Method and apparatus for processing a substrate using non-contact temperature measurement - Patents.com

Abstract

A method and apparatus for processing a substrate is provided, which may include, for example, a processing chamber having a chamber body defining a processing space and a viewport coupled to the chamber body, a substrate support disposed within the processing space and having a support surface for supporting a substrate, and an infrared temperature sensor (IRTS) disposed outside the chamber body adjacent the viewport to measure a temperature of the substrate as it is processed in the processing space, the IRTS being movable relative to the viewport to scan the substrate through the viewport.

Description

[Technical field]

[0001] FIELD OF THE DISCLOSURE Embodiments of the present disclosure relate generally to substrate processing, and more particularly, to methods and apparatus for processing a substrate using non-contact temperature measurement. [Background technology]

[0002] Fan-out packaging wafers are composite structures, including silicon dies of various sizes packaged on, for example, an epoxy substrate. Typically, the wafer is heated in a chamber at low pressure, and non-contact temperature measurements can be used to monitor the temperature of the wafer. The temperature of the wafer is controlled so that the wafer is not damaged, for example, by warping. However, due to the non-uniform structure of the wafer, it is difficult to accurately measure the wafer temperature with an infrared (IR) sensor at normal incidence, because the temperature measurement depends mainly on the emissivity of the material the IR sensor sees. Furthermore, the customer's wafer pattern is often unknown, and therefore it is difficult to design the IR sensor architecture and calibration for normal incidence so that the IR sensor can detect, capture, or otherwise measure a variety of materials. Summary of the Invention

[0003] Provided herein are methods and apparatus for processing a substrate. In some embodiments, the apparatus for processing a substrate may include a processing chamber having a chamber body defining a processing space, with a viewport coupled to the chamber body, a substrate support disposed within the processing space and having a support surface for supporting a substrate, and an infrared temperature sensor (IRTS) disposed outside the chamber body adjacent the viewport to measure a temperature of the substrate when it is being processed within the processing space, the IRTS being a device movable relative to the viewport to scan the substrate through the viewport.

[0004] According to some embodiments, a method for substrate packaging may include positioning a substrate on a support surface of a substrate support disposed within a processing space of a processing chamber having a chamber body and a viewport coupled to the chamber body, providing an infrared temperature sensor (IRTS) outside the chamber body adjacent the viewport, moving the IRTS relative to the viewport to scan the substrate through the viewport, and measuring a temperature of the substrate while the substrate is being processed in the processing space.

[0005] According to some embodiments, a non-transitory computer readable memory device storing instructions is provided. memory A medium is provided having instructions that, when executed by a processor, cause the processor to position a substrate on a support surface of a substrate support disposed within a processing volume of a processing chamber having a chamber body and a viewport coupled to the chamber body; providing an infrared temperature sensor (IRTS) on an exterior of the chamber body adjacent the viewport; port and measuring a temperature of the substrate while the substrate is being processed within the processing space.

[0006] Other and further embodiments of the present disclosure are described below.

[0007]

[0013] Embodiments of the present disclosure, briefly summarized above and discussed in more detail below, can be understood by reference to the exemplary embodiments of the present disclosure as illustrated in the accompanying drawings, which, however, depict only typical embodiments of the present disclosure and are therefore not to be considered as limiting in scope, as the present disclosure may admit of other equally effective embodiments. [Brief description of the drawings]

[0008] [Figure 1] 1 is a schematic diagram of a processing chamber including a temperature measurement device according to one or more embodiments of the present disclosure. [Diagram 2] 1 is a schematic plan view of an exemplary substrate for forming an electronic circuit package according to one or more embodiments of the present disclosure. [Figure 3A] FIG. 2 is a partial side view of a processing chamber including a temperature measurement device according to one or more embodiments of the present disclosure. [Figure 3B] FIG. 3B is a detailed enlarged view of FIG. 3A. [Figure 3C] FIG. 1 is a diagram of a temperature sensing device according to one or more embodiments of the present disclosure. [Figure 4] 1 is a flowchart of a method for processing a substrate in accordance with one or more embodiments of the present disclosure. [Figure 5A] 1 is a perspective cross-sectional view of a portion of a processing chamber including a temperature measurement device according to one or more embodiments of the present disclosure. [Figure 5B] 1 is a partial cross-sectional view of a processing chamber including a temperature measurement device according to one or more embodiments of the present disclosure. [Figure 5C] FIG. 5C is a detailed expanded view of FIG. 5B in accordance with one or more embodiments of the present disclosure. [Figure 5D] FIG. 2 is an exploded view of components of a temperature measurement device according to one or more embodiments of the present disclosure. [Figure 5E] FIG. 1 is a diagram of a temperature sensing device according to one or more embodiments of the present disclosure. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0009] To facilitate understanding, identical elements common to the drawings have been designated using the same reference numerals where possible. The drawings are not drawn to scale and may be simplified for clarity. Elements and features of one embodiment may be beneficially incorporated in other embodiments without further recitation.

