Mounting table and inspection device

Abstract

To provide a mounting table that suppresses warpage.SOLUTION: A mounting table includes: a mounting section having a plate member on which an object to be inspected is placed and a transparent member; and a light irradiation mechanism that irradiates light to raise temperature of the object to be inspected. The plate member is made of a member being transparent, and has a thermally sprayed film on a surface of the plate member. The thermally sprayed film includes: an insulating film formed on the plate member; and a resistance temperature detector film formed on the insulating film. The thermally sprayed film is configured to absorb the light emitted from the light irradiation mechanism so as to be heated.SELECTED DRAWING: Figure 2

Description

[Technical field]

[0001] The present disclosure relates to a mounting table and an inspection apparatus. [Background technology]

[0002] There is known an inspection apparatus that inspects the electrical characteristics of an electronic device by placing a wafer on which an electronic device is formed or a carrier on which an electronic device is arranged on a mounting table and supplying a current from a tester to the electronic device via a probe, etc. The temperature of the electronic device is controlled by a cooling mechanism or a heating mechanism in the mounting table.

[0003] Patent Document 1 discloses a mounting stage comprising a cooling mechanism on which an object to be inspected is placed, and a light irradiation mechanism arranged to face the object to be inspected via the cooling mechanism, the cooling mechanism being made of a light-transmitting member through which a light-transmitting refrigerant flows, and the light irradiation mechanism having a number of LEDs directed at the object to be inspected. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] JP 2018-151369 A Summary of the Invention [Problem to be solved by the invention]

[0005] However, when the object to be inspected is heated by the light irradiation mechanism, the upper surface side of the cooling mechanism is also heated, and the temperature difference between the upper and lower surfaces of the cooling mechanism may cause the mounting table to warp. In addition, since the area heated by the light irradiation mechanism is limited, a high-temperature region heated by light irradiation by the light irradiation mechanism and a low-temperature region not irradiated by the light irradiation mechanism are mixed, and the temperature difference between the high-temperature region and the low-temperature region of the cooling mechanism may cause the mounting table to warp.

[0006] In one aspect, the present disclosure provides a mounting table and an inspection apparatus that suppress warping. [Means for solving the problem]

[0007] In order to solve the above problems, according to one aspect, a test apparatus includes a mounting section having a plate member and a light-transmitting member on which an object to be inspected is mounted, and a light irradiation mechanism that irradiates light to raise the temperature of the object to be inspected, the plate member being formed of a light-transmitting member and having a sprayed film on a surface of the plate member, the sprayed film having an insulating film formed on the plate member and a resistance temperature detector film formed on the insulating film. 、 Light emitted from the light irradiation mechanism is transmitted through the light-transmitting member and the plate member, and is formed by the thermal spray coating. Absorb The thermal sprayed film Heated The deformation force due to thermal expansion of the sprayed film is smaller than the rigidity of the plate member. A mounting platform is provided. Effect of the Invention

[0008] According to one aspect, it is possible to provide a mounting table and an inspection device that suppress warping. [Brief description of the drawings]

[0009] [Figure 1] FIG. 2 is a schematic cross-sectional view illustrating the configuration of the inspection device according to the embodiment. [Diagram 2] FIG. 3 is a schematic cross-sectional view illustrating the configuration of an upper portion of a stage according to the first embodiment. [Diagram 3] 5A and 5B are diagrams showing a comparison between the stage of the reference example and the stage of the first embodiment during light irradiation. [Figure 4] FIG. 11 is a schematic cross-sectional view illustrating the configuration of an upper portion of a stage according to a second embodiment. [Diagram 5] FIG. 13 is a schematic cross-sectional view illustrating the configuration of an upper portion of a stage according to a third embodiment. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0010] Hereinafter, an embodiment of the present disclosure will be described with reference to the drawings. In the drawings, the same components are denoted by the same reference numerals, and duplicated descriptions may be omitted.

[0011] <Inspection equipment> An inspection device 10 including a stage (mounting table) 11 according to this embodiment will be described with reference to Fig. 1. Fig. 1 is a schematic cross-sectional view illustrating the configuration of the inspection device 10 according to this embodiment.

[0012] The inspection apparatus 10 is an apparatus that inspects the electrical characteristics of each of a plurality of electronic devices arranged on a carrier (test subject) C. The inspection apparatus 10 includes a storage chamber 12 that houses a stage 11 on which the carrier C is placed, a loader 13 that is arranged adjacent to the storage chamber 12, and a tester 14 that is arranged to cover the storage chamber 12.

