OPTOELECTRONIC FUNCTIONAL MULTILAYER STRUCTURE AND METHOD FOR PRODUCING OPTOELECTRONIC FUNCTIONAL MULTILAYER STRUCTURE - Patent application

Abstract

To provide an optoelectronically functional multilayer structure and a method for manufacturing the optoelectronically functional multilayer structure.SOLUTION: A method for manufacturing an optoelectronically functional multilayer structure includes a fourth step (1310) of producing an optically transmissive layer (103) on a first side of a substrate film (108), so that i) light-defining segments (112) including several optically functional elements (106) are at least partially embedded in and optically coupled to the optically transmissive layer (103) establishing at least partially the internals of structural channels (110), and ii) a light-blocking layer (104) is secured with the optically transmissive layer (103) to position several optically functional elements (106) in respective light-defining segments (112) to the light-blocking layer (104), the light-blocking layer (104) at least partially optically isolating the light-defining segments (112) from each other.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] FIELD OF THEINVENTION The present invention relates generally to electronics and related devices, structures and methods of manufacture. Specifically, but not exclusively, the present invention relates to multi-layer assemblies having illumination portions that are discernible in an environment. [Background technology]

[0002] Generally, there are a variety of different stacked multi-layer assemblies and structures and associated manufacturing techniques associated with electronics and electronic products.

[0003] In the concept of manufacturing in-mold structural electronics (IMSE) functional devices and components therefor, the electronic and optical functions of the structure are stacked in the form of a multi-layer structure that encapsulates them as seamlessly as possible. What is characteristic of IMSE is that electronics and optional further embedded features such as optics are generally manufactured in true 3D (non-planar) form according to the overall 3D model of the target product, part, or generally design. To achieve the desired 3D layout of electronics on the 3D substrate and in the related end product, electronics can still be provided on an initially planar substrate such as a film using two-dimensional (2D) methods of electronics assembly, and then the substrate already housing the electronics can be formed and overmolded into the desired 3D shape, for example by a suitable plastic material that covers and embeds the underlying elements, thus protecting and potentially hiding them from the environment.

[0004] Patent document 1 presents a housing for an electric or electronic device or component comprising a molding of thermoplastic material having, at selected locations on its surface, electrical conductor tracks with contact pins attached at predetermined locations, whereby an electronic component such as a sensor, microswitch or surface mounted device can be applied to the electrical conductor tracks which are then simultaneously encapsulated and sealed by a second layer of thermoplastic material.

[0005] However, there are various challenges associated with known solutions that utilize light transport or illumination, for example in the context of IMSE. For example, the so-called light leakage or crosstalk phenomenon is a common problem with solutions with more optically functional components or elements arranged in the same structure, among other potential factors considered. In addition, in the manufacture, for example in the alignment of a substrate layer containing several optically functional elements with other layers, subsequent layers can be time-consuming and technically difficult. In general, it can be said that the controllability of the features embedded or transported in the IMSE structure, such as light, can still be a challenge in some use cases, while the obtained integrated structure, in terms of integration level, product weight and size, durability, manufacturing process complexity and yield, product and process cost, and the ability to include additional functions, for example sensing, communication, data processing, and data storage, are examples of many further aspects that need to be considered in the design and manufacture of solutions that fall under or evoke the IMSE concept. [Prior art documents] [Patent documents]

[0006] [Patent Document 1] U.S. Patent No. 6,521,830 Summary of the Invention [Problem to be solved by the invention]

[0007] It is an object of the present invention to at least alleviate one or more of the above-mentioned disadvantages or problems associated with existing solutions, particularly in the context of integral multi-layer structures such as IMSE structures and electronics or other functions embedded therein.

[0008] The object of the invention is obtained by a multilayer structure and an associated manufacturing method that are characterized by what is presented in the independent claims. Some advantageous embodiments of the invention are presented in the dependent claims. [Means for solving the problem]

[0009] According to one embodiment of the present invention, a method for producing an optoelectronic and / or otherwise functional multi-layer structure comprises the steps of: a first step of providing an optionally thermoplastic (3D) formable film, such as a thermoplastic substrate film, optionally including a first and an opposite second side, optionally with the first side facing a selected top side and the second side facing a selected bottom side of the structure; a second step of placing the substrate film with electronics, the electronics including several optically functional, preferably light-emitting and / or photosensitive, elements disposed on respective light-defining segments on the first side of the substrate film, and a circuit design including several circuit traces connecting the several optically functional elements; a third step of providing a substantially optically opaque light-blocking layer and further disposing the light-blocking layer on a first side of the substrate film, the light-blocking layer having a proximal end essentially aligned with a thickness direction of the structure and defining (first) several structure channels extending from the contacts of the respective light-defining segments in a first direction, optionally toward a selected apex of the structure; Preferably, the method includes a fourth step of producing an optically transparent layer on the first side of the substrate film by molding, so that i) light-defining segments including several optically functional elements are at least partially embedded in and optically bonded to the transparent layer that at least partially establishes the interior of the structure channel, and ii) a light-blocking layer is fixed together with the transparent layer to position several optically functional elements in their respective light-defining segments to the light-blocking layer, and the light-blocking layer at least partially optically isolates the light-defining segments from each other.

[0010] In the above, the mutual order of the steps disclosed is preferably that shown.

[0011] In the method, a third step may include forming at least one of the structure channels from the number of structure channels in a first direction through the light blocking layer to define a number of through holes, preferably such that a proximal end of at least one of the structure channels (holes) toward the respective light defining segment at least partially defines an edge of the respective light defining segment, and a distal end of at least one of the structure channels defines an outlet on another side of the light blocking layer, which in this context preferably faces, for example, toward an environment in which a user of the multi-layer structure may be located, perceiving light potentially created and emitted by the structure.

[0012] In the method, a third step may include configuring at least one structure channel from the number of structure channels to define an opening, i.e., a blind hole, in the light-blocking layer, such that a proximal end of the at least one structure channel on one side of the light-blocking layer at least partially defines an edge of a respective light-defining segment and a distal end of the at least one structure channel forms an apex of the opening adjacent another side of the light-blocking layer, and a thickness of the light-blocking layer within each structure channel is locally reduced.

[0013] In the method, a third step may include arranging a portion of at least one structure channel from the several structure channels to include a protrusion or recess extending in a second direction perpendicular to the first direction to improve fixation between the light-blocking layer and the transmissive layer and / or positioning of the transmissive layer.

[0014] In the method, a fourth step may include using at least a portion of the material of the light blocking layer as an insert in a mold, preferably such that the optically transparent layer is at least partially molded between the light blocking layer and the first side of the substrate film.

[0015] In the method, a third step may include laminating at least a portion of the material of the light-blocking layer with a substrate film, optionally preceded by providing an adhesive layer between the light-blocking layer and the substrate film.

[0016] In the method, a second step may include disposing at least one electrical element of electronics selected from the group consisting of a light emitting element such as an LED, a light sensitive element, a photodetector, a solar cell, and a pressure sensitive component in at least one of the light defining segments.

[0017] In the method, a second step may include producing at least a part of the electronics, preferably at least the circuit design, by printed electronics techniques on the substrate film.

[0018] In the method, a third step can include at least partially molding the light blocking layer from at least one raw material, such as plastic.

[0019] In the method, a second step may include providing a masking layer, preferably opaque or translucent, optionally of a dark colour such as substantially black, on the first and / or second side of the substrate film, over the base layer, optionally a film or tape, housing at least one of the traces and optionally the optically functional elements, to block or at least impede the appearance of the traces.

[0020] In the method, a second step may include providing a first additional film on the substrate film on the first side, the first additional film optionally containing on or in at least one light defining segment thereof at least one element selected from the group consisting of an optical surface relief form, an optical surface relief form structure, an optical grating structure, printing, a printed letter, a printed number, a printed shape, a printed image, a printed graphic, and an engraved letter, number, shape, image or graphic.