[0010] Method and apparatus embodiments using various types of non-contact measurements, such as infrared-based temperature measurements for packaging applications, are provided herein. In particular, the present disclosure overcomes the complexities associated with temperature measurements of fan-out packaging substrates (or wafers). More specifically, by positioning an IR sensor at a relatively shallow angle relative to the edge of the substrate (or wafer), a field of view can be formed, for example, an optical ellipsoid (or elliptical field of view) on the substrate. The optical ellipsoid allows the IR sensor to scan the substrate surface and obtain the temperature of the substrate surface. Furthermore, if the IR sensor is coupled to a linear up-down slide, the IR sensor can measure the temperature of all wafers in a batch of wafers being processed.

[0011] 1 is a schematic diagram of an apparatus 100 including a processing chamber 102 including a temperature measurement apparatus according to one or more embodiments of the present disclosure. The processing chamber 102 includes a chamber body 104 defined by a sidewall, a bottom portion, and a top portion. The chamber body 104 encloses a processing space 106.

[0012] The multi-substrate holder 108 is configured to support multiple substrates in a vertically spaced apart configuration (e.g., substrates 110a, 110b, and 110c having one or more electronic circuit packages formed thereon). Although Figure 1 shows one representative configuration, the present disclosure may be adapted to multi-substrate holders having other configurations as well, for example, in combination with pedestals and / or substrate supports.

[0013] The multi-substrate holder 108 includes one or more vertical supports 112. In some embodiments, the vertical supports 112 may be supported by the bottom of the chamber body 104, for example, via another connecting element, such as a set screw. In some embodiments, for example, as shown in FIG. 1B, the multi-substrate holder 108 optionally includes a bottom member 114 connected to the one or more vertical supports 112 and for supporting the one or more vertical supports 112 (one vertical support 112 is shown in FIG. 1). The vertical support 112 further includes a plurality of peripheral members (e.g., peripheral members 116a, 116b, and 116c) extending radially inward from the vertical support 112. The plurality of peripheral members 116a-116c are configured to support respective substrates 110a-110c supported and carried by substrate supports or carriers 118a, 118b, 118c. In some embodiments, the peripheral members 116a-116c are configured to directly hold and support the respective substrates 110a-110c.

[0014] The multi-substrate holder 108 further includes a lift assembly 120. The lift assembly 120 may include one or more of motors, actuators, etc., to control the vertical position of the peripheral members 116a-116c. The vertical position of the peripheral members 116a-116c is controlled to place and remove each of the substrate carriers 118a-118c and / or substrates 110a-110c onto or off of the substrate support through an opening 119 (e.g., a slit valve opening). The opening 119 is formed through one of the side walls at a height proximate to the peripheral members 116a-116c to facilitate the entrance and exit of the substrates 110a-110c into the processing space 106. In some embodiments, the opening 119 may be retractable and sealable, for example, to control pressure and temperature conditions in the processing space 106.

[0015] In some embodiments, the processing chamber 102 may include a heat source 128 disposed about the chamber body 104 or within the processing space 106 (e.g., disposed on a pedestal, if a pedestal-like device is used). In some embodiments, the heat source 128 may be a resistive heater, a convection heater, a radiant heater, or a microwave heater, or a combination of two or more types of heaters. In some embodiments, the chamber body 104 may be configured to receive and radiate thermal energy of a microwave, convection, or other similar nature from one or more heat sources 128 disposed outside the chamber body 104 to process the substrates 110a-110c.

