How to make a package board

Abstract

To reduce a time and a cost for processing, avoid a problem on abolishment of a component due to damages of an inner layer substrate in a processing step, and further reduce a cost due to a loss of the component.SOLUTION: The present invention discloses a package substrate and a manufacturing method of the same. The method contains steps of: providing an inner layer substrate; acquiring a first insulation dielectric layer that is processed on a surface on a first side of the inner layer substrate by using a viscosity photographic sensitive material and has viscosity; mounting the component on the first insulation dielectric layer; and acquiring a second insulation dielectric layer for coating the component by processing it on a first side of the inner layer substrate by using a photosensitive package material. In the package substrate and a manufacturing method of the same, disclosed by the present invention, the component is mounted onto the first side of the inner layer substrate; the second insulation dielectric layer that coats the component by processing it on the first side of the inner layer substrate by using the photosensitive package material is acquired; and the component is prevented from being installed into a cavity of the inner layer substrate.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present invention relates to the technical field of semiconductor packages, in particular to package substrates. Board It relates to the manufacturing method. [Background technology]

[0002] By embedding electronic components inside the package substrate, the current trend of electronic product development, high integration and miniaturization, is realized. The package substrate has a multi-layer structure, for example, a six-layer package substrate. At present, it is common to obtain a package substrate by embedding components into the cavity of the package substrate core plate, and then processing multiple build-up layers and package structures of the package substrate. In the actual production process, multiple build-up layers may be discarded due to unexpected causes, processes, etc., which will result in the components embedded in the core plate being discarded, and the cost of component loss will be high. In addition, the process flow of embedding components into the cavity of the core plate is complicated, so the processing time is long. Summary of the Invention [Problem to be solved by the invention]

[0003] The present invention is intended to solve at least one of the technical problems existing in the prior art. To this end, the present invention provides a method for manufacturing a package substrate, which can reduce the cost due to component loss.

[0004] The present invention further provides a package substrate manufactured by the above manufacturing method. [Means for solving the problem]

[0005] A method for manufacturing a package substrate according to one aspect of this embodiment includes the steps of providing an inner layer substrate, processing a first side surface of the inner layer substrate using a viscous photosensitive material to obtain a viscous first insulating dielectric layer, mounting a component on the first insulating dielectric layer, and processing a photosensitive packaging material on the first side of the inner layer substrate to obtain a second insulating dielectric layer covering the component.

[0006] The method for manufacturing a package substrate according to the embodiment of the present invention has at least the following beneficial effects: By mounting components on the basis of the inner layer substrate, there is no need to process cavities on the inner layer substrate for packaging components, which can easily reduce processing time and processing costs; and by avoiding the problem of components being scrapped due to damage to the inner layer substrate during processing, the cost of losing components can be reduced.

[0007] According to some embodiments of the present invention, the viscous photosensitive material is a viscous photosensitive film, and the process of using the viscous photosensitive material to process on the first side of the inner layer substrate to obtain a viscous first insulating dielectric layer includes a process of mounting the viscous photosensitive film on the first side of the inner layer substrate to obtain the first insulating dielectric layer; or the viscous photosensitive material is a viscous photosensitive liquid, and the process of using the viscous photosensitive material to process on the first side of the inner layer substrate to obtain a viscous first insulating dielectric layer includes a process of coating the viscous photosensitive liquid on the first side of the inner layer substrate to obtain the first insulating dielectric layer.

[0008] The above steps make it easy to obtain the first insulating dielectric layer, which is beneficial for mounting components, thereby reducing the processing time and processing cost, and reducing the cost due to component loss.

[0009] According to some embodiments of the present invention, the step of using a photosensitive packaging material to process on the first side of the inner layer substrate to obtain a second insulating dielectric layer includes the step of coating the photosensitive packaging material on the first side of the inner layer substrate to cover the components and obtain the second insulating dielectric layer, which makes it easy to process on the inner layer substrate to obtain a second insulating dielectric layer to cover the components, and the components are placed in the second insulating dielectric layer to easily package the components, which is favorable for miniaturization.

