Conveyor

Abstract

To provide a transport device capable of transporting a warp correction assisting member for assisting warp correction of a resin-sealed molded article to an output magazine in which the resin-sealed molded article is accommodated.SOLUTION: A transport device 9 includes a first transport section 91 and a second transport section 92. The first transport section 91 transports each of a plurality of resin-sealed molded bodies 10 to an output magazine 61 that can accommodate the plurality of resin-sealed molded bodies 10 in a stacked state. The second transport section 92 transports a warp correction assisting member 11 for assisting the correction of the warp of the resin-sealed molded bodies 10 to a position between the resin-sealed molded bodies 10 in the output magazine 61.SELECTED DRAWING: Figure 2

Description

[Technical Field]

[0001] The disclosed embodiment relates to a conveying device that conveys a plurality of resin-sealed molded bodies to an output magazine. [Background technology]

[0002] Conventionally, a technique for correcting warpage of multiple resin molded bodies by stacking multiple molded bodies and heating them at the same time has been known. If the priority is placed on correcting warpage, the number of resin molded bodies to be stacked is limited. Conversely, if the number of stacked bodies is increased, the heat is not transferred evenly to the multiple resin molded bodies, which may result in insufficient correction of warpage or excessive annealing, which may harden and make the resin molded bodies brittle.

[0003] Therefore, Patent Document 1 proposes a technique in which a flexible spacer having a gap that serves as a heat circulation path is disposed between resin molded bodies when the molded bodies are stacked. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Application Laid-Open No. 2005-153503 Summary of the Invention [Problem to be solved by the invention]

[0005] However, the technology described in Patent Document 1 does not describe the process of placing a spacer, which is a warp correction auxiliary member that assists in correcting warpage of the molded body, between the resin molded bodies, and does not consider automating this process using a conveying device.

[0006] One aspect of the embodiment has been made in consideration of the above, and aims to provide a conveying device that can convey a warp correction auxiliary member that assists in correcting the warp of a resin-sealed molded body to an output magazine in which the resin-sealed molded body is stored. [Means for solving the problem]

[0007] A conveying device according to one aspect of the embodiment includes a first conveying unit and a second conveying unit. The first conveying unit conveys each of a plurality of resin-sealed molded bodies to an output magazine that can accommodate the plurality of resin-sealed molded bodies in a stacked state. The second conveying unit conveys a warpage correction assisting member that assists in correcting warpage of the resin-sealed molded bodies to a position between the resin-sealed molded bodies in the output magazine. [Effects of the Invention]

[0008] According to one aspect of the embodiment, the conveying device can convey the warpage correction assisting member that assists in correcting the warpage of the resin-sealed molded body to the output magazine in which the resin-sealed molded body is stored. [Brief explanation of the drawings]