[0016] The temperature sensing device may include one or more infrared (IR) temperature sensors 122 (IRTS 122) disposed outside the process chamber 102. In some embodiments, the IRTS 122 may be a digital infrared sensor including a thermopile sensor that senses infrared electromagnetic energy. The IRTS 122 is mounted outside the chamber body 104 adjacent a viewport 124 that is mounted within the process chamber 102 using any suitable mounting, such as clamps, bolts, screws, gaskets, O-rings, etc., in-line with an aperture (not shown in FIG. 1 ) defined through the chamber body 104, as described in more detail below. More specifically, the IRTS 122 is mounted to a bracket 126 coupled to a side 105 of the chamber body 104 and is vertically movable along the bracket 126, as described in more detail below. Although FIG. 1 shows one IRTS 122, if multiple IRTS 122 are provided, each would be positioned adjacent a corresponding viewport that is in-line with a corresponding aperture.

[0017] A controller 130 is provided and coupled to various components of the process chamber 102 to control operation of the process chamber 102 for processing the substrates 110a-110c. The controller 130 includes a central processing unit (CPU) 132, support circuits 134, and a memory or non-transitory computer readable storage medium 136. The controller 130 is operatively coupled to and controls the power supplies, e.g., heat source 128, and / or IRTS 122 directly or via a computer (or controller) associated with a particular process chamber and / or support system component. Additionally, the controller 130 is configured to receive input from the IRTS 122 in response to scanning the substrates 110a-110c and analyze the input for processing the substrates 110a-110c and controlling the power supplies such that the temperature of the substrates 110a-110c does not exceed a threshold value, as will be described in more detail below.

[0018] The controller 130 may be any form of general-purpose computer processor that can be used in an industrial environment to control various chambers and sub-processors. The memory or non-transitory computer-readable storage medium 136 of the controller 130 may be one or more readily available memories such as random access memory (RAM), read-only memory (ROM), floppy disk, hard disk, optical storage medium (e.g., compact disk or digital video disk), flash drive, or any other form of digital storage, local or remote. Support circuits 134 are coupled to the CPU 132 to support the CPU 132 in a conventional manner. These circuits include cache, power supplies, clock circuits, input / output circuits and subsystems, and the like. The methods of the present invention described herein, such as the method for substrate packaging, may be stored in the memory 136 as software routines 138 that may be executed or called to control the operation of the heat source 128 and / or the IRTS 122 in the manner described herein. The software routines may also be stored and / or executed by a second CPU (not shown) located remotely from the hardware controlled by the CPU 132.

[0019] FIG. 2 is a schematic plan view of representative substrates (e.g., substrates 110a-110c) for forming electronic circuit packages according to one or more embodiments of the present disclosure. For example, in some embodiments, each substrate 110a-110c may be a silicon wafer 200 (wafer 200). In some embodiments, wafer 200 may include one or more polymers or metals suitable for electronic circuit packaging applications. Wafer 200 is disposed on a substrate carrier (e.g., substrate carriers 118a-118c) shown in FIG. 1 above. Wafer 200 has a body 202 having a top surface region and an array of microcircuit dies 204 disposed on body 202. An epoxy resin 206 is provided to create insulation between adjacently disposed microcircuit dies 204 and encapsulate body 202. In some embodiments, array of microcircuit dies 204 substantially covers the top surface region of body 202 (e.g., leaving only a relatively small space between adjacent dies and the perimeter region of the top surface region uncovered). In some embodiments, one or more portions of the body 202 having the epoxy resin 206 exclude the microcircuit die 204. For example, in some embodiments, an area along the perimeter of the body 202 may include the epoxy resin 206 and exclude the microcircuit die 204.

[0020] The epoxy resin 206 may have a thickness of about 600 micrometers to about 900 micrometers depending on the amount of warpage that is acceptable due to the material composition of the epoxy. In some embodiments, the epoxy resin 206 may have a glass transition temperature of about 140° C. to about 150° C. The substrate carriers 118a-118c and the epoxy resin have substantially similar coefficients of thermal expansion (CTE) (e.g., one CTE differs from the other CTE by no more than 10 percent).

