Substrate production system and substrate production method

Abstract

To provide a substrate production system capable of suppressing a wasteful increase of a component to be used.SOLUTION: A substrate production system 100 comprises: a component mounting device 15; a printing machine 12 and a dispenser device 14 that print or apply solder on a substrate S; and a control device 30 that acquires an estimation time until a mounting of a component E to the substrate S in the component mounting device 15 is completed in the substrate S on which the solder is printed or applied, or the substrate S is conveyed to a reflow device 18 heating the substrate S. The control device 30 is configured to determine whether or not there is a risk that a quality of the solder printed or applied on the substrate S becomes a failure due to a lapsed time on the basis of a lapsed time after the solder is arranged on the substrate S and the acquired estimation time, in the substrate S on which the solder is printed or applied.SELECTED DRAWING: Figure 4

Description

[Technical Field]

[0001] The present invention relates to a board production system and a board production method. [Background technology]

[0002] Conventionally, a substrate production system is known (see, for example, Patent Document 1).

[0003] The above-mentioned Patent Document 1 discloses a board production system including a component mounting device that mounts components on a board, a solder printer that prints solder on the board, and a control device. In the board production system of Patent Document 1, the control device is configured to control the component mounting device to stop the component mounting operation if, at the time when the component mounting device starts the operation of mounting components on the board, the time since printing the solder on the board exceeds the solder's usable time limit. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Application Laid-Open No. 2004-048044 Summary of the Invention [Problem to be solved by the invention]

[0005] In the above-mentioned Patent Document 1, when the component mounting device starts mounting components on a board, if the time since solder was printed on the board exceeds the solder's usable time limit, the component mounting device stops the component mounting operation. Therefore, if components are being mounted upstream from the component mounting device that stopped the mounting operation, the mounted components will be wasted. Therefore, it is desirable to prevent an increase in the amount of components wasted.

[0006] The present invention has been made to solve the above-mentioned problems, and one object of the present invention is to provide a board production system and a board production method that can prevent an increase in the number of parts used unnecessarily. [Means for solving the problem]

[0007] In order to achieve the above object, a board production system according to a first aspect of the present invention includes a component mounting device including a mounting unit that mounts components on a board, a bonding material placement device that is provided upstream of the component mounting device and that prints or applies bonding material to the board to bond the components to the board, and a control unit that acquires an estimated time for a board on which bonding material has been printed or applied by the bonding material placement device until mounting of components on the board is completed in the component mounting device or until the board is carried into a device that heats the board, and the control unit is configured to determine whether or not the quality of the bonding material printed or applied to the board is likely to deteriorate over time, based on the elapsed time since the bonding material was placed on the board on which bonding material has been printed or applied by the bonding material placement device and the acquired estimated time. The control unit is configured to record the remaining component mounting points as unmountable for the substrate on which the bonding material, which is predicted to have a risk of becoming poor in quality over time, is printed or applied, and to perform control to stop mounting of subsequent components, when the sum of the elapsed time since the bonding material was placed on the substrate and the estimated time is equal to or greater than a first threshold value at which the quality of the bonding material may become poor. .

[0008] In the circuit board production system according to the first aspect of the present invention, as described above, the control unit is configured to determine whether the quality of the bonding material printed or applied to a board on which the bonding material has been printed or applied by the bonding material placement device is likely to deteriorate over time, based on the elapsed time since the bonding material was applied to the board and the estimated time until component mounting on the board is completed by the component mounting device or until the board is transported to a device for heating the board. This allows the mounting of components on the board to be stopped in advance if it is predicted that the quality of the bonding material will deteriorate before the bonding material, such as solder or adhesive, expires or before the quality of the bonding material is likely to deteriorate. As a result, the increase in the number of components used can be prevented. Furthermore, since boards are not produced by mounting components on boards where the quality of the bonding material is likely to deteriorate, the production of boards with poor component bonding due to a deterioration in the quality of the bonding material can be prevented.

[0009] The circuit board production system according to the first aspect So, as above The control unit is configured to control the mounting of subsequent components on a substrate on which bonding material is printed or applied, the quality of which is predicted to deteriorate over time, to be stopped when the sum of the elapsed time since the bonding material was placed on the substrate and the estimated time is equal to or greater than a first threshold value at which the quality of the bonding material may deteriorate. This If it is predicted that the quality of the bonding material may become poor between the time when the bonding material is placed on the board and the time when the mounting of components on the board is completed or the heating of the board begins, components will not be mounted on the board after the predicted time, thereby effectively preventing the waste of components.

[0010] the above According to the first aspectIn the board production system, the control unit is preferably configured to issue a warning when the sum of the elapsed time since the bonding material was placed on the board and the estimated time is equal to or greater than the second threshold value and smaller than the first threshold value. This configuration allows the worker to be made aware that there is a risk of the bonding material being of poor quality on a board if there is a future delay in work on the board. As a result, the worker can be prompted to take appropriate measures, such as preventing work delays or prioritizing work.

[0011] the above According to the first aspect In the board production system, the control unit is preferably configured to control the removal from the production line including the component mounting device of boards on which component mounting has stopped after printing or application of a bonding material that is predicted to deteriorate in quality over time. This configuration allows boards on which component mounting has been completed to be removed separately from boards on which component mounting has been completed. As a result, subsequent work processes such as inspection and reflow processes can be carried out without hindrance on boards on which component mounting has been completed.

