Radial oscillating heat pipe for enhanced heat spreading
A radial oscillating heat pipe design with a surrounding condenser and radially extending channels addresses the limitations of linear heat spreading, enhancing heat dissipation in microelectronics by concentrating the evaporator on heat sources and maximizing peripheral cooling.
Patent Information
- Application Number
- US18/805909
- Authority / Receiving Office
- US · United States
- Patent Type
- Applications(United States)
- Current Assignee / Owner
- Filing Date
- 2024-08-15
- Publication Date
- 2026-02-19
AI Technical Summary
Existing oscillating heat pipes are limited by linear heat spreading due to the condenser and evaporator sections being on opposite ends of a rectangular structure, which does not effectively manage heat concentrations in microelectronics.
The oscillating heat pipe is configured with a radial design where the condenser section surrounds the evaporator section, and the fluid channels extend radially between them, increasing in density and forming loops or nested arrangements to enhance heat transfer.
This radial configuration improves heat spreading by concentrating the evaporator on the heat source and maximizing peripheral heat dissipation, effectively cooling electronics components.
Smart Images
Figure US20260049770A1-D00000_ABST
Abstract
Description
BACKGROUND
[0001] Exemplary embodiments pertain to the art of thermal energy removal from, for example, electronics, and more particularly to oscillating heat pipe configurations for removal of such thermal energy.
[0002] Oscillating heat pipes typically include two main sections, a condenser section and an evaporator section that are interconnected by looping channels. The channels are filled with a two-phase mixture, which acts as the heat transfer medium for the system. Instabilities caused by the intermittent evaporation and condensation of working fluid transfers the vapor from the evaporator to condenser and return liquid from condenser back to the evaporator section.
[0003] Typically, the condenser section and the evaporator section are on opposite ends of a rectangular shaped structure, limiting the heat spreading to a linear direction. Microelectronics have heat concentrations that benefit from improved geometries where the evaporator is much smaller than condenser.BRIEF DESCRIPTION
[0004] In one exemplary embodiment, an oscillating heat pipe includes an evaporator section, a condenser section, and a plurality of fluid channels extending between the evaporator section and the condenser section, the plurality of fluid channels containing a volume of heat transfer fluid. The condenser section surrounds the evaporator section.
[0005] Additionally or alternatively, in this or other embodiments the plurality of fluid channels extend substantially radially between the condenser section and the evaporator section.
[0006] Additionally or alternatively, in this or other embodiments the plurality of fluid channels increases in channel density with increasing distance from the condenser section.
[0007] Additionally or alternatively, in this or other embodiments the plurality of fluid channels are arranged into a plurality of channel loops.
[0008] Additionally or alternatively, in this or other embodiments the plurality of channel loops are a plurality of loop segments arranged around a perimeter of the evaporator section.
[0009] Additionally or alternatively, in this or other embodiments the plurality of channel loops are nested in a radial direction.
[0010] Additionally or alternatively, in this or other embodiments at least two channel loops of the plurality of channel loops are interconnected in one of a serial or parallel relationship.
[0011] Additionally or alternatively, in this or other embodiments the plurality of channel loops are connected at a common fill port.
[0012] Additionally or alternatively, in this or other embodiments the plurality of fluid channels are positioned on one of a circular or rectangular or polygonal substrate.
[0013] Additionally or alternatively, in this or other embodiments one or more interconnects extend through the substrate between a first side of the substrate and a second side of the substrate opposite the first side.
[0014] In another exemplary embodiment, an electronics system includes an electronic component, and an oscillating heat pipe positioned at the electronic component configured to remove thermal energy from the electronic component. The oscillating heat pipe includes an evaporator section, a condenser section, and a plurality of fluid channels extending between the evaporator section and the condenser section. The plurality of fluid channels contain a volume of heat transfer fluid. The condenser section surrounds the evaporator section.
[0015] Additionally or alternatively, in this or other embodiments the evaporator section is positioned at a thermal energy source of the electronic component.
