Processing apparatus and substrate transport method

Abstract

To provide a technique that can absorb and convey a warped substrate.SOLUTION: A processing device in one aspect of the present disclosure includes a pick that holds and conveys a substrate, a first absorption pad disposed at a position in the pick that is in contact with the substrate curved in a concave shape, a second absorption pad provided at a position in the pick that is in contact with the substrate curved in a convex shape, a pressure sensor that detects the pressure of a first suction path connected to the first absorption pad and the pressure of a second suction path connected to the second absorption pad, and a control unit that controls the suction operation by the first absorption pad and the second absorption pad on the basis of the detection value of the pressure sensor.SELECTED DRAWING: Figure 4

Description

[Technical field]

[0001] The present disclosure relates to a processing apparatus and a substrate transport method. [Background technology]

[0002] 2. Description of the Related Art There is known a probe apparatus that includes a wafer transfer mechanism capable of transferring a semiconductor wafer between a semiconductor wafer storage container and a mounting table for performing electrical measurements (see, for example, Patent Document 1). [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2013-197375 A Summary of the Invention [Problem to be solved by the invention]

[0004] The present disclosure provides a technique for adsorbing and transporting a warped substrate. [Means for solving the problem]

[0005] A processing apparatus according to one embodiment of the present disclosure includes a pick for holding and transporting a substrate, a first suction pad positioned at a position on the pick where it will contact a concavely curved substrate, a second suction pad provided at a position on the pick where it will contact a convexly curved substrate, a pressure sensor for detecting the pressure in a first suction path connected to the first suction pad and the pressure in a second suction path connected to the second suction pad, and a control unit for controlling suction operations by the first suction pad and the second suction pad based on the detection value of the pressure sensor. Effect of the Invention

[0006] According to the present disclosure, a warped substrate can be adsorbed and transported. [Brief description of the drawings]

[0007] [Figure 1] FIG. 1 is a front view showing an example of an inspection apparatus according to an embodiment; [Diagram 2] FIG. 1 is a top view showing an example of an inspection apparatus according to an embodiment; [Diagram 3] FIG. 1 shows an example of a loader unit. [Figure 4] Top view showing an example of a pick [Diagram 5] A cross-sectional view showing an example of a pick [Figure 6] 1 is a flowchart showing an example of a substrate transfer method according to an embodiment. [Figure 7] 1 is a flowchart showing an example of an inspection method according to an embodiment. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0008] Hereinafter, non-limiting exemplary embodiments of the present disclosure will be described with reference to the accompanying drawings. In all of the accompanying drawings, the same or corresponding members or parts are designated by the same or corresponding reference numerals, and duplicated descriptions will be omitted.

[0009] [Inspection equipment] An example of an inspection device according to an embodiment will be described with reference to Fig. 1 to Fig. 3. Fig. 1 is a front view showing an example of the inspection device according to an embodiment. Fig. 2 is a top view showing an example of the inspection device according to an embodiment. Fig. 3 is a diagram showing an example of a loader unit.

[0010] The inspection apparatus 1 includes a loader unit 10, an inspection unit 20, an equipment controller 30, etc. Under the control of the equipment controller 30, the inspection apparatus 1 transports a substrate W to be inspected from the loader unit 10 to the inspection unit 20, and inspects various electrical characteristics by applying electrical signals to a device under test (DUT) formed on the substrate W. The substrate W may be, for example, a rectangular substrate. An example of a rectangular substrate is a PLP (Panel Level Package). However, the substrate W may also be, for example, a circular substrate.

[0011] The loader section 10 includes a load port 11, an aligner 12, a substrate transport mechanism 13, and the like.

[0012] The load port 11 is provided on the front (−Y direction) side of the inspection apparatus 1. On the load port 11, a cassette C containing a substrate W is placed.

[0013] The aligner 12 is provided on the rear (+Y direction) side of the inspection apparatus 1. The aligner 12 positions the substrate W.

[0014] The substrate transport mechanism 13 transports the substrate W between the cassette C placed on the load port 11, the aligner 12, and a mounting table 21 described later. The substrate transport mechanism 13 includes picks 131 and 132, a rotation drive mechanism 133, a vertical drive mechanism 134, and the like.

[0015] The picks 131, 132 are provided in two stages, upper and lower. Each of the picks 131, 132 holds a substrate W. The picks 131, 132 are also called forks or end effectors.

