Vehicle camera device, vehicle, and method of manufacturing camera device

Abstract

(Vehicle camera device, vehicle and method for manufacturing camera device) a printed circuit board (5, 5') extending in a main plane (15); one or more electronic components (16, 17, 18) mounted on a surface (19) of the printed circuit board (5, 5'); a conductive housing (6, 6') for receiving a printed circuit board (5, 5'), the housing (6, 6') having a wall (22, 22') extending perpendicularly to a main plane (15) of the printed circuit board (5, 5') and surrounding one or more electronic components (16, 17, 18); A conductive element (23) for shielding one or more electronic components (16, 17, 18) from electromagnetic interference, the conductive element (23) comprising: a surface mounted on a surface (19) of the printed circuit board (5, 5') so as to surround one or more electronic components (16, 17, 18); a conductive element (23) elastically compressed between the wall (22, 22') and the printed circuit board (5, 5'); A camera device (3, 3') for a vehicle (1).

Description

[Technical Field]

[0001] The present invention relates to a camera device for a vehicle, a vehicle equipped with such a camera device, and a method for manufacturing a camera device. [Background technology]

[0002] A camera device for a vehicle includes several electronic components, such as an image sensor, an image processor, a microcontroller, a memory, etc. Electromagnetic radiation from the electronic components can interfere with surrounding electronic components and devices. Therefore, effective shielding against electromagnetic interference between different electronic components of the camera device and between the electronic components of the camera device and external devices is desirable.

[0003] In U.S. Patent Application Publication No. 2003 / 016519, electromagnetic interference shielding is provided by a conformable shielding enclosure. A flexible, metallized, thermoformable polymer having dimensions that fit inside the housing of a semiconductor device is applied directly to the walls of the housing. The housing with the applied polymer is then encapsulated, thereby shielding the semiconductor device from electromagnetic radiation. However, manufacturing a housing using a thermoformable, adhesive polymer is an expensive process. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] US Patent Application Publication No. 2003 / 016519 Summary of the Invention [Problem to be solved by the invention]

[0005] SUMMARY OF THE INVENTION It is an object of the present invention to provide an improved camera system for a vehicle. [Means for solving the problem]

[0006] This provides a vehicle camera device. a printed circuit board extending in a major plane; one or more electronic components mounted on a surface of the printed circuit board; a conductive housing for receiving the printed circuit board, the conductive housing having walls extending perpendicular to a major plane of the printed circuit board and enclosing one or more electronic components; 1. A conductive element for shielding one or more electronic components from electromagnetic interference, comprising: Surface-mounted on the surface of the printed circuit board so as to surround one or more electronic components; a conductive element resiliently compressed between the wall and the printed circuit board.

[0007] The conductive walls and conductive elements of the housing act together to provide a (local) electromagnetic interference shield (EMI shield) for one or more electronic components. Thus, shielding is provided against electromagnetic radiation, e.g., at radio and / or microwave frequencies, entering or leaving the shielded area. Thus, electromagnetic radiation generated by one or more electronic components enclosed by the shield can be prevented from interfering with other electronic components on the same printed circuit board, other electronic components of the camera device, and / or other electronic devices in the vehicle. Furthermore, one or more electronic components enclosed by the shield can also be protected from electromagnetic radiation coming from outside.

[0008] The conductive elements are configured as surface-mounted devices (SMDs). Therefore, they can be easily mounted on a printed circuit board. Furthermore, the conductive elements can be easily connected to the ground potential of the printed circuit board. In particular, the conductive elements can be mounted by standard surface-mount technology (SMT). In particular, they can be fully automated. For example, the conductive elements can be tape-and-reel components that are mounted on a printed circuit board, for example, by using a vacuum head at the end of a high-speed pick-and-place system. For example, the conductive elements can be mounted on a printed circuit board together with electronic components using the same machine and / or in the same or subsequent manufacturing process. In particular, the conductive elements can be soldered onto surface-mount pads on the printed circuit board. They can be soldered onto the printed circuit board, for example, by reflow soldering. Reflow soldering involves heating and melting pre-applied solder pads on the printed circuit board, for example, by applying infrared light, laser radiation, or gas, and connecting the SMD to the melted pads.

