Semiconductor substrate manufacturing method, semiconductor substrate, and method for suppressing crack generation in growth layer

Abstract

The present invention addresses the problem of providing novel techniques capable of preventing crack occurrence in a growth layer. The present invention provides a method for producing a semiconductor substrate comprising a brittleness process step S10 for decreasing the strength of a base substrate 10 and a crystal growth step S20 for forming a growth layer 20 on the base substrate 10. The present invention also provides a method for preventing crack occurrence in a growth layer 20 comprising a brittleness process step S10 for decreasing the strength of a base substrate 10 before forming a growth layer 20 on the base substrate 10.

Description

[Technical Field]

[0001] The present invention relates to a method for manufacturing a semiconductor substrate, a semiconductor substrate, and a method for suppressing the occurrence of cracks in a growth layer. [Background technology]

[0002] BACKGROUND ART Conventionally, in the manufacture of semiconductor substrates, a semiconductor substrate of a desired semiconductor material is manufactured by growing crystals of a semiconductor material different from that of the base substrate on the base substrate (so-called heteroepitaxial growth).

[0003] However, heteroepitaxial growth has been problematic in that differences in the lattice constants and thermal expansion coefficients of the two materials can cause cracks in the growth layer, dislocations, deterioration of the surface morphology, and warping of the substrate.

[0004] To solve such problems as cracking in the growth layer, an intermediate layer (so-called buffer layer) is formed between the base substrate and the growth layer to absorb stress caused by differences in lattice constants and thermal expansion coefficients.

[0005] For example, Patent Document 1 discloses a two-stage growth method in which a low-temperature grown layer is formed prior to the formation of a compound semiconductor layer in order to absorb stress and crystal defects caused by differences in lattice constant and thermal expansion coefficient between a Si substrate and a compound semiconductor.

[0006] Furthermore, Patent Document 2 discloses a technique of inserting an aluminum nitride (AlN) layer as a buffer layer between a silicon carbide (SiC) layer and a gallium nitride (GaN) layer. [Prior art documents] [Patent documents]

[0007] [Patent Document 1] Japanese Patent Application Laid-Open No. 2000-311903 [Patent Document 2] Japanese Patent Application Laid-Open No. 2013-179121 Summary of the Invention [Problem to be solved by the invention]

[0008] The above-mentioned cracks in the growth layer can also occur when the same semiconductor material as the base substrate is grown on the base substrate (so-called homoepitaxial growth). That is, if the doping concentrations of the base substrate and the growth layer are different, cracks can occur due to the difference in lattice distance between the base substrate and the growth layer.

[0009] An object of the present invention is to provide a novel technique capable of suppressing the occurrence of cracks in a growth layer. [Means for solving the problem]

[0010] The present invention, which solves the above-mentioned problems, is a method for manufacturing a semiconductor substrate, which includes a brittle processing step for reducing the strength of a base substrate, and a crystal growth step for forming a growth layer on the base substrate.

[0011] In this way, by including a brittle processing step that reduces the strength of the base substrate, stress generated in the growth layer can be released to the base substrate, thereby suppressing the occurrence of cracks in the growth layer.

[0012] In a preferred embodiment of the present invention, the crystal growth step is a step of forming the growth layer having a shrinkage rate different from that of the base substrate. According to the present invention, stress caused by the difference in shrinkage rate between the base substrate and the growth layer is released to the base substrate side, thereby making it possible to prevent cracks from occurring on the growth layer side.

[0013] In a preferred embodiment of the present invention, the underlying substrate and the growth layer have different doping concentrations. According to the present invention, it is possible to suppress the occurrence of cracks caused by the difference in doping concentration between the base substrate and the growth layer, that is, to suppress the occurrence of cracks in the growth layer during homoepitaxial growth.

[0014] In a preferred embodiment of the present invention, the base substrate and the growth layer are made of different materials. According to the present invention, it is possible to suppress the occurrence of cracks caused by differences in the physical properties (lattice constant and thermal expansion coefficient) of the semiconductor materials of the base substrate and the growth layer, i.e., it is possible to suppress the occurrence of cracks in the growth layer during heteroepitaxial growth.

[0015] In a preferred embodiment of the present invention, the embrittlement processing step includes a through-hole forming step of forming through-holes in the base substrate, and a strained layer removing step of removing the strained layer introduced in the through-hole forming step.

