Transfer device

Abstract

To provide a transfer device which can prevent parts irradiated with an active energy line from becoming congested excessively.SOLUTION: A transfer device 10 is for transferring an element 21 held by a transfer substrate 22 to a transfer target substrate 23 by irradiating the transfer substrate 22 with an active energy line 11, and includes: an energy emitting unit 12 for emitting the active energy line 11 intermittently; and an irradiation position control unit 15 for controlling the position of applying the active energy line 11 emitted from the energy emitting unit 12 to the transfer substrate 22. The time interval of applying the active energy line to the transfer substrate 22 is adjusted according to the moving rate of the position of applying the active energy line 11 to the transfer substrate 22 by the irradiation position control unit 15.SELECTED DRAWING: Figure 2

Description

[Technical Field]

[0001] The present invention relates to a transfer apparatus that transfers elements onto a transfer substrate by irradiating the transfer substrate with light energy. [Background technology]

[0002] In recent years, semiconductor chips have been miniaturized to reduce costs, and efforts are being made to mount these miniaturized semiconductor chips with high precision. To mount these miniaturized chips at high speed, a technique known as laser lift-off is used, in which a laser is irradiated onto the bonding surface of a chip bonded to a transfer substrate to cause ablation, peeling the chip from the transfer substrate and transferring it to a transfer substrate by applying a force.

[0003] Patent Document 1 discloses an element transfer device that transfers elements using ablation technology. This element transfer device uses a laser irradiation device that includes a laser light source that generates a laser beam, a reflecting means that reflects the laser beam from the laser light source in a required direction, and a control means that controls the irradiation and non-irradiation of the laser beam in conjunction with the reflecting means. The laser beam is selectively irradiated onto some of the elements arranged on a transfer substrate, causing ablation (ablation) of the layer that holds the elements. This selective ablation transfers some of the elements onto the transfer substrate. In other words, the elements are transferred from the transfer substrate to the transfer substrate by laser lift-off. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Application Laid-Open No. 2006-041500 Summary of the Invention [Problem to be solved by the invention]

[0005] However, in the transfer device disclosed in Patent Document 1, there is a risk that the laser irradiated areas on the transfer substrate may become densely packed when the reflecting means is in an accelerating or decelerating state, such as when it performs a folding back operation. In particular, when transferring elements 121 by irradiating a plurality of laser beams 111 onto a holding area of ​​one element 121 on a transfer substrate 122 while changing the irradiation position, as shown in Figure 7, there is a problem that the elements 121 may be damaged in areas where the laser irradiated areas are densely packed, and cracks or the like may occur in the elements 121.

[0006] SUMMARY OF THE INVENTION In view of the above problems, an object of the present invention is to provide a transfer device that can prevent areas irradiated with active energy rays from becoming more dense than necessary. [Means for solving the problem]

[0007] In order to solve the above problems, the transfer device of the present invention is a transfer device that transfers elements held by a transfer substrate to a transferee substrate by irradiating the transfer substrate with active energy rays, and is characterized in that it comprises an energy emitting unit that intermittently emits active energy rays, and an irradiation position control unit that controls the irradiation position of the active energy rays emitted from the energy emitting unit on the transfer substrate, and the irradiation time interval of the active energy rays on the transfer substrate is adjusted according to the moving speed of the irradiation position of the active energy rays on the transfer substrate by the irradiation position control unit.

[0008] According to the transfer device of the present invention, when the moving speed of the irradiation position of the active energy ray on the transfer substrate is relatively slow, such as when the transfer substrate is in an accelerating or decelerating state, the time interval between irradiation of the active energy ray on the transfer substrate is adjusted to be relatively long, thereby preventing the areas irradiated with the active energy ray from becoming crowded.

[0009] Furthermore, when the direction of movement of the irradiation position of the active energy ray is changed, it is preferable that the time interval between irradiation of the active energy ray to the transfer substrate is adjusted to be relatively long.

[0010] When the movement direction of the irradiation position of the active energy rays is changed in this way, the movement speed of the irradiation position of the active energy rays is slowed down, so that it is possible to prevent the areas irradiated with the active energy rays from becoming crowded together.

[0011] The present invention is also preferably used when an element is transferred to the transfer substrate by irradiating the holding area of ​​one element held on the transfer substrate with active energy rays multiple times while changing the irradiation position.

[0012] Preferably, the time interval between the emission of the active energy rays by the energy emission unit is adjustable, and the time interval between the irradiation of the active energy rays onto the transfer substrate is adjusted by adjusting the emission time interval.

