Light-emitting substrate, its manufacturing method, and display device

Abstract

The present invention discloses a light emitting substrate, a manufacturing method thereof, and a display device. The light emitting substrate includes a driving circuit layer including a bonding electrode, an LED chip having a connection electrode connected to the bonding electrode, a sealing layer provided on the side of the LED chip remote from the driving circuit layer and covering the LED chip and the driving circuit layer, and a cover plate provided on the sealing layer remote from the LED chip, the surface of the sealing layer remote from the LED chip being the light emitting surface of the light emitting substrate.

Description

[Technical field]

[0001] The present invention relates to the technical field of displays, and more particularly to a light-emitting substrate, a manufacturing method thereof, and a display device. [Background technology]

[0002] Micro-LED (Micro Light-Emitting Diode) and Mini-LED (Mini Light-Emitting Diode) are new display technologies that have been actively developed in the market in recent years. Such display technologies have many incomparable advantages, such as a long lifespan, low screen delay, wide color gamut, and high refresh rate. With the reduction in cost and the maturity of related technologies, MLED (Mini-LED / Micro-LED) displays are gradually becoming the mainstream in the market. The conventional method of forming an MLED structure is to first form a driving circuit and a bonding electrode on a glass substrate, then transfer and bond the LED chip directly onto the glass substrate, and finally apply a sealing adhesive. Although this structure is simple, the display surface is located on the sealing adhesive and driving circuit side, so the scratch resistance of the display surface is poor. Summary of the Invention [Problem to be solved by the invention]

[0003] The present invention provides a light emitting substrate, a manufacturing method thereof, and a display device, so as to solve the technical problem that the surface of the MLED display device in the prior art has poor scratch resistance. [Means for solving the problem]

[0004] The present invention relates to a drive circuit layer including a bonding electrode; an LED chip including a connection electrode connected to the bonding electrode; a sealing layer provided on a side of the LED chip farther from the drive circuit layer and covering the LED chip and the drive circuit layer; a cover plate provided on the side of the encapsulation layer remote from the LED chip, the surface of the cover plate remote from the encapsulation layer being a light emitting surface of the light emitting substrate.

[0005] Optionally, in some embodiments of the present invention, the light emitting substrate further comprises a substrate disposed on a side of the driving circuit layer remote from the LED chip.

[0006] Optionally, in some embodiments of the present invention, the driving circuit layer further includes bonding pads, the substrate is a flexible substrate, and via holes are provided on the substrate, corresponding to the bonding pads, and exposing the surfaces of the bonding pads on the side away from the cover plate; The light emitting substrate further includes at least one driver chip including bonding pins connected to the corresponding bonding pads through the via holes.

[0007] Optionally, in some embodiments of the present invention, a diameter of the via hole is larger than a radial dimension of the corresponding bonding pin, and at least a portion of the bonding pin is located within the corresponding via hole.

[0008] Optionally, in some embodiments of the present invention, the bonding pin is fixedly engaged with the via hole.

[0009] Optionally, in some embodiments of the present invention, the driving circuit layer further includes bonding pads, and the light emitting substrate further includes at least one driving chip disposed on a side of the driving circuit layer away from the LED chips, the driving chip including a bonding pin connected to a corresponding one of the bonding pads.

[0010] Optionally, in some embodiments of the present invention, the bonding pins are in contact with the corresponding bonding pads such that a metallurgical bond is formed between the bonding pins and the corresponding bonding pads.

[0011] Optionally, in some embodiments of the present invention, the light emitting substrate further includes a conductive paste layer disposed between the bonding pad and the driving chip, and the bonding pin and the corresponding bonding pad are connected via the conductive paste layer.

[0012] Optionally, in some embodiments of the present invention, the light emitting substrate is a display panel or a backlight panel.

[0013] Therefore, the present invention further provides a display device formed by bonding at least two light-emitting substrates according to any of the above.

[0014] Thus, the present invention provides Providing a rigid substrate; Sequentially forming a substrate and a driving circuit layer including a bonding electrode and a bonding pad on the hard substrate; providing an LED chip, and bonding-connecting connection electrodes of the LED chip to the bonding electrodes; Sequentially forming an encapsulation layer and a cover plate on a side of the LED chip away from the rigid substrate; and peeling off the hard substrate.

