Substrate for mounting electronic components, electronic component mounting body and manufacturing method thereof, and electronic device

Abstract

In the present invention, an electronic component package comprises a base, a connection part provided on the base, an electronic component having a terminal connected to the connection part, and solder for fixing the electronic component to the connection part. The connection part has a first region to which the terminal is fixed with solder interposed therebetween, and a second region having a lower wettability than the first region. The second region has an extension region extended to the peripheral edge of the connection part, and a set-apart region provided so as to project from the extension region towards the first region and so as to be set apart from the peripheral edge.

Description

[Technical field]

[0001] The present disclosure relates to an electronic component mounting substrate, an electronic component mounting body and a manufacturing method thereof, and an electronic device including the same. [Background technology]

[0002] In order to suppress the spreading of solder onto a conductor pattern, a technique is known in which a low solder wettability region is formed by laser processing so as to completely separate the conductor pattern (see, for example, Patent Document 1). [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2006-86453 A Summary of the Invention [Problem to be solved by the invention]

[0004] However, because of the positional accuracy required for laser processing, when the above technology is applied to MIDs (Molded Interconnect Devices) or the like, it is unavoidable that the underlying resin of the conductor pattern is also processed at the same time.

[0005] When the base resin is laser processed, there is a risk of a decrease in soldering quality. This decrease in quality is believed to be due to the following (1) to (3). (1) When solder paste or other solder is applied, the solvent components containing flux flow into the laser processed area due to capillary action, losing the activation power during soldering. (2) The base resin processing around the conductor pattern causes damage to the conductor pattern (stress-induced breaks and cracks, and the resulting effects on reliability). (3) Insulating resin foreign matter causes poor joints during soldering.

[0006] An object of the present disclosure is to provide an electronic component mounting substrate capable of suppressing deterioration in soldering quality, an electronic component mounting body and a manufacturing method thereof, and an electronic device equipped with the same. [Means for solving the problem]

[0007] In order to solve the above problems, the first disclosure is: A substrate; A first metal layer and a second metal layer provided below the first metal layer and having a lower wettability than the first metal layer, A pair of connection parts provided on a base body; an electronic component having a pair of terminals connected to a pair of connection portions; A pair of solders that fix a pair of terminals of an electronic component to a pair of connecting parts Equipped with The pair of connections are a region where the surface of the first metal layer is exposed; a pair of first regions to which a pair of terminals are fixed by a pair of solders; a region where the surface of the second metal layer is exposed; A pair of second regions having a lower wettability than the first regions; having The pair of second regions are A pair of extended regions extending to the periphery of the connection portion; a pair of spaced apart regions projecting from the extended region toward the first region and spaced apart from the periphery; having the pair of first regions are disposed inside the pair of second regions, The pair of separated regions are electronic component mounted structures that are disposed inside the pair of extended regions. The second disclosure is: A substrate; A pair of connection parts provided on a base body; an electronic component having a pair of terminals connected to a pair of connection portions; A pair of solders that fix a pair of terminals of an electronic component to a pair of connecting parts Equipped with The pair of connections are a pair of first regions to which a pair of terminals are fixed by a pair of solders; A pair of second regions having a lower wettability than the first regions; having The pair of second regions are A pair of extended regions extending to the periphery of the connection portion; a pair of spaced apart regions projecting from the extended region toward the first region and spaced apart from the periphery; having the pair of first regions are disposed inside the pair of second regions, The pair of separation regions are disposed inside the pair of extension regions, In this electronic component mounting structure, a laser processing region is provided adjacent to the extended region on the surface of the substrate.

[0008] No. 3 The disclosure of the present invention relates to an electronic component mounting body according to the first disclosure. or the electronic component mounting body of the second disclosure It is an electronic device equipped with:

[0009] No. 4 The disclosure of A substrate; A first metal layer and a second metal layer provided below the first metal layer and having a lower wettability than the first metal layer, A pair of connection parts provided on a base body; Equipped with The pair of connections are The surface of the first metal layer is exposed. A pair of first regions; a region where the surface of the second metal layer is exposed; A pair of second regions having a lower wettability than the first regions; having The pair of second regions are A pair of extended regions extending to the periphery of the connection portion; a pair of spaced apart regions projecting from the extended region toward the first region and spaced apart from the periphery; having the pair of first regions are disposed inside the pair of second regions, The pair of spaced regions are electronic component mounting substrates that are disposed inside the pair of extended regions. The fifth disclosure is: A substrate; A pair of connection parts provided on a base body; Equipped with The pair of connections are A pair of first regions; A pair of second regions having a lower wettability than the first regions; having The pair of second regions are A pair of extended regions extending to the periphery of the connection portion; a pair of spaced apart regions projecting from the extended region toward the first region and spaced apart from the periphery; having the pair of first regions are disposed inside the pair of second regions, The pair of separation regions are disposed inside the pair of extension regions, The substrate for mounting electronic components has a laser processing region provided on the surface of the substrate adjacent to the extended region.