[0009] The elastically deformable conductive element allows for improved electrical contact between the conductive camera housing and the printed circuit board (e.g., the ground traces of the printed circuit board). Therefore, uneven mating surfaces due to mechanical tolerances and bending can be compensated for by the elastically deformable conductive element, and electromagnetic radiation leakage can be reduced. Furthermore, reliable electrical contact between the conductive camera housing and the printed circuit board (e.g., the ground traces of the printed circuit board) can be provided even in the event of mechanical stress (e.g., bending).

[0010] The conductive elements are elastically deformable, in particular in a direction perpendicular to the main plane of the printed circuit board.

[0011] The housing, for example, comprises side walls extending substantially perpendicular to the main plane of the printed circuit board. The printed circuit board, for example, is completely housed between the side walls of the housing. The side walls of the housing are electrically connected to the ground potential of the printed circuit board and can function as a global electromagnetic interference shield for the entire printed circuit board, i.e., all electronic components on the printed circuit board. Furthermore, the claimed walls, for example, are provided in addition to the aforementioned side walls and act together with the conductive elements to provide local (i.e., secondary) electromagnetic interference shielding for one or more electronic components surrounded by the claimed walls and conductive elements.

[0012] The wall that cooperates with the conductive SMD element may, for example, have a contact surface for contacting the conductive element. The contact surface may, in particular, be arranged parallel to a main surface of the printed circuit board. The contact surface may, in particular, be a surface perpendicular to the main surface of the wall. The wall may, for example, be integrally formed with the housing. The wall may, for example, be a peripheral wall.

[0013] The camera device is particularly applicable to vehicles such as automobiles, for example cars, automobiles, buses, sport utility vehicles, trucks, trains, ships and / or airplanes, and may also be used in vehicles that enable autonomous or semi-autonomous driving.

[0014] The camera device is configured to be in electronic communication with, for example, a central electronic control unit (ECU) of the vehicle.

[0015] The camera device is disposed inside a vehicle window, such as the windshield (front window) or rear window of the vehicle. When the camera device is disposed inside the windshield (front window), it is called a front camera. However, the camera device can also be disposed on a different window of the vehicle.

[0016] In an embodiment, the housing comprises a first portion and a second portion, the first portion comprising a wall.

[0017] According to one embodiment, one, some, or all of the conductive elements comprise a conductive and elastically deformable gasket portion in contact with the wall and a conductive mounting portion mounted on the surface of the printed circuit board.

[0018] The gasket portion can be compressed between the wall and a mounting portion mounted on the printed circuit board to provide good mechanical contact, and therefore electrical contact, between the housing and the ground traces of the printed circuit board.

[0019] The mounting portion may, for example, comprise a solderable shim. The mounting portion and gasket portion may be attached to one another by mechanical means, such as crimping, or by adhesive.

[0020] In an embodiment, the gasket portion comprises internal holes to increase the compressibility of the gasket portion, for example through holes extending parallel to the major plane of the printed circuit board.

[0021] According to a further embodiment, the gasket portion comprises an elastomeric inner core and a conductive outer layer.

[0022] The elastomeric inner core may include, for example, a high temperature elastomeric material to withstand soldering temperatures. The elastomeric material may include, for example, silicone, fluorocarbon, fluorosilicone, etc. The elastomeric inner core may also include another type of elastomeric material.

[0023] The conductive outer layer comprises a metal such as copper, gold, silver, and / or tin. For example, the conductive outer layer comprises a substrate such as plastic or metal (e.g., copper or brass) plated with a highly conductive metal layer such as gold, silver, or tin.

[0024] In another example, the gasket portion can include, for example, a conductive gasket material. The conductive gasket material can include, for example, conductive particles in an elastomeric binder, i.e., a mixture of conductive particles and an elastomeric material. The mixture can be provided, for example, in the form of a paste, dispersion, or powder that is used to form the gasket portion. The conductive gasket material can include, for example, a conductive polymer matrix, conductive polytetrafluoroethylene (PTFE), particle-filled foam, etc.

[0025] According to a further embodiment, one, some or all of the conductive elements comprise a spring element in contact with the wall and a conductive mounting portion mounted on a surface of the printed circuit board.

[0026] The spring element is compressed between the wall and a mounting portion mounted on the printed circuit board, and the spring force can provide good mechanical contact, and therefore electrical contact, between the housing and the ground traces on the printed circuit board.

[0027] According to a further embodiment, the camera device comprises an imaging module for providing image data of the vehicle's surroundings, and the one or more electronic components further comprise an image processor unit for processing the image data provided by the imaging module, a memory unit for storing the image data, and / or a communication bus for transferring the image data between the image processor unit and the memory unit.

