Base Material

Abstract

To provide a base member which has a shape suitable for being accommodated in an electronic device and is mounted using an MID.SOLUTION: In a base member of the present invention, when viewed from a direction in which a base surface 503Y extends, a first hole and a second hole each have a shape becoming wider as getting closer to one surface and the other surface of the base surface from a portion at which a lower end of the first hole and an upper end of the second hole are in contact with each other, and when viewed from the direction in which the base surface extends, a smaller angle 513, 906 of angles formed by a generatrix of the first hole and a generatrix of the second hole is smaller in a thin region of the base member 503 than in a thick region of the base member 503.SELECTED DRAWING: Figure 8

Description

[Technical field]

[0001] The present invention relates to a base member using MID technology. [Background technology]

[0002] 2. Description of the Related Art In recent years, electronic devices such as cameras and smartphones, and transportation devices such as automobiles, have built-in modularized sensor modules equipped with various sensors.

[0003] As such a sensor module, one that employs MID technology is known.

[0004] MID technology is a technology that irradiates a laser on the necessary parts of a base material and forms a metal plating film only on the irradiated parts. The parts where the metal plating is formed become the conductive pattern.

[0005] For example, Patent Document 1 discloses an MID package having a gyro element mounted on each of three inclined surfaces of a body having a substantially triangular pyramid shape in which a first pyramidal surface, a second pyramidal surface, and a third pyramidal surface are perpendicular to each other. [Prior art documents] [Patent documents]

[0006] [Patent Document 1] JP 2013-44645 A Summary of the Invention [Problem to be solved by the invention]

[0007] In recent years, there has been an increasing demand for smaller electronic devices. Accordingly, there is a demand for base members such as compact sensor modules that can be easily accommodated in the miniaturized electronic devices.

[0008] In the conventional techniques disclosed in the above-mentioned patent documents, the dimensions of the MID package, length, width and thickness, are large, which hinders miniaturization of devices.

[0009] Furthermore, when the MID package is housed in an electronic device, the triangular pyramid shape is not desirable because it tends to create dead space inside the device.

[0010] SUMMARY OF THE PRESENT EMBODIMENT An object of the present invention is to provide a small-sized base member having a shape suitable for being housed in an electronic device. [Means for solving the problem]

[0011] In order to achieve the above object, there is provided a base member which is a molded part on which a pattern wiring is directly formed, the base member comprising: B Surface When viewed from the extending direction of the base surface, there are a thick region and a thin region, and for each of the thick region and the thin region, A via is provided for electrically connecting one surface and the other surface opposite to the one surface. At least one the via has a structure in which a shape of a lower end of a first hole having a truncated cone shape and a shape of an upper end of a second hole having a truncated cone shape are identical, the via has a structure in which a pattern is formed across one side and the other side of the base surface on an inner wall of a hole having a shape in which the lower end of the first hole and the upper end of the second hole overlap so as to be in contact with each other when viewed from the extending direction of the base surface, the shape of each of the first hole and the second hole becomes wider from a portion where the lower end of the first hole and the upper end of the second hole contact each other toward the one side and the other side of the base surface when viewed from the extending direction of the base surface, and the smaller angle between a generatrix of the first hole and a generatrix of the second hole is smaller in a region where the thickness of the base member is thicker than in a region where the thickness of the base member is thicker. Effect of the Invention

[0012] According to the present invention, it is possible to provide a base member that is mounted in an MID and has a shape suitable for being housed in an electronic device. [Brief description of the drawings]

[0013] [Figure 1] FIG. 1 is a block diagram showing the configuration of a camera according to a first embodiment of the present invention; [Diagram 2] FIG. 1 is a perspective view showing the appearance of a camera according to a first embodiment of the present invention; [Diagram 3] FIG. 1 is an exploded perspective view of a camera according to a first embodiment of the present invention; [Figure 4] FIG. 1 is a perspective view showing an internal structure of a top cover unit according to a first embodiment of the present invention; [Diagram 5] 1A and 1B are an exploded perspective view and a side view of a shake detection unit according to a first embodiment of the present invention; [Figure 6] 1 is a perspective view of the appearance of a sensor module according to a first embodiment of the present invention, a cross-sectional view of a main part, a plan view of a land shape, a cross-sectional perspective view of a via part, and an enlarged cross-sectional view of a via part [Figure 7] FIG. 1 is a side view of a sensor module according to a first embodiment of the present invention; [Figure 8] 2 is a side view and a perspective view of a sensor module according to a second embodiment of the present invention, and a cross-sectional view of a via [Figure 9] 3 is an enlarged cross-sectional view, a cross-sectional perspective view, and a pattern wiring schematic diagram of a via in a third embodiment of the present invention. [Figure 10] 4A and 4B are perspective and cross-sectional views of a via according to a fourth embodiment of the present invention; [Figure 11] FIG. 13 is a plan view of a land shape according to a fifth embodiment of the present invention; [Figure 12] FIG. 13 is a plan view of a land shape according to a sixth embodiment of the present invention; [Figure 13] FIG. 13 is a plan view of a land shape according to a seventh embodiment of the present invention; [Figure 14] 13A and 13B are a side view and a perspective view of a shake detection unit according to an eighth embodiment of the present invention; DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0014] Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

[0015] MID (Molded Interconnect Device) refers to a resin molded product with wiring and electrodes formed on it. EXAMPLES

[0016] A first embodiment of the present invention will be described below with reference to FIGS.

[0017] (Block diagram showing an example of the configuration of a digital camera 100) 1 is a block diagram showing an example of the configuration of a digital camera (hereinafter, camera) 100 according to this embodiment. The camera 100 is a lens-interchangeable camera to which a lens unit 200 can be attached or detached.

[0018] FIG. 2 is a perspective view of the appearance of the camera 100.

[0019] The lens unit 200 shown in FIG. 1 is fixed to the camera 100 by a lens mount 201 provided on the lens unit 200 and a lens mount 101 provided on the camera 100 .

[0020] The lens unit 200 and the camera 100 are configured to be able to communicate with each other via a connector 202 provided on the lens unit 200 and a connector 102 provided on the camera 100 .

[0021] Specifically, the system control unit 307 and the lens drive control unit 203 communicate with each other.

