Substrate Processing Equipment

Abstract

To provide a substrate processing apparatus that can prevent a substrate from drying during substrate transport from a batch processing area to a single substrate processing area.SOLUTION: A processing block 7 of a substrate processing apparatus 1 includes a wet transfer area R5 adjacent to a batch processing area R1 and a single substrate transfer area R3. In the wet transfer area R5, a second posture conversion unit 55 that is provided on an extension line of the row of six batch processing tanks BT1 to BT6 and converts the plurality of substrates subjected to an immersion process from a vertical posture to a horizontal posture, a belt conveyor mechanism 57 that receives horizontally-positioned substrates one by one from the second posture conversion unit 55 and conveys them to the single substrate transfer area R3, and a liquid supply unit that supplies liquid to wet the substrate transferred by the belt conveyor mechanism 57.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to a substrate processing apparatus for processing substrates. Examples of the substrate include semiconductor substrates, FPD (Flat Panel Display) substrates, photomask glass substrates, optical disk substrates, magnetic disk substrates, ceramic substrates, and solar cell substrates. Examples of the FPD include liquid crystal display devices and organic EL (electroluminescence) display devices. [Background technology]

[0002] A conventional substrate processing apparatus is a hybrid type substrate processing apparatus that includes a batch processing module (batch processing section) that processes multiple substrates at once, and a single-wafer processing module (single-wafer processing section) that processes the substrates processed in the batch processing module one by one (see, for example, Patent Documents 1 and 2). After being converted to a horizontal position, the multiple substrates processed in the batch processing module are transferred one by one to the single-wafer processing module by a transfer robot.

[0003] Patent Document 3 discloses a submerged loader that includes a liquid tank, an arm on which a cassette (carrier) that stores a large number of thin plates is placed, a lifting device that raises and lowers the arm, and a pusher (push-out member) that pushes the thin plates from the cassette onto a conveyor. The submerged loader immerses the cassette placed on the arm into the liquid. When using thin plates, the submerged loader brings the uppermost thin plates one by one onto the liquid surface, and pushes the thin plates that have risen to the liquid surface onto the conveyor using the pusher. The pushed-out thin plates are sent to the next processing device. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Special Publication No. 2016-502275 [Patent Document 2] Patent Publication No. 2021-064652 [Patent Document 3] Publication number 03-006581 Summary of the Invention [Problem to be solved by the invention]

[0005] However, conventional substrate processing apparatuses have the following problem: After processing multiple substrates in a batch processing module, they must be transported from a batch processing area where the batch processing module is installed to a single-wafer processing area where a single-wafer processing module is installed. If the substrates dry out during this transport, the patterns formed on the substrates will collapse.

[0006] The present invention has been made in consideration of the above circumstances, and aims to provide a substrate processing apparatus that can prevent substrates from drying out when transporting them from a batch processing area to a single wafer processing area. [Means for solving the problem]

[0007] In order to achieve the above object, the present invention has the following configuration: That is, a substrate processing apparatus according to the present invention is a substrate processing apparatus that successively performs batch processing for processing a plurality of substrates collectively and single wafer processing for processing substrates one by one, and includes a carrier mounting shelf for mounting a carrier that stores a plurality of substrates in a horizontal position and vertically spaced at predetermined intervals, a transfer block adjacent to the carrier mounting shelf, and a processing block adjacent to the transfer block, wherein the transfer block includes a first position conversion mechanism that converts the plurality of substrates taken out from the carrier from a horizontal position to a vertical position, and a second position conversion mechanism that converts the plurality of substrates taken out from the carrier from a horizontal position to a vertical position, and a second position conversion mechanism that converts the plurality of substrates taken out from the carrier from a horizontal position to a vertical position. a substrate handling mechanism that collectively removes the plurality of substrates from the carrier placed on the carrier placement shelf and transports them to the first attitude conversion mechanism, and returns the processed substrates to the carrier placed on the carrier placement shelf; the processing block includes a batch processing area extending in a direction away from the transfer block, a batch substrate transport area that is provided along the batch processing area and has one end extending to the transfer block and the other end extending in a direction away from the transfer block, and a single substrate transport area that extends in a direction away from the transfer block. a single substrate processing area provided along the single substrate transport area, a single substrate processing area provided along the single substrate transport area, and a wet transport area adjacent to the batch processing area and the single substrate transport area, wherein the batch processing area has a plurality of batch processing tanks arranged in a direction in which the area extends, and the wet transport area has a second position change mechanism provided on an extension line of the row of the plurality of batch processing tanks, which changes the plurality of substrates that have been subjected to the immersion processing from a vertical position to a horizontal position, and a second position change mechanism which receives the substrates in a horizontal position one by one from the second position change mechanism and transfers the substrates to the wet transport area. A belt conveyor mechanism for transporting substrates to a single substrate transport area and a liquid supply unit for supplying liquid to wet the substrates transported by the belt conveyor mechanism are provided, and the single substrate processing area has a plurality of single substrate processing chambers arranged in the direction in which the area extends, and the single substrate transport area has a single substrate transport mechanism that can receive horizontally oriented substrates transported by the belt conveyor mechanism, transport them to the single substrate processing chambers, and unload the substrates processed in the single substrate processing chambers, and the batch substrate transport area hasA batch substrate transport mechanism is provided to transport multiple substrates collectively between a substrate transfer position determined within the transfer block, the multiple batch processing tanks, and the second attitude conversion mechanism.

[0008] In the substrate processing apparatus according to the present invention, the wet transport region is adjacent to the batch processing region and the single substrate transport region. The wet transport region is provided with a second position change mechanism, a belt conveyor mechanism, and a liquid supply unit. The second position change mechanism is provided on an extension of the row of multiple batch processing tanks and converts multiple substrates that have undergone immersion processing from a vertical position to a horizontal position. The belt conveyor mechanism receives horizontally positioned substrates one by one from the second position change mechanism and transports them to the single substrate transport region. The liquid supply unit supplies liquid to wet the substrates being transported by the belt conveyor mechanism. The belt conveyor mechanism transports the substrates wetted by the liquid supply unit from the second position change mechanism to the single substrate transport region. The single substrate transport mechanism in the single substrate transport region receives the horizontally positioned substrates transported by the belt conveyor mechanism and transports them to the single substrate processing chamber. This prevents the substrates from drying out during substrate transport from the batch processing region to the single substrate processing region.

[0009] Furthermore, even if the single substrate transport area is separated from the batch processing area, the belt conveyor mechanism transports the substrate, making it easy for the single substrate transport mechanism to receive the substrate. Furthermore, the belt conveyor mechanism and liquid supply unit can prevent the substrate from drying out. This allows the transport path to be longer, thereby increasing the degree of freedom in the arrangement of the batch processing area and the single substrate processing area.

[0010] In the substrate processing apparatus described above, it is preferable that the single substrate transport area is interposed between the batch processing area and the single substrate processing area, whereby the transfer block, the batch processing area, and the single substrate processing area can be arranged with the single substrate transport area at the center.

[0011] In the above-described substrate processing apparatus, it is preferable that the single wafer processing area is provided with a first single wafer processing chamber and a second single wafer processing chamber as the plurality of single wafer processing chambers, and further provided with a second single wafer substrate transfer mechanism for transferring substrates between the two chambers, and that the single wafer substrate transfer mechanism receives horizontally oriented substrates transferred by the belt conveyor mechanism and transfers them to the first single wafer processing chamber, and unloads the substrates processed in the second single wafer processing chamber. In this way, substrates are transferred by two single wafer substrate transfer mechanisms, thereby improving throughput.

[0012] In the substrate processing apparatus described above, the single wafer processing area is preferably located between the batch processing area and the single wafer transfer area, so that the area on the opposite side of the single wafer processing area via the single wafer transfer area can be used as a second single wafer processing area, allowing for the arrangement of many single wafer processing chambers.

[0013] In the substrate processing apparatus described above, it is preferable that the wet transport area is provided at one end of the batch processing area, opposite the side where the transfer block is provided, and the belt conveyor mechanism is provided so as to go around the single wafer processing area in a plan view when the single wafer processing area intervenes and it is not possible to transport the substrate in a straight line from the second position conversion mechanism to the single wafer substrate transport area. Since the belt conveyor mechanism can transport the substrate while going around obstacles, the degree of freedom in the arrangement of the single wafer processing area, etc. can be increased.

[0014] In the substrate processing apparatus described above, the wet transfer area is preferably located between the transfer block and the batch processing area. This allows the wet transfer area to be positioned near the transfer block. Therefore, the single-substrate transfer mechanism can transfer substrates using the transfer block as a base point. Furthermore, since the chemical treatment tank can be located away from the transfer block, adverse effects such as corrosion of the substrate handling mechanism of the transfer block due to the chemical atmosphere can be suppressed.

[0015] Furthermore, in the above-described substrate processing apparatus, the single wafer processing area is provided with a first single wafer processing chamber and a second single wafer processing chamber as the plurality of single wafer processing chambers, and a second single wafer substrate transport area is further provided between the two chambers, the wet transport area is provided at one end of the batch processing area, opposite the side where the transfer block is provided, the single wafer transport area has a transfer block side transport area on the transfer block side and a belt conveyor side transport area on the belt conveyor mechanism side, and the second single wafer substrate transport area and the belt conveyor side transport area are provided with a second single wafer substrate transport mechanism that receives horizontally oriented substrates transported by the belt conveyor mechanism and transports them to the first single wafer processing chamber, and also transports substrates processed in the first single wafer processing chamber to the second single wafer processing chamber, and the single wafer substrate transport mechanism preferably transports substrates processed in the second single wafer processing chamber out of the single wafer processing chamber.

[0016] This allows the single substrate transport mechanism to transport only substrates that have been dried, and the second single substrate transport mechanism to transport only wet substrates.