[0021] In some embodiments, the epoxy resin 206 can include a dopant 208. In some embodiments, the dopant can be in a region along the periphery of the body 202 that includes the epoxy resin 206 and away from the array of microcircuit dies 204, as shown, for example, in FIG.

[0022] In some embodiments, the individual dies in the array of microcircuit die 204 may be identical. In other embodiments, the individual dies in the array of microcircuit die 204 may differ from one another. In some embodiments, the individual dies in the array of microcircuit die 204 may be configured for use in memory, logic, communications, and sensing applications, for example, although microcircuit dies may generally be used in any application.

[0023] FIG. 3A is a partial side view of a processing chamber including a temperature measurement device, such as the IRTS 122, according to one or more embodiments of the present disclosure, and FIG. 3B is a detailed enlarged view of FIG. 3A. The processing chamber 302 is substantially identical to the processing chamber 102. For example, the processing chamber 302 includes a multi-substrate holder 308 including a bottom member 314 coupled to one or more vertical supports 312 for supporting the one or more vertical supports 312 (one is shown in FIG. 3A). The vertical supports 312 further include a plurality of peripheral members 316 extending radially inward from the vertical supports 312. The plurality of peripheral members 316 are configured to support respective substrates 310 supported and transported by the substrate carrier. For clarity, the substrate carrier is not shown coupled to the peripheral members 316, and some of the peripheral members 316 have been removed. For ease of illustration, the substrate 310 includes, for example, a top substrate 310a, a middle substrate 310b, and a bottom substrate 310c.

[0024] As described above, the IRTS 322 is positioned outside the chamber body of the processing chamber 302 adjacent the viewport 324 for measuring the temperature of the substrate 310 as it is processed within the processing space of the processing chamber 302. The viewport 324 may be made of quartz or other suitable material, is transparent to the IRTS 322, and seals the processing space of the processing chamber 302 to a vacuum condition, isolating the IRTS 322 from the processing space of the processing chamber 302.

[0025] The IRTS 322 is mounted on a bracket 326 that is coupled to a side of the chamber body 304. The bracket 326 can be coupled to the chamber body 304 using any suitable fastening device, such as screws, bolts, etc. In some embodiments, the bracket 326 and the chamber body 304 can be monolithically formed.

[0026] The IRTS 322 can be fixedly or movably coupled to the bracket 326. For example, in some embodiments, for example when there are multiple substrates 310, the IRTS 322 can be vertically movable relative to the viewport 324 to scan the substrates 310, as described in more detail below. As shown in FIG. 3B, the bracket 326 can include, for example, an upstanding post 327 (or pillar) along which the IRTS 322 can move in a vertical direction. Thus, in some embodiments, an aperture of suitable configuration (not explicitly shown) can be defined through the IRTS 322 and configured to receive the post 327 of the bracket 326. Alternatively, the IRTS 322 can be attached to a side of the post 327 using one or more fastening devices, for example, clamps, nuts, bolts, and the like. One or more of the actuators, motors, or drivers (not explicitly shown), which can be controlled by a controller, for example, the controller 130, can be coupled to the IRTS 322 and / or the bracket 326, and can be configured to move the IRTS 322 along the post 327 during operation.

[0027] In some embodiments, the IRTS 322 can be manually manipulated along the post 327, and one or more devices can be used to lock the IRTS 322 into one or more positions along the post 327. For example, a threaded aperture can be defined through a side of the IRTS 322. The threaded aperture can be configured to receive a corresponding threaded, knurled knob that can be rotated to pass a threaded portion of the knob through the threaded aperture of the IRTS 322 such that a distal end of the threaded portion contacts the post 327, locking the IRTS 322 into one or more positions along the post 327.

[0028] Movement of the IRTS 322 along the post 327 ensures that any fixed position of the IRTS 322 relative to the viewport 324 (as best shown in FIG. 3B ) will provide a field of view for the IRTS 322 that is always smaller than the diameter of the aperture 325 defined through the chamber body 304. Similarly, if the IRTS 322 were fixedly mounted to the bracket 326 (e.g., the IRTS 322 could not move vertically), then any fixed position of the IRTS 322 relative to the viewport 324 would provide a field of view for the IRTS 322 that is always smaller than the diameter of the aperture 325 defined through the chamber body 304.

