Probe position monitoring structure and method for monitoring probe position

Abstract

To provide a probe position monitoring structure and a method of monitoring a position of a probe.SOLUTION: A probe position monitoring structure 101 includes a first common line CL1 and a contact portion CT configured for being directly contacted with a probe. The contact portion CT includes a first zigzag structure ZS1, and a first end E11 of the first zigzag structure ZS1 is directly connected with the first common line CL1. A method of monitoring a position of a probe includes the steps of: providing the probe position monitoring structure 101; directly contacting the first zigzag structure ZS1 with a first probe PR1; and measuring a resistance of a portion of the first zigzag structure ZS1 located between the first probe PR1 and the first end E11 for monitoring a position of the first probe PR1.SELECTED DRAWING: Figure 1

Description

[Background technology]

[0001] 1.Technical Field The present invention relates to a probe position monitoring structure and a method for monitoring the position of a probe, and more particularly to a probe position monitoring structure including a zigzag structure in a contact portion, and a method for monitoring the position of a probe having a probe position monitoring structure.

[0002] 2.Background technology The fabrication of integrated circuits continues to advance as related technologies advance. Many types of electrical circuits can be integrated and formed on a single chip. The semiconductor process for fabricating a chip may include many steps, such as a deposition process for forming a thin film, a photoresist coating process, an exposure process, a development process for forming a patterned photoresist, and an etching process for patterning the thin film. The above processes may be performed iteratively to form an integrated circuit and / or corresponding chip on a substrate (e.g., a wafer). During and / or after the fabrication process, many tests are required to be performed on the chip directly and / or on element groups on the substrate. Typically, test probes are used to contact test pads in the above-mentioned tests. If the test probes do not contact the test pads accurately, the status of the test element groups and / or chips may be erroneously determined by the test results. Therefore, before using the test results to determine the status of the test object, it is important to monitor the position of the test probes and ensure that the test probes are in accurate contact with the corresponding test pads. Summary of the Invention

[0003] A probe position monitoring structure and a method for monitoring the position of a probe are provided in the present invention, in which the contact portion of the probe position monitoring structure includes a zigzag structure used for resistance measurement, in which the probe directly contacts the zigzag structure, and the position of the probe can be monitored by measuring the resistance of the zigzag structure between the common line and the probe.

[0004] According to an embodiment of the present invention, there is provided a probe position monitoring structure, the probe position monitoring structure including a first common line and a contact portion configured to directly contact the probe, the contact portion including a first zigzag structure, and a first end of the first zigzag structure directly connected to the first common line.

[0005] According to an embodiment of the present invention, a method for monitoring a position of a probe is provided. The method includes the following steps: a probe position monitoring structure is provided. The probe position monitoring structure includes a first common line and a contact portion. The contact portion includes a first zigzag structure, and a first end of the first zigzag structure is directly connected to the first common line. The first zigzag structure directly contacts a first probe. A resistance measurement is performed to measure the resistance of a portion of the first zigzag structure located between the first probe and the first end to monitor the position of the first probe.

[0006] These and other objects of the present invention will no doubt become obvious to those of ordinary skill in the art after reading the following detailed description of the preferred embodiment that is illustrated in the various figures and drawings. [Brief explanation of the drawings]

[0007] [Figure 1] 1 is a schematic diagram illustrating a probe position monitoring structure according to a first embodiment of the present invention;

[0008] [Figure 2] 1 is a schematic diagram showing a partially enlarged view of a probe position monitoring structure according to a first embodiment of the present invention;

[0009] [Figure 3] FIG. 3 is a cross-sectional view taken along line AA' in FIG. 2.

[0010] [Figure 4] 1 is a schematic diagram illustrating a semiconductor wafer including a probe position monitoring structure according to an embodiment of the present invention.

[0011] [Figure 5] 3A and 3B are schematic diagrams illustrating a method for monitoring the position of a probe by the probe position monitoring structure of the first embodiment according to an embodiment of the present invention.

[0012] [Figure 6A] 6A is a schematic diagram showing a method for monitoring the position of a probe by the probe position monitoring structure of the first embodiment according to another embodiment of the present invention, in which FIG. 6A shows two-point measurement steps by a first probe and a second probe. [Figure 6B] 6A and 6B are schematic diagrams illustrating a method for monitoring the position of a probe by the probe position monitoring structure of the first embodiment according to another embodiment of the present invention, and FIG. 6B illustrates two-point measurement steps by the second probe and the third probe. [Figure 6C] 6A and 6B are schematic diagrams illustrating a method for monitoring the position of a probe by the probe position monitoring structure of the first embodiment according to another embodiment of the present invention, in which FIG. 6C illustrates a two-point measurement step by the first probe and the third probe.

[0013] [Figure 7A] 7A is a schematic diagram showing a method according to another embodiment of the present invention for monitoring the position of a probe using the probe position monitoring structure of the first embodiment, and FIG. 7A shows three-point measurement steps using a first probe, a second probe, and a third probe. [Figure 7B]7A and 7B are schematic diagrams showing a method according to another embodiment of the present invention for monitoring the position of a probe using the probe position monitoring structure of the first embodiment, and FIG. 7B shows another three-point measurement step using a first probe, a second probe, and a third probe. [Figure 7C] 7A and 7B are schematic diagrams showing a method according to another embodiment of the present invention for monitoring the position of a probe using the probe position monitoring structure of the first embodiment, and FIG. 7C shows yet another three-point measurement step using a first probe, a second probe, and a third probe.

[0014] [Figure 8A] 8A is a schematic diagram showing a method according to another embodiment of the present invention for monitoring the position of a probe using the probe position monitoring structure of the first embodiment, and FIG. 8A shows three-point measurement steps using a first probe, a second probe, and a third probe. [Figure 8B] 8A and 8B are schematic diagrams showing a method according to another embodiment of the present invention for monitoring the position of a probe using the probe position monitoring structure of the first embodiment, and FIG. 8B shows another three-point measurement step using a first probe, a second probe, and a third probe. [Figure 8C] 8A and 8B are schematic diagrams showing a method according to another embodiment of the present invention for monitoring the position of a probe using the probe position monitoring structure of the first embodiment, and FIG. 8C shows yet another three-point measurement step using a first probe, a second probe, and a third probe.

[0015] [Figure 9] FIG. 4 is a schematic diagram illustrating a probe position monitoring structure according to a second embodiment of the present invention.

[0016] [Figure 10A] 10A is a schematic diagram illustrating a method for monitoring the position of a probe using a probe position monitoring structure of a second embodiment according to an embodiment of the present invention, in which FIG. 10A illustrates a two-point measurement step using a first probe and a second probe. [Figure 10B]FIG. 10B is a schematic diagram showing a method for monitoring the position of a probe using a probe position monitoring structure of a second embodiment according to an embodiment of the present invention, and FIG. 10B shows a two-point measurement step using a second probe and a third probe.

[0017] [Figure 11] FIG. 10 is a schematic diagram illustrating a probe position monitoring structure according to a third embodiment of the present invention.

[0018] [Figure 12] 10A and 10B are schematic diagrams showing a method for monitoring the position of a probe by the probe position monitoring structure of the third embodiment.

[0019] [Figure 13] FIG. 10 is a schematic diagram illustrating a probe position monitoring structure according to a fourth embodiment of the present invention.

[0020] [Figure 14A] 14A is a schematic diagram showing a method for monitoring the position of a probe using the probe position monitoring structure of the fourth embodiment, and FIG. 14A shows four-point measurement steps using a first probe, a second probe, a third probe, and a fourth probe. [Figure 14B] 14A and 14B are schematic diagrams showing a method for monitoring the position of a probe using the probe position monitoring structure of the fourth embodiment, and FIG. 14B shows another four-point measurement step using the first probe, the second probe, the fifth probe, and the sixth probe. [Figure 14C] 14A and 14B are schematic diagrams showing a method for monitoring the position of a probe using the probe position monitoring structure of the fourth embodiment, and FIG. 14C shows yet another four-point measurement step using the first probe, the third probe, the fourth probe, and the fifth probe.

[0021] [Figure 15] FIG. 10 is a schematic diagram illustrating a probe position monitoring structure according to a fifth embodiment of the present invention.

