Diamond Wire Cutting Machine

Abstract

To provide a diamond wire sawing device in which new diamond particles continue to contact the wafer, resulting in very little wear and ensuring stability and consistency of the sawing process. [Solution] The apparatus comprises an apparatus stand 1, multiple winding devices 2, and a diamond wire 3, the apparatus stand having a base with a base 12 extending upward from the base, multiple tension adjustment arms 13 provided on the base, multiple tension adjustment arms having multiple tension rollers 14 provided on the base, multiple guide rollers 15 provided on the base, multiple tension rollers and multiple guide rollers arranged at intervals, multiple winding devices respectively arranged on both sides of the base, multiple winding devices respectively provided with winding wheels 21, the diamond wire passes through the multiple tension rollers, the multiple guide rollers and the multiple winding wheels, and multiple diamond particles are provided on the surface of the diamond wire.

Description

[Technical field]

[0001] The present invention relates to a cutting machine, and more particularly to a diamond wire cutting machine. [Background technology]

[0002] In semiconductor manufacturing, wafer sawing is the process of separating dies from a larger wafer into smaller chips. Multiple identical or similar chips can be produced from a single large wafer, improving production efficiency. After the wafer is sawn, the individual chips are packaged into chip carriers.

[0003] In the above structure, the wafer cutting is generally performed using a saw blade attached to a wafer cutting machine. A saw blade is a general term for a thin circular blade for cutting solid materials, and is usually made of high-precision hard alloy materials (e.g. diamond) and cuts by rotating at high speed. However, the saw blade is prone to chipping and grooves on the cutting edge of the chip, and may also form cracks. In addition, the saw blade may wear out after long-term use, reducing the cutting accuracy. How to solve the problems and inconveniences that have such adverse effects is an important issue that needs improvement in this field.

[0004] The diamond wire cutting machine includes a machine stand, a base seat is provided on the machine stand, a base seat extends upward from the base seat, a plurality of tension adjustment arms are provided on the base seat, and each tension adjustment arm is provided with a tension roller. A plurality of guide rollers are provided on the base seat, and the tension rollers and the guide rollers are arranged at an interval. A plurality of winding devices are provided on both sides of the base seat, and each winding device is provided with a winding wheel. Furthermore, the diamond wire passes through the plurality of tension rollers, the guide rollers, and the winding wheel, and a plurality of diamond particles are arranged on the surface of the diamond wire.

[0005] This design allows multiple winding devices to be used to wind the diamond wire, and the diamond wire cuts the wafers as it reciprocates. As the diamond wire reciprocates, new diamond particles continue to contact the wafer, resulting in very little wear and keeping the cutting process stable and consistent. [Prior art documents] [Patent documents]

[0006] [Patent Document 1] Taiwan Patent No. M582228 Summary of the Invention [Problem to be solved by the invention]

[0007] The prior art includes Taiwan Patent M582228 "Precision Diamond Cutting Machine", which includes a machine table, a cutting mechanism, a lifting base, a rotating spindle, and a cutting tool, and the rotating spindle drives and rotates the cutting tool. The lifting base reciprocates along at least two lifting slide axes, and the cutting tool performs a cutting stroke and a return stroke vertically to the machine table. However, as shown in Figure 4 of M582228 Patent, during cutting, the cutting tool (saw blade) reciprocates vertically, so that the diamond particles will wear out after long-term use, which will have a negative impact on the stability and consistency of the cutting process.

[0008] Therefore, improving the above problems is the technical problem that the present inventor aims to solve. [Means for solving the problem]

[0009] In order to achieve the above object, the present invention provides a diamond wire cutting machine, which includes a machine stand, a base seat provided on the machine stand, a base seat extending upward from the base seat, a plurality of tension adjustment arms provided on the base seat, and a plurality of tension rollers provided on the plurality of tension adjustment arms.

[0010] A plurality of guide rollers are installed on the base, and the tension rollers and the guide rollers are spaced apart. A plurality of winding devices are installed on both sides of the base, and the winding devices are provided with winding wheels. Further, a diamond wire passes through the tension rollers, the guide rollers, and the winding wheels, and has a plurality of diamond particles disposed on its surface.