[0016] Additionally or alternatively, in this or other embodiments the plurality of fluid channels are formed in a substrate of the electronics component.
[0017] Additionally or alternatively, in this or other embodiments the plurality of fluid channels are positioned in a substrate operably connected to the electronic component.
[0018] Additionally or alternatively, in this or other embodiments one or more interconnects extend through the substrate between a first side of the substrate and a second side of the substrate opposite the first side for electronic connections through the oscillating heat pipe.
[0019] Additionally or alternatively, in this or other embodiments the plurality of fluid channels increases in channel density with increasing distance from the condenser section.
[0020] Additionally or alternatively, in this or other embodiments the plurality of fluid channels are arranged into a plurality of channel loops.
[0021] Additionally or alternatively, in this or other embodiments the plurality of channel loops are nested in a radial direction.
[0022] Additionally or alternatively, in this or other embodiments the plurality of channel loops are a plurality of loop segments arranged around a perimeter of the evaporator section.
[0023] Additionally or alternatively, in this or other embodiments at least two channel loops of the plurality of channel loops are interconnected in one of a serial or parallel relationship. BRIEF DESCRIPTION OF THE DRAWINGS
[0024] The following descriptions should not be considered limiting in any way. With reference to the accompanying drawings, like elements are numbered alike:
[0025] FIG. 1 is a cross-sectional view of an embodiment of an electronics assembly including an oscillating heat pipe heat exchanger;
[0026] FIG. 2 is a plan view of the electronics assembly of FIG. 1;
[0027] FIG. 3 is a plan view of an embodiment of an oscillating heat pipe heat exchanger;
[0028] FIG. 4 is a plan view of another embodiment of an oscillating heat pipe heat exchanger;
[0029] FIG. 5 is a plan view of an embodiment of an oscillating heat pipe heat exchanger having multiple parallel channel loops;
[0030] FIG. 6 is a plan view of an embodiment of an oscillating heat pump heat exchanger having connected channel loops;
[0031] FIG. 7 is a plan view of another embodiment of an oscillating heat pump heat exchanger having connected channel loops;
[0032] FIG. 8 is a plan view of an embodiment of an oscillating heat pump heat exchanger having radially nested channel loops;
[0033] FIG. 9 is a cross-sectional view of an embodiment of an oscillating heat pipe heat exchanger; and
[0034] FIG. 10 is a cross-sectional view of another embodiment of an oscillating heat pipe heat exchanger.DETAILED DESCRIPTION
[0035] A detailed description of one or more embodiments of the disclosed apparatus and method are presented herein by way of exemplification and not limitation with reference to the Figures.
[0036] Illustrated in FIG. 1 and FIG. 2 is an exemplary embodiment of an electronics assembly 10. The electronics assembly 10 includes an electronics device 12, for example, a silicon or semiconductor device that generates heat during operation. A heat exchanger is operably connected to the electronics device 12 to remover thermal energy generated by the electronics device 12 to thereby cool the electronics device 12. In some embodiments, the heat exchanger is operably connected to the electronics device 12 via a layer of thermal interface material 14 disposed between the electronics device 12 and the heat exchanger.
[0037] The heat exchanger is configured as a radial oscillating heat pipe (OHP) 16. The radial OHP 16 includes an evaporator section 18 at which thermal energy is absorbed from the electronics device12, and a condenser section 20 at which the thermal energy is rejected from the OHP 16 to, for example, one or more heat sinks 21. The OHP 16 is configured as a radial OHP 16, in which the condenser section 20 surrounds the evaporator section 18. A plurality of fluid channels 22 extend substantially radially outwardly from the evaporator section 18 to the condenser section 20. In some embodiments, the plurality of fluid channels 22 are arranged into one or more closed fluid loops 24 that are arranged between the evaporator section 18 and the condenser section 20.
