Substrate processing apparatus and substrate processing method

Abstract

To determine damage to and chipping of a substrate for every processing tank.SOLUTION: A substrate processing method is a method for controlling a substrate processing apparatus, and the substrate processing apparatus includes: processing tanks that have a plurality of substrates immersed therein and retain processing liquid collectively processing the plurality of substrates; and a substrate holding mechanism that is a mechanism having a function to collectively hold the plurality of substrates, and has a first function to extract the plurality of substrates from the processing liquid and a second function to immerse the plurality of substrates in the processing liquid. The method determines the presence or absence of chipping of the plurality of substrates in processing using the processing tanks based on the load on the substrate holding mechanism when it exerts the first function.SELECTED DRAWING: Figure 9

Description

[Technical Field]

[0001] The present disclosure relates to a substrate processing apparatus and a substrate processing method. [Background technology]

[0002] The following Patent Documents 1 and 2 propose a batch-type substrate processing apparatus that processes a plurality of substrates at once. In Patent Documents 1 and 2, the substrate processing apparatus includes a processing tank that stores a processing liquid. The plurality of substrates are immersed in the processing liquid stored in the processing tank, thereby performing processing on the plurality of substrates at once.

[0003] In Patent Document 1, the weight of a substrate before and after undergoing multiple processes is measured, and the difference between the weights is compared with a comparison value. In Patent Document 2, an imaging unit (camera) is provided to monitor the inside of a substrate processing apparatus. The camera captures images of the inside of a processing tank from vertically above, and the presence or absence of substrate fragments inside the processing tank is determined based on the captured images. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Application Publication No. 10-313038 [Patent Document 2] US Patent Application Publication No. 2007 / 0177788 Summary of the Invention [Problem to be solved by the invention]

[0005] When immersing multiple substrates in a processing solution, a mechanism (hereinafter referred to as a "substrate holding mechanism") having the function of holding the multiple substrates together is used. The substrate holding mechanism immerses the multiple substrates in the processing solution and removes them from the processing solution. The multiple substrates that have been collectively processed by the processing solution are then moved from the substrate holding mechanism to another location by another mechanism. It is desirable to determine whether the multiple substrates moved from the substrate holding mechanism are damaged or missing.

[0006] In Patent Document 1, the presence or absence of damage is determined based on whether the weight difference between before and after processing of a substrate in multiple processing tanks is greater than a comparison value. However, this technology is not suitable for determining damage or loss for each processing tank.

[0007] In Patent Document 2, the captured image is affected by light reflected by the surface of the processing liquid, which can lead to erroneous determination of the presence or absence of substrate fragments inside the processing tank.

[0008] Therefore, an object of the present disclosure is to provide a technique for reducing the influence of light reflected by the liquid surface of the processing liquid and determining whether a substrate is damaged or missing for each processing tank. [Means for solving the problem]

[0009] A substrate processing method according to a first aspect is a method for controlling a substrate processing apparatus, the substrate processing apparatus including: a processing tank for storing a processing liquid in which a plurality of substrates are immersed and which processes the plurality of substrates collectively; and a substrate holding mechanism having a function of holding the plurality of substrates collectively, the substrate holding mechanism having a first function of removing the plurality of substrates from the processing liquid and a second function of immersing the plurality of substrates in the processing liquid. The method determines whether or not the plurality of substrates are damaged during processing using the processing tank, based on a load applied to the substrate holding mechanism when the first function is exercised.

[0010] The substrate processing method of the second aspect is a substrate processing method of the first aspect, in which the presence or absence is determined based on the difference between a first value, which is the value of the load applied to the substrate holding mechanism before the substrate holding mechanism immerses the multiple substrates in the processing liquid, and a second value, which is the value of the load applied to the substrate holding mechanism when it performs the first function.

[0011] A substrate processing method according to a third aspect is the substrate processing method according to the second aspect, in which the presence or absence is determined based on a difference between the second value and a reference value that is a value that serves as a reference for the second value.

[0012] A substrate processing method according to a fourth aspect is a substrate processing method according to the third aspect, in which the second value for a plurality of substrates that have already been processed with the processing liquid and that have been determined to have no defects is adopted as the reference value.

[0013] A substrate processing method according to a fifth aspect is a substrate processing method according to the first to fourth aspects, in which the presence or absence is determined based on the load at a predetermined position of the substrate holding mechanism after the plurality of substrates are removed from the processing liquid.

[0014] A substrate processing method according to a sixth aspect is the substrate processing method according to the fifth aspect, wherein a driving torque applied to the substrate holding mechanism at the predetermined position is employed as the load.

[0015] A substrate processing method according to a seventh aspect is the substrate processing method according to the fifth aspect, wherein the load is a weight applied to the substrate holding mechanism at the predetermined position.

[0016] The substrate processing method according to the eighth aspect is a substrate processing method according to the first to fourth aspects, in which the presence or absence is determined based on the time-dependent value of the load during a time period in which the substrate holding mechanism lifts the plurality of substrates from a first position to a second position that is farther from the processing liquid than the first position.

[0017] A substrate processing method according to a ninth aspect is the substrate processing method according to the eighth aspect, wherein a driving torque applied to the substrate holding mechanism during the time period is employed as the load.

[0018] A substrate processing method according to a tenth aspect is the substrate processing method according to the eighth aspect, wherein the load is a weight acting on the substrate holding mechanism during the time period.

[0019] A substrate processing method according to an eleventh aspect is a substrate processing method according to the first aspect, in which the presence or absence is determined by inputting the load values ​​over time into a trained model generated from a training dataset based on the load values ​​over time for multiple substrates that have already been processed with the processing liquid and have been determined to have no defects.

[0020] A substrate processing apparatus according to a twelfth aspect includes a processing tank that stores a processing liquid in which multiple substrates are immersed and that processes the multiple substrates collectively; a substrate holding mechanism that holds the multiple substrates collectively and has a first function of removing the multiple substrates from the processing liquid and a second function of immersing the multiple substrates in the processing liquid; and a judgment unit that judges whether or not the multiple substrates are damaged during processing using the processing tank based on a value that is the value of the load applied to the substrate holding mechanism when the first function is performed. [Effects of the Invention]

[0021] According to the substrate processing method and substrate processing apparatus of the present disclosure, damage or missing substrates can be determined for each processing tank without the need to capture an image of the processing tank, and the influence of light reflected by the surface of the processing liquid is small. [Brief explanation of the drawings]

[0022] [Figure 1] 1 is a plan view schematically showing an example of a configuration of a substrate processing apparatus according to an embodiment; [Figure 2] FIG. 10 is a side view showing a transfer cassette and a plurality of processing sections. [Figure 3]FIG. 2 is a side view illustrating the configuration of a transport mechanism. [Figure 4] 3 is a side view showing the immersion of a substrate in a processing liquid stored in a processing tank and the removal of the substrate from the processing liquid. FIG. [Figure 5] 3 is a side view showing the immersion of a substrate in a processing liquid stored in a processing tank and the removal of the substrate from the processing liquid. FIG. [Figure 6] 10 is a flowchart showing a first immersion process. [Figure 7] FIG. 10 is a side view showing the position where the load cell is arranged. [Figure 8] FIG. 2 is a block diagram illustrating an example of the connection relationship between a control unit and its peripherals. [Figure 9] 10 is a flowchart showing a first determination process. [Figure 10] 10 is a flowchart showing a second determination process. [Figure 11] FIG. 4 is a diagram schematically showing the value of the driving torque over time. [Figure 12] 10 is a flowchart showing a second immersion treatment. [Figure 13] 10 is a flowchart showing a third determination process. [Figure 14] 10 is a flowchart showing a learning process. [Figure 15] FIG. 1 is a schematic diagram illustrating generation of a trained model. [Figure 16] 10 is a flowchart showing a fourth determination process. [Figure 17] FIG. 2 is a block diagram illustrating a connection relationship between a control unit and an external device. DETAILED DESCRIPTION OF THE INVENTION

[0023] Hereinafter, embodiments will be described with reference to the accompanying drawings. Note that the drawings are schematic, and components are omitted or simplified as appropriate for the convenience of explanation. The relative sizes and positions of components shown in the drawings are not necessarily accurately depicted and may be changed as appropriate.

