Substrate Processing Equipment

Abstract

To provide a substrate processing apparatus capable of excellently releasing a substrate from being held with two perpendicular holding parts.SOLUTION: At a posture conversion part 63 of a substrate processing apparatus, a first perpendicular holding part 71 comprises a first rotary member 83 and a first holding part body 84 provided protruding from the first rotary member 83. A second perpendicular holding part 72 comprises a second rotary member 85 and a second holding part body 86 provided protruding from the second rotary member 85. A rotary drive part rotates the two holding part bodies 84, 86 around the two rotary members 83, 85 respectively to place the two perpendicular holding parts 71, 72 in a holding state or releasing state. The rotary drive part places the two perpendicular holding parts in the releasing state when a support base rotary part changes the posture of a substrate W into a horizontal posture so as to separate the two holding part bodies 84, 86 from the substrate W.SELECTED DRAWING: Figure 6

Description

[Technical Field]

[0001] The present invention relates to a substrate processing apparatus for processing substrates. Examples of the substrate include semiconductor substrates, FPD (Flat Panel Display) substrates, photomask glass substrates, optical disk substrates, magnetic disk substrates, ceramic substrates, and solar cell substrates. Examples of the FPD include liquid crystal display devices and organic EL (electroluminescence) display devices. [Background technology]

[0002] Conventional substrate processing apparatuses include hybrid substrate processing apparatuses that include a batch processing module (batch processing section) that processes multiple substrates at once, a single-wafer processing module (single-wafer processing section) that processes substrates processed in the batch processing module one by one, and a rotation mechanism that changes the orientation of the substrates (see, for example, Patent Documents 1 and 2).

[0003] Patent Document 3 discloses an attitude change mechanism 201 as shown in Figure 18(a). The attitude change mechanism 201 includes a pair of horizontal support members 203, a pair of vertical support members 205, a cylindrical end abutment portion 207, a mounting block 209, and a rotating portion 211. The pair of horizontal support members 203, the pair of vertical support members 205, and the cylindrical end abutment portion 207 are provided upright on the mounting block 209. The mounting block 209 is rotated around a horizontal axis AX12 by the rotating portion 211.

[0004] The pair of vertical support members 205 are movable in the direction of arrow AR10, and the end abutment portions 207 are movable in the direction of arrow AR11. After the substrate W, which is in a vertical position, is converted to a horizontal position, the end abutment portions 207 are moved from the dotted line position to the end position of the substrate W, which is shown in the solid line. Thereafter, the pair of vertical support members 205 are moved from the solid line position to the dashed line position. As a result, as shown in FIG. 18(b), the pair of vertical holding portions 205 are moved while the end abutment portions 207 are in contact with the substrate W, and the substrate W is released from being clamped by the pair of vertical support members 20. [Prior art documents] [Patent documents]

[0005] [Patent Document 1] Special Publication No. 2016-502275 [Patent Document 2] Patent Publication No. 2021-064652 [Patent Document 3] Japanese Patent Application Publication No. 2018-056341 Summary of the Invention [Problem to be solved by the invention]

[0006] However, in a substrate processing apparatus having such a configuration, there may be cases where it is desired to release the substrate W from the pair (two) of vertical support members (vertical holding portions) 205 without using the end abutment portions 207.

[0007] The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a substrate processing apparatus that can effectively release a substrate from being held by two vertical holding parts. [Means for solving the problem]

[0008] In order to achieve the above object, the present invention has the following configuration: That is, a substrate processing apparatus according to the present invention is a substrate processing apparatus that successively performs batch processing for processing a plurality of substrates collectively and single wafer processing for processing substrates one by one, and includes a batch processing tank for processing a plurality of substrates collectively, a batch substrate transport mechanism for transporting the plurality of substrates collectively in a vertical orientation relative to the batch processing tank, a single wafer processing chamber for processing substrates one by one, a horizontal substrate transport mechanism for transporting substrates in a horizontal orientation relative to the single wafer processing chamber one by one, and a substrate transport mechanism for converting the plurality of batch-processed substrates from the vertical orientation to the horizontal orientation. and a posture conversion mechanism for converting the substrates into a horizontal posture, wherein the posture conversion mechanism comprises a substrate holding unit that holds the plurality of substrates in a vertical posture arranged at a predetermined interval, and a posture conversion unit that receives the plurality of substrates from the substrate holding unit and converts the received plurality of substrates from a vertical posture to a horizontal posture, wherein the posture conversion unit comprises two horizontal holding units that accommodate the plurality of substrates, the two horizontal holding units on which the plurality of substrates are placed when the plurality of substrates are in a horizontal posture, and the two horizontal holding units that convert the plurality of substrates into a horizontal posture when the plurality of substrates are in a vertical posture. the substrate holding device includes two vertical holding parts that hold the plurality of substrates accommodated in the horizontal holding parts in a vertical position; a support base that supports the two horizontal holding parts and the two vertical holding parts; a support base rotation part that rotates the support base around a horizontal axis; and a state change part that changes the state of the two vertical holding parts between a holding state in which the two vertical holding parts can hold the plurality of substrates and a release state in which the holding state is released, and the first of the two vertical holding parts includes a first rotating member that extends perpendicular to the support surface of the support base and a second rotating member that rotates the first a first holding unit main body provided so as to protrude from the first rotating member in a direction perpendicular to the direction in which the rotating member extends, and a second vertical holding unit of the two vertical holding units comprises a second rotating member extending perpendicular to the support surface of the support base, and a second holding unit main body provided so as to protrude from the second rotating member in a direction perpendicular to the direction in which the second rotating member extends, and the first holding unit main body and the second holding unit main body each have a plurality of holding grooves provided along the direction in which the plurality of substrates are aligned, and the state changing unit isThe first holding unit body and the second holding unit body are rotated around the first rotating member and the second rotating member, respectively, to place the two vertical holding units in the holding state or the released state, and when holding the plurality of substrates, the state change unit places the two vertical holding units in the holding state to sandwich the plurality of substrates between the first holding unit body and the second holding unit body, and when the plurality of substrates held by the two vertical holding units are converted from a vertical position to a horizontal position by the support base rotation unit, the state change unit places the two vertical holding units in the released state to separate the first holding unit body and the second holding unit body from the plurality of substrates.

[0009] In the substrate processing apparatus according to the present invention, when the support base rotation unit converts the substrates held by the two vertical holders from a vertical position to a horizontal position, the state change unit releases the two vertical holders, thereby separating the first holder body and the second holder body from the substrates. Here, because the two holder bodies are released by rotating them, the force acting on the substrates during release (which can cause displacement of the substrates) is canceled out by the two holder bodies. Therefore, displacement of the substrates is less likely to occur. Therefore, the substrates can be released from the two vertical holders in an efficient manner.

[0010] Furthermore, the first and second holding unit bodies are rotated to place the two vertical holding units in either the holding state or the release state, which allows the support base, i.e., the posture conversion unit, to be configured compactly.

[0011] In the substrate processing apparatus described above, the first and second rotating members are preferably arranged with a width smaller than the diameter of each substrate. Even if the substrate shifts position when two holder bodies, each having a plurality of holding grooves, are rotated to release the substrate, the first and second rotating members act as stoppers. This further prevents the substrate from shifting position.

[0012] Preferably, the substrate processing apparatus further comprises a horizontal rotation unit that rotates the substrate holder about a vertical axis, so that the orientation of the substrate can be arbitrarily changed.

[0013] Furthermore, in the above-mentioned substrate processing apparatus, it is preferable that the first holding unit main body and the second holding unit main body each further include a plurality of passing grooves arranged along the direction in which the plurality of substrates are aligned, for passing one substrate each, and that the plurality of holding grooves and the plurality of passing grooves are arranged alternately one by one so that a first group of divided substrates, in which every other one of the plurality of substrates is aligned, is held in the plurality of holding grooves, and that the posture conversion unit receives the first group of divided substrates of the plurality of substrates from the substrate holding unit and converts the received first group of divided substrates from a vertical posture to a horizontal posture.

[0014] The two vertical holders hold every other substrate in the first group of divided substrates, which allows the horizontal substrate transfer mechanism to easily remove the substrates from the attitude conversion unit.

[0015] Furthermore, the above-mentioned substrate processing apparatus preferably further comprises a relative movement unit that moves the substrate holding unit and the two vertical holding units horizontally relative to one another, and a relative lifting unit that raises and lowers the substrate holding unit and the two vertical holding units vertically relative to one another, and when the posture conversion unit receives the plurality of substrates from the substrate holding unit, the relative movement unit and the relative lifting unit place the two vertical holding units in a pre-receiving state in which the two vertical holding units are positioned below the substrate holding unit, and the relative lifting unit changes the state from the pre-receiving state to a post-receiving state in which the two vertical holding units are positioned above the substrate holding unit, thereby receiving the plurality of substrates in a vertical position held by the substrate holding unit with the two vertical holding units, and the support table rotation unit rotates the support table around the horizontal axis to convert the plurality of substrates held by the two vertical holding units from a vertical position to a horizontal position.

[0016] By relatively horizontally moving the substrate holder and the two vertical holders and raising and lowering them, the attitude conversion unit can receive a plurality of substrates from the substrate holder.

[0017] In addition, the above-described substrate processing apparatus preferably further includes a standby tank for storing the liquid so that the plurality of substrates held by the substrate holders are immersed in the liquid. If the substrates dry out, pattern collapse on the substrates occurs. However, the present invention can prevent the substrates held by the substrate holders from drying out.

[0018] Furthermore, in the above-described substrate processing apparatus, it is preferable that each of the plurality of holding grooves is V-shaped so that the width in the substrate thickness direction narrows toward the back. This allows the plurality of holding grooves to hold the plurality of substrates in a vertical position. Furthermore, suppose that after the substrate is converted to a horizontal position, the substrate is held by two vertical holding units. In this case, since the substrate is constrained, lifting and transporting the substrate imposes a load on the substrate. However, according to the present invention, the first holding unit main body and the second holding unit main body are separated from the plurality of substrates by releasing the two vertical holding units. This prevents the substrate from being subjected to a load.