[0022] Based on a signal from the system control unit 307 , the lens drive control unit 203 controls the lens drive unit 204 , and the lens drive unit 204 drives the aperture 211 and the lens 210 .

[0023] The lens 210 is used to form an optical image from a subject on the image sensor 302 .

[0024] The shutter 301 is disposed between the image sensor 302 and the lens 210, and blocks light from the lens 210 to the image sensor 302 when no image is being captured.

[0025] During shooting, the shutter 301 opens under the control of the system control unit 307 to enable an optical image by the lens 210 to be formed on the image sensor 302 .

[0026] The image sensor 302 is an image sensor configured with a CCD, CMOS device, or the like that converts an optical image into an electrical signal.

[0027] The A / D converter 304 converts an analog signal into a digital signal. The A / D converter 304 is used to convert an analog signal output from the image sensor 302 into a digital signal.

[0028] An image processing unit 305 performs predetermined pixel interpolation, resizing such as reduction, and color conversion processing on the data from the A / D converter 304 or the data from the memory control unit 306 .

[0029] In addition, the image processing unit 305 performs a predetermined calculation process using the captured image data, and the system control unit 307 performs exposure control and distance measurement control based on the obtained calculation results.

[0030] This allows TTL (through-the-lens) AF (autofocus) processing, AE (autoexposure) processing, and EF (pre-flash) processing to be performed.

[0031] The image processing unit 305 further performs predetermined calculation processing using the captured image data, and also performs TTL type AWB (auto white balance) processing based on the obtained calculation results.

[0032] The output data from the A / D converter 304 is written into a memory 308 via an image processing unit 305 and a memory control unit 306 , or directly via the memory control unit 306 .

[0033] The memory 308 stores image data converted into digital data by the A / D converter 304 for display on the display unit 105 or the display unit 106 .

[0034] The memory 308 also serves as a memory for displaying images (video memory).

[0035] The D / A converter 309 converts the image display data stored in the memory 308 into an analog signal and supplies it to the display unit 105 or the display unit 106 .

[0036] In this way, the image data for display written in the memory 308 is displayed on the display unit 105 or 106 via the D / A converter 309 .

[0037] The display unit 105 and the display unit 106 perform display on a display device such as an LCD in response to the analog signal from the D / A converter 309 .

[0038] The digital signal that has been A / D converted by the A / D converter 304 and stored in the memory 308 is converted to analog by the D / A converter 309 .

[0039] Then, the images are sequentially transferred to the display unit 105 or the display unit 106 for display, thereby enabling through image display (live view display).

[0040] The non-volatile memory 310 is a memory serving as an electrically erasable and recordable recording medium, and may be, for example, an EEPROM.

[0041] The non-volatile memory 310 stores constants, programs, etc. for the operation of the system control unit 307.

[0042] The system control unit 307 is a control unit that has at least one processor, and controls the entire camera 100 and the lens unit 200 .

[0043] A RAM is used for the system memory 311. In the system memory 311, constants and variables for the operation of the system control unit 307, programs read from the non-volatile memory 310, and the like are expanded.

[0044] The system control unit 307 also performs display control by controlling the memory 308, the D / A converter 309, the display units 105 and 106, and the like.

[0045] The system timer 312 is a timing unit that measures the time used for various controls and the time of a built-in clock.

[0046] The first shutter switch 104a is turned on when the shutter button 104 provided on the camera 100 is pressed halfway (instruction to prepare for shooting) during operation, and generates a first shutter switch signal SW1.

[0047] The first shutter switch signal SW1 starts operations such as AF (autofocus) processing, AE (auto exposure) processing, AWB (auto white balance) processing, and EF (pre-flash) processing.

[0048] The second shutter switch 104b is turned on when the operation of the shutter button 104 is completed, that is, when the shutter button 104 is fully pressed (a shooting instruction) and generates a second shutter switch signal SW2.

[0049] The system control unit 307 causes the shutter 301 to drive the shutter blades 301a in response to the second shutter switch signal SW2.

[0050] Then, a series of image capturing processing operations from reading out the signal from the image sensor 302 to writing image data to the recording medium 330 is started.

[0051] The shutter blades 301a move at high speed inside the shutter 301 in a direction perpendicular to the optical axis of the lens 210, and stop moving instantly when they collide with a stopper member (not shown) inside the shutter 301.

[0052] By selecting and operating various functional icons displayed on the display units 105 and 106, appropriate functions are assigned to the individual operating members of the operating unit 108, and the operating members function as various functional buttons.

[0053] The function buttons include, for example, an end button, a back button, an image forward button, a jump button, a narrow down button, and an attribute change button.

[0054] For example, when the menu button is pressed, a menu screen in which various settings can be made is displayed on the display unit 105 or the display unit 106 .

[0055] The power supply is turned on / off by a power switch 103 .

[0056] The power supply control unit 313 is made up of a battery detection circuit, a DC-DC converter, a switch circuit for switching between blocks to which electricity is applied, and the like, and detects the presence or absence of a battery, its type, and its remaining capacity.

[0057] Furthermore, the power supply control unit 313 controls the DC-DC converter based on the detection result and instructions from the system control unit 307, and supplies the necessary voltage to each unit including the recording medium 330 for the necessary period.

[0058] The power supply unit 314 is composed of a primary battery such as an alkaline battery or a lithium battery, a secondary battery such as a NiCd battery, a NiMH battery, or a Li battery, an AC adapter, or the like.

[0059] The recording medium I / F 315 is an interface with a recording medium 330 such as a memory card or a hard disk.

[0060] The recording medium 330 is a recording medium such as a memory card for recording captured images, and is composed of a semiconductor memory, an optical disk, a magnetic disk, or the like.

[0061] A communication unit 316 is connected wirelessly or via a wired cable, and transmits and receives video signals, audio signals, and the like.

[0062] The communication unit 316 can also be connected to a wireless LAN (Local Area Network) and the Internet.

[0063] The communication unit 316 can transmit images (including through images) captured by the image sensor 302 and images recorded on the recording medium 330, and can also receive image data and various other information from external devices.

[0064] (Shake detection unit 320 / gyro sensor) The shake detection unit 320 is, for example, a gyro sensor, and detects the amount of vibration of the camera.

