Chip holder, chip holding device, and semiconductor device manufacturing device

Abstract

To provide a chip holder capable of appropriately positioning a semiconductor chip without touching the semiconductor chip.SOLUTION: A chip holder 12 comprises: a holding surface 24 on which a semiconductor chip 100 is held with no contact; a suction passage 33 sucking the semiconductor chip 100 by applying a negative pressure to the holding surface 24; and an ultrasonic wave generator 14 for applying ultrasonic vibration to the holding surface 24. A contour size of the holding surface 24 is larger than a contour size of the semiconductor chip 100. A positioning groove 36 in a shape along with at least a portion of a contour of the semiconductor chip 100 is formed on the holding surface 24.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] This specification discloses a technique for holding a semiconductor chip in a non-contact manner using ultrasonic waves. [Background technology]

[0002] In recent years, in order to realize further miniaturization and higher density of semiconductor devices, there has been a demand for chip holders that hold semiconductor chips in a non-contact manner. To meet this demand, some chip holders that hold semiconductor chips in a non-contact manner have been proposed.

[0003] A known example of such a chip holder is one that uses a Bernoulli chuck. However, a Bernoulli chuck cannot restrict the movement of the semiconductor chip held in a non-contact manner in the plane direction. Therefore, chip holders that use a Bernoulli chuck often have a guide member on the chip holding surface that restricts the movement of the chip in the plane direction.

[0004] However, when a guide member is provided, there is a risk that the edge of the semiconductor chip may come into contact with the guide member, resulting in chipping of the semiconductor chip. [Prior art documents] [Patent documents]

[0005] [Patent Document 1] Japanese Patent Application Laid-Open No. 2006-73654 Summary of the Invention [Problem to be solved by the invention]

[0006] Therefore, some have proposed a technology that uses ultrasonic waves to hold workpieces such as IC chips without contact (for example, Patent Document 1). The ultrasonic squeeze effect caused by applying ultrasonic waves also generates a force that holds the workpiece in the plane direction, making it possible to omit a guide member. However, the technology in Patent Document 1 leaves room for further improvement in the positioning accuracy in the plane direction.

[0007] Therefore, this specification discloses a chip holder, a chip holding device, and a semiconductor device manufacturing device that can properly position a semiconductor chip without contacting the semiconductor chip. [Means for solving the problem]

[0008] The chip holder disclosed in this specification is characterized in that it comprises a holding surface that holds a semiconductor chip without contact, a suction path that applies negative pressure to the holding surface to suck the semiconductor chip, and a vibration generating unit that applies ultrasonic vibrations to the holding surface, and the outer size of the holding surface is larger than the outer size of the semiconductor chip.

[0009] In this case, a positioning groove may be formed in the holding surface, the groove having a shape that follows at least a part of the outer shape of the semiconductor chip.

[0010] Furthermore, the vibration generating unit may have a horn portion that transmits ultrasonic vibrations, and may further include a plate-shaped holding portion connected to the end of the horn portion, the end face of which functions as the holding surface, and the holding portion may have a central portion that overlaps with the horn portion in the axial direction, and a flange portion that protrudes radially outward from the central portion and is thinner than the central portion.

[0011] At least a portion of the positioning groove may penetrate the flange portion in the thickness direction.

[0012] Furthermore, when ultrasonic vibration is applied to the holding surface, the vibration amplitude at the portion outside the positioning groove may be larger than the vibration amplitude at the portion inside the positioning groove.

[0013] In this case, the semiconductor chip may be self-aligned so as to be positioned inside the positioning groove by receiving the vibration amplitude of the portion outside the positioning groove.

[0014] Another chip holder disclosed in this specification is a chip holder comprising a holding surface that holds a semiconductor chip without contact, a suction path that applies negative pressure to the holding surface to suck the semiconductor chip, and a vibration generating unit that applies ultrasonic vibrations to the holding surface, wherein the suction path has a suction hole formed in the holding surface and connected to a suction source, and the holding surface has an airflow forming groove formed therein that is connected to the suction hole and extends in the surface direction.

[0015] In this case, the airflow forming groove may be formed only in an area inside the outer shape of the semiconductor chip.

[0016] The air flow forming groove may have one or more radiating portions extending in the planar direction from the suction hole. In this case, the air flow forming groove may further have one or more peripheral portions directly connected to the radiating portions but not passing through the suction hole. The peripheral portions may have a closed shape that surrounds the suction hole and connects all of the one or more radiating portions.

[0017] The depth of the airflow forming groove may be greater than the floating amount of the semiconductor chip from the holding surface, but less than 50 times the floating amount.

[0018] The chip holding device disclosed in this specification is a chip holding device that holds a semiconductor chip non-contact, and is characterized by comprising: a chip holding tool that holds the semiconductor chip non-contact; an ultrasonic generating unit that applies ultrasonic vibrations to a holding surface that is the end surface of the holder; a suction path that applies negative pressure to a suction hole formed on the holding surface to generate a suction force; and a controller that controls ultrasonic energy or the suction force so that the holding force generated by the ultrasonic vibration, the suction force, and gravity acting on the semiconductor chip are balanced when the semiconductor chip is separated from the holding surface.

[0019] In this case, the controller may change the magnitude of at least one of the ultrasonic energy and the suction force applied to the holding surface depending on whether the position of the holding surface is moved or kept stationary.

[0020] The controller may also increase at least one of the ultrasonic energy and the suction force when the holding surface is moving compared to when the holding surface is stationary.

