Magnetoelectrostatic detection, focusing, and steering of electron beams in vacuum electron devices

Abstract

To create a VED having a plurality of two-dimensional layers formed of different materials which are joined together to form at least one vacuum electronic device (VED) at the same time.SOLUTION: A two-dimensional material layer is mechanically processed to include features necessary for device operations to form features of a three-dimension when the two-dimensional material is assembled and is joined and becomes a three-dimensional structure. The two-dimensional layers are joined together using techniques such as brazing, diffusion bonding, assisted diffusion bonding, solid-state bonding, cold welding, and ultrasonic welding. This manufacturing step makes it possible to built in a metal material, a magnetic material, and a ceramic material which are necessary to manufacture a VED while maintaining a required positional accuracy and a large number of devices for a batch capacity. The thus formed VED includes a combination of a magnetic lens and an electrostatic lens for controlling electron beams.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] (CROSS-REFERENCE TO RELATED APPLICATIONS) This application is incorporated herein by reference in its entirety (1) as if fully set forth herein; The term "Multi-layered multi-material" is incorporated herein by reference. al manufacturing process for vacuum elec "Multilayer multi-material manufacturing process for vacuum electronic devices" The present application is jointly owned by inventor Diana Gamzina Daugherty. U.S. Provisional Patent Application No. 63 / 198,817, filed November 15, 2020; and (2) the contents of which are incorporated herein by reference as if fully set forth herein. Incorporated into the Specification, "Electronic magneto-electrost atic sensing, focusing, and steering of electron beams in microwave, millimeter wave, and near-terahertz vacuum electron IC devices (microwave, millimeter wave, and near-terahertz vacuum electron "Electronic, magnetic, and electrostatic detection, focusing, and steering of electron beams in a device," inventor Shared under the name of Diana Gamzina Daugherty, © 2020 Priority based on U.S. Provisional Patent Application No. 63 / 198,915 filed November 21st assert the interests of rights.

[0002] This application also provides: (1) "Multi-layered multi-materia l manufacturing process for vacuum elect "Multilayer multi-material manufacturing process for vacuum electronic devices" , inventor Diana Gamzina Daugherty, co-owned with this application. U.S. Provisional Patent Application No. 63 / 198,817, filed November 15, 2020; Rabini (2) “Electronic magneto-electrostatic sensing, focusing, and steering of elect ron beams in microwave, millimeter wave, and near-terahertz vacuum electronic de vices (microwave, millimeter wave, and near-terahertz vacuum electronic devices) "Electronic, Magnetic, and Electrostatic Detection, Focusing, and Steering of Electron Beams," inventor Diana Shared under the name of Gamzina Daugherty and published on November 21, 2020 The present application claims the benefit of priority to U.S. Provisional Patent Application No. 63 / 198,915, filed on Another patent application filed on the same date herewith claims inventor Diana G. Shared with this specification under the name of amzina Daugherty, "Multi-lay er Vacuum Electron Device and Method of A US provisional patent application entitled "Multilayer Vacuum Electron Devices and Manufacturing" was filed. This application may be considered related to U.S. Provisional Patent Application No. 17 / 525,658. The contents of Serial No. 17 / 525,658 are incorporated herein by reference as if fully set forth herein. No. 6,299,499, filed on Dec. 1, 2002, and incorporated herein by reference as if fully set forth herein. [Background technology]

[0003] The present disclosure generally relates to one or more vacuum electron devices. Various materials bonded together to form a simultaneous VED The present invention relates to a manufacturing process used to fabricate a VED having multiple two-dimensional layers comprising: Two-dimensional material layers acquire three-dimensional features when assembled and joined into three-dimensional structures. It is machined to form and contain the features necessary for device operation. The layers are brazed, diffusion bonded, and assisted diffusion bonded. bonding, solid state bonding, cold welding, ultra This manufacturing process allows for the required positional accuracy and balance. The metal materials required for VED fabrication while maintaining a large number of devices per switch capacity It is possible to incorporate magnetic, ceramic, and other materials. The VED, which was created in this way, uses a combination of magnetic and electrostatic lenses for electron beam control. include.

[0004] A vacuum electron device (VED) operates in a vacuum environment and combines one or more electron beams with a VE The interaction between the electromagnetic field generated in the interaction region of the D is utilized. is the passage of electrons from the cathode (electron emitter) to the collector (electron acceptor) of a vacuum electron device. A single assembly that may be vacuum-held or vacuum-sealed to prevent the A vacuum region is also a vacuum. Also called a chamber, cavity, tunnel, or RF interaction region, 1 It is a place where interaction takes place between one or more electron beams and one or more electromagnetic waves. Examples of such VEDs in the prior art are particle accelerators, klystrons, gyrotrons, Gyroklystron, gyro amplifier, traveling wave tube tube, TWT), gyro TWT, backward wave oscillator, inductive output tube e output tubes (IOTS), magnetrons, cross-field amplifiers (cross -field amplifier, free electron laser, ubitron , including (but not limited to) masers, diodes, triodes, tetrodes, pentodes, etc. Some gas-ion lasers do not operate strictly in a vacuum, but at very low pressures. They operate on forces and generally lack an RF interaction region, but operate in much the same way.

