Mounting device and mounting method

Abstract

To improve an operation rate of a main transfer part.SOLUTION: A mounted device comprises a mount part that forms an attachment having a base plate attached to a frame via an adhesive tape, by sticking the adhesive tape on the base plate and the frame. The mount part is provided next to a main transfer passage adjacent to a carrying-in part into which a carrying-in cassette housing the base plate before the formation of the attachment is carried from the outside, and a carrying-out part from which a carrying-out cassette housing the attachment is carried out. The attachment is formed by receiving the base plate taken out of the carrying-in cassette by the main transfer part moving along the main transfer passage. The attachment formed in the mounted part is housed in the carrying-out cassette by the main transfer part.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present disclosure relates to a mounting device and a mounting method. [Background technology]

[0002] In recent years, in order to meet the demand for smaller and lighter semiconductor devices, after elements, circuits, terminals, etc. are formed on a first main surface of a substrate such as a semiconductor wafer, the second main surface opposite the first main surface of the substrate is ground to thin the substrate. Dicing is performed after or before thinning.

[0003] During processing such as thinning and dicing, the first main surface of the substrate is protected with a protective tape. The protective tape used is one whose adhesive strength is reduced by exposure to ultraviolet light. After the adhesive strength is reduced, the protective tape can be easily peeled off from the substrate by a peeling operation.

[0004] After the protective tape is irradiated with ultraviolet light and before the protective tape is peeled off from the substrate, the substrate is attached to a frame via an adhesive tape separate from the protective tape. The adhesive tape is attached to the frame so as to cover the opening of the annular frame and is bonded to the second main surface of the substrate at the opening of the frame.

[0005] The device of Patent Document 1 has a processing unit that grinds the back surface of the wafer, a UV irradiation unit that irradiates ultraviolet rays onto a protective tape that protects the front surface of the wafer, a mounting unit that attaches the wafer to a frame via adhesive tape that is affixed to the back surface of the wafer, and a peeling unit that peels the protective tape off the wafer. [Prior art documents] [Patent documents]

[0006] [Patent Document 1] Japanese Patent Application Publication No. 2002-343756 Summary of the Invention [Problem to be solved by the invention]

[0007] One aspect of the present disclosure provides a technique for improving the availability of a main transport section. [Means for solving the problem]

[0008] The present invention employs the configurations described in the claims. [Effects of the Invention]

[0009] According to one aspect of the present disclosure, the availability of the main transport section can be improved. [Brief explanation of the drawings]

[0010] [Figure 1] FIG. 1 is a perspective view showing a substrate before processing by a substrate processing system according to an embodiment. [Figure 2] FIG. 2 is a perspective view showing a substrate after processing by the substrate processing system according to one embodiment. [Figure 3] FIG. 3 is a plan view illustrating a substrate processing system according to an embodiment. [Figure 4] FIG. 4 is a diagram illustrating a dicing unit according to one embodiment. [Figure 5] FIG. 5 is a diagram illustrating a rough-ground portion of a thinning portion according to one embodiment. [Figure 6] FIG. 6 is a diagram illustrating an ultraviolet irradiation unit according to one embodiment. [Figure 7] FIG. 7 is a diagram illustrating a mount according to one embodiment. [Figure 8] FIG. 8 illustrates a peeler according to one embodiment. [Figure 9] FIG. 9 is a diagram illustrating an ID attaching unit according to one embodiment. [Figure 10] FIG. 10 is a flowchart of a substrate processing method according to one embodiment. [Figure 11] FIG. 11 is a plan view showing a main part of a substrate processing system according to an embodiment. [Figure 12]FIG. 12 is a side view showing a mount section according to one embodiment, and an ultraviolet irradiation section and a delivery section provided above the mount section and overlapping the mount section. [Figure 13] FIG. 13 is a side view showing a peeling portion and an ID attaching portion provided above and overlapping the peeling portion according to one embodiment. [Figure 14] FIG. 14 is a diagram illustrating the operation of the second sub-transport unit according to one embodiment. [Figure 15] FIG. 15 is a side view showing a peeling section and an ID pasting section provided above the peeling section so as to overlap the peeling section according to a first modified example. [Figure 16] FIG. 16 is a plan view showing a main part of a substrate processing system according to a second modified example. DETAILED DESCRIPTION OF THE INVENTION

[0011] Hereinafter, embodiments of the present disclosure will be described with reference to the drawings. In each drawing, identical or corresponding components are denoted by the same or corresponding reference numerals, and description thereof will be omitted. In the following description, the X direction, Y direction, and Z direction are perpendicular to each other, the X direction and Y direction are horizontal directions, and the Z direction is vertical direction. The rotation direction around the vertical axis is also referred to as the θ direction. In this specification, downward means downward in the vertical direction, and upward means upward in the vertical direction.

[0012] 1 is a perspective view showing a substrate before processing by a substrate processing system according to one embodiment. The substrate 10 is, for example, a semiconductor substrate or a sapphire substrate. A first main surface 11 of the substrate 10 is partitioned by a plurality of streets formed in a grid pattern, and elements, circuits, terminals, etc. are formed in advance in each partitioned area. By dividing the substrate 10 along the plurality of streets formed in a grid pattern, chips 13 (see FIG. 2) are obtained.

[0013] A protective tape 14 is attached to the first main surface 11 of the substrate 10. The protective tape 14 protects the first main surface 11 of the substrate 10 during processing such as dicing and thinning, and protects elements, circuits, terminals, etc. that have been previously formed on the first main surface 11. The protective tape 14 covers the entire first main surface 11 of the substrate 10.

[0014] The protective tape 14 is composed of a sheet substrate and an adhesive applied to the surface of the sheet substrate. The adhesive may be one that hardens when irradiated with ultraviolet light, thereby reducing its adhesive strength. After the adhesive strength has been reduced, the protective tape 14 can be easily peeled off from the substrate 10 by a peeling operation.

[0015] 2 is a perspective view showing a substrate after processing by a substrate processing system according to one embodiment. The substrate 10 is diced into a thin plate and then attached to a frame 19 via adhesive tape 18. The protective tape 14 shown in FIG. 1 is peeled off and removed from the substrate 10.

[0016] The adhesive tape 18 is composed of a sheet substrate and an adhesive applied to the surface of the sheet substrate. The adhesive tape 18 is attached to the annular frame 19 so as to cover the opening of the frame 19, and is bonded to the substrate 10 at the opening of the frame 19. This allows the substrate 10 to be transported while holding the frame 19, improving the handleability of the substrate 10.

[0017] As shown in FIG. 2, a DAF (Die Attach Film) 15 may be provided between the adhesive tape 18 and the substrate 10. The DAF 15 is an adhesive sheet for die bonding. The DAF 15 is used for stacking the chips 13, etc. The DAF 15 may be either conductive or insulating.

[0018] The DAF 15 is formed to be smaller than the opening of the frame 19 and is provided inside the frame 19. The DAF 15 covers the entire second main surface 12 of the substrate 10. If the chip 13 is not stacked, the DAF 15 is not necessary, and therefore the substrate 10 may be attached to the frame 19 only via the adhesive tape 18.