[0009] [Figure 1] FIG. 1 is a plan view showing an example of the configuration of a tape separating device according to an embodiment. [Figure 2] FIG. 2 is a front view showing an example of the configuration of the tape separating device according to the embodiment. [Figure 3] FIG. 3 is a front view illustrating an example of a conveying device according to an embodiment. [Figure 4] FIG. 4 is a diagram (part 1) for explaining an example of a process for transporting a resin-sealed molded body and a warp correction assisting member by a transport device according to the embodiment. [Figure 5] FIG. 5 is a diagram (part 2) for explaining an example of a process for transporting a resin-sealed molded body and a warp correction assisting member by the transport device according to the embodiment. [Figure 6] FIG. 6 is a diagram (part 3) for explaining an example of a process for transporting a resin-sealed molded body and a warp correction assisting member by the transport device according to the embodiment. [Figure 7] FIG. 7 is a diagram (part 4) for explaining an example of a process for transporting a resin-sealed molded body and a warp correction assisting member by the transport device according to the embodiment. [Figure 8]FIG. 8 is a diagram (part 5) for explaining an example of a process for transporting a resin-sealed molded body and a warp correction assisting member by the transport device according to the embodiment. [Figure 9] FIG. 9 is a diagram (part 6) for explaining an example of a process for transporting a resin-sealed molded body and a warp correction assisting member by the transport device according to the embodiment. [Figure 10] FIG. 10 is a diagram (part 7) for explaining an example of a process for transporting a resin-sealed molded body and a warp correction assisting member by the transport device according to the embodiment. [Figure 11] FIG. 11 is a diagram (part 8) for explaining an example of a process for transporting a resin-sealed molded body and a warp correction assisting member by the transport device according to the embodiment. [Figure 12] FIG. 12 is a diagram (part 9) for explaining an example of a process for transporting a resin-sealed molded body and a warp correction assisting member by the transport device according to the embodiment. [Figure 13] FIG. 13 is a diagram (part 10) for explaining an example of a process for transporting a resin-sealed molded body and a warp correction assisting member by the transport device according to the embodiment. [Figure 14] FIG. 14 is a diagram (part 11) for explaining an example of a process for transporting a resin-sealed molded body and a warp correction assisting member by the transport device according to the embodiment. [Figure 15] FIG. 15 is a diagram (part 12) for explaining an example of a process for transporting a resin-sealed molded body and a warp correction assisting member by the transport device according to the embodiment. [Figure 16] FIG. 16 is a front view showing an example of resin-sealed molded bodies and warp correction auxiliary members stacked in an output magazine according to an embodiment. [Figure 17] FIG. 17 is a plan view showing an example of the configuration of a resin sealing apparatus according to an embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0010] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, embodiments of the conveying device disclosed in the present application will be described in detail with reference to the accompanying drawings. However, the present invention is not limited to the following embodiments.

[0011] As shown in FIG. 1, the tape peeling device 100 according to the embodiment includes an input magazine 1, a pull unit 2, a resin-sealed molded body supply area 3, a heater unit 4, a peeling unit 5, an output unit 6, a warp correction auxiliary material supply unit 7, and a control unit 30.

[0012] 2, the tape separating apparatus 100 further includes conveying devices 8 and 9. Note that the conveying devices 8 and 9 are not shown in Fig. 1. The pulling unit 2, the heater unit 4, the separating unit 5, and the conveying devices 8 and 9 are controlled by a control unit 30.

[0013] The input magazine 1 contains a plurality of resin-sealed molded bodies 10. The resin-sealed molded body 10 is, for example, a plate-like molded body in which a plurality of semiconductor packages are sealed with resin and integrally formed, and tape is attached to one surface of the resin-sealed molded body 10 to prevent resin leakage during resin sealing molding.

[0014] The semiconductor package included in the resin-sealed molded body 10 is, for example, a QFN (Quad Flat No Lead Package), a DFN (Dual Flatpack No-Leaded), or a SON (Small Outline No Lead Package). Note that the resin-sealed molded body 10 is not limited to a configuration including a semiconductor package.

[0015] The pull unit 2 transports the tape-attached resin-sealed molded body 10 housed in the input magazine 1 to the resin-sealed molded body supply area 3. The transport device 8 receives the tape-attached resin-sealed molded body 10 in the resin-sealed molded body supply area 3, transports the received tape-attached resin-sealed molded body 10 to the position of the heater unit 4, and hands it over to the heater unit 4. The heater unit 4 heats the tape-attached resin-sealed molded body 10 to make it easier to peel the tape from the tape-attached resin-sealed molded body 10.

[0016] The conveying device 8 is attached to a belt 13 that is moved by a driving source 12, and moves in the left-right direction in FIG. 2 as the belt 13 is moved by the driving source 12. The conveying device 8 may have a built-in driving source 12 and a running mechanism that moves along rails instead of the belt 13. The driving source 12 is controlled by a control unit 30.

