Method for manufacturing a circuit support for a vehicle floodlight with a predetermined number of components mounted thereon

Abstract

To provide a method for improving quality inspection of solder joint.SOLUTION: In an automotive floodlight circuit support attached with a prescribed number of components, a prescribed number of components 2', 2" have a prescribed number of pins 2a, the prescribed number of components 2', 2" are coupled to the automotive floodlight circuit support 1 through the prescribed number of pins 2a by fitting the prescribed number of pins 2a into a prescribed number of holes 1a formed in the automotive floodlight circuit support 1 corresponding to the prescribed number of pins 2a and soldering the pins in the prescribed number of holes 1a by solder joint 3. The automotive floodlight circuit support 1 is provided with a prescribed number of index surfaces 4 wettable by a molten solder material. A method for improving quality managing of the solder joint 3 performs providing the automotive floodlight circuit support 1, attaching the prescribed number of components 2', 2" to the automotive floodlight circuit support 1, and coupling the prescribed number of components 2', 2" to the automotive floodlight circuit support 1.SELECTED DRAWING: Figure 2

Description

[Technical field]

[0001] This application claims the benefit of Paris Convention priority from European Patent Application No. 22199521.0, filed October 4, 2022, the entire contents of which are incorporated herein by reference.

[0002] The present invention relates to a method for manufacturing a circuit support (circuit board) for an automotive floodlight having a predetermined number of components (which can be selected arbitrarily, for example, 1, 2, 3 or more, more than 10, more than 20, etc.) mounted thereon, the method comprising: The predetermined number of components (e.g., connectors (Stecker), coolers, electronic components (chips, ICs, capacitors, coils, resistors, etc.)) have a predetermined number of pins (e.g., one, two, or three or more per component), and the predetermined number of pins are fitted into a predetermined number of holes formed in the automobile floodlight circuit support corresponding to the predetermined number of pins, and the predetermined number of components are coupled to the automobile floodlight circuit support via the predetermined number of pins by being soldered in the predetermined number of holes; the vehicle floodlight circuit support is configured to provide a quality control of the solder joints by providing a number of indicator surfaces (also referred to as wetting indicators) that are wettable with molten solder material (e.g., at least one indicator surface per vehicle floodlight circuit support; any number of indicator surfaces may be provided, up to the number of holes); The method comprises the steps of: a) providing an automotive light projector circuit support, the automotive light projector circuit support having a first exterior surface and a second exterior surface facing the first exterior surface, the automotive light projector circuit support having a number of holes formed therethrough for receiving the number of pins of the number of components to be coupled, the holes extending from the first exterior surface through hole inlets directed toward the first exterior surface to hole outlets opening in the second exterior surface, at least a subset of the plurality of hole outlets being coupled to at least one respective indicator surface wettable with a molten solder material, thereby forming the number of indicator surfaces; b) mounting (attaching) a number of components to the vehicle floodlight circuit support, wherein the number of pins of the number of components are fitted into the number of corresponding holes according to step a); c) performing a soldering process to form solder joints to couple (mechanically, electrically and / or thermally) said number of components to said vehicle floodlight circuit support; Includes. [Background technology]

[0003] Circuit carriers used in motor vehicles are exposed to increased mechanical loads (as a result of vibrations during driving) as well as more violent environmental influences (e.g. strong humidity and temperature fluctuations). These increased loads must be withstood by the associated components and their solder joints. Particularly strict demands that the devices used must withstand are therefore applicable in the automotive sector. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] US 7 176 388 B2 Summary of the Invention [Problem to be solved by the invention]

[0005] It is known to use indicator surfaces wettable by solder material for checking the quality of solder joints. A difficulty in controlling the quality of solder joints is that an indicator surface has hitherto only been an indication of the wettability of the solder site in its immediate surroundings, since the solder material of the solder site surrounding the indicator surface was usually applied directly. For the quality of solder joints that are far from the indicator surface, only inaccurate results or indications could be given hitherto.

[0006] The object of the present invention is therefore to overcome this drawback. [Means for solving the problem]