[0010] No. 6 The disclosure of removing a portion of the first metal layer by laser processing to expose a second metal layer having a lower wettability than the first metal layer, thereby forming a pair of connection parts on the substrate, the pair of connection parts having a pair of first regions where the first metal layer is exposed and a pair of second regions where the second metal layer is exposed; The pair of second regions are A pair of extended regions extending to the periphery of the connection portion; a pair of spaced apart regions projecting from the extended region toward the first region and spaced apart from the periphery; having the pair of first regions are disposed inside the pair of second regions, The method for manufacturing an electronic component mounted assembly includes a pair of spaced regions disposed inside a pair of extended regions. [Brief description of the drawings]

[0011] [Figure 1] Fig. 1A is a plan view showing an example of a configuration of an electronic component mounted body according to a first embodiment of the present disclosure, and Fig. 1B is a cross-sectional view taken along line IB-IB in Fig. 1A. [Diagram 2] FIG. 2 is a plan view showing an example of the configuration of an electronic component mounting substrate. [Diagram 3] Fig. 3A is an enlarged plan view showing a part of Fig. 2. Fig. 3B is a cross-sectional view taken along line IIIB-IIIB in Fig. 3A. [Figure 4] FIG. 4 is a plan view showing an example of each region of the connection portion. [Diagram 5]Fig. 5A is a plan view for explaining an example of a manufacturing method of an electronic component mounted body according to the first embodiment of the present disclosure, Fig. 5B is a cross-sectional view taken along line VB-VB in Fig. 5A, and Fig. 5C is a cross-sectional view taken along line VC-VC in Fig. 5A. [Figure 6] Fig. 6A is a plan view for explaining an example of a manufacturing method of an electronic component mounted body according to the first embodiment of the present disclosure, Fig. 6B is a cross-sectional view taken along line VIB-VIB in Fig. 6A, and Fig. 6C is a cross-sectional view taken along line VIC-VIC in Fig. 6A. [Figure 7] Fig. 7A is a plan view showing an example of the configuration of an electronic component mounted body according to a second embodiment of the present disclosure, and Fig. 7B is a plan view showing an example of the configuration of an electronic component mounting substrate. [Figure 8] FIG. 8 is a plan view showing an example of each region of the connection portion. [Figure 9] Fig. 9A is a plan view showing the configuration of an electronic component mounted body according to Reference Example 1. Fig. 9B is a plan view showing the configuration of an electronic component mounted body according to Reference Example 2. [Figure 10] Fig. 10A is a plan view showing an example of a configuration of an electronic component mounted body according to a third embodiment of the present disclosure, and Fig. 10B is a plan view showing an enlarged portion of Fig. 10A. [Figure 11] FIG. 11 is a plan view showing an example of the configuration of an electronic component mounted body according to a modified example. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0012] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present disclosure will be described in the following order with reference to the drawings. In all the drawings of the following embodiments, the same or corresponding parts are denoted by the same reference numerals. 1 First embodiment (example of electronic component mounting body) 2. Second embodiment (example of electronic component mounting body) 3. Third embodiment (example of electronic component mounting body) 4. Variations 5. Application Examples

[0013] <1 First embodiment> [Configuration of electronic component assembly] Fig. 1A is a plan view showing an example of the configuration of an electronic component mounted body 1 according to a first embodiment of the present disclosure. Fig. 1B is a cross-sectional view taken along line IB-IB in Fig. 1A. The electronic component mounted body 1 includes an electronic component mounting substrate 10, an electronic component 20, and solders 21A and 21B. The electronic component mounted body 1 may be a molded interconnect device (MID).

[0014] (Electronic Components) The electronic component 20 has a connection terminal (first connection terminal) 20A and a connection terminal (second connection terminal) 20B. The connection terminal 20A and the connection terminal 20B have different polarities. For example, the connection terminal 20A is a positive terminal, and the connection terminal 20B is a negative terminal. The electronic component may have a chip shape or a shape other than a chip shape. Examples of the electronic component include, but are not limited to, a capacitor, a battery, a resistor, a coil, a diode, a transistor, or a switch. FIG. 1A shows an example in which the electronic component 20 is a chip-shaped capacitor.

[0015] (Substrate for electronic component mounting) Fig. 2 is a plan view showing an example of the configuration of electronic component mounting substrate 10. Fig. 3A is an enlarged plan view of a portion of Fig. 2. Fig. 3B is a cross-sectional view taken along line IIIB-IIIB in Fig. 3A. Electronic component mounting substrate 10 includes substrate body 11, a pair of connecting portions 12A, 12B, and conductor patterns 13A, 13B.

[0016] (Main body) The base body 11 supports the electronic component 20. The base body 11 contains a polymer resin at least on the surface. The base body 11 may be a resin molded body containing a polymer resin. The resin molded body may be a housing used in an electronic device or the like. Although an example in which the base body 11 is flat-plate shaped is shown in Figs. 1A, 1B, 2, and 3, the shape of the base body 11 is not limited thereto, and the base body 11 may be a molded body having a three-dimensional structure (for example, an injection molded body having a three-dimensional structure).

[0017] (Connection) The connection parts 12A and 12B are so-called lands. The connection parts 12A and 12B are provided on the base body 11. The electronic component 20 is connected to the connection parts 12A and 12B. Specifically, the connection terminal 20A of the electronic component 20 is connected to the connection part 12A, and the connection terminal 20B of the electronic component 20 is connected to the connection part 12B. The connection part 12A and the connection terminal 20B are fixed by solder 21A, and the connection part 12B and the connection terminal 20B are fixed by solder 21B. The connection parts 12A and 12B have the same width as the conductor patterns 13A and 13B. The connection parts 12A and 12B have a rectangular shape. However, the shape of the connection parts 12A and 12B is not limited to a rectangular shape, and may be a circular shape, an elliptical shape, or a polygonal shape other than a rectangular shape.