[0017] The conveying device 8 includes a main body 81 attached to the belt 13, a pickup unit 82 that receives the resin-sealed molded body 10, and a movement mechanism 83 that moves the pickup unit 82 in the vertical direction in Fig. 2. The movement mechanism 83 has, for example, an air cylinder or a motor, and is controlled by the control unit 30 (see Fig. 1).

[0018] The conveying device 8 is driven by the drive source 12 to move to a position above the resin-sealed molded body supply region 3, and then driven by the movement mechanism 83 to move the pickup unit 82 downward in FIG. 2 to receive the tape-attached resin-sealed molded body 10 from the resin-sealed molded body supply region 3. The pickup unit 82 has a gripping unit that grips the resin-sealed molded body 10, and receives the resin-sealed molded body 10 from the pull unit 2 by gripping with the gripping unit. Note that the pickup unit 82 may have a suction unit that sucks the resin-sealed molded body 10 instead of the gripping unit.

[0019] After receiving the resin-sealed molded body 10 from the resin-sealed molded body supply region 3, the conveying device 8 moves the pickup unit 82 upward in FIG. 2 by being driven by the movement mechanism 83. Thereafter, the conveying device 8 moves rightward in FIG. 2 by being driven by the drive source 12, and conveys the tape-attached resin-sealed molded body 10 to a position above the heater unit 4 in FIG. 2. The conveying device 8 moves the pickup unit 82 downward in FIG. 2 by being driven by the movement mechanism 83, and delivers the tape-attached resin-sealed molded body 10 to the heater unit 4.

[0020] In addition, after the resin-sealed molded body 10 is heated by the heater unit 4, the conveying device 8 moves the pickup section 82 downward in Figure 2 by driving the moving mechanism 83, and receives the tape-attached resin-sealed molded body 10 heated by the heater unit 4 from the heater unit 4.

[0021] Thereafter, the conveying device 8 moves the pickup unit 82 holding the resin-sealed molded body 10 upward in FIG. 2 by being driven by the moving mechanism 83. Then, the conveying device 8 moves rightward in FIG. 2 by being driven by the driving source 12, and conveys the tape-attached resin-sealed molded body 10 to a position above the peeling unit 5 in FIG. 2. The conveying device 8 moves the pickup unit 82 downward in FIG. 2 by being driven by the moving mechanism 83, and delivers the tape-attached resin-sealed molded body 10 to the peeling unit 5. The peeling unit 5 peels the tape from the tape-attached resin-sealed molded body 10.

[0022] An output magazine 61 capable of accommodating a plurality of stacked resin-sealed molded bodies 10 is disposed in the output unit 6. The output magazine 61 is detachably disposed in the output unit 6, and the output magazine 61 that is carried out from the output unit 6 is transported from the tape peeling device 100 with a plurality of resin-sealed molded bodies 10 accommodated therein, and then transported to a warpage correction unit (not shown) where it is heated.

[0023] The warpage correction auxiliary member supply unit 7 is provided with an input magazine 71 that can accommodate a plurality of warpage correction auxiliary members 11 in a stacked state. The warpage correction auxiliary members 11 are members that are placed between the resin-sealed molded bodies 10 to assist in correcting the warpage of the resin-sealed molded bodies 10.

[0024] A semiconductor package such as a QFN, DFN, or SON included in the resin-sealed molded body 10 has a lead frame arranged biased to one side. In such a resin-sealed molded body 10, a temperature drop after resin-sealing causes the resin to shrink more than the lead frame, resulting in warpage of the resin-sealed molded body 10. Therefore, after being carried out from the tape peeling device 100, the resin-sealed molded body 10 is stacked and stored in the output magazine 61, and is pressurized and heated by the warpage correction unit (not shown) described above to correct the warpage.

[0025] The warpage correction auxiliary members 11 are disposed between the resin-sealed molded bodies 10 stacked and accommodated in the output magazine 61 in the tape peeling device 100. As a result, when heating is performed by a warpage correction unit (not shown), at least one of the load of the warpage correction auxiliary members 11 and the heat transfer between the resin-sealed molded bodies 10 by the warpage correction auxiliary members 11 assists in correcting the warpage of the resin-sealed molded bodies 10.