[0010] According to some embodiments of the present invention, a wiring layer having at least one connection point is provided on the inner layer substrate, an attachment area is provided on a first side of the inner layer substrate, and the first insulating dielectric layer is located within the attachment area, and the manufacturing method includes: The method further includes the steps of: processing the second insulating dielectric layer by exposure and development to obtain a first blind via; or processing the second insulating dielectric layer by exposure and development to obtain the first blind via and a second blind via, the position of the first blind via corresponds to the position of a connection terminal of the component, the position of the second blind via corresponds to the position of a connection point of the wiring layer, and both the first blind via and the second blind via penetrate the second insulating dielectric layer. The above steps can easily obtain a blind via with higher inner wall flatness, better verticality, and deeper depth, which can facilitate the connection between the subsequent wiring outer layer, wiring layer, and components, and is favorable for improving the conductive effect.

[0011] According to some embodiments of the present invention, a wiring layer having at least one connection point is provided on the inner layer substrate, and the manufacturing method further includes the steps of: processing on the second insulating dielectric layer by exposure and development to obtain a first blind via, or processing on the second insulating dielectric layer by exposure and development to obtain the first blind via and processing on the first insulating dielectric layer and the second insulating dielectric layer to obtain a second blind via, where the position of the first blind via corresponds to the position of the connection terminal of the component, the second blind via corresponds to the position of the connection point of the wiring layer, the first blind via penetrates the second insulating dielectric layer, and the second blind via penetrates the first insulating dielectric layer and the second insulating dielectric layer. The above steps can easily obtain a blind via with higher inner wall flatness, better verticality, and deeper depth, which facilitates the connection between the subsequent wiring outer layer, wiring layer, and components, and is favorable to improving the conductive effect.

[0012] According to some embodiments of the present invention, a wiring layer is provided on the inner layer substrate, and the manufacturing method further includes: processing on the second insulating dielectric layer by pattern transfer and pattern plating to obtain an outer layer wiring connected to the wiring layer and the components, or processing on the second insulating dielectric layer and on the second side of the inner layer substrate by pattern transfer and pattern plating to obtain the wiring layer and the outer layer wiring connected to the components. The above steps facilitate connecting the wiring layer of the inner layer substrate and the components mounted on the inner layer substrate to the outer layer wiring, respectively.

[0013] According to some embodiments of the present invention, the step of processing on the second insulating dielectric layer by pattern transfer and pattern plating to obtain the outer layer wiring connected to the wiring layer and the components includes the steps of processing on the second insulating dielectric layer to obtain a seed layer, and processing on the seed layer by a photosensitive shielding material to obtain the outer layer wiring connected to the wiring layer and the components, or the step of processing on the second insulating dielectric layer and on the second side of the inner layer substrate by pattern transfer and pattern plating to obtain the outer layer wiring connected to the wiring layer and the components includes the steps of processing on the second side of the inner layer substrate and on the second insulating dielectric layer to obtain the seed layer, and processing on the seed layer by a photosensitive shielding material to obtain the outer layer wiring connected to the wiring layer and the components. The above steps make it easy to process the outer layer wiring.

[0014] According to some embodiments of the present invention, the method further includes using a reinforcing medium material to process on the second side of the inner layer substrate and the second insulating dielectric layer to obtain a reinforcing dielectric layer covering the outer layer wiring, which is favorable to improving the rigidity of the package substrate and facilitating the use of the package substrate.

[0015] A package substrate according to another embodiment of the present invention is manufactured by the above-mentioned method for manufacturing a package substrate.

[0016] The package substrate according to the embodiment of the present invention has at least the following beneficial effects: The package substrate manufactured by the above-mentioned method for manufacturing a package substrate has a shorter processing time and a lower cost due to component loss, which is advantageous for reducing the production cost of the package substrate.

[0017] A package substrate according to another embodiment of the present invention includes an inner layer substrate, a component, and an insulating medium outer layer processed by a photosensitive material, the component and the insulating medium outer layer are both disposed on a first side of the inner layer substrate, and the component is located within the insulating medium outer layer.