[0005] Conventionally, electron beam propagation through the electron beam tunnel of a VED is performed by This is achieved by using a magnetic or electrostatic field that encompasses the electron beam. That is, the effect of negatively charged electrons compressed into a narrow beam is that the electrons all have the same charge. Because of the loads they tend to repel each other, which tends to spread the beams outwards. , RF signal and electronics in the interaction region to obtain higher efficiency and performance for VED. Bundle the beams for longer periods and distances so that the beams can interact longer Therefore, containment techniques are required.

[0006] Permanent magnets, electromagnets, and periodic arrays of permanent magnets and electromagnets are usually used in beam tunnels. It is used to confine the beam in the tube. When preparing a VED for this purpose, two challenges arise: (1) the beam tunnel, The centerline and beam injection location are often significant, especially in higher frequency devices. (2) the quality of the magnetic material is not as good as required; It is suitable for ensuring that the magnetic domains of individual magnets are aligned according to design targets with a precision that is As a result, after the VED is manufactured, technical experts usually When adjusting or fine-tuning the magnetic field around the VED to achieve optimal electron beam transmission This fine tuning is typically achieved by manually attaching the VED structure to the outside using adhesive. This is accomplished by applying fine tuning magnets in the process. This process is related to the transmission optimization process. The power for guidance is limited and in most cases the cathode current and beam delivery are compared. While only the results are available, additional fine-tuning magnets can be added to optimize VED performance. This process is lengthy and can take several hours to complete depending on the complexity of the VED. It may take several weeks from now. Stereoscopy has recently incorporated quadrupole alignment magnets for this purpose, but the alignment process has been gradually increased. This only accelerates the frequency response slightly, and still falls short of the requirements for near-THz devices. [Prior art documents] [Patent documents]

[0007] [Patent Document 1] U.S. Provisional Patent Application No. 63 / 198,817 [Patent Document 2] U.S. Provisional Patent Application No. 63 / 198,915 [Patent Document 3] U.S. Provisional Patent Application No. 17 / 525,658 Summary of the Invention [Problem to be solved by the invention]

[0008] Previous VEDs generally used individual 2D and 3D subcomponents to The components are formed into an assembly and the assembly is joined to the enclosure to provide structural support and a vacuum enclosure. and then undergoing conventional vacuum processing and sealing procedures to produce a functional VED. Such procedures may take several minutes to complete a single device, depending on the complexity of the device. It can take weeks or more and requires many highly skilled workers and large Today, we have a clean room for the ground station to the satellite, base station, and local Wi-Fi. Explosive demand for wireless broadband data communications on i-systems and terrestrial backbone systems As the number of such devices increases dramatically, there is a significant need for cheaper, higher volume such devices. [Means for solving the problem]

[0009] The subject matter described herein generally relates to laminates of materials assembled and bonded together. Fabrication of three-dimensional vacuum electron devices (VEDs) using parallel sheets The advantage of this approach is that multiple VEDs can be fabricated simultaneously with the same structure, and the semiconductor device When completed, they can be easily separated for individual use, much like is commonly done in vise making. This allows for separation, thereby significantly reducing manufacturing costs per device. The VED so produced uses a combination of magnetic and electrostatic lenses for electron beam control. Includes combinations.

[0010] The foregoing summary is a summary and, as a result, may contain simplifications, generalizations, and omissions of detail. As a result, those skilled in the art will understand that the summary is illustrative only and is in no way intended to be limiting. Please be aware that this is not a diagram.

[0011] The accompanying drawings, which are incorporated in and constitute a part of this specification, show one or more representative drawings. The present invention will be described in detail with reference to the accompanying drawings, in which: It helps to explain. [Brief explanation of the drawings]

[0012] [Figure 1] FIG. 1 is a front right perspective view of a VED according to an embodiment. [Figure 2] 2 is a rear left perspective view of the VED of FIG. 1 according to an embodiment. [Figure 3] FIG. 2 is a right-side front view of the VED of FIG. 1 according to an embodiment. [Figure 4] 2 is a partially cutaway perspective view of the front right side of the VED of FIG. 1 according to an embodiment. [Figure 5] 2 is a partial cutaway perspective view of the front right interior of the VED of FIG. 1 according to one embodiment. [Figure 6] 6 is a cross-sectional view taken along line 6-6 of a portion of the interior of the VED of FIG. 1 according to an embodiment. [Figure 7] FIG. 1 is a front right perspective view of one VED cut out from the assembly according to one embodiment. [Figure 8] 1 is a cross-sectional view of a portion of the interior of a VED according to an embodiment. [Figure 9] 9 is a partial cutaway perspective view of the interior front left side of the VED of FIG. 8 according to one embodiment. [Figure 10] FIG. 1 is a partially cutaway perspective view of the interior front left side of a VED according to an embodiment. [Figure 11] 11 is a partially cutaway exploded perspective view of the front left side of the interior of section 11 of the VED of FIG. 10 according to one embodiment. [Figure 12A]10A-10C illustrate various control plates that may be used with embodiments to provide beam steering and focusing functions. [Figure 12B] 10A-10C illustrate various control plates that may be used with embodiments to provide beam steering and focusing functions. [Figure 12C] 10A-10C illustrate various control plates that may be used with embodiments to provide beam steering and focusing functions. [Figure 12D] 10A-10C illustrate various control plates that may be used with embodiments to provide beam steering and focusing functions. [Figure 13] 1 is a flow chart illustrating a process or method for fabricating a vacuum electronic device according to an embodiment of the present invention. DETAILED DESCRIPTION OF THE INVENTION

[0013] Representative embodiments are described herein in the context of a VED, such as a TWT. Those skilled in the art will recognize that the description is representative only and is not intended to be limiting in any way. Other embodiments will readily suggest themselves to such skilled persons having the benefit of this disclosure. Reference will now be made in detail to exemplary embodiment implementations, as illustrated in the accompanying drawings. and throughout the following description, the same reference numbers have been used to refer to the same or similar items wherever possible. This refers to the item.

