Exchange device, processing device, and exchange method

An exchange device automates chuck replacement in grinding systems, reducing user burden and maintaining cleanliness by using a self-propelled robot, enhancing system efficiency and compactness.

JP7740828B2Active Publication Date: 2025-09-17TOKYO ELECTRON LTD
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Patent Information

Application Number
JP2021172594
Authority / Receiving Office
JP · JP
Patent Type
Patents
Current Assignee / Owner
Filing Date
2021-10-21
Publication Date
2025-09-17
Estimated Expiration
2041-10-21

AI Technical Summary

Technical Problem

The burden on users is significant when replacing components in processing devices, particularly due to the weight and handling of heavy parts like chucks in grinding systems.

Method used

An exchange device that automates the replacement of chucks in grinding systems, utilizing a self-propelled robot to handle and replace chucks, reducing human interaction with potentially dirty or heavy components.

Benefits of technology

Reduces the physical burden on users by automating the replacement process, maintaining a cleaner working environment, and allowing for a more compact and efficient grinding system design.

✦ Generated by Eureka AI based on patent content.

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Patent Text Reader

Abstract

To provide a technique that can reduce burdens on a user who uses a processing apparatus.SOLUTION: An exchange apparatus exchanges a holding part that is used in a processing apparatus. The processing apparatus comprises: the holding part that holds a process body; a mounting part on which the holding part is exchangeably mounted; a processing part that processes the process body held by the holding part; and an exterior cover that stores the holding part, the mounting part and the processing part. The exchange apparatus comprises: an exchange mechanism that attaches the holding part to the mounting part or detaches the holding part from the mounting part; a movement mechanism that moves the exchange mechanism from the outside to the inside of the exterior cover through an approach port of the exterior cover; a running base on which the movement mechanism is supported; and a running mechanism that makes the running base run.SELECTED DRAWING: Figure 6
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Description

[Technical Field]

[0001] The present disclosure relates to an exchange device, a processing device, and an exchange method. [Background technology]

[0002] The grinding device described in Patent Document 1 includes a chuck table for holding a workpiece and a grinding wheel for grinding the workpiece held on the chuck table. When the grinding wheel or the chuck table is replaced, the grinding device performs so-called self-grinding, in which the chuck table is ground with the grinding wheel to form the grinding surface of the grinding wheel parallel to the holding surface of the chuck table. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Laid-Open No. 2014-237210 Summary of the Invention [Problem to be solved by the invention]

[0004] One aspect of the present disclosure provides a technique for reducing the burden on a user who uses a processing device. [Means for solving the problem]

[0005] An exchange device according to one aspect of the present disclosure exchanges a holder used in a processing device. substrate a holding part for holding the above-mentioned, a mounting part to which the above-mentioned holding part is replaceably mounted, and substrate of Grinding, cutting or cuttingThe replacement device includes a processing section for replacing the holding section, the mounting section, and an exterior cover that houses the holding section, the mounting section, and the processing section. The replacement device includes an replacement mechanism that mounts the holding section to the mounting section or removes the holding section from the mounting section, a movement mechanism that moves the replacement mechanism from the outside to the inside of the exterior cover through an entrance opening in the exterior cover, a running platform that supports the movement mechanism, and a running mechanism that moves the running platform. The replacement mechanism includes an operating mechanism for tightening or loosening a fastener that fastens the holding part to the mounting part, and a rotation mechanism for rotating the mounting part. The rotation mechanism includes a holder that grips the mounting part, and a motor that rotates the holder about a desired rotation center line, thereby rotating the mounting part. A plurality of the fasteners are provided on a rotational orbit centered on the desired rotation center line. [Effects of the Invention]

[0006] According to one aspect of the present disclosure, the burden on a user who uses a processing device can be reduced. [Brief explanation of the drawings]

[0007] [Figure 1] FIG. 1 is a plan view showing an example of a factory layout. [Figure 2] FIG. 2 is a plan view showing another example of a factory layout. [Figure 3] FIG. 3 is a plan view showing an example of a grinding system. [Figure 4] FIG. 4 is a cross-sectional view showing a grinding device according to one embodiment. [Figure 5] FIG. 5 is a plan view showing an example of a chuck of a grinding device. [Figure 6] FIG. 6 is a cross-sectional view showing a grinding device and an exchange device according to one embodiment. [Figure 7] FIG. 7 is a cross-sectional view showing an example of an operation mechanism included in the replacement mechanism. [Figure 8] FIG. 8 is a cross-sectional view showing an example of an injection port of the mounting base. [Figure 9] FIG. 9 is a cross-sectional view showing an example of an arm included in the replacement mechanism. [Figure 10] FIG. 10 is a cross-sectional view showing another example of an arm included in the replacement mechanism. [Figure 11] FIG. 11 is a cross-sectional view showing an example of the positioning portion. [Figure 12]FIG. 12 is a cross-sectional view showing another example of the positioning portion. [Figure 13] FIG. 13 is a cross-sectional view showing an example of a measurement mechanism included in the exchange mechanism. [Figure 14] FIG. 14 is a functional block diagram showing components of the control units of the grinding device and the exchanging device according to one embodiment. [Figure 15] FIG. 15 is a cross-sectional view showing a grinding device and an exchanging device according to a first modified example. [Figure 16] FIG. 16 is a cross-sectional view showing a grinding device and an exchanging device according to a second modified example. [Figure 17] FIG. 17 is a cross-sectional view showing a grinding device and an exchanging device according to a third modified example. [Figure 18] FIG. 18 is a plan view showing an example of an exchange device including a storage unit. DETAILED DESCRIPTION OF THE INVENTION

[0008] Hereinafter, embodiments of the present disclosure will be described with reference to the drawings. In each drawing, the same or corresponding components are denoted by the same reference numerals, and their description may be omitted. In this specification, the X-axis, Y-axis, and Z-axis directions are perpendicular to each other. The X-axis and Y-axis directions are horizontal directions, and the Z-axis direction is vertical.

[0009] 1, a room in a factory is equipped with, for example, a grinding system 1 for grinding a substrate W, an exchange device 7 for exchanging a chuck 42, a storage facility 8 for storing the exchange device 7, and a storage unit 9 for storing the chuck 42. The factory may be, for example, a semiconductor factory, and the room may be, for example, a clean room. In this embodiment, the substrate W corresponds to the processing body recited in the claims, and the chuck 42 corresponds to the holder recited in the claims.

[0010] The substrate W includes a semiconductor substrate such as a silicon wafer or a compound semiconductor wafer, or a glass substrate. The substrate W may further include a device layer formed on the surface of the semiconductor substrate or the glass substrate. The device layer includes an electronic circuit. The substrate W may also be a laminated substrate formed by bonding multiple substrates.

[0011] A plurality of grinding systems 1 may be arranged in a factory room as shown in Fig. 1, or only one may be arranged. The chuck 42 is replaced by an exchange device 7 at a desired timing. Since the chuck 42 is heavy (for example, about 10 kg), if the exchange device 7 replaces the chuck 42 instead of a human, the burden on the human can be reduced. The work of replacing the chuck 42 includes the work of removing and carrying out the used chuck 42, and the work of carrying in and installing the unused chuck 42.

[0012] The storage unit 9 stores the chucks 42. In this embodiment, the used chucks 42 and the unused chucks 42 are stored in the same storage unit 9, but they may also be stored in separate storage units 9. The storage unit 9 is provided outside the grinding system 1. This makes it possible to reduce the size of the grinding system 1. Because the storage unit 9 is provided outside the grinding system 1, a self-propelled robot is used as the exchange device 7, unlike when the storage unit 9 is provided inside the grinding system 1.

