Photosensitive resin composition, photosensitive element, and method for manufacturing wiring board

Abstract

This photosensitive resin composition contains a binder polymer, a photopolymerizable compound, a photopolymerization initiator, and an anthracene-based sensitizer, wherein the binder polymer has a hydroxyalkyl(meth)acrylate unit, and styrene or a styrene derivative unit, and the photosensitive resin composition also includes a polymer (a) wherein the content of styrene or a styrene derivative unit is at least 40 mass%.

Description

[Technical Field]

[0001] The present disclosure relates to a photosensitive resin composition, a photosensitive element, and a method for producing a wiring board. [Background technology]

[0002] In the manufacture of wiring boards, a resist pattern is formed to obtain desired wiring. Photosensitive resin compositions are widely used to form resist patterns. In recent years, with the miniaturization and increasing density of electronic devices, there has been a demand for the formation of finer wiring than ever before on wiring boards. As methods for manufacturing wiring boards that can meet these demands, MSAP (Modified Semi-Additive Process) and SAP (Semi-Additive Process) have attracted attention. In these methods, to form fine wiring, it is necessary to form a resist pattern with adhesion of 7 μm or less and resolution of 12 μm or less.

[0003] To date, photosensitive resin compositions have been improved by adding photosensitizers to improve the resolution and adhesion of the formed resist patterns. As photosensitizers, for example, anthracene derivatives such as 9,10-dibutoxyanthracene (DBA) have been investigated (see, for example, Patent Document 1). [Prior art documents] [Patent documents]

[0004] [Patent Document 1] International Publication No. 2007 / 004619 Summary of the Invention [Problem to be solved by the invention]

[0005] However, the photosensitive resin composition containing DBA described in Patent Document 1 has not been able to form a resist pattern with adhesion of 7 μm or less and resolution of 12 μm or less, and there is a demand for photosensitive resin compositions with improved adhesion and resolution of the resulting resist patterns.

[0006] Therefore, an object of the present disclosure is to provide a photosensitive resin composition and a photosensitive element that are capable of forming a resist pattern with excellent adhesion and resolution, and a method for manufacturing a wiring board using the same. [Means for solving the problem]

[0007] In order to achieve the above object, the present disclosure provides a photosensitive resin composition comprising a binder polymer, a photopolymerizable compound, a photopolymerization initiator, and an anthracene-based sensitizer, wherein the binder polymer contains a polymer (a) having hydroxyalkyl (meth)acrylate units and styrene or styrene derivative units, and the content of the styrene or styrene derivative units is 40 mass% or more.

[0008] According to the photosensitive resin composition, by using the specific polymer (a) in combination with an anthracene-based sensitizer, it is possible to form a resist pattern with excellent adhesion and resolution. This is thought to be because the polymer (a) contains hydroxyalkyl (meth)acrylate units and 40 mass% or more of styrene or styrene derivative units, which improves the water absorption of the polymer (a) and its dispersibility in the photosensitive resin composition, and the use of the polymer (a) in combination with an anthracene-based sensitizer makes it possible to achieve high developability and high adhesion.

[0009] In the photosensitive resin composition, the photopolymerizable compound may contain a polyfunctional monomer having two or more reactive groups that react with radicals and a total of 2 to 40 oxyethylene groups and / or oxypropylene groups. By containing the polyfunctional monomer, the alkali resistance of the resulting resist pattern can be further improved, and better adhesion can be obtained.

[0010] In the photosensitive resin composition, the photopolymerizable compound may contain 2,2-bis(4-((meth)acryloxypolyethoxy)phenyl)propane having 10 or more oxyethylene groups. By containing the compound, the adhesion and resolution of the obtained resist pattern can be further improved.

[0011] In the photosensitive resin composition, the photopolymerizable compound may contain 2,2-bis(4-((meth)acryloxypolyethoxy)phenyl)propane having less than 10 oxyethylene groups. By containing this compound, adhesion can be further improved. By making the number of oxyethylene groups less than 10, the molecular weight between crosslinking points in the exposed area is reduced, swelling of the exposed area in a developer is suppressed, and adhesion is improved.

[0012] In the photosensitive resin composition, the photopolymerizable compound may contain 2,2-bis(4-((meth)acryloxypolyethoxy)phenyl)propane having 10 or more oxyethylene groups and 2,2-bis(4-((meth)acryloxypolyethoxy)phenyl)propane having less than 10 oxyethylene groups.

[0013] In the photosensitive resin composition, the polymer (a) may have a weight average molecular weight of 30000 to 40000. By using such a polymer (a), the dispersibility in the photosensitive resin composition is further improved, and better developability and adhesion can be achieved.

[0014] In the photosensitive resin composition, the content of the anthracene-based sensitizer may be 0.2 parts by mass or more but less than 0.8 parts by mass per 100 parts by mass of the total amount of the binder polymer and the photopolymerizable compound. When the content of the anthracene-based sensitizer is within the above range, superior high developability and high adhesion can be achieved, and a better resist pattern shape can be obtained. Furthermore, when the content of the anthracene-based sensitizer is less than 0.8 parts by mass, precipitation of the anthracene-based sensitizer on the surface of a photosensitive resin layer formed using the photosensitive resin composition can be suppressed when a photosensitive element is formed and stored in a refrigerator.

[0015] The present disclosure also provides a photosensitive element comprising a support and a photosensitive resin layer formed on the support using the photosensitive resin composition of the present disclosure.

[0016] The present disclosure further provides a method for manufacturing a wiring board, comprising the steps of: providing a photosensitive resin layer on a substrate using the photosensitive resin composition of the present disclosure or the photosensitive element of the present disclosure; photocuring a portion of the photosensitive resin layer; removing an uncured portion of the photosensitive resin layer to form a resist pattern; and forming a wiring layer on a portion of the substrate where the resist pattern is not formed. [Effects of the Invention]

[0017] According to the present disclosure, it is possible to provide a photosensitive resin composition and a photosensitive element that are capable of forming a resist pattern with excellent adhesion and resolution, as well as a method for manufacturing a wiring board using the same. [Brief explanation of the drawings]

[0018] [Figure 1] FIG. 1 is a schematic cross-sectional view illustrating a photosensitive element according to one embodiment. [Figure 2] 1A to 1C are schematic diagrams illustrating a method for manufacturing a wiring substrate according to an embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0019] Hereinafter, embodiments of the present disclosure will be described in detail.

