Water-cooled heat dissipation structure and electronic device using same

Abstract

To provide a water-cooling heat dissipation structure in which the overall structure is simplified to reduce the volume, the heat conduction effect is improved, and the assembly process is correspondingly simplified, and an electronic device using the same is provided. [Solution] The water-cooled heat dissipation structure is used to cover a heat-generating element 40 and comprises a cooling plate 10 and a circuit board 20. A space for accommodating the heat-generating element is formed surrounded by the cooling plate and the circuit board, and the space is filled with a first thermally conductive medium 30 that is in direct contact with the cooling plate and also in direct contact with the circuit board.

Description

[Technical field]

[0001] The present invention relates to a water-cooling heat dissipation structure, and more particularly to a water-cooling heat dissipation structure for the interior of an electronic device. [Background technology]

[0002] With the continuous development of global technology, the heat generated by high-performance chips, servers, and power supplies required to support various advanced technologies is gradually increasing. In order to ensure the normal operation of hardware and extend the life of equipment, water-cooled heat dissipation technology has been used to replace the traditional air-cooled heat dissipation technology in order to improve heat dissipation efficiency.

[0003] As shown in Fig. 5, taking a power supply as an example, in a conventional water-cooled heat dissipation structure, a transformer module 51, which is a main heat generating element, is placed inside a heat sink 52 so as to be covered by the transformer module 51. The heat sink 52 may be an aluminum heat sink made of aluminum or an aluminum alloy. A first heat conducting medium 53 is filled between the transformer module 51 and the heat sink 52. An aluminum substrate 54 on which a power semiconductor element 541 is provided and a cooling plate 55 on which a cooling liquid flow path 551 is provided are attached to the outer wall surface of the heat sink 52 by a second heat conducting medium 56. The first heat conducting medium 53 can reduce the thermal resistance between the heat sink 52 and the transformer module 51, and the second heat conducting medium 56 can reduce the thermal resistance between the heat sink 52 and the aluminum substrate 54 and between the heat sink 52 and the cooling plate 55. As a result, the thermal energy generated during the operation of the transformer module 51 and the power semiconductor elements 541 is transferred to the cooling liquid in the cooling plate 55, and the heat is discharged.

[0004] However, in the above-mentioned conventional water-cooled heat dissipation structure, since the volume of the heat sink 52 is large, the volume of the entire water-cooled heat dissipation structure and the volume of the power supply also become large accordingly, making it impossible to miniaturize the structure. In addition, the heat conduction effect is reduced due to multiple thermal resistances formed by the first heat conduction medium 53, the heat sink 52, the second heat conduction medium 56 and the cooling plate 55, and further, there is a disadvantage that the water-cooled heat dissipation structure including the heat sink 52 requires more assembly steps. Summary of the Invention [Problem to be solved by the invention]

[0005] In view of the problems in the conventional technology described above, the present invention provides a water-cooled heat dissipation structure and an electronic device using the same, which simplifies the overall structure of the water-cooled heat dissipation structure, reduces its volume, improves the thermal conduction effect, and accordingly simplifies the assembly process. [Means for solving the problem]

[0006] In order to achieve the above object of the invention, the technical means adopted by the invention is to design a water-cooled heat dissipation structure which is used to cover a heat-generating element and includes a cooling plate and a circuit board, and a space for accommodating the heat-generating element is formed surrounded by the cooling plate and the circuit board, and the space is filled with the first heat-conducting medium which is in direct contact with the cooling plate and also in direct contact with the circuit board.

[0007] In the water-cooled heat dissipation structure, a flow path through which a cooling liquid flows is formed in the cooling plate.

[0008] In the water-cooled heat dissipation structure, another component to be dissipated heat is provided on the circuit board, and the other component to be dissipated heat is provided on the outer surface of the circuit board, or on both the outer surface and the inner surface of the circuit board.