[0016] The rotation drive mechanism 133 is provided below the picks 131 and 132, and rotates the picks 131 and 132. The rotation drive mechanism 133 includes, for example, a stepping motor.

[0017] The vertical drive mechanism 134 is provided below the rotation drive mechanism 133, and drives the picks 131, 132 and the rotation drive mechanism 133 vertically. The vertical drive mechanism 134 includes, for example, a stepping motor. Note that the substrate transport mechanism 13 is not limited to the form shown in Fig. 3, and may have, for example, a form including a multi-joint arm and a vertical drive mechanism.

[0018] The inspection unit 20 is disposed adjacent to the loader unit 10. The inspection unit 20 includes a mounting table 21, a lifting mechanism 22, an XY stage 23, a probe card 24, an alignment mechanism 25, and the like.

[0019] The mounting table 21 mounts and holds the substrate W. The mounting table 21 includes, for example, a vacuum chuck.

[0020] The lifting mechanism 22 is provided below the mounting table 21, and raises and lowers the mounting table 21 relative to the XY stage 23. The lifting mechanism 22 includes, for example, a stepping motor.

[0021] The XY stage 23 is provided below the lifting mechanism 22 and moves the mounting table 21 and the lifting mechanism 22 in two axial directions (X and Y directions in the figure). The XY stage 23 is fixed to the bottom of the inspection unit 20. The XY stage 23 includes, for example, a stepping motor.

[0022] The probe card 24 is disposed above the mounting table 21. A plurality of probes 24a are formed on the side of the probe card 24 facing the mounting table 21. The probe card 24 is detachably attached to a head plate 24b. A tester (not shown) is connected to the probe card 24 via a test head T.

[0023] The alignment mechanism 25 includes a camera 25a, a guide rail 25b, an alignment bridge 25c, and the like. The camera 25a is attached facing downward at the center of the alignment bridge 25c, and captures images of the mounting table 21, the substrate W, and the like. The camera 25a is, for example, a CCD camera or a CMOS camera. The guide rail 25b supports the alignment bridge 25c so that it can move in the horizontal direction (Y direction in the figure). The alignment bridge 25c is supported by a pair of left and right guide rails 25b, and moves in the horizontal direction (Y direction in the figure) along the guide rails 25b. As a result, the camera 25a moves between a standby position and directly below the center of the probe card 24 (hereinafter referred to as the "probe center") via the alignment bridge 25c. During alignment, the camera 25a located at the probe center captures images of the electrode pads of the substrate W on the mounting table 21 from above while the mounting table 21 moves in the XY directions, processes the images, and displays the captured images on the display device 40.

[0024] The equipment controller 30 is provided below the mounting table 21, and controls the overall operation of the inspection equipment 1. A CPU provided in the equipment controller 30 executes a desired inspection in accordance with product parameters stored in a memory such as a ROM or RAM. The desired inspection includes a substrate transport method, an inspection method, and the like, which will be described later. The product parameters may be stored in a semiconductor memory other than a hard disk, ROM, or RAM. The product parameters may be recorded on a computer-readable recording medium such as a CD-ROM or DVD, which is inserted at a predetermined position and read out.

[0025] 〔pick〕 An example of the pick 131 provided in the inspection device 1 of the embodiment will be described with reference to Figs. 4 and 5. Fig. 4 is a top view showing an example of the pick 131. Fig. 5 is a cross-sectional view showing an example of the pick 131, showing a cross-section taken along dashed line VV in Fig. 4. Fig. 5(a) shows the pick 131 holding a non-warped substrate W, Fig. 5(b) shows the pick 131 holding a concavely curved substrate W, and Fig. 5(c) shows the pick 131 holding a convexly curved substrate W. The pick 132 may have the same configuration as the pick 131.

[0026] The pick 131 is configured to be able to hold the substrate W. The tip side of the pick 131 has a substantially U-shape. On the upper surface of the pick 131, first suction pads 211a, 211b, second suction pads 221a, 221b, first support pads 231a, 231b, and second support pads 241a, 241b are provided. The first suction pads 211a, 211b and the second suction pads 221a, 221b hold the substrate W by vacuum suction. The first support pads 231a, 231b and the second support pads 241a, 241b support the substrate W without vacuum suction.

