Cooling mechanism, electrical assembly and vehicle

Abstract

A cooling mechanism (21), an electrical assembly and a vehicle. The cooling mechanism (21) comprises: a bottom shell (211), which is provided with a cooling compartment having an opening; a cover body (212), which is arranged on the opening; and a flow guide mechanism (213), which is arranged in the cooling compartment and is detachably connected to the cover body (212) and / or the bottom shell (211), wherein the flow guide mechanism (213) is configured to adjust a flow path and / or flow rate of a cooling liquid in the cooling compartment. The flow path and / or flow rate can be flexibly adjusted, thereby improving heat dissipation control and a heat dissipation effect.

Description

Cooling mechanisms, electrical components and vehicles

[0001] This application claims priority to Chinese patent application No. 2023107798524, filed on June 28, 2023, entitled “Cooling mechanism, electrical components and vehicle,” which is incorporated herein by reference in its entirety. Technical Field

[0002] The present application relates to the technical field of heat dissipation devices, and in particular to a cooling mechanism, an electrical component, and a vehicle. Background Art

[0003] With the advancement and widespread use of technology, various electronic devices have become an indispensable part of our daily lives. The electronic components within these devices generate heat during operation, and high temperatures can easily damage these components. Therefore, cooling mechanisms are crucial and essential components in electronic devices.

[0004] In the related art, the cooling mechanism uses coolant as the heat dissipation medium. The cooling mechanism is provided with a fluid flow channel, through which the coolant is directed to the vicinity of the electronic components to absorb the heat generated by the electronic components, and the coolant after absorbing the heat is discharged through the flow channel, thereby achieving heat dissipation of the electronic components.

[0005] Summary of the Invention

[0006] In view of the above problems, the present application provides a cooling mechanism, an electrical component and a vehicle to achieve flexible adjustment of the flow channel and / or flow rate, thereby improving heat dissipation control and enhancing the heat dissipation effect.

[0007] To address the aforementioned technical issues, this application proposes a cooling mechanism. The cooling mechanism comprises: a bottom shell having a cooling chamber with an opening; a cover disposed over the opening; and a flow guide mechanism disposed within the cooling chamber and detachably connected to the cover and / or bottom shell. The flow guide mechanism is configured to adjust the flow path and / or flow rate of the coolant within the cooling chamber.

[0008] The cooling chamber of the cooling mechanism is provided with a flow guide mechanism, which can be used to adjust the flow path and / or flow rate of the coolant in the cooling chamber. Therefore, the flow path and / or flow rate of the coolant in the cooling chamber can be adjusted according to the heat dissipation requirements of the heat-generating components, thereby improving the heat dissipation effect of the cooling mechanism on the heat-generating components. Furthermore, the flow guide mechanism is detachably connected to the cover and / or bottom shell, which can improve the convenience of adjusting the flow path and / or flow rate of the coolant in the cooling chamber. Therefore, the flow path and / or flow rate can be flexibly adjusted, thereby improving heat dissipation control and enhancing heat dissipation effect.

[0009] In some embodiments, at least one limiting hole is provided on a side of the cover body close to the cooling chamber and / or on an inner side wall of the bottom shell, and at least a portion of the flow guide mechanism is connected to the limiting hole.

[0010] The flow guide mechanism is installed through the limiting hole on the side of the cover body close to the cooling bin or the inner wall of the bottom shell. The structure is simple and easy to implement, and can reduce the volume of the cooling mechanism or increase the volume of the cold zone bin.

[0011] In some embodiments, the flow guiding mechanism includes: a flow limiting member, including a connecting portion and a flow limiting portion. The connecting portion is arranged in the limiting hole.

[0012] The flow-guiding mechanism is realized by the flow-limiting member, and turbulence is formed when the coolant flows through the flow-limiting member. The flow rate of the coolant in the cooling chamber can be reduced by the flow-limiting member, so that the coolant can absorb the heat of the heat-generating components more fully and effectively, thereby improving the heat dissipation effect; and the connection part of the flow-limiting member is connected by the limiting hole, which not only improves the sealing of the cover body and / or the bottom shell, but also reduces the height of the flow-limiting member and realizes a detachable connection between the flow-limiting member and the cover body and / or the bottom shell.

[0013] In some embodiments, the flow guide mechanism further includes: a flow guide plate, which is detachably connected to the flow limiting member.