[0012] In this case, preferably, the system further includes a reflow device located downstream of the component mounting device for heating the substrate, and the control unit is configured to control the ejection of a substrate, on which a bonding material that is predicted to deteriorate over time has been printed or applied and component mounting has ceased, so that the substrate can be removed from the production line upstream of the reflow device. This configuration prevents the substrate from being heated by the reflow device, allowing the substrate to be removed before the bonding material printed or applied to the substrate hardens in the reflow device. This prevents unnecessary reflow processes from being performed.

[0013] In the circuit board production system having the reflow device, preferably, the system further includes a buffer device that is located downstream of the component mounting device and upstream of the reflow device and is capable of holding the circuit board, and the control unit is configured to control the discharge of the circuit board in the buffer device after the circuit board has been printed or coated with a bonding material that is predicted to deteriorate in quality over time and after component mounting has stopped, so that the circuit board can be removed from the production line. With this configuration, the circuit board whose production has stopped can be easily removed from the buffer device located upstream of the reflow device.

[0014] In the circuit board production system according to the first aspect, the bonding material placement device preferably includes a printing device that prints solder on the circuit board, and the control unit is configured to determine whether the quality of the solder printed on the circuit board is likely to deteriorate over time. With this configuration, if it is predicted that the quality of the solder will deteriorate before the mounting of components on the circuit board is completed or before heating of the circuit board begins, the mounting of components on the circuit board can be stopped, thereby preventing an increase in the number of components used in vain.

[0015] In the board production system according to the first aspect, the control unit is preferably provided in a component mounting device or in a device separate from the production line including the component mounting device. With this configuration, when the control unit is provided in the component mounting device, the component mounting device can predict whether the quality of the bonding material printed or applied to the boards inside the device is likely to deteriorate over time. Furthermore, when the control unit is provided separately from the devices included in the production line, the control unit can collectively control board production on the production line.

[0016] A board production method according to a second aspect of the present invention includes the steps of: acquiring an estimated time until the mounting of components on a board is completed in the component mounting device or until the board is transported into a device that heats the board, for a board on which bonding material has been printed or applied by a bonding material placement device that is provided upstream of a component mounting device that mounts components on the board and that prints or applies bonding material to the board for bonding the components to the board; and determining, for a board on which bonding material has been printed or applied by the bonding material placement device, whether or not the quality of the bonding material printed or applied to the board is likely to deteriorate over time, based on the elapsed time since the bonding material was placed on the board and the acquired estimated time. a step of recording the remaining component mounting points as unmountable for the substrate on which the bonding material that is predicted to become poor in quality over time is printed or applied as being unmountable, and stopping the mounting of subsequent components, when the sum of the elapsed time since the bonding material was placed on the substrate and the estimated time is equal to or greater than a first threshold value at which the quality of the bonding material may become poor; Equipped with.

[0017] A second aspect of the present invention provides a board production method that includes a step of determining whether the quality of the bonding material printed or applied to a board, printed or applied by a bonding material placement device, is likely to deteriorate over time, based on the elapsed time since the bonding material was applied to the board and the estimated time until component mounting on the board is completed by a component mounting device or until the board is transported to a board heating device. This allows component mounting on a board to be stopped in advance if it is predicted that the quality of the bonding material will deteriorate before the expiration date of the bonding material, such as solder or adhesive, is reached or before heating of the board begins. As a result, a board production method can be provided that can prevent the wasteful use of components. Furthermore, because boards are not produced by mounting components on boards where the quality of the bonding material is likely to deteriorate, the production of boards with poor component bonding due to a deterioration in the quality of the bonding material can be prevented.

[0018] The substrate production method according to the second aspect So, as aboveThe method further includes a step of stopping the mounting of subsequent components on a substrate on which a bonding material that is predicted to become poor in quality over time has been printed or applied, when the sum of the elapsed time since the bonding material was placed on the substrate and the estimated time is equal to or greater than a first threshold value at which the quality of the bonding material may become poor. This If it is predicted that the quality of the bonding material may become poor between the time when the bonding material is placed on the board and the time when the mounting of components on the board is completed or the heating of the board begins, components will not be mounted on the board after the predicted time, thereby effectively preventing the waste of components. [Effects of the Invention]

[0019] According to the present invention, as described above, it is possible to prevent an increase in the number of parts used unnecessarily. [Brief explanation of the drawings]

[0020] [Figure 1] 1 is a block diagram showing an outline of a board production system according to an embodiment of the present invention; [Figure 2] 1 is a plan view showing a configuration of a component mounting apparatus according to an embodiment of the present invention; [Figure 3] 1 is a diagram for explaining an example of normal production of a large substrate by a substrate production system according to an embodiment of the present invention; [Figure 4] 10A and 10B are diagrams for explaining an example of production of a large substrate when a delay occurs in the substrate production system according to an embodiment of the present invention. [Figure 5] 10A and 10B are diagrams for explaining an example of normal production of small boards in the board production system according to an embodiment of the present invention; [Figure 6] 10A and 10B are diagrams for explaining an example of production of small boards when a delay occurs in the board production system according to an embodiment of the present invention. [Figure 7] 3 is a flowchart illustrating a board production process of the board production system according to an embodiment of the present invention. DETAILED DESCRIPTION OF THE INVENTION

[0021] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, specific embodiments of the present invention will be described with reference to the accompanying drawings.

[0022] (Configuration of circuit board production system) The configuration of a board production system 100 according to an embodiment of the present invention will be described with reference to FIGS.