[0019] In the substrate processing apparatus described above, it is preferable that the state changer rotates the first and second holder bodies around the first and second rotating members, respectively, in a direction away from the two horizontal holders from a state in which the first and second holder bodies sandwich the plurality of substrates, in order to set the two vertical holders in the released state. This allows the two holder bodies to be separated from the plurality of substrates while preventing displacement of the substrates by the two rotating members. [Effects of the Invention]

[0020] According to the substrate processing apparatus of the present invention, the substrate held by the two vertical holders can be released satisfactorily. [Brief explanation of the drawings]

[0021] [Figure 1] 1 is a plan view showing a schematic configuration of a substrate processing apparatus according to a first embodiment. [Figure 2] FIG. 2 is a side view showing the substrate handling mechanism. [Figure 3] 10(a) to 10(f) are side views for explaining a first position changing mechanism (position changing unit and pusher mechanism) of the transfer block. [Figure 4] 1A is a plan view showing the second position change mechanism, and FIG. 1B is a rear view showing the second position change mechanism as viewed in the direction of the arrow. [Figure 5] FIG. [Figure 6] FIG. [Figure 7] 10 is a flowchart illustrating an operation of the substrate processing apparatus. [Figure 8] 10 is a flowchart illustrating the first half of the operation of the second attitude change mechanism. [Figure 9] 10 is a flowchart illustrating the second half of the operation of the second attitude change mechanism. [Figure 10] 10(a) to 10(d) are diagrams illustrating the operation of the second attitude changing mechanism. [Figure 11] 10(a) to 10(d) are diagrams illustrating the operation of the second attitude changing mechanism. [Figure 12] 10(a) to 10(d) are diagrams illustrating the operation of the second attitude changing mechanism. [Figure 13] 10(a) to 10(d) are diagrams illustrating the operation of the second attitude changing mechanism. [Figure 14] 10(a) is a vertical cross-sectional view showing a pusher mechanism of a second position change mechanism according to a second embodiment, and FIG. 10(b) is a side view showing a position change unit of the second position change mechanism according to the second embodiment. [Figure 15] 10(a) and 10(b) are diagrams illustrating a second attitude changing mechanism according to a modified example. [Figure 16] 10(a) and 10(b) are diagrams illustrating a second attitude changing mechanism according to a modified example. [Figure 17] 10(a) and 10(b) are diagrams illustrating a second attitude changing mechanism according to a modified example. [Figure 18] FIG. 1A is a plan view showing a conventional attitude change mechanism, and FIG. 1B is a side view for explaining the operation of the conventional attitude change mechanism. Example 1

[0022] A first embodiment of the present invention will be described below with reference to the drawings. Fig. 1 is a plan view showing a schematic configuration of a substrate processing apparatus 1 according to the first embodiment. Fig. 2 is a side view showing a substrate handling mechanism HTR.

[0023] <1. Overall structure> 1, the substrate processing apparatus 1 includes a stocker block 3, a transfer block 5, and a processing block 7. The stocker block 3, the transfer block 5, and the processing block 7 are arranged in this order in a single horizontal row.

[0024] The substrate processing apparatus 1 performs, for example, chemical processing, cleaning processing, drying processing, etc. on the substrates W. The substrate processing apparatus 1 successively performs batch processing and single wafer processing on the substrates W. That is, the substrate processing apparatus 1 performs batch processing and then single wafer processing on the substrates W. Batch processing is a processing method in which multiple substrates W are processed at once. Single wafer processing is a processing method in which substrates W are processed one by one.

[0025] For convenience, in this specification, the direction in which the stocker block 3, transfer block 5, and processing block 7 are lined up is referred to as the "front-rear direction X." The front-rear direction X is horizontal. Within the front-rear direction X, the direction from the transfer block 5 toward the stocker block 3 is referred to as the "front." The direction opposite to the front is referred to as the "rear." The horizontal direction perpendicular to the front-rear direction X is referred to as the "width direction Y." One direction in the width direction Y is referred to as the "right" as appropriate. The direction opposite to the right is referred to as the "left." The direction perpendicular to the horizontal direction is referred to as the "vertical direction Z." For example, in Figure 1, for reference, front, back, right, left, top, and bottom are indicated as appropriate.

[0026] <2. Stocker block> The stocker block 3 accommodates at least one carrier C. The stocker block 3 is provided with one or more (for example, two) load ports 9. The stocker block 3 is equipped with a carrier transport mechanism (robot) 11 and shelves 13.

[0027] The carrier transport mechanism 11 transports the carrier C between the load port 9 and the shelf 13. The carrier transport mechanism 11 is equipped with a gripping portion that grips a protrusion on the top surface of the carrier C, or a hand that supports the carrier C while contacting the bottom surface of the carrier C. The shelf 13 is divided into a shelf 13A for removing and storing the substrates W, and a shelf 13B for storage.

[0028] The shelf 13A is arranged adjacent to the transfer block 5. The shelf 13A may be provided with a mechanism for attaching and detaching the lid of the carrier C. At least one shelf 13A is provided. The carrier C is placed on the shelf 13A. The carrier C stores a plurality of substrates W (for example, 25 substrates) in a horizontal position in the vertical direction Z at predetermined intervals (for example, 10 mm intervals). The substrates W are aligned in the thickness direction of the substrates W. For example, a FOUP (Front Opening Unify Pod) is used as the carrier C. A FOUP is a sealed container. The carrier C may also be an open container, and any type of container is acceptable.

[0029] <3. Transfer block> The transfer block 5 is disposed adjacent to the rear X of the stocker block 3. The transfer block 5 includes a substrate handling mechanism (robot) HTR and a first attitude conversion mechanism 15.

[0030] The substrate handling mechanism HTR is provided on the right Y side within the transfer block 5. The substrate handling mechanism HTR can transport multiple (e.g., 25) substrates W in a horizontal position all at once between the carrier C placed on the shelf 13A, the first position changing mechanism 15, and the buffer unit 33 (described later).

[0031] Please refer to Figure 2. The substrate handling mechanism HTR has a plurality of (e.g., 25) hands 17. For convenience of illustration, in Figure 2, the substrate handling mechanism HTR is shown to have three hands 17. Each hand 17 holds one substrate W.

[0032] The substrate handling mechanism HTR also includes a hand support unit 19, an advancing / retreating unit 20, and an elevation rotation unit 21. The hand support unit 19 supports a plurality of hands 17. This allows the plurality of hands 17 to move as a unit. The advancing / retreating unit 20 moves the plurality of hands 17 forward and backward via the hand support unit 19. The elevation rotation unit 21 rotates the advancing / retreating unit 20 about the vertical axis AX1, thereby rotating the plurality of hands 17, etc. about the vertical axis AX1. The elevation rotation unit 21 also raises and lowers the advancing / retreating unit 20, thereby raising and lowering the plurality of hands 17, etc. The elevation rotation unit 21 is fixed to the floor surface. In other words, the elevation rotation unit 21 does not move horizontally. The advancing / retreating unit 20 and the elevation rotation unit 21 each include an electric motor. The substrate handling mechanism HTR may include a hand (not shown) for transporting one substrate W, in addition to the hand 17 and the hand support part 19.

[0033] Please refer to Figure 1. The first position change mechanism 15 changes the position of multiple substrates W taken out from the carrier C from a horizontal position to a vertical position. The first position change mechanism 15 includes a position change unit 23 and a pusher mechanism 25. In Figure 1, the substrate handling mechanism HTR, the position change unit 23 and the pusher mechanism 25 are arranged in this order on the left side Y. Figures 3(a) to 3(f) are side views for explaining the first position change mechanism 15 (the position change unit 23 and the pusher mechanism 25) of the transfer block 5.

[0034] As shown in FIGS. 1 and 3(a), the posture conversion unit 23 includes a support base 23A, a pair of horizontal holding units 23B, a pair of vertical holding units 23C, and a rotation drive unit 23D. The pair of horizontal holding units 23B and the pair of vertical holding units 23C are provided on the support base 23A. The horizontal holding units 23B and the vertical holding units 23C receive multiple substrates W transported by the substrate handling mechanism HTR. When the substrates W are in a horizontal posture, the pair of horizontal holding units 23B contact the underside of each substrate W and support the substrates W from below. When the substrates W are in a vertical posture, the pair of vertical holding units 23C hold the substrates W.

[0035] The rotation drive unit 23D supports the support table 23A so that the support table 23A can rotate about the horizontal axis AX2. Furthermore, the rotation drive unit 23D rotates the support table 23A about the horizontal axis AX2, thereby converting the orientation of the plurality of substrates W held by the holders 23B and 23C from horizontal to vertical.

[0036] 1 and 3(f), the pusher mechanism 25 includes a pusher 25A, an elevation rotation unit 25B, a horizontal movement unit 25C, and a rail 25D. The pusher 25A supports the lower portion of each of a plurality of (e.g., 50) vertically oriented substrates W. For convenience of illustration, in FIGS. 3(a) to 3(f), the pusher 25A is configured to be able to support six substrates W.

[0037] The lifting and rotating unit 25B is connected to the underside of the pusher 25A. The lifting and rotating unit 25B moves the pusher 25A up and down by extending and retracting. The lifting and rotating unit 25B also rotates the pusher 25A around the vertical axis AX3. The horizontal moving unit 25C supports the lifting and rotating unit 25B. The horizontal moving unit 25C moves the pusher 25A and the lifting and rotating unit 25B horizontally along the rail 25D. The rail 25D is formed to extend in the width direction Y. The rotation driving unit 23D, the lifting and rotating unit 25B, and the horizontal moving unit 25C each include an electric motor.

[0038] The operation of the first position change mechanism 15 will now be described. The batch processing baths BT1 to BT6 in the processing block 7, which will be described later, process, for example, 50 substrates W in two carriers C at once. The first position change mechanism 15 changes the position of the 50 substrates W in groups of 25. The first position change mechanism 15 also arranges the substrates W face-to-face at a predetermined interval (half pitch). The half pitch is, for example, 5 mm. The pusher mechanism 25 transports these 50 substrates W to the transport mechanism WTR.