[0029] To ensure that the field of view of the IRTS 322 is always less than the diameter of the aperture 325, any one or more devices may be used to direct (or focus) the beam (e.g., infrared electromagnetic energy) output from the IRTS 322 for scanning the substrate 310 through a viewport 324. For example, with reference to FIG. 3C, in some embodiments, a Faraday cage 321c having one or more apertures 323c (two are shown in FIG. 3C) may be operatively coupled to an IRTS 322c that is identical to the IRTS 322 (or to a viewport 324), such that the beam emanating from the IRTS 322c may pass through the Faraday cage 321 and the viewport 324 to ensure that the field of view of the IRTS 322c is always less than the diameter of the aperture 325.

[0030] The viewport 324 may be mounted inside the processing chamber 302 using one or more devices including, but not limited to, clamps, plates, O-rings, gaskets, brackets, etc. For example, in some embodiments, the viewport 324 may be mounted inside a space or cavity defined in a chamber wall of the processing chamber 302 using a mounting bracket assembly 331 including one or more O-rings or centering rings 333 and a clamp 335.

[0031] The diameter of the aperture 325 can be about 5 millimeters to about 10 millimeters, but should not exceed a quarter wavelength of the energy used to process the substrate 310, for example, to minimize and / or prevent leakage of the energy used to process the substrate 310. For example, in some embodiments, such as when the processing chamber 302 is a microwave chamber, leakage of microwaves can be potentially harmful to an operator and / or make it difficult to reach a temperature for processing one or more of the substrates 310. Thus, the inventors have found that when the processing chamber 302 is a microwave chamber, the diameter of the aperture 325 should be about a quarter wavelength of the microwaves. The inventors have also found that in some embodiments, the field of view through the aperture 325 should form an optical ellipsoid (e.g., an elliptical field of view) on the one or more substrates 310. The optical ellipsoid allows the IRTS 322 to scan the substrate surface along the major axis of the optical ellipsoid during operation to obtain the temperature of the one or more substrates 310.

[0032] The angle of incidence of the beam output from the IRTS 322 for scanning the substrate 310 relative to the substrate 310 can be any suitable angle. For example, in some embodiments, the angle of incidence of the beam can be from about 3 degrees to about 7 degrees. Various factors can be used to determine the angle of incidence, including, but not limited to, the distance of the IRTS 322 from the substrate 310, the spacing between each of the substrates 310a-310c of the substrate 310, an angle of incidence that avoids or limits interference resulting from other materials present in the processing space of the processing chamber 302 when the substrate 310 is being processed, an angle of incidence that provides a maximum field of view on the substrate 310, etc.

[0033] 4 is a flow chart of a method 400 for processing a substrate, e.g., one or more of substrates 110a-110c, in accordance with one or more embodiments of the present disclosure. At 402, a substrate may be positioned on a support surface of one of substrate supports, e.g., substrate carriers 118a-118c, disposed in a processing space, e.g., processing space 106, of a processing chamber, e.g., processing chamber 102.

[0034] Next, at 404, an IRTS, e.g., IRTS 122, can be provided outside the chamber body 104 of the processing chamber 102 and adjacent to a viewport, e.g., viewport 124. Next, at 406, the IRTS can scan one or more substrates through the viewport and aperture, e.g., aperture 325. For example, if the aperture is configured to provide a field of view for more than one substrate, the IRTS can be moved vertically along the bracket to scan as many substrates as are in its field of view. In some embodiments, under the control of the controller 130, the IRTS can scan the substrates while processing them in the processing chamber. As described above, the IRTS is positioned on the bracket such that any fixed position of the IRTS relative to the viewport and / or aperture scans the substrates and always provides a field of view that is less than the diameter of the aperture, e.g., the IRTS moves to allow the beam to propagate through the aperture without interference.