[0014] For clarity, not all of the routine features of the implementations described herein are shown. It is understood that any such practical implementation may be developed. to achieve the developer's specific goals, including adhering to application-related and business-related constraints. Many implementation-specific decisions must be made to achieve this, and these specific goals are It will be recognized that this will vary from implementation to implementation and from developer to developer. Development efforts can be complex and time-consuming, but this development is nonetheless It will be appreciated that this is a routine undertaking for those skilled in the art having the benefit of the present teachings.

[0015] As used herein, "one embodiment" or "an embodiment" or "one implementation" or References to "an implementation" or the like refer to particular features described in connection with representative embodiments. , structure, part, function, or characteristic may be included in at least one exemplary embodiment. In various places within this specification, "in one embodiment" or "in one embodiment" may be used. The appearance of phrases such as "in one embodiment" or "in another embodiment" does not necessarily refer to the same embodiment or implementation. The present invention does not refer to any particular embodiment, nor does it refer to any separate embodiment that necessarily excludes other embodiments. It is not an alternative embodiment of the.

[0016] In accordance with the present disclosure, the components and process steps described herein are may be implemented using various techniques without departing from the spirit and scope of the inventive concept. That's fine.

[0017] What is described herein includes examples of embodiments of the present invention. Any conceivable combination of elements or methodologies for the purpose of describing the subject matter sought Although it is not possible to describe all of the above, other combinations and permutations of the subject innovation are also possible. Accordingly, it is recognized that claimed subject matter is all such alternatives, modifications, and variations that fall within the spirit and scope of the Moreover, the disclosure of the subject matter, including that described in the Abstract, is intended to be illustrative and not restrictive. The above description of the embodiments is neither exclusive nor intended to limit the scope of the disclosed embodiments. Furthermore, it is not intended to be limiting to the specific embodiments, examples, and aspects described herein. Although implementations are described herein, those skilled in the art will recognize that such implementations Various modifications are possible that are considered to fall within the scope of the embodiments and examples.

[0018] In particular, the various functions performed by the components, devices, systems, etc. described above The terminology used to describe such components with respect to functionality is not specified. As long as the claimed subject matter performs its functions in the exemplary manner illustrated herein, Even if they are not structurally equivalent to the disclosed structures, they may still perform the designated functions of the described components. It is intended to correspond to any component (e.g., functional equivalent) that performs the functions described herein.

[0019] Additionally, certain features of the present invention may be described with respect to only one of several implementations. Although some features have been disclosed, such features may not be suitable for any given application or particular suitability. One or more of such other implementations may be desirable or advantageous in the field of application. It may be combined with any number of other features. (including), "has", "contains" The terms "and" and variations thereof, and other similar terms, are used in the detailed description and claims. to the extent that it is used within the scope of It is included in a similar way to the term "comprising" as a transitional word that is not unique. It is intended to be comprehensive.

[0020] Moreover, the words "example" or "exemplary" are used herein to mean something that is an example, instance, or illustration. Any term described herein as "representative" is used to mean "useful" No aspect or design is necessarily to be construed as preferred or advantageous over other aspects or designs. Rather, the use of the words "example" or "representative" should not be construed as implying that It is intended to present concepts in a concrete manner. As used in this application, the terms "or" and "(" are used interchangeably herein). "or") is intended to mean an inclusive "or" rather than an exclusive "or." That is, unless otherwise specified or clear from the context, "X is A" "or with B" is intended to mean any of the natural inclusive permutations, i.e. If X uses A, X uses B, or X uses both A and B, then "X is either A or B" "Using the article 'a' and 'a'" is satisfied under any of the preceding examples. As used in this application and the appended claims, the terms "an" and "an" refer to or "one or more" generally unless the context clearly directs to the singular. should be interpreted to mean "number."

[0021] In the figures, when a callout number or reference symbol is used in more than one figure, Unless otherwise expressly intended by the context, the same or similar parts, components, or step.

[0022] The devices and methods described herein are applicable to pencil beams, sheet beams, rectangular beams, and for VEDs utilizing beams, elliptical beams, hollow beams, diverging beams, and multiple beams It can be used.

[0023] Most of the following description assumes that the plate is positioned above the electron beam. It addresses the creation of VEDs in the form of parallel aligned layers, but also the fabrication of such devices. The chair can be constructed perpendicular to the electron beam in a relatively simple manner as taught herein. It is contemplated that such a device may also be used, if desired, for example, as a diverging beam detector. The device may be constructed at any angle to the electron beam, such as a vise.

[0024] A significant benefit of the present invention is that it is possible to build even a single prototype device using the present invention without using prior art techniques. It has been proven to be much more cost-effective than multiple VEDs in a single batch. The ability of the present invention to simultaneously fabricate multiple VEDs and then cut them into individual components It's in the power.