[0028] Depending on the location of the camera device and imaging module within the vehicle, different surveillance areas can be monitored at the front, rear, and / or sides of the vehicle. In particular, the imaging module can be used to detect stationary or moving objects such as other vehicles, people, animals, plants, obstacles, road irregularities (e.g., potholes or stones), lane markings, traffic signs, or open spaces (e.g., parking spaces).

[0029] The imaging module of the camera device comprises, in particular, an optical system including, for example, an objective lens, a lens, etc. Furthermore, the imaging module comprises an image sensor unit including, for example, a CCD camera (Charged Coupled Device) or a CMOS sensor (Complementary Metal-Oxide Semiconductor-Sensor). The imaging module is configured, for example, to capture high-resolution images of the surroundings of the vehicle. The image sensor unit of the imaging module may be mounted on a printed circuit board. Alternatively, the camera device may comprise another separate printed circuit board arranged across the optical axis of the optical system of the imaging module and comprising the image sensor unit.

[0030] The image processor unit is particularly realized as electronic hardware components mounted on a printed circuit board. The image processor unit is particularly configured to analyze and interpret image data acquired by the imaging module. The image processor includes, for example, a video processor. The image processor includes, for example, a graphics processor. The image processor includes, for example, a high-speed processor with a clock rate of 1 GHz or higher, 2 GHz or higher, 3 GHz or higher, 4 GHz or higher, 5 GHz or higher, and / or 10 GHz or higher.

[0031] The memory unit is in particular realized by electronic hardware components mounted on a printed circuit board.

[0032] According to a further embodiment, the housing comprises a first portion and a second portion, the first portion comprising a wall, the wall comprising at least one through-hole extending perpendicular to a major plane of the printed circuit board, and the camera device comprises one or more conductive fastening elements that mechanically fasten the first and second portions of the housing to one another, and further, at least one of the one or more fastening elements passes through the at least one through-hole in the wall and a corresponding one of the corresponding through-holes in the printed circuit board and serves as an additional conductive element for shielding the one or more electronic components from electromagnetic interference.

[0033] Thus, the manufacturing of the camera device can be simplified by using (some of) the fastening elements required to secure the first and second housing parts together with the printed circuit board as additional conductive elements for shielding one or more electronic components from electromagnetic interference, in particular as fewer conductive elements are required as SMD components.

[0034] The fastening element is, for example, a screw. The fastening element comprises, for example, a threaded portion. A corresponding opening in the housing, for example in the second part of the housing, comprises, for example, a mating threaded portion.

[0035] According to a further embodiment, the conductive elements are arranged intermittently on the surface of the printed circuit board.

[0036] This allows the number of conductive elements to be reduced, and further allows the conductive elements to be easily mounted on a printed circuit board.

[0037] For example, the size of the gap between each of two adjacent conductive elements is configured to achieve a high shielding effect in the 2G band, the 3G band, and / or the 5G band, which enables good electromagnetic shielding performance, especially for windshield-mounted cameras, where 2G, 3G, 5G, and other antennas are typically mounted in close proximity to the camera.

[0038] According to further embodiments, the size of the gap between each two adjacent conductive elements is 3 cm or less, 1.5 cm or less, 1 cm or less, 0.5 cm or less and / or 0.3 cm or less, and / or the size of the gap between each pair of conductive elements and an adjacent additional conductive element is 3 cm or less, 1.5 cm or less, 1 cm or less, 0.5 cm or less and / or 0.3 cm or less.

[0039] If the gap size is 3cm or less, it can efficiently block electromagnetic radiation with a frequency of 1GHz or less. If the gap is 1.5cm or less, it can efficiently block electromagnetic radiation with a frequency of 2GHz or less. If the gap is 1cm or less, it can efficiently block electromagnetic radiation with a frequency of 3GHz or less. If the gap is 0.5cm or less, it can efficiently block electromagnetic radiation with a frequency of 6GHz or less. If the gap is 0.3cm or less, it can efficiently block electromagnetic radiation with a frequency of 10GHz or less.

[0040] For example, to effectively shield the electromagnetic radiation of a processor with a clock rate of 1.2 GHz, a gap of 0.5 cm is required because the processor generates electromagnetic radiation with a frequency of 1.2 GHz as well as significant harmonics at 3.6 GHz, which is in the 5G band.