[0013] The replacement device 7 waits in the storage 8 until it receives a replacement command for the chuck 42. When the replacement device 7 receives the replacement command, it travels, for example, to the grinding system 1 and removes the used chuck 42 from the grinding system 1. Next, the replacement device 7 travels to the storage unit 9 while holding the removed used chuck 42, and places the used chuck 42 in the storage unit 9. Thereafter, the replacement device 7 obtains an unused chuck 42 from the storage unit 9, and travels to the grinding system 1 while holding the obtained unused chuck 42, and attaches the unused chuck 42 to the grinding system 1. Finally, the replacement device 7 returns to the storage 8 and waits.

[0014] Alternatively, when the exchange device 7 receives an exchange command, it first travels to the storage unit 9, acquires an unused chuck 42 there, and travels to the grinding system 1 while holding the acquired unused chuck 42. Next, the exchange device 7 removes the used chuck 42 from the grinding system 1. Subsequently, the exchange device 7 attaches the unused chuck 42 to the grinding system 1. Thereafter, the exchange device 7 travels to the storage unit 9 while holding the removed used chuck 42, and places the used chuck 42 in the storage unit 9. Finally, the exchange device 7 returns to the storage shed 8 and waits.

[0015] The storage unit 9 is common to a plurality of grinding systems 1. Compared to the case where a storage unit 9 is provided for each grinding system 1, the number of storage units 9 installed can be reduced.

[0016] 2, the storage unit 9 may be provided for each grinding system 1. In this case, the storage unit 9 can be installed closer to the grinding system 1 than when the storage unit 9 is common to multiple grinding systems 1.

[0017] 1 and 2 is provided separately from the exchange device 7, but the exchange device 7 may also be provided with the storage unit 9 as shown in FIG. 18. The storage unit 9 of the exchange device 7 travels together with the traveling platform 73 of the exchange device 7. In this case, the traveling distance of the exchange device 7 can be shortened. The storage unit 9 of the exchange device 7 temporarily stores the chucks 42 that are transported between the storage unit 9 (see FIG. 1 or 2) fixed to the outside of the exchange device 7 and the grinding device 40 of the grinding system 1.

[0018] Next, the grinding system 1 will be described with reference to Fig. 3. The grinding system 1 includes a carry-in / out unit 2, a cleaning unit 3, a grinding unit 4, and a control unit 5. The carry-in / out unit 2, the cleaning unit 3, and the grinding unit 4 are arranged in this order from the negative side in the X-axis direction to the positive side in the X-axis direction.

[0019] The loading / unloading section 2 has a mounting table 21 on which a cassette C is placed. The cassette C stores a plurality of substrates W spaced apart in the vertical direction. The mounting table 21 includes a plurality of mounting plates 22 arranged in a row in the Y-axis direction. A cassette C is placed on each of the plurality of mounting plates 22. The number of mounting plates 22 is not particularly limited. Similarly, the number of cassettes C is not particularly limited.

[0020] The loader / unloader 2 also has a first transfer region 23. In plan view, the first transfer region 23 is disposed adjacent to the mounting table 21 and a transition device 35 (described later) so as to be sandwiched between the mounting table 21 and the transition device 35. The loader / unloader 2 has a first transfer device 24 that transfers the substrate W in the first transfer region 23. The first transfer device 24 transfers the substrate W between multiple devices disposed adjacent to the first transfer region 23. The first transfer device 24 includes a first transfer arm 24a that holds the substrate W. The first transfer arm 24a is capable of moving in the horizontal direction (both in the X-axis direction and the Y-axis direction) and the vertical direction, and of rotating about a vertical axis. The number of first transfer arms 24a may be one or more.

[0021] The cleaning section 3 has a first cleaning device 31. The first cleaning device 31 scrubs and washes the substrate W after it has been ground by the grinding device 40, which will be described later. The first cleaning device 31 includes a cleaning body such as a sponge or a brush, and removes particles such as grinding dust with the cleaning body.

[0022] The cleaning section 3 also has a second cleaning device 32. The second cleaning device 32 etches the substrate W with a chemical solution after it has been ground by the grinding device 40. The second cleaning device 32 includes a spin chuck that holds the substrate W and a nozzle that discharges the chemical solution. The nozzle supplies the chemical solution to the center of the upper surface of the rotating substrate W.

[0023] The cleaning section 3 may further include a third cleaning device 33. Unlike the first cleaning device 31 and the second cleaning device 32, the third cleaning device 33 cleans the substrate W before it is ground by the grinding device 40. Like the first cleaning device 31, the third cleaning device 33 scrubs the substrate W. This can prevent foreign matter from getting caught between the chuck 42 of the grinding device 40 and the substrate W, allowing the substrate W to be ground flat.

[0024] The cleaning unit 3 has a detection device 34. The detection device 34 detects the center of the substrate W before it is ground by the grinding device 40. In a plan view, the detection device 34 can align the center of the substrate W with the center of the chuck 42 of the grinding device 40. In addition to the center of the substrate W, the detection device 34 may also detect the crystal orientation of the substrate W; specifically, it may detect a notch or orientation flat that indicates the crystal orientation of the substrate W. In a rotating coordinate system that rotates together with the chuck 42, the detection device 34 can align the crystal orientation of the substrate W to a desired orientation.

[0025] The first cleaning device 31, the third cleaning device 33, and the detection device 34 may be stacked in the vertical direction to reduce the installation area of ​​the grinding system 1. For example, the detection device 34, the first cleaning device 31, and the third cleaning device 33 are arranged in this order from bottom to top. However, the order is not particularly limited.

[0026] The cleaning section 3 has a transition device 35. The transition device 35 temporarily accommodates the substrate W. A plurality of transition devices 35 may be stacked vertically. The arrangement and number of the transition devices 35 are not particularly limited.

[0027] The cleaning unit 3 has a second transfer region 36. In plan view, the second transfer region 36 is arranged adjacent to the first cleaning apparatus 31, the second cleaning apparatus 32, and the transition device 35, and is surrounded on three sides by the first cleaning apparatus 31, the second cleaning apparatus 32, and the transition device 35. The cleaning unit 3 has a second transfer device 37 that transfers the substrate W in the second transfer region 36. The second transfer device 37 transfers the substrate W between multiple devices arranged adjacent to the second transfer region 36. The second transfer device 37 includes a second transfer arm 37a that holds the substrate W. The second transfer arm 37a is capable of moving in the horizontal direction (both in the X-axis direction and the Y-axis direction) and the vertical direction, and of rotating about a vertical axis. The number of second transfer arms 37a may be one or more.

[0028] The cleaning unit 3 has a rectangular shape with corners cut out in a plan view, and the third transfer region 38 is disposed in the cut-out position. In a plan view, the third transfer region 38 is disposed adjacent to the second transfer region 36, the first cleaning device 31, and the grinding device 40, and is surrounded on three sides by the second transfer region 36, the first cleaning device 31, and the grinding device 40. The third transfer region 38 may be provided inside a housing that covers both the cleaning unit 3 and the third transfer region 38, or may be provided inside a housing separate from the housing that covers the cleaning unit 3 and connected to the cleaning unit 3.

[0029] The grinding system 1 includes a third transfer device 39 that transfers the substrate W in a third transfer region 38. The third transfer device 39 transfers the substrate W between a plurality of devices arranged adjacent to the third transfer region 38. The third transfer device 39 includes a suction pad 39a that holds the substrate W. The suction pad 39a adsorbs the substrate W from above. The suction pad 39a is capable of moving in the horizontal direction (both in the X-axis direction and the Y-axis direction) and the vertical direction, and of rotating about a vertical axis.