[0022] [Figure 16] 10A and 10B are schematic diagrams showing a method for monitoring the position of a probe by the probe position monitoring structure of the fifth embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0023] While specific configurations and arrangements are discussed, it should be understood that this is done for illustrative purposes only. Those skilled in the art will recognize that other configurations and arrangements can be used without departing from the spirit and scope of the present disclosure. It will be apparent to those skilled in the art that the present invention can also be used in a variety of other applications.

[0024] It should be noted that references in the specification to "one embodiment," "an embodiment," "some embodiments," etc., indicate that the described embodiment may include a particular feature, structure, or characteristic, but not all embodiments necessarily include that particular feature, structure, or characteristic. Also, such phrases do not necessarily refer to the same embodiment. Furthermore, when a particular feature, structure, or characteristic is described in connection with an embodiment, it would be within the knowledge of one of ordinary skill in the art to apply such feature, structure, or characteristic to other embodiments, whether or not explicitly described.

[0025] In this specification, terms such as "first," "second," and the like may be used to describe various elements, components, regions, layers, and / or sections, but it should be understood that these elements, components, regions, layers, and / or sections should not be limited by these terms. These terms are used only to distinguish one element, component, region, layer, and / or section from another. Thus, a first element, component, region, layer, or section described below could be referred to as a second element, component, region, layer, or section without departing from the teachings of the present disclosure.

[0026] It should be understood that the meanings of "to," "on," and "above" in this disclosure should be interpreted broadly so that "to" not only means "directly on" something but also includes the meaning "on" something with an intermediate feature or layer therebetween, and that "on" or "beyond" not only indicates the meaning "above" or "beyond" something but can also include the meaning "above" or "beyond" something without an intermediate feature or layer therebetween (i.e., directly on top of something).

[0027] FIG. 1 is a schematic diagram illustrating a probe position monitoring structure according to a first embodiment of the present invention, and FIG. 2 is a schematic diagram illustrating a partially enlarged view of the probe position monitoring structure. As shown in FIGS. 1 and 2, a probe position monitoring structure 101 is provided in this embodiment. The probe position monitoring structure 101 includes a first common line CL1 and a contact portion CT configured to directly contact a probe (such as the first probe PR1, second probe PR2, and / or third probe PR3 shown in FIGS. 1 and 2). The contact portion CT includes a first zigzag structure ZS1, and a first end E11 of the first zigzag structure ZS1 is directly connected to the first common line CL1. In some embodiments, the first zigzag structure ZS1 can extend in a horizontal direction (e.g., the first direction D1 and the second direction D2 shown in FIGS. 1 and 2) to directly contact the probe in a vertical direction (e.g., the third direction D3 shown in FIGS. 1 and 2), but is not limited thereto. For example, the first zigzag structure ZS1 may include a plurality of first sections SC1 and a plurality of second sections SC2. Each of the first sections SC1 may extend in a first direction D1, and the first sections SC1 may be repeatedly arranged in a second direction D2 and arranged parallel to each other. Each of the second sections SC2 may extend in the second direction D2 and be directly connected to two of the first sections SC1 arranged adjacent to each other in the second direction D2. In other words, the first zigzag structure ZS1 has an S-shaped structure formed by the first sections SC1 and the second sections SC2. The second direction D2 is different from the first direction D1. In some embodiments, the first direction D1 and the second direction D2 may be orthogonal and perpendicular to each other, but are not limited to this.

[0028] Furthermore, the first zigzag structure ZS1 may be directly connected to the first common line CL1 via the third section SC3 of the first zigzag structure ZS1, and the third section SC3 may extend in the second direction D2. One end (e.g., the first end E11) of the third section SC3 may be directly connected to the first common line CL1, and the other end of the third section SC3 in the second direction may be directly connected to one of the first sections SC1 adjacent to the first common line CL1. In some embodiments, the line widths of the sections of the first zigzag structure ZS1 may be preferably equal to each other in order to calculate the length (e.g., the length L11 shown in FIG. 2) of the first zigzag structure ZS1 located between the first end E11 of the first zigzag structure ZS1 and the first probe PR1 in order to monitor the position of the first probe PR1. In other words, the width W1 of each first section SC1, the width W2 of each second section SC2, and the width W3 of the third section SC3 may be substantially equal to each other, but are not limited to this. In some embodiments, in calculating the length of the first zigzag structure ZS1 located between the first probe PR1 and the first end E11 of the first zigzag structure ZS1, the width W1 of each first section SC1 may be smaller than the width W4 of the first common line CL1 to ignore the resistance of the first common line CL1. For example, the ratio (W4 / W1) of the width W4 of the first common line CL1 to the width W1 of each first section SC1 may range from 5 to 200, but is not limited to this.

[0029] In some embodiments, the contact portion CT in the probe position monitoring structure 101 may further include a second zigzag structure ZS2 and a third zigzag structure ZS3. The first zigzag structure ZS1, the second zigzag structure ZS2, and the third zigzag structure ZS3 may be aligned in the first direction D1, and the patterns of the first zigzag structure ZS1, the second zigzag structure ZS2, and the third zigzag structure ZS3 may be, but are not limited to, identical to each other in the third direction D3 to monitor the positions of the first probe PR1 in contact with the first zigzag structure ZS1, the second probe PR2 in contact with the second zigzag structure ZS2, and the third probe PR3 in contact with the third zigzag structure ZS3. In some embodiments, the first end E21 of the second zigzag structure ZS2 and the first end E31 of the third zigzag structure ZS3 may each be directly connected to the first common line CL1, and the first zigzag structure ZS1, the second zigzag structure ZS2, the third zigzag structure ZS3, and the first common line CL1 may be different parts of a single conductive layer (such as, but not limited to, a metal layer embedded in a dielectric material).

[0030] FIG. 3 is a cross-sectional view taken along line A-A' in FIG. 2. As shown in FIGS. 1-3, the probe position monitoring structure 101 may further include an interlayer dielectric ILD, and the first common line CL1 and the contact CT may be at least partially disposed within the interlayer dielectric ILD. In some embodiments, multiple conductive layers (e.g., metal layer M1, metal layer M2, metal layer M3, and metal layer M4 shown in FIG. 3) may be disposed within the interlayer dielectric ILD and stacked on each other in a third direction D3 to form a stacked structure (e.g., stacked metal layers SM shown in FIG. 3). Note that the third direction D3 may refer to the vertical direction and thickness direction of the interlayer dielectric ILD, and the first direction D1 and the second direction D2 may refer to, but are not limited to, horizontal directions perpendicular to the third direction D3. In some embodiments, one or more metal layers within the stacked metal layers SM may be used to form the first common line CL1 and the contact CT. For example, the first common line CL1 may include a first layer (such as the first portion M11 of the metal layer M1), a second layer (such as the first portion M21 of the metal layer M2), a third layer (such as the first portion M31 of the metal layer M3), and a fourth layer (such as the first portion M4 of the metal layer M4) stacked in the third direction D3, and the first zigzag structure ZS1 may include a first layer (such as the second portion M12 of the metal layer M1), a second layer (such as the second portion M22 of the metal layer M2), a third layer (such as the second portion M32 of the metal layer M3), and a fourth layer (such as the second portion M4 of the metal layer M4) stacked in the third direction D3 and separated from each other by portions of the interlayer dielectric ILD, but is not limited to this. In some embodiments, the first common line CL1 may be composed of only the first portion M41 of the metal layer M4, and the contact portion CT may be composed of the second portion M42 of the metal layer M4, and accordingly the first common line CL1 and the contact portion CT may be located at least on the top layer of the stacked metal layer SM, but is not limited to this. In some embodiments, the first zigzag structure ZS1, the second zigzag structure ZS2, the third zigzag structure ZS3, and the first common line CL1 may be, but is not limited to, different portions of one conductive layer (such as the metal layer M4).