[0014] The guide plate guides the coolant within the cooling chamber, defining the flow path of the coolant within the cooling chamber and enabling flexible adjustment of the flow path. Furthermore, the guide plate and the flow restrictor are detachably connected, enhancing the flexibility of their assembly, thereby increasing the flexibility of adjusting the flow path within the cooling chamber and, in turn, improving the heat dissipation effect.

[0015] In some embodiments, a side surface of the flow limiting portion is provided with a notch, and one end of the guide plate is disposed in the notch so that the guide plate is detachably connected to the flow limiting member.

[0016] The flow limiting member and the guide plate are detachably connected through the notch on the side of the flow limiting portion, and no additional connection structure is required. The structure is simple and easy to implement.

[0017] In some embodiments, the notch extends through a side of the restriction.

[0018] The slot passes through the side of the flow limiting part, so that the end of the guide plate can be embedded behind the slot, and the side close to the cover body can abut against the cover body, which can reduce the gap between the guide plate and the cover body, thereby improving the guide effect of the guide plate.

[0019] In some embodiments, a plurality of notches are provided on the side of the flow limiting portion, and different notches on the flow limiting portion can be connected to guide plates arranged at different positions of the flow limiting member.

[0020] Multiple slots are provided on the side of the flow limiting part, which can be connected to guide plates in different directions, so that the same flow limiting part can limit multiple flow channels; and after the flow limiting part is connected to the cover body, the flow channel can be adjusted by simply adjusting the connection between the guide plate and different slots on the flow limiting part, which can improve the efficiency and flexibility of the flow channel adjustment.

[0021] In some embodiments, the connecting portion and the limiting portion of the flow limiting member are arranged along a first direction, a limiting hole is provided on the side of the cover body close to the cooling chamber, and the connecting portion is provided in the limiting hole; wherein, the first direction is the same as the stacking direction of the cover body and the bottom shell; the size of the flow limiting portion along the second direction is larger than the size of the connecting portion along the second direction, and the end face of the flow limiting portion close to the cover body abuts against the end face of the limiting hole; wherein, the second direction is perpendicular to the first direction.

[0022] The end surface of the flow limiting portion close to the cover body abuts against the end surface of the limiting hole, which can reduce the gap between the end surface of the flow limiting portion and the cover body and improve the flow limiting effect of the flow limiting portion.

[0023] In some embodiments, the notch of the flow restriction portion extends along a first direction, and the notch penetrates a side surface of the flow restriction portion along the first direction.

[0024] The notch extends along the stacking direction of the cover and bottom shell. Because the end of the deflector plate extends along this stacking direction, the deflector plate and the flow restrictor can be detachably connected. The notch penetrates the side of the flow restrictor along the first direction, allowing the end of the deflector plate to be embedded behind the notch, and its side close to the cover body to abut the cover body, thereby reducing the gap between the deflector plate and the cover body, thereby improving the flow guiding effect of the deflector plate.

[0025] In some embodiments, the cover is provided with an inlet and an outlet communicating with the cooling chamber.

[0026] The inlet and outlet of the cooling chamber are arranged on the cover body, so that the inlet and outlet are away from the heat absorbing side of the bottom shell, that is, the side of the bottom shell away from the cover body, thereby reducing the erosion of the cooling liquid on the heat-generating components arranged on the heat absorbing side.

[0027] In some embodiments, a side of the air guide mechanism facing away from the cover body abuts against the bottom wall of the cooling chamber.

[0028] The side of the guide mechanism facing away from the cover body abuts against the side of the bottom plate of the bottom shell close to the cooling bin, that is, the bottom wall of the cooling bin, which can reduce the gap between the guide mechanism and the bottom shell, thereby improving the guide effect of the guide mechanism.

[0029] In some embodiments, the cooling mechanism further includes: a heat dissipation layer, which is arranged on a side of the cover body away from the cooling chamber, wherein a side of the bottom shell away from the cover body is configured to be provided with a heat-generating component.

[0030] The coolant in the cooling chamber absorbs heat from the heat-generating components arranged on the side of the bottom shell facing away from the cover body, and takes away the heat through the circulation of the coolant, thereby achieving the effect of cooling the heat-generating components; at the same time, the coolant and / or the shell of the cooling mechanism can also transfer heat to the heat dissipation layer arranged on the side of the cover body facing away from the cooling chamber, so as to dissipate the heat through the heat dissipation layer, thereby improving the heat dissipation effect of the cooling mechanism through the heat dissipation layer.