[0041] According to further embodiments, the total number of conductive elements surrounding one or more electronic components is 4, 6, 8, 10, 16 or more, and / or the total number of conductive elements and additional conductive elements together surrounding one or more electronic components is 4, 6, 8, 10, 16 or more.

[0042] The greater the number of conductive elements, the smaller the gap size can be achieved using the same type of conductive elements, and therefore the more high frequency electromagnetic radiation can be blocked.

[0043] According to a further aspect, there is provided a vehicle comprising the camera device described above.

[0044] According to a further aspect, there is provided a method for manufacturing a vehicle camera device, the method comprising the steps of: providing a printed circuit board extending in a major plane; Mounting one or more electronic components on a surface of the printed circuit board; Mounting conductive elements on the surface of a printed circuit board by surface mount technology so that they surround one or more electronic components; providing a conductive housing having walls configured to extend perpendicular to a major plane of the printed circuit board when the camera device is assembled; receiving the printed circuit board within the housing such that the walls of the housing are disposed on the conductive elements and the conductive elements are resiliently compressed between the walls and the printed circuit board; Includes.

[0045] Features described in relation to the camera device apply equally to the vehicle or method according to the further aspect, and vice versa.

[0046] The above-mentioned units, such as the image processor unit, the memory unit, and the communication bus, are particularly implemented in hardware. The corresponding units can be designed as devices or parts of devices, for example, as computers or microprocessors. For example, the devices can include a central processing unit (CPU), a graphics processing unit (GPU), programmable hardware logic (for example, field programmable gate arrays, FPGAs), application-specific integrated circuits (ASICs), etc. Furthermore, one or more units may be implemented together in a single hardware device or may, for example, share an interface, etc. The units may also be implemented in separate hardware devices.

[0047] Further possible implementations or alternative solutions of the invention also encompass combinations of the features described above or below with respect to the embodiments, not explicitly mentioned herein. Those skilled in the art can also add individual or isolated aspects and features to the most basic form of the invention.

[0048] Further embodiments, features and advantages of the invention will become apparent from the dependent claims and the subsequent description of embodiments.

[0049] The present invention will now be described in detail based on preferred embodiments with reference to the following drawings. [Brief explanation of the drawings]

[0050] [Figure 1] 1 shows a front view of a vehicle. [Figure 2] 2 shows a cross-sectional view of the camera device of the vehicle of FIG. 1 according to the first embodiment; [Figure 3] 3 shows a bottom view of the printed circuit board of the camera device of FIG. 2. [Figure 4] 3 shows a plan view of a first portion of the housing of the camera device of FIG. 2; [Figure 5] 3 illustrates conductive elements of the camera device of FIG. 2 according to one embodiment. [Figure 6] 3 shows conductive elements of the camera device of FIG. 2 according to a further embodiment; [Figure 7] 3 shows conductive elements of the camera device of FIG. 2 according to a further embodiment; [Figure 8] 2 shows a cross-sectional view of the camera device of the vehicle of FIG. 1 according to a second embodiment; [Figure 9] 9 shows a bottom view of the printed circuit board of the camera device of FIG. 8. [Figure 10] 9 shows a flowchart of a method for manufacturing the camera device of FIG. 2 or FIG. 8. DETAILED DESCRIPTION OF THE INVENTION

[0051] In the drawings, unless otherwise indicated, like reference numbers indicate like or functionally equivalent elements.

[0052] FIG. 1 shows a front view of a vehicle 1. In this example, the vehicle 1 is a passenger car. In other examples, the vehicle 1 may be a truck, a bus, or another automobile. A camera device 3 (front camera) is attached to the inside of a windshield 2 of the vehicle 1. The camera device 3 is attached, for example, behind or near a rearview mirror (not shown) of the vehicle 1 when viewed from the driver.

[0053] FIG. 2 shows a cross-sectional view of the camera device 3.

[0054] The camera device 3 includes an imaging module 4 configured to monitor the area in front of the vehicle 1. The imaging module 4 can be used for several driver assistance functions such as object detection, adaptive cruise control, lane keep assist, automatic emergency braking, automatic (emergency) steering, traffic jam assist, high beam assist, highway assist and / or traffic jam pilot. In other examples, the camera device 3 may also be mounted on other windows or positions of the vehicle 1 and / or pointed in other directions.

[0055] The camera device 3 comprises a main printed circuit board 5 housed within a conductive housing 6 .