[0011] Each of the winding devices includes a winding shaft and a power unit, the winding wheel is mounted on the power unit through the winding shaft, and the winding wheel is rotatable and driven by the power unit. For the above purpose, the present invention includes a wafer fixing device and a sensor device, the wafer fixing device is mounted on a base, and the sensor device is mounted on the base.

[0012] For the above purpose, the present invention can use the multiple winding devices to wind the diamond wire, and then move the diamond wire back and forth to cut the wafer. When the diamond wire moves back and forth, new diamond particles are always in contact with the wafer, which is very little wear and helps to maintain the stability and consistency of the cutting process. Effect of the Invention

[0013] The present invention uses the multiple winding devices to wind up the diamond wire, and the diamond wire cuts the wafer by reciprocating motion, and as the diamond wire reciprocates, new diamond particles continue to contact the wafer, resulting in very little wear and ensuring the stability and consistency of the cutting process. [Brief description of the drawings]

[0014] [Figure 1] 1 is a schematic diagram of a diamond wire cutting machine according to the present invention; [Diagram 2]1 is a schematic diagram of a first portion of the diamond wire cutting machine of the present invention; FIG. [Diagram 3] FIG. 2 is a schematic diagram of a second part of the diamond wire cutting machine of the present invention. [Figure 4] FIG. 2 is a side view of the diamond wire cutting machine of the present invention. [Diagram 5] FIG. 2 is a schematic diagram of a first operation of the diamond wire cutting machine of the present invention. [Figure 6] 4 is a schematic diagram of a second operation of the wire cutting machine of the present invention; FIG. [Figure 7] FIG. 2 is a schematic diagram of a third operation of the diamond wire cutting machine of the present invention. [Figure 8] FIG. 1 is a schematic diagram of a diamond wire according to the present invention. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS EXAMPLES

[0015] In order to achieve the objectives and advantages of the present invention, the features and functions of a preferred embodiment of the present invention will be described in detail, with reference to Figures 1 and 2. In particular, the present invention provides a diamond wire cutting machine, which includes the following components: a machine stand 1, multiple winding devices 2, and a diamond wire 3.

[0016] The device stand 1 has a base 11 from which a base 12 extends upward, the base 12 is provided with a plurality of tension adjustment arms 13, each of the plurality of tension adjustment arms 13 is attached with a tension roller 14, and the base 12 is provided with a plurality of guide rollers 15, the plurality of tension rollers 14 and the guide rollers 15 are arranged at intervals.

[0017] The tension adjustment arm 13 is pivoted to the base 12 via a rotating shaft 131 and can rotate freely around the rotating shaft 131, and the tension adjustment arm 13 is used to adjust the tension of the diamond wire 3. The tension roller 14 is attached to the tension adjustment arm 13 via a rotating shaft 141 and is in a rotatable state. The plurality of guide rollers 15 are also attached to the base 12 via a rotating shaft 151 and are in a rotatable state. The plurality of tension rollers 14 and the plurality of guide rollers 15 are disposed at both ends of the base 12 and are spaced apart from each other.

[0018] The plurality of winding devices 2 are disposed on both sides of the base 12, respectively, and each of the plurality of winding devices 2 is provided with a winding wheel 21.

[0019] Each winding device 2 includes one winding shaft 22 and one power unit 23, and the winding wheel 21 is attached to the power unit 23 via the winding shaft 22 and is in a rotatable state. The power unit 23 drives the winding shaft 22, and the winding wheel 21 operates in conjunction with the winding shaft 22. The power unit 23 functions as a motor, and the winding device 2 repeatedly winds and releases the diamond wire 3, causing the diamond wire 3 to reciprocate.

[0020] The diamond wire 3 passes through the tension rollers 14, the guide rollers 15 and the take-up wheels 21, and the surface of the diamond wire 3 is provided with diamond particles 31 (as shown in FIG. 8).

[0021] 1, 3 and 4, the present invention further includes a wafer clamping device 4 and a sensor device 5. The wafer clamping device 4 is mounted on the base 11, and the sensor device 5 is mounted on the base 12.