[0018] The packaging substrate according to the embodiment of the present invention has at least the following beneficial effects: By packaging components based on the inner substrate, and locating the components in the outer layer of the insulating medium and on the first side of the inner substrate, it is advantageous to avoid the situation of components being scrapped due to damage to the inner substrate, and to reduce the cost of components being lost; and by avoiding the components being installed in the inner substrate, it is advantageous to reduce the processing difficulty, and to reduce the processing time and processing costs.

[0019] Additional aspects and advantages of the invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. The above and / or additional aspects and advantages of the present invention will become apparent and will be more easily understood from the following detailed description of the embodiments taken in conjunction with the accompanying drawings. [Brief description of the drawings]

[0020] [Figure 1] 4 is a flowchart of a method for fabricating a package substrate according to an embodiment of the present invention. [Diagram 2] 1A to 1C are schematic cross-sectional views of a package substrate corresponding to intermediate processes of a method for fabricating a package substrate according to an embodiment of the present invention. [Diagram 3] 1A to 1C are schematic cross-sectional views of a package substrate corresponding to intermediate processes of a method for fabricating a package substrate according to an embodiment of the present invention. [Figure 4] 1A to 1C are schematic cross-sectional views of a package substrate corresponding to intermediate processes of a method for fabricating a package substrate according to an embodiment of the present invention. [Diagram 5] 1A to 1C are schematic cross-sectional views of a package substrate corresponding to intermediate processes of a method for fabricating a package substrate according to an embodiment of the present invention. [Figure 6] 1A to 1C are schematic cross-sectional views of a package substrate corresponding to intermediate processes of a method for fabricating a package substrate according to an embodiment of the present invention. [Figure 7] 1A to 1C are schematic cross-sectional views of a package substrate corresponding to intermediate processes of a method for fabricating a package substrate according to an embodiment of the present invention. [Figure 8] 1A to 1C are schematic cross-sectional views of a package substrate corresponding to intermediate processes of a method for fabricating a package substrate according to an embodiment of the present invention. [Figure 9] 1A to 1C are schematic cross-sectional views of a package substrate corresponding to intermediate processes of a method for fabricating a package substrate according to an embodiment of the present invention. [Figure 10] 1A to 1C are schematic cross-sectional views of a package substrate corresponding to intermediate processes of a method for fabricating a package substrate according to an embodiment of the present invention. [Figure 11] 1A to 1C are schematic cross-sectional views of a package substrate corresponding to intermediate processes of a method for fabricating a package substrate according to an embodiment of the present invention. [Figure 12] 1A to 1C are schematic cross-sectional views of a package substrate corresponding to intermediate processes of a method for fabricating a package substrate according to an embodiment of the present invention. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0021] The following describes the embodiments of the present invention in detail, and the form of the embodiment is shown in the accompanying drawings. Here, the same or similar reference numerals throughout indicate the same or similar elements, or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are illustrative and are only used to interpret the present invention, and should not be understood as limiting the present invention.

[0022] In the description of the present invention, orientation descriptions such as up, down, front, back, left, right, and the like are orientations or positional relationships shown based on the drawings, and are intended to facilitate and simplify the present invention, and are not intended to indicate or imply that the devices or elements described necessarily have a specific orientation, or are constructed and operated in a specific orientation, and therefore should not be understood as limiting the present invention.

[0023] In the description of the present invention, some means one or more, multiple means two and more than two, greater than, less than, more than etc. are understood as not including the number, and greater than, less than, within etc. are understood as including the number. Where first and second are described, they are merely intended to distinguish technical features and should not be understood as indicating or implying a relative importance or the number of the indicated technical features or the context of the indicated technical features.

[0024] In the description of the present invention, unless otherwise clearly limited, the terms "installation," "mounting," "connection," etc. shall be understood in a broad sense, and those skilled in the art can reasonably determine the specific meaning of the above terms in the present invention by combining the specific content of the technical solutions.