[0019] Fig. 3 is a plan view showing a substrate processing system according to one embodiment. In Fig. 3, the insides of the load cassette 35 and the load cassette 45 are cut away to show the insides of the load cassette 35 and the load cassette 45. In Fig. 3, arrows indicate the movement directions of the substrate 10 and the frame 19 in the mounting device including the mounting unit 500, the peeling unit 600, and the like.

[0020] The substrate processing system 1 performs various processes such as dicing the substrate 10, thinning the substrate 10, irradiating the protective tape 14 with ultraviolet light, mounting the substrate 10, peeling the protective tape 14 from the substrate 10, and attaching an ID to a frame 19.

[0021] The substrate processing system 1 includes a control unit 20, a carry-in unit 30, an unloading unit 40, a main transport path 50, a main transport unit 58, and various processing units. The processing units are not particularly limited, but may include, for example, a dicing unit 100, a thinning unit 200, an ultraviolet irradiation unit 400, a mounting unit 500, a peeling unit 600, and an ID attachment unit 700.

[0022] The control unit 20 is configured, for example, by a computer, and has a CPU (Central Processing Unit) 21, a storage medium 22 such as a memory, an input interface 23, and an output interface 24, as shown in Fig. 3. The control unit 20 performs various controls by causing the CPU 21 to execute a program stored in the storage medium 22. The control unit 20 also receives signals from the outside via the input interface 23 and transmits signals to the outside via the output interface 24.

[0023] The program for the control unit 20 is stored in an information storage medium and installed from the information storage medium. Examples of information storage media include a hard disk (HD), a flexible disk (FD), a compact disk (CD), a magnetic optical disk (MO), and a memory card. The program may also be downloaded from a server via the Internet and installed.

[0024] A carry-in cassette 35 containing unprocessed substrates 10 is carried in from the outside to the carry-in section 30. The carry-in cassette 35 stores a plurality of substrates 10 at intervals in the Z direction before they are attached to a frame 19 via, for example, adhesive tape 18.

[0025] The input cassette 35 has a plurality of pairs of horizontally arranged storage plates 36 spaced apart in the Z direction to store a plurality of substrates 10 at intervals in the Z direction. As shown in FIG. 3, the pair of storage plates 36 support both ends of the substrates 10 in the Y direction.

[0026] The input cassette 35 may store the substrate 10 horizontally with the protective tape 14 facing upward to prevent deformation such as curling of the protective tape 14. The substrate 10 removed from the input cassette 35 is turned upside down and transported to a processing unit such as the dicing unit 100.

[0027] The loading section 30 includes a loading plate 31 on which the loading cassette 35 is placed. A plurality of loading plates 31 are provided in a row in the Y direction. The number of loading plates 31 is not limited to that shown in the figure.

[0028] The unloading section 40 is a section through which the unloading cassette 45 containing the processed substrates 10 is unloaded to the outside. The unloading cassette 45 stores a plurality of substrates 10, each attached to a frame 19 via adhesive tape 18, spaced apart in the Z direction.

[0029] The output cassette 45 has a plurality of pairs of horizontally arranged storage plates 46 spaced apart in the Z direction to store a plurality of substrates 10 at intervals in the Z direction. As shown in FIG. 3, the pair of storage plates 46 support both ends of the frame 19 in the Y direction.

[0030] The unloading section 40 includes a mounting plate 41 on which the unloading cassette 45 is placed. A plurality of mounting plates 41 are provided in a row in the Y direction. The number of mounting plates 41 is not limited to that shown in the figure.

[0031] The main transport path 50 is a passageway along which the main transport unit 58 transports the substrates 10 to the loading unit 30, the unloading unit 40, and a plurality of processing units, and extends, for example, in the Y direction. The main transport path 50 is provided with a Y-axis guide 51 extending in the Y direction, and a Y-axis slider 52 is movable along the Y-axis guide 51.

[0032] The main transport unit 58 holds the substrate 10 and moves along the main transport path 50 to transport the substrate 10. The main transport unit 58 may hold the substrate 10 via a frame 19. The main transport unit 58 vacuum-adsorbs the substrate 10 and the frame 19, but may also adsorb them electrostatically. The main transport unit 58 includes a Y-axis slider 52 as a transport base and moves along the Y direction. The main transport unit 58 is movable not only in the Y direction but also in the X direction, Z direction, and θ direction.

[0033] The main transfer section 58 may have a plurality of holders for holding the substrate 10. The plurality of holders are arranged side by side at intervals in the Z direction. The plurality of holders may be used differently depending on the processing stage of the substrate 10.

[0034] For example, main transfer unit 58 has a first holding unit used to remove substrate 10 from input cassette 35, and a second holding unit used to transfer substrate 10 whose strength has been reduced by processing such as dicing or thinning. The second holding unit may be used to transfer substrate 10 before it is attached to frame 19. In this case, main transfer unit 58 may further have a third holding unit used to transfer substrate 10 after it has been attached to frame 19. The third holding unit holds substrate 10 via frame 19.

[0035] The loading unit 30, the unloading unit 40, and the multiple processing units are arranged adjacent to the main transport path 50 when viewed in the vertical direction. For example, the longitudinal direction of the main transport path 50 is the Y direction. The loading unit 30 and the unloading unit 40 are arranged adjacent to each other on one side of the main transport path 50 in the X direction (the left side in FIG. 3, hereinafter also referred to as the "front side"). Furthermore, the dicing unit 100, the thinning unit 200, the peeling unit 600, and the ID affixing unit 700 are arranged adjacent to each other on the opposite side of the main transport path 50 in the X direction (the right side in FIG. 3, hereinafter also referred to as the "rear side"). The peeling unit 600 and the ID affixing unit 700 are stacked in the Z direction, and the ID affixing unit 700 is arranged above the peeling unit 600 and overlaps it. Furthermore, a mounting unit 500 is arranged adjacent to one end of the main transport path 50 in the Y direction. The mount section 500 and the ultraviolet irradiation section 400 are stacked in the Z direction, and the ultraviolet irradiation section 400 is provided above the mount section 500 so as to overlap the mount section 500 .

[0036] According to this embodiment, the loading section 30 and the multiple processing sections are provided adjacent to the main transport path 50. Therefore, the main transport section 58 can deliver the substrate 10 to and from the loading section 30 and the multiple processing sections. This makes it possible to multiply the functions of the main transport section 58, increase the workload of the main transport section 58, and improve the availability of the main transport section 58.

[0037] Furthermore, according to this embodiment, the unloading part 40 is also provided adjacent to the main transport path 50. Therefore, the main transport part 58 can deliver the substrate 10 to the unloading part 40. This makes it possible to further multiply the functionality of the main transport part 58, further increasing the workload of the main transport part 58 and further improving the availability of the main transport part 58. Furthermore, since multiple processing parts and the unloading part 40 are provided adjacent to the main transport path 50, if an abnormality occurs in a substrate 10 in one processing part, the abnormal substrate 10 can be quickly transported to the unloading part 40 without being transported to another processing part.

[0038] The arrangement and number of processing units are not limited to those shown in Fig. 3 and can be selected arbitrarily. In addition, multiple processing units may be arranged in a distributed or integrated manner in any unit. Each processing unit will be described below.