[0016] In a preferred embodiment of the present invention, the through-hole forming step is a step of forming the through-hole by irradiating the base substrate with a laser.

[0017] In a preferred embodiment of the present invention, the strained layer removal step is a step of etching the base substrate by heat treatment.

[0018] In a preferred embodiment of the present invention, the base substrate is made of silicon carbide, and the strained layer removing step is a step of etching the base substrate in a silicon atmosphere.

[0019] In a preferred embodiment of the present invention, the crystal growth step is a step of growing the crystal by physical vapor transport.

[0020] The present invention also relates to a method for suppressing the occurrence of cracks in a growth layer, which solves the above-mentioned problems and includes a brittle processing step of reducing the strength of a base substrate before forming a growth layer on the base substrate.

[0021] In a preferred embodiment of the present invention, the embrittlement processing step includes a through-hole forming step of forming through-holes in the base substrate, and a strained layer removing step of removing the strained layer introduced in the through-hole forming step.

[0022] In a preferred embodiment of the present invention, the strained layer removal step is a step of removing the strained layer of the starting substrate by heat treatment.

[0023] In a preferred embodiment of the present invention, the base substrate is made of silicon carbide, and the strained layer removing step is a step of etching the base substrate in a silicon atmosphere. [Effects of the Invention]

[0024] The disclosed technology can provide a novel technology that can suppress the occurrence of cracks in the growth layer.

[0025] Other objects, features and advantages will become apparent from a reading of the following detailed description when taken in conjunction with the drawings and claims. [Brief explanation of the drawings]

[0026] [Figure 1] 1A to 1C are explanatory diagrams illustrating steps of a method for manufacturing a semiconductor substrate according to an embodiment. [Figure 2] 1A to 1C are explanatory diagrams illustrating steps of a method for manufacturing a semiconductor substrate according to an embodiment. [Figure 3] 10A to 10C are explanatory views of a through-hole forming step according to the embodiment. [Figure 4] FIG. 2 is an explanatory diagram illustrating a crystal growth process according to an embodiment. [Figure 5] FIG. 3 is an explanatory view of a through-hole forming step according to the first embodiment. [Figure 6] FIG. 4 is an explanatory diagram of a strained layer removing step according to the first embodiment. [Figure 7] FIG. 2 is an explanatory diagram of a crystal growth process according to Example 1. [Figure 8] FIG. 3 is an explanatory diagram of a temperature lowering step according to Example 1. DETAILED DESCRIPTION OF THE INVENTION

[0027] Preferred embodiments of a method for manufacturing a semiconductor substrate according to the present invention will be described in detail below with reference to the accompanying drawings. The technical scope of the present invention is not limited to the embodiments shown in the accompanying drawings, and appropriate modifications are possible within the scope of the claims. The accompanying drawings are conceptual diagrams, and the relative dimensions of each component do not limit the present invention. Furthermore, in this specification, for the purpose of explaining the invention, the top and bottom may be referred to based on the top and bottom of the drawings, but this does not limit the top and bottom in relation to the use mode of the semiconductor substrate of the present invention. In the following description of the embodiments and the accompanying drawings, similar components are designated by the same reference numerals, and redundant explanations will be omitted.

[0028] <<Method for manufacturing semiconductor substrate>> 1 and 2 show steps of a method for manufacturing a semiconductor substrate according to an embodiment of the present invention. The manufacturing method of the semiconductor substrate according to the embodiment may include a brittle processing step S10 for reducing the strength of the base substrate 10, a crystal growth step S20 for forming a growth layer 20 on the base substrate 10, and a temperature reduction step S30 for reducing the temperature of the base substrate 10 and the growth layer 20 after the crystal growth step S20.

[0029] Furthermore, this embodiment can be understood as a method for suppressing the occurrence of cracks in the growth layer 20 by including a brittle processing step S10 that reduces the strength of the base substrate 10 before forming the growth layer 20 on the base substrate 10. Each step of the embodiment will be described in detail below.

[0030] <Brittle processing process> The embrittlement processing step S10 is a step of reducing the strength of the base substrate 10. In other words, the embrittlement processing step S10 is a step of processing the base substrate 10 so that it is easily deformed or broken by an external force. In yet another way, the embrittlement processing step S10 is a step of increasing the fragility of the base substrate 10. In this specification, "strength" refers to the durability against physical external forces such as compression and tension, and includes the concept of mechanical strength.