[0015] Optionally, in some embodiments of the present invention, blanket or hole etch the substrate to expose surfaces of the bonding pads remote from the cover plate; The method further includes providing a driver chip and bonding the driver chip to the bonding pad. Effect of the Invention

[0016] The present invention provides a light emitting substrate, a manufacturing method thereof, and a display device. In the light emitting substrate, the driving circuit layer includes a plurality of bonding electrodes. Each of the LED chips includes two connection electrodes that are respectively connected to the corresponding bonding electrodes. The sealing layer is provided on the side of the LED chips far from the driving circuit layer, and covers the LED chips and the driving circuit layer. The cover plate is provided on the side of the sealing layer far from the LED chips, and the surface far from the sealing layer is the light emitting surface of the light emitting substrate. The present invention improves the scratch resistance of the surface of the light emitting substrate by inverting bonding the LED chip to the light emitting substrate, improves the corrosion resistance of the light emitting substrate to water and oxygen, and improves the reliability of the product. Furthermore, the substrate is peeled off or half-etched, and the driving chip is bonded to the side of the driving circuit layer far from the cover plate, and a double-sided bonding method is adopted to achieve the purpose of narrowing the frame or making it frameless (frameless, bezelless). [Brief description of the drawings]

[0017] In order to more clearly describe the technical means in the embodiments of the present invention, the following briefly introduces the drawings that need to be used in the description of the embodiments, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and those skilled in the art can also derive other drawings from these drawings without creative efforts. [Figure 1] FIG. 1 is a first structural schematic diagram of a light emitting substrate according to the present invention. [Diagram 2] FIG. 2 is a second structural schematic diagram of the light emitting substrate according to the present invention. [Diagram 3] FIG. 3 is a schematic diagram showing the planar structure of the light emitting surface of the light emitting substrate according to the present invention. [Figure 4] FIG. 4 is a schematic plan view of the rear surface of the light emitting substrate according to the present invention. [Diagram 5] FIG. 5 is a third structural schematic diagram of the light emitting substrate according to the present invention. [Figure 6] FIG. 6 is a fourth structural schematic diagram of the light emitting substrate according to the present invention. [Figure 7]FIG. 7 is a fifth structural schematic diagram of the light emitting substrate according to the present invention. [Figure 8] FIG. 8 is a structural schematic diagram of a display device according to the present invention. [Figure 9] FIG. 9 is a first flowchart of a method for manufacturing a light emitting substrate according to the present invention. [Figure 10] 10A to 10E are schematic diagrams of a structure obtained in steps 101 to 105 in a method for producing a light emitting substrate according to the present invention. [Figure 11] FIG. 11 is a second flowchart of the method for manufacturing a light emitting substrate according to the present invention. [Figure 12] 12A to 12D are schematic diagrams of the structure obtained in steps 106 and 107 in the method for producing a light emitting substrate according to the present invention. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0018] Hereinafter, the technical means in the embodiments of the present invention will be described clearly and completely with reference to the drawings in the embodiments of the present invention, but it is obvious that the described embodiments are not all of the embodiments of the present invention, but only some of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative efforts are all within the protection scope of the present invention.

[0019] In the description of the present invention, the terms "first" and "second" are merely for descriptive purposes and should not be understood to indicate or suggest the relative importance or number of technical features depicted. Thus, features qualified by "first" and "second" should not be understood as limiting the present invention, since they may expressly or imply the inclusion of one or more of said features.

[0020] The present invention provides a light emitting substrate, a manufacturing method thereof, and a display device, which will be described in detail below. Note that the order of description of the following embodiments does not limit the preferred order of the embodiments of the present invention.

[0021] As shown in Fig. 1, Fig. 1 is a first structural schematic diagram of a light emitting substrate according to the present invention. In an embodiment of the present invention, the light emitting substrate 100 includes a driving circuit layer 10 including a bonding electrode 11, an LED chip 20 including a connection electrode 21 connected to the bonding electrode 11, a sealing layer 30 provided on the LED chip 20 on the side remote from the driving circuit layer 10 and covering the LED chip 20 and the driving circuit layer 10, and a cover plate 40 provided on the sealing layer 30 on the side remote from the LED chip 20, the surface 40a on the side remote from the sealing layer 30 being the light emitting surface of the light emitting substrate 100.