[0039] 4 is a diagram showing a dicing unit according to one embodiment. The dicing unit 100 dices the substrate 10. In this specification, dicing the substrate 10 refers to processing for dividing the substrate 10 into a plurality of chips 13, and includes dividing the substrate 10 and forming starting points for division in the substrate 10. The dicing unit 100 has, for example, a dicing table 110, a substrate processing unit 120, and a movement mechanism unit 130.

[0040] The dicing table 110 holds the substrate 10 via the protective tape 14. For example, the dicing table 110 holds the substrate 10 horizontally with the second main surface 12 of the substrate 10 facing upward. As the dicing table 110, for example, a vacuum chuck is used, but an electrostatic chuck or the like may also be used.

[0041] The substrate processing unit 120 performs dicing of the substrate 10 held by, for example, the dicing table 110. The substrate processing unit 120 has, for example, a laser oscillator 121 and an optical system 122 that irradiates the substrate 10 with a laser beam from the laser oscillator 121. The optical system 122 is composed of a condenser lens that condenses the laser beam from the laser oscillator 121 toward the substrate 10.

[0042] The movement mechanism 130 relatively moves the dicing table 110 and the substrate processing unit 120. The movement mechanism 130 is configured, for example, with an XYZθ stage or the like that moves the dicing table 110 in the X direction, Y direction, Z direction, and θ direction.

[0043] The control unit 20 controls the substrate processing unit 120 and the movement mechanism unit 130 to dice the substrate 10 along the streets of the substrate 10. As shown in FIG. 4, a modified layer 2 that serves as the starting point for fracture may be formed inside the substrate 10, or a laser-processed groove may be formed on the laser-irradiated surface of the substrate 10 (for example, the top surface in FIG. 4). The laser-processed groove may or may not penetrate the substrate 10 in the thickness direction.

[0044] When forming the modified layer 2 inside the substrate 10, a laser beam that is transparent to the substrate 10 is used. The modified layer 2 is formed, for example, by locally melting and solidifying the inside of the substrate 10. On the other hand, when forming a laser-processed groove on the laser-irradiated surface of the substrate 10, a laser beam that is absorbable by the substrate 10 is used.

[0045] In this embodiment, the substrate processing unit 120 has a laser oscillator 121 that irradiates a laser beam onto the substrate 10, but it may also have a cutting blade that cuts the substrate 10, or a scrubber that forms a scribe groove on the surface of the substrate 10.

[0046] In this embodiment, the dicing unit 100 is provided as part of the substrate processing system 1, but may be provided outside the substrate processing system 1. In this case, the substrate 10 is diced and then carried into the carrying-in unit 30 from the outside, and is then removed from the carrying-in cassette 35 in the carrying-in unit 30 and transported to the thinning unit 200 instead of the dicing unit 100.

[0047] The thinning unit 200 (see FIG. 3) thins the substrate 10 by processing the second main surface 12 opposite to the first main surface 11 of the diced substrate 10 that is protected by the protective tape 14.

[0048] When the starting point of division is formed in the dicing section 100, processing stress acts on the substrate 10 in the thinning section 200, causing a crack to propagate from the starting point of division in the thickness direction of the substrate, and the substrate 10 is divided into multiple chips 13.

[0049] Furthermore, when the modified layer 2 is formed inside the substrate 10 in the dicing section 100, the modified layer 2 is removed by thinning the substrate 10 in the thinning section 200.

[0050] The thinning unit 200 includes, for example, a rotary table 201, a chuck table 202, a rough grinding unit 210, a finish grinding unit 220, and a damaged layer removing unit 230, as shown in FIG.

[0051] The rotary table 201 is rotated around the center line of the rotary table 201. A plurality of chuck tables 202 (for example, four in FIG. 3) are arranged around the rotation center line of the rotary table 201 at equal intervals.

[0052] The multiple chuck tables 202 rotate together with the turntable 201 around the center line of the turntable 201. The center line of the turntable 201 is set vertical. Every time the turntable 201 rotates, the chuck tables 202 facing the rough grinding unit 210, the finish grinding unit 220, and the damaged layer removal unit 230 are changed.

[0053] Each chuck table 202 holds the substrate 10 via the protective tape 14. The chuck table 202 holds the substrate 10 horizontally with the second main surface 12 of the substrate 10 facing upward. As the chuck table 202, for example, a vacuum chuck is used, but an electrostatic chuck or the like may also be used.

[0054] 5 is a diagram showing a rough grinding unit of a thinning unit according to one embodiment. The rough grinding unit 210 performs rough grinding of the substrate 10. The rough grinding unit 210 has a rotary grindstone 211, as shown in FIG. 5, for example. The rotary grindstone 211 is rotated about its center line and lowered to process the upper surface (i.e., the second main surface 12) of the substrate 10 held by the chuck table 202.

[0055] The finish grinding unit 220 performs finish grinding of the substrate 10. The configuration of the finish grinding unit 220 is substantially the same as the configuration of the rough grinding unit 210. However, the average grain size of the abrasive grains of the rotary grinding stone of the finish grinding unit 220 is smaller than the average grain size of the abrasive grains of the rotary grinding stone of the rough grinding unit 210.

[0056] The damaged layer removal unit 230 removes a damaged layer formed on the second main surface 12 of the substrate 10 by grinding such as rough grinding or finish grinding. For example, the damaged layer removal unit 230 supplies a processing liquid to the substrate 10 to perform a wet etching process to remove the damaged layer. Note that the method for removing the damaged layer is not particularly limited.

[0057] The thinning unit 200 may have a polishing unit that polishes the substrate 10. The configuration of the polishing unit is substantially the same as that of the rough grinding unit 210. Examples of polishing the substrate 10 include CMP (Chemical Mechanical Polishing). The thinning unit 200 may also have a gettering unit that forms gettering sites (e.g., crystal defects or distortions) that capture impurities. The number of chuck tables 202 is four in FIG. 3, but this can be changed appropriately depending on the number of types of processing. One processing unit (e.g., damaged layer removal unit 230) may also perform multiple types of processing (e.g., damaged layer removal and gettering site formation).

[0058] 6 is a diagram showing an ultraviolet irradiation unit according to one embodiment. The ultraviolet irradiation unit 400 irradiates ultraviolet light onto the protective tape 14 that protects the diced and thinned substrate 10. The adhesive of the protective tape 14 can be hardened by irradiation with ultraviolet light, thereby reducing the adhesive strength of the protective tape 14. After the adhesive strength has been reduced, the protective tape 14 can be easily peeled off from the substrate 10 by a peeling operation.

[0059] The ultraviolet irradiation unit 400 has a UV lamp 410 inside a housing into which the substrate 10 protected by the protective tape 14 is carried. The UV lamp 410 irradiates the protective tape 14 with ultraviolet light from the side opposite the substrate 10 relative to the protective tape 14.

[0060] 7 is a diagram showing a mounting unit according to one embodiment. In FIG. 7, the two-dot chain line indicates the state after mounting of the adhesive tape 18 and DAF 15. The mounting unit 500 mounts the substrate 10 to the frame 19 via the adhesive tape 18, which is provided on the opposite side of the substrate 10 from the protective tape 14 after UV irradiation. The adhesive tape 18 is attached to the annular frame 19 so as to cover the opening of the frame 19, and is bonded to the substrate 10 at the opening of the frame 19.