[0065] The shake detection unit 320 detects the vibration and the amount of vibration in three axial directions of the camera 100, that is, the pitch direction, the yaw direction, and the roll direction.

[0066] In the camera 100 shown in FIG. 1, the image sensor driver 303 controls the movement of the image sensor 302 in accordance with the amount of shake detected by the shake detector 320 to perform optical shake correction.

[0067] Furthermore, the image processing unit 305 electronically performs shake correction on the image according to the amount of shake detected by the shake detection unit 320 under the control of the system control unit 307 .

[0068] (An exploded perspective view of the camera 100) FIG. 3 is an exploded perspective view of the camera 100 with the front, rear, and bottom cover members removed.

[0069] The base plate 120 is a structure that provides the strength of the camera 100, and a shutter 301, an image sensor 302, an image sensor drive unit 303, and a system control unit 307 are fastened to the base plate 120 with screws (not shown).

[0070] The top cover unit 110 is fastened to a base plate 120 with screws (not shown).

[0071] (External perspective view of the top cover unit 110) FIG. 4(a) is an external perspective view of the top cover unit 110, and FIG. 4(b) is an exploded perspective view of the top cover unit 110. As shown in FIG.

[0072] The top cover unit 110 is made up of a top cover member 111 that covers the top surface of the camera 100, a power switch 103, a shutter button 104, and the like.

[0073] As shown in FIG. 4( b ), the shake detection unit 320 is fastened to the center of the top cover member 111 with a screw 401 .

[0074] (An exploded perspective view of the shake detection unit 320) FIG. 5( a ) is an exploded perspective view of the shake detection unit 320 , and FIGS. 5 ( b ) and ( c ) are perspective views of the appearance of the shake detection unit 320 .

[0075] The shake detection unit 320 is composed of plates 505 and 506, a cushioning member 504, a sensor module 508, and a flexible substrate 502F.

[0076] The sensor module 508 has gyro sensors 501P, 501R, and 501Y for measuring angular velocity, and an acceleration sensor 502A for detecting acceleration.

[0077] The sensor module 508 further includes three gyro sensors 501P, 501R, and 501Y and a passive element 502R (see FIG. 6) such as a resistor or a capacitor for driving the acceleration sensor 502A.

[0078] Flexible substrate 502F has terminal portion 502D and terminal portion 502E.

[0079] The terminal portion 502D is connected to a connector 502C (see FIG. 6) that the sensor module 508 has.

[0080] The terminal portion 502E is electrically connected to a connector (not shown) that forms part of the path to the system control unit 307.

[0081] This allows the sensor module 508 and the system control unit 307 to perform various necessary communications via the flexible substrate 502F.

[0082] Through this communication, the system control unit 307 can acquire the detection values ​​detected by the gyro sensors 501P, 501R, and 501Y, and the acceleration sensor 502A.

[0083] The buffer member 504 is made of an elastic material such as sponge that absorbs vibrations.

[0084] The vibration detection unit 320 has two buffer members 504 .

[0085] The two buffer members 504 are disposed on different surfaces facing the sensor module 508, and are disposed so as to sandwich the sensor module 508 therebetween.

[0086] In this embodiment, the gyro sensor 501Y is disposed on a surface approximately parallel to the main surface 503Y, which is the surface on which the gyro sensor 501Y is disposed.

[0087] The plates 505 and 506 have surfaces that are approximately parallel to the main surface 503Y, and the plates 505 and 506 sandwich the sensor module 508 and the buffer member 504 between them.

[0088] Furthermore, one of the buffer members 504 is compressed by the plate 505 and the sensor module 508, and the other of the buffer members 504 is compressed by the plate 506 and the sensor module 508.

[0089] Thus, the plates 505 , 506 are configured not to come into contact with the sensor module 508 .

[0090] The vibration detection unit 320 is completed when the plate 505 and the plate 506 are fastened together with a screw 507 .

[0091] (Perspective view of the exterior of the sensor module 508) 6(a) and (b) are external perspective views of the sensor module 508, and FIG. 6(c) is a cross-sectional view of the main parts of the sensor module 508.

[0092] A base member 503 shown in FIG. 6 is a member for holding the gyro sensors 501P, 501R, and 501Y in predetermined positions, and is made of a material such as plastic or LCP (liquid crystal polymer).

[0093] The base member 503 has a first side wall 503P substantially perpendicular to the rotation axis in the pitch direction, a second side wall 503R substantially perpendicular to the rotation axis in the roll direction, and a main surface 503Y substantially perpendicular to the rotation axis in the yaw direction.

[0094] In other words, the first side wall 503P is perpendicular to the main surface 503Y, and the second side wall 503R is perpendicular to both the main surface 503Y and the first side wall 503P.

[0095] The gyro sensor 501P is mounted on a first side wall 503P, the gyro sensor 501R is mounted on a second side wall 503R, and the gyro sensor 501Y is mounted on a main surface 503Y.

[0096] The gyro sensors 501P, 501R, and 501Y are directly mounted on the land portions of the pattern wiring 500 on the base member 503 by soldering.

[0097] The sensor module 508 is configured as described above.

[0098] Therefore, the gyro sensor 501P detects vibrations and vibration amounts in the pitch direction of the camera 100, the gyro sensor 501R in the roll direction, and the gyro sensor 501Y in the yaw direction.

[0099] The connector 502C is mounted on the surface of the main surface 503Y opposite to the surface on which the gyro sensor 501Y is mounted.

[0100] Here, the surface of the main surface 503Y on which the gyro sensor 501Y is mounted is called a first surface 509, and the surface of the main surface 503Y on which the connector 502C is mounted is called a second surface 510.

[0101] Additionally, acceleration sensor 502A is mounted on second side wall 503R.

[0102] As shown in FIGS. 6( a ) and 6 ( b ), a pattern wiring 500 is directly wired on a base member 503 .

[0103] The pattern wiring 500 is formed by MID technology.

[0104] MID technology is a technology that forms a pattern by irradiating a laser onto a specified location on a base material and then applying metal plating only to the laser-irradiated areas.

[0105] Gyro sensors 501P, 501R, 501Y and acceleration sensor 502A for detecting shake, and various passive elements 502R for driving them will be described.