[0021] Another chip holding device disclosed in this specification is a chip holding device that holds a semiconductor chip non-contact, and is characterized by comprising: a chip holding tool that holds the semiconductor chip non-contact; an ultrasonic generating unit that applies ultrasonic vibrations to the holding surface, which is the end surface of the chip holding tool; a suction path that applies negative pressure to a suction hole formed on the holding surface to generate a suction force; a controller that controls the driving of the ultrasonic generating unit and the suction source so that the holding force generated by the ultrasonic vibrations, the suction force, and gravity acting on the semiconductor chip are balanced when the semiconductor chip is separated from the holding surface; and at least one of a surface treatment device that treats the surface of the semiconductor chip held non-contact by the holding surface, or an inspection device that inspects the surface.

[0022] The semiconductor device manufacturing apparatus disclosed in this specification comprises a chip holder that holds a semiconductor chip without contact, an ultrasonic generating unit that applies ultrasonic vibrations to the holding surface, which is the end surface of the chip holder, a suction path that applies negative pressure to a suction hole formed in the holding surface to generate a suction force, and a controller that controls the driving of the ultrasonic generating unit and the suction source so that the holding force generated by the ultrasonic vibrations, the suction force, and gravity acting on the semiconductor chip are balanced when the semiconductor chip is separated from the holding surface, and is characterized in that the outer size of the holding surface is larger than the outer size of the semiconductor chip.

[0023] In this case, the chip holder may function as a pickup collet that receives the semiconductor chip from a chip supply source, then flips the semiconductor chip 180 degrees while holding it non-contact, and then transfers the semiconductor chip to a bonding tool.

[0024] The semiconductor device manufacturing apparatus may also directly bond the semiconductor chip to a substrate. [Effects of the Invention]

[0025] The chip holder disclosed in this specification allows the semiconductor chip to be appropriately positioned relative to the holder without contacting the semiconductor chip. [Brief explanation of the drawings]

[0026] [Figure 1] FIG. 2 is a diagram showing the configuration of a tip holding device. [Figure 2] FIG. 1 is an axial view of the holding surface. [Figure 3] FIG. 10 is an image diagram showing the function of the positioning groove. [Figure 4] FIG. 10 is an image diagram showing the function of the airflow forming groove. [Figure 5A] 10A and 10B are diagrams showing an example of grooves formed on a holding surface. [Figure 5B] 10A and 10B are diagrams showing another example of grooves formed on the holding surface. [Figure 5C] 10A and 10B are diagrams showing another example of grooves formed on the holding surface. [Figure 6A] 10A and 10B are diagrams showing another example of grooves formed on the holding surface. [Figure 6B] 10A and 10B are diagrams showing another example of grooves formed on the holding surface. [Figure 6C] 10A and 10B are diagrams showing another example of grooves formed on the holding surface. [Figure 7] FIG. 10 is a diagram showing the configuration of another chip holding device. [Figure 8A] FIG. 1 is a diagram showing a processing apparatus for performing plasma processing. [Figure 8B] FIG. 1 is a diagram showing a processing device for performing a cleaning process. [Figure 9A] FIG. 1 is a diagram showing an inspection device for inspecting the edge of a semiconductor chip. [Figure 9B] FIG. 1 is a diagram showing an inspection device for inspecting the appearance of a semiconductor chip. [Figure 10] FIG. 1 is a diagram showing an example of a manufacturing apparatus having a chip holding device. DETAILED DESCRIPTION OF THE INVENTION

[0027] The configuration of the chip holding device 10 will be described below with reference to the drawings. Fig. 1 is a diagram showing the configuration of the chip holding device 10. This chip holding device 10 is a device that holds and transports semiconductor chips 100 in a non-contact manner, and is incorporated into, for example, semiconductor device manufacturing equipment, inspection equipment, etc.

[0028] As shown in FIG. 1 , the chip holding device 10 includes a chip holder 12, an ultrasonic generator 14, a vacuum source 20, and a controller 22. The chip holder 12 holds a semiconductor chip 100 in a non-contact manner. The chip holder 12 has a substantially plate-shaped holding portion 23 and a horn portion 26 extending axially from the holding portion 23. The end face of the holding portion 23 functions as a holding surface 24 that holds the semiconductor chip 100. The holding surface 24 is formed with an airflow-forming groove 34 and a positioning groove 36; these two types of grooves 34, 36 will be described later. The chip holder 12 also has a suction path 33 that communicates with the vacuum source 20, which will be described later, and applies negative pressure to the holding surface 24 to suck the semiconductor chip 100. A suction hole 32, which is the end of the suction path 33, is formed in the center of the holding surface 24.

[0029] The position and posture of the chip holder 12 can be changed as needed. Therefore, although the holding surface 24 faces upward in Fig. 1, depending on the usage situation of the chip holder 12, the chip holder 12 may take a posture in which the holding surface 24 is parallel to the vertical direction or faces downward. Even if the posture of the chip holder 12 is changed, the chip holder 12 can continue to hold the semiconductor chip 100 without contact.

[0030] Horn portion 26 extends in the axial direction from the back side of holding surface 24 (i.e., the side opposite semiconductor chip 100). Horn portion 26 is a portion that transmits ultrasonic vibrations generated by ultrasonic generator 14 to holding surface 24. Inside horn portion 26, suction path 33 is formed that connects suction hole 32 and vacuum source 20. In addition, the base end of horn portion 26 is mechanically connected to ultrasonic vibrator 16.