[0024] In the following description, the same components are denoted by the same reference numerals and have the same names and functions, and therefore detailed descriptions thereof may be omitted to avoid duplication.

[0025] In the following description, even if ordinal numbers such as "first" or "second" are used, these terms are used for convenience to facilitate understanding of the contents of the embodiments, and are not limited to the order that may result from these ordinal numbers.

[0026] When an expression indicating a relative or absolute positional relationship (for example, "in one direction," "along one direction," "parallel," "orthogonal," "center," "concentric," "coaxial," etc.) is used, unless otherwise specified, the expression not only expresses the exact positional relationship, but also expresses a state in which there is a relative displacement in terms of angle or distance within a range in which a tolerance or equivalent functionality is obtained. When an expression indicating an equal state (for example, "identical," "equal," "homogeneous," etc.) is used, the expression not only expresses a state in which there is an exact quantitative equivalence, but also expresses a state in which there is a difference in which a tolerance or equivalent functionality is obtained, unless otherwise specified.

[0027] When an expression indicating a shape (for example, "rectangular shape" or "cylindrical shape") is used, unless otherwise specified, the expression not only represents the shape in a strict geometrical sense, but also represents a shape that has, for example, irregularities or chamfers, within the scope of achieving the same effect.

[0028] When the expression "comprises," "includes," "has," "includes," or "has" is used with respect to one element, the expression is not an exclusive expression that excludes the presence of other elements.

[0029] Unless otherwise specified, the expression "connected" includes a state in which two elements are in contact with each other, as well as a state in which two elements are separated by another element.

[0030] When the phrase "at least one of A, B, and C" is used, the phrase includes A only, B only, C only, any two of A, B, and C, and all of A, B, and C.

[0031] <Outline of the configuration of the substrate processing apparatus> FIG. 1 is a plan view schematically illustrating an example of the configuration of a substrate processing apparatus 1 according to an embodiment. To unify the directions in the following figures, a right-handed XYZ Cartesian coordinate system is set as shown in FIG. 1. Here, the XY plane represents the horizontal plane. The Z axis represents the vertical axis, and more specifically, the Z direction is the vertically upward direction. The -X direction is the direction opposite to the X direction, the -Y direction is the direction opposite to the Y direction, and the -Z direction is the direction opposite to the Z direction.

[0032] The substrate processing apparatus 1 is a batch processing apparatus that collectively processes a plurality of substrates W. The substrate processing apparatus 1 includes a mounting unit 2, a robot 4, a posture conversion mechanism 5, a pusher 6, a transport mechanism 8, a processing unit 10, a transfer cassette 11, and a control unit 9.

[0033] The control unit 9 can, for example, comprehensively control the operation of the substrate processing apparatus 1. The control unit 9 has, for example, a calculation unit, a memory, a storage unit, etc. The calculation unit is, for example, configured with one or more central processing units (CPUs), etc. The calculation unit will be described later as a calculation unit 901.

[0034] The memory is configured, for example, by a volatile storage medium such as RAM (Random Access Memory). The storage unit is configured, for example, by a non-volatile storage medium such as a hard disk drive (HDD) or a solid state drive (SSD). The storage unit can store, for example, programs and various information. The calculation unit can realize various functions, for example, by reading and executing programs stored in the storage unit. At this time, the RAM is used, for example, as a workspace, and stores information that is temporarily generated or acquired. The memory and storage unit will be described later as a storage unit 902.

[0035] At least a part of the functional configuration realized by the control unit 9 may be realized by hardware such as a dedicated electronic circuit, for example.

[0036] The mounting section 2 has a function to mount a storage container F thereon. The storage container F has a function to store a plurality of substrates W. The storage container F is placed on the mounting section 2 while storing unprocessed substrates W, or while empty, to store processed substrates W. An example of a storage container F is a FOUP (Front Opening Unified Pod) configured to store a plurality of horizontally oriented substrates W (for example, 25 substrates W) stacked in the Z direction.

[0037] The processing space 3 is adjacent to the mounting part 2 on the Y-direction side. In the processing space 3, a robot 4, a posture conversion mechanism 5, a pusher 6, a transport mechanism 8, a processing unit 10, and a delivery cassette 11 are arranged.

[0038] FIG. 2 is a side view of the processing unit 10 and the delivery cassette 11 as viewed along the -X direction.

[0039] The mounting part 2 and the processing space 3 are separated by a partition wall (not shown) equipped with a shutter that can be opened and closed. The shutter is opened and closed under the control of the control unit 9, spatially separating the mounting part 2 and the processing space 3 or connecting them to each other. With the mounting part 2 and the processing space 3 connected to each other, unprocessed substrates W are carried in from the storage container F to the processing space 3, and processed substrates W are carried out to the storage container F.

[0040] The substrates W are transported in and out between the process space 3 and the storage container F by a robot 4. The robot 4 is configured to be able to rotate freely in a horizontal plane. With its shutter open, the robot 4 transfers multiple substrates W between the attitude conversion mechanism 5 and the storage container F. This transfer is schematically indicated by an outline arrow.

[0041] The posture conversion mechanism 5 converts the posture of the substrates W from a horizontal posture to an upright posture after receiving the substrates W from the storage container F via the robot 4. The posture conversion mechanism 5 converts the posture of the substrates W from an upright posture to a horizontal posture before transferring the substrates W to the storage container F via the robot 4.

[0042] The processing unit 10 is disposed on the opposite side of the robot 4 (the -X direction side in the figure) with respect to the posture conversion mechanism 5. The transport mechanism 8 is disposed on the opposite side of the processing unit 10 from the posture conversion mechanism 5 (the -X direction side in the figure).

[0043] Processing unit 10 includes processing sections 101, 102, 103, 104, and 105 arranged in this order in one direction (the -Y direction in the figure). Transport mechanism 8 is movable horizontally from a position facing pusher 6 (hereinafter referred to as the "standby position") along the direction in which processing sections 101, 102, 103, 104, and 105 are arranged and along the opposite direction.

[0044] The pusher 6 is disposed between the attitude changing mechanism 5 and the transport mechanism 8. The pusher 6 transfers a plurality of substrates W in an upright attitude between the attitude changing mechanism 5 and a stage 12, which will be described later.