[0020] In this specification, the term "process" includes not only an independent process but also a process that cannot be clearly distinguished from other processes as long as the intended effect of the process is achieved. A numerical range indicated using "to" indicates a range that includes the numerical values ​​before and after "to" as the minimum and maximum values, respectively. The term "layer" encompasses not only a structure that is formed over the entire surface when observed in a plan view, but also a structure that is formed on a part of the surface. "(Meth)acrylic acid" means at least one of "acrylic acid" and the corresponding "methacrylic acid." The same applies to other similar expressions such as (meth)acrylate.

[0021] In this specification, "(poly)oxyethylene group" means an oxyethylene group or a polyoxyethylene group in which two or more ethylene groups are linked by ether bonds. "(poly)oxypropylene group" means an oxypropylene group or a polyoxypropylene group in which two or more propylene groups are linked by ether bonds. "EO-modified" means a compound having a (poly)oxyethylene group. "PO-modified" means a compound having a (poly)oxypropylene group. "EO·PO-modified" means a compound having a (poly)oxyethylene group and / or a (poly)oxypropylene group.

[0022] In this specification, when a composition contains multiple substances corresponding to each component, the amount of each component refers to the total amount of those multiple substances present in the composition, unless otherwise specified. In this specification, the term "solid content" refers to the non-volatile content of a photosensitive resin composition excluding volatile substances (water, solvent, etc.). In other words, the term "solid content" refers to components other than the solvent that remain unvolatilized during drying of the photosensitive resin composition, as described below, and includes those that are liquid, syrup-like, or waxy at room temperature (25°C).

[0023] <Photosensitive resin composition> The photosensitive resin composition according to this embodiment contains a binder polymer (component A), a photopolymerizable compound (component B), a photopolymerization initiator (component C), and an anthracene-based sensitizer (component D). The component A includes a polymer (a) containing hydroxyalkyl (meth)acrylate units and styrene or styrene derivative units, with the styrene or styrene derivative unit content being 40% by mass or more. The photosensitive resin composition according to this embodiment may further contain a polymerization inhibitor (component E). Each component will be described below.

[0024] Component (A): Binder polymer The photosensitive resin composition contains one or more components (A). Examples of the component (A) include acrylic resins, styrene resins, epoxy resins, amide resins, amide-epoxy resins, alkyd resins, and phenol resins. The component (A) may contain an acrylic resin to further improve alkaline developability. The photosensitive resin composition according to this embodiment contains, as the component (A), at least a polymer (a) having hydroxyalkyl (meth)acrylate units and styrene or styrene derivative units, and having a content of the styrene or styrene derivative units of 40 mass% or more.

[0025] The polymer (a) has a hydroxyalkyl (meth)acrylate unit (a structural unit derived from a hydroxyalkyl (meth)acrylate). The hydroxyalkyl (meth)acrylate may be, for example, hydroxymethyl (meth)acrylate, hydroxyethyl (meth)acrylate, hydroxypropyl (meth)acrylate, hydroxybutyl (meth)acrylate, hydroxypentyl (meth)acrylate, or hydroxyhexyl (meth)acrylate. In addition, when the number of carbon atoms in the alkyl portion of the hydroxyalkyl (meth)acrylate unit is 3 or more, the hydroxyalkyl (meth)acrylate unit may have a branched structure.

[0026] The content of hydroxyalkyl (meth)acrylate units in polymer (a), based on the total amount of monomer units constituting polymer (a), may be 0.5 mass% or more, 0.75 mass% or more, or 1.0 mass% or more from the viewpoint of dispersibility, and may be 20 mass% or less, 15 mass% or less, or 8 mass% or less from the viewpoint of water absorbency.

[0027] The polymer (a) has styrene or styrene derivative units (structural units derived from styrene or a styrene derivative), and the content of the styrene or styrene derivative units is 40 mass% or more based on the total amount of the monomer units constituting the polymer (a). The styrene derivative may be, for example, vinyltoluene, α-methylstyrene, etc.

[0028] The content of styrene and styrene derivatives in polymer (a) is 40% by mass or more based on the total amount of monomer units constituting polymer (a), but from the viewpoint of resolution, it may be 45% by mass or more, 47% by mass or more, or 50% by mass or more, and from the viewpoint of developability, it may be 90% by mass or less, 85% by mass or less, or 80% by mass or less.

[0029] The polymer (a) may have, in addition to the above-mentioned structural units, a structural unit derived from (meth)acrylic acid, or may further have a structural unit derived from a monomer other than (meth)acrylic acid. The other monomer may be one type or two or more types.

[0030] The other monomer may be, for example, a (meth)acrylic acid ester. Examples of the (meth)acrylic acid ester include a (meth)acrylic acid alkyl ester, a (meth)acrylic acid cycloalkyl ester, and a (meth)acrylic acid aryl ester.

[0031] From the viewpoint of improving alkaline developability and release properties, the other monomer may preferably be a (meth)acrylic acid alkyl ester. The alkyl group of the (meth)acrylic acid alkyl ester may be, for example, a methyl group, ethyl group, propyl group, butyl group, pentyl group, hexyl group, heptyl group, octyl group, nonyl group, decyl group, undecyl group, dodecyl group, or a structural isomer thereof, and from the viewpoint of further improving release properties, may be an alkyl group having 1 to 4 carbon atoms.

[0032] When the other monomer is a (meth)acrylic acid alkyl ester, the content of the (meth)acrylic acid alkyl ester, based on the total amount of monomers constituting the component (A), may be 1 mass % or more, 2 mass % or more, or 3 mass % or more from the viewpoint of excellent release properties, and may be 80 mass % or less, 60 mass % or less, or 50 mass % or less from the viewpoint of further improving resolution and adhesion.

[0033] Further, examples of other monomers include acrylamides such as diacetone acrylamide, acrylonitrile, ethers of vinyl alcohol such as vinyl-n-butyl ether, (meth)acrylic acid alkyl esters, (meth)acrylic acid benzyl esters such as benzyl methacrylate, (meth)acrylic acid tetrahydrofurfuryl ester, (meth)acrylic acid dimethylaminoethyl ester, (meth)acrylic acid diethylaminoethyl ester, (meth)acrylic acid glycidyl ester, 2,2,2-trifluoroethyl (meth)acrylate, 2,2,3,3-tetrafluoropropyl (meth)acrylate, α-bromoacrylic acid, α-chloroacrylic acid, β-furyl (meth)acrylic acid, β-styryl (meth)acrylic acid, maleic acid, maleic anhydride, maleic acid monoesters such as monomethyl maleate, monoethyl maleate, and monoisopropyl maleate, fumaric acid, cinnamic acid, α-cyanocinnamic acid, itaconic acid, crotonic acid, and propiolic acid.

