Electronic component joining equipment

Abstract

To provide an electronic component bonding device capable of matching, by means of a simple structure, the degrees of parallelization of an electronic component and a substrate, and precisely aligning and bonding electrodes of the electronic component and electrodes of the substrate.SOLUTION: An electronic component bonding device 1 has an electronic component lifting mechanism 11 for moving a bonding tool 33 up and down with respect to a stage 13. The electronic component lifting mechanism 11 has: a high-speed movement mechanism 20 for moving the bonding tool 33 until a distance between an electrode 70 of an electronic component M and an electrode 71 of a substrate P becomes a predetermined distance D1; and a low-speed movement mechanism 21 for moving the bonding tool 33 at a speed lower than that of the high-speed movement mechanism 20. The low-speed movement mechanism 21 has a parallelization degree adjustment mechanism 44 that enables matching the degrees of parallelization of an electronic component holding surface 33a of the bonding tool 33 with respect to a stage surface 13a of the stage 13. The parallelization degree adjustment mechanism 44 is connected by a hemisphere face 65a of a convex spherical face member 65 and a hemisphere face 66a of a concave spherical face member 66.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to an electronic component joining device. [Background technology]

[0002] There is known an electronic component bonding apparatus that presses electrodes of an electronic component against electrodes of a substrate via a bonding material, melts the bonding material, and bonds the electronic component to the substrate. Such an electronic component bonding apparatus is required to press the electronic component and the substrate parallel to each other and to align the electrode positions of the electronic component and the electrode positions of the substrate with high precision. An example of an electronic component bonding apparatus that can adjust the parallelism between an electronic component and a substrate is an electronic component bonding apparatus that has a parallelism adjustment mechanism on the stage that holds the substrate, and that can adjust the parallelism of the substrate holding surface of the stage with the electronic component holding surface of a bonding tool that suction-holds the electronic component (see, for example, Patent Document 1).

[0003] There is also an electronic component bonding device that can simultaneously capture images of the electrode positions of an electronic component and the electrode positions of a substrate using a dual-view camera unit with upper and lower fields of view, and align the two with high precision (see, for example, Patent Document 2). [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Application Laid-Open No. 2012-84740 [Patent Document 2] Japanese Patent Application Laid-Open No. 2017-183451 Summary of the Invention [Problem to be solved by the invention]

[0005] The parallelism adjustment mechanism described in Patent Document 1 is composed of a convex spherical member having a substrate holding surface and a concave spherical member that fits into the convex spherical member. Parallelism adjustment involves detecting the height position of the electronic component holding surface with a height detection means, changing the inclination of the substrate holding surface with a driving means while the electronic component holding surface of the bonding tool is pressed against the substrate holding surface, and then maintaining the inclined position of the substrate holding surface with a control means when the height position of the electronic component holding surface is at its lowest point. The parallelism adjustment requires multiple driving means for changing the inclination of the substrate holding surface and additional control means for maintaining the inclined position, which creates a problem of the parallelism adjustment mechanism becoming large and complex.

[0006] Furthermore, the electronic component bonding device described in Patent Document 2 is capable of aligning the electrodes of an electronic component with the electrodes of a substrate with high precision using a dual-view camera unit. However, the optical axis of the dual-view camera unit may be misaligned due to the heat generated when the stage and bonding tool melt the bonding material, which could result in unstable alignment. Furthermore, the dual-view camera unit is movably fixed to a base plate to which the stage and bonding tool are fixed. This may result in vibrations from the stage, bonding tool, and dual-view camera unit during operation, which may affect the overall performance due to movement of the dual-view camera unit between the detection position and the retracted position, or due to the operation of the bonding tool involved in bonding. This may make it difficult to align the electrodes of an electronic component with the electrodes of a substrate with high precision and to increase the speed of bonding.

[0007] Therefore, the present invention has been made to solve at least one of these problems, and aims to realize an electronic component joining device that, when joining an electronic component to a substrate, provides a small and simple mechanism for adjusting the parallelism between the electronic component and the substrate, and is capable of highly accurate alignment of the electrodes of the electronic component and the electrodes of the substrate. [Means for solving the problem]

[0008] [1] The electronic component bonding device of the present invention has an electronic component lifting mechanism that raises and lowers a bonding tool that adsorbs and holds an electronic component relative to a stage that adsorbs and holds a substrate, and is capable of bonding an electrode of the substrate and an electrode of the electronic component via a heat-fusible bonding material, wherein the electronic component lifting mechanism has a high-speed movement mechanism that moves the bonding tool until the distance between the electrode of the electronic component and the electrode of the substrate becomes a predetermined distance, a low-speed movement mechanism that moves the bonding tool at a speed slower than that of the high-speed movement mechanism, and a parallelism adjustment mechanism provided in the low-speed movement mechanism that can adjust the parallelism of the electronic component holding surface of the bonding tool with respect to the stage surface of the stage, and wherein the parallelism adjustment mechanism is characterized in that the convex spherical member is connected to the hemispherical surface of the concave spherical member.

[0009] [2] In the electronic component bonding apparatus of the present invention, it is preferable that the low-speed movement mechanism has a piezoelectric drive mechanism using a piezoelectric element as a drive source, and the parallelism adjustment mechanism is attached directly above the piezoelectric drive mechanism.