[0017] Furthermore, in the substrate processing apparatus described above, the second attitude changing mechanism is an intra-tank carrier having an entrance / exit for introducing and removing substrates, and two side walls on which a plurality of pairs of holding grooves for storing the plurality of substrates that have passed through the entrance / exit, the intra-tank carrier being disposed opposite the entrance / exit across the plurality of substrates and having a back-side opening having a width smaller than the diameter of each substrate in the radial direction of each substrate; an immersion tank for storing immersion liquid so that the intra-tank carrier is immersed in the immersion liquid; a carrier support part for supporting the intra-tank carrier from below; a carrier elevating part for raising and lowering the carrier support part; and In order to convert the substrates from a vertical position to a horizontal position, the apparatus includes a rotation mechanism that rotates the intra-tank carrier around two horizontally extending rotating shafts while clamping the two side walls of the intra-tank carrier with the two rotating shafts, a push-out member for pushing out one substrate stored in the intra-tank carrier, and a push-out member advance / retract section that moves the push-out member forward and backward horizontally, and it is preferable that when the multiple substrates stored in the intra-tank carrier are in a horizontal position, the push-out member advance / retract section pushes out the one substrate through the entrance / exit while entering the push-out member into the intra-tank carrier from the back opening.

[0018] The second position change mechanism includes an immersion tank that can immerse the intra-tank carrier in immersion liquid. This prevents the substrates stored in the intra-tank carrier from drying out. The push-out member advance / retract unit also uses the push-out member to push out the substrates stored in the intra-tank carrier. This allows the substrates to be removed from the intra-tank carrier without the need to insert the hand of the single-substrate transport mechanism. [Effects of the Invention]

[0019] According to the substrate processing apparatus of the present invention, it is possible to prevent the substrates from drying out when they are transported from the batch processing area to the single wafer processing area. [Brief explanation of the drawings]

[0020] [Figure 1]1 is a plan view showing a schematic configuration of a substrate processing apparatus according to a first embodiment. [Figure 2] FIG. 2 is a side view showing the substrate handling mechanism. [Figure 3] 10(a) to 10(c) are side views illustrating the first position changing mechanism (the position changing unit and the pusher mechanism). [Figure 4] FIG. 4 is a longitudinal cross-sectional view of the second attitude change unit as seen from the front. [Figure 5] 1(a) is a vertical cross-sectional view of the second position change unit as seen from the left side, and FIG. 1(b) is a plan view showing the second position change unit. [Figure 6] FIG. 2(a) is a plan view showing the belt conveyor mechanism, and FIG. 2(b) is a left side view showing the belt conveyor mechanism and the shower head. [Figure 7] 10 is a flowchart illustrating an operation of the substrate processing apparatus. [Figure 8] 10(a) to 10(c) are front views for explaining the operation of the attitude changing unit. [Figure 9] 10(a) to 10(c) are front views for explaining the operation of the attitude changing unit. [Figure 10] FIG. 10 is a front view for explaining the operation of the attitude conversion unit. [Figure 11] 10(a) and 10(b) are diagrams for explaining the operation of unloading a substrate from an intra-tank carrier. [Figure 12] FIG. 10 is a plan view showing a schematic configuration of a substrate processing apparatus according to a second embodiment. [Figure 13] FIG. 10 is a plan view showing a schematic configuration of a substrate processing apparatus according to a modified example of the second embodiment. [Figure 14] 5A and 5B are side views illustrating the operation of a direction changer of the belt conveyor mechanism. [Figure 15] FIG. 10 is a plan view showing a schematic configuration of a substrate processing apparatus according to a third embodiment. [Figure 16] FIG. 10 is a plan view showing a schematic configuration of a substrate processing apparatus according to a fourth embodiment. [Figure 17] FIG. 10 is a side view showing a belt conveyor mechanism according to a modified example. Example 1

[0021] A first embodiment of the present invention will be described below with reference to the drawings. Fig. 1 is a plan view showing a schematic configuration of a substrate processing apparatus 1 according to the first embodiment. Fig. 2 is a side view showing a substrate handling mechanism HTR. Figs. 3(a) to 3(c) are side views for explaining a first position changing mechanism 15 (position changing unit 23 and pusher mechanism 25).

[0022] <1. Overall structure> 1, the substrate processing apparatus 1 includes a stocker block 3, a transfer block 5, and a processing block 7. The stocker block 3, the transfer block 5, and the processing block 7 are arranged in this order in a single horizontal row.

[0023] The substrate processing apparatus 1 performs, for example, chemical processing, cleaning processing, drying processing, etc. on the substrates W. The substrate processing apparatus 1 successively performs batch processing and single wafer processing on the substrates W. That is, the substrate processing apparatus 1 performs batch processing and then single wafer processing on the substrates W. Batch processing is a processing method in which multiple substrates W are processed at once. Single wafer processing is a processing method in which substrates W are processed one by one.

[0024] For convenience, in this specification, the direction in which the stocker block 3, transfer block 5, and processing block 7 are lined up is referred to as the "front-rear direction X." The front-rear direction X is horizontal. Within the front-rear direction X, the direction from the transfer block 5 toward the stocker block 3 is referred to as the "front." The direction opposite to the front is referred to as the "rear." The horizontal direction perpendicular to the front-rear direction X is referred to as the "width direction Y." One direction in the width direction Y is referred to as the "right" as appropriate. The direction opposite to the right is referred to as the "left." The direction perpendicular to the horizontal direction is referred to as the "vertical direction Z." For example, in Figure 1, for reference, front, back, right, left, top, and bottom are indicated as appropriate.

[0025] <2. Stocker Block> The stocker block 3 accommodates at least one carrier C. The stocker block 3 is provided with one or more (for example, two) load ports 9. The stocker block 3 is equipped with a carrier transport mechanism (robot) 11 and shelves 13.

[0026] The carrier transport mechanism 11 transports the carrier C between the load port 9 and the shelf 13. The carrier transport mechanism 11 is equipped with a gripping portion that grips a protrusion on the top surface of the carrier C, or a hand that supports the carrier C while contacting the bottom surface of the carrier C. The shelf 13 is divided into a shelf 13A for removing and storing the substrates W, and a shelf 13B for storage.

[0027] The shelf 13A is arranged adjacent to the transfer block 5. The shelf 13A may be provided with a mechanism for attaching and detaching the lid of the carrier C. At least one shelf 13A is provided. The carrier C is placed on the shelf 13A. The carrier C stores a plurality of substrates W (e.g., 25 substrates) in a horizontal position in the vertical direction Z at predetermined intervals (e.g., 10 mm intervals). The substrates W are aligned in the thickness direction of the substrates W. For example, a FOUP (Front Opening Unify Pod) is used as the carrier C. A FOUP is a sealed container. The carrier C may be an open container and any type of container is acceptable. The shelf 13A corresponds to the carrier placement shelf of the present invention.

[0028] <3. Transfer block> The transfer block 5 is disposed adjacent to the rear X of the stocker block 3. The transfer block 5 includes a substrate handling mechanism (robot) HTR and a first attitude conversion mechanism 15.

[0029] The substrate handling mechanism HTR is provided on the right Y side within the transfer block 5. The substrate handling mechanism HTR picks up a plurality of substrates W (e.g., 25 substrates) all at once from a carrier C placed on the loading shelf 13A and transports them to the first position change mechanism 15. The substrate handling mechanism HTR also returns the substrates W that have been processed on a single wafer basis to the carrier C placed on the loading shelf 13A. For example, the substrate handling mechanism HTR picks up a plurality of substrates W (e.g., 25 substrates) from the buffer unit 33 and returns the plurality of substrates W to the carrier C placed on the loading shelf 13A. The substrate handling mechanism HTR can transport a plurality of substrates W between the carrier C placed on the shelf 13A, the first position change mechanism 15, and the buffer unit 33.

[0030] Please refer to Figure 2. The substrate handling mechanism HTR has a plurality of (e.g., 25) hands 17. For convenience of illustration, in Figure 2, the substrate handling mechanism HTR is shown to have three hands 17. Each hand 17 holds one substrate W.

[0031] The substrate handling mechanism HTR also includes a hand support unit 19, an advancing / retreating unit 20, and an elevation rotation unit 21. The hand support unit 19 supports a plurality of hands 17. This allows the plurality of hands 17 to move as a unit. The advancing / retreating unit 20 moves the plurality of hands 17 forward and backward via the hand support unit 19. The elevation rotation unit 21 rotates the advancing / retreating unit 20 about the vertical axis AX1, thereby rotating the plurality of hands 17, etc. about the vertical axis AX1. The elevation rotation unit 21 also raises and lowers the advancing / retreating unit 20, thereby raising and lowering the plurality of hands 17, etc. The elevation rotation unit 21 is fixed to the floor surface. In other words, the elevation rotation unit 21 does not move horizontally. The advancing / retreating unit 20 and the elevation rotation unit 21 each include an electric motor. The substrate handling mechanism HTR may include a hand (not shown) for transporting one substrate W, in addition to the hand 17 and the hand support part 19.

[0032] Please refer to Figure 1. The first position change mechanism 15 changes the position of multiple substrates W collectively from a horizontal position to a vertical position. The first position change mechanism 15 includes a position change unit 23 and a pusher mechanism 25. In Figure 1, the substrate handling mechanism HTR, the position change unit 23, and the pusher mechanism 25 are arranged on the left side Y in this order. Figures 3(a) to 3(c) are diagrams for explaining the first position change mechanism 15.

[0033] As shown in FIG. 3(a), the posture conversion unit 23 includes a support base 23A, a pair of horizontal holding units 23B, a pair of vertical holding units 23C, and a rotation drive unit 23D. The pair of horizontal holding units 23B and the pair of vertical holding units 23C are provided on the support base 23A. The horizontal holding units 23B and the vertical holding units 23C receive multiple substrates W transported by the substrate handling mechanism HTR. When the substrates W are in a horizontal posture, the pair of horizontal holding units 23B contact the underside of each substrate W and support the substrates W from below. When the substrates W are in a vertical posture, the pair of vertical holding units 23C hold the substrates W.