[0007] According to a first aspect of the present invention, there is provided a method for manufacturing an automotive floodlight circuit support having a predetermined number of components mounted thereon, the method comprising the steps of: The predetermined number of components have a predetermined number of pins, and the predetermined number of pins are fitted into a predetermined number of holes formed in the vehicle floodlight circuit support corresponding to the predetermined number of pins, and the predetermined number of components are connected to the vehicle floodlight circuit support via the predetermined number of pins by being soldered in the predetermined number of holes; the automotive floodlight circuit support is configured to provide a quality control for the solder joints by providing a predetermined number of indexing surfaces wettable by molten solder material; The method comprises the steps of: a) providing an automotive light projector circuit support, the automotive light projector circuit support having a first exterior surface and a second exterior surface facing the first exterior surface, the automotive light projector circuit support having a number of holes formed therethrough for receiving the number of pins of the number of components to be coupled, the holes extending from the first exterior surface through hole inlets directed toward the first exterior surface to hole outlets opening in the second exterior surface, at least a subset of the plurality of hole outlets being coupled to at least one respective indicator surface wettable with a molten solder material, thereby forming the number of indicator surfaces; b) mounting (attaching) a number of components to the vehicle floodlight circuit support, wherein the number of pins of the number of components are fitted into the number of corresponding holes according to step a); c) performing a soldering process to form solder joints to couple said number of components to said automotive floodlight circuit support; Including, c1) for this purpose, the number of components are arranged so that in each hole through which a pin of the corresponding component is inserted, the molten solder material is sucked through the hole via the hole inlet and up to the hole outlet during the soldering process, and the number of indexing surfaces are in contact with the solder material emerging from the corresponding hole via the respectively assigned hole outlet, and the solder material present for the soldering process is supplied via the first outer surface of the vehicle floodlight circuit carrier. (Form 1) According to a second aspect of the present invention, there is provided an automotive floodlight circuit support comprising a number of components manufactured by the method of the present invention (see form 20 ). DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0008] Preferred embodiments of the present invention are described below. (Mode 1) See the first aspect of the present invention above. (Mode 2) In the method according to mode 1, The index surface, which is wettable by a solder material, is preferably configured as a copper surface, preferably bounded by a solder stop resin layer surrounding the index surface. (Mode 3) In the method according to mode 2, The index surface is preferably bounded by a solder-stop resin layer surrounding the index surface. (form 4 2. The method according to claim 1, Each indexing surface preferably has a ring portion bounded at the hole outlet and / or defined by a gap between the hole outlet and a fitted pin. (form 5 )form 4 In the method according to claim 1, Preferably, the predetermined number of index surfaces have linear extensions extending radially outwardly from the ring portion. (form 6 )form 5 In the method according to claim 1, At least four extensions are provided for each index surface; It is preferable that these extensions are distributed at regular intervals around the ring portion so that at least one cross is formed by imaginary connecting lines (multiple) of extensions located opposite each other and intersecting with the center point of the ring portion. (form 7 )form 5 In the method according to claim 1, each extension portion extends from said ring portion by a respective length; Each length is preferably from 10 μm to 6000 μm. (form 8 )form 5 In the method according to claim 1, each extension portion extends from said ring portion by a respective length; Preferably, the extensions assigned to the same ring portion have different lengths, and these lengths differ from each other by at least 20%. (form 9 )form 5 In the method according to claim 1, Each extension has a width of 0.1 mm to 0.7 mm. Toga preferable. (Mode 10) In the method according to Mode 9, Each ring preferably has a diameter of 0.8 mm to 2.5 mm and a thickness of 200 μm. (form 11 )form 5 In the method according to claim 1, the ring portion and / or the linear extension portion are inclined toward the hole outlet with respect to a plane oriented parallel to the second outer surface. Toga preferable. (Form 12) 12. The method of claim 11, The inclination angle measured with respect to the parallel oriented plane is preferably 10° to 60°. (form 13 2. The method according to claim 1, At least one subset of the hole outlets that are associated with the index surface , S Starting from a cylindrical hole, the hole is widened by transitioning in the direction towards the second outer surface to a conical or rounded peripheral surface, so that the opening angle measured between the boundary area of ​​the second outer surface and the hole outlet is less than 90°, respectively. or A maximum of 60° is preferred. (form 14 2. The method according to claim 1, After carrying out the soldering process according to step c1), the following steps: d) inspecting the solder joints by detecting said number of fiducials and producing an X-ray image, wherein a wetting state of said number of fiducials is taken into account for assessing the quality of said solder joints. is preferably carried out. (form 15 2. The method according to claim 1, After carrying out the soldering process according to step c), the following steps: d) inspecting the solder joints by detecting the number of index surfaces and creating an optical image, wherein a wetting state of the number of index surfaces is taken into account for evaluating the quality of the solder joints. is preferably carried out. (form 16 )form 14In the method according to claim 1, the examination according to step d) is carried out in an automated manner and a computer-aided algorithm is implemented for the evaluation of the images, Preferably, the wetness of the indicator surface is measured and compared with at least one threshold value. (form 17 )form 5 In the method according to claim 1, The wetness state of each extension portion is detected; the length of the longest extension is determined such that when an appropriate amount of solder material is selected, the extension is not completely wetted each time, and the length of the shortest extension is determined such that when an appropriate amount of solder material is selected, the extension is completely wetted each time; It is preferable that a signal is processed and outputted to increase the amount of solder material dispensed when the shortest extension is incompletely wetted, and to decrease the amount of solder material dispensed when the longest extension is completely wetted. (form 18 2. The method according to claim 1, Between steps a) and b), solder paste is applied to at least a predetermined number of through-holes formed in the vehicle floodlight circuit support; after mounting according to step b), said solder paste is penetrated by the respective pins; The soldering process according to step c) is preferably carried out by means of a reflow soldering method, in which the solder paste is melted so that solder material obtained from the melted solder paste is sucked through the respective hole inlets to the respective hole outlets. (form 19 2. The method according to claim 1, In step b), the second outer surface of the vehicle floodlight circuit support is provided with a predetermined number of components; The soldering process according to step c) is preferably carried out using a jet (wave) solder, in which the first external surface of the automotive floodlight circuit support is directed towards the solder jet to receive the solder material during the soldering process, so that the solder material is sucked through the respective hole inlets and into the respective hole outlets. (form 20 ) See the second aspect of the invention above.

[0009] The above-mentioned object is achieved by a method of the type listed at the beginning, in which step c) is comprised according to the invention by the feature c1), whereby a number of components are arranged such that in each hole through which a pin of the corresponding component is inserted, the molten solder material is sucked through the hole via the hole inlet and up to the hole outlet during the soldering process, and the index surface(s) of a number of index surfaces are brought into contact with the solder material emerging through the corresponding hole via the respectively assigned hole outlet, in particular so long as the amount of solder material deposited is sufficient to wet the index surfaces, and the solder material present for the soldering process is fed via a first outer surface of the automotive floodlight circuit carrier.

[0010] Since the indicator surface is therefore arranged on the side opposite to the side (of the automotive floodlight circuit carrier) on which the solder material is applied, inspection of the indicator surface makes it possible to draw conclusions about the quality of the entire solder joint. If the indicator surface is sufficiently wetted, this means that a sufficient amount of solder material has been applied to the hole and guided through the hole to the indicator surface. The spreading of the molten solder material inside the hole and onto the indicator surface can be promoted by the use of capillary forces, gravity and by a favorable surface wettability of the surface (for example when the surface to be wetted is formed of copper). When using reflow soldering methods ("pin in paste"), the solder material is already applied in the form of a solder paste before the application according to step b). In contrast, when using wave soldering methods (Wellenloeten), the solder material is only applied during the ongoing soldering process, i.e. after step b).

[0011] In particular, the indicator surface wettable with the solder material can be configured as a copper surface, which is preferably bounded by a solder stop resin layer surrounding the indicator surface. The copper surface is usually provided with a finish, i.e. a surface coating / surface treatment. This can be, for example, HAL (Hot Air Leveling), chemical coating with tin / silver / gold, galvanic coating, etc. Such surface-treated copper surfaces are also understood and referred to as "copper surfaces" in the present invention. The wettable surface is bounded by the solder stop resin or the wettable surface is simply bounded in the form of a wettable surface (free-etched copper structures are compatible with typical circuit board manufacturing processes). There are also solder stop resin-free configurations (arrangements) that do not overlap the wettable surface and therefore do not form a boundary.

[0012] Furthermore, each indicator surface may have a ring portion formed by a boundary at the hole exit and / or a gap occurring between the hole exit and the fitted pin. One criterion for the inspection may be a complete wetting of the ring portion.