[0030] The grinding section 4 includes a grinding device 40. The grinding device 40 grinds the substrate W. The grinding includes polishing. The grinding device 40 includes, for example, a table 41, four chucks 42, and three processing sections 43.

[0031] The table 41 holds four chucks 42 at equal intervals around a rotation center line R1 and rotates around the rotation center line R1. Each of the four chucks 42 rotates together with the table 41 and moves to a carry-in / out position A0, a primary grinding position A1, a secondary grinding position A2, a tertiary grinding position A3, and the carry-in / out position A0 in this order.

[0032] The loading / unloading position A0 serves as both a position where the substrate W is loaded and a position where the substrate W is unloaded. In this embodiment, the loading position and the unloading position are the same position, but they may be different positions. The primary grinding position A1 is a position where primary grinding of the substrate W is performed. The secondary grinding position A2 is a position where secondary grinding of the substrate W is performed. The tertiary grinding position A3 is a position where tertiary grinding of the substrate W is performed.

[0033] The four chucks 42 are attached to the table 41 so as to be rotatable about their respective rotation center lines R2 (see FIG. 4). At the primary grinding position A1, the secondary grinding position A2, and the tertiary grinding position A3, the chucks 42 rotate about their respective rotation center lines R2.

[0034] One processing section 43 performs primary grinding of the substrate W at a primary grinding position A1. Another processing section 43 performs secondary grinding of the substrate W at a secondary grinding position A2. The remaining processing section 43 performs tertiary grinding of the substrate W at a tertiary grinding position A3.

[0035] The number of processing sections 43 may be one or more. The number of chucks 42 may be greater than the number of processing sections 43. However, the table 41 may not be present. If the table 41 is not present, the number of chucks 42 may be the same as the number of processing sections 43, or may be one.

[0036] The control unit 5 is, for example, a computer, and includes a CPU (Central Processing Unit) 51 and a storage medium 52 such as a memory. The storage medium 52 stores programs that control various processes executed in the grinding system 1. The control unit 5 controls the operation of the grinding system 1 by causing the CPU 51 to execute the programs stored in the storage medium 52.

[0037] Next, a description will be given of the operation of the grinding system 1. The following operation is performed under the control of the control unit 5.

[0038] First, the first transfer device 24 takes out the substrate W from the cassette C and transfers it to the transition device 35. Subsequently, the second transfer device 37 transfers the substrate W from the transition device 35 to the third cleaning device 33.

[0039] Next, the third cleaning device 33 cleans the substrate W before it is ground by the grinding device 40. The clean substrate W can be placed on the chuck 42 of the grinding device 40, which prevents foreign matter from getting caught. Therefore, the substrate W can be ground flat and the thickness deviation of the substrate W can be prevented from worsening. After the substrate W is dried, the second transport device 37 transports the substrate W from the third cleaning device 33 to the detection device 34.

[0040] It should be noted that the third cleaning device 33 may be omitted if the unground substrate W is clean or if the grinding device 40 has a mechanism for cleaning the unground substrate W. In this case, the second transport device 37 transports the substrate W from the transition device 35 to the detection device 34.

[0041] Next, the detection device 34 detects the center of the substrate W. The detection device 34 may also detect the crystal orientation of the substrate W, and more specifically, may also detect a notch or the like. Thereafter, the third transfer device 39 transfers the substrate W from the detection device 34 to the chuck 42 of the grinding device 40. During this time, the control unit 5 controls the third transfer device 39 based on the detection result of the detection device 34 to align the center of the chuck 42 with the center of the substrate W. The control unit 5 also controls the third transfer device 39 based on the detection result of the detection device 34 to align the crystal orientation of the substrate W with a desired orientation in a rotating coordinate system that rotates together with the chuck 42.

[0042] Next, the grinding device 40 grinds the upper surface of the substrate W. The substrate W rotates together with the table 41 and moves to the load / unload position A0, the first grinding position A1, the second grinding position A2, the third grinding position A3, and the load / unload position A0 in this order. During this time, the first grinding, the second grinding, and the third grinding are performed. Thereafter, the third transfer device 39 transfers the substrate W from the chuck 42 to the first cleaning device 31.

[0043] Next, the first cleaning device 31 cleans the upper surface of the substrate W to remove particles such as grinding debris. After the substrate W is dried, the second transfer device 37 transfers the substrate W from the first cleaning device 31 to the second cleaning device 32.

[0044] Next, the second cleaning device 32 etches the upper surface of the substrate W to remove grinding marks. After the substrate W is dried, the second transfer device 37 transfers the substrate W from the second cleaning device 32 to the transition device 35. Then, the first transfer device 24 transfers the substrate W from the transition device 35 to the cassette C. The substrate W is stored in the cassette C.

[0045] Next, the grinding apparatus 40 will be described mainly with reference to Fig. 4. The grinding apparatus 40 includes a processing section 43. The processing section 43 processes the substrate W held by the chuck 42. Processing the substrate W includes, for example, grinding the substrate W. The processing section 43 includes, for example, a flange 43a to which a grinding tool D is attached, a spindle shaft 43b on the lower end of which the flange 43a is provided, and a spindle motor 43c that rotates the spindle shaft 43b.

[0046] The flange 43a is disposed horizontally, and a grinding tool D is attached to its underside. The grinding tool D includes, for example, a disk-shaped grinding wheel D1 and a plurality of grindstones D2 arranged in a ring shape on the underside of the grinding wheel D1. The spindle shaft 43b is disposed vertically. The spindle motor 43c rotates the spindle shaft 43b, thereby rotating the grinding tool D about a rotation center line R3. The processing unit 43 raises and lowers the spindle motor 43c, thereby raising and lowering the grinding tool D.

[0047] The processing unit 43 rotates the grinding tool D about the rotation center line R3, while lowering the grinding tool D to bring it into contact with the upper surface of the substrate W. At this time, the substrate W is rotated about another rotation center line R2. The grinding tool D grinds the entire upper surface of the substrate W. When the thickness of the substrate W reaches a set value, the processing unit 43 stops the lowering of the grinding tool D. Thereafter, the processing unit 43 raises the grinding tool D.

[0048] The chuck 42 holds the substrate W from below. Although not shown, the suction surface of the chuck 42 that suctions the substrate W, i.e., the upper surface of the chuck 42, may be a conical surface that is symmetrical about the rotation center line R2 of the chuck 42. The thickness distribution of the substrate W in the radial direction can be adjusted by adjusting the tilt angle of the rotation center line R2 of the chuck 42 using a chuck tilt adjustment mechanism (not shown). The chuck motor 82 rotates the chuck 42, thereby rotating the substrate W.

[0049] The chuck 42 includes, for example, a porous body 42a that vacuum-sucks the substrate W, a holder 42b that holds the porous body 42a, and a flange 42c provided on the lower edge of the holder 42b. The chuck 42 is replaceably attached to a mounting base 49. The fastener that fastens the chuck 42 to the mounting base 49 is not particularly limited, but is, for example, a bolt 81.

[0050] As shown in Fig. 5, a plurality of bolts 81 are provided at intervals around the periphery of the chuck 42. As shown in Fig. 4, the shaft 81a of the bolt 81 passes through a through-hole in the flange 42c of the chuck 42 and is screwed into a bolt hole in the mounting base 49. The head 81b of the bolt 81 presses the flange 42c of the chuck 42 from above. The chuck 42 can be replaced by loosening and tightening the bolt 81.