[0039] The 25 substrates W in the first carrier C will be described as substrates W1 of the first substrate group. The 25 substrates W in the second carrier C will be described as substrates W2 of the second substrate group. For convenience of illustration, in Figures 3(a) to 3(f), the first substrate group will be described as having three substrates W1, and the second substrate group will be described as having three substrates W2. When there is no particular distinction between substrates W1 and substrates W2, substrates W1 and W2 will be referred to as "substrates W."

[0040] See Figure 3(a). The attitude conversion unit 23 receives the 25 substrates W1 of the first substrate group transported by the substrate handling mechanism HTR with the holders 23B and 23C. At this time, the 25 substrates W1 are in a horizontal position with their device surfaces facing upward. The 25 substrates W1 are arranged at a predetermined interval (full pitch). The full pitch is, for example, 10 mm. The full pitch is also called the normal pitch.

[0041] The half pitch is half the distance of the full pitch. The device surface of the substrate W (W1, W2) is the surface on which the electronic circuit is formed and is called the "front surface." The back surface of the substrate W is the surface on which the electronic circuit is not formed. The surface opposite the device surface is called the back surface.

[0042] See Figure 3(b). The attitude conversion unit 23 rotates the holders 23B and 23C by 90 degrees around the horizontal axis AX2 to convert the attitude of the 25 substrates W1 from horizontal to vertical. See Figure 3(c). The pusher mechanism 25 raises the pusher 25A to a position higher than the holders 23B and 23C of the attitude conversion unit 23. As a result, the pusher 25A receives the 25 substrates W from the holders 23B and 23C. The 25 substrates W1 held by the pusher 25A face leftward Y. Note that in Figures 3(a) to 3(f), the arrow AR1 attached to the substrate W indicates the orientation of the device surface of the substrate W.

[0043] See FIG. 3(d). The pusher mechanism 25 rotates the 25 substrates W in a vertical orientation by 180 degrees around the vertical axis AX3. As a result, the 25 substrates W1 are inverted and face rightward Y. The inverted 25 substrates W1 then move half a pitch (e.g., 5 mm) leftward Y from their pre-rotation positions. The holders 23B and 23C of the orientation conversion unit 23 are rotated -90 degrees around the horizontal axis AX2 to prepare for receiving the next substrate W2. The orientation conversion unit 23 then receives the 25 substrates W2 of the second substrate group transported by the substrate handling mechanism HTR with the holders 23B and 23C. At this time, the 25 substrates W2 are in a horizontal orientation, with their device surfaces facing upward. The orientation conversion unit 23 and the pusher mechanism 25 are operated so as not to interfere with each other.

[0044] See Figure 3(e). The pusher mechanism 25 lowers the pusher 25A holding the 25 substrates W1 of the first substrate group to the retracted position. Thereafter, the attitude changing unit 23 changes the attitude of the 25 substrates W2 from horizontal to vertical. After the attitude change, the 25 substrates W2 face leftward Y. See Figure 3(f). Thereafter, the pusher mechanism 25 raises the pusher 25A holding the 25 substrates W2 of the second substrate group. This causes the pusher mechanism 25 to receive another 25 substrates W2 from the attitude changing unit 23.

[0045] As a result, the pusher 25A holds 50 substrates W (W1, W2) of the first substrate group and the second substrate group. The 50 substrates W are arranged alternately, with 25 substrates W1 and 25 substrates W2 arranged one by one. The 50 substrates W are arranged at a half pitch (e.g., 5 mm intervals). Furthermore, the 25 substrates W1 face in the opposite direction to the 25 substrates W2. Therefore, the 50 substrates W are arranged face-to-face. That is, two adjacent substrates W1 and W2 have their two device surfaces (or two back surfaces) facing each other.

[0046] Thereafter, the pusher mechanism 25 moves the pusher 25A holding the 50 substrates W along the rails 25D to the substrate transfer position PP below the pair of chucks 49, 50 of the transport mechanism WTR.

[0047] <4. Processing Block 7> The processing block 7 is adjacent to the transfer block 5. The processing block 7 includes a batch processing area R1, a single substrate transport area R2, a single substrate processing area R3, and a batch substrate transport area R4. The substrate processing apparatus 1 includes an electrical equipment area R5.

[0048] <4-1. Batch processing area R1> The batch processing area R1 is adjacent to the transfer block 5, the single substrate transport area R2, and the batch substrate transport area R4. The batch processing area R1 is also disposed between the single substrate transport area R2 and the batch substrate transport area R4. One end of the batch processing area R1 is adjacent to the transfer block 5, and the other end of the batch processing area R1 extends in a direction away from the transfer block 5, i.e., toward the rear X.

[0049] The batch processing region R1 is provided with, for example, six batch processing vessels BT1 to BT6 and a second position change mechanism 31. The six batch processing vessels BT1 to BT6 are aligned in a row in the front-rear direction X along which the batch processing region R1 extends. The second position change mechanism 31 is disposed on the opposite side of the transfer block 5 from the first position change mechanism 15, with the six batch processing vessels BT1 to BT6 interposed therebetween. That is, the six batch processing vessels BT1 to BT6 are disposed between the two position change mechanisms 15, 31. The second position change mechanism 31 is disposed on an extension of the row of the six batch processing vessels BT1 to BT6. The number of batch processing vessels is not limited to six, and may be any plural number.

[0050] Each of the six batch processing tanks BT1 to BT6 immerses a plurality of vertically oriented substrates W in a single process. For example, the six batch processing tanks BT1 to BT6 are composed of four chemical processing tanks BT1 to BT4 and two water rinsing processing tanks BT5 and BT6. Specifically, two chemical processing tanks BT1 and BT2 and a water rinsing processing tank BT5 form one set, and two chemical processing tanks BT3 and BT4 and a water rinsing processing tank BT6 form another set.

[0051] Each of the four chemical treatment tanks BT1 to BT4 performs etching treatment using a chemical solution. For example, phosphoric acid is used as the chemical solution. The chemical treatment tank BT1 stores the chemical solution supplied from a chemical solution jetting pipe (not shown). The chemical solution jetting pipe is provided on the inner wall of the chemical treatment tank BT1. Each of the three chemical treatment tanks BT2 to BT4 has the same configuration as the chemical treatment tank BT1.

[0052] Each of the two water-rinsing processing tanks BT5, BT6 performs a pure water cleaning process in which chemicals adhering to a plurality of substrates W are washed away with pure water. Deionized water (DIW), for example, is used as the pure water. Each of the two water-rinsing processing tanks BT5, BT6 stores pure water supplied from a cleaning liquid jetting pipe (not shown). The cleaning liquid jetting pipe is provided on the inner wall of each of the water-rinsing processing tanks BT5, BT6.

[0053] Six lifters LF1 to LF6 are provided for the six batch processing tanks BT1 to BT6, respectively. For example, the lifter LF1 holds multiple substrates W in a vertical position arranged at a predetermined interval (half pitch). The lifter LF1 also raises and lowers the multiple substrates W between a processing position inside the batch processing tank (chemical processing tank) BT1 and a transfer position above the batch processing tank BT1. The other five lifters LF2 to LF6 are configured similarly to the lifter LF1.

[0054] The second position changing mechanism 31 collectively changes all or some of the plurality of vertically positioned substrates W that have been batch processed to a horizontal position. Details of the second position changing mechanism 31 will be described later. The second position changing mechanism 31 corresponds to the position changing mechanism of the present invention.

[0055] <4-2. Single-substrate transport area R2>

[0056] The single substrate transport area R2 is adjacent to the transfer block 5, the batch processing area R1, the single substrate processing area R3, and the electrical equipment area R5. The single substrate transport area R2 is located between the batch processing area R1 and the single substrate processing area R3. One end of the single substrate transport area R2 is adjacent to the transfer block 5. The other end of the single substrate transport area R2 extends in a direction away from the transfer block 5, i.e., toward the rear X.

[0057] The single substrate transport region R2 is provided with a center robot CR and a buffer unit 33. The center robot CR transports substrates between the second position conversion mechanism 31, the single substrate processing chambers SW1 to SW4 (described later), and the buffer unit 33. For example, the center robot CR transports substrates W in a horizontal position one by one to each of the single substrate processing chambers SW1 to SW4.

[0058] The center robot CR includes two hands 35, an advance / retreat section 37, an elevation / rotation section 39, and a horizontal movement section 41 (including a guide rail). Each of the two hands 35 holds one substrate W in a horizontal position.

[0059] The advancing / retreating unit 37 movably supports the hand 35 and moves the hand 35 forward and backward individually. The lifting and rotating unit 39 rotates the hand 35 and the advancing / retreating unit 37 about a vertical axis AX9. The lifting and rotating unit 39 also raises and lowers the hand 35 and the advancing / retreating unit 37. The guide rail is provided along the direction in which the single-substrate transport region R2 extends and is provided on the floor surface of the single-substrate transport region R2. The horizontal moving unit 41 moves the hand 35, the advancing / retreating unit 37, etc. in the forward and backward direction X along the guide rail. The advancing / retreating unit 37, the lifting and rotating unit 39, and the horizontal moving unit 41 each include an electric motor.

[0060] For example, the advancing / retracting unit 37 may advance two hands 35 to remove two substrates W from the second attitude conversion mechanism 31. Thereafter, the advancing / retracting unit 37 may advance one hand 35 holding one substrate W to transport the one substrate W to one single-wafer processing chamber. The center robot CR may be equipped with one hand 35 or three or more hands 35. When equipped with three or more hands 35, the center robot CR advances and retracts the three or more hands 35 individually.

[0061] The buffer unit 33 is equipped with a plurality of loading shelves. Each of the plurality of loading shelves is in a horizontal position. Each of the plurality of loading shelves can load one substrate W. The buffer unit 33 loads the plurality of substrates W in a horizontal position in the vertical direction Z at a predetermined interval (full pitch). In other words, the plurality of loading shelves are arranged at a predetermined interval (full pitch) in the vertical direction Z. The buffer unit 33 is configured to be able to load at least 25 substrates W that can be transported by the substrate handling mechanism HTR. The buffer unit 33 is configured to be able to load, for example, 50 substrates W.