[0034] The rotation drive unit 23D supports the support table 23A so that the support table 23A can rotate about the horizontal axis AX2. Furthermore, the rotation drive unit 23D rotates the support table 23A about the horizontal axis AX2, thereby converting the orientation of the plurality of substrates W held by the holders 23B and 23C from horizontal to vertical.

[0035] As shown in Fig. 3(c), the pusher mechanism 25 includes a pusher 25A, an elevation rotation unit 25B, a horizontal movement unit 25C, and a rail 25D. The pusher 25A supports the lower portion of each of a plurality of (e.g., 25) vertically oriented substrates W. For convenience of illustration, in Figs. 3(a) to 3(f), the pusher 25A is shown supporting three substrates W.

[0036] The lifting and rotating unit 25B is connected to the underside of the pusher 25A. The lifting and rotating unit 25B extends and retracts to raise and lower the pusher 25A in the vertical direction. The lifting and rotating unit 25B also rotates the pusher 25A around the vertical axis AX3. This allows the orientation of the device surface of the substrate W, indicated by the arrow AR, to be set in any direction. The horizontal moving unit 25C supports the lifting and rotating unit 25B. The horizontal moving unit 25C moves the pusher 25A and the lifting and rotating unit 25B horizontally along the rail 25D. The rail 25D is formed to extend in the width direction Y. The rotation driving unit 23D, the lifting and rotating unit 25B, and the horizontal moving unit 25C each include an electric motor.

[0037] Here, we will explain the operation of the first position changing mechanism 15. The batch processing tanks BT1 to BT6, which will be described later, in the processing block 7 collectively process, for example, 25 substrates W in one carrier C. Therefore, the first position changing mechanism 15 collectively changes the position of the 25 substrates W taken out of the carrier C from a horizontal position to a vertical position.

[0038] See Figure 3(a). The attitude conversion unit 23 receives the 25 substrates W transported by the substrate handling mechanism HTR at the holders 23B and 23C. At this time, the 25 substrates W are in a horizontal position with their device surfaces facing upward. The 25 substrates W are arranged at a predetermined interval (full pitch). The full pitch is, for example, 10 mm apart. The full pitch is also called the normal pitch. The half pitch is half the full pitch.

[0039] The device surface of the substrate W is the surface on which electronic circuits are formed and is called the "front surface." The back surface of the substrate W is the surface on which electronic circuits are not formed. The surface opposite the device surface is called the back surface.

[0040] See Figure 3(b). The attitude conversion unit 23 rotates the holders 23B and 23C by 90 degrees around the horizontal axis AX2 to convert the 25 substrates W from a horizontal attitude to a vertical attitude. See Figure 3(c). The pusher mechanism 25 raises the pusher 25A to a position higher than the holders 23B and 23C of the attitude conversion unit 23. As a result, the pusher 25A receives the 25 substrates W from the holders 23B and 23C. The 25 substrates W held by the pusher 25A face leftward Y. Note that the arrow AR indicates the orientation of the device surfaces of the substrates W.

[0041] Thereafter, the pusher mechanism 25 moves the pushers 25A holding the 25 substrates W along the rails 25D to a substrate transfer position PP below a pair of chucks 29, 30 of a transport mechanism WTR (described later).

[0042] <4. Processing Block 7> The processing block 7 is adjacent to the transfer block 5. The processing block 7 is arranged behind the transfer block 5 in the X direction. The processing block 7 includes a batch processing area R1, a batch substrate transport area R2, a single substrate transport area R3, a single substrate processing area R4, and a wet transport area R5.

[0043] <4-1. Batch processing area R1> The batch processing region R1 is adjacent to the transfer block 5, batch substrate transport region R2, single substrate transport region R3, and wet transport region R5. The batch processing region R1 is also interposed between the batch substrate transport region R2 and single substrate transport region R3 in the width direction Y. The batch processing region R1 is also interposed between the transfer block 5 and the wet transport region R5 in the front-rear direction X. One end of the batch processing region R1 is adjacent to the transfer block 5. The other end of the batch processing region R1 (i.e., the batch processing region R1) extends in a direction away from the transfer block 5 (rearward X).

[0044] The batch processing region R1 is provided with, for example, six batch processing tanks BT1 to BT6. The six batch processing tanks BT1 to BT6 are aligned in a line in the direction in which the batch processing region R1 extends (the front-rear direction X). Each of the six batch processing tanks BT1 to BT6 immerses a plurality of substrates W in a single batch. For example, the six batch processing tanks BT1 to BT6 are composed of four chemical processing tanks BT1 to BT4 and two water rinsing processing tanks BT5 and BT6. Specifically, two chemical processing tanks BT1 and BT2 and the water rinsing processing tank BT5 form one set. Two chemical processing tanks BT3 and BT4 and the water rinsing processing tank BT6 form another set. The combination of chemical processing tanks and water rinsing processing tanks is not limited to this example. The number of batch processing tanks is not limited to six, and may be any plural number.

[0045] Each of the four chemical treatment tanks BT1 to BT4 performs etching treatment using a chemical solution. For example, phosphoric acid is used as the chemical solution. The chemical treatment tank BT1 stores the chemical solution supplied from a chemical solution jetting pipe (not shown). The chemical solution jetting pipe is provided on the inner wall of the chemical treatment tank BT1. Each of the three chemical treatment tanks BT2 to BT4 has the same configuration as the chemical treatment tank BT1.

[0046] Each of the two water-rinsing processing tanks BT5, BT6 performs a pure water cleaning process in which chemicals adhering to a plurality of substrates W are washed away with pure water. Deionized water (DIW), for example, is used as the pure water. Each of the two water-rinsing processing tanks BT5, BT6 stores pure water supplied from a cleaning liquid jetting pipe (not shown). The cleaning liquid jetting pipe is provided on the inner wall of each of the water-rinsing processing tanks BT5, BT6.

[0047] Six lifters LF1 to LF6 are provided for the six batch processing tanks BT1 to BT6, respectively. For example, the lifter LF1 holds multiple substrates W in a vertical position arranged at a predetermined interval (for example, 10 mm (full pitch)). The lifter LF1 also raises and lowers the multiple substrates W between a processing position inside the batch processing tank (chemical processing tank) BT1 and a transfer position above the batch processing tank BT1. The other five lifters LF2 to LF6 are configured similarly to the lifter LF1.

[0048] <4-2. Batch substrate transport area R2> The batch substrate transport region R2 is adjacent to the transfer block 5, the batch processing region R1, and the wet transfer region R5. The batch substrate transport region R2 is provided along the batch processing region R1. One end of the batch substrate transport region R2 extends to the transfer block 5, and the other end extends in a direction away from the transfer block 5 (rearward X). The batch substrate transport region R2 extends parallel to the batch processing region R1.

[0049] The batch substrate transfer region R2 has a transfer mechanism (robot) WTR. That is, the transfer mechanism WTR is provided in the batch substrate transfer region R2. The transfer mechanism WTR transfers multiple (e.g., 25) substrates W in a vertical position all at once between a substrate transfer position PP defined in the transfer block 5, for example, six batch processing baths BT1 to BT6, and the second position conversion unit 55.

[0050] The transport mechanism WTR includes a pair of chucks 29, 30 and a guide rail 31. Each of the chucks 29, 30 includes, for example, 25 holding grooves for holding 25 substrates W. The two chucks 29, 30 each extend parallel to the width direction Y (FIG. 1) in a plan view. The transport mechanism WTR opens and closes the two chucks 29, 30. The transport mechanism WTR moves the pair of chucks 29, 30 along the guide rail 31. The transport mechanism WTR is driven by an electric motor.

[0051] <4-3. Single-substrate transport area R3> The single substrate transport region R3 is adjacent to the transfer block 5, the batch processing region R1, the single substrate processing region R4, and the wet transfer region R5. The single substrate transport region R3 is located between the batch processing region R1 and the single substrate processing region R4. One end of the single substrate transport region R3 is adjacent to the transfer block 5. The other end of the single substrate transport region R3 (i.e., the single substrate transport region R3) extends in a direction away from the transfer block 5 (rearward X).

[0052] The single substrate transport region R3 is provided with a first center robot CR1 and a buffer unit 33. The first center robot CR1 transports a substrate W in a horizontal position between a belt conveyor mechanism 57 (described later), a first single substrate processing chamber SW1 (described later), a second single substrate processing chamber SW2 (described later), and the buffer unit 33. The first center robot CR1 includes two hands 35, an advancing / retreating unit 37, an elevating / rotating unit 39, and a horizontal moving unit 41 (including a guide rail).

[0053] Each of the two hands 35 holds one substrate W in a horizontal position. The first hand 35 is used to transport a wet substrate W, and the second hand 35 is used to transport a dried substrate W. The advancing / retracting unit 37 movably supports the two hands 35 and individually advances and retreats the two hands 35. The lifting / rotating unit 39 rotates the hand 35 and the advancing / retracting unit 37 about a vertical axis AX4. The lifting / rotating unit 39 also raises and lowers the hand 35 and the advancing / retracting unit 37. The guide rail is provided along the extension direction of the single-substrate transport region R3 and is provided on the floor surface of the single-substrate transport region R3. The horizontal moving unit 41 moves the two hands 35 and the advancing / retracting unit 37 in the forward / backward direction X along the guide rail. The advancing / retracting unit 37, the lifting / rotating unit 39, and the horizontal moving unit 41 each include an electric motor.

[0054] For example, the advancing / retracting unit 37 advances the first hand 35 to receive the substrate W from the belt conveyor mechanism 57. Thereafter, the advancing / retracting unit 37 advances the first hand 35 to transport one substrate W to the first single-wafer processing chamber SW1. Note that the first center robot CR1 may be equipped with three or more hands 35. When equipped with three or more hands 35, the first center robot CR1 advances and retracts the three or more hands 35 individually.