[0045] 3 is a side view illustrating the configuration of the transport mechanism 8. The transport mechanism 8 includes a pair of arms 81. Depending on the position of the pair of arms 81, it is possible to switch between holding a plurality of substrates W collectively and releasing this holding. The arms 81 swing about a horizontal axis in directions in which their lower edges approach each other, thereby clamping and holding a plurality of substrates W collectively. The arms 81 swing about a horizontal axis in directions in which their lower edges move away from each other, thereby releasing the holding of the plurality of substrates W.

[0046] For example, the transport mechanism 8 includes a rod 83 and a pair of connecting parts 82. One connecting part 82 connects one end of the rod 83 to one arm 81. The other connecting part 82 connects the other end of the rod 83 to the other arm 81. The pair of arms 81 are supported at both ends of the rod 83 by the connecting parts 82 and swing as described above.

[0047] Since the transport mechanism 8 is movable in both the Y and −Y directions, the pair of arms 81 are positioned at positions facing each of the processing sections 101, 102, 103, 104, and 105 (hereinafter also referred to as “processing positions”) and at standby positions.

[0048] 2, the solid lines indicate the case where the transport mechanism 8 is at a position facing the processing section 104. In FIG. 2, the dashed lines indicate the case where the transport mechanism 8 is at a standby position and at a position facing the processing sections 101, 103, 104, and 105.

[0049] At the standby position, the substrate W can be transferred between the attitude changing mechanism 5 and the arm 81 via the pusher 6 .

[0050] The pusher 6 delivers the substrate W to and from the transport mechanism 8 via a stage 12 that moves up and down in a delivery cassette 11 .

[0051] 2, the stage 12 that is still positioned at the upper side after the substrate W has already been transported to the processing section 105 is illustrated by a solid line, and the stage 12 that is positioned at the lower side is illustrated by a chain line.

[0052] The processing unit 10 has elevators 40a, 40b, and 40c. A lifter 20a is attached to the elevator 40a. A lifter 20b is attached to the elevator 40b. A lifter 20c is attached to the elevator 40c. Each of the lifters 20a, 20b, and 20c functions as a substrate holding mechanism for holding multiple substrates W.

[0053] In the following description, when there is no need to distinguish between the lifters 20a, 20b, and 20c, for example, in the description of common functions, the name lifter 20 may be used to refer to the lifters 20a, 20b, and 20c without distinction.

[0054] In the following description, when there is no need to distinguish between elevators 40a, 40b, and 40c, for example, when describing common functions, elevator 40 may be used as the name to refer to elevators 40a, 40b, and 40c without distinguishing between them.

[0055] The elevator 40a and the lifter 20a are movable in either the Y direction or the −Y direction between the processing sections 103 and 104, and are positioned at processing positions corresponding to the processing sections 103 and 104. The elevator 40a and the lifter 20a are used for processing the substrate W in the processing sections 103 and 104.

[0056] The elevator 40b and the lifter 20b are movable in either the Y direction or the −Y direction between the processing sections 101 and 102, and are positioned at processing positions corresponding to the processing sections 101 and 102. The elevator 40b and the lifter 20b are used for processing the substrate W in the processing sections 101 and 102.

[0057] The elevator 40c and the lifter 20c are used to process the substrate W in the processing section 105.

[0058] In the processing units 101 and 103, the substrate W is processed with, for example, a chemical solution as a processing liquid. In the processing units 102 and 104, for example, the chemical solution on the substrate W is rinsed (hereinafter referred to as "cleaning"). In the processing unit 105, for example, a drying process is performed.

[0059] The processing section 101 includes processing tanks 101a and 101b. The processing section 103 includes processing tanks 103a and 103b. The processing tanks 101a, 101b, 103a, and 103b are open in the Z direction. The processing tanks 101a and 103a store a predetermined chemical liquid for collectively processing a plurality of substrates W.

[0060] The treatment tank 101a is provided with a circulation pipe 101c. The circulation pipe 101c is a path through which the chemical solution stored in the treatment tank 101a is circulated by, for example, a pump (not shown). The treatment tank 103a is provided with a circulation pipe 103c. The circulation pipe 103c is a path through which the chemical solution stored in the treatment tank 103a is circulated by, for example, a pump (not shown).

[0061] The treatment tank 101b surrounds the treatment tank 101a and receives the chemical solution overflowing from the treatment tank 101a. The treatment tank 103b surrounds the treatment tank 103a and receives the chemical solution overflowing from the treatment tank 103a.

[0062] The substrate W immersed in the chemical solution stored in the processing tank 101a is processed by the chemical solution. The substrate W immersed in the chemical solution stored in the processing tank 103a is processed by the chemical solution. It does not matter whether the chemical solutions stored in the processing tanks 101a and 103a are different from each other. For example, the processing tanks 101a and 103a are also called "CHBs (chemical baths)."

[0063] The processing unit 102 includes a processing tank 102a. The processing unit 104 includes a processing tank 104a. The processing tanks 102a and 104a are open in the Z direction. For example, the processing tanks 102a and 104a are also referred to as "ONB (ONe Bath)." The processing tank 102a stores a rinse liquid (e.g., pure water) that is a processing liquid used to rinse the chemical liquid stored in the processing tank 101a from the substrate W. The processing tank 104a stores a rinse liquid (e.g., pure water) that is a processing liquid used to rinse the chemical liquid stored in the processing tank 103a from the substrate W. The substrate W immersed in the rinse liquid stored in the processing tank 102a is cleaned by the rinse liquid. The substrate W immersed in the rinse liquid stored in the processing tank 104a is cleaned by the rinse liquid.

[0064] The processing tank 102a is provided with a circulation pipe 102c. The circulation pipe 102c is a path through which the rinse liquid stored in the processing tank 102a is circulated by, for example, a pump (not shown). The processing tank 104a is provided with a circulation pipe 104c. The circulation pipe 104c is a path through which the rinse liquid stored in the processing tank 104a is circulated by, for example, a pump (not shown).

[0065] The processing unit 105 dries the substrate W by supplying an organic solvent, such as isopropyl alcohol, to the substrate W in a reduced pressure atmosphere. The processing unit 105 includes a processing tank 105a. The processing tank 105a stores, for example, isopropyl alcohol. The processing tank 105a is provided with a circulation pipe 105c. The circulation pipe 105c is a path through which the organic solvent stored in the processing tank 105a is circulated by, for example, a pump (not shown).

[0066] The immersion of the substrate W in and removal from the processing liquid stored in the processing tanks 103a and 104a is achieved by the elevator 40a and the lifter 20a. The elevator 40a has the functions of immersing the lifter 20a in the chemical liquid stored in the processing tank 103a, removing the lifter 20a from the chemical liquid, immersing the lifter 20a in the rinse liquid stored in the processing tank 104a, and removing the lifter 20a from the rinse liquid.

[0067] The immersion of the substrate W in and removal from the processing liquid stored in the processing tanks 101a and 102a is achieved by the elevator 40b and the lifter 20b. The elevator 40b has the functions of immersing the lifter 20b in the chemical liquid stored in the processing tank 101a, removing the lifter 20b from the chemical liquid, immersing the lifter 20b in the rinse liquid stored in the processing tank 102a, and removing the lifter 20b from the rinse liquid.

[0068] The substrate W is loaded into and unloaded from the processing section 105 by the transport mechanism 8, the elevator 40c, and the lifter 20c.