[0022] In the embodiment of the present invention, the surface 40a of the cover plate 40 far from the sealing layer 30 is used as the light emitting surface of the light emitting substrate 100 by a method of inverting bonding the LED chip 20. Since the cover plate 40 has a high hardness, the scratch resistance of the surface of the light emitting substrate 100 is improved, and the LED chip 20 and the driving circuit layer 10 can be prevented from being scratched from the outside. In addition, in the conventional technology, the bonding electrode 11 and the connection electrode 21 are provided on the outside, which exposes the sealing layer 30 and makes it susceptible to corrosion from water and oxygen. In the light emitting substrate 100 of the embodiment of the present invention, the bonding electrode 11 and the connection electrode 21 are provided on the inside of the light emitting substrate 100, which improves the corrosion resistance of the light emitting substrate 100 to water and oxygen, thereby improving the reliability of the product.

[0023] In the embodiment of the present invention, the driving circuit layer 10 is for supplying driving signals such as a driving voltage and a power supply voltage to the LED chip 20, and may include a thin film transistor functional layer provided on a substrate. The specific configuration of the thin film transistor functional layer can be referred to in the prior art, and the description thereof will be omitted here.

[0024] In the embodiment of the present invention, the bonding electrodes 11 are signal output terminals for extracting driving signals on the driving circuit layer 10, and may be provided in at least two, specifically determined by the number of LED chips 20, and may be made of conductive materials with good conductivity and relatively low melting points, such as copper, aluminum, magnesium, silver, tin, indium tin oxide, etc., and may be arranged in an array. The number and arrangement structure of the bonding electrodes 11 can be designed according to actual requirements such as the resolution of the light emitting substrate 100, and the present invention is not limited thereto.

[0025] In the embodiment of the present invention, at least two LED chips 20 may be provided. Two connection electrodes 21 are provided on each LED chip 20. Bonding electrodes 11 are provided at intervals in the drive circuit layer 10 corresponding to each LED chip 20. The two bonding electrodes 11 are for extracting different drive signals in the drive circuit layer 10. Each connection electrode 21 and the corresponding bonding electrode 11 may be connected via a solder paste 13, or may be connected by a direct contact method such as fusion welding or metal bonding, and the present invention is not particularly limited thereto.

[0026] In the embodiment of the present invention, the LED chip 20 may be a Mini-LED chip, a Micro-LED chip, etc. The number of the LED chips 20 can be set according to the requirements of the size and luminous brightness of the light emitting substrate 100. The LED chip 20 further includes a light emitting material layer 23, a protective layer 22, a first electrode and a second electrode deposited on the light emitting material layer 23. Each connection electrode 21 is connected to a first electrode or a second electrode. Or, in the LED chip 20, one connection electrode 21 is the first electrode, and the other connection electrode 21 is the second electrode. Of course, the configuration of the LED chip 20 in the present invention is not limited to this.

[0027] The luminescent material of the LED chip 20 may be an inorganic luminescent material such as gallium nitride or an organic luminescent material such as quantum dots. The LED chip 20 can emit red light, blue light, green light, white light, yellow light, etc. When manufacturing the LED chip 20, different luminescent materials can be selected according to the needs of the emission color.

[0028] In one embodiment of the present invention, the plurality of LED chips 20 includes a red LED chip, a green LED chip and a blue LED chip. In the red LED chip, the luminescent material layer 23 is a red luminescent material layer 201. In the green LED chip, the luminescent material layer 23 is a green luminescent material layer 202. In the blue LED chip, the luminescent material layer 23 is a blue luminescent material layer 203.

[0029] In the embodiment of the present invention, the material of the encapsulation layer 30 is usually transparent so as to increase the light transmittance of the light emitting substrate 100. Specifically, the material of the encapsulation layer 30 may be OCA (Optically Clear Adhesive) or other transparent adhesive. In the embodiment of the present invention, the encapsulation layer 30 is formed using a transparent adhesive, which can improve the light extraction efficiency of the light emitting substrate 100 while increasing the adhesion between the driving circuit layer 10 and the cover plate 40, thereby improving the structural stability of the light emitting substrate 100. Furthermore, since the encapsulation layer 30 covers the LED chip 20, it can play a role of fixing and protecting the LED chip 20.

[0030] In the embodiment of the present invention, the cover plate 40 may be a glass cover plate or other hard transparent cover plate, and serves to support and protect other functional film layers in the light emitting substrate 100. Since the surface 40a of the cover plate 40 away from the sealing layer 30 is the light emitting surface of the light emitting substrate 100, providing the cover plate 40 as a transparent cover plate can improve the light extraction efficiency of the light emitting substrate 100.