[0025] Typically, magnets are used to perform some of the functions of shaping and aiming the electron beam in a VED. If the electron beam is not properly guided from the cathode to the anode, V It may collide with some other part of the ED structure, causing damage and contaminating the vacuum area. The ability to incorporate a variety of magnet material types is beneficial in the assembly of VEDs. The lbach, or quadrupole array, is often placed some distance from the electron beam. A solenoid is introduced around the electron beam, which is used to focus the electron beam. Another important benefit of the present invention is that it allows for the electric field to be generated without placing a magnet inside the vacuum chamber. This allows the magnet to be brought much closer to the electron beam (electromagnetic solenoid providing a higher magnetic field strength at the electron beam for a given magnet (either fixed or standard) The ability of the present invention to achieve this is due to the fact that the magnetic field obtained from a magnet decreases with the square of the distance from the magnet. This allows the magnets to be brought closer together and the magnets can be made smaller with this invention. Magnetic steering is not just about the actual magnets, but also about creating the desired magnetic field inside the VED in conjunction with the magnets. a combination of magnetically susceptible material and magnets to establish a suitable steered electron beam; Magnetic materials and / or materials containing iron and nickel are also suitable. Since the electron beam is not a good conductor, the electromagnetic circuit typically moves the focusing structure away from the electron beam. Made from materials such as copper (or tungsten for spiral-type devices). and / or iron and nickel containing materials should be galvanized with a highly conductive material such as copper. can be developed and used to alleviate this problem, however, The arrangement is based on the VED, as such materials may degrade over time within the VED. This can create potential vacuum purity issues.

[0026] Electrostatic focusing also provides some of the electron beam shaping and aiming functions in VEDs. The ability of the present invention to introduce conductors into vacuum structures can then be used to: A vacuum is created by applying a voltage across two or more plates placed around the electron beam. Allows for precise electrostatic focusing within the structure, as desired for specific applications, and If required, several sets of such plates may be used.

[0027] The manufacturing approach described herein is suitable for manufacturing VEDs at a variety of frequencies. It can be used for VEDs, but is particularly useful for VEDs operating between about 25 GHz and about 1 THz. The manufacture of such devices using conventional device assembly by hand (in some cases) Some are difficult due to the small feature scale (micrometers to millimeters). be.

[0028] The embodiments described herein generally relate to improved electron beam current detection within a VED. , electron beam focusing, and electron beam steering. It uses a conductor (electrode) to apply an electrostatic field on the electron beam in the vicinity of the electron beam. to electronically detect and control electron beam propagation within a confining magnetic field. The electrodes detail the beam transmission and losses along the VED circuit structure. It is not only for detecting electrons, but also for applying a potential to the area around the electron beam (generally a single potential element). By using electrostatic lenses, which are elements of electron beams, or by focusing the electron beam (generally 2 To steer the beam (by using electrostatic deflectors, which are one or four potential elements) In this case, an electronic control system of conventional design may be employed to control the It detects the resulting current and consumes much less time than previous approaches. It is a relatively simple and cost-effective technique to adjust the potentials of the various electrodes to maximize the current passing through the electron beam. This allows for a larger current to be drawn into the body of the VED, minimizing the amount of current that enters it.

[0029] Turning now to the figures, FIG. 1 is a front right perspective view of a VED 100 according to one embodiment. The VED 100 in FIG. 1 may be, for example, a sheet beam TWT. D100 is fabricated in the form of several layers stacked and bonded together according to one embodiment. The layers are parallel to the electron (sheet) beam axis (one end of the axis is called 102). The axes may be arranged parallel to each other, or perpendicular to the axes if desired, or in any other way. They may be arranged at other angles. According to FIG. 1, the interior is made up of elements 104, 106, 108, 110. , and 112, with elements 108 also being permanent magnets, or or by elements 106 and 110 which may be formed from a magnetic material such as iron or nickel. The sandwich is made up of two permanent magnets sandwiched together. The elements 104 and 112 are insulating materials (e.g., alumina). Electrical signals, such as bias signals (discussed in more detail below) and / or RF input / output signals, The terminals 114, 116, 118, and 120 are carried by the , insulators 122, 124, 126, and 128, respectively, and conductor insulation It is insulated from the rest of the structure by bodies 130, 132, 134, and 136. To the right of 100 is shown a quadrupole (quadrupole) electrostatic steering / focusing assembly 138. Assembly 138 is The electrode terminals 140, 142, 144, and 146 each include an insulating piece 148, 150, 152, and 154 provide insulation from the structure of VED100. The elements 156, 158, and 160 that form the outer body of the device are formed from a conductive material such as copper. This electrostatic quadrupole focusing approach is compatible with sheet and pencil beam VEs. D. Elements 162, 164 confine the electron beam traveling along axis 102. Between elements 156 and 160, there is a periodic cusp. Magnets, Periodic Permanent Magnets, Wiggler Magnets, Halbach Magnets, Permanent Magnets, Electromagnets - Permanent The magnetic assembly or magnetics of the VED may consist of one or more of the following types: magnets, The circuit is located.

[0030] 2 is a rear left perspective view of the VED 100 of FIG. 1 in accordance with one embodiment. , 168 are magnetic poles that help contain and focus the electron beam traveling along axis 102. Control plate bias signal (discussed in more detail below) and / or RF input Electrical signals, such as output signals, are transmitted to terminals 170, 172, 174, 176, 178, and 180. These terminals are carried by insulators 182, 184, and 186, respectively, as shown. , 188, 190, and 192 from the rest of the structure.