[0025] The package substrate can provide functions such as electrical connection, protection, support, heat dissipation, assembly, etc. for the component 300, and can increase the number of pins, reduce the volume of the packaged product, improve the electrical properties and heat dissipation, and achieve the purpose of multi-chip modularization.

[0026] In the related art, the processing flow of a package substrate generally includes inner layer processing and outer layer processing. Here, the inner layer processing step includes processing the core plate of the package substrate to realize embedding the component 300 in the core plate. In some applications, the inner layer processing step further includes processing one or more build-up layers on the core plate, and the outer layer processing step includes processing the outer layer wiring based on the semi-finished product obtained by processing the inner layer. In the above processing flow, the build-up layer is processed after embedding the component 300, but because the embedding process flow of the component 300 is complicated and the build-up layer may fail to process or be accidentally damaged, the component 300 will be scrapped, and the cost of the loss of the component 300 will be relatively high.

[0027] Referring to FIG. 1, the method for manufacturing a package substrate according to the present invention includes steps S1000, S2000, S3000 and S4000.

[0028] Step S1000: An inner layer substrate 100 is provided.

[0029] Here, the inner layer substrate 100 may be a single-layer substrate, a double-sided substrate, a multi-layer substrate, etc., depending on the production materials. That is, when the inner layer substrate 100 is a single-layer substrate or a double-sided substrate, the semi-finished product on which the core plate processing is completed is the inner layer substrate 100, and when the inner layer substrate 100 is a multi-layer substrate, the semi-finished product on which the core plate and the build-up layer processing are completed is the inner layer substrate 100. For example, for a package substrate having a six-layer structure, a semi-finished product with a five-layer structure that has already been processed can be processed using the manufacturing method according to the present embodiment to obtain a package substrate having a six-layer structure, or for a package substrate having a two-layer structure, a semi-finished product with a one-layer structure that has already been processed can be processed using the manufacturing method according to the present embodiment to obtain a package substrate having a two-layer structure.

[0030] As described above, the embedded package of component 300 is performed in the process of inner layer processing in the related art, but in step S1000, it is performed after the inner layer processing is completed and before the outer layer processing is started. This reduces the number of processing steps after mounting of component 300 as much as possible, and reduces the probability of scrapping component 300 due to processing failure.

[0031] Step S2000: A viscous photosensitive material is used to process the first surface of the inner layer substrate 100 to obtain a viscous first insulating dielectric layer 200.

[0032] Step S3000: The component 300 is mounted on the first insulating dielectric layer 200.

[0033] Here, the component 300 is placed on the first side of the inner layer substrate 100 by using a viscous photosensitive material, which can reduce the complexity of the processing process and the processing time and processing cost compared to the method of placing the component 300 in the cavity of the core plate. The viscous photosensitive material is a material having a photosensitive property that can easily process a blind via with higher performance in the subsequent process. For example, the viscous photosensitive material may be an epoxy resin, which is a high molecular weight polymer. Due to the chemical activity of the epoxy group, it can be ring-opened by using a compound containing multiple types of active hydrogen, and cured and cross-linked to form a network structure. Therefore, the epoxy resin is a thermosetting resin, has excellent heat resistance and electrical insulation, and has high adhesion to metal.

[0034] Also, steps S2000 and S3000 are after step S1000 and before step S4000. That is, the processing of the inner layer substrate 100 is completed, and the second insulating dielectric layer 400 is not processed. For example, if the inner layer substrate 100 is a single-layer substrate or a double-sided substrate, the processing of the core plate must be completed first before performing steps S2000 and S3000, and the second insulating dielectric layer 400 is not processed. If the inner layer substrate 100 is a multi-layer substrate, the processing of the core plate and the build-up layer must be completed first before performing steps S2000 and S3000, and the second insulating dielectric layer 400 is not processed.

[0035] It should be noted that the component 300 may be an active device, such as an integrated chip, or a passive device, such as a patch resistor, a patch capacitor, etc.

[0036] Step S4000: Using a photosensitive packaging material to process on the first side of the inner layer substrate 100 to obtain a second insulating dielectric layer 400 covering the component 300.