[0026] The warpage correction auxiliary member 11 is, for example, a member with high thermal conductivity, such as a metal plate. The warpage correction auxiliary member 11 may also be a bendable spacer having a gap that serves as a heat circulation path when stacking the resin-sealed molded bodies 10. The resin-sealed molded body 10 may be any resin-sealed molded body that is prone to warpage, and is not limited to configurations including QFN, DFN, or SON.

[0027] The conveying device 9 is attached to a belt 15 that is moved by a driving source 14, and moves in the left-right direction in FIG. 2 as the belt 15 is moved by the driving source 14. Note that the conveying device 9 may have the driving source 14 built-in, and may move along a rail instead of the belt 15. The driving source 14 is controlled by a control unit 30.

[0028] The conveying device 9 includes a first conveying section 91 and a second conveying section 92. The first conveying section 91 receives the resin-sealed molded body 10 from which the tape has been peeled off by the peeling unit 5. The conveying device 9 then conveys the resin-sealed molded body 10 received from the peeling unit 5 to the position of the output magazine 61 of the output unit 6, and transfers the conveyed resin-sealed molded body 10 to the output magazine 61.

[0029] Furthermore, the second conveying section 92 receives the warp correction auxiliary member 11 stored in the input magazine 71 of the warp correction auxiliary member supply unit 7. Then, the conveying device 9 conveys the warp correction auxiliary member 11 received from the input magazine 71 to the position of the output magazine 61, and delivers the conveyed warp correction auxiliary member 11 to the output magazine 61.

[0030] 3, the first conveyor 91 includes a main body 911 attached to a belt 15 that is moved by a drive source 14 (see FIG. 2) in the left-right direction in FIGS. 2 and 3, a pickup unit 912 that receives the resin-sealed molded body 10, and a movement mechanism 913 that moves the pickup unit 912 in the up-down direction in FIGS. 2 and 3. The movement mechanism 913 has, for example, an air cylinder or a motor, and is controlled by the control unit 30 (see FIG. 1).

[0031] The pickup unit 912 has a gripping portion that grips the resin-sealed molded body 10, and receives the resin-sealed molded body 10 from the heater unit 4 by gripping it with the gripping portion. Note that the pickup unit 912 may be configured to have an adsorption portion that adsorbs the resin-sealed molded body 10 instead of the gripping portion.

[0032] The second conveying section 92 includes a main body 921 attached to the pickup section 912 of the first conveying section 91, a pickup section 922 that receives the warpage correction assist member 11, and a moving mechanism 923 that moves the pickup section 922 in the vertical direction in Figures 2 and 3. The moving mechanism 923 has, for example, an air cylinder or a motor, and is controlled by the control unit 30 (see Figure 1).

[0033] The pickup unit 922 has a suction unit that sucks the warpage correction auxiliary member 11, and receives the warpage correction auxiliary member 11 from the input magazine 71 by suction with the suction unit. Note that the pickup unit 922 may be configured to have a gripping unit that grips the warpage correction auxiliary member 11 instead of the suction unit.

[0034] 2 and 3, the first conveying unit 91 and the second conveying unit 92 are integrally configured and move along a common movement path driven by the same drive source 14. In the example shown in FIGS. 2 and 3, the common movement path is a movement path in the left-right direction along the movement direction of the belt 15.

[0035] The transport device 9 may be configured such that the first transport section 91 and the second transport section 92 are separate entities that move along a common path driven by the same drive source 14. The transport device 9 may also be configured such that the first transport section 91 and the second transport section 92 are driven and moved by different drive sources.

[0036] The first conveying section 91 delivers the resin-sealed molded body 10 to the output unit 6, and the second conveying section 92 conveys the warpage correction assisting member 11 to a position between the resin-sealed molded bodies 10 in the output magazine 61.