[0013] By doing so, the time interval between irradiation of the active energy rays onto the transfer substrate during acceleration and deceleration can be lengthened.

[0014] In addition, it is preferable that the device further has an irradiation blocking section that prevents the active energy rays emitted from the energy emitting section from being irradiated onto the transfer substrate, and that the irradiation blocking section be activated to prevent a portion of the active energy rays emitted from the energy emitting section from reaching the transfer substrate, thereby lengthening the irradiation time interval of the active energy rays onto the transfer substrate.

[0015] In this case, the irradiation blocking portion is preferably an acousto-optic element.

[0016] By doing so, even if the time interval between the emission of active energy rays from the energy emission part is constant, the time interval between the emission of active energy rays to the transfer substrate can be made longer when the moving speed of the irradiation position is relatively slow. [Effects of the Invention]

[0017] The transfer device of the present invention can prevent areas irradiated with active energy rays from becoming more dense than necessary. [Brief explanation of the drawings]

[0018] [Figure 1] FIG. 2 is a diagram illustrating a transfer device according to an embodiment of the present invention. [Figure 2] 2 is a diagram illustrating a state in which a transfer substrate is irradiated with laser light by the transfer device shown in FIG. 1. FIG. [Figure 3] 3 is an example of a data exchange format between devices for forming the irradiation state shown in FIG. 2. [Figure 4] FIG. 10 is a diagram illustrating a transfer device according to another embodiment of the present invention. [Figure 5] 5 is a diagram illustrating a state in which a transfer substrate is irradiated with laser light by the transfer device shown in FIG. [Figure 6] FIG. 10 is a diagram illustrating an example of a trajectory of an irradiation spot of laser light. [Figure 7] 10A and 10B are diagrams illustrating a state in which a transfer substrate is irradiated with laser light by a conventional transfer device. DETAILED DESCRIPTION OF THE INVENTION

[0019] A transfer device according to one embodiment of the present invention will be described with reference to FIG.

[0020] The transfer device 10 includes a laser emission unit 12 that irradiates laser light 11, a transfer substrate holding unit 13 that holds a transfer substrate 22 and is movable at least in the X-axis and Y-axis directions, a transferee substrate holding unit 14 that is located below the transfer substrate holding unit 13 and holds a transferee substrate 23 so as to face the transfer substrate 22 with a gap, and a control unit (not shown).By irradiating the transfer substrate 22 with laser light 11, ablation is caused in the transfer substrate, and an element 21 is transferred from the transfer substrate 22 to the transferee substrate 23.

[0021] The laser emitter 12 is an embodiment of the energy emitter of the present invention and is a device that intermittently emits laser light 11, such as an excimer laser, which is an active energy ray. The laser emitter 12 is fixed to the transfer device 10. In this embodiment, the laser emitter 12 emits spot-shaped laser light 11. The irradiation position of the laser light 11 in the X-axis and Y-axis directions is controlled by a control unit via a galvanometer mirror 15 and an fθ lens 16, whose angles are adjusted by the control unit. The laser light 11 selectively irradiates a plurality of elements 21 arranged on a transfer substrate 22 held by a transfer substrate holder 13. When the laser light 11 is incident on the vicinity of the elements 21 through the transfer substrate 22, ablation occurs between the transfer substrate 22 and the elements 21 due to the application of active energy (light energy). This ablation energizes the elements 21, and the elements 21 are transferred from the transfer substrate 22 to the transferee substrate 23. In this description, the elements 21 are, for example, semiconductor chips. Furthermore, a member that controls the irradiation position of the laser light 11, such as the galvanometer mirror 15, is also referred to as an irradiation position control section in this description.

[0022] The transfer substrate gripper 13 has an opening and sucks and grips the vicinity of the outer periphery of the transfer substrate 22. The laser light 11 emitted from the laser emission part 12 can be applied to the transfer substrate 22 held by the transfer substrate gripper 13 through this opening.

[0023] The transfer substrate 22 is a substrate made of a material such as glass that is capable of transmitting the laser beam 11, and holds the elements 21 on its underside. As shown in FIG. 2(a), a release layer 24 is formed on the surface of the transfer substrate 22 that holds the elements 21, and the surface of this release layer 24 is adhesive. The adhesive force of the surface of this release layer 24 serves as a holding force for the elements 21, adhesively holding the elements 21. When the release layer 24 is irradiated with the laser beam 11, ablation occurs, and the layer is decomposed and gasified, thereby disappearing.

