How nanocoatings protect electrical equipment

Abstract

Plasma polymerization apparatus and processes are disclosed. Exemplary embodiments include a vacuum chamber with a shape substantially symmetrical with respect to a central axis. A rotating rack may be operable to rotate about the central axis of the vacuum chamber. Furthermore, a reactive species release mechanism, substantially symmetrically positioned around the outer periphery of the vacuum chamber, may be configured to disperse reactive species within the vacuum chamber. The reactive species may form a polymer multilayer coating on the surface of one or more apparatuses. Each layer may have a different atomic composition to enhance the water resistance, corrosion resistance, and fission resistance of the polymer multilayer coating. [Selection Diagram] Figure 6

Description

[Technical Field]

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS This application claims priority to U.S. Provisional Patent Application No. 62 / 667,408, filed May 4, 2018, and U.S. Provisional Patent Application No. 62 / 667,413, filed May 4, 2018. The contents of the above-identified applications are incorporated herein by reference in their entireties.

[0002] FIELD OF THE DISCLOSURE The present disclosure relates to plasma polymerization technology, and more particularly to plasma polymerization coating apparatus and processes. [Background technology]

[0003] Plasma polymerization coating is an important surface treatment technology because of its significant advantages over other conventional techniques. For example, in plasma polymerization coating, polymers can be directly attached to the desired surface, where molecular chains grow. This reduces the overall number of steps required to coat the surface being treated. Other advantages include the availability of a wider selection of monomers compared to traditional chemical polymerization techniques.

[0004] However, due to various shortcomings in the existing designs of conventional plasma coating equipment, conventional plasma polymerization processes often suffer from manufacturing limitations, resulting in small batch sizes, low efficiency, high costs, and poor batch uniformity. Summary of the Invention [Means for solving the problem]

[0005] One or more embodiments of the present disclosure are illustrated by way of example, and not by way of limitation, in the figures of the accompanying drawings, in which like reference numerals refer to like elements and in which the drawings are not necessarily drawn to scale. [Brief explanation of the drawings]

[0006] [Figure 1] FIG. 1 is a schematic front view of an exemplary plasma polymerization coating apparatus configuration having planetary rotation axes arranged on a carousel in accordance with one or more embodiments of the present disclosure.

[0007] [Figure 2] FIG. 2 is a schematic top view of the structure of the exemplary device shown in FIG. 1, in accordance with one or more embodiments of the present disclosure.

[0008] [Figure 3] FIG. 3 is a flow diagram illustrating an exemplary process for plasma polymerization.

[0009] [Figure 4] FIG. 4 is a block diagram illustrating an example of a processing system capable of performing at least some of the operations described herein.

[0010] [Figure 5] FIG. 5 is a schematic front view of an exemplary plasma polymerization coating apparatus with optional shafts and gears for rotating the carousel and planetary rotating shafts, in accordance with one or more embodiments of the present disclosure.

[0011] [Figure 6] FIG. 6 is a flow diagram illustrating another exemplary process for plasma polymerization, according to one or more embodiments of the present disclosure.

[0012] [Figure 7] FIG. 7 illustrates an exemplary plasma polymerized coating applied on a device according to one or more embodiments of the present disclosure. DETAILED DESCRIPTION OF THE INVENTION

[0013] Specific embodiments of the present disclosure are described in detail below with reference to related technical solutions and the accompanying drawings. In the following description, specific details are set forth to provide a thorough understanding of the presently disclosed technology. In other embodiments, the technology described herein may be practiced without these specific details. In other instances, well-known features, such as specific manufacturing techniques, are not described in detail to avoid unnecessarily obscuring the technology. In this description, references to "an embodiment," "one embodiment," and the like mean that at least one embodiment of the present disclosure includes the particular feature, structure, material, or characteristic being described. Thus, instances of such terms in the specification do not necessarily all refer to the same embodiment. On the other hand, such references are not necessarily mutually exclusive. Furthermore, particular features, structures, materials, or characteristics can be combined in any suitable manner in one or more embodiments. It should also be understood that the various embodiments shown in the figures are merely illustrative representations and are not necessarily drawn to scale.

[0014] As previously mentioned, plasma polymerized coatings can produce results with highly desirable properties and can work well in certain applications, such as hydrophobic film coatings. However, because polymer coatings tend to be very thin, achieving the desired uniformity in the coating can be difficult.

[0015] To perform plasma polymerization coating, the device to be treated is first placed in a vacuum chamber, and then a carrier gas and gaseous organic monomer are dispersed into the vacuum chamber. The gaseous organic monomer is converted to a plasma state by applying power to the monomer, generating various types of reactive species. Further reactions then occur between the reactive species and the monomer or between the reactive species, forming a polymer film on the device surface. At various points in the plasma polymerization coating process, the atmosphere in the vacuum chamber may contain one or more of the following: a carrier gas, gaseous organic monomer, plasma resulting from applying power to the monomer, reactive species resulting from the combination of the plasma and the monomer vapor, etc. For certain applications, such as hydrophobic or oleophobic film coatings, plasma polymerization coatings can produce results with highly desirable properties.

[0016] Conventional plasma coating equipment typically features a rectangular vacuum chamber. As a result, the position of the device transport platform and the devices placed on it are typically fixed within the conventional vacuum chamber during the coating process. Because different devices within the same batch are located at different positions within the vacuum chamber, they are at different distances from the electrode, monomer / carrier gas outlet, vacuum gas outlet, etc. This inevitably leads to variations in the thickness of the coating applied to each device based on their different positions within the chamber. Therefore, to reduce variations in uniformity within the same batch, currently available plasma coating equipment typically employs small-capacity vacuum chambers and processes small batches. This process significantly reduces processing efficiency and increases costs. Nevertheless, it may not produce satisfactory batch uniformity to meet customer demands. With the rapid expansion of polymer coating applications, the demand for such processing is rapidly increasing.

[0017] Accordingly, disclosed herein are plasma coating apparatus and techniques that address technical issues in existing plasma coating processes, such as small batch sizes, low efficiency, high cost, and poor batch uniformity. In some embodiments, the uniformity of the applied plasma polymerized coating is enhanced using control mechanisms, such as controlling the evacuation of gases from a vacuum chamber.

[0018] Plasma-enhanced chemical vapor deposition (PCVD) is a technique that uses plasma to create protective coatings on the surfaces of devices. The PCVD process activates reactive gases to promote chemical reactions at or near the surface of the device to create the protective coating.

[0019] PCVD is a process that offers many advantages during the production of protective coatings. For example, PCVD is a dry process that does not damage the device being coated. Compared to parylene vapor deposition, PCVD technology has a lower deposition temperature and offers greater control over the monomers used and the coating structure formed, while avoiding damage to the device being coated. Furthermore, coatings can be applied uniformly over non-uniform or irregularly shaped devices.

[0020] Furthermore, the coating process can be performed on the device's gold fingers and other conductive components because it does not affect the product's normal functions, such as current conduction, heat dissipation, and data transmission. Therefore, masking operations are not required to control which areas of the device receive the plasma polymerization coating. The simplified coating process therefore improves production throughput and results in higher production yields. Finally, PCVD technology is more environmentally friendly than applying three protective coating layers using liquid chemicals because it reduces the number of undesirable by-products.

[0021] In addition to advantages during manufacturing, PCVD produces protective coatings that have significant advantages over coatings produced using other methods. For example, as opposed to traditional water-resistant protection via mechanical structures (e.g., adhesive coatings, rubber rings, and gaskets), the protection provided by plasma polymer films avoids complex mechanical designs, high costs, low production yields, and susceptibility to degradation due to wear. Furthermore, by avoiding mechanical structures to impart water resistance, PCVD protective coatings improve product appearance and the user experience.

[0022] Another advantage of the coating is its strong bonding strength to the device, allowing it to remain on the device surface while sustaining normal wear. The coating also has stable chemical and physical properties, providing resistance to damage from solvents, chemical corrosion, heat, and abrasion. Furthermore, the PCVD process can produce coatings as thin as a few nanometers. Therefore, compared to other coatings, plasma polymer films offer an effective method for providing thin, durable, water- and corrosion-resistant coatings. In the following description, numerous specific details are set forth, such as examples of specific components, circuits, and processes, to provide a thorough understanding of the present disclosure. Also, for purposes of the following description and explanation, specific nomenclature is used to provide a thorough understanding of the present embodiments. However, it will be apparent to those skilled in the art that these specific details may not be required to practice the present embodiments. In other instances, well-known circuits and devices are shown in block diagram form to avoid obscuring the present disclosure.

[0023] As used herein, the term "coupled" means directly connected or connected via one or more intervening components or circuits. Any of the signals provided on the various buses described herein may be time-multiplexed with other signals and provided on one or more common buses. Furthermore, the interconnection between multiple circuit elements or multiple software blocks may be depicted as multiple buses or a single signal line. Each of multiple buses may alternatively be a single signal line, and each single signal line may alternatively be multiple buses, and a single line or bus may represent any one or more of the myriad physical or logical mechanisms for communication (e.g., a network) between multiple components. The present embodiments should not be construed as limited to the specific embodiments described herein, but rather include within their scope all embodiments defined by the appended claims.

[0024] <Plasma polymerization coating equipment> 1 and 2 is a plasma polymerization coating apparatus 100 according to one or more embodiments of the present disclosure for applying a plasma polymerization coating to an apparatus 115. In an exemplary embodiment, the plasma polymerization coating apparatus includes a vacuum chamber 101, a porous electrode 102, a radio frequency power supply 103, a discharge cavity 104, a metal grid 105, a pulsed power supply 106, a discharge source 107, a discharge power supply 108, a carrier gas pipe 109, a monomer vapor pipe 110, a tail gas recovery pipe 111, a carousel 112, a planetary rotation shaft 113, a planetary rotation platform 114, an apparatus to be treated 115, a vacuum pump 116, a controller 117, a rotation motor 118, and a guide sleeve 119.

[0025] In some embodiments, device 115 may be a connector for transmitting electrical signals. A connector may be an interface used to connect two or more devices and transmit electrical signals between the connected devices. In some embodiments, a connector may be a USB TM Connector (e.g. Micro USB)TM , USB-A TM ,USB TM Type-C connector, Micro-USB TM Connectors, etc.), Apple TM Lightning connector, HDMI TM The device 115 may be a connector, a flexible printed circuit (FPC) connector, a board-to-board (BTB) connector, a probe connector, or a radio frequency (RF) coaxial connector. In other embodiments, the device 115 may be a consumer electronics device, a mobile device, a computing device, a display device, or a wearable device. In some examples, the device 115 is a mobile phone, headphones, wireless headphones, a tablet computer, a children's watch, a positioning tracker, a laptop computer, an audio system, an unmanned aerial vehicle, augmented reality (AR) glasses, or virtual reality (VR) glasses.

[0026] The device 115 can be subjected to a plasma polymerization treatment to achieve improved durability and performance. Because the device 115 experiences frequent plugging and unplugging events and may operate in harsh environments that increase the likelihood of damage from moisture and corrosion, abrasion resistance and resilience are important. Therefore, as described in detail below, the plasma-polymerized coating provides protection against various abrasions encountered by the device 115. For example, the plasma-polymerized coating can provide a protective layer that makes the device 115 resistant to water and moisture (e.g., condensation due to temperature changes). Furthermore, the plasma-polymerized coating can provide protection against acidic solvents, acidic atmospheres, and basic solvents. Finally, the plasma-polymerized coating can also provide protection or resistance against sweat, cosmetics, and frequent temperature changes.

[0027] <Vacuum chamber> The vacuum chamber 101 serves as a vessel in which the polymerized plasma can be applied to the apparatus 115. For purposes of this disclosure, the term "vacuum chamber" refers to a chamber having a lower gas pressure than outside the chamber (e.g., as a result of a vacuum pump 116 pumping gas out of the chamber). This term does not necessarily mean that the chamber is evacuated to a vacuum. For purposes of discussion herein, the vacuum chamber 101 may also be referred to as a "reaction chamber." The vacuum chamber 101 may be a chamber in which one or more chemical reactions described herein (e.g., for performing the disclosed plasma coating techniques) occur. In some examples, during the coating process, the vacuum chamber 101 may first be evacuated to a base pressure of approximately 5 mTorr and then filled with a carrier gas. After filling the vacuum chamber 101 with the carrier gas, the air pressure within the vacuum chamber 101 may rise to approximately tens of mTorr. The volume of the vacuum chamber 101 may vary, for example, between 50 and 3000 liters, depending on the application. Examples of chamber materials may include aluminum alloy or stainless steel.

[0028] The vacuum chamber 101 has an inner wall of a chamber body along the periphery of the vacuum chamber 101. The inner wall of the vacuum chamber 101 may be characterized by a circular top cross-section having the same diameter as the other top cross-sections, or a polygon having the same edge length as the other top cross-sections. Some embodiments of the polygon have at least six edges.