[0034] The component (A) may contain a binder polymer other than the above-mentioned polymer (a), or may consist solely of polymer (a). From the viewpoint of obtaining better adhesion and resolution, the content of polymer (a) in the component (A) may be 50 to 100 mass % or 80 to 100 mass % based on the total amount of the component (A).

[0035] The acid value of polymer (a) may be 100 mgKOH / g or more, 120 mgKOH / g or more, 140 mgKOH / g or more, or 150 mgKOH / g or more from the viewpoint of enabling suitable development, and may be 250 mgKOH / g or less, 240 mgKOH / g or less, or 230 mgKOH / g or less from the viewpoint of improving the adhesion (developer resistance) of the cured product of the photosensitive resin composition. The acid value of polymer (a) can be adjusted by the content of structural units constituting polymer (a) (e.g., structural units derived from (meth)acrylic acid). When component (A) contains a binder polymer other than polymer (a), the acid value of the other binder polymer may also be within the above range.

[0036] The weight average molecular weight (Mw) of polymer (a) may be 10,000 or more, 20,000 or more, 25,000 or more, or 30,000 or more from the viewpoint of excellent adhesion (developer resistance) of the cured product of the photosensitive resin composition, and may be 100,000 or less, 80,000 or less, 60,000 or less, or 40,000 or less from the viewpoint of suitable development. The dispersity (Mw / Mn) of polymer (a) may be, for example, 1.0 or more or 1.5 or more, and may be 3.0 or less or 2.5 or less from the viewpoint of further improving adhesion and resolution. When component (A) contains a binder polymer other than polymer (a), the Mw of the other binder polymer may also be within the above range.

[0037] The weight-average molecular weight and dispersity can be measured, for example, by gel permeation chromatography (GPC) using a calibration curve of standard polystyrene. More specifically, they can be measured under the conditions described in the Examples. For compounds with low molecular weights, if it is difficult to measure the weight-average molecular weight using the above-mentioned method, the molecular weight can be measured by another method and the average can be calculated.

[0038] The content of the component (A), based on the total solid content of the photosensitive resin composition, may be 20% by mass or more, 30% by mass or more, or 40% by mass or more from the viewpoint of excellent film formability, and may be 90% by mass or less, 80% by mass or less, or 65% by mass or less from the viewpoint of even better sensitivity and resolution.

[0039] The content of the (A) component may be 30 parts by mass or more, 35 parts by mass or more, or 40 parts by mass or more, relative to 100 parts by mass of the total of the (A) component and the (B) component, from the viewpoint of excellent film formability, and may be 70 parts by mass or less, 65 parts by mass or less, or 60 parts by mass or less, from the viewpoint of further improving sensitivity and resolution.

[0040] (B) Component: Photopolymerizable compound The photosensitive resin composition contains one or more types of component (B). Component (B) may be any compound that polymerizes when exposed to light, such as a compound having an ethylenically unsaturated bond. Component (B) may also contain a polyfunctional monomer having two or more reactive groups that react with radicals. From the viewpoint of further improving alkali developability, resolution, and release properties after curing, component (B) may also contain a bisphenol A (meth)acrylate compound.

[0041] Examples of bisphenol A type (meth)acrylate compounds include 2,2-bis(4-((meth)acryloxypolyethoxy)phenyl)propane (e.g., 2,2-bis(4-((meth)acryloxypentaethoxy)phenyl)propane), 2,2-bis(4-((meth)acryloxypolypropoxy)phenyl)propane, 2,2-bis(4-((meth)acryloxypolybutoxy)phenyl)propane, and 2,2-bis(4-((meth)acryloxypolyethoxypolypropoxy)phenyl)propane. From the viewpoint of further improving resolution and release properties, component (B) may contain 2,2-bis(4-((meth)acryloxypolyethoxy)phenyl)propane (e.g., 2,2-bis(4-((meth)acryloxypentaethoxy)phenyl)propane). As the 2,2-bis(4-((meth)acryloxypolyethoxy)phenyl)propane, a compound having 10 or more oxyethylene groups may be used, or a compound having less than 10 oxyethylene groups may be used, or a compound having 10 or more oxyethylene groups and a compound having less than 10 oxyethylene groups may be used in combination.

[0042] From the viewpoint of further improving the resolution of the resist, the content of the bisphenol A type (meth)acrylate compound may be 20% by mass or more or 40% by mass or more, and may be 100% by mass or less, 95% by mass or less, or 90% by mass or less, based on the total amount of component (B).

[0043] To further improve resolution and flexibility, component (B) may contain an α,β-unsaturated ester compound obtained by reacting a polyhydric alcohol with an α,β-unsaturated carboxylic acid. Examples of the α,β-unsaturated ester compound include polyalkylene glycol di(meth)acrylates such as polyethylene glycol di(meth)acrylate, polypropylene glycol di(meth)acrylate, and EO-modified polypropylene glycol, trimethylolpropane di(meth)acrylate, trimethylolpropane tri(meth)acrylate, EO-modified trimethylolpropane tri(meth)acrylate, PO-modified trimethylolpropane tri(meth)acrylate, EO·PO-modified trimethylolpropane tri(meth)acrylate, tetramethylolmethane tri(meth)acrylate, and tetramethylolmethane tetra(meth)acrylate.

[0044] From the viewpoint of improving sensitivity and adhesion, component (B) may contain a compound having three or more (meth)acryloyl groups. Examples of such compounds include trimethylolpropane tri(meth)acrylate, EO-modified trimethylolpropane tri(meth)acrylate, PO-modified trimethylolpropane tri(meth)acrylate, EO·PO-modified trimethylolpropane tri(meth)acrylate, EO-modified pentaerythritol tetra(meth)acrylate, EO-modified ditrimethylolpropane tetra(meth)acrylate, and EO-modified dipentaerythritol hexa(meth)acrylate.

[0045] The content of the α,β-unsaturated ester compound may be 20% by mass or more or 30% by mass or more, based on the total amount of the component (B), from the viewpoint of improving flexibility, and may be 70% by mass or less or 60% by mass or less, from the viewpoint of further improving resolution.

[0046] The photosensitive resin composition may contain, as the component (B), a photopolymerizable compound other than the bisphenol A (meth)acrylate compound and the α,β-unsaturated ester compound.

[0047] Other photopolymerizable compounds include nonylphenoxy polyethyleneoxy acrylate, phthalic acid compounds, (meth)acrylic acid alkyl esters, photopolymerizable compounds having at least one cationically polymerizable cyclic ether group in the molecule (oxetane compounds, etc.), etc. From the viewpoint of further suitably improving the resolution, adhesion, resist shape, and release properties after curing, the other photopolymerizable compound may be at least one selected from the group consisting of nonylphenoxy polyethyleneoxy acrylate and phthalic acid compounds.

