Inner layer board welding machine and method for manufacturing multilayer printed wiring board

Abstract

To provide an inner layer board welding machine capable of suppressing displacement between layers in an inner layer wiring board forming an inner layer of a multilayer printed wiring board.SOLUTION: An inner layer plate welding machine 1 includes a temporary fixing device 3 in which a prepreg and a wiring board are alternately laminated such that the wiring board is arranged on the pair of outermost layers, and that forms a temporary fixing portion in which the prepreg is melted on the inner layer wiring board 100 forming the inner layer of the multilayer printed wiring board, a clamper 30 that holds the temporary fixing portion from both sides in the thickness direction of the inner layer wiring board 100, and a cooling mechanism that cools the clamper.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to an inner layer board welding machine and a method for manufacturing a multilayer printed wiring board. [Background technology]

[0002] Multilayer printed wiring boards are formed by alternately laminating printed wiring boards and prepregs. Patent Document 1 discloses a method for manufacturing this type of multilayer printed wiring board. Patent Document 1 discloses a method for laying up a set of inner layer wiring boards by alternately placing a plurality of inner layer double-sided wiring boards and prepregs that form the inner layers of the multilayer printed wiring board, pressurizing and heating a portion of the laid-up set of inner layer wiring boards from both sides with a heater-heated welding head to melt-weld and temporarily fix the prepregs, and then heating and pressurizing the entire set of temporarily fixed inner layer wiring boards together to obtain a plurality of sets of thermoset multilayer wiring boards. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Laid-Open No. 2000-294936 Summary of the Invention [Problem to be solved by the invention]

[0004] However, in the prior art, when the inner layer wiring board is temporarily fixed, the molten parts are allowed to harden by natural cooling, which can result in insufficient temporary fixing. In this case, misalignment occurs between the layers of the inner layer wiring board during the temporary fixing process and the process of applying heat and pressure to the entire inner layer wiring board, and this misalignment can cause defects in the multilayer printed wiring board.

[0005] Therefore, the present invention provides an inner layer board welding machine and a method for manufacturing a multilayer printed wiring board that can suppress misalignment between layers in an inner layer wiring board that forms the inner layer of a multilayer printed wiring board. [Means for solving the problem]

[0006] The inner layer board welding machine of the present invention is an inner layer wiring board that forms the inner layer of a multilayer printed wiring board by alternately stacking prepregs and the wiring boards so that the wiring boards are arranged on a pair of outermost layers, and is equipped with a temporary fixing device that forms a temporary fixing portion made of melted prepregs on the inner layer wiring board, a clamper that presses the temporary fixing portion from both sides in the thickness direction of the inner layer wiring board, and a cooling mechanism that cools the clamper.

[0007] According to the present invention, the wiring board can be adhered to the prepreg at the temporary joint portion during the temperature drop process. When the wiring board is adhered to the prepreg, the inner wiring board can be held down by a clamper that is actively cooled by a cooling mechanism, so the temporary joint portion can be reliably lowered in temperature and hardened, and the prepreg and the wiring board can be welded to each other at the temporary joint portion. Therefore, the inner wiring board can be reliably temporarily fixed, and misalignment between the inner wiring board layers can be suppressed.

[0008] In the above-described inner layer board welding machine, the cooling mechanism may include a flow path provided in the clamper through which a coolant flows.

[0009] According to the present invention, the clamper can be heated by heat exchange with the temporary fastening portion when pressing the inner wiring board, but the clamper can be reliably cooled by heat exchange between the clamper and the refrigerant, thereby achieving the above-mentioned effects.

[0010] In the above-described inner layer board welding machine, the cooling mechanism may include a heat dissipation fin provided on the clamper.

[0011] According to the present invention, when the clamper presses down on the inner wiring board, the temperature of the clamper can rise due to heat exchange with the temporary fastening portion, but the heat held by the clamper can be released into the surrounding air through the heat dissipation fins, thereby ensuring that the clamper is cooled. Therefore, the above-mentioned operational effects can be achieved.

[0012] In the above-described inner layer board welding machine, the cooling mechanism may blow gas onto the clamper.

[0013] According to the present invention, the clamper can be heated by heat exchange with the temporary fastening portion when pressing the inner wiring board, but the clamper can be reliably cooled by heat exchange with the gas blown onto the clamper, thereby achieving the above-mentioned effects.

[0014] In the above-described inner layer board welding machine, the clamper may press down the entire temporary fastening portion.

[0015] According to the present invention, the wiring board can be tightly attached to the prepreg over the entire temporary fixing portion, thereby reliably forming a welded portion where the prepreg and the wiring board are welded to each other.

[0016] In the above-described inner layer board welding machine, the clamper may hold down the temporary fastening portion until the temperature drops below a predetermined temperature.