[0013] In particular, a number of the indexing surfaces can have linear extensions extending radially outward from the ring, outward in this case meaning away from the ring center, thus simplifying inspection of the indexing surfaces, since the protruding extensions can be easily detected.

[0014] Furthermore, at least four extensions are provided for each indicator surface, which can be distributed at regular intervals around the ring so that at least one cross is formed by imaginary connecting lines of the extensions located opposite each other, intersecting with the center point of the ring. The use of extensions allows for an improved accuracy and / or simplification of the quality inspection of the solder parts. In particular, each extension can extend from the ring with a respective length, which can be between 10 μm and 6000 μm. Furthermore, each extension can extend from the ring with a respective length, and the extensions assigned to the same ring can have different lengths, which can differ from each other by at least 20%. This allows an actual amount of deposited solder material to be determined, which can be compared with, for example, a target amount and adapted. In particular, each extension has a width of 0.1 mm to 0.7 mm, each ring can advantageously have a diameter of 0.8 mm to 2.5 mm and a thickness (ring width) of 200 μm, the width being measured in a direction perpendicular to the length. The term "thickness (ring width)" is to be understood as the difference between the outer and inner radii (of the rings). The indicated range of dimensions has proven to be particularly advantageous.

[0015] Furthermore, the ring portion and / or the linear extension portion can be inclined towards the hole outlet with respect to a plane oriented parallel to the second outer surface, advantageously the inclination angle measured with respect to the parallel oriented plane being between 10° and 60°, thereby facilitating wetting of the index surface by the solder material, since the solder material can reach the index surface from the hole outlet at a flatter angle compared to an exclusively right angle transition.

[0016] In particular, at least one subset of the hole outlets which are connected to the indexing surface preferably starts from a cylindrical bore and is widened in the direction towards the second outer surface by transitioning to a conical or rounded circumferential surface (i.e. the transition to the circumferential surface is rounded (chamfered)), so that the opening angle measured between the boundary area of ​​the second outer surface and the hole outlet, respectively, can be less than 90°, preferably at most 60°. This facilitates wetting of the indexing surface by the solder material, since the solder material can reach the indexing surface at a more flat angle compared to an exclusively right-angled hole (bore).

[0017] Furthermore, after carrying out the soldering process according to step c1), the following steps can be carried out: d) Inspecting the solder joints by detecting a predetermined number of fiducials and producing an X-ray image, whereby the wetting state of the predetermined number of fiducials is taken into account for the evaluation of the quality of the solder joints.

[0018] In particular, after carrying out the soldering process according to step c), the following steps can be carried out: d) Inspection of the solder joints by detecting a certain number of index surfaces and generating an optical image, whereby the wetting state of the certain number of index surfaces is taken into account for the evaluation of the quality of the solder joints. In this case, for example, camera photography can be carried out. Furthermore, it is also possible in principle to combine this with X-ray photography. However, additionally or alternatively, manual visual inspection by an inspector is also possible.

[0019] Furthermore, the test according to step d) can be performed in an automated manner and a computer-aided algorithm can be implemented for the evaluation of the images, the wetness state of the indicator surface being measured and compared with at least one predefinable threshold value.

[0020] In particular, the wetting state of each extension is detected, the length of the longest extension is determined such that it is not completely wetted in each case when an appropriate amount of solder material is selected, and the length of the shortest extension is determined such that it is completely wetted in each case when an appropriate amount of solder material is selected, and if the wetting of the shortest extension is incomplete, a signal is output to increase the supply of solder material, and if the wetting of the longest extension is complete, a signal can be processed and output to decrease the supply of solder material. If the indicator surface is not sufficiently wetted, the supply of solder material is increased, for example by applying a larger amount of paste in the case of paste printing or by increasing the supply by jet solder. Thus, the amount of solder used in the method can be adapted repeatedly. Thus, if the method is carried out continuously, a suitable range of solder material quantities can be provided - slight deviations in the manufacture of the vehicle floodlight circuit carrier to which the component is attached can be compensated for in the manufacture of the next vehicle floodlight circuit carrier to which the component is attached. The degree of wetting of the remaining extensions can be taken into account for fine-tuning the suitable solder quantity. Advantageously, the increment of the quantity (of solder) (at one extension) can be 20% to 100% relative to the next larger extension. The supply of solder material can also be influenced by the manipulation of the soldering temperature and / or the duration of the soldering process. Thus, for example, the melting of the solder can also be manipulated via the temperature or temperature profile in the reflow oven. The composition of the solder also influences the flowability of the solder to the indicator surface.

[0021] Furthermore, between steps a) and b), solder paste is placed at least in a certain number of hole inlets formed through the vehicle floodlight circuit carrier, after the mounting according to step b), the solder paste is penetrated by the respective pins, and the soldering process according to step c) can be carried out by means of a reflow soldering method, in which the solder paste is melted so that the solder material obtained from this melted solder paste is sucked through the respective hole inlets to the respective hole outlets. A great advantage of this "pin in paste" technique is the situation that the components can be soldered via a reflow soldering process. Compared to other (alternative) processes, such as for example jet soldering, a further advantage is obtained in that the components are better held in their position after mounting and up to the soldering process by adhering to the solder paste.

[0022] Alternatively to this, in step b), the second outer surface of the vehicle floodlight circuit carrier is fitted with a number of components, and the soldering process according to step c) can be carried out by means of a jet soldering method, in which the first outer surface of the vehicle floodlight circuit carrier is directed towards a solder jet to receive the solder material during the soldering process, so that the solder material is sucked through the respective hole inlets and into the respective hole outlets. The indicator surfaces do not need to be in electrical operative contact with the further electrical surfaces (except the hole surfaces), but these surfaces are fully usable for further coupling with other conductive surfaces. The protruding indicator surfaces are advantageously arranged in such a way that they do not overlap the components when viewed perpendicularly to the circuit board surface, i.e. the perpendicular projection of the components onto the circuit board does not overlap the indicator surfaces. In so doing, it is also possible to use a meist selective soldering method in which the solder jet (wave) is restricted to locally specific locations on the circuit board which it is desired to wet with solder.

[0023] The invention further relates to a circuit carrier (circuit board) for a motor vehicle floodlight, comprising a number of components, manufactured according to the method of the invention. Unless expressly excluded, all structural features of the circuit carrier and components listed in the method may also be part (component) of the circuit carrier (and components).