[0069] Lifter 20a is raised in the Z direction by elevator 40a to a position above processing baths 103b and 104a, and transfers a plurality of substrates W between it and the transport mechanism 8. Lifter 20b is raised in the Z direction by elevator 40b to a position above processing baths 101b and 102a, and transfers a plurality of substrates W between it and the transport mechanism 8. Lifter 20c is raised in the Z direction by elevator 40c to a position above processing unit 105, and transfers a plurality of substrates W between it and the transport mechanism 8.

[0070] Specifically, for example, in this state, the transport mechanism 8 moves to the processing position and is aligned with one of the lifters 20c, 20b, and 20a in the X direction, and the transfer is carried out by the above-mentioned holding and release.

[0071] 2, the solid lines illustrate cases where the lifter 20c holding the substrate W is located above (in the Z direction) the processing tank 105a in the processing section 105, the lifter 20a holding the substrate W is located above the processing tank 104a in the processing section 104, and the lifter 20b is located above the processing tank 101a. The transport mechanism 8 can move downward to the vicinity of the processing tank 105a, as illustrated by the chain lines.

[0072] 2, the following cases are illustrated by dashed lines: when lifter 20a holding a substrate W is immersed in the rinse liquid in processing tank 104a in processing unit 104; when lifter 20a is positioned above processing tank 103b without holding a substrate W; and when lifter 20b is positioned above processing tank 102a without holding a substrate W. The following cases are omitted from the illustration: when lifter 20a is immersed in the chemical liquid in processing tank 103a; when lifter 20b is immersed in the rinse liquid in processing tank 102a; when lifter 20b is immersed in the chemical liquid in processing tank 101a; and when lifter 20c is located in processing tank 105a.

[0073] Fig. 4 is a side view, viewed along the -X direction, showing the immersion of a substrate W in the processing liquid stored in the processing tank 104a and the removal of the substrate W from the processing liquid. Fig. 5 is a side view, viewed along the Y direction, showing the immersion of a substrate W in the processing liquid stored in the processing tank 104a and the removal of the substrate W from the processing liquid.

[0074] To avoid complication of the illustration, the elevator 40a is omitted in Figures 2 and 4. Figures 4 and 5 illustrate a case where a rinse liquid Q is stored in the processing tank 104a.

[0075] 4 and 5, the state in which the substrate W is immersed in the rinse liquid Q together with the lifter 20a is shown using a dashed line. In Figures 4 and 5, the state in which the substrate W is being removed from the rinse liquid Q together with the lifter 20a is shown using a solid line, regardless of whether it is before or after immersion. In Figure 4, the dashed line two-dots schematically shows the transition between the state in which the substrate W is being removed from the rinse liquid Q together with the lifter 20a and the state in which the substrate W is immersed in the rinse liquid Q.

[0076] The lifter 20a includes a plurality of rods 21 and plates 22. For example, the lifter 20a includes three rods 21. Each of the rods 21 supports a plurality of substrates W at intervals. For example, each of the rods 21 is provided with 25 grooves spaced apart from one another in an X direction, although this is not shown in the drawing.

[0077] Plate 22 extends, for example, perpendicular to the X direction. The ends of all rods 21 (for example, the ends in the -X direction) are connected to plate 22. By including multiple rods 21 and plates 22, lifter 20a has the function of holding multiple substrates W. Lifters 20b and 20c are configured similarly to lifter 20a and have the function of holding multiple substrates W.

[0078] Referring to FIG. 5, the elevator 40 a includes a support piece 41 , an elevator guide 42 , a motor 43 , and a servo amplifier 44 .

[0079] The support piece 41 supports the plate 22 of the lifter 20a from the -X direction side. The lifting guide 42 guides the lifting and lowering of the support piece 41, specifically, the movement of the support piece 41 in the Z direction and the -Z direction. For example, the lifting guide 42 has a ball screw connected to the rotating shaft of the motor 43 and a rod (neither of which is shown) with a tap that fits onto the ball screw and to which the plate 22 is connected. The motor 43 is driven by a servo amplifier 44 under the control of the control unit 9 to lift and lower the support piece 41. The control unit 9 controls the motor 43 via the servo amplifier 44 to move the lifter 20a to a predetermined position.

[0080] For example, the motor 43 is a servo motor. The servo amplifier 44 drives the motor 43 upon receiving a rotation command from the control unit 9, and also transmits information from the motor 43 to the control unit 9 regarding the vertical position of the support piece 41, and therefore the vertical position of the lifter 20a.

[0081] The elevators 40b and 40c are configured similarly to the elevator 40a, and raise and lower the lifters 20b and 20c, respectively, to move them to predetermined positions.

[0082] <Transfer of substrates between the lifter and the transport mechanism> The flow of processing of the substrate W in the processing units 101, 102, 103, 104, and 105 is exemplified by the following divided steps: (i) The pusher 6 delivers the substrate W to the transport mechanism 8; (ii) The transport mechanism 8 moves in the Y direction to a processing position for the processing section 101; (iii) The substrate W is delivered from the transport mechanism 8 to the lifter 20b located above the processing bath 101a by the elevator 40b; (iv) The elevator 40b lowers the lifter 20b, and the lifter 20b and the substrate W held by it are immersed in the chemical solution stored in the processing bath 101a; (v) The elevator 40b raises the lifter 20b, and the lifter 20b and the substrate W held by it are removed from the chemical solution stored in the processing bath 101a; (vi) elevator 40b moves in the −Y direction to a processing position relative to processing section 102; (vii) The elevator 40b lowers the lifter 20b, and the lifter 20b and the substrate W held by it are immersed in the rinse liquid stored in the processing bath 102a; (viii) The elevator 40b raises the lifter 20b, and the lifter 20b and the substrate W held by it are removed from the rinse liquid stored in the processing bath 102a; (ix) the transport mechanism 8 moves to a processing position for the processing section 102; (x) The substrate W is transferred from the lifter 20b positioned above the processing bath 102a to the transport mechanism 8 by the elevator 40b; (xi) The transport mechanism 8 moves in the −Y direction to a processing position for the processing section 103; (xii) The substrate W is delivered from the transport mechanism 8 to the lifter 20a located above the processing bath 103a by the elevator 40a; (xiii) The elevator 40a lowers the lifter 20a, and the lifter 20a and the substrate W held by it are immersed in the chemical solution stored in the processing bath 103a; (xiv) The elevator 40a raises the lifter 20a, and the lifter 20a and the substrate W held by it are removed from the chemical solution stored in the processing bath 103a; (xv) elevator 40a moves in the −Y direction to a processing position relative to processing section 104; (xvi) The elevator 40a lowers the lifter 20a, and the lifter 20a and the substrate W held by it are immersed in the rinse liquid Q stored in the processing bath 104a; (xvii) The elevator 40a raises the lifter 20a, and removes the lifter 20a and the substrate W held thereon from the rinse liquid Q; (xviii) the transport mechanism 8 moves to a processing position for the processing section 104; (xix) The substrate W is transferred from the lifter 20a located above the processing bath 104a to the transfer mechanism 8 by the elevator 40a; (xx) The transport mechanism 8 moves in the −Y direction to a processing position for the processing unit 105; (xxi) The elevator 40c delivers the substrate W from the transport mechanism 8 to the lifter 20c located above the processing section 105; (xxii) The lifter 20c puts the substrate W into the processing section 105, where the substrate W is dried.