[0037] Here, the second insulating dielectric layer 400 is used to package the component 300, thereby making full use of the wiring area of ​​the package substrate and facilitating miniaturization. Note that the photosensitive package material may be epoxy resin.

[0038] Through the above steps S1000 to S4000, the component 300 is mounted on the inner substrate 100 and processed to obtain the second insulating dielectric layer 400, completing the processing into the package substrate. In the above process, the processing flow for the component 300 is added later, and the component 300 is positioned in the second insulating dielectric layer 400, thereby avoiding the situation of discarding the component 300 due to damage to the core plate or build-up layer when processing the core plate or build-up layer in the inner substrate 100, thereby reducing the cost due to the loss of the component 300. In addition, by avoiding embedding the component 300 in the cavity of the core plate, it is advantageous to further reduce the complexity of the process and to reduce the processing time and processing cost.

[0039] 2 to 11, an embodiment of the present invention provides schematic cross-sectional views of a package substrate. The schematic cross-sectional views of the package substrate shown in FIG. 2 to FIG. 11 correspond to intermediate processes of a method for fabricating a package substrate according to an embodiment of the present invention.

[0040] Referring to FIG. 2, a wiring layer 110 is installed on an inner layer substrate 100 according to this embodiment, which facilitates the subsequent installation of an outer layer wiring 700 and a component 300 to establish an electrical connection with the inner layer substrate 100 .

[0041] 3 and 4, when a viscous photosensitive film is used as the viscous photosensitive material, the above step S2000 includes step S2100, and when a viscous photosensitive liquid is used as the viscous photosensitive material, the above step S2000 includes step S2200.

[0042] Step S2100: Mount a viscous photosensitive film on the first surface of the inner layer substrate 100 to obtain a first insulating dielectric layer 200.

[0043] Step S2200: Coat a viscous photosensitive liquid on the first surface of the inner layer substrate 100 to obtain a first insulating dielectric layer 200.

[0044] Here, the viscous photosensitive material has photosensitive properties and viscosity. When the viscous photosensitive material is liquid, it can be processed on the first side of the inner layer substrate 100 by coating to obtain the first insulating dielectric layer 200. When the viscous photosensitive material is solid, it can be processed on the first side of the inner layer substrate 100 by mounting to obtain the first insulating dielectric layer 200. The first insulating dielectric layer 200 has photosensitive properties and viscosity at the same time, which facilitates mounting of the component 300 and subsequently facilitates processing of higher performance blind vias. The first insulating dielectric layer 200 may completely cover the first side of the inner layer substrate 100, or may cover only the required position for mounting the component 300.

[0045] Referring to FIG. 5, the above step S4000 may include step S4100.

[0046] Step S4100: Coat a photosensitive packaging material on the first side of the innerlayer substrate 100 to cover the component 300 and obtain a second insulating dielectric layer 400.

[0047] Here, since the components 300 are mounted on the first side of the inner substrate 100, the surface of the first side of the inner substrate 100 is not flat. In this manner, a liquid photosensitive packaging material is coated on the first side of the inner substrate 100 to cover the components 300, thereby obtaining a second insulating dielectric layer 400. In addition, the photosensitive packaging material has photosensitive properties that allow a higher performance blind via to be easily fabricated on the basis of the second insulating dielectric layer 400 in the subsequent process.

[0048] In some embodiments, a wiring layer 110 having at least one connection point is provided on the inner layer substrate 100, an attachment area is provided on a first side of the inner layer substrate 100, and a first insulating dielectric layer 200 is located within the attachment area, and the above-mentioned method for manufacturing a package substrate further includes step S5100 or step S5200.

[0049] Step S5100: Obtain a first blind via 410 by processing on the second insulating dielectric layer 400 through exposure and development.

[0050] Step S5200: Obtain a first blind via 410 and a second blind via 420 by processing on the second insulating dielectric layer 400 through exposure and development.

