Method and apparatus for manufacturing electronic components

Abstract

To provide a manufacturing method of an electronic component in which a conductive block between the electronic component and a carrier is covered and blocked by a capillary underfill, and provide a manufacturing device.SOLUTION: A manufacturing method of an electronic component comprises steps of: providing a carrier; providing the electronic component; fixing a conductive block located on at least one surface of the electronic component to the carrier to form an entire assembly; and disposing the entire assembly in a chamber. The manufacturing method of an electronic component further comprises a step M1 of lowering a temperature in a chamber to a first predetermined temperature lower than room temperature, a step M2 of lowering a pressure in the chamber to a first predetermined pressure which is a vacuum pressure and maintaining the vacuum pressure for a predetermined time, a step M3 of raising the pressure in the chamber to a second predetermined pressure equal to or higher than one atmospheric pressure and maintaining the second predetermined pressure for a predetermined time, and a step M4 of raising the temperature in the chamber to a second predetermined temperature.SELECTED DRAWING: Figure 1

Description

Technical Field

[0001] The present invention relates to a method and an apparatus for manufacturing electronic components.

Background Art

[0002] In the manufacturing process of conventional electronic components (such as chips, etc.), generally, the electronic components are fixed to a carrier through a plurality of conductive blocks, and after capillary underfill is applied from one or more sides of the electronic component, the capillary underfill spreads along the gap between the electronic component and the carrier to fill the gap, so that the conductive blocks between the electronic component and the carrier can be covered and blocked by the capillary underfill. However, generally, there are a plurality of minute bubbles in the capillary underfill. In the process of filling this gap, the capillary underfill spreads along one or more sides of the electronic component. Also, when the tip of the capillary underfill spreads, it may cause unfilled spaces due to various factors. Specifically, when the capillary underfill spreads from at least one side of the electronic component towards the other end, for example, the flow rates of the tips where the underfill spreads do not match, or unfilled spaces are formed due to various factors such as the backfill space (herein referred to as the backfill phenomenon) caused by the convergence of the tips where the underfill spreads from multiple sides. Due to such various factors that cause bubbles to occur, unfilled spaces are formed. The bubbles generated by this phenomenon and the plurality of minute bubbles in the capillary underfill will ultimately result in the formation of voids in the capillary underfill.

[0003] Conventional methods for removing bubbles generally involve raising the temperature and creating a vacuum. However, this method is not recommended for degassing advanced chiplet packages, system-in-a-packages (SiPs), or fillers made of low-temperature materials. Higher temperatures reduce the viscosity of the resin, resulting in increased fluidity and a higher risk of the resin overflowing or oozing onto the electronic components. Additionally, polymer materials have a tendency to diffuse easily, making it easy for too much material to be extracted during the bubble removal process due to the pressure difference between the inside and outside of the bubbles.

[0004] Therefore, consumers are earnestly hoping for the development of a more ideal and practical innovative structure to address the problems of the conventional structure described above, and those skilled in the art must strive to achieve a breakthrough by setting goals and directions for development.

[0005] In light of this, the inventor, having engaged in the manufacturing, development, and design of related products for many years, and after detailed design and careful evaluation for the above-mentioned purpose, has completed the development of the practical present invention. [Overview of the project]

[0006] To solve the aforementioned problems, one embodiment of the present invention provides a method for manufacturing an electronic component, comprising the steps of: providing a carrier having a first surface; providing an electronic component having a conductive block on at least one surface; fixing the conductive block located on at least one surface of the electronic component to the first surface of the carrier to form an entire assembly; applying capillary underfill from at least one side of the electronic component, wherein the capillary underfill spreads along the gap between the electronic component and the carrier, filling the gap and thus protecting the conductive block; placing the entire assembly in a chamber; lowering the temperature inside the chamber to a first predetermined temperature lower than room temperature; lowering the pressure inside the chamber to a first predetermined pressure which is a vacuum pressure and maintaining the vacuum pressure for a predetermined time; raising the pressure inside the chamber to a second predetermined pressure which is equal to or greater than 1 atmospheric pressure and maintaining the second predetermined pressure for a predetermined time; and raising the temperature inside the chamber to a second predetermined temperature.