[0106] Gyro sensors 501P, 501R, 501Y, acceleration sensor 502A, and passive element 502R are directly mounted on mounting lands provided by pattern wiring 500 on base member 503 by soldering or the like.

[0107] The pattern wiring 500 enables necessary electrical connections between the gyro sensors 501P, 501R, and 501Y, the acceleration sensor 502A, the passive element 502R, and the connector 502C.

[0108] FIG. 6C is a cross-sectional view of a main part of the sensor module 508.

[0109] Here, when the thickness of the main surface 503Y is Z and the shorter of the length of the first side wall 503P and the length of the second side wall 503R in a direction perpendicular to the main surface 503Y is W, W is greater than Z.

[0110] In addition, the height of the higher of the first side wall 503P and the second side wall 503R from the first surface 509 is designated as A, and the height of the higher of the first side wall 503P and the second side wall 503R from the second surface 510 is designated as B.

[0111] Also, the height from the first surface 509 to the top surface of the gyro sensor 501Y is denoted by C, and the height from the second surface 510 to the top surface of the connector 502C is denoted by D.

[0112] In this case, A is greater than or equal to C, and B is greater than or equal to D.

[0113] This embodiment is configured as described above.

[0114] Therefore, the gyro sensor 501Y and the connector 502C do not protrude beyond the higher one of the first side wall 503P and the second side wall 503R in the direction perpendicular to the main surface 503Y.

[0115] Therefore, the height of the sensor module 508 in a direction perpendicular to the main surface 503Y can be reduced.

[0116] FIG. 6(d) shows an enlarged view of the land 522 for mounting the gyro sensor 501P formed on the first side wall 503P.

[0117] The gyro sensor 501P is mounted on the first side wall 503P with solder by reflow mounting.

[0118] In FIG. 6(d), G indicates the direction of gravity when cream solder is melted to mount the gyro sensor 501P on the first side wall 503P by reflow soldering.

[0119] Moreover, H indicates a direction perpendicular to the direction of gravity and parallel to the first side wall 503P.

[0120] In normal reflow mounting on a flat board, gravity always acts on the components being mounted perpendicular to the surface on which the components are mounted.

[0121] However, in the case of the shake detection unit 320 of this embodiment, gyro sensors 501P, 501R, and 501Y are mounted on three mutually orthogonal surfaces.

[0122] Therefore, gravity acts on at least one of the gyro sensors 501P, 501R, and 501Y in a direction parallel to the surface on which the gyro sensors are mounted during reflow mounting.

[0123] In this embodiment, the gyro sensor 501P is mounted on the first side wall 503P in a state in which gravity acts in the direction of the arrow G.

[0124] Therefore, when the solder melts, it may be affected by gravity in the direction of arrow G and may be displaced in the direction of arrow G from the desired mounting position.

[0125] Therefore, of the land row A and land row B each consisting of five lands, the amount of solder applied to the lower land row B in FIG. 6(d) is made less than the amount of solder applied to the other land row A.

[0126] As a result, the surface tension of the solder applied to land row A becomes greater than the surface tension of the solder applied to land row B.

[0127] By doing so, the force acting on the gyro sensor 501P due to the surface tension of the solder is directed in the direction opposite to that of arrow G, thereby canceling out the gravity acting on the gyro sensor 501P in the direction of arrow G, and preventing mounting misalignment due to gravity during reflow mounting.

[0128] As shown in FIGS. 6(a) and 6(b), the base member 503 is provided with a plurality of vias 510 for electrically connecting one surface of the main surface 503Y to the other surface.

[0129] FIG. 6(e) is an enlarged cross-sectional perspective view of the base member 503 in the portion where the via 510 is disposed, and FIG. 6(f) is an enlarged cross-sectional view of the base member 503 in the portion where the via 510 is disposed.

[0130] The structure of the mold for molding the base member is such that the main surface 503Y is the largest flat surface, and therefore the mold has a structure for punching in a direction perpendicular to the main surface 503Y, which results in good productivity.

[0131] Therefore, in this embodiment, the vias 510 are disposed only on the main surface 503Y, so that the direction of the holes 512 of the vias 510 coincides with the direction in which the die is removed, thereby simplifying the die structure.

[0132] In this embodiment, as shown in FIGS. 6(e) and 6(f), the via 510 has a hole 512 shaped like two overlapping mortars, which is formed symmetrically with respect to the center in the thickness direction of the main surface 503Y.

[0133] The mortar has a shape in which the diameter is smallest at the center in the thickness direction of the main surface 503Y and the diameter increases with increasing distance from the center in the thickness direction.

[0134] If the diameter of the circle at via apex 515 is via diameter 514 , then hole 512 opens to the surface of the base member while increasing in diameter at a constant via angle 513 from via apex 515 as the starting point, and penetrates base member 511 .

[0135] On the inner wall of the hole 512, a pattern is directly wired by MID from one surface to the other surface of the main surface 503Y.

[0136] Therefore, the patterns to be wired on one surface and the other surface of the base member 511 are electrically connected through the vias 510 .

[0137] The reason why hole 512 in this embodiment is not a simple cylindrical hole penetrating main surface Y, but has the above-mentioned shape, is to make it easier to irradiate a laser onto the inner wall of hole 512 for pattern formation.

[0138] (Side view of sensor module 508) 7A and 7B are side views of the sensor module 508, with FIG. 7(a) showing the first side wall 503P and FIG. 7(b) showing the second side wall 503R.

[0139] Here, the gyro sensors 501Y, 501R, and 501P of this embodiment are substantially rectangular when viewed in a direction perpendicular to the surface on which they are mounted.

[0140] Therefore, the gyro sensor 501R has a long side 501Ra and a short side 501Rb, and the gyro sensor 501P has a long side 501Pa and a short side 501Pb.

[0141] In this embodiment, the gyro sensor 501R and the gyro sensor 501P are attached to the base member 503 so that the short sides 501Rb and 501Pb are parallel to the direction perpendicular to the main surface 503Y.

[0142] Therefore, the height of the first side wall 503P and the second side wall 503R in a direction perpendicular to the main surface 503Y can be reduced. EXAMPLES

[0143] The definition of the frustum of the present invention is given below.