[0051] Here, the position of the first blind via 410 corresponds to the position of the connection terminal of the component 300, the position of the second blind via 420 corresponds to the position of the connection point of the wiring layer 110, and both the first blind via 410 and the second blind via 420 penetrate the second insulating dielectric layer 400.

[0052] In this embodiment, referring to FIG. 6, a wiring layer 110 having at least one connection point is provided on an inner layer substrate 100, and the above-mentioned method for manufacturing a package substrate further includes step S5300 or step S5400.

[0053] Step S5300: Obtain a first blind via 410 by processing on the second insulating dielectric layer 400 through exposure and development.

[0054] Step S5400: through exposure and development, process on the second insulating dielectric layer 400 to obtain a first blind via 410, and process on the first insulating dielectric layer 200 and the second insulating dielectric layer 400 to obtain a second blind via 420.

[0055] Here, the position of the first blind via 410 corresponds to the position of the connection terminal of the component 300, the position of the second blind via 420 corresponds to the position of the connection point of the wiring layer 110, the first blind via 410 penetrates the second insulating dielectric layer 400, and the second blind via 420 penetrates the first insulating dielectric layer 200 and the second insulating dielectric layer 400.

[0056] Here, the first blind via 410 is used to enable the connection terminal of the component 300 to be electrically connected to the outside, and the second blind via 420 is used to enable the connection point of the wiring layer 110 to be electrically connected to the outside. For example, the external layer wiring 700 to be installed subsequently can be connected to the component 300 by the first blind via 410, and can be connected to the wiring layer 110 of the inner layer substrate 100 by the second blind via 420. In addition, the first blind via 410 and the second blind via 420 can be obtained by processing on the second insulating dielectric layer 400, or on the second insulating dielectric layer 400 and the first insulating dielectric layer 200, by exposure and development.

[0057] In addition, since the viscous photosensitive material and the photosensitive packaging material both have photosensitive properties, in step S5400, the second blind via 420 can more easily penetrate the second insulating dielectric layer 400 and the first insulating dielectric layer 200, which is advantageous for reducing the complexity of the processing process and reducing the processing time, and also for easily avoiding the situation where the second blind via 420 cannot penetrate the second insulating dielectric layer 400 and the first insulating dielectric layer 200, which is advantageous for improving the yield rate.

[0058] The position of the first blind via 410 corresponds to a connection terminal of the component 300, i.e., allows the connection terminal of the component 300 to be connected to an outer layer wiring 700 to be subsequently processed by the first blind via 410. The position of the second blind via 420 corresponds to a connection point of the wiring layer 110, i.e., allows the wiring layer 110 to be connected to an outer layer wiring 700 to be subsequently processed by the second blind via 420.

[0059] 7 to 10, a wiring layer 110 is provided on an inner layer substrate 100, and the method for manufacturing a package substrate further includes step S6100 or step S6200.

[0060] Step S6100: By pattern transfer and pattern plating, processing is performed on the second insulating dielectric layer 400 to obtain the wiring layer 110 and the outer layer wiring 700 to be connected to the components 300.

[0061] Step S6200: By pattern transfer and pattern plating, the second insulating dielectric layer 400 and the second side of the inner layer substrate 100 are processed to obtain the wiring layer 110 and the outer layer wiring 700 connected to the component 300.

[0062] Here, the outer layer wiring 700 is used to establish an electrical connection between the wiring layer 110 of the inner layer substrate 100 and the component 300, thereby enabling the wiring layer 110 and the component 300 to easily transmit signals to the outside.

[0063] Specifically, the above step S6100 may include step S6110 and step S6120.

[0064] Step S6110: Obtain a seed layer 500 by processing on the second insulating dielectric layer 400.

[0065] Step S6120: A photosensitive shielding material is processed on the seed layer 500 to obtain the wiring layer 110 and the outer layer wiring 700 connected to the component 300.

[0066] The above step S6200 may include step S6210 and step S6220.

[0067] Step S6210: Obtain a seed layer 500 by processing on the second side of the innerlayer substrate 100 and the second insulating dielectric layer 400.