[0010] [3] In the electronic component joining device of the present invention, it is preferable that the device further includes a moving part that connects the high-speed moving mechanism and the low-speed moving mechanism, and a plurality of springs that are suspended between the side surface of the convex spherical member and the moving part and urge the hemispherical surface of the convex spherical member against the hemispherical surface of the concave spherical member.

[0011] [4] In the electronic component joining device of the present invention, when adjusting the parallelism between the stage surface and the electronic component holding surface, it is preferable that the high-speed movement mechanism be used to bring the stage surface and the electronic component holding surface into close contact with each other, and that the device further include a high-load sensor that can control the load when pressing the hemispherical surface of the convex spherical member against the hemispherical surface of the concave spherical member.

[0012] [5] In the electronic component bonding device of the present invention, it is preferable that the center of the radius of curvature of the hemispherical surfaces of the convex spherical member and the concave spherical member is at the center of the contact surface between the stage surface and the electronic component holding surface.

[0013] [6] In the electronic component bonding apparatus of the present invention, it is preferable that the apparatus further includes a heater disposed on the stage for thermally melting the bonding material, a two-view camera unit with an upper and lower field of view that is arranged to be able to move back and forth between the stage and the bonding tool, and an insulating plate disposed between the stage and the two-view camera unit with an upper and lower field of view that is able to move between a position covering the top of the stage and a position retracted from the stage.

[0014] [7] In the electronic component bonding apparatus of the present invention, it is preferable that the upper and lower two-view camera unit is attached to a base plate independent of the lower base that supports the electronic component lifting mechanism and the stage via an X-axis drive unit, a Y-axis drive unit, and a Z-axis drive unit. [Effects of the Invention]

[0015] The electronic component bonding apparatus described above includes a convex spherical member and a concave spherical member, and a parallelism adjustment mechanism that uses a spring to bias the hemispherical surfaces of the convex spherical member and the concave spherical member. The parallelism adjustment mechanism is located on the upper side of the bonding tool. After replacing the bonding tool, when the electronic component holding surface is brought into contact with the stage surface and a predetermined load is applied, the convex spherical member oscillates relative to the concave spherical member in accordance with the hemispherical surfaces, and the electronic component holding surface on the bonding tool side comes into close contact with the fixed stage surface. This makes the stage surface and the electronic component holding surface parallel. The electronic component bonding apparatus configured in this manner enables parallelism adjustment between the electronic component and the substrate with a simple structure, without the need for a control or drive means for parallelism adjustment.

[0016] The electronic component bonding device also has an insulating plate between the stage and the upper / lower dual-view camera unit. The insulating plate prevents heat from being transferred from a heater mounted on the stage to the upper / lower dual-view unit, which could cause the optical axes of the upper / lower dual-view camera unit to shift due to the heat. The upper / lower dual-view camera unit is mounted on a base plate that is independent of the lower base that supports the electronic component lifting mechanism and the stage. This makes it possible to suppress the effects of vibrations caused by the operation of the electronic component lifting mechanism being transferred to the upper / lower dual-view camera unit, or vice versa.

[0017] According to the electronic component joining device of the present invention configured as described above, when joining an electronic component to a substrate, a parallelism adjustment mechanism between the electronic component and the substrate can be realized with a small and simple structure, making it possible to align the electrodes of the electronic component with the electrodes of the substrate with high precision. [Brief explanation of the drawings]

[0018] [Figure 1] 1 is a cross-sectional view showing the overall configuration of an electronic component bonding apparatus 1. FIG. [Figure 2] FIG. 2 is a front view of the electronic component bonding apparatus 1 as seen from the Y-axis direction. [Figure 3] 10 is an explanatory diagram showing a state in which an electronic component holding surface 33a is adjusted to be parallel to a stage surface 13a by a parallelism adjusting mechanism 44. FIG. [Figure 4] 1 is a diagram showing an example of an electronic component M. FIG. [Figure 5] FIG. 2 is a diagram showing an example of a substrate P. [Figure 6] 10 is a diagram showing the state after the electronic component M and the substrate P are joined together. FIG. [Figure 7] FIG. 1 is a process flow diagram showing the main steps of joining electronic components. [Figure 8] 10 is a cross-sectional view showing the state of alignment between the electronic component M and the substrate P. FIG. [Figure 9] 2A to 2C are schematic diagrams illustrating the joining operation of the electronic component joining apparatus 1. FIG. [Figure 10] 1 is a cross-sectional view showing a state when the electronic component bonding apparatus 1 is bonding an electronic component M to a substrate P. FIG. DETAILED DESCRIPTION OF THE INVENTION

[0019] (Configuration of electronic component bonding device 1) An electronic component bonding apparatus 1 according to an embodiment of the present invention will be described below with reference to FIGS.