[0062] 1, the buffer unit 33 is specifically arranged across the transfer block 5 and the single substrate transport area R2. That is, the buffer unit 33 is provided at the boundary between the transfer block 5 and the single substrate transport area R2. The buffer unit 33 may also be provided only in the transfer block 5 or the single substrate transport area R2. Therefore, the buffer unit 33 only needs to be fixedly provided at the boundary between the transfer block 5 and the single substrate transport area R2, the transfer block 5, or the single substrate transport area R2.

[0063] <4-3. Single wafer processing area R3> The single wafer processing area R3 is adjacent to the single substrate transport area R2 and the electrical equipment area R5. One end of the single wafer processing area R3 is located close to the transfer block 5 via the electrical equipment area R5. The electrical equipment area R5 is provided with electrical circuits necessary for the substrate processing apparatus 1 and a control unit 59 (described later). The other end of the single wafer processing area R3 extends in a direction away from the transfer block 5, i.e., toward the rear X. The single wafer processing area R3 is provided along the batch processing area R1 and the single substrate transport area R2.

[0064] A plurality of (for example, four) single wafer processing chambers SW1 to SW4 are provided in the single wafer processing region R3. The four single wafer processing chambers SW1 to SW4 are aligned in the front-rear direction X along which the single wafer processing region R3 extends. Each of the single wafer processing chambers SW1 to SW4 processes one substrate W at a time. The fourth single wafer processing chamber SW4, the third single wafer processing chamber SW3, the second single wafer processing chamber SW2, and the first single wafer processing chamber SW1 are arranged in this order from the transfer block 5 side. The single wafer processing chambers SW1 to SW4 may be configured in multiple stages. For example, 12 single wafer processing chambers may be arranged with four in the front-rear direction X (horizontal direction) and three in the vertical direction Z.

[0065] For example, each of the single wafer processing chambers SW1 and SW2 includes a rotation processing unit 45 and a nozzle 47. The rotation processing unit 45 includes a spin chuck that holds one substrate W in a horizontal position, and an electric motor that rotates the spin chuck around a vertical axis that passes through the center of the substrate W. The spin chuck may hold the lower surface of the substrate W by vacuum suction. The spin chuck may also include three or more chuck pins that grip the outer edge of the substrate W.

[0066] The nozzle 47 supplies a processing liquid to the substrate W held in the rotary processing unit 45. The nozzle 47 is moved between a standby position away from the rotary processing unit 45 and a supply position above the rotary processing unit 45. For example, deionized water (DIW) and IPA (isopropyl alcohol) are used as the processing liquid. Each of the single wafer processing chambers SW1 and SW2 may perform a cleaning process on the substrate W with deionized water, and then perform a preliminary drying process with IPA, or may form a liquid film of IPA on the upper surface of the substrate W.

[0067] Each of the single-wafer processing chambers SW3 and SW4 performs a drying process using, for example, a supercritical fluid. Carbon dioxide, for example, is used as the fluid. Each of the single-wafer processing chambers SW3 and SW4 includes a chamber body (container) 48, a support tray, and a lid. The chamber body 48 includes an internal processing space, an opening for inserting the substrate W into the processing space, a supply port, and an exhaust port. The substrate W is accommodated in the processing space while being supported by the support tray. The lid closes the opening of the chamber body 48. For example, each of the single-wafer processing chambers SW3 and SW4 brings a fluid into a supercritical state and supplies the supercritical fluid to the processing space in the chamber body 48 from the supply port. At this time, the processing space in the chamber body 48 is exhausted from the exhaust port. The supercritical fluid supplied to the processing space performs a drying process on the substrate W.

[0068] The supercritical state is achieved by adjusting the fluid to its specific critical temperature and critical pressure. Specifically, when the fluid is carbon dioxide, the critical temperature is 31°C and the critical pressure is 7.38 MPa. In the supercritical state, the surface tension of the fluid becomes almost zero. Therefore, the gas-liquid interface does not affect the pattern on the substrate W. Therefore, the pattern on the substrate W is less likely to collapse.

[0069] <4-4. Batch substrate transport area R4> The batch substrate transport region R4 is adjacent to the transfer block 5 and the batch processing region R1. The batch substrate transport region R4 is provided along the batch processing region R1. The batch substrate transport region R4 extends in the front-rear direction X. The four regions R1, R2, R3, and R4 are provided to extend parallel to one another.

[0070] The batch substrate transfer region R4 has a transfer mechanism (robot) WTR. That is, the transfer mechanism WTR is provided in the batch substrate transfer region R4. The transfer mechanism WTR transfers a plurality of substrates W (e.g., 50 substrates) collectively between a substrate transfer position PP defined in the transfer block 5, each of six batch processing baths BT1 to BT6, and the second attitude conversion mechanism 31.

[0071] The transport mechanism WTR includes a pair of chucks 49, 50 and a guide rail 53. Each of the chucks 49, 50 includes, for example, 50 holding grooves for holding 50 substrates W. The two chucks 49, 50 each extend parallel to the width direction Y (FIG. 1) in a plan view. The transport mechanism WTR opens and closes the two chucks 49, 50. The transport mechanism WTR moves the pair of chucks 49, 50 along the guide rail 53. The transport mechanism WTR is driven by an electric motor.

[0072] <5. Control Unit> The substrate processing apparatus 1 includes a control unit 59 and a storage unit (not shown). The control unit 59 controls each component of the substrate processing apparatus 1. The control unit 59 includes one or more processors, such as a central processing unit (CPU). The storage unit includes at least one of a read-only memory (ROM), a random-access memory (RAM), and a hard disk. The storage unit stores computer programs required to control each component of the substrate processing apparatus 1.

[0073] <6. Second attitude conversion mechanism> Fig. 4(a) is a plan view showing the second position change mechanism 31. Fig. 4(b) is a rear view showing the second position change mechanism 31 as seen from the direction of arrow AR2. Fig. 5 is a rear view showing the position change unit 63. Fig. 6 is a plan view showing the position change unit 63.

[0074] The second position change mechanism 31 includes a substrate waiting area R31 and a position change execution area R32. The substrate waiting area R31 and the position change execution area R32 are arranged along a width direction Y that is perpendicular to a front-rear direction X along which the batch processing area R1 or the six batch processing tanks BT1 to BT6 extend.

[0075] The second position change mechanism 31 includes a pusher mechanism 61 and a position change unit 63. The pusher mechanism 61 is provided in the substrate waiting area R31. On the other hand, the position change execution area R32 is provided with the position change unit 63. Next, the pusher mechanism 61 and the position change unit 63 will be described in detail.

[0076] <6-1. Pusher mechanism> The pusher mechanism 61 holds a plurality of substrates W (for example, 50 substrates) transported by the transport mechanism WTR in a vertical position. The pusher mechanism 61 includes a pusher 65 and an elevation rotation unit 67 that raises and lowers the pusher 65 and rotates the pusher 65 about a vertical axis AX4. This allows the front and back orientations of the substrates W to be changed as desired.

[0077] The pusher 65 holds, from below, for example, 50 substrates W arranged at a predetermined interval (for example, half pitch). The pusher 65 has holding grooves in the same number (50) as the number of substrates W. Each holding groove of the pusher 65 is formed in a V-shape so that the width in the thickness direction of the substrates W narrows toward the back. The lifting and rotating unit 67 includes, for example, an electric motor or an air cylinder.

[0078] The pusher mechanism 61 (pusher 65) and the six batch processing tanks BT1 to BT6 are arranged linearly in the front-rear direction X so that the transport mechanism WTR can transport 50 substrates W in a straight line. The pusher 65 corresponds to the substrate holder of the present invention. The lifting and rotating unit 67 corresponds to the horizontal rotating unit and the relative lifting and rotating unit of the present invention.

[0079] <6-2. Posture conversion unit> The attitude conversion unit 63 receives a plurality of substrates W from the pusher 65 and converts the plurality of substrates W from a vertical attitude to a horizontal attitude. Alternatively, the attitude conversion unit 63 receives one of a first group of substrates (two or more substrates W1) and a second group of substrates (two or more substrates W2) from the plurality of substrates from the pusher 65 and converts the received first group of substrates or second group of substrates from a vertical attitude to a horizontal attitude.

[0080] The attitude conversion unit 63 includes two horizontal holding units 69, 70, two vertical holding units 71, 72, a support base 74, a support base rotation unit 76, and a rotation drive unit 78. The support base 74 supports the two horizontal holding units 69, 70 and the two vertical holding units 71, 72. The support base rotation unit 76 rotates the support base 74 around a horizontal axis AX5. The support base rotation unit 76 includes, for example, an electric motor.

[0081] The two horizontal holding portions 69, 70 each extend perpendicular to the support surface 74A of the support base 74. The two horizontal holding portions 69, 70 accommodate a plurality of (e.g., 25) substrates W. Specifically, the two horizontal holding portions 69, 70 accommodate two radially opposing side portions of each substrate W. As shown in the frame in FIG. 6, the two horizontal holding portions 69, 70 place the plurality of substrates W when the plurality of substrates W are in a horizontal position.

[0082] As shown in Figures 5 and 6, the two horizontal holding units 69, 70 are provided with multiple pairs (e.g., 25 pairs) of horizontal placement guides 79, 80 arranged at a predetermined interval (e.g., full pitch). The first horizontal holding unit 69 is provided with multiple (e.g., 25) horizontal placement guides 79. The multiple horizontal placement guides 79 are arranged along the thickness direction in which the multiple substrates W are aligned. The second horizontal holding unit 70 is provided with multiple horizontal placement guides 80. The multiple horizontal placement guides 80 are arranged along the thickness direction in which the multiple substrates W are aligned. For example, if the two horizontal holding units 69, 70 are to accommodate 50 substrates W in a vertical position arranged at a half pitch, the two adjacent pairs of horizontal placement guides 79, 80 are configured to be able to accommodate two substrates W1, W2.

[0083] As shown in Fig. 5, when a plurality of substrates W (e.g., 50 substrates W) are in a vertical position, the two vertical holding units 71, 72 hold a plurality of substrates W (e.g., 25 substrates W) accommodated by the two horizontal holding units 69, 70 in a vertical position. When the substrates W are in a vertical position, the two vertical holding units 71, 72 are provided below the two horizontal holding units 69, 70. When the substrates W are in a horizontal position, the two vertical holding units 71, 72 are provided closer to the pusher 65 than the two horizontal holding units 69, 70 (see Fig. 11(c) described later).