[0029] The top and bottom covers of the vacuum chamber 101 can be flat plates or arched structures, such as spherical segments, regular polygons, or ellipses. In some embodiments, the structures match the top view cross section of the chamber body inner wall of the vacuum chamber 101.

[0030] <Porous electrode> In some embodiments, the porous electrode 102 can generate plasma to pretreat the surface of the device 115 to be coated by polymerization in a subsequent step. In particular, high power (e.g., greater than 600 watts) is continuously discharged through the porous electrode 102 to generate a powerful plasma. The resulting plasma can be used for at least two purposes: (1) to clean the substrate surface of organic impurities such as water and oil, and (2) to activate organic substrates to form dangling bonds to facilitate coating deposition and increase the bonding strength between the substrate and the coating. In some embodiments, this surface plasma pretreatment via the porous electrode 102 is optional.

[0031] In some embodiments, the porous electrode 102 may form a cylinder or may be divided into at least two cylindrical sections, and the porous electrode 102 may be coaxial with the vacuum chamber 101. The porous electrode 102 may be covered with a plurality of holes, and the size of the holes may range from 2 to 30 mm in diameter. The spacing between each hole may range from 2 to 30 mm. Furthermore, the holes may be uniformly spaced or may be spaced with varying distances between each hole.

[0032] The porous electrode 102 is placed within the vacuum chamber 101 near or adjacent to the inner wall of the vacuum chamber 101. The porous electrode 102 may form a porous arch structure away from the inner wall of the vacuum chamber 101. In some embodiments, the distance from the porous electrode 102 to the inner wall of the vacuum chamber 101 may be in the range of 1 to 6 cm.

[0033] The vacuum chamber 101 of the plasma polymerization coating apparatus 100 may include a radio frequency power source 103 coupled to the porous electrode 102. In some embodiments, the radio frequency power source 103 is configured to provide an electric charge to the porous electrode 102 to generate a treatment plasma for removing impurities from the surface of one or more substrates. The radio frequency power source 103 may be coupled to a controller 117 to receive a radio frequency control signal that controls the power output to the porous electrode 102.

[0034] For example, the porous electrode 102 may be connected to a radio frequency (e.g., radio frequency) power source 103. When power from the radio frequency power source 103 is applied to the porous electrode 102, a plasma is generated to remove impurities from the surface of the device 115. The power of the radio frequency power source 103 may be configured to be 15-1500 watts. Note that in some embodiments, the plasma generated during the power discharge may be used for cleaning and pre-treating the substrate surface. According to some embodiments, the gas used to generate the plasma for cleaning (e.g., pre-treating the surface of the substrate) includes oxygen.

[0035] As described above, a radio frequency power source 103 is applied to the porous electrode 102 to generate a plasma for removing impurities from the surface of the device 115. In one or more embodiments, the radio frequency power source 103 is used to drive the discharge even if the porous electrode 102 is coated with a dielectric coating. In comparison, direct current (DC) power sources or low-frequency (e.g., less than 50 Hz) power sources do not have this advantage. The applicable high frequency applied by the radio frequency power source 103 can range from tens of kHz to several GHz. Typical high frequencies include 40 kHz, 13.56 MHz, 2.45 GHz, etc. The frequency selection may depend on technical requirements or specifications, material properties of existing products, and costs. It should be noted that those skilled in the art of dielectric coating can select an appropriately high frequency for coating a particular material.

[0036] Additionally, because the electrodes of the radio frequency power source 103 alternate in polarity, they are identified as a driven electrode and a ground electrode instead of a cathode and an anode. In one or more embodiments of the disclosed apparatus, the porous electrode 102, which interfaces with the output of the radio frequency power source 103, is the driven electrode. In at least some of these embodiments, the wall of the vacuum chamber 101 may act as the ground electrode. Additionally or alternatively, the tail gas recovery pipe 111 may also act as the ground electrode.

[0037] <Discharge cavity> The vacuum chamber 101 of the plasma polymerization coating apparatus 100 includes a distribution mechanism disposed around the vacuum chamber 101. In some embodiments, the vacuum chamber 101 is configured to substantially uniformly distribute reactive species within the vacuum chamber 101. The distribution mechanism may be configured to distribute the reactive species toward a central axis of the vacuum chamber 101 such that the reactive species form a polymer coating on the surface of one or more substrates. The distribution mechanism may include a discharge cavity 104 and a metal grid 105 configured to create a pressure differential between the discharge cavity and the vacuum chamber 101. The metal grid 105 may also be configured to reduce or prevent backflow of gas from the vacuum chamber 101 into the discharge cavity.

[0038] In some embodiments, discharge cavity 104 is connected to vacuum chamber 101. Discharge cavity 104 includes a discharge source 107 connected to discharge power supply 108 to generate plasma for polymerization. One end of discharge source 107 may be connected to discharge power supply 108. The other end of carrier gas pipe 109 may be adjacent to a carrier gas source. Monomer vapor pipe 110 may be connected to vacuum chamber 101, and its outlet may be located before discharge cavity 104. The other end of monomer vapor pipe 110 may be connected to a monomer vapor source.

[0039] In some embodiments, the discharge cavity 104 may form a cylindrical shape and may be made from materials including, for example, aluminum, carbon steel, or stainless steel. The diameter of the discharge cavity 104 may be 5 to 20 cm, the depth may be 3 to 15 cm, and the distance between two adjacent discharge cavities may be 7 to 40 cm. The axis of the discharge cavity 104 may be perpendicular to the axis of the vacuum chamber 101 to provide the largest open area for the plasma to move into the vacuum chamber 101. In another embodiment, for processes under pressures of a few pascals, the orientation of the discharge cavity is of little importance because free diffusion dominates plasma propagation.

[0040] Various size ratios between the discharge cavities and the vacuum chamber are discussed. For example, a single, relatively large discharge cavity 104 allows for the distribution of a larger volume of carrier gas-based plasma. However, a single discharge cavity provides the carrier gas-based plasma to the vacuum chamber 101 from a single direction and therefore does not provide adequate uniformity of the polymerized coating. Conversely, the number and distribution of discharge cavities are determined by the desired coating uniformity. Evenly distributed smaller discharge cavities 104 provide better uniformity of the applied coating. However, having too many small discharge cavities creates technical limitations and increases costs. The final design should be optimized to provide a balance between uniformity, technical limitations, and cost.

[0041] The discharge cavity 104 is provided with a carrier gas pipe 109 that introduces a carrier gas from a carrier gas source into the discharge cavity 104. The carrier gas is ionized in the discharge cavity 104 and becomes a plasma (i.e., a mixture of positive ions and electrons produced by ionization). The carrier gas transfers energy to the monomer vapor to activate it to a high-energy state (i.e., the monomer vapor becomes an activated species). In some embodiments, the carrier gas can even break some chemical bonds in the monomer, forming reactive particles such as free radicals.

[0042] When the carrier gas encounters the discharge from the discharge power supply 108 at the discharge source 107, the carrier gas forms a plasma. During the coating process, the discharge cavity 104 discharges at a relatively low power, generating a weak plasma. The weak plasma is intermittently released into the vacuum chamber 101 by the metal grid 105, initiating polymerization of the monomer and its deposition on the surface of the substrate, forming a polymerized coating. Depending on the embodiment, the discharge source 107 can be a lamp filament, an electrode, an induction coil, or a microwave antenna. The discharge source 107 can have a discharge power ranging from 2 to 500 W.

[0043] Depending on the embodiment, the porous electrode 102 and the discharge cavity 104 are independent of one another, and they can operate together or separately. In some embodiments, during the plasma polymerization coating process, the porous electrode 102 is used for (1) sample pretreatment and (2) chamber post-cleaning. That is, in these embodiments, the porous electrode 102 is not operational during the coating process. Meanwhile, according to one or more embodiments, the discharge cavity 104 is primarily used for coating. Additionally or alternatively, the discharge cavity 104 can also be used for post-cleaning of the cavity itself.

[0044] For purposes of this disclosure, the term "intense plasma" refers to the power applied by the discharge power supply 108 and to the higher power applied by the radio frequency power supply 103. Typical discharge powers for intense plasmas can be several hundred watts, and the plasma density can be as high as 10 9 -10 10 / cm 3 Conversely, the term "weak plasma" relates to the power applied by the radio frequency power supply 103 and the lower power applied by the discharge power supply 108. Typical discharge powers for weak plasmas can be from a few watts to tens of watts, and their plasma densities are between 10 7 -10 8 / cm 3 Exemplary materials for the monomer include acrylates such as, for example, ethoxylated trimethylolpropane triacrylate, or perfluorocyclohexylmethyl acrylate.

[0045] <Metal grid> Under typical vacuum conditions, even without a mesh, a pressure gradient can exist along the path from the gas inlet to the exhaust. This can be measured by vacuum gauges at different locations in the vacuum chamber 101. Therefore, strategic placement of the metal grid 105, as introduced here, can increase the pressure difference between the discharge cavity 104 and the vacuum chamber 101 by impeding the flow of carrier gas. In general, the pressure difference can increase with the number of layers, the number of meshes, and the grid's permeability. In some embodiments, each layer can have different characteristics. For example, one layer can have smaller openings and other layers can have larger openings. Furthermore, there can be a preferred order for the gates (e.g., the carrier gas-based plasma moves through the gates with larger openings before moving through the gates with smaller openings).

[0046] In some embodiments, the number of layers of the metal grid 105 can range from two to six. The metal grid 105 can be made of materials including, for example, stainless steel or nickel. The metal grid 105 can be in the range of 100 to 1,000 mesh, and its permeability can range from 25% to 40%. The metal grid 105 increases the pressure difference and reduces or prevents backflow of carrier gas from the vacuum chamber 101 to the discharge cavity 104. In some embodiments, at least two layers of the metal grid 105 are provided at the connection between the discharge chamber and the inner wall of the vacuum chamber 101. The metal grid 105 can be insulated from the inner wall of the vacuum chamber 101.

[0047] In certain embodiments, a metal grid 105 may be positioned at the junction of the discharge cavity and the inner wall of the vacuum chamber 101. In some implementations, at least two discharge cavities 104 are provided in a sealed manner on the outer wall of the vacuum chamber 101. In some examples, the porous electrode 102 and the discharge cavities may be discharged together or separately depending on the needs of a particular process.

[0048] In one or more embodiments, a pulsed power supply 106 is coupled to the metal grid 105. The pulsed power supply 106 may be configured to impart a positive charge to the metal grid 105 in pulses, such that the plasma in the discharge cavity is blocked from entering the vacuum chamber 101 during the pulse-off period. The plasma in the discharge cavity may pass through the vacuum chamber 101 during the pulse-on period.

[0049] As a result, when power is applied, plasma generated in the discharge cavity 104 is released into the vacuum chamber 101. For example, the plasma is blocked (at least partially) by the metal grid 105 in the discharge cavity 104 during the pulse-off period (i.e., when no power is applied to the metal grid 105), and the plasma can pass through the metal grid 105 and enter the vacuum chamber 101 during the pulse-on period (i.e., when power is applied to the metal grid 105). In some embodiments, the pulsed power supply 106 outputs positive pulses with parameters of 20 to 140 V peak, a pulse width of 2 μs to 1 ms, and a repetition frequency of 20 Hz to 10 kHz.

[0050] Similarly, the metal grid 105 may have an impeding effect on the back diffusion of the monomer vapor from the vacuum chamber 101 to the discharge cavity 104. Furthermore, because the pressure in the discharge cavity 104 may be higher than the pressure in the vacuum chamber 101, the monomer vapor may not easily move from the vacuum chamber 101 to the discharge cavity 104 by back diffusion, thereby preventing the monomer vapor from being excessively decomposed and destroyed by the continuously discharged plasma in the discharge cavity 104. In some embodiments, the metal grid 105 may help create a pressure difference to reduce or prevent backflow of the carrier gas.

[0051] <Monomer vapor piping> The monomer vapor pipe 110 may be connected to the vacuum chamber 101, and the outlet may be located adjacent to the discharge cavity 104. The other end of the monomer vapor pipe 110 is connected to a monomer vapor source. In some embodiments, the distance between the outlet of the monomer vapor pipe 110 and the discharge cavity 104 may be in the range of 1 to 10 cm. In one embodiment, the monomer vapor pipe 110 is connected directly to the vacuum chamber 101, rather than within the discharge cavity 104. This is to avoid exposing the monomer vapor to a strong electric charge from the discharge cavity 104.

[0052] In some embodiments, when the porous electrode 102 is activated during pretreatment (e.g., step 306), monomer vapor is not introduced into the vacuum chamber 101. During the plasma polymerization coating, the monomer vapor may be partially released into and out of the discharge cavity 104. However, releasing the monomer vapor into the discharge cavity 104 may be undesirable because it may lead to excessive destruction of the monomer molecules. Therefore, the monomer vapor pipe 110 may be designed to be directly connected to the vacuum chamber 101 to avoid violent release of the monomer vapor into the discharge cavity 104 as it passes through the pipe. Rather, a carrier gas-based plasma is intermittently released from the discharge cavity to activate the monomer vapor with minimal release.