[0083] <Determining whether or not there is damage to the board> This embodiment describes a technique for determining whether or not a substrate W is damaged during processing using the processing tank 100. The processing tank 100 is a name that refers to the processing tanks 101a, 102a, 103a, and 104a without distinction.

[0084] From the above description, it can be said that the processing tank 100 stores a processing liquid in which a plurality of substrates W are immersed to collectively process the plurality of substrates W. When the processing tank 100 corresponds to the processing tanks 101a and 103a, the processing liquid is the above-mentioned chemical liquid. When the processing tank 100 corresponds to the processing tanks 102a and 104a, the processing liquid is the above-mentioned rinse chemical liquid.

[0085] The lifter 20 is a mechanism having the function of collectively holding a plurality of substrates W, and functions as a substrate holding mechanism. The substrate holding mechanism has a first function of removing the substrates W from the processing liquid and a second function of immersing the substrates W in the processing liquid.

[0086] In this embodiment, the presence or absence of damage to the substrate W during processing using the processing bath 100 is determined based on the load applied to the substrate holding mechanism when the first function is exercised. Specific examples of when the lifter 20 exercises the first function include the above-mentioned steps (v), (viii), (xiv), and (xvii).

[0087] <Determination based on before and after processing of substrates W from the same lot> 6 is a flowchart showing a group of steps employed in a process of immersing a substrate W in a processing liquid and removing it from the processing liquid (hereinafter also referred to simply as an "immersion process"). The group of steps includes steps S11, S12, S13, S14, S15, S51, S52, and S53. In FIG. 6, the immersion process employing this group of steps is indicated as a "first immersion process."

[0088] Step S11 is a step of placing the substrate W on the lifter 20. When the processing tank 100 corresponds to the processing tanks 101a and 103a, step S11 corresponds to the above-mentioned steps (iii) and (xii). Such placement is performed by the transport mechanism 8. When the processing tank 100 corresponds to the processing tanks 102a and 104a, step S11 is omitted.

[0089] After step S11 is performed, step S51, which will be described later, is further performed, and then step S12 is performed. Step S12 is a step of immersing the substrate W in the processing liquid stored in the processing tank 100. Step S12 corresponds to the second function, and corresponds to the above-mentioned steps (iv), (vii), (xiii), and (xvi).

[0090] Step S13 is a process for ensuring the time required for processing the substrate W in the processing bath 100. In step S13, it is determined whether a predetermined time has elapsed since step S12 was performed. If the determination is negative, that is, if the predetermined time has not elapsed since step S12 was performed, step S13 is repeatedly performed. If the determination is positive, that is, if the predetermined time has elapsed since step S12 was performed, step S14 is performed.

[0091] Step S14 is a step of lifting up the substrate W from the processing tank 100. By this lifting, the substrate W is removed from the processing liquid stored in the processing tank 100. Step S14 corresponds to the first function, and corresponds to the above-mentioned steps (v), (viii), (xiv), and (xvii).

[0092] The above-described immersion of the substrate W in the processing liquid and removal of the substrate W from the processing liquid are achieved by raising and lowering the elevator 40. From this perspective, the combination of the elevator 40a and the lifter 20a can be regarded as a substrate holding mechanism, and the combination of the elevator 40b and the lifter 20b can be regarded as a substrate holding mechanism.

[0093] After step S14 is executed, steps S52 and S53 (described later) are further executed, and then step S15 is executed. However, step S53 can be omitted, and the box representing step S53 is indicated by a dashed line.

[0094] Step S15 is a step of moving the substrate W from the lifter 20. More specifically, step S15 is a step of transferring the substrate W from the lifter 20 to the transport mechanism 8. Step S15 corresponds to the above-mentioned steps (x) and (xix). Such transfer is performed by the transport mechanism 8. When the processing tank 100 corresponds to the processing tank 101a or 103a, step S15 is omitted.

[0095] Step S51 is performed before step S12 is performed. Step S51 is performed while the lifter 20 is holding the substrate W. When the processing tank 100 corresponds to the processing tank 101a or 103a, step S11 is performed before step S51. When the processing tank 100 corresponds to the processing tank 102a, step S51 is performed after the lifter 20b is positioned above the processing tank 102a in step (vi). When the processing tank 100 corresponds to the processing tank 104a, step S51 is performed after the lifter 20a is positioned above the processing tank 104a in step (xv).

[0096] Step S52 is executed after step S14 and before step S15 is executed. Step S52 is executed while the lifter 20 is holding the substrate W.

[0097] Steps S51 and S52 are both steps for measuring the load on the lifter 20 (hereinafter also referred to as "the load on the lifter 20"). Hereinafter, the value of the load measured in step S51 will be described as a first value, and the value of the load measured in step S52 will be described as a second value.

[0098] In step S52, the load on the lifter 20 that holds the substrate W removed in step S14 is measured, so the second value can be said to be the load applied to the substrate holding mechanism when the first function is exercised.

[0099] In step S51, the load before the substrate W is immersed in the processing liquid in step S12 is measured, and therefore the first value can be said to be the load applied to the substrate holding mechanism before the substrate W is immersed.

[0100] Steps S51 and S52 are performed, for example, when the lifter 20 is at its highest position. Alternatively, either or both of steps S51 and S52 may be performed in a situation where the substrate W is not immersed in the processing liquid. For example, step S51 may be performed at a position where the lifter 20 is partway down before the substrate W is immersed in the processing liquid. Step S52 may be performed at a position where the lifter 20 is partway up after the substrate W is removed from the processing liquid.

[0101] For example, the load on the lifter 20 at a predetermined position after the substrate W has been removed from the processing liquid can be used as the second value. The motor 43 is driven by the servo amplifier 44, and the elevator 40 is raised and lowered by the motor 43. The lifter 20 can be moved to a predetermined position by the servo amplifier 44 under the control of the control unit 9.

[0102] <Transformation of the first value> For example, in the first immersion process, step S12 is performed on the assumption that the substrates W immersed in the processing liquid are free of defects. If such an assumption is adopted, step S51 can be omitted, and a reference value can be adopted as the first value. The reference value is a value that serves as a reference for the second value. For example, the load acting on the lifter 20 when multiple substrates W without defects are held on the lifter 20 can be measured or estimated in advance, and the value of the load can be adopted as the reference value for the second value, and ultimately as the first value described above.

[0103] <Evaluation of load by weight> The load on the substrate holding mechanism can be evaluated by the weight on the lifter 20. FIG. 7 is a side view showing the position where the load cell 50 is disposed. The load cell 50 is provided between the support piece 41 and the lifter 20. The load cell 50 measures the weight on the lifter 20. This weight reflects the load on the lifter 20. The information about the weight obtained from the load cell 50 can be used to obtain the first and second values ​​described above.

[0104] As will be described later, there are cases where the load is evaluated by a measurement value other than weight, in which case there is no need for the load cell 50. From this perspective, the load cell 50 is omitted in FIG.

[0105] 8 is a block diagram illustrating the connection relationship between the control unit 9 and its peripherals when the load cell 50 is provided. The control unit 9 includes a calculation unit 901, a storage unit 902, and an input / output interface 903.

[0106] The input / output interface 903 exchanges information with the servo amplifier 44, the load cell 50, and the transport mechanism 8. The input / output interface 903 also exchanges information with other components of the substrate processing apparatus 1, such as the elevators 40a, 40b, and 40c, the robot 4, the attitude conversion mechanism 5, the pusher 6, and other components, but such exchanges are omitted from FIG.