[0031] The embrittlement processing step S10 according to the embodiment reduces the strength of the starting substrate 10 by forming through holes 11 in the starting substrate 10. In other words, by reducing the volume of the starting substrate 10, processing is performed so that the starting substrate 10 can be easily deformed or broken by an external force.

[0032] More specifically, the embrittlement processing step S10 includes a through hole forming step S11 for forming a through hole 11 in the base substrate 10, and a strained layer removal step S12 for removing the strained layer 12 introduced by this through hole forming step S11.

[0033] The base substrate 10 can naturally be made of any material commonly used in manufacturing semiconductor substrates. Examples of the material for the base substrate 10 include known Group IV materials such as silicon (Si), germanium (Ge), and diamond (C). Examples of the material for the base substrate 10 include known Group IV-IV compound materials such as silicon carbide (SiC). Examples of the material for the base substrate 10 include known Group II-VI compound materials such as zinc oxide (ZnO), zinc sulfide (ZnS), zinc selenide (ZnSe), cadmium sulfide (CdS), and cadmium telluride (CdTe). The material of the base substrate 10 is, for example, a known III-V compound material such as boron nitride (BN), gallium arsenide (GaAs), gallium nitride (GaN), aluminum nitride (AlN), indium nitride (InN), gallium phosphide (GaP), indium phosphide (InP), or indium antimonide (InSb). The material of the base substrate 10 is, for example, an oxide material such as aluminum oxide (Al2O3) or gallium oxide (Ga2O3). The material of the base substrate 10 is, for example, a metal material such as copper (Cu) or nickel (Ni). The base substrate 10 may be appropriately doped with known dopant atoms used depending on the material.

[0034] The base substrate 10 may be a wafer or substrate processed from a bulk crystal, or may be a substrate having a buffer layer made of the semiconductor material described above.

[0035] The through hole forming step S11 is a step of reducing the strength of the base substrate 10 by forming through holes 11 in the base substrate 10. Naturally, any method capable of forming through holes 11 in the base substrate 10 can be used for this through hole forming step S11.

[0036] The through-holes 11 can be formed, for example, by laser processing, focused ion beam (FIB) system, reactive ion etching (RIE) or other plasma etching. In Fig. 2 showing this embodiment, a means for forming the through-holes 11 by irradiating the base substrate 10 with a laser L is illustrated.

[0037] The through hole 11 may be formed in one or more shapes that reduce the strength of the base substrate 10. Alternatively, a through hole group (pattern) in which a plurality of through holes 11 are arranged may be used.

[0038] An example of a pattern for growing a hexagonal semiconductor material will now be described in detail.

[0039] FIG. 3 is an explanatory diagram illustrating a pattern 100 according to an embodiment. The line segments of the pattern 100 represent the base substrate 10. The pattern 100 preferably has a three-fold symmetrical, regular hexagonal displaced shape. The "regular hexagonal displaced shape" in the description of this specification will be described in detail below with reference to FIG. 3. The regular hexagonal displaced shape is a dodecagon. The regular hexagonal displaced shape is composed of 12 straight line segments of equal length. The regular hexagonal displaced shape of the pattern 100 contains a reference figure 101 that is a regular triangle, has an area 101a, and includes three vertices 104. Each of the three vertices 104 is included in the vertices of the pattern 100. It can be understood that the three vertices 104 may be located on the line segments that constitute the pattern 100. Pattern 100 includes line segment 102 (corresponding to a first line segment) that extends from and includes vertex 104, and line segment 103 (corresponding to a second line segment) that does not extend from vertex 104 and is adjacent to line segment 102 without including vertex 104. Here, the angle θ formed by the two adjacent line segments 102 in pattern 100 is constant and equal to the angle θ formed by the two adjacent line segments 103 in pattern 100. Note that the term "regular hexagon-displaced shape" in the description herein can be understood to mean a dodecagon formed by displacing (deforming) a regular hexagon while maintaining the area of ​​the regular hexagon based on angle θ, which indicates the degree of irregularity.

[0040] The angle θ is preferably greater than 60°, and is preferably 66° or greater, and is preferably 80° or greater, and is preferably 83° or greater, and is preferably 120° or greater, and is preferably 150° or greater, and is preferably 155° or greater. The angle θ is preferably 180° or less, and is preferably 155° or less, and is preferably 150° or less, and is preferably 120° or less, and is preferably 83° or less, and is preferably 80° or less, and is preferably 66° or less.