[0053] <Tail gas recovery pipe and vacuum pump> The vacuum chamber 101 of the plasma polymerization coating apparatus 100 may include a tail gas collection pipe 111 positioned vertically along the central axis of the vacuum chamber 101. In some embodiments, the vacuum chamber 101 is operable to have a lower air pressure than the vacuum chamber 101 to collect excess reactive species in the atmosphere of the vacuum chamber 101 at a controlled pumping rate.

[0054] One or more ends of the tail gas recovery pipes 111 may be hollow and may be connected to a vacuum pump 116 at a gas outlet. Additionally, holes may be distributed along the wall of the tail gas recovery pipes 111. The atmosphere in the vacuum chamber 101 enters the tail gas recovery pipes 111 through the holes on the tail gas recovery pipes 111 and is then pumped out of the vacuum chamber 101 by the vacuum pump 116. The power applied to the vacuum pump 116 may be in the range of 3-50 kW, and the pumping speed may be in the range of 600-1200 m / s. 3 The inner diameter of the tail gas recovery pipe 111 may be in the range of 25-100 mm. In some embodiments, the holes may be evenly distributed in the wall of the tail gas recovery pipe 111. The hole size may be 2-30 mm, and the hole spacing may be 2-100 mm.

[0055] The vacuum pump 116 may be configured to evacuate the atmosphere from the vacuum chamber 101 via the tail gas recovery pipe 111. The operation of the vacuum pump 116 may be controlled by receiving a control signal from the controller 117 that indicates the pumping speed at which the atmosphere of the vacuum chamber 101 is evacuated.

[0056] The vacuum pump 116 may receive a control signal to initiate operation of the vacuum pump 116 to evacuate the atmosphere within the vacuum chamber 101. This may be done prior to the release of the carrier gas or monomer vapor to remove any undesired gases, plasma, reactive species, or contaminants before applying a plasma polymerized coating to the device 115. For example, when an excessively high concentration of reactive species is present within the vacuum chamber 101, a control signal may be received from the controller 117 to initiate operation of the vacuum pump 116 at a maximum pumping speed (e.g., 1200 m 3 / hr). In contrast, when lower concentrations of reactive species are present, the minimum pump speed (e.g., 600 m 3 / hour) may be used or the operation of the vacuum pump 116 may be stopped.

[0057] Additionally, the vacuum pump 116 may receive a control signal that controls the speed of the pump used to evacuate the atmosphere within the vacuum chamber 101 during the plasma polymerization coating process. In some examples, the generation of reactive species may result in different concentrations of reactive species in localized regions within the vacuum chamber 101.

[0058] In one example, the concentration of reactive species can be affected by the amount or rate at which monomer vapor is introduced into vacuum chamber 101. If monomer vapor is introduced too quickly, an excessive amount of reactive species can form within vacuum chamber 101. In addition to the total amount of reactive species, high local concentrations of reactive species can form in areas where more monomer vapor is introduced.

[0059] In another example, reactive species generation can be affected by the rate and / or level of power of the discharge applied to the carrier gas. The higher the rate or power, the greater the overall plasma generation. Furthermore, the opening of the discharge cavity 104, where the discharge is applied to the carrier gas, can support a greater local concentration of plasma. As the plasma converges with the monomer vapor, the local plasma concentration increases, which can lead to a higher local concentration of reactive species.

[0060] In yet another example, the generation of reactive species can be affected by the rate at which energy is transferred from the plasma to the monomer vapor. For example, the local concentration at the point where the plasma and monomer vapor meet within the vacuum chamber 101 can increase if the rate at which energy is transferred from the plasma to the monomer vapor is high. Furthermore, the local concentration of reactive species can increase in regions where the converging plasma and monomer are present in ideal amounts.

[0061] As another example, the concentration of reactive species can be affected by the deposition of reactive species onto the device 115. As reactive species are deposited onto the device 115, less reactive species remain in the atmosphere of the vacuum chamber 101. Thus, as reactive species move from the outer regions of the vacuum chamber 101 toward the central axis and are deposited onto the device 115, a gradient can be formed in which the concentration of reactive species in the atmosphere decreases toward the central axis of the vacuum chamber 101. In an example of a countervailing effect, the concentration of reactive species in the atmosphere increases as the reactive species converge toward the central axis of the vacuum chamber 101. Those skilled in the art will recognize that various other factors can affect the concentration of reactive species within the vacuum chamber 101. For example, the concentration of reactive species can be affected by the ratio of plasma to monomer vapor.

[0062] Based on the various factors affecting the generation of reactive species described above, non-uniform or undesirable levels of reactive species concentration may form within the vacuum chamber 101. In some embodiments, the pumping speed of the vacuum pump 116 may be controlled to compensate for the non-uniform or undesirable levels of reactive species concentration. The vacuum pump 116 may receive a control signal to increase the pumping speed to reduce the overall amount of reactive species within the vacuum chamber 101. Additionally, the vacuum pump 116 may receive a control signal to reduce higher concentrations of reactive species in localized regions where the plasma and monomer vapor converge.

[0063] For example, the pump speed may be increased to reduce local increases in the concentration of reactive species where the plasma and monomer vapor converge. In another example, the pump speed may be decreased to reduce local decreases in the concentration of reactive species where the power applied to the carrier gas is reduced. Those skilled in the art will recognize that the vacuum pump 116 can be configured in various ways to enhance the uniformity of reactive species within the vacuum chamber 101. For example, timing, cyclic operation, and gradual increases and decreases in pump speed can be controlled to compensate for changes in the concentration of reactive species or to compensate for localized regions where the concentration of reactive species varies.

[0064] <Hollow guide sleeve> In some embodiments, one end of the tail gas recovery pipe 111 may be connected to a hollow guide sleeve 119. The hollow guide sleeve 119 may be configured as a support structure that allows the tail gas recovery pipe 111 to rotate along the central axis of the vacuum chamber 101. In some examples, the tail gas recovery pipe 111 may be inserted into the hollow guide sleeve. This may be achieved by configuring the inner diameter of the hollow guide sleeve 119 to be equal to or larger than the outer diameter of the tail gas recovery pipe 111. Those skilled in the art will recognize that the hollow guide sleeve 119 may be configured in other ways to function as a support structure. For example, the hollow guide sleeve 119 may be configured to be inserted into the tail gas recovery pipe 111. This may be achieved by configuring the outer diameter of the hollow guide sleeve 119 to be equal to or smaller than the inner diameter of the tail gas recovery pipe 111.

[0065] <Carousel> The vacuum chamber 101 of the plasma polymerization coating apparatus 100 may include a carousel 112 operably coupled to a planetary rotating shaft 113 and configured to rotate along a central axis. In some embodiments, the primary carousel includes one or more rack layers, each rack layer holding multiple, up to one or more, substrate platforms. In some embodiments, the primary rotating shaft may be coupled to or otherwise integrated with a tail gas recovery pipe 111.

[0066] In some embodiments, the carousel 112 is coupled to one or more planetary rotating shafts 113, which in turn are coupled to rotation platforms 114. The planetary rotating shafts 113 can support the planetary rotating platforms 114, which rotate along secondary axes coaxial with the planetary rotating shafts 113. Additionally, the planetary rotating shafts 113 can be distal to the central axis of the vacuum chamber 101. The rotation of the primary carousel along the central axis and the rotation of the secondary carousel along the secondary axes can provide the same spatial movement speed for each of the one or more substrates during the coating process to achieve a uniform coating. In some examples, the number of planetary rotating shafts 113 can be between two and eight, and the number of planetary rotating platforms 114 can be between one and ten.

[0067] The vacuum chamber 101 of the plasma polymerization coating apparatus also includes one or more substrate platforms configured to carry one or more substrates to be plasma-polymerized. Each substrate platform may be positioned on a secondary carousel. The substrate platforms may be planetary rotation platforms 114. The planetary rotation platforms 114 allow the devices 115 to be processed to be positioned so that they move continuously along the vacuum chamber 101. The planetary rotation platforms 114 are fixed along planetary rotation shafts 113, and each planetary rotation platform 114 rotates around its own planetary rotation shaft while the planetary rotation shaft rotates around the central axis of the vacuum chamber 101. The continuous movement allows for uniform plasma polymerization treatment on the surface of the devices 115.

[0068] It should be noted that while there are no specific directional requirements for the rotation of the planetary rotating shaft 113 versus the rotation of the carousel 112, the rotation as a whole should be properly tuned and adjusted (e.g., for rotational balance and stability) so that substantially all samples experience the same spatial movement during the coating process to achieve a uniform coating. Similarly, there are no particular limitations on the rotation speed. However, it is clear that excessively fast rotation speeds are undesirable due to unnecessary power consumption, wear on parts, and platform instability.

[0069] <Polymerization controller> In some embodiments, the plasma polymerization coating apparatus 100 includes a controller 117 configured to provide control signals that regulate the operation of various components of the plasma polymerization coating apparatus 100. The control signals enable the apparatus to adjust the plasma polymerization process applied to the apparatus 115.

[0070] The controller 117 may send a rotation speed signal to the rotation motor 118. The rotation speed signal indicates the rotation speed at which the rotation motor 118 should operate. Adjusting the rotation speed may determine the speed at which the device 115 traverses the vacuum chamber 101. For example, a faster rotation speed may allow the substrate to traverse the vacuum chamber 101 relatively quickly. Thus, the device 115 is quickly exposed to both ends of the plasma concentration gradient, thereby counteracting any imbalance in plasma concentration within the vacuum chamber 101.

[0071] In some embodiments, the dispersion mechanism is communicatively coupled to the controller 117 to receive a dispersion control signal from the controller to control the dispersion rate of the reactive species in a substantially uniform manner over one or more substrates. The dispersion control signal controls the dispersion rate of the reactive species by adjusting the power applied to the dispersion mechanism and / or adjusting the velocity of gas entering the dispersion mechanism for polymerization. In some embodiments, the dispersion rate control signal adjusts the dispersion rate to compensate for a decrease in the density of reactive species in the vacuum chamber 101 due to deposition of reactive species on one or more substrates, and an increase in the density of reactive species in the vacuum chamber 101 due to reactive species converging toward the center of the chamber to uniformly distribute the reactive species throughout the vacuum chamber 101.

[0072] For example, the controller 117 may send distributed control signals to the discharge power source 108 indicating the power to be applied to the discharge source 107. By adjusting the power applied to the discharge source 107, the rate at which a plasma is generated in the discharge cavity 104 may be controlled. Thus, changes in the power to the discharge source 107 may affect changes in the density of the plasma and the properties of the plasma within the vacuum chamber 101, and ultimately the thickness of the plasma applied to the device 115.

[0073] In some embodiments, the pulsed power supply receives a pulse control signal from a controller, and the pulse control signal controls the power and frequency of the positive charge. Specifically, the controller 117 may send a pulse control signal to the pulsed power supply 106. The pulse control signal indicates the power applied to the metal grid 105 by the pulsed power supply 106. Specifically, the pulsed power supply 106 applies a positive electric pulse bias to the metal grid 105, so that the plasma generated in the discharge cavity 104 is intermittently released into the vacuum chamber 101. For example, the metal grid 105 may block the plasma in the discharge cavity 104 during the pulse-off period, and the metal grid 105 may allow the plasma to pass into the vacuum chamber 101 during the pulse-on period. Using this mechanism, the pulse control signal controls the time and frequency at which the plasma can enter the vacuum chamber 101 from the discharge cavity 104.

[0074] The controller 117 may send a radio frequency power control signal to the radio frequency power source 103. The radio frequency power signal indicates to the radio frequency power source 103 when to apply power to the porous electrode 102 to generate a plasma to remove impurities from the device 115. For example, the controller 117 may send a radio frequency power control signal to the radio frequency power source 103 at the start of a plasma polymerization process to pre-treat the device 115 or after plasma is applied to a substrate for post-treatment of the device 115 and vacuum chamber 101.

[0075] The controller 117 also sends various control signals to control the introduction and exhaust of gases to the planetary carousel apparatus. For example, the controller 117 sends a carrier gas control signal to the carrier gas pipe 109. This control signal indicates the rate at which the carrier gas should be introduced into the discharge cavity 104. The controller 117 also sends a monomer vapor control signal to the monomer vapor pipe 110. The monomer vapor control signal indicates the rate at which the monomer vapor gas is introduced into the vacuum chamber 101.

[0076] In some embodiments, the collection line is communicatively coupled to a controller to receive a pumping speed control signal from the controller to control the pumping speed of the reactive species. For example, the controller 117 provides a tail gas control signal to the tail gas collection line 111. This signal controls the rate at which the atmosphere is pumped from the vacuum chamber 101. In some embodiments, the controller sends a pumping speed control signal to adjust the rate at which the reactive species are evacuated from the vacuum chamber 101. The pumping speed is controlled to account for two factors that contribute to the density of reactive species within the vacuum chamber 101. (1) A decrease in the density of reactive species within the vacuum chamber 101 due to the deposition of reactive species on one or more substrates, and (2) an increase in the density of reactive species within the vacuum chamber 101 as a result of reactive species converging toward the center of the chamber so that the density of reactive species throughout the vacuum chamber 101 is uniform; (3) an increase in the density of reactive species within the vacuum chamber 101 based on the rate at which monomer vapor is introduced into the reaction chamber; (4) an increase in the density of reactive species within the vacuum chamber 101 based on the rate at which power is applied to the carrier gas to generate plasma; and (5) an increase in the density of reactive species within the vacuum chamber 101 based on the rate at which energy from the plasma is transferred to the monomer vapor.