[0021] The method includes the further step of providing one or more second additional, optically functional, optionally diffusive films or layers on a distal end of at least one of the several structure channels, at least one of the second additional films or layers optionally containing at least one element selected from the group consisting of optical surface relief forms, optical surface relief form structures, optical grating structures, printing, printed letters, printed numbers, printed shapes, printed images, printed graphics, and engraved letters, numbers, shapes, images or graphics.

[0022] In the method, a third step includes: irradiating at least two light beams through a second number of structure channels of the light blocking layer, the second number of structure channels extending in a second direction, which is optionally essentially perpendicular to the first direction. The second direction may thus point, for example, in a direction substantially parallel to the plane of the substrate film, such that a proximal end of at least one structure channel from the second several structure channels is connected to one light-defining segment and a distal end of at least one structure channel is connected to another light-defining segment.

[0023] The method may include a further step after or before the second step, preferably 3D shaping (3D forming) the substrate film into a selected 3D target shape (a curve, a serpentine, a dome, or some other preferred and potentially more complex 3D shape) by thermoforming, optionally with the light-defining segments defined by the shape of recesses, grooves, pockets, ridges and / or protrusions in the substrate film.

[0024] According to one embodiment of the present invention, an optoelectronic functional multilayer structure comprises: an optionally thermoplastic formable substrate film, optionally including a first side and an opposite second side, optionally the first side toward a selected top side and the second side toward a selected bottom side of the structure; electronics including a number of optically functional, preferably light emissive and / or photosensitive, elements disposed within each light defining segment on the first side of the substrate film, and a circuit design including a number of conductive circuit traces connecting the number of optically functional elements; an optically transmissive layer molded onto a first side of the substrate film such that at least a portion of each light-defining segment, which includes several optically functional elements, is at least partially embedded in and optically coupled to the optically transmissive layer; a substantially optically opaque light blocking layer disposed on a first side of the substrate film, the light blocking layer defining a number of structural channels at least partially constructed from a material of the transmissive layer; A number of structure channels are optionally formed to extend in at least a first direction, coincident with a thickness direction of the structure toward a selected top of the structure, to i) optionally transport light emitted by at least one optically functional element toward the environment on the selected top of the structure and / or transport light onto at least one optically functional element from the environment, such that the light-blocking layer at least partially optically isolates the light-defining segments from each other, and ii) position a number of optically functional elements in each light-defining segment in the light-blocking layer.

[0025] In the multi-layer structure, at least one structure channel from several structure channels may be formed to extend through the light-blocking layer in a first direction and define several through holes, such that a proximal end of the at least one structure channel on one side of the light-blocking layer at least partially defines an edge of a respective light-defining segment and a distal end of the at least one structure channel defines an exit on another side of the light-blocking layer.

[0026] In the multilayer structure, at least one structure channel from several structure channels can be formed to define an opening in the light-blocking layer, such that a proximal end of the at least one structure channel on one side of the light-blocking layer at least partially defines an edge of a respective light-defining segment and a distal end of the at least one structure channel forms an apex of the opening adjacent another side of the light-blocking layer, and the thickness of the light-blocking layer within each structure channel is locally reduced.

[0027] In the multilayer structure, at least a portion of at least one of the several structure channels on a first side of the substrate film may include a protrusion or recess formed to extend in a second direction perpendicular to the first direction.

[0028] In a multi-layer structure, a light blocking layer and a substrate film may include an adhesive layer, and optionally a heat-activated film, sandwiched therebetween.

[0029] In the multi-layer structure, the electronics may include at least one electrical element selected from the group consisting of a light emitting element, such as an LED, a light sensitive element, a photodetector, a solar cell, and a pressure sensitive component disposed on at least one of the light defining segments.

[0030] In a multi-layer structure, the electronics, optionally at least a portion of the circuit design, may be produced by printed electronics techniques on a substrate film.

[0031] In a multi-layer structure, the first and / or second side of the substrate film includes a base layer housing the traces and optionally at least one optically functional element, optionally a masking layer over the film or tape, preferably opaque or translucent, optionally of a dark color such as substantially black, to block or at least impede the appearance of the traces.

[0032] In the multilayer structure, a first side of the substrate film optionally includes a first additional film containing on or within at least one light-defining segment at least one element selected from the group consisting of optical surface relief forms, optical surface relief form structures, optical grating structures, printing, printed letters, printed numbers, printed shapes, printed images, printed graphics, and engraved letters, numbers, shapes, images or graphics.

[0033] In a multi-layer structure, the structure may comprise one or more second additional, optically functional, optionally diffusive films or layers over the light-blocking layer, at least one of the second additional films or layers optionally containing at least one element on a distal end of at least one of the several structure channels of the light-blocking layer selected from the group consisting of optical surface relief forms, optical surface relief form structures, optical grating structures, printing, printed letters, printed numbers, printed shapes, printed images, printed graphics, and engraved letters, numbers, shapes, images or graphics.

[0034] In the multilayer structure, at least two light-defining segments may be connected via a second number of structure channels in the light-blocking layer formed to extend in a second direction perpendicular to the first direction, such that a proximal end of at least one structure channel from the second number of structure channels is connected to one light-defining segment and a distal end of at least one structure channel is connected to another light-defining segment.

[0035] In the multilayer structure, various layers and elements, such as optically functional elements, optically transparent layers, and possibly molding layers such as light blocking layers, and / or substrate film layers, may at least in places comprise optically substantially opaque, translucent or transparent materials, for example allowing visible light and / or other preferred wavelengths of light to pass therethrough with minimal loss. In the latter case, sufficient light transmission (transmission) at the desired wavelengths may be, for example, at least about 70%, 75%, 80%, 85%, 90%, 95% or more. These higher transmission elements include, for example, the optically transparent layers of the multilayer structure contemplated herein. The light blocking layers and optionally further elements that are not intended to transmit incident light may then have a transmission of about 50%, 40%, 30%, 20%, 10%, 5%, 2% or less. The wavelengths considered may in fact be, specifically, for some embodiments / elements, transmission of substantially all wavelengths of visible light may be relevant, while in some other embodiments involving other wavelengths of electromagnetic radiation for transmission or capture, e.g., wavelengths of interest. may be more specific, different, or in a broader bandwidth.

[0036] Generally, possible molding methods include, for example, injection molding. In the case of some plastic materials included in the structure, they may be molded using a two-shot or generally multi-shot molding method. Molding machines with multiple molding units may be utilized. Alternatively, multiple machines or a single reconfigurable machine may be used to provide several materials in sequence.

[0037] The usefulness of the present invention arises from a variety of factors, depending on each particular embodiment at issue.

[0038] For example, alignment of the substrate film, electrical components such as optically functional elements, and optional features such as graphics or other information elements of further layers or films of the structure may be easy as in known methods. Several separate portions of the injected or molded transparent layer may be isolated from each other and secured to the substrate film by light blocking layers, so that extensional stresses on the substrate film and the elements thereon during the injection or molding process may be reduced.

[0039] Because the structure may be arranged in a substantially non-planar, e.g., curved, shape, it may be more conveniently used in applications where the use of a planar shape is not possible, or at least not desirable, for either aesthetic or functional reasons, e.g., in terms of the host device / slot / environment dimensions.

[0040] However, the resulting structure can be easily mounted to the target surface. The structure can remain relatively light and flat with a high degree of integration. It may even include integral supporting and / or mounting elements such as bosses for positioning and fixation purposes. The manufacturing process is fast, affordable, and offers good yields.