[0061] In the mounting unit 500, the diced and thinned substrate 10 may be attached to the frame 19 only via the adhesive tape 18, but in FIG. 7, the substrate 10 is attached to the frame 19 via the pre-laminated adhesive tape 18 and the DAF 15. The DAF 15 is formed smaller than the opening of the frame 19 and is provided inside the frame 19. The DAF 15 covers the entire second main surface 12 of the substrate 10.

[0062] The mounting section 500 has, for example, a mounting table 510 that holds the substrate 10 and the frame 19, and a laminating roller 520 that attaches the substrate 10 to the frame 19 held by the mounting table 510 via adhesive tape 18.

[0063] The mount table 510 holds the frame 19 and the substrate 10, which is placed in the opening of the frame 19, in parallel. The frame 19 and the substrate 10 may be held horizontally. The upper surface of the frame 19 and the upper surface of the substrate 10 may have a height difference that is approximately the same as the thickness of the DAF 15. If the DAF 15 is not used, the upper surface of the frame 19 and the upper surface of the substrate 10 may be placed on the same plane.

[0064] The adhesive tape 18 and the like are supplied wound around a core and are used by being pulled out from the core. The adhesive tape 18 passes between the laminating roller 520 and the substrate 10 while clinging to the laminating roller 520 due to tension, and is laminated on the substrate 10. The adhesive tape 18 also passes between the laminating roller 520 and the frame 19 while clinging to the laminating roller 520 due to tension, and is laminated on the frame 19.

[0065] 7, the mounting unit 500 bonds the adhesive tape 18 to the frame 19 and the substrate 10 sequentially from one end of the frame 19 to the other end. This makes it possible to prevent air from getting trapped. Furthermore, since the substrate 10 is kept flat while the adhesive tape 18 is being bonded to the substrate 10, damage to the substrate 10 can be prevented.

[0066] Fig. 8 is a diagram showing a peeling unit according to one embodiment. In Fig. 8, the two-dot chain line indicates the state before the protective tape 14 is peeled off. The peeling unit 600 peels off the protective tape 14 from the substrate 10 attached to the frame 19 via the adhesive tape 18. The protective tape 14 that is no longer needed can be removed. The peeling unit 600 has, for example, a peeling table 610 and a peeling roller 620.

[0067] The protective tape 14 passes between the peeling roller 620 and the substrate 10 while clinging to the peeling roller 620 due to tension, and is peeled off from the substrate 10. During this time, the peeling table 610 holds the substrate 10 and the frame 19 flat via the adhesive tape 18 and the like. The protective tape 14 peeled off from the substrate 10 is taken up on a take-up core (not shown).

[0068] 8, the peeling unit 600 peels the protective tape 14 from the substrate 10 while gradually deforming the protective tape 14 from one end side to the other end side of the substrate 10. This allows the protective tape 14 to be smoothly peeled from the substrate 10. Furthermore, since the substrate 10 is held flat while the protective tape 14 is being peeled from the substrate 10, damage to the substrate 10 can be suppressed.

[0069] The peeling section 600 may peel the protective tape 14 and the substrate 10 in parallel.

[0070] 9 is a diagram showing an ID affixing unit according to one embodiment. The ID affixing unit 700 reads the identification information 16 (see FIG. 2) on the substrate 10 from which the protective tape 14 has been peeled off, prints the read identification information 16 on a label 17 (see FIG. 2), and affixes the printed label 17 to the frame 19. The identification information 16 is information that identifies the substrate 10 and is expressed by numbers, letters, symbols, one-dimensional codes, two-dimensional codes, etc.

[0071] The ID affixing unit 700 has, for example, an ID affixing table 710, a reader 720, and a label printer 730. The ID affixing table 710 holds the substrate 10 and the frame 19 via adhesive tape 18 or the like. The reader 720 reads the identification information 16 pre-formed on the substrate 10. The label printer 730 prints the identification information 16 read by the reader 720 on a label 17 and affixes the printed label 17 to the frame 19 using a laminator or the like. The identification information 16 printed on the label 17 and the identification information 16 pre-formed on the substrate 10 may represent the same content in different formats, as shown in FIG. 2 .

[0072] Next, a description will be given of a substrate processing method using the substrate processing system 1 having the above configuration. Fig. 10 is a flowchart of a substrate processing method according to one embodiment.

[0073] 10, the substrate processing method includes a loading step S101, a dicing step S102, a thinning step S103, an ultraviolet ray irradiation step S104, a mounting step S105, a peeling step S106, an ID affixing step S107, and a loading step S108. These steps are performed under the control of the control unit 20. The order of these steps is not limited to the order shown in FIG. 10. For example, the dicing step S102 may be performed after the thinning step S103.

[0074] In the carry-in step S101, the main transfer section 58 takes out the substrate 10 from the carry-in cassette 35 placed in the carry-in section 30, and transfers the taken-out substrate 10 to the dicing section 100.

[0075] 4, in the dicing step S102, the dicing unit 100 dices the substrate 10. While the substrate 10 is being diced, the first main surface 11 of the substrate 10 is protected by a protective tape 14. The substrate 10 diced in the dicing unit 100 is transported to the thinning unit 200 by the main transport unit 58.

[0076] 5, in the thinning step S103, the thinning unit 200 processes the second main surface 12 of the substrate 10 to thin the substrate 10. While the substrate 10 is being thinned, the first main surface 11 of the substrate 10 is protected by a protective tape 14. The substrate 10 thinned in the thinning unit 200 is transported by the main transport unit 58 to the delivery unit 300 (described below), and then transported by the first sub-transport unit 910 (described below) to the ultraviolet irradiation unit 400.

[0077] 6, in the ultraviolet irradiation step S104, an ultraviolet irradiation unit 400 irradiates ultraviolet rays onto the protective tape 14. The adhesive of the protective tape 14 can be hardened by the irradiation of ultraviolet rays, thereby reducing the adhesive strength of the protective tape 14. After the adhesive strength has been reduced, the protective tape 14 can be easily peeled off from the substrate 10 by a peeling operation.

[0078] The ultraviolet ray irradiation step S104 may be performed after the mounting step S105, but in this embodiment it is performed before the mounting step S105. This prevents deterioration of the adhesive tape 18 that is bonded to the substrate 10 in the mounting step S105 due to ultraviolet ray irradiation. The substrate 10 with the protective tape 14 attached and irradiated with ultraviolet rays in the ultraviolet ray irradiation unit 400 is transported to the mounting unit 500 by a first sub-conveyor unit 910, which will be described later.

[0079] 7, in the mounting step S105, the mounting unit 500 mounts the diced and thinned substrate 10 on the frame 19 via the adhesive tape 18. The mounting unit 500 may mount the diced and thinned substrate 10 on the frame 19 via only the adhesive tape 18, but in this embodiment, the mounting unit 500 mounts the substrate 10 on the frame 19 via the adhesive tape 18 and the DAF 15 that have been laminated in advance. The substrate 10 mounted on the frame 19 via the adhesive tape 18 in the mounting unit 500 is transported to the peeling unit 600 by the second sub-transport unit 920, which will be described later.