[0031] In some embodiments of the present invention, the light emitting substrate 100 further includes a substrate 50 disposed on the side of the driving circuit layer 10 away from the LED chip 20 .

[0032] The substrate 50 may be a flexible substrate or a rigid substrate, may include one or more layers of flexible PI (Polyimide), and may be made of a material such as a resin.

[0033] In the embodiment of the present invention, the substrate 50 is provided on the side of the driving circuit layer 10 farther from the LED chip 20 , thereby serving to protect and support the driving circuit layer 10 , and the structural stability of the light emitting substrate 100 can be improved.

[0034] In an embodiment of the present invention, the light emitting substrate 100 may further include a driving chip for supplying a driving signal or a power supply voltage to the driving circuit layer 10. The driving chip may be provided in a frame region of the light emitting substrate 100, on a side of the light emitting substrate 100, or on a rear surface of the light emitting substrate 100, and the specific details will be described in the following embodiments, and the description thereof will be omitted here.

[0035] As shown in Fig. 2, Fig. 2 is a second structural schematic diagram of a light emitting substrate according to the present invention. The difference from the light emitting substrate 100 shown in Fig. 1 is that in this embodiment of the present invention, the driving circuit layer 10 further includes a bonding pad 12. The substrate 50 is a flexible substrate, and a via hole 50a is provided on the substrate 50. The via hole 50a is provided corresponding to the bonding pad 12, and exposes the surface of each bonding pad 12 away from the cover plate 40.

[0036] The light emitting substrate 100 further includes at least one driver chip 60 including bonding pins 61 connected to corresponding bonding pads 12 through via holes 50a.

[0037] One or more driving chips 60 may be provided. The number of driving chips 60 may be specifically set according to the size of the light emitting substrate 100. A plurality of bonding pads 12 may be provided. The number of bonding pins 61 may be equal to the number of bonding pads 12. The bonding pads 12 are bonded to the bonding pins 61 in one-to-one correspondence.

[0038] The bonding pads 12 are bonded to the bonding pins 61 so that the driving voltage or power supply voltage output from the driving chip 60 is output to the driving circuit or power supply wiring in the driving circuit layer 10 .

[0039] Specifically, please refer to FIG. 3 and FIG. 4. FIG. 3 is a schematic diagram of the planar structure of the light-emitting surface of the light-emitting substrate according to the present invention. FIG. 4 is a schematic diagram of the planar structure of the back surface of the light-emitting substrate according to the present invention. As shown in FIG. 3, the light-emitting substrate 100 includes a display area DA and a non-display area NA connected to the display area DA. A driving chip 60 is provided in the display area DA. A plurality of wirings are provided in the non-display area NA, which mainly transfer signals, and the description thereof is omitted here. Of course, in some embodiments, the light-emitting substrate 100 includes only the display area DA, so that a frameless structure can be realized. The driving chip 60 is bonded to the back surface of the light-emitting substrate 100. A plurality of driving chips 60 may be provided, and a plurality of driving chips 60 may be arranged in an array on the back surface of the light-emitting substrate 100. Of course, the setting of the driving chip 60 is not limited to this, and can be specifically set according to the actual configuration of the light-emitting substrate 100.

[0040] In an embodiment of the present invention, the substrate 50 is a flexible substrate, and an etching technique can be used to drill holes in the substrate 50 to realize bonding between the driving chip 60 and the driving circuit layer 10. For example, when the substrate 50 is a PI flexible substrate, the substrate 50 can be etched by a chemical solution according to the properties of the PI material.

[0041] In the embodiment of the present invention, the LED chip 20 is bonded to the side of the driving circuit layer 10 close to the cover plate 40, and the driving chip 60 is bonded to the side of the substrate 50 far from the cover plate 40. By using double-sided bonding and etching technology of the substrate 50, the driving chip 60 can be mounted on the back surface of the light emitting substrate 100, and the space required for independently bonding the driving chip 60 on the side is eliminated, thereby achieving the purpose of narrowing the frame or eliminating the frame. In addition, the technical difficulty is lower than that of directly mounting the driving chip 60 on the circuit substrate in the prior art.

[0042] Still referring to FIG. 2, in the embodiment of the present invention, the hole diameter of the via hole 50a is larger than the radial dimension of the corresponding bonding pin 61, and at least a portion of the bonding pin 61 is located within the corresponding via hole 50a.