[0035] During scanning of the substrates, at 408, the temperature of the substrates can be measured while the substrates are being processed within the processing space. The IRTS can, for example, detect infrared energy emitted by the substrates and can measure the temperature of each substrate based on one or more of an output reference voltage, a voltage gradient, and / or a voltage offset (or other electrical parameters). The controller receives the temperature measurements from the IRTS and controls the temperature of each substrate, for example, by controlling the power supply. For example, if the processing chamber is a microwave chamber that can be configured to perform, for example, a degassing process on the substrates, the controller can control one or more of the heat sources 128 (e.g., microwave heaters) to limit the amount of thermal energy accepted and radiated within the processing space of the processing chamber.

[0036] 5A is a perspective view of a portion of a processing chamber 502 including a temperature measurement device according to one or more embodiments of the present disclosure. The processing chamber 502 and the temperature measurement device are substantially identical to the processing chambers and temperature measurement devices described above. Thus, only the features unique to the processing chamber 502 and the temperature measurement device are described herein.

[0037] The processing chamber 502 can be configured to process one or more substrates, but unlike the processing chamber 302, the processing chamber 502 includes an aperture 525a (or slot) having a relatively large diameter and / or length compared to the aperture 325. More specifically, the inventors have found that in some cases, such as when the chamber is configured for high throughput (e.g., for processing large batches of multiple substrates), the aperture 525a defined in the chamber must be large enough so that the IRTS 522 can move vertically along the bracket to scan all substrates in the batches of substrates in one pass. However, as discussed above, because there is a slight possibility that processing energy may escape through the aperture 525a (e.g., if the slot is too large), one or more metal plates 521c (or baffles) are defined at a position between the IRTS 522 and the viewport 524 (see FIGS. 5C-5D).

[0038] The metal plate 521c may be made of any suitable metal and includes one or more apertures configured to allow the beam output from the IRTS 522 to pass through the viewport 524 to scan the substrate. In at least some embodiments, one aperture 525b may be positioned through the metal plate 521c. As described above, the aperture 525b has a diameter configured to minimize and / or prevent leakage of the energy used to process the substrate, e.g., less than about a quarter wavelength of the wavelength of the energy used to process the substrate.

[0039] Metal plate 521c is vertically movable as IRTS 522 moves vertically along the bracket posts during operation, such that a beam output from the IRTS can propagate through aperture 525b and viewport 524. Accordingly, one or more tabs are provided and configured to support metal plate 521c as it moves vertically. In some embodiments, for example, a plurality of tabs 550 (e.g., eight tabs are shown in the figures) are provided and coupled to metal block 552 using one or more screws, bolts, or other fasteners.

[0040] Metal block 552 includes a cutout 554 (see FIG. 5D ) of a suitable configuration similar to viewport 524, e.g., a generally rectangular configuration. One or more suitable gaskets (not explicitly shown) can be installed in or around cutout 554 to provide shielding from the energy used to process the substrate. In some implementations, one or more gaskets (or O-rings) can be installed around cutout 554 and between metal plate 521c and metal block 552. Gaskets can be made from any suitable material, including, but not limited to, plastic (e.g., thermoplastic), foam, rubber, and the like.

[0041] Disposed between the metal block 552 and the viewport 524 can be one or more protective barriers configured to prevent the metal block 552 from pressing directly against the viewport 562524 when the metal plate 521c is coupled to the process chamber 502. The one or more barriers can be, for example, one or more additional gaskets or other types of barriers. In some embodiments, for example, the barrier can be a rectangular cap 556 that partially covers the front of the viewport 524 along its perimeter. As with the gasket installed in the cutout 554, the cap 556 can be made of any suitable material, including, but not limited to, plastic (e.g., thermoplastic), foam, rubber, etc.

[0042] The viewport 524 is defined at a location between the metal block 552 and an additional metal block 558. More specifically, one or more of the metal blocks 552 and 558 may include a recess or groove 560 in which the viewport 524 is seated. For ease of illustration, only the recess 560 is shown in the metal block 558. One or more gaskets (or O-rings) may be provided within the recess 560. Compressing the viewport 524 between the metal blocks 552 and 558 provides a vacuum seal to maintain energy used to process substrates within the processing space of the processing chamber 502.