[0031] To address the aforementioned technical issues, this application proposes an electrical assembly. The electrical assembly comprises: a cooling mechanism as described above; a heat-generating component disposed on a side of the bottom housing facing away from the cooling chamber; and the cooling mechanism configured to cool the heat-generating component. This improves heat dissipation control and effectiveness of the heat-generating component, thereby enhancing the reliability of the electrical assembly.

[0032] In some embodiments, the heat generating component is a circuit board or a battery, thereby improving the heat dissipation control and heat dissipation effect of the circuit board or the battery, thereby improving the reliability of the electrical component.

[0033] To address the above technical issues, the present application proposes a vehicle. The vehicle includes the above-mentioned electrical components. This improves heat dissipation control and heat dissipation effectiveness of heat-generating components, thereby improving the reliability of the electrical components and, in turn, the reliability of the vehicle.

[0034] In some embodiments, the vehicle further includes a battery and a thermal management system configured to exchange heat with the battery, and the cooling mechanism is in fluid communication with the thermal management system. To this end, the cooling mechanism can transfer heat absorbed from heat-generating components to the battery via the thermal management system to improve battery performance.

[0035] Different from the prior art: The cooling mechanism of the present application is provided with a flow guide mechanism in the cooling chamber, which can be used to adjust the flow path and / or flow rate of the fluid in the cooling chamber. Therefore, the flow path and / or flow rate of the fluid in the cooling chamber can be adjusted according to the heat dissipation requirements of the heat-generating components, thereby improving the heat dissipation effect of the cooling mechanism on the heat-generating components. Furthermore, the flow guide mechanism is detachably connected to the side of the cover body close to the cooling chamber, which can improve the convenience of adjusting the flow path and / or flow rate of the fluid in the cooling chamber. Therefore, the present application can achieve flexible adjustment of the flow path and / or flow rate, thereby improving the heat dissipation effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0036] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following briefly introduces the drawings required for describing the embodiments. Obviously, the drawings described below are only some embodiments of the present application. Those skilled in the art can also derive other drawings based on these drawings without inventive work, among which:

[0037] FIG1 is a schematic structural diagram of an embodiment of a vehicle of the present application;

[0038] FIG2 is a schematic structural diagram of an embodiment of an electrical component of the present application;

[0039] FIG3 is a schematic structural diagram of an embodiment of a cooling mechanism of the present application;

[0040] FIG4 is a structural diagram of an embodiment of the cover and the flow guide mechanism of the present application;

[0041] FIG5 is a schematic structural diagram of an embodiment of a flow limiting member of the present application;

[0042] FIG6 is a structural diagram of another embodiment of the cover and the flow guide mechanism of the present application;

[0043] FIG7 is a schematic structural diagram of another embodiment of the cooling mechanism of the present application;

[0044] FIG8 is a structural diagram of another embodiment of the cover and the flow guide mechanism of the present application.

[0045] Figure numerals: power load 1, power distribution system 2, controller 3, thermal management system 4, cooling mechanism 21, circuit board 22, bottom shell 211, cover 212, flow guide mechanism 213, flow limiting member 513, connecting part 610, flow limiting part 620, limiting hole 630, notch 640, flow guide plate 710, heat dissipation layer 810, inlet A, outlet B, first direction x, second direction y, heating component 80. DETAILED DESCRIPTION

[0046] The following embodiments of the technical solution of the present application will be described in detail with reference to the accompanying drawings. The following embodiments are only used to more clearly illustrate the technical solution of the present application and are therefore only examples and are not intended to limit the scope of protection of the present application.

[0047] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those skilled in the art to which this application belongs; the terms used herein are only for the purpose of describing specific embodiments and are not intended to limit this application; the terms "including" and "having" and any variations thereof in the specification and claims of this application and the above-mentioned figure descriptions are intended to cover non-exclusive inclusions.

[0048] In the description of the embodiments of this application, the technical terms "first" and "second" are used only to distinguish different objects and should not be understood to indicate or imply relative importance or implicitly specify the quantity, specific order, or primary and secondary relationship of the indicated technical features. In the description of the embodiments of this application, the meaning of "plurality" is more than two, unless otherwise clearly and specifically defined.

[0049] References herein to "embodiments" mean that a particular feature, structure, or characteristic described in connection with the embodiments may be included in at least one embodiment of the present application. The appearance of this phrase in various places in the specification does not necessarily refer to the same embodiment, nor does it constitute an independent or alternative embodiment that is mutually exclusive of other embodiments. It is understood, both explicitly and implicitly, by those skilled in the art that the embodiments described herein may be combined with other embodiments.