[0017] According to the present invention, loosening of the adhesion between the prepreg and the wiring board before the temporary fixing portion hardens can be prevented, and therefore the prepreg and the wiring board can be reliably welded to each other at the temporary fixing portion.

[0018] In the above-described inner layer board welding machine, the predetermined temperature may be a glass transition temperature of a thermosetting resin that forms the prepreg.

[0019] According to the present invention, since the temperature drop of the temporary joint can be monitored, the temporary joint can be reliably cured in a state in which the prepreg and the wiring board are in close contact with each other, thereby reliably welding the prepreg and the wiring board to each other at the temporary joint.

[0020] The method for manufacturing a multilayer printed wiring board of the present invention includes a temporary fixing step in which prepregs and wiring boards are alternately stacked so that wiring boards are arranged on a pair of outermost layers, and a temporary fixing portion made of melted prepregs is formed on an inner layer wiring board that forms the inner layer of the multilayer printed wiring board; a pressing step in which the temporary fixing portion is pressed from both sides in the thickness direction of the inner layer wiring board with a clamper; and a cooling step in which the clamper is cooled.

[0021] According to the present invention, the wiring board can be tightly attached to the prepreg at the temporary fastening portion in the holding step. When the wiring board is tightly attached to the prepreg, the inner wiring board can be held down by a clamper that has been actively cooled in the cooling step, so the temporary fastening portion can be reliably cooled and hardened, and the prepreg and the wiring board can be welded to each other at the temporary fastening portion. Therefore, the inner wiring board can be reliably temporarily fastened, and misalignment between the inner wiring board layers can be suppressed. [Effects of the Invention]

[0022] According to the present invention, misalignment between layers can be suppressed in an inner layer wiring board that forms an inner layer of a multilayer printed wiring board. [Brief explanation of the drawings]

[0023] [Figure 1] FIG. 2 is a perspective view showing an inner layer board welding machine according to an embodiment. [Figure 2] FIG. 2 is a perspective view showing a substrate setting unit according to the embodiment. [Figure 3] FIG. 2 is a plan view showing a substrate setting section of the embodiment. [Figure 4] FIG. 2 is a perspective view showing a clamper and a cooling mechanism according to the first embodiment. [Figure 5] 5A to 5C are diagrams illustrating a pressing step in the method for manufacturing a multilayer printed wiring board according to the first embodiment. [Figure 6] 5A to 5C are diagrams illustrating a pressing step in the method for manufacturing a multilayer printed wiring board according to the first embodiment. [Figure 7] 5A to 5C are diagrams illustrating a pressing step in the method for manufacturing a multilayer printed wiring board according to the first embodiment. [Figure 8] 5A to 5C are diagrams illustrating a pressing step in the method for manufacturing a multilayer printed wiring board according to the first embodiment. [Figure 9] 10 is a plan view showing the positional relationship between the temporary fastening portion and the lower and upper contact surfaces. FIG. [Figure 10] FIG. 10 is a perspective view showing a clamper and a cooling mechanism of a second embodiment. [Figure 11] FIG. 10 is a perspective view showing a clamper and a cooling mechanism according to a third embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0024] Hereinafter, an embodiment of the present invention will be described with reference to the drawings. In the following description, components having the same or similar functions will be denoted by the same reference numerals. Duplicate descriptions of those components may be omitted.

[0025] (Overall configuration of the inner layer board welding machine of the embodiment) The inner layer board welding machine 1 of the embodiment is a device that performs part of the process of forming an inner layer wiring board 100 that forms the inner layer of a multilayer printed wiring board. The inner layer wiring board 100 formed by the inner layer board welding machine 1 is formed by alternately stacking prepregs and double-sided wiring boards, with double-sided wiring boards arranged on a pair of outermost layers (front and back). The inner layer wiring board 100 of the present embodiment is formed in a rectangular shape in a plan view. Note that the prepreg is a component formed by impregnating a glass fiber sheet with a thermosetting resin such as epoxy resin and curing it to a semi-cured state. The double-sided wiring board is a component formed by forming printed wiring on both sides of the thermoset prepreg. For example, the inner layer wiring board 100 is formed by stacking two double-sided wiring boards so that one layer of prepreg is sandwiched between them. A plurality of inner layer wiring boards 100 are stacked with separately prepared prepregs interposed therebetween, and then pressurized and heated by another device to form a multilayer printed wiring board.

[0026] FIG. 1 is a perspective view showing an inner layer board welding machine according to an embodiment. As shown in Figure 1, the inner layer board welding machine 1 includes a substrate setting unit 2, a temporary fastening device 3, a housing 4 that houses or supports the substrate setting unit 2 and the temporary fastening device 3, and a pallet 5 that transports inner layer wiring boards 100 between the substrate setting unit 2 and the temporary fastening device 3. In this embodiment, the direction along the longitudinal direction when the housing 4 placed on a horizontal surface is viewed from above is defined as the front-to-rear direction, and the direction along the lateral direction when the housing 4 is viewed from above is defined as the left-to-right direction. In Figure 1, the direction indicated by the arrow LH is defined as the left, and the direction indicated by the arrow FR is defined as the forward direction.