[0023] The board production system 100 according to this embodiment is configured to mount components E on a board S to produce the board S on which the components E are mounted. As shown in FIG. 1, the board production system 100 includes a production line 10 and a control device 30. The control device 30 is an example of a "control unit" in the claims.

[0024] A plurality of production lines 10 are provided. Each production line 10 includes a loader 11, a printer 12, a print inspection machine 13, a dispenser device 14, a plurality of component mounting devices 15, an appearance inspection device 16, a buffer device 17, a reflow device 18, an appearance inspection device 19, and an unloader 20. The production line 10 is configured so that the substrate S is transported along the production line 10 from the upstream side (left side) to the downstream side (right side). The printer 12 is an example of a "bonding material placement device" and a "printing device" in the claims. The dispenser device 14 is an example of a "bonding material placement device" in the claims.

[0025] (Production line configuration) Next, the configuration of each device that constitutes the production line 10 will be described.

[0026] The loader 11 holds the substrate S (wiring substrate) before the components E are mounted thereon, and also serves to carry the substrate S into the production line 10. The components E include small piece-like electronic components such as LSIs, ICs, transistors, capacitors, and resistors.

[0027] The printer 12 is provided upstream of the component mounting device 15, and prints a bonding material (solder) on the board S for bonding the components E to the board S. Specifically, the printer 12 is a screen printer, and has the function of printing cream solder on the mounting surface of the board S for bonding the components E to the board S. The solder is an example of a "bonding material" in the claims.

[0028] The print inspection machine 13 has a function of inspecting the condition of the cream solder printed by the printer 12.

[0029] The dispenser device 14 is provided upstream of the component mounting device 15, and applies a bonding material (solder or adhesive) to the board S for bonding the component E to the board S. Specifically, the dispenser device 14 has a function of applying cream solder or adhesive to the mounting surface of the board S for bonding the component E to the board S. The solder and adhesive are examples of the "bonding material" in the claims.

[0030] The component mounting device 15 has a function of mounting (mounting) the component E at a predetermined mounting position on the board S on which cream solder has been printed. A plurality of component mounting devices 15 are arranged along the conveyance direction of the board S.

[0031] The appearance inspection device 16 is provided downstream of the plurality of component mounting devices 15. The appearance inspection device 16 has a function of inspecting the appearance of the board S on which the components E have been mounted by the component mounting device 15.

[0032] The buffer device 17 is provided downstream of the component mounting device 15 and upstream of the reflow device 18. The buffer device 17 is capable of holding the board S. Specifically, the buffer device 17 is provided so that the board S being transported can be removed midway through the production line 10. The buffer device 17 is also provided to allow the board S to wait temporarily. The buffer device 17 is also provided so that defective boards S or boards S that require inspection by an operator can be removed from the production line 10. The buffer device 17 also has the function of retracting the removed board S so that the subsequent board S can pass through.

[0033] The reflow device 18 is provided downstream of the component mounting device 15 and heats the board S. Specifically, the reflow device 18 has a function of melting the solder by performing a heat treatment to bond the component E to the electrode portion of the board S. The reflow device 18 also has a function of drying or hardening the adhesive by performing a heat treatment to bond the component E to the board S. The reflow device 18 is configured to perform the heat treatment while transporting the board S on the lane.

[0034] The appearance inspection device 19 is provided downstream of the reflow device 18. The appearance inspection device 19 has a function of inspecting the appearance of the substrate S after the heat treatment by the reflow device 18.

[0035] The unloader 20 has the role of unloading the board S from the production line 10 after the components E have been mounted thereon.

[0036] Between the multiple production lines 10, passages are provided for workers and autonomous mobile robots to pass through and perform work.

[0037] The control device 30 manages information related to the production line 10. The control device 30 manages the type and number of boards S produced by the production line 10, the type of components E to be mounted, the inventory amount of components E, and data related to mounting. The control device 30 is configured to be able to communicate with each device of the production line 10 (loader 11, printer 12, print inspection machine 13, dispenser device 14, component mounting device 15, appearance inspection device 16, buffer device 17, reflow device 18, appearance inspection device 19, and unloader 20). The control device 30 is configured by a computer having a control unit such as a CPU, a memory unit, and a communication unit.

[0038] The control device 30 can also communicate with a mobile device carried by the worker. The control device 30 can send notifications to the mobile device of the worker. The control device 30 also executes a predetermined program based on operations input from the mobile device of the worker.

[0039] Furthermore, the control device 30 is provided separately from the production line 10 including the component mounting device 15.

[0040] 2, component mounting apparatus 15 has a function of mounting (mounting) components E at predetermined mounting positions on a board S on which solder has been printed. Component mounting apparatus 15 includes a base 151, a pair of conveyors 152, a component supply unit 153, a head unit 154, a support unit 155, a pair of rail units 156, a component recognition imaging unit 157, and a control unit 158.

[0041] The pair of conveyors 152 are installed on a base 151 and are configured to transport the board S in the X direction. The pair of conveyors 152 are also configured to hold the board S stopped at the mounting work position during transportation. The pair of conveyors 152 are also configured so that the distance between them in the Y direction can be adjusted to match the dimensions of the board S.

[0042] The component supply unit 153 supplies components E to the mounting head 154a of the head unit 154. The component supply unit 153 is arranged on the outer sides (Y1 side and Y2 side) of the pair of conveyors 152. The component supply unit 153 also has a plurality of tape feeders 153a arranged therein. The mounting head 154a is an example of the "mounting unit" in the claims.