[0037] As a result, the conveying device 9 can deliver the resin-sealed molded bodies 10 to the output magazine 61, and can also place the warpage correction auxiliary members 11, which assist in correcting warpage of the resin-sealed molded bodies 10, between the resin-sealed molded bodies 10 in the output magazine 61. Therefore, the conveying device 9 can save the effort of placing the warpage correction auxiliary members 11 between the resin-sealed molded bodies 10 in the output magazine 61.

[0038] The conveying device 9, for example, alternately conveys the resin-sealed molded body 10 to the output magazine 61 by the first conveying section 91 and conveys the warpage correction auxiliary member 11 to the output magazine 61 by the second conveying section 92. Note that the conveying device 9 can also convey the warpage correction auxiliary member 11 to the output magazine 61 by the second conveying section 92 for each of multiple conveyances of the resin-sealed molded body 10 to the output magazine 61 by the first conveying section 91.

[0039] Furthermore, the conveying device 9 conveys the plurality of resin-sealed molded bodies 10 one by one to the output magazine 61, and conveys the plurality of warp correction assist members 11 one by one to the output magazine 61, but is not limited to such an example. For example, the conveying device 9 can also convey two or more resin-sealed molded bodies 10 to the output magazine 61 at a time.

[0040] Here, an example of a process for transporting the resin-sealed molded body 10 and the warpage correction auxiliary member 11 by the transport device 9 will be described. In the following, the upward, downward, rightward, and leftward directions in Figs. 4 to 15 may be simply referred to as the upward, downward, rightward, and leftward directions.

[0041] First, the transport of the resin-sealed molded body 10 to the output magazine 61 by the first transport unit 91 of the transport device 9 will be described. As shown in Fig. 4, in the first transport unit 91 of the transport device 9, the pickup unit 912 is driven by the drive source 14 to move in the vertical direction to a position facing the peeling unit 5. The second transport unit 92 of the transport device 9 is integrated with the first transport unit 91, and therefore moves in conjunction with the movement of the first transport unit 91.

[0042] 5, in the first conveying section 91 of the conveying device 9, the pickup section 912 is driven by the moving mechanism 913 to move downward, and the moved pickup section 912 grips the resin-sealed molded body 10 from which the tape has been peeled off in the peeling unit 5. In this way, the first conveying section 91 of the conveying device 9 receives the resin-sealed molded body 10 from the peeling unit 5. The area in the peeling unit 5 where the first conveying section 91 receives the resin-sealed molded body 10 is an example of a first pickup area.

[0043] Next, in the first conveying section 91 of the conveying device 9, as shown in FIG. 6, the pickup section 912, which is holding the resin-sealed molded body 10 received from the peeling unit 5, moves upward by being driven by the moving mechanism 913.

[0044] Next, in the first transport section 91 of the transport device 9, as shown in FIG. 7, the pickup section 912 is driven by the drive source 14 to move to a position facing the output magazine 61 in the vertical direction.

[0045] 8, in the first conveying section 91 of the conveying device 9, the pickup section 912 moves downward by being driven by the moving mechanism 913. Then, the first conveying section 91 releases the grip of the resin-sealed molded body 10 by the pickup section 912, thereby transferring the resin-sealed molded body 10 to the output magazine 61.

[0046] Next, in the first transport section 91 of the transport device 9, as shown in FIG. 9, the pickup section 912 after delivering the resin-sealed molded body 10 to the output magazine 61 is driven by the movement mechanism 913 to move upward.

[0047] Next, the transport of the warpage correction auxiliary members 11 to the output magazine 61 by the second transport section 92 of the transport device 9 will be described. As shown in Fig. 10, in the second transport section 92 of the transport device 9, the pickup section 922 is driven by the drive source 14 to move from the position shown in Fig. 9 to a position facing the input magazine 71 in the vertical direction.