[0024] Furthermore, the transfer substrate gripping part 13 is moved relative to the transferred substrate gripping part 14 in at least the X-axis direction and the Y-axis direction by a movement mechanism (not shown). A control part (not shown) controls this movement mechanism to adjust the position of the transfer substrate gripping part 13, thereby adjusting the relative position of the element 21 held on the transfer substrate 22 with respect to the transferred substrate 23.

[0025] The transferred substrate gripping unit 14 has a flat upper surface, and during the transfer process of the elements 21, grips the transferred substrate 23 so that the release layer 24 of the transfer substrate 22 and the elements 21 held by the release layer 24 face the transferred surface of the transferred substrate 23. The transferred substrate gripping unit 14 has a plurality of suction holes on its upper surface, and grips the back surface of the transferred substrate 23 (the surface to which the elements 21 are not transferred) by suction force.

[0026] Here, the transfer substrate 23 in this embodiment is a substrate made of a material such as glass, and as shown in Figure 2(a), an adhesive catch layer 25 is provided on the transfer surface (the surface that receives the element 21), which adhesively holds the element 21 transferred from the transfer substrate 22.

[0027] In this embodiment, only the transfer substrate holding part 13 moves in the X-axis and Y-axis directions, thereby causing the transfer substrate holding part 13 and the transferred substrate holding part 14 to move relatively in the X-axis and Y-axis directions. However, if the dimensions of the transferred substrate 23 are large and the entire surface of the transferred substrate 23 cannot be positioned directly under the irradiation range of the laser light 11, the transferred substrate holding part 14 may also be provided with a movement mechanism in the X-axis and Y-axis directions.

[0028] In the transfer device 10 having the above configuration, the transfer substrate 22 and the transferee substrate 23 are opposed to each other with the element 21 sandwiched therebetween, and laser light 11 is irradiated toward the element 21 through the transfer substrate 22. As the laser light 11 irradiates the release layer 24, the energy of the laser light 11 decomposes a portion of the material of the release layer 24, generating gas. Then, in the holding region of one element 21 on the transfer substrate 22, the material of this release layer 24 is decomposed and gas is generated, forming a blister 24a inside the release layer 24 or at the boundary between the transfer substrate 22 and the release layer 24. When the blister 24a is formed, the contact area between the surface of the release layer 24 and the element 21 decreases, and at the same time, the holding force of the release layer 24 on the element 21 decreases, resulting in the element 21 being separated from the transfer substrate 22 and moving to the transferee substrate 23. In other words, laser lift-off is performed.

[0029] The state of laser light irradiation onto the transfer substrate by the transfer device of this embodiment is shown in Fig. 2. Fig. 2(a) shows the state of laser light emission from the laser emission unit, and Fig. 2(b) is a view taken along the arrow AA in Fig. 1, showing the state of laser light irradiation onto the transfer substrate.

[0030] 2(b), in the present embodiment, the laser beam 11 is irradiated multiple times while changing the irradiation position in an area (indicated by the dashed line in FIG. 2(b)) where one element 21 is held in the release layer 24 provided on the transfer substrate 22, thereby transferring the element 21 from the transfer substrate 22 to the transferee substrate 23. In the present embodiment, the change in the irradiation position of the laser beam 11 (hereinafter also referred to as the irradiation spot) is performed by the galvanometer mirror 15, which is the irradiation position control unit, as described above.

[0031] At this time, the trajectory of movement of the irradiation spot of the laser light 11 in this embodiment is a roughly spiral shape, as shown in Figure 2(b), which is a repeat of linear movement in the X-axis direction, a 90-degree rotation in the movement direction, linear movement in the Y-axis direction, and a 90-degree rotation in the movement direction.

[0032] Here, when the irradiation position of the laser light 11 on the transfer substrate 22 (release layer 24) is controlled by the galvanometer mirror 15 so that the trajectory of the irradiation spot takes on such an approximately spiral shape, it is possible to keep the movement speed constant (speed V1) when the irradiation spot moves in a straight line, but when the movement direction is changed, such as by a 90-degree rotation in this embodiment, the movement speed of the irradiation spot decelerates from speed V1 and accelerates back to speed V1, resulting in a movement speed that is relatively slower than speed V1.

[0033] In this case, if the timing of irradiating the release layer 24 with the laser light 11 were constant, the areas actually irradiated with the laser light 11 would be concentrated as shown in Figure 7, and even if the release layer 24 disappears, the laser light 11 may still be irradiated, potentially damaging the element 21.