[0043] In some embodiments, the metal plate 521c including the viewport 524 including the tab 550, metal blocks 552 and 558, and cap 556 can be mounted within a cavity inside the wall of the processing chamber 502 adjacent the aperture 525a, as described above. In such embodiments, the IRTS 522 can be attached to a mounting bracket, e.g., bracket 326, that is coupled to the outer wall of the processing chamber 502 and can be in-line with the aperture 525b defined through the metal plate 521c.

[0044] Alternatively, in some embodiments, the viewport 524 including the tab 550, the metal blocks 552 and 558, and the cap 556 can be attached to an exterior wall of the processing chamber 502 adjacent the aperture 525a, for example, using one or more of a nut, bolt, screw, clamp, etc. In some embodiments, for example, the viewport 524 including the tab 550, the metal blocks 552 and 558, and the cap 556 can be attached to a metal plate 562 that can be used as a mount to the exterior wall, using another suitable mount (e.g., a nut, bolt, screw, clamp, etc.) of the processing chamber 502, as illustrated in FIGS. 5A-5D. In such embodiments, one or more gaskets or O-rings (not explicitly shown) can be provided between the metal block 558 and the metal plate 562 and / or between the metal plate 562 and the exterior wall of the processing chamber 502. When metal plate 562 is used, IRTS 522 can again be attached to a mounting bracket, such as bracket 326, that is connected to the exterior wall of processing chamber 502 (or metal plate 562) and can be in-line with aperture 525b through metal plate 521c. Additionally, when metal plate 562 is used, the temperature measurement device can be sold as a kit and configured to couple to processing chamber 502 and / or one or more other types of processing chambers.

[0045] The use of IRTS 522 is substantially similar to IRTS 322. For example, under the control of a controller, e.g., controller 130, IRTS 522 can scan one or more substrates such that the temperature of the substrates can be measured while the substrates are being processed within the processing space of processing chamber 502.

[0046] For example, the controller can move the IRTS 522 vertically along a post of a bracket (e.g., which can be coupled to the IRTS 522). The controller can also move the metal plate 521c in synchronization with the IRTS 522 to scan one or more substrates through the viewport 524 such that the IRTS 522 remains in-line with the aperture 525b of the metal plate 521c. However, because the viewport 524 and the aperture 525a defined through the processing chamber wall of the processing chamber 502 each have a larger diameter and / or length than the aperture 525b, the overall relative field of view seen by the IRTS 522 is larger than the field of view that the aperture 525b alone can provide, e.g., the aperture 525b can only provide a field of view that is approximately one-quarter wavelength of the wavelength of the energy used to process the substrates. Thus, the IRTS 522 can scan a relatively large number of substrates through the viewport 524 to obtain temperature measurements of the substrates while ensuring that no energy leaks through the aperture 525b while the substrates are being processed.

[0047] During scanning of the substrates, the IRTS 522 can detect infrared energy emitted by the substrates and can measure the temperature of each substrate based on one or more of the output reference voltage, voltage slope, and / or voltage offset (or other electrical parameters). The controller receives the temperature measurements from the IRTS 522 and controls the temperature of each substrate, for example, by controlling the power supply. For example, if the processing chamber is a microwave chamber that can be configured to perform, for example, a degassing process on the substrates, the controller can control one or more of the heat sources 128 (e.g., microwave heaters) to limit the amount of thermal energy accepted and radiated within the processing space of the processing chamber.

[0048] In some embodiments, it may prove advantageous to not have the metal plate 521c move with the IRTS 522. In such embodiments, the metal plate 521e may include a plurality of vertically aligned apertures 525e (four are shown in FIG. 5E). The beam from the IRTS 522e may propagate through one aperture at a time as the IRTS 522e moves vertically along the bracket post. For ease of illustration, the beam is shown propagating through the second aperture 525e from the top.

[0049] While the forgoing is directed to embodiments of the present disclosure, other and further embodiments of the disclosure may be devised without departing from the basic scope thereof.

Claims

1. 1. An apparatus for processing a substrate, comprising: a process chamber comprising a chamber body defining a process volume, the viewport coupled to the chamber body; a substrate support disposed within the processing space, the substrate support having a plurality of support surfaces for receiving and supporting a corresponding plurality of substrates; an infrared temperature sensor (IRTS) disposed outside the chamber body adjacent the viewport for measuring a temperature of one of the plurality of substrates during processing in the process space, the IRTS being movable relative to the viewport; a metal plate including at least one aperture, the metal plate being movable with the IRTS to direct a beam output from the IRTS through the at least one aperture and the viewport to scan the plurality of substrates; Equipped with An apparatus, wherein an angle of incidence of the beam output from the IRTS to scan one of the plurality of substrates with respect to the substrate creates an elliptical field of view.