[0144] A frustum is a solid figure formed by removing a similarly reduced cone that shares a common vertex from a pyramid, or in other words, a solid figure bounded by a pyramidal surface and two parallel planes.

[0145] A frustum made from a cone is called a frustum of a cone, a frustum made from a pyramid is called a frustum of a pyramid, and a frustum made from an n-sided pyramid is called an n-sided pyramid. n can be 3, 4, 6, 8, etc.

[0146] In the following embodiment, a more preferable truncated cone will be used as an example.

[0147] A second embodiment of the present invention will now be described with reference to FIG.

[0148] FIG. 8( a ) is a side view of the sensor module 900 .

[0149] FIG. 8B is a perspective view of the exterior of the sensor module 900. FIG.

[0150] FIG. 8( c ) is a cross-sectional view of a via disposed in a second portion 903 of a major surface 901 of a base member 904 of a sensor module 900 .

[0151] The sensor module 900 is constructed by mounting a gyro sensor on a base member 904 .

[0152] The thickness of the first portion 902 of the main surface 901 of the base member 904 is the same as that of the main surface 503Y of the base member 503 in the first embodiment.

[0153] The thickness of second portion 903 of main surface 901 is configured to be thicker than the thickness of main surface 503Y of base member 503 of Example 1. Because of this configuration, base member 904 of the present example has improved strength compared to base member 503 of Example 1.

[0154] In FIG. 8, pattern wiring and passive elements such as resistors and capacitors are omitted for ease of understanding.

[0155] A main surface 901 of a base member 904 is provided with a plurality of first shaped vias 510 and a plurality of second shaped vias 905 for electrically connecting one surface to the other surface.

[0156] Here, a first via 510 is formed in a first portion 902 and a via of a second shape 905 is formed in a second portion 903 .

[0157] The first via 510 has the same shape as that described in the first embodiment, and therefore a description thereof will be omitted here.

[0158] The second via 905 has a hole 908 that is shaped like two overlapping mortars like the first via 510 , but is different in that an angle 906 of the second via 905 is larger than an angle 513 of the first via 510 .

[0159] A pattern is directly wired on the inner wall of the hole 908 by MID, spanning from one surface of the main surface 901 to the other surface.

[0160] Therefore, the patterns to be wired on one surface and the other surface of the base member 904 are electrically connected through the vias 905 .

[0161] When the sensor module 900 is mounted on the camera 100 and operates, the temperature of the sensor module 900 rises during operation, and the temperature of the sensor module 900 drops when the sensor module 900 is not in operation.

[0162] Such temperature rise and fall causes the base member 904 of the sensor module 900 to repeatedly undergo thermal expansion and contraction.

[0163] This expansion and contraction of base member 904 applies stress to the pattern formed on the inner wall of hole 908.

[0164] In particular, a large stress is applied to the pattern at the via apex 909 due to stress concentration, which may cause the pattern to break.

[0165] The greater the thickness of the main surface 901, the greater the stress applied to the pattern at the via apex 909. On the other hand, the greater the value of the via angle 906, the smaller the stress applied to the pattern at the via apex 909.

[0166] In this embodiment, a case will be considered in which a via 510 of the first shape is disposed in the second portion 903 which is thicker.

[0167] In that case, a larger stress is applied to the pattern at the via apex 515 than when the via is disposed in the first portion 902, and there is a risk of the pattern on the via inner wall being broken.

[0168] Therefore, via 905 of the second shape is arranged in second portion 903, which is expected to reduce the stress at via apex 909 more than via 510 of the first shape.

[0169] Furthermore, if the via angle 906 is changed to an obtuse angle, it may become difficult to irradiate the inner wall of the hole 908 with a laser in order to form a pattern.

[0170] Therefore, in order to facilitate laser irradiation onto the inner wall of hole 908, it is advisable to increase via diameter 907.

[0171] The invention of this embodiment is outlined below.

[0172] The base member 503 is a molded part on which the pattern wiring is directly formed.

[0173] The base member 503 has a via 905 for electrically connecting one surface of a base surface 503Y constituting the base member 503 to the other surface opposite to the one surface.

[0174] In the via 905, the shape of the bottom end of the first hole in the shape of a truncated cone is the same as the shape of the top end of the second hole in the shape of a truncated cone.

[0175] Via 905 has a structure in which a pattern is formed across one side and the other side of base surface 503Y on the inner wall of hole 908, which has a shape in which the lower end of a first hole and the upper end of a second hole overlap so as to be in contact with each other.

[0176] The shape of each of the first hole and the second hole becomes wider from the portion where the lower end of the first hole and the upper end of the second hole meet toward one side and the other side of the base surface (503Y).

[0177] The smaller angle (513, twice 906) between the generatrix of the first hole and the generatrix of the second hole is smaller in the region where base member 503 is thin than in the region where base member 503 is thick.

[0178] The base member 503 has a via (905) for electrically connecting one surface of a base surface 503Y constituting the base member 503 to the other surface opposite to the one surface.

[0179] In the via 905, the shape of the bottom end of the first hole in the shape of a polygonal truncated pyramid is the same as the shape of the top end of the second hole in the shape of a polygonal truncated pyramid.

[0180] Via 905 has a structure in which a pattern is formed across one side and the other side of base surface 503Y on the inner wall of hole 908, which has a shape in which the lower end of a first hole and the upper end of a second hole overlap so as to be in contact with each other.

[0181] The shape of each of the first hole and the second hole becomes wider from the portion where the lower end of the first hole and the upper end of the second hole meet toward one side and the other side of the base surface (503Y).

[0182] The smaller of the angles (513, twice 906) between the side of the first hole and the side of the second hole that is in contact with the side of the first hole is smaller in the region where the base member (503) is thin than in the region where the base member (503) is thick. EXAMPLES

[0183] A third embodiment of the present invention will now be described with reference to FIG.

[0184] In the fifth embodiment, it has been explained that when the thickness of the via formation surface is large, making the via angle 906 an obtuse angle is effective from the viewpoint of preventing breakage of the pattern.

[0185] In this embodiment, an example will be described in which a recess is provided around a hole 1002 constituting a via 1000 formed in a base member 1001 constituting a shake detection unit.