[0031] The ultrasonic generator 14 generates ultrasonic vibrations and includes, for example, an ultrasonic vibrator 16 and an AC power supply 18. The ultrasonic vibrator 16 is a vibration generating source that generates longitudinal vibrations upon receiving a drive signal, which is a voltage signal. The ultrasonic vibrator 16 includes, for example, lead zirconate titanate (commonly known as PZT) that vibrates upon receiving an AC voltage, and is a bolt-tightened Langevin vibrator (commonly known as a BLT or BL vibrator) in which the PZT is sandwiched between metal blocks and tightened with screws (bolts) to apply pressure. The AC power supply 18 applies an alternating voltage of a frequency corresponding to a predetermined resonant frequency to the ultrasonic vibrator 16.

[0032] Driving the ultrasonic generator 14 causes ultrasonic vibrations in the axial direction of the holding surface 24. Then, the ultrasonic vibrations of the holding surface 24 cause an ultrasonic squeeze effect between the holding surface 24 and a plane (for example, an end face of the semiconductor chip 100) closely facing the holding surface 24, whereby the semiconductor chip 100 is held on the holding surface 24 while remaining spaced apart from the holding surface 24.

[0033] The vacuum source 20 generates negative pressure and includes, for example, an air pump, etc. The vacuum source 20 is in communication with the suction path 33, and when the vacuum source 20 is driven, negative pressure acts on the suction holes 32, generating a suction force that attracts the semiconductor chip 100 to the holding surface 24.

[0034] The controller 22 controls the operation of the ultrasonic generator 14 and the vacuum source 20. Physically, the controller 22 is a computer having a processor 22a and a memory 22b. The term "computer" also includes a microcontroller incorporating a computer system into a single integrated circuit. The processor 22a refers to a processor in a broad sense, including general-purpose processors (e.g., a central processing unit (CPU)) and dedicated processors (e.g., a graphics processing unit (GPU), an application-specific integrated circuit (ASIC), a field programmable gate array (FPGA), a programmable logic device, etc.). The memory 22b may include at least one of a semiconductor memory (e.g., a RAM, a ROM, a solid-state drive, etc.) and a magnetic disk (e.g., a hard disk drive, etc.). The processor 22a and the memory 22b do not necessarily have to be single; the controller 22 may have multiple processors 22a and multiple memories 22b.

[0035] The controller 22 controls the operation of the ultrasonic generator 14 and the vacuum source 20 so that the holding surface 24 can hold the semiconductor chip 100 without contact. Specifically, as described above, when an alternating voltage is applied to the ultrasonic vibrator 16, the holding surface 24 undergoes ultrasonic vibration. When the semiconductor chip 100 is brought close to the holding surface 24 while this ultrasonic vibration is occurring, an ultrasonic squeeze effect occurs between the holding surface 24 and the semiconductor chip 100. The ultrasonic squeeze effect occurs when one of two flat plates facing each other across a small gap is vibrated, generating a pressure within the gap that is higher than the external pressure due to the influence of viscosity within the gap. When this ultrasonic squeeze effect occurs, an air film Sf is formed between the semiconductor chip 100 and the holding surface 24, preventing contact between the two, and a holding force is generated that holds the semiconductor chip 100 on the holding surface 24.

[0036] Here, the holding force generated by the ultrasonic squeeze effect (hereinafter referred to as "ultrasonic holding force") occurs in both a direction perpendicular to the holding surface 24 and a direction parallel to the holding surface 24 (i.e., the planar direction). That is, when the ultrasonic squeeze effect occurs, a force acts on the semiconductor chip 100 in a direction that moves it away from the holding surface 24 or causes it to float up from the holding surface 24. Furthermore, when the ultrasonic squeeze effect occurs, the semiconductor chip 100 tends to remain within the vibration plane. Therefore, even if the semiconductor chip 100 is temporarily displaced in the planar direction due to an external force, the semiconductor chip 100 tends to move in the planar direction so that its entirety is positioned within the vibration plane, and return to a state facing the holding surface 24.

[0037] The thickness of the air film (hereinafter referred to as "ultrasonic squeeze film Sf") generated by the ultrasonic squeeze effect, i.e., the floating amount Df of the semiconductor chip 100 from the holding surface 24, increases as the ultrasonic energy increases (i.e., the amplitude of the ultrasonic vibration increases).Furthermore, the ultrasonic holding force also increases as the ultrasonic energy increases.

[0038] In this example, to assist this ultrasonic holding force, a suction force due to negative pressure is also generated on the holding surface 24. With the semiconductor chip 100 floating above the holding surface 24, the controller 22 controls the driving of the vacuum source 20 and the ultrasonic generator 14 so that this suction force, the ultrasonic holding force, and the gravity acting on the semiconductor chip 100 are balanced.

[0039] As described above, when the ultrasonic squeeze effect occurs, the semiconductor chip 100 tends to be positioned within the vibration plane. Therefore, if the holding surface 24 is made to have substantially the same shape as the semiconductor chip 100, the ultrasonic squeeze effect causes the semiconductor chip 100 to automatically move in the planar direction so that the entire semiconductor chip 100 is positioned within the vibration plane (i.e., within the area inside the outer shape of the holding surface 24). In other words, self-alignment of the semiconductor chip 100 in the planar direction becomes possible.

[0040] However, the holding force in the plane direction due to this ultrasonic squeeze effect is not very strong. Therefore, depending on the magnitude of gravity and inertial forces acting on the semiconductor chip 100, it may not be possible to position the semiconductor chip 100 in the plane direction with sufficient accuracy. Therefore, in this example, in order to further improve the positioning accuracy in the plane direction of the semiconductor chip 100, the holding surface 24 is made larger than the semiconductor chip 100, and several grooves 34, 36 are formed in the holding surface 24. This will be explained in detail below.