[0043] The tape feeder 153a holds a reel around which a tape is wound, holding a plurality of components E at predetermined intervals. The tape feeder 153a is configured to supply the components E from the tip of the tape feeder 153a by rotating the reel to feed out the tape holding the components E.

[0044] The head unit 154 is provided to move between above the pair of conveyors 152 and above the component supply unit 153. The head unit 154 also includes a plurality of (five) mounting heads 154a, each having a nozzle attached to its lower end, and a board recognition imaging unit 154b.

[0045] The mounting head 154a is configured to mount components E on the board S. Specifically, the mounting head 154a is configured to be able to move up and down (to be able to move in the Z direction), and is configured to suck and hold the components E supplied from the tape feeder 153a by using negative pressure generated at the tip of the nozzle by an air pressure generating unit, and to attach (mount) the components E at the mounting position on the board S.

[0046] The board recognition imaging unit 154b is configured to capture an image of the fiducial mark FM on the board S in order to recognize the position and posture of the board S that is the work target. Then, by capturing an image of the fiducial mark FM and recognizing the position of the fiducial mark FM, it is possible to accurately obtain the mounting position of the component E on the board S. The board recognition imaging unit 154b is configured to capture an image of the board S from above (the Z1 direction side).

[0047] The support portion 155 includes an X-axis motor 155a. The support portion 155 is configured to move the head unit 154 in the X direction along the support portion 155 by driving the X-axis motor 155a. The support portion 155 is supported at both ends by a pair of rail portions 156.

[0048] The pair of rail portions 156 are fixed onto the base 151. The rail portion 156 on the X1 side includes a Y-axis motor 156a. The rail portion 156 is configured so that, by driving the Y-axis motor 156a, the support portion 155 is moved in the Y direction perpendicular to the X direction along the pair of rail portions 156. The head unit 154 is movable in the X direction along the support portions 155, and the support portion 155 is movable in the Y direction along the rail portions 156, so that the head unit 154 is movable in the X and Y directions.

[0049] The component recognition imaging unit 157 is fixed on the upper surface of the base 151. The component recognition imaging unit 157 is disposed on the outer sides (Y1 side and Y2 side) of the pair of conveyors 152. The component recognition imaging unit 157 is configured to capture an image of the component E picked up by the nozzle of the mounting head 154a from below (Z2 direction side) in order to recognize the pick-up state (picking up posture) of the component E prior to mounting the component E. This makes it possible to acquire the pick-up state of the component E picked up by the nozzle of the mounting head 154a.

[0050] The control unit 158 ​​includes a processor such as a CPU and a memory, and is configured to control the overall operation of the component mounting device 15, such as the transport operation of the board S by the pair of conveyors 152, the mounting operation by the head unit 154, and the imaging operations by the component recognition imaging unit 157 and the board recognition imaging unit 154b. The control unit 158 ​​is also configured to be able to communicate with the control device 30. The control unit 158 ​​is configured to send and receive information such as production information and component information to and from the control device 30.

[0051] Furthermore, the control unit 158 ​​is configured to be able to communicate with the plurality of tape feeders 153a of the component supply unit 153. The control unit 158 ​​acquires information on the remaining number of components E from the plurality of tape feeders 153a through communication.

[0052] In this embodiment, the control device 30 acquires an estimated time from when the board S, on which solder has been printed by the printer 12 and solder or adhesive has been applied by the dispenser device 14, is transported to the component mounting device 15 to complete mounting of components E on the board S, or from when the board S is transported to the reflow device 18 that heats the board S. Specifically, the control device 30 estimates the time from when the board S, on which solder has been printed by the printer 12, is transported out of the printer 12 to when mounting of components E is completed by the most downstream component mounting device 15, and acquires this estimated time. Alternatively, the control device 30 estimates the time from when the board S, on which solder has been printed by the printer 12, is transported out of the printer 12 to when it is transported into the reflow device 18, and acquires this estimated time.

[0053] In addition, the control device 30 is configured to determine, for a substrate S on which solder has been printed by the printer 12 and solder or adhesive has been applied by the dispenser device 14, whether or not the quality of the solder or adhesive printed or applied to the substrate S is likely to deteriorate over time, based on the elapsed time since the solder or adhesive was placed on the substrate S and the estimated time obtained.

[0054] Here, the quality of the solder and adhesive applied to the board S deteriorates over time due to drying and other factors. In this case, the quality of the solder or adhesive may deteriorate over time. In other words, there is a risk of poor solder or adhesive bonding. For example, if the flux contained in the solder dries over time, the strength holding the component E weakens, and the mounted component E may shift position during transport of the board S. Furthermore, if the solder dries, the component E may be repelled when mounted on the solder. Furthermore, if dried solder is heated by the reflow device 18, balls may form. Furthermore, if the adhesive dries, it becomes difficult to adhere the component E to be mounted thereafter. For this reason, solder and adhesives are managed with a quality limit set, which is the time limit until the quality of the solder and adhesive deteriorates.

