Tape application device

Abstract

To provide a tape sticking device capable of preventing generation of creases in a tape even if a ring-shaped reinforcement part is removed from a wafer stuck to the tape of a frame with tape.SOLUTION: A tape sticking device 2 comprises a frame support table 4 supporting a frame F, lift means 6 lifting the frame support table 4, tape sticking means 8 and control means. The tape sticking means 8 includes a tape feed-out part 14, a tape take-up part 16, and a pressing roller 18 by which a fed-out tape T is moved and stuck while pressing it from one end to the other end of the frame F supported by the frame support table 4. The control means sticks the tape T to one end of the frame F by locating the pressing roller 18 at a pressing position and applying a tension to the tape T, moves the pressing roller 18 toward the other end of the frame F, and keeps the tension applied to the tape T constant by moving the frame support table 4 up synchronously with the movement of the pressing roller 18.SELECTED DRAWING: Figure 3

Description

[Technical Field]

[0001] The present invention relates to a tape application device that applies tape to a frame having an opening in the center for accommodating a wafer. [Background technology]

[0002] A wafer has on its surface a device region where a plurality of devices such as ICs and LSIs are partitioned by planned division lines, and a peripheral excess region surrounding the device region.The back surface of the wafer is ground to a desired thickness, and then the wafer is divided into individual device chips using a dicing machine and a laser processing machine, and each of the divided device chips is used in electrical equipment such as mobile phones and personal computers.

[0003] In order to facilitate the transportation of ground wafers, the applicant has proposed a technology in which a ring-shaped reinforcing portion is left on the back surface corresponding to the peripheral excess area, and the wafer is subjected to a predetermined processing, and then a dicing tape is attached to the back surface of the wafer, the wafer is supported by a frame, and the ring-shaped reinforcing portion is removed from the wafer (see, for example, Patent Document 1).

[0004] However, the technology disclosed in Patent Document 1 has the problem that it is difficult to attach dicing tape to the back surface of a wafer that has a convex ring-shaped reinforcing portion formed on the back surface corresponding to the peripheral excess area, and to integrate it with a frame, and it is also difficult to cut and remove the ring-shaped reinforcing portion from the wafer, resulting in low productivity.

[0005] Therefore, the applicant developed a processing device for removing convex ring-shaped reinforcement portions from wafers having such convex reinforcement portions formed on the back surface corresponding to the peripheral excess area, and filed a patent application on July 17, 2020 (Patent Application No. 2020-123301).

[0006] This processing equipment is a wafer cassette table on which a wafer cassette containing a plurality of wafers is placed; a wafer carrying-out means for carrying out wafers from a wafer cassette placed on the wafer cassette table; a wafer table that supports the front surface side of the wafer carried out by the wafer carrying-out means; a frame receiving means for receiving a plurality of ring-shaped frames each having an opening for receiving a wafer; a frame unloading means for unloading the frame from the frame storage means; a frame table for supporting the frame carried out by the frame carrying-out means; a tape applying means disposed above the frame table for applying tape to the frame; a tape-attached frame transport means for transporting the frame with the tape attached to the wafer table and placing the tape-attached frame on the wafer table by positioning the opening of the frame over the backside of the wafer supported on the wafer table; a tape pressing means for pressing the tape of the tape-attached frame onto the back surface of the wafer; a frame unit carrying-out means for carrying out, from the wafer table, the frame unit in which the tape of the tape-attached frame and the back surface of the wafer are pressure-bonded by the tape pressure-bonding means; a reinforcing portion removing means for cutting and removing the ring-shaped reinforcing portion from the wafer of the frame unit carried out by the frame unit carrying-out means; a ring-free unit carrying-out means for carrying out the ring-free unit from the reinforcing part removing means; and a frame cassette table on which a frame cassette containing the ring-less unit carried out by the ring-less unit carrying-out means is placed. [Prior art documents] [Patent documents]

[0007] [Patent Document 1] Japanese Patent Application Laid-Open No. 2010-62375 Summary of the Invention [Problem to be solved by the invention]

[0008] However, when the ring-shaped reinforcing portion is removed from the wafer attached to the tape of the tape-attached frame, wrinkles occur in the tape attached to the frame and the wafer, which causes problems when dividing the wafer into individual device chips.