[0031] In some embodiments, connection plugs (such as, but not limited to, connection plug V1, connection plug V2, and connection plug V3 shown in FIG. 3 ) may be disposed between the metal layers of the first common line CL1 to electrically connect the first portion M11 of the metal layer M1, the first portion M21 of the metal layer M2, the first portion M31 of the metal layer M3, and the first portion M41 of the metal layer M4. In some embodiments, the metal layers M1, M2, M3, and M4 may be electrically isolated from each other, and the metal layers M1, M2, M3, and M4 may be considered to be electrically floating, but are not limited to this. In some embodiments, the zigzag pattern shown in FIG. 2 may be considered to be the pattern of the second portion M42 of the metal layer M4 in the third direction D3. The pattern of the second portion M32 of the metal layer M3 in the third direction D3, the pattern of the second portion M22 of the metal layer M2 in the third direction D3, and the pattern of the second portion M12 of the metal layer M1 in the third direction D3 may each be the same as the pattern of the second portion M42 of the metal layer M4 in the third direction D3. In some embodiments, the stacked metal layer SM and the interconnect structure (not shown) may be formed simultaneously by the same back-end-of-line (BEOL) process in a semiconductor manufacturing method. Therefore, if the metal layer M4 is the last metal layer in the BEOL process, the second portion M42 of the metal layer M4 may come into direct contact with the probe in the final inspection and measurement step, the second portion M32 of the metal layer M3 may come into direct contact with the probe in the in-line inspection and measurement step before the step of forming the metal layer M4, the second portion M22 of the metal layer M2 may come into direct contact with the probe in the in-line inspection and measurement step before the step of forming the metal layer M3, and the second portion M12 of the metal layer M1 may come into direct contact with the probe in the in-line inspection and measurement step before the step of forming the metal layer M2.In some embodiments, the second portion M42 of metal layer M4, the second portion M32 of metal layer M3, the second portion M22 of metal layer M2, and the second portion M12 of metal layer M1 may be separated from each other by portions of the interlayer dielectric ILD to avoid the influence of conductive residues generated by a previous inspection measurement step on the measurement results of the current inspection measurement step.

[0032] In some embodiments, an interlayer dielectric ILD may be formed on a semiconductor substrate (e.g., a semiconductor wafer not shown in FIGS. 1-3 ) during the above-described BEOL process. The interlayer dielectric ILD may include a single layer or multilayer structure of a dielectric material such as silicon oxide, a low-dielectric-constant (low-k) dielectric material, or other suitable dielectric material. The low-k dielectric material may include benzocyclobutene (BCB), hydrogen silsesquioxane (HSQ), methyl silsesquioxane (MSQ), hydrogenated silicon oxycarbide (SiOC-H), a porous dielectric material, or other suitable material having a relatively low dielectric constant. In some embodiments, the metal layers M1-M4 and the connection plugs V1-V3 may include a barrier material and a conductive material disposed on the barrier material, respectively. The barrier material may include titanium (Ti), titanium nitride (TiN), tantalum (Ta), tantalum nitride (TaN), or other suitable conductive barrier material, and the conductive material may include tungsten (W), copper (Cu), aluminum (Al), titanium aluminum (TiAl), cobalt tungsten phosphide (CoWP), or other suitable metallic conductive material. In some embodiments, the probes (e.g., first probe PR1, second probe PR2, and third probe PR3) may be probe needles connected to a probe card structure (not shown), and the probe material may include tungsten, tungsten-rhenium (WRe), beryllium copper (BeCu), or other suitable conductive material.

[0033] FIG. 4 is a schematic diagram illustrating a semiconductor wafer 10 including a probe position monitoring structure 101 according to an embodiment of the present invention. As shown in FIGS. 1 and 4, a first region R1 and a second region R2 adjacent to the first region R1 may be defined on the semiconductor wafer 10. A semiconductor chip (not shown) and a plurality of contact pads TP may be disposed in the first region R1, and the probe position monitoring structure 101 may be disposed in the second region R2. In some embodiments, the second region R2 may be a scribe region between semiconductor chips in a wafer dicing process. Marks for manufacturing the semiconductor wafer 10 (such as alignment marks), in-line test pads, and test pads for final testing may also be disposed in the second region R2, but are not limited to these. In some embodiments, the probes (such as the first probe PR1, the second probe PR2, and the third probe PR3) configured to contact the zigzag structure of the contact portions CT in the probe position monitoring structure 101 and other probe needles configured to contact in-line test pads, test pads for final testing, and / or contact pads TP may be connected to the same probe card structure, and accordingly, the positions of the probe needles may be monitored relatively by monitoring the positions of the first probe PR1, the second probe PR2, and / or the third probe PR3.

[0034] FIG. 5 is a schematic diagram illustrating a method for monitoring the position of a probe using a probe position monitoring structure 101 according to an embodiment of the present invention. As shown in FIGS. 1, 2, and 5, the method for monitoring the position of a probe may include the following steps: A probe position monitoring structure 101 is provided. The probe position monitoring structure 101 includes a first common line CL1 and a contact portion CT configured to directly contact the probe. The contact portion CT includes a first zigzag structure ZS1, and a first end E11 of the first zigzag structure ZS1 is directly connected to the first common line CL1. The first zigzag structure ZS1 is in direct contact with a first probe PR1. A resistance measurement is performed to measure the resistance of a portion of the first zigzag structure ZS1 located between the first probe PR1 and the first end E11 to monitor the position of the first probe PR1.

[0035] In some embodiments, the method for monitoring the position of the probe may include, but is not limited to, the following steps: As shown in FIGS. 1-3 and 5, in some embodiments, the first zigzag structure ZS1 directly contacts the first probe PR1, the second zigzag structure ZS2 directly contacts the second probe PR2, and the third zigzag structure ZS3 directly contacts the first probe PR3, and a resistance (resistance R shown in FIG. 5) of a portion of the first zigzag structure ZS1 located between the first end E11 of the first zigzag structure ZS1 and the first probe PR1 is measured. L11 ), the resistance of the portion of the second zigzag structure ZS2 located between the first end E21 of the second zigzag structure ZS2 and the second probe PR2 (resistance R shown in FIG. 5 L21 5 ), and the resistance of the portion of the third zigzag structure ZS3 located between the first end E31 of the third zigzag structure ZS3 and the third probe PR3 (resistance R L31 ) may be obtained by measuring the resistance with the first probe PR1, the second probe PR2, and the third probe PR3. L11 , resistance R L21 , and resistor R L31In addition, the method for monitoring the position of the probe may further include calculating a length L11 of the portion of the first zigzag structure ZS1 located between the first end E11 of the first zigzag structure ZS1 and the first probe PR1 according to the result of the resistance measurement. For example, the resistance R L11 can be defined as the electrical resistance of the first zigzag structure ZS1 located between the contact end C11 that directly contacts the first probe PR1 and the first end E11, and the length L11 of the first zigzag structure ZS1 located between the first end E11 and the contact end C11 can be calculated by the following formula, where ρ represents the electrical resistivity of the first zigzag structure ZS1 (for example, but not limited to, the electrical resistivity of the metal layer M4), and H represents the thickness of the first zigzag structure ZS1 (for example, but not limited to, the thickness of the metal layer M4 in the third direction D3).

number

[0036] Similarly, the resistor R L21 may be the electrical resistance of the second zigzag structure ZS2 located between the contact end C21 that directly contacts the second probe PR2 and the first end E21, and the resistance R L31may be the electrical resistance of the third zigzag structure ZS3 located between the first end E31 and the contact end C31 that directly contacts the third probe PR3, and the length L21 of the second zigzag structure ZS2 located between the first end E21 and the contact end C21 and the length L31 of the third zigzag structure ZS3 located between the first end E31 and the contact end C31 may be calculated according to the results of the above-mentioned resistance measurement. Therefore, the positions of the first probe PR1, the second probe PR2, and the third probe PR3 can be monitored by the lengths L11, L21, and L31 obtained through the above-mentioned resistance measurement. In some embodiments, the length L11 may be considered to be the length of the shortest path along the first zigzag structure ZS1 between the first end E11 and the first probe PR1, the length L21 may be considered to be the length of the shortest path along the second zigzag structure ZS2 between the first end E21 and the second probe PR2, and the length L31 may be considered to be the length of the shortest path along the third zigzag structure ZS3 between the first end E31 and the third probe PR3, but is not limited to these.