[0055] Furthermore, the control device 30 is configured to perform control to stop subsequent mounting of components E on the substrate S on which solder or adhesive is printed or applied, the quality of which is predicted to deteriorate over time, when the sum of the elapsed time since the solder or adhesive was placed on the substrate S and the estimated time is equal to or greater than a first threshold value indicating that the quality of the solder or adhesive may deteriorate over time. The first threshold value is set to a quality limit value indicating that the quality of the solder or adhesive may deteriorate. The first threshold value is determined depending on the type of solder and adhesive. For example, the quality limit value of solder is set to a value between one hour and 24 hours. The quality limit value of adhesive is set to a value ranging from several minutes to several hours.

[0056] Furthermore, the control device 30 is configured to perform control to issue a warning when the sum of the elapsed time and the estimated time since the solder or adhesive was placed on the substrate S is equal to or greater than a second threshold value and smaller than the first threshold value. The second threshold value is set to a time shorter than the first threshold value. The second threshold value is set based on the first threshold value. For example, the second threshold value is set to a time shorter than the first threshold value by several minutes to several tens of minutes, or a time shorter than the first threshold value by several percent to several tens of percent.

[0057] For example, the control device 30 issues a warning by displaying a monitor of the control device 30. The control device 30 also issues a warning to a mobile terminal of the worker. The control device 30 also issues a warning by displaying a monitor or a warning light of the component mounting device 15.

[0058] The control device 30 is also configured to control the ejection of a board S, on which mounting of components E has been stopped after solder or adhesive that is predicted to become defective over time has been printed or applied, from the production line 10 including the component mounting device 15. The control device 30 is also configured to control the ejection of a board S, on which mounting of components E has been stopped after solder or adhesive that is predicted to become defective over time has been printed or applied, so that the board can be removed from the production line 10 upstream of the reflow device 18.

[0059] Specifically, the control device 30 is configured to control the ejection of a board S, on which the mounting of components E has been stopped after solder or adhesive that is predicted to be at risk of becoming poor in quality over time, so that the board S can be removed from the production line 10 in the buffer device 17.

[0060] In the example of normal large-sized board production shown in Figure 3, the board S is large, so the work time for one board S is long. For this reason, if a delay occurs, the solder may be expected to dry out even if the delay time is short. In the example shown in Figure 3, the first threshold (quality deadline), at which the quality of the solder may become poor, is set to 100 minutes. Furthermore, the second threshold (warning deadline) is set to 85 minutes, 15 minutes shorter than the first threshold (quality deadline).

[0061] 3, board A has completed the work up to mounting device M3 in the normal work time. At this point, the elapsed time t for board A from the printer 12 is 65 minutes. The estimated time Δt for board A to subsequently reach the reflow device 18 is 10 minutes. The total predicted time t + Δt from the printer 12 to the reflow device 18 is 75 minutes. In this case, because the total predicted time is less than the second threshold (85 minutes), production of board A continues.

[0062] 3, board B has completed the work up to mounting device M2 in the normal work time. At this point, the elapsed time t for board B from printer 12 is 45 minutes. The estimated time Δt for board B to subsequently reach reflow device 18 is 30 minutes. The total predicted time t + Δt from printer 12 to reflow device 18 is 75 minutes. In this case, because the total predicted time is less than the second threshold (85 minutes), production of board B continues.

[0063] 3, board C has completed the work up to mounting device M1 in the normal work time. At this point, the elapsed time t for board C from printer 12 is 25 minutes. The estimated time Δt for board C to subsequently reach reflow device 18 is 50 minutes. The total predicted time t + Δt from printer 12 to reflow device 18 is 75 minutes. In this case, because the total predicted time is less than the second threshold (85 minutes), production of board C continues.

[0064] In the example of large circuit board production when a delay occurs shown in Figure 4, the first threshold value (quality deadline) at which the quality of the solder may become poor is set to 100 minutes, as in the example shown in Figure 3. The second threshold value (warning deadline) is set to 85 minutes, which is 15 minutes shorter than the first threshold value (quality deadline).

[0065] In Figure 4, board D has completed the work up to mounting device M3 in the normal work time. At this point, the elapsed time t for board D from the printer 12 is 65 minutes. The estimated time Δt for board D to subsequently reach the reflow device 18 is 10 minutes. The total predicted time t + Δt from the printer 12 to the reflow device 18 is 75 minutes. In this case, because the total predicted time is less than the second threshold value (85 minutes), production of board D continues.

[0066] 4, component mounting apparatus 15 (mounting apparatus M2) stopped during mounting work on board F, resulting in a delay in the work time. At this point, the elapsed time t for board F from printer 12 is 70 minutes. The estimated time Δt for board F to subsequently reach reflow apparatus 18 is 30 minutes. The total predicted time t + Δt from printer 12 to reflow apparatus 18 is 100 minutes. In this case, the total predicted time is greater than or equal to the first threshold value (100 minutes), so future work of mounting components E on board F is halted. Then, board F is transported to buffer apparatus 17 without undergoing work by visual inspection apparatus 16. Board F, whose production has been halted, is removed from production line 10 by buffer apparatus 17.

[0067] Regarding board G in FIG. 4, the component mounting device 15 (mounting device M2) stopped during the mounting operation on board F in the mounting device M2, so a delay also occurred in the work time for board G. At this point, the elapsed time t for board G from the printing machine 12 is 25 minutes. Furthermore, the estimated time Δt for board G to subsequently reach the reflow device 18, taking the delay into account, is 55 minutes. The total predicted time t + Δt from the printing machine 12 to the reflow device 18 is 80 minutes. In this case, the total predicted time is equal to or greater than the second threshold value (85 minutes) and less than the first threshold value (100 minutes), so a warning is issued for board G. Furthermore, In other words, the production of the substrate G continues.