[0077] Controller 117 may be a microcontroller, a general-purpose processor, or an application-specific integrated circuit that provides arithmetic and control functions for implementing the techniques disclosed herein. The processor may include cache memory (not shown for simplicity) and other memory (e.g., main memory and / or non-volatile memory such as a hard disk drive or solid-state drive). In some examples, the cache memory is implemented using SRAM, the main memory is implemented using DRAM, and the non-volatile memory is implemented using flash memory or one or more magnetic disk drives. According to some embodiments, the memory may include one or more memory chips or modules, and the processor on controller 117 may execute instructions or program code stored in the memory.

[0078] <Rotary motor> In some embodiments, the plasma polymerization coating apparatus 100 includes a rotation motor 118 to rotate the apparatus 115 within the vacuum chamber 101. Rotation of the apparatus 115 enhances the uniformity of the plasma polymerization coating applied to the apparatus 115. In some embodiments, the rotation motor 118 actuates rotation of the carousel 112 coupled to the tail gas recovery pipe 111 such that the planetary rotation platform 114 rotates along a path concentric with respect to the central axis of the vacuum chamber 101. Additionally, the rotation motor 118 may actuate rotation of the substrate platform along the planetary rotation axis along the planetary rotation shaft 113. As described above, control signals from the controller 117 may be used to control the speed at which the rotation motor 118 operates to rotate the carousel 112 and / or the planetary rotation shaft 113. In some examples, the rotation frequency may be in the range of 10 Hz to 50 Hz. Furthermore, in some embodiments, the rotation frequency may be dynamically adjusted during the plasma polymerization coating process (e.g., process 300).

[0079] The rotation motor 118 can be disposed in various positions relative to the vacuum chamber 101. For example, the rotation motor 118 can be disposed below the vacuum chamber 101 and coupled to the lower end of the tail gas recovery pipe 111. In another example, the rotation motor 118 can be disposed at the center of the vacuum chamber 101 and coupled to the center of the tail gas recovery pipe 111. In yet another example, the rotation motor 118 can be disposed above the vacuum chamber 101 and coupled to the upper end of the tail gas recovery pipe 111. Furthermore, the rotation motor 118 can be disposed inside or outside the vacuum chamber 101.

[0080] FIG. 2 is a schematic top view of the structure of the plasma polymerization coating apparatus 100 shown in FIG. 1, in accordance with one or more embodiments of the present disclosure.

[0081] Overall, the present disclosure has various beneficial effects. First, the apparatus employs a vacuum chamber 101 structure symmetrical about a central axis to maintain uniformity in spatial polymerization reactive material density. The vacuum chamber 101 employs a mechanism in which gas is supplied through the sidewall, transported radially, and exhausted along the central axis.

[0082] In one or more embodiments, a carrier gas pipe 109 is provided with an outlet in each discharge cavity 104. The carrier gas enters the discharge cavity through the carrier gas pipe 109 and can then be diffused into the vacuum chamber 101 through the multi-layer metal grid 105. A monomer vapor pipe 110 has an outlet in front of the discharge cavity 104 in the vacuum chamber 101. The monomer vapor gas enters the vacuum chamber 101 through the monomer vapor pipe 110. Furthermore, a tail gas recovery pipe 111 is provided coaxially with the vacuum chamber 101 along the axis of the vacuum chamber 101. The tail gas recovery pipe vertically penetrates the vacuum chamber 101. One end of the tail gas recovery pipe 111 is connected to a vacuum pump 116, and holes are evenly distributed in the wall of the pipe. The tail gas enters the tail gas recovery pipe through the holes in the tail gas recovery pipe and is exhausted from the vacuum chamber 101 by the vacuum pump 116.

[0083] In the above-described approach, gas is supplied through the sidewall, transported radially, and then released along the central axis, resulting in a convergent gas transport process. This can promote increased stability of the reactive species concentration and more uniform distribution in the spatial polymerization reaction. In one embodiment, the process begins by generating polymerization reactive species when monomer vapor comes into contact with a carrier gas-based plasma near the discharge cavity 104. Activated by the carrier gas, the generated polymerization reactive species are dispersed radially toward the axis of the vacuum chamber 101. As the device 115 rotates within the vacuum chamber 101, the amount of polymerization reactive species gradually decreases due to continuous consumption. At the same time, the polymerization reactive species also gradually converge, which can compensate for the aforementioned decrease in the amount of polymerization reactive species. In this way, the concentration of the polymerization reactive species can remain stable. The bulk density of the reactive species within the vacuum chamber 101 can remain unchanged, and therefore, batch processing can enjoy good uniformity.

[0084] In other words, the reactive species release mechanism and the collection tube can be collectively configured such that the decrease in reactive species density due to reactive species consumption can be substantially equal to the increase in reactive species density due to reactive species converging toward the collection tube. Thus, the coordinated operation of the reactive species discharge mechanism and the tail gas collection tube 111 can provide a uniform density of reactive species throughout the vacuum chamber 101 and the apparatus 115. Specifically, in some embodiments, the discharge rate of the discharge mechanism can be adjusted (e.g., by controlling the applied power and / or amount of gas) along with the pumping rate of the collection tube (e.g., by controlling the output of the vacuum pump) to achieve a substantially uniform density of reactive species throughout the vacuum chamber 101. In many embodiments, the aforementioned collective adjustment of the discharge mechanism and the collection tube corresponds to the cross-sectional shape of the inner wall of a given vacuum chamber 101. That is, in these embodiments, the combination of the discharge rate of the discharge mechanism and the pumping rate of the collection tube is preferably adjusted to fit the particular shape (e.g., circular or polygonal) of a given vacuum chamber 101 to achieve a substantially uniform density of reactive species.

[0085] Compared to conventional coating equipment and techniques, the difference in substrate coating thickness for the same batch processing in conventional coating equipment can be more than 30%, while the difference in substrate coating thickness for the same batch processing using the disclosed equipment can be less than 10%.

[0086] Second, the apparatus also uses a carousel 112 to significantly improve the uniformity of each substrate coating. In one or more embodiments, the vacuum chamber 101 includes a carousel 112. A planetary rotation platform 114 on the carousel 112 can perform planetary rotation within the vacuum chamber 101. In particular, the disclosed mechanism allows each planetary rotation platform 114 to rotate along an axis of planetary rotation (e.g., along a planetary rotation shaft 113) while moving concentrically relative to the central axis of the vacuum chamber 101 (e.g., along the rotation of the carousel 112 coupled to the tail gas recovery pipe 111).

[0087] The device 115 to be processed can be placed on a planetary rotation platform 114. The planetary rotation motion introduced allows the spatial position and orientation of each processed substrate to be continuously changed during the processing process, so that the spatial positions of different substrates in the coating processing process can all be substantially the same, thereby eliminating the coating difference caused by the different spatial positions of different substrates in the existing technology. Therefore, the introduced technology can achieve the same coating effect and better uniformity for substrates at different positions in the same batch.

[0088] Third, the apparatus can significantly increase the volume of the vacuum chamber 101 and significantly improve processing efficiency. By improving the structure of the vacuum chamber 101 and the carousel 112, the uniformity of the coating film thickness can be significantly improved in the same batch processing. Furthermore, the volume of the vacuum chamber 101 can be expanded by 5 to 6 times. Therefore, the batch processing volume and processing efficiency are significantly increased. In some embodiments, the apparatus according to the present disclosure can effectively protect the monomer vapor from decomposition and destruction to obtain a high-quality polymer coating.

[0089] <Plasma polymerization coating process> One aspect of the technology disclosed herein involves a reactive species discharge process. In one embodiment, the process begins by placing a substrate on a substrate platform located within a vacuum chamber. The atmosphere of the vacuum chamber 101 is evacuated by a vacuum pump through an air outlet in a collection tube located along the central axis of the vacuum chamber 101. The process proceeds by rotating a primary carousel connected to a primary rotation shaft with a rotary motor. In some embodiments, the primary carousel is configured to rotate along the central axis. Next, a carrier gas is released into the discharge cavity through an inlet valve. The carrier gas can facilitate a reaction between the substrate and the reactive species. The process continues by releasing a monomer vapor into the vacuum chamber 101 using a feed port. The process generates reactive species by polymerizing the monomer vapor within the vacuum chamber 101 using the carrier gas. The process then deposits the reactive species on the surface of the substrate to form a polymer coating.

[0090] 3 is a flow chart illustrating an exemplary reactive species discharge process 300. In some embodiments, the process 300 controls and regulates various components of the plasma polymerization coating apparatus 100.

[0091] In step 301, the apparatus 115 is placed within the vacuum chamber 101. In some embodiments, the apparatus 115 is placed on a planetary rotating platform 114, as shown in Figures 1 and 2. The placement of the apparatus 115 on the planetary rotating platform 114 facilitates movement of the apparatus 115 throughout the vacuum chamber 101 during the plasma polymerization coating process. By moving the apparatus 115 through different regions of the vacuum chamber 101, the negative effects of plasma density fluctuations are reduced or eliminated, allowing for a more uniform plasma coating on the substrate.

[0092] In step 302, the vacuum pump 116 may evacuate the atmosphere within the vacuum chamber 101. In some embodiments, the controller 117 sends a control signal to the vacuum pump 116 to control the evacuation of the atmosphere within the vacuum chamber 101. This process ensures that the atmosphere does not interfere with the plasma polymerization process and facilitates the plasma polymerization process, which requires a vacuum. In some examples, the vacuum pump 116 is coupled to the tail gas recovery pipe 111 and creates a negative atmospheric pressure within the tail gas recovery pipe 111 relative to the atmospheric pressure of the vacuum chamber 101. The negative atmospheric pressure generates a flow of gas from the vacuum chamber 101. The controller 117 may send a control signal to the vacuum pump 116 to control the timing, power, and other operating parameters used to evacuate the atmosphere.

[0093] In step 303, the carousel 112 rotates the device 115 within the vacuum chamber 101. In some embodiments, the controller may send control signals to the rotation motor 118 to control the rotational speed of the carousel 112 to provide the same spatial movement speed for each of the one or more substrates during the coating process and achieve a uniform coating. Specifically, the controller 117 sends a control signal to the carousel 112, which includes the device 115 for plasma polymerization coating. Upon receiving the control signal, the carousel 112 may rotate to rotate the device 115 within the vacuum chamber 101, according to various embodiments of the present invention. In some embodiments, the carousel 112 includes a planetary rotation shaft 113 and a planetary rotation platform 114 for holding the device 115 undergoing the plasma polymerization process. The rotation motor 118 generates the rotational motion of the carousel 112. The controller 117 may send a control signal to the rotation motor 118 to control the timing, duration, and speed of the rotation.

[0094] In step 304, the planetary rotating shaft 113 and the planetary rotating platform 114 rotate the devices 115 within the vacuum chamber 101. In some implementations, the secondary carousel rotates on a secondary axis different from the central axis. Specifically, the controller 117 sends control signals to the planetary rotating shaft 113. The control signals cause the planetary rotating shaft 113 to independently rotate along the secondary axis, according to various embodiments of the present invention. The additional rotation provides a wider range of movement for the devices 115 within the vacuum chamber 101. This allows for further mitigation of negative effects caused by plasma density fluctuations by further varying the position and orientation of each device 115 to be processed.

[0095] In step 305, a carrier gas is introduced into the discharge cavity 104. In some embodiments, the controller 117 sends control signals to the carrier gas pipe 109, causing the carrier gas to be introduced into the discharge cavity 104 and activate the monomer vapor. Once the carrier gas is introduced into the discharge cavity 104, an electric charge is applied to the discharge source 107 by the discharge power supply 108. The electric charge ionizes the carrier gas within the discharge cavity 104, forming a plasma (i.e., a mixture of positive ions and electrons produced by ionization). In some embodiments, the carrier gas is continuously introduced into the discharge cavity 104 and forms a plasma throughout the polymerization process up to step 309. The controller 117 may send control signals that control the timing and amount of carrier gas introduced into the discharge cavity 104, as well as the timing and power applied by the discharge power supply 108 to the discharge source 107.

[0096] In step 306, process 300 optionally generates a treatment plasma to remove impurities from the surface of one or more devices 115. In certain embodiments, the treatment plasma may be introduced into vacuum chamber 101 before reactive species are released into vacuum chamber 101. In other embodiments, the treatment plasma may also be generated after reactive species are deposited on the surface of the substrate.