[0020] FIG. 1 is a cross-sectional view showing the overall configuration of an electronic component bonding apparatus 1. FIG. 2 is a front view of the electronic component bonding apparatus 1 as seen from the Y-axis direction. FIG. 1 shows the electronic component bonding apparatus 1 immediately before operation, and FIG. 2 is a simplified explanatory diagram showing the positional relationship between an insulating plate 57 and a dual-view camera unit 12 with a top-bottom field of view. In FIG. 1, the horizontal direction of the drawing is the Y-axis, the direction perpendicular to the paper surface is the X-axis, and the direction perpendicular to the XY plane is the Z-axis or up-down direction. The electronic component bonding apparatus 1 has a stage mechanism 10, an electronic component lifting mechanism 11, and a dual-view camera unit 12 with a top-bottom field of view. The stage mechanism 10 has a stage 13 that suction-holds a substrate P, which is a material to be bonded, an X-axis drive table 14 that moves the stage 13 in the X-axis direction, and a Y-axis drive table 15 that moves the stage 13 in the Y-axis direction.

[0021] The stage 13 has a heater 16 for mainly thermally melting a solder layer H2 (see FIG. 5) serving as a bonding material on the substrate P side when bonding the electronic component M to the substrate P. The stage 13 is fixed to a lower base 17 via an X-axis drive table 14 and a Y-axis drive table 15. A stage surface 13a of the stage 13 has vacuum suction holes (not shown) that enable vacuum suction of the substrate P. The X-axis drive table 14 and the Y-axis drive table 15 are configured to enable fine adjustment of the position of the substrate P in the X and Y directions.

[0022] The electronic component lifting mechanism 11 is composed of a high-speed movement mechanism 20 and a low-speed movement mechanism 21. The high-speed movement mechanism 20 has a motor 22, a ball screw 23, and a ball screw nut 24. The ball screw nut 24 is connected to an output shaft 26 of the motor 22 via a connecting portion 25. The ball screw nut 24 is fixed to a connecting / moving portion 27. The ball screw nut 24 is also threadably connected to the ball screw 23. The connecting / moving portion 27 is attached to an upper base 28 disposed above the electronic component lifting mechanism 11 via a first guide portion 29, a second guide portion 30, and a side plate 31. The first guide portion 29 and the second guide portion 30 guide the connecting / moving portion 27 so that it can move up and down relative to the upper base 28. In other words, the high-speed movement mechanism 20 is configured to be able to move the connecting / moving portion 27 up and down by driving the motor 22.

[0023] The high-speed moving mechanism 20 has a displacement sensor 32, which detects the amount of vertical movement of the connecting moving part 27, i.e., the amount of vertical movement of the bonding tool 33 by the high-speed moving mechanism 20. The displacement sensor 32 can be configured by, for example, a linear encoder.

[0024] A moving part 41 is supported on the connecting moving part 27 via a heavy load sensor 40. A heavy load spring 42 serving as a biasing means is provided between the connecting moving part 27 and the moving part 41. The heavy load spring 42 generates a reaction force against the connecting moving part 27, biasing the moving part 41 downward. The first guide part 29 and the second guide part 30 may be, for example, a cross roller guide or an air slide guide. The high-speed moving mechanism 20 raises and lowers the low-speed moving mechanism 21 via the moving part 41.

[0025] When an upward force acts on the moving part 41 from below (the bonding tool 33 side), the moving part 41 is biased upward relative to the connecting moving part 27, and the upward force acting on the moving part 41 via the bonding tool 33 can be measured by the high load sensor 40.

[0026] The low-speed movement mechanism 21 is connected to a motor 43, a parallelism adjustment mechanism 44, a piezoelectric drive mechanism 45, a low-load sensor 46, a displacement sensor 47, and a bonding tool 33, in that order from the high-speed movement mechanism 20 side along the central axis Cp of the high-speed movement mechanism 20. The parallelism adjustment mechanism 44 is attached directly above the piezoelectric drive mechanism 45. The bonding tool 33 has a heater 48 that mainly heat-melts a solder layer H1 (see FIG. 4) serving as a bonding material on the electronic component M side when bonding the electronic component M to the substrate P. The low-speed movement mechanism 21 moves up and down on the central axis Cp. The configuration of the parallelism adjustment mechanism 44 will be described with reference to FIG. 3.

[0027] The piezoelectric driving mechanism 45 has a piezoelectric element (not shown) as a driving source, and moves the bonding tool 33 downward in response to a voltage signal applied to the piezoelectric element. The piezoelectric driving mechanism 45 may be configured to transmit the deformation amount of the piezoelectric element directly to the bonding tool 33, or may be configured to amplify the displacement amount using a displacement magnification mechanism and transmit it to the bonding tool 33.

[0028] The displacement sensor 47 detects the amount of displacement of the bonding tool 33. The detection accuracy is approximately 0.01 μm, and for example, a capacitance type displacement sensor can be used. The low load sensor 46 detects the load applied to the bonding tool 33 from below. In other words, it can detect the load applied when bonding the electronic component M to the substrate P. The bonding tool 33 has a vacuum suction hole (not shown) in the electronic component holding surface 33 a, and can vacuum-suck the electronic component M to the stage surface 13 a.