[0034] In contrast to this, in the present invention, the irradiation time interval of the laser beam 11 onto the transfer substrate 22 is adjusted according to the moving speed of the irradiation position of the laser beam 11 onto the transfer substrate 22 by the irradiation position control unit (galvanometer mirror 15). Specifically, when the moving speed of the irradiation position of the laser beam 11 onto the transfer substrate 22 is a predetermined speed V1 and is relatively fast, the irradiation time interval of the laser beam 11 onto the transfer substrate 22 is adjusted to be relatively long when the moving speed is relatively slow, such as when the moving speed is accelerating and decelerating until it reaches this predetermined speed V1.

[0035] In this embodiment, more specifically, in the example shown in FIG. 2(b), the irradiation time interval of the laser light 11 when the irradiation spot moves linearly at a predetermined speed V1 (for example, the time interval between the trigger pulse of the laser light 11a for irradiating the intended irradiation position 26a (see FIG. 2(a)) and the trigger pulse of the laser light 11b for irradiating the intended irradiation position 26b) is the time interval T1 shown in FIG. 2(a).

[0036] In contrast, because the direction of movement of the irradiation spot changes before and after irradiation of laser beam 11 onto planned irradiation position 26c, the movement speed of the irradiation spot decelerates from speed V1 and then accelerates back to speed V1. Therefore, the time it takes for the irradiation spot to reach planned irradiation position 26c from planned irradiation position 26b and the time it takes for the irradiation spot to reach planned irradiation position 26d from planned irradiation position 26c are longer than the time it takes for the irradiation spot to reach planned irradiation position 26b from planned irradiation position 26a. Accordingly, the time interval T2 between the trigger pulse of laser beam 11b irradiating planned irradiation position 26b and the trigger pulse of laser beam 11c irradiating planned irradiation position 26c is set longer than the time interval T1. Similarly, the time interval between the trigger pulse of laser beam 11c and the trigger pulse of laser beam 11d irradiating planned irradiation position 26d is also set to time interval T2.

[0037] This prevents the areas where laser light 11 is actually irradiated from concentrating in areas where the moving speed is increased or decreased, such as areas where the moving direction of the irradiation spot is changed, and therefore prevents laser light 11 from locally applying more energy than necessary to release layer 24 and ultimately element 21.

[0038] The equipment configuration and data exchange format for adjusting the irradiation time interval of the laser light 11 as described above are shown in FIG. 3(a).

[0039] In this embodiment, a galvanometer motor 41 that adjusts the angle of the galvanometer mirror 15 and a galvanometer controller 42 that controls the operation of the galvanometer motor 41 are connected by wiring, and the galvanometer controller 42 and the laser emission unit 12 are connected by wiring.

[0040] Furthermore, a control unit (not shown) stores in advance data on a plurality of planned irradiation positions of laser light 11 to be irradiated onto release layer 24 in order to transfer one element 21, as well as data on the movement pattern of the irradiation spot, and when this movement pattern data is input to galvanometer controller 42, galvanometer controller 42 issues an operation command to galvanometer motor 41 to realize this movement pattern. Then, galvanometer motor 41 is driven based on this operation command, and the angle of galvanometer mirror 15 is continuously changed, whereby laser light 11 is irradiated onto release layer 24 in accordance with the predetermined movement pattern.

[0041] Here, the galvano controller 42 calculates the time when the laser beam 11 will arrive at each of the planned irradiation positions set on the movement pattern, taking into consideration the speed and acceleration / deceleration of the galvano motor 41. In this embodiment, the galvano controller 42 also functions as a trigger circuit that transmits a trigger pulse to the laser emission unit 12 as a trigger for emitting (outputting) the laser beam 11, and the galvano controller 42 transmits a trigger pulse to the laser emission unit 12 at each of the planned irradiation times, thereby irradiating the laser beam 11 onto any of the planned irradiation positions on the release layer 24.

[0042] Here, as described above, the galvanometer controller 42 calculates the arrival time at each planned irradiation position taking into account the acceleration and deceleration of the galvanometer motor 41, so that it is possible to prevent the areas actually irradiated with the laser light 11 from being inadvertently concentrated together due to the acceleration and deceleration of the galvanometer motor 41.

[0043] The data on the plurality of planned irradiation positions of laser beam 11 and the data on the movement pattern of the irradiation spot may be created manually by an operator, or may be automatically generated by a control unit (not shown) using AI, etc. In this case, it is preferable to prepare, as parameters for automatic generation, shape information of element 21, information (energy, shape, etc.) of laser beam 11 emitted from laser emission unit 12, energy information required to ablate release layer 24, etc.