[0056] The camera device 3 may further include an imaging module housing 7. The imaging module housing 7 is made of, for example, plastic. The imaging module housing 7 is attached to the conductive housing 6 by, for example, fastening elements (not shown).

[0057] Camera device 3 may further include a bracket and / or cover (not shown) for mounting (eg, gluing) camera device 3 to windshield 2 (FIG. 1), for example.

[0058] The imaging module 4 is accommodated in an imaging module housing 7. The imaging module 4 comprises an optical system 8 (e.g., an objective lens 8) protruding from the imaging module housing 7. Reference symbol O denotes the optical axis of the optical system 8. Furthermore, the imaging module 4 comprises an image sensor unit 9. The image sensor unit 9 is, for example, a CCD camera (Charged Coupled Device) or a CMOS sensor. For example, the image sensor unit 9 is an active pixel sensor based on CMOS technology (CMOS-APS, CMOS active pixel sensor). The imaging module 4 is, for example, configured to capture high-resolution images of the surroundings of the vehicle 1.

[0059] In the illustrated example, the image sensor unit 9 is mounted on a separate printed circuit board 10. The separate printed circuit board 10 and the main printed circuit board 5 are electronically connected, for example, by an electronic cable 11 and a connector 12. The optical system 8 (e.g., the objective lens 8) is mechanically attached to the separate printed circuit board 10, for example, by an objective mount (not shown). In another example, the printed circuit board 5 may be positioned intersecting the optical axis O of the optical system 8, and the image sensor unit 9 may be disposed on the printed circuit board 5. In this case, the separate printed circuit board 10 is not required.

[0060] Figure 3 shows a bottom view of the printed circuit board 5 of Figure 2. In particular, Figure 2 is a cross-sectional view taken along line AA in Figure 3. The printed circuit board 5 extends in a major plane 15 (Figure 3). The major plane 15 is the XY plane (Figures 2 and 3).

[0061] The camera device 3 comprises one or more electronic components 16, 17, 18 mounted on a surface 19 of the printed circuit board 5. In the example shown, the one or more electronic components 16, 17, 18 comprise an image processor unit 16 for processing image data provided by the imaging module 4, a memory unit 17 for storing the image data, and a communication bus 18 for transferring the image data and possibly other data between the image processor unit 16 and the memory unit 17.

[0062] To shield the electronic components 16, 17, 18 against electromagnetic interference (EMI) from other electronic components 20 mounted on the printed circuit board 5 or from other electronic devices (not shown) of the vehicle 1, the camera device 3 comprises a local EMI shield 21 (FIG. 2). The local EMI shield 21 comprises a wall 22 and an elastically deformable conductive element 23 compressed between the wall 22 and the printed circuit board 5.

[0063] In the examples of FIGS. 2 and 3 , the camera device 3 includes eight conductive elements 23 (three of which are indicated by reference numerals in FIG. 3 ) surrounding the electronic components 16, 17, and 18. The conductive elements 23 are intermittently arranged on the printed circuit board 5 with gaps 24 between each two adjacent conductive elements 23 (one of the eight gaps 24 is indicated by a reference numeral in FIG. 3 ). The frequency range of electromagnetic radiation that can be effectively blocked by the EMI shield 21 depends on the size S of the gaps 24. The smaller the size S of the gaps 24, the higher the maximum frequency that can be blocked by the EMI shield 21. For example, to effectively block electromagnetic radiation with frequencies below 6 GHz, the size S of the gaps 24 needs to be a maximum of 0.5 cm. In other examples, a different number of conductive elements 23 can also be applied. Furthermore, the size S of the gaps 24 can also have a different value.

[0064] The conductive element 23 is a surface mounted device (SMD). The conductive element 23 is connected to a ground potential, such as a ground trace (not shown) on the printed circuit board 5.

[0065] 2, the conductive housing 6 that houses the printed circuit board 5 includes a first portion 13 and a second portion 14. The first portion 13 includes a wall 22. The wall 22 is, for example, formed integrally with the first portion 13 of the housing 6. The wall 22 extends perpendicular to the main plane 15 of the printed circuit board 5 (the XY plane in FIG. 2). In other words, the wall 22 extends in the Z direction in FIG. 2.

[0066] Figure 4 shows a plan view of the first portion 13 of the housing 6. As can be seen in Figure 4, the wall 22 is a peripheral wall 22 that surrounds the electronic components 16, 17, 18 (Figure 2) when the camera device 3 is in an assembled state.