[0107] The storage unit 902 stores various information. The calculation unit 901 performs calculations using the information stored in the storage unit 902 and / or the information of data input from the input / output interface 903.

[0108] The load cell 50 provides data indicating the measured first and second values ​​to the calculation unit 901 via the input / output interface 903. The calculation unit 901 determines whether or not there is damage to the substrate W during processing using the processing tank 100, based on the difference between the first and second values. If the difference between the first value and the second value is greater than a predetermined range, it is estimated that the substrate W itself, or a part of it, will remain in the processing tank 100. When it is estimated that such a residue exists, it is reasonable to determine that the substrate W pulled out of the processing tank 100 has a defect. Determining whether or not there is a defect in the pulled-out substrate W directly leads to determining whether or not there is a defect in the substrate W during processing using the processing tank 100 that stores the processing liquid from which the substrate W was removed.

[0109] In step S14, some of the processing liquid may adhere to the lifter 20. This portion (hereinafter tentatively referred to as "carry-out liquid") affects the second value. The weight of the carry-out liquid depends on, for example, the type of processing liquid, the hydrophilicity or hydrophobicity of the surface of the substrate W, the number of substrates W held on the lifter 20, and the time for which the substrates W are immersed in the processing liquid. For example, the time interval from step S14 to step S52 also affects the second value due to the carry-out liquid evaporating and dripping from the lifter 20. From this perspective, the presence or absence of a defect is determined depending on whether the difference between the first value and the second value is within a predetermined range.

[0110] 9 is a flowchart showing a group of steps of a first determination process, which is an example of the above-mentioned determination. The group of steps includes steps S101, S102, and S103. The first determination process is executed, for example, by the control unit 9. The control unit 9 functions as a determination unit that performs the above-mentioned determination.

[0111] Step S101 is a step of determining whether the difference between the first value and the second value is within a predetermined range. The determination is negative when there is a large difference in the load on the lifter 20 before and after immersion in the processing liquid. If the determination in step S101 is negative, then in step S102 it is determined that the pulled-up substrate W has a defect, and the first determination process ends.

[0112] The determination is affirmative when there is no significant difference in the load on the lifter 20 before and after immersion in the processing liquid. If the determination in step S101 is affirmative, it is determined in step S103 that the pulled-up substrate W is free of defects, and the first determination process ends.

[0113] The first determination process determines whether or not the pulled-up substrate W has any damage, and therefore determines whether or not the substrate W has any damage in the process using the processing liquid in which the pulled-up substrate W is immersed.

[0114] According to the first determination process, the load on the lifter 20 is evaluated before and after immersion in the processing liquid. Therefore, damage or loss of the substrate W is determined for each processing tank 100. In addition, there is no need to capture an image of the processing tank 100, and the influence of reflected light from the surface of the processing liquid is small.

[0115] According to the first determination process, the above determination is performed for each substrate W (hereinafter referred to as a "lot") that is collectively processed in the same processing bath 100. Therefore, there is no need to refer to the results of other lots, as will be described later.

[0116] <Load estimation by torque> The load on the lifter 20 is evaluated using, for example, the drive torque applied to the lifter 20 from the motor 43 instead of or in addition to the weight on the lifter 20. The drive torque is reflected in the value of the current supplied to the motor 43 by the servo amplifier 44. The value of this current is given to the calculation unit 901 via the input / output interface 903 and is used to calculate the load in the calculation unit 901. If the weight on the lifter 20 is not used in load evaluation, the load cell 50 may be omitted.

[0117] <Determination using data from different lots> The following describes a case in which data from a plurality of substrates W (hereinafter tentatively referred to as the "current lot") that have already been processed in the same processing tank 100 prior to the plurality of substrates W (hereinafter tentatively referred to as the "current lot") that are the subject of judgment in the same processing tank 100 is used.

[0118] For example, as explained in "<Modification of the First Value>" above, the second value in a previous lot that had no defects can be used as the reference value for the second value used as the first value. In this case, it is desirable to store the second value in the previous lot and compare it with the second value in the current lot. FIG. 6 shows step S53 in the first immersion process. Step S53 is executed after step S52. Step S53 can be executed before or after step S15.

[0119] The current lot is a preceding lot with respect to a plurality of substrates W (hereinafter referred to as "subsequent lots") that will be processed in the same processing tank 100 following the current lot. Storing the second value in step S53 is a preparation for adopting the stored second value as the first value for the subsequent lot. For example, the second value is stored in the storage unit 902.

[0120] 10 is a flowchart showing a group of steps of the second determination process, which is an example of determining whether or not there is a defect in the pulled-up substrate W. The group of steps includes steps S201, S202, S203, and S204. The second determination process is executed by, for example, the control unit 9. The control unit 9 functions as a determination unit that performs the above-mentioned determination.

[0121] Step S201 is a process for determining whether there is a defect in the immersion process of the preceding lot. This determination may be made, for example, using the results of the first determination process, the results of the second determination process for other substrates W, or visual inspection of the presence or absence of defects. If the determination is positive, there was a defect in the immersion process of the preceding lot, and the second value stored for the preceding lot is not appropriate as the reference value for the second value of the current lot. In this case, the second determination process ends.

[0122] If the determination in step S201 is negative, the second value stored for the preceding lot is adopted as the reference value for the second value of the current lot. Specifically, step S202 is executed. Step S202 is a step of determining whether the difference between the second value of the preceding lot and the second value of the current lot is within a predetermined range. Step S202 can be said to be a step of adopting the second value for the preceding lot that was free of defects instead of the first value in step S101 of the first determination process.

[0123] If the determination result in step S202 is positive, then in step S204, it is determined that there is no defect in the pulled-up substrate W, similar to step S103 of the first determination process. If the determination result in step S202 is negative, then in step S203, it is determined that there is a defect in the pulled-up substrate W, similar to step S102 of the first determination process.

[0124] The second determination process also determines whether the substrate W is damaged or missing for each processing tank 100. Furthermore, there is no need to capture an image of the processing tank 100, and the influence of light reflected by the surface of the processing liquid is small.

[0125] <Determination using load history> The load may be the value of the load over time during a time period when the substrate W is lifted from a first position to a second position (the second position being farther from the processing liquid than the first position). For example, the presence or absence of a defect in the substrate W may be determined based on the value of the load over time (hereinafter tentatively referred to as the "load history") during a time period when the lifter 20 lifts the substrate W from a position immersed in the processing liquid (hereinafter referred to as the "low position") to a position for delivery to the transport mechanism 8 or the highest position of the lifter 20 (hereinafter referred to as the "high position").

[0126] The load may be the weight applied to the lifter 20 or the drive torque (hereinafter simply referred to as "torque"). The following mainly describes the case where the torque value over time in the relevant time period (hereinafter tentatively referred to as "torque history") is used.

[0127] FIG. 11 is a diagram showing a load history 71 as a torque load. In FIG. 11, the horizontal axis represents time and the vertical axis represents torque. Before time ts, the lifter 20 is in a low position, and after time te, the lifter 20 is in a high position. From time ts to time te, the lifter 20 rises.

[0128] Graph T1 shows the torque history when there is no defect in the substrate W. Graph T2 shows the torque history when there is a defect in the substrate W. Graph T0 shows the torque history at a high position when there is a larger defect in the substrate W than in the case illustrated in graph T2.

