Ceramic wiring member motherboard and ceramic wiring member

Abstract

A ceramic wiring member motherboard (100) is formed such that, as viewed from the thickness direction, a plurality of ceramic wiring members (110, 120) having a rectangular shape are laid side by side and are integrally connected. The plurality of ceramic wiring members (110, 120) include first ceramic wiring members (110) and second ceramic wiring members (120). Each of the first ceramic wiring members (110) and each of the second ceramic wiring members (120) are disposed such that a first side (111) of the first ceramic wiring member (110) and a second side (121) of the second ceramic wiring member (120) partially overlap. A first via hole (131) and a first via conductor (28) are formed in a region where the first side (111) and the second side (121) overlap. The first ceramic wiring member (110) and the second ceramic wiring member (120) are point symmetrically disposed with respect to the first via conductor (28).

Description

Ceramic wiring member mother board and ceramic wiring member

[0001] The present disclosure relates to a ceramic wiring member mother substrate and a ceramic wiring member.

[0002] A ceramic wiring member is known that includes a ceramic main body having a plate-shaped portion and a conductive portion arranged in contact with the plate-shaped portion. Such a ceramic wiring member is used as a member for holding an electronic component. The conductive portion forms part of a path of current to or from the electronic component. From the viewpoint of improving the efficiency of the manufacturing process, such a ceramic wiring member can be manufactured by manufacturing a ceramic wiring member mother substrate on which a plurality of ceramic wiring members are laid out and connected together, and then dividing the substrate into a plurality of individual ceramic wiring members (see, for example, WO 2017 / 126596 (Patent Document 1), JP 2000-312060 A (Patent Document 2), and JP 2016-66676 A (Patent Document 3)).

[0003] International Publication No. 2017 / 126596 Japanese Patent Application Laid-Open No. 2000-312060 Japanese Patent Application Laid-Open No. 2016-66676

[0004] A ceramic wiring member is known that includes a ceramic body having a plate-like portion and a conductive portion disposed in contact with the body, and that has a rectangular shape when viewed perpendicular to the plate-like portion. In such a ceramic wiring member, the conductive portion may include a frame-like portion that is annularly disposed on the body along the periphery of the rectangle in a top plan view, and a ground terminal that is disposed on the body in a back plan view. In a ceramic wiring member with such a structure, an electronic component such as a crystal element is housed in the space above the plate-like portion, sealed by joining a metal lid to the frame-like portion. Furthermore, electrical connection between the frame-like portion and the ground terminal ensures grounding of the lid. Electrical connection between the frame-like portion and the ground terminal can be achieved, for example, by forming a through-hole that penetrates the body from the frame-like portion to the ground terminal and filling the through-hole with a conductor.

[0005] In response to recent demands for miniaturization of electronic devices, miniaturization of ceramic wiring members is also being demanded. As the ceramic wiring member becomes smaller, the width of the frame-shaped portion becomes smaller, making it difficult to achieve electrical connection between the frame-shaped portion and the ground terminal by forming the through-hole. In response to this, a measure can be adopted in which, instead of the through-hole, electrical connection between the frame-shaped portion and the ground terminal is achieved by forming a groove on the outer periphery of the main body from the frame-shaped portion to the ground terminal and arranging a conductor on the wall surface of the groove.

[0006] When such a ceramic wiring member is manufactured by a manufacturing process that first prepares the ceramic wiring member mother substrate, a process can be adopted in which the ceramic wiring members are arranged in a matrix pattern so that four ceramic wiring members share a vertex of a rectangle, through holes are formed at positions corresponding to the vertices of the rectangle, and conductors are disposed on the wall surfaces surrounding the through holes.The ceramic wiring member can then be manufactured by dividing the ceramic wiring member mother substrate along the periphery of the rectangle.

[0007] However, according to the inventors' investigations, when the above process is adopted, the conductors arranged on the walls surrounding the through holes may fall off during division into ceramic wiring members. This is thought to be because the conductors located at the vertices of the rectangle are separated into four pieces during division, reducing the contact area between the walls of the through holes and the conductors, making them more susceptible to falling off. The falling off of the conductors reduces the reliability of the electrical connection between the frame-shaped portion and the ground terminal. On the other hand, by forming the through holes and conductors at positions corresponding to sides away from the vertices of the rectangle instead of at the vertices, the contact area between the conductors and the walls of the through holes is increased, thereby preventing the conductors from falling off. However, when two ceramic wiring members sharing the above through holes and conductors are separated into left and right halves in the ceramic wiring member motherboard state, two different ceramic wiring members are obtained: one with the conductor located on the left side and the other with the conductor located on the right side. In the manufacture of ceramic wiring members, it is preferable to mass-produce products with the same structure. Therefore, the production of two types of ceramic wiring members with different structures creates the need to control the structures of the ceramic wiring members, which becomes an obstacle to improving the efficiency of the manufacturing process.

[0008] The present disclosure aims to solve the above-mentioned problems, and one of the objects of the present disclosure is to provide a ceramic wiring member mother board and a ceramic wiring member that can achieve efficiency in the manufacturing process while maintaining the reliability of the electrical connection between the frame-shaped portion and the ground terminal.

[0009] A ceramic wiring member mother substrate according to the present disclosure has a first surface that is one surface in a thickness direction and a second surface that is the surface opposite to the first surface in the thickness direction, and is a ceramic wiring member mother substrate on which a plurality of ceramic wiring members, each having a rectangular shape as viewed in the thickness direction, are laid out and connected together. The plurality of ceramic wiring members include a first ceramic wiring member and a second ceramic wiring member connected to the first ceramic wiring member.