[0037] 6A-6C are schematic diagrams illustrating a method for monitoring the position of a probe using a probe position monitoring structure 101 according to an embodiment of the present invention. As shown in FIGS. 1-3 and 6A-6C, in some embodiments, the resistance measurement may include a two-point measurement step via a first probe PR1, a second probe PR2, and a third probe PR3. For example, as shown in FIG. 6A, a DC power supply may be connected to the first probe PR1 and the second probe PR2 to supply a constant current (the value of which may be obtained from an ammeter connected to the DC power supply), and the voltage drop between the first probe PR1 and the second probe PR2 may be measured to obtain a first resistance value R in the first two-point measurement step. 6A A voltmeter may be connected to the first probe PR1 and the second probe PR2 to obtain a second resistance value R. Similarly, as shown in FIG. 6B, a DC power supply may be connected to the second probe PR2 and the third probe PR3 to provide a constant current, and the voltage drop between the second probe PR2 and the third probe PR3 is measured to obtain a second resistance value R in a second two-point measurement step. 6BA voltmeter may be connected to the second probe PR2 and the third probe PR3 to obtain a resistance R. Similarly, as shown in FIG. 6C, a DC power supply may be connected to the first probe PR1 and the third probe PR3 to provide a constant current, and the voltage drop between the first probe PR1 and the third probe PR3 is measured to obtain a third resistance R in a third two-point measurement step. 6C A voltmeter may be connected to the first probe PR1 and the third probe PR3 to obtain a resistance value. The resistance value obtained in each measurement step may be equal to the voltage value from the voltmeter divided by the current value from the ammeter in each of the above measurement steps. In some embodiments, the resistance of the first common line CL1 is specifically set to a value equal to the resistance R L11 , resistance R L21 , and resistor R L31 The first resistance R is relatively much smaller than the first resistance R and can be omitted accordingly. 6A is the resistance R L11 and resistance R L21 and the second resistance value R 6B is the resistance R L21 and resistance R L31 and a third resistance value R 6C is the resistance R L11 and resistance R L31 Therefore, the resistance R L11 , resistance R L21 , and resistor R L31 can be calculated respectively according to the results of the above two-point measurement steps.

[0038] 7A-7C are schematic diagrams illustrating a method for monitoring the position of a probe using a probe position monitoring structure 101 according to an embodiment of the present invention. As shown in FIGS. 1-3 and 7A-7C, in some embodiments, the resistance measurement may include a three-point measurement step via a first probe PR1, a second probe PR2, and a third probe PR3. For example, as shown in FIG. 7A, a DC power supply may be connected to the first probe PR1 and the second probe PR2 to supply a constant current, and the voltage drop between the first probe PR1 and the third probe PR3 may be measured to obtain a first resistance value R in the first three-point measurement step. 7A A voltmeter may be connected to the first probe PR1 and the third probe PR3 to obtain a second resistance value R. As shown in FIG. 7B, a DC power supply may be connected to the first probe PR1 and the second probe PR2 to supply a constant current, and the voltage drop between the second probe PR2 and the third probe PR3 is measured to obtain a second resistance value R in a second three-point measurement step. 7B A voltmeter may be connected to the second probe PR2 and the third probe PR3 to obtain a third resistance value R. As shown in FIG. 7C, a DC power supply may be connected to the second probe PR2 and the third probe PR3 to supply a constant current, and the voltage drop between the first probe PR1 and the third probe PR3 is measured to obtain a third resistance value R in a third three-point measurement step. 7C In some embodiments, a voltmeter may be connected to the first probe PR1 and the third probe PR3 to obtain: L11 , resistance R L21 , and resistor R L31 The first resistance R is relatively much smaller than the first resistance R and can be omitted accordingly. 7A is the resistance R L11 and a second resistance value R 7B is the resistance R L21 and a third resistance value R 7C is the resistance R L31 may be substantially equal to

[0039] 8A-8C are schematic diagrams illustrating a method for monitoring the position of a probe using a probe position monitoring structure 101 according to an embodiment of the present invention. As shown in FIGS. 1-3 and 8A-8C, in some embodiments, the resistance measurement may include a three-point measurement step via a first probe PR1, a second probe PR2, and a third probe PR3. For example, as shown in FIG. 8A, a DC power supply may be connected to the first probe PR1 and the third probe PR3 to supply a constant current, and the voltage drop between the first probe PR1 and the second probe PR2 may be measured to obtain a first resistance value R in the first three-point measurement step. 8A A voltmeter may be connected to the first probe PR1 and the second probe PR2 to obtain a second resistance value R. As shown in FIG. 8B, a DC power supply may be connected to the second probe PR2 and the third probe PR3 to supply a constant current, and the voltage drop between the first probe PR1 and the second probe PR2 is measured to obtain a second resistance value R in a second three-point measurement step. 8B A voltmeter may be connected to the first probe PR1 and the second probe PR2 to obtain a third resistance value R. As shown in FIG. 8C, a DC power supply may be connected to the first probe PR1 and the third probe PR3 to supply a constant current, and the voltage drop between the second probe PR2 and the third probe PR3 is measured to obtain a third resistance value R in a third three-point measurement step. 8C In some embodiments, a voltmeter may be connected to the second probe PR2 and the third probe PR3 to obtain: L11 , resistance R L21 , and resistor R L31 The first resistance R is relatively much smaller than the first resistance R and can be omitted accordingly. 8A is the resistance R L11 and a second resistance value R 8B is the resistance R L21 and a third resistance value R 8C is the resistance R L31 may be substantially equal to

[0040] The resistance measurement method in the method for monitoring the position of the probe using the probe position monitoring structure 101 is not limited to the above-mentioned measurement steps, and may be performed by measuring the resistance R L11 , resistance R L21 , and resistor R L31 It is worth mentioning that other suitable measurement methods may be applied to measure .

[0041] The following description details various embodiments of the present invention. For the sake of clarity, identical components in each of the following embodiments are marked with identical symbols. To make the differences between the embodiments easier to understand, the following description will detail the differences between the various embodiments, and will not redundantly describe identical features.

[0042] 9 is a schematic diagram illustrating a probe position monitoring structure 102 according to a second embodiment of the present invention. As shown in FIG. 9, the probe position monitoring structure 102 may further include a second common line CL2. The first end E21 of the second zigzag structure ZS2 may be directly connected to the first common line CL1, the second end E22 of the second zigzag structure ZS2 may be directly connected to the second common line CL2, and the first end E31 of the third zigzag structure ZS3 may be directly connected to the second common line CL1. In some embodiments, the probe position monitoring structure 102 may further include a third common line CL3 and a fourth common line CL4, where the second end E12 of the first zigzag structure ZS1 may be directly connected to the third common line CL3, and the second end E32 of the third zigzag structure ZS3 may be directly connected to the fourth common line CL4. The material composition and structure of the second common line CL2, the third common line CL3, and the fourth common line CL4 may be similar to that of the first common line CL1. The first end E11 and the second end E12 may be two ends on either side of the first zigzag structure ZS1 in the second direction D2, the first end E21 and the second end E22 may be two ends on either side of the second zigzag structure ZS2 in the second direction D2, and the first end E31 and the second end E32 may be two ends on either side of the third zigzag structure ZS3 in the second direction D2.

[0043] 10A and 10B are schematic diagrams illustrating a method for monitoring the position of a probe using a probe position monitoring structure 102 according to an embodiment of the present invention. As shown in FIGS. 9, 10A, and 10B, the method for monitoring the position of a probe using the probe position monitoring structure 102 may include directly contacting the first zigzag structure ZS1 with the first probe PR1, directly contacting the second zigzag structure ZS2 with the second probe PR2, and directly contacting the third zigzag structure ZS3 with the third probe PR3. The resistance measurement in this embodiment is performed by measuring the resistance of a portion of the first zigzag structure ZS1 located between the first end E11 of the first zigzag structure ZS1 and the first probe PR1 (resistance R shown in FIG. 10A). L11 10A ), the resistance of the portion of the second zigzag structure ZS2 located between the first end E21 of the second zigzag structure ZS2 and the second probe PR2 (resistance R L21 ), the resistance of the portion of the second zigzag structure ZS2 located between the second end E22 of the second zigzag structure ZS2 and the second probe PR2 (resistance R shown in FIG. 10A ). L22 ), the resistance of the portion of the third zigzag structure ZS3 located between the first end E31 of the third zigzag structure ZS3 and the third probe PR3 (resistance R shown in FIG. 10A ). L31 ) may be performed to measure the resistance R L11 may be the electrical resistance of the first zigzag structure ZS1 located between the first end E11 and the contact end C11, and the resistance R L12 may be the electrical resistance of the first zigzag structure ZS1 located between the contact end C12 that directly contacts the first probe PR1 and the second end E12, and the resistance R L21 may be the electrical resistance of the second zigzag structure ZS2 located between the first end E21 and the contact end C21, and the resistance R L22 may be the electrical resistance of the second zigzag structure ZS2 located between the contact end C22 that directly contacts the second probe PR2 and the second end E22, and the resistance R L31may be the electrical resistance of the third zigzag structure ZS3 located between the first end E31 and the contact end C31, and the resistance R L32 may be the electrical resistance of the third zigzag structure ZS3 located between the contact end C32 that directly contacts the third probe PR3 and the second end E32.