[0050] In the description of the embodiments of this application, the term "and / or" is simply a description of the association relationship between associated objects, indicating that three relationships can exist. For example, A and / or B can represent the following three situations: A exists alone, A and B exist simultaneously, and B exists alone. In addition, the character " / " in this document generally indicates that the associated objects are in an "or" relationship.

[0051] In the description of the embodiments of the present application, the term "multiple" refers to more than two (including two). Similarly, "multiple groups" refers to more than two groups (including two groups), and "multiple pieces" refers to more than two pieces (including two pieces).

[0052] In the description of the embodiments of the present application, the technical terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the accompanying drawings, and are only for the convenience of describing the embodiments of the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the embodiments of the present application.

[0053] In the description of the embodiments of the present application, unless otherwise expressly specified or limited, technical terms such as "installed," "connected," "connected," and "fixed" should be understood in a broad sense. For example, they can refer to fixed connections, detachable connections, or integration; mechanical connections or electrical connections; direct connections or indirect connections through an intermediate medium; internal connections between two components or interactions between two components. Those skilled in the art can understand the specific meanings of the above terms in the embodiments of the present application based on specific circumstances.

[0054] With the advancement and widespread use of technology, various electronic devices have become an indispensable part of our daily lives. The electronic components within these devices generate heat during operation, and high temperatures can easily damage these components. Therefore, cooling mechanisms are crucial and essential components in electronic devices.

[0055] Taking a vehicle as an example, as shown in Figure 1, the vehicle includes: an electrical load 1, a power distribution system 2 and a controller 3. The power distribution system 2 is connected to the electrical load 1 and the controller 3 respectively. The power distribution system 2 distributes power to the electrical load 1 under the control of the controller 3.

[0056] Specifically, controller 3 refers to a circuit or integrated chip with logic processing capabilities that generates control signals based on power demand and usage status to control the operation of power distribution system 2 and other components. Controller 3 can be a standalone controller or integrated into the vehicle's vehicle controller. Power distribution system 2 refers to the power grid that distributes electrical energy to power loads 1, enabling power distribution. Power distribution system 2 is also used to monitor and control power distribution status and usage information.

[0057] The electrical loads 1 may include multiple ones, such as a vehicle control domain controller, an electronic stability system, an electronic power steering system, an air-conditioning compressor, a PTC heater, and instruments.

[0058] The vehicle further includes a thermal management system 4, which includes a cooling mechanism, a heating mechanism, and valves. These mechanisms are connected via pipelines, and the valves connect different pipelines within the thermal management system 4, each of which is filled with coolant. The valves are used to switch the connections between different pipelines within the thermal management system 4 or adjust the opening of the pipelines to enable coolant to flow through different pipelines, in different directions, or at different flow rates, thereby switching between different thermal management modes.

[0059] The electrical components of the power distribution system 2 are also connected to a refrigeration mechanism through valves and pipelines, and the refrigeration mechanism is used to provide cooling liquid for the electrical components of the power distribution system 2.

[0060] In the field of vehicle technology, the power distribution system 2 can be applied to electric vehicles / electric vehicles, pure electric vehicles, hybrid vehicles, extended-range electric vehicles, plug-in hybrid vehicles, electric buses, electric motorcycles, hydrogen energy vehicles and other new energy vehicles.

[0061] At present, the vehicle's power distribution system is implemented using a large number of electronic devices. As the power level of the electronic devices increases, the heat generated becomes higher and higher, and the heat accumulation becomes more and more serious, which has an increasingly serious impact on the electronic devices in the power distribution system 2, resulting in a reduction in the reliability of the power distribution system 2 and a reduction in the safety of the vehicle.

[0062] In order to solve the above problems, the present application proposes an electrical component. The power distribution system 2 includes an electrical component. As shown in Figure 2, the electrical component includes: a cooling mechanism 21 and a circuit board 22, wherein the circuit board 22 is provided with a circuit, especially a power distribution circuit. The cooling mechanism 21 and the circuit board 22 are stacked and arranged close to each other for cooling and dissipating heat from the circuit board 22.