[0129] After time ts, graph T2 shows a smaller torque than graph T1. At a high position, graph T0 shows a smaller torque than graph T2. Such a difference in torque reflects that the larger the defect in the substrate W, the smaller the weight of the substrate W held by the lifter 20.

[0130] Determining whether or not there is a defect at a high position by comparing graph T1 (or graph T0) with graph T2 can be said to be equivalent to adopting the torque shown by graph T2 at a high position as the first value in the first determination process (see Figure 9).

[0131] When graph T2 is obtained for the preceding lot and graph T1 (or graph T0) is obtained for the current lot, determining whether or not there is a defect by comparing the two is equivalent to adopting the torque shown by graph T2 at a high position as the second value for the preceding lot in the second determination process (see Figure 10).

[0132] The time period during which the substrate W is lifted is, for example, part or all of the time period from time ts to time te.

[0133] In both graphs T1 and T2, the torque increases immediately after time ts, reaches a maximum value, then decreases and remains at a substantially constant value. This torque history reflects the fact that when the lifter 20 lifts the substrate W, the torque increases until it reaches a predetermined speed, after which the torque decreases and remains at a constant value to maintain the predetermined speed, and the torque decreases as the lifter 20 decelerates until it stops.

[0134] 12 is a flowchart showing the process group employed in the second immersion process. The process group includes steps S11, S12, S13, S14, S15, S54, S55, and S56. The second immersion process is an immersion process employed when determining the presence or absence of defects using the load history 71.

[0135] The contents and execution order of steps S11, S12, S13, S14, and S15 are the same as those of the first immersion process (see FIG. 6).

[0136] In the second immersion process, step S54 is executed after a positive determination is made in step S13. In step S54, measurement of the load, e.g., torque, of the lifter 20 is started. Thereafter, the load of the lifter 20 continues to be measured, and the time-dependent value of the load continues to be measured, until step S55, which will be described later, is executed.

[0137] When the measurement of the load is started in step S54, step S14 is executed. When step S14 is completed, step S55 is executed. In step S55, the measurement of the load of the lifter 20, for example, the torque, is completed.

[0138] When the load measurement is completed in step S55, step S56 is executed. In step S56, a load history 71 is stored as the load on the lifter 20 from when step S54 is executed until when step S55 is executed. The load history 71 is stored in the storage unit 902, for example.

[0139] After step S56 is performed, step S15 is performed. If steps S11 and S15 are omitted, the process is the same as the first immersion process.

[0140] 13 is a flowchart showing a group of steps of the third determination process, which is an example of determining whether or not there is a defect in the pulled-up substrate W. The group of steps includes steps S301, S302, S303, and S304. The third determination process is executed by, for example, the control unit 9. The control unit 9 functions as a determination unit that performs the above-mentioned determination.

[0141] Step S301 is a step for determining whether or not there is a defect in the immersion process of the preceding lot, similar to step S201 of the second determination process (FIG. 10). This determination is made, for example, using the result of the first determination process, the result of the second determination process, or the result of a third determination process that uses the presence or absence of defects in an even preceding lot, or by visual inspection.

[0142] If the determination is affirmative, then there was a defect in the immersion process of the preceding lot, and the load history 71 stored for the preceding lot is therefore not appropriate for comparison with the load history 71 of the current lot. In this case, the third determination process ends. Hereinafter, the load history 71 for the preceding lot will be described as load history 71f.

[0143] If the determination result of S301 is negative, step S302 is executed. In step S302, it is determined whether the difference between the load history 71f of the preceding lot and the load history 71 of the current lot is within a predetermined range. Step S302 can be said to be a process in which the load history is used instead of the second value of step S202 in the second determination process.

[0144] If the determination result in step S302 is positive, then in step S304, it is determined that there is no defect in the pulled-up substrate W, similar to step S103 of the first determination process and step S204 of the second determination process. If the determination result in step S302 is negative, then in step S303, it is determined that there is a defect in the pulled-up substrate W, similar to step S102 of the first determination process and step S203 of the second determination process.

[0145] The third determination process also determines whether the substrate W is damaged or missing for each processing tank 100. Furthermore, there is no need to capture an image of the processing tank 100, and the influence of light reflected by the surface of the processing liquid is small.

[0146] <Decision using a trained model> Using a trained model generated from the load history 71f of the preceding lot, it is possible to determine whether or not the pulled-up substrate W has any defects.

[0147] 14 is a flowchart showing the process group used in the learning process. The process group includes steps S61, S62, and S63, which are executed in this order. Step S61 is a process for generating a learning dataset 73. Specifically, the learning dataset 73 is generated based on a load history group 70 for a preceding lot that has been determined to have no defects.

[0148] FIG. 15 is a schematic diagram showing the generation of a trained model 72. As illustrated in FIG. 15, the load history group 70 is composed of multiple load histories 71(1), 71(2), ..., 71(n). All of the load histories 71(1), 71(2), ..., 71(n) are load histories 71f for a preceding lot that had no defects. For example, all of the load histories 71(1), 71(2), ..., 71(n) are torque histories.

[0149] The load history group 70 is provided to the calculation unit 901 via the input / output interface 903 and is stored in, for example, a memory unit 902. If the load histories 71(1), 71(2), ..., 71(n) are torque histories, they are, for example, current information input from the servo amplifier 44. The calculation unit 901 generates a learning data set 73 using the load history group 70 and stores it in, for example, the memory unit 902. The load history group 70 itself may be used as the learning data set 73.

[0150] Step S62 is a process of generating the trained model 72. For example, the calculation unit 901 generates the trained model 72 using the training data set 73 generated in step S61 or using the load history group 70 itself. It can be said that the trained model 72 is generated from the training data set 73 based on the load history group 70, which is the time-dependent values ​​of the load for multiple substrates W that have already been treated with a processing liquid and that have been determined to have no defects.

[0151] Step S63 is a process of storing the trained model 72. The trained model 72 generated in step S62 is stored in the storage unit 902, for example.

[0152] 16 is a flowchart showing a group of steps of a fourth determination process, which is an example of determining whether or not there is a defect in the pulled-up substrate W. The group of steps includes steps S401, S402, S403, and S404. The fourth determination process is executed by, for example, the control unit 9. The control unit 9 functions as a determination unit that performs the above-mentioned determination.

[0153] Step S401 is a process of inputting the load history 71 of the current lot to the trained model 72. For example, in FIG. 15, the load history 71 of the current lot is exemplified as load history 71(k) (where k≠1, 2, ..., n). If the load history 71(k) is a torque history, it is, for example, information on the current input from the servo amplifier 44.

[0154] The load history 71(k) is provided to the calculation unit 901 via the input / output interface 903. The trained model 72 is input to the calculation unit 901 from the storage unit 902. In the calculation unit 901, the load history 71(k) is input to the trained model 72.

[0155] Step S402 is a process of making a determination using the trained model 72. For example, the calculation unit 901 refers to the trained model 72 and determines whether the load history 71(k) is normal or abnormal.

[0156] If the determination result in step S402 is "normal," it can be said that it has been determined that there is no defect in the current lot, since the trained model 72 was generated from the load history 71f of the preceding lot that had no defect. That is, in this case, in step S404, it is determined that there is no defect in the pulled-up substrate W, as in step S103 of the first determination process, step S204 of the second determination process, and step S304 of the third determination process.