[0048] Examples of nonylphenoxy polyethyleneoxyacrylates include nonylphenoxytriethyleneoxyacrylate, nonylphenoxytetraethyleneoxyacrylate, nonylphenoxypentaethyleneoxyacrylate, nonylphenoxyhexaethyleneoxyacrylate, nonylphenoxyheptaethyleneoxyacrylate, nonylphenoxyoctaethyleneoxyacrylate, nonylphenoxynonaethyleneoxyacrylate, nonylphenoxydecaethyleneoxyacrylate, and nonylphenoxyundecaethyleneoxyacrylate.

[0049] The phthalic acid compound may be, for example, γ-chloro-β-hydroxypropyl-β'-(meth)acryloyloxyethyl-o-phthalate (also known as 3-chloro-2-hydroxypropyl-2-(meth)acryloyloxyethyl phthalate), β-hydroxyethyl-β'-(meth)acryloyloxyethyl-o-phthalate, β-hydroxypropyl-β'-(meth)acryloyloxyethyl-o-phthalate, or the like, and is preferably γ-chloro-β-hydroxypropyl-β'-(meth)acryloyloxyethyl-o-phthalate.

[0050] When the component (B) contains other photopolymerizable compounds, the content of the other photopolymerizable compounds may be 1% by mass or more, 3% by mass or more, or 5% by mass or more, and may be 30% by mass or less, 25% by mass or less, or 20% by mass or less, based on the total amount of the component (B), from the viewpoint of further suitably improving the resolution, adhesion, resist shape, and release properties after curing.

[0051] From the viewpoint of further improving adhesion and resolution, component (B) may contain, among the above-mentioned compounds, a compound having a total of 2 to 40 oxyethylene groups (EO groups) and / or oxypropylene groups (PO groups) in the molecule. From the viewpoint of further improving adhesion and resolution, the total number of EO groups and / or PO groups may be 2 to 40 or 2 to 30.

[0052] The content of the compound having a total of 2 to 40 EO groups and / or PO groups may be 2 to 15 mass%, 4 to 12 mass%, or 5 to 8 mass%, based on the total amount of component (B), from the viewpoint of further improving adhesion and resolution.

[0053] The content of the component (B) may be 3% by mass or more, 10% by mass or more, or 25% by mass or more, based on the total solid content of the photosensitive resin composition, from the viewpoint of further improving sensitivity and resolution, and may be 70% by mass or less, 60% by mass or less, or 50% by mass or less, from the viewpoint of excellent film formability.

[0054] Component (C): Photopolymerization initiator The photosensitive resin composition contains one or more kinds of component (C), such as a hexaarylbiimidazole compound, an aromatic ketone such as benzophenone, 2-benzyl-2-dimethylamino-1-(4-morpholinophenyl)-1-butanone, 2-(dimethylamino)-2-[(4-methylphenyl)methyl]-1-[4-(4-morpholinyl)phenyl]-1-butanone, 4-(2-hydroxyethoxy)phenyl-2-(hydroxy-2-propyl)ketone, or 2-methyl-1-[4-(methylthio)phenyl]-2-morpholino-propanone-1, quinones such as alkyl anthraquinones; benzoin ether compounds such as benzoin alkyl ethers; benzoin compounds such as benzoin and alkyl benzoins; benzil derivatives such as benzil dimethyl ketal; bis(2,4,6-trimethylbenzoyl)-phenylphosphine oxide; bis(2,6-dimethylbenzoyl)-2,4,4-trimethyl-pentylphosphine oxide; (2,4,6-trimethylbenzoyl)ethoxyphenylphosphine oxide, etc.

[0055] From the viewpoint of further suppressing the penetration of the photosensitizer into the polyethylene film, component (C) may contain a hexaarylbiimidazole compound. The aryl group in the hexaarylbiimidazole compound may be a phenyl group or the like. The hydrogen atom bonded to the aryl group in the hexaarylbiimidazole compound may be substituted with a halogen atom (e.g., a chlorine atom).

[0056] The hexaarylbiimidazole compound may be a 2,4,5-triarylimidazole dimer. Examples of the 2,4,5-triarylimidazole dimer include 2-(o-chlorophenyl)-4,5-diphenylimidazole dimer, 2-(o-chlorophenyl)-4,5-bis-(m-methoxyphenyl)imidazole dimer, and 2-(p-methoxyphenyl)-4,5-diphenylimidazole dimer. From the viewpoint of further suppressing the penetration of the photosensitizer into the polyethylene film, the hexaarylbiimidazole compound is preferably 2-(o-chlorophenyl)-4,5-diphenylimidazole dimer, and more preferably 2,2-bis(o-chlorophenyl)-4,5-4',5'-tetraphenyl-1,2'biimidazole.

[0057] From the viewpoint of further suppressing penetration of the photosensitizer into the polyethylene film, the content of the hexaarylbiimidazole compound may be 90% by mass or more, 95% by mass or more, or 99% by mass or more based on the total amount of component (C).Component (C) may consist solely of the hexaarylbiimidazole compound.

[0058] From the viewpoint of further improving sensitivity and adhesion, the content of the component (C) may be 0.1 mass % or more, 0.5 mass % or more, or 1 mass % or more, and may be 20 mass % or less, 10 mass % or less, or 5 mass % or less, based on the total solid content of the photosensitive resin composition.

[0059] Component (D): Anthracene-based sensitizer The photosensitive resin composition contains one or more types of component (D). Component (D) is used as a photosensitizer. Examples of component (D) include 9,10-dibutoxyanthracene, 9,10-diphenylanthracene, and 9,10-diethoxyanthracene. Among these, 9,10-dibutoxyanthracene is preferred from the viewpoint of further improving adhesion and resolution.

[0060] The content of component (D) is, relative to 100 parts by mass of the total of components (A) and (B), for example, 0.2 parts by mass or more, preferably 0.3 parts by mass or more, more preferably 0.4 parts by mass or more, and even more preferably 0.5 parts by mass or more, from the viewpoint of further improving sensitivity, adhesion, and resolution. From the viewpoint of improving the resist pattern shape, the content is, for example, 1.5 parts by mass or less, preferably 1.0 parts by mass or less, more preferably 0.8 parts by mass or less, even more preferably less than 0.8 parts by mass, and particularly preferably 0.7 parts by mass or less. Furthermore, when the content of component (D) is less than 0.8 parts by mass, the storage stability of the photosensitive element formed can be improved. Specifically, for example, precipitation of component (D) on the surface of the photosensitive resin layer (or between the photosensitive resin layer and the protective layer if the photosensitive element has a protective layer) can be suppressed during refrigerated storage of the photosensitive element. Note that precipitation of component (D) is likely to occur when 9,10-dibutoxyanthracene is used as component (D) and the protective layer is a polyethylene film. However, even when such a combination is used, precipitation of component (D) during refrigerated storage can be suppressed by keeping the content of component (D) less than 0.8 parts by mass.