[0041] FIG. 2 is an axial view of the holding surface 24. In FIG. 2, diagonally hatched areas indicate recesses that do not penetrate the holding portion 23, and cross-hatched areas indicate holes that penetrate the holding portion 23. As shown in FIG. 2, the holding surface 24 is formed with suction holes 32, airflow-forming grooves 34, and positioning grooves 36. The positioning grooves 36 have substantially the same shape as the outer shape of the semiconductor chip 100. In this example, since the semiconductor chip 100 is a square with sides of approximately L1, the shape of the inner peripheral edge of the positioning groove 36 is also a square with sides of approximately L1. As described above, the holding surface 24 is roughly divided into a central portion 28 that overlaps with the horn portion 26 and a flange portion 30 that extends radially outward from the central portion 28, and the positioning groove 36 is located in this flange portion 30. At least a portion of the positioning groove 36 is a recess 36a that is sufficiently shallower than the thickness of the flange portion 30, and the remainder of the positioning groove 36 is a hole 36b that penetrates the flange portion 30 in the thickness direction. In the example of Fig. 2, the rectangular straight portion of the positioning groove 36 penetrates the flange portion 30 in the thickness direction, and the corner portions of the rectangle are recesses that do not penetrate the flange portion 30.

[0042] The function of the positioning groove 36 will be described with reference to FIG. 3. FIG. 3 is an image diagram showing the function of the positioning groove 36. Note that the airflow forming groove 34 is not shown in FIG. 3. When the positioning groove 36 is formed, the positioning accuracy in the surface direction of the semiconductor chip 100 is improved compared to when the positioning groove 36 is not formed. It is presumed that the principle behind this function is that the amplitude of the ultrasonic vibration changes suddenly at the boundary of the positioning groove 36.

[0043] That is, when the ultrasonic generator 14 is driven, ultrasonic vibrations are generated on the holding surface 24. It is believed that, in the absence of the positioning groove 36, the amplitude of these ultrasonic vibrations gradually increases as the position approaches the outer periphery of the holding surface 24. Because the ultrasonic holding force varies depending on the amplitude of the ultrasonic vibrations, even in the absence of the positioning groove 36, if the semiconductor chip 100 is displaced in the plane direction from the center of the holding surface 24, the ultrasonic holding force acting on the semiconductor chip 100 will be unbalanced between the left and right. The semiconductor chip 100 moves in the plane direction to eliminate this force imbalance, automatically correcting the positional misalignment of the semiconductor chip 100 in the plane direction, i.e., self-aligning. However, in the absence of the positioning groove 36, the imbalance in the ultrasonic holding force caused by the positional misalignment of the semiconductor chip 100 is minimal, and therefore the self-alignment force is small.

[0044] On the other hand, when the positioning groove 36 is formed, the strength of the holding surface 24 is locally reduced at the location where the positioning groove 36 is formed. When ultrasonic vibration is applied to such holding surface 24, the portion outside the positioning groove 36 tends to oscillate with the positioning groove 36 as a fulcrum. As a result, the vibration amplitude becomes suddenly larger in the outer portion than in the inner portion of the positioning groove 36, and the ultrasonic holding force changes suddenly at the boundary of the positioning groove 36.

[0045] 3, if one end of the semiconductor chip 100 in the planar direction is positioned beyond the positioning groove 36 and outward in the planar direction, the left-right balance of the ultrasonic holding force is significantly disrupted. To eliminate this imbalance, a relatively large force acts on the semiconductor chip 100, causing the semiconductor chip 100 to move toward the inside of the positioning groove 36. As a result, when the positioning groove 36 is present, the self-alignment accuracy of the semiconductor chip 100 can be improved compared to when the positioning groove 36 is not present.

[0046] Next, the airflow forming groove 34 will be described. As shown in FIG. 2, a suction hole 32 is formed in the center of the holding surface 24, and this suction hole 32 is connected to the vacuum source 20. The airflow forming groove 34 is a groove connected to this vacuum source 20. The shape of this airflow forming groove 34 is not particularly limited as long as it is connected to the suction hole 32. In this example, the airflow forming groove 34 is composed of four radiating portions 34a extending radially or crisscrossingly from the suction hole 32, and a peripheral portion 34b that is directly connected to the radiating portions 34a but does not pass through the suction hole 32. As shown in FIG. 2, the peripheral portion 34b has a closed shape, more specifically, a substantially rectangular shape, surrounding the suction hole 32 so as to connect all of the one or more radiating portions 34a. As shown in FIG. 2, this airflow forming groove 34 is formed only in an area inside the positioning groove 36, in other words, inside the outer shape of the semiconductor chip 100.

[0047] The function of the air flow forming grooves 34 will be described with reference to Fig. 4. Fig. 4 is an image diagram showing the function of the air flow forming grooves 34. Note that the positioning grooves 36 are not shown in Fig. 4. When the air flow forming grooves 34 are formed, the positioning accuracy of the semiconductor chip 100 in the surface direction is improved compared to when the air flow forming grooves 34 are not formed. The principle behind this function is presumably that the formation of the air flow forming grooves 34 increases the speed and stabilizes the air flow in the surface direction that flows between the semiconductor chip 100 and the holding surface 24.