[0027] The first suction pads 211a and 211b are disposed at positions where they come into contact with the concavely curved substrate W. In this embodiment, the first suction pads 211a and 211b are disposed on the tip side of the pick 131 from the center O of the substrate W held by the pick 131. The first suction pads 211a and 211b are disposed on different tip sides of the approximately U-shaped pick 131. The first suction pad 211a is sucked through the first suction paths 212a and 212c. The first suction pad 211b is sucked through the first suction paths 212b and 212c. The first suction path 212c is provided with a first valve 213. The first valve 213 opens and closes the first suction path 212c based on a command from the device controller 30. When the first suction path 212c is opened by the first valve 213, suction by the first suction pads 211a and 211b is started. On the other hand, when the first suction path 212c is closed by the first valve 213, suction by the first suction pads 211a and 211b is stopped. The first valve 213 may be, for example, an electromagnetic valve. In addition, a first pressure sensor 214 is provided in the first suction path 212c. The first pressure sensor 214 detects the pressure of the first suction path 212c and transmits the detected value to the device controller 30.

[0028] The second suction pads 221a and 221b are disposed at positions where they come into contact with the convexly curved substrate W. In this embodiment, the second suction pads 221a and 221b are disposed closer to the base end side of the pick 131 than the center O of the substrate W held by the pick 131. The second suction pads 221a and 221b are provided at positions farther away from the center O of the substrate W than the first suction pads 211a and 211b. The second suction pad 221a is sucked through the second suction paths 222a and 222c. The second suction pad 221b is sucked through the second suction paths 222b and 222c. A second valve 223 is provided in the second suction path 222c. The second valve 223 opens and closes the second suction path 222c based on a command from the device controller 30. When the second suction path 222c is opened by the second valve 223, suction by the second suction pads 221a and 221b is started. On the other hand, when the second suction path 222c is closed by the second valve 223, suction by the second suction pads 221a and 221b is stopped. The second valve 223 may be, for example, an electromagnetic valve. In addition, a second pressure sensor 224 is provided in the second suction path 222c. The second pressure sensor 224 detects the pressure of the second suction path 222c and transmits the detected value to the device controller 30.

[0029] The first support pads 231a, 231b are disposed at positions to support the concavely curved substrate W. In this embodiment, the first support pads 231a, 231b are disposed closer to the base end of the pick 131 than the center O of the substrate W held by the pick 131. The first support pads 231a, 231b are disposed such that a distance L3 from the center O of the substrate W to the first support pads 231a, 231b in the forward / backward direction of the pick 131 is equal to a distance L1 from the center O of the substrate W to the first suction pads 211a, 211b. For example, the distances L1, L3 may be 75 mm.

[0030] The second support pads 241a and 241b are disposed at positions to support the convexly curved substrate W. In this embodiment, the second support pads 241a and 241b are disposed on the tip side of the pick 131 from the center O of the substrate W held by the pick 131. The second support pads 241a and 241b are disposed on different tip sides of the approximately U-shaped pick 131. The second support pads 241a and 241b are provided at positions farther away from the center O of the substrate W than the first support pads 231a and 231b. The second support pads 241a and 241b are disposed such that a distance L4 from the center O of the substrate W to the second support pads 241a and 241b in the forward and backward direction of the pick 131 is equal to a distance L2 from the center O of the substrate W to the second suction pads 221a and 221b. For example, the distances L2 and L4 may be 115 mm.

[0031] The pick 131 of the embodiment described above has the first suction pads 211a, 211b and the first support pads 231a, 231b arranged at positions where it contacts the concavely curved substrate W. The pick 131 also has the second suction pads 221a, 221b and the second support pads 241a, 241b arranged at positions where it contacts the convexly curved substrate W. This allows the pads to be separated for the concavely curved substrate W and the convexly curved substrate W. As a result, the height of the pads can be reduced. In addition, since the pads can be evenly arranged with respect to the center O of the substrate W, the inclination of the substrate W when the substrate W is held by the pick 131 can be suppressed. As a result, the restrictions on the area where the pick 131 is inserted and the area where the pick 131 moves can be reduced.

[0032] 4 and 5, the first suction pads 211a, 211b are disposed on the tip side of the pick 131 from the center O, and the second suction pads 221a, 221b are disposed on the base end side of the pick 131 from the center O. However, the positional relationship of the pads is not limited to this.

[0033] For example, the first suction pads 211a and 211b may be disposed closer to the base end of the pick 131 than the center O, and the second suction pads 221a and 221b may be disposed closer to the tip end of the pick 131 than the center O. In this case, the first support pads 231a and 231b are disposed closer to the tip end of the pick 131 than the center O, and the second support pads 241a and 241b are disposed closer to the base end of the pick 131 than the center O.