[0051] After the chuck 42 is attached to the mounting base 49, the processing unit 43 grinds the chuck 42 to adjust the shape of the chucking surface of the chuck 42 before grinding the substrate W. The grinding tool for grinding the chuck 42 may be prepared separately from the grinding tool D for grinding the substrate W. The processing unit 43 may grind the chuck 42 to remove dirt and the like attached to the chuck 42 between repeated grindings of the substrate W. When the total grinding amount of the chuck 42 reaches a set amount, the chuck 42 is replaced.

[0052] Next, the attachment and detachment of the chuck 42 to the mounting base 49 will be described mainly with reference to FIGS. 6 to 13. As shown in FIG. 6, the grinding device 40 has an exterior cover 44. The exterior cover 44 houses the chuck 42, the mounting base 49, and the processing section 43 (see FIG. 4). The exterior cover 44 may also house the table 41 and the like. The exterior cover 44 prevents particles such as grinding chips generated inside from flowing out to the outside, thereby keeping the factory room clean.

[0053] The exterior cover 44 has an entrance 44a through which the replacement device 7 passes when entering from the outside to the inside of the exterior cover 44. The replacement device 7 enters the interior of the exterior cover 44 from the outside instead of a person, and replaces the chuck 42 inside the exterior cover 44.

[0054] Since the replacement device 7 enters the interior of the exterior cover 44 instead of a person to replace the chuck 42, it is possible to prevent the person from becoming dirty with the deposits inside the exterior cover 44. Furthermore, since the replacement device 7 is provided outside the grinding device 40, the grinding device 40 can be made smaller than when the replacement device 7 is provided inside the grinding device 40.

[0055] The grinding device 40 is provided with a shutter 45 that opens and closes the entrance 44a of the exterior cover 44. The shutter 45 basically closes the entrance 44a, and opens the entrance 44a when the exchange device 7 enters. Compared to when the entrance 44a is always open, this can suppress the outflow of particles from the inside to the outside of the exterior cover 44 through the entrance 44a, and the factory room can be kept clean.

[0056] The grinding device 40 may include a movement mechanism 46 that moves the shutter 45 between an open position (for example, the position shown in FIG. 6) that opens the entrance 44a and a closed position that closes the entrance 44a. The movement mechanism 46 is a pneumatic cylinder, an electric cylinder, or the like. The electric cylinder includes a motor and a ball screw. The shutter 45 can be moved automatically rather than manually.

[0057] The entrance 44a and shutter 45 of the exterior cover 44 are provided, for example, at the loading / unloading position A0. The loading / unloading position A0 is a position where the substrate W is loaded and unloaded. The processing section 43 that grinds the substrate W is not present at the loading / unloading position A0. This makes it easy to replace the chuck 42. The replacement of the chuck 42 includes removing and unloading a used chuck 42, and loading and attaching an unused chuck 42.

[0058] The grinding device 40 may include a limiting mechanism 47. The limiting mechanism 47 limits the outflow of gas from the inside to the outside of the exterior cover 44 through the inlet 44a of the exterior cover 44. By limiting the outflow of gas, the outflow of particles can be suppressed, and the factory room can be kept clean.

[0059] For example, the restriction mechanism 47 includes an exhaust line 47a that creates a negative pressure inside the exterior cover 44 compared to the outside. The exhaust line 47a is a duct or the like, and connects the exterior cover 44 to an exhaust source. The exhaust source is, for example, a vacuum pump or an ejector. An air pressure controller 47b, for example, is provided midway along the exhaust line 47a. The air pressure controller 47b controls the air pressure inside the exterior cover 44. The difference in air pressure creates an airflow that flows from the inlet 44a of the exterior cover 44 toward the inside. As a result, the outflow of gas from the inside of the exterior cover 44 to the outside can be restricted.

[0060] Although the connection port of the exhaust line 47a with the exterior cover 44 is shown above the inlet 44a of the exterior cover 44 in FIG. 6, it may be below. In the latter case, a downflow can be formed inside the exterior cover 44. A blower such as a fan filter unit may be provided on the ceiling of the exterior cover 44. The amount of air blown and the amount of air exhausted are controlled so as to create a negative pressure inside the exterior cover 44 compared to the outside.

[0061] The grinding device 40 may include a cleaning mechanism 48. The cleaning mechanism 48 supplies a cleaning liquid to the chuck 42 or the peripheral members of the chuck 42 using a nozzle or the like. The cleaning liquid is, for example, DIW (deionized water). The peripheral members of the chuck 42 are, for example, a mounting base 49. The cleaning mechanism 48 cleans the chuck 42 and the like before removing the used chuck 42 from the mounting base 49. This makes it possible to prevent the replacement device 7 from becoming dirty. Furthermore, cleaning the chuck 42 using the cleaning mechanism 48 makes it possible to prevent particles from being carried out together with the chuck 42.

[0062] The grinding device 40 includes a control unit 50. The control unit 50 is, for example, a computer, and includes a CPU 50a and a storage medium 50b such as a memory. The storage medium 50b stores programs that control various processes executed by the grinding device 40. The control unit 50 controls the operation of the grinding device 40 by having the CPU 50a execute the programs stored in the storage medium 50b. The control unit 50 of the grinding device 40 may be part of the control unit 5 of the grinding system 1.

[0063] The exchange device 7 includes, for example, an exchange mechanism 71, a moving mechanism 72, a running platform 73, and a running mechanism 74. The exchange mechanism 71 attaches the chuck 42 to the mounting platform 49 or removes the chuck 42 from the mounting platform 49. The exchange mechanism 71 is capable of moving in the horizontal direction (both the X-axis direction and the Y-axis direction) and the vertical direction, and of rotating about the vertical axis. The moving mechanism 72 moves the exchange mechanism 71 from the outside to the inside of the exterior cover 44 through the entrance 44a of the exterior cover 44. The moving mechanism 72 is, for example, an articulated arm, and holds the exchange mechanism 71 at one end and is connected to the running platform 73 at the other end. The running platform 73 supports the moving mechanism 72. The running mechanism 74 moves the running platform 73.

[0064] Since the replacement device 7 is provided outside the grinding device 40, a self-propelled robot is used as the replacement device 7, unlike when the replacement device 7 is provided inside the grinding device 40. The replacement device 7 replaces the chuck 42 instead of a human. This prevents the human from getting dirty. Furthermore, since the replacement device 7 is provided outside the grinding device 40, the grinding device 40 can be made smaller than when the replacement device 7 is provided inside the grinding device 40.

[0065] 7, the replacement mechanism 71 has an operation mechanism 71a that tightens or loosens a fastener that fastens the chuck 42 to the mounting base 49. When the fastener is a bolt 81, the operation mechanism 71a is made up of a tool such as a spanner or wrench that fits onto the bolt 81 and a rotation mechanism that turns the tool.

[0066] The replacement mechanism 71 may have a rotation prevention mechanism 71b that stops the rotation of the mounting base 49. The rotation prevention mechanism 71b includes, for example, a clamp that grips the mounting base 49 or a pin that is inserted into a hole in the mounting base 49. With the rotation of the mounting base 49 stopped by the rotation prevention mechanism 71b, the fastener can be tightened or loosened.

[0067] The replacement mechanism 71 may have a rotation mechanism 71c that rotates the mounting base 49. The rotation mechanism 71c includes, for example, a holder that grips the mounting base 49 and a motor that rotates the holder about the rotation center line R2. When multiple fasteners are present on a rotational orbit centered on the rotation center line R2, the multiple fasteners can be sequentially positioned directly below the operation mechanism 71a.

[0068] As shown in Fig. 8, the mounting base 49 may have a mounting surface 49a on which the chuck 42 is mounted, and an injection port 49b for injecting a fluid is provided. The fluid may be a liquid such as water or a gas such as air. The injection pressure of the fluid can separate the mounting base 49 and the chuck 42. This is effective when the chuck 42 is stuck to the mounting base 49, as the grinding fluid supplied to the substrate W during grinding enters between the chuck 42 and the mounting base 49 and forms a liquid film.

