1, further comprising a heat insulating member 370 that at least partially overlaps the heat dissipation portion 350a in the first direction.

5. The heat insulating member 370 is at least partially surrounded by the first heat dissipating member 361. The at least one heat dissipation member 360 is The electronic device 101 according to claim 4, further comprising a second heat dissipation member 362 disposed on and covering the first heat dissipation member 361 and the heat insulating member 370.

6. The first shielding member 331 is, The first region 331c containing the adhesive substance by the first adhesive member 333, and The second region 331d includes the adhesive substance provided by the second adhesive member 334, At least a portion of one surface 331b of the first shielding member 331 facing the second shielding member 332, The electronic device 101 according to claim 1, which is in contact with the second shielding member 332.

7. The thickness t1 of the first shielding member 331 is It is within the range of 70 μm to 80 μm. The thickness t2 of the second shielding member 332 is The electronic device 101 according to claim 1, wherein the particle size is within the range of 10 μm or more and 20 μm or less.

8. The heat conductive member 340 is The electronic device 101 according to claim 1, comprising at least one of rubber, paraffin wax, and oil.

9. The metal plate 350 includes a recess or a through hole, and the recess or through hole is configured such that at least a portion of it overlaps with the electronic component 301 in a first direction perpendicular to the upper surface of the printed circuit board 310 on which the electronic component 301 is arranged. The at least one heat dissipation member 360 is arranged in the recess or the through hole, The recess is formed on the first surface 351 of the metal plate 350 facing the shield can 320, or on the second surface 352 of the metal plate 350 opposite to the first surface 351. The electronic device 101 according to claim 1, wherein the through hole extends from the first surface 351 of the metal plate 350 to the second surface 352 of the metal plate 351.

10. The at least one heat dissipation member 360 is The electronic device 101 according to claim 1, further comprising a third heat dissipation member 363 that covers at least a portion of the first surface 351 of the metal plate 350 facing the shield can 320.

11. The present invention further includes a heat insulating member 370 which is at least partially surrounded by the third heat dissipation member 363, The aforementioned metal plate 350 is It includes a heat dissipation portion 350a which is placed on the electronic component 301 and to which the heat insulating member 370 is attached, The at least one heat dissipation member 360 is The electronic device 101 according to claim 10, further comprising a fourth heat dissipation member 364 disposed on the third heat dissipation member 363.

12. The at least one heat dissipation member 360 is The electronic device 101 according to claim 1, comprising at least one of a vapor chamber, a heat pipe, graphite, and graphene.

13. The thickness t3 of the first adhesive member 333 and the thicknesses t4 and t5 of the second adhesive member 334 are, The electronic device 101 according to claim 1, wherein each is within the range of 1 μm or more and 15 μm or less.

14. The shielding structure 330 is, The electronic device 101 according to claim 1, further comprising a protective member 335 disposed on the second shielding member 332.

15. A display 201 on the metal plate 350, including a first display area 831, a second display area 832 separated from the first display area 831, and a third display area 833 connecting the first display area 831 and the second display area 832, which is foldable with respect to a folding axis f; A first housing 810 supporting the first display area 831; A second housing 820 supporting the second display area 832; and The electronic device 101 according to any one of claims 1 to 14, further comprising a hinge structure 850 configured to deform the third display area 833 by rotatably connecting the first housing 810 and the second housing 820.

Images