[0018] As shown in FIG. 3B, the connection parts 12A and 12B include a high-wettability metal layer (first metal layer) 14 and a low-wettability metal layer (second metal layer) 15. The low-wettability metal layer 15 has a lower wettability than the high-wettability metal layer 14. Therefore, the solder spreads less easily on the low-wettability metal layer 15 than on the high-wettability metal layer 14. The low-wettability metal layer 15 is provided under the high-wettability metal layer 14. The low-wettability metal layer 15 is provided on the surface of the base body 11. The high-wettability metal layer 14 includes, for example, gold (Au), a gold alloy, silver (Ag), or a silver alloy. The low-wettability metal layer 15 includes, for example, nickel (Ni), a nickel alloy, copper (Cu), or a copper alloy.

[0019] A pair of connecting parts 12A, 12B are disposed facing each other at a specified distance. As shown in Figures 2 and 3A, connecting part 12A has a high wettability region (first region) 14R and a low wettability region (second region) 15R on the surface side of base body 11. Similarly, connecting part 12B has a high wettability region 14R and a low wettability region 15R on the surface side of base body 11.

[0020] (High wettability area) It is preferable that the contact angle of the solder in the high wettability region 14R is approximately 0 degrees. When the contact angle of the solder is approximately 0 degrees, the high wettability region 14R has excellent functionality. Here, approximately 0 degrees includes 0 degrees. The contact angle of the solder in the high wettability region 14R is measured as follows. Solder (solder composition: SAC305) is applied to the high wettability region 14R so that the solder application diameter φ is 0.3 mm, and after melting by reflow, the contact angle of the solder is measured.

[0021] The high wettability region 14R is a region where the surface of the high wettability metal layer 14 is exposed. As shown in FIG. A and region R B Region R A and region R B It is connected to the area R. A and region R B In other words, the high wettability region 14R is a region where the solders 21A and 21B are provided. In the first embodiment, the solders 21A and 21B are provided in the region R. B The case where the solders 21A and 21B are provided in the region R B It is not necessary to provide the

[0022] Region R of the connection portion 12A A A connection terminal 20A of the electronic component 20 is connected to the connecting portion 12B. A A connection terminal 20B of the electronic component 20 is connected to the connecting portion 12A. The connection terminal 20A of the electronic component 20 is fixed to the connecting portion 12A by solder 21A. A The connection terminal 20B of the electronic component 20 is fixed to the region R of the connection portion 12B by solder 21B. A is fixed to the region R A and region R B For example, the region R has a rectangular shape. B may have a linear shape.

[0023] Region R of the connection portion 12A A The region R of the connecting portion 12B is provided on the side of the connecting portion 12A that faces the connecting portion 12B. AThe region R of the connecting portion 12A is provided on the side of the connecting portion 12B facing the connecting portion 12A. B The regions R of the connecting portion 12B are provided along the opposing peripheral portions (specifically, the opposing two sides) of the connecting portion 12A. B are provided along opposing peripheral portions (specifically, two opposing sides) of the connection portion 12B.

[0024] (Low wettability area) The contact angle of the solder in the low wettability region 15R is preferably 55 degrees or more. When the contact angle of the solder is approximately 55 degrees or more, excellent functionality of the low wettability region 15R can be obtained. The contact angle of the solder in the low wettability region 15R is measured in the same manner as the contact angle of the solder in the high wettability region 14R.

[0025] The low-wettability region 15R is a region where the surface of the low-wettability metal layer 15 is exposed from the high-wettability metal layer 14. The low-wettability regions 15R of the connection portions 12A and 12B face each other. The low-wettability region 15R of the connection portion 12A faces the connection terminal 20A of the electronic component 20. The low-wettability region 15R of the connection portion 12B faces the connection terminal 20B of the electronic component 20.

[0026] The low-wettability region 15R suppresses the spreading of the molten solders 21A and 21B during the manufacturing process, and restricts the application positions of the solders 21A and 21B to within the high-wettability region 14R. The low-wettability region 15R is a region where the solders 21A and 21B are not provided, or where the solders 21A and 21B are hardly provided. The low-wettability region 15R is a region where the surface of the low-wettability metal layer 15 is exposed. The wettability of the low-wettability region 15R is lower than that of the high-wettability region 14R. Therefore, the wettability of the low-wettability region 15R makes it difficult for the solders 21A and 21B to spread compared to the high-wettability region 14R.

[0027] As described later, the low wettability region 15R is formed by removing a part of the high wettability metal layer 14 provided on the low wettability metal layer 15. A part of the high wettability metal layer 14 may remain on the surface of the low wettability region 15R. The materials of the high wettability metal layer 14 and the low wettability metal layer 15 may form an alloy on the surface of the low wettability region 15R. When the high wettability metal layer 14 contains gold (Au), the Au mass concentration % in the low wettability region 15R is preferably 20% or less. If the Au mass concentration % is 20% or less, the wettability of the molten solders 21A and 21B can be sufficiently reduced. Therefore, the low wettability region 15R can have a sufficient function.

[0028] The Au mass concentration % is determined by performing a component analysis of the low wettability region 15R using SEM-EDX (scanning electron microscope SU3500, manufactured by Hitachi High-Technologies Corporation, accelerating voltage 15 kV).

