Electrical connection device and method for manufacturing the same

Abstract

To provide an electrical connection device capable of easily inserting a probe into a guide hole formed in a guide plate, and a manufacturing method for an electrical connection device.SOLUTION: An electrical connection device comprises: a first guide plate having a first guide hole through which a probe passes; a second guide plate having a second guide hole through which the probe passes; and an introduction film placed between the first guide plate and the second guide plate and having an introduction guide hole through which the probe penetrates. The introduction film is composed of a material that dissolves with a specific solvent that does not dissolve the first guide plate, the second guide plate, and the probe.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present invention relates to an electrical connecting device used for measuring the characteristics of an object to be measured and a method for manufacturing the electrical connecting device. [Background technology]

[0002] An electrical connection device with a probe is used to measure an object under test such as an integrated circuit without separating it from a wafer. In a measurement using the electrical connection device, one end of the probe is brought into contact with a signal terminal of the object under test, and the other end of the probe is brought into contact with an electrode terminal (hereinafter also referred to as a "land") arranged on a printed circuit board or the like. The land is electrically connected to a measuring device such as an IC tester. An electrical signal is transmitted between the object under test and the measuring device via the electrical connection device.

[0003] In order for the electrical connection device to hold the probes, a probe head is used in which multiple guide plates are arranged along the axial direction of the probes. The probe head holds the probes with the probes passing through through holes (hereinafter referred to as "guide holes") formed in each guide plate. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] JP 2010-281583 A Summary of the Invention [Problem to be solved by the invention]

[0005] In the manufacture of electrical connection devices with guide plates, probes are successively inserted into the guide holes of multiple guide plates that are stacked apart from one another. In this case, it can be difficult to insert the probes into the guide holes of all of the guide plates. For example, there was a problem where the probe that had penetrated the guide hole of the first guide plate would collide with the second or subsequent guide plates due to deformation of the probe, etc.

[0006] In view of the above problems, an object of the present invention is to provide an electrical connecting device that allows a probe to be easily inserted into a guide hole formed in a guide plate, and a method for manufacturing the electrical connecting device. [Means for solving the problem]

[0007] The electrical connecting device according to one aspect of the present invention includes a first guide plate having a first guide hole through which a probe penetrates, a second guide plate having a second guide hole through which the probe penetrates, and a probe hole disposed between the first guide plate and the second guide plate. Guided by The introduction film is made of a material that is dissolved by a specific solvent that does not dissolve the first guide plate, the second guide plate, and the probe. Effect of the Invention

[0008] According to the present invention, it is possible to provide an electrical connecting device that allows a probe to be easily inserted into a guide hole formed in a guide plate, and a method for manufacturing the electrical connecting device. [Brief description of the drawings]

[0009] [Figure 1] 1 is a schematic diagram showing a configuration of an electrical connecting device according to an embodiment of the present invention. [Diagram 2] 1A to 1C are schematic process diagrams for explaining a manufacturing method of an electrical connecting device according to an embodiment of the present invention (part 1). [Diagram 3] 5A to 5C are schematic process diagrams for explaining the manufacturing method of the electrical connecting device according to the embodiment of the present invention (part 2). [Figure 4] 5A to 5C are schematic process diagrams for explaining the manufacturing method of the electrical connecting device according to the embodiment of the present invention (part 3). [Diagram 5] 4A to 4C are schematic process diagrams for explaining the manufacturing method of the electrical connecting device according to the embodiment of the present invention (part 4). [Figure 6] FIG. 13 is a schematic diagram for explaining an offset arrangement. [Figure 7]FIG. 13 is a schematic diagram showing an electrical connecting device of a comparative example. [Figure 8] 11A to 11C are schematic diagrams illustrating a manufacturing method of an electrical connecting device of a comparative example. [Figure 9] 1 is a schematic diagram showing an example of a probe card using an electrical connecting device according to an embodiment of the present invention. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0010] Next, an embodiment of the present invention will be described with reference to the drawings. In the following description of the drawings, the same or similar parts are given the same or similar reference numerals. However, it should be noted that the drawings are schematic, and the thickness ratios of each part are different from the actual ones. In addition, the drawings include parts with different dimensional relationships and ratios. The embodiments shown below are examples of devices and methods for embodying the technical ideas of this invention, and the embodiments of this invention do not specify the materials, shapes, structures, arrangements, etc. of the components as described below.