[0067] FIG. 5 shows one embodiment of the conductive elements 23 of the EMI shield 21 ( FIG. 2 ) in an uncompressed state. The conductive elements 23 include conductive mounting portions 25 for mounting the conductive elements 23 to the surface 19 ( FIG. 2 ) of the printed circuit board 5 by surface mount technology (SMT). The conductive mounting portions 25 are, for example, solderable shims. Additionally, the conductive elements 23 include gasket portions 26 for contacting the walls 22 ( FIG. 2 ). The gasket portions 26 are conductive to provide electrical connection to the walls 22, particularly the face sides 27 ( FIGS. 2 and 4 ) of the walls 22. Furthermore, the gasket portions 26 are elastically deformable to provide good mechanical (and therefore electrical) contact with the walls 22, particularly the face sides 27 ( FIG. 2 shows the conductive elements 23, i.e., their gasket portions 26, in a compressed state). In the embodiment of FIG. 5 , the gasket portions 26 include a conductive elastomeric material, such as a material made by mixing conductive particles into an elastomeric binder.

[0068] As shown in FIG. 2 by dashed lines and denoted by reference character A, the conductive housing 6 may include one or more protrusions A. The protrusions A protrude, in particular, from the first portion 13 of the conductive housing 6 toward the printed circuit board 5. The protrusions A may also contact one or more of the electronic components 16, 17, 18 on the printed circuit board 5. The protrusions A provide additional shielding against electromagnetic leakage. The protrusions A may, for example, be integrally formed with the first portion 13 of the housing 6.

[0069] Figure 6 shows another embodiment of a conductive element 23' in an uncompressed state. In the embodiment of Figure 6, a gasket portion 26' includes an elastomeric inner core 28 and a conductive outer layer 29. Otherwise, the conductive element 23' is identical to the conductive element 23 of Figure 5.

[0070] FIG. 7 shows another embodiment of a conductive element 23″ in an uncompressed state. The conductive element 23″ of FIG. 7 includes a conductive mounting portion 25″ similar to the conductive mounting portion 25 of FIG. 1. Additionally, the conductive element 23″ includes a spring element 30.

[0071] 8 shows a camera device 3' for the vehicle 1 of FIG. 1 according to a second embodiment. The camera device 3' of the second embodiment includes one or more conductive fastening elements 31 (e.g., screws 31) that mechanically secure the first and second portions 13', 14' of the conductive housing 6' to one another. In the illustrated example, the camera device 3' includes three screws 31, one of which is visible in the cross-sectional view of FIG. 8.

[0072] In the embodiment of Fig. 8, two of these three screws 31 serve as additional conductive elements 32 for shielding the electronic components 16, 17, 18 from electromagnetic interference. For this purpose, the wall 22' of the first part 13' of the housing 6' is provided with two through-holes 33 (from which one is visible in the cross-sectional view of Fig. 8). The through-holes 33 extend perpendicular to the main plane 15 (XY-plane) of the printed circuit board 5'. In other words, the through-holes 33 extend in the Z-direction in Fig. 8.

[0073] Although not shown in FIG. 8, the conductive housing 6′ according to the second embodiment may also include one or more protrusions, such as protrusion A shown in FIG. 2, protruding from the first portion 13′ of the conductive housing 6′ toward the printed circuit board 5′.

[0074] 9 shows the printed circuit board 5' in a bottom view. The printed circuit board 5' comprises two through holes 34 (FIGS. 8 and 9) corresponding to the two through holes 33 in the wall 22' (FIG. 8). Furthermore, the second part 14' of the housing 5' comprises two corresponding openings 35 (FIG. 8) having a matching configuration (e.g., threads) for engaging, for example, the screws 31.

[0075] In this example, two screws 31 (FIG. 8) penetrate two corresponding through-holes 33 (FIG. 8) in the wall 22' of the first part 13' of the housing 6', penetrate two corresponding through-holes 34 (FIGS. 8 and 9) in the printed circuit board 5', electrically connect the ground potential (such as a ground trace not shown) of the printed circuit board 5', and engage with two corresponding openings 35 (FIG. 8) in the second part 14' of the housing. Therefore, these two screws 31 can function as additional conductive elements 32 for shielding the electronic components 16, 17, and 18 from electromagnetic interference. As shown in FIG. 9, the two screws 31 inserted into the two openings 34 in the printed circuit board 5' can replace two conductive elements 23. Therefore, in this example, the electronic components 16, 17, and 18 are surrounded by six conductive elements 23 and two screws 31. The size S' of each gap 24 between two adjacent conductive elements 23 and screws 31 is, for example, 0.5 cm. However, the size can also have different values ​​depending on the frequency range of the electromagnetic radiation that needs to be blocked from escaping or entering the fence built by the conductive elements 23 and the screws 31. In this embodiment, when two screws 31 are used as additional conductive elements 32, fewer conductive elements 23 are required as SMT components.