[0063] Among them, the distribution circuit is used to realize power management of the vehicle's electrical load 1, such as supplying power to or cutting off power to the electrical load 1; the circuit board 22 can serve as a carrier of the distribution circuit, which can realize the integrated setting of various components in the distribution circuit, and can also provide a distribution signal loop between various components in the distribution circuit, avoiding the use of wires to realize the electrical signal loop, and can improve the integration.

[0064] Optionally, the circuit board 22 may be a printed circuit board (PCB) or a flexible printed circuit (FPC).

[0065] The stacking arrangement of the cooling mechanism 21 and the circuit board 22 means that the circuit board 22 is arranged with the cooling mechanism 21 along its thickness direction, so that each component in the distribution circuit arranged on the circuit board 22 (the surface extending in the width and length directions) can be arranged corresponding to the cooling mechanism 21, which can improve the uniformity and efficiency of heat dissipation.

[0066] The electrical components of this embodiment are provided with a cooling mechanism 21, which can dissipate heat generated by the power distribution circuit. The cooling mechanism 21 is stacked with a circuit board 22 on which the power distribution circuit is provided, so that the heating components or heating areas of the circuit board 22 can directly or indirectly contact the cooling mechanism 21, preferably directly contacting the cooling mechanism 21. This improves the cooling effect and efficiency of the cooling mechanism 21. Therefore, this embodiment can improve the heat dissipation performance of the power distribution system 2, alleviate problems such as abnormalities in the power distribution circuit caused by heat accumulation, and thus enhance the reliability of the power distribution system 2 and the safety of the vehicle.

[0067] In some embodiments, as shown in Figures 3 and 4, Figure 3 is a schematic structural diagram of an embodiment of the cooling mechanism of the present application, and Figure 4 is a schematic structural diagram of an embodiment of the cover and flow guide mechanism of the present application. The cooling mechanism 21 of this embodiment includes: a bottom shell 211, a cover 212, and a flow guide mechanism, wherein the bottom shell 211 is provided with a cooling chamber with an opening; the cover 212 is provided over the opening; the flow guide mechanism is provided in the cooling chamber and is detachably connected to the cover 212 and / or the bottom shell 211, and the flow guide mechanism is configured to adjust the flow path and / or flow rate of the coolant in the cooling chamber.

[0068] Specifically, the bottom case 211 includes a bottom plate positioned opposite the opening, and side plates connected to the edge of the bottom plate and extending from the bottom plate toward the opening. The bottom plate and side plates cooperate to form a storage space, which serves as a cooling chamber. The cooling chamber refers to a space capable of accommodating coolant. The cover 212 refers to a component or assembly used to seal the cooling chamber. The flow guide mechanism refers to a component or assembly capable of controlling the flow direction and / or flow rate of the fluid. Preferably, the bottom plate or side plates of the bottom case 211 abut against the heat-generating component to receive the heat generated by the heat-generating component.

[0069] Specifically, a detachable connection between components means that the connection between the components can be established and released repeatedly, multiple times, and without damage, without damaging the components and their performance.

[0070] Optionally, the coolant in this embodiment may be water or other fluids capable of absorbing heat, which is used to absorb the heat generated by the heat-generating components, thereby enabling the cooling mechanism 21 to dissipate heat from the heat-generating components.

[0071] The cooling chamber of the cooling mechanism 21 of this embodiment is provided with a flow guide mechanism, which can be used to adjust the flow path and / or flow rate of the coolant in the cooling chamber. Therefore, the flow path and / or flow rate of the coolant in the cooling chamber can be adjusted according to the heat dissipation requirements of the heat-generating components, thereby improving the heat dissipation effect of the cooling mechanism 21 on the heat-generating components. Furthermore, the flow guide mechanism is detachably connected to the cover 212 and / or the bottom shell 211, which can improve the convenience of adjusting the flow path and / or flow rate of the coolant in the cooling chamber. Therefore, this embodiment can achieve flexible adjustment of the flow path and / or flow rate, thereby improving heat dissipation control and enhancing the heat dissipation effect.

[0072] In some embodiments, at least one limiting hole 630 is provided on a side of the cover 212 close to the cooling chamber and / or on the inner wall of the bottom shell 211 , and at least a portion of the flow guide mechanism is connected to the limiting hole 630 .

[0073] The guide mechanism is installed through the limiting holes on the side of the cover 212 close to the cooling bin or the inner wall of the bottom shell 211. The structure is simple and easy to implement, and can reduce the volume of the cooling mechanism 21 or increase the volume of the cold zone bin.