[0024] The indicator surfaces can also be referred to as wettable outflow areas. Furthermore, the following aspects can also be configured: the indicator surfaces can extend sharply outwards or have rounded corners.

[0025] The invention is explained in more detail below using exemplary and non-limiting embodiments or examples which are specifically illustrated in the drawings. [Brief description of the drawings]

[0026] [Figure 1] (a): A plan view of the upper surface of an example of an automotive floodlight circuit support configured for (enabling) the method of the present invention; (b): A plan view of the lower surface of the automotive floodlight circuit support of FIG. 1(a). [Diagram 2] 1(a)-(c): Cross-sectional views of a portion of the circuit support of FIG. 1 (and 2) in different configurations for use in a reflow soldering process. [Diagram 3] FIG. 2 is a detailed view of an example of a solder joint. [Figure 4a] 13A-13C are cross-sectional views of an example of an automotive floodlight circuit support alternatively configured for use in a reflow solder process. [Figure 4b] FIG. 4(b) is a (cross-sectional) view of an example of a solder joint made in the circuit support of FIG. 4(a). [Diagram 5] (a): Plan view of the upper surface of a further example of an automotive floodlight circuit support configured for the method of the present invention (to enable the method of the present invention to be carried out) for the use of wave soldering methods; (b): Plan view of the underside of the circuit support of Figure 5(a). [Figure 6a]FIG. 6 is a cross-sectional view of the circuit support of FIGS. 5(a) and (b) in an example of a first state. [Figure 6b] FIG. 6 is a cross-sectional view of the circuit support of FIGS. 5(a) and (b) in an example of a second state. [Figure 6c] FIG. 6 is a cross-sectional view of the circuit support of FIGS. 5(a) and (b) in an example of a third state. [Figure 6d] FIG. 6 is a detailed cross-sectional view of the circuit support of FIGS. 5(a) and (b) in an example fourth state. [Figure 7a] 1 is a diagram (cross-section) of an example of an automotive floodlight circuit support alternatively configured for use with a wave soldering process; [Figure 7b] FIG. 7(b) is a detailed cross-sectional view of the circuit support of FIG. 7(a) in an exemplary second state. [Figure 8] (a)–(g): Examples of indicator surfaces and their wetting states. [Figure 9] (a)~(c): Examples of inclined portions (Abschraegungen) within the index surface. [Figure 10] (a), (b): Two examples of manufacturing of inclined sections. EXAMPLES

[0027] In the following figures, like drawing reference numbers represent like features unless otherwise specified.

[0028] Fig. 1(a) is a plan view of the upper surface 1', also referred to in this example as the first outer surface 1', of an example of an automobile floodlight circuit support (circuit board) 1 configured for the method of the present invention (to be able to carry out the method of the present invention). A certain number of components 2' and 2x are mounted (attached) to the support 1. The components 2x are configured as surface-mounted components. In contrast, the components 2' have pins 2a that connect the component 2' to the automobile floodlight circuit support 1, and this connection is made by fitting the pins 2a into a certain number of holes 1a formed in the automobile floodlight circuit support 1 corresponding to the pins 2a and soldering therein by solder joints 3 (see Fig. 2(c)).

[0029] FIG. 1(b) is a plan view of the underside, also referred to in this example as the second outer side 1″, of the vehicle floodlight circuit support 1 of FIG. 1(a).

[0030] 2(a)-(c) are cross-sectional views of a number of different configurations of a portion of the circuit support 1 of FIG. 1 (and 2) for use in a reflow soldering process. The automotive floodlight circuit support 1 is configured for quality control of the solder joint(s) 3 by providing a predetermined number of indexing surfaces 4 that are wettable by molten solder material, and the method of the invention comprises the following steps: a) providing an automotive floodlight circuit support 1, the automotive floodlight circuit support 1 having a first outer surface 1' and a second outer surface 1" facing the first outer surface 1', the automotive floodlight circuit support 1 having a number of holes 1a formed therethrough for receiving pins 2a of a number of components 2', 2" to be coupled thereto, the holes 1a extending from the first outer surface 1' through hole inlets 1a' directed towards the first outer surface 1' to hole outlets 1a" opening in the second outer surface 1", at least a subset of the plurality of hole outlets 1a" being coupled (connected) to at least one respective indicator surface 4 wettable by a molten solder material, thereby forming the number of indicator surfaces 4; b) mounting (attaching) a given number of parts 2', 2" on the motor vehicle floodlight circuit carrier 1, with the pins 2a of the parts 2 being fitted into the corresponding given number of holes 1a according to step a); c) Execution of a soldering process to form solder joints 3 for joining a predetermined number of components 2', 2" to the automotive floodlight circuit support 1 (see FIG. 2(c)).

[0031] The solder material 3' is present here in the form of a solder paste 3a which is subsequently melted to form a solder joint. In this example, a reflow soldering method is used. As can be clearly seen in FIG. 2(c), the component 2' is arranged and the solder material 3' present for the soldering process is supplied via the first outer surface 1' of the automotive floodlight circuit support 1 such that in each hole 1a through which a pin 2a of the component 2' is inserted, the molten solder material 3' is sucked through the hole 1a via the hole inlet 1a' and up to the hole outlet 1a" during the soldering process, and furthermore, the (one or more) indexing surfaces 4 of the predetermined number of indexing surfaces 4 come into contact with the solder material 3' emerging through the corresponding hole 1a via the respectively assigned hole outlet 1a" and thus wet the indexing surface 4. FIG. 2(a) shows an example of a state in which the support 1 is not yet provided with solder paste 3a. FIG. 2(b) shows an example of a state where the solder paste 3a has already been applied and the components 2x, 2' have been brought into position, but the melting of the paste 3a has not yet taken place. FIG. 2(c) shows an example of a final state where the paste 3a has melted and transformed into a solder joint 3 with a hardened solder material 3'. In other words, in this method, between steps a) and b), the solder paste 3a is applied at least to a certain number of hole inlets 1a' formed through the automotive floodlight circuit carrier 1, and after the mounting according to step b), the solder paste 3a is penetrated by the respective pins 2a, and the soldering process according to step c) is carried out by a reflow soldering method, in particular in such a way that the solder paste 3a is melted so that the solder material 3' resulting therefrom is sucked through the respective hole inlets 1a' to the respective hole outlets 1a".