[0010] Each of the first ceramic wiring member and the second ceramic wiring member includes a ceramic body having a plate-shaped portion and a conductive portion arranged in contact with the body. In a plan view of the first surface side, the conductive portion includes a frame-shaped portion arranged annularly on the body along the outer periphery of the rectangle and a pair of internal terminals arranged in a region of the body surrounded by the frame-shaped portion. In a plan view of the second surface side, the conductive portion includes a pair of external terminals arranged spaced apart from each other on the body portion and a ground terminal arranged on the body portion spaced apart from the pair of external terminals. One of the pair of internal terminals is electrically connected to one of the pair of external terminals. The other of the pair of internal terminals is electrically connected to the other of the pair of external terminals.

[0011] At least one of the first surface and the second surface has break grooves extending along each side of the rectangular shape of adjacent ceramic wiring members. The first ceramic wiring member and the second ceramic wiring member are arranged so that a first side, which is one of the sides of the rectangular shape of the first ceramic wiring member, partially overlaps with a second side, which is one of the sides of the rectangular shape of the second ceramic wiring member, but both ends of the first side and both ends of the second side do not overlap. A first via hole is formed in the overlapping area of ​​the first side and the second side, penetrating the ceramic wiring member mother substrate in the thickness direction. The conductive portion further includes a first via conductor formed on a wall surface surrounding the first via hole and connecting ground terminals of the first ceramic wiring member and the second ceramic wiring member to the frame-shaped portion of the first ceramic wiring member and the second ceramic wiring member. The first ceramic wiring member and the second ceramic wiring member are arranged point-symmetrically with respect to the first via conductor when viewed in the thickness direction of the ceramic wiring member mother substrate. The plurality of ceramic wiring members are configured by interconnecting a first ceramic wiring member and a second ceramic wiring member, each of which is a unit structure, and the unit structures are laid out closely together with no gaps therebetween.

[0012] A ceramic wiring member according to the present disclosure includes a ceramic body having a plate-like portion and a conductive portion arranged in contact with the body, and has a rectangular shape when viewed perpendicular to the plate-like portion. The plate-like portion has a first main surface that is one of the main surfaces in the thickness direction and a second main surface located on the opposite side of the thickness direction from the first main surface. The conductive portion includes, in a plan view from the first main surface side, a frame-like portion arranged annularly on the body along the outer periphery of the rectangle and a pair of internal terminals arranged in a region of the body surrounded by the frame-like portion. In a plan view from the second main surface side, the conductive portion includes a pair of external terminals arranged on the body portion at a distance from each other and a ground terminal arranged on the body portion at a distance from the pair of external terminals.

[0013] One of the pair of internal terminals is electrically connected to one of the pair of external terminals. The other of the pair of internal terminals is electrically connected to the other of the pair of external terminals. A first groove penetrating the body in the thickness direction is formed on the outer periphery of the body, spaced apart from the vertex of the rectangle. The conductive portion further includes a first via conductor formed on a wall surface of the first groove and connecting the ground terminal to the frame-shaped portion. In at least one of a plan view of the first main surface side and a plan view of the second main surface side, the outer periphery of the ceramic wiring member is formed with a first notch formed on a third side, which is the side of the rectangle in which the first groove is formed, spaced apart from the vertex, and a second notch formed on a fourth side opposite the third side, spaced apart from the vertex. The first notch and the second notch are located on the same straight line perpendicular to the third and fourth sides. Note that in this application, "rectangle" includes "square."

[0014] The ceramic wiring member mother substrate and ceramic wiring member described above can provide a ceramic wiring member mother substrate and ceramic wiring member that can achieve efficient manufacturing processes while maintaining the reliability of the electrical connection between the frame-shaped portion and the ground terminal.

[0015] FIG. 1 is a schematic plan view of a first surface side of a ceramic wiring member mother substrate in accordance with the first embodiment. FIG. 2 is a schematic plan view of a second surface side of a ceramic wiring member mother substrate in accordance with the first embodiment. FIG. 3 is a schematic plan view of a top surface side of a ceramic wiring member. FIG. 4 is a schematic side view of a ceramic wiring member. FIG. 5 is a schematic cross-sectional view taken along line V-V in FIGS. 3 and 6. FIG. 6 is a schematic plan view of a back surface side of a ceramic wiring member. FIG. 7 is a schematic side view of a ceramic wiring member. FIG. 8 is a schematic cross-sectional view taken along line VIII-VIII in FIGS. 3 and 6. FIG. 9 is a schematic plan view of a first surface side of a ceramic wiring member mother substrate in accordance with the second embodiment. FIG. 10 is a schematic plan view of a second surface side of a ceramic wiring member mother substrate in accordance with the second embodiment.

[0016] [Summary of the Embodiments] First, embodiments of the present disclosure will be described. A ceramic wiring member mother substrate of the present disclosure has a first surface that is one surface in the thickness direction and a second surface that is the surface opposite to the first surface in the thickness direction, and is a ceramic wiring member mother substrate on which a plurality of ceramic wiring members each having a rectangular shape when viewed in the thickness direction are laid out and connected together. The plurality of ceramic wiring members include a first ceramic wiring member and a second ceramic wiring member connected to the first ceramic wiring member.

[0017] Each of the first ceramic wiring member and the second ceramic wiring member includes a ceramic body having a plate-shaped portion and a conductive portion arranged in contact with the body. In a plan view of the first surface side, the conductive portion includes a frame-shaped portion arranged annularly on the body along the outer periphery of the rectangle and a pair of internal terminals arranged in a region of the body surrounded by the frame-shaped portion. In a plan view of the second surface side, the conductive portion includes a pair of external terminals arranged spaced apart from each other on the body portion and a ground terminal arranged on the body portion spaced apart from the pair of external terminals. One of the pair of internal terminals is electrically connected to one of the pair of external terminals. The other of the pair of internal terminals is electrically connected to the other of the pair of external terminals.