[0097] In some embodiments, the treatment plasma is generated by an electrode coupled to a radio frequency power source. Specifically, the controller 117 sends control signals to the radio frequency power source 103 to generate an electrical charge that generates the plasma within the vacuum chamber 101. The plasma is generated to remove impurities from the device 115 undergoing plasma polymerization. Additionally, the plasma may activate the surface of the device 115, allowing bonding between the surface of the device 115 and the plasma to form a plasma-polymerized coating. In some embodiments, a carrier gas may be introduced through a carrier gas pipe 109 to propagate the plasma throughout the vacuum chamber 101. The controller 117 may send control signals to the radio frequency power source 103 and the porous electrode 102 that control the timing, power, and other operating parameters. In some examples, a continuous flow of carrier gas may occur during this step.

[0098] In step 307, reactive species are generated for application to the surface of the apparatus 115 undergoing plasma polymerization. Introducing a plasma into the monomer vapor generates reactive species. Energy from the plasma is transferred from the plasma to the monomer vapor, activating the monomer vapor. In some embodiments, the controller 117 sends control signals to the monomer vapor pipe 110 to introduce the monomer vapor into the vacuum chamber 101. The controller 117 also sends control signals to the discharge power supply 108 to regulate the timing and amount of power applied to the discharge source 107. When the discharge power supply 108 supplies power to the discharge source 107, the carrier gas in the discharge cavity 104 becomes a plasma. This provides a mechanism for controlling when the discharge cavity 104 generates plasma.

[0099] Additionally, the controller 117 may provide a control signal to the pulsed power supply 106 to adjust the power applied to the metal grid 105. The metal grid 105 is coupled to the pulsed power supply 106 and positioned at the connection between the discharge cavity and the inner wall of the vacuum chamber 101. The metal grid 105 regulates the flow of plasma generated in step 305 and entering the vacuum chamber 101, as well as the backflow of carrier gas into the discharge cavity 104. In some embodiments, the controller 117 may provide a control signal to control the timing and amount of carrier gas introduced into the discharge cavity 104.

[0100] Specifically, when power is applied to the metal grid 105, the plasma can pass through the metal grid 105, and when power is not applied to the metal grid 105, the plasma cannot pass through the metal grid 105. As the plasma travels through the metal grid 105 into the vacuum chamber 101, the plasma transfers energy to the monomer vapor, activating the monomer vapor to a high-energy state (i.e., the monomer vapor becomes an activated species). In some embodiments, the carrier vapor may break some chemical bonds of the monomer to form reactive particles such as free radicals. Also, in some examples, a continuous flow of carrier gas may occur during this step.

[0101] In step 308, the reactive species generated in step 307 may be deposited on the surface of the apparatus 115 undergoing plasma polymerization. Specifically, the polymerized reactive species are generated from the monomer vapor when the monomer vapor comes into contact with the plasma emitted in step 307 from the discharge cavity 104. When activated by the carrier gas plasma, the generated polymerized reactive species are dispersed radially toward the axis of the vacuum chamber 101 and onto the apparatus 115. In some embodiments, after the reactive species are introduced into the vacuum chamber 101, the vacuum chamber 101 contains a combination of ionized species, free electrons, free radicals, excited molecules or atoms, and unchanged gas.

[0102] In step 309, the reactive species release process 300 recovers excess reactive species in the atmosphere of the vacuum chamber 101 by reducing the air pressure in the recovery tube below the air pressure of the vacuum chamber 101. The pumping speed of the vacuum pump is configured to compensate for: (1) a decrease in the density of reactive species in the vacuum chamber 101 as a result of deposition of reactive species on the substrate; (2) an increase in the density of reactive species in the vacuum chamber 101 due to reactive species converging toward the center of the chamber to ensure a uniform density of reactive species throughout the vacuum chamber 101; (3) an increase in the density of reactive species in the vacuum chamber 101 based on the rate at which monomer vapor is introduced into the reaction chamber; (4) an increase in the density of reactive species in the vacuum chamber 101 based on the rate at which power is applied to the carrier gas to create a plasma; and (5) an increase in the density of reactive species in the vacuum chamber 101 based on the rate at which energy from the plasma is transferred to the monomer vapor.

[0103] Specifically, the controller 117 sends control signals to the vacuum pump 116 to evacuate excess gas, plasma, and reactive species from the atmosphere of the vacuum chamber 101. The vacuum pump 116 is coupled to the tail gas recovery pipe 111 and creates a negative ambient pressure in the tail gas recovery pipe 111 relative to the ambient pressure of the vacuum chamber 101. The negative ambient pressure generates a flow of gas from the vacuum chamber 101.

[0104] In some embodiments, step 306 (i.e., the pretreatment step) should be longer than one planetary rotation cycle so that all substrate samples are moved to the point closest to the porous electrode to receive the plasma. For example, step 306 may require between 1 and 30 minutes. In contrast, step 308 is determined by the required film thickness. Generally, step 308 takes longer than the other steps. For example, step 306 may require between 20 and 300 minutes. Finally, step 309 should be performed until excess monomer is evacuated from the chamber. For example, step 309 may require between 1 and 10 minutes.

[0105] <Processing System> 4 is a block diagram illustrating an example of a processing system 400 capable of performing at least some of the operations described herein. For example, some components of the processing system 400 may be implemented in a control device (e.g., controller 117 of FIGS. 1 and 2).

[0106] The processing system 400 may include one or more central processing units (“processors”) 402, main memory 406, non-volatile memory 410, network adapter 412 (e.g., network interface), video display 418, input / output devices 420, control devices 422 (e.g., keyboard and pointing device), drive devices 424 including storage medium 426, and signal generator 430 communicatively coupled to bus 416. Bus 416 is shown as an abstraction representing one or more physical buses and / or point-to-point connections connected by appropriate bridges, adapters, or controllers. Thus, bus 416 may include a system bus, a Peripheral Component Interconnect (PCI) bus or PCI-Express bus, a HyperTransport or Industry Standard Architecture (ISA) bus, a Small Computer System Interface (SCSI) bus, a Universal Serial Bus (USB), an IIC (I2C) bus, or an Institute of Electrical and Electronics Engineers (IEEE) standard 1394 bus (also referred to as “Firewire”).

[0107] Processing system 400 may share a similar computer processor architecture with a desktop computer, a tablet computer, a personal digital assistant (PDA), a mobile phone, a game console, a music player, a wearable electronic device (e.g., a watch or fitness tracker), a network-connected (“smart”) device (e.g., a television or home assistant device), a virtual / augmented reality system (e.g., a head-mounted display), or another electronic device capable of executing a series of instructions (sequential or otherwise) that specify actions to be taken by processing system 400.

[0108] While main memory 406, non-volatile memory 410, and storage medium 426 (also referred to as "machine-readable medium") are shown to be a single medium, the terms "machine-readable medium" and "storage medium" should be interpreted to include a single medium or multiple media (e.g., a centralized / distributed database and / or associated caches and servers) that store one or more sets of instructions 428. The terms "machine-readable medium" and "storage medium" should also be interpreted to include any medium that can store, encode, or carry sets of instructions for execution by processing system 400.

[0109] Generally, the routines executed to implement embodiments of the present disclosure may be implemented as part of an operating system or as part of a specific application, component, program, object, module, or sequence of instructions (collectively referred to as a "computer program"). A computer program typically includes one or more instructions (e.g., instructions 404, 408, 428) stored at various times in various memories and storage devices within a computing device. When read and executed by one or more processors 402, the instructions cause the processing system 400 to perform operations to implement elements comprising various aspects of the present disclosure.

[0110] Additionally, while embodiments have been described in the context of fully functional computing devices, those skilled in the art will appreciate that various embodiments may be distributed as program products in a variety of forms, and the present disclosure applies regardless of the particular type of machine or computer-readable medium used to actually effect the distribution.

[0111] Further examples of machine-readable storage media, machine-readable media, or computer-readable media include recordable-type media such as volatile and non-volatile memory devices 410, floppy and other removable disks, hard disk drives, optical disks (e.g., compact disk read-only memories (CD-ROMs), digital versatile disks (DVDs)), and transmission-type media such as digital and analog communications links.

[0112] The network adapter 412 enables the processing system 400 to broker data within the network 414 with entities external to the processing system 400 via any communication protocol supported by the processing system 400 and the external entities. The network adapter 412 may include a network adapter card, a wireless network interface card, a router, an access point, a wireless router, a switch, a multi-layer switch, a protocol converter, a gateway, a bridge, a bridge router, a hub, a digital media receiver, and / or a repeater.

[0113] Network adapter 412 may include a firewall that governs and / or manages permissions to access / proxy data within a computer network and tracks various levels of trust between different machines and / or applications. A firewall may be any number of modules with any combination of hardware and / or software components that can enforce a predetermined set of access rights (e.g., control the flow of traffic and resource sharing between these entities) between a particular set of machines and applications, machines and / or applications. A firewall may further manage and / or access access control lists that detail permissions, including the rights of individuals, machines and / or applications to access and manipulate objects, and the circumstances under which the permissions exist.

[0114] 5 is a schematic front view of a plasma polymerization coating apparatus 100 including optional shafts and gears for rotating the carousel 112 and / or the planetary rotating shaft 113. In some embodiments, the polymerization coating apparatus 100 can include a rotation motor 118, a motor shaft 120, a motor shaft gear 121, a tail gas collection pipe primary gear 122, a tail gas collection pipe secondary gear 123, a carousel shaft 125, a carousel shaft primary gear 126, a carousel shaft secondary gear 127, and a planetary rotating shaft gear 128.

[0115] In some embodiments, the rotary motor 118 is coupled to a motor shaft 120, which may protrude from a housing of the rotary motor 118. Further, the motor shaft 120 may be coupled to a motor shaft gear 121. Further, the tail gas recovery pipe 111 may be coupled to a tail gas recovery pipe primary gear 122 and a tail gas recovery pipe secondary gear 123. Similarly, the rotating rack shaft 125 may be coupled to a rotating rack shaft primary gear 126 and a rotating rack shaft secondary gear 127.

[0116] In certain embodiments, operation of the rotary motor 118 rotates the tail gas collection pipe 111. Specifically, a motor shaft gear 121 may be engaged with a tail gas collection pipe primary gear 122. When the rotary motor 118 rotates the motor shaft 120, the motor gear 121 drives the tail gas collection pipe primary gear 122. As described above, the tail gas collection pipe 111 is coupled to the tail gas collection pipe primary gear 122 and therefore rotates together with the tail gas collection pipe primary gear 122. In effect, the rotational motion generated by the rotary motor 118 is transmitted from the motor shaft 120 to the tail gas collection pipe 111 via the motor gear 121 and the tail gas collection pipe primary gear 122.

[0117] In some embodiments, the rotational motion of the tail gas recovery pipe 111 is transmitted to the rotating rack shaft 125. As described above, the tail gas recovery pipe secondary gear 123 is coupled to the tail gas recovery pipe 111 and therefore rotates with the tail gas recovery pipe 111. Additionally, the tail gas recovery pipe secondary gear 123 engages with the rotating rack shaft primary gear 126. Therefore, as the tail gas recovery pipe 111 rotates, the tail gas recovery pipe secondary gear 123 also drives the rotation of the rotating rack shaft primary gear 126. Because the rotating rack shaft primary gear 126 is coupled to the rotating rack 125, the rotation of the rotating rack shaft primary gear 126 drives the rotation of the rotating rack 125. In some examples, the rotating rack shaft 125 may be enclosed within the rotating rack 112, may be implemented as a sleeve that encloses the rotating rack 112, or may be implemented in any manner that transmits rotational motion from the tail gas recovery pipe 111 to the planetary rotating shaft 113.

[0118] In various embodiments, the rotational motion of the rotating rack shaft 125 is transmitted to the planetary rotating shaft 113. As described above, the rotating rack shaft secondary gear 127 is coupled to the rotating rack 125 and therefore rotates with the rotating rack 125. Additionally, the rotating rack shaft secondary gear 127 engages with the planetary rotating shaft gear 128. Therefore, as the rotating rack 125 rotates, the rotating rack shaft secondary gear 127 also drives the rotation of the planetary rotating shaft gear 128. Because the planetary rotating shaft gear 128 is coupled to the planetary rotating shaft 113, the rotation of the planetary rotating shaft gear 128 drives the rotation of the planetary rotating shaft 113.

[0119] One advantage of the optional shafts and gears is that the rotational motion generated by the rotary motor 118 can be transmitted to the tail gas collection pipe 111 and / or the planetary rotary shaft 113 at various controlled rotational speeds. For example, a series of gears of various diameters can be used to implement a gear ratio to achieve a desired torque or rotational speed. Furthermore, the various gears can be engaged to transmit rotational motion between the gears or disengaged to stop transmitting rotational motion between the gears. Furthermore, the series of gears of various diameters can be housed in a gearbox. In another example, the series of gears can be divided into groups (e.g., the motor shaft gear 121 and the tail gas collection pipe primary gear 122 in one group), and the gears in each group can be housed in a gearbox housing. Furthermore, the one or more gearboxes can be communicatively coupled to the controller 117 to receive control signals. For example, the control signals can indicate the size of the gear to select and the size of the gear to engage or disengage.