[0074] In some embodiments, the flow guiding mechanism includes: a flow limiting member 513 , the flow limiting member 513 includes a connecting portion 610 and a flow limiting portion 620 , and the flow limiting member 513 is disposed on a side of the cover 212 close to the cooling chamber.

[0075] Specifically, the flow restrictor 513 refers to a component or assembly that blocks the tendency of fluid to flow in a certain direction.

[0076] In this embodiment, the flow-guiding mechanism is implemented through the flow-limiting member 513. When the coolant flows through the flow-limiting member 513, turbulence is generated. This reduces the flow rate of the coolant within the cooling chamber, allowing the coolant to more fully and effectively absorb heat from the heat-generating components, thereby improving heat dissipation. Furthermore, the connection portion of the flow-limiting member 513, connected through the limiting hole 630, not only improves the sealing performance of the cover 212 and / or bottom shell 211, but also reduces the height of the flow-limiting member 513 and achieves a detachable connection between the flow-limiting member 513 and the cover 212 and / or bottom shell 211.

[0077] In one application scenario, according to the heat dissipation requirements of heat-generating components, such as the circuit board 22, a flow limiting member 513 can be set on the cover 212 at a position corresponding to the high heat generation area of ​​the circuit board 22, so that the flow limiting member 513 can reduce the speed of the coolant in the cooling chamber when it flows through the area corresponding to the high heat generation area of ​​the circuit board 22 and create turbulence, so that the coolant has more time to more fully absorb the heat generated by the high heat generation area, thereby improving the heat dissipation effect of the high heat generation area.

[0078] In some embodiments, as shown in FIG6 , FIG6 is a structural diagram of another embodiment of the cover and the flow guide mechanism of the present application. The flow guide mechanism of this embodiment further includes a flow guide plate 710 , and the flow guide plate 710 is detachably connected to the flow limiting member 513 .

[0079] In this embodiment, the guide plate 710 is used to divert or direct the coolant within the cooling chamber. Specifically, the guide plate 710 defines the coolant flow path within the cooling chamber, enabling flexible adjustment of the flow path. Furthermore, the guide plate 710 is detachably connected to the flow restrictor 513, which increases the flexibility of their assembly, thereby increasing the flexibility of adjusting the flow path within the cooling chamber and, in turn, improving the heat dissipation effect.

[0080] In some embodiments, the guide plate 710 is disposed on a side of the cover 212 close to the cooling chamber and is connected to the cover 212 , and is preferably disposed perpendicular to the cover 212 .

[0081] Specifically, the deflector 710 is capable of diverting or confining the fluid flow, directing a portion of the fluid to a specific area. The deflector 710 is perpendicular to the cover 212, meaning that the width of the deflector 710 is perpendicular to the cover 212, extending into the cooling chamber. The deflector 710 is parallel to the cover 212 in its length, abutting against the cover 212 and reducing the gap between the two.

[0082] The guide plate 710 is connected to the cover 212 via the flow limiting member 513 , and no additional connection structure for connecting the guide plate 710 is provided on the cover 212 , thereby simplifying the cooling mechanism.

[0083] In some embodiments, the flow guide mechanism may include multiple flow guide plates 710 and / or multiple flow limiting members 513. The same flow limiting member 513 can connect two adjacent flow guide plates 710, and the two ends of the same flow guide plate 710 can also be connected to the cover body 212 through two flow limiting members 513 respectively.

[0084] In one application scenario, this embodiment can be configured to provide four flow restrictors 513 and four flow guide plates 710 on the cover 212 based on the heat dissipation requirements of the circuit board 22. The four flow restrictors 513 and the four flow guide plates 710 are sequentially cross-connected, which can improve the stability of the flow guide mechanism and reduce the number of flow restrictors 513 and flow guide plates 710. This flow guide mechanism can guide the coolant entering from the inlet A to the high heat dissipation area of ​​the circuit board 22, thereby improving the heat dissipation effect on the circuit board 22.

[0085] In some embodiments, as shown in FIG5 , a notch 640 is provided on the side of the flow limiting portion 620 , and one end of the guide plate 710 is disposed in the notch 640 so that the guide plate 710 is detachably connected to the flow limiting member 513 .

[0086] The flow limiting member 513 and the guide plate 710 are detachably connected through the notch 640 on the side of the flow limiting portion 520, without the need for an additional connection structure, and the structure is simple and easy to implement.

[0087] In some embodiments, the notch 640 extends through a side surface of the restrictor 620 .