[0055] The buffer unit 33 is equipped with a plurality of loading shelves. Each of the plurality of loading shelves is in a horizontal position. Each of the plurality of loading shelves can load one substrate W. The buffer unit 33 loads the plurality of substrates W in a horizontal position at a predetermined interval (full pitch) in the vertical direction Z. In other words, the plurality of loading shelves are arranged at a predetermined interval (full pitch) in the vertical direction Z. The buffer unit 33 is configured, for example, to be able to load at least 25 substrates W that can be transported by the substrate handling mechanism HTR. Note that the buffer unit 33 may be configured to be able to load 2 or more but less than 25 substrates W.

[0056] The buffer unit 33 may be disposed across the transfer block 5 and the single substrate transport area R3. That is, the buffer unit 33 may be provided at the boundary between the transfer block 5 and the single substrate transport area R3. The buffer unit 33 may also be provided only in the transfer block 5. Therefore, the buffer unit 33 may be fixedly provided at either the boundary between the transfer block 5 and the single substrate transport area R3, the transfer block 5, or the single substrate transport area R3. The first center robot CR1 corresponds to the single substrate transport mechanism of the present invention.

[0057] <4-4. Single wafer processing area R4> The single wafer processing area R4 is adjacent to the transfer block 5 and the single substrate transport area R3. One end of the single wafer processing area R4 is adjacent to the transfer block 5, and the other end extends in a direction (rearward X) away from the transfer block 5. The single wafer processing area R4 is also provided along the batch processing area R1 and the single substrate transport area R3.

[0058] A plurality of (for example, two) single wafer processing chambers SW1 and SW2 are provided in the single wafer processing region R4. The two single wafer processing chambers SW1 and SW2 are aligned in the front-rear direction X along which the single wafer processing region R4 extends. Each of the single wafer processing chambers SW1 and SW2 processes one substrate W at a time. The first single wafer processing chamber SW1 is located at the farthest position from the transfer block 5. The second single wafer processing chamber SW2 is located in front of the first single wafer processing chamber SW1 in the X direction. The two single wafer processing chambers SW1 and SW2 may be configured in multiple stages. For example, six single wafer processing chambers may be arranged with two in the front-rear direction X (horizontal direction) and three in the vertical direction Z.

[0059] For example, the first single-wafer processing chamber SW1 includes a rotation processing unit 45 and a nozzle 47. The rotation processing unit 45 includes a spin chuck that holds one substrate W in a horizontal position, and an electric motor that rotates the spin chuck around a vertical axis that passes through the center of the substrate W.

[0060] The nozzle 47 supplies a processing liquid to the substrate W held in the rotary processing unit 45. The nozzle 47 is moved between a standby position away from the rotary processing unit 45 and a supply position above the rotary processing unit 45. For example, deionized water (DIW) and IPA (isopropyl alcohol) are used as the processing liquid. In the first single-wafer processing chamber SW1, for example, after cleaning the substrate W with deionized water, a preliminary drying process may be performed with IPA, or a liquid film of IPA may be formed on the upper surface of the substrate W.

[0061] The second single-wafer processing chamber SW2 performs a drying process using, for example, a supercritical fluid. Carbon dioxide, for example, is used as the fluid. The second single-wafer processing chamber SW2 includes a chamber main body (container) 48, a support tray 49, a lid 51, and three lift pins 52. The chamber main body 48 includes an internal processing space 48A, an opening for inserting a substrate W into the processing space 48A, a supply port, and an exhaust port. The support tray 49 includes three holes 49A for passing the three lift pins 52. The three lift pins 52 are movable up and down. When the support tray 49 shown in FIG. 1 is removed from the processing space 48A, the three lift pins 52 can pass through the three holes 49A, respectively. This allows the three lift pins 52 to lift the substrate W from the support tray 49 and lower it onto the support tray 49. The first center robot CR1 and the second center robot CR2 (described later) can each transfer the substrate W when the three lift pins 52 are raised.

[0062] The substrate W is accommodated in the processing space 48A while being supported on a support tray 49. A lid 51 closes the opening of the chamber main body 48. For example, the second single-wafer processing chamber SW2 brings a fluid to a supercritical state and supplies the supercritical fluid from a supply port to the processing space in the chamber main body 48. At this time, the gas in the processing space 48A in the chamber main body 48 is exhausted from an exhaust port. The supercritical fluid supplied to the processing space 48A performs a drying process on the substrate W.

[0063] The supercritical state is achieved by adjusting the fluid to its specific critical temperature and critical pressure. Specifically, when the fluid is carbon dioxide, the critical temperature is 31°C and the critical pressure is 7.38 MPa. In the supercritical state, the surface tension of the fluid becomes almost zero. Therefore, the gas-liquid interface does not affect the pattern on the substrate W. Therefore, the pattern on the substrate W is less likely to collapse.

[0064] Furthermore, the single wafer processing region R4 is further provided with a second central robot CR2 that transports substrates W between the first single wafer processing chamber SW1 and the second single wafer processing chamber SW2. The second central robot CR2 transports substrates W from the first single wafer processing chamber SW1 to the second single wafer processing chamber SW2. The second central robot CR2 is configured similarly to the first central robot CR1, except that the lower end of the lifting and rotating unit 39 is fixed to the floor. The second central robot CR2 is equipped with two hands 35, a forward / backward moving unit 37, and a lifting and rotating unit 39. Each hand 35 transports wet substrates W.

[0065] <4-5. Wet transport area R5> The wet transfer region R5 is adjacent to the batch processing region R1, the batch substrate transfer region R2, and the single substrate transfer region R3. The wet transfer region R5 is provided at one end of the batch processing region R1, opposite the side where the transfer block 5 is provided. A second position change unit (submerged position change unit) 55, a belt conveyor mechanism 57, and a shower head 59 are provided in the wet transfer region R5.

[0066] The second position changer 55 corresponds to the second position change mechanism of the present invention. The shower head 59 corresponds to the liquid supply unit of the present invention.

[0067] <4-5-1. Second posture transformation unit 55> As shown in Fig. 1, the second position changing unit 55 is provided on an extension line of the row of six batch processing tanks BT1 to BT6. The second position changing unit 55 changes the position of multiple substrates W that have been subjected to immersion processing from a vertical position to a horizontal position. Fig. 4 is a longitudinal sectional view of the second position changing unit 55 as seen from the front. Fig. 5(a) is a longitudinal sectional view of the second position changing unit 55 as seen from the left side. Fig. 5(b) is a plan view showing the second position changing unit 55.

[0068] The second position change unit 55 includes an intra-tank carrier 61, an immersion tank 63, a rotation mechanism 65, a lifter LF9, and a pusher 67. The intra-tank carrier 61 is capable of storing a plurality of substrates W (for example, 25 substrates W). In this case, the intra-tank carrier 61 stores the 25 substrates W at a predetermined interval (for example, full pitch). The 25 substrates W are aligned in the thickness direction of each substrate W.

[0069] The intra-tank carrier 61 has an entrance / exit 69, two side walls 71, and a back opening 73. The entrance / exit 69 is an opening for allowing substrates W to enter and exit. The two side walls 71 are provided with multiple pairs (e.g., 25 pairs) of holding grooves 75. The 25 pairs of holding grooves 75 face each other. The 25 pairs of holding grooves 75 store 25 substrates W that have passed through the entrance / exit 69. That is, each pair of holding grooves 75 stores one substrate W. The back opening 73 is positioned opposite the entrance / exit 69 across the 25 substrates W stored in the intra-tank carrier 61. The back opening 73 has a width in the radial direction (front-rear direction X) of each substrate W that is smaller than the diameter of each substrate W. This prevents each substrate W from entering or exiting through the back opening 73. When the inlet / outlet port 69 of the in-tank carrier 61 faces upward, the pusher 67 can pass through the inlet / outlet port 69 and the rear opening 73 .

[0070] The immersion tank 63 accommodates the intra-tank carrier 61 and two carrier support members 85 (described later) of the lifter LF9. The immersion tank 63 stores, for example, pure water as an immersion liquid. This allows the intra-tank carrier 61 to be immersed in the pure water in the immersion tank 63. This prevents the substrate W from drying out. The immersion liquid is not limited to pure water, but may be alcohol. The pure water may be, for example, deionized water (DIW). The immersion tank 63 is provided with ejection pipes 77 at both ends of the bottom surface in the front-rear direction X. Each ejection pipe 77 is formed in a cylindrical shape and extends in the width direction Y. Each ejection pipe 77 ejects pure water into the immersion tank 63.

[0071] The rotation mechanism 65 rotates the intra-tank carrier 61 around two operating shafts 79A (described later) while clamping the intra-tank carrier 61 between the two operating shafts 79A (described later) in order to convert the 25 substrates W stored in the intra-tank carrier 61 from a vertical position to a horizontal position. The rotation mechanism 65 includes two air cylinders 79 and two electric motors 81.

[0072] Each air cylinder 79 has an operating shaft 79A extending along the front-rear direction X. Two through holes 74 are formed in the immersion tank 63. The two operating shafts 79A pass through the two through holes 74, respectively. The two air cylinders 79 advance the two operating shafts 79A along the front-rear direction X, thereby clamping the two side walls 71 of the intra-tank carrier 61 between the two operating shafts 79A. This unites the two operating shafts 79A and the intra-tank carrier 61. The two air cylinders 79 also retract the two operating shafts 79A along the front-rear direction X, thereby releasing the clamping state of the intra-tank carrier 61 between the two operating shafts 79A. Each operating shaft 79A corresponds to a rotating shaft in the present invention.

[0073] The two electric motors 81 rotate the two air cylinders 79 around the two operating shafts 79A (horizontal shafts), thereby allowing the two electric motors 81 to rotate the in-tank carrier 61 sandwiched between the two operating shafts 79A.