[0120] For example, the tail gas collection pipe 111 and / or the planetary rotary shaft 113 may rotate at a controlled speed by selecting specific size ratios of various gears. Specifically, the size ratio of the motor shaft gear 121 to the tail gas collection pipe primary gear 122 may be selected to ensure that the tail gas carousel 112, and therefore the rotating platform 114, rotates along the central axis of the vacuum chamber 101 at a controlled speed. Similarly, the size ratio of the tail gas collection pipe secondary gear 123 to the carousel shaft 125 may be selected to ensure that the carousel shaft 125 rotates at yet another controlled speed. Finally, the size ratio of the carousel shaft secondary gear 127 to the planetary rotary shaft gear 128 may be selected to ensure that the planetary rotary shaft 113 rotates at a specific controlled speed. Therefore, the size ratios of the tail gas recovery pipe secondary gear 123, the rotating rack shaft 125, the rotating rack shaft secondary gear 127, and the planetary rotating shaft gear 128 can be selected to ensure that the planetary rotating shaft 113, and thus the rotating platform 114, rotates along the planetary axis of the vacuum chamber 101 at a controlled speed.

[0121] The controlled speed can ensure that the plasma polymerized coating is applied uniformly to the one or more devices 115. The controlled speed can be fast enough to allow each of the one or more devices 115 to traverse various regions of the vacuum chamber 101 where densities of monomer vapor, carrier gas, plasma, reactive species, etc. vary. By ensuring that each of the one or more devices 115 passes through various regions, each of the one or more substrates experiences the same atmospheric fluctuations and receives the same uniform plasma polymerized coating across each substrate. Additionally, the controlled speed can allow the orientation of each of the one or more devices 115 to be shifted to ensure that a uniform plasma polymerized coating is applied across the entire surface of each individual substrate.

[0122] 6 is a flow chart illustrating an exemplary reactive species evacuation process 600. In some embodiments, process 600 may be performed by various components of plasma polymerization coating apparatus 100. Additionally, process 600 may be used to apply a plasma polymerization coating to apparatus 115.

[0123] In step 601, process 600 prepares vacuum chamber 101 for performing exemplary reactive species discharge process 600 on apparatus 115. An initialization operation is performed to ensure that the proper conditions are met before the plasma polymerized coating is applied. In certain embodiments, step 601 may be performed in a manner consistent with steps 301-305 of FIG. 3 .

[0124] As part of the start-up operation, the apparatus 115 may be appropriately positioned within the vacuum chamber 101 to receive the plasma polymerization coating. For example, the apparatus 115 may be positioned on a planetary rotating platform 114, as shown in Figures 1 and 2. Positioning the apparatus 115 on the planetary rotating platform 114 facilitates movement of the apparatus 115 throughout the vacuum chamber 101 during the plasma polymerization coating process, reduces the negative effects of plasma density fluctuations, and allows for a more uniform plasma coating on the apparatus 115.

[0125] In some embodiments, the atmospheric conditions of the vacuum chamber 101 are appropriately set to ensure that the atmosphere is suitable for the plasma polymerization process. For example, the vacuum chamber 101 can be closed to allow the vacuum pump 116 to evacuate the atmosphere within the vacuum chamber 101 until the atmosphere reaches between 10 and 300 mTorr. In addition to the pressure, the temperature of the vacuum chamber 101 can be adjusted to facilitate the plasma polymerization process. In some examples, the temperature of the vacuum chamber 101 can be controlled to be between 30 and 60°C.

[0126] The apparatus may be moved in a consistent manner throughout any period within the process 600. For example, the plasma polymerization coating apparatus 100 may initiate rotation of the carousel 112 to rotate the apparatus 115 along the central axis of the vacuum chamber 101 at a controlled rotational speed. For example, the carousel 112 may rotate the apparatus 115 along the central axis at a speed of 1.5 to 2.5 revolutions per minute. Additionally, the plasma polymerization coating apparatus 100 may initiate rotation of the planetary rotation shaft 113 and planetary rotation platform 114 to rotate the apparatus 115 within the vacuum chamber 101 along a secondary axis at a controlled rotational speed. In some embodiments, the secondary carousel rotates on a secondary axis distal to the central axis of the vacuum chamber 101.

[0127] The controller 117 may send control signals to the rotary motor 116 and other components of the plasma polymerized coating of the device 115 to control the timing and rotational speed of the carousel 112 and / or planetary rotating shaft 113. Additionally, the operation of the carousel 112 and / or planetary rotating shaft 113 is synchronized with the application of power to the metal grid barrier 105, thereby depositing reactive species on the surface of the device 115 while simultaneously moving the electrical connector throughout the vacuum chamber 101.

[0128] In some embodiments, rotation of the carousel 112 and / or planetary rotating shaft 113 results in movement of the device 115 within the vacuum chamber 101. This movement may include a linear reciprocating motion or a curvilinear motion relative to the central axis of the reaction chamber. Furthermore, the curvilinear motion may include one or more of a circular motion about the central axis, an elliptical motion about the central axis, a spherical motion, and a curvilinear motion with other irregular routes. Furthermore, in some embodiments, movement of the carousel 112 and / or planetary rotating shaft 113 changes the orientation of the device 115 relative to the central axis of the vacuum chamber 101 during deposition of reactive species onto the device 115. Furthermore, the rotational speeds of the carousel 112 and planetary rotating shaft 113 may be independently configured.

[0129] In certain embodiments, a treatment plasma may be introduced into the vacuum chamber 101 to remove impurities from the surface of the device 115 and prevent defects in the plasma polymerized coating. Additionally, the treatment plasma may activate the surface of the device 115, enabling bonding between the surface of the device 115 and the reactive species used to form the plasma polymerized coating. The treatment plasma may be generated by applying a charge from the radio frequency power source 103 to the porous electrode 102. In some embodiments, the controller 117 may send control signals to the radio frequency power source 103 that control the timing, power, and other operating parameters. For example, the treatment plasma may be applied before releasing the reactive species into the vacuum chamber 101 and / or after the reactive species are deposited on the surface of the substrate. In some examples, the power of the charge applied by the radio frequency power source 103 may be a continuous discharge, a pulsed discharge, or a periodic alternating discharge. Furthermore, the power of the charge and the duration of the charge may be varied depending on the desired plasma polymerized coating. In some examples, the power applied by the radio frequency power source 103 may be between 120-400 watts and the duration of the charge may be between 60-450 seconds.

[0130] In step 602, a plasma is generated from a carrier gas introduced into the discharge cavity 104 through the carrier gas pipe 109. The plasma is generated by applying an electric discharge from the discharge power supply 108 to the discharge source 107. In some embodiments, step 602 may be performed in a manner consistent with step 305 of FIG. 3 . After the carrier gas is introduced into the discharge cavity 104, an electric charge is applied to the discharge source 107 by the discharge power supply 108. The electric charge ionizes the carrier gas and turns it into a plasma. The controller 117 may send control signals that control the timing and amount of carrier gas introduced into the discharge cavity 104, as well as the timing and power applied by the discharge power supply 108 to the discharge source 107. In some embodiments, the carrier gas may include one or more of helium, neon, krypton, and argon. However, one skilled in the art may recognize that other elements may be used as carrier gases based, for example, on their ability to transfer energy to the monomer vapor.

[0131] In certain embodiments, the discharge may be generated using one or more of radio frequency discharge, microwave discharge, intermediate frequency discharge, sinusoidal or bipolar pulse waveform, radio frequency discharge, and electric spark discharge. Furthermore, the radio frequency discharge and intermediate frequency discharge may have a sinusoidal or bipolar pulse waveform. In some examples, the radio frequency discharge generates plasma via a radio frequency electromagnetic field discharge. In other examples, the radio frequency discharge and intermediate frequency discharge have a sinusoidal or bipolar pulse waveform.

[0132] In yet another example, microwave discharge uses microwave energy to excite plasma. The microwave method has the advantage of high energy utilization efficiency. Furthermore, microwave discharge does not use electrodes, and the resulting plasma is pure. Therefore, microwave discharge provides high-quality, high-speed, and large-area application of plasma-polymerized coatings.

[0133] In some embodiments, a pulsed or periodic AC discharge may be applied by the discharge power supply 108 during a particular period of the process 600 to generate plasma that is released into the vacuum chamber 101. In one example, the pulsed discharge uses a power of between 50 and 200 watts for a duration of 600 to 3,600 seconds. Furthermore, the frequency of the pulsed discharge may be between 1 and 1,000 Hz, and the pulse duty cycle may be between 1:1 and 1:500. In yet another example, the periodic AC discharge uses a power of between 50 and 200 watts for a duration of 600 to 3,600 seconds. Furthermore, the alternating frequency of the discharge may be between 1 and 1,000 Hz. In some embodiments, the periodic alternating electrical discharge may be a sawtooth waveform, a sinusoidal waveform, a square waveform, a full-wave rectified waveform, or a half-wave rectified waveform.

[0134] In step 603, monomer vapor may be introduced into vacuum chamber 101. In some embodiments, step 603 may be performed in a manner consistent with step 307 of FIG. 3 . The monomer vapor is used to generate reactive species that are deposited on apparatus 115 to form a plasma-polymerized coating. The reactive species may be released from the monomer vapor when energy is transferred from the plasma to the monomer vapor. In some embodiments, the monomer vapor may be partially released into discharge cavity 104 and then released into vacuum chamber 101. In other embodiments, the monomer vapor may be released directly into vacuum chamber 101 through monomer vapor tailpipe 110 to avoid releasing the monomer vapor into discharge cavity 104. In yet other embodiments, controller 117 may send control signals to monomer vapor tailpipe 110 to select the type of monomer vapor to release, the rate at which the monomer vapor is released, and the timing of the release of the monomer vapor. In some embodiments, the monomer vapor is introduced into vacuum chamber 101 at a rate such that the atmosphere reaches between 10 and 300 mTorr.

[0135] Various monomer vapors can be selected to achieve compact, uniform plasma-polymerized coatings with good electrical insulation properties and low breakdown voltages. In some embodiments, the monomer vapors can include one or more of: a first vapor containing at least one organic monomer with a low dipole moment; a second vapor containing at least one polyfunctional unsaturated hydrocarbon and hydrocarbon derivative monomer; a third vapor containing at least one monofunctional unsaturated fluorocarbon resin monomer; and a fourth vapor containing at least one organosilicon monomer in a Si-Cl, Si-OC, or ring structure.

[0136] The monomer vapor can include a first vapor containing at least one organic monomer having a low dipole moment. A low dipole polymer having a low dipole moment can reduce interference with electrical signals throughout the plasma-polymerized coating. In certain embodiments, the first vapor is selected from the group consisting of p-xylene, benzene, toluene, carbon tetrafluoride, α-methylstyrene, poly-p-dichlorotoluene, dimethylsiloxane, allylbenzene, decafluorobiphenyl, decafluorobenzophenone, perfluoro(allylbenzene), tetrafluoroethylene, hexafluoropropylene, 1H,1H-perfluorooctylamine, perfluorodecyl iodide, perfluorotributylamine, 1,8-diiodoperfluorooctane, perfluorohexyl iodide, perfluorobutyl iodide, perfluorodecyl iodide, perfluorooctyl iodide, 1,4-bis(2',3'-epoxypropyl)perfluorobutane, dodecafluoro-2-methyl-2-pentene, and 2-(perfluorobutyl)ethylene. perfluorooctylmethyl acrylate, 2-(perfluorooctyl)ethyl methyl acrylate, 2-(perfluorooctyl)iodoethane, perfluorodecylethyl iodide, 1,1,2,2-tetrahydroperfluorohexyl iodide, perfluorobutylethylene, 1H,1H,2H-perfluoro-1-decene, 2,4,6-tris(perfluoroheptyl)-1,3,5-triazine, perfluorohexylethylene, 3-(perfluorooctyl)-1,2-epoxypropane, perfluorocycloether, perfluorodecylethylene, perfluorodecylethyl iodide, dibromo-p-xylene, 1,1,4,4-tetraphenyl-1,3-butadiene, and polydimethylsiloxane (molecular weight 500-50,000).

[0137] The monomer vapor may also include a second vapor containing at least one polyfunctional unsaturated hydrocarbon and hydrocarbon derivative monomer. The polyfunctional unsaturated hydrocarbon and hydrocarbon derivative monomer has at least two reactive groups to enable the formation of a crosslinked polymer coating. In some embodiments, the second vapor may include one or more of 1,3-butadiene, isoprene, 1,4-pentadiene, trimethylolpropane ethoxylate triacrylate, tri(propylene glycol) diacrylate, poly(ethylene glycol) diacrylate, 1,6-hexanediol diacrylate, ethylene glycol diacrylate, diethylene glycol divinyl ether, and neopentyl glycol diacrylate.