[0018] At least one of the first surface and the second surface has break grooves extending along each side of the rectangular shape of adjacent ceramic wiring members. The first ceramic wiring member and the second ceramic wiring member are arranged so that a first side, which is one of the sides of the rectangular shape of the first ceramic wiring member, partially overlaps with a second side, which is one of the sides of the rectangular shape of the second ceramic wiring member, but both ends of the first side and both ends of the second side do not overlap. A first via hole is formed in the overlapping area of ​​the first side and the second side, penetrating the ceramic wiring member mother substrate in the thickness direction. The conductive portion further includes a first via conductor formed on a wall surface surrounding the first via hole and connecting ground terminals of the first ceramic wiring member and the second ceramic wiring member to the frame-shaped portion of the first ceramic wiring member and the second ceramic wiring member. The first ceramic wiring member and the second ceramic wiring member are arranged point-symmetrically with respect to the first via conductor when viewed in the thickness direction of the ceramic wiring member mother substrate. The plurality of ceramic wiring members are configured by interconnecting a first ceramic wiring member and a second ceramic wiring member, each of which is a unit structure, and the unit structures are laid out closely together with no gaps therebetween.

[0019] In the ceramic wiring member mother substrate of the present disclosure, a first via hole is formed in a region where a first side of a first ceramic wiring member and a second side of a second ceramic wiring member overlap, and a first via conductor formed on a wall surface surrounding the first via hole connects the ground terminal and the frame-shaped portion. By arranging the first via hole and the first via conductor at positions corresponding to the sides of the rectangle rather than the vertices of the rectangle, when the first ceramic wiring member and the second ceramic wiring member are separated along the first and second sides, the contact area between the first via conductor and the wall surface of the through hole is increased, thereby preventing the first via conductor from falling off. Furthermore, by arranging the first ceramic wiring member and the second ceramic wiring member point-symmetrically with respect to the first via conductor and offset from each other so that the first and second sides partially overlap, the first ceramic wiring member and the second ceramic wiring member after separation have the same structure. As a result, the efficiency of the manufacturing process is improved.

[0020] Thus, the ceramic wiring member motherboard of the present disclosure can achieve an efficient manufacturing process while maintaining the reliability of the electrical connection between the frame portion and the ground terminal.

[0021] In the ceramic wiring member mother substrate, first through holes may be formed at each vertex of the rectangular shape of the plurality of ceramic wiring members, penetrating from the first surface to the second surface. With this configuration, even if there is some error in the formation positions of the break grooves extending along each side of the rectangle, it is possible to connect the break grooves extending perpendicular to each other at desired positions.

[0022] In a plan view of the first surface side of the ceramic wiring member mother substrate, the pair of internal terminals of the first ceramic wiring member and the pair of internal terminals of the second ceramic wiring member may be arranged offset in opposite directions along the first and second sides within the region surrounded by the frame-shaped portion. With this configuration, even if the internal terminals are arranged offset due to the structure of the electronic component to be held in the ceramic wiring member, it is possible to achieve an efficient manufacturing process.

[0023] The ceramic wiring member according to the present disclosure includes a ceramic body having a plate-like portion and a conductive portion disposed in contact with the body, and has a rectangular shape when viewed perpendicular to the plate-like portion. The plate-like portion has a first main surface that is one of the main surfaces in the thickness direction and a second main surface located on the opposite side of the thickness direction from the first main surface. The conductive portion includes, in a plan view from the first main surface side, a frame-like portion that is annularly disposed on the body along the outer periphery of the rectangle and a pair of internal terminals that are disposed in a region of the body surrounded by the frame-like portion. In a plan view from the second main surface side, the conductive portion includes a pair of external terminals that are spaced apart from each other on the body portion and a ground terminal that is spaced apart from the pair of external terminals on the body portion.

[0024] One of the pair of internal terminals is electrically connected to one of the pair of external terminals. The other of the pair of internal terminals is electrically connected to the other of the pair of external terminals. A first groove penetrating the body in the thickness direction is formed on the outer periphery of the body, spaced apart from the vertex of the rectangle. The conductive portion further includes a first via conductor formed on a wall surface of the first groove and connecting the ground terminal to the frame-shaped portion. In at least one of a plan view of the first main surface side and a plan view of the second main surface side, the outer periphery of the ceramic wiring member is formed with a first notch formed on a third side, which is the side of the rectangle on which the first groove is formed, spaced apart from the vertex, and a second notch formed on a fourth side opposite the third side, spaced apart from the vertex. The first notch and the second notch are located on the same straight line perpendicular to the third and fourth sides.

[0025] The ceramic wiring member of the present disclosure can be efficiently manufactured by dividing the ceramic wiring member mother substrate of the present disclosure along the break grooves into ceramic wiring members while maintaining the reliability of the electrical connection between the frame portion and the ground terminal, wherein the first and second cutouts are formed in correspondence with the regions where the break grooves branch off in the ceramic wiring member mother substrate.

[0026] In the ceramic wiring member, the first and second notches may penetrate the ceramic wiring member in a thickness direction of the main body. Such first and second notches may be formed by forming first through holes in the ceramic wiring member mother substrate. With this configuration, break grooves extending perpendicular to each other in the ceramic wiring member mother substrate can be connected at desired positions, thereby suppressing variation in the shape of the ceramic wiring member.

[0027] In the ceramic wiring member, the first and second notches may be arranged biased to one side in a direction along the third and fourth sides. With this configuration, even when an electronic component is mounted on the ceramic wiring member and is sealed with a lid, making it possible to determine the orientation of the electronic component by the first and second notches.

[0028] [Specific Examples of Embodiments] Next, specific embodiments of the ceramic wiring member mother substrate and ceramic wiring member of the present disclosure will be described with reference to the drawings. In the following drawings, the same or corresponding parts are designated by the same reference characters, and their description will not be repeated.

[0029] (Embodiment 1) Fig. 1 is a schematic plan view of a first surface side of a ceramic wiring member mother substrate in embodiment 1 which is an embodiment of the present disclosure. Fig. 2 is a schematic plan view of a second surface side of a ceramic wiring member mother substrate in embodiment 1. Fig. 3 is a schematic plan view of an upper surface side of a ceramic wiring member. Fig. 4 is a schematic side view of a ceramic wiring member. Fig. 5 is a schematic cross-sectional view taken along line V-V in Figs. 3 and 6. Fig. 6 is a schematic plan view of a back surface side of a ceramic wiring member. Fig. 7 is a schematic side view of a ceramic wiring member. Fig. 8 is a schematic cross-sectional view taken along line VIII-VIII in Figs. 3 and 6.