[0011] 1 shows the configuration of an electrical connecting device 1 according to an embodiment of the present invention. The electrical connecting device 1 has a probe head 2 having a function of holding a probe 10. The probe head 2 includes a first guide plate 21, a second guide plate 22, and a third guide plate 23. The probe head 2 has a configuration in which the second guide plate 22 and the third guide plate 23 are integrated. The probe head 2 also includes a first introduction film 31 and a second introduction film 32 that are arranged between the first guide plate 21 and the second guide plate 22 and spaced apart from each other.

[0012] 1, the probe head 2 has a configuration in which a first guide plate 21, a first introduction film 31, a second introduction film 32, a second guide plate 22, and a third guide plate 23 are arranged in this order along the Z-axis direction. Here, the Z-axis direction is the axial direction of the probe 10 held by the probe head 2. A plane perpendicular to the Z-axis direction is defined as the XY plane.

[0013] The first guide plate 21, the second guide plate 22, the third guide plate 23, the first introduction film 31, and the second introduction film 32 each have a guide hole through which the probe 10 passes. The guide hole of the first guide plate 21 is referred to as the first guide hole 210, the guide hole of the second guide plate 22 is referred to as the second guide hole 220, and the guide hole of the third guide plate 23 is referred to as the third guide hole 230. In addition, the guide hole of the first introduction film 31 is referred to as the first introduction guide hole 310, and the guide hole of the second introduction film 32 is referred to as the second introduction guide hole 320.

[0014] Hereinafter, the guide plates of the probe head 2, such as the first guide plate 21 to the third guide plate 23, are also referred to as "guide plates 20." The guide holes formed in the guide plates 20 are also referred to as "guide holes 200." The introduction films of the probe head 2, such as the first introduction film 31 and the second introduction film 32, are also referred to as "introduction films 30." The guide holes formed in the introduction films 30 are also referred to as "introduction guide holes 300."

[0015] 1 holds the probe 10 so that the probe 10 is linear. In other words, the guide plate 20 and the introduction film 30 are arranged so that the central axes of the guide hole 200 of the guide plate 20 and the introduction guide hole 300 of the introduction film 30 coincide with each other.

[0016] The probe head 2 has a spacer 40 disposed between the outer edge region of the first guide plate 21 and the outer edge region of the second guide plate 22. The spacer 40 defines a hollow region 25 between the first guide plate 21 and the second guide plate 22. A first introduction film 31 and a second introduction film 32 are disposed in the hollow region 25. As will be described later, when measuring the object to be measured, the probe head 2 holds the probe 10 in a curved state in the hollow region 25.

[0017] The spacer 40 shown in FIG. 1 has a configuration in which a plurality of partial spacers are stacked along the Z-axis direction. Specifically, the spacer 40 has a configuration in which three partial spacers, a first spacer 41, a second spacer 42, and a third spacer 43, are stacked and arranged between the first guide plate 21 and the second guide plate 22 along the Z-axis direction. The outer edge of the introduction film 30 is sandwiched between the partial spacers. That is, the outer edge of the first introduction film 31 is sandwiched between the first spacer 41 and the second spacer 42. The outer edge of the second introduction film 32 is sandwiched between the second spacer 42 and the third spacer 43.

[0018] 1, in order to make the configuration easier to understand, an example is shown in which the probe head 2 holds three probes 10. The number of probes 10 held by the probe head 2 is set arbitrarily depending on the number of signal terminals of the device under test, etc.

[0019] The introduction film 30 is made of a material that dissolves in a specific solvent that does not dissolve the components other than the introduction film 30 of the probe head 2 and the probe 10. In other words, the first introduction film 31 and the second introduction film 32 are dissolved in a specific solvent that does not dissolve the guide plate 20 and the spacer 40 of the probe head 2, and the probe 10.

[0020] For example, the material of the introduction film 30 may be any one of polyvinyl alcohol, starch, and gelatin. The components of the probe head 2 excluding the introduction film 30, i.e., the guide plate 20 and the spacer 40, are made of materials such as ceramic. The material of the probe 10 is palladium (Pd) or nickel (Ni). In this case, water may be used as a specific solvent that dissolves the introduction film 30 without dissolving the guide plate 20, the spacer 40, and the probe 10.

[0021] 2 to 5, a method for manufacturing the electrical connecting device 1 according to the embodiment will be described below. In the following, for ease of understanding, the spacers 40 are omitted from the illustration, and only one probe 10 is shown. In practice, the number of probes 10 required for the measurement of the object to be measured is used.

[0022] First, a probe head 2 is prepared, which includes a guide plate 20 having a guide hole 200 and an introduction film 30 having an introduction guide hole 300. For example, a probe head 2 is prepared which includes a first guide plate 21 to a third guide plate 23, a first introduction film 31 and a second introduction film 32 as shown in FIG.