[0027] The substrate setting unit 2 is where a user, a transport device, or the like sets an inner layer wiring board 100 in the inner layer board welding machine 1 and removes the inner layer wiring board 100. The substrate setting unit 2 is supported by the housing 4 so as to be exposed upward in the front half of the inner layer board welding machine 1. The temporary fixing device 3 is housed within the housing 4 in the rear half of the inner layer board welding machine 1. The inner layer wiring board 100 is placed on the pallet 5. The pallet 5 transports the inner layer wiring board 100 before and after temporary fixing (described later) in both directions between the substrate setting unit 2 and the temporary fixing device 3. Specifically, the pallet 5 moves the inner layer wiring board 100 before temporary fixing rearward from the substrate setting unit 2 and transports it to the temporary fixing device 3, and moves the inner layer wiring board 100 that has been temporarily fixed by the temporary fixing device 3 forward from the temporary fixing device 3 and transports it to the substrate setting unit 2.

[0028] The temporary joining device 3 temporarily joins an inner layer wiring board 100 in which prepregs and double-sided wiring boards are alternately stacked in a predetermined order. The temporary joining device 3 has a welding head (not shown), and uses the heated welding head to clamp the outer periphery of the inner layer wiring board 100, thereby heating and melting the prepregs. In this way, the temporary joining device 3 melts the prepregs on the inner layer wiring board 100, forming temporary joining portions 101 in which the prepregs and the double-sided wiring boards are temporarily joined together. For example, the welding head has a rectangular tip surface that presses against the outermost layer of the inner layer wiring board 100, forming temporary joining portions 101 that are rectangular in plan view. In this embodiment, three temporary joining devices 3 are formed at intervals in the front-to-rear direction on each of a pair of peripheral portions of the inner layer wiring board 100 along a pair of sides extending in the front-to-rear direction in plan view.

[0029] Fig. 2 is a perspective view showing a substrate setting unit of the embodiment, and Fig. 3 is a plan view showing the substrate setting unit of the embodiment. As shown in Figures 2 and 3, the substrate setting unit 2 includes a base 6 fixedly mounted to the housing 4, a stage 7 supporting the above-mentioned pallet 5 above the base 6, a positioning mechanism 10 for positioning the above-mentioned inner layer wiring board 100, a clamper 30 for pressing the above-mentioned temporary fastening portion 101, and a clamper drive unit 50 for displacing the clamper 30 horizontally.

[0030] Positioning mechanism 10 positions inner layer wiring board 100 placed on pallet 5 supported by stage 7. Positioning mechanism 10 is installed on base 6. Positioning mechanism 10 includes first positioning mechanism 10A that positions inner layer wiring board 100 in the left-right direction, and second positioning mechanism 10B that positions inner layer wiring board 100 in the front-rear direction.

[0031] First positioning mechanism 10A includes first pin 11A that contacts inner wiring board 100, first drive unit 12A that drives first pin 11A in the left-right direction, and first pin lifting unit 17A that drives first pin 11A in the up-down direction. In this embodiment, a pair of first pins 11A and a pair of first pin lifting units 17A are provided.

[0032] The first drive unit 12A includes a pair of pulleys 13A spaced apart in the left-right direction, an endless belt 14A stretched across the pair of pulleys 13A, a motor 15A that drives and rotates one of the pulleys 13A, and a support member 16A fixed to the endless belt 14A and supporting a pair of first pin lifting units 17A.

[0033] The pair of first pin lifting units 17A are moved together in the left-right direction by the first driving unit 12A. The first pin lifting units 17A are linear actuators. In this embodiment, the first pin lifting units 17A are air cylinders. Each first pin lifting unit 17A includes a cylinder body 18 fixed to the support member 16A and a stage 19 that supports the first pin 11A from below and moves up and down relative to the cylinder body 18.

[0034] A pair of first pins 11A are fixed one by one to the stage 19 of the first pin lifting unit 17A. Each first pin 11A protrudes upward from the stage 19 of the first pin lifting unit 17A. Each first pin 11A is formed in a cylindrical shape. Each first pin 11A moves up and down by the operation of the first pin lifting unit 17A. Each first pin 11A moves in accordance with the up and down movement of the stage 19 between an elevated position where its upper end is above the pallet 5 and a lowered position where its upper end is below the top surface of the pallet 5. The pair of first pins 11A are positioned to the right of the center of the pallet 5 in the left-right direction in a plan view and can contact the inner layer wiring board 100 on the pallet 5 from the right. The pair of first pins 11A are positioned at the same position in the left-right direction and overlap each other when viewed from the front-to-back direction.