[0041] The pattern 100 according to the embodiment may have a configuration of a displaced regular dodecagon with six-fold symmetry, instead of a displaced regular hexagon with three-fold symmetry. The displaced regular dodecagon is a 24-sided polygon. The displaced regular dodecagon is composed of 24 straight line segments of equal length. The pattern 100 having a displaced regular dodecagon contains a reference figure 101 that is a regular hexagon, has an area 101a, and includes six vertices 104. Each of the six vertices 104 is included as a vertex of the pattern 100. As with the displaced regular hexagon, the angle θ between two adjacent line segments 102 in the pattern 100 is constant and equal to the angle θ between two adjacent line segments 103 in the pattern 100. In other words, the "regular dodecagon-displaced shape" in the description herein can be understood as a 24-gon obtained by displacing (deforming) a regular dodecagon while maintaining the area of ​​the regular dodecagon based on the angle θ, which indicates the degree of irregularity. Note that the pattern 100 may be configured to present a 2n-gon-displaced shape, which is a 4n-gon obtained by displacing (deforming) a regular 2n-gon while maintaining the area of ​​the regular 2n-gon based on the angle θ, which indicates the degree of irregularity. In this case, the 2n-gon-displaced shape can be understood to include a regular n-gon (corresponding to the reference figure 101). Here, the reference figure 101 can be understood to include n vertices.

[0042] The pattern 100 according to the embodiment may include a displaced regular 2n-gon shape (including a displaced regular hexagon shape and a displaced regular dodecagon shape). The pattern 100 may further include, in addition to the line segments constituting the displaced regular 2n-gon shape, at least one line segment (corresponding to a third line segment) connecting the intersection of two adjacent line segments 103 in the displaced regular 2n-gon shape to the center of gravity of the reference figure 101. The pattern 100 may further include, in addition to the line segments constituting the displaced regular 2n-gon shape, at least one line segment connecting the intersection of two adjacent line segments 103 in the displaced regular 2n-gon shape to a vertex 104 constituting the reference figure 101. The pattern 100 may further include, in addition to the line segments constituting the displaced regular 2n-gon shape, at least one line segment constituting the reference figure 101 included in the displaced regular 2n-gon shape.

[0043] Furthermore, the through-hole forming step S11 is preferably a step of removing 50% or more of the effective area of ​​the base substrate 10. Furthermore, it is more preferably a step of removing 60% or more of the effective area, even more preferably a step of removing 70% or more of the effective area, and even more preferably a step of removing 80% or more of the effective area.

[0044] In this specification, the effective area refers to the surface of the base substrate 10 to which the raw material adheres in the crystal growth step S20. In other words, it refers to the remaining area on the growth surface of the base substrate 10 other than the area removed by the through holes 11.

[0045] The effective area of ​​the base substrate 10 and the shape and pattern of the through holes 11 are preferably set taking into consideration the difference in lattice constant and thermal expansion coefficient between the base substrate 10 and the growth layer 20, the crystal structure of the growth layer 20, and the growth method.

[0046] The strained layer removal step S12 is a step of removing the strained layer 12 formed on the base substrate 10 by the through-hole formation step S11. This strained layer removal step S12 can naturally be adopted as long as it is a means capable of removing the strained layer 12 introduced into the base substrate 10.

[0047] The strained layer 12 can be removed by, for example, a hydrogen etching method using hydrogen gas as an etching gas, a Si-Vapor Etching (SiVE) method in which heating is performed under a Si atmosphere, or an etching method described in Example 1 below.

[0048] <Crystal growth process> The crystal growth step S20 is a step of forming a growth layer 20 on the base substrate 10 after the embrittlement processing step S10.

[0049] The semiconductor material of the growth layer 20 may be the same as that of the base substrate 10 (homoepitaxial growth), or may be a different semiconductor material from that of the base substrate 10 (heteroepitaxial growth). In addition, the semiconductor material of the growth layer 20 may have lower strength than the semiconductor material of the base substrate 10, for example.

[0050] Naturally, any material that can be epitaxially grown as a semiconductor material can be used as the material for the growth layer 20. The material for the growth layer 20 may be the material for the base substrate 10, or may be a known material that can be used as the material for the base substrate 10, or may be a known material that can be epitaxially grown on the base substrate 10.