[0030] 1 and 2 , a ceramic wiring mother substrate 100 according to this embodiment has a first surface 100A (see FIG. 1 ), which is one surface in the thickness direction (Z-axis direction), and a second surface 100B (see FIG. 2 ), which is the surface opposite the first surface 100A in the thickness direction. The ceramic wiring mother substrate 100 has a structure in which a plurality of rectangular ceramic wiring members 110, 120 are laid out and integrally connected when viewed in the thickness direction (along the Z-axis direction). The plurality of ceramic wiring members 110, 120 includes a first ceramic wiring member 110 and a second ceramic wiring member 120 connected to the first ceramic wiring member 110. Although the first ceramic wiring member 110 and the second ceramic wiring member 120 are arranged in different orientations within the ceramic wiring mother substrate 100, they are ceramic wiring members 1 having the same structure, as will be described below with reference to FIGS. 3 to 8 .

[0031] 3 to 8 , the ceramic wiring member 1 (each of the first ceramic wiring member 110 and the second ceramic wiring member 120) includes a ceramic body 10 and a conductive portion 20 arranged in contact with the body 10. The ceramic constituting the body 10 is not particularly limited, but alumina (aluminum oxide) can be used, for example. The body 10 includes a plate-like portion 11 having a flat plate shape and a frame 12. The plate-like portion 11 has a rectangular shape when viewed in the thickness direction (Z-axis direction). The plate-like portion 11 includes a first main surface 11A and a second main surface 11B located on the opposite side of the first main surface 11A in the thickness direction. The thickness t of the body 10 can be, for example, 0.1 mm or more and 0.6 mm or less.

[0032] The frame 12 has a frame-like shape rising from the outer edge of the first main surface 11A of the plate-shaped portion 11. More specifically, it has an annular shape that follows the outer edge of the first main surface 11A of the plate-shaped portion 11, which has a rectangular planar shape. When viewed perpendicular to the first main surface 11A, the frame 12 surrounds a cavity 50, which is a space above the first main surface 11A. The frame 12 includes a planar first end surface 12A and a planar second end surface 12B opposite the first end surface 12A in the thickness direction of the plate-shaped portion 11. The frame 12 is connected to the first main surface 11A of the plate-shaped portion 11 at the second end surface 12B. The first end surface 12A is located on a single plane throughout its entire area. As a result, the cavity 50 can be closed by placing a flat cover member on the first end surface 12A. The cavity 50 can accommodate electronic components, such as quartz crystal elements, that require airtightness. Such a ceramic wiring member 1 can be used as a ceramic package for accommodating electronic components. For example, when electrodes attached to both sides of a quartz crystal element are connected to a pair of internal terminals 22, a quartz crystal unit is formed.

[0033] The conductive portion 20 includes a frame-shaped portion 21, a pair of internal terminals 22, a pair of external terminals 23, a pair of ground terminals 24, a first via conductor 28, a second via conductor 25, a third via conductor 27, a first connecting portion 26, and a second connecting portion 29. The frame-shaped portion 21 is arranged to cover the first end surface 12A of the frame body 12. The frame-shaped portion 21 has an annular shape corresponding to the first end surface 12A of the frame body 12. That is, in a plan view of the first surface 100A side (as viewed from FIGS. 1 and 3 ), the frame-shaped portion 21 is arranged in an annular shape on the frame body 12 of the main body 10 along the outer periphery of the rectangular ceramic wiring member 1. The pair of internal terminals 22 are arranged in contact with the first main surface 11A of the plate-shaped portion 11 surrounded by the frame body 12. That is, when viewed in a plan view from the first surface 100A side, the pair of internal terminals 22 are arranged on the area of ​​the first main surface 11A of the plate-shaped portion 11 included in the main body 10 that is surrounded by the frame-shaped portion 21.

[0034] The frame 12 may be omitted. That is, the conductive portion 20 includes a frame-shaped portion 21, a pair of internal terminals 22, a pair of external terminals 23, a pair of ground terminals 24, a first via conductor 28, a second via conductor 25, a third via conductor 27, a first connecting portion 26, and a second connecting portion 29. In a plan view of the first surface 100A side (as viewed from FIGS. 1 and 3 ), the frame-shaped portion 21 is annularly arranged on the first main surface 11A of the main body 10 (plate-shaped portion 11) along the outer periphery of the rectangular ceramic wiring member 1. The pair of internal terminals 22 are arranged in contact with the first main surface 11A. In a plan view of the first surface 100A side, the pair of internal terminals 22 are arranged in a region of the first main surface 11A of the plate-shaped portion 11 included in the main body 10 that is surrounded by the frame-shaped portion 21.

[0035] As a result, by placing a bathtub-shaped lid member having a cavity on the frame portion 21, an electronic component that requires airtightness, such as a quartz crystal element, can be housed in the cavity of the lid member. Such ceramic wiring member 1 can be used as a ceramic package for housing electronic components. For example, when electrodes attached to both sides of a quartz crystal element are connected to a pair of internal terminals 22, respectively, a quartz crystal resonator is formed.