[0035] Second positioning mechanism 10B includes second pins 11B that contact inner wiring board 100, second drive unit 12B that drives second pins 11B in the front-to-rear direction, and second pin lifting unit 17B that drives second pins 11B in the up-and-down direction. In this embodiment, a pair of second pins 11B and a pair of second pin lifting units 17B are provided.

[0036] The second drive unit 12B includes a pair of pulleys 13B spaced apart in the left-right direction, an endless belt 14B stretched across the pair of pulleys 13B, a motor 15B that drives and rotates one of the pulleys 13B, and a support member 16B fixed to the endless belt 14B and supporting a pair of second pin lifting units 17B.

[0037] The pair of second pin lifting units 17B are moved together in the front-to-rear direction by second drive unit 12B. Second pin lifting unit 17B is configured similarly to first pin lifting unit 17A, and includes a cylinder body 18 fixed to support member 16B, and a stage 19 that supports second pin 11B from below and moves up and down relative to cylinder body 18.

[0038] The pair of second pins 11B are fixed one by one to the stage 19 of the second pin lifting unit 17B. Each second pin 11B protrudes upward from the stage 19 of the second pin lifting unit 17B. Each second pin 11B is formed in a cylindrical shape. Each second pin 11B moves up and down by the operation of the second pin lifting unit 17B. Each second pin 11B moves in accordance with the up and down movement of the stage 19 between an elevated position where its upper end is above the pallet 5 and a lowered position where its upper end is below the top surface of the pallet 5. The pair of second pins 11B are positioned forward of the center between the front and rear of the pallet 5 in a plan view and are capable of contacting the inner layer wiring board 100 on the pallet 5 from the front. The pair of second pins 11B are positioned at the same position in the front-to-rear direction and overlap each other when viewed left and right.

[0039] The clampers 30 are supported on the base 6 via a clamper drive unit 50, which will be described later. The clampers 30 clamp the temporarily fastened inner wiring board 100. The clampers 30 are provided separately from the welding head of the temporary fastening device 3. The clampers 30 grip the temporary fastening portions 101 (see FIG. 9 ) of the inner wiring board 100 placed on the pallet 5. In this embodiment, six clampers 30 are provided, corresponding to the number of temporary fastening portions 101. The clampers 30 individually grip the multiple temporary fastening portions 101. Three clampers 30 grip the three temporary fastening portions 101 formed on the right peripheral edge of the inner wiring board 100, and three clampers 30 grip the three temporary fastening portions 101 formed on the left peripheral edge of the inner wiring board 100. Note that the configuration of each clamper 30 is the same, and therefore, unless otherwise specified, the clampers 30 will not be distinguished from one another in the following description.

[0040] FIG. 4 is a perspective view showing a clamper and a cooling mechanism, which will be described later, according to the first embodiment. As shown in FIG. 4, the clamper 30 includes a lower clamping body 31 and an upper clamping body 33 that contact the inner layer wiring board 100, and a pair of lifting units 37A, 37B that drive the lower clamping body 31 and the upper clamping body 33 vertically, respectively.

[0041] The lifting units 37A and 37B are linear actuators. In this embodiment, the lifting units 37A and 37B are air cylinders. Each of the lifting units 37A and 37B includes a cylinder body 38 and a stage 39 that moves up and down relative to the cylinder body 38. The lifting units 37A and 37B are arranged side by side in the left-right direction. The pair of lifting units 37A and 37B includes an inner lifting unit 37A arranged on the inside in the left-right direction and an outer lifting unit 37B arranged on the outside in the left-right direction. The stage 39 of the inner lifting unit 37A supports the lower clamping body 31 from below. The stage 39 of the outer lifting unit 37B supports the upper clamping body 33 from below. The inner lifting units 37A of the front two of the three right clampers 30 are adjacent to the first pin lifting units 17A of the first positioning mechanism 10A from the outside in the left-right direction.

[0042] The lower clamping body 31 is fixed to the stage 39 of the inner lifting section 37A. The lower clamping body 31 is made of a metal material such as stainless steel or brass. The lower clamping body 31 protrudes upward from the stage 39 of the inner lifting section 37A. The lower clamping body 31 contacts the inner layer wiring board 100 from below. The lower clamping body 31 has a lower contact surface 31a that comes into surface contact with the underside of the inner layer wiring board 100. The lower contact surface 31a is a flat surface that extends horizontally. The lower contact surface 31a is formed in a rectangular shape with the longitudinal direction extending in the front-to-rear direction.