[0061] The photosensitive resin composition may further contain other known photosensitizers in addition to component (D). The content of the other sensitizers may be, for example, 0.2 to 1.5 parts by mass or 0.4 to 1.0 part by mass per 100 parts by mass of the total amount of components (A) and (B).

[0062] Component (E): Polymerization inhibitor The photosensitive resin composition may further contain a polymerization inhibitor (component (E)) to suppress polymerization in unexposed areas during resist pattern formation and further improve resolution. Examples of the polymerization inhibitor include t-butylcatechol and 4-hydroxy-2,2,6,6-tetramethylpiperidine-N-oxyl.

[0063] The content of the (E) component may be 0.001 part by mass or more, 0.002 part by mass or more, or 0.003 part by mass or more, relative to 100 parts by mass of the total of the (A) component and the (B) component, from the viewpoints of sensitivity and resolution, and may be 0.1 part by mass or less, 0.05 part by mass or less, or 0.01 part by mass or less, from the viewpoints of sensitivity and adhesion.

[0064] The photosensitive resin composition may further contain one or more other components in addition to the components described above. Examples of other components include hydrogen donors (such as bis[4-(dimethylamino)phenyl]methane, bis[4-(diethylamino)phenyl]methane, leucocrystal violet, and N-phenylglycine), dyes (such as malachite green), tribromophenyl sulfone, photocoloring agents, thermal color-developing inhibitors, plasticizers (such as p-toluenesulfonamide), pigments, fillers, antifoaming agents, flame retardants, stabilizers, adhesion promoters, leveling agents, release promoters, antioxidants, fragrances, imaging agents, and thermal crosslinking agents. The content of these other components may be 0.005 parts by mass or more, or 0.01 parts by mass or more, or 20 parts by mass or less, per 100 parts by mass of the total amount of components (A) and (B).

[0065] The photosensitive resin composition may further contain one or more organic solvents to adjust the viscosity. Examples of organic solvents include methanol, ethanol, acetone, methyl ethyl ketone, methyl cellosolve, ethyl cellosolve, toluene, N,N-dimethylformamide, and propylene glycol monomethyl ether. The content of the organic solvent may be 40% by mass or more and 70% by mass or less, based on the total amount of the photosensitive resin composition.

[0066] The photosensitive resin composition can be suitably used for forming a resist pattern, and can be particularly suitably used in the method for producing a wiring board described below.

[0067] <Photosensitive element> Fig. 1 is a schematic cross-sectional view of a photosensitive element according to one embodiment. As shown in Fig. 1, the photosensitive element 1 includes a support 2, a photosensitive resin layer 3 provided on the support 2, and a protective layer 4 provided on the side of the photosensitive resin layer 3 opposite the support 2.

[0068] The support 2 and the protective layer 4 may each be a polymer film having heat resistance and solvent resistance, such as a polyester film such as a polyethylene terephthalate film, a polyethylene film, or a polyolefin film such as a polypropylene film. The support 2 and the protective layer 4 may each be a film of a hydrocarbon polymer other than polyolefin. A film of a hydrocarbon polymer including polyolefin may have a low density, for example, 1.014 g / cm. 3 The support 2 and the protective layer 4 may each be a stretched film obtained by stretching the low-density hydrocarbon-based polymer film. The type of polymer film constituting the protective layer 4 may be the same as or different from the type of polymer film constituting the support 2.

[0069] These polymer films are commercially available, for example, as polyethylene terephthalate films such as the PS series (e.g., PS-25) manufactured by Teijin Limited, polyethylene films such as NF-15 manufactured by Tamapoly Co., Ltd., or polypropylene films manufactured by Oji Paper Co., Ltd. (e.g., Alphan MA-410, E-200C) and Shin-Etsu Film Co., Ltd.

[0070] The thickness of the support 2 may be 1 μm or more or 5 μm or more from the viewpoint of preventing damage to the support 2 when peeling the support 2 from the photosensitive resin layer 3, and may be 100 μm or less, 50 μm or less, or 30 μm or less from the viewpoint of enabling suitable exposure even when exposure is performed through the support 2.

[0071] The thickness of the protective layer 4 may be 1 μm or more, 5 μm or more, or 15 μm or more from the viewpoint of suppressing damage to the protective layer 4 when the photosensitive resin layer 3 and the support 2 are laminated onto the substrate while peeling off the protective layer 4, and may be 100 μm or less, 50 μm or less, or 30 μm or less from the viewpoint of improving productivity.

[0072] The photosensitive resin layer 3 is made of the above-mentioned photosensitive resin composition. The thickness of the photosensitive resin layer 3 after drying (after volatilizing the organic solvent if the photosensitive resin composition contains an organic solvent) may be 1 μm or more or 5 μm or more from the viewpoints of facilitating coating and improving productivity, and may be 100 μm or less, 50 μm or less, or 40 μm or less from the viewpoints of further improving adhesion and resolution.

[0073] The photosensitive element 1 can be obtained, for example, as follows. First, a photosensitive resin layer 3 is formed on a support 2. The photosensitive resin layer 3 can be formed, for example, by applying a photosensitive resin composition containing an organic solvent to form a coating layer and drying this coating layer. Next, a protective layer 4 is formed on the surface of the photosensitive resin layer 3 opposite the support 2.

[0074] The coating layer is formed by a known method such as roll coating, comma coating, gravure coating, air knife coating, die coating, bar coating, etc. The coating layer is dried so that the amount of organic solvent remaining in the photosensitive resin layer 3 is, for example, 2% by mass or less, and specifically, for example, at 70 to 150°C for about 5 to 30 minutes.

[0075] In another embodiment, the photosensitive element may not include a protective layer, and may further include other layers such as a cushion layer, an adhesive layer, a light-absorbing layer, and a gas barrier layer.