[0069] As shown in FIG. 9, the replacement mechanism 71 has, for example, a pair of arms 71d that grip the chuck 42. The pair of arms 71d are arranged symmetrically about the rotation center line R2 of the chuck 42 and can move toward or away from each other in a direction perpendicular to the rotation center line R2. Each of the pair of arms 71d has, for example, a claw portion 711d that is inserted between the mounting base 49 and the chuck 42. The claw portion 711d is inserted into a gap formed by the injection pressure of the fluid. Thereafter, the injection of the fluid is stopped. The claw portion 711d holds the chuck 42 from below.

[0070] 10, each of the pair of arms 71d may have a bifurcated fork portion 712d that is hooked onto the bolt 81. The fork portion 712d is inserted, for example, into the gap between the head portion 81b of the bolt 81 and the flange 42c of the chuck 42 to sandwich the shank 81a of the bolt 81 and hold the head 81b of the bolt 81 from below. When the fork portion 712d is hooked onto the bolt 81, ejection of the fluid begins. Instead of the bolt 81, a dedicated bolt for hooking the fork portion 712d may be provided.

[0071] The chuck 42 may be peeled off from the mounting base 49 only by the driving force of the arm 71d, without using the injection pressure of the fluid.

[0072] 11, a plurality of positioning portions 83 (only one is shown in FIG. 11) may be provided to determine the position of the chuck 42 relative to the mounting base 49. The positioning portion 83 includes, for example, a positioning pin 83a and a positioning hole 83b that fits into the positioning pin 83a. The positioning pin 83a is provided on the upper surface of the mounting base 49, and the positioning hole 83b is provided on the lower surface of the chuck 42. The tip of the positioning pin 83a may have a tapered shape.

[0073] When attaching the chuck 42 to the mounting base 49, the position of the chuck 42 relative to the mounting base 49 is determined by fitting the positioning pin 83a into the positioning hole 83b. Therefore, the task of adjusting the position of the chuck 42 relative to the mounting base 49, specifically the task of aligning the center of the chuck 42 with the center of the mounting base 49, is not required.

[0074] The positions of the positioning pins 83a and the positioning holes 83b may be reversed. That is, the positioning pins 83a may be provided on the lower surface of the chuck 42, and the positioning holes 83b may be provided on the upper surface of the mounting base 49.

[0075] 12, the positioning portion 83 may include a tapered screw 83c and tapered screw holes 83d and 83e into which the tapered screw 83c is screwed. The tapered screw hole 83d is formed in, for example, the flange 42c of the chuck 42, and another tapered screw hole 83e is formed in the upper surface of the mounting base 49.

[0076] When attaching the chuck 42 to the mounting base 49, the tapered screw 83c is screwed into the tapered screw holes 83d and 83e, thereby correcting the position of the chuck 42 with respect to the mounting base 49. Therefore, the task of adjusting the position of the chuck 42 with respect to the mounting base 49, specifically the task of aligning the center of the chuck 42 with the center of the mounting base 49, becomes unnecessary.

[0077] If the chuck 42 sticks to the mounting base 49 and does not move when the tapered screw 83c is screwed into the tapered screw holes 83d and 83e, the injection port 49b of the mounting base 49 may inject a fluid. The injection pressure of the fluid can separate the mounting base 49 and the chuck 42. Thereafter, the position of the chuck 42 relative to the mounting base 49 is corrected by screwing the tapered screw 83c into the tapered screw holes 83d and 83e.

[0078] After the position of the chuck 42 relative to the mounting base 49 is determined by the positioning portion 83, the chuck 42 is fastened to the mounting base 49 by the bolt 81. If the positioning portion 83 includes a tapered screw 83c, the tapered screw 83c may be removed after the position of the chuck 42 relative to the mounting base 49 is determined.

[0079] 13, the replacement mechanism 71 may have a measurement mechanism 7e1 that measures the positional deviation of the chuck 42 relative to the mounting base 49. The measurement mechanism 71e measures, for example, the positional deviation of the center of the chuck 42 relative to the center of the mounting base 49. If the positional deviation measured by the measurement mechanism 71e is outside the tolerance range, the position of the chuck 42 relative to the mounting base 49 is corrected so that the positional deviation falls within the tolerance range.

[0080] The measuring mechanism 71e includes, for example, a probe that is pressed against the outer peripheral surface of the chuck 42, a guide that guides the probe, and a sensor that measures the displacement of the probe. From the displacement of the probe when the mount 49 is rotated, the positional deviation of the center of the chuck 42 from the center of the mount 49 can be measured. Note that although the measuring mechanism 71e is of a contact type in this embodiment, it may also be of a non-contact type.

[0081] As shown in FIG. 1 etc., a plurality of pairs of replacement mechanism 71 and moving mechanism 72 may be provided and controlled independently. One pair is used for attaching chuck 42, and another pair is used for removing chuck 42. Unlike when there is only one pair of replacement mechanism 71 and moving mechanism 72, if there are a plurality of pairs, the chuck 42 can be quickly removed and attached in succession. In other words, the replacement device 7 does not need to go back and forth between the grinding device 40 and the storage unit 9 between the removal and attachment of chuck 42.

[0082] Furthermore, if the storage section 9 of the replacement device 7 (see Figure 18) stores both used and unused chucks 42, the chucks 42 can be removed and installed quickly in succession even if there is only one replacement mechanism 71 and one moving mechanism 72.

[0083] 6, the replacement device 7 may include an imaging device 75 that captures an image of the replacement mechanism 71. The imaging device 75 is attached to one end of the moving mechanism 72, similar to the replacement mechanism 71. The replacement mechanism 71 can be controlled while monitoring the operation of the replacement mechanism 71 with the imaging device 75. For example, when the chuck 42 is placed on the mounting base 49, the bolt holes of the mounting base 49 can be aligned with the through holes in the flange 42c of the chuck 42.

[0084] The exchange device 7 includes a control unit 76. The control unit 76 is, for example, a computer, and includes a CPU 76a and a storage medium 76b such as a memory. The storage medium 76b stores programs that control various processes executed in the exchange device 7. The control unit 76 controls the operation of the exchange device 7 by having the CPU 76a execute the programs stored in the storage medium 76b.

[0085] Next, the functions of the control unit 50 of the grinding device 40 and the control unit 76 of the exchange device 7 will be described with reference to FIG. 14. Note that each functional block shown in FIG. 14 is conceptual and does not necessarily have to be physically configured as shown. All or part of each functional block can be configured by functionally or physically distributing or integrating in any unit. All or any part of each processing function performed by each functional block can be realized by a program executed by a CPU, or can be realized as hardware using wired logic.

[0086] First, we will explain the functions of the control unit 50 of the grinding device 40. The control unit 50 has, for example, a replacement command creation unit 50c, a position detection unit 50d, an opening / closing control unit 50e, a negative pressure control unit 50f, a cleaning control unit 50g, an auto-setup control unit 50h, and a blow control unit 50i.

[0087] The replacement command creation unit 50c determines whether the chuck 42 needs to be replaced and creates a replacement command for the chuck 42. Specifically, the replacement command creation unit 50c monitors, for example, the total grinding amount of the chuck 42 or the elapsed time since the chuck 42 was attached, and creates a replacement command when the monitored value reaches a set value. The created replacement command is transmitted wirelessly or via a cable to the control unit 76 of the replacement device 7. The replacement device 7 and the grinding device 40 may send and receive signals via an external computer. When the replacement device 7 receives the replacement command and a request from the grinding device 40, it travels to the grinding device 40.