[0036] The pair of external terminals 23 are arranged in contact with the second main surface 11B of the plate-shaped portion 11. That is, in a plan view of the second surface 100B side (as viewed from FIGS. 2 and 6 ), the pair of external terminals 23 are arranged spaced apart from each other on the second main surface 11B of the plate-shaped portion 11 included in the main body 10. The pair of ground terminals 24 are arranged in contact with the second main surface 11B of the plate-shaped portion 11, spaced apart from the pair of external terminals 23. That is, in a plan view of the second surface 100B side, the pair of ground terminals 24 are arranged spaced apart from the pair of external terminals 23 and spaced apart from each other on the second main surface 11B of the plate-shaped portion 11 included in the main body 10. In a plan view of the second surface 100B side, the pair of external terminals 23 are arranged on one diagonal of the rectangle, and the pair of ground terminals 24 are arranged on the other diagonal of the rectangle. The pair of external terminals 23 and the pair of ground terminals 24 are respectively arranged at the four corners of the rectangle. Such a terminal arrangement can facilitate the wiring design of an external substrate to which the ceramic wiring member 1 is to be attached.

[0037] The second via conductor 25 is arranged to extend from the first main surface 11A to the second main surface 11B of the plate-shaped portion 11. More specifically, the second via conductor 25 is formed to fill a through hole formed in the plate-shaped portion 11. The second via conductor 25 is physically and electrically connected to one of the pair of external terminals 23 at an end of the plate-shaped portion 11 on the second main surface 11B side. The first connection portion 26 is formed on the first main surface 11A of the plate-shaped portion 11. The first connection portion 26 connects one of the pair of internal terminals 22 to the second via conductor 25. The second via conductor 25 is physically and electrically connected to one of the pair of internal terminals 22 at an end of the plate-shaped portion 11 on the first main surface 11A side. That is, one of the pair of internal terminals 22 and one of the pair of external terminals 23 are electrically connected via the first connection portion 26 and the second via conductor 25.

[0038] The third via conductor 27 is arranged to extend from the first main surface 11A to the second main surface 11B of the plate-shaped portion 11. More specifically, the third via conductor 27 is formed to fill a through hole formed in the plate-shaped portion 11. The third via conductor 27 is physically and electrically connected to the other of the pair of external terminals 23 at the end of the plate-shaped portion 11 on the second main surface 11B side. The third via conductor 27 is physically and electrically connected to the other of the pair of internal terminals 22 at the end of the plate-shaped portion 11 on the first main surface 11A side. In other words, the other of the pair of internal terminals 22 and the other of the pair of external terminals 23 are electrically connected via the third via conductor 27.

[0039] The second connection portion 29 electrically connects the pair of ground terminals 24 inside the plate-shaped portion 11. The second connection portion 29 may be formed on the second main surface 11B of the plate-shaped portion 11. In this case, it is preferable that a portion of the second connection portion 29 in the longitudinal direction is covered with an insulator. This prevents poor connection caused by connecting the ground terminals 24 with each other by solder when soldering the ground terminals 24 to wiring on an external board. The second connection portion 29 may also be omitted. In this case, the ground terminal 24 not connected to the first via conductor 28 does not function as a ground. As a result, only one ground terminal 24 functions as a ground.

[0040] 1 and 2, break grooves 151 extending along each side of the rectangular shape of adjacent ceramic wiring members 110, 120 are formed on the first surface 100A and the second surface 100B. In this embodiment, break grooves 151 are formed on both the first surface 100A and the second surface 100B, but one of the break grooves may be omitted. The ceramic wiring mother substrate 100 can be divided along the break grooves 151. The depth of the break grooves 151 may be, for example, 0.025 mm or more and 0.200 mm or less. Furthermore, dummy portions made of the same material may be provided around the ceramic wiring mother substrate 100. Providing the dummy portions can prevent unintended damage to the ceramic wiring mother substrate 100.

[0041] Next, the arrangement of the plurality of ceramic wiring members 110, 120 will be described in detail, focusing on a unit structure including a first ceramic wiring member 110 located at the center of the leftmost column in Fig. 1 and a second ceramic wiring member 120 located at the center of the second column from the left. The first ceramic wiring member 110 includes a side 111 serving as a first side, which is one of the sides of a rectangle, a side 112 opposite to side 111, a side 113 perpendicular to sides 111 and 112, and a side 114 opposite to side 113. Sides 111 and 112 correspond to long sides extending along the Y-axis direction. Sides 113 and 114 correspond to short sides extending along the X-axis direction. The second ceramic wiring member 120 includes a side 121 as a second side that is one of the sides of the rectangle, a side 122 opposite to side 121, a side 123 perpendicular to sides 121 and 122, and a side 124 opposite to side 123. Sides 121 and 122 correspond to long sides extending along the Y-axis direction. Sides 123 and 124 correspond to short sides extending along the X-axis direction.

[0042] The first ceramic wiring member 110 and the second ceramic wiring member 120 are arranged such that the side 111 serving as the first side of the first ceramic wiring member 110 partially overlaps the side 121 serving as the second side of the second ceramic wiring member 120, while the ends 111A and 111B of the side 111 do not overlap the ends 121A and 121B of the side 121. More specifically, the sides 111 and 121 are arranged offset in the Y-axis direction so that they overlap by approximately half their respective lengths. When the ceramic wiring substrate 100 is divided along the break grooves 151, the sides 111 and 121 become the side 71 serving as the third side of the ceramic wiring member 1 (see FIGS. 3 and 6 ). Similarly, the sides 112 and 122 become the side 72 serving as the fourth side of the ceramic wiring member 1. The sides 113 and 123 become the side 73 of the ceramic wiring member 1. The sides 114 and 124 become the sides 74 of the ceramic wiring member 1 .

[0043] In the region where the side 111 serving as the first side and the side 121 serving as the second side overlap, a first via hole 131 is formed penetrating the ceramic wiring member mother substrate 100 in the thickness direction. When the ceramic wiring member mother substrate 100 is divided along the break grooves 151, the first via hole 131 becomes the first groove portion 31 of the ceramic wiring member 1 (see FIGS. 3, 4, and 6). The first groove portion 31 is formed on the outer periphery of the main body portion 10. The first groove portion 31 penetrates the main body portion 10 in the thickness direction, away from the vertices of the rectangle. The first groove portion 31 penetrates the frame-shaped portion 21, the frame body 12, the plate-shaped portion 11, and one of the pair of ground terminals 24.