[0043] The upper clamping body 33 is fixed to the stage 39 of the outer lifting section 37B. The upper clamping body 33 is formed from a metal material such as stainless steel or brass. The upper clamping body 33 has a base 34 that protrudes upward from the stage 39 of the outer lifting section 37B, and a visor portion 35 that protrudes inward in the left-right direction from the upper end of the base 34. The visor portion 35 overlaps the lower clamping body 31 in a plan view. The visor portion 35 contacts the inner layer wiring board 100 from above. The visor portion 35 has an upper contact surface 33a that comes into surface contact with the upper surface of the inner layer wiring board 100. The upper contact surface 33a is a flat surface that extends horizontally.

[0044] The lower contact surface 31a of the lower clamping body 31 is formed in a rectangular shape with its longitudinal direction extending in the front-to-rear direction. The upper contact surface 33a of the upper clamping body 33 is a downward-facing surface of the eaves portion 35 that is located opposite the lower contact surface 31a of the lower clamping body 31 and coincides with the lower contact surface 31a in a planar view. As a result, the upper contact surface 33a has the same shape and size as the lower contact surface 31a in a planar view and is formed in a rectangular shape with its longitudinal direction extending in the front-to-rear direction. In other words, the lower contact surface 31a is defined as the portion of the contact area between the lower clamping body 31 and the inner layer wiring board 100 that coincides with the contact area between the upper clamping body 33 and the inner layer wiring board 100 in a planar view when the clamper 30 clamps the inner layer wiring board 100. Furthermore, upper contact surface 33a is defined as the portion of the contact area between upper clamping body 33 and inner wiring board 100 that coincides in plan view with the contact area between lower clamping body 31 and inner wiring board 100 when clamper 30 clamps inner wiring board 100. Lower contact surface 31a and upper contact surface 33a are formed larger than temporary fastening portion 101 in plan view.

[0045] As shown in FIGS. 2 and 3 , the clamper drive unit 50 drives the clampers 30 in the left-right direction relative to the base 6. The clamper drive unit 50 supports the cylinder bodies 38 of the lifting units 37A and 37B. The clamper drive unit 50 is provided so as to be shared by the three right-side clampers 30. The clamper drive unit 50 is provided so as to be shared by the three left-side clampers 30. In this embodiment, the clamper drive unit 50 is shared by all the clampers 30 and is also shared with the first drive unit 12A of the positioning mechanism 10. The clamper drive unit 50 includes a pair of pulleys 13A spaced apart in the left-right direction, an endless belt 14A wound around the pair of pulleys 13A, a motor 15A that rotates and drives one of the pulleys 13A, a support member 51 fixed to the endless belt 14A and supporting the three right-side clampers 30, and a support member 52 fixed to the endless belt 14A and supporting the three left-side clampers 30. The support member 51 is also used as the support member 16A of the first drive unit 12A. The support members 51 and 52 are fixed to positions on the endless belt 14A that move in opposite directions in the left-right direction. This allows the three clampers 30 on the right side and the three clampers 30 on the left side to move in opposite directions in the left-right direction when the endless belt 14A is rotated.

[0046] (Cooling mechanism of the first embodiment) As shown in FIG. 4 , the inner layer board welding machine 1 of the first embodiment further includes a cooling mechanism 60 for cooling the clampers 30. The cooling mechanism 60 cools at least one of the lower clamping body 31 and the upper clamping body 33 of each clamper 30. The cooling mechanism 60 of this embodiment uses a refrigerant. The cooling mechanism 60 includes flow paths 61 formed in the lower clamping body 31 and the upper clamping body 33 and through which the refrigerant flows. A supply pipe 62 through which the refrigerant flows toward the flow path 61 is connected to one end of the flow path 61. A discharge pipe 63 through which the refrigerant discharged from the flow path 61 flows is connected to the other end of the flow path 61. The supply pipe 62 and the discharge pipe 63 are connected to a pump, a heat exchanger, or the like (not shown) on the opposite side of the flow path 61. Note that, although the flow paths 61 are formed in both the lower clamping body 31 and the upper clamping body 33 in this embodiment, a flow path 61 may be formed in only one of the lower clamping body 31 and the upper clamping body 33.

[0047] (Manufacturing method using the inner layer board welding machine of the first embodiment) A description will be given of a method for manufacturing a multilayer printed wiring board using the inner layer board welding machine 1 of the first embodiment. The inner layer board welding machine 1 of this embodiment performs the following steps in the manufacturing process of a multilayer printed wiring board: a temporary fixing step of forming temporary fixing portions 101 on an inner layer wiring board 100, a pressing step of pressing the temporary fixing portions 101, and a cooling step of cooling a clamper 30.

[0048] First, prior to the execution of the temporary fixing step, the double-sided wiring boards and prepregs that form inner layer wiring board 100 are placed on pallet 5 in substrate setting section 2. At this time, the prepregs and double-sided wiring boards are alternately stacked so that the double-sided wiring boards are arranged as the pair of outermost layers. The double-sided wiring boards and prepregs placed on pallet 5 are transported together with pallet 5 from substrate setting section 2 to temporary fixing device 3.