[0080] 8, in the peeling step S106, the peeling unit 600 peels the protective tape 14 from the substrate 10 that has been attached to the frame 19 via the adhesive tape 18 by the mounting unit 500. The protective tape 14 that is no longer needed can be removed. The substrate 10 from which the protective tape 14 has been peeled in the peeling unit 600 is transported to the ID affixing unit 700 by the third sub-transport unit 930, which will be described later.

[0081] In the ID attachment process S107, as shown in FIG. 9, the ID attachment unit 700 reads the identification information 16 (see FIG. 2) pre-formed on the substrate 10, prints the read identification information 16 on a label 17 (see FIG. 2), and attaches the printed label 17 to the frame 19.

[0082] In the carry-out step S108, the main transport unit 58 transports the substrate 10 from the ID affixing unit 700 to the carry-out unit 40, where the substrate 10 is stored inside the carry-out cassette 45. The carry-out cassette 45 is carried out from the carry-out unit 40 to the outside. The substrate 10 carried out together with the carry-out cassette 45 is picked up for each chip 13. In this manner, the chips 13 are manufactured.

[0083] Fig. 11 is a plan view showing the main parts of a substrate processing system according to one embodiment. Fig. 12 is a side view showing a mount unit according to one embodiment, and an ultraviolet irradiation unit and a transfer unit that are provided above the mount unit and overlap the mount unit. Fig. 13 is a side view showing a peeling unit according to one embodiment, and an ID attachment unit that is provided above the peeling unit and overlap the peeling unit. In Figs. 11 to 13, arrows indicate the movement directions of the substrate 10 and frame 19 in the mount unit 500, peeling unit 600, etc.

[0084] The substrate processing system 1 includes a mount unit 500. As shown in FIG. 12, the mount unit 500 includes, for example, a mount table 510, a laminating roller 520, a mount table guide 530, a frame supply unit 540, and a frame transport unit 550.

[0085] 11, the mount table guides 530 extend in the X direction and are provided as a pair spaced apart in the Y direction. The mount table 510 is movable along the pair of mount table guides 530. A servo motor, for example, is used as a drive source for moving the mount table 510.

[0086] As shown in Figure 12, a laminating roller 520 is provided above the rear end of the mount table guide 530, and a frame supply unit 540 is provided below the front end of the mount table guide 530. A frame cassette 541 containing frames 19 before the substrates 10 are mounted is carried into the frame supply unit 540 from outside. The frame cassette 541 stores multiple frames 19 lined up in the Z direction. Note that the frame cassette 541 does not necessarily have to be provided, and an operator may set the frames 19 in the frame supply unit 540. The frames 19 may be set in the frame supply unit 540 in multiple batches, with multiple frames 19 at a time.

[0087] As shown in Fig. 3, the loading section 30 and the unloading section 40 may be provided on one side (front side) of the width direction of the main transport path 50, and the mounting section 500 may be provided adjacent to one end of the main transport path 50 in the longitudinal direction. In this case, as shown in Fig. 12, a frame cassette 541 may be loaded into the frame supply section 540 from the front side. Unprocessed articles (substrates 10 and frames 19) are loaded from the front side, and processed articles (frames 19 with substrates 10 mounted) are unloaded to the front side. Loading and unloading of articles can be concentrated at the front side, improving maintainability and transport efficiency.

[0088] The frame transport unit 550 removes a frame 19 from a frame cassette 541 placed in the frame supply unit 540, and places the removed frame 19 on the mount table 510. The frame transport unit 550 is disposed, for example, between a pair of mount table guides 530 when viewed in the Z direction, and is movable in the Z direction. A servo motor, for example, is used as a drive source for moving the frame transport unit 550.

[0089] The frame transport unit 550 has a suction unit 559 that suctions the frame 19. A plurality of suction units 559 are provided, for example, at intervals in the X direction, and suction both ends of the frame 19 in the X direction. The suction unit 559 has a suction hole. Gas from the suction hole is sucked by a suction source, for example, a vacuum pump. By operating the suction source to generate negative pressure in the suction unit 559, the frame transport unit 550 vacuum-sucks the frame 19. On the other hand, by stopping the operation of the suction source and opening the suction hole to the atmosphere, the frame transport unit 550 releases the vacuum suction of the frame 19. When the vacuum suction is released, a positive pressure may be generated in the frame transport unit 550. In this specification, negative pressure refers to a pressure lower than atmospheric pressure, and positive pressure refers to a pressure higher than atmospheric pressure.

[0090] The mount table 510 receives the frame 19 from the frame transport unit 550 at the end of the mount table guide 530 on the main transport path 50 side (front side). Specifically, the frame transport unit 550 is first raised from the position indicated by the solid line in FIG. 12 to the position indicated by the two-dot chain line in FIG. 12 and passes in the Z direction between a pair of mount table guides 530 spaced apart in the Y direction. At this time, the mount table 510 waits in a retracted position that does not interfere with the lifting of the frame transport unit 550. After that, when the mount table 510 is moved directly below the frame transport unit 550, the frame transport unit 550 is lowered and the frame 19 held by the frame transport unit 550 is placed on the mount table 510.

[0091] Thereafter, the mount table 510 is moved in the X direction (rearward) away from the main transport path 50, and receives the substrate 10 from the first sub-transport unit 910 (described later) while being moved directly below the laminating rollers 520. The substrate 10 is placed in the opening of the frame 19, and the mount table 510 holds the substrate 10 via the protective tape 14.

[0092] Thereafter, the mount table 510 is moved further in the X direction (rearward) away from the main transport path 50, and is moved directly below the laminating roller 520. The laminating roller 520 bonds the adhesive tape 18 to the frame 19 placed on the mount table 510 and the substrate 10 arranged in the opening of the frame 19, as shown in Fig. 7. The adhesive tape 18 is provided on the opposite side (upper side) of the protective tape 14 relative to the substrate 10.

[0093] The substrate processing system 1 includes an ultraviolet ray irradiation unit 400. As shown in Figures 11 and 12, the ultraviolet ray irradiation unit 400 is provided above the mount unit 500 so as to overlap the mount unit 500. For example, the ultraviolet ray irradiation unit 400 is provided so as to overlap a pair of mount table guides 530 when viewed in the Z direction.

[0094] Because the ultraviolet irradiation unit 400 and the mounting unit 500 are stacked in the Z direction, the installation area of ​​the substrate processing system 1 can be reduced as viewed in the Z direction compared to when the ultraviolet irradiation unit 400 and the mounting unit 500 are arranged side by side as viewed in the Z direction. In addition, the flow of transporting the substrate 10 from the ultraviolet irradiation unit 400 to the mounting unit 500 is good.

[0095] The substrate processing system 1 may include a transfer unit 300 that receives the diced and thinned substrate 10 from the main transfer unit 58 (see FIG. 3). The transfer unit 300 receives the substrate 10 from the main transfer unit 58 and transfers the received substrate 10 to a first sub-transfer unit 910, which will be described later.