[0088] The position detection unit 50d detects, by the detection unit 53, whether the running platform 73 of the exchange device 7 has arrived at a position where the chuck 42 is to be exchanged (for example, the position shown in FIG. 6). The position where the chuck 42 is to be exchanged is set outside the exterior cover 44, and serves as both a position where the chuck 42 is attached and a position where the chuck 42 is removed. The detection unit 53 (see FIG. 6) detects, for example, that the running platform 73 of the exchange device 7 has arrived at a set position outside the exterior cover 44. The detection unit 53 is attached, for example, to the outer wall surface of the exterior cover 44, above the entrance 44a. The detection unit 53 is, for example, a camera or the like.

[0089] The opening / closing control unit 50e controls the moving mechanism 46 of the shutter 45 to control the position of the shutter 45. When the traveling platform 73 of the exchange device 7 arrives at the position where the chuck 42 is replaced, the opening / closing control unit 50e changes the position of the shutter 45 from the closed position to the open position. Also, when the traveling platform 73 of the exchange device 7 leaves the position where the chuck 42 is replaced, the opening / closing control unit 50e changes the position of the shutter 45 from the open position to the closed position.

[0090] The negative pressure control unit 50f controls the air pressure controller 47b of the exhaust line 47a to make the pressure inside the exterior cover 44 negative compared to the outside. The negative pressure control unit 50f makes the pressure inside the exterior cover 44 negative compared to the outside at least while the shutter 45 opens the entrance 44a of the exterior cover 44.

[0091] Before the shutter 45 opens the entrance 44a of the exterior cover 44, the cleaning control unit 50g controls the cleaning mechanism 48 to supply cleaning liquid to the chuck 42 or the peripheral components of the chuck 42. The supply of cleaning liquid is performed, for example, after issuing a command to replace the chuck 42. Note that the supply of cleaning liquid may also be performed during grinding of the substrate W or at the end of grinding.

[0092] The auto-setup control unit 50h performs auto-setup when the replacement of the chuck 42 is completed and the replacement device 7 leaves the position where the chuck 42 was replaced. The auto-setup includes, for example, grinding of the unused chuck 42 by the processing unit 43 or temperature adjustment inside the exterior cover 44.

[0093] The blow control unit 50i controls the injection of fluid from the injection port 49b of the mounting base 49. For example, the blow control unit 50i controls the injection of fluid from the injection port 49b of the mounting base 49 when removing the chuck 42 from the mounting base 49. Furthermore, the blow control unit 50i may control the injection of fluid from the injection port 49b of the mounting base 49 to correct the position of the chuck 42 when attaching the chuck 42 to the mounting base 49.

[0094] Next, a description will be given of the functions of the control unit 76 of the exchange device 7. The control unit 76 has, for example, a travel control unit 76c, a movement control unit 76d, and an exchange control unit 76e.

[0095] The travel control unit 76c controls the travel mechanism 74 to control the position of the travel platform 73. For example, the travel control unit 76c controls the travel mechanism 74 to cause the travel platform 73 to travel between a position where the chuck 42 is stored and a position where the chuck 42 is replaced.

[0096] The movement control unit 76d controls the movement mechanism 72 and controls the position of the replacement mechanism 71. When the replacement device 7 detects from a signal or the like transmitted from the grinding device 40 that the traveling platform 73 has stopped at the position where the chuck 42 is replaced and the entrance 44a of the exterior cover 44 is open, the movement control unit 76d moves the replacement mechanism 71 from the outside to the inside of the exterior cover 44 through the entrance 44a of the exterior cover 44. Furthermore, before the traveling platform 73 leaves the position where the chuck 42 is replaced, the movement control unit 76d moves the replacement mechanism 71 from the inside to the outside of the exterior cover 44 through the entrance 44a of the exterior cover 44.

[0097] The replacement control unit 76e controls the replacement mechanism 71 and controls the removal or installation of the chuck 42. The replacement control unit 76e tightens or loosens the bolt 81 with the operation mechanism 71a while stopping the rotation of the mounting base 49 with the anti-rotation mechanism 71b. The replacement control unit 76e controls the replacement mechanism 71 while monitoring the operation of the replacement mechanism 71 with the imaging device 75.

[0098] Next, the operations of the grinding device 40 and the exchanging device 7 will be described together. The grinding device 40 determines whether the chuck 42 needs to be replaced and creates a command to replace the chuck 42. The grinding device 40 then transmits the created command to the exchanging device 7. Furthermore, when the grinding device 40 determines that the chuck 42 needs to be replaced, it stops grinding the substrate W and performs cleaning using the cleaning mechanism 48.

[0099] On the other hand, when the exchange device 7 receives an exchange command from the grinding device 40, it approaches the grinding device 40. When the grinding device 40 detects that the carriage 73 of the exchange device 7 has arrived at a position for exchanging the chuck 42, it opens the shutter 45. Thereafter, the exchange device 7 causes the exchange mechanism 71 to enter the interior through the entrance 44a of the exterior cover 44.

[0100] Next, the replacement mechanism 71 removes the used chuck 42 from the mount 49. Specifically, for example, with the rotation prevention mechanism 71b stopping the rotation of the mount 49, the operation mechanism 71a loosens the bolt 81. This operation is repeated while the rotation mechanism 71c rotates the mount 49, replacing the bolt 81 located directly below the operation mechanism 71a.

[0101] Next, the injection port 49b of the mounting base 49 injects fluid. The injection pressure of the fluid forms a gap between the chuck 42 and the mounting base 49, and the claw portion 711d of the arm 71d is inserted into the gap. Thereafter, the injection of the fluid is stopped. The claw portion 711d of the arm 71d holds the chuck 42 from below. The fork portion 712d of the arm 71d may be hooked onto the bolt 81.

[0102] Next, the moving mechanism 72 moves the arm 71d to carry the used chuck 42 from the inside to the outside of the exterior cover 44. Thereafter, the arm 71d stores the used chuck 42 in the storage unit 9 of the exchange device 7, and takes out an unused chuck 42 from the storage unit 9. Subsequently, the moving mechanism 72 moves the arm 71d to carry the unused chuck 42 from the outside to the inside of the exterior cover 44.

[0103] Next, the replacement mechanism 71 attaches an unused chuck 42 to the mounting base 49. Specifically, for example, the chuck 42 is placed on the mounting base 49 while the relative positions of the mounting base 49 and the chuck 42 are monitored by the imaging device 75. At this time, the position of the chuck 42 relative to the mounting base 49 may be corrected by fitting the positioning pin 83a into the positioning hole 83b.

[0104] Note that instead of or in addition to the positioning pin 83a and the positioning hole 83b, a tapered screw 83c and tapered screw holes 83d and 83e may be used to correct the position of the chuck 42 with respect to the mounting base 49. If the chuck 42 sticks to the mounting base 49 and does not move when the tapered screw 83c is screwed into the tapered screw holes 83d and 83e, the injection port 49b of the mounting base 49 may inject a fluid.

[0105] After the position of the chuck 42 relative to the mounting base 49 is determined by the positioning portion 83, the chuck 42 is fastened to the mounting base 49 by the bolt 81. With the rotation of the mounting base 49 stopped by the anti-rotation mechanism 71b, the bolt 81 is tightened by the operating mechanism 71a. This operation is repeated by rotating the mounting base 49 by the rotation mechanism 71c, while changing the bolt 81 located directly below the operating mechanism 71a.