[0049] Next, a temporary fixing process is performed. In this process, the double-sided wiring board and prepreg transported to the temporary fixing device 3 are sandwiched between heated welding heads, and the prepreg is heated and melted. This results in an inner layer wiring board 100 having a temporary fixing portion 101 where the prepreg is melted. The melted prepreg generates a bonding force between the prepreg and the double-sided wiring board at the temporary fixing portion 101, temporarily fixing the prepreg and the double-sided wiring board together. The temporarily fixed inner layer wiring board 100 is transported together with the pallet 5 from the temporary fixing device 3 to the board setting unit 2.

[0050] Next, a pressing step is performed. In the pressing step, inner layer wiring board 100 transported to board setting section 2 is pressed down from both sides in the thickness direction of inner layer wiring board 100 by clamper 30. Specifically, the following operations are performed.

[0051] 5 to 8 are diagrams illustrating the pressing step in the method for manufacturing a multilayer printed wiring board according to the first embodiment. 5, when the temporarily fixed inner layer wiring board 100 is transported to the board setting unit 2, the first driving unit 12A displaces the pair of first pins 11A, which are in the raised position, leftward toward the desired position in the left-right direction. Furthermore, although not shown, the second driving unit 12B displaces the pair of second pins 11B, which are in the raised position, rearward toward the desired position in the front-to-rear direction. During this process, the pair of first pins 11A contact the right edge of the inner layer wiring board 100 to position the inner layer wiring board 100 in the left-to-right direction, and the pair of second pins 11B contact the front edge of the inner layer wiring board 100 to position the inner layer wiring board 100 in the front-to-rear direction.

[0052] 6, first pin 11A and second pin 11B are lowered to the lowered position. Also, outer lifting unit 37B lifts upper clamp 33 so that upper contact surface 33a of upper clamp 33 is positioned above inner wiring board 100.

[0053] 7, clamper 30 is displaced inward in the left-right direction by clamper driving unit 50 so that lower contact surface 31a of lower clamping body 31 and upper contact surface 33a of upper clamping body 33 overlap temporary fastening portion 101 of inner layer wiring board 100 in a plan view. Also, lower clamping body 31 is raised by inner lifting unit 37A so that lower contact surface 31a comes into contact with the underside of inner layer wiring board 100.

[0054] Next, as shown in FIG. 8 , outer lifting / lowering unit 37B lowers upper clamping body 33 so that upper contact surface 33a contacts the top surface of inner wiring board 100. As a result, each temporary fastening portion 101 is pressed down from above and below by lower clamping body 31 and upper clamping body 33 while its temperature is being lowered. The order of operation of inner lifting / lowering unit 37A and outer lifting / lowering unit 37B is not particularly limited. That is, outer lifting / lowering unit 37B may lower upper clamping body 33 before inner lifting / lowering unit 37A lifts lower clamping body 31. Furthermore, outer lifting / lowering unit 37B may lower upper clamping body 33 simultaneously with inner lifting / lowering unit 37A lifting lower clamping body 31.

[0055] FIG. 9 is a plan view showing the positional relationship between the temporary fixing portion and the lower and upper contact surfaces. 9, clamper 30 clamps inner wiring board 100 so that temporary fixing portion 101 entirely overlaps lower contact surface 31a and upper contact surface 33a in a plan view. At this time, as shown in the figure, it is desirable that temporary fixing portion 101 entirely be located inside the outline of lower contact surface 31a and upper contact surface 33a.

[0056] The clamper 30 holds the temporarily fastened portion 101 until the temperature of the temporarily fastened portion 101 drops below a predetermined temperature. For example, the predetermined temperature is the glass transition temperature of the thermosetting resin forming the prepreg. The temperature of the temporarily fastened portion 101 may be monitored using a contact or non-contact thermometer. For example, the temperature of the temporarily fastened portion 101 may be monitored indirectly by detecting the temperature of the clamper 30. Alternatively, the temperature of the temporarily fastened portion 101 may be considered to have dropped below the predetermined temperature when the clamper 30 holds the temporarily fastened portion 101 for a predetermined period of time. After that, when the clamper 30 completes clamping the temporarily fastened portion 101 between the lower clamping body 31 and the upper clamping body 33, the inner lifting / lowering unit 37A lowers the lower clamping body 31 and the outer lifting / lowering unit 37B raises the upper clamping body 33, completing clamping of the temporarily fastened portion 101. The clamper driver 50 then displaces the clamper 30 outward in the left-right direction. This makes it possible to remove inner wiring board 100 from pallet 5.