[0096] The delivery unit 300 is provided adjacent to the main transport path 50 as shown in Fig. 11 and above the mounting unit 500 so as to overlap the mounting unit 500 as shown in Fig. 12. For example, the delivery unit 300 is provided so as to overlap a pair of mount table guides 530 when viewed in the Z direction. When the mounting unit 500 is provided adjacent to the Y-direction end of the main transport path 50, the delivery unit 300 is also provided adjacent to the Y-direction end of the main transport path 50.

[0097] Because the delivery unit 300 and the mounting unit 500 are stacked in the Z direction, the installation area of ​​the substrate processing system 1 can be reduced as viewed in the Z direction compared to when the mounting unit 500 and the delivery unit 300 are arranged side by side as viewed in the Z direction. Furthermore, the delivery unit 300 can be arranged at the same height as the ultraviolet irradiation unit 400 and next to the ultraviolet irradiation unit 400, which improves the flow of transport of the substrate 10 from the delivery unit 300 to the ultraviolet irradiation unit 400.

[0098] 11, as viewed in the Z direction, the delivery section 300, the ultraviolet irradiation section 400, and the lamination rollers 520 are arranged in this order from the front to the rear. This improves the flow of the substrate 10 from the delivery section 300 through the ultraviolet irradiation section 400 until it is placed on the mount table 510, thereby improving the transport efficiency of the substrate 10.

[0099] The delivery unit 300 may also serve as an alignment unit that acquires information used to align the mounting position of the substrate 10 relative to the frame 19. This allows the position of the substrate 10 in the X direction, Y direction, and θ direction to be corrected when a positional deviation of the substrate 10 occurs, for example, due to the transfer of the substrate 10 between the thinning unit 200 and the main transfer unit 58, or the transfer of the substrate 10 between the main transfer unit 58 and the delivery unit 300. The correction is performed so that the center of the opening of the frame 19 coincides with the center of the substrate 10, and so that the orientation of the substrate 10 relative to the frame 19 is in a predetermined direction.

[0100] 12 , the delivery unit 300 includes, for example, a delivery table 310 that holds the substrate 10, an imaging unit 320 that captures an image of the substrate 10 held by the delivery table 310, and a rotation drive unit 330 that rotates the delivery table 310. For example, a vacuum chuck is used as the delivery table 310, but an electrostatic chuck or the like may also be used. The imaging unit 320 is provided, for example, above the delivery table 310, and captures an image of the substrate 10 from above the substrate 10 held by the delivery table 310. The rotation drive unit 330 changes the imaging position of the substrate 10 held by the delivery table 310 by rotating the delivery table 310.

[0101] The delivery unit 300 converts the image of the substrate 10 captured by the imaging unit 320 into an electrical signal and transmits it to the control unit 20. The control unit 20 detects the position of the substrate 10 held on the delivery table 310 by image processing the image of the substrate 10 captured by the imaging unit 320. Known detection methods are used, such as matching the pattern of the substrate 10 (e.g., a division pattern) with a reference pattern, or determining the center point and orientation of the substrate 10 from multiple points on the periphery of the substrate 10. The orientation of the substrate 10 is detected from the position of a notch formed on the periphery of the substrate 10. An orientation flat may be used instead of the notch. This allows the control unit 20 to determine the position of the substrate 10 in a coordinate system fixed to the delivery table 310.

[0102] The alignment of the substrate 10 in the θ direction is performed, for example, by rotating the delivery table 310. On the other hand, the alignment of the substrate 10 in the X direction and the Y direction is performed after the substrate 10 is released from the delivery table 310, and is performed while the substrate 10 is transported from the delivery section 300 to the mounting section 500 via the ultraviolet irradiation section 400. For example, the alignment of the substrate 10 in the X direction and the Y direction is performed when the first sub-transport section 910 described below receives the substrate 10 from the delivery table 310 or when the first sub-transport section 910 delivers the substrate 10 to the mount table 510. This allows the placement position of the substrate 10 relative to the mount table 510 to be aligned, and ultimately the mounting position of the substrate 10 relative to the frame 19 to be aligned.

[0103] The substrate processing system 1 includes a peeling unit 600. The peeling unit 600 includes, for example, a peeling table 610, a peeling roller 620, and a peeling table guide 630, as shown in FIG.

[0104] 11, a pair of peeling table guides 630 extend in the X direction and are provided at an interval in the Y direction. The peeling table 610 is movable along the pair of peeling table guides 630. A servo motor, for example, is used as a drive source for moving the peeling table 610.

[0105] 13, the peeling table 610 receives the frame 19 from the second sub-conveyor 920 (described later) at the center in the X direction of the peeling table guide 630. The substrate 10 is attached to the frame 19 in advance via an adhesive tape 18. The peeling table 610 holds the substrate 10 and the frame 19 via the adhesive tape 18.

[0106] Thereafter, the peeling table 610 is moved in the X direction (rearward) so as to move away from the main transport path 50, and is moved directly below the peeling roller 620. The peeling roller 620 peels the protective tape 14 from the substrate 10 while sequentially deforming the protective tape 14 from one end side of the substrate 10 toward the other end side, as shown in FIG.

[0107] The substrate processing system 1 may include an ID affixing unit 700. As shown in Figures 11 and 13, the ID affixing unit 700 is provided adjacent to the main transport path 50. The main transport unit 58 transports the frame 19, to which the ID affixing unit 700 has affixed the label 17, from the ID affixing unit 700 to the unloading unit 40, and stores the frame 19 in the unloading cassette 45 placed in the unloading unit 40.

[0108] 11 and 13, in the substrate processing system 1, the ID affixing unit 700 may be provided above the peeling unit 600 so as to overlap the peeling unit 600. For example, the ID affixing unit 700 is provided so as to overlap a pair of peeling table guides 630 when viewed in the Z direction.

[0109] Because the peeling unit 600 and the ID affixing unit 700 are stacked in the Z direction, the installation area of ​​the substrate processing system 1 can be reduced as viewed in the Z direction compared to when the peeling unit 600 and the ID affixing unit 700 are arranged side by side as viewed in the Z direction. In addition, the flow of transporting the substrate 10 from the peeling unit 600 to the ID affixing unit 700 is good.

[0110] As shown in FIG. 11 and other figures, the substrate processing system 1 may include a main transfer unit 58 (see FIG. 3), a first sub-transfer unit 910, a second sub-transfer unit 920, and a third sub-transfer unit 930. The main transfer unit 58 transfers the substrate 10 from the loading unit 30 to the transferring unit 300 via the dicing unit 100 and the thinning unit 200. The first sub-transfer unit 910 transfers the substrate 10 from the transferring unit 300 to the mounting unit 500 via the ultraviolet irradiation unit 400. The second sub-transfer unit 920 transfers the substrate 10 from the mounting unit 500 to the peeling unit 600 and also turns the substrate 10 upside down. The third sub-transfer unit 930 transfers the substrate 10 from the peeling unit 600 to the ID affixing unit 700. The main transfer unit 58 transfers the substrate 10 from the ID affixing unit 700 to the unloading unit 40.

[0111] The first sub-carrier 910 is movable in the X and Z directions. For example, as shown in Fig. 11, an X-axis guide 911 is fixed to the mount 500. A Z-axis guide 913 is fixed to an X-axis slider 912 that moves in the X direction along the X-axis guide 911. The first sub-carrier 910 is fixed to a Z-axis slider 914 that moves in the Z direction along the Z-axis guide 913. The first sub-carrier 910 may also be movable in the Y direction to align the substrate 10 in the Y direction.