[0076] In other examples, a different number of fastening elements 31 (eg, screws 31 ) can also function as additional conductive elements 32 .

[0077] FIG. 10 shows a flowchart of a method for manufacturing the camera device 3, 3' of FIG. 2 or FIG.

[0078] In a first step S1 of the method, a printed circuit board 5, 5' is provided, the printed circuit board 5, 5' extending in a main plane 15.

[0079] In a second step S2 of the method, one or more electronic components 16, 17, 18 are mounted on a surface 19 of the printed circuit board 5, 5'.

[0080] In a third step S3 of the method, a conductive element 23 is attached by surface mount technology (SMT) onto the surface 19 of the printed circuit board 5, 5' so as to surround the one or more electronic components 16, 17, 18. The conductive element 23 is elastically deformable.

[0081] In a fourth step S4 of the method, a conductive housing 6, 6' is provided having walls 22, 22' configured to extend perpendicular to the main plane 15 of the printed circuit board 5, 5' when the camera device 3, 3' is assembled.

[0082] In a fifth step S5 of the method, the printed circuit board 5, 5' is accommodated in the housing 6, 6' such that the walls 22, 22' of the housing 6, 6' are placed on the conductive element 23 and the conductive element 23 is compressed between the walls 22, 22' and the printed circuit board 5, 5'.

[0083] To manufacture the camera device 3′ (FIGS. 8 and 9) according to the second embodiment, the method may further include a sixth step S6 of inserting fastening elements 31 into the through-holes 33 in the wall 22′, the through-holes 34 in the printed circuit board 5′, and engaging them with corresponding openings 35 in the second part 14′ of the housing 6′. Furthermore, the fastening elements 31 are electrically connected to ground traces (not shown) on the printed circuit board 5′.

[0084] Although the present invention has been described in accordance with preferred embodiments, it will be apparent to those skilled in the art that modifications are possible in all embodiments. [Explanation of symbols]

[0085] 1 vehicle 2 Windows 3, 3' camera equipment 4. Imaging module 5, 5' printed circuit board 6, 6' housing 7. Housing 8, 8' optics 9 Image sensor unit 10 Printed Circuit Board 11 Electronic Cables 12 Connectors 13 First Part 14 Second Part 15 Main plane 16 Electronic Components 17 Electronic Components 18 Electronic Components 19 Surface 20 Electronic Components 21 EMI shielding 22, 22' wall 23 Conductive Elements 24 Gap 25, 25', 25" mounting 26, 26' gasket part 27th side 28 Inner Core 29 Outer layer 30 Spring Elements 31 Fastening Elements 32 Additional conductive elements 33 Through hole 34 Through hole 35 Opening A protrusion O optical axis S, S' size

Claims

1. A camera device, a printed circuit board (5, 5') extending in a main plane (15); one or more electronic components (16, 17, 18) mounted on a surface (19) of said printed circuit board (5, 5'); a conductive housing (6, 6') for accommodating the printed circuit board (5, 5'), the housing (6, 6') having a wall (22, 22') extending perpendicular to the main plane (15) of the printed circuit board (5, 5') and surrounding the one or more electronic components (16, 17, 18); a conductive element (23) for shielding the one or more electronic components (16, 17, 18) from electromagnetic interference, the conductive element (23) being surface-mounted on the surface (19) of the printed circuit board (5, 5') so as to surround the one or more electronic components (16, 17, 18) and being elastically compressed between the wall (22, 22') and the printed circuit board (5, 5'); Equipped with The housing (6, 6') further comprises a side wall extending perpendicular to a main plane (15) of the printed circuit board (5, 5') and surrounding the wall (22, 22'); The printed circuit board (5, 5') is completely housed between the side walls; the housing (6') comprises a first portion (13') and a second portion (14'); said first portion (13') comprising said wall (22'); the wall (22') comprises at least one through hole (33) extending perpendicular to the main plane (15) of the printed circuit board (5'); the camera device comprises one or more electrically conductive fastening elements (31) that mechanically fasten the first and second parts (13', 14') of the housing (6') to one another; a camera device (3, 3') for a vehicle (1), wherein at least one of the one or more fastening elements (31) passes through the at least one through-hole (33) in the wall (22') and a corresponding one of the corresponding through-holes (34) in the printed circuit board (5') and serves as an additional conductive element (32) for shielding the one or more electronic components (16, 17, 18) from electromagnetic interference;