[0013] The accommodation chamber 12 has a hollow housing shape. A stage 11 on which the carrier C is placed and a probe card 15 arranged to face the stage 11 are accommodated inside the accommodation chamber 12. The probe card 15 has electrode pads (electrode pads 26 described later in FIG. 2) provided corresponding to the electrodes of each electronic device (electronic device 25 described later in FIG. 2) of the carrier C and a large number of needle-shaped probes (contact terminals) 16 arranged corresponding to solder bumps.

[0014] The stage 11 has a fixing mechanism (not shown) for fixing the carrier C to the stage 11. This prevents the carrier C from being displaced relative to the stage 11. The accommodation chamber 12 is also provided with a moving mechanism (not shown) for moving the stage 11 horizontally and vertically, thereby adjusting the relative positions of the probe card 15 and the carrier C to bring electrode pads and solder bumps provided corresponding to the electrodes of each electronic device into contact with each probe 16 of the probe card 15.

[0015] The loader 13 takes out a carrier C on which electronic devices are placed from a FOUP (not shown), which is a transport container, and places it on a stage 11 inside the storage chamber 12. It also removes the carrier C that has been inspected from the stage 11 and stores it in the FOUP.

[0016] The probe card 15 is connected to the tester 14 via the interface 17, and when each probe 16 contacts an electrode pad or a solder bump provided corresponding to the electrode of each electronic device on the carrier C, each probe 16 supplies power from the tester 14 to the electronic device via the interface 17, or transmits a signal from the electronic device to the tester 14 via the interface 17.

[0017] Tester 14 has a test board (not shown) that reproduces part of the circuit configuration of a motherboard on which an electronic device is mounted, and the test board is connected to a tester computer 18 that judges the acceptability of the electronic device based on a signal from the electronic device. Tester 14 can reproduce the circuit configurations of a variety of motherboards by replacing the test board.

[0018] The control unit 19 controls the operation of the stage 11. The control unit 19 controls a moving mechanism (not shown) of the stage 11 to move the stage 11 in the horizontal and vertical directions. The control unit 19 is also connected to the stage 11 by wiring 20. The control unit 19 controls the operation of a light irradiation mechanism 40, which will be described later, via the wiring 20. The control unit 19 is also connected to a resistance temperature sensor film 34, which will be described later, via the wiring 20 to detect temperature.

[0019] The refrigerant supplying device 21 is connected to the refrigerant flow path 35 of the stage 11 via a forward piping 22 and a return piping 23, and can circulate the refrigerant between the refrigerant supplying device 21 and the refrigerant flow path 35 of the stage 11. The control unit 19 controls the refrigerant supplying device 21 to control the temperature, flow rate, etc. of the refrigerant supplied from the refrigerant supplying device 21 to the refrigerant flow path 35.

[0020] Although the control unit 19 and the coolant supply device 21 are illustrated as being provided inside the loader 13, the present invention is not limited to this and they may be provided in other positions.

[0021] In the inspection apparatus 10, when inspecting the electrical characteristics of an electronic device, the tester computer 18 transmits data to a test board connected to the electronic device via each probe 16, and further determines whether the transmitted data has been correctly processed by the test board based on an electrical signal from the test board.

[0022] <Placement table> Next, the mounting table according to the first embodiment will be described with reference to Fig. 2. Fig. 2 is a schematic cross-sectional view illustrating the configuration of the upper part of the stage 11. In Fig. 2 (and Figs. 4 and 5 described later), the flow of the refrigerant is indicated by outlined arrows. In Fig. 2 (and Figs. 3 to 5 described later), the light irradiated from the light irradiation mechanism 40 is indicated by solid arrows.

[0023] The carrier C placed on the stage 11 is formed of a substantially disk-shaped substrate 24. A plurality of electronic devices 25 cut (diced) from a semiconductor device are arranged on the surface of the carrier C at a predetermined interval from each other. The carrier C is also provided with a plurality of electrode pads 26 corresponding to a plurality of electrodes of each electronic device 25, and a current can be passed through an internal circuit of each electronic device 25 by applying a voltage to each electrode pad 26. The shape of the substrate 24 of the carrier C is not limited to a substantially disk-shaped shape, and may be, for example, a substantially rectangular shape as long as it can be placed on the stage 11.