[0051] Specifically, examples of materials that can be used for the growth layer 20 include Si, Ge, GaN, AlN, InN, ZnS, ZnSe, CdTe, GaP, GaAs, InP, InAs, InSb, and SiC. The combination of the material of the base substrate 10 and the material of the growth layer 20 can be selected appropriately taking into consideration the difference in lattice constant and thermal expansion coefficient between the two materials.

[0052] The crystal growth step S20 can employ known vapor phase growth methods (corresponding to vapor phase epitaxy), such as physical vapor transport (PVT), sublimation recrystallization, modified Rayleigh process, chemical vapor transport (CVT), molecular-organic vapor phase epitaxy (MOVPE), and hydride vapor phase epitaxy (HVPE), as a growth method for the growth layer 20. Note that the crystal growth step S20 can employ physical vapor deposition (PVD) instead of PVT. Note that the crystal growth step S20 can employ chemical vapor deposition (CVD) instead of CVT. Furthermore, the crystal growth step S20 can employ known liquid phase growth methods (corresponding to liquid phase epitaxial methods) such as the TSSG (Top-Seeded Solution Growth) method and the MSE (Metastable Solvent Epitaxy) method as the growth method for the growth layer 20. The crystal growth step S20 can employ the CZ (Czochralski) method as the growth method for the growth layer 20. The crystal growth step S20 can employ an appropriate growth method depending on the materials of the base substrate 10 and the growth layer 20, respectively.

[0053] FIG. 4 is an explanatory diagram illustrating the crystal growth step S20 according to the embodiment. The crystal growth step S20 according to the embodiment is a step of arranging the base substrate 10 and the semiconductor material 40, which is the raw material for the growth layer 20, facing each other in a crucible 30 having a semi-closed space, and heating them. Note that the "semi-closed space" in this specification refers to a space in which the inside of the container can be evacuated, but at least a portion of the vapor generated inside the container can be confined.

[0054] The crystal growth step S20 is a step of heating the base substrate 10 so as to form a temperature gradient along the vertical direction of the base substrate 10. By heating the crucible 30 (base substrate 10 and semiconductor material 40) in this temperature gradient, the raw material is transported from the semiconductor material 40 onto the base substrate 10 via the raw material transport space 31.

[0055] The driving force for transporting the source material can be the temperature gradient described above or the chemical potential difference between the base substrate 10 and the semiconductor material 40 .

[0056] Specifically, within the semi-closed space, vapor consisting of elements sublimated from the semiconductor material 40 is transported by diffusion within the source transport space 31, and condenses in a supersaturated state on the base substrate 10, which is set at a lower temperature than the semiconductor material 40. Alternatively, the vapor condenses in a supersaturated state on the base substrate 10, which has a lower chemical potential than the semiconductor material 40. As a result, a growth layer 20 is formed on the base substrate 10.

[0057] In this crystal growth step S20, an inert gas or a doping gas may be introduced into the source material transport space 31 to control the doping concentration of the growth layer 20 and the growth environment.

[0058] In this embodiment, the growth layer 20 is formed by the PVT method, but any method that can form the growth layer 20 can be naturally adopted.

[0059] <Temperature cooling process> The temperature-lowering step S30 is a step of lowering the temperatures of the base substrate 10 and growth layer 20 that have been heated in the crystal growth step S20.

[0060] In the cooling step S30, the temperature of the base substrate 10 and the growth layer 20 decreases, causing them to shrink according to their respective thermal expansion coefficients. At this time, if the semiconductor materials or doping concentrations of the base substrate 10 and the growth layer 20 are different, a difference in the shrinkage rate will occur.

[0061] According to this embodiment, the strength of the base substrate 10 is reduced in the embrittlement processing step S10, so that even if there is a difference in the shrinkage rate between the base substrate 10 and the growth layer 20, the base substrate 10 will be deformed or cracks 13 will form (see Figures 2 and 8).

[0062] That is, the crystal growth step S20 according to the present invention is a step of forming a growth layer 20 having a different shrinkage rate from that of the base substrate 10. Specifically, the base substrate 10 and the growth layer 20 may have different doping concentrations or may be made of different materials.