[0074] The lifter LF9 includes a back plate 83, two carrier support members 85, and a carrier lifting unit 87. The back plate 83 extends in the vertical direction Z. The back plate 83 has a back plate opening 83A for passing a push-out member 96 (described later). The two carrier support members 85 are attached to the lower end of the back plate 83 and extend along the width direction Y. The distance between the two carrier support members 85 is wider than the width of the rear opening 73 in the front-rear direction X. The two carrier support members 85 support the intra-tank carrier 61 from below. The carrier lifting unit 87 raises and lowers the back plate 83 and the two carrier support members 85, thereby raising and lowering the intra-tank carrier 61 supported by the two carrier support members 85. The carrier lifting unit 87 includes an electric motor.

[0075] Furthermore, the second position conversion unit 55 includes, in addition to the pusher 67, a vertical shaft 89 and a pusher lifting and rotating unit 91. The pusher 67 holds a plurality of (e.g., 25) substrates W from below in a vertical position. The upper end of the vertical shaft 89 is connected to the lower surface of the pusher 67. The vertical shaft 89 extends along the vertical direction Z. As shown in FIG. 4, a through-hole 93 is provided in the bottom of the immersion tank 63. The vertical shaft 89 passes through the through-hole 93. The pusher lifting and rotating unit 91 raises and lowers the pusher 67 and the vertical shaft 89 and rotates them about the vertical axis AX5. The pusher lifting and rotating unit 91 includes, for example, a plurality of electric motors.

[0076] 5(a), the second position changer 55 includes a pusher 96 and a pusher advance / retract unit 98. The pusher 96 pushes out one substrate W stored in the intravessel carrier 61. The pusher 96 is connected to the tip of a rod 98A of the pusher advance / retract unit 98 that can advance and retract. The pusher advance / retract unit 98 advances and retracts the pusher 96 in the horizontal direction. The pusher advance / retract unit 98 includes an electric motor or an air cylinder. When a plurality of substrates W (e.g., 25 substrates W) stored in the intravessel carrier 61 are in a horizontal position, the pusher advance / retract unit 98 advances the pusher 96 into the intravessel carrier 61 through the back panel opening 83A and the rear opening 73, and pushes out one substrate W through the inlet / outlet 69. The substrate W may also be pushed out of the intravessel carrier 61 by spraying liquid onto the edge of the substrate W.

[0077] <4-5-2. Belt conveyor mechanism 57> Fig. 6(a) is a plan view showing the belt conveyor mechanism 57. Fig. 6(b) is a left side view showing the belt conveyor mechanism 57 and the shower head 59. A single substrate W pushed out of the intra-tank carrier 61 by the push-out member 96 is delivered to the belt conveyor mechanism 57. The belt conveyor mechanism 57 receives the substrates W in a horizontal position one by one from the second position conversion unit 55 and transports them to the single-substrate transport region R3.

[0078] The belt conveyor mechanism 57 includes a belt conveyor 101 and a delivery unit 103. The belt conveyor 101 transports the substrate W from the second position change unit 55 to the delivery unit 103. The belt conveyor 101 includes three pulleys 105, 106, and 107, three belts 109A, 109B, and 109C, and an electric motor 112.

[0079] The three pulleys 105, 106, and 107 are arranged in this order from the second position change unit 55 side along the width direction Y. The three pulleys 105, 106, and 107 are supported rotatably around horizontal axes AX7, AX8, and AX9, respectively. The pulley 107 is also arranged near three lift pins 123 (described later) of the delivery unit 103.

[0080] Each of the three belts 109A, 109B, and 109C is formed in a ring shape. The cross section of each of the three belts 109A, 109B, and 109C is formed, for example, in a circular shape. Two of the belts 109A and 109B are wound around two pulleys 105 and 106, respectively. Furthermore, the belt 109C is disposed between the two belts 109A and 109B and is wound around three pulleys 105, 106, and 107.

[0081] The electric motor 112 rotates, for example, the pulley 105, thereby transporting the substrate W placed on the three belts 109A to 109C. In addition, since the belt 109C of the belt conveyor 101 is wound around the pulley 107, the substrate W can be moved close to the three lift pins 123.

[0082] The delivery section 103 includes three pulleys 115, 116, and 117, two belts 119 and 121, three lift pins 123, and a lift pin lifting section 125. Each of the three pulleys 115, 116, and 117 is freely rotatable. Two of the pulleys 115 and 116 are arranged along a horizontal axis AX9 and sandwich the third pulley 107 of the belt conveyor 101. Each of the two pulleys 115 and 116 is supported rotatably about the horizontal axis AX9. The pulley 117 is supported rotatably about a horizontal axis AX10. The belt 119 is wound around the two pulleys 115 and 117. The belt 121 is wound around the two pulleys 116 and 117.

[0083] The delivery unit 103 does not have an electric motor and therefore cannot drive the two belts 119 and 121 by itself. However, the delivery unit 103 may have an electric motor to drive the belts 119 and 121.

[0084] The belt conveyor 101 has belts 109A to 109C in addition to the belts 119 and 121 of the delivery section 103. Therefore, even if there is a substrate W on the belts 119 and 121, another substrate W on the belts 109A to 109C can be moved.

[0085] As shown in FIG. 6(a), three lift pins 123 are disposed between two belts 119, 121. A lift pin elevating unit 125 raises and lowers the three lift pins 123 between a lower standby position and an upper delivery position. When the three lift pins 123 are raised to the delivery position, the substrate W is lifted from the belts 119, 121. When the three lift pins 123 are lowered to the standby position, the upper ends of the lift pins 123 are positioned lower than the transport surfaces 127 of the two belts 119, 121 so as not to interfere with the transport of the substrate W. The lift pin elevating unit 125 includes an electric motor or an air cylinder.

[0086] As shown in FIG. 6(b), the shower head 59 supplies liquid to wet the substrate W transported by the belt conveyor mechanism 57. For example, deionized water (DIW) is supplied as the liquid. Alternatively, the liquid may be alcohol such as IPA. The multiple shower heads 59 are arranged in a row along the three belts 109A to 109C of the belt conveyor 101. The device surface (arrow AR) of the substrate W in a horizontal position on the belt conveyor 101 faces upward. Therefore, a liquid film of deionized water can be formed on the device surface of the substrate W. Note that the wet transport region R5 may be provided with one shower head 59 for one belt conveyor 101.

[0087] <5. Control Unit> The substrate processing apparatus 1 includes a control unit 131 (see FIG. 1) and a storage unit (not shown). The control unit 131 controls each component of the substrate processing apparatus 1. The control unit 131 includes one or more processors, such as a central processing unit (CPU). The storage unit includes at least one of a read-only memory (ROM), a random-access memory (RAM), and a hard disk. The storage unit stores computer programs required to control each component of the substrate processing apparatus 1.

[0088] <6. Operational Description> Next, the operation of the substrate processing apparatus 1 will be described with reference to the flowchart of Fig. 7. See Fig. 1. An external transfer robot (not shown) transfers one carrier C to the load port 9.

[0089] [Step S01] Transferring substrates from carriers The carrier transport mechanism 11 in the stocker block 3 transports the carrier C from the load port 9 to the shelf 13A. The substrate handling mechanism HTR in the transfer block 5 takes out 25 horizontally oriented substrates from the carrier C placed on the shelf 13A and transports them to the orientation conversion unit 23.

[0090] [Step S02] Transformation to vertical posture 3(a) to 3(c), the attitude conversion unit 23 converts the 25 substrates W from a horizontal attitude to a vertical attitude, and transfers the 25 substrates W in the vertical attitude to the pusher mechanism 25. The pusher mechanism 25 transports the 25 substrates W in the vertical attitude to a substrate transfer position PP defined in the transfer block 5.

[0091] [Step S03] Chemical treatment (batch treatment) The transport mechanism WTR receives 25 substrates W in a vertical position from the pusher mechanism 25 at the substrate transfer position PP, and transports the 25 substrates W to any one of the four lifters LF1 to LF4 of the four chemical liquid processing tanks BT1 to BT4.

[0092] For example, the transport mechanism WTR transports 25 substrates W to the lifter LF1 of the chemical liquid treatment tank BT1. The lifter LF1 receives the 25 substrates W at a position above the chemical liquid treatment tank BT1. The lifter LF1 immerses the 25 substrates W in phosphoric acid, which serves as the treatment liquid in the chemical liquid treatment tank BT1. This allows the 25 substrates W to be etched. After the etching process, the lifter LF1 lifts the 25 substrates W out of the phosphoric acid in the chemical liquid treatment tank BT1. Note that when the 25 substrates W are transported to the lifters LF2 to LF4 of the other chemical liquid treatment tanks BT2 to BT4, the same treatment as in the chemical liquid treatment tank BT1 is performed.

[0093] [Step S04] Pure water cleaning process (batch processing) The transport mechanism WTR receives 25 substrates W in a vertical position from, for example, the lifter LF1 (or lifter LF2), and transports the 25 substrates W to the lifter LF5 in the water-rinsing processing tank BT5. The lifter LF5 receives the 25 substrates W at a position above the water-rinsing processing tank BT5. The lifter LF5 immerses the 25 substrates W in the pure water in the water-rinsing processing tank BT5. This allows the 25 substrates W to be cleaned.

[0094] When the transport mechanism WTR receives 25 vertically oriented substrates W from one of the lifters LF3 and LF4, the transport mechanism WTR transports the 25 substrates W to the lifter LF6 in the water-rinsing processing tank BT6. The lifter LF6 immerses the 25 substrates W in the pure water in the water-rinsing processing tank BT6.

[0095] In this embodiment, the second position changer 55 is provided on the opposite side of the transfer block 5, with six batch processing tanks BT1 to BT6 interposed therebetween. The transport mechanism WTR transports 25 substrates W collectively from, for example, the batch processing tank BT1 (BT3) on the side closer to the transfer block 5, via the batch processing tank BT5 (BT6) on the side farther from the transfer block 5, to the second position changer 55.