[0048] Next, in the second conveying section 92 of the conveying device 9, as shown in Figure 11, the pickup section 922 moves downward by being driven by the moving mechanisms 913, 923, and the moved pickup section 922 adsorbs one of the multiple warp correction auxiliary members 11 stored in the input magazine 71.

[0049] As a result, the second transport section 92 of the transport device 9 receives the warp correction assisting member 11 from the input magazine 71. In the input magazine 71, the area where the second transport section 92 receives the warp correction assisting member 11 is an example of a second pickup area.

[0050] Next, in the second conveying section 92 of the conveying device 9, as shown in Figure 12, the pickup section 922, which is adsorbing the warp correction auxiliary member 11 received from the input magazine 71, moves upward by being driven by the moving mechanisms 913, 923.

[0051] Next, in the second transport section 92 of the transport device 9, as shown in FIG. 13, the pickup section 922 is driven by the drive source 14 to move to a position facing the output magazine 61 in the vertical direction.

[0052] 14, in the second transport section 92 of the transport device 9, the pickup section 922 moves downward by being driven by the moving mechanisms 913 and 923. Then, the second transport section 92 releases the pickup section 922 from the suction state of the warpage correction auxiliary member 11, thereby delivering the warpage correction auxiliary member 11 to the output magazine 61.

[0053] 15, in the second conveying section 92 of the conveying device 9, after delivering the warpage correction auxiliary member 11 to the output magazine 61, the pickup section 922 moves upward by being driven by the moving mechanisms 913 and 923. In this way, the conveying device 9 conveys the warpage correction auxiliary member 11 to the output magazine 61.

[0054] 4 to 15, the conveying device 9 can deliver the resin-sealed molded body 10 and the warpage correction auxiliary member 11 to the output magazine 61. Therefore, the second conveying section 92 of the conveying device 9 can convey the warpage correction auxiliary member 11, which assists in correcting the warpage of the resin-sealed molded body 10, to a position between the resin-sealed molded bodies 10 in the output magazine 61.

[0055] As a result, as shown in Figure 16, the conveying device 9 automatically places the warp correction auxiliary members 11 between the resin-sealed molded bodies 10, thereby reducing the workload compared to when the warp correction auxiliary members 11 are manually placed between the resin-sealed molded bodies 10.

[0056] 10 to 15 once every time the conveying device 9 repeats the operations shown in Figures 4 to 9 a plurality of times. In this case, one warpage correction auxiliary member 11 is delivered to the output magazine 61 every time a plurality of resin-sealed molded bodies 10 are delivered to the output magazine 61.

[0057] In this case, a warpage correction auxiliary member 11 is stacked for each of the plurality of resin-sealed molded bodies 10. This also allows the warpage correction auxiliary members 11 to be automatically placed between the resin-sealed molded bodies 10, thereby reducing the workload on the conveying device 9 compared to when the warpage correction auxiliary members 11 are manually placed between the resin-sealed molded bodies 10.

[0058] In the above example, the conveying device 9 is provided as a part of the tape separating device 100, but may be configured to be disposed outside the tape separating device 100. For example, the conveying device 9 may be provided as a part of a resin sealing device 200 shown in FIG.

[0059] The resin sealing apparatus 200 shown in Figure 17 includes an input magazine 20, a pull unit 21, a lead frame supply section 22, a tablet supply area 23, an inloader 24, resin sealing molds 25, 26, an outloader 27, a degasser 28, an output unit 6, and a warp correction auxiliary material supply unit 7.

[0060] The resin sealing apparatus 200 further includes a conveying device 9 (not shown). The conveying device 9 is not shown in Fig. 17. The output unit 6 and the warpage correction auxiliary material supplying unit 7 of the resin sealing apparatus 200 are the same as the output unit 6 and the warpage correction auxiliary material supplying unit 7 of the tape peeling apparatus 100.