[0186] FIG. 9( a ) is a cross-sectional view of a via 1000 formed in a base member 1001 , and FIGS. 9 ( b ) and 9 ( c ) are cross-sectional perspective views of the via 1000 formed in the base member 1001 .

[0187] FIG. 9( d ) is a schematic diagram of the pattern wiring around the via 1000 .

[0188] The hole 1002 of the via 1000 is shaped like two overlapping mortars, similar to the via 510 of the first embodiment.

[0189] However, it is different in that a recess is provided in the base member 1001 around the via 1000 .

[0190] With this shape, the thickness of base member 1001 in the via arrangement portion is locally thin, and the stress applied to the pattern at via apex 1003 can be alleviated.

[0191] The concave shape 1004 may be a shape as shown in FIG. 9(b) or FIG. 9(c), but is not limited thereto.

[0192] Another effect of providing the recessed shape 1004 is that the hole diameter of the via hole 1002 on the surface of the base member 1001 is reduced.

[0193] This effect allows a larger wiring area to be secured on the surface of base member 1001.

[0194] This is because, as shown in FIG. 9D, another signal wiring 1006 can be placed near the signal 1005 that is electrically connected to the via.

[0195] The invention of this embodiment will be outlined below.

[0196] The base member 503 is an injection molded part on which pattern wiring is directly formed, that is, an MID.

[0197] The base member 503 has a via (1000) for electrically connecting one surface of a base surface 503Y constituting the base member 503 to the other surface opposite to the one surface.

[0198] In the via 1000, the shape of the bottom end of the first frustum-shaped hole and the shape of the top end of the second frustum-shaped hole are the same.

[0199] The via 1000 has a structure in which a pattern is formed across one side and the other side of the base surface 503Y on the inner wall of a hole 1002 having a shape in which the lower end of a first hole and the upper end of a second hole are overlapped so as to be in contact with each other.

[0200] The shape of each of the first hole and the second hole becomes wider from the portion where the lower end of the first hole and the upper end of the second hole meet toward one side and the other side of the base surface 503).

[0201] The thickness of a periphery 1004 of the portion of the base member 503 in which the vias 1000 are arranged is thinner than the thickness of a portion of the base member 503 in which the vias 1000 are not arranged. EXAMPLES

[0202] A fourth embodiment of the present invention will now be described with reference to FIG.

[0203] In this embodiment, an example will be described in which the cone shape of a hole 1100 constituting a via 1107 formed in a base member 1101 constituting a shake detection unit is not symmetrical with respect to the center of the thickness of the base member 1101.

[0204] 10(a) is a cross-sectional perspective view of the base member 1101 in the vicinity of a via 1107 formed directly in the base member 1101, and FIG. 10(b) is a cross-sectional view of the base member 1101 in the vicinity of the via 1107. FIG.

[0205] Here, the distance of the hole 1100 from the via apex 1106 to one surface of the base member 1101 is set as L1, and the distance to the other surface of the base member 1101 is set as L2.

[0206] At this time, a via hole having a via angle 1103 that satisfies the relationship L2>L1 is formed in a funnel shape.

[0207] In this embodiment, as it is configured in this manner, the center of the thickness of the base member 1101, where the stress is greatest, can be shifted from the position of the via apex 1106, where the stress is concentrated, and the stress applied to the pattern at the apex 1106 can be alleviated.

[0208] Furthermore, although the via diameter 1105 on one surface side of the surface of the base member 1101 becomes large, the via diameter 1104 on the other surface side of the surface of the base member 1101 can be made small.

[0209] Therefore, by arranging the smaller via diameter 1104 side on the side with a higher pattern wiring density, the pattern wiring efficiency can be improved.

[0210] The invention of this embodiment will be outlined below.

[0211] The base member 503 is an injection molded part onto which the pattern wiring is directly formed.

[0212] The base member 503 has a via 1107 for electrically connecting one surface of a base surface 503Y constituting the base member 503 to the other surface opposite to the one surface.

[0213] In the via 1107, the shape of the bottom end of the first frustum-shaped hole and the shape of the top end of the second frustum-shaped hole are the same.

[0214] The via 1107 has a structure in which a pattern is formed on the inner wall of a hole 1100 having a shape in which the lower end of the first hole and the upper end of the second hole are overlapped so as to be in contact with each other, across one side and the other side of the base surface 503Y.

[0215] The shape of each of the first hole and the second hole becomes wider from the portion where the lower end of the first hole and the upper end of the second hole meet toward one side and the other side of the base surface 503Y.

[0216] A width L1 of the first hole in a direction perpendicular to the base surface 503Y is different from a width L2 of the second hole in a direction perpendicular to the base surface 503Y.

[0217] When viewed from the extending direction of the base surface, the thickness of the periphery 1004 of the portion of the base member 503 where the vias 1000 are arranged is thinner than the thickness of the portion of the base member 503 where the vias 1000 are not arranged. EXAMPLES

[0218] A fifth embodiment of the present invention will now be described with reference to FIG.

[0219] In FIG. 11, passive elements such as a gyro sensor, resistors, and capacitors are omitted for ease of understanding.

[0220] (Enlarged view of the land 522 for mounting the gyro sensor 501P formed on the first side wall 503P) FIG. 11 shows an enlarged view of lands 522 for mounting the gyro sensor 501P formed on the first side wall 503P.

[0221] The gyro sensor 501P is mounted on the first side wall 503P with solder by reflow mounting.

[0222] In FIG. 14, G indicates the direction of gravity when cream solder is melted in reflow mounting the gyro sensor 501P on the first side wall 503P.

[0223] Moreover, H indicates a direction perpendicular to the direction of gravity and parallel to the first side wall 503P.

[0224] In this embodiment, the gyro sensor 501P is mounted on the first side wall 503P in a state in which gravity acts in the direction of the arrow G.

[0225] Therefore, when the solder melts, it may be affected by gravity in the direction of arrow G and may be displaced in the direction of arrow G from the desired mounting position.

[0226] Therefore, of the land row A and land row B each consisting of five lands 522, the amount of solder applied to the lower land row B in FIG.

[0227] As a result, the surface tension of the solder applied to land row A becomes greater than the surface tension of the solder applied to land row B.