[0007] The first predetermined temperature and pressure can avoid problems such as the capillary underfill overflowing onto the outside of the electronic component or rising onto the electronic component, and can also promote the reduction in the volume of bubbles caused by the backfilling phenomenon resulting from the capillary underfill being applied from multiple sides of the electronic component. The second predetermined temperature and pressure are used to completely remove the bubbles whose volume has been reduced from the gap between the electronic component and the carrier by gas dissolution and diffusion. Furthermore, by changing the parameters and order of the second predetermined temperature and pressure according to the requirements of the manufacturing process, bubbles caused by the backfilling phenomenon can be removed in order from large to small.

[0008] Furthermore, as mentioned above, polymer materials have a tendency to diffuse easily, so as long as the pressure difference between the inside and outside of the foam does not cause too much material to be drawn out during the foam removal process, a larger pressure difference contributes more to degassing. Also, increasing the viscosity by lowering the temperature of the material is a measure to prevent the material from being drawn out during the foam removal process. Increasing the viscosity of the material reduces the foam removal rate, but from a microscopic perspective, increasing the vacuum pressure difference between the inside and outside of the foam before the material is completely aged allows the foam to penetrate (dissolve) into the material more quickly, and the foam can be removed by the force of movement toward the edges of the electronic component due to the difference in concentration (gradient).

[0009] After describing in detail, with reference to more preferred embodiments and using drawings, the techniques, means, and effects used for the present invention will be explained, and the above-mentioned objectives, structure, and features of the present invention will be understood in depth and in detail. [Brief explanation of the drawing]

[0010] [Figure 1] This is a flowchart showing a method for manufacturing an electronic component according to one embodiment of the present invention. [Figure 2] This is a schematic diagram showing a manufacturing apparatus for electronic components related to one embodiment of the present invention. [Figure 3A] This is a schematic diagram showing the manufacturing process of electronic components. [Figure 3B] This is a schematic diagram showing the manufacturing process of electronic components. [Figure 3C] This is a schematic diagram showing the manufacturing process of electronic components. [Figure 3D] This is a schematic diagram illustrating the backfilling phenomenon that occurs when the tip of the capillary underfill converges during the three-way filling process. [Figure 3E] This is a schematic diagram illustrating the behavior of stress on bubbles in a material during the degassing process caused by the vacuum pressure difference in a capillary underfill. [Figure 4A] This is a schematic diagram illustrating different filling methods for capillary underfill. [Figure 4B] This is a schematic diagram illustrating different filling methods for capillary underfill. [Figure 5] This graph shows the relationship between process temperature, process pressure, and process time in one embodiment of the present invention. [Modes for carrying out the invention]

[0011] Therefore, in order to help your judges gain a further understanding and appreciation of the purpose, features, and effects of the present invention, we will provide a detailed explanation below, in accordance with the embodiments and drawings.

[0012] According to one embodiment of the present invention, a method for manufacturing an electronic component is provided with reference to drawings 3A to 3C. The method for manufacturing an electronic component includes the following steps.