[0034] Also, for example, both the first suction pads 211a, 211b and the second suction pads 221a, 221b may be disposed closer to the base end of the pick 131 than the center O. In this case, both the first support pads 231a, 231b and the second support pads 241a, 241b are disposed closer to the tip end of the pick 131 than the center O.

[0035] Also, for example, both the first suction pads 211a, 211b and the second suction pads 221a, 221b may be disposed on the tip side of the pick 131 from the center O. In this case, both the first support pads 231a, 231b and the second support pads 241a, 241b are disposed on the base end side of the pick 131 from the center O.

[0036] In the example of FIG. 4 and FIG. 5, the case where two first suction pads 211a, 211b and two second suction pads 221a, 221b are arranged on the pick 131 has been described. However, the number of the first suction pads 211a, 211b and the second suction pads 221a, 221b is not limited to this. For example, four first suction pads and four second suction pads may be arranged on the pick 131. In this case, it is preferable to arrange two first suction pads and two second suction pads on the tip side of the pick 131 from the center O, and arrange the remaining two first suction pads and two second suction pads on the base end side of the pick 131 from the center O. In this case, the first support pads 231a, 231b and the second support pads 241a, 241b may not be arranged.

[0037] [Substrate transport method] An example of a method for transporting the substrate W by the above-mentioned substrate transport mechanism 13 will be described with reference to Fig. 6. Fig. 6 is a flow chart showing an example of a substrate transport method of an embodiment. Below, a case will be described in which the apparatus controller 30 controls the suction operation by the first suction pads 211a, 211b and the second suction pads 221a, 221b based on the detection values ​​of the first pressure sensor 214 and the second pressure sensor 224 to transport the substrate W by the pick 131. However, instead of the apparatus controller 30, another controller may be used. The same may be true in the case in which the substrate W is transported by the pick 132.

[0038] First, the equipment controller 30 controls the substrate transport mechanism 13 to hold the substrate W with the pick 131 (step S11).

[0039] Next, the apparatus controller 30 opens the first valve 213 and the second valve 223 to start suction by the first suction pads 211a, 211b and the second suction pads 221a, 221b (step S12).

[0040] Next, the apparatus controller 30 acquires the pressure in the first suction path 212c and the pressure in the second suction path 222c based on the detection values ​​of the first pressure sensor 214 and the second pressure sensor 224 (step S13).

[0041] Next, the device controller 30 judges whether or not there is a leak in the first suction pads 211a, 211b and the second suction pads 221a, 221b based on the pressure in the first suction path 212c and the pressure in the second suction path 222c acquired in step S13 (step S14). For example, when the pressure in the first suction path 212c is equal to or greater than the first threshold value and the pressure in the second suction path 222c is equal to or greater than the second threshold value, the device controller 30 judges that there is no leak in the first suction pads 211a, 211b and the second suction pads 221a, 221b. For example, when the pressure in the first suction path 212c is equal to or greater than the first threshold value and the pressure in the second suction path 222c is less than the second threshold value, the device controller 30 judges that there is no leak in the first suction pads 211a, 211b and that there is a leak in the second suction pads 221a, 221b. For example, when the pressure of the first suction path 212c is less than the first threshold and the pressure of the second suction path 222c is equal to or greater than the second threshold, the device controller 30 determines that the first suction pads 211a, 211b are leaking and that the second suction pads 221a, 221b are not leaking. For example, when the pressure of the first suction path 212c is less than the first threshold and the pressure of the second suction path 222c is less than the second threshold, the device controller 30 determines that the first suction pads 211a, 211b and the second suction pads 221a, 221b are leaking. The first threshold and the second threshold may be the same value or different values.

[0042] Next, the device controller 30 determines whether or not there is a leak in the first suction pads 211a, 211b based on the result of the determination in step S14 (step S15).