[0029] As shown in FIG. 4, the low wettability region 15R is a region R C and region R D Region R C and region R D It is connected to the area R. C has, for example, a rectangular shape. D For example, the region R C An example is shown in which the region R is linear. C is the region R D to the high wettability region 14R (specifically, the region R of the high wettability region 14R A ) and is spaced apart from the opposing peripheral portions (specifically, the opposing two sides) of the connection portions 12A and 12B. C Region R in the direction perpendicular to the protruding direction of C On either side of the region R B is provided.

[0030] area R C When the solders 21A and 21B are applied, the area R2 is an area that allows the application positions and application amounts of the solders 21A and 21B.C The region R controls the positions of the applied solders 21A and 21B when the solders 21A and 21B melt. C The width Wc (see FIG. 3A and FIG. 3B) of the solder 21A, 21B can tolerate the misalignment and the amount (size) of the solder 21A, 21B to be applied, and is within the soldering area R A It is preferable that the solder amount is set so that a desired amount of solder remains in the region R. C In order to prevent the surface of the base body 11 from being laser processed when forming the region R B Width W B is preferably set taking into consideration the positional accuracy of laser processing.

[0031] area R D is a region that stops the spreading of the solders 21A and 21B when the solders 21A and 21B melt in the manufacturing process. D The region R of the connecting portion 12A is an extended region extending to the opposing peripheral portions (specifically, the opposing two sides) of the connecting portions 12A and 12B. D is an area R C The connecting portion 12B is provided on the inner side of the region R D is an area R C It is located further back.

[0032] area R D Width W D is preferably equal to or larger than the minimum spot diameter of the laser beam and equal to or smaller than 15 μm, and more preferably, is approximately equal to the minimum spot diameter of the laser beam. D Width W D is smaller than the minimum spot diameter of the laser beam, the area R D On the other hand, it may be difficult to form the region R D Width W D When the area R is 15 μm or less, the size of the laser processed areas 16R1, 16R2 formed on the surface of the base body 11 by laser processing in the process of forming the connecting portions 12A, 12B can be reduced, so that deterioration in the quality of the soldering can be further suppressed. DWidth W D When the minimum spot diameter of the laser beam is about 25 μm, the size of the laser processed regions 16R1 and 16R2 formed on the surface of the base body 11 by the laser processing can be minimized. Therefore, deterioration of the soldering quality can be particularly suppressed. The minimum spot diameter of the laser beam is, for example, about 25 μm, although it depends on the type of laser processing device.

[0033] (Laser processing area) The laser processing regions 16R1 and 16R2 are formed by laser processing in the process of forming the connection portions 12A and 12B. The laser processing regions 16R1 and 16R2 may not be provided, but considering the positional accuracy of the laser processing, the region R D During the formation of the region R D Since it is difficult to accurately perform laser processing only in the range R, it is preferable to provide laser processing areas 16R1 and 16R2. D The laser processing area 16R1 is adjacent to one end of the area R D The laser processing area 16R1 and the area R D The periphery of the connection portion 12A, 12B is located at the boundary between the laser processing area 16R2 and the area R D The peripheral edges of the connection portions 12A and 12B are located at the boundary between them.

[0034] The width W of the laser processing areas 16R1 and 16R2 in the direction of protrusion from the peripheral edge of the connection parts 12A and 12B E It is preferable that the width W of the laser processing regions 16R1 and 16R2 is set according to the accuracy of the laser processing position. E is the region R B Width W B (W E= W B ).

[0035] (Conductor pattern) Conductive patterns 13A and 13B connect electronic component 20 to other electronic components. Conductive patterns 13A and 13B are provided on the surface of base body 11. Conductive patterns 13A and 13B extend from connecting portions 12A and 12B, respectively. Conductive patterns 13A and 13B are so-called wiring and have a linear shape.

[0036] Like the connecting portions 12A and 12B, the conductive patterns 13A and 13B may each include a high-wettability metal layer 14 and a low-wettability metal layer 15. The conductive patterns 13A and 13B may each be integral with the connecting portions 12A and 12B.

[0037] (Solder) Solder 21A fixes electronic component 20 to connection portion 12A. Specifically, solder 21A fixes connection terminal 20A of electronic component 20 to high wettability region 14R of connection portion 12A. Solder 21B fixes electronic component 20 to connection portion 12B. Specifically, solder 21B fixes connection terminal 20B of electronic component 20 to high wettability region 14R of connection portion 12B. Solder 21A is provided in high wettability region 14R of connection portion 12A. Solder 21B is provided in high wettability region 14R of connection portion 12B. Solder 21A and 21B are, for example, solder paste.

[0038] [Method of manufacturing electronic component mounting body] An example of a manufacturing method for an electronic component mounted body 1 according to the first embodiment of the present disclosure will be described below with reference to Figures 5A to 5C and 6A to 6C. Note that in Figures 5A to 5C, position P1 indicates the peripheral position of the low-wettability region 15R on the side farther from the connection terminal 20A of the electronic component 20. Also, in Figures 6A to 6C, position P2 indicates the peripheral position of the low-wettability region 15R on the side closer to the connection terminal 20A of the electronic component 20.

[0039] First, a plurality of linear conductor patterns are formed on the surface of the substrate body 11. The conductor pattern is a laminate of a low wettability metal layer 15 and a high wettability metal layer 14 provided on the low wettability metal layer 15. Next, one end of the conductor pattern that forms the connection parts 12A and 12B among the plurality of conductor patterns is laser processed to remove a part of the high wettability metal layer 14, and to expose the surface of the metal layer 15 that has a lower wettability than the high wettability metal layer 14. As a result, the connection parts 12A and 12B having a high wettability region 14R where the high wettability metal layer 14 is exposed and a low wettability region 15R where the low wettability metal layer 15 is exposed are formed on the substrate 10 for mounting electronic components.