[0088] The slot 640 passes through the side of the flow limiting portion 620, so that the end of the guide plate 710 can be embedded behind the slot 640, and the side close to the cover body 212 can abut against the cover body 212, thereby reducing the gap between the guide plate 710 and the cover body 212, thereby improving the guide effect of the guide plate 710.

[0089] In some embodiments, the side of the guide plate 710 facing away from the cover body 212 is also in contact with the bottom shell 211 , which can reduce the gap between the guide plate 710 and the bottom shell 211 , thereby improving the guide effect of the guide plate 710 .

[0090] In some embodiments, a plurality of notches 640 are provided on the side of the flow limiting portion 620 , and different notches 640 on the flow limiting portion 620 can be connected to the guide plates 710 arranged at different positions of the flow limiting member 513 .

[0091] A plurality of slots 640 are provided on the side of the flow limiting portion 620, which can be connected to the guide plates 710 in different directions, so that the same flow limiting member 513 can limit multiple flow channels; and after the flow limiting member 513 is connected to the cover body 212, the flow channel can be adjusted by simply adjusting the connection between the guide plate 710 and different slots 640 on the flow limiting member 513, which can improve the efficiency and flexibility of the flow channel adjustment.

[0092] In some embodiments, the cover body 212 is provided with a plurality of limiting holes 630 arranged in an array, and the side of the flow limiting portion 620 is provided with eight equally spaced slots 640, so that the flow limiting member 513 can be connected to the guide plate 710 with other flow limiting members 513 located in eight directions around it, thereby realizing an eight-direction guide structure.

[0093] In some embodiments, the connecting portion 610 and the limiting portion 620 of the flow limiting member 513 are arranged along the first direction x, and a limiting hole 630 is provided on the side of the cover body 212 close to the cooling chamber, especially multiple limiting holes 630, and the connecting portion 610 is arranged in the limiting hole 630; wherein, the first direction x is the same as the stacking direction of the cover body 212 and the bottom shell 211; the size of the flow limiting portion 610 along the second direction y is greater than the size of the connecting portion 610 along the second direction y, and after the connecting portion 610 is inserted into the limiting hole 630, the end face of the flow limiting portion 620 close to the cover body 212 abuts against the end face of the limiting hole 630; wherein, the second direction y is perpendicular to the first direction x.

[0094] Specifically, the stacking direction of the cover body 212 and the bottom shell 211 refers to the direction of the line connecting the two, which can also be called the thickness direction of the cover body 212.

[0095] The end surface of the flow limiting portion 620 close to the cover body 212 abuts against the end surface of the limiting hole 630 , which can reduce the gap between the end surface of the flow limiting portion 620 and the cover body 212 and improve the flow limiting effect of the flow limiting portion 620 .

[0096] In some embodiments, the notch 640 of the restrictor 610 extends along the first direction x, and the notch 640 penetrates the side surface of the restrictor 610 along the first direction x.

[0097] The notch 640 extends along the stacking direction of the cover 212 and the bottom shell 211, as well as the first direction x. Because the end of the deflector 710 extends along this stacking direction, the deflector 710 can be detachably connected to the flow restrictor 620. The notch 640 penetrates the side of the flow restrictor 610 along the first direction x, allowing the end of the deflector 710 to be embedded behind the notch 640. The side of the deflector 710 closest to the cover 212 can abut against the cover 212, reducing the gap between the deflector 710 and the cover 212, thereby improving the flow guiding effect of the deflector 710.

[0098] In some embodiments, the cover 212 is provided with an inlet A and an outlet B communicating with the cooling chamber.

[0099] In this embodiment, the inlet A and outlet B of the cooling chamber are set on the cover body 212, so that the inlet A and outlet B are away from the heat absorption side of the bottom shell 211, that is, the bottom shell 211 is away from the cover body 212, thereby reducing the erosion of the cooling liquid on the heat-generating components arranged on the heat absorption side.

[0100] In other embodiments, an inlet and an outlet may be provided on the side panels of the bottom housing.

[0101] In some embodiments, the side of the air guide mechanism facing away from the cover 212 abuts against the bottom wall of the cooling chamber.

[0102] The side of the guide mechanism facing away from the cover body 212 abuts against the side of the bottom plate of the bottom shell 211 close to the cooling bin, that is, the bottom wall of the cooling bin, which can reduce the gap between the guide mechanism and the bottom shell 211, thereby improving the guide effect of the guide mechanism.