[0009] In the water-cooled heat dissipation structure, a fixing protrusion is provided on the outer wall surface of the cooling plate, and a fixing member penetrates the circuit board and is connected and fixed to the fixing protrusion.

[0010] In the water-cooled heat dissipation structure, the cooling plate and the circuit board are combined via a connecting member, one part of the connecting member is connected and fixed to the cooling plate, and another part of the connecting member is connected and fixed to the circuit board.

[0011] In the water-cooled heat dissipation structure, solid The fixing member is connected and fixed to the cooling plate through the connecting member.

[0012] In the water-cooled heat dissipation structure, a thermal conduction block is further provided on an outer wall surface of the cooling plate, and a space for accommodating the heat-generating element is formed surrounded by the portion of the cooling plate where the thermal conduction block is installed and the circuit board, and the cooling plate comes into direct contact with the first thermal conduction medium via the thermal conduction block.

[0013] In the water-cooled heat dissipation structure, the thermally conductive block is attached to the cooling plate by a second thermally conductive medium.

[0014] In order to achieve the above object, the present invention provides an electronic device including a heat generating element and the above-mentioned water-cooling heat dissipation structure that covers the heat generating element. Effect of the Invention

[0015] With the above design, the first thermal conductive medium of the water-cooled heat dissipation structure is in direct contact with the heat-generating element, the circuit board and the cooling plate, which not only simplifies the water-cooled heat dissipation structure and its assembly process, but also reduces thermal resistance and improves thermal conductivity, and further reduces the size of the water-cooled heat dissipation structure and the electronic device in which it is installed. [Brief description of the drawings]

[0016] [Figure 1]1 is a schematic side view of a first preferred embodiment of the present invention; FIG. [Diagram 2] FIG. 2 is a schematic side view of the second preferred embodiment of the present invention; [Diagram 3] FIG. 11 is a schematic side view of the third preferred embodiment of the present invention. [Figure 4] FIG. 13 is a schematic side view of the fourth preferred embodiment of the present invention. [Diagram 5] FIG. 1 is a schematic side view of a conventional water-cooled heat dissipation structure. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0017] The following will describe in more detail the technical means employed by the present invention to achieve the intended objectives in combination with the drawings and preferred embodiments of the present invention.

[0018] As shown in FIG. 1, the first preferred embodiment of the water-cooled heat dissipation structure of the present invention is installed inside an electronic device and is used to cover a heat-generating element 40 in the electronic device. Specifically, for example, the electronic device is a power supply, and the heat-generating element 40 is a transformer module in the power supply, but is not limited thereto, and may also be an electronic element in other electronic devices that generates a relatively large amount of heat.

[0019] The water-cooled heat dissipation structure includes a cooling plate 10 and a circuit board 20. A flow path 101 through which a coolant 11 flows is formed in the cooling plate 10. The circuit board 20 is an electronic circuit board such as a printed circuit board (PCB), an aluminum board, a copper board, etc. Other heat dissipation target members 21 such as power semiconductor elements and transistors are provided on the circuit board 20. The cooling plate 10 and the circuit board 20 are provided around the heat generating element 40, so that the heat generating element 40 is covered by the space surrounded by the cooling plate 10 and the circuit board 20. The space surrounded by the cooling plate 10 and the circuit board 20 is filled with a first heat conducting medium 30 that is in direct contact with the cooling plate 10 and also in direct contact with the circuit board 20. As a result, the thermal energy generated by the heat-generating element 40 and the other heat dissipation target components 21 is quickly transferred to the cooling plate 10 via the first thermal conduction medium 30, or is transferred to the cooling plate 10 by direct contact between the circuit board 20 and the cooling plate 10, and is further discharged via the cooling liquid 11 in the cooling plate 10.