[0106] Next, the measurement mechanism 71e measures the positional deviation of the chuck 42 relative to the mounting base 49. For example, the measurement mechanism 71e measures the positional deviation of the center of the chuck 42 relative to the center of the mounting base 49. If the positional deviation measured by the measurement mechanism 71e is outside the allowable range, the position of the chuck 42 is corrected using the arm 71d or the like so that the positional deviation falls within the allowable range.

[0107] Next, the replacement device 7 causes the replacement mechanism 71 to exit to the outside through the entrance 44a of the exterior cover 44. Subsequently, the grinding device 40 closes the shutter 45 and performs auto-setup control. The auto-setup control includes, for example, grinding of an unused chuck 42 by the processing unit 43. Grinding of the chuck 42 is performed, for example, at the tertiary grinding position A3, but may also be performed at the primary grinding position A1 or the secondary grinding position A2.

[0108] The processing unit 43 grinds the chuck 42 to adjust the shape of the chucking surface of the chuck 42. The grinding tool for grinding the chuck 42 may be prepared separately from the grinding tool D for grinding the substrate W. In this case, the replacement device 7 may replace not only the chuck 42 but also the grinding tool D before closing the shutter 45 to perform auto-setup control.

[0109] Thereafter, the grinding apparatus 40 resumes grinding of the substrate W. The grinding apparatus 40 may measure the thickness distribution of the substrate W that is ground for the first time after the replacement of the chuck 42, and change the tilt angle of the rotation center line R2 of the chuck 42 in accordance with the thickness distribution. The tilt angle is changed so as to reduce the variation in thickness of the substrate W.

[0110] Next, a grinding device 40 and an exchanging device 7 according to a first modified example will be described with reference to Fig. 15. Differences from the above embodiment will be mainly described below.

[0111] The limiting mechanism 47 of the grinding device 40 of this modified example has a sealing member 47c in addition to the exhaust line 47a. Note that the limiting mechanism 47 may have only the sealing member 47c. The sealing member 47c comes into contact with the articulated arm or the like of the exchange device 7 that has entered the entrance 44a of the exterior cover 44, and closes the entrance 44a of the exterior cover 44. The sealing member 47c limits the outflow of gas and suppresses the outflow of particles.

[0112] The seal member 47c is attached to, for example, the shutter 45, and moves together with the shutter 45. A pair of shutters 45 is provided, and the seal members 47c are attached to the opposing surfaces of the pair of shutters 45. The pair of seal members 47c sandwich and encase the exchange device 7, and close the entrance 44a of the exterior cover 44. The seal member 47c is made of a flexible material such as rubber, and deforms to follow the outer shape of the exchange device 7.

[0113] When the running platform 73 of the exchange device 7 reaches a set position outside the exterior cover 44, the opening / closing control unit 50e changes the position of the shutter 45 from the closed position to the open position. Thereafter, the movement control unit 76d moves the exchange mechanism 71 from the outside to the inside of the exterior cover 44 through the entrance 44a of the exterior cover 44. At this time, the seal member 47c does not come into contact with the exchange device 7.

[0114] Thereafter, the opening / closing control unit 50e changes the position of the shutter 45 from the open position to the sealed position (for example, the position shown in FIG. 15). The sealed position is a position where the sealing member 47c comes into contact with the articulated arm or the like of the exchange device 7 and blocks the entrance 44a of the exterior cover 44. With the entrance 44a blocked by the sealing member 47c, the exchange control unit 76e controls the exchange mechanism 71 to remove or attach the chuck 42.

[0115] When the removal or installation of the chuck 42 is completed, the opening / closing control unit 50e changes the position of the shutter 45 from the sealed position to the open position. Next, the movement control unit 76d moves the replacement mechanism 71 from the outside to the inside of the exterior cover 44 through the entrance 44a of the exterior cover 44. Thereafter, the travel control unit 76c controls the travel mechanism 74 to cause the travel platform 73 to travel from the position where the chuck 42 is replaced to the position where the chuck 42 is stored.

[0116] Next, a grinding device 40 and an exchanging device 7 according to a second modified example will be described with reference to Fig. 16. Below, differences from the above embodiment and the above first modified example will be mainly described.

[0117] The exterior cover 44 of the grinding device 40 of this modified example has a main housing 44b in which an entrance 44a is formed, and a sub-housing 44c attached to the outer wall surface of the main housing 44b so as to surround the entrance 44a of the main housing 44b. The main housing 44b houses the chuck 42, the mounting base 49, and the processing section 43 (see FIG. 4).

[0118] The sub-housing 44c includes a second entrance 44d through which the replacement device 7 passes when entering the inside of the sub-housing 44c from the outside. After arriving at a position where the replacement device 7 replaces the chuck 42, the replacement device 7 passes through the second entrance 44d and the entrance 44a in this order, enters the inside of the main housing 44b, and replaces the chuck 42 inside the main housing 44b.

[0119] The grinding device 40 is provided with a second shutter 61 that opens and closes the second entrance 44d of the sub-housing 44c. The second shutter 61 basically closes the second entrance 44d, and opens the second entrance 44d when the exchange device 7 enters. Compared to when the second entrance 44d is always open, this can suppress the outflow of particles from the inside to the outside of the exterior cover 44 through the second entrance 44d, and can keep the factory room clean.

[0120] The grinding device 40 may include a second movement mechanism 62 that moves the second shutter 61 between a second open position that opens the second entrance 44d and a second closed position that closes the second entrance 44d. The second movement mechanism 62 is a pneumatic cylinder, an electric cylinder, or the like. The second shutter 61 can be moved automatically rather than manually.

[0121] The control unit 50 of the grinding device 40 includes a second opening / closing control unit (not shown). The second opening / closing control unit controls the second moving mechanism 62 to control the position of the second shutter 61. When the running platform 73 of the exchange device 7 arrives at a position where the chuck 42 is to be replaced, the second opening / closing control unit changes the position of the second shutter 61 from the second closed position to the second open position. Furthermore, when the running platform 73 of the exchange device 7 leaves the position where the chuck 42 is to be replaced, the second opening / closing control unit changes the position of the second shutter 61 from the second open position to the second closed position.

[0122] The limiting mechanism 47 of the grinding device 40 may have a second seal member 47d. The second seal member 47d comes into contact with the articulated arm or the like of the exchange device 7 that has entered the second entrance 44d of the sub-housing 44c, and closes the second entrance 44d of the sub-housing 44c. The second seal member 47d limits the outflow of gas and suppresses the outflow of particles.

[0123] The second seal member 47d is attached to, for example, the second shutter 61 and moves together with the second shutter 61. A pair of second shutters 61 is provided, and the second seal members 47d are attached to the opposing surfaces of the pair of second shutters 61. The pair of second seal members 47d sandwich and encase the exchange device 7, and close the second entrance 44d of the exterior cover 44. The second seal member 47d is made of a flexible material such as rubber, and deforms to follow the outer shape of the exchange device 7.

[0124] When the running platform 73 of the exchange device 7 reaches a set position outside the exterior cover 44, the second opening / closing control unit changes the position of the second shutter 61 from the second closed position to the second open position. Thereafter, the movement control unit 76d moves the exchange mechanism 71 from the outside to the inside of the sub-housing 44c through the second entrance 44d of the sub-housing 44c. At this time, the second seal member 47d does not come into contact with the exchange device 7.