[0023] Then, the probe 10 is passed through the guide hole 200 of the guide plate 20 of the probe head 2 and the introduction guide hole 300 of the introduction film 30. For example, as shown by the arrows in Fig. 3, the probe is passed through the first guide hole 210, the first introduction guide hole 310, the second introduction guide hole 320, the second guide hole 220, and the third guide hole 230 in this order. At this time, the probe 10 is passed through the guide hole 200 and the introduction guide hole 300 with the central axes of the guide hole 200 and the introduction guide hole 300 coinciding with each other.

[0024] Next, the introduction film 30 is dissolved by a specific solvent that does not dissolve the guide plate 20, the spacer 40, and the probe 10. For example, as shown in FIG. 4, a container 50 is prepared that contains a solution 500 that dissolves the introduction film 30 but does not dissolve the components of the probe head 2 other than the introduction film 30 and the probe 10. Then, the probe head 2 holding the probe 10 is immersed in the solution 500. This dissolves the introduction film 30 of the probe head 2.

[0025] When the introduction film 30 is dissolved, a gap is generated between the partial spacers by the thickness of the introduction film 30. This gap may be closed by pressing the first guide plate 21 and the second guide plate 22 together in the Z-axis direction. For example, the probe head 2 may be configured to join the first guide plate 21 to the third guide plate 23 with a screw that penetrates the spacer 40 and the introduction film 30. By tightening this screw, the gap generated between the partial spacers of the spacer 40 is closed.

[0026] After dissolving the introduction film 30, the relative position of the second guide hole 220 with respect to the first guide hole 210 is moved along a direction perpendicular to the extension direction of the probe 10. At this time, it is not necessary to change the relative positions of the second guide hole 220 and the third guide hole 230. For example, as shown by the arrow M in FIG. 5, the second guide plate 22 and the third guide plate 23 are moved in parallel with respect to the first guide plate 21.

[0027] By moving a part of the guide plate 20 in parallel, the position of the guide hole 200 through which the same probe 10 penetrates moves in a direction parallel to the main surface of the guide plate 20 when viewed from the surface normal direction of the main surface of the guide plate 20. In other words, the second guide hole 220 and the third guide hole 230 are shifted in parallel with respect to the first guide hole 210. An arrangement in which the positions of the guide holes 200 are shifted in this manner is hereinafter referred to as an "offset arrangement."

[0028] Due to the offset arrangement, the probe 10 is curved by elastic deformation in the hollow region 25 between the first guide plate 21 and the second guide plate 22. To realize the offset arrangement, the probe head 2 is configured so that the relative position of the second guide hole 220 with respect to the first guide hole 210 can be moved freely along a direction perpendicular to the extension direction of the probe 10.

[0029] When the tip of the probe 10 held by the probe head 2 comes into contact with the object to be measured, a stress P is applied to the probe 10 along the axial direction of the probe 10, as shown by the arrow in Fig. 6. At this time, in the probe head 2 having the offset arrangement structure, the probe 10 buckles in the hollow region 25. That is, the probe 10 is further curved by bending deformation between the first guide plate 21 and the second guide plate 22. This allows the probe 10 to come into contact with the object to be measured with a stable pressure.

[0030] In the comparative example in which the introduction film 30 is not removed from the probe head 2, the space in which the probe 10 buckles is narrow. For this reason, as shown in FIG. 7, for example, the probe 10 to which the stress P is applied does not buckle into a predetermined shape. As a result, the probe 10 and the measured object cannot be stably contacted with each other at a predetermined pressure. In addition, if the introduction film 30 is left on the probe head 2, the probe 10 is greatly curved between the introduction film 30. As a result, even after the stress P is removed, the probe 10 may remain deformed and not return to its original linear shape. If the probe 10 is deformed, the probe 10 and the measured object do not come into contact with each other at a predetermined pressure, and accurate measurement cannot be performed. In addition, if the probe 10 is curved, it is difficult to pull out the probe 10 from the probe head 2 when replacing the probe 10 in the probe head 2. In addition, if the probe 10 arranged in the probe head 2 is curved, the newly inserted probe 10 and the curved probe 10 come into contact with each other, making it difficult to replace the probe 10.

[0031] On the other hand, when the probe head does not have the introduction film 30, the intervals between the guide holes 200 through which the same probe 10 penetrates are wide. For this reason, it may be difficult to continuously insert the probes 10 into the guide holes 200 of all the guide plates 20 due to bending of the probes 10 caused by manufacturing errors and the positional accuracy of the guide holes 200. For example, as in the manufacturing method of the electrical connection device of the comparative example shown in FIG. 8, the tip of the probe 10 that penetrates the guide hole of the first guide plate 21 collides with the surface of the second guide plate 22. Thus, in a probe head without the introduction film 30, a problem occurs in which the probe 10 cannot penetrate all the guide plates.