[0044] 1 and 2 , the first via conductor 28 is formed on the wall surface surrounding the first via hole 131. In this embodiment, the first via conductor 28 fills the first via hole 131. The first via conductor 28 may cover the wall surface of the first via hole 131 without filling the first via hole 131. The first via conductor 28 physically and electrically connects one of the pair of ground terminals 24 of the first ceramic wiring member 110 and the second ceramic wiring member 120 to the frame-shaped portion 21 of the first ceramic wiring member 110 and the second ceramic wiring member 120. When the ceramic wiring member mother substrate 100 is divided along the break grooves 151, the first via conductor 28 of the ceramic wiring member mother substrate 100 becomes the first via conductor 28 formed on the wall surface defining the first groove portion 31 (see FIGS. 3 , 4 , and 6 ). The first via conductor 28 physically and electrically connects one of the pair of ground terminals 24 to the frame-shaped portion 21.

[0045] 1 and 2 , first through holes 161 penetrating from the first surface 100A to the second surface 100B are formed at each vertex of the rectangle of the plurality of ceramic wiring members 110, 120. The first through holes 161 are arranged on a line 191 extending in the X-axis direction to include the short sides 113, 114 of the first ceramic wiring member 110, and on a line 192 extending in the X-axis direction to include the short sides 123, 124 of the second ceramic wiring member 120. When the ceramic wiring mother substrate 100 is divided along the break grooves 151, the first through holes 161 become the first notch portion 41, the second notch portion 42, the third notch portion 43, the fourth notch portion 44, the fifth notch portion 45, and the sixth notch portion 46 (see FIGS. 3 and 6 ). The first notch 41 is formed at a distance from the apex on side 71, which serves as a third side along which the first groove 31 is formed. The second notch 42 is formed at a distance from the apex on side 72, which serves as a fourth side opposite side 71. The third notch 43 is formed at a position corresponding to the intersection of side 71 and side 74. The fourth notch 44 is formed at a position corresponding to the intersection of side 71 and side 73. The fifth notch 45 is formed at a position corresponding to the intersection of side 72 and side 73. The sixth notch 46 is formed at a position corresponding to the intersection of side 72 and side 74. The first notch 41, the second notch 42, the third notch 43, the fourth notch 44, the fifth notch 45, and the sixth notch 46 penetrate the ceramic wiring member 1 in the thickness direction of the main body 10. The first notch 41 and the second notch 42 are located on a straight line 91 that is perpendicular to the side 71 (the third side) and the side 72 (the fourth side). The width w of the first notch 41 and the second notch 42 can be, for example, greater than 0 μm and not more than 40 μm. The depth d of the first notch 41 and the second notch 42 can be, for example, greater than 0 μm and not more than 50 μm.

[0046] 1 and 2 , the first through holes 161 can be omitted. In this case, when the ceramic wiring member mother substrate 100 is divided along the break grooves 151, the first notch portions 41 and the second notch portions 42 are formed without penetrating the ceramic wiring member 1 in the thickness direction (see FIGS. 3 and 6 ). More specifically, the first notch portions 41 and the second notch portions 42 are formed to have depths corresponding to the depths of the break grooves 151. This is because, when the break grooves 151 are formed in the manufacturing process, the break grooves 151 are intentionally formed to slightly intersect with each other in the branched regions in order to avoid discontinuity in the branched regions. In order to more clearly form the first notch portions 41 and the second notch portions 42, it is sufficient for the break grooves 151 to intersect with each other by a distance corresponding to the desired size of the first notch portions 41 and the second notch portions 42. In the manufacturing process, when the break grooves 151 are formed in the green sheet by irradiating the laser, the irradiated portions volatilize. In the regions where the break grooves 151 intersect, the laser is irradiated twice, so volatilization progresses more. As a result, in the regions where the break grooves 151 intersect, the depth of the break grooves 151 becomes, for example, more than 1 time and not more than 1.2 times deeper than in other portions.

[0047] As shown in FIGS. 1 and 2 , the first ceramic wiring member 110 and the second ceramic wiring member 120, which are ceramic wiring members 1 having the same structure as described above, are arranged point-symmetrically with respect to the first via conductor 28 when viewed in the thickness direction of the ceramic wiring member mother substrate 100 (so that they overlap over the entire surface when rotated 180° about the first via conductor 28). The ceramic wiring members 110, 120 included in the ceramic wiring member mother substrate 100 are configured by interconnecting the first ceramic wiring member 110 and the second ceramic wiring member 120 as unit structures, and these unit structures are laid out without gaps. More specifically, in the unit structures adjacent to each other in the long side direction (Y-axis direction) of the rectangle, sides 113 and 114 overlap over their entire lengths, and sides 124 and 123 overlap over their entire lengths. In addition, in the unit structures adjacent to each other in the short side direction (X-axis direction) of the rectangle, sides 112 and 122 overlap over approximately half of their entire lengths. In this way, unit structures each made up of the first ceramic wiring member 110 and the second ceramic wiring member 120 having the same structure are arranged in a matrix, thereby making it possible to use the raw materials efficiently.

[0048] In the ceramic wiring member mother substrate 100 of this embodiment, a first via hole 131 is formed in a region where the side 111 of the first ceramic wiring member 110 and the side 121 of the second ceramic wiring member 120 overlap, and the ground terminal 24 is connected to the frame portion 21 by a first via conductor 28 formed on a wall surface surrounding the first via hole 131. In this way, by arranging the first via hole 131 and the first via conductor 28 at positions corresponding to the sides of the rectangle rather than at the vertices of the rectangle, when the first ceramic wiring member 110 and the second ceramic wiring member 120 are separated along the break grooves 151 along the sides 111 and 121, the contact area between the first via conductor 28 and the wall surface of the first via hole 131 is increased, and detachment of the first via conductor 28 is suppressed. Furthermore, by arranging the first ceramic wiring member 110 and the second ceramic wiring member 120 in point symmetry with respect to the first via conductor 28 while being offset from each other so that the sides 111 and 121 partially overlap, the first ceramic wiring member 110 and the second ceramic wiring member 120 after separation become ceramic wiring members 1 having the same structure. As a result, the efficiency of the manufacturing process is improved. Furthermore, even when an electronic component is mounted on the ceramic wiring member 1 and is sealed with a lid, making it impossible to see the electronic component, the orientation of the electronic component can be determined by the first via hole 131 (first groove portion 31 after separation) and the first via conductor 28.