[0041] Nevertheless, according to the present invention it is possible to provide an optoelectronic functional multilayer structure, and a method for manufacturing such an optoelectronic functional multilayer structure, which is able to prevent leakage or crosstalk phenomena when the structure contains more optically functional components and optoelectronic functions. [Brief description of the drawings]

[0042] [Figure 1] 1 illustrates, via a partial cross-sectional side view, one embodiment of a multi-layer structure according to the present disclosure. [Diagram 2] 1. A modification of the embodiment of FIG. [Figure 3a] 4 illustrates a further variation of a multi-layer structure according to the present disclosure. [Figure 3b] 4 illustrates a further variation of a multi-layer structure according to the present disclosure. [Figure 3c] 4 illustrates a further variation of a multi-layer structure according to the present disclosure. [Figure 3d] 4 illustrates a further variation of a multi-layer structure according to the present disclosure. [Figure 4] 4 illustrates a further variation of a multi-layer structure according to the present disclosure. [Diagram 5] 4 illustrates a further variation of a multi-layer structure according to the present disclosure. [Figure 6] 4 illustrates a further variation of a multi-layer structure according to the present disclosure. [Figure 7a] 4 illustrates a further variation of a multi-layer structure according to the present disclosure. [Figure 7b] 4 illustrates a further variation of a multi-layer structure according to the present disclosure. [Figure 7c] 4 illustrates a further variation of a multi-layer structure according to the present disclosure. [Figure 8a] 4 illustrates a further variation of a multi-layer structure according to the present disclosure. [Figure 8b] 4 illustrates a further variation of a multi-layer structure according to the present disclosure. [Figure 8c] 4 illustrates a further variation of a multi-layer structure according to the present disclosure. [Figure 9] 4 illustrates a further variation of a multi-layer structure according to the present disclosure. [Figure 10] 4 illustrates a further variation of a multi-layer structure according to the present disclosure. [Figure 11] 1 illustrates one embodiment of a light blocking layer. [Figure 12] 4 illustrates a further variation of a multi-layer structure according to the present disclosure. [Figure 13] 1 is a flow chart disclosing one embodiment of a method m according to the present disclosure. [Figure 14] 1 is a flow diagram disclosing an alternative method for producing a multi-layer structure. [Figure 15] 4 illustrates a further variation of a multi-layer structure according to the present disclosure. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0043] The term "some," as used herein, may refer to any positive integer starting with one (1).

[0044] The terms "plurality" may each refer to any positive integer starting with two (2).

[0045] The terms "first" and "second" are used herein to distinguish one element from other elements and do not confer any special priority or ordering thereon unless expressly stated otherwise.

[0046] The considerations presented previously with respect to the various aspects and embodiments of the method may be flexibly applied, mutatis mutandis, to the aspects and embodiments of the multi-layer structure, and vice versa, as will be understood by the skilled artisan.

[0047] The invention will now be explained in more detail with reference to exemplary embodiments according to the accompanying drawings.

[0048] In the various figures, the same or corresponding parts are indicated by the same reference numerals, and in most cases duplicate textual descriptions are also omitted.

[0049] FIG. 1 illustrates, in a cross-sectional side view, at 100, the general concepts of many of the various embodiments of the present invention through one, merely exemplary, implementation of a multi-layer structure.

[0050] The depicted, still merely exemplary, structure 100 is shown to exhibit a fairly flat general shape for the sake of clarity. However, those skilled in the art must appreciate the fact that the optimal shape may be determined specifically based on, for example, optical, structural, dimensional, or aesthetic design targets. The resulting overall shape and / or the constituent shapes of the included elements or parts of the structure are therefore more fundamentally three-dimensional and may incorporate, for example, at least locally curved or angular portions in addition to or instead of a substantially flat surface. However, the finer scale surface texture of the structure 100 may be constant or spatially varying. The texture may contain, for example, flat and / or granular portions resulting from, for example, the material used or surface-type microstructures, such as optical microstructures, provided in the surface layer.

[0051] The completed multi-layer structure 100, by itself or after further processing, effectively establishes its own end product, e.g., an electronic device, or may be disposed within a host device or element as a building block or component module thereof, which may of course include several additional elements or layers not shown in the figures.

[0052] The structure 100 includes a substrate film 108 as previously described.

[0053] The substrate film 108 and / or any additional layers or films in the structure (e.g. , first or second additional layer 118) may comprise or consist of materials such as plastics and / or organic or biomaterials, for example, with reference to wood, leather, or fabric, or combinations of any of these materials with each other or with metal. The film may generally comprise or consist of a thermoplastic material. The film may be flexible or pliable in nature. In some embodiments, the film 108 may alternatively be substantially rigid. The thickness of the film may vary depending on the embodiment and may be only a few tenths or a few percent of a millimeter, or may be quite thick, for example, on the order of a millimeter or several millimeters.

[0054] The film 108 may comprise at least one material selected from the group consisting of, for example, a polymer, a thermoplastic material, a thermoplastic polymer, an electrically insulating material, PMMA (polymethyl methacrylate), polycarbonate (PC), copolyester, copolyester resin, polyimide, copolymer of methyl methacrylate and styrene (MS resin), glass, polyethylene terephthalate (PET), carbon fiber, an organic material, a biomaterial, leather, wood, a textile, a fabric, a metal, an organic natural material, solid wood, veneer, plywood, bark, tree bark, birch bark, cork, natural leather, a natural textile or fabric material, a naturally grown material, cotton, wool, linen, silk, and any combination of the above.

[0055] The substrate film 108 may be configured to host electronics including, for example, three separate optically functional elements 106 disposed within respective light-defining segments 112 on a first side of the substrate film 108, as shown in Figure 1. The electronics may further include circuit traces 114 that electrically connect to the optically functional elements 106. However, the substrate film 108 may be configured to host several additional electrical or specifically electronic elements, and / or elements of a different nature, on either the same or opposite ("second") side.

[0056] Indeed, in this and other embodiments of the present invention, the multi-layer structure 100, or more specifically the substrate 108 provided thereon, may be any of a variety of components, such as electronic components, electromechanical components, electro-optical components, radiation emitting components, light emitting components, LEDs (light emitting diodes), OLEDs (organic LEDs), side shooting LEDs or other light sources, top shooting LEDs or other light sources, bottom shooting LEDs or other light sources, red (light emitting) LEDs, green LEDs, blue LEDs, RGB LEDs, and the like. The device may include several functional elements including at least one functional element selected from the list consisting of an LED, a radiation detection component, a light detection or light sensing component, a photodiode, a phototransistor, a solar cell device, a sensor, a micromechanical component, a switch, a touch switch, a touch panel, a proximity switch, a touch sensor, an air sensor, a temperature sensor, a pressure sensor, a moisture sensor, a gas sensor, a proximity sensor, a capacitive switch, a capacitance sensor, a projected capacitance sensor or switch, a single electrode capacitance switch or sensor, a capacitance button, a multi-electrode capacitance switch or sensor, a self-capacitance sensor, a mutual capacitance sensor, an inductive sensor, a sensor electrode, a micromechanical (MEMS) component, a UI element, a user input element, a vibration element, a sound generating element, a communication element, a transmitter, a receiver, a transceiver, an antenna, a resonator, an infrared (IR) receiver or transmitter, a wireless communication element, a wireless tag, a radio tag, a tag reader, a data processing element, a data storage or memory element, an electronic subassembly, a light directing element, a light guide, a lens, and a reflector.

[0057] The multi-layer structure 100 further includes an optically substantially opaque light blocking layer 104 and an optically transmissive layer 103 disposed on a first side of the substrate film 108, as shown in FIG. 1. The two layers 103, 104 may be arranged alternately and / or establish various other configurations. The light blocking layer 104 is either through or blind holes in a direction (first direction) D1. 1, the optically functional elements 106 are at least partially embedded in the transmissive layer 103 and optically coupled to the transmissive layer 103. As shown in FIG. 1, preferably, edges of the light-defining segments 112 on the first side of the substrate film 108 are at least partially defined by proximal ends of respective structure channels 110, such that the light-defining segments 112 are at least partially optically isolated from one another.