[0013] A carrier 100 having a first surface 100a is provided. An electronic component 101 is provided having conductive blocks 103 on at least one surface of the electronic component 101. Conductive blocks 103 located on at least one surface of the electronic component 101 are fixed to the first surface 100a of the carrier 100, forming the entire assembly, where the spacing between the conductive blocks 103 is B and the gap between the electronic component 101 and the carrier 100 is A. Capillary underfill 105 is applied from at least one side of the electronic component 101, and the capillary underfill 105 spreads along the gap A between the electronic component 101 and the carrier 100, filling the gap A, covering and shielding the conductive blocks 105 between the electronic component 101 and the carrier 100, thereby forming protection for the conductive blocks 103. The entire assembly is then placed in the chamber 1 of Figure 2. Referring to Figures 1 and 5, the temperature inside chamber 1 is lowered to a first predetermined temperature lower than room temperature, increasing the viscosity of the capillary underfill 105, i.e., reducing the fluidity of the capillary underfill 105. The pressure inside chamber 1 is lowered to a first predetermined pressure, which is a vacuum pressure, and this vacuum pressure is maintained for a predetermined time to remove most of the bubbles 107 and bubbles (backfill space) 109 or reduce the volume of bubbles. Then the pressure inside chamber 1 is raised to a second predetermined pressure of 1 atmospheric pressure or more, and the second predetermined pressure is maintained for a predetermined time. The temperature inside chamber 1 is raised to a second predetermined temperature to further remove the remaining bubbles 107 and bubbles (backfill space) 109 by aging the capillary underfill and / or increasing the fluidity of the capillary underfill 105. For example, in one embodiment of the present invention, the second predetermined pressure may be, but is not limited to, 1 atmospheric pressure or more and 50 atmospheres or less.

[0014] Figure 5 is a graph showing the relationship between process temperature, process pressure, and process time according to one embodiment of the present invention. It should be understood that the process parameters shown in Figure 5 are illustrative and do not limit the present invention.

[0015] In embodiments of the present invention, the first predetermined temperature can be lowered from below room temperature (30°C) to -40°C. The second predetermined temperature is 40°C to 300°C. The first predetermined pressure can be lowered from below 1 atmospheric pressure (atm) to 10⁻⁴ torr. The second predetermined pressure may be 1 atmospheric pressure (atm) to 50 atmospheric pressures (atm). In embodiments of the present invention, step 1 (M1) includes lowering the temperature inside the chamber 1 to a first predetermined temperature lower than room temperature. Step 2 (M2) includes lowering the pressure inside the chamber 1 to a first predetermined pressure which is a vacuum pressure and maintaining the vacuum pressure for a predetermined time. Step 3 (M3) includes raising the pressure inside the chamber 1 to a second predetermined pressure of 1 atmospheric pressure or higher and maintaining the second predetermined pressure for a predetermined time. Step 4 (M4) includes raising the temperature inside the chamber 1 to a second predetermined temperature.

[0016] Figures 3A to 3C are schematic diagrams showing the manufacturing process of electronic components. As shown in Figures 3A to 3C, in the manufacturing process of electronic components, a conductive block 103 located on at least one side of the electronic component 101 is fixed to the first surface 100a (Figure 3A) of the carrier 100. Then, capillary underfill 105 is applied from at least one side of the electronic component 101 (Figure 3B). The capillary underfill spreads along the gap between the electronic component 101 and the carrier 100, flowing through this gap to fill it and protect the conductive block 103 (Figure 3C). However, generally, the capillary underfill 105 contains many tiny bubbles 107 and bubbles (backfill spaces) 109 caused by backfilling spaces created when the tip of the capillary underfill converges. Subsequently, these bubbles 107 and bubbles (backfill spaces) 109 form voids in the capillary underfill, and these voids cause a decrease in the reliability of the electronic component and lead to electrical failures. As shown in Figure 3D, during the process of filling the gap, the capillary underfill 105 spreads along the three sides of the electronic component 101, and furthermore, the tips C, D, and E of the capillary underfill 105 are left unfilled during convergence, creating spaces (i.e., bubbles (backfilled spaces) 109 in Figure 3C). Conventionally, the problem of void formation in the capillary underfill 105 was solved by high temperature and high pressure, but as a result, the fluidity increased during the bubble removal process, causing the capillary underfill 105 to rise and overflow onto the electronic component 101. Therefore, to solve this problem, the viscosity of the capillary underfill 105 is increased by lowering the temperature to below room temperature, and further, by creating a vacuum, the problem of the capillary underfill 105 rising and overflowing onto the electronic component 101 can be avoided. The effect of vacuum on bubbles is not only to cause bubble movement and tension according to Newton's laws of motion, but also to promote dissolution and diffusion.First, the process of lowering the temperature to below room temperature to increase the viscosity of the capillary underfill 105, and then creating a vacuum, is applied to the chiplets, which are tiny gaps between the tips. This process prevents the capillary underfill 105 from rising and overflowing when degassing the tiny gaps between the electronic components 101. This method is suitable for degassing chiplets, multi-chip packages, system-in-packages (SiPs), and capillary underfill 105 of low-temperature materials. Since capillary underfill is a polymer material, and gas molecules easily diffuse into the polymer material, a larger pressure difference contributes to the degassing rate, as long as the polymer material is not extracted by the vacuum pressure difference inside and outside the foam during the degassing process. Figure 3E is a schematic diagram showing the behavior of stress on bubbles in the material during the degassing process due to the vacuum pressure difference of capillary underfill 105. Lowering the temperature of the polymer material, i.e., increasing the viscosity of the polymer material, is an action taken to prevent the polymer material from being extracted during the process of removing bubbles from the polymer material. In general, the processes after the cooling and vacuum degassing processes both involve further increases in temperature and pressure. This is because vacuum degassing alone does not necessarily completely eliminate bubbles, and further lowering the viscosity of the capillary underfill 105 at a higher temperature and promoting the dissolution and dispersion of bubbles at a higher pressure is advantageous for the reduction and disappearance of bubbles.