[0032] For example, in the case of a probe 10 having a total length of 3 mm and an outer diameter of 60 μm, the inner diameter of the guide hole 200 is about 65 μm. The distance between the guide holes 200 is about 15 μm. Therefore, if the probe 10 is curved even slightly, the tip of the probe 10 may collide with the guide plate 20 in the process of inserting the probe 10 into the probe head. On the other hand, by widening the inner diameter of the guide hole 200, the possibility of the probe 10 colliding with the guide plate 20 can be reduced. However, widening the inner diameter of the guide hole 200 causes the position of the probe 10 to shift inside the guide hole 200. As a result, the alignment accuracy between the probe 10 and the object to be measured decreases.

[0033] In contrast to this, in the electrical connecting device 1, the probe 10 is passed through the guide hole 200 of the guide plate 20 while the position of the probe 10 is corrected by the introduction guide hole 300 of the introduction film 30. Therefore, according to the electrical connecting device 1, the probe 10 can be passed through all of the guide holes 200 of the guide plate 20 without widening the difference between the outer diameter of the probe 10 and the inner diameter of the guide hole 200.

[0034] As described above, in the electrical connecting device 1 according to the embodiment, the introduction film 30 is disposed in the hollow region 25 where the interval between the guide plates 20 is wide. This makes it possible to narrow the interval between the guide holes through which the probes 10 penetrate along the axial direction of the probes 10. As a result, the electrical connecting device 1 makes it possible to easily insert the probes 10 into the guide holes 200 formed in the guide plates 20.

[0035] 1 illustrates an example in which the probe head 2 has the first guide plate 21 to the third guide plate 23. However, the number of guide plates of the probe head 2 is not limited to three. For example, the probe head 2 may have two guide plates, the first guide plate 21 and the second guide plate 22. Alternatively, the probe head 2 may have four or more guide plates.

[0036] Although the probe head 2 has the first introduction film 31 and the second introduction film 32, the number of introduction films 30 in the probe head 2 is not limited to two. For example, the number of introduction films 30 in the probe head 2 may be three or more. Also, although the example has been shown in which a plurality of introduction films 30 are arranged spaced apart from each other between the first guide plate 21 and the second guide plate 22, the number of introduction films 30 in the probe head 2 may be one.

[0037] For example, when the distance of hollow area 25 in the Z-axis direction is long, the number of introduction films 30 is increased. This allows the position of probe 10 to be corrected throughout hollow area 25. On the other hand, when the distance of hollow area 25 in the Z-axis direction is short, the number of introduction films 30 may be decreased. By decreasing the number of introduction films 30, the manufacturing cost of electrical connecting device 1 can be reduced. In the case of probe 10 with a total length of 3 mm and an outer diameter of 60 μm, the distance between guide plate 20 and introduction film 30 may be, for example, about 1 mm.

[0038] In the above, the case where all the introduction films 30 are removed from the probe head 2 has been described, but there may be a manufacturing method in which all the introduction films 30 are not removed from the probe head 2. For example, some of the introduction films 30 may be removed from the probe head 2 so that a space is secured in the hollow region 25 in which the probe 10 can buckle into a predetermined shape. In this case, only the introduction films 30 to be removed may be immersed in a solvent. Alternatively, a material that dissolves in a specific solvent may be used only for the introduction films 30 to be removed, and a material that does not dissolve in a specific solvent may be used for the introduction films 30 to be left on the probe head 2.

[0039] Fig. 9 shows an example of the configuration of a probe card 3 having an electrical connecting device 1 manufactured by the manufacturing method described above. The probe card 3 is used to measure electrical characteristics of a measured object 100. The probe card 3 shown in Fig. 9 is a vertically operating probe card, and for example, a stage 70 carrying the measured object 100 rises, and the tip of the probe 10 comes into contact with the measured object 100. Fig. 9 shows a state in which the probe 10 is not in contact with the measured object 100.

[0040] The probe card 3 includes a probe head 2 that holds a probe 10, and a wiring board 60. The probe 10 is curved in a hollow area 25 formed by a spacer 40 between a first guide plate 21 and a second guide plate 22. The base end of the probe 10 exposed on the upper surface of the first guide plate 21 of the probe head 2 is connected to an electrode terminal (land 61) arranged on the lower surface of the wiring board 60 facing the probe head 2. The land 61 is electrically connected to a measuring device (not shown) such as an IC tester.