[0058] The material of the light blocking layer 104 and / or the transparent layer 103 may include, for example, thermoplastic and / or thermosetting materials. The thickness of the molded or otherwise produced layer may vary depending on the embodiment. It may be, for example, less than a millimeter, a millimeter, a few millimeters, or a few tens of millimeters in size. For example, the molded material may be electrically insulating. More specifically, the included layer, such as the light blocking layer 104 or the transparent 103 layer, may include at least one material selected from the group consisting of elastomeric resins, thermosetting materials, thermoplastic materials, PC, PMMA, ABS, PET, copolyesters, copolyester resins, nylon (PA, polyamide), PP (polypropylene), TPU (thermoplastic polyurethane), polystyrene (GPPS), TPSiV (thermoplastic silicone sulfite), and MS resin.

[0059] Some circuit traces 114, or "wiring," may be provided to supply power to electronics such as optically functional elements 106 from an internal or external power source, as will be understood by those skilled in the art. However, there may be traces 114 for carrying signals (e.g., control signals and / or (other) data) between different elements of the on-board electronics, i.e., electronics included in structure 100, and / or between electronics included in structure 100 and external devices or structures. The same traces 114 may be used jointly for power and data communication.

[0060] The optically functional element 106 may be an electrical element selected from the group consisting of an LED, a photosensitive element, a photodetector, or a light emitting element such as a solar cell.

[0061] The traces 114, conductive portions of the optically functional elements 106 and / or other conductive features included in the structure 100 may comprise at least one material selected from the group consisting of conductive ink, conductive nanoparticle ink, copper, steel, iron, tin, aluminum, silver, gold, platinum, conductive adhesives, carbon fiber, alloys, silver alloys, zinc, brass, titanium, solder, and any components thereof. The conductive material used may be optically opaque, semi-transparent, and / or transparent at a desired wavelength, such as visible light, and thus mask or reflect therefrom, absorb therein, or pass radiation, such as visible light.

[0062] However, any of the structure channels 110 may be associated with multiple optically functional elements 106 instead of only one, although the latter option is the situation shown in the figures for the sake of clarity. The elements 106 may be aligned with one another as desired. Two or more of the elements 106 may be positioned in any of a row, matrix, circle, or other selected formation with respect to a particular channel 110, or generally.

[0063] The material of the transparent layer 103 is configured to transport light emitted by at least one optically functional element 106 or to transport light from the environment onto at least the optically functional element 106, and therefore, for such purpose, optionally transmits visible light and / or other selected wavelengths emitted by the optically functional element 106. The optical fiber may have suitable transmission characteristics, such as sufficient transmission at wavelengths / frequencies of interest, including or limited to the wavelengths of light transmitted from the optical fiber and / or the environment.

[0064] In general, the desired total transmittance at the wavelengths of interest may of course vary depending on the particular embodiment being implemented, but generally, for example, the plastic material used to establish the transmissive layer 103 comprises a material that is optically substantially transparent or translucent given the selected frequency or wavelength, thus allowing the frequency / wavelength to pass therethrough with sufficiently low loss. Thus, a sufficient total transmittance of layer 103 at the relevant wavelengths may vary depending on the embodiment, but may be, for example, about 50%, 60%, 70%, 75%, 85%, 90% or 95% or more, as briefly discussed above.

[0065] Generally, in various embodiments, power supply to any element, such as the optically functional elements or the control / processing device hosted by the multi-layer structure, may be arranged at least in part by an included battery or other locally provided power source. However, specific power circuits, including, for example, several converters, may be utilized to arrange suitable power from a source to several electrical or specifically electronic elements included in the multi-layer structure. Several electrical conductors or circuit traces 114, connectors and / or cabling may be utilized for power transport as well as for communication purposes between different elements and / or between the structure 100 and external elements.

[0066] The light blocking layer 104 may contain a thermally conductive material, such as a selected metal and / or thermally conductive features on or within the layer 104. This material may be configured to act as a heat sink.

[0067] The light blocking layer 104 may be configured to interface with an external structure or device. For this purpose, the layer 104 may contain several fastening features. These fastening features may be, for example, chemically based (adhesive) or mechanically based means of suitable shape designed to fasten the external structure or device to the structure.

[0068] The structure may include an additional film 118 on another side of the transmissive layer 103, and / or a light blocking layer 104 facing the substrate film 108. The additional film 118 may function optically or otherwise, for example, may be at least selectively light transmissive, opaque, diffusive and / or collimating. The additional film 118 may host elements similar to or different from those of the substrate film 108, for example, the light source 112, and the transmissive layer 103 (which may or may not extend through the structure to the substrate film 108).

[0069] The substrate film 108 and / or other layers of the structure that may be embedded within or on the structure may have reflective, scattering and / or other optical functions.

[0070] For example, various general principles already described herein with respect to the included elements, their functions, materials, other properties, and their mutual configuration within a structure, with respect to FIG. 1 or without explicit reference to any drawing attached hereto, can be selectively adopted and essentially applied in any embodiment of the present disclosure, as readily understood by those skilled in the art, and therefore they will not be unnecessarily repeated below with respect to the description of the remaining drawings. Similarly, additional features that are disclosed for the first time below with respect to the description of any remaining drawings can be flexibly adopted in other illustrated or merely text-described embodiments, unless expressly stated to the contrary.

[0071] FIG. 2 shows a cross-sectional view of a slit extending inward or outward in a second direction D2 (width) perpendicular to the first direction D1. A variant of the structure is shown at 200, which differs from the embodiment of FIG. 1 in that it includes several protrusions or recesses 101 in the structure channel that connect the protrusions or recesses 101 to the first side of the substrate film 108. As shown in FIG. 2, the protrusions or recesses 101 may be located directly on and connected to the first side of the substrate film 108, or may be further connected to the side between the proximal and distal ends of the structure channel 110. The protrusions or recesses 101 may have, for example, a rectangular, wedge, or double wedge shape. The optically functional element 106 may be located on the protrusions 101, as shown in FIG. 2. The protrusions improve the fixation between the light blocking layer 104 and the transparent layer 103 and / or the positioning of the transparent layer 103.

[0072] In general, two or more structure channels 110 may also be optionally connected to one another via additional structure channels 110 (not shown).

[0073] Figures 3a-3d show the multi-layer structure 300 in four different degrees of completion for clarity. In Figure 3a, several optically functional elements 108 are arranged on four insulated and separated light-defining segments 112. In this design, the light-defining segments 112 are formed in recesses in the substrate film 108. In Figure 3b, the recesses of the light-defining segments 108 are filled / molded by the material of the transmissive layer 103, whereby the optically functional elements 108 are at least partially embedded in and optically coupled to the transmissive layer 103. In FIG. 3c, an optically substantially opaque light blocking layer 104 is disposed on the structure 300 of FIG. 3b such that light transported between different light defining segments 112 is at least partially blocked by the disposed light blocking layer 104, but light transported between the optically functional elements 108 on the individual light defining segments 112 and the environment above the structure is permitted within the transparent layer 103 inside the structure channel 110. This may be provided such that the light blocking layer 104 has a varying transmittance, which may be higher at the location (i.e., above) of the light defining segments 112, i.e., in the structure channel, and substantially less at the portion not on the segments 112, i.e., outside the structure channel 110, and optionally 104 may be opaque. The various transmittances of the layer 104 may be manufactured, for example, such that color particles that reduce the transmission properties are disposed in the portion of the layer 104 that is not on the segments 112. As will be appreciated by those skilled in the art, other methods may also be used to provide various transmittances for the light blocking layer 104. In Figure 3d, at least one second additional film or layer 118 is provided on top of the structure 300 of Figure 3c such that there is optional information element 116 on the three light defining segments 112 in the at least one second additional film or layer 118. Figures 3a-3c show a connector 114a that can be used to connect 300 to a host device, structure or element (not shown in the figures).

[0074] Generally, the desired total light blocking, i.e., blocking of transmission of light at wavelengths of interest, can of course vary depending on the particular embodiment being implemented, but generally, the opaque, or partially opaque, e.g., plastic or other material used to establish light blocking layer 104, comprises a material that is optically substantially opaque in view of the selected frequency or wavelength, thus preventing the frequency / wavelength from passing through it. Thus, the sufficient total transmittance of layer 104 at the relevant wavelengths can vary depending on the embodiment, but can be, for example, about 50%, 40%, 30%, 20%, 10%, 5%, 2%, 1% or 0%, and thus the optical transmittance of layer 104 can be configured to be substantially less than the optical transmittance of optically transparent layer 103.