[0038] In some embodiments, as illustrated in FIG. 3, the OHP 16 has a square or rectangular configuration, with the evaporator section 18 positioned at a center, and the condenser section 20 defining an outer circumference of the OHP 16. While FIG. 3 illustrates an embodiment where the evaporator section 18 in centered in the OHP 16, in other embodiments the evaporator section 18 may be offset from a center of the OHP 16. In another embodiment, such as illustrated in FIG. 4, the OHP 16 has a circular configuration. In this embodiment, the condenser section 20 defines an outer perimeter of the OHP 16, while the evaporator section 18 is located at a center of the circle. In some embodiments a density of the fluid channels 22 is constant from the evaporator section 18 to the condenser section 20, while in other embodiments, such as shown in FIGS. 3 and 4 the density of the fluid channels 22 increases in channel density with increasing distance from the condenser section 20, so that the density of the fluid channels 22 is greatest at the evaporator section 18. Additionally or alternatively, in other embodiments a cross-sectional size and / or shape of the fluid channels 22 may vary along their length to provide the selected thermal energy transfer properties and / or flow properties of the fluid through the fluid channels 22.
[0039] In some embodiments, such as illustrated in FIG. 5, the plurality of fluid channels 22 are arranged into a plurality of closed and fluidly isolated channel loops 24 that may be arranged circumferentially around the evaporator section 18, with each channel loop 24 defining a circumferential segment of the OHP 16. In some embodiments the channel loops 24 are substantially identical in channel size, channel arrangement and channel density, in other embodiments the channel loops 24 differ from one another based on a thermal profile of the electronic component 12 and / or other factors. While in some embodiments the channel loops 24 are fluidly isolated from each other, in other embodiments, such as illustrated in FIG. 6, the channel loops 24 may be fluidly interconnected via one or more loop branches 30 extending between adjacent channel loops 24. The interconnection may connect the channel loops 24 in a fluidly parallel arrangement as illustrated in FIG. 6, or alternatively in a fluidly serial arrangement. The interconnection of the channel loops 24 may be advantageous to manage and distribute the thermal load on the OHP 16, and may aid in filling of the OHP 16 with fluid, such as in the embodiment of FIG. 7, where the channel loops 24 are interconnected at a common fill port 32 which in some embodiments is located at a center of the OHP 16, at the evaporator section 18.
[0040] In other embodiments, such as in FIG. 8, the plurality of channel loops 24 are nested in a radial direction, and includes at least an inner loop 26 closest to the evaporator section 18, and an outer loop 28 disposed closest to the condenser section 20. While not fluidly connected, the inner loop 26 and the outer loop 28 are in thermal communication to transfer thermal energy toward the condenser section 20. In some embodiments, the plurality of channel loops 24 includes one or more intermediate loops positioned between the inner loop 26 and the outer loop 28 and thermally communicative with the inner loop 26 and the outer loop 28.
[0041] Referring to FIG. 9, the OHP 16 may be constructed in layers, where the fluid channels 22 are formed in a first layer 34 and a second layer 36 is bonded or otherwise secured to the first layer 34, thereby enclosing the plurality of fluid channels 22. In some embodiments, the fluid channels 22 are etched into the first layer 34, which may be a silicon or semiconductor wafer. The second layer 36 is bonded or sealed to the first layer 34 using oxide bonding or other wafer-wafer or metal-metal bonding approach (i.e., thermocompression bonds) forming a sealed cavity between the first layer 34 and the second layer 36. The OHP 16 may include one or more interconnects 38 extending therethrough, between adjacent fluid channels 22 of the plurality of fluid channels 22. The interconnects 38 allow for electrical connections to the electronic component 12 through the OHP 16. While in the embodiment illustrated in FIG. 9 the plurality of fluid channels 22 are formed in a component separate from the electronic component 12, in other embodiments such as in FIG. 10 the plurality of fluid channels 12 may be formed directly into a silicon or other semiconductor substrate of the electronics device 12.
[0042] Use of the OHP 16 with radially-arranged fluid channels 22 as described herein improves cooling of electronics components 12. Heat sources are typically concentrated in electronics, so the radial path allows the evaporator section 18 to be concentrated on the heat source, while the condenser section 20 takes maximum advantage of available spreading around the periphery of the heat source
[0043] The term “about” is intended to include the degree of error associated with measurement of the particular quantity based upon the equipment available at the time of filing the application.