[0043] In an embodiment of the present invention, the hole diameter of the via hole 50a is made larger than the radial dimension of the corresponding bonding pin 61, so that when bonding the driving chip 60, the bonding pin 61 can be inserted deeply into the via hole 50a, thereby reducing the thickness of the light-emitting substrate 100 and improving the bonding stability of the driving chip 60.

[0044] In an embodiment of the present invention, the shape of the via hole 50a may be the same as the shape of the bonding pin 61. For example, the cross-sectional structures of the via hole 50a and the bonding pin 61 may both be rectangular. To further improve the bonding stability of the driver chip 60, the bonding pin 61 may be engaged and fixed with the via hole 50a.

[0045] In an embodiment of the present invention, the depth of the bonding pin 61 may be greater than the depth of the via hole 50a. In this case, the bonding pin 61 may be contact-connected to the corresponding bonding pad 12. A metal bond is formed between the bonding pin 61 and the corresponding bonding pad 12.

[0046] Metallic bonds are chemical bonds that connect atoms in metals together. They differ from covalent and ionic bonds because the electrons in metallic bonds are delocalized, that is, not shared solely between two atoms. Conversely, the electrons in metallic bonds float freely in the crystal lattice of the metal nuclei. This type of bond gives metals many unique material properties, including excellent thermal and electrical conductivity, high melting points, and ductility. Metallic bonds provide excellent electrical conductivity between the bonding pin 61 and the corresponding bonding pad 12.

[0047] As shown in Fig. 5, Fig. 5 is a third structural schematic diagram of the light emitting substrate according to the present invention. The difference from the light emitting substrate 100 shown in Fig. 2 is that in the embodiment of the present invention, the light emitting substrate 100 further includes a conductive paste layer 70 disposed between the bonding pad 12 and the driving chip 60. The bonding pin 61 and the corresponding bonding pad 12 are connected via the conductive paste layer 70.

[0048] The material of the conductive paste layer 70 may be anisotropic conductive film (ACF). By using conductive particles in the anisotropic conductive film to connect and conduct the bonding pins 61 and the corresponding bonding pads 12, it is possible to prevent short circuits between adjacent bonding pins 61 or adjacent bonding pads 12. Of course, the conductive paste layer 70 may be made of other conductive pastes. The conductive paste layer 70 may be provided independently for each bonding pin 61 and the corresponding bonding pad 12.

[0049] As shown in Fig. 6, Fig. 6 is a fourth structural schematic diagram of the light emitting substrate according to the present invention. The difference from the light emitting substrate 100 shown in Fig. 2 is that the light emitting substrate 100 in this embodiment of the present invention does not include a substrate 50.

[0050] Similarly, in the embodiment of the present invention, the driving circuit layer 10 further includes a bonding pad 12. The light emitting substrate 100 further includes a driving chip 60 disposed on the driving circuit layer 10 on the side farther from the LED chip 20. The driving chip 60 includes a bonding pin 61 connected to the corresponding bonding pad 12.

[0051] The bonding pin 61 may be contact-connected to the corresponding bonding pad 12. A metal bond is formed between the bonding pin 61 and the corresponding bonding pad 12. That is, the bonding pin 61 and the corresponding bonding pad 12 are connected via a metal bond, so that there is excellent electrical conductivity between the bonding pin 61 and the corresponding bonding pad 12.

[0052] The light-emitting substrate 100 according to the embodiment of the present invention does not include a substrate, which makes it possible to further reduce the thickness of the light-emitting substrate 100 and realize a thinner light-emitting substrate 100, while also making it easier to bond between each bonding pin 61 and the corresponding bonding pad 12 and preventing bonding failures.

[0053] As shown in Fig. 7, Fig. 7 is a fifth structural schematic diagram of the light emitting substrate according to the present invention. The difference from the light emitting substrate 100 shown in Fig. 6 is that in the embodiment of the present invention, the light emitting substrate 100 further includes a conductive paste layer 70 disposed between the bonding pad 12 and the driving chip 60. The bonding pin 61 and the corresponding bonding pad 12 are connected via the conductive paste layer 70.