[0024] The stage 11 includes a mounting portion 30 and a light irradiation mechanism 40 .

[0025] The mounting portion 30 includes a plate member 31, a light-transmitting member 32, an insulating film 33, and a resistance temperature detector film .

[0026] The plate member 31 is a member on which the carrier C is placed, and is formed in a substantially circular plate shape.

[0027] A sprayed film is formed on the upper surface (the surface on which the carrier C is placed) of the plate member 31. The sprayed film has an insulating film 33. The insulating film 33 is, for example, Al2O3, Cr2O3, TiO2, Y2O3, YSZ, ZnO, ZrSiO4, MgAl2O4, Y2SiO5, Al6Si2O 13 It is formed as a thermal sprayed film of ceramics such as HfO2, Al2O3-TiO2, YF3, B4C, and AlN.

[0028] The temperature detector film 34 is a film of a temperature detector formed within the insulating film 33. The temperature detector film 34 is divided into predetermined regions to form a multi-channel sensor. The temperature detector is formed, for example, as a sprayed film of tungsten. The control unit 19 (see FIG. 1) is connected to the temperature detector film 34 via wiring 20 (see FIG. 1). The control unit 19 can detect the resistance value of the temperature detector film 34 and estimate the temperature based on the resistance value.

[0029] That is, the sprayed film formed on the upper surface of the plate member 31 is formed to include a first insulating film 33 formed on the plate member 31, a temperature-sensing resistor film 34 formed on the first insulating film 33, and a second insulating film 33 formed on the temperature-sensing resistor film 34.

[0030] Further, a groove is formed on the upper surface of the light-transmitting member 32, and the plate member 31 and the light-transmitting member 32 are adhered or joined to form a refrigerant flow path 35. A refrigerant is supplied to the refrigerant flow path 35 from the refrigerant supply device 21 (see FIG. 1) via the outgoing pipe 22 (see FIG. 1). The refrigerant that has flowed through the refrigerant flow path 35 is returned to the refrigerant supply device 21 via the return pipe 23 (see FIG. 1). Note that a groove may be formed on the lower surface side of the plate member 31, and the plate member 31 and the light-transmitting member 32 are adhered or joined to form the refrigerant flow path 35. For example, water or Galden (registered trademark), which is a colorless liquid that allows light to pass through, is used as the refrigerant.

[0031] The light irradiation mechanism 40 includes a plurality of LEDs 41 that emit light. The LEDs 41 are divided into predetermined regions in a plan view. The control unit 19 can control the lighting of each divided LED 41. For each divided region, the control unit 19 can switch between a high-temperature region in which the LEDs 41 are turned on to raise the temperature of the electronic device, and a low-temperature region in which the LEDs 41 are not turned on. Note that the light irradiation mechanism 40 will be described as using the LEDs 41 as a light source, but the type of light source is not limited thereto.

[0032] In the stage 11 of the first embodiment, the plate member 31 and the light-transmitting member 32 have a linear expansion coefficient of 1.0×10 -6 / K or less. The plate member 31 and the light-transmitting member 32 are made of a light-transmitting material. For example, the plate member 31 and the light-transmitting member 32 have a linear expansion coefficient of 1.0×10 -6 / K or less. Further, on the upper surface of the plate member 31, a thermal sprayed film (insulating film 33, resistance temperature detector film 34) that absorbs light is formed.

[0033] The light emitted from the light irradiation mechanism 40 is transmitted through the light-transmitting member 32, the coolant flowing through the coolant flow passage 35, and the plate member 31, and is irradiated onto the sprayed film (insulating film 33). As a result, the temperature of the sprayed film (insulating film 33) irradiated with the light increases, and the temperature of the electronic device 25 increases.

[0034] Here, the effect of the stage 11 of the first embodiment will be described in comparison with the stage 11X according to the reference example. FIG. 3 is a diagram showing the stage 11X of the reference example and the stage 11 of the first embodiment in comparison during light irradiation. FIG. 3(a) shows an example of the stage 11X of the reference example, and FIG. 3(b) shows an example of the stage 11 of the first embodiment. The stage 11X of the reference example has a mounting portion 30X and a light irradiation mechanism 40. The mounting portion 30X has a plate member 31X and a light-transmitting member 32X. The mounting portion 30X has a coolant flow path 35X through which a coolant flows. The plate member 31X is made of ceramics that absorbs light. The light-transmitting member 32X transmits light. The plate member 31X and the light-transmitting member 32X are made of materials having approximately the same linear expansion coefficient. The linear expansion coefficient of the plate member 31X and the light-transmitting member 32X of the reference example is 3.2×10 -6 / K material.