[0084] When the multiple substrates W held by the two vertical holding units 71, 72 are in a vertical position, the two horizontal holding units 69, 70 are arranged along the front-rear direction X while sandwiching the multiple substrates W. Similarly, when the substrates W are in a vertical position, the two vertical holding units 71, 72 are arranged along the front-rear direction X while sandwiching the multiple substrates W.

[0085] The first vertical holding unit 71 includes a first rotating member 83 and a first holding unit main body 84. The first rotating member 83 extends perpendicular to the support surface 74A of the support base 74. The first holding unit main body 84 is provided so as to protrude from the first rotating member 83 in a direction (radial direction) perpendicular to the direction in which the first rotating member 83 extends. Similarly, the second vertical holding unit 72 includes a second rotating member 85 and a second holding unit main body 86. The second rotating member 85 extends perpendicular to the support surface 74A of the support base 74. The second holding unit main body 86 is provided so as to protrude from the second rotating member 85 in a direction (radial direction) perpendicular to the direction in which the second rotating member 85 extends.

[0086] Furthermore, the two vertical holding units 71, 72 are provided with multiple pairs (25 pairs) of holding grooves 89, 90 and multiple pairs (25 pairs) of passing grooves 91, 92. The multiple pairs of holding grooves 89, 90 and the multiple pairs of passing grooves 91, 92 are arranged alternately. Each of the multiple pairs of holding grooves 89, 90 holds one substrate. Each of the holding grooves 89, 90 is formed in a V-shape so that the width in the thickness direction of the substrate narrows toward the back. This allows the multiple holding grooves 89, 90 to hold multiple substrates W in a vertical position. Each of the multiple pairs of passing grooves 91, 92 does not hold a single substrate, but allows one substrate W to pass through.

[0087] The first holding unit main body 84 has a plurality of holding grooves 89 and a plurality of passing grooves 91 provided along the direction in which the plurality of substrates W are aligned. The plurality of holding grooves 89 and the plurality of passing grooves 91 are provided alternately. This is because the 25 holding grooves 89 (25 pairs of holding grooves 89, 90) hold a first group of substrates (25 substrates W1) or a second group of substrates (25 substrates W2), in which every other substrate out of, for example, 50 substrates W held by the pusher 65 is aligned. The second holding unit main body 86 also has a plurality of holding grooves 90 and a plurality of passing grooves 92 provided along the direction in which the plurality of substrates W are aligned. The plurality of holding grooves 90 and the plurality of passing grooves 92 are provided alternately.

[0088] The two holder bodies 84, 86 are arranged with a width WD that is smaller than the diameter of each substrate W. Therefore, each substrate W cannot pass between the two holder bodies 84, 86. The first rotating member 83 is rotatable about a central axis AX7. Similarly, the second rotating member 85 is rotatable about a central axis AX8. The two central axes AX7, AX8 each extend perpendicular to the support surface 74A of the support base 74 and extend along the alignment direction of the multiple substrates W.

[0089] The rotation drive unit 78 rotates the first rotating member 83 and the first holding unit main body 84 together around the central axis AX7. At the same time, the rotation drive unit 78 rotates the second rotating member 85 and the second holding unit main body 86 together around the central axis AX8. The rotation drive unit 78 includes an electric motor. The rotation drive unit 78 corresponds to the state change unit of the present invention.

[0090] Therefore, the rotation drive unit 78 rotates the two holder bodies 84, 86 around the two rotating members 83, 85 (central axes AX7, AX8), respectively, to place the two vertical holders 71, 72 in a holding state or a released state. In other words, the rotation drive unit 78 changes the states of the two vertical holders 71, 72 between the holding state and the released state.

[0091] The holding state is a state in which the two vertical holding parts 71, 72 can hold multiple substrates W. In the holding state, the two vertical holding parts 71, 72 sandwich multiple substrates W between the two holding part bodies 84, 86 and hold the multiple substrates W in the multiple pairs of holding grooves 89, 90. The released state is a state in which the holding state is released. In the released state, the two holding part bodies 84, 86 are moved away from the multiple substrates W so that the multiple pairs of holding grooves 89, 90 no longer hold the multiple substrates W.

[0092] In FIG. 6, in the released state, the two holding unit bodies 84, 86 indicated by solid lines are located to the left Y of the two rotating members 83, 85. For example, the first holding unit body 84 is located on the opposite side of the first horizontal holding unit 69 across the first rotating member 83. From these states, the rotation drive unit 78 rotates the first holding unit body 84 rightward (clockwise) and rotates the second holding unit body 86 leftward (counterclockwise). At this time, the two holding unit bodies 84, 86 pass between the two rotating members 83, 85. Then, the two holding unit bodies 84, 86 are moved to the positions indicated by dashed lines, thereby entering the holding state.

[0093] 6, when transitioning from the holding state to the release state, the rotation drive unit 78 rotates the first holding unit main body 84, indicated by a dashed line, counterclockwise and rotates the second holding unit main body 86, indicated by a dashed line, clockwise. At this time, the two holding unit main bodies 84, 86 pass between the two rotating members 83, 85. That is, in order to set the two vertical holding units 71, 72 to the release state, the rotation drive unit 78 rotates the two holding unit main bodies 84, 86 about the two rotating members 83, 85 (central axes AX7, AX8) in a direction away from the two horizontal holding units 69, 70 from a state in which the two holding unit main bodies 84, 86 sandwich multiple substrates W. This allows the transition from the holding state to the release state to be made while preventing positional misalignment of the substrates W by the two rotating members 83, 85.

[0094] As shown in FIG. 4 , the second attitude change mechanism 31 also includes a horizontal movement unit 95. The horizontal movement unit 95 linearly moves the two horizontal holding units 69, 70, the two vertical holding units 71, 72, the support base 74, the support base rotation unit 76, and the rotation drive unit 78 in the width direction Y. The horizontal movement unit 95 includes an electric motor. The horizontal movement unit 95 may also move the support base 74 and the like in the front-rear direction X as well as the width direction Y. The horizontal movement unit 95 corresponds to the relative movement unit of the present invention.

[0095] <6. Operational Description> Next, the operation of the substrate processing apparatus 1 will be described with reference to the flowcharts of Figures 7 to 9. See Figure 1. An external transfer robot (not shown) transfers two carriers C to the load port 9 in turn.

[0096] [Step S01] Transferring substrates from carriers The carrier transport mechanism 11 in the stocker block 3 transports the first carrier C from the load port 9 to the shelf 13A. The substrate handling mechanism HTR in the transfer block 5 takes out 25 substrates W1 in a horizontal position from the first carrier C placed on the shelf 13A and transports them to the attitude conversion unit 23. The carrier transport mechanism 11 then transports the empty first carrier C to the shelf 13B. The carrier transport mechanism 11 then transports the second carrier C from the load port 9 to the shelf 13A. The substrate handling mechanism HTR takes out 25 substrates W2 in a horizontal position from the second carrier C placed on the shelf 13A and transports them to the attitude conversion unit 23.

[0097] [Step S02] Transformation to vertical posture Fifty substrates W (W1, W2) on two carriers C are transported to the attitude conversion unit 23. As shown in Figures 3(a) to 3(f), the attitude conversion unit 23 and pusher mechanism 25 align the 50 substrates W face-to-face at a half pitch (5 mm) and convert the 50 substrates W from a horizontal attitude to a vertical attitude. The pusher mechanism 25 transports the 50 substrates W in a vertical attitude to a substrate transfer position PP defined within the transfer block 5.

[0098] [Step S03] Chemical treatment (batch treatment) The transport mechanism WTR receives 50 substrates W in a vertical position from the pusher mechanism 25 at the substrate transfer position PP, and transports the 50 substrates W to any one of the four lifters LF1 to LF4 of the four chemical liquid processing tanks BT1 to BT4.

[0099] For example, the transport mechanism WTR transports 50 substrates W to the lifter LF1 of the chemical liquid treatment tank BT1. The lifter LF1 receives the 50 substrates W at a position above the chemical liquid treatment tank BT1. The lifter LF1 immerses the 50 substrates W in phosphoric acid, which serves as the treatment liquid in the chemical liquid treatment tank BT1. This allows the 50 substrates W to be etched. After the etching process, the lifter LF1 lifts the 50 substrates W out of the phosphoric acid in the chemical liquid treatment tank BT1. Note that when the 50 substrates W are transported to the lifters LF2 to LF4 of the other chemical liquid treatment tanks BT2 to BT4, the same treatment as in the chemical liquid treatment tank BT1 is performed.

[0100] [Step S04] Pure water cleaning process (batch processing) The transport mechanism WTR receives 50 substrates W in a vertical position from, for example, the lifter LF1 (or lifter LF2), and transports the 50 substrates W to the lifter LF5 in the water-rinsing processing tank BT5. The lifter LF5 receives the 50 substrates W at a position above the water-rinsing processing tank BT5. The lifter LF5 immerses the 50 substrates W in the pure water in the water-rinsing processing tank BT5. This causes the 50 substrates W to undergo a cleaning process.

[0101] When the transport mechanism WTR receives 50 vertically oriented substrates W from one of the lifters LF3 and LF4, the transport mechanism WTR transports the 50 substrates W to the lifter LF6 of the water-rinsing processing tank BT6. The lifter LF6 immerses the 50 substrates W in the pure water in the water-rinsing processing tank BT6.

[0102] In this embodiment, the second position changing mechanism 31 is provided on the opposite side of the transfer block 5, with six batch processing tanks BT1 to BT6 interposed therebetween. The transport mechanism WTR transports 50 substrates W in a batch from, for example, the batch processing tank BT1 (BT3) on the side closer to the transfer block 5, via the batch processing tank BT5 (BT6) on the side farther from the transfer block 5, to the second position changing mechanism 31.