[0138] The monomer vapor may further comprise a third vapor comprising at least one monofunctional unsaturated fluorocarbon resin monomer. The monofunctional unsaturated fluorocarbon resin monomer is advantageous because it allows for the formation of a waterproof polymer coating. The third vapor may include one or more of 3-(perfluoro-5-methylhexyl)-2-hydroxypropyl methyl acrylate, 2-(perfluorodecyl)ethyl methyl acrylate, 2-(perfluorohexyl)ethyl methyl acrylate, 2-(perfluorododecyl)ethyl acrylate, 2-perfluorooctyl ethyl acrylate, 1H,1H,2H,2H-perfluorooctyl acrylate, 2-(perfluorobutyl)ethyl acrylate, (2H-perfluoropropyl)-2-acrylate, (perfluorocyclohexyl)methyl acrylate, 3,3,3-trifluoro-1-propyne, 1-acetenyl-3,5-difluorobenzene, and 4-acetenylbenzotrifluoride as the monofunctional unsaturated fluorocarbon resin.

[0139] Finally, the monomer vapor may include a fourth vapor containing at least one organosilicon monomer in a Si-Cl, Si-OC, or ring structure, enabling the formation of a wear-resistant coating. In some embodiments, the fourth vapor may include one or more of tetramethoxysilane, trimethoxyhydrogensiloxane, triethoxyoctylsilane, phenyltriethoxysilane, vinyltris(2-methoxyethoxy)silane, triethylvinylsilane, hexaethylcyclotrisiloxane, 3-(methacryloyloxy)propyltrimethoxysilane, phenyltris(trimethylsiloxy)silane, diphenyldiethoxysilane, dodecyltrimethoxysilane, triethoxyoctylsilane, dimethoxysilane, and 3-chloropropyltrimethoxysilane.

[0140] The vapor used in step 603 depends on the coating being formed. For example, a cross-linked structural monomer generates reactive species that improve the strength and water resistance of the plasma-polymerized coating. In some embodiments, steps 603-605 are performed to apply a transition layer to the surface of the device 115. The transition layer is an intermediate layer formed between the surface of the device 115 and the surface layer of the plasma-polymerized coating. In some embodiments, the transition layer can include a second vapor containing at least one polyfunctional unsaturated hydrocarbon and hydrocarbon derivative monomer and / or a fourth vapor containing at least one organosilicon monomer in Si—Cl, Si—OC. As described above, the two vapors enable the formation of a cross-linked polymer coating and a structure that provides water resistance.

[0141] The process parameters used in process 600 can be varied based on various properties of the monomer vapor and carrier gas. For example, the type of vapor or ratio of different vapors introduced in step 603 can be selected based on differences in molecular bond energy, bond length, and evaporation temperatures of different monomer vapors. Furthermore, the higher the evaporation temperature, the higher the temperature that must be applied to the monomer vapor. In yet other embodiments, the rate at which the monomer vapor is released can be varied to affect the rate at which reactive species are generated within the vacuum chamber 101 and the resulting density of reactive species. In some examples, the monomer vapor can be released into the vacuum chamber at a rate of 10 to 10-1000 μL / min.

[0142] Furthermore, the energy applied to the first and second monomer vapors and / or the carrier gas can be selected according to the molecular bond energies, bond lengths, and differences in vaporization temperatures of the different monomers to produce compact transition and surface layers that provide water resistance and low breakdown voltage. As described above, energy from the plasma is transferred to the monomer vapor, releasing reactive species that are deposited on the device 115. The energy required depends on the monomer vapor used. For example, sufficient energy is needed to break the molecular bonds of the monomer vapor and release the reactive species. If the bond energy of the reagent is high, more energy must be applied to the monomer. Similarly, the shorter the bond distance of the monomer, the more energy is needed.

[0143] In step 604, reactive species are generated for application to the surface of device 115. The reactive species are generated when the plasma generated in step 602 is emitted from discharge cavity 104 into vacuum chamber 101 and energy from the plasma is transferred to the monomer vapor emitted in step 603. In some embodiments, step 604 can be performed in a manner consistent with step 307 of FIG.

[0144] In some embodiments, the emission of plasma from the discharge cavity 104 into the vacuum chamber 101 may be regulated by the metal grid 105. Specifically, the controller 117 may provide a control signal to the pulsed power supply 106 to adjust the power applied to the metal grid 105. When power is applied to the metal grid 105, the plasma can pass through the metal grid 105, and when power is not applied to the metal grid 105, the plasma is blocked from passing through the metal grid 105. In certain aspects, the plasma may break the chemical bonds of monomers and form reactive particles such as free radicals.

[0145] In some embodiments, the release of plasma can be controlled by using a constant or periodic electrical discharge to the metal gate 105. For example, by applying a constant discharge to the metal gate 105, plasma can be constantly flowing into the vacuum chamber 101. In another example, by applying a periodic discharge to the metal gate 105, plasma can be periodically flowing into the vacuum chamber 101. The periodic electrical discharge can be a continuous electrical discharge or a discontinuous electrical discharge, such as a pulsed electrical discharge. A waveform is continuous if it forms an unbroken curve along a domain (e.g., the time domain). In contrast, a waveform is discontinuous if there are breaks in the curve along that domain.

[0146] In some embodiments, the plasma may be released in multiple stages. For example, the plasma may be released in a stage that applies a constant electrical discharge to the metal gate 105. The constant electrical discharge allows the plasma to be constantly released from the discharge cavity 104 into the vacuum chamber 101. Another stage may be implemented by applying a periodic electrical discharge to the metal gate 105. The periodic electrical discharge may be a continuous or discontinuous discharge. For example, the continuous electrical discharge may take the form of a sinusoidal waveform. In another example, the discontinuous electrical discharge may take the form of a sawtooth waveform, a square waveform, a full-wave rectified waveform, a half-wave rectified waveform, or a pulsed discharge. Those skilled in the art will recognize that one or more stages may be implemented using any combination of constant and periodic waveforms.

[0147] The periodic waveform can be generated using various techniques to affect the periodic discharge applied to the metal gate 105. In one embodiment, the amplitude and frequency of the waveform can be adjusted. For example, by increasing the amplitude of the waveform, a larger amount of discharge is periodically applied to the metal gate 105, allowing for a greater flow of plasma from the discharge cavity 104 into the vacuum chamber 101. In another example, increasing the frequency of the waveform causes the discharge applied to the metal gate 105 to alternate more rapidly. This results in a more rapid change in the flow of plasma through the metal gate 105 into the vacuum chamber 101 (e.g., alternating between high and low plasma flow, or alternating between plasma-on and plasma-off periods).

[0148] In yet another technique, a composite waveform can be formed by combining multiple other waveforms. In one embodiment, a square waveform and a sinusoidal waveform can be combined. The square waveform can be a periodic waveform that alternates between a minimum and a maximum value. For example, the minimum value can be zero to provide an "off" state when no discharge is applied to the metal gate 105. The sinusoidal wave can be a sine wave with a higher frequency than the square wave. If the square wave has a negative minimum value and a greater amplitude than the sine wave, the value of the composite wave remains less than zero during the square wave's minimum value, resulting in a periodic "off" state. When the square wave reaches its maximum value, the composite waveform becomes a sinusoidal wave. Effectively, the composite waveform alternates between an "on" and an "off" state based on whether the square wave is at its maximum or minimum value, respectively. During the "on" state, the waveform provides alternating output values ​​based on the sinusoidal waveform.

[0149] In other embodiments, a DC bias waveform can be combined with a periodic waveform. The DC bias waveform can be used to configure the average amplitude of the resulting composite waveform. For example, a positive DC bias waveform increases the value of the square waveform. If the DC bias waveform is high enough to make the minimum value of the square wave greater than zero, the value of the square wave will not go below zero. In practice, this means that a discharge is always applied to the metal gate 105, where the discharge alternates between higher and lower discharges.

[0150] Yet another technique for generating a waveform involves clipping an existing waveform. Clipping is performed to limit the waveform when it exceeds a certain value. For example, a minimum toggle threshold may specify a minimum value for the waveform. When the waveform falls below the minimum toggle threshold, the waveform is clipped at that threshold value. For example, the minimum toggle threshold may be zero, so that when the waveform drops below zero, the waveform simply remains at zero. A waveform clipped by a minimum toggle threshold of zero does not apply a discharge to the metal gate 105, resulting in a plasma-off period. Similarly, a maximum toggle threshold may specify a maximum value for the waveform. When the waveform exceeds the maximum toggle threshold, the waveform is clipped at that threshold value. Those skilled in the art will recognize that waveforms can be generated using a combination of various techniques. For example, the composite waveform described above can be adjusted by a toggle threshold to limit the amplitude of the waveform.

[0151] The hybrid plasma polymerization process can be performed by utilizing the metal grid 105 to precisely control the pulses of plasma flowing into the vacuum chamber 101. For example, a periodic discharge, as described above, can be used to perform the hybrid plasma polymerization process. During the periodic discharge, a discharge is periodically applied to the metal gate 105. A plasma-on period occurs when a discharge is applied to the metal gate 105. In contrast, a plasma-off period occurs when no discharge is applied to the metal gate 105.

[0152] In some embodiments, this hybrid process begins with a plasma-on period (i.e., when a charge is applied to the metal gate 105). When plasma flows into the vacuum chamber 101 and is deposited on the surface of the device 115 during the plasma-on period, a portion of the plasma polymer formation occurs through a fragmentation-multiple recombination process due to plasma-chemical activation of chemically polymerizable monomers, such as vinyl or acrylic monomers. Then, during the plasma-off period (i.e., when no charge is applied to the metal gate 105), plasma does not flow into the vacuum chamber 101. During this period, radical chain propagation occurs on the surface of the device 115. In some instances, a greater portion of the plasma polymer formation is due to radical chain propagation during the plasma-off period compared to the fragmentation-multiple recombination process during the plasma-on period. In some embodiments, alternating plasma-on periods (i.e., the fragmentation-multiple recombination process) and plasma-off periods (i.e., the radical chain propagation process) results in an alternating microstructure of the layer that dissipates energy from the layer.

[0153] The precise control of plasma emission provided by the metal grid 105 can be used to produce plasma polymerized coatings with varying thicknesses of plasma-on and plasma-off sublayers. Specifically, by varying the thickness of each layer formed during the plasma-on or plasma-off period, a graded structure can be created. For example, the thickness of each layer can decrease with each new layer applied onto the device 115.

[0154] In step 605, the reactive species generated in step 604 are deposited on the surface of the device 115 undergoing plasma polymerization. In some embodiments, step 605 may be performed in a manner consistent with step 308 of FIG. 3. The reactive species generated in step 604 may be dispersed radially toward the axis of the vacuum chamber 101 and dispersed onto the device 115. In some embodiments, after the reactive species are introduced into the vacuum chamber 101, the vacuum chamber 101 contains a combination of ionized species, free electrons, free radicals, excited molecules or atoms, and unchanged gases. In some embodiments, the free radicals are polymerized on the surface of the device 115 to form a polymer coating.

[0155] The reactive species are deposited on the surface of the device 115, producing a compact, uniform plasma-polymerized coating with good electrical insulating properties and a low breakdown voltage associated with the breakdown effect. Specifically, the breakdown effect is the mechanism that allows electrical conduction through the coating. Because the polymer film is very thin and textured with numerous nanometer-sized pores, a low voltage can provide a conductive channel when applied across the coating.

[0156] Consistent with various embodiments disclosed herein, movement of the device 115 (e.g., movement initiated in step 601) throughout process 600 ensures that the device 115 passes through different regions of the vacuum chamber 101 and through different atmospheres, ensuring uniform application of the plasma polymerized coating. Additionally, the treatment plasma of step 601 may activate the organic substrate of the device 115 to form dangling bonds that facilitate coating deposition and enhance the bonding strength between the surface of the device 115 and the plasma polymerized coating. The plasma polymerized coating resulting from step 605 may be a transition layer. In some implementations, the transition layer is deposited directly on the surface of the device 115. A surface layer may then be deposited on the surface of the transition layer.

[0157] In step 606, a monomer vapor is introduced into the vacuum chamber 101. In some embodiments, step 606 may be performed in a manner consistent with step 603. The monomer vapor is used to generate reactive species that are deposited on the apparatus 115 to form a plasma polymerized coating. When energy is transferred from the plasma to the monomer vapor, reactive species may be released from the monomer vapor.

[0158] The vapor introduced into the vacuum chamber 101 in step 606 depends on the coating to be formed. For example, a cross-linking monomer generates reactive species that improve the strength and water resistance of the plasma-polymerized coating. In some embodiments, steps 606-608 are performed to apply a surface layer to the surface of the device 115. In some implementations, the surface layer of plasma-polymerized coating is applied to the transition layer applied in steps 603-605. The surface layer can include a first vapor including at least one organic monomer having a low dipole moment and / or a third vapor including at least one monofunctional unsaturated fluorocarbon resin monomer. As described above, the first and third vapors enable the formation of a low-dielectric-constant coating and a water-resistant polymer coating.