[0048] That is, when the vacuum source 20 generates a suction force while the semiconductor chip 100 is levitated due to the ultrasonic squeeze effect, an airflow is generated in the levitation gap in a planar and centerward direction. Without the airflow-forming grooves 34, the airflow in the planar direction toward the center tends to be slow and unstable due to the influence of fluid viscosity. Furthermore, the suction force acts locally only near the suction holes 32. In this case, even if the semiconductor chip 100 is misaligned in the planar direction, it is difficult for it to move in the planar direction, making it difficult for the misalignment to be corrected on its own.

[0049] On the other hand, as shown in FIG. 4, when the airflow forming grooves 34 are formed, the gap between the semiconductor chip 100 and the holding surface 24 is thicker near the airflow forming grooves 34, reducing the influence of fluid viscosity acting on the entire airflow. As a result, the speed of the airflow in the planar direction increases, stabilizing the airflow in the planar direction. In particular, the airflow near the outer periphery of the semiconductor chip 100 (near area A in FIG. 4) is significantly more stable than when the airflow forming grooves 34 are not formed. Such a stable airflow in the planar direction applies a force to the semiconductor chip 100 that moves the center of the semiconductor chip 100 toward the suction holes 32 (and thus the center of the holding surface 24). This automatically positions the semiconductor chip 100 relative to the holding surface 24. Furthermore, by forming the airflow forming grooves 34, the peak of the suction force generated near the suction holes 32 can be reduced, dispersing the suction force in the planar direction. This makes it easier for the semiconductor chip 100 to move in the planar direction and self-correct any misalignment in the planar direction.

[0050] The depth of the airflow forming grooves 34 is not particularly limited. However, if the airflow forming grooves 34 are excessively shallow, the flow velocity of the airflow in the surface direction in the floating gap will be reduced due to the influence of fluid viscosity. Therefore, the depth of the airflow forming grooves 34 may be equal to or greater than the floating height Df of the semiconductor chip 100 from the holding surface 24. Furthermore, if the airflow forming grooves 34 are excessively deep, this will affect the vibration mode and vibration amplitude of the holding surface 24. Therefore, the airflow forming grooves 34 should be sized so as not to affect the vibration mode and vibration amplitude of the holding surface 24. For example, the airflow forming grooves 34 may be less than 100 times, less than 50 times, or less than 10 times the floating height Df.

[0051] As is clear from the above explanation, this example can further improve the positional accuracy in the automatic positioning, or so-called self-alignment, of the semiconductor chip 100. Note that the explanation so far is just one example, and as long as the outer size of the holding surface 24 is larger than the outer size of the semiconductor chip 100, or the airflow forming grooves 34 connected to the suction holes 32 are formed on the holding surface 24, other configurations may be changed as appropriate.

[0052] Therefore, if the outer size of the holding surface 24 is made larger than the outer size of the semiconductor chip 100, it is not necessary to form any grooves on the holding surface 24. Furthermore, if the airflow-forming grooves 34 are formed on the holding surface 24, the outer size of the holding surface 24 may be the same as or smaller than the outer size of the semiconductor chip 100.

[0053] The shapes and combinations of the positioning grooves 36 and the airflow forming grooves 34 may be changed as appropriate. For example, as shown in FIG. 5A, only the positioning grooves 36 may be formed on the holding surface 24, without the airflow forming grooves 34. The position and range of the hole portions (cross-hatched portions) of the positioning grooves 36 that penetrate the flange portion 30 may also be changed as appropriate. For example, as shown in FIG. 5A, the positioning grooves 36 may not have hole portions. The shape of the positioning grooves 36 does not need to be a closed curve with no starting or ending, but may be one or more open curves as shown in FIG. 5C. In this case, the entire positioning groove 36 may be a hole portion (cross-hatched portion) that penetrates the flange portion 30 in the thickness direction.

[0054] Furthermore, as shown in FIG. 5B, only the airflow forming groove 34 may be formed on the holding surface 24, without the positioning groove 36. Furthermore, the shape of the airflow forming groove 34 may be modified as appropriate, as long as it is connected to the suction hole 32. For example, the number of radiating portions 34a constituting the airflow forming groove 34 is not limited and may be less than four or more than four. Therefore, for example, as shown in FIG. 5B, the airflow forming groove 34 may have two radiating portions 34a and an overall shape resembling the digital number "8." Furthermore, the peripheral portion 34b of the airflow forming groove 34 is not limited to a rectangular shape, and may be circular as shown in FIG. 5C. Furthermore, the radiating portion 34a may extend beyond the peripheral portion 34b to the outside, as shown in FIG. 6A. Furthermore, as shown in FIG. 6B, the airflow forming groove 34 may have only the radiating portion 34a extending from the suction hole 32 in the planar direction, without the peripheral portion 34b. Furthermore, the peripheral portion 34b does not need to be a closed shape connecting all of the one or more radiating portions 34a, but may be a line segment with ends. Therefore, for example, the air flow forming groove 34 may be shaped like an "H." Furthermore, as shown in FIG. 6C, the air flow forming groove 34 may be shaped like a "T" having linear radiating portions 34a parallel to the positioning groove 36 and peripheral portions 34b extending linearly in both directions from the ends of the radiating portions 34a.

[0055] As described above, the tip holder 12 in this example is movable and rotatable, and its posture and position can be changed. The controller 22 changes the ultrasonic energy and suction force applied to the holding surface 24 in response to these changes in the movement and posture of the tip holder 12.

[0056] That is, the direction and magnitude of the inertial force acting on the semiconductor chip 100 change according to the movement of the holding surface 24. The controller 22 adjusts the ultrasonic energy and suction force so that the semiconductor chip 100 can be held in a non-contact manner even if the direction and magnitude of the inertial force change. Specifically, when the holding surface 24 moves, the controller 22 increases at least one of the ultrasonic energy and the suction force compared to when the holding surface 24 is stationary.