[0075] At least one further film or layer in general, such as at least one second additional film or layer 118 or a first additional film, may be provided, incorporating, for example, diffusion optics and / or printing. In this context, the first additional film may be disposed directly on the first surface of the substrate film 108, or such that there is an adhesive layer or the like between the first surface of the film 108 and the first additional film. In this context, a second additional film or layer 118 refers to a film or layer that follows layers 103 and 104 in the structure and may constitute at least a portion of the top cover of the structure.

[0076] In some embodiments, several additional layers or films, such as a molding layer, may also be provided on the second side of the substrate film 108 (not shown in the figures). These additional layers may have, for example, insulating, protective, decorative, optical and / or mounting functions.

[0077] IML (In-Mold Labeling) / IMD (In-Mold Decoration) technology may be applied to provide embedded graphics, colors, etc. within the structure, optionally in the substrate film 108, and / or other films / layers.

[0078] As mentioned above, 3D forming, for example via a thermoforming process such as vacuum or pressure forming, may be applied to introduce a substantially three-dimensional shape, for example some recesses as shown in embodiment 300, into the target element or portion of the multi-layer structure, with particular reference to the substrate film layer 108. Practical examples of lower limits of typically suitable thermoforming temperatures (in degrees Celsius) include the following: PC150, PET70, and ABS88-120. The pressure applied to the target film, obtained by mechanically forcing air into the mold or drawing a vacuum into the mold, can exceed about 100 psi for monolayer film structures, but can exceed about 200 psi for laminated structures. The film and process parameters used should preferably be selected so that the film does not melt unless desired.

[0079] Concerning the forming parameters, only a few further merely exemplary guidelines can be given. If the target film, such as the substrate film 108, is, for example, PET and the plastic to be, for example, injection molded thereon is PC, the temperature of the melted PC may be, in the general case, about 280-320°C, and the forming temperature may be about 20-95°C, for example about 80°C. The film and process parameters used should preferably be selected such that the film does not melt and remains substantially solid during the process, unless otherwise desired. The film should be positioned in the mold so that it remains properly fixed. The skilled person will understand that the best forming and forming parameters depend, for example, on the material used and the target properties of the structure to be established, so that in the optimal case they should be specifically selected by relying on the known properties and behavior of the material when subjected to thermal and physical stresses, such as, for example, pressure / vacuum induced stretching. However, particular care should be taken to preserve the electronics and possible other elements already provided on the substrate film layer 108 before forming, by appropriately selecting the forming and forming parameters.

[0080] In various embodiments, the multi-layered structure may be arranged with preferably integral, e.g. molded, features such as bosses (e.g. rivets or screws) with holes / inserts and associated bases, optionally for attaching, spacing, and / or positioning the structure relative to the exterior surface and, e.g., the host device. However, some integral, preferably molded, features such as ribs may be incorporated to stiffen the structure.

[0081] 4 shows a further variation of the structure at 400. 400 has a second additional layer 118 on top of the light blocking layer 104 and the optically transmissive layer 103, i.e., layer 118 is after layers 103 and 104. In the figure, second additional layer 118 is shown separately to reveal the internal structure of 400. 400 is defined in the light blocking layer 104 and the optically transmissive layer 103. 400 has three separate structure channels 110 filled with material of the transparent layer 103. In the figure, each of the structure channels 110 defines a light defining segment 112 on a first side of the substrate film 118, which includes two optically functional elements 106 on opposite sides of the rectangular light defining segment 112. The optically functional elements 106 are encapsulated by the light blocking layer 104 and / or the transparent layer 103, and applied to circuit traces 114 that may be externally connected, for example, to a host device or element via a flexible connector 114b. In the figure, the second additional layer 118 includes an optional information element 116 at the distal end of the two structure channels 110 of 400.

[0082] Indeed, the one or more second additional films or layers 118 may be optically opaque, translucent, or substantially transparent. Opaque portions of layer 118 may be applied, at least in places, to further reduce crosstalk / leakage between adjacent optical channels 110.

[0083] In general, at least one second additional, optically functional, optionally diffusive film or layer 118 may be located at the distal end of at least one of some of the structure channels 110. The second additional film or layer 118 may optionally contain at least one information element selected from the group consisting of an optical surface relief form, an optical surface relief form structure, an optical grating structure, printing, printed letters, printed numbers, printed shapes, printed images, printed graphics, and imprinted letters, numbers, shapes, images, or graphics.

[0084] 5 shows at 500 a further embodiment of a multi-layer structure according to the present technology. In the figure, the substrate layer 108, the transmissive layer 103 and the light blocking layer 104 are shown separately. In 500, the transmissive layer 103 comprises a thin continuous transmissive layer 103 on a first side of the substrate film 108. In this design, the layer 103 is higher / thicker at a location 103b that extends into and forms the structure channel 110 in a first direction (D1) toward a selected apex. Thus, the light blocking layer 104 at least partially optically isolates the light defining segments 112 (not shown) from each other below the extension 103b.

[0085] FIG. 6 shows at 600 a further embodiment of a multi-layer structure according to the present technology. 600 may represent a seven segment display. 600 discloses a light blocking layer 108 on a first side of a substrate film 108. In 600, the light blocking layer 108 includes seven structure channels 110 that are filled by the material of the transparent layer 103, so that the structure channels are optically at least partially insulated from each other. On top of the layer 104, there is at least one second additional film or layer 118 having a light-transmitting portion on the light-defining segments 112, as well as several optically functional elements 106 (not shown in the figure) and structure channels 110 on each segment 112. As will be understood by those skilled in the art, types other than seven segment displays, such as 9, 14 or 16 segment displays, can also be realized in a similar manner by the present technology.

[0086] 7a-7c show further embodiments of the multi-layer structure at 700 in three different degrees of completion. In FIG. 7a, a substrate film 108 is shown having two light-defining segments 112, both having two optically functional elements 106 and a first additional film on a first side of the substrate film 108. The first additional film contains an optional information-providing element 116 on or in those two light-defining segments 112. At least one information element 116 is selected from the group consisting of an optical surface relief form, an optical surface relief form structure, an optical grating structure, a print, a printed letter, a printed number, a printed shape, a printed image, a printed graphic, and an imprinted letter, number, shape, image, or graphic. In FIG. 7b, a light-blocking layer 104 is shown on a first side of the substrate film 108, having a structure channel 110 that at least partially constitutes the transparent layer 103. The proximal end of the structure channel 110 extends from the contact of the light defining segment 112 in a first direction (D1) that coincides with the thickness direction of the structure toward a selected top of the structure. As shown in FIG. 7c, there may be at least one additional layer on the light blocking layer 104 and the transparent layer 103, possibly constituting a top cover of 700.

[0087] 8a-8c show a structure variation at 800 that differs from 700 in that it includes optional information elements 116 in at least one additional film or layer 118 over the two light defining segments 112 and respective structure channels 110, instead of in the first additional film on the first side of the substrate film 108. Fig. 8a further shows that the substrate film 108 may include through molded holes 124 or weakened portions, such as blind holes, as shown in this example, or cuts designed to allow molded plastic to flow in a molten state from one side to another during molding, such as, for example, from the second side to the first side.

[0088] 9 shows at 900 a further embodiment of a multi-layer structure. Some portions of the substrate film 108 are 3D formed into at least one receptacle, recess or pocket or similar shape 108d. In this design, the light blocking layer 104 and the transmissive layer 103 are at least partially configured inside the pocket 108d that extends towards the environment in a first direction.