[0125] Thereafter, the second opening / closing control unit changes the position of the second shutter 61 from the second open position to the second sealing position (for example, the position shown in FIG. 16). The second sealing position is a position where the second sealing member 47d comes into contact with the articulated arm or the like of the exchange device 7 and blocks the second entrance 44d of the sub-housing 44c. With the second sealing member 47d blocking the second entrance 44d, the opening / closing control unit 50e changes the position of the shutter 45 from the closed position to the open position. Next, the movement control unit 76d moves the exchange mechanism 71 from the outside to the inside of the main housing 44b through the entrance 44a of the main housing 44b. Next, the opening / closing control unit 50e changes the position of the shutter 45 from the open position to the sealing position. Thereafter, the exchange control unit 76e controls the exchange mechanism 71 to remove or attach the chuck 42. When the second seal member 47d is attached to the second shutter 61, the outflow of particles can be suppressed by blocking the second entrance 44d of the sub-housing 44c with the second seal member 47d. Therefore, the seal member 47c may not be necessary. However, if the seal member 47c is present, the outflow of particles can be further suppressed.

[0126] After the chuck 42 has been removed or installed, the opening / closing control unit 50e changes the position of the shutter 45 from the sealed position to the open position. Then, the movement control unit 76d moves the replacement mechanism 71 from the inside to the outside of the main housing 44b through the entrance 44a of the main housing 44b. Then, the opening / closing control unit 50e changes the position of the shutter 45 from the open position to the closed position. Then, the second opening / closing control unit changes the position of the second shutter 61 from the second sealed position to the second open position. Then, the movement control unit 76d moves the replacement mechanism 71 from the inside to the outside of the sub-housing 44c through the second entrance 44d of the sub-housing 44c. Then, the travel control unit 76c controls the travel mechanism 74 to travel the travel platform 73 from the position where the chuck 42 is replaced to the position where the chuck 42 is stored. In this way, by closing at least one of the entrance 44a and the second entrance 44d without opening them simultaneously, the inside of the main housing 44b can be prevented from being exposed to the outside of the grinding device 40.

[0127] Next, a grinding device 40 and an exchanging device 7 according to a third modified example will be described with reference to Fig. 17. Below, differences from the above embodiment, the above first modified example, and the above second modified example will be mainly described.

[0128] The exchange device 7 of this modified example includes a housing 77 attached to the running platform 73. The housing 77 comes into contact with the outer wall surface of the exterior cover 44 while accommodating the exchange mechanism 71 and the moving mechanism 72, thereby sealing the inside of the housing 77. The housing 77 may have a seal member 77a on the surface that comes into contact with the exterior cover 44.

[0129] When the shutter 45 opens the entrance 44a of the exterior cover 44, the inside of the housing 77 and the inside of the exterior cover 44 communicate with each other via the entrance 44a of the exterior cover 44. In this state, the chuck 42 is replaced. The housing 77 can restrict the outflow of gas and suppress the outflow of particles, thereby keeping the factory room clean.

[0130] 16, when the exterior cover 44 has a main housing 44b and a sub-housing 44c, the housing 77 comes into contact with the outer wall surface of the sub-housing 44c. When the second shutter 61 opens the second entrance 44d of the sub-housing 44c and the shutter 45 opens the entrance 44a of the main housing 44b, the interior of the housing 77 communicates with the interior of the main housing 44b.

[0131] The above describes the exchange device, processing device, and exchange method according to the present disclosure, but the present disclosure is not limited to the above embodiments. Various changes, modifications, substitutions, additions, deletions, and combinations are possible within the scope of the claims. These naturally fall within the technical scope of the present disclosure.

[0132] Although the processing device of the present disclosure is a grinding device in the above embodiment, it may also be a cutting device, a cutting device, or the like. Grinding includes polishing. The processing device may be any device that includes a holding unit that holds the object to be processed, a mounting unit to which the holding unit is replaceably mounted, and a processing unit that processes the object to be processed held in the holding unit. The processing unit, for example, drives a processing tool. The processing tool is replaceably mounted to the processing unit. When the processing device is a cutting device, a cutting tool such as an end mill is used as the processing tool. When the processing device is a cutting device, a cutting tool such as a blade is used as the processing tool. The processing tool comes into contact with the object to be processed and processes it. When the processing tool wears out, it is replaced.

[0133] Furthermore, the object to be processed by the processing apparatus of the present disclosure is the substrate W in the above embodiment, but is not limited to the substrate W. [Explanation of symbols]

[0134] 7 Exchange device 40 Grinding equipment (processing equipment) 42 Chuck (holding part) 43 Processing section 44 Exterior cover 44a entrance 49 Mounting base (mounting part) 71 Exchange mechanism 72 Moving mechanism 73 Running platform 74 Running mechanism W substrate (processing body)

Claims

1. A replacement device for a holding part used in a processing device comprising: a holding part for holding a substrate; an attachment part to which the holding part is replaceably attached; a processing part for grinding, cutting or cutting the substrate held in the holding part; and an exterior cover that houses the holding part, the attachment part and the processing part, an exchange mechanism that attaches the holding portion to the attachment portion or detaches the holding portion from the attachment portion; a moving mechanism that moves the replacement mechanism from the outside to the inside of the exterior cover through an entrance of the exterior cover; a running platform that supports the movement mechanism; a traveling mechanism for traveling the traveling platform; Equipped with the replacement mechanism includes an operation mechanism that tightens or loosens a fastener that fastens the holding portion to the attachment portion, and a rotation mechanism that rotates the attachment portion; the rotation mechanism includes a holder that grips the attachment portion, and a motor that rotates the holder about a desired rotation center line to thereby rotate the attachment portion; A replacement device in which a plurality of the fasteners are provided on a rotational orbit centered on the desired rotation center line.

2. A control unit is provided, The replacement device according to claim 1 , wherein the control unit controls the rotation mechanism to position the plurality of fasteners directly below the operating mechanism.

3. The replacement mechanism has a rotation prevention mechanism that stops rotation of the mounting portion, The replacement device according to claim 1 or 2, wherein the anti-rotation mechanism includes a clamp that grips the mounting portion or a pin that is inserted into a hole formed in the mounting portion.

4. An imaging device that images the exchange mechanism; A control unit; Equipped with The exchange device according to any one of claims 1 to 3, wherein the control unit controls the exchange mechanism while monitoring the operation of the exchange mechanism using the imaging device so as to align the fastening holes of the mounting portion with the through holes of the holding portion when the exchange mechanism places the holding portion on the mounting portion.

5. a housing attached to the running platform; the housing contacts an outer wall surface of the exterior cover while accommodating the replacement mechanism and the movement mechanism, thereby sealing the inside of the housing; 5. The replacement device according to claim 1, wherein the interior of the housing and the interior of the exterior cover communicate with each other through the entrance of the exterior cover.

6. A control unit is provided, The control unit performs control including receiving an exchange command created by the processing device, and upon receiving the exchange command, moving the running platform to a set position outside the exterior cover, detecting that an entrance of the exterior cover is open, entering the exchange mechanism from the outside to the inside of the exterior cover through the entrance, and attaching the holding part to the mounting part with the exchange mechanism, or detaching the holding part from the mounting part. An exchange device as described in any one of claims 1 to 5.

7. the replacement mechanism has a pair of arms that grip the holding portion, the fastener is a bolt; An exchange device as described in any one of claims 1 to 6, wherein each of the pair of arms has a claw portion that is inserted between the mounting portion and the holding portion, or a bifurcated fork portion that is hooked onto the bolt attached to the holding portion.

8. A replacement method comprising an exchange device described in any one of claims 1 to 6 attaching the holding portion to the mounting portion or removing the holding portion from the mounting portion.

Citation Information

Patent Citations

  • Control unit for machine tool facility using mobile robot device

    JP1987102959A

  • Wafer transport device, and processing device

    JP2009170797A

  • Grinding device

    JP2011161546A

  • Grinding apparatus and grinding method

    JP2014237210A

  • Machine tool system and stocker

    JP2019150894A