[0040] In addition, the region R of the low-wettability metal layer 15 D When forming the regions 16R1 and 16R2 by laser processing, it is preferable to form the laser processing regions 16R1 and 16R2 by performing laser processing to a position beyond both long sides of the conductor pattern, that is, to a position outside the conductor pattern (high wettability metal layer 14 and low wettability metal layer 15). Even if deviation from the ideal laser processing position occurs due to the limit of laser processing accuracy, the regions R1 and 16R2 can be formed up to the positions of both long sides of the conductor pattern. D Therefore, the region R D Therefore, the occurrence of defective formation can be suppressed.

[0041] 5A to 5C, solders 21A and 21B are applied onto connecting portions 12A and 12B, respectively, and then connection terminals 20A and 20B of electronic component 20 are placed on solders 21A and 21B, respectively. At this time, solder 21A is applied at a position closer to connection terminal 20A of electronic component 20 than position P1. Solder 21B is applied at a position closer to connection terminal 20B of electronic component 20 than position P1.

[0042] Next, the solders 21A and 21B are heated and melted, for example, in a reflow furnace. The melted solders 21A and 21B are D This can prevent the molten solder 21A, 21B from spreading beyond the position P1 onto the conductive patterns 13A, 13B.C This holds the solders 21A, 21B closer to the electronic component 20 than position P2, thereby regulating the positions of the solders 21A, 21B. Note that connection terminal 20A is not shown in Figures 6A to 6C. The method for heating and melting the solders 21A, 21B is not limited to a reflow furnace, and local heating by laser light irradiation may also be used.

[0043] When the solders 21A and 21B are melted, the region R A and region R B Due to the difference in surface tension between the molten solders 21A and 21B caused by the difference in dimensions, the molten solders 21A and 21B are in the region R A Area R B The molten solder 21A and 21B spreads even in the region R B The height of the molten solder 21A, 21B that has spread over the area R is sufficiently low. A In this manner, the desired electronic component mounting assembly 1 is obtained.

[0044] [Effects] As described above, in the electronic component mounting body 1 according to the first embodiment, the low wettability region 15R is a region R that extends to the opposing peripheral portions (specifically, the opposing two sides) of the connection portions 12A and 12B. D and region R D A region R protruding from the connecting portion 12A toward the high wettability region 14R and spaced apart from the opposing peripheral portions (specifically, the opposing two sides) of the connecting portions 12A and 12B. C As a result, (1) even if deviation occurs from the ideal laser processing position due to limitations in laser processing accuracy when forming the low-wettability region 15R by laser processing, the area of ​​the surface of the base body 11 that is processed can be reduced. Therefore, when applying the solder 21A, 21B such as solder paste, it is possible to prevent the solvent component containing flux from flowing out to the laser processing area due to capillary action. (2) In addition, even if deviation occurs in the application position of the solder 21A, 21B such as solder paste, the area R of the low-wettability region 15R can be reduced. CAs a result, most of the molten solder 21A and 21B is melted into the region R A (See FIGS. 5A to 5C and 6A to 6C.) This makes it possible to widen the tolerance for misalignment of the application positions of the solders 21A and 21B. Due to the above (1) and (2), it is possible to suppress deterioration of the soldering quality.

[0045] In addition, the region R of the low wettability region 15R C In the manufacturing process, the wetting and spreading of the molten solders 21A and 21B is suppressed, and the soldering area R according to the shape, size, etc. of the electronic component 20 is suppressed. A It is possible to supply an appropriate amount of solder to the solder joint 1. Therefore, a good fillet shape can be formed, and the impact resistance of the electronic component mounted body 1 can be improved. Therefore, the long-term reliability of the electronic component mounted body 1 can be improved.

[0046] In the case of only surface wiring, it is difficult to narrow the pitch of the connection terminals of the electronic components and to miniaturize the electronic components because the solder cannot be suppressed from spreading. In contrast, in the electronic component mounted body 1 according to the first embodiment, the low-wettability region 15R can regulate the position and amount of molten solder 21A, 21B, making it possible to narrow the pitch of the connection terminals 20A, 20B of the electronic component 20 and to miniaturize the electronic component 20. Therefore, the electronic component mounted body 1 can be highly dense.

[0047] <2. Second embodiment> [Configuration of electronic component assembly] Fig. 7A is a plan view showing an example of the configuration of electronic component mounting body 101 according to a second embodiment of the present disclosure. Fig. 7B is a plan view showing an example of the configuration of electronic component mounting substrate 110. Electronic component mounting body 101 differs from electronic component mounting body 1 according to the first embodiment in that electronic component mounting substrate 110 includes connection portions 112A and 112B instead of connection portions 12A and 12B.

[0048] The connection parts 112A and 112B have a high wettability region 14R and a pair of low wettability regions 15R. The widths of the connection parts 112A and 112B are wider than the widths of the conductor patterns 13A and 13B, respectively. This allows the spots of the laser light used to melt the solders 21A and 21B to be contained within the connection parts 112A and 112B. Therefore, when the solders 21A and 21B are locally heated by irradiating them with the laser light, it is possible to prevent the spots of the laser light from protruding from the connection parts 112A and 112B and directly irradiating the surface of the base body 11. This prevents the resin contained in the surface of the base body 11 from melting, which would cause a deterioration in the quality of the soldering.