[0061] The input magazine 20 accommodates a plurality of lead frames 16 in a stacked state, and the pull unit 21 takes out the lead frame 16 from the input magazine 20 and transports the taken-out lead frame 16 to a lead frame supply unit 22.

[0062] The inloader 24 receives the lead frame 16 from the lead frame supply unit 22 and also receives the resin tablet 17 from the tablet supply area 23. Then, the inloader 24 supplies the lead frame 16 and the resin tablet 17 to the resin sealing molds 25, 26. The resin sealing molds 25, 26 place the lead frame 16 and the resin tablet 17 in a space surrounded by an upper mold and a lower mold, and apply pressure to the space while heating the upper mold and the lower mold to melt the resin tablet 17 and produce the resin-sealed molded body 10.

[0063] The outloader 27 receives the resin-sealed molded body 10 from the resin-sealing molds 25, 26, and transports the received resin-sealed molded body 10 to the degator 28. The degator 28 removes unnecessary resin portions such as culls and runners from the resin-sealed molded body 10.

[0064] The conveying device 9 receives the resin-sealed molded body 10 from which unnecessary portions have been removed by the degater 28, and conveys the received resin-sealed molded body 10 to the output magazine 61 of the output unit 6. The conveying device 9 also receives the warp correction auxiliary member 11 from the input magazine 71 of the warp correction auxiliary member supply unit 7, and conveys the received warp correction auxiliary member 11 to the output magazine 61.

[0065] In the resin sealing apparatus 200, the conveying device 9 alternately conveys, for example, the resin-sealed molded body 10 to the output magazine 61 by the first conveying section 91 and the warp correction auxiliary member 11 to the output magazine 61 by the second conveying section 92.

[0066] In addition, in the resin sealing apparatus 200, the conveying device 9 can also transport the warp correction auxiliary member 11 to the output magazine 61 once by the second conveying section 92 for each of the multiple times the first conveying section 91 transports the resin-sealed molded body 10 to the output magazine 61.

[0067] 3 to 15, in the resin sealing apparatus 200, the positions of the degator 28, the output magazine 61, and the input magazine 71 may be arranged on a straight line. That is, similar to the case of the conveying process shown in FIGS. 3 to 15, in the conveying direction of the resin-sealed molded body 10 by the first conveying unit 91, they may be arranged in the order of a first pickup area where the first conveying unit 91 receives the resin-sealed molded body 10, the output magazine 61, and a second pickup area where the second conveying unit 92 receives the warpage correction auxiliary member 11.

[0068] In this case, the first pickup area is the area in the degasser 28 where the resin-sealed molded body 10 is received by the first conveying section 91, and the second pickup area is the area in the input magazine 71 where the warp correction auxiliary member 11 is received by the second conveying section 92.

[0069] The resin sealing apparatus 200 may also be configured to include a pull unit 2, a resin-sealed molded body supply area 3, a heater unit 4, and a peeling unit 5 between the degater 28 and the output unit 6. That is, the resin sealing apparatus 200 may also be configured to include a tape peeling apparatus 100. In this case, tape is attached to the lead frames 16 housed in the input magazine 20 to prevent resin leakage.

[0070] As described above, the conveying device 9 according to the embodiment includes the first conveying unit 91 and the second conveying unit 92. The first conveying unit 91 conveys each of the multiple resin-sealed molded bodies 10 to the output magazine 61, which can accommodate the multiple resin-sealed molded bodies 10 in a stacked state. The second conveying unit 92 conveys the warpage correction auxiliary members 11, which assist in correcting warpage of the resin-sealed molded bodies 10, to positions in the output magazine 61 between the resin-sealed molded bodies 10. As a result, the conveying device 9 automatically places the warpage correction auxiliary members 11 between the resin-sealed molded bodies 10 in the output magazine 61, thereby reducing the workload compared to manually placing the warpage correction auxiliary members 11 between the resin-sealed molded bodies 10.