[0029] Motor 43 is connected to parallelism adjustment mechanism 44, and rotates bonding tool 33 in a horizontal plane via parallelism adjustment mechanism 44. That is, motor 43 rotates electronic component M about central axis Cp as the rotation axis, and fine-tunes the position of electronic component M in the rotational direction relative to substrate P. Electronic component lifting mechanism 11 configured as described above is fixed to upper base 28 so as to hang down from it, and upper base 28 is fixed to lower base 17 via rigid columnar frame 49.

[0030] Since a known device can be used for the top-bottom dual-view camera unit 12, detailed description thereof will be omitted. The top-bottom dual-view camera unit 12 has an imaging unit 50, which is the main body, an upper opening 51 that inputs reflected light from electrodes 70 (see FIG. 4) of an electronic component M provided in the imaging unit 50, and a lower opening 52 that inputs reflected light from electrodes 71 (see FIG. 5) of a substrate P. The imaging unit 50 is internally configured with a prism (not shown) that switches the optical axis of the input reflected light, an imaging camera that images the electrodes 70, and an imaging camera (not shown) that images the electrodes 71. The top-bottom dual-view camera unit 12 is fixed in a suspended position on a base plate 56 via a Z-axis drive unit 53, an X-axis drive unit 54, and a Y-axis drive unit 55.

[0031] The base plate 56 is fixed to the lower base 17 by a columnar frame 49 that has rigidity independent of the electronic component lifting mechanism 11. This makes it difficult for vibrations that occur when the electronic component lifting mechanism 11 or the stage mechanism 10 are operated to be transmitted to the upper / lower dual-field-of-view camera unit 12. Conversely, it makes it difficult for vibrations that occur when the upper / lower dual-field-of-view camera unit 12 is operated to be transmitted to the electronic component lifting mechanism 11 or the stage mechanism 10.

[0032] As shown in FIGS. 1 and 2, an insulating plate 57 is disposed between the stage 13 and the vertical dual-view camera unit 12. FIG. 1 illustrates a state immediately before the electronic component bonding apparatus 1 is put into operation, with the vertical dual-view camera unit 12 retracted from the bonding tool 33 in the Y-axis direction. The insulating plate 57 is attached to the Y-axis drive table 15 via a support frame 58 and a linear drive unit 59. That is, the insulating plate 57 is movable relative to the Y-axis drive table 15 in the movement direction (Y-axis direction) of the vertical dual-view camera unit 12, and is configured to be movable between a position covering the top of the stage 13 so as to block the gap between the vertical dual-view camera unit 12 and the stage 13, and a position spaced apart from the bonding tool 33 in the planar direction. When aligning the electronic component M with the substrate P, the center positions of the upper opening 51 and the lower opening 52 of the vertical dual-view camera unit 12 move to the central axis Cp. When the upper and lower dual field of view camera unit 12 moves to a position where it can capture images of the electronic component M and the electrodes 70, 71 (see Figures 4 and 5) of the substrate P, the insulating plate 57 retracts in the Y-axis direction to a position where it does not interfere with the operation of the bonding tool 33.

[0033] 2 shows the situation after the upper / lower dual-view camera unit 12 has moved to a position where it can capture images of the electronic component M and the substrate P. At this time, the centers of the upper opening 51 and the lower opening 52 are on the central axis Cp. The heat insulating plate 57 has retreated to a position away from the stage 13 in the depth direction of the page. The heat insulating plate 57 is supported by two support frames 58 and is configured to be movable in the Y-axis direction relative to the Y-axis drive table 15 by a linear drive unit 59. The sides of the low-speed movement mechanism 21 are surrounded by side plates 31.

[0034] (Configuration of parallelism adjustment mechanism 44) FIG. 3 is an explanatory diagram showing the parallelism adjustment mechanism 44 adjusting the electronic component holding surface 33a so that it is parallel to the stage surface 13a. FIG. 3(a) is a cross-sectional view of the electronic component bonding apparatus 1, and FIG. 3(b) is a plan view of the AA cross section of FIG. 3(a) viewed from above. As shown in FIG. 3(a), the parallelism adjustment mechanism 44 is composed of a convex spherical member 65, a concave spherical member 66, and a spring 67. The convex spherical member 65 has a convex hemispherical surface 65a. The concave spherical member 66 has a concave hemispherical surface 66a. The convex hemispherical surface 65a is biased toward the concave hemispherical surface 66a by the spring 67 via an air bearing 68. Although not shown, a compressed air supply device is connected to the parallelism adjustment mechanism 44 to supply compressed air to form the air bearing 68. During the joining operation between the electronic component M and the substrate P, air is sucked from the air bearing 68 to bring the connecting portion between the convex spherical member 65 and the concave spherical member 66 into vacuum tight contact.

[0035] As shown in FIG. 3(a), the concave spherical member 66 is fixed to the motor 43, and the piezo drive mechanism 45 is fixed to the convex spherical member 65. Also, as shown in FIGS. 3(a) and 3(b), the outer diameter of the convex spherical member 65 is rectangular, and springs 67 are suspended between the side surfaces 65b of each of the four sides and the end surface 41a of the moving part 41. The four springs 67 constantly urge the convex hemispherical surface 66a toward the concave hemispherical surface 65a. That is, the convex spherical member 65, the piezo drive mechanism 45, the low-load sensor 46, the displacement sensor 47, and the bonding tool 33 are integrally held to the moving part 41 by the springs 67 via the concave spherical member 66. Therefore, the springs 67 have a urging force sufficient to bring the convex spherical member 65 and the concave spherical member 66 into close contact with each other while holding the components from the parallelism adjustment mechanism 44 to the bonding tool 33.