[0057] For example, consider a case where the holding surface 24 moves in its planar direction (e.g., the direction of arrow A1 in FIG. 1). In this case, an inertial force acts on the semiconductor chip 100 in the planar direction and in the direction opposite to the movement direction. To maintain the holding state of the semiconductor chip 100 against this inertial force, the controller 22 adjusts the ultrasonic energy and suction force so as to increase the holding force in the planar direction of the semiconductor chip 100. Specifically, the controller 22 may increase the suction force so as to increase the holding force in the planar direction while keeping the ultrasonic energy constant. Alternatively, the controller 22 may increase the ultrasonic energy so as to increase the holding force in the planar direction while keeping the suction force constant.

[0058] Also, consider a case where the chip holder 12 moves in its axial direction toward the semiconductor chip 100 (for example, the direction of arrow A2 in FIG. 1). In this case, the semiconductor chip 100 approaches the holding surface 24 due to inertial force, which may reduce the thickness of the ultrasonic squeeze film Sf between the semiconductor chip 100 and the holding surface 24. Therefore, in this case, the ultrasonic energy may be increased to prevent the thickness of the ultrasonic squeeze film Sf from decreasing.

[0059] Also, consider a case where the chip holder 12 moves in its axial direction away from the semiconductor chip 100 (for example, the direction of arrow A3 in FIG. 1). In this case, the semiconductor chip 100 may move away from the holding surface 24 due to inertial force, which may reduce the holding force of the semiconductor chip 100 by the holding surface 24. Therefore, in this case, the suction force or ultrasonic energy may be increased to prevent the reduction in the holding force.

[0060] Furthermore, the effect of gravity on the semiconductor chip 100 changes depending on the orientation of the chip holder 12. For example, when the chip holder 12 faces upward, gravity acting on the semiconductor chip 100 acts as a force that moves the semiconductor chip 100 closer to the holding surface 24. On the other hand, when the chip holder 12 faces downward, gravity acting on the semiconductor chip 100 acts as a force that moves the semiconductor chip 100 away from the holding surface 24. Therefore, when the chip holder 12 faces downward, the controller 22 may increase at least one of the ultrasonic energy and the suction force so that the holding force by the holding surface 24 is stronger than when the chip holder 12 faces upward.

[0061] Furthermore, when the chip holder 12 is oriented sideways, gravity acting on the semiconductor chip 100 acts as a force that moves the semiconductor chip 100 in the planar direction, i.e., a force that causes a positional deviation in the planar direction of the semiconductor chip 100. Therefore, when the chip holder 12 is oriented sideways, the controller 22 may increase the ultrasonic energy so that the holding force in the planar direction by the holding surface 24 is stronger than when the chip holder 12 is oriented upward or downward.

[0062] Next, another chip holding device 10 will be described with reference to FIG. 7. FIG. 7 is a diagram showing the configuration of another chip holding device 10. In addition to the chip holding device 10 of FIG. 1, this chip holding device 10 further includes a processing device 50 and an inspection device 52. The processing device 50 is a device that performs a predetermined process, such as a plasma process or a cleaning process, on the surface of a semiconductor chip 100 held in a non-contact manner by a chip holder 12. FIGS. 8A and 8B show an example of such a processing device 50. FIG. 8A shows a processing device 50 that performs plasma processing and includes a plasma irradiation head 50a. As shown in FIG. 8A, the plasma irradiation head 50a can irradiate plasma onto the surface of the semiconductor chip 100 opposite the holding surface 24, thereby performing plasma processing on the opposite surface. FIG. 8B also shows a processing device that performs cleaning processing on the surface of the semiconductor chip 100 and includes an air blower 50b that removes foreign matter and a suction duct 50c that collects the blown-off foreign matter. By using this processing device 50, foreign matter adhering to the surface of the semiconductor chip 100 can be removed.

[0063] 8A and 8B, according to this example, such surface treatment (plasma treatment, cleaning treatment, etc.) can be performed in a floating state of the semiconductor chip 100. As a result, deterioration and contamination of the semiconductor chip 100 can be effectively prevented.

[0064] The inspection device 52 is a device that inspects the semiconductor chip 100 held in a non-contact manner by the chip holder 12. An example of such an inspection device 52 is shown in FIGS. 9A and 9B. FIG. 9A shows the inspection device 52 that inspects the edge of the semiconductor chip 100, and includes a laser displacement meter 52a. The laser displacement meter 52a irradiates a laser onto an object and detects the distance to the object and the presence or absence of the object based on the reflected light. By scanning the laser displacement meter 52a in the surface direction of the semiconductor chip 100, the position of the edge of the semiconductor chip 100 can be detected.

[0065] 9B shows inspection device 52 that inspects the appearance of semiconductor chip 100, and includes inspection camera 52b. Inspection camera 52b captures an image of the surface of semiconductor chip 100 opposite holding surface 24. Controller 22 determines the quality, etc. of semiconductor chip 100 based on the obtained image.

[0066] 9A and 9B, this embodiment allows inspection (edge ​​inspection and visual inspection) of the semiconductor chip 100 to be performed while the semiconductor chip 100 is levitated. As a result, deterioration and contamination of the semiconductor chip 100 can be effectively prevented. When the semiconductor chip 100 is levitated using the ultrasonic squeeze effect, the semiconductor chip 100 vibrates slightly in the axial direction. The amplitude of the vibration of the semiconductor chip 100 is lower when the vacuum source 20 is released than when the vacuum source 20 is suctioning. Therefore, to reduce the impact of the vibration on the inspection accuracy, the vacuum source 20 may be stopped and the suction force may be eliminated during the inspection. Alternatively, to reduce the impact of the vibration on the inspection accuracy, the timing of sampling the inspection value by the inspection device 52 may be synchronized with the vibration period of the semiconductor chip 100.