[0035] For example, the LED 41 in the area corresponding to the electronic device 25 to be inspected is turned on. By irradiating the plate member 31X with light, a temperature rise area 50 is formed in the center of the upper surface of the placement part 30X, where the temperature rises. Here, since the temperature rise area 50 is formed on the upper surface side of the placement part 30X, a temperature difference occurs between the upper surface side of the placement part 30X and the lower surface side of the placement part 30X. In addition, when the placement part 30X is viewed from above, a high temperature area (the center in the example of FIG. 3) where light is irradiated and a low temperature area (the outer periphery in the example of FIG. 3) where light is not irradiated are formed. Therefore, a temperature difference also occurs in the surface direction. As a result, in the example shown in FIG. 3(a), as shown by the outline arrow, the thermal expansion in the center of the upper surface of the placement part 30X becomes larger than other parts, and the placement part 30X on which the carrier C is placed is warped, and the flatness of the placement surface of the carrier C is reduced.

[0036] In contrast, as shown in FIG. 3(b), in the stage 11 according to the first embodiment, a temperature rise region 50 is formed in the center of the upper surface of the mounting portion 30, and even if a temperature difference is formed between the upper surface side and the lower surface side of the mounting portion 30, or even if a temperature difference is formed between a high-temperature region irradiated with light and a low-temperature region not irradiated with light in a plan view, deformation due to thermal expansion can be suppressed, and warping of the mounting portion 30 on which the carrier C is mounted can be suppressed. This ensures the flatness of the mounting surface of the carrier C. Note that since the sprayed film (insulating film 33, resistance temperature detector film 34) is formed as a thin film by thermal spraying, the deformation force due to thermal expansion of the sprayed film is sufficiently smaller than the rigidity of the plate member 31, and the effect on warping of the mounting portion 30 can be sufficiently reduced.

[0037] Next, a stage 11A according to a second embodiment will be described with reference to Fig. 4. Fig. 4 is a schematic cross-sectional view illustrating the configuration of the upper part of the stage 11A. The stage 11A according to the second embodiment has a mounting portion 30A and a light irradiation mechanism 40. The mounting portion 30A has a plate member 31A, a light-transmitting member 32, an insulating film 33, and a resistance temperature detector film 34.

[0038] In the stage 11A of the second embodiment, the plate member 31A and the light-transmitting member 32 have a linear expansion coefficient of 1.0×10 -6 / K or less. The plate member 31A is made of a non-translucent material. The translucent member 32 is made of a translucent material. For example, the plate member 31A is made of Invar material (metal material). The translucent member 32 is made of quartz glass.

[0039] The light emitted from the light irradiation mechanism 40 passes through the light-transmitting member 32 and the refrigerant flowing through the refrigerant flow passage 35, and is irradiated onto the rear surface of the plate member 31A. This causes the temperature of the plate member 31A irradiated with the light to rise. The heat of the plate member 31A is transferred to the electronic device 25 via the insulating film 33 and the resistance temperature detector film 34, and the temperature of the electronic device 25 rises.

[0040] According to the stage 11A of the second embodiment, even if a temperature difference is formed between the upper and lower surfaces of the mounting part 30A, or even if a temperature difference is formed between a high-temperature region where light is irradiated and a low-temperature region where light is not irradiated in a plan view, deformation due to thermal expansion can be suppressed, and warping of the mounting part 30 on which the carrier C is mounted can be suppressed. This makes it possible to ensure the flatness of the mounting surface for the carrier C.

[0041] Next, a stage 11B according to a third embodiment will be described with reference to Fig. 5. Fig. 5 is a schematic cross-sectional view illustrating the configuration of the upper part of the stage 11B. The stage 11B according to the third embodiment has a mounting portion 30B and a light irradiation mechanism 40. The mounting portion 30B has a plate member 31B, a light-transmitting member 32, an insulating film 33, and a resistance temperature detector film 34.

[0042] In the stage 11B of the third embodiment, the light-transmitting member 32 has a linear expansion coefficient of 1.0×10 -6 The light-transmitting member 32 is made of a low-thermal expansion material having a thermal expansion coefficient of 1000 kPa or less and a thermal expansion coefficient of 1000 kPa or less. The light-transmitting member 32 is made of a light-transmitting material. For example, the light-transmitting member 32 is made of quartz glass.