[0071] Furthermore, the first conveying section 91 and the second conveying section 92 have a common movement path and are driven integrally by the same driving source 14. In this way, according to the conveying device 9, since the first conveying section 91 and the second conveying section 92 are driven by the same driving source 14, the drive configuration for the first conveying section 91 and the second conveying section 92 can be simplified.

[0072] Further, in the conveying direction of the resin-sealed molded body 10 by the first conveying unit 91, the first pickup area where the first conveying unit 91 receives the resin-sealed molded body 10, the output magazine 61, and the second pickup area where the second conveying unit 92 receives the warpage correction auxiliary member 11 are arranged in this order. As a result, the conveying device 9 can shorten the moving distances of the first conveying unit 91 and the second conveying unit 92 as much as possible, and can prevent the time required for the process of conveying the resin-sealed molded body 10 and the warpage correction auxiliary member 11 by the first conveying unit 91 and the second conveying unit 92 from becoming long.

[0073] The conveying device 9 is provided as a part of a tape peeling device 100 that peels off the tape attached to the resin-sealed molded body 10. As a result, in the tape peeling device 100, the warpage correction auxiliary members 11 are automatically placed between the resin-sealed molded bodies 10 in the output magazine 61, so that the workload can be reduced compared to when the warpage correction auxiliary members 11 are manually placed between the resin-sealed molded bodies 10.

[0074] The conveying device 9 is provided as a part of the resin sealing device 200. As a result, in the resin sealing device 200, the warpage correction auxiliary members 11 are automatically placed between the resin-sealed molded bodies 10 in the output magazine 61, which reduces the workload compared to when the warpage correction auxiliary members 11 are manually placed between the resin-sealed molded bodies 10.

[0075] Further advantages and modifications will readily occur to those skilled in the art. Therefore, the invention in its broader aspects is not limited to the specific details and representative embodiments shown and described above. Accordingly, various modifications may be made without departing from the spirit or scope of the general inventive concept as defined by the appended claims and their equivalents. [Explanation of symbols]

[0076] 1 Input Magazine 2 Pull Unit 3 Resin-sealed molded body supply area 4 Heater Unit 5 Peeling unit 6 Output Unit 7. Warp correction auxiliary material supply unit 8,9 Conveyor device 10 Resin-sealed molded body 11. Warp correction auxiliary member 14 Power Source 61 Output Magazine 91 First conveyor section 92 Second conveying section 100 Tape peeling device 200 Resin sealing equipment

Claims

1. a first conveying unit that conveys each of the plurality of resin-sealed molded bodies to an output magazine that can accommodate the plurality of resin-sealed molded bodies in a stacked state; a second conveying unit that conveys a warpage correction assisting member that assists in correcting warpage of the resin-sealed molded body to a position between the resin-sealed molded bodies in the output magazine, The first transport unit is a first main body portion that is moved by a drive source; a first holding portion that holds the resin-sealed molded body; a first moving mechanism that moves the first holding portion in a vertical direction relative to the first main body portion, The second transport unit is a second body portion attached to the first holding portion; a second holding portion that holds the warp correction auxiliary member; a second moving mechanism that moves the second holding portion in the up-down direction relative to the second main body portion; A conveying device characterized by:

2. In a conveying direction of the resin-sealed molded body by the first conveying unit, a first pickup area where the first conveying unit receives the resin-sealed molded body, the output magazine, and a second pickup area where the second conveying unit receives the warpage correction assist member are arranged in this order, The first conveying unit and the second conveying unit are disposed in this order in a conveying direction of the resin-sealed molded body by the first conveying unit.

2. The conveying device according to claim 1.

3. The tape peeling device is provided as a part of the tape peeling device that peels off the tape attached to the resin-sealed molded body.

3. The conveying device according to claim 1 or 2.

4. Installed as part of the resin sealing equipment 4. The conveying device according to claim 1, wherein the conveying device is a conveying device for conveying a plurality of objects.

Images