[0068] Step S6220: A photosensitive shielding material is processed on the seed layer 500 to obtain the wiring layer 110 and the outer layer wiring 700 connected to the component 300.

[0069] Here, the seed layer 500 can improve the bonding strength between the second insulating dielectric layer 400 and the outer wiring 700 as a plating base, and can improve the bonding strength between the inner layer substrate 100 and the outer wiring 700, so that the outer wiring 700 with a tighter connection with the component 300 and the wiring layer 110 can be easily obtained by processing on the seed layer 500. Referring to FIG. 7, the seed layer 500 is obtained on the second side of the inner layer substrate 100 and the second insulating dielectric layer 400. Referring to FIG. 8, the pattern layer 600 having the first pattern 610 is formed on the seed layer 500 by image transfer. Referring to FIG. 9, the outer wiring 700 is obtained by processing on the first pattern 610 by plating. Referring to FIG. 10, the pattern layer 600 and a part of the seed layer 500 are removed by using processes such as film removal and etching.

[0070] Referring to FIG. 11, the above-mentioned method for manufacturing a package substrate may further include step S7000.

[0071] Step S7000: Using a reinforcing medium material, process the reinforcing medium material on the second side of the inner layer substrate 100 and the second insulating dielectric layer 400 to obtain a reinforcing dielectric layer 800 covering the outer layer wiring 700.

[0072] Here, the reinforcing dielectric layer 800 is processed by a reinforcing medium material. The reinforcing medium material can be a glass fiber medium material, which is an inorganic non-metallic material having advantages such as light weight, high strength, high temperature resistance, corrosion resistance, heat insulation, sound absorption, and electrical insulation. The reinforcing dielectric layer 800 processed by the reinforcing medium material can increase the rigidity of the package substrate and facilitate the protection of the package substrate.

[0073] 12, after step S7000, the outer wiring 700 is covered under the reinforcing dielectric layer 800. In order to provide the package substrate with a corresponding function, the reinforcing dielectric layer 800 can be processed to obtain a conductive hole 900, and the surface wiring layer 1000 can be processed on the surface of the reinforcing dielectric layer 800 to obtain a surface wiring layer 1000, so that the surface wiring layer 1000 can establish an electrical connection with the outer wiring 700 through the conductive hole 900, so that the external electric circuit can establish an electrical connection with the component 300 in the package substrate through the surface wiring layer 1000. After the processing of the surface wiring layer 1000 is completed, the surface of the reinforcing dielectric layer 800 can be surface-treated, and the processing into the package substrate can be completed. For example, a liquid photo solder resistor can be coated on the surface of the reinforcing dielectric layer 800 to cover the surface wiring layer 1000, and a protective layer 1100 can be obtained.

[0074] 5 or 11, the present embodiment further provides a package substrate manufactured by the above-mentioned method for manufacturing a package substrate, where the package substrate manufactured by the above-mentioned method for manufacturing a package substrate has a shorter processing time and a lower cost due to loss of components 300, which is advantageous for reducing the production cost of the package substrate.

[0075] Referring to FIG. 5, a package substrate according to another aspect of this embodiment includes an inner layer substrate 100, a component 300, and an insulating medium outer layer processed by a photosensitive material, where the component 300 and the insulating medium outer layer are both installed on a first side of the inner layer substrate 100, and the component 300 is located within the insulating medium outer layer.

[0076] Here, the insulating medium outer layer includes a first insulating dielectric layer 200 and a second insulating dielectric layer 400 that can be processed using the same photosensitive material, for example, epoxy resin. The component 300 is packaged based on the inner layer substrate 100, and the component 300 is located in the insulating medium outer layer and on the first side of the inner layer substrate 100, which is advantageous in avoiding the waste of the component 300 due to the damage of the inner layer substrate 100 and reducing the cost due to the loss of the component 300. In addition, the component 300 is avoided from being installed in the inner layer substrate 100, which is advantageous in reducing the processing difficulty and the processing time and processing cost. The package substrate of this embodiment may be processed by the above-mentioned method for manufacturing the package substrate, and the contents not mentioned here may refer to the above, and will not be mentioned here to avoid duplication.