[0063] In other words, the crystal growth step S20 according to this embodiment is a step of forming a growth layer 20 having a doping concentration different from that of the base substrate 10. Furthermore, the crystal growth step S20 according to this embodiment is a step of forming a growth layer 20 of a material different from that of the base substrate 10.

[0064] According to the present invention, by including a brittle processing step S10 that reduces the strength of the base substrate 10, the stress that occurs between the base substrate 10 and the growth layer 20 can be released to the base substrate 10, thereby suppressing the occurrence of cracks in the growth layer 20.

[0065] One embodiment of the method for manufacturing a semiconductor substrate according to the present invention is to grow AlN on a SiC substrate, as shown in the following example. Furthermore, one embodiment of the method for manufacturing a semiconductor substrate according to the present invention does not include a method for growing AlN on a SiC substrate. [Example]

[0066] The present invention will be explained more specifically with reference to Example 1 and Comparative Example 1. In Example 1 and Comparative Example 1, semiconductor substrates were manufactured by growing an AlN growth layer 20 on a SiC base substrate 10.

[0067] AlN has a lattice mismatch with SiC of about 1% and a thermal expansion coefficient difference of about 23%. In Example 1, the stress due to the lattice mismatch and the thermal expansion coefficient difference is released to the SiC base substrate 10, thereby suppressing the occurrence of cracks in the AlN growth layer 20.

[0068] Example 1 <Through hole formation step S11> Under the following conditions, a laser was irradiated onto the base substrate 10 to form through-holes 11.

[0069] (Base substrate 10) Semiconductor material: 4H-SiC Board size: 11mm wide x 11mm long x 524μm thick Growth aspect: Si-face Off-axis angle: on-axis

[0070] (Laser processing conditions) Type: Green laser Wavelength: 532nm Spot diameter: 40 μm Average output power: 4W (at 30kHz)

[0071] (Pattern details) 5A and 5B are explanatory diagrams illustrating the pattern of through holes 11 formed in the through hole forming step S11 according to Example 1. Fig. 5A is an explanatory diagram illustrating an arrangement of a plurality of through holes 11. In Fig. 5A, the black areas indicate the portions of the through holes 11, and the white areas are left as the base substrate 10.

[0072] Fig. 5(b) is an explanatory diagram showing an enlarged view of the through-hole 11 in Fig. 5(a). In Fig. 5(b), the white area indicates the through-hole 11, and the black area is left as the base substrate 10. In the pattern of FIG. 5, 80% or more of the effective area of ​​the starting substrate 10 is removed, thereby reducing the strength of the starting substrate 10.

[0073] (Strained layer removal process S12) FIG. 6 is an explanatory diagram illustrating the strained layer removing step S12 according to the first embodiment. The base substrate 10 in which the through holes 11 were formed in the through hole forming step S11 was housed in a SiC container 50, and the SiC container 50 was then housed in a TaC container 60, and heated under the following conditions.

[0074] (Heating conditions) Heating temperature: 1800℃ Heating time: 2h Etching amount: 8 μm

[0075] (SiC container 50) Material: Polycrystalline SiC Container size: diameter 60mm x height 4mm Distance between base substrate 10 and the bottom surface of SiC container 50: 2 mm

[0076] (Details of the SiC container 50) 6, the SiC container 50 is a fitting container having an upper container 51 and a lower container 52 that can fit together. A minute gap 53 is formed at the fitting portion between the upper container 51 and the lower container 52, and the SiC container 50 is configured so that the inside of the SiC container 50 can be evacuated (vacuumed) through this gap 53.

[0077] The SiC container 50 has an etching space 54 formed by facing the starting substrate 10 to a part of the SiC container 50 located on the low temperature side of the temperature gradient, with the starting substrate 10 located on the high temperature side of the temperature gradient. This etching space 54 is a space in which Si atoms and C atoms are transported from the starting substrate 10 to the SiC container 50 for etching, using the temperature difference between the starting substrate 10 and the bottom surface of the SiC container 50 as a driving force.

[0078] The SiC vessel 50 also has a substrate holder 55 that holds the base substrate 10 in the hollow to form an etching space 54. Note that this substrate holder 55 may not be provided depending on the direction of the temperature gradient of the heating furnace. For example, if the heating furnace forms a temperature gradient such that the temperature decreases from the lower vessel 52 to the upper vessel 51, the base substrate 10 may be placed on the bottom surface of the lower vessel 52 without providing the substrate holder 55.