[0044] The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the present disclosure. As used herein, the singular forms “a”, “an” and “the” are intended to include the plural forms as well, unless the context clearly indicates otherwise. It will be further understood that the terms “comprises” and / or “comprising,” when used in this specification, specify the presence of stated features, integers, steps, operations, elements, and / or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, element components, and / or groups thereof.
[0045] While the present disclosure has been described with reference to an exemplary embodiment or embodiments, it will be understood by those skilled in the art that various changes may be made and equivalents may be substituted for elements thereof without departing from the scope of the present disclosure. In addition, many modifications may be made to adapt a particular situation or material to the teachings of the present disclosure without departing from the essential scope thereof. Therefore, it is intended that the present disclosure not be limited to the particular embodiment disclosed as the best mode contemplated for carrying out this present disclosure, but that the present disclosure will include all embodiments falling within the scope of the claims.
Claims
1. An oscillating heat pipe, comprising: an evaporator section; a condenser section;a plurality of fluid channels extending between the evaporator section and the condenser section, the plurality of fluid channels containing a volume of heat transfer fluid;wherein the condenser section surrounds the evaporator section.
2. The oscillating heat pipe of claim 1, wherein the plurality of fluid channels extend substantially radially between the condenser section and the evaporator section.
3. The oscillating heat pipe of claim 1, wherein the plurality of fluid channels increases in channel density with increasing distance from the condenser section.
4. The oscillating heat pipe of claim 1, wherein the plurality of fluid channels are arranged into a plurality of channel loops.
5. The oscillating heat pipe of claim 4, wherein the plurality of channel loops are a plurality of loop segments arranged around a perimeter of the evaporator section.
6. The oscillating heat pipe of claim 4, wherein the plurality of channel loops are nested in a radial direction.
7. The oscillating heat pipe of claim 4, wherein at least two channel loops of the plurality of channel loops are interconnected in one of a serial or parallel relationship.
8. The oscillating heat pipe of claim 1, wherein the plurality of channel loops are connected at a common fill port.
9. The oscillating heat pipe of claim 1, wherein the plurality of fluid channels are disposed on one of a circular or rectangular or polygonal substrate.
10. The oscillating heat pipe of claim 1, further comprising one or more interconnects extending through the substrate between a first side of the substrate and a second side of the substrate opposite the first side.
11. An electronics system, comprising: an electronic component; and an oscillating heat pipe disposed at the electronic component configured to remove thermal energy from the electronic component, the oscillating heat pipe including: an evaporator section; a condenser section;a plurality of fluid channels extending between the evaporator section and the condenser section, the plurality of fluid channels containing a volume of heat transfer fluid;wherein the condenser section surrounds the evaporator section.
12. The electronics system of claim 11, wherein the evaporator section is disposed at a thermal energy source of the electronic component.
13. The electronics system of claim 11, wherein the plurality of fluid channels are formed in a substrate of the electronics component.
14. The electronics system of claim 11, wherein the plurality of fluid channels are disposed in a substrate operably connected to the electronic component.
15. The electronics system of claim 14, further comprising one or more interconnects extending through the substrate between a first side of the substrate and a second side of the substrate opposite the first side for electronic connections through the oscillating heat pipe.
16. The electronics system of claim 11, wherein the plurality of fluid channels increases in channel density with increasing distance from the condenser section.
17. The electronics system of claim 11, wherein the plurality of fluid channels are arranged into a plurality of channel loops.
18. The electronics system of claim 17, wherein the plurality of channel loops are nested in a radial direction.
19. The electronics system of claim 17, wherein the plurality of channel loops are a plurality of loop segments arranged around a perimeter of the evaporator section.
20. The electronics system of claim 17, wherein at least two channel loops of the plurality of channel loops are interconnected in one of a serial or parallel relationship.