[0067] Furthermore, the chip holding device 10 described above may be incorporated into, for example, a semiconductor device manufacturing device. Fig. 10 is a diagram showing an example of a manufacturing device 60 having the chip holding device 10. The manufacturing device 60 in Fig. 10 is an apparatus that manufactures a semiconductor device by bonding one or more semiconductor chips 100 to a substrate 110.

[0068] This manufacturing apparatus 60 has a chip supply source 61, a pickup unit 62, and a bonding unit 64. The chip supply source 61 has semiconductor chips 100 attached to a dicing tape 66 prepared therein. The pickup unit 62 has push-up pins 70 that push up the semiconductor chips 100 attached to the dicing tape 66 from below, and a pickup collet 68 that picks up the pushed-up semiconductor chips 100. In this example, the above-mentioned chip holding device 10 is used as this pickup collet 68.

[0069] The semiconductor chip 100 is attached to the dicing tape 66 with the surface to be bonded to the substrate 110, i.e., the bonding surface (the thick line portion in FIG. 10), facing upward. The chip holder 12 of the pickup collet 68 holds this bonding surface without contact with the holding surface 24. In other words, because the bonding surface does not come into contact with the holding surface 24, adhesion of foreign matter is prevented, and chipping due to impact upon contact is also effectively prevented.

[0070] When the pickup collet 68 receives the semiconductor chip 100 from the dicing tape 66, it rotates 180 degrees around the specified rotation axis 72. This changes the holding surface 24 from a downward-facing state to an upward-facing state. To ensure that the semiconductor chip 100 can be held appropriately during this rotational movement, the controller 22 increases at least one of the ultrasonic energy and the suction force during the rotational movement compared to when the device is stationary.

[0071] The bonding section 64 has a bonding stage 76 on which the substrate 110 is placed, and a bonding tool 74 that holds and transports the semiconductor chip 100. The bonding tool 74 suction-holds the semiconductor chip 100 at its end surface and transports the semiconductor chip 100. As shown in FIG. 10 , the bonding tool 74 receives the semiconductor chip 100 from a pickup collet 68 that is facing upward, and suction-holds the surface of the semiconductor chip 100 opposite the bonding surface. The bonding tool 74 also presses the semiconductor chip 100 against the substrate 110 and bonds the semiconductor chip 100 to the substrate 110. A semiconductor device 120 is manufactured by bonding the required number of semiconductor chips 100 to one substrate 110.

[0072] Here, the bonding method is not particularly limited, but in this example, the semiconductor chip 100 is directly bonded to the substrate 110. Direct bonding is a bonding method in which the semiconductor chip 100 is directly bonded to the substrate 110 without using an adhesive. For example, in direct bonding, chip-side electrodes formed on the bonding surface of the semiconductor chip 100 are bonded to substrate-side electrodes formed on the substrate 110. At this time, the electrodes may be welded using heat, or may be bonded at room temperature.

[0073] However, direct bonding is susceptible to the influence of foreign matter or chips on the bonding surface, and even the slightest foreign matter or chips can easily cause bonding defects. The pickup collet 68 of this example holds the semiconductor chip 100 in a non-contact manner, and the bonding surface of the semiconductor chip 100 does not come into contact with other components until it is bonded to the substrate 110. Therefore, this example effectively prevents the adhesion of foreign matter to the bonding surface and the occurrence of chips. This effectively prevents bonding defects in direct bonding.

[0074] The configuration described here is merely an example, and other configurations may be changed as appropriate as long as the manufacturing apparatus 60 has the chip holding device 10 that holds the semiconductor chip 100 in a non-contact manner. For example, the manufacturing apparatus 60 may bond the semiconductor chip 100 to the substrate 110 using an adhesive such as NCF. Furthermore, the chip holding device 10 may be used not only for the pickup collet 68 but also for the bonding tool 74. [Explanation of symbols]

[0075] 10 chip holding device, 12 chip holder, 14 ultrasonic generator, 16 ultrasonic vibrator, 18 AC power supply, 20 vacuum source, 22 controller, 23 holding portion, 24 holding surface, 26 horn portion, 28 center portion, 30 flange portion, 32 suction hole, 33 suction path, 34 air flow forming groove, 36 positioning groove, 50 processing device, 50a plasma irradiation head, 50b air blow, 50c suction duct, 52 inspection device, 52a laser displacement meter, 52b inspection camera, 60 manufacturing device, 61 chip supply source, 62 pickup portion, 64 bonding portion, 66 dicing tape, 68 pickup collet, 70 push-up pin, 72 rotating shaft, 74 bonding tool, 76 bonding stage, 100 semiconductor chip, 110 substrate, 120 semiconductor device.

Claims

1. a holding surface for holding a semiconductor chip without contact, a suction path for applying negative pressure to the holding surface to suck the semiconductor chip, and a vibration generating unit for applying ultrasonic vibration to the holding surface, the outer size of the holding surface being larger than the outer size of the semiconductor chip; a positioning groove formed on the holding surface and having a shape that follows at least a part of the outer shape of the semiconductor chip; The positioning groove does not communicate with the suction path. A chip holder characterized by:

2. The chip holder according to claim 1, the vibration generating unit has a horn unit that transmits ultrasonic vibrations, The device further includes a plate-shaped holding portion connected to an end of the horn portion, the end surface of which functions as the holding surface, The holding portion is a central portion overlapping the horn portion in the axial direction; a flange portion that protrudes radially outward from the central portion and is thinner than the central portion; It has A chip holder characterized by:

3. The chip holder according to claim 2, The chip holder is characterized in that at least a part of the positioning groove penetrates the flange portion in the thickness direction.