[0076] The photosensitive element 1 may be, for example, in the form of a sheet, or may be in the form of a photosensitive element roll wound around a core. In the photosensitive element roll, the photosensitive element 1 is preferably wound with the support 2 facing outward. The core is formed of, for example, polyethylene, polypropylene, polystyrene, polyvinyl chloride, acrylonitrile-butadiene-styrene copolymer, or the like. An end separator may be provided on the end face of the photosensitive element roll from the viewpoint of end face protection, and a moisture-proof end face separator may be provided from the viewpoint of edge fusion resistance. The photosensitive element 1 may be wrapped, for example, in a black sheet with low moisture permeability.

[0077] The photosensitive element 1 can be suitably used for forming a resist pattern, and can be particularly suitably used in the method for producing a wiring board, which will be described later.

[0078] <Method of manufacturing wiring board> 2A and 2B are schematic diagrams illustrating a method for manufacturing a wiring board (also called a printed wiring board) according to one embodiment. In this manufacturing method, first, as shown in FIG. 2A, a substrate (e.g., a circuit-forming substrate) is prepared, which includes an insulating layer 11 and a conductor layer 12 formed on the insulating layer 11. The conductor layer 12 may be, for example, a metallic copper layer.

[0079] Next, as shown in FIG. 2(b), a photosensitive resin layer 13 is provided on the substrate (conductor layer 12). In this step, the photosensitive resin layer 13 made of the photosensitive resin composition described above is formed on the substrate (conductor layer 12) using the photosensitive resin composition or photosensitive element 1 described above. For example, the photosensitive resin layer 13 is formed by applying the photosensitive resin composition to the substrate and drying it. Alternatively, the photosensitive resin layer 13 is formed by removing the protective layer 4 from the photosensitive element 1, and then pressing the photosensitive resin layer 3 of the photosensitive element 1 to the substrate while heating. During the pressing, at least one of the photosensitive resin layer 3 and the substrate may be heated, for example, to 70 to 130°C. The pressure during the pressing may be, for example, 0.1 to 1.0 MPa.

[0080] 2(c), a mask 14 is placed on the photosensitive resin layer 13, and actinic rays 15 are irradiated to expose areas other than the area where the mask 14 is placed, thereby photo-curing the photosensitive resin layer 13. The light source for the actinic rays 15 may be an ultraviolet or visible light source such as a carbon arc lamp, a mercury vapor arc lamp, a high-pressure mercury lamp, a xenon lamp, a gas laser (such as an argon laser), a solid-state laser (such as a YAG laser), or a semiconductor laser.

[0081] In another embodiment, without using the mask 14, a part of the photosensitive resin layer 13 may be exposed by irradiating with actinic rays 15 in a desired pattern by a direct imaging exposure method such as LDI exposure method or DLP exposure method.

[0082] 2(d), the regions (uncured portions) other than the photocured portions formed by exposure are removed from the substrate by development to form a resist pattern 16 consisting of the photocured portions (cured product of the photosensitive resin layer). The development method may be, for example, wet development or dry development, with wet development being preferred.

[0083] Wet development is carried out using a developer suitable for the photosensitive resin composition by, for example, a dipping method, a puddle method, a spray method, brushing, slapping, scrubbing, swinging immersion, etc. The developer is appropriately selected depending on the constitution of the photosensitive resin composition, and may be an alkaline developer or an organic solvent developer.

[0084] The alkaline developer may be an aqueous solution containing a base such as an alkali hydroxide such as lithium, sodium, or potassium hydroxide; an alkali carbonate such as lithium, sodium, potassium, or ammonium carbonate or bicarbonate; an alkali metal phosphate such as potassium phosphate or sodium phosphate; an alkali metal pyrophosphate such as sodium pyrophosphate or potassium pyrophosphate; borax; sodium metasilicate; tetramethylammonium hydroxide; ethanolamine; ethylenediamine; diethylenetriamine; 2-amino-2-hydroxymethyl-1,3-propanediol; 1,3-diamino-2-propanol; morpholine, etc.

[0085] The alkaline developer may be, for example, a 0.1 to 5 mass % aqueous sodium carbonate solution, a 0.1 to 5 mass % aqueous potassium carbonate solution, a 0.1 to 5 mass % aqueous sodium hydroxide solution, a 0.1 to 5 mass % aqueous sodium tetraborate solution, etc. The pH of the alkaline developer may be, for example, 9 to 11.

[0086] The alkaline developer may further contain a surfactant, an antifoaming agent, an organic solvent, etc. Examples of the organic solvent include acetone, ethyl acetate, an alkoxyethanol having an alkoxy group having 1 to 4 carbon atoms, ethyl alcohol, isopropyl alcohol, butyl alcohol, diethylene glycol monomethyl ether, diethylene glycol monoethyl ether, and diethylene glycol monobutyl ether. The content of the organic solvent may be 2 to 90 mass % based on the total amount of the alkaline developer.

[0087] The organic solvent developer may contain an organic solvent such as 1,1,1-trichloroethane, N-methylpyrrolidone, N,N-dimethylformamide, cyclohexanone, methyl isobutyl ketone, γ-butyrolactone, etc. The organic solvent developer may further contain 1 to 20% by mass of water.

[0088] In this step, after removing the unexposed portion, if necessary, heating at 60 to 250°C or applying 0.2 to 10 J / cm 2 The resist pattern 16 may be further hardened by further exposure to light at 1000 K.

[0089] 2(e), a wiring layer 17 is formed on the portion of the conductor layer 12 where the resist pattern 16 is not formed, for example, by plating. The wiring layer 17 may be formed of the same material as the conductor layer 12, or may be formed of a different material. The wiring layer 17 may be, for example, a metallic copper layer. The plating may be one or both of an electrolytic plating process and an electroless plating process.

[0090] 2(f), the resist pattern 16 is removed, and the conductor layer 12 provided in a position corresponding to the resist pattern 16 is also removed, thereby obtaining a wiring substrate 18 in which the wiring layer 17 is formed on the substrate.

[0091] The resist pattern 16 can be removed by, for example, developing using a strong alkaline aqueous solution by immersion, spraying, etc. The strong alkaline aqueous solution may be, for example, a 1 to 10 mass % sodium hydroxide aqueous solution, a 1 to 10 mass % potassium hydroxide aqueous solution, or the like.

[0092] The conductive layer 12 can be removed by etching. The etching solution is appropriately selected depending on the type of conductive layer 12, and may be, for example, a cupric chloride solution, a ferric chloride solution, an alkaline etching solution, a hydrogen peroxide etching solution, or the like. [Example]

[0093] The present disclosure will be explained in more detail below using examples, but the present disclosure is not limited to these examples.