[0032] FIG. 3 shows a detailed (side cross-sectional) view of a solder joint 3 formed in this way. The indicator surface 4 is in this case very well wetted by the solder material and has a ring 4a and extensions connected thereto, which are exemplarily indicated with the reference number 4b2. An example of a detailed view of an exemplary indicator surface can also be seen, for example, from FIG. 8a. The solder joint 3 according to FIG. 3 is continuous, free of inclusions and therefore of good quality. The solder material completely fills the hole 1a and spreads well through it to the indicator surface 4. The wetting of the indicator surface 4 according to FIG. 3 suggests (indicates) that the solder joint is very well formed.

[0033] Fig. 4a is a (side cross-sectional) view of an example of an alternatively configured automotive floodlight circuit carrier 1 for use in a reflow soldering process. Fig. 4b is a (side cross-sectional) view of an example of a solder joint 3 formed on the circuit carrier 1 according to Fig. 4a, which in this case has a smaller amount of solder material than in Fig. 3. Unlike in the embodiment according to Fig. 3, in the embodiment according to Figs. 4a and 4b, the ring part 4a and the rectilinear extensions (exemplary represented by extension 4b2) are inclined in the direction of the hole outlet 1a" with respect to a plane E oriented parallel to the second outer surface 1", the inclination angle α measured with respect to the parallel oriented plane being advantageously between 10° and 60°. Furthermore, as can be seen in Figures 4a and 4b, the hole outlet 1a" connected to the index surface 4 is preferably widened by starting from a cylindrical bore and transitioning in the direction towards the second outer surface 1" to a conical or rounded circumferential surface, so that the opening angle β measured between the boundary area of ​​the second outer surface 1" and the hole outlet 1a" is less than 90°, preferably at most 60°. In this example, the conically inclined circumferential surface of the hole outlet 1a" transitions directly into the ring portion 4a and the extensions, so that the angles α and β are coincident.

[0034] The indicator surface 4 wettable by the solder material 3 ′ may preferably be configured as a copper surface bounded by a solder stop resin layer surrounding said indicator surface 4 .

[0035] Fig. 5(a) is a plan view of the upper side of a further example of a motor vehicle floodlight circuit carrier (circuit board) 1 configured for the method of the invention (to be able to carry out the method of the invention) for use with wave soldering methods. Fig. 5(b) is a plan view of the underside of the circuit carrier 1 of Fig. 5(a). In step b), the second outer surface 1" of the motor vehicle floodlight circuit carrier 1 is fitted with components 2". Unlike the reflow soldering method described above, here the soldering process according to step c) is carried out by jet soldering, in particular such that the first external surface 1' of the automotive floodlight circuit support 1 is directed towards the solder jet in order to receive the solder material 3' during the soldering process, so that the solder material 3' is sucked through the respective hole inlets 1a' and into the respective hole outlets 1a". The solder jet used for this can also be locally restricted to selected areas of the circuit support 1. Thus, (as in the reflow soldering method) components can be arranged on both sides of the support 1.

[0036] Figures 6a to 6d are cross-sectional side views of the circuit carrier 1 according to Figures 5(a) and 5(b) in four successive states in time: Figure 6a shows the mounting process. FIG. 6b shows an example of a state in which components 2″ are placed on the circuit support 1. The pins 2a of these components in this case protrude completely through the holes 1a and can thus assist in the reception of the solder material of the solder bath (molten material). FIG. 6c shows how the support 1 is guided above the solder material 3′ in the form of a solder bath jet, and FIG. 6d shows an example of an instantaneous snapshot in time in which the solder material 3′ comes into contact with the pins 2a and is sucked along them through the hole 1a. The indicator surface 4 is present on the top surface of the support 1 in this example. Essentially, the indicator surface 4 is arranged on the surface that is opposite to the supply surface (supply side) on which the solder material 3′ is supplied. In this way, it is ensured that wetting of the indicator surface 4 indicates the progress (success) of the penetration of the hole 1a by the solder material 3′.

[0037] Figure 7a shows a view (side cross-section) of an example of an alternatively configured automotive floodlight circuit carrier 1 for use in a jet soldering method. In this embodiment, the jet soldering method is also used, but in contrast to Figures 6a to 6d, the hole 1a widens conically towards the index surface 4. This has already been explained with reference to Figures 4a and 4b.

[0038] Figure 7b is a detailed (side) cross-sectional view of the circuit carrier 1 according to Figure 7a in a second state in which the solder material 3' is sucked through the hole 1a, specifically from the hole inlet 1a' to the hole outlet 1a". The conical expansion allows the solder material 3' to reach the index surface 4 more easily, so that a higher precision (accuracy) can be achieved during inspection.

[0039] 8(a)-(g) show exemplary indexing surfaces 4 and their wetted states as well as the pins 2a received therein, respectively. Each indexing surface 4 may have a ring portion 4a, shown diagrammatically in dashed lines in FIG. 8(a), bounded at the hole outlet 1a″ and / or constituted by a gap occurring between the hole outlet 1a″ and the fitted pin 2a. The indexing surfaces 4 have linear extensions 4b1, 4b2, 4b3, 4b4 extending radially outward from the ring portion 4a. Here, the index surface 4 has exactly four extensions 4b1, 4b2, 4b3, 4b4, which are uniformly distributed (arranged) around the ring portion 4a, so that the virtual connecting lines (multiple) of the extensions 4b1, 4b2, 4b3, 4b4 located opposite each other form at least one cross shape intersecting with the center point of the ring portion 4a. Each extension 4b1, 4b2, 4b3, 4b4 extends from the ring portion 4a with a respective length l1, l2, l3, l4, each length being 10 μm to 6000 μm. The extensions 4b1, 4b2, 4b3, 4b4 have different lengths l1, l2, l3, l4, which differ from each other by at least 20%. In this way, the wetness state of the indicator surface can be detected with particular accuracy. Each of the extensions 4b1, 4b2, 4b3, 4b4 advantageously has a width b1, b2, b3, b4 of 0.1 mm to 0.7 mm, and each of the ring portions 4a advantageously has a diameter of 0.8 mm to 2.5 mm and a thickness (ring width) of 200 μm.