[0031] 3 is a right-side front view of the VED 100 of FIG. 1, according to one embodiment. 138. Additionally shown here are conductor insulators 198, 200 to separate element 1. 58 are electrical terminals 194, 196 insulated from the

[0032] FIG. 4 is a cutaway perspective view of the front right side of the VED 100 of FIG. 1, according to one embodiment. According to this embodiment, elements 156a and 160a are similar to elements 15 in FIGS. 1, 2, and 3. 6 and 160 are formed from insulating material rather than conductive material. Element 158 ​​is shown in FIG. 4 (and FIG. 5) as having two portions 158a and 158b. In the cutaway view, the electronic sheet beam tunnel 202 is shown as a coupled cavity. It may appear to be a structure of this type.

[0033] 5 is a partial cutaway perspective view of the interior front right side of the VED 100 of FIG. 1, according to one embodiment. is.

[0034] FIG. 6 is a view taken along line 6-6 of a portion of the interior of VED 100 of FIG. 1 in accordance with one embodiment. 1 is a cross-sectional view of a control plate bias signal (discussed in more detail below) and / or Electrical signals such as RF input / output signals are input to terminals 204, 206, 208, 210, 212, and These terminals are carried by insulators 216 and 214, respectively, as shown. 8, 220, 222, 224, and 226. 228 is an outer conductive cover, and element 230 is a conductive part made of, for example, copper. minutes.

[0035] FIG. 7 shows the front of one VED 700 cut out of an assembly 702 according to one embodiment. According to this embodiment, the VED 700 is made up of materials 704, 706, 708. , 710, 712, 714, 716, and at least one of these materials At least 706, 708, 710, 712, and 714 comprise a conductive material such as copper, and 7 Layers 702, 704, and 716 may be magnetic materials such as iron or nickel. 706, 708, 710, 712, 714, 716 are joined together. Interaction Region 7 18 includes layers 708, 710, and 712, and is configured to allow the electron beam of the VED 700 to interact with the RF signal. Such an RF signal is transmitted to the interaction region 7 via, for example, a conductor 720. 18 and may be extracted via conductor 722. After fabrication, assembly 702 is cut ( (e.g. laser or water jet cutting) to individual components such as the VED700 , leaving a gap 724.

[0036] 8 is a cross-sectional view of a portion of the interior of a VED 800 according to one embodiment. 00 is a set of bonding layers that may be horizontal or perpendicular to the electron beam axis 802 of the device. The electron beam tunnel or interaction region is shown at 804. VE D800 includes a repeating set of blocks 806 comprising elements 808, 810, and 812. Elements 808 and 812 confine one or more electron beams of VED 800. Element 810 is a permanent magnet to help contain the magnetic material, such as iron or nickel. The elements 814, 816, 818, 820, 822 may be permanent magnets made of pieces of material. 2, and 824 are conductive elements along which the electron beam of the VED 800 travels. 26, 828, 830, 832, 834, 836, 838, 840, and 842 are V The various control plates 844, 846, 848, 8 50, and 852. Control plates 854, 856, and 858 are, for example, By applying various electrical biases (DC voltages) to the control plate, the electron beam The control plate 860 may be used to focus the three insulators 838, 840. , 842, and two conductive plates 850, 852, e.g., Various electrical biases (DC voltages) are applied to the electrodes 850, 852, e.g., one is positive and the other is negative. Two-axis electrostatic beam steering (PST) is achieved by applying an electrical bias, one of which may be positive and one of which may be negative. The element 862 may be made of a material such as iron or nickel. The elements 864, 866, 868, and 870 is a conductive element along which the electron beam of VED 800 travels.

[0037] It is desirable to "punch" or "pre-punch" the electron beam to improve efficiency. Preferably, the single-electrode electrostatic lens is supplied with a pulsed or modulated voltage signal rather than a continuous DC voltage signal. It can provide a voltage signal.

[0038] FIG. 9 is a partial cutaway perspective view of the interior front left side of the VED 800 of FIG. 8 according to one embodiment. is.

[0039] FIG. 10 is a partial cutaway perspective view of the front left side of the VED 800 of FIG. 8 in accordance with one embodiment. do.

[0040] FIG. 11 illustrates an interior front left portion of section 11 of VED 800 of FIG. 10 according to one embodiment. FIG.

[0041] 12A, 12B, 12C, and 12D illustrate the detection of beams according to one embodiment. It may be used to provide output (current), steering (deflection), and focusing (bias) functions. Various control plates or electrostatic lenses 1200, 1202, 1204, and 1206 are 06. The beam focusing is achieved by, for example, forming a completely conductive This can be achieved using a single voltage introduced into the plate. This is illustrated in Figure 12A. Port 1200 may be formed from a conductor such as copper or another vacuum-compatible material. The coil passes through an opening 1208 in the plate 1200 and connects to a terminal 1210 (either positive or negative). ) voltage is applied. The negatively charged electrons are attracted somewhat by the charged plate 1200. They attract or repel, providing a focusing function.

[0042] FIG. 12B shows a similar plate 120 made from an insulator such as alumina (Al2O3). 2. Alumina is easily brazed, as known to those skilled in the art. In the example shown, two electrodes 1212 and 1214 (located at 12 o'clock and 6 o'clock) formed (such as by plating or electroplating, or another equivalent method). The system can be configured by applying a positive or negative voltage to one or both of the electrodes 1212 and 1214. For example, electrodes 1212 and 1214 One of the electrodes may be positively biased and the other may be negatively biased. Alternatively, one of electrodes 1212 and 1214 may be omitted entirely, and the voltage simply applied to the remaining electrode. It may be applied.