[0054] Similarly, the material of the conductive paste layer 70 may be an anisotropic conductive film. By using conductive particles in the anisotropic conductive film to connect and conduct the bonding pins 61 and the corresponding bonding pads 12, it is possible to prevent short circuits between adjacent bonding pins 61 or adjacent bonding pads 12. Of course, the conductive paste layer 70 may be made of other conductive pastes. The conductive paste layer 70 may be provided independently for each bonding pin 61 and the corresponding bonding pad 12.

[0055] In some embodiments of the present invention, the light emitting substrate 100 may be a display panel such as a Mini-LED display panel, a Micro-LED display panel, etc. In some embodiments of the present invention, the light emitting substrate 100 may be a backlight panel that serves as a backlight for a liquid crystal display device and supplies backlight required for displaying on the display panel.

[0056] Therefore, as shown in Fig. 8, Fig. 8 is a structural schematic diagram of a display device according to the present invention. In an embodiment of the present invention, a display device 1000 is formed by bonding at least two light-emitting substrates 100. The light-emitting substrate 100 is the light-emitting substrate 100 described in any of the above-mentioned embodiments, and therefore the description thereof is omitted here.

[0057] In the display device 1000, the embodiment of the present invention uses a method of reverse bonding of the LED chips to make the surface 40a of the cover plate away from the sealing layer the light-emitting surface of the light-emitting substrate, that is, the light-emitting surface of the display device 1000. The high hardness of the cover plate improves the scratch resistance of the surface of the light-emitting substrate and prevents the LED chips and the driving circuit layer from being scratched from the outside, thereby improving the product reliability of the display device 1000.

[0058] In addition, some embodiments of the present invention use double-sided bonding and substrate etching technology to provide the driving chip on the back side of the light-emitting substrate 100, thereby achieving the purpose of narrowing the frame or making the light-emitting substrate 100 frameless. When at least two light-emitting substrates 100 are bonded together to form the display device 1000, the seam can be effectively reduced and the display effect of the display device 1000 can be improved.

[0059] Therefore, the present invention further provides a method for manufacturing a light emitting substrate. Specifically, as shown in Fig. 9 and Fig. 10A to Fig. 10E, Fig. 9 is a flowchart of the method for manufacturing a light emitting substrate according to the present invention. Fig. 10A to Fig. 10E are schematic diagrams of a structure obtained in steps 101 to 105 in the method for manufacturing a light emitting substrate according to the present invention. The method for manufacturing a light emitting substrate specifically includes steps 101 to 105.

[0060] Step 101, provide a rigid substrate.

[0061] As shown in FIG. 10A, the hard substrate may be a glass substrate, a resin substrate or a rigid substrate to play a supporting role.

[0062] Step 102: a substrate and a driving circuit layer including a bonding electrode and a bonding pad are sequentially formed on the rigid substrate.

[0063] 10B, a substrate 50 is first deposited on the rigid substrate 15. The substrate 50 may be a flexible PI substrate.

[0064] Thereafter, the driving circuit layer 10 is manufactured and formed on the substrate 50. The driving circuit layer 10 may include a plurality of bonding electrodes 11 and a plurality of bonding pads 12, and may include a thin film transistor functional layer provided on the substrate 50. The specific configuration of the thin film transistor functional layer may refer to the prior art, and the description thereof will be omitted here. The bonding electrodes 11 and the bonding pads 12 are each connected to the thin film transistor functional layer.

[0065] The embodiment of the present invention adopts a glass substrate MLED process and utilizes a flat panel display process to manufacture the driving transistor, i.e., the driving circuit layer 10, to realize active driving.

[0066] Step 103: providing a plurality of LED chips, and bonding connection electrodes of the LED chips to the bonding electrodes.

[0067] As shown in FIG. 10C, the LED chip 20 may be a Mini-LED chip, a Micro-LED chip, etc. The LED chip 20 further includes a light emitting material layer 23, a protective layer 22, a first electrode and a second electrode deposited on the light emitting material layer 23. Each LED chip 20 includes two connection electrodes 21. Each connection electrode 21 is connected to the first electrode or the second electrode. Or, in the LED chip 20, one connection electrode 21 is the first electrode, and the other connection electrode 21 is the second electrode. Of course, the configuration of the LED chip 20 in the present invention is not limited to this.

[0068] Specifically, the embodiment of the present invention can bond the LED chip 20 by mass transfer technology. The LED chip 20 is bonded in the forward direction and then reversed for application. Compared to the conventional technology of COB (Chip On Board, where a bare chip is directly mounted on a circuit board) / chip mounting technology, the bonding efficiency, bonding accuracy, product specifications, etc. can be improved.