[0079] (TaC container 60) Material: TaC Container size: diameter 160mm x height 60mm Si vapor source 64 (Si compound): TaSi2

[0080] (Details of TaC container 60) Similar to the SiC container 50, the TaC container 60 is a fitting container having an upper container 61 and a lower container 62 that can fit together, and is configured to be able to house the SiC container 50. A minute gap 63 is formed at the fitting portion between the upper container 61 and the lower container 62, and the TaC container 60 is configured to be able to be evacuated (vacuumed) through this gap 63.

[0081] The TaC container 60 has a Si vapor supply source 64 capable of supplying vapor pressure of a gaseous species containing Si element into the TaC container 60. The Si vapor supply source 64 may be configured to generate vapor pressure of a gaseous species containing Si element inside the TaC container 60 during heat treatment.

[0082] <Crystal growth process S20> FIG. 7 is an explanatory diagram illustrating the crystal growth step S20 according to the first embodiment. The base substrate 10 from which the strained layer 12 had been removed in the strained layer removing step S12 was placed opposite the semiconductor material 40 and placed in the crucible 30, and heated under the following conditions.

[0083] (Heating conditions) Heating temperature: 2040℃ Heating time: 70h Growth thickness: 500 μm N2 gas pressure: 10kPa

[0084] (crucible 30) Material: Tantalum carbide (TaC) and / or tungsten (W) Container size: 10mm x 10mm x 1.5mm Distance between substrate 10 and semiconductor material 40: 1 mm

[0085] (Details of Crucible 30) The crucible 30 has a raw material transport space 31 between the starting substrate 10 and the semiconductor material 40. The raw material is transported from the semiconductor material 40 onto the starting substrate 10 via this raw material transport space 31.

[0086] 7(a) shows an example of a crucible 30 used in the crystal growth step S20. Similar to the SiC container 50 and the TaC container 60, this crucible 30 is a fitting container including an upper container 32 and a lower container 33 that can fit together. A minute gap 34 is formed at the fitting portion between the upper container 32 and the lower container 33, and the crucible 30 is configured so that the inside of the crucible 30 can be evacuated (evacuated) through this gap 34.

[0087] Furthermore, crucible 30 has a substrate holder 35 that forms raw material transport space 31. This substrate holder 35 is provided between starting substrate 10 and semiconductor material 40, and forms raw material transport space 31 by placing semiconductor material 40 on the high temperature side and starting substrate 10 on the low temperature side.

[0088] Figures 7(b) and 7(c) show other examples of the crucible 30 used in the crystal growth step S20. The temperature gradient in Figures 7(b) and 7(c) is set to be the opposite of that in Figure 7(a), with the base substrate 10 placed on the upper side. That is, similar to Figure 7(a), the semiconductor material 40 is placed on the high-temperature side and the base substrate 10 is placed on the low-temperature side to form the raw material transport space 31.

[0089] FIG. 7(b) shows an example in which starting substrate 10 is fixed to the upper vessel 32 side, thereby forming a source material transport space 31 between the starting substrate 10 and semiconductor material 40. 7(c) shows an example in which a through window is formed in the upper container 32 and a base substrate 10 is placed therein, thereby forming a raw material transport space 31 between the upper container 32 and the lower container 33. Alternatively, as shown in FIG. 7(c), the raw material transport space 31 may be formed by providing an intermediate member 36 between the upper container 32 and the lower container 33.

[0090] (Semiconductor Materials 40) Material: AlN sintered body Size: Width 20mm x Height 20mm x Thickness 5mm

[0091] (Details of Semiconductor Material 40) The AlN sintered body of the semiconductor material 40 was sintered by the following procedure. The AlN powder was placed in the frame of a TaC block and compressed with a moderate force.The compressed AlN powder and TaC block were then placed in a pyrolytic carbon crucible and heated under the following conditions.

[0092] Heating temperature: 1850℃ N2 gas pressure: 10kPa Heating time: 3h

[0093] <Temperature cooling process> Finally, the temperature of the base substrate 10 and growth layer 20 after the crystal growth step S20 was lowered under the following conditions.

[0094] (Temperature-lowering conditions) Substrate temperature before cooling: 2040℃ Substrate temperature after cooling: Room temperature Cooling rate: 128℃ / min

[0095] 7 is an SEM image of the base substrate 10 and growth layer 20 cooled under the above conditions, observed from the side of the base substrate 10. It can be seen that cracks 13 have formed in the base substrate 10.