[0049] 8 is a plan view showing an example of each region of the connection portion 112A. The connection portion 112A has protruding portions 112A1 and 112A2 protruding from both long sides of the conductor pattern 13B. Two low wettability regions 15R are provided in the protruding portions 112A1 and 112A2, respectively. The high wettability region 14R is provided between the two low wettability regions 15R. The two low wettability regions 15R face each other with the high wettability region 14R sandwiched therebetween. The connection portion 112B has each region similar to that of the connection portion 112A. In electronic component mounting body 101 having the above-mentioned configuration, connection terminals 20A, 20B of electronic component 20 are connected to connection portions 112A, 112B, respectively, as follows. That is, connection terminal 20A of electronic component 20 and solder 21A are arranged in high wettability region 14R of connection portion 112A, and connection terminal 20B of electronic component 20 and solder 21B are arranged in high wettability region 14R of connection portion 112B. Then, solders 21A, 21B are melted and solidified by irradiation with laser light.

[0050] [Effects] 9A is a plan view showing the configuration of electronic component mount 201 according to Reference Example 1. Electronic component mount 201 differs from electronic component mount 101 according to the second embodiment in that electronic component mount 201 includes electronic component mount substrate 210 in which connection portions 212A, 212B have substantially the same width as conductive patterns 13A, 13B, and connection portions 212A, 212B do not have two low-wettability regions 15R.

[0051] In the manufacturing process of electronic component mounting body 201 having the above-mentioned configuration, when solders 21A, 21B are heated by laser light, as shown in FIG. 9A, spot 220 of the laser light may extend beyond connection portions 112A, 112B, and the laser light may be directly irradiated onto the underlying resin, which may cause the resin contained in base body 11 to melt.

[0052] 9B is a plan view showing the configuration of electronic component mounted body 202 according to Reference Example 2. In electronic component mounted body 202, in order to suppress the above-mentioned resin melting, the sizes of connecting portions 212A and 212B are increased so that laser light spot 220 fits within connecting portions 212A and 212B. However, when the sizes of connecting portions 212A and 212B are increased in this manner, as shown in FIG. 9B, molten solder 21A and 21B wet and spread on connecting portions 212A and 212B, and electronic component 20 may rotate or move from a specified position, making soldering difficult.

[0053] In the electronic component mounting body 201 according to the second embodiment, the size of the connection parts 212A, 212B is increased by providing the protrusions 112A1, 112A2, and the pair of low wettability regions 15R face each other with the high / low wettability region 15R in between. This makes it possible to prevent the laser light spot 220 from protruding from the connection parts 112A, 112B, and to restrict the molten solders 21A, 21B from two sides in the manufacturing process. This makes it possible to prevent the deterioration of soldering quality due to resin melting, and to prevent the electronic component 20 from being displaced from the specified position.

[0054] <3. Third embodiment> [Configuration of electronic component assembly] Fig. 10A is a plan view showing an example of the configuration of an electronic component mounted body 301 according to a third embodiment of the present disclosure. Fig. 10B is a plan view showing an enlarged portion of Fig. 10A. Electronic component mounted body 301 includes electronic component mounting substrate 310, electronic component 320, and multiple solders 321. Note that in the third embodiment, the same parts as in the first embodiment are denoted by the same reference numerals, and description thereof will be omitted.

[0055] (Electronic Components) The electronic component 320 has a chip shape. The electronic component 320 includes a plurality of connection terminals 320A. Examples of the electronic component include, but are not limited to, an IC (Integrated Circuit), a CPU (Central Processing Unit), an image sensor, and the like. FIG. 10A shows an example in which the electronic component 320 is an IC.

[0056] (Solder) The solder 321 is similar to the solders 21A and 21B in the first embodiment.

[0057] (Substrate for electronic component mounting) Electronic component mounting substrate 310 differs from electronic component mounting substrate 10 according to the first embodiment in that electronic component 320 has a number of connection portions 12A corresponding to a number of connection terminals 320A.

[0058] [Effects] In electronic component mounting body 301 according to the third embodiment, electronic component mounting substrate 310 includes multiple connection terminals 320A having high wettability regions 14R and low wettability regions 15R. Therefore, it is possible to obtain the same effects as those of electronic component mounting body 1 according to the first embodiment.

[0059] <4 Variation> [Variation 1] In the above-mentioned second embodiment, the connection parts 112A and 112B have a pair of low-wettability regions 15R, and the pair of low-wettability regions 15R are regulated to sandwich the high-wettability region 14R from two sides, but the configuration of the connection parts 112A and 112B is not limited to this. For example, as shown in FIG. 11, the connection parts 112A and 112B may have one low-wettability region 17R having a U-shape, and the one low-wettability region 17R may be regulated to surround the high-wettability region 14R from three sides. Here, the U-shape refers to the shape of the connection parts 112A and 112B when viewed from a plane perpendicular to the surface of the electronic component mounting substrate 110.

[0060] Of the connection portion 112A, the peripheral portion on the side facing the connection portion 112B is open and not surrounded by the low-wettability region 17R. Similarly, of the connection portion 112B, the peripheral portion on the side facing the connection portion 112A is open and not surrounded by the low-wettability region 17R. The tip of the low-wettability region 17R of the connection portion 112A extends to the peripheral portion of the connection portion 112A on the side facing the connection portion 112B. Similarly, the tip of the low-wettability region 17R of the connection portion 112B extends to the peripheral portion of the connection portion 112B on the side facing the connection portion 112A.