[0043] In step S15, when it is determined that there is no leakage from the first suction pads 211a, 211b, the device controller 30 determines whether or not there is leakage from the second suction pads 221a, 221b based on the result determined in step S14 (step S16). In step S16, when it is determined that there is no leakage from the second suction pads 221a, 221b, the device controller 30 controls the substrate transport mechanism 13 to start transporting the substrate W (step S22). At this time, the substrate W is suctioned and held by the first suction pads 211a, 211b and the second suction pads 221a, 221b, and is transported in a state supported by the first support pads 231a, 231b and the second support pads 241a, 241b. On the other hand, if it is determined in step S16 that there is a leak from the second suction pads 221a, 221b, the equipment controller 30 closes the second valve 223 to stop suction by the second suction pads 221a, 221b (step S17). After that, the equipment controller 30 controls the substrate transport mechanism 13 to start transporting the substrate W (step S22). At this time, the substrate W is suctioned and held by the first suction pads 211a, 211b, and is transported in a state in which it is supported by the first support pads 231a, 231b.

[0044] On the other hand, if it is determined in step S15 that there is a leak from the first suction pads 211a and 211b, the device controller 30 closes the first valve 213 to stop suction by the first suction pads 211a and 211b (step S18). After that, the device controller 30 determines whether or not there is a leak from the second suction pads 221a and 221b based on the result determined in step S14 (step S19). If it is determined in step S19 that there is no leak from the second suction pads 221a and 221b, the device controller 30 controls the substrate transport mechanism 13 to start transporting the substrate W (step S22). At this time, the substrate W is suctioned and held by the second suction pads 221a and 221b, and is transported in a state supported by the second support pads 241a and 241b. On the other hand, if it is determined in step S19 that there is a leak in the second suction pads 221a and 221b, the device controller 30 closes the second valve 223 to stop suction by the second suction pads 221a and 221b (step S20). After that, the device controller 30 issues an alarm (step S21) and ends the process.

[0045] According to the substrate transport method of the embodiment described above, the suction pads in contact with the substrate W and the suction pads not in contact with the substrate W are distinguished, and the substrate W is transported in a state in which the suction pads not in contact with the substrate W have stopped suction. This makes it possible to suppress leakage from the suction pads not in contact with the substrate W, thereby increasing the suction force of the suction pads in contact with the substrate W. As a result, even a substrate W that is not in contact with all the suction pads, for example a warped substrate W, can be transported while being sucked and held by the suction pads.

[0046] For example, when a concavely curved substrate W is transported, the substrate W can be transported in a state where it is adsorbed and held by the first suction pads 211a and 211b and supported by the first support pads 231a and 231b. For example, when a convexly curved substrate W is transported, the substrate W can be transported in a state where it is adsorbed and held by the second suction pads 221a and 221b and supported by the second support pads 241a and 241b. For example, when a substrate W without warping is transported, the substrate W can be adsorbed and held by the first suction pads 211a and 211b and the second suction pads 221a and 221b and supported by the first support pads 231a, 231b and the second support pads 241a and 241b. In addition, a substrate W with a small warp can be transported in the same manner as a substrate W without warping.

[0047] [Testing method] An example of an inspection method for inspecting the substrate W in the above-mentioned inspection apparatus 1 will be described with reference to Fig. 7. Fig. 7 is a flow chart showing an example of the inspection method according to the embodiment.

[0048] In step S1, the loader unit 10 positions the substrate W before inspection. In this embodiment, first, the equipment controller 30 controls the substrate transport mechanism 13 to transport the substrate W accommodated in the cassette C to the aligner 12. At this time, the substrate W is transported by the above-mentioned substrate transport method. Next, the equipment controller 30 controls the aligner 12 to position the substrate W.

[0049] In step S2, the uninspected substrate W positioned in step S1 is transported to the inspection unit 20. In this embodiment, the apparatus controller 30 controls the substrate transport mechanism 13 to transport the substrate W positioned by the aligner 12 to the inspection unit 20 and place it on the mounting table 21. At this time, the substrate W is transported by the substrate transport method described above.

[0050] In step S3, the inspection unit 20 inspects the substrate W. In this embodiment, the apparatus controller 30 controls the alignment mechanism 25 to align the electrode pads of the device to be inspected formed on the substrate W on the mounting table 21 with the multiple probes 24a of the probe card 24. Next, the apparatus controller 30 controls the lift mechanism 22 to raise the mounting table 21 and bring the multiple probes 24a of the probe card 24 into contact with the corresponding electrode pads. Next, the apparatus controller 30 applies a test signal from the tester to the device to be inspected formed on the substrate W via the test head T and the multiple probes 24a of the probe card 24, thereby inspecting the electrical characteristics of the device to be inspected. After the inspection of the electrical characteristics of the device to be inspected is completed, the apparatus controller 30 controls the lift mechanism 22 to lower the mounting table 21 and move the probes 24a away from the electrode pads.