[0096] [Step S05] Transform to horizontal position 8(a) to 10 are front views illustrating the operation of the second position changer 55. When the carrier support part 85 of the lifter LF9 is located at the first height position P1, the carrier support part 85 is located near the bottom surface of the immersion tank 63. When the carrier support part 85 is located at the first height position P1, the rotation mechanism 65 can vertically rotate the intra-tank carrier 61 in the immersion tank 63. When the carrier support part 85 is located at the second height position P2, the entire intra-tank carrier 61 is located below the liquid surface of the immersion tank 63. When the carrier support part 85 is located at the second height position P2, the rotation mechanism 65 can perform a clamping operation on the intra-tank carrier 61 with the entrance / exit 69 facing upward.

[0097] When the carrier support part 85 is located at the third height position P3, 25 substrates W can be transferred between the intra-tank carrier 61 and the pusher 67. When the carrier support part 85 is located at the fourth height position P4, the intra-tank carrier 61 storing 25 horizontally oriented substrates W is located below the water surface in the immersion tank 63.

[0098] See Figure 8(a). The entrance / exit 69 of the intra-tank carrier 61 of the second position changer 55 faces upward. The transport mechanism WTR transports 25 substrates W above the intra-tank carrier 61. See Figure 8(b). Thereafter, the pusher lifting and rotating unit 91 raises the pusher 67 to a height that can hold the 25 substrates W in a vertical position. As a result, the pusher 67 receives the 25 substrates W from the transport mechanism WTR. The pusher 67 passes between the two carrier support parts 85, through the rear opening 73 and the entrance / exit 69 in order, and is raised to the position of the 25 substrates W.

[0099] 8(c). Thereafter, the transport mechanism WTR opens the two chucks 29, 30, releases the 25 substrates W, and then moves from above the intra-tank carrier 61. Thereafter, the carrier lifting unit 87 raises the carrier support unit 85 to the third height position P3. As a result, the 25 substrates W held in a vertical position by the pusher 67 are stored in the intra-tank carrier 61.

[0100] See Figure 9(a). Thereafter, the pusher lifting and rotating unit 91 lowers the pusher 67 to the bottom of the immersion tank 63. Furthermore, the carrier lifting unit 87 lowers the carrier support unit 85 to the second height position P2. This causes the intra-tank carrier 61 storing 25 substrates W to be immersed in the pure water in the immersion tank 63. This prevents the substrates W from drying out. See Figure 9(b). Thereafter, the two air cylinders 79 of the rotation mechanism 65 advance the two operating shafts 79A, thereby clamping the intra-tank carrier 61 (two side walls 71) between the two operating shafts 79A (clamping operation).

[0101] See FIG. 9(c). Thereafter, the carrier lifting unit 87 lowers the carrier support unit 85 to the first height position P1. As a result, the intravessel carrier 61 is supported only by the two operating shafts 79A. Furthermore, the intravessel carrier 61 can be rotated vertically. The rotation mechanism 65 rotates the intravessel carrier 61 90 degrees around the two operating shafts 79A (horizontal axes). As a result, the 25 substrates W are converted from a vertical position to a horizontal position, with the device surfaces facing upward. Note that this 90-degree rotation is performed so that the rear opening 73 faces the back plate portion 83 (see FIG. 5(a)).

[0102] See Figure 10. Thereafter, the carrier lifting unit 87 raises the carrier support unit 85 to a fourth height position P4. Thereafter, the two air cylinders 79 of the rotation mechanism 65 retract the two operating shafts 79A, thereby releasing the clamping of the intra-tank carrier 61 by the two operating shafts 79A. As a result, the intra-tank carrier 61 is supported only by the carrier support unit 85.

[0103] [Step S06] Transporting the substrate by belt conveyor Thereafter, the second position changer 55 unloads the 25 horizontally oriented substrates W stored in the intra-tank carrier 61, in order, starting with the top substrate W. The carrier lifting unit 87 raises the carrier support unit 85 supporting the intra-tank carrier 61 so that the top substrate W emerges from the liquid surface, as shown in FIG. 11(a). The substrates W other than the top substrate W wait in the pure water. Thereafter, the push-out member advancing / retracting unit 98 pushes out the top substrate W through the entrance / exit 69 while inserting the push-out member 96 into the intra-tank carrier 61 from the back plate opening 83A and the rear opening 73.

[0104] The substrate W (referred to as the "first substrate W") pushed out through the entrance / exit 69 is placed on the three belts 109A, 109B, and 109C of the belt conveyor 101. See FIGS. 6(a) and 6(b). The electric motor 112 of the belt conveyor 101 rotates the pulley 105 to move the first substrate W toward the delivery section 103. When the first substrate W passes a predetermined position between the two pulleys 105 and 106, the second position conversion section 55 carries out the second substrate W. This predetermined position is detected, for example, by the optical sensor 135. When the optical sensor 135 detects the passage of the first substrate W, the carrier lifting section 87 lifts the carrier support section 85 so that the upper substrate W emerges from the liquid surface. Thereafter, as shown in FIG. 11(b), the push-out member advancing / retracting section 98 pushes out the second substrate W using the push-out member 96.

[0105] The belt conveyor 101 transports the substrate W to the delivery section 103. Here, multiple shower heads 59 are arranged along the three belts 109A to 109C of the belt conveyor 101. This prevents the substrate W from drying out while being transported by the belt conveyor 101. Because the belt 109C of the belt conveyor 101 is arranged close to the three lift pins 123, the substrate W can be transported up to above the three lift pins 123. Once the substrate W is transported above the three lift pins 123, the lift pin elevating section 125 can lift the lift pins 123, thereby lifting the substrate W on the two belts 119, 121. The first central robot CR1 shown in FIG. 1 transports the substrate W lifted by the three lift pins 123 while holding it with the first hand 35.

[0106] [Step S07] First single wafer processing Referring to Figure 1, the first central robot CR1 transports the substrate W received from the lift pins 123 to the first single-wafer processing chamber SW1. The first single-wafer processing chamber SW1 supplies pure water to the device surface from the nozzle 47 while rotating the substrate W with the device surface facing upward using, for example, the rotation processing unit 45. Thereafter, the first single-wafer processing chamber SW1 supplies IPA from the nozzle 47 to the device surface (upper surface) of the substrate W to replace the pure water on the substrate W with IPA.

[0107] [Step S08] Second Single-Wafer Processing (Drying Processing) Thereafter, the second central robot CR2 removes the substrate W wet with IPA from the first single-wafer processing chamber SW1 and transfers the substrate W to the three lift pins 52 of the second single-wafer processing chamber SW2. The three lift pins 52 are then lowered, and the substrate W is placed on the support tray 49. The support tray 49 is then moved into the processing space 48A of the chamber main body 48.

[0108] The second single-wafer processing chamber SW2 performs a drying process on the substrate W using carbon dioxide in a supercritical state (supercritical fluid). The drying process using the supercritical fluid prevents pattern collapse on the pattern surface (device surface) of the substrate W. After the drying process, the support tray 49 is removed from the processing space 48A. Thereafter, the three lift pins 52 rise while passing through the three holes 49A of the support tray 49, and lift the substrate W after the drying process.

[0109] [Step S09] Transferring substrates from the buffer unit to the carrier The first central robot CR1 uses the second hand 35 to transport the substrates W from the three lift pins 52 of the second single-wafer processing chamber SW2 to one of the loading shelves of the buffer unit 33. When one lot (25 substrates W) of substrates W has been transported to the buffer unit 33, the substrate handling mechanism HTR transports all 25 substrates W from the buffer unit 33 into an empty carrier C placed on the shelf 13A. Thereafter, the carrier transport mechanism 11 in the stocker block 3 transports the carrier C containing the processed substrates W to the load port 9. An external transport robot (not shown) transports the carrier C from the load port 9 to its next destination. The substrate handling mechanism HTR may return the substrates W one by one from the buffer unit 33 to the carrier C placed on the shelf 13A.

[0110] According to this embodiment, the wet transfer region R5 is adjacent to the batch processing region R1 and the single-substrate transfer region R3. The wet transfer region R5 is provided with a second position change mechanism 55, a belt conveyor mechanism 57, and a shower head 59. The second position change mechanism 55 is provided on an extension of the row of six batch processing baths BT1 to BT6, and changes the position of multiple substrates W that have been immersion-processed from a vertical position to a horizontal position. The belt conveyor mechanism 57 receives the horizontally positioned substrates W one by one from the second position change mechanism 55 and transfers them to the single-substrate transfer region R3. The shower head 59 supplies liquid to wet the substrates W being transferred by the belt conveyor mechanism 57. The belt conveyor mechanism 57 transfers the substrates W wetted by the shower head 59 from the second position change mechanism 55 to the single-substrate transfer region R3. The first central robot CR1 in the single substrate transport region R3 receives the horizontally oriented substrate W transported by the belt conveyor mechanism 57 and transports it to the first single substrate processing chamber SW1. This prevents the substrate W from drying out when it is transported from the batch processing region R1 to the single substrate processing region R3.

[0111] Furthermore, even if the single-substrate transport region R3 is separated from the batch processing region R1, the belt conveyor mechanism 57 transports the substrate W, making it easy for the first central robot CR1 to receive the substrate W. Furthermore, the belt conveyor mechanism 57 and the shower head 59 can prevent the substrate W from drying out. This allows the transport path to be longer, thereby increasing the degree of freedom in the arrangement of the batch processing region R1 and the single-substrate processing region R4.

[0112] Additionally, the single substrate transport region R3 is interposed between the batch processing region R1 and the single substrate processing region R4, which allows the transfer block 5, the batch processing region R1, and the single substrate processing region R4 to be positioned around the single substrate transport region R3.

[0113] Furthermore, the single wafer processing region R4 is provided with a first single wafer processing chamber SW1 and a second single wafer processing chamber SW2, and is further provided with a second center robot CR2 that transports substrates W between the two chambers SW1 and SW2. The first center robot CR1 receives a horizontally oriented substrate W transported by the belt conveyor mechanism 57, transports it to the first single wafer processing chamber SW1, and unloads the substrate W that has been processed in the second single wafer processing chamber SW2. As a result, the substrate W is transported by the two center robots CR1 and CR2, thereby improving throughput.