[0036] Next, the operation of the parallelism adjustment mechanism 44 will be described with reference to FIG. 3(a). The bonding tool 33 is used to suction and hold electronic components M and is replaced for each type of electronic component M. Therefore, when replacing the bonding tool 33, it is important to adjust the parallelism between the electronic component holding surface 33a of the bonding tool 33 and the stage surface 13a of the stage 13. To adjust the parallelism, first, the high-speed movement mechanism 20 is driven to bring the electronic component holding surface 33a of the bonding tool 33 into contact with the stage surface 13a of the stage 13. The concave spherical member 66 is supported by the moving part 41. The convex spherical member 65 is biased toward the concave spherical member 66 by the tensile force of the spring 67. The high-speed movement mechanism 20 causes the concave spherical member 66 to push the convex spherical member 65 along the central axis Cp. An air bearing 68 is formed between the concave spherical member 66 and the convex spherical member 65 by supplying compressed air from a compressed air supply device (not shown). By providing the air bearing 68, the convex spherical member 65 can freely swing along the hemispherical surface 66a, and the electronic component holding surface 33a comes into close contact with the horizontal stage surface 13a. In other words, the electronic component holding surface 33a and the stage surface 13a become parallel to each other.

[0037] The centers Rc of the curvature radii R of the convex spherical member 65 and the concave spherical member 66 are set to coincide with the center of the plane of the contact surface between the electronic component holding surface 33a of the bonding tool 33 and the stage surface 13a of the stage 13. In other words, because the center Rc is on the central axis Cp, the convex spherical member 65 can freely oscillate along the concave spherical member 66. After the parallelism between the electronic component holding surface 33a and the stage surface 13a is adjusted, air is vacuum-suctioned from the air bearing 68. This results in the convex hemispherical surface 65a and the concave hemispherical surface 66a being in the same state as when they are vacuum-sucked, preventing the convex spherical member 65 and the concave spherical member 66 from oscillating relative to each other and maintaining their parallel position. The electronic component M and the substrate P are bonded in this parallel position. The biasing forces of the four springs 67 vary depending on the parallelism adjustment, but this difference is negligible.

[0038] (Electronic component joining method) Next, a method for bonding an electronic component M to a substrate P will be described with reference to the process flow diagram shown in FIG. 7. First, the electronic component M and substrate P to be bonded will be described. FIG. 4 is a diagram showing an example of an electronic component M. FIG. 5 is a diagram showing an example of a substrate P. FIG. 6 is a diagram showing the state after bonding of the electronic component M to the substrate P. FIG. 4(a) is a plan view of the electronic component M as seen from the bonding tool 33 side, and FIG. 4(b) is a side view. The electronic component M has a large number of electrodes 70, and a bonding material (not shown) such as a solder layer H1 is formed on the surface of the electrodes 70. FIG. 5(a) is a plan view of the substrate P as seen from the bonding tool 33 side, and FIG. 5(b) is a side view. The substrate P has a large number of electrodes 71, and a bonding material (not shown) such as a solder layer H2 is formed on the surface of the electrodes 71. After aligning the positions of the electrodes 70, 71 of the electronic component M and the substrate P, the electronic component M and the substrate P are electrically and mechanically joined by the electrodes 70, 71 by pressing the solder layers H1, H2 together while melting them.

[0039] FIG. 7 is a process flow diagram showing the main steps of electronic component bonding. FIG. 8 is a cross-sectional view showing the alignment of an electronic component M and a substrate P. As a preparation step, as shown in FIG. 3, a bonding tool 33 is attached to the electronic component bonding apparatus 1, and the parallelism between the electronic component holding surface 33a of the bonding tool 33 and the stage surface 13a of the stage 13 is adjusted. When adjusting the parallelism, an air bearing 68 is formed between the convex spherical member 65 and the concave spherical member 66. After adjusting the parallelism, air is sucked from the air bearing 68 to bring the convex spherical member 65 and the concave spherical member 66 into close contact with each other, maintaining the parallelism. The electronic component bonding apparatus 1 performs the bonding operation while maintaining the parallelism. First, the heat insulating plate 57 is moved from above the stage 13 and retracted to a position where the bonding tool 33 can be driven (the position shown in FIG. 8) (step S1). At this time, the upper and lower dual-view camera unit 12 is retracted to its initial position where the bonding tool 33 can be driven, as shown in FIG. 1.

[0040] Next, the substrate P is transported to the stage 13 and vacuum-adsorbed (step S2), and the electronic component M is transported to the bonding tool 33 and vacuum-adsorbed (step S3). Then, the upper and lower dual-view camera unit 12 is moved to a position where both the electronic component M and the substrate P can be recognized (step S4). Next, as shown in Fig. 8, the positions of the electronic component M and the substrate P are detected by the upper and lower dual-view camera unit 12 (step S5), and the electronic component M and the substrate P are aligned (step S6).