[0089] The pocket 108d of the substrate film 108 accommodates at least one optically functional element 106 (not shown) at least partially embedded in the material of the transmissive layer 103 inside a structural channel 110 of the light blocking layer 104. The inner wall of the pocket 108 is thus at least partially in contact with the material of the light blocking layer 104 which at least partially interfaces with the inner portion of the pocket 108d. As shown in Fig. 9, there may be one or more structural channels 110 at least partially constituted of the material of the transmissive layer 103 in one pocket 108d.

[0090] 10 shows a further embodiment of a multi-layer structure at 1000. At least a portion of the light blocking layer 104 forms a number of cell morphologies or cell shapes in the at least partially configured structure channels 110 of the transparent layer 103.

[0091] The illustrated 1000 design incorporates a cellular arrangement of structural channels 110 in the light blocking layer 104. Such a design allows for the fabrication of highly compact multi-layer structures.

[0092] 11 shows at 1100 one embodiment of a light blocking layer 104 according to the present disclosure. In the manufacture of a multi-layer structure, the light blocking layer 104 can be a pre-fabricated layer or element, or it 104 may be prepared in the manufacturing process of the structure, preferably by molding, as described herein.

[0093] 12 shows at 1200 a further embodiment of a multi-layer structure, in particular an example of how different materials or layers of the structure overlap each other. At least a portion of the light blocking layer 104 and / or the transparent layer 103 may be located at the outer edge of the structure. The structure may include some hollow portions 130 between the layers or films of the structure.

[0094] The illustrated 1200 design includes a hollow portion 130 on a first side of the substrate film 108 that extends to the outer edge of the structure. The portion 130 is sandwiched in a first direction between the substrate layer 108 and the permeable layer 103. This 130 may allow for interfacing electrical components or elements, such as sensors, inside the structure with an external device or structure.

[0095] Alternatively, portion 130 may be sandwiched in a first direction between substrate layer 108 and light blocking layer 104 .

[0096] The hollow portion 130 may be fabricated, for example, by injecting or molding a sacrificial material that is removed from the structure in a post-processing step such that the volume of the desired portion 130 is initially filled. The sacrificial material may be removed from the structure to provide the hollow portion 130, for example, by irradiating or exposing the sacrificial material to a suitable chemical.

[0097] As will be appreciated by one of ordinary skill in the art, hollow portion 130 may also be located in other ways than as in 1200. FIG. 130 may be located, for example, on top of functional element 106 or other electrical component such as a detector or sensor.

[0098] FIG. 13 includes a flow diagram 1300 disclosing one embodiment of a method according to the present disclosure.

[0099] At the beginning of the method for manufacturing a multi-layer structure, a start-up step 1302 may be performed. During the start-up 1302, necessary tasks such as selection, acquisition, calibration of materials, components and tools, as well as other construction activities may be performed. Special care must be taken to ensure that the selection of the individual elements and materials works together and survives the selected manufacturing and installation process, which is of course preferably checked in advance based on the manufacturing process specifications and component data sheets or, for example, by studying and testing made prototypes. Thus, the equipment used, such as molding, casting, laminating, (thermo)forming, cutting, drilling and / or printing equipment, among others, may be brought up to operational status at this stage. Moulds may be prepared with the required surface morphology, etc.

[0100] At 1304, at least one, optionally thermoplastic, formable substrate film 108 for housing electronics is provided. Prefabricated element substrate material may be obtained, e.g., rolled or sheeted plastic film. In some embodiments, the substrate film 108 itself may first be manufactured in-house by molding, extrusion or other methods from a desired raw material. In some embodiments, the substrate film 108 may be manufactured from a selected raw material or material. Optionally, the substrate film 108 is treated. It may, for example, be coated, cut, and / or provided with desired openings, notches, recesses, cuts, etc. The initial and / or resulting treated film 108 may have, for example, a rectangular, square, or circular shape. The substrate film may generally, or at least selectively, be opaque, translucent, or substantially transparent in view of selected frequencies / wavelengths, such as emission frequencies / wavelengths, of optoelectronic elements, such as optically functional elements 106, provided thereon. The substrate film 108 may include a thermoplastic material, although, as described herein, a wide variety of significantly different materials are applicable for use in the substrates and other films contemplated herein.

[0101] At 1306, the substrate film 108 is arranged with electronics including a number of optically functional elements 106 disposed on each light-defining segment 112 on the first side of the substrate film, a circuit design including a number of circuit traces 114 connecting the number of optically functional elements 106, and potentially one or more other electronic components such as power circuits, sensing circuits, and / or control circuits (e.g., microcontrollers, processors, signal processors, programmable / programmed logic chips, etc.). Each segment 112 may include one or more optically functional elements 106. In practice, some prefabricated components such as various SMDs (surface mounted devices) may be attached to selected contact areas of the film 108, for example, by solder and / or adhesive.

[0102] In optional 1306B, electronics, preferably at least the circuit design, are produced by printing electronics techniques on the substrate film 108. In 806B, for example, several conductor lines of the desired circuit design or circuit pattern, and / or contact pads (or other contact areas) for electrically coupling electronic and optoelectronic components such as the optically functional elements 106, as well as several conductive circuit traces 114, optionally defining power (supply) and / or control circuits, are provided on the substrate film 108, preferably by one or more techniques of printing electronics, with reference to the associated additive techniques. For example, screen, inkjet, flexographic, gravure, or offset lithographic printing may be utilized. However, more traditional such etching-based methods may be considered as well, provided, for example, that the used material of the substrate film 108 is compatible therewith. Also, further actions of refining the substrate film may be performed here, including, for example, printing or other provision of color layers, graphics, visual indicators, coatings, etc.

[0103] Alternatively or additionally, printed electronics techniques may be applied to actually fabricate at least a portion of the components, such as OLEDs, directly on the substrate film 108. Each included optically functional element may optionally be individually selected, fabricated, or otherwise configured, for example, to emit only white light or selected wavelengths / frequencies (colors), not forgetting potential non-visible wavelengths.

[0104] There has been further discussion herein of how electronics such as optically functional elements 106 may be dimensioned, aligned, or positioned relative to one another or to other features of the multi-layer structure being constructed. In short, the mutual positioning of the various elements must be selected such that a desired overall performance goal is achieved, for example in terms of uniformity of light outcoupled or incoupled through a selected surface and / or optical efficiency. However, there may be aesthetic goals that influence the positioning of the electronics and / or masking or blocking elements, for example so that the electronics are not visible from outside the completed multi-layer structure.

[0105] In some embodiments, the substrate film 108 and / or other films included in the multilayer structure can be formed to assume a desired 3D shape (at least locally a substantially non-planar shape) preferably through a step of thermoforming, such as vacuum or pressure forming. Cold forming can also be applied. For example, in view of the forming technique, the aforementioned pressure forming can be applied to provide precise and sharp details in the substrate, and pressure forming may also generally be preferred if the substrate lacks (through) forming holes that may allow undesired flows and result in pressure drops through them. The thermoforming step can be performed following the placement of the electronics 1306 to avoid associated 3D assembly. However, it is alternatively or additionally possible to perform 3D forming already before step 1306.

[0106] At 1308, an optically substantially opaque light blocking layer 104 is provided and further disposed on the first side of the substrate film. The light blocking layer 104 is configured such that its proximal end defines a number of structure channels 110 extending from the contact of the light defining segments 112 in a first direction D1 that coincides with the thickness direction of the structure toward a selected apex of the structure. The light blocking layer 108 may be performed, for example, by molding any portion of the layer 104 or the entire layer 104, as described above, or a pre-prepared subassembly of the layer 104 may be used.

[0107] In fact, the substrate film 108 may be used as an insert, for example, in an injection molding process. Selected areas of the film, such as edges, may remain free of molded plastic if desired. In some embodiments, even both sides of the film may be provided with a molded layer. The substrate film may include through molded holes, or weakened areas, such as, for example, blind molded holes, or cuts designed to allow the molded plastic to flow in a molten state from one side to another, for example, during molding.

[0108] At least a portion of the material of the light blocking layer 104 may be laminated to the preceding substrate film 108 , optionally by providing an adhesive layer between the light blocking layer 104 and the substrate film 108 .