[0069] Step 104: sequentially forming an encapsulation layer and a cover plate on the side of the LED chip farther from the rigid substrate.

[0070] 10D, a sealing protection adhesive is applied to the side of the LED chip 20 farther from the hard substrate 15 so as to form a sealing layer 30. Next, a cover plate 40 is bonded onto the sealing layer 30.

[0071] The material of the encapsulation layer 30 may be OCA or other transparent adhesive. The encapsulation layer 30 is formed by coating with a transparent adhesive, which can improve the light extraction efficiency of the light emitting substrate 100. The encapsulation layer 30 covers the LED chip 20, and therefore can serve to fix and protect the LED chip 20.

[0072] The cover plate 40 may be a glass cover plate or other hard transparent cover plate, and serves to support and protect other functional film layers in the light emitting substrate 100. Since the surface 40a of the cover plate 40 away from the sealing layer 30 is the light emitting surface of the light emitting substrate 100, providing the cover plate 40 as a transparent cover plate can improve the light extraction efficiency of the light emitting substrate 100.

[0073] Step 105, peel off the hard substrate.

[0074] As shown in Fig. 10E, the light-emitting substrate formed in step 104 is turned over. Then, the hard substrate 15 is peeled off from the substrate 50 by a laser lift-off method or other methods. The laser lift-off technique is well known to those skilled in the art, and therefore, the description thereof is omitted here.

[0075] In addition, a driving chip can be bonded to the light emitting substrate. The driving chip 60 needs to be connected to the bonding pad 12 so as to output a driving signal to the driving circuit layer 10. The driving chip may be bonded to the side of the light emitting substrate or may be bonded to the back surface of the driving substrate.

[0076] Specifically, as shown in Fig. 11 and Fig. 12A to Fig. 12D, Fig. 11 is a second flowchart of the manufacturing method of the light emitting substrate according to the present invention. Fig. 12A to Fig. 12D are schematic diagrams of a structure obtained in steps 106 to 107 in the manufacturing method of the light emitting substrate according to the present invention. The difference from the manufacturing method of the light emitting substrate shown in Fig. 9 is that in the embodiment of the present invention, the manufacturing method of the light emitting substrate further includes steps 106 to 107.

[0077] Step 106, blanket etch or hole etch the substrate to expose the surfaces of the bonding pads facing away from the cover plate.

[0078] In some embodiments, substrate 50 is blanket etched, as shown in Figure 12A, i.e., substrate 50 is removed to expose the surface of bonding pad 12 facing away from cover plate 40.

[0079] In some other embodiments, as shown in Figure 12B, the substrate 50 is subjected to a drilling etch process to form via holes 50a. The via holes 50a are provided corresponding to the bonding pads 12 so as to expose the surface of each bonding pad 12 away from the cover plate 40.

[0080] Step 107: providing a driver chip, and bonding the driver chip to the bonding pad.

[0081] Specifically, the driver chip 60 may include a plurality of bonding pins 61. A plurality of bonding pads 12 may be provided. The number of bonding pins 61 may be equal to the number of bonding pads 12. The bonding pads 12 are bonded to the bonding pins 61 in one-to-one correspondence. The driver chip 60 outputs a driving signal, a power supply voltage, etc. through the bonding pins 61.

[0082] In some embodiments, when the substrate 50 is blanket etched, the driver chip 60 is bonded to the driver circuit layer 10 via the bonding pins 61 and the bonding pads 12, as shown in FIG. 12C.

[0083] In some other embodiments, as shown in FIG. 12D, if the substrate 50 is hole-etched, each bonding pin 61 is connected to a corresponding bonding pad 12 through a via hole 50a.

[0084] The shape of the via hole 50a can match the shape of the bonding pin 61. The hole diameter of the via hole 50a may be larger than the radial dimension of the corresponding bonding pin 61. At least a portion of the bonding pin 61 is located within the corresponding via hole 50a.

[0085] In the embodiment of the present invention, the conductive paste layer 70 can be used to connect the bonding pin 61 to the corresponding bonding pad 12, and the connection between the bonding pin 61 and the corresponding bonding pad 12 can also be realized by a metal bonding method.