[0103] [Step S05] Transform to horizontal position The second position change mechanism 31 collectively changes the position of the substrates W that have been cleaned from vertical to horizontal. However, the following problem occurs: When the position of 50 substrates W arranged at half pitch (5 mm intervals) is collectively changed, one hand 35 of the center robot CR may not be able to properly enter the gap between two adjacent substrates W among the 50 substrates W.

[0104] Furthermore, when the substrates W are aligned face-to-face, some of the substrates W converted to a horizontal position have their device surfaces facing upward, while others have their device surfaces facing downward. For example, it is undesirable for the hand 35 of the center robot CR to come into contact with the device surfaces of the substrates W. Furthermore, it is undesirable for substrates W with device surfaces facing different directions to be transported to each of the single-wafer processing chambers SW1 to SW4.

[0105] Therefore, in this embodiment, the distance between two adjacent substrates W is widened, and the device surfaces of the 50 substrates W are aligned with one another. The 50 substrates W are also separated into a first substrate group and a second substrate group. This will be described in detail with reference to the flowcharts of FIGS. 8 and 9, and FIGS. 10(a) to 13(d).

[0106] [Step S11] Transporting the substrate to the pusher mechanism The transport mechanism WTR transports 50 substrates W from one of the lifters LF5 and LF6 to the pusher mechanism 61 of the second position changing mechanism 31 (see FIG. 1). The pushers 65 of the pusher mechanism 61 hold the 50 substrates W in a vertical position arranged at half pitch and face-to-face. The 50 substrates W are aligned along the width direction Y.

[0107] The attitude changing part 63 waits in the attitude change execution region R32 so as not to interfere with the transport mechanism WTR. After transporting the substrate W to the pusher mechanism 61, the transport mechanism WTR moves from above the pusher mechanism 61.

[0108] [Step S12] Preparation for receiving the substrate (W1) 10(a) and 10(b). The attitude conversion unit 63 prepares to receive the substrate W. Specifically, the support base rotation unit 76 rotates the support base 74 and the like 90 degrees to the left Y about the horizontal axis AX5 so that the two horizontal holding units 69, 70 and the two vertical holding units 71, 72 extend to the left Y (towards the pusher mechanism 61) in order to hold the substrate W in a vertical attitude. In addition, the rotation drive unit 78 rotates the two holding unit main bodies 84, 86 about the two rotating members 83, 85 (central axes AX7, AX8), respectively, to put the two vertical holding units 71, 72 into a holding state.

[0109] Furthermore, the lifting and rotating unit 67 of the pusher mechanism 61 rotates the pusher 65 holding the 50 substrates W in a vertical position around the vertical axis AX4. As a result, as shown in FIG. 10(a), the device surfaces of the substrates W1 in the first substrate group are oriented to the left Y (the opposite side of the support base 74). Therefore, when the 25 substrates W1 are converted to a horizontal position, the device surfaces can be oriented upward. Note that the operation of step S12 may be performed in the next step S13.

[0110] [Step S13] Actions before receiving When the posture conversion unit 63 receives 25 substrates W1 (first group of substrates) from the pusher 65, the horizontal movement unit 95 and the lifting and rotation unit 67 place the two vertical holding units 71, 72 below the pusher 65 in a pre-receiving state.

[0111] A more detailed explanation will be given with reference to Figures 10(c) and 10(d). The lifting and rotating unit 67 of the pusher mechanism 61 moves the pusher 65, which supports 50 substrates W in a vertical position, to an upper position higher than the two vertical holding units 71, 72 and the two horizontal holding units 69, 70. Thereafter, the horizontal moving unit 95 moves the two vertical holding units 71, 72, etc. from the position change execution region R32 to the substrate waiting region R31, while moving the two vertical holding units 71, 72 and the two horizontal holding units 69, 70 below the pusher 65. This places the pusher 65 and the two vertical holding units 71, 72 in a pre-receiving state.

[0112] [Step S14] Receiving operation 11(a) and 11(b). Thereafter, the lifting and rotating unit 67 lowers the pusher 65 to the standby position. As the pusher 65 passes the two vertical holding units 71, 72, the 50 substrates W are accommodated in the two horizontal holding units 69, 70, while also being accommodated in the 25 pairs of holding grooves 89, 90 and the 25 pairs of passing grooves 91, 92 of the two vertical holding units 71, 72. The two vertical holding units 71, 72 then receive a first group of substrates (25 substrates W1) of the 50 substrates W from the pusher 65 in the 25 pairs of holding grooves 89, 90. Meanwhile, the second group of substrates (25 substrates W2) accommodated in the 25 pairs of passing grooves 91, 92 is left on the pusher 65.

[0113] The 25 substrates W1 that are extracted every other substrate are aligned at full pitch. The 25 substrates W2 left on the pusher 65 are also arranged at full pitch. The 25 substrates W2 left on the pusher 65 are placed in a standby state. The first substrate group corresponds to the first divided substrate group of the present invention. The second substrate group is also called the second divided substrate group.

[0114] [Step S15] Change the position of the substrate (W1) to a horizontal position See Figures 11(c) and 11(d). Thereafter, the horizontal movement unit 95 moves the two vertical holding units 71, 72, etc. from the substrate waiting area R31 to predetermined positions in the attitude change execution area R32. Thereafter, the support base rotation unit 76 rotates the support base 74, etc. by 90 degrees to the right Y around the horizontal axis AX5. This changes the first substrate group (25 substrates W1) held by the two vertical holding units 71, 72 from a vertical attitude to a horizontal attitude.

[0115] [Step S16] Transition from the hold state to the release state Thereafter, the rotation drive unit 78 rotates the two holder bodies 84, 86 around the two rotating members 83, 85 (center axes AX7, AX8), respectively, to change the two vertical holders 71, 72 from the holding state to the release state. This causes the two holder bodies 84, 86 to move away from the first substrate group. The first substrate group is also removed from the 25 pairs of holding grooves 89, 90 of the two vertical holders 71, 72 (see FIG. 6).

[0116] Each of the 25 pairs of holding grooves 89, 90 is formed in a V shape. Therefore, for example, suppose that a single substrate W in a horizontal position is placed on a pair of horizontal placement guides 79, 80 and held by a pair of holding grooves 89, 90. The single horizontally oriented substrate W is constrained in the vertical direction by the pair of V-shaped holding grooves 89, 90. Therefore, when the center robot CR lifts the substrate W, a load is applied to the substrate W. Therefore, by releasing the constraint of the pair of holding grooves 89, 90, the center robot CR can transport the horizontally oriented substrate W smoothly.

[0117] [Step S17] Transport of substrate (W1) by center robot Thereafter, the center robot CR transports the 25 substrates W1 (first substrate group) placed on the 25 pairs of horizontal placement guides 79, 80 of the two horizontal holding units 69, 70 one by one to either of the single wafer processing chambers SW1, SW2. The center robot CR also lifts up one substrate W1 placed on each pair of horizontal placement guides 79, 80 while transporting that substrate W1.

[0118] Next, steps S18 to S23 will be explained. The parts that overlap with steps S12 to S17 will be briefly explained.

[0119] [Step S18] Preparation for receiving the substrate (W2) 12(a) and 12(b). The attitude conversion unit 63 prepares to receive the 25 substrates W2 of the second substrate group. Specifically, the support base rotation unit 76 rotates the support base 74, etc. 90 degrees to the left Y about the horizontal axis AX5 so that the two vertical holding units 71, 72, etc. extend to the left Y (pusher mechanism 61). In addition, the rotation drive unit 78 rotates the two holding unit main bodies 84, 86 about the two rotating members 83, 85 (central axes AX7, AX8), respectively, to put the two vertical holding units 71, 72 into a holding state.

[0120] Furthermore, the lifting and rotating unit 67 of the pusher mechanism 61 rotates the pusher 65, which holds the 25 substrates W2 (second substrate group) in a vertical position, 180 degrees around the vertical axis AX4. This allows the device surfaces to face upward when the 25 substrates W2 are converted to a horizontal position. Furthermore, the 180-degree rotation allows the 25 substrates W2 to be held at the positions in the width direction Y where the 25 pairs of holding grooves 89, 90 hold the first substrate group.

[0121] [Step S19] Actions before receiving See Figures 12(c) and 12(d). The lifting and rotating unit 67 moves the pusher 65, which supports 25 substrates W2 in a vertical position, to a position higher than the two vertical holding units 71, 72 and the two horizontal holding units 69, 70. Thereafter, the horizontal moving unit 95 moves the two vertical holding units 71, 72, etc. below the pusher 65. This places the pusher 65 and the two vertical holding units 71, 72 in a pre-receiving state.

[0122] [Step S20] Receiving operation 13(a) and 13(b). Thereafter, the lifting and rotating unit 67 lowers the pusher 65 to the standby position. As the pusher 65 passes the two vertical holding units 71, 72, the 25 substrates W2 are accommodated in the two horizontal holding units 69, 70 and also in the 25 pairs of holding grooves 89, 90. The two vertical holding units 71, 72 then receive the second substrate group (25 substrates W2) from the pusher 65 in the 25 pairs of holding grooves 89, 90.

[0123] [Step S21] Change the position of the substrate (W2) to a horizontal position See Figures 13(c) and 13(d). Thereafter, the horizontal movement unit 95 moves the two vertical holding units 71, 72, etc. from the substrate waiting area R31 to predetermined positions in the attitude change execution area R32. Thereafter, the support base rotation unit 76 rotates the support base 74, etc. by 90 degrees to the right Y around the horizontal axis AX5. This changes the second substrate group (25 substrates W2) held by the two vertical holding units 71, 72 from a vertical attitude to a horizontal attitude.

[0124] [Step S22] Transition from the hold state to the release state Thereafter, the rotation drive unit 78 rotates the two holder bodies 84, 86 around the two rotating members 83, 85 (center axes AX7, AX8), respectively, to change the two vertical holders 71, 72 from the holding state to the release state. This causes the two holder bodies 84, 86 to move away from the second substrate group. The second substrate group is also removed from the 25 pairs of holding grooves 89, 90 of the two vertical holders 71, 72.

[0125] [Step S23] Transport of substrate (W2) by center robot Thereafter, the center robot CR transports the 25 substrates W2 (second substrate group) placed on the 25 pairs of horizontal placement guides 79, 80 one by one to either of the single wafer processing chambers SW1, SW2.