[0061] In the electronic component mounting body 101 having the above-mentioned configuration, the molten solders 21A and 21B can be restricted from three sides in the manufacturing process, so that the solders 21A and 21B can be prevented from spreading onto the conductor patterns 13A and 13B, respectively. This allows the connection portions 112A and 112B to hold a specified amount of the solders 21A and 21B, so that a good fillet shape can be formed. This improves the impact resistance of the electronic component mounting body 101. This improves the long-term reliability of the electronic component mounting body 101. In addition, it is possible to prevent the electronic component 20 from being displaced in the arrangement direction of the connection portions 112A and 112B.

[0062] Alternatively, the connecting portions 112A and 112B may each have three low-wettability regions 15R, and these three low-wettability regions 15R may be regulated so as to surround the high-wettability region 14R from three sides.

[0063] [Variation 2] In the above-mentioned second embodiment, a case was described in which two low-wettability regions 15R are spaced apart in a direction perpendicular to the arrangement direction of the connection portions 112A, 112B, and a high-wettability region 14R is sandwiched between these two low-wettability regions 15R. However, it is also possible that two low-wettability regions 15R are spaced apart in the arrangement direction of the connection portions 112A, 112B, and a high-wettability region 14R is sandwiched between these two low-wettability regions 15R.

[0064] [Variation 3] In the above-described first to third embodiments, the region R D The case where the region R D The shape is not limited to this, and may be an arch shape, a V shape, a bent line shape, a meandering shape, a meandering shape, or the like.

[0065] <5 Application Examples> Any of the electronic component mounted bodies 1, 101, 301 according to the first to third embodiments and their modified examples may be provided in an electronic device. Examples of electronic devices that may include any of the electronic component mounted bodies 1, 101, 301 include, but are not limited to, personal computers, mobile devices, mobile phones, tablet computers, display devices, imaging devices, audio devices, game devices, medical devices, industrial instruments, and robots.

[0066] Although the embodiments and modifications of the present disclosure have been specifically described above, the present disclosure is not limited to the above-described embodiments and modifications, and various modifications based on the technical ideas of the present disclosure are possible.

[0067] For example, the configurations, methods, steps, shapes, materials, and values ​​described in the above-described embodiments and modified examples are merely examples, and different configurations, methods, steps, shapes, materials, and values ​​may be used as necessary.

[0068] The configurations, methods, steps, shapes, materials, and numerical values ​​of the above-described embodiments and modified examples can be combined with each other without departing from the spirit of this disclosure.

[0069] In the numerical ranges described in stages in the above-mentioned embodiments and modified examples, the upper limit or lower limit of a numerical range of a certain stage may be replaced with the upper limit or lower limit of a numerical range of another stage.

[0070] Unless otherwise specified, the materials exemplified in the above-mentioned embodiments and modifications may be used alone or in combination of two or more.

[0071] The present disclosure may also employ the following configuration. (1) A substrate; A connection portion provided on the base; an electronic component having a terminal connected to the connection portion; Solder for fixing the electronic component to the connection portion; Equipped with The connection portion is a first region to which the terminal is fixed by the solder; a second region having a lower wettability than the first region; having The second region is An extension region extending to a periphery of the connection portion; a separation region that protrudes from the extension region toward the first region and is spaced apart from the periphery; An electronic component assembly having the above structure. (2) The connection portion is a first metal layer; a second metal layer provided under the first metal layer and having a lower wettability than the first metal layer; Equipped with the first region is a region where a surface of the first metal layer is exposed, The electronic component mounting assembly according to (1), wherein the second region is a region where the surface of the second metal layer is exposed. (3) A pair of said connection parts is provided, The electronic component mounting assembly according to (1) or (2), wherein the first regions of the pair of connecting portions face each other. (4) The connection portion has a pair of the second regions, The electronic component mounting assembly according to any one of (1) to (3), wherein a pair of the second regions face each other with the first region therebetween. (5) The electronic component mounting assembly according to any one of (1) to (3), wherein the second region surrounds the first region on three sides. (6) The electronic component mounting body according to any one of (1) to (4), wherein the base is a resin molded body. (7) The electronic component mounting body according to any one of (1) to (6), wherein a laser processed region is provided adjacent to the extended region on the surface of the base. (8) The electronic component mounting assembly according to any one of (1) to (7), further comprising a conductor pattern extending from the connection portion. (9) An electronic device comprising an electronic component mounting assembly according to any one of (1) to (8). (10) A substrate; A connection portion provided on the base; Equipped with The connection portion is A first area; a second region having a lower wettability than the first region; having The second region is An extension region extending to a periphery of the connection portion; a separation region that protrudes from the extension region toward the first region and is spaced apart from the periphery; The electronic component mounting substrate has (11) removing a portion of a first metal layer by laser processing to expose a second metal layer having a lower wettability than the first metal layer, thereby forming a connection portion on a substrate, the connection portion having a first region where the first metal layer is exposed and a second region where the second metal layer is exposed; The second region is An extension region extending to a periphery of the connection portion; a separation region that protrudes from the extension region toward the first region and is spaced apart from the periphery; The method for manufacturing an electronic component assembly comprising the steps of: (12) The method for manufacturing an electronic component assembly according to (11), wherein when forming the extended region by the laser processing, processing is performed up to a position outside the first metal layer and the second metal layer. (13) The method for manufacturing an electronic component assembly according to (11) or (12), wherein the width of the extension region is approximately equal to the spot diameter of the laser light used in the laser processing. (14) The method for manufacturing an electronic component assembly according to any one of (1) to (13), further comprising arranging a connection terminal of an electronic component and solder in the first region, and melting the solder by irradiating with laser light. (15) The method for manufacturing an electronic component assembly according to claim 14, wherein the spot of the laser light used to melt the solder is contained within the connection portion. [Explanation of symbols]