[0009] In view of the above, the object of the present invention is to provide a tape application device that can prevent wrinkles from occurring in the tape even when a ring-shaped reinforcing portion is removed from a wafer adhered to the tape of a tape-attached frame. [Means for solving the problem]

[0010] According to the present invention, there is provided the following tape application device that solves the above-mentioned problems: "A tape application device that applies tape to a frame having an opening in the center for accommodating a wafer, The apparatus comprises at least a frame support table for supporting a frame, a lifting means for lifting the frame support table, a tape application means disposed opposite the frame support table, and a control means, the tape applying means comprises a tape feeding section that feeds out the tape, a tape winding section that winds up used tape, and a pressure roller that is disposed between the tape feeding section and the tape winding section and moves while pressing the fed tape from one end to the other end of the frame supported on the frame support table, thereby applying the tape; the axial dimension of the pressing surface of the pressing roller is equal to or greater than the width dimension of the tape; The control means positions the pressure roller at the pressing position. The pressing surface of the pressing roller is brought into contact with the tape from one end in the width direction to the other end in the width direction, A tape application device is provided which applies tension to the tape to apply the tape to one end of the frame, moves the pressure roller toward the other end of the frame, and raises the frame support table in synchronization with the movement of the pressure roller to keep the tension applied to the tape constant.

[0011] Preferably, when the pressure roller is positioned at the pressing position, the tape forms an elevation angle from the pressure roller toward the tape take-up section, and the frame support table is raised in synchronization with the movement of the pressure roller so that the elevation angle remains constant. Preferably, the tape applying means includes a cutter that rotates in contact with the frame to cut the tape. [Effects of the Invention]

[0012] The tape application device of the present invention is a tape application device that applies tape to a frame having an opening in the center for accommodating a wafer, and includes at least a frame support table that supports the frame, an elevating means that elevates the frame support table, a tape application means that is disposed opposite the frame support table, and a control means, and the tape application means includes a tape feed-out section that feeds out the tape, a tape winding section that winds up used tape, and a pressure roller that is disposed between the tape feed-out section and the tape winding section and moves from one end of the frame supported on the frame support table to the other end while pressing the tape that has been fed out, to apply the tape, the axial dimension of the pressing surface of the pressing roller is equal to or greater than the width dimension of the tape; The control means positions the pressure roller at the pressing position. The pressing surface of the pressing roller is brought into contact with the tape from one end in the width direction to the other end in the width direction, By applying tension to the tape and attaching it to one end of the frame, the pressure roller is moved toward the other end of the frame, and the frame support table is raised in synchronization with the movement of the pressure roller to keep the tension applied to the tape constant, so that even when the ring-shaped reinforcing part is removed from the wafer attached to the tape on the tape-attached frame, wrinkles can be prevented from occurring in the tape, and therefore there is no problem when dividing the wafer into individual device chips. [Brief explanation of the drawings]

[0013] [Figure 1] 1 is a perspective view of a tape application device constructed in accordance with the present invention; [Figure 2] 2 is a schematic diagram of the tape application device shown in FIG. 1. [Figure 3] FIG. 10 is a schematic diagram showing a state in which the pressure roller is positioned at the pressing position and tape is attached to one end of the frame. [Figure 4] FIG. 4 is a schematic diagram showing a state in which the pressure roller has been moved from the state shown in FIG. 3; [Figure 5] 5 is a schematic diagram showing a state in which the pressure roller has been further moved from the state shown in FIG. 4. [Figure 6] (a) is a perspective view of a wafer with a reinforced portion, and (b) is a perspective view of a wafer without a reinforced portion. [Figure 7] 6(a) is a perspective view showing a state in which the back surface of the wafer with the reinforcement portion shown in FIG. 6(a) is attached to the tape of the tape-attached frame, and FIG. 6(b) is a perspective view showing a state in which the front surface of the wafer with the reinforcement portion shown in FIG. 6(a) is attached to the tape of the tape-attached frame. [Figure 8] 6(a) is a perspective view showing a state in which the back surface of the wafer with a reinforcement portion shown in FIG. 6(b) is attached to the tape of the tape-attached frame, and FIG. 6(b) is a perspective view showing a state in which the front surface of the wafer without a reinforcement portion shown in FIG. 6(b) is attached to the tape of the tape-attached frame. DETAILED DESCRIPTION OF THE INVENTION

[0014] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A preferred embodiment of a tape application device constructed according to the present invention will now be described with reference to the drawings.

[0015] (Tape application device 2) Referring to Figure 1, the tape application device, generally designated by the reference numeral 2, comprises at least a frame support table 4 that supports a frame F, a lifting means 6 that raises and lowers the frame support table 4, a tape application means 8 arranged opposite the frame support table 4, and a control means 10.