2. 2. The apparatus of claim 1, wherein the IRTS is positioned relative to the viewport such that the field of view of the IRTS is always smaller than a diameter of an aperture defined in the process volume of the chamber body.

3. 2. The apparatus of claim 1, wherein a diameter of an aperture defined in the processing space of the chamber body is larger than a diameter of the at least one aperture in the metal plate for high throughput processing, and the at least one aperture in the metal plate is no larger than a quarter of a wavelength of microwave energy used to process the substrate.

4. The apparatus of claim 1 , wherein the IRTS is mounted on a bracket coupled to a side of the chamber body and is vertically movable along the bracket.

5. The apparatus of claim 1 , wherein the processing chamber is a microwave chamber.

6. The apparatus of claim 1 , wherein the angle of incidence of the beam is between 3 degrees and 7 degrees.

7. a controller operably coupled to the IRTS and a power supply used to process the plurality of substrates; 2. The apparatus of claim 1, wherein the controller receives an input from the IRTS in response to scanning the plurality of substrates and analyzes the input to control the power supply such that a temperature of one of the plurality of substrates does not exceed a threshold while the substrate is being processed.

8. The apparatus of claim 1 , wherein the substrate support supports the plurality of substrates in a vertically spaced apart configuration.

9. The apparatus of claim 1, wherein the metal plate is positioned adjacent to the viewport.

10. 1. A method for substrate packaging, comprising: positioning a plurality of substrates on a plurality of support surfaces of a substrate support disposed within a processing volume of a processing chamber having a chamber body and a viewport coupled to the chamber body; providing an infrared temperature sensor (IRTS) on an exterior side of the chamber body adjacent the viewport; moving the IRTS relative to the viewport to scan the plurality of substrates through the viewport, where scanning the plurality of substrates includes outputting a beam from the IRTS at an angle of incidence that creates an elliptical field of view for one of the plurality of substrates; moving a metal plate including at least one aperture with the IRTS for the scanning of the plurality of substrates, thereby directing the beam output from the IRTS through the at least one aperture and the viewport; measuring a temperature of each of the plurality of substrates while the plurality of substrates are being processed within the processing space; The method includes:

11. The method of claim 10 , wherein the IRTS is positioned relative to the viewport such that the field of view of the IRTS is always smaller than a diameter of an aperture defined in the process volume of the chamber body.

12. 11. The method of claim 10, wherein a diameter of an aperture defined in the processing space of the chamber body is larger than a diameter of the at least one aperture in the metal plate for high throughput processing, and the at least one aperture in the metal plate is no larger than a quarter of a wavelength of microwave energy used to process the substrate.

13. The method of claim 10 , wherein moving the IRTS comprises moving the IRTS vertically along a bracket coupled to a side of the chamber body.

14. The method of claim 10, wherein the angle of incidence of the beam is between 3 degrees and 7 degrees.

15. A non-transitory computer-readable storage medium storing instructions that, when executed by a processor, cause the processor to: positioning a plurality of substrates on a plurality of support surfaces of a substrate support disposed within a processing volume of a processing chamber having a chamber body and a viewport coupled to the chamber body; providing an infrared temperature sensor (IRTS) on an exterior side of the chamber body adjacent the viewport; moving the IRTS relative to the viewport to scan the plurality of substrates through the viewport, where scanning the plurality of substrates includes outputting a beam from the IRTS at an angle of incidence that creates an elliptical field of view for one of the plurality of substrates; moving a metal plate including at least one aperture with the IRTS for the scanning of the plurality of substrates, thereby directing the beam output from the IRTS through the at least one aperture and the viewport; measuring a temperature of each of the plurality of substrates while the plurality of substrates are being processed within the processing space; 16. A non-transitory computer readable storage medium that causes a method for substrate packaging to be performed, comprising:

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