[0159] In step 607, reactive species are generated within the vacuum chamber 101. In some embodiments, step 607 may be performed in a manner consistent with step 604. The reactive species are generated when the plasma generated in step 602 is emitted from the discharge cavity 104 into the vacuum chamber 101 and energy from the plasma is transferred to the monomer vapor emitted in step 603.

[0160] In step 608, the reactive species generated in step 604 are deposited on the surface of the apparatus 115 undergoing plasma polymerization. In some embodiments, step 608 may be performed in a manner consistent with step 605. The plasma polymerized coating resulting from step 608 may be a surface layer. In some embodiments, the surface layer may be deposited on the surface of a transition layer (e.g., the transition layer applied in steps 603-605).

[0161] 7 illustrates an exemplary plasma polymerized coating 700 applied to apparatus 115. The plasma polymerized coating may include a transition layer 701 and a surface layer 702. The plasma polymerized coating may also include a transition layer 703, a surface layer 704, a transition layer 705, and / or a surface layer 706. Transition layers 701, 703, and 705 may be produced in a manner consistent with steps 603-605 of FIG. 6. Similarly, surface layers 702, 704, and 706 may be produced in a manner consistent with steps 606-608 of FIG. 6.

[0162] In some embodiments, transition layer 701 may be deposited directly on the surface of device 115. Subsequently, surface layer 702 may then be deposited on the surface of transition layer 701. Similarly, transition layer 703 may be deposited on the surface of surface layer 702, surface layer 704 may be deposited on the surface of transition layer 703, transition layer 705 may be deposited on the surface of surface layer 704, and surface layer 706 may be deposited on the surface of transition layer 705.

[0163] In some embodiments, the transition layers 701, 703, 705 and / or the surface layers 702, 704, 706 may each include one or more of carbon, fluorine, oxygen, silicon, and hydrogen atoms. In some examples, the plasma-polymerized coating may have a ratio of oxygen atoms to carbon atoms between 1:3 and 1:20. Oxygen atoms are somewhat hydrophilic, and carbon atoms are hydrophobic. Therefore, if the ratio of oxygen atoms to carbon atoms is too high, the water resistance of the coating may be reduced.

[0164] In some embodiments, the transition layers 701, 703, 705 and the surface layers 702, 704, 706, respectively, can be formed using a hybrid plasma polymerization process, such as the process described in step 604 of FIG. 6 . The hybrid process begins with plasma-chemical activation of chemically polymerizable monomers, such as vinyl or acrylic monomers, during the plasma-on period (i.e., when a charge is applied to the metal gate 105), followed by a fragmentation-multiple recombination process. Subsequently, radical chain propagation occurs on the surface of the device 115 during the plasma-off period (i.e., when no charge is applied to the metal gate 105). In some examples, the majority of the plasma polymer coating formation is due to radical chain propagation during the plasma-off period compared to the fragmentation-multiple recombination process during the plasma-on period. For example, only a small portion of the plasma polymerized coating can be produced using the fragmentation-multiple recombination process during the plasma-on period. In some embodiments, the alternating radical chain propagation and fragmentation-multiple recombination process result in an alternating arrangement of layers that dissipates energy from the plasma polymerized coating.

[0165] The foregoing description of various embodiments of the claimed subject matter has been provided for purposes of illustration and description. It is not intended to be exhaustive or to limit the claimed subject matter to the precise form disclosed. Many modifications and variations will be apparent to those skilled in the art. The embodiments were chosen and described in order to best explain the principles of the invention and its practical application, so that those skilled in the art can appreciate the claimed subject matter, various embodiments, and various modifications suited to the particular applications intended.

[0166] While the detailed description describes specific embodiments and the best mode contemplated, the technology, no matter how detailed the description, can be practiced in many ways. While embodiments are still encompassed within this specification, the details of the embodiments may vary considerably. Specific terminology used in describing particular features or aspects of various embodiments should not be construed to mean that the terminology is redefined herein to be limited to any particular characteristic, feature, or aspect of the relevant technology. In general, the terms used in the following claims should not be construed to limit the technology to the specific embodiments disclosed in the specification, unless these terms are expressly defined herein. Thus, the actual scope of the technology includes not only the disclosed embodiments but also all equivalent ways of practicing or implementing the embodiments.

[0167] The language used in the specification has been selected primarily for readability and educational purposes. It may not be selected to distinguish or limit the subject matter. Accordingly, it is intended that the scope of the technology be limited not by this detailed description, but rather by the claims that issue on an application based on this specification. Accordingly, the disclosure of various embodiments is intended to be illustrative, but not limiting, of the scope of the technology, which is set forth in the following claims.

Claims

1. 1. A method for protecting electrical connectors from corrosive damage using a polymerization process to produce a plasma polymerized coating, comprising: the plasma polymerized coating includes a transition layer and a surface layer; consistently moving the electrical connector within a reaction chamber for a selected period of time; During the selected time period, applying the transition layer to the electrical connector; releasing a first monomer vapor into the reaction chamber, the first monomer vapor comprising: (1) at least one polyfunctional unsaturated hydrocarbon or hydrocarbon derivative monomer having at least two reactive groups; and (2) at least one organosilicon monomer having a Si—Cl structure, a Si—O—C structure, or a ring structure; generating a first reactive species from the first monomer vapor by discharging a first polymerization plasma into the reaction chamber; and applying the transition layer to the electrical connector, the transition layer comprising: depositing the first reactive species to form the transition layer on a surface of the electrical connector having a first ratio of oxygen atoms to carbon atoms; and applying the surface layer to the electrical connector, releasing a second monomer vapor into the reaction chamber; generating a second reactive species from the second monomer vapor by discharging a second polymerization plasma into the reaction chamber; and applying the surface layer to the electrical connector, comprising depositing the second reactive species to form the surface layer on a surface of the transition layer having a second ratio of oxygen atoms to carbon atoms, the second ratio of oxygen atoms to carbon atoms of the surface layer being less than the first ratio; Including, The method wherein the oxygen atom:carbon atom ratio of said plasma polymerized coating is from 1:3 to 1:

20.

2. the first and / or second monomer vapors are a first vapor comprising at least one organic monomer having a low dipole moment; and a third vapor comprising at least one monofunctional unsaturated fluorocarbon resin monomer; The method of claim 1 , comprising one or more of:

3. The method of claim 2 , wherein the low dipole moment of the first vapor reduces interference with electrical signals across the plasma polymerized coating.

4. 3. The method of claim 2, further comprising controlling the ratio of the vapors based on molecular bond energy, bond length, and a difference in vaporization temperature between the first and second monomer vapors.

5. The method of claim 1 , wherein the first and / or second monomer vapors comprise cross-linking structural monomers that improve the strength and water resistance of the transition layer and / or the surface layer.

6. 10. The method of claim 1, further comprising varying process parameters of the process based on differences in molecular bond energies, bond lengths, and vaporization temperatures of different monomers.

7. 7. The method of claim 6, further comprising varying the energy applied to the first, second monomer vapors, and / or carrier gas based on differences in molecular bond energies, bond lengths, and vaporization temperatures of different monomers to create compact transition and surface layers that impart water resistance and low breakdown voltage.

8. 10. The method of claim 1, wherein the monomer vapor is released into the reaction chamber at a rate of 10-1000 μL / min.

9. 10. The method of claim 1, wherein the first and / or second polymerization plasma is formed by applying an electric charge to a carrier gas in the reaction chamber, and the polymerization plasma is deposited using a pulsed electric discharge or a periodic AC electric discharge.

10. 10. The method of claim 9, wherein during application of the surface coating layer, the duration of the pulse discharge is 600-3,600 seconds, the applied power is 1-600 watts, the frequency of the pulse discharge is 1-1000 Hz, and the duty cycle of the pulse is 1:1-1:

500.

11. 10. The method of claim 9, wherein during application of the surface coating layer, the duration of the periodic AC electrical discharge is 600-3,600 seconds, the applied power is 1-600 watts, and the AC frequency is 1-1000 Hz.

12. The method of claim 1 , further comprising applying an electric charge to a carrier gas to generate the first and / or the second polymerizing plasma.

13. The method of claim 12 , wherein the carrier gas comprises an inert gas of argon (Ar) atoms.

14. The method of claim 1 , wherein the transition layer and / or the surface layer comprises one or more of carbon, fluorine, oxygen, silicon, and hydrogen atoms.

15. 2. The method of claim 1, wherein the reactive species are free radicals released from the monomer vapor when energy is transferred to the monomer vapor from the first and / or second polymerization plasmas.

16. The method of claim 15 , wherein the free radicals are polymerized on the surface of the electrical connector to form a polymer coating.

17. 10. The method of claim 1, wherein the electrical connector is a USB™ Type-C connector, a micro-USB™ connector, an Apple™ Lightning connector, an HDMI™ connector, a flexible printed circuit (FPC) connector, a board-to-board (BTB) connector, a probe connector, or a radio frequency (RF) coaxial connector.

18. 1. A reaction chamber for protecting electrical connectors from corrosive damage using a polymerization process to produce a plasma polymerized coating, comprising: the plasma polymerized coating includes a transition layer and a surface layer; a carousel driven by a rotary motor to secure the electrical connector within the reaction chamber and move the electrical connector consistently within the reaction chamber; a discharge cavity for generating a polymerization plasma by applying a discharge to a carrier gas; a monomer vapor pipe for discharging a first monomer vapor and a second monomer vapor into the reaction chamber; and a metal grid barrier between the reaction chamber and the discharge cavity; where: generating a first reactive species from the first monomer vapor comprising (1) at least one polyfunctional unsaturated hydrocarbon or hydrocarbon derivative monomer having at least two reactive groups and (2) at least one organosilicon monomer having a Si—Cl structure, a Si—O—C structure, or a ring structure, by discharging a first polymerization plasma into the reaction chamber, generating the first reactive species deposited on a surface of the electrical connector, and applying the transition layer to the electrical connector by generating the transition layer having a first ratio of carbon atoms to oxygen atoms; and generating second reactive species from the second monomer vapor by discharging a second polymerization plasma into the reaction chamber, generating the second reactive species deposited on the surface of the transition layer; and applying the surface layer to the electrical connector by generating the surface layer having a second ratio of carbon atoms to oxygen atoms, the second ratio of carbon atoms to oxygen atoms of the surface layer being greater than the first ratio; A reaction chamber wherein the oxygen atom:carbon atom ratio of said plasma polymerized coating is 1:3 to 1:

20.

19. 20. The reaction chamber of claim 18, wherein the carousel is operated simultaneously with the application of power to the metal grid barrier to deposit reactive species on the electrical connector while simultaneously moving the electrical connector throughout the reaction chamber.

20. 20. The reaction chamber of claim 18, wherein movement of the electrical connector within the reaction chamber comprises a linear reciprocating motion or a curvilinear motion relative to a central axis of the reaction chamber.

21. 21. The reaction chamber of claim 20, wherein the curvilinear motion comprises one or more of a circular motion about the central axis, an elliptical motion about the central axis, a spherical motion, and a curvilinear motion with another irregular route.

22. The carousel is coupled to a planetary rotation shaft having planet axes distal from a central axis, and the planetary rotation shaft is coupled to a planetary rotation platform, wherein:

20. The reaction chamber of claim 18, wherein the electrical connector is fixed on the planetary rotation platform, and the electrical connector is rotated along the planetary axis.

23. the transition layer comprises one or more of the elements carbon, fluorine, oxygen, silicon, and hydrogen; and 20. The reaction chamber of claim 18, wherein the surface layer comprises one or more of the following elements: carbon, fluorine, oxygen, silicon, and hydrogen.

24. 20. The reaction chamber of claim 18, wherein the electrical connector is a USB™ Type-C connector, a micro-USB™ connector, an Apple™ Lightning connector, an HDMI™ connector, a flexible printed circuit (FPC) connector, a board-to-board (BTB) connector, a probe connector, or a radio frequency (RF) coaxial connector.

25. 1. A plasma polymerized coating for protecting electrical connectors from moisture and corrosive damage, comprising: the plasma polymerized coating includes a transition layer and a surface layer; a transition layer on a surface of the electrical connector having a first ratio of oxygen atoms to carbon atoms, wherein the transition layer comprises: at least one polyfunctional unsaturated hydrocarbon and hydrocarbon derivative monomer; and formed using vapor of at least one or more first monomers selected from the group consisting of Si—Cl structure, at least one organosilicon monomer having a Si—O—C structure, and a surface layer on a surface of the transition layer having a second ratio of oxygen atoms to carbon atoms less than the first ratio, wherein the surface layer comprises: at least one organic monomer having a low dipole moment, and at least one monofunctional unsaturated fluorocarbon resin monomer; A plasma polymerized coating, wherein the oxygen atom:carbon atom ratio of said plasma polymerized coating is 1:3 to 1:

20.

26. The transition layer and / or the surface layer may contain carbon, fluorine, oxygen, silicon, and hydrogen.

26. The plasma polymerized coating of claim 25, comprising one or more of the atoms.

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