[0041] The alignment of the electronic component M and the substrate P is performed using the upper / lower dual-view camera unit 12. The bonding tool 33 is located at the top of its movable range. The upper / lower dual-view camera unit 12 adjusts the X, Y, and Z positions of the upper opening 51 so that it can capture images of the electrodes 70 (or alignment marks) of the electronic component M. The position of the substrate P is adjusted in the X and Y directions until the lower opening 52 is positioned so that it can detect the electrodes 71 (or alignment marks) of the substrate P. At this time, the center C1 of the electrode 70 of the electronic component M and the center C2 of the electrode 71 of the substrate P are aligned on the central axis Cp. Based on the detection data from the upper and lower imaging cameras, the motor 43 of the low-speed movement mechanism 21 is driven to rotate the bonding tool 33 (electronic component M) on the central axis Cp to adjust the rotational misalignment of the electronic component M with respect to the substrate P. Note that this rotational adjustment is a fine adjustment, and the displacement of the spring 67 of the parallelism adjustment mechanism 44 due to the rotation is negligible and does not affect the parallelism adjustment.

[0042] Next, the upper and lower dual-view camera unit 12 is moved to its initial position (the position shown in FIG. 1) (step S7), and as shown in FIGS. 8 and 9, the electronic component M is lowered toward the substrate P to bond the electronic component M to the substrate P (step S8). At this time, the heater 48 of the bonding tool 33 and the heater 16 of the stage 13 are heated to a temperature sufficient to thermally melt the bonding materials such as the solder layers H1 and S2. The heaters 16 and 48 are preferably ceramic heaters or the like, and are kept heated at all times while the electronic component bonding apparatus 1 is in operation. The bonding operation between the electronic component M and the substrate P is performed in two steps. First, the bonding operation will be described with reference to FIG. 9.

[0043] FIG. 9 is a schematic diagram illustrating the bonding operation of the electronic component bonding apparatus 1. FIG. 10 is a cross-sectional view illustrating the state when the electronic component bonding apparatus 1 is bonding an electronic component M to a substrate P. The electronic component bonding apparatus 1 has a high-speed movement mechanism 20 and a low-speed movement mechanism 21. The motor 22 of the high-speed movement mechanism 20 is a high-torque motor and pushes the low-speed movement mechanism 21 via a large-load spring 42. Therefore, if the high-speed movement mechanism 20 performs the bonding operation, there is a risk of deforming the electronic component M and the substrate P or damaging the electrodes 70, 71. Therefore, as shown in FIG. 9, the high-speed movement mechanism 20 moves the bonding tool 33 toward the substrate P until the distance between the electrode 70 of the electronic component M and the electrode 71 of the substrate P becomes a predetermined distance D1, and then stops the bonding tool 33. Thereafter, the low-speed movement mechanism 21 starts driving the bonding tool 33. The predetermined distance D1 is approximately 100 μm.

[0044] After the distance between the electrode 70 of the electronic component M and the electrode 70 of the substrate P reaches a predetermined distance D1, the low-speed movement mechanism 21 moves the bonding tool 33 at a slower speed than the high-speed movement mechanism 20. The low-speed movement mechanism 21 contacts the solder layer H1 of the electrode 70 of the electronic component M with the solder layer H2 of the electrode 71 of the substrate P via the solder layer H1. The contact can be detected by the low-load sensor 46 and the displacement sensor 47. The drive source of the low-speed movement mechanism 21 is a piezoelectric drive mechanism 45. After detecting the contact between the electronic component M and the substrate P, the piezoelectric drive mechanism 45 further applies a predetermined load to the substrate P based on the detection data of the low-load sensor 46 and the displacement sensor 47 to bond the electronic component M to the substrate P. Next, with reference to FIG. 10 , the state of the electronic component bonding apparatus 1 when bonding the electronic component M to the substrate P will be described.

[0045] When the electronic component bonding apparatus 1 bonds the electronic component M to the substrate P, the upper and lower dual-view camera unit 12 and the heat insulating plate 57 are retracted to positions where they do not interfere with the operation of the bonding tool 33. The bonding tool 33 is lowered by the piezo drive mechanism 45 to bond the electronic component M to the substrate P. The movement speed of the bonding tool 33 and the load applied to the electronic component M and the substrate P during bonding are managed by the displacement sensor 47 and the load sensor 46.

[0046] Returning to FIG. 7, the operations after bonding the electronic component M to the substrate P will be described. After bonding the electronic component M to the substrate P, the bonding tool 33 is moved to the initial position (the position shown in FIG. 1) (step S9). During this operation, the top and bottom dual-view camera unit 12 and the heat insulating plate 57 are retracted to positions that do not interfere with the operation of the bonding tool 33. After the bonding tool 33 has moved to the initial position, the substrate P to which the electronic component M has been bonded is carried out from above the stage 13 (step S10). After the substrate P is carried out, the heat insulating plate 57 is moved onto the stage 13 (step S11). As described above, the heat insulating plate 57 covers the top of the stage 13 during times other than the operations related to bonding the electronic component M to the substrate P (the operations of steps S2 to S10).