[0040] In FIG. 8(b) an example of a pin with a rectangular cross section is shown which is wetted to a small extent by the solder material 3'. However, the ring 4a, whose inner boundary is bounded exactly by the edge of the solder material 3', is not yet wetted. In FIG. 8(c) a larger amount of solder material 3' is already present, but the ring 4a is not yet completely wetted (although it is partially wetted). Only in FIG. 8(d) is the ring completely wetted, whereas the extensions are not yet wetted. FIG. 8(e) and FIG. 8(f) respectively represent an example of an ideal situation in which an ideal amount of solder material 3' passes through the hole 1a and the indicator surface 4 is wetted together with the extensions. In the case of FIG. 8(g) all the extensions are completely wetted and it can be deduced from this situation that the amount of solder material 3' can be reduced in order to avoid the formation of excesses and solder lumps.

[0041] Figures 9(a)-(c) show exemplary ramps within the indicator surfaces 4. These ramps are shown in the form of hatched surfaces. For example, ramps in the form of a (partial) cone shape can correspond only to the ring portion 4a (Figure 9(a)), only to the extension portion (Figure 9(b)) or only to the area of ​​the ring portion transitioning into the extension portion (Figure 9(c)).

[0042] Figures 10(a) and (b) show two examples of how the ramps or grooves can be formed, in particular by, for example, boring (see Figure 10(a)) or by, for example, a circular saw or milling cutter (see Figure 10(b)).

[0043] The invention allows the inspection of solder joints / joints. For this purpose, after the execution of a soldering process according to step c1), the following step is performed: d) inspection of the solder joints / joints 3 by detecting a predetermined number of fiducial surfaces 4 and producing X-ray images, with the wetting state of the fiducial surfaces 4 being taken into account for the assessment of the quality of the solder joints / joints 3. Complementarily or alternatively, after the execution of a soldering process according to step c), the following step is performed: d) inspection of the solder joints / joints 3 by detecting a predetermined number of fiducial surfaces 4 and producing optical images, with the wetting state of the fiducial surfaces 4 being taken into account for the assessment of the quality of the solder joints / joints 3.

[0044] The inspection according to step d) can be carried out in an automated manner, and for the evaluation of the images a computer-aided algorithm can be carried out, but the wetting state of the indicator surface can be measured and compared with at least one threshold value. Advantageously, the wetting state of each extension 4b1, 4b2, 4b3, 4b4 is detected, the length of the longest extension being determined such that, when selecting an appropriate amount of solder material 3', it is in each case not completely wetted, and the length of the shortest extension being determined such that, when selecting an appropriate amount of solder material 3', it is in each case completely wetted, and in the event of incomplete wetting of the shortest extension a signal is output to increase the supply of solder material 3' and in the event of complete wetting of the longest extension a signal is processed and output to decrease the supply of solder material 3'. If the indicator surface(s) are not sufficiently wetted, the supply of solder material is increased, for example by applying a larger amount of paste in the case of paste printing or by increasing the supply with a solder jet, and the subsequent repeated production can be adapted by the signal (mentioned above). Thus, if the method is carried out continuously, a suitable range of solder material quantities can be supplied - slight deviations in the production of the motor vehicle floodlight circuit carrier to which the component is to be attached can already be compensated for in the production of the next motor vehicle floodlight circuit carrier to which the component is to be attached. The degree of wetting of the remaining extensions can be taken into account for fine-tuning the suitable solder quantity.

[0045] The invention further relates to a motor vehicle floodlight circuit carrier 1 with a number of components 2 manufactured according to the method of the invention, and to a motor vehicle floodlight comprising the motor vehicle floodlight circuit carrier 1 of the invention. All the structural features of the circuit carrier 1 and the above-mentioned components mentioned in the method can be part of the circuit carrier 1 or of an apparatus directed to the circuit carrier 1.

[0046] The present invention is not limited to the illustrated embodiments, but is defined by the full scope of protection of the claims. Moreover, the individual aspects (or aspects) of the invention or embodiments can be adopted individually or in combination with each other. Possible drawing reference signs in the claims are exemplary and serve only to facilitate the readability of the claims, without limiting the claims.