[0049] In this way, the ceramic wiring member mother substrate 100 of this embodiment is a ceramic wiring member mother substrate that can achieve efficiency in the manufacturing process while maintaining the reliability of the electrical connection between the frame-shaped portion 21 and the ground terminal 24.

[0050] Furthermore, in the ceramic wiring member mother substrate 100 of this embodiment, first via holes 131 penetrating from the first surface 100A to the second surface 100B are formed at each vertex of the rectangles of the plurality of ceramic wiring members 110, 120. This makes it possible to connect the break grooves 151 extending in the X-axis direction and the break grooves 151 extending in the Y-axis direction at desired positions even if there is some error in the formation positions of the break grooves 151 extending along each side of the rectangle.

[0051] In addition, in a plan view of the first surface 100A side of the ceramic wiring member mother substrate 100 of this embodiment, the pair of internal terminals 22 of the first ceramic wiring member 110 and the pair of internal terminals 22 of the second ceramic wiring member 120 are arranged offset in opposite directions to each other in the direction (Y-axis direction) along the sides 111 and 121 within the region surrounded by the frame portion 21. This makes it possible to achieve an efficient manufacturing process even when the internal terminals 22 are arranged offset due to the structure of the electronic component to be held in the ceramic wiring member 1.

[0052] The ceramic wiring member 1 of this embodiment can be manufactured efficiently while maintaining the reliability of the electrical connection between the frame portion 21 and the ground terminal 24 by dividing the ceramic wiring member mother substrate 100 of this embodiment into ceramic wiring members 1 along the break grooves 151.

[0053] In the ceramic wiring member 1 of this embodiment, the first notch 41 and the second notch 42 penetrate the ceramic wiring member 1 in the thickness direction of the main body 10. This allows the break grooves 151 extending perpendicular to each other in the ceramic wiring member mother substrate 100 to be connected at desired positions, thereby making it possible to suppress variation in the shape of the ceramic wiring member 1.

[0054] Furthermore, in the ceramic wiring member 1 of this embodiment, the first notch 41 and the second notch 42 are arranged biased to one side in the direction (Y-axis direction) along the side 111 and the side 121. As a result, even when an electronic component is mounted on the ceramic wiring member 1 and is sealed with a lid so that the electronic component cannot be seen, the orientation of the electronic component can be determined by the first notch 41 and the second notch 42.

[0055] The ceramic wiring member mother substrate 100 of this embodiment can be manufactured, for example, by roughly following the procedure below. First, a green sheet to become the main body 10 is prepared. Specifically, ceramic powder that will make up the main body 10, such as alumina powder, is mixed with resin, a solvent, etc. in a ball mill to obtain a slurry. This slurry is processed into a green sheet by a doctor blade method. This results in a green sheet that will become the main body 10. A plurality of green sheets are prepared, with the assumption that they will be stacked to form the main body 10.

[0056] Next, a paste to become the conductive portion 20 is printed on the prepared green sheet. The paste is prepared by mixing and kneading a powder of a conductive material such as a metal with additives, resin, a solvent, etc. This paste is printed on multiple green sheets, for example, by screen printing. The multiple green sheets are then stacked to form a laminate having the desired structure of the ceramic wiring member mother substrate 100, and the first via holes 131 and first through holes 161 are then formed. The first via holes 131 are filled with the paste. Furthermore, break grooves 151 are formed, for example, by laser irradiation. The laminate is then fired to produce the ceramic wiring member mother substrate 100.

[0057] The ceramic wiring member 1 of this embodiment can be manufactured by dividing the ceramic wiring member mother substrate 100 along the break grooves 151 .

[0058] Next, a second embodiment of the present disclosure will be described. Fig. 9 is a schematic plan view of a first surface side of a ceramic wiring mother substrate in the second embodiment. Fig. 10 is a schematic plan view of a second surface side of a ceramic wiring mother substrate in the second embodiment.

[0059] 9 and 10 as well as 1 and 2, the ceramic wiring mother substrate 100 of the second embodiment has a configuration basically similar to that of the first embodiment, provides similar effects, and can be manufactured in the same manner. However, the ceramic wiring mother substrate 100 of the second embodiment differs from that of the first embodiment in the positional relationship between the first ceramic wiring member 110 and the second ceramic wiring member 120. The differences from the first embodiment will be described below.

[0060] 9 and 10 , the first ceramic wiring member 110 and the second ceramic wiring member 120 constituting the unit structure are disposed with a shift in the Y-axis direction so that a side 111 serving as a first side of the first ceramic wiring member 110 and a side 121 serving as a second side of the second ceramic wiring member 120 overlap by a portion corresponding to three-quarters of their respective lengths. Furthermore, in the unit structures adjacent to each other in the shorter side direction (X-axis direction) of the rectangle, the sides 122 and 112 overlap by three-quarters of their entire lengths. Even when this positional relationship between the first ceramic wiring member 110 and the second ceramic wiring member 120 is adopted, the same effect as in the first embodiment can be obtained. The ceramic wiring member 1 of the second embodiment has the same structure and exhibits the same effects as those of the first embodiment, except that the positions of the first cutout portion 41 and the second cutout portion 42 change in the Y-axis direction as a result of a change in the position of the first through hole 161 due to a difference in the positional relationship between the first ceramic wiring member 110 and the second ceramic wiring member 120.

[0061] It should be understood that the embodiments disclosed herein are illustrative in all respects and are not limiting in any respect. The scope of the present invention is defined not by the above description but by the claims, and it is intended to include all modifications within the meaning and scope of the claims.