[0068] In the example of normal small board production shown in Figure 5, the board S is small, so the work time for one board S is short. For this reason, if a long delay occurs, the solder may be expected to dry out. In the example shown in Figure 5, the first threshold (quality deadline) at which the quality of the solder may become poor is set to 100 minutes. In addition, the second threshold (warning deadline) is set to 85 minutes, 15 minutes shorter than the first threshold (quality deadline).

[0069] 5, board H has completed the work up to mounting device M3 in the normal work time. At this point, the elapsed time t for board H from printer 12 is 4 minutes. The estimated time Δt for board H to subsequently reach reflow device 18 is 1 minute. The total predicted time t + Δt from printer 12 to reflow device 18 is 5 minutes. In this case, because the total predicted time is less than the second threshold (85 minutes), production of board H continues.

[0070] In Figure 5, board I has completed the work up to mounting device M2 in the normal work time. At this point, the elapsed time t for board I from printer 12 is 3 minutes. The estimated time Δt for board I to subsequently reach reflow device 18 is 2 minutes. The total predicted time t + Δt from printer 12 to reflow device 18 is 5 minutes. In this case, because the total predicted time is less than the second threshold (85 minutes), production of board I continues.

[0071] 5, board J has completed the work up to mounting device M1 in the normal work time. At this point, the elapsed time t for board J from the printer 12 is 2 minutes. The estimated time Δt for board J to subsequently reach the reflow device 18 is 3 minutes. The total predicted time t + Δt from the printer 12 to the reflow device 18 is 5 minutes. In this case, because the total predicted time is less than the second threshold value (85 minutes), production of board J continues.

[0072] In the example of small circuit board production when a delay occurs shown in Figure 6, the first threshold value (quality deadline) at which the quality of the solder may become poor is set to 100 minutes, similar to the example shown in Figure 5. The second threshold value (warning deadline) is set to 85 minutes, which is 15 minutes shorter than the first threshold value (quality deadline).

[0073] In Figure 6, board K has completed the work up to mounting device M3 in the normal work time. At this point, the elapsed time t for board K from the printer 12 is 4 minutes. The estimated time Δt for board K to subsequently reach the reflow device 18 is 1 minute. The total predicted time t + Δt from the printer 12 to the reflow device 18 is 5 minutes. In this case, because the total predicted time is less than the second threshold value (85 minutes), production of board K continues.

[0074] 6, the component mounting device 15 (mounting device M2) stopped during the mounting operation on the board L, causing a delay in the work time. At this point, the elapsed time t for the board L from the printer 12 is 98 minutes. The estimated time Δt for the board L to subsequently reach the reflow device 18 is 2 minutes. The total predicted time t + Δt from the printer 12 to the reflow device 18 is 100 minutes. In this case, since the total predicted time is greater than or equal to the first threshold value (100 minutes), the future mounting operation of components E on the board L is stopped. The board L is then transported to the buffer device 17 without undergoing operation by the visual inspection device 16. The board L, for which production has been stopped, is removed from the production line 10 in the buffer device 17.

[0075] For board M in FIG. 6, component mounting apparatus 15 (mounting apparatus M2) stopped during mounting work on board M in mounting apparatus M2, causing a delay in the work time for board M as well. At this point, the elapsed time t for board M from printer 12 is 2 minutes. Furthermore, the estimated time Δt for board M to subsequently reach reflow apparatus 18, taking delays into account, is 80 minutes. The total predicted time t + Δt from printer 12 to reflow apparatus 18 is 82 minutes. In this case, the total predicted time is equal to or greater than the second threshold (85 minutes) and less than the first threshold (100 minutes), so a warning is issued for board M. Furthermore, production of board M is not stopped. In other words, production of board M continues.

[0076] (Board production processing) Referring to FIG. 7, the board production process by board production system 100 will be described.

[0077] 7, in step S1, the board S is carried into the component mounting apparatus 15. In step S2, the control device 30 constantly records the elapsed time from the printing of the solder or the application of the adhesive.

[0078] In step S3, control device 30 calculates the time required to complete mounting of all components E for each of the multiple boards S on production line 10. In step S4, control device 30 determines whether the sum of the time elapsed since the solder or adhesive was placed and the estimated time required for subsequent work for each board S has reached the quality deadline (first threshold value). If the quality deadline (first threshold value) has not been reached, the process proceeds to step S5; if the quality deadline (first threshold value) has been reached, the process proceeds to step S9.

[0079] In step S5, the control device 30 determines whether the sum of the time elapsed since the solder or adhesive was placed and the estimated time required for subsequent work for each substrate S has reached the warning deadline (second threshold value). If the warning deadline (second threshold value) has not been reached, the process proceeds to step S7, and if the warning deadline (second threshold value) has been reached, the process proceeds to step S6. In step S6, the control device 30 issues a warning.

[0080] In step S7, the control unit 158 ​​of the component mounting device 15 controls the mounting of the component E on the board S. In step S8, the control unit 158 ​​determines whether or not the mounting of the component E has been completed at all mounting points on the board S. If the mounting has not been completed, the process returns to step S4. If the mounting has been completed, the mounting work is completed, and the board S is carried out from the component mounting device 15.

[0081] In step S9, the control device 30 records the remaining mounting points on the board S as bad information, and prevents the components E from being mounted on the board S thereafter. As a result, the mounting operation of the components E on the board S thereafter is stopped.