[0096] A plurality of cracks 13 were observed in the base substrate 10 of the semiconductor substrate produced in Example 1. On the other hand, no cracks were observed in the growth layer 20. That is, it was confirmed that there were no cracks in the entire 10 mm × 10 mm area of ​​the AlN crystal growth surface (0001).

[0097] Comparative Example 1 The same starting substrate 10 as in Example 1 was subjected to the crystal growth step S20 and the temperature-lowering step S30 under the same conditions as in Example 1. That is, in Comparative Example 1, the embrittlement processing step S10 was not performed, and the crystal growth step S20 was performed.

[0098] No cracks 13 were observed in the base substrate 10 of the semiconductor substrate manufactured in Comparative Example 1. On the other hand, in the growth layer 20, cracks 13 were observed in the base substrate 10 of the semiconductor substrate manufactured in Comparative Example 1. -1 Cracks were observed at a crack linear density of 100 mm. In this specification, the crack linear density refers to the value obtained by dividing the total length of all cracks observed in the measurement area by the measurement area (total crack length (mm) / measurement area (mm -2 ) = crack linear density (mm -1 )).

[0099] From the results of Example 1 and Comparative Example 1, it can be seen that by reducing the strength of the base substrate 10 by the embrittlement processing step S10, the stress generated in the growth layer 20 can be released to the base substrate 10, thereby suppressing the occurrence of cracks in the growth layer 20.

[0100] 10 Base substrate 11 Through hole 12 Strain layer 13 Crack 20 growth layer 30 Crucible 31 Raw material transportation space 40 Semiconductor Materials 50 SiC container 60 TaC container S10 Brittle processing process S11 Through-hole formation process S12 Strained layer removal process S20 Crystallization Growth Project S30 Cooling Project

Claims

1. a brittle processing step for reducing the strength of the base substrate; a crystal growth step of forming a growth layer on the base substrate, the embrittlement processing step includes a through-hole forming step of forming a through-hole in the base substrate, A method for manufacturing a semiconductor substrate, wherein the through-hole forming step is a step of removing 50% or more of the effective area, which is the area of ​​the surface of the base substrate to which the raw material of the growth layer adheres in the crystal growth step.

2. 2. The method for manufacturing a semiconductor substrate according to claim 1, wherein the crystal growth step is a step of forming the growth layer having a shrinkage rate different from that of the base substrate.

3. 3. The method for manufacturing a semiconductor substrate according to claim 1, wherein the base substrate and the growth layer have different doping concentrations.

4. 4. The method for manufacturing a semiconductor substrate according to claim 1, wherein the base substrate and the growth layer are made of different materials.

5. A method for manufacturing a semiconductor substrate described in any one of claims 1 to 4, further comprising a strained layer removal process for removing the strained layer introduced by the through hole formation process.

6. The method for manufacturing a semiconductor substrate according to claim 5 , wherein the through-hole forming step is a step of forming the through-hole by irradiating the base substrate with a laser.

7. 7. The method for manufacturing a semiconductor substrate according to claim 5, wherein the strained layer removing step is a step of removing the strained layer of the base substrate by heat treatment.

8. the base substrate is silicon carbide; 8. The method for manufacturing a semiconductor substrate according to claim 5, wherein the strained layer removing step is a step of etching the base substrate in a silicon atmosphere.

9. 9. The method for manufacturing a semiconductor substrate according to claim 1, wherein the crystal growth step is a step of growing the crystal by physical vapor transport.

10. a brittle processing step of reducing the strength of the base substrate before forming a growth layer on the base substrate, the embrittlement processing step includes a through-hole forming step of forming a through-hole in the base substrate, A method for suppressing the occurrence of cracks in a growth layer, wherein the through-hole forming step is a step of removing 50% or more of the area of ​​the growth surface of the base substrate on which the growth layer is to be formed.

11. The method described in claim 10, further comprising a strain layer removal process for removing the strain layer introduced by the through hole formation process.

12. The method according to claim 11 , wherein the strained layer removal step is a step of etching the base substrate by heat treatment.

13. the base substrate is silicon carbide; 13. The method according to claim 11 or 12, wherein the strained layer removing step is a step of etching the base substrate in a silicon atmosphere.

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