[0077] Although the embodiment of the present invention has been described in detail above with reference to the attached drawings, the present invention is not limited to the above embodiment, and various modifications are possible within the scope of knowledge of those skilled in the art without departing from the purpose of the present invention. [Explanation of symbols]

[0078] 100 Inner layer board 110 wiring layer 200 First insulating dielectric layer 300 parts 400 Second insulating dielectric layer 410 First blind via 420 2nd blind via 500 seed layer 600 pattern layers 610 First Pattern 700 Outer layer wiring 800 Reinforced dielectric layer 900 Through hole 1000 surface wiring layer 1100 protective layer

Claims

1. A step of providing an inner layer substrate having a first side surface, the inner layer substrate having a wiring layer on which at least one connection point is provided, the wiring layer being provided on the first side surface; using a viscous photosensitive material to process the first side of the inner layer substrate to obtain a viscous first insulating dielectric layer; mounting a component on the first insulating dielectric layer; using a photosensitive packaging material to process on the first side of the inner layer substrate to obtain a second insulating dielectric layer covering the components; and processing the second insulating dielectric layer to obtain a first blind via by exposure and development, and processing the first insulating dielectric layer and the second insulating dielectric layer to obtain a second blind via; a position of the first blind via corresponds to a position of a connection terminal of the component, the second blind via corresponds to a position of the connection point of the wiring layer, the first blind via penetrates the second insulating dielectric layer, and the second blind via penetrates the first insulating dielectric layer and the second insulating dielectric layer; A method for manufacturing a package substrate comprising the steps of:

2. The viscous photosensitive material is a viscous photosensitive film, and the step of obtaining a viscous first insulating dielectric layer by processing the viscous photosensitive material on the first side of the inner layer substrate includes: mounting the viscous photosensitive film on a first surface of the inner layer substrate to obtain the first insulating dielectric layer; Or, The viscous photosensitive material is a viscous photosensitive liquid, and the step of obtaining a viscous first insulating dielectric layer by processing the viscous photosensitive material on the first side of the inner layer substrate includes: coating the viscous photosensitive liquid onto a first side surface of the inner layer substrate to obtain the first insulating dielectric layer; 2. The method for manufacturing a package substrate according to claim 1.

3. The step of obtaining a second insulating dielectric layer on the first side of the inner layer substrate by processing a photosensitive packaging material is described as follows: coating the photosensitive packaging material onto a first side of the innerlayer substrate to cover the components and obtain the second insulating dielectric layer; 2. The method for manufacturing a package substrate according to claim 1.

4. The manufacturing method comprises: A process of processing on the second insulating dielectric layer by pattern transfer and pattern plating to obtain the wiring layer and outer layer wiring connected to the components; Or, and processing the second insulating dielectric layer and the second side of the inner layer substrate by pattern transfer and pattern plating to obtain the wiring layer and the outer layer wiring connected to the components.

2. The method for manufacturing a package substrate according to claim 1.

5. The step of obtaining an outer layer wiring connected to the wiring layer and the components by processing on the second insulating dielectric layer through pattern transfer and pattern plating, processing on the second insulating dielectric layer to obtain a seed layer; A step of processing the seed layer with a photosensitive shielding material to obtain the wiring layer and the outer layer wiring connected to the component; Or, The step of processing the second insulating dielectric layer and the second side of the inner layer substrate by pattern transfer and pattern plating to obtain the wiring layer and the outer layer wiring connected to the components, processing on a second side of the innerlayer substrate and on the second insulating dielectric layer to obtain the seed layer; and processing the seed layer with a photosensitive shielding material to obtain the wiring layer and the outer layer wiring connected to the component.

5. The method for manufacturing a package substrate according to claim 4.

6. The method further includes using a reinforcing medium material to process on the second side of the inner layer substrate and the second insulating dielectric layer to obtain a reinforcing dielectric layer covering the outer layer wiring.

6. The method for manufacturing a package substrate according to claim 4 or 5.

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