[0082] In step S10, the control device 30 empty-transports the board S on which the mounting of the components E has been stopped to a removal position (buffer device 17) before the reflow device 18. Then, in step S11, the board S on which the mounting of the components E has been stopped is removed.

[0083] (Effects of this embodiment) In this embodiment, the following effects can be obtained.

[0084] In this embodiment, as described above, the control device 30 is configured to determine whether the quality of the solder or adhesive printed on or applied to the substrate S, on which the solder has been printed by the printer 12 and the solder or adhesive has been applied by the dispenser device 14, is likely to deteriorate over time, based on the elapsed time since the solder or adhesive was placed on the substrate S and the estimated time until the mounting of components E on the substrate S is completed by the component mounting device 15 or until the substrate S is transported to the reflow device 18, which heats the substrate S. This allows the mounting of components E on the substrate S to be stopped in advance if it is predicted that the quality of the solder or adhesive will deteriorate by the time the mounting of components E on the substrate S is completed or heating of the substrate S begins, before the quality of the bonding material, such as solder or adhesive, is likely to deteriorate due to exceeding its expiration date. As a result, it is possible to prevent an increase in the amount of components E being wasted. Furthermore, since the substrate S is not produced by mounting components E on a substrate S where the quality of the solder or adhesive may be poor, it is possible to prevent the production of a substrate S in which poor bonding of components E occurs due to a deterioration in the quality of the solder or adhesive.

[0085] Furthermore, in this embodiment, as described above, the control device 30 is configured to perform control to stop subsequent mounting of components E on the substrate S on which solder or adhesive is printed or applied, the quality of which is predicted to be likely to deteriorate over time, when the sum of the elapsed time since the solder or adhesive was placed on the substrate S and the estimated time is equal to or greater than a first threshold value at which the quality of the solder or adhesive may become poor. As a result, if it is predicted that the quality of the solder or adhesive may become poor from the time the solder or adhesive is placed on the substrate S until the mounting of the components E on the substrate S is completed or heating of the substrate S is started, the components E are not mounted on the substrate S after the predicted time, thereby effectively preventing the waste of the components E.

[0086] Furthermore, in this embodiment, as described above, the control device 30 is configured to perform control to issue a warning when the sum of the elapsed time and the estimated time since the solder or adhesive was placed on the substrate S is equal to or greater than the second threshold value and smaller than the first threshold value. This allows the worker to recognize that if there is a future delay in work on the substrate S, there is a substrate S that may have poor quality solder or adhesive. As a result, the worker can be prompted to take appropriate measures, such as preventing work delays or prioritizing work.

[0087] Furthermore, in this embodiment, as described above, the control device 30 is configured to control the removal from the production line 10 including the component mounting device 15 of a board S on which mounting of components E has stopped after solder or adhesive that is predicted to become defective over time has been printed or applied. This allows the board S on which production has stopped to be removed separately from the board S on which mounting of components E has been completed. As a result, subsequent work processes such as an inspection process and a reflow process can be carried out without hindrance on the board S on which mounting of components E has been completed.

[0088] Furthermore, in this embodiment, as described above, the control device 30 is configured to control the ejection of a board S, on which solder or adhesive that is predicted to become defective over time has been printed or applied and on which mounting of components E has ceased, so that the board S can be removed from the production line 10 upstream of the reflow device 18. This prevents the board S, on which production has ceased, from being heated by the reflow device 18, and allows the board S to be removed before the solder or adhesive printed or applied to the board S hardens in the reflow device 18. This makes it possible to prevent unnecessary reflow processes from being performed.

[0089] Furthermore, in this embodiment, as described above, the control device 30 is configured to control the discharge of the board S, on which the mounting of components E has stopped after solder or adhesive that is predicted to become defective over time has been printed or applied, so that the board S can be removed from the production line 10 in the buffer device 17. This allows the board S, on which production has stopped, to be easily removed in the buffer device 17 located upstream of the reflow device 18.

[0090] Furthermore, in this embodiment, as described above, the control device 30 is configured to determine whether or not there is a risk that the quality of the solder printed on the board S will deteriorate over time. As a result, if it is predicted that there is a risk that the quality of the solder will deteriorate before the mounting of the components E on the board S is completed or before heating of the board S begins, the mounting of the components E on the board S can be stopped, thereby preventing an increase in the amount of components E used wastefully.

[0091] Furthermore, in this embodiment, as described above, the control device 30 is provided in a device separate from the production line 10 including the component mounting device 15. With this configuration, the control device 30 can collectively control the board production on the production line 10.

[0092] (Variation) The embodiments disclosed herein should be considered to be illustrative and not restrictive in all respects. The scope of the present invention is defined by the claims rather than the description of the above embodiments, and further includes all modifications (variations) within the meaning and scope of the claims.

[0093] For example, in the above embodiment, an example of a configuration in which the board production system is provided with a printing device that prints solder (bonding material) on the board and a dispenser device that applies solder or adhesive (bonding material) to the board is shown, but the present invention is not limited to this. In the present invention, the board production system may be provided with either a printing device that prints bonding material on the board or a dispenser device that applies bonding material to the board.

[0094] In the above embodiment, an example of a configuration in which the board production system includes a plurality of component mounting devices has been shown, but the present invention is not limited to this. In the present invention, the board production system may include a single component mounting device.