[0044] In some embodiments, the resistance measurement may include a two-point measurement step via the first probe PR1 and the second probe PR2, and another two-point measurement step via the second probe PR2 and the third probe PR3. For example, as shown in FIG. 10A, a DC power supply may be connected to the first probe PR1 and the second probe PR2 to supply a constant current, and the voltage drop between the first probe PR1 and the second probe PR2 may be measured to determine a first resistance value R in the first two-point measurement step. 10A A voltmeter may be connected to the first probe PR1 and the second probe PR2 to obtain a second resistance value R. As shown in FIG. 10B, a DC power supply may be connected to the second probe PR2 and the third probe PR3 to supply a constant current, and the voltage drop between the second probe PR2 and the third probe PR3 is measured to obtain a second resistance value R in a second two-point measurement step. 10B In some embodiments, the resistance of the first common line CL1 and the second common line CL2 may be determined by a resistance R L11 , resistance R L21 , resistance R L22 , and resistor R L31 and can be omitted accordingly. 10A is the resistance R L11 and resistance R L21 and a second resistance value R 10B is the resistance R L22 and resistance R L31 In some embodiments, when the first probe PR1, the second probe PR2, and the third probe PR3 are aligned in the first direction D1, the resistance R L11 is the first resistance value R 10A may be substantially equal to half of the resistance RL21 is the first resistance value R 10A may be substantially equal to half of the resistance R L22 is the second resistance value R 10B may be substantially equal to half of the resistance R L31 is the second resistance value R 10B The length of the second zigzag structure ZS2 located between the first end E21 and the contact end C21 and the length of the second zigzag structure ZS2 located between the second end E22 and the contact end C22 may be calculated according to the resistance measurement described above to more accurately monitor the position of the second probe PR2.

[0045] The resistance measurement method in the method for monitoring the position of the probe using the probe position monitoring structure 102 is not limited to the above-mentioned measurement steps, and may be performed by measuring the resistance R L11 , resistance R L12 , resistance R L21 , resistance R L22 , resistance R L31 , and resistor R L32 It is worth mentioning that other suitable measurement methods may be applied to measure . Furthermore, in some embodiments, the first common line CL1, the second common line CL2, the third common line CL3, the fourth common line CL4, and the contact portion CT may at least be located on the top layer of a stacked metal layer (such as, but not limited to, the stacked metal layer SM shown in FIG. 3 above).

[0046] It is worth noting that in this embodiment, when the first common line CL1, the second common line CL2, the third common line CL3, and the fourth common line CL4 are formed by metal layers in a stacked metal layer (such as the stacked metal layer SM shown in FIG. 3), the metal layers of each common line should be physically and electrically separated so as to avoid forming a closed circuit between the metal wirings and not affect the above-mentioned resistance measurement. In other words, when each common line is formed by a metal layer in a stacked metal layer, no connecting plugs (such as the connecting plugs V1 to V3 shown in FIG. 3) are disposed between the metal layers.

[0047] FIG. 11 is a schematic diagram illustrating a probe position monitoring structure 103 according to a third embodiment of the present invention. FIG. 12 is a schematic diagram illustrating a method for monitoring the position of a probe using the probe position monitoring structure 103. As shown in FIG. 11, the probe position monitoring structure 103 includes a first common line CL1 and a contact portion CT. The contact portion CT includes a first zigzag structure ZS1 and a second zigzag structure ZS2, each directly connected to the first common line CL1. Specifically, the first end E11 of the first zigzag structure ZS1 and the first end E21 of the second zigzag structure ZS2 can be directly connected to the first common line CL1. As shown in FIGS. 11 and 12, the method for monitoring the position of a probe using the probe position monitoring structure 103 can include directly contacting the first zigzag structure ZS1 with the first probe PR1 and the second probe PR2, and directly contacting the second zigzag structure ZS2 with the third probe PR3 and the fourth probe PR4. The resistor R shown in FIG. 12 CT1 , resistance R CT2 , resistance R CT3 , and resistor R CT4 and can be respectively the contact resistance between the first probe PR1 and the first zigzag structure ZS1, the contact resistance between the second probe PR2 and the first zigzag structure ZS1, the contact resistance between the third probe PR3 and the second zigzag structure ZS2, and the contact resistance between the fourth probe PR4 and the second zigzag structure ZS2. Furthermore, since the length of the first zigzag structure ZS1 located between the first end E11 and the contact end C11 is shorter than the length of the first zigzag structure ZS1 located between the contact end C21 that directly contacts the second probe PR2 and the first end E11, the resistance R shown in FIG. L1 can be the electrical resistance of the first zigzag structure ZS1 located between the contact end C11 that directly contacts the first probe PR1 and the first end E11. The length of the second zigzag structure ZS2 located between the first end E21 and the contact end C31 is shorter than the length of the second zigzag structure ZS2 located between the contact end C41 that directly contacts the fourth probe PR4 and the first end E21. Therefore, the resistance R L2may be the electrical resistance of the second zigzag structure ZS1 located between the first end E21 and the contact end C31 that directly contacts the third probe PR3.

[0048] In some embodiments, the resistance measurement in the method of monitoring the position of the probe by the probe position monitoring structure 103 may include a four-point measurement step via the first probe PR1, the second probe PR2, the third probe PR3, and the fourth probe PR4. For example, as shown in FIG. 12, a DC power supply can be connected to the first probe PR1 and the third probe PR3 to supply a constant current, and the voltage drop between the second probe PR2 and the fourth probe PR4 is measured, and in the four-point measurement step, the resistance R L1 and resistor R L2 A voltmeter may be connected to the second probe PR2 and the fourth probe PR4 to obtain a resistance value substantially equal to the sum of R. In some embodiments, when the first probe PR1, the second probe PR2, the third probe PR3, and the fourth probe PR4 are aligned in the first direction D1, the resistance R L1 may be substantially equal to half the resistance value obtained in the four-point measurement step shown in FIG. 12, and the resistance R L2 may be substantially equal to, but not limited to, half of the resistance value obtained by the four-point measurement step shown in Fig. 12. In other words, the contact resistance between the probe and the contact portion CT can be omitted by the four-point measurement step used in the above-mentioned resistance measurement, the length of the first zigzag structure ZS1 located between the first end E11 and the first probe PR1, and the length of the second zigzag structure ZS2 located between the first end E21 and the third probe PR3 can be calculated more accurately, and the positions of the first probe PR1 and the third probe PR3 can be monitored more accurately.

[0049] The resistance measurement method in the method for monitoring the position of the probe using the probe position monitoring structure 103 is not limited to the above-mentioned measurement steps, and may be performed by measuring the resistance R L11 and resistor R L21It is worth mentioning that other suitable measurement methods may be applied to measure the contact resistance between the probe and the contact portion CT in this embodiment. Furthermore, the measurement method configured to omit the contact resistance between the probe and the contact portion CT in this embodiment may be applied to other embodiments of the present invention.