[0112] The first sub-transport unit 910 adsorbs the substrate 10. The first sub-transport unit 910 may have an adsorption surface that is larger than the main surface (e.g., the second main surface 12) of the substrate 10 in order to prevent deformation or damage to the substrate 10. The entire second main surface 12 of the substrate 10 can be held flat, thereby preventing deformation or damage to the substrate 10.

[0113] The first sub-transport unit 910 is formed, for example, by a porous chuck and has a porous body. Gas in the pores of the porous body is sucked by a suction source such as a vacuum pump. By operating the suction source to generate negative pressure in the first sub-transport unit 910, the first sub-transport unit 910 vacuum-sucks the substrate 10. On the other hand, by stopping the operation of the suction source and opening the pores of the porous body to the atmosphere, the first sub-transport unit 910 releases the vacuum suction of the substrate 10. When the vacuum suction is released, a positive pressure may be generated in the first sub-transport unit 910.

[0114] The first sub-carrier unit 910 holds the substrate 10 and moves it in the X and Z directions to transport the substrate 10 from the delivery unit 300 to the mounting unit 500 via the ultraviolet irradiation unit 400. For example, the substrate 10 is lifted from the delivery table 310, passed above the UV lamp 410, and lowered onto the mounting table 510. A servo motor, for example, is used as a drive source for moving the first sub-carrier unit 910.

[0115] The first sub-conveyor 910 holds the substrate 10 from above with the protective tape 14 facing downward, and moves in the X direction above the UV lamps 410 extending in the Y direction. The Y direction dimension of the UV lamps 410 is larger than the diameter of the substrate 10 so that the UV lamps 410 can irradiate the entire protective tape 14 in the Y direction. The speed at which the first sub-conveyor 910 passes over the UV lamps 410 is set so as to sufficiently reduce the adhesive strength of the protective tape 14.

[0116] According to this embodiment, while the protective tape 14 is irradiated with ultraviolet light, the substrate 10 is held by the first sub-transport unit 910, so another substrate 10 can be held and transported by the main transport unit 58. This improves the efficiency with which the substrate 10 is transported throughout the substrate processing system 1, and also improves the processing speed of the substrate 10 throughout the substrate processing system 1.

[0117] The second sub-conveyor 920 is movable in the Y and Z directions. For example, as shown in FIG. 12 , a Y-axis guide 921 is fixed to the mounter 500 and the peeler 600. The Y-axis guide 921 is provided to straddle both the mounter 500 and the peeler 600 when viewed in the Z direction. A Z-axis guide 923 is fixed to a Y-axis slider 922 that moves in the Y direction along the Y-axis guide 921. A reversing unit 925 is fixed to a Z-axis slider 924 that moves in the Z direction along the Z-axis guide 923. The reversing unit 925 holds the second sub-conveyor 920 so that it can be turned upside down around a reversing shaft 926. In this embodiment, the axial direction of the reversing shaft 926 is the Y direction, but it may also be the X direction.

[0118] The second sub-conveyor 920 has a suction portion 929 that suctions the frame 19. A plurality of suction portions 929 are provided at intervals in the axial direction (e.g., Y direction) of the reversing shaft 926 (see FIG. 14), and suctions both ends of the frame 19 in the Y direction. The suction portion 929 has a suction hole. Gas is sucked from the suction hole by a suction source such as a vacuum pump. By operating the suction source to generate negative pressure in the second sub-conveyor 920, the second sub-conveyor 920 vacuum-sucks the frame 19. On the other hand, by stopping the operation of the suction source and opening the suction hole to the atmosphere, the second sub-conveyor 920 releases the vacuum suction of the frame 19. When the vacuum suction is released, a positive pressure may be generated in the second sub-conveyor 920.

[0119] Fig. 14 is a diagram showing the operation of the second sub-conveyor unit according to one embodiment. In Fig. 14, the arrows indicate the movement direction of the substrate 10 and frame 19 from the mounting unit 500 to the peeling unit 600. The second sub-conveyor unit 920 holds the frame 19 and moves in the Y and Z directions to transport the substrate 10 attached to the frame 19 via adhesive tape 18 from the mounting unit 500 to the peeling unit 600. A servo motor, for example, is used as a drive source for moving the second sub-conveyor unit 920.

[0120] After lifting the frame 19 from the mount table 510, the second sub-conveyor 920 moves the frame 19 by the inverting unit 925, for example, from the position shown by the solid line in Fig. 14 to the position shown by the dashed line in Fig. 14. As a result, the substrate 10 attached to the frame 19 via the adhesive tape 18 is inverted upside down. Thereafter, the second sub-conveyor 920 places the frame 19 on the peeling table 610 as shown by the two-dot chain line in Fig. 14. The peeling table 610 holds the center of the frame 19 in the Y direction so as not to interfere with a plurality of suction units 929 provided at intervals in the axial direction of the inverting shaft 926 (the Y direction in this embodiment).

[0121] According to this embodiment, the substrate 10 is turned upside down by the reversing unit 925 in the process of being transported from the mounting unit 500 to the peeling unit 600. This allows the adhesive tape 18 and the protective tape 14, which are provided on either side of the substrate 10, to be reversed in position. Specifically, the adhesive tape 18 is disposed on the underside of the substrate 10, and the protective tape 14 is disposed on the upper side of the substrate 10. The protective tape 14 is disposed on the opposite side of the substrate 10 from the peeling table 610, and is therefore easily peeled off from the substrate 10.

[0122] The third sub-transport unit 930 is movable in the X and Z directions. For example, as shown in Fig. 11, an X-axis guide 931 is fixed to the peeling unit 600. A Z-axis guide 933 is fixed to an X-axis slider 932 that moves in the X direction along the X-axis guide 931. The third sub-transport unit 930 is fixed to a Z-axis slider 934 that moves in the Z direction along the Z-axis guide 933. The third sub-transport unit 930 may also be movable in the Y direction to align the substrate 10 in the Y direction.

[0123] The third sub-conveyor 930 has suction units 939 that suction the frame 19. A plurality of suction units 939 are provided, for example, at intervals in the X direction, and suction both ends of the frame 19 in the X direction. The suction units 939 have suction holes. Gas is sucked from the suction holes by a suction source, for example, a vacuum pump. By operating the suction source to generate negative pressure in the third sub-conveyor 930, the third sub-conveyor 930 vacuum-sucks the frame 19. On the other hand, by stopping the operation of the suction source and opening the suction holes to the atmosphere, the third sub-conveyor 930 releases the vacuum suction of the frame 19. When the vacuum suction is released, a positive pressure may be generated in the third sub-conveyor 930.

[0124] The third sub-conveyor 930 holds the frame 19 and moves in the X and Z directions to transport the substrate 10 attached to the frame 19 via the adhesive tape 18 from the peeling section 600 to the ID affixing section 700. For example, the substrate 10 is lifted from the peeling table 610 and lowered onto the ID affixing table 710. A servo motor, for example, is used as a drive source for moving the third sub-conveyor 930.