[0057] Next, a cooling step is performed. In the cooling step, the lower clamp 31 and the upper clamp 33 are cooled by the cooling mechanism 60. Specifically, in the cooling step, a refrigerant is circulated through the flow paths 61 formed in the lower clamp 31 and the upper clamp 33 to promote heat exchange between the refrigerant and the lower clamp 31 and the upper clamp 33, thereby cooling the lower clamp 31 and the upper clamp 33. In the cooling step, the lower clamp 31 and the upper clamp 33, which have been heated by heat exchange with the temporary fastening portions 101 in the pressing step, are cooled before the pressing step is performed on the next inner layer wiring board 100. In other words, when the clamper 30 sequentially performs the pressing steps on multiple inner layer wiring boards 100, performing the cooling step before the pressing step and performing the cooling step after the pressing step are synonymous. Note that the cooling step may be performed simultaneously with the pressing step.

[0058] As described above, the inner layer board welding machine 1 of this embodiment includes a clamper 30 that presses down the temporary fastening portion 101 of the inner layer wiring board 100 formed by the temporary fastening device 3 in the temporary fastening step from both sides in the thickness direction in the pressing step. This configuration allows the double-sided wiring board to be adhered to the prepreg at the temporary fastening portion 101, which is cooling down in the pressing step. Furthermore, the inner layer board welding machine 1 of this embodiment includes a cooling mechanism 60 that cools the clamper 30 in the cooling step. Therefore, when adhering the double-sided wiring board to the prepreg, the inner layer wiring board 100 can be pressed down by the clamper 30 actively cooled by the cooling mechanism 60. This reliably cools and hardens the temporary fastening portion 101, allowing the prepreg and the wiring board to be welded to each other at the temporary fastening portion 101. Therefore, the inner layer wiring board 100 can be reliably temporarily fastened, preventing misalignment between the layers of the inner layer wiring board 100.

[0059] Furthermore, the cooling mechanism 60 is provided with a flow path 61 provided in the clamper 30 through which a refrigerant flows. With this configuration, the temperature of the clamper 30 can rise due to heat exchange with the temporary fastening portion 101 when the clamper 30 holds down the inner wiring board 100, and the clamper 30 can be reliably cooled by heat exchange between the clamper 30 and the refrigerant. Therefore, the above-mentioned operational effects can be achieved.

[0060] Furthermore, the clamper 30 presses the entire temporary fixing portion 101. With this configuration, the double-sided wiring board can be tightly attached to the prepreg by the entire temporary fixing portion 101. This makes it possible to reliably form a temporary fixing welded portion where the prepreg and the double-sided wiring board are welded to each other.

[0061] Furthermore, the clamper 30 holds the temporary fixing portion 101 down until the temperature drops below a predetermined temperature. This configuration prevents the prepreg and the double-sided wiring board from loosening their adhesion before the temporary fixing portion 101 hardens. Therefore, the prepreg and the double-sided wiring board can be reliably welded to each other at the temporary fixing portion 101.

[0062] (Cooling mechanism of the second embodiment) The cooling mechanism of the second embodiment will be described. FIG. 10 is a perspective view showing a clamper and a cooling mechanism of the second embodiment. 10, the inner layer board welding machine 1 of the second embodiment differs from the first embodiment in that it includes a cooling mechanism 160 for cooling the clamper 30 instead of the cooling mechanism 60 of the first embodiment. Note that the configuration other than that described below is the same as that of the first embodiment.

[0063] The cooling mechanism 160 cools the upper clamping body 33 of each clamper 30. The cooling mechanism 160 is a heat dissipation fin 164 provided on the upper clamping body 33. The heat dissipation fin 164 stands upright on the top surface of the upper clamping body 33. The heat dissipation fin may be provided on the lower clamping body 31, or on both the lower clamping body 31 and the upper clamping body 33.

[0064] According to this embodiment, when clamper 30 presses inner wiring board 100, the temperature of clamper 30 can rise due to heat exchange with temporary fastening portion 101, but the heat of clamper 30 can be released into the surrounding air through heat dissipation fins 164, thereby reliably cooling clamper 30. Therefore, the above-mentioned operational effects can be achieved.

[0065] (Cooling mechanism of the third embodiment) The cooling mechanism of the third embodiment will be described. FIG. 11 is a perspective view showing a clamper and a cooling mechanism of the third embodiment. 11, the inner layer board welding machine 1 of the third embodiment differs from the first embodiment in that it includes a cooling mechanism 260 for cooling the clamper 30 instead of the cooling mechanism 60 of the first embodiment. Note that the configuration other than that described below is the same as that of the first embodiment.

[0066] The cooling mechanism 260 cools at least one of the lower clamping body 31 and the upper clamping body 33 of each clamper 30. The cooling mechanism 260 is a nozzle 265 that blows gas onto the clamper 30. For example, the nozzle 265 blows compressed air onto the lower clamping body 31 and the upper clamping body 33.