[0016] (Lifting means 6) The lifting means 6 includes a guide member 12 that supports the frame support table 4 so that it can be raised and lowered, and a lifting mechanism (not shown) attached to the guide member 12. The lifting mechanism may include, for example, a ball screw that is connected to the frame support table 4 and extends in the vertical direction, and a motor that rotates the ball screw. The lifting means 6 raises and lowers the frame support table 4 along the guide member 12 by operating the lifting mechanism.

[0017] (Tape attachment means 8) The tape application means 8 includes a tape delivery section 14 that delivers the tape T, a tape winding section 16 that winds up the used tape T, and a pressure roller 18 that is disposed between the tape delivery section 14 and the tape winding section 16 and moves while pressing the delivered tape T from one end to the other end of the frame F supported on the frame support table 4 to apply the tape T.

[0018] (Tape feeding section 14 of tape application means 8) The tape feeding section 14 includes a support roller 20 that supports a roll tape R in which unused tape T is wound into a cylindrical shape, a feed roller 22 arranged below the support roller 20, a motor (not shown) that rotates the feed roller 22, and a driven roller 24 that rotates in conjunction with the rotation of the feed roller 22.

[0019] The tape feeding section 14 rotates the driven roller 24 together with the feed roller 22 using a motor, thereby feeding out the tape T sandwiched between the feed roller 22 and the driven roller 24 from the roll tape R. In addition, the release paper P is peeled off from the tape T that has passed between the feed roller 22 and the driven roller 24, and the peeled release paper P is taken up by the release paper roller 26 and collected.

[0020] (Tape winding section 16 of tape application means 8) The tape winding section 16 includes a winding roller 28 that winds up used tape T, a motor (not shown) that rotates the winding roller 28, and a pair of guide rollers 30 installed between the feed roller 22 and the winding roller 28.

[0021] In the tape winding section 16, a motor is used to rotate a winding roller 28, which opens a circular opening T O The used tape T on which the tape guide rollers 30 are wound up by the winding roller 28 while being guided by the pair of guide rollers 30 (see FIG. 1).

[0022] (Pressing roller 18 of tape application means 8) 2 and 3, the pressure roller 18 is raised and lowered by a pressure roller positioning means (not shown), and is positioned at an upper standby position shown in Fig. 2 and a lower pressing position shown in Fig. 3. When the pressure roller 18 is positioned at the lower pressing position, it is moved in the Y-axis direction by a pressure roller moving means (not shown).

[0023] The Y-axis direction is the direction indicated by the arrow Y in Fig. 1. The X-axis direction indicated by the arrow X in Fig. 1 is the direction perpendicular to the Y-axis direction, and the Z-axis direction indicated by the arrow Z in Fig. 1 is the up-down direction perpendicular to the X-axis and Y-axis directions. The XY plane defined by the X-axis and Y-axis directions is substantially horizontal.

[0024] (Cutting mechanism 32 of tape application means 8) 1, the tape application means 8 of the illustrated embodiment further includes a cutting mechanism 32 including a cutter 44 that rotates in contact with the frame F to cut the tape T. The cutting mechanism 32 includes a Z-axis guide member 34 extending in the Z-axis direction, a Z-axis movable member 36 supported by the Z-axis guide member 34 so as to be movable in the Z-axis direction, and a Z-axis feed means (not shown) that moves the Z-axis movable member 36 in the Z-axis direction. The Z-axis feed means may include a ball screw that is connected to the Z-axis movable member 36 and extends in the Z-axis direction, and a motor that rotates the ball screw.

[0025] The cutting mechanism 32 also includes a motor 38 fixed to the underside of the tip of the Z-axis movable member 36, and an arm piece 40 that is rotated by the motor 38 about an axis extending in the Z-axis direction. First and second hanging pieces 42a, 42b are attached to the underside of the arm piece 40 at a distance from each other. A circular cutter 44 is supported on the first hanging piece 42a so as to be rotatable about an axis perpendicular to the Z-axis direction, and a pressure roller 46 is supported on the second hanging piece 42b so as to be rotatable about an axis perpendicular to the Z-axis direction.

[0026] (Control means 10) The control means 10 is composed of a computer having a central processing unit (CPU) that performs calculations according to a control program, a read-only memory (ROM) that stores the control program, etc., and a readable / writable random access memory (RAM) that stores the calculation results, etc. The control means 10 controls the operation of the lifting means 6 and the tape applying means 8.

[0027] (Frame F) The frame F to which the tape T is applied by the tape application device 2 described above is annular and has a circular opening Fa in the center for accommodating the wafer.