[0044] Here, the transfer device 10 may be capable of adjusting not only the time interval but also the output of the emitted laser beam 11. By reducing the output of the laser beam 11 in the acceleration / deceleration state compared to other states, it is possible to further prevent the laser beam 11 from locally applying more energy than necessary.

[0045] Next, the configuration of equipment and data exchange in another embodiment for adjusting the irradiation time interval of the laser light 11 is shown in FIG. 3(b).

[0046] In this embodiment, the galvanometer motor 41 is connected by wiring to a galvanometer controller 42 and a trigger circuit 43. The trigger circuit 43 transmits a trigger pulse that serves as a trigger for emitting (outputting) the laser beam 11 to the laser emission unit 12, and is connected to the laser emission unit 12 by wiring.

[0047] In addition, the control unit (not shown) pre-stores data on multiple irradiation positions of the laser light 11 to be irradiated onto the release layer 24 in order to transfer one element 21, as well as data on the movement pattern of the irradiation spot of the laser light 11.

[0048] Then, the position information of the galvanometer motor 41 is continuously transmitted from the galvanometer controller 42 and the trigger circuit 43. Then, when the trigger circuit 43 confirms that the position information of the galvanometer motor 41 corresponds to the planned irradiation positions of the laser beam 11, the trigger circuit 43 transmits a trigger pulse to the laser emission unit 12, whereby the laser beam 11 is irradiated onto each planned irradiation position provided on the release layer 24.

[0049] In this embodiment, the trigger circuit 43 transmits a trigger pulse based on the position information of the galvano motor 41, so that the laser beam 11 is emitted from the laser emission unit 12 when the irradiation spot reaches the predetermined irradiation position, regardless of the time it takes to reach the predetermined irradiation position. Therefore, the laser beam 11 can be irradiated to the desired position regardless of the moving speed of the irradiation spot or its acceleration or deceleration, and as a result, the time interval between irradiation of the laser beam 11 onto the transfer substrate 22 when the moving speed of the irradiation spot is at a predetermined speed is longer than the time interval between irradiation of the laser beam 11 onto the transfer substrate 22 when the moving speed of the irradiation spot is in a state where it is accelerating or decelerating until it reaches this predetermined speed.

[0050] Furthermore, since the galvanometer controller 42 and the trigger circuit 43 are provided separately, the laser beam 11 can be emitted from the laser emission unit 12 without stopping the operation of the galvanometer motor 41 .

[0051] At this time, the trigger circuit 43 itself may detect the speed of the galvanometer motor 41 by converting the position information transmitted from the galvanometer motor 41 into speed information, and may adjust the emission time interval of the laser light 11 based on the speed information of the galvanometer motor 41, as in the example of Figure 3(a).

[0052] Next, a transfer device according to another embodiment of the present invention will be described with reference to FIGS.

[0053] The transfer device 10 of this embodiment differs from the transfer device shown in FIG. 1 in that an irradiation blocking section 30 is provided on the path of the laser light 11 from the laser emission section 12 to the galvanometer mirror 15.

[0054] The irradiation blocking section 30 is a member that prevents the laser light 11 emitted from the laser emission section 12 from reaching the transfer substrate 22 when it is in operation.

[0055] In this embodiment, the irradiation blocking unit 30 is an acousto-optic material (AOM), which diffracts the laser light 11 when activated. The laser light 11, which is emitted from the laser emission unit 12 and diffracted by the activation of the acousto-optic element 30, travels along a path that does not hit the galvanometer mirror 15, as shown in FIG. 5(a). Therefore, when the acousto-optic element 30 is activated, the laser light 11 emitted from the laser emission unit 12 is thinned out without being irradiated onto the transfer substrate 22.

[0056] FIG. 5(b) is a view showing a state in which the transfer substrate is irradiated with laser light by the transfer device of this embodiment, and is a view taken along the arrow BB in FIG.

[0057] 2, in this embodiment, there is no particular difference in the time intervals at which the laser beam 11 is emitted from the laser emission unit 12, and the laser beam 11 is emitted intermittently at regular time intervals. Therefore, when the galvanometer mirror 15 is in an accelerating / decelerating state and is moving at a relatively slow speed, the areas to be irradiated with the laser beam 11 are concentrated.