[0114] The second attitude change section 55 is equipped with an immersion tank 63 in which the intra-tank carrier 61 can be immersed in pure water. This prevents the substrates W stored in the intra-tank carrier 61 from drying out. Furthermore, the push-out member advance / retract section 98 can push out the substrates W stored in the intra-tank carrier 61 with the push-out member 96. This allows the substrates W to be removed from the intra-tank carrier 61 without having to insert the hand 35 of the first central robot CR1. Example 2

[0115] Next, a second embodiment of the present invention will be described with reference to the drawings. Note that descriptions that overlap with those of the first embodiment will be omitted. Fig. 12 is a plan view showing a schematic configuration of a substrate processing apparatus 1 according to the second embodiment.

[0116] In Example 1, the single substrate transport region R3 was interposed between the batch processing region R1 and the single substrate processing region R4, as shown in Fig. 1. In contrast, in Example 2, the single substrate processing region R4 was interposed between the batch processing region R1 and the single substrate transport region R3, as shown in Fig. 12.

[0117] That is, the batch processing area R1, single wafer processing area R4, and single wafer substrate transport area R3 are arranged in this order to the right (Y). Therefore, in FIG. 12, a second single wafer processing area R6 can be arranged to the right of the single wafer substrate transport area R3. This allows the area on the opposite side of the single wafer processing area R4, across the single wafer substrate transport area R3, to be used as the second single wafer processing area R6, thereby enabling a larger number of single wafer processing chambers to be arranged. Note that a maintenance area R7 exists between the batch processing area R1 and the single wafer processing area R4, but this area R7 need not necessarily be present. The transfer block 5 also includes a buffer unit 33. The substrate handling mechanism HTR can move in the width direction Y along rails 136.

[0118] 12, the belt conveyor mechanism 57 transports the substrate W in a straight line from the second position changer 55 to the single-substrate transport region R3. In this regard, when the belt conveyor mechanism 57 cannot transport the substrate W in a straight line, the belt conveyor mechanism 57 may be arranged to go around an obstructing element in a plan view. This allows the belt conveyor mechanism 57 to transport the substrate W while going around an obstacle, thereby increasing the degree of freedom in the arrangement of the single-substrate processing region R4, etc.

[0119] See FIG. 13. In the single wafer processing region R4, a side cabinet 137, for example, may be provided behind the two single wafer processing chambers SW1 and SW2. The side cabinet 137 is provided with at least one of a bottle for supplying chemicals, a chemical piping, a pure water piping, and an exhaust duct. In this case, the presence of the side cabinet 137 in the single wafer processing region R4 prevents the belt conveyor mechanism 57 from transporting the substrate W in a straight line from the second position change unit 55 to the single wafer substrate transport region R3. The obstacle is not limited to the side cabinet 137 and may be, for example, a single wafer processing chamber.

[0120] Therefore, the belt conveyor mechanism 139 includes, for example, three (n) belt conveyors 141, 143, and 145, and two (n-1) direction changers 147 and 149, where "n" is a natural number equal to or greater than 2. The second position changer 55 faces backward X. That is, the push-out member advancing and retracting unit 98 advances and retracts the push-out member 96 along the front-rear direction X.

[0121] A first belt conveyor 141 is provided behind the second position changer 55 in the X direction. A first direction changer 147 is provided behind the first belt conveyor 141 in the X direction. A second belt conveyor 143 is provided to the right of the first direction changer 147 in the Y direction. A second direction changer 149 is provided to the right of the second belt conveyor 143 in the Y direction. A third belt conveyor 145 is provided in front of the second direction changer 149 in the X direction. A delivery unit 103 (see FIG. 6(b)) is provided in front of the third belt conveyor 145 in the X direction.

[0122] Each of the three belt conveyors 141 to 145 and the two direction changers 147 and 149 includes an electric motor for driving the belt 151 (151A). The first direction changer 147 changes the transport direction of the substrate W to transport the substrate W between the two belt conveyors 141 and 143, which have different transport directions. As shown in FIG. 14(a), the first direction changer 147 includes two pulleys 153 and 154, two belts 151A wound around the pulleys 153 and 154, a support member 155 that rotatably supports the two pulleys 153 and 154, and an elevation rotation unit 157. The elevation rotation unit 157 raises and lowers the support member 155 and rotates the support member 155 around a vertical axis AX15. The second direction changer 149 has a similar configuration to the first direction changer 147.

[0123] 14(a) and 14(b), each of the three belt conveyors 141, 143 has a pulley 158. As shown in FIG. 14(a), for example, the second belt conveyor 143 is disposed at a higher position than the first belt conveyor 141. The third belt conveyor 145 is disposed at a lower position than the second belt conveyor 143. The third belt conveyor 145 may be disposed at a higher position than the second belt conveyor 143.

[0124] Here, the operation of the first direction changer 147 will be described. See FIG. 14(a). The substrate W is transported to the first direction changer 147 by the first belt conveyor 141. As shown in FIG. 14(b), the first direction changer 147 rotates the two pulleys 153, 154, the support member 155, etc. around the vertical axis AX15 at a height that does not interfere with the two belt conveyors 141, 143. Thereafter, the first direction changer 147 drives the belt 151A using an electric motor, thereby transporting the substrate W to the second belt conveyor 143.

[0125] Next, the operation of the belt conveyor mechanism 139 will be described. The pusher 67 of the second position conversion unit 55 receives 25 substrates W aligned in the width direction Y from the transport mechanism WTR. The pusher lifting and rotating unit 91 then rotates the pusher 67 by 90 degrees about the vertical axis AX5. As a result, the 25 substrates W are aligned in the front-rear direction X. The second position conversion unit 55 converts the 25 substrates W aligned in the front-rear direction X from a vertical position to a horizontal position in the pure water stored in the immersion tank 63.

[0126] Thereafter, the second attitude change unit 55 pushes the substrate W onto the first belt conveyor 141 using the push-out member 96. The first belt conveyor 141 transports the substrate W to the first direction change unit 147. The first direction change unit 147 raises the substrate W, changes the transport direction of the substrate W, and transports the substrate W to the second belt conveyor 143. The second belt conveyor 143 transports the substrate W to the second direction change unit 149. The second direction change unit 149 lowers the substrate W, changes the transport direction of the substrate W, and transports the substrate W to the third belt conveyor 145. The third belt conveyor 145 transports the substrate W to the delivery unit 103. The delivery unit 103 lifts the substrate W using three lift pins 123. Then, the first central robot CR1 uses the first hand 35 to hold the substrate W lifted by the three lift pins 123, and then transports the substrate W to the first single-wafer processing chamber SW1.

[0127] A plurality of shower heads 59 are provided along the belt 151 of each of the three belt conveyors 141, 143, and 145. The shower heads 59 supply pure water in the form of a shower onto the substrates W being transported. This prevents the substrates W from drying out in the belt conveyor mechanism 139. Note that shower heads 59 may also be provided on each of the direction changers 147 and 149. Example 3

[0128] Next, a third embodiment of the present invention will be described with reference to the drawings. Note that descriptions that overlap with those of the first and second embodiments will be omitted. Fig. 15 is a plan view showing a schematic configuration of a substrate processing apparatus 1 according to the third embodiment.

[0129] In Example 1, the first center robot CR1 transported the substrate W from the belt conveyor mechanism 57 to the first single-wafer processing chamber SW1, and also transported the substrate W from the second single-wafer processing chamber SW2 to the buffer unit 33. The second center robot CR2 transported the substrate W from the first single-wafer processing chamber SW1 to the second single-wafer processing chamber SW2. In contrast, in Example 3, the first center robot CR1 transports the substrate W from the second single-wafer processing chamber SW2 to the buffer unit 33. The second center robot CR2 transports the substrate W from the belt conveyor mechanism 57 to the first single-wafer processing chamber SW1, and also transports the substrate W from the first single-wafer processing chamber SW1 to the second single-wafer processing chamber SW2.

[0130] The single substrate processing region R4 is provided with two single substrate processing chambers SW1 and SW2, and further provided with a second single substrate transport region R8 disposed between the chambers SW1 and SW2. The wet transport region R5 is provided at one end of the batch processing region R1, opposite the side where the transfer block 5 is provided. The single substrate transport region R3 has a transfer block side transport region R31 on the transfer block 5 side and a belt conveyor side transport region R32 on the belt conveyor mechanism 57 side.

[0131] A first center robot CR1 is provided in the transfer block side transport region R31. The first center robot CR1 removes the substrate W processed in the second single wafer processing chamber SW2. That is, the first center robot CR1 transports the substrate W processed in the second single wafer processing chamber SW2 to the buffer unit 33. A second center robot CR2 is provided in the second single wafer substrate transport region R8 and the belt conveyor side transport region R32. The second center robot CR2 receives a horizontally oriented substrate W transported by the belt conveyor mechanism 57 and transports it to the first single wafer processing chamber SW1. The second center robot CR2 also transports the substrate W processed in the first single wafer processing chamber SW1 to the second single wafer processing chamber SW2. The second center robot CR2 can move in the width direction Y between the second single wafer substrate transport region R8 and the belt conveyor side transport region R32.

[0132] According to this embodiment, the first central robot CR1 can transport only the substrates W after drying processing, and the second central robot CR2 can transport only the wet substrates W. Example 4

[0133] Next, a fourth embodiment of the present invention will be described with reference to the drawings. Note that descriptions that overlap with those of the first to third embodiments will be omitted. Fig. 16 is a plan view showing a schematic configuration of a substrate processing apparatus 1 according to the fourth embodiment.

[0134] In Example 1, the wet transport region R5 was provided at one end of the batch processing region R1, opposite to the side where the transfer block 5 was provided. In contrast, in Example 4, the wet transport region R5 is interposed between the transfer block 5 and the batch processing region R1.