[0062] 1 Ceramic wiring member, 10 Main body portion, 11 Plate-shaped portion, 11A First main surface, 11B Second main surface, 12 Frame body, 12A First end surface, 12B Second end surface, 20 Conductive portion, 21 Frame-shaped portion, 22 Internal terminal, 23 External terminal, 24 Ground terminal, 25 Second via conductor, 26 First connection portion, 27 Third via conductor, 28 First via conductor, 29 Second connection portion, 31 First groove portion, 41 First notch portion, 42 Second notch portion, 43 Third notch portion, 44 Fourth notch portion, 45 Fifth notch portion, 46 Sixth notch portion, 50 Cavity, 71 to 74 Side, 91 Straight line, 100 Ceramic wiring member mother board, 100A First surface, 100B Second surface, 110 First ceramic wiring member, 111 to 114 sides, 111A, 111B both ends, 120 second ceramic wiring member, 121 to 124 sides, 121A, 121B both ends, 131 first via hole, 151 break groove, 161 first through hole.

Claims

1. A ceramic wiring member motherboard having a first surface which is one surface in a thickness direction and a second surface which is a surface opposite to the first surface in the thickness direction, and having a plurality of ceramic wiring members each having a rectangular shape as viewed in the thickness direction, laid out and integrally connected thereon, The plurality of ceramic wiring members include A first ceramic wiring member; a second ceramic wiring member connected to the first ceramic wiring member, Each of the first ceramic wiring member and the second ceramic wiring member has A ceramic body having a plate-shaped portion; a conductive portion disposed in contact with the body portion, The conductive portion is In a plan view of the first surface side, a frame-shaped portion disposed annularly on the main body portion along an outer periphery of the rectangular shape; a pair of internal terminals disposed on a region of the main body portion surrounded by the frame portion; In a plan view of the second surface side, A pair of external terminals disposed on the body portion at a distance from each other; a ground terminal disposed on the main body and spaced apart from the pair of external terminals; one of the pair of internal terminals and one of the pair of external terminals are electrically connected to each other; the other of the pair of internal terminals is electrically connected to the other of the pair of external terminals, At least one of the first surface and the second surface is formed with break grooves extending along each side of the rectangular shape of each of the adjacent ceramic wiring members, the first ceramic wiring member and the second ceramic wiring member are arranged such that a first side which is one of the sides of the rectangle of the first ceramic wiring member and a second side which is one of the sides of the rectangle of the second ceramic wiring member partially overlap each other, and both ends of the first side and both ends of the second side do not overlap each other; a first via hole penetrating the ceramic wiring member mother substrate in a thickness direction is formed in a region where the first side and the second side overlap, the conductive portion further includes a first via conductor formed on a wall surface surrounding the first via hole and connecting the ground terminals of the first ceramic wiring member and the second ceramic wiring member to the frame-shaped portion of the first ceramic wiring member and the frame-shaped portion of the second ceramic wiring member, the first ceramic wiring member and the second ceramic wiring member are disposed point-symmetrically with respect to the first via conductor when viewed in a thickness direction of the ceramic wiring member mother substrate, the plurality of ceramic wiring members are configured by arranging the unit structures, each of which is the first ceramic wiring member and the second ceramic wiring member connected to each other, without any gaps between the unit structures, In a plan view of the first surface side, the first via hole is located outside an inner periphery of the frame-shaped portion.

2. 2 . The ceramic wiring member mother substrate according to claim 1 , wherein a first through hole penetrating from the first surface to the second surface is formed at each vertex of the rectangular shape of the plurality of ceramic wiring members.

3. In a plan view of the first surface side, 3. The ceramic wiring member mother board according to claim 1, wherein the pair of internal terminals of the first ceramic wiring member and the pair of internal terminals of the second ceramic wiring member are arranged in opposite directions to each other in a direction along the first side and the second side within a region surrounded by the frame-shaped portion.

4. A ceramic wiring member including a ceramic body having a plate-like portion and a conductive portion arranged in contact with the body, the ceramic wiring member having a rectangular shape when viewed in a direction perpendicular to the plate-like portion, The plate-like portion has a first main surface which is one main surface in a thickness direction, and a second main surface which is located on the opposite side of the first main surface in the thickness direction, The conductive portion is In a plan view of the first main surface side, a frame-shaped portion disposed annularly on the main body portion along an outer periphery of the rectangular shape; a pair of internal terminals disposed on a region of the main body portion surrounded by the frame portion; In a plan view of the second main surface side, A pair of external terminals disposed on the body portion at a distance from each other; a ground terminal disposed on the main body and spaced apart from the pair of external terminals; one of the pair of internal terminals and one of the pair of external terminals are electrically connected to each other; the other of the pair of internal terminals is electrically connected to the other of the pair of external terminals, The outer periphery of the main body is A first groove portion penetrating the main body in a thickness direction is formed away from a vertex of the rectangle, the conductive portion further includes a first via conductor formed on a wall surface of the first groove portion and connecting the ground terminal and the frame portion; In at least one of a plan view of the first main surface side and a plan view of the second main surface side, the ceramic wiring member has an outer periphery having a first notch portion formed away from a vertex on a third side, which is the side of the rectangle on which the first groove portion is formed; a second notch portion formed on a fourth side opposite to the third side and spaced apart from the apex; the first cutout portion and the second cutout portion are located on the same straight line perpendicular to the third side and the fourth side, The ceramic wiring member, in a plan view of the first surface side, the first groove portion is located outside an inner periphery of the frame-shaped portion.

5. The ceramic wiring member according to claim 4 , wherein the first cutout portion and the second cutout portion penetrate the ceramic wiring member in a thickness direction of the main body portion.

6. 6. The ceramic wiring member according to claim 4, wherein the first cutout portion and the second cutout portion are arranged biased to one side in a direction along the third side and the fourth side.