[0043] The plate member 31B includes a plate member 311 having a large number of through holes in the thickness direction, and a heat conductive film 312 that covers the surface of the plate member 311 and fills the through holes. The plate member 311 has a linear expansion coefficient of 1.0×10 -6 / K or less. The plate member 311 is made of a non-translucent material. For example, the plate member 311 is made of an Invar material (metal material). The thermally conductive film 312 is made of a material with high thermal conductivity, for example, an Au plating film or a Cu plating film.

[0044] The light emitted from the light irradiation mechanism 40 passes through the light-transmitting member 32 and the refrigerant flowing through the refrigerant flow path 35, and is irradiated onto the back surface of the plate member 31B. As a result, the temperature of the back surface side of the plate member 31B irradiated with the light increases. Moreover, the thermal conduction film 312 is responsible for the thermal conduction from the back surface side of the plate member 31B to the front surface side of the plate member 31B. The heat of the plate member 31B is transferred to the electronic device 25 via the insulating film 33 and the resistance temperature detector film 34, and the temperature of the electronic device 25 increases.

[0045] According to the stage 11B of the third embodiment, even if a temperature difference is formed between the upper and lower surfaces of the mounting portion 30B, or even if a temperature difference is formed between a high-temperature region irradiated with light and a low-temperature region not irradiated with light in a plan view, deformation due to thermal expansion can be suppressed, and warping of the mounting portion 30 on which the carrier C is mounted can be suppressed. This ensures the flatness of the mounting surface of the carrier C. Furthermore, by improving the thermal conductivity of the plate member 31B, the responsiveness of the temperature control of the electronic device 25 can be improved.

[0046] The inspection device 10 has been described above, but the present disclosure is not limited to the above-described embodiments, and various modifications and improvements are possible within the scope of the gist of the present disclosure described in the claims.

[0047] The object to be inspected by the inspection apparatus 10 has been described as a carrier C on which a plurality of electronic devices 25 are arranged, but is not limited to this. The object to be inspected by the inspection apparatus 10 may be a wafer on which a plurality of electronic devices are formed. [Explanation of symbols]

[0048] 10 Inspection equipment 11 Stage (mounting table) 19 Control section 20 Wiring 21 Refrigerant supply device 22 Outgoing piping 23 Return pipe 25 Electronic Devices 30, 30A, 30B Placement section 31,31A,31B Plate members 311 Plate members 312 Thermal conductive membrane 32 Translucent member 33 Insulating film 34 Resistance temperature sensor film 35 Coolant flow path 40 Light irradiation mechanism 41 LED C Carrier (test subject)

Claims

1. a mounting section having a plate member and a light-transmitting member on which an object to be inspected is placed; a light irradiation mechanism for irradiating the object under inspection with light to raise the temperature of the object under inspection, The plate member is formed of a material having light-transmitting properties, A thermal spray coating is provided on the surface of the plate member, the thermal sprayed film includes an insulating film formed on the plate member and a resistance temperature detector film formed on the insulating film, the light emitted from the light irradiation mechanism is transmitted through the light-transmitting member and the plate member and is absorbed by the thermal sprayed film, thereby heating the thermal sprayed film; a deformation force due to thermal expansion of the sprayed film is smaller than the rigidity of the plate member; Mounting stand.

2. The placement portion is A flow path through which a coolant flows. The mounting table according to claim 1 .

3. The temperature sensing resistor film is divided into predetermined regions. The mounting table according to claim 1 or 2.

4. a mounting table on which an object to be inspected is placed; a probe card disposed opposite the mounting table; a tester connected to the probe card; The mounting table is a mounting section having a plate member and a light-transmitting member on which the object to be inspected is placed; a light irradiation mechanism for irradiating the object under test with light to raise the temperature of the object under test, The plate member is formed of a material having light-transmitting properties, A thermal spray coating is provided on the surface of the plate member, the thermal sprayed film includes an insulating film formed on the plate member and a resistance temperature detector film formed on the insulating film, the light emitted from the light irradiation mechanism is transmitted through the light-transmitting member and the plate member and is absorbed by the thermal sprayed film, thereby heating the thermal sprayed film; a deformation force due to thermal expansion of the sprayed film is smaller than the rigidity of the plate member; Inspection equipment.

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