[0047] The present invention can be described as follows: [Appendix 1] A method for manufacturing an automotive floodlight circuit support having a specified number of parts mounted thereon. The predetermined number of components have a predetermined number of pins. The predetermined number of pins are fitted into a predetermined number of holes formed in the automobile floodlight circuit support corresponding to the predetermined number of pins, and the predetermined number of components are connected to the automobile floodlight circuit support via the predetermined number of pins by being soldered in the predetermined number of holes. The automotive floodlight circuit support is configured to provide quality control for the solder joints by providing a predetermined number of indexing surfaces that are wettable by molten solder material. The method includes the following steps: a) providing an automotive floodlight circuit support, the automotive floodlight circuit support having a first exterior surface and a second exterior surface opposite the first exterior surface, the automotive floodlight circuit support having a number of holes formed therethrough for receiving the number of pins of the number of components to be coupled, the holes extending from the first exterior surface through hole inlets directed toward the first exterior surface to hole outlets opening in the second exterior surface, at least a subset of the plurality of hole outlets being coupled (connected) to at least one respective indicator surface wettable with molten solder material, thereby forming a number of indicator surfaces; b) mounting (attaching) a number of components to said vehicle floodlight circuit support, wherein said number of pins of said number of components are fitted into said number of corresponding holes according to step a). c) performing a soldering process to form solder joints to join said number of components and said automotive floodlight circuit support; c1) For this purpose, the number of components is arranged in such a way that in each hole through which a pin of a corresponding component is inserted, molten solder material is sucked through the hole via the hole inlet and up to the hole outlet during the soldering process, and the number of index surfaces is in contact with the solder material emerging through the corresponding hole via the respectively assigned hole outlet, and the solder material present for the soldering process is supplied via a first outer surface of the automotive floodlight circuit support. [Appendix 2] In the above method, particularly in the method described in appendix 1, The index surface which is wettable by a solder material is preferably configured as a copper surface bounded by a solder stop resin layer surrounding the index surface. [Appendix 3] In the above-mentioned method, particularly in the method according to appendix 1 or 2, Each indexing surface has a ring portion bounded at the hole exit and / or defined by a gap between the hole exit and a fitted pin. [Appendix 4] In the method described above, particularly in appendix 3, A predetermined number of the indexing surfaces have linear extensions extending radially outwardly from the ring portion. [Appendix 5] In the method described above, particularly in appendix 4, At least four extensions are provided for each index surface. These extensions are distributed at regular intervals around the ring portion so that imaginary connecting lines of the extensions positioned opposite each other form at least one cross shape that intersects with the center point of the ring portion. [Appendix 6] In the method described above, particularly in appendix 4 or 5, Each extension portion extends from the ring portion with a respective length. Each length is 10 μm to 6000 μm. [Appendix 7] In the above method, particularly in any one of appendices 4 to 6, Each extension portion extends from the ring portion with a respective length. The extensions that are assigned to the same ring portion have different lengths, and these lengths differ from each other by at least 20%. [Appendix 8] In the above method, particularly in any of appendices 4 to 7, Each extension has a width of 0.1 mm to 0.7 mm. Each ring advantageously has a diameter of between 0.8 mm and 2.5 mm and a thickness of 200 μm. [Appendix 9] In the above method, particularly in any one of appendices 4 to 8, The ring portion and / or the linear extension portion are inclined towards the hole exit with respect to a plane oriented parallel to the second outer surface. Advantageously, the tilt angle measured relative to said parallel oriented planes is between 10° and 60°. [Appendix 10] In the above method, particularly in any of appendices 1 to 9, At least one subset of the hole outlets which are connected to the index surface preferably starts from a cylindrical bore and is widened by transitioning in the direction towards the second outer surface to a conical or rounded peripheral surface, so that the opening angle measured between the second outer surface and the boundary area of ​​the hole outlet in each case is less than 90°, preferably at most 60°. [Appendix 11] In the above method, particularly in any one of appendices 1 to 10, After carrying out the soldering process according to step c1), the following steps are carried out: d) inspecting the solder joints by detecting said number of fiducial surfaces and producing an X-ray image, wherein a wetting state of said number of fiducial surfaces is taken into account for assessing the quality of said solder joints. [Appendix 12] In the above method, particularly in any of appendices 1 to 11, After carrying out the soldering process according to step c), the following steps are carried out: d) inspecting the solder joints by detecting said number of index surfaces and creating an optical image, wherein a wetting state of said number of index surfaces is taken into account for evaluating the quality of said solder joints. [Appendix 13] In the method described above, particularly as described in appendix 11 or 12, The examination according to step d) is carried out in an automated manner and for the evaluation of the images a computer-aided algorithm is implemented. The wetness of the indicator surface is measured and compared to at least one threshold value. [Appendix 14] In the method described above, in particular in Appendices 4 and 13 [Appendix 13 citing Appendices 4], The wetness state of each extension portion is detected; The length of the longest extension is determined such that when an appropriate amount of solder material is selected, the extension is not completely wet each time, and the length of the shortest extension is determined such that when an appropriate amount of solder material is selected, the extension is completely wet each time. If the shortest extension is incompletely wetted, a signal is output to increase the amount of solder material dispensed, and if the longest extension is completely wetted, a signal is processed and output to decrease the amount of solder material dispensed. [Appendix 15] In the above method, particularly in any one of appendices 1 to 14, Between steps a) and b), solder paste is applied to at least a predetermined number of hole inlets formed through the vehicle floodlight circuit carrier. After mounting according to step b), the solder paste is penetrated by the respective pins. The soldering process according to step c) is carried out by using a reflow soldering method, in which the solder paste is melted so that the solder material obtained from the melted solder paste is sucked through the respective hole inlets to the respective hole outlets. [Appendix 16] In the method according to any one of the above, particularly any one of appendices 1 to 14, In step b), the second exterior surface of the vehicle floodlight circuit support is populated with a number of components. The soldering process according to step c) is carried out using a jet solder, with the automotive floodlight circuit support first outer surface being directed towards the solder jet to receive the solder material during the soldering process, so that the solder material is sucked through the respective hole inlets and into the respective hole outlets. [Appendix 17] 17. An automotive floodlight circuit support including a predetermined number of components, manufactured by the method according to any one of claims 1 to 16.

[0048] Within the scope of the entire disclosure of the present invention (including the claims and drawings), modifications and adjustments of the embodiments are possible based on the basic technical ideas. Furthermore, within the scope of the entire disclosure of the present invention, various combinations or selections (including "non-selection") of various disclosed elements (including each element of each claim, each element of each embodiment, each element of each drawing, etc.) are possible. In other words, the present invention naturally includes various modifications and corrections that a person skilled in the art would be able to make in accordance with the entire disclosure including the claims and drawings and the technical ideas of the present invention. In particular, with regard to the numerical ranges described in this specification, any numerical value or subrange included in the range should be interpreted as being specifically described even if not otherwise specified.

[0049] Furthermore, the reference numerals in the drawings attached in the claims are intended solely to aid in the understanding of the invention, and are not intended to limit the invention to the embodiments and examples shown.

[0050] Furthermore, the entire contents of the above references are incorporated herein by reference. [Explanation of symbols]

[0051] 1. Circuit support (circuit board) for automobile floodlights (headlights, etc.) 1' 1st outer surface 1” 2nd outer surface 1a hole 1a' hole entrance 1a” hole exit 2a pin 3 Solder joint (part) 3' Solder material 3a solder paste 4 Indicator plane 4a Ring section 4b1, 4b2, 4b3, 4b4 extension

Claims

1. 1. A method for manufacturing an automotive floodlight circuit support having a predetermined number of components mounted thereon, comprising the steps of: The predetermined number of components (2', 2") have a predetermined number of pins (2a), and the predetermined number of pins (2a) are fitted into a predetermined number of holes (1a) formed in the automobile floodlight circuit support (1) corresponding to the predetermined number of pins (2a) and soldered by solder joints (3) within the predetermined number of holes (1a), thereby coupling the predetermined number of components (2', 2") to the automobile floodlight circuit support (1) via the predetermined number of pins (2a); said vehicle floodlight circuit support (1) being adapted for quality control of said solder joints (3) by providing a predetermined number of indexing surfaces (4) which are wettable by molten solder material; The method comprises the steps of: a) providing a vehicle floodlight circuit support (1), the vehicle floodlight circuit support (1) having a first outer surface (1') and a second outer surface (1") located opposite the first outer surface (1'), the vehicle floodlight circuit support (1) having a number of holes (1a) formed therethrough for receiving the number of pins (2a) of the number of components (2', 2") to be coupled, the holes (1a) extending from the first outer surface (1') via hole inlets (1a') directed towards the first outer surface (1') to hole outlets (1a") opening in the second outer surface (1"), at least a subset (Teilmenge) of the plurality of hole outlets (1a") being coupled to at least one respective indicator surface (4) wettable with a molten solder material, thereby forming a number of indicator surfaces (4); b) mounting a number of components (2', 2") on said vehicle floodlight circuit carrier (1), with said number of pins (2a) of said number of components (2) being fitted into said number of corresponding holes (1a) according to step a); c) carrying out a soldering process to form solder joints (3) for connecting said number of components (2', 2") to said vehicle floodlight circuit support (1); Including, c1) for this purpose, the number of components (2', 2") are arranged in such a way that in each hole (1a) through which a pin (2a) of a corresponding component (2') is inserted, the molten solder material (3') is sucked through the hole (1a) via the hole inlet (1a') and into the hole outlet (1a") during the soldering process, and the number of indexing surfaces (4) are in contact with the solder material (3') emerging from the corresponding hole (1a) via the hole outlet (1a") respectively assigned to them, and the solder material (3') present for the soldering process is supplied via the first outer surface (1') of the vehicle floodlight circuit carrier (1). A method comprising:

2. 10. The method of claim 1 , The indicator surface (4) which is wettable by the solder material (3') is configured as a copper surface. A method comprising:

3. In the method according to claim 2, The index surface (4) is bounded by a solder-stop resin layer surrounding the index surface (4). A method comprising:

4. 10. The method of claim 1 , Each index surface (4) has a ring portion (4a) bounded at the hole outlet (1a'') and / or bounded by the gap between the hole outlet (1a'') and the fitted pin (2a). A method comprising:

5. 5. The method of claim 4, The predetermined number of the index surfaces (4) have linear extensions (4b1, 4b2, 4b3, 4b4) extending radially outward from the ring portion (4a). A method comprising:

6. 6. The method of claim 5, At least four extensions (4b1, 4b2, 4b3, 4b4) are provided for each index surface (4); These extensions (4b1, 4b2, 4b3, 4b4) are distributed at regular intervals around the ring portion (4a) so that at least one cross shape intersecting with the center point of the ring portion (4a) is formed by imaginary connecting lines (plurality) of the extensions (4b1, 4b2, 4b3, 4b4) positioned opposite each other. A method comprising:

7. 6. The method of claim 5, Each of the extensions (4b1, 4b2, 4b3, 4b4) extends from the ring portion (4a) with a respective length (l1, l2, l3, l4); Each length is between 10μm and 6000μm A method comprising:

8. 6. The method of claim 5, Each of the extensions (4b1, 4b2, 4b3, 4b4) extends from the ring portion (4a) with a respective length (l1, l2, l3, l4); A plurality of extensions (4b1, 4b2, 4b3, 4b4) assigned to the same ring portion (4a) have different lengths (l1, l2, l3, l4), and these lengths differ from each other by at least 20%. A method comprising:

9. 6. The method of claim 5, Each of the extensions (4b1, 4b2, 4b3, 4b4) has a width (b1, b2, b3, b4) of 0.1 mm to 0.7 mm. A method comprising:

10. The method according to claim 9, Each ring portion (4a) has a diameter of 0.8 mm to 2.5 mm and a thickness of 200 μm. A method comprising:

11. 6. The method of claim 5, the ring portion (4a) and / or the linear extension portion are inclined toward the hole outlet (1a'') with respect to a plane (E) oriented parallel to the second outer surface (1''); A method comprising:

12. The method according to claim 11, The inclination angle (α) measured with respect to the parallel oriented plane (E) is between 10° and 60°. A method comprising:

13. 10. The method of claim 1 , At least one subset of the hole outlets (1a'') which are connected to the index surface (4) are widened by starting from a cylindrical bore and transitioning in the direction towards the second outer surface (1'') to a conical or rounded circumferential surface, so that the opening angle (β), measured between the boundary area of ​​the second outer surface (1'') and the hole outlets (1a''), respectively, is less than 90° or at most 60°. A method comprising:

14. 10. The method of claim 1 , After carrying out the soldering process according to step c1), the following steps: d) inspecting the solder joints (3) by detecting said number of indicator surfaces (4) and creating an X-ray image, wherein the wetting state of said number of indicator surfaces (4) is taken into account for the assessment of the quality of said solder joints (3). That is carried out A method comprising:

15. 10. The method of claim 1 , After carrying out the soldering process according to step c), the following steps: d) inspecting the solder joints (3) by detecting said number of indicator surfaces (4) and creating an optical image, wherein the wetting state of said number of indicator surfaces (4) is taken into account for the assessment of the quality of said solder joints (3). That is carried out A method comprising:

16. 15. The method of claim 14, the examination according to step d) is carried out in an automated manner and a computer-aided algorithm is implemented for the evaluation of the images, The wetness of the indicator surface is measured and compared to at least one threshold value. A method comprising:

17. 6. The method of claim 5, the examination according to step d) is carried out in an automated manner and a computer-aided algorithm is implemented for the evaluation of the images, a wetness state of the indicator surface is measured and compared with at least one threshold value; The wetness state of each extension portion (4b1, 4b2, 4b3, 4b4) is detected; the length of the longest extension is determined such that when an appropriate amount of solder material (3') is selected, the extension is not completely wet in each case, and the length of the shortest extension is determined such that when an appropriate amount of solder material (3') is selected, the extension is completely wet in each case; If the wetting of the shortest extension is incomplete, a signal is output to increase the supply of solder material (3'), and if the wetting of the longest extension is complete, a signal is processed and output to decrease the supply of solder material (3'). A method comprising:

18. 10. The method of claim 1 , Between steps a) and b), a solder paste (3a) is applied to at least a certain number of through-hole inlets (1a') formed in the vehicle floodlight circuit carrier (1); that, after mounting according to step b), said solder paste (3a) is penetrated by the respective pins (2a); The soldering process according to step c) is carried out by using a reflow soldering method, in which the solder paste (3a) is melted so that the solder material (3') obtained from the melted solder paste (3a) is sucked through the respective hole inlets (1a') to the respective hole outlets (1a''). A method comprising:

19. 10. The method of claim 1 , In step b), the second outer surface (1'') of the vehicle floodlight circuit support (1) is fitted with a predetermined number of components (2''); The soldering process according to step c) is carried out using a jet solder, in that the first external surface (1') of said automotive floodlight circuit carrier (1) is directed towards the solder jet to receive the solder material (3') during the soldering process, so that the solder material (3') is sucked through the respective hole inlets (1a') and into the respective hole outlets (1a''). A method comprising:

20. A motor vehicle floodlight circuit support comprising a number of components (2), manufactured according to the method of any one of the preceding claims.

Images