[0109] At 1310, an optically transparent layer 103 is produced on a first side of the substrate film 108, preferably produced directly from the relevant material, for example through molding or eastward, onto the substrate film 108 and at least a portion of the electronics thereon, such as some of the optically functional elements 106, such that the material establishes light transport within the transparent interior of the structural channels 110 of the light blocking layer 104.

[0110] Preferably, at least a part of the electronics, such as the optically functional elements 106 and / or other elements provided on the substrate, are thereby at least partially embedded within the provided material, so that the optical coupling between the optically functional elements 106 and the transmissive layer 103 inside the structure channel 110 of the light blocking layer 104 can be made efficient and the associated coupling losses reduced.

[0111] In 1310, at least a portion of the material of the light blocking layer 104 may preferably be used as an insert in molding the optically transparent layer 103 such that the optically transparent layer 103 is at least partially molded between the light blocking layer 104 and a first side of the substrate film 108.

[0112] Item 1312 refers to the potential task of providing one or more second, additional, optically functional, optionally diffusive films or layers on the distal end of at least one of the several structure channels 110.

[0113] In one embodiment, the method includes at least one further step, for example between the third step 1308 and the fourth step 1310, potentially optionally providing a cladding layer 128 between the blocking layer 104 and the transmissive layer 103.

[0114] At 1314, method execution ends.

[0115] FIG. 14 includes a flow diagram 1400 that discloses an alternative method for producing a multi-layer structure.

[0116] The method of 1400 is otherwise similar to the method of 1300, except that the optically transmissive layer 103 is formed in step 1408 prior to providing the light blocking layer 104 in step 1410.

[0117] Step 1408 includes the subject matter discussed above for step 1310. In step 1408, an optically transmissive layer 103 is produced, preferably by molding, on a first side of the substrate film 108 such that at least the light defining segments 112, including several optically functional elements 106, are at least partially embedded in and optically coupled to the transmissive layer 103.

[0118] Step 1410 includes the subject matter discussed above for step 1308. At 1410, a light blocking layer 104 is provided on the substrate film 108, thus further securing the transmissive layer 103 between the light blocking layer 104 and the substrate film 108, as discussed above. The light blocking layer 104 is configured to define a number of structure channels 110 having their proximal ends provided on respective light defining segments 112, and the transmissive layer 103 at least partially establishes interiors of the structure channels 110 extending in a first direction D1 coinciding with a thickness direction of the structure toward selected apexes of the structure.

[0119] As described herein, the light blocking layer 104 may be provided by at least partially molding it from at least one raw material, such as plastic.

[0120] 15 shows at 1500 a further embodiment of a multi-layer structure. It 1500 differs from the previously described multi-layer structure variants in that at least one optically functional element 106 is optically coupled through the substrate film 108 via the transmissive layer 103 to an environment located on the second side of the substrate film 108.

[0121] In the design of 1500, light may be arranged to selectively pass through the substrate film 108 via the exit portion 132 of the substrate film 108. Thus, the exit portion 132 is at least partially light transmissive. The exit portion 132 may optionally include an optically functional element, such as, for example, a light diffuser, a lens, or a diffractive element.

[0122] The structure channels created by the light blocking layer 104 may extend potentially more predominantly in the width or second direction (D2) than in the thickness or first direction (D1).

[0123] Design 1500 optionally includes a cladding layer 128 potentially selectively disposed between barrier layer 104 and transmissive layer 103 and / or on the first side of substrate film 108 .

[0124] As for the resulting overall thickness of the resulting stacked structure, it depends largely on the materials used and the associated minimum material thickness that provides the necessary strength in view of manufacture and subsequent use. These aspects need to be considered on an individual basis. For example, the overall thickness of the structure may be about 1 mm, although significantly thicker or thinner embodiments are feasible.

[0125] The scope of the present invention is determined by the appended claims and their equivalents. Those skilled in the art will appreciate that the disclosed embodiments have been constructed for illustrative purposes only, and that other configurations applying many of the principles described above can be readily prepared to best suit each potential usage scenario.

Claims

1. 1. A method for producing an optoelectronic functional multi-layer structure, comprising: A first step (1304) of providing an optionally thermoplastic formable substrate film (108) including a first side and an opposing second side; a second step (1306) of arranging the substrate film (108) with electronics, the electronics including a number of optically functional, preferably light-emitting and / or photosensitive, elements (106) disposed on each light-defining segment (112) on the first side of the substrate film (108) and a circuit design including a number of circuit traces (114) connecting the number of optically functional elements (106); a third step (1308) of providing a substantially optically opaque light blocking layer (104) and further disposing the light blocking layer (104) on the first side of the substrate film (108), the light blocking layer (104) defining a number of structure channels (110) whose proximal ends extend from contacts of the respective light defining segments (112) in a first direction (D1) coinciding with a thickness direction of the optoelectronic functional multilayer structure; a fourth step (1310) of producing an optically transparent layer (103) on the first side of the substrate film (108) preferably by molding, so that i) the light defining segments (112) including the number of optically functional elements (106) are at least partially embedded in and optically coupled to the optically transparent layer (103) that at least partially establishes an interior of the structure channel (110); and ii) the light blocking layer (104) is fixed together with the optically transparent layer (103) to position the number of optically functional elements (106) in their respective light defining segments (112) to the light blocking layer (104), the light blocking layer (104) at least partially optically insulating the light defining segments (112) from each other; The third step (1308) provides the light blocking layer (104) with varying transmittance; the transmittance is high over the light-defining segments (112), i.e., in the structure channels (110), and is substantially low not over the light-defining segments (112), i.e., outside the structure channels (110), and the light-blocking layer (104) is optionally opaque; method.

2. 2. The method of claim 1, wherein the third step (1308) includes forming at least one structure channel (110) from the number of structure channels (110) to extend through the light-blocking layer (104) in the first direction (D1), preferably such that the proximal end of the at least one structure channel (110) at least partially defines an edge of the respective light-defining segment (112) and the distal end of the at least one structure channel (110) defines an exit on another side of the light-blocking layer (104).

3. 3. The method of claim 1 or claim 2, wherein the third step (1308) includes forming at least one structure channel (110) from the number of structure channels (110) to define an opening in the light-blocking layer (104), such that a proximal end of the at least one structure channel (110) on one side of the light-blocking layer (104) at least partially defines an edge of the respective light-defining segment (112) and a distal end of the at least one structure channel (110) forms an apex of the opening adjacent to another side of the light-blocking layer (104), and the thickness of the light-blocking layer (104) within the respective structure channel (110) is locally reduced.

4. The method of claim 1 or claim 2, wherein the third step (1308) comprises arranging a portion of at least one structure channel (110) from the several structure channels (110) to include a protrusion or recess (101) extending in a second direction (D2) perpendicular to the first direction (D1) to improve the fixation between the light-blocking layer (104) and the transparent layer (103) and / or the positioning of the transparent layer (103).

5. 3. The method of claim 1 or claim 2, wherein the fourth step (1310) includes using at least a portion of the material of the light blocking layer (104) preferably as an insert in a mold such that the optically transparent layer (103) is at least partially molded between the light blocking layer (104) and the first side of the substrate film (108).

6. 3. The method of claim 1 or claim 2, wherein the third step (1308) comprises laminating at least one portion of the material of the light-blocking layer (104) with the substrate film (108), optionally preceded by providing an adhesive layer between the light-blocking layer (104) and the substrate film (108).

7. 3. The method of claim 1 or claim 2, wherein the second step (1306) includes disposing at least one electrical element of the electronics selected from the group consisting of a light emitting element, a light sensing element, a photodetector, a solar cell, and a pressure sensing component in at least one of the light defining segments (112).

8. 3. The method of claim 1 or claim 2, wherein the second step (1306) comprises producing at least a part of the electronics, preferably at least the circuit design, by printed electronics technology on the substrate film (108).