[0072] 1, 101, 201, 301 Electronic component mounting board 10, 110, 210, 310 Electronic component mounting board 11 Board body 12A, 12B, 112A, 112B, 212A, 212B Connections 13A, 13B Conductor Pattern 14 Highly wettable metal layer (first conductive layer) 15 Low wettability metal layer (second conductive layer) 14R High wettability region (first region) 15R, 17R Low wettability region (second region) 16R1, 16R2 laser processing area 20, 320 Electronic Components 20A, 20B, 320 terminals 320A Terminal 21A, 21B, 321 solder 112A1, 112A2 protrusion

Claims

1. A substrate; a pair of connection parts provided on the substrate, the connection parts including a first metal layer and a second metal layer provided below the first metal layer and having a lower wettability than the first metal layer; an electronic component having a pair of terminals connected to the pair of connection portions; A pair of solders for fixing the pair of terminals of the electronic component to the pair of connecting portions; Equipped with The pair of connecting portions are a pair of first regions, which are regions where the surface of the first metal layer is exposed, and to which the pair of terminals are fixed by the pair of solders; a pair of second regions, which are regions where the surface of the second metal layer is exposed and have lower wettability than the first region; having The pair of second regions include A pair of extension regions extending to the periphery of the connection portion; a pair of spaced apart regions projecting from the extension region toward the first region and spaced apart from the periphery; having the pair of first regions are disposed inside the pair of second regions, The electronic component mounting structure in which the pair of spaced regions are disposed inside the pair of extended regions.

2. A substrate; A pair of connection parts provided on the base; an electronic component having a pair of terminals connected to the pair of connection portions; A pair of solders for fixing the pair of terminals of the electronic component to the pair of connecting portions; Equipped with The pair of connecting portions are a pair of first regions to which the pair of terminals are fixed by the pair of solders; a pair of second regions having a lower wettability than the first regions; having The pair of second regions include A pair of extension regions extending to the periphery of the connection portion; a pair of spaced apart regions projecting from the extension region toward the first region and spaced apart from the periphery; having the pair of first regions are disposed inside the pair of second regions, The pair of separation regions are disposed inside the pair of extension regions, The electronic component mounting structure has a laser processed region on the surface of the base, the laser processed region being adjacent to the extended region.

3. 3. The electronic component assembly according to claim 1, wherein the base is a resin molded body.

4. The electronic component assembly according to claim 1 , further comprising a conductor pattern extending from the connection portion.

5. An electronic device comprising the electronic component assembly according to claim 1 .

6. A substrate; a pair of connection parts provided on the substrate, the connection parts including a first metal layer and a second metal layer provided below the first metal layer and having a lower wettability than the first metal layer; Equipped with The pair of connecting portions are a pair of first regions which are regions where the surface of the first metal layer is exposed; a pair of second regions, which are regions where the surface of the second metal layer is exposed and have lower wettability than the first region; having The pair of second regions include A pair of extension regions extending to the periphery of the connection portion; a pair of spaced apart regions projecting from the extension region toward the first region and spaced apart from the periphery; having the pair of first regions are disposed inside the pair of second regions, The pair of spaced regions are disposed inside the pair of extended regions in an electronic component mounting substrate.

7. A substrate; A pair of connection parts provided on the base; Equipped with The pair of connecting portions are A pair of first regions; a pair of second regions having a lower wettability than the first regions; having The pair of second regions include A pair of extension regions extending to the periphery of the connection portion; a pair of spaced apart regions projecting from the extension region toward the first region and spaced apart from the periphery; having the pair of first regions are disposed inside the pair of second regions, The pair of separation regions are disposed inside the pair of extension regions, The substrate for mounting electronic components has a laser processing region on the surface of the substrate, the laser processing region being adjacent to the extended region.

8. removing a portion of a first metal layer by laser processing to expose a second metal layer having a lower wettability than the first metal layer, thereby forming a pair of connection parts on a substrate, the pair of connection parts having a pair of first regions where the first metal layer is exposed and a pair of second regions where the second metal layer is exposed; The pair of second regions include A pair of extension regions extending to the periphery of the connection portion; a pair of spaced apart regions projecting from the extension region toward the first region and spaced apart from the periphery; having the pair of first regions are disposed inside the pair of second regions, A method for manufacturing an electronic component assembly, wherein the pair of spaced regions are disposed inside the pair of extended regions.

9. The method for manufacturing an electronic component according to claim 8 , wherein when the extension region is formed by the laser processing, the processing is performed up to a position outside the first metal layer and the second metal layer.

10. 9. The method for manufacturing an electronic component assembly according to claim 8, wherein a width of the extension region is approximately equal to a spot diameter of the laser light used in the laser processing.

11. The method for manufacturing an electronic component assembly according to claim 8 , further comprising: arranging a pair of connection terminals of an electronic component and a pair of solders in the pair of first regions; and melting the pair of solders by irradiating the pair of solders with laser light.

12. The method for manufacturing an electronic component assembly according to claim 11 , wherein a spot of the laser light used to melt the solder is contained within the connection portion.

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