[0094] <Synthesis of component (A)> Solution (a) was prepared by mixing the monomers shown in Table 1 in the amounts (unit: parts by mass) shown in the table with 0.9 parts by mass of azobisisobutyronitrile. Solution (b) was prepared by dissolving 0.5 parts by mass of azobisisobutyronitrile in 50 parts by mass of a mixture (x) of 30 parts by mass of methyl cellosolve and 20 parts by mass of toluene. 500 g of mixture (x) was placed in a flask equipped with a stirrer, reflux condenser, thermometer, dropping funnel, and nitrogen gas inlet tube, and the mixture was stirred while blowing nitrogen gas into the flask and heated to 80°C. Solution (a) was added dropwise to the mixture in the flask at a constant rate over 4 hours, followed by stirring at 80°C for 2 hours. Next, solution (b) was added dropwise to the solution in the flask at a constant rate over 10 minutes, followed by stirring the solution in the flask at 80°C for 3 hours. The solution in the flask was then heated to 90°C over 30 minutes and maintained at 90°C for 2 hours. After this, stirring was stopped and the solution was cooled to room temperature (25°C) to obtain solutions of binder polymers A1 to A9. The non-volatile content (solid content) of the solutions of binder polymers A1 to A9 was 49% by mass. The weight-average molecular weights (Mw) of binder polymers A1 to A9 are shown in Table 1.

[0095] The weight average molecular weight was measured by gel permeation chromatography (GPC) and calculated using a calibration curve of standard polystyrene. The GPC conditions are as follows: (GPC conditions) Pump: Hitachi L-6000 type (manufactured by Hitachi, Ltd., product name) Columns: 3 in total Gelpack GL-R420 Gelpack GL-R430 Gelpack GL-R440 (all product names, manufactured by Hitachi Chemical Co., Ltd.) Eluent: tetrahydrofuran Measurement temperature: 40℃ Flow rate: 2.05mL / min Detector: Hitachi L-3300 RI (Hitachi, Ltd., product name)

[0096] [Table 1]

[0097] [Examples 1 to 16 and Comparative Examples 1 to 10] <Preparation of Photosensitive Resin Composition> Photosensitive resin compositions were prepared by mixing the components shown in Tables 2 to 4 in the amounts (parts by mass) shown in the tables. The amounts (parts by mass) of component (A) shown in Tables 2 to 4 are the mass of nonvolatile matter (solid content). Details of each component shown in Tables 2 to 4 are as follows:

[0098] (B) Component FA-321M(70): 70% solution of 2,2-bis(4-(methacryloxyethoxy)phenyl)propane (average 10 mol ethylene oxide adduct) in propylene glycol monomethyl ether (Hitachi Chemical Co., Ltd.) FA-024M: (PO)(EO)(PO) modified dimethacrylate (manufactured by Hitachi Chemical Co., Ltd., an adduct of an average of 6 mol of ethylene oxide and an average of 12 mol of propylene oxide (total value)) BP-2EM: 2,2-bis(4-(methacryloxypolyethoxy)phenyl)propane (manufactured by Kyoeisha Chemical Co., Ltd., EO group: 5.2 (total value)) Trifunctional monomer 1: EO-modified trimethylolpropane trimethacrylate (EO groups: 21 (total)) Tetrafunctional monomer 1: EO-modified pentaerythritol tetramethacrylate (EO groups: 4 (total value)) Tetrafunctional monomer 2: EO-modified pentaerythritol tetramethacrylate (EO groups: 12 (total)) Tetrafunctional monomer 3: EO-modified ditrimethylolpropane tetramethacrylate (EO groups: 4 (total)) Tetrafunctional monomer 4: EO-modified ditrimethylolpropane tetramethacrylate (EO groups: 12 (total)) Hexafunctional monomer 1: EO-modified dipentaerythritol hexamethacrylate (EO groups: 6 (total)) Hexafunctional monomer 2: EO-modified dipentaerythritol hexamethacrylate (EO groups: 18 (total)) Hexafunctional monomer 3: EO-modified dipentaerythritol hexaacrylate (EO groups: 12 (total))

[0099] (C) Component BCIM: 2,2'-bis(o-chlorophenyl)-4,4',5,5'-tetraphenyl-1,2'-biimidazole (Hampford)

[0100] (D) Component DBA: 9,10-dibutoxyanthracene (Kawasaki Chemical Industries, Ltd.) DPA: 9,10-diphenylanthracene (Kawasaki Chemical Industries, Ltd.) (D)' component PZ-501D: 1-phenyl-3-(4-methoxystyryl)-5-(4-methoxyphenyl)pyrazoline (manufactured by Nippon Chemical Industry Co., Ltd.) (E) Component TBC: 4-t-butylcatechol (manufactured by DIC Corporation, product name "DIC-TBC")

[0101] (Other ingredients) LCV: Leuco Crystal Violet (Yamada Chemical Industry Co., Ltd.) MKG: Malachite Green (Osaka Organic Chemical Industry Co., Ltd.) SF-808H: A mixture of carboxybenzotriazole, 5-amino-1H-tetrazole, and methoxypropanol (manufactured by Sanwa Chemical Co., Ltd.) (solvent) TLS: Toluene MAL: Methanol ACS: Acetone

[0102] <Preparation of Photosensitive Element> A 16 μm thick polyethylene terephthalate film (manufactured by Teijin Limited, product name "HTF-01") was prepared as a support, and the photosensitive resin composition was applied to a uniform thickness on the support, followed by drying in a hot air convection dryer at 70°C and 110°C sequentially to form a photosensitive resin layer with a thickness of 25 μm after drying. A polyethylene film (manufactured by Tamapoly Corporation, product name "NF-15") was laminated onto this photosensitive resin layer as a protective layer to obtain a photosensitive element in which the support, photosensitive resin layer, and protective layer were laminated in that order.

[0103] <Preparation of laminate> A copper-clad laminate (substrate, manufactured by Hitachi Chemical Co., Ltd., product name "MCL-E-679"), a glass epoxy material with copper foil (thickness: 35 μm) laminated on both sides, was surface-treated using a surface roughening treatment solution "MEC Etch Bond CZ-8100" (manufactured by MEC Co., Ltd., product name). It was then washed with water, pickled, and washed again with water, and then dried under airflow. The surface-treated copper-clad laminate was heated to 80°C, and while the protective layer was peeled off, the above-mentioned photosensitive element was laminated onto each of the laminates so that the photosensitive resin layer was in contact with the copper surface. This resulted in a laminate in which the copper-clad laminate, photosensitive resin layer, and support were laminated in this order. The resulting laminate was used as a test piece in the tests described below. Lamination was performed using a heat roll at 110°C, with a pressure of 0.4 MPa and a roll speed of 1.5 m / min.