[0017] In embodiments of the present invention, the capillary underfill 105 is applied from at least one side of the electronic component 101 by at least one method shown in Figures 4A to 4B, and the capillary underfill 105 spreads along the gap A between the electronic component 101 and the carrier 100, filling the gap A. Although Figures 4A to 4B show a rectangular carrier 100 and electronic component 101, the present invention can be applied to carriers and electronic components of various shapes. In one embodiment of the present invention, the electronic component 101 may be, for example, a chip.

[0018] As shown in Figure 2, according to one embodiment of the present invention, an electronic component manufacturing apparatus is connected to a facility pressure 12, i.e., an external pressure source. "Facility pressure" generally refers to the pressure supplied from a factory. The manufacturing apparatus includes an extension space 3 communicating with a chamber 1, a processing chamber 1 having one or more gas inlets 5 connected to the facility pressure 12, and one or more gas outlets 7, a cooler 9 mounted on the outside of the chamber 1 and connected to the chamber 1 via piping, a heater 10 mounted inside the chamber 1, a vacuum generator 11 mounted on the outside of the chamber and connected to the chamber 1 via the gas outlets 7, a controller 15, and a fan 17 that generates an airflow into the chamber 1. The cooler 9, heater 10, vacuum generator 11, and fan 17 are electrically connected to the controller 15 and can transmit signals and are controlled by the controller 15. The controller 15 can perform the following steps: lower the temperature inside the chamber 1 to a first predetermined temperature lower than room temperature using the cooler 9 and increase the viscosity of the capillary underfill 105; lower the pressure inside the chamber 1 to a first predetermined vacuum pressure using the vacuum generator 11 and maintain this vacuum pressure for a predetermined time to remove most of the bubbles 107 and bubbles (backfill space) 109 or reduce the volume of bubbles; raise the pressure inside the chamber 1 to a second predetermined pressure of 1 atmospheric pressure or higher using this external pressure source and maintain the second predetermined pressure for a predetermined time; and adjust the temperature inside the chamber 1 to rise to a second predetermined temperature using the heater 10 and fan 17 to age the capillary underfill 105 and / or increase the fluidity of the capillary underfill 105, thereby further removing the remaining bubbles 107 and bubbles (backfill space) 109.