[0058] Here, when such a galvanometer mirror 15 is in an accelerating or decelerating state, the acousto-optical element 30 operates to appropriately block the laser light 11 emitted from the laser emission section 12 from reaching the release layer 24, thereby preventing the areas on the release layer 24 where the laser light 11 is actually irradiated from becoming densely packed.

[0059] In particular, in this embodiment, the emission time interval of the laser beam 11 emitted from the laser emission unit 12 may be constant, which stabilizes the emission of the laser beam 11. Therefore, it is possible to prevent the occurrence of so-called giant pulses.

[0060] The above-described transfer device can prevent areas irradiated with active energy rays from becoming more dense than necessary.

[0061] Here, the transfer device of the present invention is not limited to the above-described embodiment, and may be of other embodiments within the scope of the present invention. For example, in the above description, a single element is transferred from a transfer substrate to a transferee substrate by irradiating the element with laser light multiple times while changing the irradiation position, but the present invention is not limited to this, and the transfer device of the present invention may also be used in cases where a single element is transferred by irradiating it with laser light once.

[0062] In the above description, the locus of the irradiation spot of the laser light is generally spiral-shaped, but the locus is not limited to this, and may be a generally zigzag shape in which a linear movement in the positive X direction, a reversal of the movement direction accompanied by a shift in the negative Y direction, a linear movement in the negative X direction, and a reversal of the movement direction accompanied by a shift in the negative Y direction are repeated, as shown in Fig. 6. In this case, since the movement speed decelerates and accelerates when the movement direction of the irradiation spot is reversed, by making the irradiation time interval of the laser light relatively long at this time as in the above embodiment, it is possible to prevent the areas irradiated with the laser light from being concentrated.

[0063] Furthermore, in the above description, the release layer of the transfer substrate forms blisters inside when irradiated with laser light, thereby releasing the elements, but this is not limited to this, and it may also be something that disappears when irradiated with laser light, for example, with the generation of gas.

[0064] In the above description, the irradiation blocking portion is an acousto-optical element, but it is not limited to this and may be, for example, a mirror, a shutter, or the like.

[0065] Furthermore, as explained above, the timing for relatively lengthening the irradiation time interval of the laser light is not necessarily limited to when the moving direction of the irradiation spot is changed. [Explanation of symbols]

[0066] 10 Transcription device 11 Laser light (active energy rays) 11a to 11d Laser light 12 Laser emission part (energy emission part) 13 Transfer substrate holder 14 Transferred substrate gripping part 15 Galvanometer mirror (irradiation position control unit) 16 Fθ lens 21 elements 22 Transfer substrate 22a Glass surface 23 Transferred substrate 24 release tier 24a Blister 25 Catch layer 26a~d Planned irradiation position 30 Acousto-optic element (irradiation blocking section) 41 Galvano motor 42 Galvano Controller 43 Trigger Circuit 111 Laser light 121 elements 122 Transfer substrate

Claims

1. a transfer device that transfers an element held on a transfer substrate to a transfer substrate by irradiating the transfer substrate with active energy rays, an energy emitting unit that intermittently emits active energy rays; an irradiation position control unit that controls an irradiation position of the active energy ray emitted from the energy emission unit on the transfer substrate; Equipped with A transfer device, characterized in that the time interval of irradiating the transfer substrate with active energy rays is adjusted according to the speed at which the irradiation position control unit moves the irradiation position of the active energy rays on the transfer substrate.

2. 2. The transfer device according to claim 1, wherein when the moving direction of the irradiation position of the active energy ray is changed, the time interval of irradiation of the active energy ray to the transfer substrate is adjusted to be relatively long.

3. 2. The transfer apparatus according to claim 1, wherein the device is transferred to the transfer substrate by irradiating a holding area of ​​one device held on the transfer substrate with active energy rays multiple times while changing the irradiation position.

4. 2. The transfer device according to claim 1, wherein the time interval between the emission of the active energy rays by the energy emission unit is adjustable, and the time interval between the irradiation of the active energy rays onto the transfer substrate is adjusted by adjusting the emission time interval.

5. 2. The transfer device according to claim 1, further comprising an irradiation blocking section that blocks the active energy rays emitted from the energy emitting section from being irradiated onto the transfer substrate, and the irradiation blocking section is activated to prevent a portion of the active energy rays emitted from the energy emitting section from reaching the transfer substrate, thereby lengthening the irradiation time interval of the active energy rays onto the transfer substrate.

6. 6. The transfer device according to claim 5, wherein the radiation blocking portion is an acousto-optical element.

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