[0050] Fig. 13 is a schematic diagram showing a probe position monitoring structure 104 according to a fourth embodiment of the present invention. Figs. 14A to 14C are schematic diagrams showing a method for monitoring the position of a probe using the probe position monitoring structure 104. As shown in Fig. 13, the probe position monitoring structure 104 includes a first common line CL1 and a contact portion CT, and the contact portion CT includes a first zigzag structure ZS1, a second zigzag structure ZS2, and a third zigzag structure ZS3, each of which is directly connected to the first common line CL1. Specifically, a first end E11 of the first zigzag structure ZS1, a first end E21 of the second zigzag structure ZS2, and a first end E31 of the third zigzag structure ZS3 can each be directly connected to the first common line CL1. 13 and 14A-14C, a method for monitoring the position of a probe by the probe position monitoring structure 104 can include directly contacting the first zigzag structure ZS1 with the first probe PR1 and the second probe PR2, directly contacting the second zigzag structure ZS2 with the third probe PR3 and the fifth probe PR5, and directly contacting the third zigzag structure ZS3 with the fourth probe PR4 and the sixth probe PR6. CT1 , resistance R CT2 , resistance R CT3 , resistance R CT4 , resistance R CT5 , and resistor R CT6can be the contact resistance between the first probe PR1 and the first zigzag structure ZS1, the contact resistance between the second probe PR2 and the first zigzag structure ZS1, the contact resistance between the third probe PR3 and the second zigzag structure ZS2, the contact resistance between the fourth probe PR4 and the third zigzag structure ZS3, the contact resistance between the fifth probe PR5 and the second zigzag structure ZS2, and the contact resistance between the sixth probe PR6 and the third zigzag structure ZS3. Furthermore, since the length of the first zigzag structure ZS1 located between the first end E11 and the contact end C11 is shorter than the length of the first zigzag structure ZS1 located between the contact end C21 that directly contacts the second probe PR2 and the first end E11, the resistance R shown in FIGS. L1 may be the electrical resistance of the first zigzag structure ZS1 located between the contact end C11 that directly contacts the first probe PR1 and the first end E11. The length of the second zigzag structure ZS2 located between the first end E21 and the contact end C31 is shorter than the length of the second zigzag structure ZS2 located between the contact end C51 that directly contacts the fifth probe PR5 and the first end E21. Therefore, the resistance R shown in FIGS. 14A-14C L2 may be the electrical resistance of the second zigzag structure ZS2 located between the first end E21 and the contact end C31 that directly contacts the third probe PR3. The length of the third zigzag structure ZS3 located between the first end E31 and the contact end C61 is shorter than the length of the third zigzag structure ZS3 located between the first end E31 and the contact end C41 that directly contacts the fourth probe PR4. Therefore, the resistance R shown in FIGS. 14A-14C L3 may be the electrical resistance of the third zigzag structure ZS3 located between the contact end C61 that directly contacts the sixth probe PR6 and the first end E31.

[0051] In some embodiments, the resistance measurement in the method of monitoring the position of a probe by the probe position monitoring structure 104 may include a four-point measurement step via the first probe PR1, the second probe PR2, the third probe PR3, the fourth probe PR4, the fifth probe PR5, and / or the sixth probe PR6. For example, as shown in FIG. 14A, a DC power supply may be connected to the first probe PR1 and the third probe PR3 to supply a constant current, and the voltage drop between the second probe PR2 and the fourth probe PR4 may be measured to obtain the resistance R as described above in the four-point measurement step via the first probe PR1, the second probe PR2, the third probe PR3, and the fourth probe PR4. L1 A voltmeter may be connected to the second probe PR2 and the fourth probe PR4 to obtain a resistance value substantially equal to R. As shown in FIG. 14B, a DC power supply may be connected to the first probe PR1 and the sixth probe PR6 to provide a constant current, and the voltage drop between the second probe PR2 and the fifth probe PR5 may be measured to obtain the resistance R mentioned above in another four-point measurement step via the first probe PR1, the second probe PR2, the fifth probe PR5, and the sixth probe PR6. L1 A voltmeter may be connected to the second probe PR2 and the fifth probe PR5 to obtain a resistance value substantially equal to R. As shown in FIG. 14C, a DC power supply may be connected to the fifth probe PR5 and the fourth probe PR4 to provide a constant current, and the voltage drop between the first probe PR1 and the third probe PR3 may be measured to obtain the resistance R mentioned above in another four-point measurement step via the first probe PR1, the third probe PR3, the fourth probe PR4, and the fifth probe PR5. L2 A voltmeter may be connected to the first probe PR1 and the third probe PR3 to obtain a resistance value substantially equal to the above-mentioned resistor R L314A and / or a four-point measurement step similar to the four-point measurement step shown in FIG. 14B. For example, a DC power supply may be connected to the fifth probe PR5 and the fourth probe PR4 to supply a constant current, and the voltage drop between the first probe PR1 and the sixth probe PR6 is measured, and the resistance R L3 A voltmeter may be connected to the first probe PR1 and the sixth probe PR6 to obtain a resistance value substantially equal to (√{square root over (√πf)} / √πf). The contact resistance between the probes and the contact portion CT can be omitted by the four-point measurement step used in the resistance measurement described above, and the length of the first zigzag structure ZS1 located between the first end E11 and the first probe PR1, the length of the second zigzag structure ZS2 located between the first end E21 and the third probe PR3, and the length of the third zigzag structure ZS3 located between the first end E31 and the sixth probe PR6 can be calculated more accurately, and the positions of the first probe PR1, the third probe PR3, and the sixth probe PR6 can be monitored more accurately.

[0052] The resistance measurement method in the method for monitoring the position of the probe using the probe position monitoring structure 104 is not limited to the above-mentioned measurement steps, and may be performed by measuring the resistance R L1 , resistance R L2 , resistance R L3 It is worth mentioning that other suitable measurement methods may be applied to measure the contact resistance between the probe and the contact portion CT in this embodiment. Furthermore, the measurement method configured to omit the contact resistance between the probe and the contact portion CT in this embodiment may also be applied to other embodiments of the present invention.

[0053] FIG. 15 is a schematic diagram illustrating a probe position monitoring structure 105 according to a fifth embodiment of the present invention. FIG. 16 is a schematic diagram illustrating a method for monitoring the position of a probe using the probe position monitoring structure 105. As shown in FIG. 15, the probe position monitoring structure 105 includes a first common line CL1, a second common line CL2, a reference zigzag structure RZ, and a contact portion CT including a first zigzag structure ZS1 and a second zigzag structure ZS2. A first end E11 of the first zigzag structure ZS1 may be directly connected to the first common line CL1, and a first end E21 of the second zigzag structure ZS2 may be directly connected to the second common line CL2. The reference zigzag structure RZ may be disposed between the first zigzag structure ZS1 and the second zigzag structure ZS2 in the first direction D1. The first end E91 of the reference zigzag structure RZ may be directly connected to the first common line CL1, the second end E92 of the reference zigzag structure RZ may be directly connected to the second common line CL2, and the line width of the reference zigzag structure RZ may be equal to the line width of the first zigzag structure ZS1 and / or the line width of the second zigzag structure ZS2. In some embodiments, the contact portion CT may further include a third zigzag structure ZS3 and a fourth zigzag structure ZS4. The first end E41 of the fourth zigzag structure ZS4 may be directly connected to the first common line CL1, and the first end E31 of the third zigzag structure ZS3 may be directly connected to the second common line CL2. The first zigzag structure ZS1, the second zigzag structure ZS2, the third zigzag structure ZS3, and the fourth zigzag structure ZS4 may be aligned in the first direction D1, and the first zigzag structure ZS1 and the second zigzag structure ZS2 may be disposed between the fourth zigzag structure ZS4 and the third zigzag structure ZS3 in the first direction. In some embodiments, the patterns of the first zigzag structure ZS1, the second zigzag structure ZS2, the third zigzag structure ZS3, and the fourth zigzag structure ZS4 in the third direction may be, but are not limited to, identical to each other.In some embodiments, the reference zigzag structure RZ is not part of the contact portion CT, and the reference zigzag structure RZ, the first zigzag structure ZS1, the second zigzag structure ZS2, the third zigzag structure ZS3, the fourth zigzag structure ZS4, the first common line CL1 and the second common line CL2 may be, but are not limited to, different parts of one conductive layer (such as the metal layer M4 shown in FIG. 3).