[0126] [Step S06] First single wafer processing Returning to the explanation of the flowchart in Fig. 7, for example, the center robot CR transports the substrate W (W1, W2) from the attitude conversion unit 63 to the first single-wafer processing chamber SW1. The first single-wafer processing chamber SW1 supplies pure water to the device surface from the nozzle 47 while rotating the substrate W with the device surface facing upward by, for example, the rotation processing unit 45. Thereafter, the first single-wafer processing chamber SW1 supplies IPA from the nozzle 47 to the device surface (upper surface) of the substrate W to replace the pure water on the substrate W with IPA.

[0127] [Step S07] Second Single-Wafer Processing (Drying Processing) Thereafter, the center robot CR removes the substrate W wetted with IPA from the first single wafer processing chamber SW1 (SW2) and transports the substrate W to one of the single wafer processing chambers SW3 and SW4. Each of the single wafer processing chambers SW3 and SW4 performs a drying process on the substrate W using carbon dioxide in a supercritical state (supercritical fluid). The drying process using the supercritical fluid prevents pattern collapse on the device surface of the substrate W.

[0128] [Step S08] Transferring substrates from the buffer unit to the carrier The center robot CR transports the dried substrates W from one of the single-wafer processing chambers SW3, SW4 to one of the loading shelves in the buffer unit 33. When one lot (25 substrates) of substrates W1 have been transported to the buffer unit 33, the substrate handling mechanism HTR transports all 25 substrates W1 from the buffer unit 33 into an empty first carrier C placed on the shelf 13A. Thereafter, the carrier transport mechanism 11 in the stocker block 3 transports the first carrier C to the load port 9.

[0129] Furthermore, when one lot of substrates W2 is placed in the buffer section 33, the substrate handling mechanism HTR transports all 25 substrates W2 from the buffer section 33 into an empty second carrier C placed on the shelf 13A. Thereafter, the carrier transport mechanism 11 in the stocker block 3 transports the second carrier C to the load port 9. An external transport robot (not shown) transports the two carriers C in turn to their next destinations.

[0130] According to this embodiment, when the substrates W held by the two vertical holders 71, 72 are converted from a vertical position to a horizontal position by the support base rotation unit 76, the rotation drive unit 78 releases the two vertical holders 71, 72, thereby separating the first holder body 84 and the second holder body 86 from the substrates W. Here, because the two holder bodies 84, 86 are released by rotating them, forces acting on the substrates W during release (which could cause the substrates W to be displaced) are canceled out by the two holder bodies 84, 86. For example, as shown by arrows AR5 and AR6 in FIG. 6 , forces acting in the left-right direction (front-back direction X) are canceled out. Therefore, displacement of the substrates W is unlikely to occur. Therefore, the substrates W can be effectively released from the two vertical holders 71, 72.

[0131] Furthermore, the two holding portion bodies 84, 86 are each rotated to place the two vertical holding portions 71, 72 in either the holding state or the released state, which allows the support base 74, i.e., the attitude conversion portion 63, to be configured compactly.

[0132] Furthermore, the first rotating member 83 and the second rotating member 85 are arranged with a width WD that is smaller than the diameter of each substrate W. Even if the substrate W shifts position when the two holder bodies 84, 86, each having a plurality of holding grooves 89, 90, are rotated to release the substrate W, the first rotating member 83 and the second rotating member 85 act as stoppers. This further prevents the substrate W from shifting position.

[0133] Each of the two holding unit bodies 84, 86 is provided along the direction in which the plurality of substrates W are aligned, and further includes a plurality of passing grooves 91, 92 for passing one substrate W. The holding grooves 89, 90 and the passing grooves 91, 92 are arranged alternately one by one so that the holding grooves 89, 90 hold a first group of substrates (substrates W1) in which every other substrate among the plurality of substrates W is aligned, and the posture conversion unit 63 receives the first group of substrates (substrates W) among the plurality of substrates W from the pusher 65 and converts the received first group of substrates from a vertical posture to a horizontal posture.

[0134] The two vertical holders 71, 72 hold the first group of substrates (substrates W1) in which every other substrate is aligned among the plurality of substrates W, thereby widening the gap between two adjacent substrates W. This allows the center robot CR to easily remove the substrates W from the posture conversion unit 63.

[0135] The pusher mechanism 61 also includes a lifting and rotating unit 67 that raises and lowers the pusher 65 in the vertical direction Z relative to the two vertical holding units 71, 72, etc. of the attitude changing unit 63. The attitude changing unit 63 includes a horizontal moving unit 95 that horizontally moves the two vertical holding units 71, 72, etc. relative to the pusher 65. When the attitude changing unit 63 receives multiple substrates W from the pusher 65, the lifting and rotating unit 67 and the horizontal moving unit 95 place the pusher 65 in a pre-receiving state in which the two vertical holding units 71, 72 are positioned below the pusher 65. The lifting and rotating unit 67 changes the state from the pre-receiving state to a post-receiving state in which the two vertical holding units 71, 72 are positioned above the pusher 65, so that the multiple substrates W in a vertical position held by the pusher 65 are received by the two vertical holding units 71, 72. The support base rotation unit 76 rotates the support base 74 around the horizontal axis AX5, thereby converting the substrates W held by the two vertical holding units 71, 72 from a vertical position to a horizontal position.

[0136] The attitude changing section 63 can receive a plurality of substrates W from the pusher 65 by relatively moving the pusher 65 and the two vertical holding sections 71 and 72 horizontally and raising and lowering them.

[0137] Each of the multiple holding grooves 89, 90 is formed in a V-shape so that its width in the thickness direction of the substrate W narrows toward the back. This allows the multiple holding grooves 89, 90 to hold multiple substrates W in a vertical position. Also, suppose that after the substrate W is converted to a horizontal position, the two vertical holding parts 71, 72 are holding the substrate W. In this case, since the substrate W is restrained, a load will be applied to the substrate W if an attempt is made to lift and transport the substrate W. However, according to this embodiment, the two vertical holding parts 71, 72 are released, so the two holding part main bodies 84, 86 are separated from the multiple substrates W. This makes it possible to prevent a load from being applied to the substrate W.

[0138] Furthermore, in order to release the two vertical holders 71, 72, the rotation drive unit 78 rotates the two holder bodies 84, 86 around the two rotating members 83, 85 in a direction away from the two horizontal holders 69, 70 from a state in which the two holder bodies 84, 86 sandwich the multiple substrates W. This allows the two holder bodies 84, 86 to be moved away from the multiple substrates W while the two rotating members 83, 85 prevent the substrates W from shifting out of position. Example 2

[0139] Next, a second embodiment of the present invention will be described with reference to the drawings. Note that descriptions that overlap with those of the first embodiment will be omitted. Fig. 14(a) is a vertical cross-sectional view showing a pusher mechanism 61 of a second position change mechanism 31 according to the second embodiment. Fig. 14(b) is a side view showing a position change unit 63 of the second position change mechanism 31 according to the second embodiment.

[0140] 14(a). The pusher mechanism 61 of the second embodiment includes a standby tank 107 that stores liquid so that the substrate W held by the pusher 65 is immersed in the liquid when the pusher 65 is lowered, and two ejection pipes 109 that supply the liquid, such as deionized water (DIW), to the standby tank 107. The ejection pipes 109 are formed to extend linearly in the front-rear direction X or the width direction Y. The ejection pipes 109 include a plurality of ejection ports 109A (nozzles for the holder) in the direction in which the ejection pipes 109 extend. Each of the plurality of ejection ports 109A ejects deionized water. The standby tank 107 stores the deionized water ejected by the ejection pipes 109.

[0141] For example, as shown in Figures 11(c) and 11(d), when the posture change unit 63 is changing the posture of the substrate W1, the waiting substrate W2 can be immersed in pure water in the waiting tank 107, thereby preventing the substrate W2 from drying out.

[0142] It is noted that the standby tank 107 does not have to store pure water. In this case, the nozzle 109A of the jet pipe 109 may supply pure water in the form of a shower or mist to the substrate W held by the substrate holder 65. The nozzle 109A (jet pipe 109) may be positioned higher than the substrate W, as shown by the dashed line in FIG. 14(a). When pure water is supplied to the substrate W in the form of a shower or mist, the standby tank 107 may or may not be provided.

[0143] 14(b). The second position changing mechanism 31 includes a nozzle 112 for the position changing unit. The nozzle 112 supplies liquid, such as deionized water (DIW), in the form of a shower or mist to the substrate W held by the vertical holding units 71, 72 of the position changing unit 63. The nozzle 112 is provided at a position higher than the substrate W. The nozzle 112 may be configured to be movable so as not to interfere with the position changing unit 63.

[0144] For example, the support base rotation unit 76 sets the orientation of the substrate W held by the vertical holders 71 and 72 to one of a vertical orientation and an oblique orientation. In this state, the nozzle 112 supplies pure water in the form of a shower or mist to the substrate W held by the vertical holders 71 and 72. The oblique orientation is an orientation in which the device surface of the substrate faces upward.

[0145] For example, when the center robot CR suspends the transport of the substrate W, the substrate W held by the attitude changing unit 63 can be prevented from drying out. Also, if the attitude of the substrate W is horizontal during supply, the shower or mist of pure water is unlikely to reach the entire device surface. However, by changing the attitude of the substrate W to either a vertical attitude or an oblique attitude with the device surface facing upward, the shower or mist of pure water can more easily reach the entire device surface.

[0146] The substrate processing apparatus 1 may employ both the configuration shown in Fig. 14(a) and the configuration shown in Fig. 14(b). Alternatively, the substrate processing apparatus 1 may employ only one of the configuration shown in Fig. 14(a) and the configuration shown in Fig. 14(b).

[0147] If the substrate W dries before the drying process in the single wafer processing chambers SW3 and SW4, the pattern on the substrate W will collapse. However, according to this embodiment, the substrate W held by the pusher 65 can be prevented from drying. Also, the substrate W held by the two vertical holding units 71 and 72 of the attitude changing unit 63 can be prevented from drying.