[0020] 1, according to a specific example of the first preferred embodiment of the present invention, the other heat dissipation target member 21 is provided on the outer surface of the circuit board 20, the inner surface of the circuit board 20 faces the heat generating element 40, and is in direct contact with the first heat conducting medium 30. A fixing protrusion 12 is protruded from the outer wall surface of the cooling plate 10, and a fixing member 22 penetrates the circuit board 20 and is connected and fixed to the fixing protrusion 12, thereby determining the relative position between the circuit board 20 and the cooling plate 10, and the thermal energy generated by the heat generating element 40 and the other heat dissipation target member 21 is transferred to the cooling plate 10 through the fixing protrusion 12 of the circuit board 20 and the cooling plate 10, and is discharged.

[0021] In the second preferred embodiment of the water-cooled heat dissipation structure of the present invention shown in Fig. 2, similarly to the first preferred embodiment, another heat dissipation target member 21A is provided on the outer surface of the circuit board 20A, and the inner surface of the circuit board 20A faces the heat generating element 40 and is in direct contact with the first heat conducting medium 30A. The main difference between the first preferred embodiment and the second preferred embodiment is that the cooling plate 10A and the circuit board 20A are combined via a connecting member 23A, and a part of the connecting member 23A is connected and fixed to the cooling plate 10A, and another part of the connecting member 23A is connected and fixed to the circuit board 20A, thereby determining the relative positions of the circuit board 20A and the cooling plate 10A.

[0022] According to a specific example of the first preferred embodiment of the present invention, the fixing member 22A penetrates the connecting member 23A and is connected and fixed to the cooling plate 10A, thereby connecting the connecting member 23A to the cooling plate 10A. Although the connecting member 23A is formed in an L-shape, this is not limited thereto, and the shape can be selected according to the relative positions of the cooling plate 10A and the circuit board 20A.

[0023] The third preferred embodiment of the water-cooled heat dissipation structure of the present invention shown in FIG. 3 is almost the same as the first preferred embodiment, in which another heat dissipation target component 21B is provided on the outer surface of the circuit board 20B, and the inner surface of the circuit board 20B faces the heat-generating element 40 and is in direct contact with the first heat-conducting medium 30B. The main difference between the first preferred embodiment and the third preferred embodiment is that a heat conduction block 13B is further provided on the outer wall surface of the cooling plate 10B, and a space for accommodating the heat generating element 40 is formed by being surrounded by the portion of the cooling plate 10B where the heat conduction block 13B is installed and the circuit board 20B, and the cooling plate 10B comes into direct contact with the first heat conduction medium 30B by the heat conduction block 13B, so that the thermal energy generated by the heat generating element 40 and the other heat dissipation target member 21B is first transferred directly to the first heat conduction medium 30B and then transferred to the cooling plate 10B via the heat conduction block 13B, or transferred to the cooling plate 10B via the contact surface between the circuit board 20B and the heat conduction block 13B, and further discharged by the cooling liquid 11B in the cooling plate 10B.

[0024] It is preferable that the thermally conductive block 13B is attached to the cooling plate 10B by a second thermally conductive medium 24B, and the fixing member 22B penetrates the circuit board 20B and is connected and fixed to the thermally conductive block 13B. Specifically, the material of the thermally conductive block 13B can be a metal with high thermal conductivity, such as aluminum, an aluminum alloy, copper, or a copper alloy.

[0025] The fourth preferred embodiment of the water-cooled heat dissipation structure of the present invention shown in FIG. 4 is almost the same as the third preferred embodiment, with the main difference being that other heat dissipation target parts 21C are provided on both the outer and inner sides of the circuit board 20C, and the other heat dissipation target parts 21C located on the inner side of the circuit board 20C are in direct contact with the first heat conduction medium 30C, so that the thermal energy generated by the heat-generating element 40 and the other heat dissipation target parts 21C located on the outer and inner sides of the circuit board 20C is first directly transmitted to the first heat conduction medium 30C, and then transmitted to the cooling plate 10C via the heat conduction block 13C, or transmitted to the cooling plate 10C via the contact surface between the circuit board 20C and the heat conduction block 13C, and then further discharged by the coolant 11C in the cooling plate 10C.