[0028] (Tape T) Tape T may be an adhesive tape with an adhesive layer (glue layer) on one side, or a thermocompression sheet without an adhesive layer. A thermocompression sheet is a sheet of thermoplastic synthetic resin (e.g., polyolefin resin) that softens or melts and exhibits adhesive strength when heated to a temperature near its melting point.

[0029] A release paper P is attached to the adhesive surface of the adhesive tape, while the pressure-sensitive adhesive surface of the thermocompression sheet may or may not have a release paper P. When a thermocompression sheet without a release paper P is used, the tape application device 2 does not need to collect the release paper P, and therefore does not need to be equipped with a release paper roller 26.

[0030] Furthermore, if the tape T is a thermo-compression sheet, a heater and a temperature sensor (neither of which are shown) are built into at least one of the frame support table 4 or the pressure roller 18, and when the thermo-compression sheet is adhered to the frame F, at least one of the frame support table 4 or the pressure roller 18 is heated to a temperature close to the melting point of the thermo-compression sheet.

[0031] Next, the operation of the tape application device 2 as described above will be described.

[0032] First, before the frame F is placed on the frame support table 4, the frame support table 4 is positioned to a position where it can receive the frame F (for example, the position shown in FIGS. 1 and 2), and the pressure roller 18 is positioned in the upper standby position. Then, the tape T is fed from the roll tape R, and the release paper P is peeled off, and the tape T is positioned above the frame support table 4 in a taut state without slack. If the tape T is an adhesive tape, the adhesive side of the tape T positioned above the frame support table 4 is faced downward.

[0033] Next, when a frame F is carried out by a frame carrying-out means (not shown) from a frame storage means (not shown) that stores a plurality of frames F and placed on the frame support table 4, the control means 10 operates the lifting means 6 and the pressure roller positioning means to position the frame support table 4 at the application start position, as shown in FIG. 3, and also positions the pressure roller 18 at the lower pressing position, thereby applying tension to the tape T and applying the tape T to one end of the frame F.

[0034] As described above, when the frame support table 4 is positioned at the application start position and the pressure roller 18 is positioned at the pressing position, the tape T forms an elevation angle α from the pressure roller 18 toward the guide roller 30 below the tape winding section 16, as shown in Figure 3.

[0035] Next, while the pressure roller 18 presses the tape T against the frame F, the pressure roller 18 is moved in the Y-axis direction toward the other end of the frame F. This allows the tape T to be adhered to the frame F with uniform tension being applied to the tape T.

[0036] When moving the pressure roller 18, it is important to maintain a constant tension on the tape T by raising the frame support table 4 in synchronization with the movement of the pressure roller 18. Specifically, as shown in Figures 4 and 5, the control means 10 controls the frame support table 4 to gradually rise in synchronization with the movement of the pressure roller 18 so that the elevation angle α remains constant.

[0037] If the tape T is a thermocompression sheet, the temperature of the upper surface of the frame support table 4 or the temperature of the outer circumferential surface of the pressure roller 18 is adjusted to a temperature at which the tape T softens or melts, and then the pressure roller 18 is rolled in the Y-axis direction while applying a constant tension to the tape T, thereby thermocompressing the tape T to the frame F. Of course, when thermocompressing the tape T, the frame support table 4 is gradually raised in synchronization with the movement of the pressure roller 18 so that the elevation angle α remains constant.

[0038] After the tape T has been applied to the frame F, the cutter 44 and pressure roller 46 of the cutting mechanism 32 of the tape application means 8 are lowered, and the cutter 44 is pressed against the tape T on the frame F, while the pressure roller 46 presses the frame F from above the tape T. Next, the motor 38 rotates the arm piece 40, and the cutter 44 and pressure roller 46 move in a circular motion along the frame F. This allows the tape T that extends beyond the outer periphery of the frame F to be cut along the frame F.

[0039] In addition, since the press roller 46 presses the frame F from above the tape T, the frame F and the tape T are prevented from shifting in position when the tape T is being cut. O The used tape T on which the above-mentioned pattern is formed is taken up by the tape take-up unit 16.

[0040] Then, the frame support table 4 is lowered to a position where the tape-attached frame F, with the tape T attached to the frame F, can be transported, and then the tape-attached frame F is transported by a tape-attached frame transport means (not shown) to a device (not shown) that positions the opening Fa of the tape-attached frame F over the wafer and attaches the wafer to the tape T on the tape-attached frame F. Examples of wafers that can be attached to the tape T on the tape-attached frame F include wafers 50, 50' shown in FIG.