[0135] According to this embodiment, the wet transfer region R5 is located near the transfer block 5. Therefore, the first central robot CR1 can transfer the substrate W using the transfer block 5 as a base point. Furthermore, since the chemical treatment tanks BT1 to BT4 can be located away from the transfer block 5, adverse effects such as corrosion of mechanisms such as the substrate handling mechanism HTR of the transfer block 5 due to a chemical atmosphere can be suppressed.

[0136] The wet transfer region R5 may be interposed between, for example, two batch processing baths BT3 and BT4 in the batch processing region R1, thereby enabling the substrate W to be transferred from the center of the row of six batch processing baths BT1 to BT6 as a base point.

[0137] The present invention is not limited to the above-described embodiment, but can be modified as follows.

[0138] (1) In each of the above-described embodiments, the belt conveyor mechanism 57 (139) has a plurality of shower heads 59 to prevent the substrate W from drying out during transport. In this regard, the belt conveyor mechanism 57 (139) may transport the substrate W in pure water stored in an immersion tank 63, for example, as shown in FIG. 17. In this case, for example, the jet pipe 77 corresponds to the liquid supply unit of the present invention. Furthermore, as the liquid supply unit, the shower head 59 supplies pure water to the substrate W in a shower-like manner. In this regard, the liquid supply unit may supply pure water to the substrate W in a mist-like manner.

[0139] (2) In each of the above-described embodiments and modified example (1), the processing block 7 includes the second center robot CR2 in addition to the first center robot CR1. However, if necessary, the processing block 7 does not need to include the second center robot CR2.

[0140] (3) In the above-described embodiments and modifications, each of the batch processing tanks BT1 to BT6 processed 25 substrates W aligned in a face-to-back format at a full pitch (e.g., 10 mm). The face-to-back format is an arrangement in which the device surfaces of all substrates W face the same direction. However, each of the batch processing tanks BT1 to BT6 may process 50 substrates W aligned at a half pitch (e.g., 5 mm), which is half the full pitch.

[0141] 5(a) pushes out the substrate W horizontally while contacting the edge of the horizontally oriented substrate W. Therefore, even if 50 substrates W are aligned at half pitch and in a face-to-back manner, one substrate W can be removed by the push-out member 96 without widening the gap between two substrates W.

[0142] Each batch processing tank BT1 to BT6 may process 50 substrates W aligned face-to-face. The face-to-face arrangement is an arrangement in which the two device surfaces (or two back surfaces) of two adjacent substrates W face each other. In this case, the batch substrate transport region R2 is equipped with a transport mechanism WTR that transports the 50 substrates W aligned at a half pitch, as well as a second transport mechanism that can extract every other 25 substrates W aligned at a half pitch from the 50 substrates W aligned at a half pitch. The second transport mechanism transports the 25 substrates W, for example, from the lifter LF5 of the water-rinsing processing tank BT5 to the pusher 67.

[0143] (4) In the above-described embodiments and modifications, the single wafer processing chamber SW2 uses a supercritical fluid to dry the substrate W. In this regard, the single wafer processing chamber SW2 may be provided with a rotation processing unit 45 and a nozzle 47, similar to the single wafer processing chamber SW1. In this case, each of the single wafer processing chambers SW1 and SW2 (or the single wafer processing chambers SW1 to SW3) supplies, for example, pure water and IPA to the substrate W in this order, and then performs a drying process (spin drying) on ​​the substrate W. [Explanation of symbols]

[0144] 1... Substrate processing equipment 5...Transfer block 7 ... Processing block 13A … Shelf HTR: Substrate handling mechanism 15...First attitude conversion mechanism PP: PCB transfer position R1 ... Batch processing area R2: Batch substrate transport area R3: Single substrate transport area R4 … Single wafer processing area R5: Wet transport area BT1~BT6 ... Batch processing tanks WTR: Transport mechanism CR1: Center Robot No. 1 CR2: Second Center Robot 55 ... Second posture transformation unit 57,139 ... Belt conveyor mechanism 59... shower head 61 ... Tank carrier 63 … Soaking tank 65...Rotation mechanism 69 … Entrance / exit 71... 2 side walls 73 ... Back opening 75 … Retaining groove 79A ... Operating shaft 85 ... Carrier support part 96 ... Extrusion member 98 ... Push-out member advance / retract section

Claims

1. A substrate processing apparatus that continuously performs batch processing, in which a plurality of substrates are processed at once, and single-substrate processing, in which substrates are processed one by one, a carrier placement shelf for placing carriers that store a plurality of substrates in a horizontal position at predetermined intervals in a vertical direction; a transfer block adjacent to the carrier placement shelf; a processing block adjacent to the transfer block; Equipped with The transfer block is a first position change mechanism that changes the position of the substrates removed from the carrier from a horizontal position to a vertical position; a substrate handling mechanism that simultaneously removes the plurality of substrates from the carrier placed on the carrier placement shelf and transports them to the first attitude changing mechanism, and returns the substrates that have been subjected to the single-substrate processing to the carrier placed on the carrier placement shelf, The processing block comprises: a batch processing area extending in a direction away from the transfer block; a batch substrate transport area provided along the batch processing area, one end of which extends to the transfer block and the other end of which extends in a direction away from the transfer block; a single substrate transport area extending in a direction away from the transfer block; a single substrate processing area provided along the single substrate transport area; a wet transport area adjacent to the batch processing area and the single substrate transport area, In the batch processing area, a plurality of batch processing tanks for immersing a plurality of substrates at once are arranged in a direction in which the area extends, the wet transport area is provided with a second position change mechanism that is provided on an extension line of the row of the plurality of batch processing tanks and that changes the plurality of substrates that have been subjected to the immersion processing from a vertical position to a horizontal position, a belt conveyor mechanism that receives the horizontally oriented substrates one by one from the second position change mechanism and transports them to the single substrate transport area, and a liquid supply unit that supplies liquid to wet the substrates transported by the belt conveyor mechanism, In the single wafer processing area, a plurality of single wafer processing chambers for processing substrates one by one are arranged in a direction in which the area extends, a single substrate transport mechanism is provided in the single substrate transport area, which is capable of receiving a horizontally oriented substrate transported by the belt conveyor mechanism, transporting it to the single substrate processing chamber, and unloading the substrate that has been processed in the single substrate processing chamber; A substrate processing apparatus characterized in that the batch substrate transport area is provided with a batch substrate transport mechanism that transports multiple substrates at once between a substrate transfer position defined within the transfer block, the multiple batch processing tanks, and the second attitude conversion mechanism.

2. 2. The substrate processing apparatus according to claim 1, The substrate processing apparatus, wherein the single substrate transport area is located between the batch processing area and the single substrate processing area.

3. 3. The substrate processing apparatus according to claim 2, the single wafer processing area is provided with a first single wafer processing chamber and a second single wafer processing chamber as the plurality of single wafer processing chambers, and is further provided with a second single wafer substrate transport mechanism that transports substrates between the two chambers; The substrate processing apparatus is characterized in that the single substrate transport mechanism receives a horizontally oriented substrate transported by the belt conveyor mechanism, transports it to the first single substrate processing chamber, and unloads the substrate that has been processed in the second single substrate processing chamber.

4. 2. The substrate processing apparatus according to claim 1, The substrate processing apparatus, wherein the single substrate processing area is located between the batch processing area and the single substrate transport area.

5. 5. The substrate processing apparatus according to claim 4, the wet transport area is provided at one end of the batch processing area, on the opposite side to the side where the transfer block is provided; A substrate processing apparatus characterized in that the belt conveyor mechanism is arranged to wrap around the single-wafer processing area in a planar view when the single-wafer processing area intervenes and it is not possible to transport the substrate in a straight line from the second posture conversion mechanism to the single-wafer substrate transport area.

6. 2. The substrate processing apparatus according to claim 1, The wet transport area is interposed between the transfer block and the batch processing area. The substrate processing apparatus is characterized by the above.

7. 2. The substrate processing apparatus according to claim 1, the single wafer processing area includes a first single wafer processing chamber and a second single wafer processing chamber as the plurality of single wafer processing chambers, and further includes a second single wafer substrate transport area disposed between the chambers; the wet transport area is provided at one end of the batch processing area, on the opposite side to the side where the transfer block is provided; the single substrate transport area includes a transfer block side transport area on the transfer block side and a belt conveyor side transport area on the belt conveyor mechanism side; a second single-substrate transport mechanism is provided in the second single-substrate transport area and the belt conveyor side transport area to receive a horizontally oriented substrate transported by the belt conveyor mechanism and transport the substrate to the first single-substrate processing chamber, and to transport a substrate processed in the first single-substrate processing chamber to the second single-substrate processing chamber; The substrate processing apparatus, wherein the single substrate transport mechanism unloads the substrate processed in the second single substrate processing chamber.

8. 8. The substrate processing apparatus according to claim 1, The second attitude conversion mechanism includes: an in-tank carrier having an entrance for introducing and removing substrates and having two side walls on which a plurality of pairs of holding grooves for storing the plurality of substrates that have passed through the entrance are provided so as to face each other, the in-tank carrier having a back side opening that is disposed opposite the entrance with the plurality of substrates interposed therebetween and has a width that is smaller than the diameter of each substrate in the radial direction of the substrates; an immersion tank for storing an immersion liquid so that the in-tank carrier is immersed in the immersion liquid; a carrier support portion that supports the in-tank carrier from below; a carrier lifting unit that lifts and lowers the carrier support unit; a rotation mechanism that rotates the intra-tank carrier around two rotating shafts while sandwiching the two side walls of the intra-tank carrier between two rotating shafts extending horizontally, in order to convert the plurality of substrates from a vertical position to a horizontal position; a push-out member for pushing out one substrate housed in the intra-tank carrier; a push-out member advancing and retreating unit that moves the push-out member forward and backward in a horizontal direction, The substrate processing apparatus is characterized in that, when the multiple substrates stored in the intra-tank carrier are in a horizontal position, the push-out member advance / retract section advances the push-out member into the intra-tank carrier from the back side opening, and pushes out one of the substrates through the entrance / exit.

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