[0051] In step S4, the post-inspection substrate W is positioned in the loader unit 10. The post-inspection substrate W can be positioned in the same manner as the pre-inspection substrate W in step S1.

[0052] In step S5, the inspected substrate W is stored in the cassette C. In this embodiment, the apparatus controller 30 controls the substrate transport mechanism 13 to transport the inspected substrate W positioned in the loader unit 10 to the cassette C and store it therein. At this time, the substrate W is transported by the substrate transport method described above.

[0053] According to the inspection method of the embodiment described above, when the substrate transport mechanism 13 transports the substrate W, the substrate W is transported by the substrate transport method of the embodiment described above. That is, the suction pads in contact with the substrate W and the suction pads not in contact with the substrate W are identified, and the substrate W is transported in a state in which the suction pads not in contact with the substrate W stop suction. This makes it possible to suppress leakage from the suction pads not in contact with the substrate W, and the suction force of the suction pads in contact with the substrate W is increased. As a result, even if the substrate W does not contact all the suction pads, for example, the substrate W having a warp, it can be transported in a state in which it is sucked and held by the suction pads. As a result, the substrate W having a warp can be inspected in the inspection device 1.

[0054] 7, the positioning of the substrate W before inspection (step S1) and the positioning of the substrate W after inspection (step S4) are described, but the present invention is not limited to this. For example, either the positioning of the substrate W before inspection (step S1) or the positioning of the substrate W after inspection (step S4) may be omitted.

[0055] In the above embodiment, the device controller 30 is an example of a control unit.

[0056] The embodiments disclosed herein should be considered to be illustrative and not restrictive in all respects. The above-described embodiments may be omitted, substituted, or modified in various forms without departing from the scope and spirit of the appended claims.

[0057] In the above embodiment, the inspection apparatus 1 has been described as an example, but the present disclosure is not limited thereto. Instead of the inspection apparatus 1, the present disclosure may be applied to other processing apparatuses such as a film forming apparatus that forms a film on the substrate W, and an etching apparatus that etches the film formed on the substrate W. [Explanation of symbols]

[0058] 1. Inspection equipment 30 Equipment Controller 131,132 picks 211a, 211b First suction pad 212a to 212c First suction path 214 First pressure sensor 221a, 221b Second suction pad 222a-222c Second suction path 224 Second Pressure Sensor W substrate

Claims

1. A pick that holds and transports the substrate; a first suction pad disposed at a position on the pick where the first suction pad comes into contact with the concavely curved substrate; a second suction pad provided on the pick at a position where the second suction pad comes into contact with the convexly curved substrate; a pressure sensor that detects a pressure in a first suction path connected to the first suction pad and a pressure in a second suction path connected to the second suction pad; a control unit that controls a suction operation by the first suction pad and the second suction pad based on a detection value of the pressure sensor; A processing device comprising:

2. the control unit stops suction by one of the first suction pad and the second suction pad based on the detection value of the pressure sensor. The processing device of claim 1 .

3. the second suction pad is disposed at a position farther from the center of the substrate than the first suction pad; The processing device according to claim 1 or 2.

4. the first suction pad is disposed closer to the tip of the pick than the center of the substrate; the second suction pad is disposed closer to the base end of the pick than the center of the substrate; The processing device according to any one of claims 1 to 3.

5. A first support pad provided on the pick for supporting a concavely curved substrate; a second support pad provided on the pick for supporting a convexly curved substrate; The processing apparatus of claim 1 , further comprising:

6. the first suction pad and the first support pad are disposed at positions equidistant from the center of the substrate; the second suction pad and the second support pad are disposed at positions equidistant from the center of the substrate; The processing device according to claim 5 .

7. The substrate has a rectangular shape. The processing device according to any one of claims 1 to 6.

8. a first valve that opens and closes the first suction path; a second valve that opens and closes the second suction path; Further comprising: the control unit stops suction by the first suction pad by closing the first valve, and stops suction by the second suction pad by closing the second valve. The processing device according to any one of claims 1 to 7.

9. A method for transporting a substrate using a pick provided with a first suction pad arranged at a position where it will come into contact with a concavely curved substrate and a second suction pad arranged at a position where it will come into contact with a convexly curved substrate, comprising: a suction operation of the first suction pad and the second suction pad is controlled based on a pressure of a suction path connected to the first suction pad and a pressure of a suction path connected to the second suction pad. A method for transporting substrates.

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