[0043] FIG. 12C shows a plate 1202 similar to that of FIG. 12B but at a different angle (in this case, 90° 12 illustrates a plate 1204 oriented (at 3 o'clock and 9 o'clock offset). If control is desired, plates 12020 and 1204 may be stacked close to each other but insulated from each other. Additionally, electrodes 1216 and 1218 on plate 1204 are added to provide such control. It may be offered.

[0044] FIG. 12D shows the concept just described, but with four electrodes 1220, 1222. 12 illustrates the concept implemented in the form of a single plate having 1224, 1226, and 1228. Note that more electrodes may be provided and different angular positions may be used if desired. It should be noted that the final voltage applied to the electrodes may provide a focusing effect, and the unbalanced voltage may It may provide a deflection effect.

[0045] 12A, 12B, 12C, and 12D illustrate electron beams according to an embodiment. used for beam detection, focusing, and steering (and also beam acceleration / deceleration, if desired). For example, in FIG. 8, the control plate includes elements 854, 855, and 856. 56, 858, and 860. The VEDs referred to herein are The electron beam is confined to a beam tunnel region within the application region by a magnet. The ED may be of the solenoid type surrounding the ED, or as exemplified herein, Incorporated into the VED structure to place the magnet closer (and more effectively) to the beam Without some kind of containment force, the electron beam The electron beam spreads out like water coming out of a hose. Magnetic containment keeps the electron beam narrow and The beam is incident directly onto the VED structure, damaging the VED and wasting the electron beam energy. The electron beam is contained along its path to keep it out of the range of It acts like a magnetic lens.

[0046] The control plate is an electrostatic lens. Electrostatic lenses are periodically introduced along the electron beam. The electron lens steers and focuses the electron beam and is built around the electron beam (the electron lens is the The propagation path is along the fixed magnetic field and the electric field These control plates may have one or more electrical connections. The control plates may be stacked close to each other. The electrostatic lens focuses along the magnetic structure of the VED. may be stacked, occasionally interrupting the magnetic structure of the VED to achieve higher magnetic strength at the beam axis. This allows the magnetic structure to be closer to the beam tunnel.

[0047] Furthermore, by incorporating electrostatic lenses at various locations along the electron beam tunnel, This allows for incremental measurement of electron beam loss along the electron beam tunnel. measurement) and / or as a result, the circuit or to help identify problem areas with electron beam alignment. The electrostatic lens extends continuously along the electron beam tunnel at a certain axial location. The electron beam may be oriented in a direction perpendicular to the beam axis, or may be oriented to surround the electron beam, or may be oriented at a separate location. and may be positioned along the electron beam at a fixed axial location.

[0048] Electrostatic lenses (individual conductors) detect the electron current density at each sensor location along the electron beam. The electrostatic lens may function to adjust the potential of the electrostatic lens to the electrodes and the VED. Focusing or steering the electron beam by minimizing the electron beam current delivered to the structure This technique operates at millimeter wave and near THz frequencies. VEDs are particularly useful for compensating for field irregularities commonly encountered in such devices. It is beneficial.

[0049] The control plate controls the position of the electron beam inside the beam tunnel and, if circular, provides multiple electrodes surrounding the electron beam, which helps characterize the concentricity of the electron beam. It can be adapted to do so.

[0050] The magnetic-electrostatic focusing design is made possible by the multi-layer, multi-material manufacturing approach described herein. According to this approach, the manufacturing of the focusing / steering / detection system requires the use of metallic, magnetic, and and ceramic materials are used.

[0051] This approach can be applied to sheet beams, hollow beams, pencil beams, distributed beams, and multiple beams. It may be used in beam types such as beam devices.

[0052] The detected electron beam current is used to apply potentials to available electrostatic lenses to control the electron beam propagation. To optimize the electron beam propagation along the electron beam tunnel by optimizing may be employed, thereby reducing the need for assembly and fine tuning by a technician.

[0053] To perfectly focus and position the electron beam for maximum performance, The current that flows to ground but not to the collector is monitored and is reflected in the magnetic field around the VED and in the Applying adjustments to the electrostatic voltage input to various control plates introduced along the child beam This can be minimized by

[0054] FIG. 13 illustrates a process for fabricating a vacuum electronic device according to an embodiment of the present invention. is a flow diagram illustrating a method 1300. The process steps described in connection with FIG. may be performed, or some or all at once.

[0055] Block 1302 is the first step, which involves forming a first planar non-magnetic conductive material from a non-magnetic conductive material. A conductive plate is formed.

[0056] Block 1304 is the second step, which involves forming a second planar non-magnetic conductive material from the non-magnetic conductive material. A conductive plate is formed.

[0057] Block 1306 is the third step, where the interaction structure includes an electron beam tunnel. The non-magnetic interaction structure is formed by a plurality of planar non-magnetic interaction structure-forming plates arranged parallel to each other. Form an interaction structure, which has at least one leading edge to the outside of the interaction structure. At least one electrostatic lens element having a conductive path, the conductive path comprising: electrically isolated from the interaction structure so that a voltage applied to the electrostatic lens element is conducted to the electrostatic lens element. do.