[0041] When the measured object 100 is measured, the tip of the probe 10 exposed on the lower surface of the third guide plate 23 of the probe head 2 comes into contact with a measurement pad (not shown) of the measured object 100. Then, an electric signal is transmitted between the measured object 100 and the measurement device via the probe 10 and the wiring board 60. For example, a predetermined voltage or current is applied to the measured object 100 by the measurement device via the probe 10. Then, an electric signal output from the measured object 100 is sent to the measurement device via the probe 10, and the characteristics of the measured object 100 are measured. After the electrical characteristics of the measured object 100 are measured, the stage 70 carrying the measured object 100 is lowered, so that the probe 10 and the measured object 100 are brought into a non-contact state.

[0042] (Other embodiments) Although the present invention has been described above by way of the embodiment, the description and drawings forming part of this disclosure should not be understood as limiting the present invention. Various alternative embodiments, examples and operating techniques will become apparent to those skilled in the art from this disclosure.

[0043] For example, although the above example shows the outer edge of the introduction film 30 being sandwiched between the partial spacers, the introduction film 30 may be disposed in the hollow region 25 by other methods. For example, the end of the introduction film 30 may be joined to the wall surface of the spacer 40 facing the hollow region 25.

[0044] In the above description, the cross-sectional shape of the probe 10 and the shapes of the guide hole 200 and the introduction guide hole 300 are round, but these shapes are not limited to round. For example, the cross-sectional shape of the probe 10 and the shapes of the guide hole 200 and the introduction guide hole 300 may be square.

[0045] Thus, the present invention includes various embodiments that are not described herein. [Explanation of symbols]

[0046] 1...Electrical connection device 2. Probe head 3. Probe card 10…Probe 21…First guide plate 22…Second guide plate 23…Third guide plate 25...Hollow area 31…First introduction film 32…Second introduction film 40…Spacer 100…Object to be measured

Claims

1. An electrical connection device having a function of holding a probe, a first guide plate having a first guide hole through which the probe passes; a second guide plate having a second guide hole through which the probe passes; an introduction film disposed between the first guide plate and the second guide plate; Equipped with 2. An electrical connecting device, comprising: said introduction film made of a material that dissolves in a specific solvent that does not dissolve said first guide plate, said second guide plate and said probe.

2. 2. The electrical connecting device according to claim 1, wherein the first guide plate, the second guide plate and the introduction film are arranged so that the central axes of the first guide hole and the second guide hole are aligned.

3. 3. The electrical connecting device according to claim 1, wherein the position of the second guide hole relative to the first guide hole is movable in a direction perpendicular to the extending direction of the probe.

4. a spacer disposed between an outer edge of the first guide plate and an outer edge of the second guide plate, the spacer being insoluble in the specific solvent; The guide film is disposed in a hollow region defined between the first guide plate and the second guide plate by the spacer.

4. The electrical connecting device according to claim 1, wherein the electrical connecting device is a connector.

5. 5. The electrical connecting device according to claim 4, wherein an outer edge of the introduction film is sandwiched between a plurality of partial spacers that constitute the spacer.

6. 6. The electrical connecting device according to claim 1, wherein a plurality of the introduction films are disposed between the first guide plate and the second guide plate and spaced apart from each other.

7. preparing a probe head including a first guide plate having a first guide hole, a second guide plate having a second guide hole, and an introduction film having an introduction guide hole and disposed between the first guide plate and the second guide plate; A probe is inserted through the first guide hole, the introduction guide hole, and the second guide hole in succession; The introduction film is dissolved by a specific solvent that does not dissolve the first guide plate, the second guide plate, and the probe. A method for manufacturing an electrical connecting device comprising the steps of:

8. 8. The method for manufacturing an electrical connection device according to claim 7, characterized in that the probe is passed through the first guide hole, the introduction guide hole and the second guide hole with the central axes of the first guide hole, the second guide hole and the introduction guide hole aligned.

9. The method for manufacturing an electrical connection device described in claim 7 or 8, characterized in that after the introduction film is dissolved, the relative position of the second guide hole with respect to the first guide hole is moved along a direction perpendicular to the extension direction of the probe.

10. 10. The method for manufacturing an electrical connecting device according to claim 7, wherein the probe head comprises a plurality of the introduction films arranged spaced apart from each other between the first guide plate and the second guide plate.

11. 11. The method for manufacturing an electrical connecting device according to claim 7, wherein the material of the introduction film is any one of polyvinyl alcohol, starch, and gelatin.

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