[0026] As described above, according to the water-cooled heat dissipation structure of the present invention, a heat sink for covering the heat-generating element 40 can be omitted, and the first thermal conduction medium 30, 30A, 30B, 30C is designed to be in direct contact with the heat-generating element 40, the circuit board 20, 20A, 20B, 20C and the cooling plate 10, 10A, 10B, 10C, which not only simplifies the water-cooled heat dissipation structure and its assembly process, but also reduces the thermal resistance and improves the thermal conduction effect. Furthermore, the volume of both the water-cooled heat dissipation structure and the electronic device in which the water-cooled heat dissipation structure is installed can be made smaller.

[0027] The above description is merely a preferred embodiment of the present invention, and does not impose any formal limitations on the present invention. Although the present invention is disclosed above using a preferred embodiment, it is not intended to limit the present invention, and all those skilled in the art can easily modify the above embodiment based on the technical essence of the present invention, and equivalent changes and modifications are all within the scope of the technical solutions of the present invention, as long as they do not deviate from the technical solutions of the present invention. [Explanation of symbols]

[0028] 10, 10A, 10B, 10C Cooling plate 101 Flow Channel 11, 11B, 11C Coolant 12 Fixed protrusion 13B, 13C Thermal conduction block 20, 20A, 20B, 20C Circuit Board 21, 21A, 21B, 21C Other heat dissipation target parts 22, 22A, 22B Fixing members 23A Connection parts 24B Second heat transfer medium 30, 30A, 30B, 30C First heat conducting medium 40 Heating element 51 Transformer module 52 Heat sink 53 First heat conducting medium 54 Aluminum Substrate 541 Power Semiconductor Devices 55 Cooling Plate 551 Coolant flow path 56 Second heat transfer medium

Claims

1. A water-cooled heat dissipation structure used to cover a heat generating element, the water-cooled heat dissipation structure including a cooling plate and a circuit board, A space for accommodating the heat generating element is formed by being surrounded by the cooling plate and the circuit board, and the space is filled with a first heat conducting medium that is in direct contact with the cooling plate and also in direct contact with the circuit board. A water-cooled heat dissipation structure.

2. 2. The water-cooled heat dissipation structure according to claim 1, wherein a flow path through which a cooling liquid flows is formed in the cooling plate.

3. 2. The water-cooled heat dissipation structure according to claim 1, wherein another heat dissipation target member is provided on said circuit board.

4. 4. The water-cooled heat dissipation structure according to claim 3, wherein the other heat dissipation target member is provided on an outer surface of the circuit board.

5. 4. The water-cooled heat dissipation structure according to claim 3, wherein the other heat dissipation target members are provided on both the outer and inner surfaces of the circuit board.

6. 6. The water-cooled heat dissipation structure according to claim 1, wherein a fixing protrusion is protrudingly provided on an outer wall surface of the cooling plate, and a fixing member penetrates the circuit board and is connected and fixed to the fixing protrusion.

7. 6. The water-cooled heat dissipation structure according to claim 1, wherein the cooling plate and the circuit board are combined via a connecting member, a part of the connecting member is connected and fixed to the cooling plate, and another part of the connecting member is connected and fixed to the circuit board.

8. 8. The water-cooled heat dissipation structure according to claim 7, wherein the fixing member is connected and fixed to the cooling plate by penetrating the connecting member.

9. 6. The water-cooled heat dissipation structure according to claim 1, further comprising a heat conduction block on an outer wall surface of the cooling plate, a space for accommodating the heat-generating element being surrounded by the portion of the cooling plate where the heat conduction block is installed and the circuit board, and the cooling plate being in direct contact with the first heat conduction medium via the heat conduction block.

10. The water-cooled heat dissipation structure according to claim 9 , wherein the heat-conducting block is attached to the cooling plate by a second heat-conducting medium.

11. A heating element; a water-cooling and heat-dissipating structure according to claim 1, the water-cooling and heat-dissipating structure covering the heat-generating element.

1. An electronic device comprising:

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