[0228] By doing so, the force acting on the gyro sensor 501P due to the surface tension of the solder is directed in the direction opposite to that of arrow G, thereby canceling out the gravity acting on the gyro sensor 501P in the direction of arrow G, and preventing mounting misalignment due to gravity during reflow mounting.

[0229] In this case, the size of each of the lands 522 constituting the lower land row B in FIG.

[0230] This allows the size of the land to be appropriate for the amount of solder, preventing problems such as the solder applied to row A, which has a larger amount of solder applied, spilling out of the land.

[0231] The invention of this embodiment will be outlined below.

[0232] The base member 503 is a molded part on which the pattern wiring is directly formed.

[0233] On different surfaces 503Y and 503P of the base member 503 that are not parallel to each other, land groups for solder-mounting electronic components 501Y and 501P, respectively, are formed.

[0234] At least one of the land groups includes a first land row A in which a plurality of lands 522 are arranged along a first direction H, and a second land row B in which a plurality of lands 522 are arranged along the first direction H, which are aligned along a second direction G that is different from the first direction.

[0235] When viewed in the normal direction of the base surface of the base member, the first land row A is disposed above the second land row B in the second direction of the surface.

[0236] The area of ​​the lands 522 constituting the first land row A is larger than the area of ​​the lands 522 constituting the second land row B.

[0237] When viewed in the normal direction of the base surface of the base member, the first land row A is disposed above the second land row B in the second direction of the surface.

[0238] The amount of solder applied to the lands 522 constituting the first land row A is greater than the amount of solder applied to the lands 522 constituting the second land row B.

[0239] In FIG. 11, the amount of solder applied to the area where the area of ​​the land 522 constituting the first land row A is large is greater than the amount of solder applied to the area where the area of ​​the land 522 constituting the second land row B is small.

[0240] As a modification of FIG. 11, the area of ​​the lands constituting the third land row in the upper stage may be the same as the area of ​​the lands constituting the fourth land row in the lower stage.

[0241] In this case, the amount of solder applied to the lands constituting the third land row on the top stage is greater than the amount of solder applied to the land 522 constituting the fourth land row.

[0242] The functions and effects described in FIG. 11 can be obtained.

[0243] The second direction G is perpendicular to the first direction.

[0244] On different surfaces 503Y and 503P of the base member 503 which are not parallel to each other, land groups are formed for solder-mounting electronic components 501Y and 501P, respectively, by reflow mounting.

[0245] The second direction is the direction of gravity G when the solder melts during reflow mounting. EXAMPLES

[0246] A sixth embodiment of the present invention will now be described with reference to FIG.

[0247] (Enlarged view of the land 1302 for mounting the gyro sensor 501P formed on the first side wall 503P) In FIG. 12, passive elements such as a gyro sensor, resistors, and capacitors are omitted for ease of understanding.

[0248] FIG. 12 shows an enlarged view of lands 1302 for mounting the gyro sensor 501P formed on the first side wall 503P.

[0249] The gyro sensor 501P is mounted on the first side wall 503P with solder by reflow mounting.

[0250] In FIG. 12, G indicates the direction of gravity when cream solder is melted in reflow mounting the gyro sensor 501P on the first side wall 503P.

[0251] Moreover, H indicates a direction perpendicular to the direction of gravity and parallel to the first side wall 503P.

[0252] In this embodiment, the gyro sensor 501P is mounted on the first side wall 503P in a state in which gravity acts in the direction of the arrow G.

[0253] Therefore, when the solder melts, it may be affected by gravity in the direction of arrow G and may be displaced in the direction of arrow G from the desired mounting position.

[0254] In this embodiment, the widths of the lands 1302, which are ten in total, are changed in the direction of the arrow G.

[0255] More specifically, the land 1302 is shaped so that its width decreases along the direction of gravity G.

[0256] As the width of the land increases, the force acting on the gyro sensor 501P due to the surface tension of the solder increases.

[0257] Therefore, by forming the land in the above shape, the force acting on the gyro sensor 501P due to the surface tension of the solder is directed in the direction opposite to that of the arrow G.

[0258] Then, the gravity acting on the gyro sensor 501P in the direction of the arrow G is offset, and mounting deviation due to gravity during reflow mounting can be prevented.

[0259] The invention of this embodiment will be outlined below.

[0260] The base member 503 is a molded part on which the pattern wiring is directly formed.

[0261] On different surfaces 503Y and 503P of the base member 503 that are not parallel to each other, land groups for solder-mounting electronic components 501Y and 501P, respectively, are formed.

[0262] When viewed from the normal direction of the base surface of the base member, at least one of the land groups includes a land row in which a plurality of lands are arranged along a predetermined direction H.

[0263] When viewed from the normal direction of the base surface of the base member, land 1302 is characterized in that the width of the land on the lower side in the predetermined direction is smaller than the width of the land on the upper side in the predetermined direction in a direction perpendicular to the predetermined direction.

[0264] On different surfaces 503Y and 503P of the base member 503 which are not parallel to each other, land groups are formed for solder-mounting electronic components 501Y and 501P, respectively, by reflow mounting.

[0265] The direction perpendicular to the predetermined direction is the direction of gravity when the solder melts during reflow mounting. EXAMPLES

[0266] A seventh embodiment of the present invention will now be described with reference to FIG.

[0267] In FIG. 13, passive elements such as a gyro sensor, resistors, and capacitors are omitted for ease of understanding.

[0268] (Enlarged view of the land 1402 for mounting the gyro sensor 501P formed on the first side wall 503P) FIG. 13 shows an enlarged view of lands 1402 for mounting the gyro sensor 501P formed on the first side wall 503P.

[0269] The gyro sensor 501P is mounted on the first side wall 503P with solder by reflow mounting.

[0270] In FIG. 13, the shape of the gyro sensor 501P is diagrammatically represented by a dashed line.

[0271] The mounting terminal 1403 is a connection terminal for mounting the gyro sensor 501P on the land 1402.

[0272] In FIG. 13, the position and shape of the terminal 1403 are diagrammatically indicated by dashed lines.

[0273] In FIG. 13, G indicates the direction of gravity when cream solder is melted in reflow mounting the gyro sensor 501P on the first side wall 503P.