[0058] Block 1308 is the fourth step, which involves forming a first planar non-magnetic conductive plate and a second planar non-magnetic conductive plate. The first planar non-magnetic conductive plate is placed on the outside of the lamination so that the second planar non-magnetic conductive plate is placed on the outside of the lamination. The port, the interacting structure, and the second planar non-magnetic conductive plate are arranged in a stack.

[0059] Block 1310 is the fifth step, which involves forming a first planar non-magnetic conductive plate, The magnetic structure and the second planar non-magnetic conductive plate are joined together.

[0060] Block 1312 is the sixth step, which involves sealing the electron beam inside the electron beam tunnel. At least one magnet in a confining arrangement surrounds the electron beam tunnel region.

[0061] Block 1314 is a seventh optional step, which involves placing a to deliver an electrical bias signal provided on at least one electrically isolated conductor. At least one electrostatic lens element is formed so as to be configured as follows:

[0062] Block 1316 is a seventh optional step, which involves placing a At least two separate electrical connections provided on at least two separate electrically isolated conductors forming at least one electrostatic lens element configured to deliver an electrical bias signal; Complete.

[0063] Block 1318 is a seventh optional step, which involves placing a At least four separate electrical connections provided on at least four separate electrically isolated conductors forming at least one electrostatic lens element configured to deliver an electrical bias signal; Complete.

[0064] Those skilled in the art will now appreciate that these steps can be performed in the order most convenient for manufacturing and fixing. It will be appreciated that the steps do not necessarily have to be performed in a set order. For example, the joining steps may all be performed in a set order. The forming step can be performed in one step to produce a part for later assembly. It can be carried out with

[0065] The step of joining two-dimensional sheets together can be performed by brazing, diffusion bonding, assisted diffusion bonding (a sisted diffusion bonding, solid state bonding ate bonding), cold welding, ultrasonic welding, or a combination of one or more of the above The joint formed between two adjacent sheets may be a 1x1 0 -6 The vacuum environment should be maintained at a level better than that of torr. Bonding can be performed using hydrogen, nitrogen, vacuum, etc. Before joining, the corresponding layers should be cleaned or plated. It should be etched to remove the surface oxide layer, which helps to form a good leak-tight joint. To avoid this, the corresponding layers should be kept in a vacuum environment before bonding. In this case, the corresponding layers (which may be of different materials) have a vacuum-compatible boundary between them. Coating with vacuum compatible materials (sputtering, electroplating, metallization, and / or painted). Coatings include nickel, gold, silver, molybdenum-manganese, Gun, Copper, Copper-Gold, Copper-Silver, Titanium-Nickel, Gold-Copper-Titanium, Copper-Silver-Titanium, Copper- Silver-titanium-aluminum, titanium-nickel-copper, gold-copper-titanium-aluminum, silver - Copper-Indium-Titanium, Copper-Germanium, Palladium-Nickel-Copper-Silver, Gold-Palladium Radium-magnesium, silver-palladium, gold-copper-nickel, gold-copper-indium, silver -Containing one or more of copper-indium, gold-nickel, gold-nickel-chromium, etc. In this manner, the bonded layers form a high strength assembly, resulting in a relatively high yield. The force handling capability and high gradient capability of the VED are obtained.

[0066] The layers are also electrically insulating to manage the heat flow as well as the electrical potential within the VED. coated with conductive or electrically conductive materials (sputtered, electroplated, metallized, and / or painted) ) The coating may also reduce the flow of heat into and away from the VED. To better manage this, materials designed to conduct heat (e.g., diamond) The layers may then include electrodes and and an insulator plated with conductive paths to form an electrical path for biasing the electrodes. (e.g., Al2O3).

[0067] Cutouts or pockets can be milled, turned, eroded, or lithographed Using techniques such as etching, laser cutting, electron beam cutting, water jet cutting, etc. The cutouts or pockets so formed may be formed in the conductive sheet of the VED. The kit includes ceramic materials, vacuum windows, and circuit-breaking materials (used to improve device stability). attenuators for electron emission, electron emitting materials, vacuum pumping materials, getter materials, Structures such as magnets, iron pieces, shielding materials, separating materials, conductors, connectors, waveguides, couplers, etc. It may be populated by elements.

[0068] Incorporating ceramic materials for focusing, propagation, guidance, steering, punching, and Electrostatic beam-shaping lenses, which ultimately help improve electron beam propagation between the cathode and collector Alternatively, an electrostatic beam forming section can be added inside the VED. Rather than providing this capability, the VED itself can incorporate this capability, This allows for more precise control of the child beams with lower power consumption.

[0069] Aligning adjacent layers or sheets of material within a VED during the manufacturing process is essential. This may be achieved using column features 112. Such features are discussed elsewhere herein. Alignment holes, alignment pins, rectangular features, and combinations thereof, suitable for robotic assembly techniques. The seat assembly may be performed by manual assembly, robot assembly, Translation stage, automatic translation, robot placement, video from microscale to nanoscale It may be affected by alignment, banya, etc.

[0070] Having shown and described exemplary embodiments and applications, it is understood that those skilled in the art will recognize that many alternatives, including those having the benefit of this disclosure, may be readily apparent to those skilled in the art. Those skilled in the art will appreciate that, without departing from the scope of the present invention as defined by the appended claims, The various exemplary embodiments described herein may include numerous modifications not specifically mentioned above. It will be apparent that corrections, modifications and adaptations may be made.