[0095] In the above embodiment, an example of a configuration in which substrates whose production has been stopped are removed by a buffer device has been shown, but the present invention is not limited to this. In the present invention, substrates whose production has been stopped may be removed from a device other than the buffer device.

[0096] In the above embodiment, an example of a configuration in which a buffer device for removing a board whose production has been stopped is provided between an inspection device and a reflow device is shown, but the present invention is not limited to this. In the present invention, a buffer device for removing a board whose production has been stopped may be provided between a component mounting device and an inspection device, or may be provided between multiple component mounting devices.

[0097] In addition, in the above embodiment, an example of a configuration in which a plurality of production lines are provided in the board production system is shown, but the present invention is not limited to this. In the present invention, the board production system may be provided with one production line.

[0098] In the above embodiment, an example of a configuration was shown in which a control unit is provided separately from a production line including a component mounting device, and the control unit obtains an estimated time for a substrate on which a bonding material has been printed or applied, until the mounting of components on the substrate is completed in a component mounting device or until the substrate is transported to a device that heats the substrate, and determines whether the quality of the bonding material printed or applied to the substrate is likely to deteriorate over time based on the elapsed time since the bonding material was placed on the substrate and the obtained estimated time, but the present invention is not limited to this. In the present invention, the control unit may be provided in any of the devices on the production line.

[0099] Furthermore, in the above embodiment, for convenience of explanation, the control processing is described using a flow-driven flow in which processing is performed sequentially according to a processing flow, but the present invention is not limited to this. In the present invention, the control processing may be performed by an event-driven processing in which processing is performed on an event-by-event basis. In this case, the control processing may be performed completely event-driven, or may be performed by combining event-driven and flow-driven processing. [Explanation of symbols]

[0100] 10 production lines 12 Printing machine (bonding material placement device, printing device) 14 Dispenser device (bonding material placement device) 15 Component mounting equipment 17 Buffer device 18 Reflow equipment 30 Control device (control unit) 100 PCB Production System 154a Mounting head (mounting section) E parts S board

Claims

1. a component mounting device including a mounting unit that mounts components on a substrate; a bonding material placement device that is provided upstream of the component mounting device and that prints or applies bonding material to the substrate for bonding components to the substrate; a control unit that acquires an estimated time until the component mounting device completes mounting of components on the substrate on which the bonding material has been printed or applied by the bonding material placement device, or until the substrate is carried into a device that heats the substrate; the control unit is configured to determine, for a substrate on which the bonding material has been printed or applied by the bonding material application device, whether or not the quality of the bonding material printed or applied to the substrate is likely to deteriorate over time, based on the elapsed time since the bonding material has been applied to the substrate and the acquired estimated time; The control unit is configured to record the mounting points of remaining components as not mountable for the board on which the bonding material that is predicted to become poor in quality over time has been printed or applied as being at risk of becoming poor in quality as time passes, and to perform control to stop the mounting of subsequent components, when the sum of the elapsed time since the bonding material was placed on the board and the estimated time is equal to or greater than a first threshold value at which the quality of the bonding material may become poor.

2. 2. The board production system of claim 1, wherein the control unit is configured to perform control to issue a warning when the sum of the elapsed time since the bonding material was placed on the board and the estimated time is greater than or equal to a second threshold value and less than the first threshold value.

3. 2. The board production system according to claim 1, wherein the control unit is configured to control the ejection of a board from a production line including the component mounting device, the board having had no further component mounting thereon after having had a bonding material printed or applied thereon that is predicted to have a risk of becoming defective in quality over time.

4. a reflow device that is provided downstream of the component mounting device and heats the substrate; 4. The board production system according to claim 3, wherein the control unit is configured to control the discharge of a board on which mounting of components has been stopped after printing or application of bonding material that is predicted to have a risk of becoming poor in quality over time, so that the board can be removed from the production line upstream of the reflow device.

5. a buffer device that is provided downstream of the component mounting device and upstream of the reflow device and that can hold a substrate; 5. The board production system according to claim 4, wherein the control unit is configured to control the discharge of a board on which a bonding material that is predicted to deteriorate in quality over time has been printed or applied and on which component mounting has been stopped so that the board can be removed from the production line in the buffer device.

6. the bonding material placement device includes a printing device that prints solder on the substrate; 2. The board production system according to claim 1, wherein the control unit is configured to determine whether or not the quality of the solder printed on the board is likely to deteriorate over time.

7. 2. The board production system according to claim 1, wherein the control unit is provided in the component mounting device or in a device separate from a production line including the component mounting device.

8. a step of acquiring an estimated time until the mounting of components onto a substrate is completed by a component mounting device or until the substrate is carried into a device that heats the substrate, for the substrate on which a bonding material has been printed or applied by a bonding material placement device that is provided upstream of a component mounting device that mounts components onto the substrate and that prints or applies bonding material onto the substrate for bonding the components to the substrate; a step of determining whether or not the quality of the bonding material printed or applied to the substrate is likely to deteriorate over time, based on the elapsed time since the bonding material was applied to the substrate by the bonding material application device and the acquired estimated time; a step of recording the remaining component mounting points as unmountable for a substrate on which a bonding material that is predicted to become poor in quality over time has been printed or applied, and stopping the mounting of subsequent components, when the sum of the elapsed time since the bonding material was placed on the substrate and the estimated time is equal to or greater than a first threshold value at which the quality of the bonding material may become poor.

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