[0274] Moreover, H indicates a direction perpendicular to the direction of gravity and parallel to the first side wall 503P.

[0275] In this embodiment, the gyro sensor 501P is mounted on the first side wall 503P in a state in which gravity acts in the direction of the arrow G.

[0276] Therefore, when the solder melts, it may be affected by gravity in the direction of arrow G and may be displaced in the direction of arrow G from the desired mounting position.

[0277] In this embodiment, the widths of the lands, which are ten in total, are changed in the direction of the arrow G.

[0278] More specifically, the width of the land at a position coinciding with the end of mounting terminal 1403 located outside gyro sensor 501P in the direction of arrow G according to the direction of gravity G is made the widest.

[0279] The land is shaped so that the width thereof becomes smaller as it moves away from the position coinciding with the end of mounting terminal 1403 in the direction of arrow G.

[0280] The location where the land is widest is the location where the force acting on the gyro sensor 501P due to the surface tension of the solder is greatest.

[0281] Therefore, during reflow mounting, the end of the mounting terminal 1403 of the gyro sensor 501P located outside the gyro sensor 501P is maintained at the position where the land width is the largest, and mounting deviation due to gravity can be prevented.

[0282] The invention of this embodiment will be outlined below.

[0283] The base member 503 is a molded part on which the pattern wiring is directly formed.

[0284] On different surfaces 503Y and 503P of the base member 503 that are not parallel to each other, land groups for solder-mounting electronic components 501Y and 501P, respectively, are formed.

[0285] When viewed from the normal direction of the base surface of the base member, at least one of the land groups includes a land row A or B in which a plurality of lands 1402 are arranged along a predetermined direction H.

[0286] Land 1402 is configured so that its width is greatest at a portion that coincides with the outer edge of mounting terminal 1403 of electronic component 501P in a predetermined direction.

[0287] In the direction G perpendicular to the predetermined direction, the width of the land 1402 narrows upward from the portion of the mounting terminal 1403 of the electronic component 501P that coincides with the outer edge of the electronic component 501P.

[0288] When viewed from the normal direction of the base surface of the base member, in a direction G perpendicular to the specified direction, the width of the land decreases downward from the portion of the mounting terminal of the electronic component that coincides with the outer edge of the electronic component.

[0289] On different surfaces 503Y and 503P of the base member 503 that are not parallel to each other, a group of lands is formed for solder-mounting electronic components (501Y and 501P) by reflow mounting.

[0290] The direction perpendicular to the specified direction is the direction of gravity G when the solder melts during reflow mounting. EXAMPLES

[0291] An eighth embodiment of the present invention will now be described with reference to FIG.

[0292] (Pattern wiring and mounting configuration base member 1500) FIG. 14 shows a base member 1500 having a pattern wiring and mounting structure similar to that of the base member 503 described in the first embodiment.

[0293] A pattern wiring 1502 is formed directly on a base member 1500, and a mounting component 1501 is directly mounted on the base member 1500.

[0294] In FIG. 14, G indicates the direction of gravity when cream solder is melted in reflow mounting the gyro sensor 501P on the first side wall 503P.

[0295] Moreover, H indicates a direction perpendicular to the direction of gravity and parallel to the first side wall 503P.

[0296] Here, a standing wall 1503 having an arbitrary height is arranged on the base member 1500 on the G-direction side of the mounted component 1501 so as to contact the mounted component 1501 along the H-direction.

[0297] This makes it possible to prevent the mounted components from shifting or falling due to gravity when the solder melts in the mounting process.

[0298] Here, an embodiment is shown in which a vertical wall 1503 is provided in a divided manner so as to avoid a pattern wiring 1502 that is directly wired on a base member 1500.

[0299] Moreover, the wiring pattern 1502 may be wired so as to straddle the standing wall 1503, with the standing wall 1503 being connected without being divided.

[0300] [Other Examples] Although the preferred embodiments of the present invention have been described above, the configurations of the present invention are not limited to those exemplified in the above embodiments.

[0301] The material, shape, size, form, number, arrangement location, etc. can be changed as appropriate without departing from the gist of the present invention.

[0302] Furthermore, the present invention has been described using the built-in camera of an electronic device and a smartphone as examples of these embodiments.

[0303] The technology can be applied to a variety of electronic devices, including personal computers, tablet devices, game devices, drones, automobiles and their peripheral devices. [Explanation of symbols]

[0304] 500 patterns 501 Sensors 501Y First Sensor 501P Second Sensor 501R Third Sensor 503 Base material 503Y Main surface 503P First side wall 503R Second Side Wall 508 Sensor Module

Claims

1. A base member which is a molded part on which a pattern wiring is directly formed, the base member has a base surface, a thick region and a thin region when viewed from an extension direction of the base surface, and at least one via for electrically connecting one surface of the thick region and another surface of the thin region opposite to the one surface; The via has a first hole having a truncated cone shape and a second hole having a truncated cone shape, the first hole having a bottom end and the second hole having a truncated cone shape each having an upper end, the first hole having a truncated cone shape and the second hole having a bottom end and a top end, the second hole having a truncated cone shape and the When viewed from an extending direction of the base surface, the via has a structure in which a pattern is formed on an inner wall of a hole having a shape in which a lower end of the first hole and an upper end of the second hole are overlapped so as to be in contact with each other, the pattern being formed across one side and the other side of the base surface; When viewed from an extending direction of the base surface, the shape of each of the first hole and the second hole becomes wider from a portion where a lower end of the first hole and an upper end of the second hole contact each other toward one side and the other side of the base surface, A base member characterized in that, when viewed from the extension direction of the base surface, the smaller of the angles between the generatrix of the first hole and the generatrix of the second hole is smaller in the thin thickness region of the base member than in the thick thickness region of the base member.

2. The base member according to claim 1, characterized in that, when viewed from the extension direction of the base surface, the thickness of the periphery of the portion of the base member in which the vias are arranged is thinner than the thickness of the portion of the base member in which the vias are not arranged.

3. A base member as described in claim 1, characterized in that the width of the first hole in a direction perpendicular to the base surface is different from the width of the second hole in a direction perpendicular to the base surface.

4. An electronic device comprising the base member according to any one of claims 1 to 3.

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