9. 3. The method of claim 1 or claim 2, wherein the third step (1308) comprises at least partially molding the light blocking layer (104) from at least one raw material, such as plastic.

10. 3. The method of claim 1 or claim 2, wherein the second step (1306) comprises providing a masking layer, preferably opaque or translucent, optionally of a dark color such as substantially black, on the first and / or second side of the substrate film (108) over a base layer, optionally a film or tape, containing the circuit traces (114) and optionally at least one of the optically functional elements (106), to block or at least impede the appearance of the circuit traces (114).

11. 3. The method of claim 1 or claim 2, wherein the second step (1306) includes providing a first additional film on the first side substrate film (108), the first additional film optionally containing at least one element selected from the group consisting of an optical surface relief form, an optical surface relief form structure, an optical grating structure, printing, printed letters, printed numbers, printed shapes, printed images, printed graphics, and engraved letters, numbers, shapes, images or graphics on or within at least one light-defining segment (112).

12. 3. The method of claim 1 or claim 2, wherein the method includes the further step (1312) of providing one or more second additional, optically functional, optionally diffusive films or layers (118) on a distal end of at least one of the several structure channels (110), at least one of the second additional films or layers (118) optionally comprising at least one element selected from the group consisting of an optical surface relief form, an optical surface relief form structure, an optical grating structure, printing, a printed letter, a printed number, a printed shape, a printed image, a printed graphic, and an imprinted letter, number, shape, image or graphic.

13. 3. The method of claim 1 or claim 2, wherein the third step (1308) connects at least two light-defining segments (112) through a second number of structure channels (110) of the light-blocking layer (104) extending in a second direction (D2) perpendicular to the first direction (D1), such that a proximal end of the at least one structure channel (110) from the second number of structure channels (110) is connected to one light-defining segment (112) and a distal end of the at least one structure channel (110) is connected to another light-defining segment (112).

14. The method according to claim 1 or claim 2, wherein the method comprises a further step after or before the second step (1306), preferably 3D shaping the substrate film (108) into a selected 3D target shape by thermoforming, optionally the light-defining segments (112) being defined by a morphology of recesses and / or protrusions of the substrate film (108).

15. 3. The method of claim 1 or claim 2, preferably further comprising a step between the third step (1308) and the fourth step (1310), wherein an optical cladding layer (128) is optionally provided between the light blocking layer (104) and the optically transparent layer (103).

16. The method includes providing the light blocking layer (104) in advance. The method according to claim 1 or claim 2.

17. the method comprising using at least a portion of the light blocking layer (104) as an insert in the molding of the optically transparent layer (103); 17. The method of claim 16.

18. An optoelectronic functional multilayer structure, comprising: an optionally thermoplastic formable substrate film (108) including a first side and an opposing second side; electronics including a number of optically functional, preferably light-emitting and / or photosensitive, elements (106) disposed within each light-defining segment (112) on the first side of the substrate film (108) and a circuit design including a number of circuit traces (114) connecting the number of optically functional elements (106); an optically transmissive layer (103) molded onto the first side of the substrate film (108) such that at least a portion of each light-defining segment (112) comprising one of the optically functional elements (106) is at least partially embedded in and optically coupled to the optically transmissive layer (103); an optically substantially opaque light blocking layer (104) disposed on the first side of the substrate film (108), the light blocking layer (104) defining a number of structural channels (110) constructed at least in part from a material of the optically transmissive layer (103); The several structural channels (110) are formed to extend in at least a first direction (D1) in line with a thickness direction of the optoelectronic functional multi-layer structure to i) transport light emitted by at least one optically functional element (106) towards an environment on the optoelectronic functional multi-layer structure and / or transport light onto at least one optically functional element (106) from the environment, such that the light blocking layer (104) at least partially optically isolates the light defining segments (112) from each other, and ii) position the several optically functional elements (106) in each light defining segment (112) in the light blocking layer (104); The light blocking layer (104) has a varying transmittance; the transmittance is high over the light-defining segments (112), i.e., in the structure channels (110), and is substantially low not over the light-defining segments (112), i.e., outside the structure channels (110), and the light-blocking layer (104) is optionally opaque; Optoelectronic functional multilayer structure.

19. 20. The optoelectronic functional multilayer structure of claim 18, wherein at least one structure channel (110) from the number of structure channels (110) is arranged to extend through the light-blocking layer (104) in the first direction (D1), preferably such that a proximal end of the at least one structure channel (110) on one side of the light-blocking layer (104) at least partially defines an edge of the respective light-defining segment (112) and a distal end of the at least one structure channel (110) defines an exit on another side of the light-blocking layer (104).

20. 20. The optoelectronic functional multilayer structure of claim 18 or 19, wherein at least one structure channel (110) from the number of structure channels (110) is formed to define an opening in the light-blocking layer (104), such that a proximal end of the at least one structure channel (110) on one side of the light-blocking layer (104) at least partially defines an edge of the respective light-defining segment (112) and a distal end of the at least one structure channel (110) forms an apex of the opening adjacent to another side of the light-blocking layer (104), and the thickness of the light-blocking layer (104) within the respective structure channel (110) is locally reduced.

21. 20. The optoelectronic functional multilayer structure of claim 18 or 19, wherein at least a portion of at least one structure channel (110) from the several structure channels (110) comprises at least one protrusion or recess (101) formed to extend in a second direction (D2) perpendicular to the first direction (D1).

22. 20. The optoelectronic functional multilayer structure of claim 18 or 19, wherein the light blocking layer (104) and the substrate film (108) include an adhesive layer, optionally a heat-activated film, sandwiched therebetween.

23. 20. The optoelectronic functional multilayer structure of claim 18 or claim 19, wherein the electronics comprises at least one electrical element selected from the group consisting of a light emitting element, a light sensing element, a photodetector, a solar cell, and a pressure sensing component disposed on at least one of the light defining segments (112).

24. 20. An optoelectronic functional multilayer structure according to claim 18 or claim 19, wherein the electronics, optionally at least a part of the circuit design, are preferably produced by printed electronics techniques on the substrate film (108).

25. 20. The optoelectronic functional multilayer structure of claim 18 or claim 19, wherein the first and / or second side of the substrate film (108) comprises a masking layer, preferably opaque or translucent, optionally of a dark color, such as substantially black, to block or at least impede the appearance of the circuit traces (114) over a base layer, optionally a film or tape, containing the circuit traces (114) and optionally at least one optically functional element (106).

26. 20. The optoelectronic functional multilayer structure of claim 18 or claim 19, wherein the first side of the substrate film (108) optionally comprises a first additional film containing on or in at least one light defining segment (112) at least one element selected from the group consisting of optical surface relief forms, optical surface relief form structures, optical grating structures, printing, printed letters, printed numbers, printed shapes, printed images, printed graphics, and engraved letters, numbers, shapes, images or graphics.

27. 20. The optoelectronic functional multilayer structure of claim 18 or claim 19, wherein the optoelectronic functional multilayer structure comprises one or more second additional, optically functional, optionally diffusive films or layers (118) on the light blocking layer (104), at least one of the second additional films or layers (118) optionally containing at least one element on a distal end of at least one of the several structure channels (110) of the light blocking layer (104) selected from the group consisting of optical surface relief forms, optical surface relief form structures, optical grating structures, printing, printed letters, printed numbers, printed shapes, printed images, printed graphics, and engraved letters, numbers, shapes, images or graphics.

28. 20. The optoelectronic functional multilayer structure of claim 18 or claim 19, wherein at least two light-defining segments (112) are connected via a second number of structure channels (110) of the light-blocking layer (104) formed to extend in a second direction (D2) perpendicular to the first direction (D1), such that a proximal end of at least one structure channel (110) from the second number of structure channels (110) is connected to one light-defining segment (112) and a distal end of the at least one structure channel (110) is connected to another light-defining segment (112).

29. 20. An optoelectronic functional multilayer structure according to claim 18 or 19, comprising a potentially optional optical cladding layer (128) between said light blocking layer (104) and said optically transmissive layer (103).

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