[0047] The electronic component bonding apparatus 1 described above includes a parallelism adjustment mechanism 44 connected to the hemispherical surfaces 65a, 66a of the convex spherical member 65 and the concave spherical member 66. The parallelism adjustment mechanism 44 is disposed above the bonding tool 33. After the bonding tool is replaced, the high-speed movement mechanism 20 abuts the electronic component holding surface 33a against the stage surface 13a and applies a predetermined load. This causes the electronic component holding surface 33a to oscillate relative to the concave spherical member 66, following the concave hemispherical surface 66a. The electronic component holding surface 33a on the bonding tool 33 side is in close contact with the horizontally fixed stage surface 13a. This ensures that the stage surface 13a and the electronic component holding surface 33a are parallel to each other. The electronic component bonding apparatus 1 configured in this manner is compact and simple, enabling highly accurate parallelism between the electronic component M and the substrate P without the need for control or drive means for parallelism adjustment, as in the prior art described above. This allows for excellent bonding quality between the electronic component M and the substrate P.

[0048] The parallelism adjustment mechanism 44 includes an air bearing 68 between the convex spherical member 65 and the concave spherical member 66. By using the air bearing 68 when adjusting the parallelism, it is possible to oscillate the convex spherical member 65 with a low load. After adjusting the parallelism, the air in the air bearing 68 is sucked out to create a vacuum, which allows the convex spherical member 65 and the concave spherical member 66 to be vacuum-tightly attached, making it possible to maintain the parallelism for a long period of time.

[0049] Furthermore, the parallelism adjustment mechanism 44 is disposed on the bonding tool 33 side. As in the prior art, it is also possible to dispose the parallelism adjustment mechanism 44 on the stage 13 side. However, since the substrate P is generally larger in size than the chip-like electronic components M, the parallelism adjustment mechanism 44 becomes larger, which in turn increases the size of the stage mechanism 10 as well as the electronic component bonding apparatus 1.

[0050] The low-speed movement mechanism 21 has a piezo drive mechanism 45 that uses a piezo element as a drive source, and the parallelism adjustment mechanism 44 is attached directly above the piezo drive mechanism 45. This allows the piezo drive mechanism 45 to bond the electronic component M and the substrate P with high precision and low load without being affected by the mass of the parallelism adjustment mechanism 44.

[0051] In the electronic component bonding apparatus 1, the hemispherical surface 65a of the convex spherical member 65 is tightly attached to the hemispherical surface 66a of the concave spherical member 66 by the biasing force of multiple springs 67 (four in the example of FIG. 5(b)). This eliminates play between the hemispherical surfaces 65a and 66a, making it possible to adjust the parallelism between the stage surface 13a and the electronic component holding surface 33a with high precision. However, since an air bearing 68 is provided between the convex spherical member 65 and the concave spherical member 66 during the parallelism adjustment operation, in order to eliminate play between the hemispherical surfaces 65a and 66a and to exert the air bearing effect, the spring 67 has a biasing force that is a sum of a load required to suspend the convex spherical member 65 and the underlying components and to tightly attach the convex spherical member 65 to the concave spherical member 66, and a load of approximately several N required to tightly and constrain the convex spherical member 65 to the concave spherical member 66.

[0052] The electronic component bonding apparatus 1 also has a high load sensor 40. When the high-speed movement mechanism 20 brings the stage surface 13a and the electronic component holding surface 33a into close contact with each other and adjusts the parallelism, the applied load is controlled by the high load sensor 40. By controlling the load appropriately, it is possible to obtain highly accurate parallelism and prevent damage to other components due to the application of an excessive load.

[0053] Furthermore, in the parallelism adjustment mechanism 44, the center Rc of the radius of curvature R of the hemispherical surfaces 65a, 66a of the convex spherical member 65 and the concave spherical member 66 is set to be the center of the contact surface between the stage surface 13a and the electronic component holding surface 33a. That is, the center C1 of the electronic component M (the central position of the arrangement of the electrodes 70), the center C2 of the substrate P (the central position of the arrangement of the electrodes 71), and the center Rc of the radius of curvature R are located on the central axis Cp. This configuration enables the convex spherical member 65 to accurately follow the concave spherical member 66.

[0054] The electronic component bonding apparatus 1 also includes a heater 16 disposed on the stage 13 for thermally melting bonding materials such as solder layers H1 and H2, and a vertically dual-view camera unit 12 that is movable between the stage 13 and the bonding tool 33. A heat insulating plate 57 is disposed between the stage 13 and the vertically dual-view camera unit 12, and is movable between a position that covers the upper portion of the stage 13 and a position that retracts from the stage 13. The heat insulating plate 57 prevents heat from being transferred from the stage 13 to the vertically dual-view camera unit 12. When the bonding materials are solder layers H1 and H2, the melting temperature is 140°C to 260°C. The heat insulating plate 57 prevents the vertically dual-view camera unit 12 from being affected by heat and prevents misalignment of the optical axis, thereby enabling highly accurate alignment of the electronic component M and the substrate P.