[0041] 6(a) shows a surface 50a of a wafer 50 in which a device region 56 is formed, in which a plurality of devices 52 such as ICs and LSIs are partitioned by grid-like planned division lines 54, and a peripheral surplus region 58 is formed surrounding the device region 56. In FIG. 6(a), for convenience, a boundary 60 between the device region 56 and the peripheral surplus region 58 is shown by a two-dot chain line, but in reality, there is no line indicating the boundary 60.

[0042] On the back surface 50b side of the wafer 50, a ring-shaped reinforcing portion 62 is formed in a convex shape in the peripheral surplus region 58, and the thickness of the peripheral surplus region 58 is greater than the thickness of the device region 56. Furthermore, the wafer to be attached to the tape T of the tape-attached frame F may be one that does not have a ring-shaped reinforcing portion provided on the back surface 50b', as in the wafer 50' shown in Figure 6(b).

[0043] When adhering the wafer 50 to the tape T of the tape-attached frame F, the back surface 50b of the wafer 50 may be adhered to the tape T as shown in Fig. 7(a), or the front surface 50a of the wafer 50 may be adhered to the tape T as shown in Fig. 7(b). Also, when adhering a wafer 50' without a ring-shaped reinforcing portion to the tape T, the back surface 50b' of the wafer 50' may be adhered to the tape T as shown in Fig. 8(a), or the front surface 50a' of the wafer 50' may be adhered to the tape T as shown in Fig. 8(b).

[0044] In the illustrated embodiment, as described above, the tape T is attached to the frame F with uniform tension applied to the tape T, so that no wrinkles occur in the tape T when the wafer 50 (or 50') is attached to the tape T on the tape-attached frame F.

[0045] Then, after adhering the wafer 50 having the ring-shaped reinforcing portion 62 to the tape T, an annular groove is formed along the base of the ring-shaped reinforcing portion 62 by ablation processing using a laser processing device or cutting processing using a dicing device, and then even if the ring-shaped reinforcing portion 62 is peeled off from the tape T, no wrinkles will occur in the tape T. This is because, as described above, in the illustrated embodiment, the tape T is adhered to the frame F with uniform tension applied to the tape T.

[0046] In other words, the tape application device 2 can apply sufficient and uniform tension to the tape T so that wrinkles do not occur in the tape T even when the ring-shaped reinforcing portion 62 is removed from the wafer 50 adhered to the tape T of the tape-attached frame F while applying the tape T to the frame F.

[0047] As described above, in the tape application device 2 of the illustrated embodiment, even if the ring-shaped reinforcing portion 62 is removed from the wafer 50 adhered to the tape T of the tape-attached frame F, it is possible to prevent wrinkles from occurring in the tape T, so that there is no problem when dividing the wafer 50 into individual device chips. [Explanation of symbols]

[0048] 2: Tape application device 4: Frame support table 6: Lifting means 8: Tape attachment means 10: Control means 14: Tape feeding section 16: Tape winding section 18: Pressure roller 44: Cutter 50: Wafer F: Frame Fa: Frame opening T: Tape α: elevation angle

Claims

1. A tape application device that applies tape to a frame having an opening in the center for accommodating a wafer, The apparatus comprises at least a frame support table for supporting a frame, a lifting means for lifting the frame support table, a tape application means disposed opposite the frame support table, and a control means, the tape applying means comprises a tape feeding section that feeds out the tape, a tape winding section that winds up used tape, and a pressure roller that is disposed between the tape feeding section and the tape winding section and moves while pressing the fed tape from one end to the other end of the frame supported on the frame support table, thereby applying the tape; the axial dimension of the pressing surface of the pressing roller is equal to or greater than the width dimension of the tape; The control means positions the pressure roller at a pressing position, brings the pressure surface of the pressure roller into contact with the tape from one widthwise end to the other widthwise end, applies tension to the tape to apply it to one end of the frame, moves the pressure roller toward the other end of the frame, and raises the frame support table in synchronization with the movement of the pressure roller to maintain a constant tension on the tape in this tape application device.

2. 2. A tape application device according to claim 1, wherein when said pressure roller is positioned at said pressing position, the tape forms an angle of elevation from said pressure roller toward said tape winding section, and said frame support table is raised in synchronization with the movement of said pressure roller so that said angle of elevation remains constant.

3. 2. A tape application device according to claim 1, wherein said tape application means includes a cutter that rotates in contact with the frame to cut the tape.

Images