Claims

1. 1. A vacuum electronic device for a radio frequency (RF) amplifier or oscillator, comprising: a first planar non-magnetic conductive plate; a second planar non-magnetic conductive plate; a plurality of planar non-magnetic interaction structure forming plates disposed in a stacked configuration between the first non-magnetic conductive plate and the second non-magnetic conductive plate to form an RF interaction structure containing an electron beam tunneling region, the first non-magnetic conductive plate, the second non-magnetic conductive plate, and the plurality of non-magnetic interaction structure forming plates being bonded together; one or more magnetic elements disposed around the electron beam tunnel region for applying RF interaction to confine the electron beam in the electron beam tunnel region; at least one control element electrically isolated from the RF interaction structure, the at least one control element being coupled to at least one electrically isolated conductor that leads to an exterior of the RF interaction structure and is arranged to be electrically isolated from the RF interaction structure; wherein the at least one electrically isolated conductor is configured to apply a corrective steering or focusing force to the electron beam within the electron beam tunnel region.

2. The vacuum electronic device of claim 1 , wherein the at least one control element is configured to deliver an electrical bias signal provided on at least one electrically isolated conductor disposed on the control element.

3. 10. The vacuum electronic device of claim 1, wherein the at least one control element is configured to deliver at least two separate electrical bias signals provided on at least two separate electrically isolated conductors disposed on the control element.

4. 10. The vacuum electronic device of claim 1, wherein the at least one control element is configured to deliver at least four separate electrical bias signals provided on at least four separate electrically isolated conductors disposed on the control element.

5. The vacuum electron device of claim 1 , wherein the at least one electrically isolated conductor is further configured to detect electron current density.

6. 1. A vacuum electron device (VED) for a radio frequency (RF) amplifier or oscillator, comprising: a plurality of conductive sections of an interaction structure containing an electron beam tunnel, the plurality of conductive sections being formed from a plurality of planar non-magnetic conductive plates arranged in a stack and bonded together, the electron beam tunnel having a longitudinal axis parallel to the interaction structure, and at least one magnetic element disposed about the electron beam tunnel to apply RF interaction to confine the electron beam in the electron beam tunnel; the plurality of conductive sections are separated by a first pair of electrical insulators at a first location along the electron beam tunnel and by a second pair of electrical insulators at a second location along the electron beam tunnel, the first pair of electrical insulators and the second pair of electrical insulators each sandwiching at least one electrostatic lens element disposed perpendicular to the longitudinal axis; 1. A vacuum electron device comprising: a first conductive path for applying a voltage to an electrostatic lens element to apply a corrective steering or focusing force to an electron beam in the electron beam tunnel; a second conductive path for applying a voltage to the electrostatic lens element to apply a corrective steering or focusing force to an electron beam in the electron beam tunnel;

7. 7. The vacuum electron device of claim 6, wherein the at least one electrostatic lens element is configured to deliver an electrical bias signal provided on at least one electrically isolated conductor disposed on the electrostatic lens element.

8. 7. The vacuum electron device of claim 6, wherein the at least one electrostatic lens element is configured to deliver at least two separate electrical bias signals provided on at least two separate electrically isolated conductors disposed on the electrostatic lens element.

9. 7. The vacuum electron device of claim 6, wherein the at least one electrostatic lens element is configured to deliver at least four separate electrical bias signals provided on at least four separate electrically isolated conductors disposed on the electrostatic lens element.

10. The vacuum electron device of claim 6 , wherein at least one conductive path is configured to detect electron current density.

11. 1. A method for manufacturing a vacuum electronic device for a radio frequency (RF) amplifier or oscillator, comprising: forming a planar first non-magnetic conductive plate from a non-magnetic conductive material; forming a planar second non-magnetic conductive plate from a non-magnetic conductive material; bonding together a plurality of planar, conductive, non-magnetic interaction structure-forming plates arranged relative to one another to accommodate an electron beam tunnel region to form an interaction structure, the interaction structure including at least one electrostatic lens element having at least one conductive path to an exterior of the interaction structure, the at least one conductive path being electrically isolated from the interaction structure such that a voltage applied to the at least one conductive path conducts to the at least one electrostatic lens element, the at least one electrostatic lens element configured to deliver an electrical bias signal to at least one electrically isolated conductor disposed on the at least one electrostatic lens element, the at least one electrically isolated conductor configured to apply a corrective steering or focusing force to an electron beam in the electron beam tunnel region; arranging the first non-magnetic conductive plate, the interacting structure, and the second non-magnetic conductive plate in a stack such that the first non-magnetic conductive plate and the second non-magnetic conductive plate are on the outside of the stack; coupling the first non-magnetic conductive plate, the interacting structure, and the second non-magnetic conductive plate; disposing at least one magnetic element around the electron beam tunnel region to apply RF interaction to confine the electron beam within the electron beam tunnel region; A method comprising:

12. configuring the at least one electrostatic lens element to deliver at least two separate electrical bias signals provided on at least two separate electrically isolated conductors disposed on the electrostatic lens element, each of the electrically isolated conductors applying a respective corrective steering or focusing force to the electron beam within the electron beam tunnel region; The method of claim 11 , comprising:

13. configuring the at least one electrostatic lens element to deliver at least four separate electrical bias signals provided on at least four separate electrically isolated conductors disposed on the electrostatic lens element, each of the electrically isolated conductors applying a respective corrective steering or focusing force to the electron beam in the electron beam tunnel region; The method of claim 11 further comprising:

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