[0055] Furthermore, the vertical dual-view camera unit 12 is fixed to the lower base 17 by a columnar frame 49 having rigidity independent of the electronic component lifting mechanism 11. This prevents vibrations from being transmitted to the vertical dual-view camera unit 12 when the electronic component lifting mechanism 11 and the stage mechanism 10 are in operation. Conversely, vibrations from the vertical dual-view camera unit 12 when the electronic component lifting mechanism 11 and the stage mechanism 10 are in operation are also prevented from being transmitted to the electronic component lifting mechanism 11 and the stage mechanism 10. In this way, the influence of vibrations between the components is suppressed, enabling highly accurate and stable alignment and joining. Furthermore, suppressing the transmission of vibrations between the components enables the electronic component lifting mechanism 11, the stage mechanism 10, and the vertical dual-view camera unit 12 to operate at high speed, and allows some of the processes shown in FIG. 7 to be performed simultaneously in parallel, thereby shortening the takt time.

[0056] The electronic component bonding device 1 described above realizes a parallelism adjustment mechanism 44 between the electronic component M and the substrate P with a small and simple structure, making it possible to align the electrodes 70 of the electronic component M with the electrodes 71 of the substrate P with high precision. [Explanation of symbols]

[0057] 1...electronic component bonding device, 10...stage mechanism, 11...electronic component lifting mechanism, 12...upper and lower dual field of view camera unit, 13...stage, 13a...stage surface, 14...X-axis drive table, 15...Y-axis drive table, 16, 48...heater, 17...lower base, 20...high-speed movement mechanism, 21...low-speed movement mechanism, 28...upper base, 32, 47...displacement sensor, 33...bonding tool, 33a...electronic component holding surface, 40...high-load sensor, 41...moving part, 42...high-load spring, 44...parallelism adjustment mechanism, 45...piezo drive mechanism, 46...low Load sensor, 53...Z-axis drive unit, 54...X-axis drive unit, 55...Y-axis drive unit, 56...base plate, 57...heat insulating plate, 59...heat insulating plate drive mechanism, 65...convex spherical member, 65a...convex hemispherical surface, 65b...side surface, 66...concave spherical member, 66a...concave hemispherical surface, 67...spring, 68...air bearing, 59...linear drive unit, 70, 71...electrodes, C1...center of electronic component M, C2...center of substrate P, Cp...central axis, D1...predetermined distance, H1, H2...solder layer (bonding material), M...electronic component, P...substrate, R...radius of curvature, Rc...center of radius of curvature

Claims

1. An electronic component bonding device having an electronic component lifting mechanism that moves up and down a bonding tool that adsorbs and holds an electronic component relative to a stage that adsorbs and holds a substrate, and capable of bonding electrodes of the substrate and electrodes of the electronic component via a heat-fusible bonding material, The electronic component lifting mechanism includes: a high-speed movement mechanism that moves the bonding tool until the distance between the electrode of the electronic component and the electrode of the substrate becomes a predetermined distance; a low-speed movement mechanism that moves the bonding tool at a speed lower than that of the high-speed movement mechanism; a parallelism adjustment mechanism provided in the low-speed movement mechanism and capable of adjusting the parallelism of an electronic component holding surface of the bonding tool with respect to a stage surface of the stage; a high load sensor that measures a push-up force acting on a moving part in the high-speed moving mechanism via the bonding tool, the parallelism adjustment mechanism is connected at the hemispherical surface of the convex spherical member and the hemispherical surface of the concave spherical member, the high-load sensor controls the load when the high-speed movement mechanism brings the stage surface and the electronic component holding surface into close contact with each other and urges the hemispherical surface of the convex spherical member toward the hemispherical surface of the concave spherical member when adjusting the parallelism between the stage surface and the electronic component holding surface. An electronic component joining device characterized by:

2. The electronic component bonding apparatus according to claim 1, the low-speed movement mechanism has a piezo drive mechanism using a piezo element as a drive source, The parallelism adjustment mechanism is attached directly above the piezo drive mechanism. An electronic component joining device characterized by:

3. The electronic component bonding apparatus according to claim 1, a moving unit that connects the high-speed moving mechanism and the low-speed moving mechanism; a plurality of springs suspended between a side surface of the convex spherical member and the moving portion, for biasing the hemispherical surface of the convex spherical member against the hemispherical surface of the concave spherical member; and An electronic component joining device characterized by:

4. The electronic component bonding apparatus according to claim 1, the center of the radius of curvature of the hemispherical surface of the convex spherical member and the concave spherical member is at the center of the contact surface between the stage surface and the electronic component holding surface; An electronic component joining device characterized by:

5. The electronic component bonding apparatus according to claim 1, a heater disposed on the stage for thermally melting the bonding material; a top and bottom dual field of view camera unit that is arranged to be able to move back and forth between the stage and the bonding tool; a heat insulating plate disposed between the stage and the upper and lower two-view camera unit and movable between a position covering the upper side of the stage and a position retracted from the stage; and An electronic component joining device characterized by:

6. In the electronic component joining device described in claim 5, the upper and lower dual field-of-view camera unit is attached to a base plate independent of a lower base supporting the electronic component lifting mechanism and the stage via an X-axis drive unit, a Y-axis drive unit, and a Z-axis drive unit; An electronic component joining device characterized by:

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