[0104] <Evaluation> (Measurement of minimum development time) The laminate was cut into 5 cm squares to obtain test pieces for measuring the minimum development time. After peeling the support from the test piece, the unexposed photosensitive resin layer was spray-developed at a pressure of 0.15 MPa using a 1% by mass aqueous solution of sodium carbonate at 30°C. The shortest time required for visually confirming that at least 1 mm of unexposed area had been removed was defined as the minimum development time. A full cone type nozzle was used. The distance between the test piece and the tip of the nozzle was 6 cm, and the nozzle was positioned so that the center of the test piece coincided with the center of the nozzle. The shorter the minimum development time (unit: seconds), the better the developability. The results are shown in Tables 2 to 4.

[0105] (Sensitivity evaluation) A Hitachi 41-step step tablet was placed on the support of the test piece, and the photosensitive resin layer was exposed through the support using a projection exposure machine (manufactured by Ushio Inc., product name UX-2240SM-XJ01) equipped with a high-pressure mercury lamp with a wavelength of 365 nm, at an exposure dose (amount of irradiation energy) such that the number of remaining steps on the Hitachi 41-step step tablet after development was 15. The exposure dose at this time (unit: mJ / cm 2 The light sensitivity was evaluated by the following formula: The lower the exposure amount, the higher the light sensitivity.

[0106] (Evaluation of Adhesion) Using a drawing pattern in which the line width (L) / space width (S) (hereinafter referred to as "L / S") was x / 3x (x = 1 to 20 (varying in 1 μm intervals)) (unit: μm), exposure (drawing) was performed on the photosensitive resin layer of the above laminate using a direct drawing exposure machine (manufactured by Via Mechanics Co., Ltd., product name DE-1UH) with a blue-violet laser diode with a wavelength of 405 nm as the light source, with an energy amount that would result in 17 remaining steps on a Hitachi 41-step step tablet.

[0107] After exposure, the support was peeled off from the laminate to expose the photosensitive resin layer, and the unexposed portions were removed by spraying a 1% by mass aqueous solution of sodium carbonate at 30°C for 60 seconds. After development, the space portions (unexposed portions) were removed without residue, and the line portions (exposed portions) were formed without meandering or chipping. Adhesion was evaluated based on the minimum line width in the resist pattern. The smaller this value, the better the adhesion. The results are shown in Tables 2 to 4. Adhesion of 7 μm or less was considered acceptable.

[0108] (resolution evaluation) Using a drawing pattern in which the line width (L) / space width (S) (hereinafter referred to as "L / S") was x / x (x = 1 to 20 (varying in 1 μm intervals)) (unit: μm), exposure (drawing) was performed on the photosensitive resin layer of the above laminate using a direct drawing exposure machine (manufactured by Via Mechanics Co., Ltd., product name DE-1UH) with a blue-violet laser diode with a wavelength of 405 nm as the light source, with an energy amount that would result in 17 remaining steps on a Hitachi 41-step step tablet.

[0109] After exposure, the support was peeled off from the laminate to expose the photosensitive resin layer, and the unexposed portions were removed by spraying a 1% by mass aqueous solution of sodium carbonate at 30°C for 60 seconds. After development, the space portions (unexposed portions) were removed without residue, and the line portions (exposed portions) were formed without meandering or chipping. Resolution was evaluated based on the minimum space width in the resist pattern. The smaller this value, the better the resolution. The results are shown in Tables 2 to 4. A resolution of 12 μm or less was considered acceptable.

[0110] (Evaluation of storage stability) The photosensitive element was stored at a temperature of 15°C or less for 30 days. After storage, the surface of the photosensitive resin layer (between the protective layer and the photosensitive resin layer) was visually observed from the polyethylene film side of the protective layer to check for the presence or absence of precipitates. Those for which no precipitates were observed were rated "A," and those for which precipitates were observed were rated "B." The results are shown in Tables 2 to 4. Those for which no precipitates were observed can be said to have excellent storage stability.

[0111] [Table 2]

[0112] [Table 3]

[0113] [Table 4] [Explanation of symbols]

[0114] 1...photosensitive element, 2...support, 3, 13...photosensitive resin layer, 4...protective layer, 11...insulating layer, 12...conductor layer, 14...mask, 15...actinic light, 16...resist pattern, 17...wiring layer, 18...wiring board.

Claims

1. The composition contains a binder polymer, a photopolymerizable compound, a photopolymerization initiator, and an anthracene-based sensitizer, The photosensitive resin composition comprises a polymer (a) in which the binder polymer has a hydroxyalkyl (meth)acrylate unit and a styrene or styrene derivative unit, and the content of the styrene or styrene derivative unit is 40 mass % or more.

2. 2. The photosensitive resin composition according to claim 1, wherein the photopolymerizable compound contains a polyfunctional monomer having two or more reactive groups that react with a radical and having a total of 2 to 40 oxyethylene groups and / or oxypropylene groups.

3. 3. The photosensitive resin composition according to claim 1, wherein the photopolymerizable compound comprises 2,2-bis(4-((meth)acryloxypolyethoxy)phenyl)propane having 10 or more oxyethylene groups.

4. The photosensitive resin composition according to any one of claims 1 to 3, wherein the photopolymerizable compound comprises 2,2-bis(4-((meth)acryloxypolyethoxy)phenyl)propane having less than 10 oxyethylene groups.

5. 3. The photosensitive resin composition according to claim 1, wherein the photopolymerizable compound comprises 2,2-bis(4-((meth)acryloxypolyethoxy)phenyl)propane having 10 or more oxyethylene groups and 2,2-bis(4-((meth)acryloxypolyethoxy)phenyl)propane having less than 10 oxyethylene groups.

6. The photosensitive resin composition according to any one of claims 1 to 5, wherein the polymer (a) has a weight average molecular weight of 30,000 to 40,000.

7. 7. The photosensitive resin composition according to claim 1, wherein the content of the anthracene-based sensitizer is 0.2 parts by mass or more and less than 0.8 parts by mass per 100 parts by mass of the total amount of the binder polymer and the photopolymerizable compound.

8. A photosensitive element comprising a support and a photosensitive resin layer formed on the support using the photosensitive resin composition according to any one of claims 1 to 7.

9. a step of providing a photosensitive resin layer on a substrate using the photosensitive resin composition according to any one of claims 1 to 7 or the photosensitive element according to claim 8; photocuring a portion of the photosensitive resin layer; removing uncured portions of the photosensitive resin layer to form a resist pattern; forming a wiring layer on a portion of the substrate where the resist pattern is not formed; A method for manufacturing a wiring board, comprising:

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