4. The chip holder according to any one of claims 1 to 3, A chip holder characterized in that, when ultrasonic vibration is applied to the holding surface, the vibration amplitude of the portion outside the positioning groove is greater than the vibration amplitude of the portion inside the positioning groove.

5. The chip holder according to any one of claims 1 to 4, The chip holder is characterized in that the semiconductor chip is subjected to vibration amplitude at a portion outside the positioning groove and self-aligns so as to be positioned inside the positioning groove.

6. A chip holder comprising: a holding surface that holds a semiconductor chip in a non-contact manner; a suction path that applies negative pressure to the holding surface to suck the semiconductor chip; and a vibration generating unit that applies ultrasonic vibration to the holding surface, the suction path has a suction hole formed in the holding surface and communicating with a suction source; an airflow forming groove connected to the suction hole and extending in a surface direction is formed on the holding surface; a positioning groove having a shape that follows at least a part of the outer shape of the semiconductor chip is formed on the holding surface; A chip holder characterized by:

7. 7. The chip holder according to claim 6, The chip holder is characterized in that the airflow forming groove is formed only in an area inside the outer shape of the semiconductor chip.

8. The chip holder according to claim 7, The air flow forming groove has one or more radiating portions extending in a planar direction from the suction hole. A chip holder characterized by:

9. The chip holder according to claim 8, The airflow forming groove further has one or more peripheral portions directly connected to the radiating portion but not passing through the suction hole. A chip holder characterized by:

10. The chip holder according to claim 9, The chip holder is characterized in that the peripheral portion has a closed shape that surrounds the suction hole and connects all of the one or more radiating portions.

11. The chip holder according to claim 7, A chip holder characterized in that the depth of the airflow forming groove is greater than the floating amount of the semiconductor chip from the holding surface, but is less than 50 times the floating amount.

12. A chip holding device that holds a semiconductor chip in a non-contact manner, a chip holder that holds the semiconductor chip in a non-contact manner; an ultrasonic generator that applies ultrasonic vibration to a holding surface that is an end surface of the tip holder; a suction path that applies negative pressure to the suction holes formed on the holding surface to generate suction force; a controller that controls ultrasonic energy or the suction force so that the holding force generated by the ultrasonic vibration, the suction force, and gravity acting on the semiconductor chip are balanced in a state in which the semiconductor chip is separated from the holding surface; and Equipped with a positioning groove formed on the holding surface and having a shape that follows at least a part of the outer shape of the semiconductor chip; The positioning groove does not communicate with the suction path. A chip holding device characterized by:

13. 13. The chip holder of claim 12, The controller changes the magnitude of at least one of the ultrasonic energy or the suction force applied to the holding surface when the position of the holding surface is moved and when the holding surface is stationary.

14. 14. The chip holder of claim 13, The tip holding device is characterized in that the controller increases at least one of the ultrasonic energy and the suction force when the holding surface is moving compared to when the holding surface is stationary.

15. A chip holding device that holds a semiconductor chip in a non-contact manner, a chip holder that holds the semiconductor chip in a non-contact manner; an ultrasonic generator that applies ultrasonic vibration to a holding surface that is an end surface of the tip holder; a suction path that applies negative pressure to the suction holes formed on the holding surface to generate suction force; a controller that controls the driving of the ultrasonic wave generating unit and the suction source so that the holding force generated by the ultrasonic vibration, the suction force, and gravity acting on the semiconductor chip are balanced in a state in which the semiconductor chip is separated from the holding surface; At least one of a surface treatment device that treats the surface of the semiconductor chip held by the holding surface in a non-contact manner, and an inspection device that inspects the surface; Equipped with a positioning groove having a shape that follows at least a part of the outer shape of the semiconductor chip is formed on the holding surface; A chip holding device characterized by:

16. a chip holder that holds a semiconductor chip in a non-contact manner; an ultrasonic generator that applies ultrasonic vibration to a holding surface that is an end surface of the tip holder; a suction path that applies negative pressure to the suction holes formed on the holding surface to generate suction force; a controller that controls the driving of the ultrasonic wave generating unit and the suction source so that the holding force generated by the ultrasonic vibration, the suction force, and gravity acting on the semiconductor chip are balanced in a state in which the semiconductor chip is separated from the holding surface; and an outer size of the holding surface is larger than an outer size of the semiconductor chip; a positioning groove formed on the holding surface and having a shape that follows at least a part of the outer shape of the semiconductor chip; The positioning groove does not communicate with the suction path.

1. A semiconductor device manufacturing apparatus comprising:

17. 17. The semiconductor device manufacturing apparatus according to claim 16, The semiconductor device manufacturing apparatus is characterized in that the chip holder functions as a pickup collet, receiving the semiconductor chip from a chip supply source, then flipping the semiconductor chip 180 degrees while holding the semiconductor chip in a non-contact state, and then transferring the semiconductor chip to a bonding tool.

18. 18. The semiconductor device manufacturing apparatus according to claim 16, A semiconductor device manufacturing apparatus characterized in that the semiconductor chip is directly bonded to a substrate.

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