[0019] In an embodiment of the present invention, the controller 15 may be a programmable logic controller (PLC). In one embodiment of the present invention, this external pressure source (i.e., the equipment pressure 12) may be connected to, for example, the pressure adjustment member 13. The pressure adjustment member 13 is electrically connected to the controller 115 and transmits a signal to be controlled by the controller 115 and used to complete a predetermined pressure setting in the chamber 1. When this external pressure source (equipment pressure) becomes insufficient or unstable, the pressure adjustment member 13 can increase or stabilize the pressure inside the chamber 1, and reach and maintain a second predetermined pressure at which the pressure in the chamber 1 does not drop below atmospheric pressure. In one embodiment of the present invention, the pressure adjustment member 13 may be a member such as a pressure pump or a compressor cylinder. The manufacturing apparatus further includes a vacuum sensor 19 connected inside the chamber 1 for detecting the vacuum pressure in the chamber 1, a pressure sensor 21 connected inside the chamber 1 for detecting the pressure in the chamber 1, and a temperature sensor 23 connected inside the chamber 1 for detecting the temperature in the chamber 1. The vacuum sensor 19, the pressure sensor 21, and the temperature sensor 23 are electrically connected to the controller 15 and are controlled by the controller 15 by transmitting signals.

[0020] In an embodiment of the present invention, the vacuum sensor 19 may be, for example, a vacuum gauge, and the pressure sensor 21 may be, for example, a pressure gauge. In one embodiment of the present invention, the vacuum generator 11 may be, for example, a vacuum pump. As described above, the fan 17 can achieve a convective heating effect when the heater 10 turns on its heating function and a convective cooling effect when the cooler 9 turns on its cooling function, and is used to promote the temperature adjustment in the chamber 1 by generating an air flow directed toward the inside of the chamber 1. The fan 17 is located inside the chamber 1 and is connected to the drive motor 17a via the transmission shaft 17b. Among them, the drive motor 17a is installed in the extended space 3 communicating with the chamber 1, and the chamber 1 and the extended space 3 are designed without a seal.

[0021] In one embodiment of the present invention, the pressure and / or temperature adjustment is performed by the controller 15. For example, when reducing the pressure inside the chamber 1 to a predetermined vacuum pressure, the controller 15 first turns on the vacuum set value and instructs the vacuum generator 11 to evacuate the inside of the chamber. Then, when the controller 15 receives a measurement signal from the vacuum sensor 19 indicating that the pressure inside the chamber has dropped to the vacuum set value, the operation of the vacuum generator 11 is stopped. Of course, as described above, the pressure increase operation inside the chamber 1 and the temperature increase / decrease operation inside the chamber 1 can also be achieved in this way.

[0022] Furthermore, as described above, linear pressure and / or temperature adjustment can also be achieved by the control of the controller 15. As an example, the controller 15 can be designed with a linearly increasing / decreasing graph function so that the pressure and / or temperature inside the chamber can be adjusted in a linearly increasing / decreasing manner. Since the design of the controller is well known to those skilled in automatic control, the design principle and method thereof will not be mentioned here.

[0023] The preferred embodiments of the present invention have been specifically described above as technical features of the present invention. However, those skilled in the art can make changes or modifications to the present invention without departing from the spirit and principles of the present invention, and such changes or modifications shall be included in the scope of the claims defined below.

Explanation of Reference Numerals

[0024] 1 Chamber 3 Extension Space 5 Gas Inlet 7 Gas Outlet 9 Cooler 10 Heater 11 Vacuum Generator 12 Equipment Pressure 13 Pressure Adjusting Member 15 Controller 17 Fan 17a Driving Motor 17b Conductive Shaft 19 Vacuum Sensor 21 Pressure Sensor 23 Temperature Sensor 100 Carriers 100a First surface 101 Electronic Components 103 Conductive block 105 Capillary Underfill 107 Bubbles 109 Foam (backfill space) A gap B Interval C Capillary underfill tip D Capillary underfill tip E Capillary underfill tip M1 Process 1 M2 process 2 M3 process 3 M4 process 4