[0067] According to this embodiment, when clamper 30 holds inner wiring board 100, the temperature can be increased by heat exchange with temporary fastening portion 101, and clamper 30 can be reliably cooled by heat exchange between clamper 30 and the gas blown onto clamper 30. Therefore, the above-mentioned operational effects can be achieved.

[0068] The present invention is not limited to the above-described embodiment explained with reference to the drawings, and various modifications are possible within the technical scope of the present invention. For example, in the above embodiment, the clamper 30 is provided in the substrate setting unit 2, but this configuration is not limiting. For example, the clamper may be disposed between the substrate setting unit and the temporary fixing unit. That is, the clamper may be provided separately from the welding head of the temporary fixing unit and configured to hold down the temporary fixing unit before the inner layer wiring board is removed from the inner layer board welding device. Alternatively, the clamper may be installed in the temporary fixing device 3. That is, the clamper may be configured to hold down the temporary fixing unit after the substrate has been temporarily fixed.

[0069] In the above embodiment, six clampers 30 are provided, but the present invention is not limited to this configuration. The clampers only need to be arranged so as to press down on at least one of the temporary fastening portions formed by the temporary fastening device 3, and it is desirable that the clampers be provided in the same number as the number of temporary fastening portions.

[0070] In the above embodiment, the clampers 30 are simultaneously driven in the left-right direction by a single clamper driver 50, but this configuration is not limiting. That is, multiple clamper drivers may be provided to drive only some of the clampers 30 in the left-right direction. The clamper drivers may also be provided separately from the driver of the positioning mechanism. Furthermore, if the temporary fastening portion changes in the front-rear direction, the clampers may be moved in the front-rear direction in accordance with this position.

[0071] In the above embodiment, the clamper 30 clamps the entire temporary fixing portion 101 in a plan view, but the present invention is not limited to this configuration. The clamper 30 may clamp the inner wiring board 100 so that a portion of the temporary fixing portion 101 overlaps the lower contact surface 31 a and the upper contact surface 33 a in a plan view.

[0072] In addition, the components in the above-described embodiments may be replaced with known components as appropriate within the scope of the present invention, and the above-described embodiments and modifications may be combined as appropriate. For example, two or more cooling mechanisms 60, 160, and 260 may be combined. [Explanation of symbols]

[0073] REFERENCE SIGNS LIST 1...inner layer board welding machine 3...temporary fixing device 30...clamper 60, 160, 260...cooling mechanism 61...flow path 100...inner layer wiring board 101...temporary fixing portion 164...heat dissipation fin

Claims

1. a temporary fixing device that alternately stacks prepregs and wiring boards so that wiring boards are disposed on a pair of outermost layers, and forms temporary fixing portions in which the prepregs are melted on inner layer wiring boards that form inner layers of a multilayer printed wiring board; a positioning mechanism that positions the inner layer wiring board transported in a horizontal first direction from the temporary fixing device; a clamper that presses the temporary fixing portion from both sides in the thickness direction of the inner layer wiring board; a cooling mechanism for cooling the clamper; a clamper driving unit that drives all of the clampers in a horizontal second direction perpendicular to the first direction; Equipped with The positioning mechanism includes: a pin that contacts the inner wiring board and positions the inner wiring board in the second direction; a pin driving unit that drives all of the pins in the second direction; and The pin driving unit and the clamper driving unit are shared. Inner layer board welding machine.

2. the cooling mechanism includes a flow path provided in the clamper through which a coolant flows. The inner layer board welding machine according to claim 1.

3. the cooling mechanism includes heat dissipation fins provided on the clamper. The inner layer board welding machine according to claim 1 or 2.

4. The cooling mechanism blows gas onto the clamper. The inner layer board welding machine according to any one of claims 1 to 3.

5. The clamper presses the entire temporary fixing portion. The inner layer board welding machine according to any one of claims 1 to 4.

6. The clamper holds the temporary fixing portion down until the temperature of the temporary fixing portion reaches or falls below a predetermined temperature. The inner layer board welding machine according to any one of claims 1 to 5.

7. the predetermined temperature is the glass transition temperature of the thermosetting resin forming the prepreg; The inner layer board welding machine according to claim 6.

8. a temporary fixing step in which prepregs and wiring boards are alternately laminated so that wiring boards are disposed on a pair of outermost layers, and temporary fixing portions in which the prepregs are melted are formed on inner layer wiring boards that form inner layers of the multilayer printed wiring board; a conveying step of conveying the inner layer wiring board on which the temporary fastening portion has been formed in a horizontal first direction; a pressing step of pressing the temporary fixing portion from both sides in the thickness direction of the inner layer wiring board by a clamper; a cooling step of cooling the clamper; Equipped with a pin driving unit that drives all of the pins that contact the inner wiring board and position the inner wiring board in a second direction perpendicular to the first direction, in the second direction, and a clamper driving unit that drives all of the clampers in the second direction are shared; A method for manufacturing a multilayer printed wiring board.

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