[0054] 15 and 16, a method for monitoring the position of a probe by the probe position monitoring structure 105 may include bringing the first zigzag structure ZS1 into direct contact with the first probe PR1, bringing the second zigzag structure ZS2 into direct contact with the second probe PR2, bringing the third zigzag structure ZS3 into direct contact with the third probe PR3, and bringing the fourth zigzag structure ZS4 into direct contact with the fourth probe PR4. L11 may be the electrical resistance of the first zigzag structure ZS1 located between the contact end C11 that directly contacts the first probe PR1 and the first end E11, and may be the resistance R L21 may be the electrical resistance of the second zigzag structure ZS2 located between the contact end C21 that directly contacts the second probe PR2 and the first end E21, and may be the resistance R L31 may be the electrical resistance of the third zigzag structure ZS3 located between the contact end C31 that directly contacts the third probe PR3 and the first end E31, and may be the resistance R L41 may be the electrical resistance of the fourth zigzag structure ZS4 located between the contact end C41 that directly contacts the fourth probe PR4 and the first end E41, and may be the resistance R LR may be the electrical resistance of the reference zigzag structure RZ.

[0055] In some embodiments, the resistance measurement in the method of monitoring the position of a probe by the probe position monitoring structure 105 may include a four-point measurement step via a first probe PR1, a second probe PR2, a third probe PR3, and a fourth probe PR4. For example, as shown in FIG. 16, a DC power supply may be connected to the first probe PR1 and the second probe PR2 to supply a constant current, and the voltage drop between the fourth probe PR4 and the third probe PR3 is measured to obtain the resistance R mentioned above in the four-point measurement step via the first probe PR1, the second probe PR2, the third probe PR3, and the fourth probe PR4. LR A voltmeter may be connected to the fourth probe PR4 and the third probe PR3 to obtain a resistance value substantially equal to the resistance R obtained by the resistance measurement. Since the design value of the line width of the reference zigzag structure RZ is the same as that of the other zigzag structures, and the reference zigzag structure RZ and the zigzag structures can be formed of the same material at the same time in the same process, the actual line width of the zigzag structure can be obtained by the resistance measurement. LR In other words, the resistance R LR can be used to more accurately calculate the length of the first zigzag structure ZS1 located between the first end E11 and the first probe PR1, the length of the second zigzag structure ZS2 located between the first end E21 and the second probe PR2, the length of the third zigzag structure ZS3 located between the first end E31 and the third probe PR3, and the length of the fourth zigzag structure ZS4 located between the first end E41 and the fourth probe PR4, and the positions of the first probe PR1, the second probe PR2, the third probe PR3, and the fourth probe PR4 can be more accurately monitored. Furthermore, in this embodiment, the resistor R L11 , resistance R L21 , resistance R L31 , and resistor R L41 can be measured by the measurement steps in the above-described embodiments or other appropriate measurement methods, and the reference zigzag structure RZ may be applied to other embodiments of the present invention depending on some design considerations.

[0056] It is worth mentioning that in this embodiment, when the first common line CL1 and the second common line CL2 are formed by a metal layer in a stacked metal layer (for example, the stacked metal layer SM shown in FIG. 3), the metal layers in the first common line and the second common line should be physically and electrically separated so as to avoid forming a closed circuit between the metal wirings and not affect the above-mentioned resistance measurement. In other words, when the first common line CL1 and the second common line CL2 are formed by a metal layer in a stacked metal layer, no connecting plugs (such as the connecting plugs V1 to V3 shown in FIG. 3) are disposed between the metal layers.

[0057] To summarize the above, according to the probe position monitoring structure and probe position monitoring method of the present invention, the contact portion of the probe position monitoring structure has a zigzag structure used for resistance measurement, where the probe is in direct contact with the zigzag structure, and the position of the probe can be monitored by measuring the resistance of the zigzag structure between the common line and the probe and calculating the length of the zigzag structure between the common line and the probe.

[0058] Those skilled in the art will readily appreciate that numerous modifications and variations of the apparatus and method may be made while retaining the teachings of the present invention. Accordingly, the above disclosure should be construed as limited only by the language and metes and bounds of the appended claims.

[0059] [Note] (Appendix 1) 1. A probe position monitoring structure comprising: First common line; and a contact portion configured to directly contact the probe, the contact portion including a first zigzag structure, a first end of the first zigzag structure being directly connected to the first common line; a probe position monitoring structure including: (Appendix 2) The first zigzag structure: first sections, each of the first sections extending in a first direction; and second sections, each of which extends in a second direction different from the first direction and is directly connected to two first sections located adjacent to each other; 2. The probe position monitoring arrangement of claim 1, comprising: (Appendix 3) 3. The probe position monitoring structure of claim 2, wherein the width of each of the first sections is less than the width of the first common line. (Appendix 4) 4. The probe position monitoring structure of claim 3, wherein a ratio of the width of the first common line to the width of each of the first sections ranges from 5 to 200. (Appendix 5) 5. The probe position monitoring structure of claim 1, wherein the contact portion further comprises a second zigzag structure, and the pattern of the second zigzag structure is the same as the pattern of the first zigzag structure. (Appendix 6) 6. The probe position monitoring structure of claim 5, further comprising a second common line, wherein a first end of the second zigzag structure is directly connected to the first common line and a second end of the second zigzag structure is directly connected to the second common line, and the contact portion further comprises a third zigzag structure, wherein a first end of the third zigzag structure is directly connected to the second common line. (Appendix 7) 6. The probe position monitoring structure of claim 5, wherein the contact portion further includes a third zigzag structure, the pattern of the third zigzag structure being identical to the pattern of the first zigzag structure, and the first zigzag structure, the second zigzag structure, the third zigzag structure, and the first common line being different portions of a metal layer. (Appendix 8) 8. The probe position monitoring structure of claim 7, wherein a first end of the third zigzag structure is directly connected to the first common line. (Appendix 9) a second common line, wherein a first end of the second zigzag structure is directly connected to the second common line; and a reference zigzag structure disposed between the first zigzag structure and the second zigzag structure, a first end of the reference zigzag structure directly connected to the first common line, a second end of the reference zigzag structure directly connected to the second common line, and a line width of the reference zigzag structure equal to that of the first zigzag structure; 6. The probe position monitoring arrangement of claim 5, further comprising: (Appendix 10) an interlayer dielectric, wherein the first common line and the contact are at least partially disposed in the interlayer dielectric, and the first zigzag structure includes first and second layers separated from each other by a portion of the interlayer dielectric; 10. The probe position monitoring structure according to any one of appendices 1 to 9, further comprising: (Appendix 11) 1. A method for monitoring the position of a probe, comprising: Providing a probe position monitoring structure, said probe position monitoring structure comprising: First common line; and a contact portion including a first zigzag structure, a first end of the first zigzag structure being directly connected to the first common line; including, steps; directly contacting the first zigzag structure with a first probe; and measuring a resistance of a portion of the first zigzag structure located between the first probe and the first end, and performing a resistance measurement to monitor the position of the first probe; A method for monitoring the position of a probe, comprising: (Appendix 12) calculating a length of a portion of the first zigzag structure located between the first end of the first zigzag structure and the first probe according to a result of the resistance measurement; 12. The method of monitoring the position of a probe of claim 11, further comprising: (Appendix 13) The contact portion may further comprise: a second zigzag structure, wherein a first end of the second zigzag structure is directly connected to the first common line; a third zigzag structure, wherein a first end of the third zigzag structure is directly connected to the first common line; wherein the method for monitoring the position of the probe comprises: directly contacting the second zigzag structure with a second probe; and directly contacting the third zigzag structure with a third probe, wherein the resistance measurement is performed to measure the resistance of a portion of the second zigzag structure located between a first end of the second zigzag structure and the second probe, and the resistance of a portion of the third zigzag structure located between a first end of the third zigzag structure and the third probe; 12. The method of monitoring the position of a probe of claim 11, further comprising: (Appendix 14) 14. The method for monitoring the position of a probe according to claim 13, wherein the resistance measurement includes a two-point measurement step or a three-point measurement step using the first probe, the second probe, and the third probe. (Appendix 15) calculating a length of a portion of the second zigzag structure located between the first end of the second zigzag structure and the second probe, and a length of a portion of the third zigzag structure located between the first end of the third zigzag structure and the third probe according to a result of the resistance measurement; 14. The method of monitoring the position of a probe of claim 13, further comprising: (Appendix 16) The probe position monitoring structure: a second common line, wherein the contact portion further includes a second zigzag structure and a third zigzag structure, a first end of the second zigzag structure directly connected to the first common line, a second end of the second zigzag structure directly connected to the second common line, and a first end of the third zigzag structure directly connected to the second common line; and wherein the method of monitoring the position of the probe further comprises: directly contacting the second zigzag structure with a second probe; and directly contacting the third zigzag structure with a third probe, wherein the resistance measurement is performed to measure a resistance of a portion of the second zigzag structure located between a first end of the second zigzag structure and the second probe, a resistance of a portion of the second zigzag structure located between a second end of the second zigzag structure and the second probe, and a resistance of a portion of the third zigzag structure located between a first end of the third zigzag structure and the third probe; 12. The method of monitoring the position of a probe of claim 11, further comprising: (Appendix 17) 17. The method for monitoring the position of a probe described in Appendix 16, wherein the resistance measurement includes a two-point measurement step using the first probe and the second probe, and another two-point measurement step using the second probe and the third probe. (Appendix 18) The contact portion comprises: a second zigzag structure, wherein a first end of the second zigzag structure is directly connected to the first common line; and wherein the method of monitoring the position of the probe further comprises: directly contacting the first zigzag structure with a second probe; and directly contacting the second zigzag structure with a third probe; and directly contacting the second zigzag structure with a fourth probe, wherein the resistance measurement includes a four-point measurement step using the first probe, the second probe, the third probe, and the fourth probe; 12. The method of monitoring the position of a probe of claim 11, further comprising: (Appendix 19) The contact portion comprises: a second zigzag structure, wherein a first end of the second zigzag structure is directly connected to the first common line; and a third zigzag structure, wherein a first end of the third zigzag structure is directly connected to the first common line; and wherein the method of monitoring the position of the probe further comprises: directly contacting the first zigzag structure with a second probe; and directly contacting the second zigzag structure with a third probe; and directly contacting the third zigzag structure with a fourth probe, wherein the resistance measurement includes a four-point measurement step using the first probe, the second probe, the third probe, and the fourth probe; 12. The method of monitoring the position of a probe of claim 11, further comprising: (Appendix 20) The probe position monitoring structure: a second common line, the contact portion further comprising a second zigzag structure, a third zigzag structure, and a fourth zigzag structure, a first end of the second zigzag structure and a first end of the third zigzag structure being directly connected to the second common line, and a first end of the fourth zigzag structure being directly connected to the first common line; and a reference zigzag structure disposed between the first zigzag structure and the second zigzag structure, a first end of the reference zigzag structure directly connected to the first common line, a second end of the reference zigzag structure directly connected to the second common line, and a line width of the reference zigzag structure equal to that of the first zigzag structure; and wherein the method of monitoring the position of the probe further comprises: directly contacting the second zigzag structure with a second probe; and directly contacting the third zigzag structure with a third probe; and directly contacting the fourth zigzag structure with a fourth probe, wherein the resistance measurement includes a four-point measurement step using the first probe, the second probe, the third probe, and the fourth probe; 12. The method of monitoring the position of a probe of claim 11, further comprising: [Prior art documents] [Patent documents]