Claims

1. A step of providing a carrier having a first surface, A step of providing an electronic component having a conductive block on at least one surface, A step of fixing a conductive block located on at least one surface of the electronic component to the first surface of the carrier to form the entire assembly, A capillary underfill is applied to at least one side of the electronic component, and the capillary underfill spreads along the gap between the electronic component and the carrier, filling the gap and thus protecting the conductive block. A method for manufacturing an electronic component, which includes the step of placing the entire assembly into a chamber, The step of adjusting the temperature and pressure inside the chamber is as follows: (a) A step of lowering the temperature inside the chamber to a first predetermined temperature lower than room temperature and increasing the viscosity of the capillary underfill, (b) Reducing the pressure inside the chamber to a first predetermined pressure which is a vacuum pressure, and maintaining the vacuum pressure for a predetermined time, thereby removing bubbles or reducing the volume of bubbles. (c) The steps of raising the pressure inside the chamber to a second predetermined pressure which is equal to or greater than 1 atmospheric pressure, and maintaining the second predetermined pressure for a predetermined time, A method for manufacturing an electronic component, comprising: (d) raising the temperature in the chamber to a second predetermined temperature to age the capillary underfill and / or increase the fluidity of the capillary underfill; and (c) further removing any remaining bubbles in accordance with step.

2. The method for manufacturing an electronic component according to claim 1, characterized in that the first predetermined temperature is between 30°C and -40°C.

3. The method for manufacturing an electronic component according to claim 1, characterized in that the first predetermined pressure is from 1 atmospheric pressure or less to 10⁻⁴ torr.

4. The method for manufacturing an electronic component according to claim 1, characterized in that the second predetermined temperature is between 40°C and 300°C.

5. The method for manufacturing an electronic component according to claim 1, characterized in that the second predetermined pressure is between 1 atmospheric pressure (atm) and 50 atmospheric pressures (atm).

6. A manufacturing apparatus for electronic components connected to an external pressure source, A chamber having an extension space communicating with the chamber, one or more gas inlets connected to the external pressure source, and one or more gas outlets, A cooler is mounted on the outside of the chamber and connected to the chamber via piping, A heater attached to the chamber, A vacuum generator is mounted on the outside of the chamber and connected to the chamber, A fan that generates an airflow that flows into the chamber, Includes the controller, The aforementioned controller, The steps include lowering the temperature inside the chamber to a first predetermined temperature lower than room temperature using the cooler, thereby increasing the viscosity of the capillary underfill, The steps include: reducing the pressure inside the chamber to a first predetermined pressure, which is a vacuum pressure, using the vacuum generator, and maintaining the vacuum pressure for a predetermined time to remove bubbles or reduce the volume of bubbles; The steps include raising the pressure inside the chamber to a second predetermined pressure of 1 atmospheric pressure or more using the external pressure source, and maintaining the second predetermined pressure for a predetermined time, An apparatus for manufacturing electronic components, characterized in that it is used to perform the steps of: raising the temperature inside the chamber to a second predetermined temperature by the heater and the fan, thereby aging the capillary underfill and / or increasing the fluidity of the capillary underfill, thereby further removing any remaining bubbles.

7. The electronic component manufacturing apparatus according to claim 6, further comprising a pressure adjustment member provided between the external pressure source and the gas inlet, for raising the pressure in the chamber to the second predetermined pressure and maintaining it at the second predetermined pressure.

8. The electronic component manufacturing apparatus according to claim 6, further comprising a vacuum sensor connected to the chamber, which detects the vacuum pressure inside the chamber and is electrically connected to the controller.

9. The electronic component manufacturing apparatus according to claim 6, further comprising a pressure sensor connected to the chamber, which detects the pressure inside the chamber and is electrically connected to the controller.

10. The electronic component manufacturing apparatus according to claim 6, further comprising a temperature sensor connected to the chamber, which detects the temperature inside the chamber and is electrically connected to the controller.

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