[0125] In the first modified example described below, unlike the above embodiment, there is no third sub-conveyor 930, and the role of the third sub-conveyor 930 is performed by the main conveyor 58. In other words, the main conveyor 58 conveys the substrate 10 from the peeling section 600 to the ID affixing section 700. The following mainly describes the differences.

[0126] 15 is a side view showing a peeling unit according to a first modified example and an ID attaching unit provided above and overlapping the peeling unit. In FIG. 15, arrows indicate the movement direction of the substrate 10 and frame 19 in the peeling unit 600 and the like. As shown in FIG. 15, the peeling unit 600 is provided adjacent to the main transport path 50.

[0127] The peeling table 610 receives the frame 19 from the second sub-conveyor 920 at the center in the X direction of the peeling table guide 630. The substrate 10 is attached to the frame 19 in advance via adhesive tape 18. The peeling table 610 holds the substrate 10 and the frame 19 via the adhesive tape 18.

[0128] Thereafter, the peeling table 610 is moved in the X direction (rearward) so as to move away from the main transport path 50, and is moved directly below the peeling roller 620. The peeling roller 620 peels the protective tape 14 from the substrate 10 while sequentially deforming the protective tape 14 from one end side of the substrate 10 toward the other end side, as shown in FIG.

[0129] Thereafter, the peeling table 610 is moved in the X direction (front side) so as to approach the main conveying path 50, and hands over the frame 19 to the main conveying unit 58 (see FIG. 3) at the end of the peeling table guide 630 on the main conveying path 50 side (front side). The main conveying unit 58 moves in the Z direction and the X direction while holding the frame 19, and places the frame 19 on the ID affixing table 710.

[0130] According to this modification, unlike the above embodiment, there is no third sub-conveyor unit 930, and the role of the third sub-conveyor unit 930 is performed by the main conveyor unit 58. In other words, the main conveyor unit 58 conveys the substrate 10 from the peeling unit 600 to the ID affixing unit 700. This makes it possible to make the main conveyor unit 58 multifunctional and increase the workload of the main conveyor unit 58, thereby improving the availability of the main conveyor unit 58.

[0131] In the second modified example described below, unlike the above embodiment and the first modified example, there is no first sub-carrier unit 910, and the role of the first sub-carrier unit 910 is performed by the main carrier unit 58. In other words, the main carrier unit 58 transports the diced and thinned substrate 10 to the ultraviolet irradiation unit 400 and the mounting unit 500 in that order. In this modified example, since there is no first sub-carrier unit 910, there is no need for a transfer unit 300 that relays the substrate 10 from the main carrier unit 58 to the first sub-carrier unit 910. The differences will be mainly explained below.

[0132] Fig. 16 is a plan view showing the main parts of a substrate processing system according to a second modified example. In Fig. 16, arrows indicate the movement directions of the substrate 10 and the frame 19 in the mounting unit 500, the peeling unit 600, etc. As shown in Fig. 16, the ultraviolet irradiation unit 400 and the mounting unit 500 are provided adjacent to the main transport path 50. When the mounting unit 500 is provided adjacent to one end of the main transport path 50 in the Y direction, the ultraviolet irradiation unit 400 is also provided adjacent to one end of the main transport path 50 in the Y direction.

[0133] The main transfer unit 58 (see FIG. 3) holds the substrate 10 and moves in the Y and Z directions to transfer the substrate 10 to the ultraviolet irradiation unit 400 and the mounting unit 500 in that order. The main transfer unit 58 is first inserted from the main transfer path 50 into the ultraviolet irradiation unit 400.

[0134] The main conveyance unit 58 holds the substrate 10 from above with the protective tape 14 facing downward, and moves in the Y direction above the UV lamps 410 extending in the X direction. The dimension of the UV lamps 410 in the X direction is larger than the diameter of the substrate 10 so that the UV lamps 410 can irradiate the entire protective tape 14 in the X direction. The speed at which the main conveyance unit 58 passes over the UV lamps 410 is set so as to sufficiently reduce the adhesive force of the protective tape 14.

[0135] Next, the main transfer unit 58 is pulled out from the ultraviolet irradiation unit 400 to the main transfer path 50, lowered on the main transfer path 50, and then inserted from the main transfer path 50 into the mounting unit 500. Thereafter, the main transfer unit 58 is lowered inside the mounting unit 500 and delivers the substrate 10 to the mounting table 510.

[0136] The mount table 510 receives both the substrate 10 and the frame 19 at the end of the mount table guide 530 on the main transport path 50 side (front side). The mount table 510 may receive either the substrate 10 or the frame 19 first.

[0137] According to this modification, unlike the above embodiment and the above first modification, there is no first sub-conveyor unit 910, and the role of the first sub-conveyor unit 910 is performed by the main conveyor unit 58. In other words, the main conveyor unit 58 conveys the diced and thinned substrate 10 to the ultraviolet irradiation unit 400 and the mounting unit 500 in that order. This makes it possible to make the main conveyor unit 58 multifunctional, increase the workload of the main conveyor unit 58, and improve the availability of the main conveyor unit 58.

[0138] Although the embodiments of the substrate processing system and substrate processing method according to the present disclosure have been described above, the present disclosure is not limited to the above embodiments. Various changes, modifications, substitutions, additions, deletions, and combinations are possible within the scope of the claims. These changes also naturally fall within the technical scope of the present disclosure.

[0139] This application claims priority based on Japanese Patent Application No. 2017-163600, filed with the Japan Patent Office on August 28, 2017, the entire contents of which are incorporated herein by reference. [Explanation of symbols]

[0140] 1. Substrate Processing System 10 Substrate 14 Protective tape 18 adhesive tape 19 frames 20 Control Unit 30 Loading area 35 Loading cassette 40 Unloading section 45 Output cassette 50 Main transport route 58 Main conveyor 100 Dicing Department 200 Thinning section 300 Delivery Department 400 UV irradiation unit 500 Mounting section 600 Peeling part 700 ID attachment section 910 First sub-transfer unit 920 Second sub-transport unit 930 Third Sub-Transport Unit

Claims

1. A mounting device including a mounting unit that forms an attachment in which an adhesive tape is attached to a substrate and a frame by bonding the adhesive tape to the substrate and the frame, the mounting unit is provided adjacent to a main transport path adjacent to a carry-in section into which a carry-in cassette storing the substrates before being made into the attached objects is carried in from the outside, and an unloading section from which an unloading cassette storing the attached objects is unloaded to the outside, and receives the substrates removed from the carry-in cassette by a main transport section moving along the main transport path to form the attached objects; The mounting device is characterized in that the attached object formed by the mounting section is stored in the output cassette by the main transport section.

2. A mounting method using a mounting unit that forms an attachment in which an adhesive tape is attached to a substrate and a frame by bonding the substrate to the frame via the adhesive tape, the mounting unit is provided adjacent to a main transport path adjacent to a carry-in section into which a carry-in cassette storing the substrates before being made into the attached objects is carried in from the outside, and an unloading section from which an unloading cassette storing the attached objects is unloaded to the outside, and receives the substrates removed from the carry-in cassette by a main transport section moving along the main transport path to form the attached objects; a mounting method, wherein the attachment formed in the mounting section is stored in the output cassette by the main transport section;

Images