[0060] [Patent Document 1] Japanese Patent Application Laid-Open No. 2008-071999 [Patent Document 2] Japanese Patent Application Publication No. 7-302773 [Patent Document 3] Japanese Patent Application Laid-Open No. 2008-235485 [Patent Document 4] Japanese Patent Application Laid-Open No. 2005-340696 [Patent Document 5] Japanese Patent Application Laid-Open No. 2007-048853 [Patent Document 6] Japanese Patent Application Laid-Open No. 2007-214392 [Patent Document 7] Japanese Patent Application Publication No. 58-43535 [Patent Document 8] Japanese Patent Application Publication No. 2-137350 [Patent Document 9] Japanese Patent Application Publication No. 3-14250 [Patent Document 10] Japanese Patent Application Publication No. 4-162544 [Patent Document 11] Japanese Patent Application Publication No. 5-343487 [Patent Document 12] Japanese Patent Application Publication No. 8-279539 [Patent Document 13] Japanese Patent Application Laid-Open No. 2007-158346 [Patent Document 14] Japanese Patent Application Laid-Open No. 2015-015441

Claims

1. 1. A probe position monitoring structure comprising: First common line; and a contact portion configured to directly contact the probe; the contact portion includes a first zigzag structure, a second zigzag structure, and a third zigzag structure; a first end of the first zigzag structure directly connected to the first common line; The pattern of the second zigzag structure is identical to the pattern of the first zigzag structure; and a pattern of the third zigzag structure being identical to the pattern of the first zigzag structure, and the first zigzag structure, the second zigzag structure, the third zigzag structure, and the first common line being different portions of a metal layer;

2. The first zigzag structure: first sections, each of the first sections extending in a first direction; and second sections, each of which extends in a second direction different from the first direction and is directly connected to two first sections located adjacent to each other; 10. The probe position monitoring arrangement of claim 1, comprising:

3. 3. The probe position monitoring structure of claim 2, wherein a width of each of said first sections is less than a width of said first common line.

4. 2. The probe position monitoring structure of claim 1, further comprising a second common line, wherein a first end of the second zigzag structure is directly connected to the first common line, a second end of the second zigzag structure is directly connected to the second common line, and a first end of the third zigzag structure is directly connected to the second common line.

5. 2. The probe position monitoring structure of claim 1, wherein a first end of said third zigzag structure is directly connected to said first common line.

6. a second common line, wherein a first end of the second zigzag structure is directly connected to the second common line; and a reference zigzag structure disposed between the first zigzag structure and the second zigzag structure, a first end of the reference zigzag structure directly connected to the first common line, a second end of the reference zigzag structure directly connected to the second common line, and a line width of the reference zigzag structure equal to the line width of the first zigzag structure; The probe position monitoring structure of claim 1 further comprising:

7. an interlayer dielectric, wherein the first common line and the contact are at least partially disposed in the interlayer dielectric, and the first zigzag structure includes first and second layers separated from each other by a portion of the interlayer dielectric; 7. A probe position monitoring arrangement according to any one of claims 1 to 6, further comprising:

8. 1. A method for monitoring the position of a probe, comprising: Providing a probe position monitoring structure, said probe position monitoring structure comprising: First common line; and a contact portion including a first zigzag structure, a second zigzag structure, and a third zigzag structure; a first end of the first zigzag structure directly connected to the first common line; The pattern of the second zigzag structure is identical to the pattern of the first zigzag structure; and a pattern of the third zigzag structure being identical to the pattern of the first zigzag structure, and the first zigzag structure, the second zigzag structure, the third zigzag structure, and the first common line being different portions of a metal layer; directly contacting the first zigzag structure with a first probe; and measuring a resistance of a portion of the first zigzag structure located between the first probe and the first end, and performing a resistance measurement to monitor the position of the first probe; A method for monitoring the position of a probe, comprising:

9. calculating a length of a portion of the first zigzag structure located between the first end of the first zigzag structure and the first probe according to a result of the resistance measurement; 9. The method of claim 8 further comprising:

10. The probe position monitoring structure comprises: a second common line, the contact portion further comprising a fourth zigzag structure, a first end of the second zigzag structure and a first end of the third zigzag structure being directly connected to the second common line, and a first end of the fourth zigzag structure being directly connected to the first common line; and a reference zigzag structure disposed between the first zigzag structure and the second zigzag structure, a first end of the reference zigzag structure directly connected to the first common line, a second end of the reference zigzag structure directly connected to the second common line, and a line width of the reference zigzag structure equal to the line width of the first zigzag structure; and wherein the method of monitoring the position of the probe further comprises: directly contacting the second zigzag structure with a second probe; and directly contacting the third zigzag structure with a third probe; and directly contacting the fourth zigzag structure with a fourth probe, wherein the resistance measurement includes a four-point measurement step using the first probe, the second probe, the third probe, and the fourth probe; 10. The method of claim 9, further comprising:

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