2. 2. The camera device of claim 1, wherein one, some, or all of the conductive elements (23) comprise a conductive and elastically deformable gasket portion (26, 26') in contact with the wall (22, 22') and a conductive mounting portion (25) mounted on the surface (19) of the printed circuit board (5, 5').

3. 3. The camera device of claim 2, wherein the gasket portion (26') comprises an elastomeric inner core (28) and a conductive outer layer (29).

4. 2. The camera device of claim 1, wherein one, some, or all of the conductive elements (23) comprise a spring element (30) in contact with the wall (22, 22′) and a conductive mounting portion (25″) mounted on the surface (19) of the printed circuit board (5, 5′).

5. an imaging module (4) for providing image data of the surroundings of the vehicle (1); 2. The camera device of claim 1, wherein the one or more electronic components (16, 17, 18) comprise an image processor unit (16) for processing the image data provided by the imaging module (4), a memory unit (17) for storing the image data, and / or a communication bus (18) for transferring the image data between the image processor unit (16) and the memory unit (17).

6. 2. The camera device of claim 1, wherein the conductive elements (23) are arranged intermittently on the surface (19) of the printed circuit board (5, 5').

7. 7. The camera device of claim 6, wherein the size (S, S') of the gap (24, 24') between each of two adjacent conductive elements (23) is 3 cm or less, 1.5 cm or less, 1 cm or less, 0.5 cm or less, and / or 0.3 cm or less, and / or the size (S') of the gap (24') between each pair of conductive elements (23) and an adjacent additional conductive element (32) is 3 cm or less, 1.5 cm or less, 1 cm or less, 0.5 cm or less, and / or 0.3 cm or less.

8. 2. The camera device of claim 1, wherein the total number of the conductive elements (23) surrounding the one or more electronic components (16, 17, 18) is 4, 6, 8, 10, 16 or more, and / or the total number of the conductive elements (23) and the additional conductive elements (32) surrounding the one or more electronic components (16, 17, 18) together is 4, 6, 8, 10, 16 or more.

9. A vehicle (1) comprising the camera device (3, 3') according to any one of claims 1 to 8.

10. A method for manufacturing a camera device (3, 3') for a vehicle (1), comprising: providing (S1) a printed circuit board (5, 5') extending in a main plane (15); a step (S2) of attaching one or more electronic components (16, 17, 18) onto a surface (19) of said printed circuit board (5, 5'); Mounting (S3) a conductive element (23) on the surface (19) of the printed circuit board (5, 5') by surface mounting technology, surrounding the one or more electronic components (16, 17, 18); providing (S4) a conductive housing (6, 6') having walls (22, 22') configured to extend perpendicular to the main plane (15) of the printed circuit board (5, 5') when the camera device (3, 3') is assembled; a step (S5) of accommodating the printed circuit board (5, 5') in the housing (6, 6') such that the walls (22, 22') of the housing (6, 6') are placed on the conductive elements (23) and the conductive elements (23) are elastically compressed between the walls (22, 22') and the printed circuit board (5, 5'); Including, The housing (6, 6') further comprises a side wall extending perpendicular to a main plane (15) of the printed circuit board (5, 5') and surrounding the wall (22, 22'); The printed circuit board (5, 5') is completely housed between the side walls; the housing (6') comprises a first portion (13') and a second portion (14'); said first portion (13') comprising said wall (22'); the wall (22') comprises at least one through hole (33) extending perpendicular to the main plane (15) of the printed circuit board (5'); the camera device comprises one or more electrically conductive fastening elements (31) that mechanically fasten the first and second parts (13', 14') of the housing (6') to one another; at least one of the one or more fastening elements (31) passes through the at least one through-hole (33) in the wall (22') and a corresponding one of the corresponding through-holes (34) in the printed circuit board (5') and serves as an additional conductive element (32) for shielding the one or more electronic components (16, 17, 18) from electromagnetic interference.

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