[0157] If the judgment result in step S402 is "abnormal," in step S403, it is judged that the pulled-up substrate W has a defect, similar to step S102 of the first judgment process, step S203 of the second judgment process, and step S303 of the third judgment process.

[0158] In the fourth determination process, a load history 71, which is a time-dependent value of the load, is input to a trained model 72 to determine whether or not there is damage to the substrate W. The fourth determination process also determines whether or not there is damage or loss to the substrate W for each processing tank 100. Furthermore, there is no need to capture an image of the processing tank 100, and the influence of light reflected by the surface of the processing liquid is small.

[0159] The load history 71(k) may be added to the load history group 70 for use in generating a trained model 72 for the subsequent lot.

[0160] <Another example of generating a trained model> Fig. 17 is a block diagram showing another example of generation of a trained model 72. Fig. 17 illustrates the connection relationship between the control unit 9 and an external device 60. In this example, the substrate processing apparatus 1 is equipped with a communication unit 51. The substrate processing apparatus 1 can communicate with the external device 60 using the communication unit 51. The external device 60 is, for example, a management device that manages the substrate processing apparatus 1 from outside.

[0161] The external device 60 includes a control unit 601, a learning model generation unit 602, a memory unit 603, and a communication unit 604. The control unit 601 controls the operations of the learning model generation unit 602, the memory unit 603, and the communication unit 604. The communication unit 604 is capable of mutual communication with the communication unit 51. The external device 60 is capable of mutual communication with the substrate processing apparatus 1 using the communication unit 604.

[0162] The communication between the communication units 51 and 604 may be wired communication or wireless communication including via a communication network.

[0163] In this example, the load history group 70 is stored in the memory unit 603 from the calculation unit 901 via the communication units 51 and 604. The learning model generation unit 602 generates a learning dataset 73 using the load history group 70, and further generates a trained model 72. The trained model 72 is stored in the memory unit 603. In this example, steps S61 and S62 are executed by the learning model generation unit 602.

[0164] In this example, the trained model 72 is provided from the storage unit 603 to the calculation unit 901 via the communication units 604 and 51, and is subjected to the fourth determination process.

[0165] <Transformation> In the above description, the lifter 20, or the lifter 20 and the elevator 40, can be understood as the substrate holding mechanism. The case has been described in which the presence or absence of defects in the substrates W is determined for each processing bath 100 using the load on the substrate holding mechanism.

[0166] However, the presence or absence of defects in the substrates W may be determined for each processing tank 100 using the load on the transport mechanism 8. For example, the control unit 9 stores the load on the transport mechanism 8 when holding a substrate W without defects for each processing tank 100, and adopts this load as a reference value. The load on the transport mechanism 8 is measured in the same manner as in step S52 (see FIG. 6), and the measured load is compared with the reference value to determine the presence or absence of defects for each processing tank 100.

[0167] For example, the load is the weight applied to the transport mechanism 8. A load cell 50 for measuring the weight is provided in a connecting portion 82 of the transport mechanism 8, for example.

[0168] Alternatively, for example, the load on the transport mechanism 8 holding the substrates W of the preceding lot is measured for each processing tank 100. As in step S202 (see FIG. 10), it is determined whether the difference between the measurement value for the preceding lot and the measurement value for the current lot for the common processing tank 100 is within a predetermined range, similarly to step S202. This allows the presence or absence of defects to be determined for each processing tank 100.

[0169] Alternatively, for example, similarly to the load history 71, the value of the load applied to the transport mechanism 8 over time is measured for each treatment tank 100. This value over time is used instead of the load history 71, 71f in the third determination process (see FIG. 13), and the presence or absence of a defect is determined for each treatment tank 100. Alternatively, a trained model is generated for each treatment tank 100 using the value of the load applied to the transport mechanism 8 over time. Using this trained model, the presence or absence of a defect is determined for each treatment tank 100, similarly to the fourth determination process (see FIG. 16).

[0170] It goes without saying that all or part of the components constituting each of the above-described embodiments and various modified examples can be combined as appropriate within a range that does not cause contradictions. [Explanation of symbols]

[0171] 1. Substrate processing equipment 9 Control Unit 20,20a,20b,20c Lifter (board holding mechanism) 40, 40a, 40b Elevator (substrate holding mechanism) 70 Load History Group 71 Load History 72 trained models 73 Training Dataset 100, 101a, 102a, 103a, 104a Treatment tank Q Rinse liquid (processing liquid) W substrate

Claims

1. a processing tank for storing a processing solution in which a plurality of substrates are immersed and which processes the plurality of substrates collectively; and a substrate holding mechanism having a function of collectively holding the plurality of substrates, the substrate holding mechanism having a first function of removing the plurality of substrates from the processing liquid and a second function of immersing the plurality of substrates in the processing liquid; A method for controlling a substrate processing apparatus, comprising: The substrate processing method further comprises determining whether or not the plurality of substrates are damaged during processing using the processing bath, based on a load applied to the substrate holding mechanism when the first function is exercised.

2. 2. The substrate processing method of claim 1, wherein the presence or absence is determined based on the difference between a first value, which is the value of the load applied to the substrate holding mechanism before the substrate holding mechanism immerses the plurality of substrates in the processing liquid, and a second value, which is the value of the load applied to the substrate holding mechanism when performing the first function.

3. The substrate processing method according to claim 2 , wherein the presence or absence is determined based on a difference between the second value and a reference value that is a reference value for the second value.

4. 4. The substrate processing method according to claim 3, wherein the second values ​​for a plurality of substrates that have already been processed with the processing liquid and that have been determined to have no defects are employed as the reference values.

5. 5. The substrate processing method according to claim 1, wherein the presence or absence is determined based on the load at a predetermined position on the substrate holding mechanism after the plurality of substrates have been removed from the processing solution.

6. 6. The substrate processing method according to claim 5, wherein a driving torque applied to the substrate holding mechanism at the predetermined position is adopted as the load.

7. The substrate processing method according to claim 5 , wherein the load is a weight applied to the substrate holding mechanism at the predetermined position.

8. 5. A substrate processing method according to claim 1, wherein the presence or absence is determined based on the time-dependent value of the load during a time period in which the substrate holding mechanism lifts the plurality of substrates from a first position to a second position that is farther from the processing liquid than the first position.

9. The substrate processing method according to claim 8 , wherein the load is a driving torque applied to the substrate holding mechanism during the time period.

10. The substrate processing method according to claim 8 , wherein the load is a weight applied to the substrate holding mechanism during the time period.

11. The substrate processing method of claim 1, wherein the presence or absence is determined by inputting the load values ​​over time into a trained model generated from a training dataset based on the load values ​​over time for multiple substrates that have already been processed with the processing liquid and have been determined to have no defects.

12. a processing tank for storing a processing solution in which a plurality of substrates are immersed and which processes the plurality of substrates collectively; a substrate holding mechanism that collectively holds the plurality of substrates, the substrate holding mechanism having a first function of removing the plurality of substrates from the processing liquid and a second function of immersing the plurality of substrates in the processing liquid; and a determining unit that determines whether or not the plurality of substrates are damaged during processing using the processing bath, based on a value that is a value of a load applied to the substrate holding mechanism when the first function is exercised; A substrate processing apparatus comprising:

Images