[0086] In the manufacturing method of the light emitting substrate according to the embodiment of the present invention, the substrate 50 is perforated or fully etched by etching technology, and the driving chip 60 can be bonded to the back surface of the light emitting substrate 100, and the space for independently bonding the driving chip 60 to the side is eliminated, thereby achieving the purpose of narrowing the frame or making the substrate frameless. In addition, in the embodiment of the present invention, the driving circuit layer 10 is a thin film layer, and the driving chip 60 and the LED chip 20 are both on one side of the cover plate 40 by peeling or half-etching the substrate 50 and re-attaching the encapsulation layer 30. In addition, in the embodiment of the present invention, the driving chip 60 is directly bonded to the cover plate 40 side including the LED chip 20, so that the driving chip 60 is connected to the bonding pad 12 by drilling or peeling the substrate 50, and the technical difficulty is lower than that of the prior art in which the driving chip 60 is directly mounted on the circuit board.

[0087] The above provides a detailed description of the light-emitting substrate, the manufacturing method thereof, and the display device according to the present invention. Although the present specification uses specific examples to explain the principles and embodiments of the present invention, the explanation of the above examples is merely for understanding the method of the present invention and its core idea. Meanwhile, a person skilled in the art may make changes to the specific embodiments and scope of application based on the concept of the present invention. In summary, the contents of this specification should not be understood as limiting the present invention.

Claims

1. a light-emitting substrate comprising: a drive circuit layer including a bonding electrode; an LED chip including a connection electrode connected to the bonding electrode; a sealing layer provided on a side of the LED chip remote from the drive circuit layer and covering the LED chip and the drive circuit layer; and a cover plate provided on the sealing layer on the side remote from the LED chip, the surface remote from the sealing layer being a light-emitting surface of the light-emitting substrate, wherein the drive circuit layer further includes bonding pads, and the light-emitting substrate further includes at least one drive chip provided on the drive circuit layer on the side remote from the LED chip, the drive chip including bonding pins connected to the corresponding bonding pads.

2. A light-emitting substrate comprising: a drive circuit layer including a bonding electrode; an LED chip including a connection electrode connected to the bonding electrode; a sealing layer provided on a side of the LED chip remote from the drive circuit layer and covering the LED chip and the drive circuit layer; and a cover plate provided on the sealing layer on the side remote from the LED chip, the surface remote from the sealing layer being a light-emitting surface of the light-emitting substrate, wherein the light-emitting substrate further includes a substrate provided on the drive circuit layer on the side remote from the LED chip, the drive circuit layer further including bonding pads, the substrate being a flexible substrate, the substrate having via holes provided in correspondence with the bonding pads and exposing the surfaces of the bonding pads remote from the cover plate, and the light-emitting substrate further including at least one drive chip including a bonding pin connected to the corresponding bonding pad via the via hole.

3. The light emitting substrate according to claim 2 , wherein a diameter of the via hole is larger than a radial dimension of the corresponding bonding pin, and at least a portion of the bonding pin is located within the corresponding via hole.

4. The light emitting substrate according to claim 2 , wherein the bonding pin is engaged and fixed in the via hole.

5. The light emitting substrate according to claim 2 , wherein the bonding pins are in contact with the corresponding bonding pads, and metal bonds are formed between the bonding pins and the corresponding bonding pads.

6. The light-emitting substrate according to claim 2 , further comprising a conductive paste layer provided between the bonding pad and the driving chip, and the bonding pin and the corresponding bonding pad are connected via the conductive paste layer.

7. The light-emitting substrate according to claim 1 or 2, wherein the light-emitting substrate is a display panel or a backlight panel.

8. A display device formed by bonding at least two light emitting substrates according to any one of claims 1 to 6.

9. A method for manufacturing a light emitting substrate, comprising the steps of: providing a rigid substrate; sequentially forming, on the rigid substrate, a substrate and a driving circuit layer including bonding electrodes and bonding pads; providing a plurality of LED chips and bonding-connecting connection electrodes of the LED chips to the bonding electrodes; sequentially forming a sealing layer and a cover plate on a side of the LED chips farther from the rigid substrate; and peeling off the rigid substrate.

10. The method for manufacturing the light emitting substrate includes the steps of: performing full etching or hole etching on the substrate to expose a surface of the bonding pad that is farther from the cover plate; The method for manufacturing a light emitting substrate according to claim 9 , further comprising: providing a driving chip; and bonding the driving chip to the bonding pad.

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