[0022] The wafer fixing device 4 includes a wafer stage 41, a wafer holder 42, and a driving device 43. The wafer stage 41 is connected to the wafer holder 42, and the wafer holder 42 is disposed between the wafer stage 41 and the driving device 43. The driving device 43 drives the wafer holder 42 to move the wafer stage 41 relative to the apparatus table 1. The wafer stage 41 of the wafer fixing device 4 functions as a vacuum chuck for adsorbing the wafer 6. The wafer holder 42 includes a slide rail, a shaft rod, or other equivalent device for achieving up-down and back-and-forth movement and 360-degree rotation. The driving device 43 includes equivalent devices such as a motor, a shaft, a pulley, and a cylinder, and drives the wafer holder 42. The sensing device 5 may be a charge-coupled device camera (CCD camera).

[0023] 1 and 5, the operation of the diamond wire cutter of the present invention is as follows: before cutting, the wafer 6 is placed on the wafer stage 41 of the wafer fixing device 4, the wafer 6 is accurately positioned on the wafer stage 41 by the sensor device 5, and then the wafer 6 is sucked by the wafer stage 41. Then, the power device 23 of the winding device 2 drives the winding shaft 22, which drives the winding wheel 21, which rotates. As a result, the diamond wire 3 is attached to the winding wheel 21, released from one end, and wound up at the other end. This operation causes the diamond wire 3 to reciprocate along the tension roller 14 and the multiple guide rollers 15, approach the wafer 6 on the wafer stage 41, and cut it. In addition, the tension adjustment arm 13 rotates on the rotation shaft 131 to adjust the tension of the diamond wire 3 to maintain an appropriate tension state and prevent the diamond wire 3 from being cut due to excessive tension. Furthermore, the wafer holder 42 is driven through the driving device 43 to move the wafer stage 41 relative to the apparatus table 1. For example, the wafer stage 41 is rotated to change the direction of the wafer 6, or the wafer stage 41 is moved up and down or back and forth (as shown in Figures 6 and 7) to cut the wafer 6 into small pieces.

[0024] Thus, the present invention utilizes multiple winding devices 2 to wind and release the diamond wire 3, and then reciprocates the diamond wire 3 to cut the wafer 6. As the diamond wire 3 reciprocates, new diamond particles 31 contact the wafer 6 one after another, which reduces wear and helps maintain the stability and consistency of the cutting process. The above description is merely a preferred embodiment of the present invention, and is not intended to limit the scope of the present invention. Therefore, equivalent shape, structure, or combination changes are also included in the invention as long as they do not deviate from the spirit and scope of the present invention. [Explanation of symbols]

[0025] 1: Equipment stand 11: Pedestal 12: Base 13: Tension adjustment arm 131: Rotation axis 14: Tension roller 141: Rotation axis 15: Guide roller 151: Rotation axis 2: Winding device 21: Winding wheel 22: Winding shaft 23: Power plant 3: Diamond wire 31: Diamond particles 4: Wafer holding device 41: Wafer stage 42: Wafer holder 43: Drive unit 5: Sensor device 6: Wafer

Claims

1. A diamond wire cutting device, comprising: a device base, a plurality of winding devices, and a diamond wire; The apparatus stand includes a base having a base and a base extending upward from the base, the base being provided with a plurality of tension adjustment arms; The tension adjustment arms are provided with a plurality of tension rollers; The plurality of guide rollers are installed on the base, and the plurality of tension rollers and the plurality of guide rollers are arranged at intervals; The plurality of winding devices are disposed on both sides of the base, respectively; Each of the plurality of winding devices is provided with a winding wheel; the diamond wire passes through the tension rollers, the guide rollers and the take-up wheels; The diamond wire is characterized in that a plurality of diamond particles are provided on a surface thereof. Diamond wire cutting equipment.

2. The winding device includes a winding shaft and a power unit; The winding wheel is attached to a power unit via a winding shaft, 2. The diamond wire cutting device according to claim 1, wherein the power unit drives the winding shaft.

3. The diamond wire cutting apparatus according to claim 1, further comprising a wafer fixing device and a sensor device, the wafer fixing device being mounted on the pedestal and the sensor device being installed on the base.

Images