[0148] The present invention is not limited to the above-described embodiment, but can be modified as follows.

[0149] (1) In each of the above-described embodiments, the lifting and rotating unit 67 moves the pusher 65, which supports 25 substrates W2 in a vertical position, to a position higher than the two vertical holding units 71, 72, etc., and then the horizontal moving unit 95 moves the two vertical holding units 71, 72, etc. below the pusher 65. In this regard, the pusher 65 and the two vertical holding units 71, 72, etc. may be moved horizontally relative to each other. Also, the pusher 65 and the two vertical holding units 71, 72, etc. may be raised and lowered relative to each other in the vertical direction Z.

[0150] 15(a), the attitude conversion unit 63 may include a horizontal movement unit 95 and a lifting / lowering unit 115. In this case, the horizontal movement unit 95 moves the two vertical holding units 71, 72 and the lifting / lowering unit 115, etc. in the width direction Y, thereby moving the two vertical holding units 71, 72, etc. below the pusher 65 (pre-receiving state). Thereafter, as shown in FIG. 15(b), the lifting / lowering unit 115 raises the vertical holding units 71, 72, etc. along the vertical direction Z, thereby receiving the substrate W held by the pusher 65 (post-receiving state).

[0151] 16(a), the pusher mechanism 61 may include a horizontal moving unit 117, and the attitude changing unit 63 may include a lifting unit 115. In this case, the horizontal moving unit 117 moves the pusher 65 in the width direction Y to move the pusher 65 above the vertical holding units 71, 72 (pre-receiving state). Thereafter, as shown in FIG. 16(b), the lifting unit 115 raises the two vertical holding units 71, 72, etc. along the vertical direction Z to receive the substrate W held by the pusher 65 (post-receiving state).

[0152] 17(a), the pusher mechanism 61 may include a horizontal moving unit 117 and an elevation rotation unit 67. In this case, the horizontal moving unit 117 moves the pusher 65 in the width direction Y to move the pusher 65 above the vertical holding units 71, 72 (pre-receiving state). Thereafter, as shown in FIG. 17(b), the elevation rotation unit 67 lowers the pusher 65 along the vertical direction Z, causing the vertical holding units 71, 72 to receive the substrate W held by the pusher 65 (post-receiving state).

[0153] The pusher mechanism 61 may include a horizontal moving unit 117 and an elevation rotation unit 67, and the attitude conversion unit 63 may include a horizontal moving unit 95 and an elevation unit 115. The elevation unit 115 and the horizontal moving unit 117 each include an electric motor. The horizontal moving unit 117 corresponds to the relative moving unit of the present invention. The elevation unit 115 corresponds to the relative elevation unit of the present invention.

[0154] (2) In the above-described embodiments and modifications, the single-wafer processing chambers SW3 and SW4 perform a drying process on the substrate W using a supercritical fluid. In this regard, each of the single-wafer processing chambers SW3 and SW4 may be provided with a rotation processing unit 45 and a nozzle 47, similar to each of the single-wafer processing chambers SW1 and SW2. In this case, each of the single-wafer processing chambers SW1 to SW4 supplies, for example, pure water and IPA to the substrate W in this order, and then performs a drying process (spin drying) on ​​the substrate W.

[0155] (3) In the above-described embodiments and modifications, each batch processing vessel BT1 to BT6 processed 50 substrates W arranged face-to-face at a half pitch. However, each batch processing vessel BT1 to BT6 may process substrates W arranged face-to-back, in which the device surfaces of all substrates W face the same direction. Each batch processing vessel BT1 to BT6 may process 25 substrates W corresponding to one carrier C arranged at a full pitch. Note that, in the case of FIG. 10(a) where 50 substrates W are arranged face-to-back, the horizontal movement unit 95 moves the two vertical holders 71, 72 in the width direction Y in which the substrates W are aligned, thereby extracting 25 substrates W1 or 25 substrates W2.

[0156] (4) In each of the above-described embodiments, the first position changing mechanism 15 changes the position of the substrate W from a horizontal position to a vertical position. In this regard, the first position changing mechanism 15 may have a configuration similar to that of the second position changing mechanism 31.

[0157] (5) In each of the above-described embodiments, the two rotating members 83, 85 are arranged with a width WD smaller than the diameter of each substrate W. However, if necessary, the two rotating members 83, 85 may be arranged with a width WD larger than the diameter of each substrate W. [Explanation of symbols]

[0158] 1... Substrate processing equipment 31 ... Second attitude conversion mechanism 59 ... Control section 61 ... Pusher mechanism 63 ... Posture conversion unit 65 ... Pusher 67 ... Elevating and rotating part AX4: Vertical axis 69,70 … Horizontal holding part 71, 72 … Vertical holding section 74 … Support stand 76 ... Support base rotation part 78 ... Rotation drive unit AX5…Horizontal axis 83 ... First rotating member 84 … First holding part main body 85 ... Second rotating member 86…Second holding part main body 89,90 … Retaining groove 91,92 … Passing groove 95,117 … Horizontal moving part 107 … Standby tank 107 115 ... Lifting section 115

Claims

1. A substrate processing apparatus that continuously performs batch processing, in which a plurality of substrates are processed at once, and single-substrate processing, in which substrates are processed one by one, a batch processing tank for processing multiple substrates at once; a batch substrate transport mechanism that transports the plurality of substrates in a vertical orientation collectively to the batch processing tank; a single wafer processing chamber for processing substrates one by one; a horizontal substrate transfer mechanism that transfers substrates in a horizontal position one by one to the single wafer processing chamber; a posture changing mechanism for changing the posture of the plurality of batch-processed substrates from a vertical posture to a horizontal posture, The attitude conversion mechanism includes: a substrate holder that holds the plurality of substrates in a vertical position and arranged at predetermined intervals; a posture changing unit that receives the plurality of substrates from the substrate holding unit and changes the received plurality of substrates from a vertical posture to a horizontal posture, The posture conversion unit is two horizontal holding units for accommodating the plurality of substrates, the two horizontal holding units on which the plurality of substrates are placed when the plurality of substrates are in a horizontal position; two vertical holding units that hold the plurality of substrates accommodated by the two horizontal holding units in a vertical position when the plurality of substrates are in a vertical position; a support base that supports the two horizontal holding portions and the two vertical holding portions; a support base rotation unit that rotates the support base around a horizontal axis; a state change unit that changes the state of the two vertical holding units between a holding state in which the two vertical holding units can hold the plurality of substrates and a release state in which the holding state is released, The first vertical holding portion of the two vertical holding portions is a first rotating member extending perpendicular to a support surface of the support base; a first holding portion main body provided so as to protrude from the first rotating member in a direction perpendicular to the direction in which the first rotating member extends, The second vertical holding portion of the two vertical holding portions is a second rotating member extending perpendicular to the support surface of the support base; a second holding portion main body provided so as to protrude from the second rotating member in a direction perpendicular to the direction in which the second rotating member extends, the first holding body and the second holding body each include a plurality of holding grooves provided along a direction in which the plurality of substrates are aligned, the state change unit rotates the first holding unit body and the second holding unit body around the first rotating member and the second rotating member, respectively, to place the two vertical holding units in the holding state or the released state; when holding the plurality of substrates, the state changer places the two vertical holders in the holding state, thereby sandwiching the plurality of substrates between the first holder body and the second holder body; The substrate processing apparatus is characterized in that, when the plurality of substrates held by the two vertical holding parts are converted from a vertical position to a horizontal position by the support base rotation part, the state change part puts the two vertical holding parts into the released state, thereby separating the first holding part main body and the second holding part main body from the plurality of substrates.

2. 2. The substrate processing apparatus according to claim 1, The substrate processing apparatus, wherein the first rotating member and the second rotating member are arranged with a width smaller than a diameter of each substrate.

3. 3. The substrate processing apparatus according to claim 1, The substrate processing apparatus further comprises a horizontal rotation unit that rotates the substrate holding unit around a vertical axis.

4. 3. The substrate processing apparatus according to claim 1, each of the first holding body and the second holding body further includes a plurality of passage grooves, each of which is provided along a direction in which the plurality of substrates are aligned, for passing one substrate therethrough; the plurality of holding grooves and the plurality of passing grooves are arranged alternately one by one so that the plurality of holding grooves hold first divided substrate groups in which every other divided substrate among the plurality of substrates is aligned, The substrate processing apparatus is characterized in that the posture conversion unit receives the first group of divided substrates from the substrate holding unit and converts the received first group of divided substrates from a vertical posture to a horizontal posture.

5. 3. The substrate processing apparatus according to claim 1, a relative moving unit that moves the substrate holding unit and the two vertical holding units horizontally relative to each other; a relative lifting unit that lifts and lowers the substrate holding unit and the two vertical holding units relative to each other in the vertical direction, when the posture conversion unit receives the plurality of substrates from the substrate holding unit, the relative movement unit and the relative lifting unit place the two vertical holding units below the substrate holding unit in a pre-receiving state, the relative lifting unit changes the pre-receiving state to a post-receiving state in which the two vertical holding units are disposed above the substrate holding unit, thereby receiving the plurality of substrates in a vertical position held by the substrate holding units with the two vertical holding units; A substrate processing apparatus characterized in that the support table rotation unit rotates the support table around the horizontal axis, thereby converting the multiple substrates held by the two vertical holding units from a vertical position to a horizontal position.

6. 3. The substrate processing apparatus according to claim 1, The substrate processing apparatus further comprises a standby tank for storing the liquid so that the plurality of substrates held by the substrate holders are immersed in the liquid.

7. 3. The substrate processing apparatus according to claim 1, 10. The substrate processing apparatus according to claim 9, wherein each of said plurality of holding grooves is formed in a V-shape so that the width in the thickness direction of the substrate becomes narrower toward the back.

8. 3. The substrate processing apparatus according to claim 2, A substrate processing apparatus characterized in that the state change unit rotates the first holding unit body and the second holding unit body around the first rotating member and the second rotating member, respectively, in a direction away from the two horizontal holding units from a state in which the first holding unit body and the second holding unit body clamp the multiple substrates, in order to put the two vertical holding units into the released state.

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