[0103] In some embodiments, as shown in Figure 7, Figure 7 is a structural schematic diagram of another embodiment of the cooling mechanism of the present application. The cooling mechanism 21 of this embodiment also includes a heat dissipation layer 810, which is arranged on the side of the cover 212 away from the cooling chamber, wherein the side of the bottom shell 211 away from the cover 212 is configured to be in contact with the heat-generating component 80.

[0104] The cooling liquid in the cooling chamber absorbs heat from the heat-generating component 80 arranged on the side of the bottom shell 211 away from the cover body 212, and takes away the heat through the circulation of the cooling liquid, thereby achieving the effect of cooling the heat-generating component 80; at the same time, the cooling liquid and / or the shell of the cooling mechanism can also transfer heat to the heat dissipation layer 810 arranged on the side of the cover body 212 away from the cooling chamber, so as to dissipate the heat through the heat dissipation layer 810. Therefore, this embodiment can improve the heat dissipation effect of the cooling mechanism 21 through the heat dissipation layer 810.

[0105] Optionally, the heat dissipation layer 810 includes a heat dissipation film layer, heat dissipation fins or a heat sink.

[0106] In some embodiments, as shown in Figures 3 and 8, Figure 8 is a schematic structural diagram of another embodiment of the cover and flow guide structure of the present application. The cooling mechanism 21 of this embodiment includes: a bottom shell 211, a cover 212, and a flow guide mechanism 213. The bottom shell 211 is provided with a cooling chamber with an opening; the cover 212 is provided over the opening; the flow guide mechanism 213 is disposed within the cooling chamber and is detachably connected to the side of the cover 212 near the cooling chamber. The flow guide mechanism 213 is configured to adjust the flow path and / or flow rate of the coolant within the cooling chamber.

[0107] The cooling chamber of the cooling mechanism 21 of this embodiment is provided with a flow guide mechanism 213, which can be used to adjust the flow path and / or flow rate of the coolant in the cooling chamber. Therefore, the flow path and / or flow rate of the coolant in the cooling chamber can be adjusted according to the heat dissipation requirements of the heat-generating components, thereby improving the heat dissipation effect of the cooling mechanism 21 on the heat-generating components. Furthermore, the flow guide mechanism 213 is detachably connected to the side of the cover 212 near the cooling chamber, which can improve the convenience of adjusting the flow path and / or flow rate of the coolant in the cooling chamber. Therefore, this embodiment can achieve flexible adjustment of the flow path and / or flow rate, thereby improving heat dissipation control and enhancing the heat dissipation effect.

[0108] The bottom plate or side plate of the bottom shell 211 is in contact with the heat-generating component to receive the heat generated by the heat-generating component.

[0109] In other embodiments, the side of the cover 212 facing away from the bottom shell 211 may also be in contact with the heat-generating component.

[0110] Optionally, the flow guiding mechanism 213 of this embodiment includes: a flow limiting member 513 and a flow guide plate 710, the flow limiting member 513 is arranged on the side of the cover body 212 close to the cooling bin; the flow guide plate 710 is arranged on the side of the cover body 212 close to the cooling bin, and is arranged vertically to the cover body 212, and the two ends of the flow guide plate 710 are connected to the flow limiting member 513.

[0111] When the coolant flows through the flow restrictor 513, turbulence forms. This can reduce the flow rate of the coolant in the cooling chamber through the flow restrictor 513, allowing the coolant to more fully and effectively absorb heat from the heat-generating components, thereby improving the heat dissipation effect. Furthermore, the guide plate 710 can guide the coolant in the cooling chamber, that is, the guide plate 710 defines the flow path of the coolant in the cooling chamber, enabling flexible adjustment of the flow path. Furthermore, the guide plate 710 is connected to the cover 212 via the flow restrictor 513, eliminating the need for an additional connection structure on the cover 212 for connecting the guide plate 710. This simplifies the construction of the flow path and, in turn, the structure of the cooling mechanism.

[0112] The flow guide mechanism 213 may include multiple flow guide plates 710 and multiple flow restrictors 513. The same flow restrictor 513 may connect two adjacent flow guide plates 710. The two ends of the same flow guide plate 710 may also be connected to the cover 212 via two flow restrictors 513. The desired flow channel design can be constructed by arranging and configuring the positions of the multiple flow restrictors 513 and the connection relationship between the flow guide plates 710 and the flow restrictors 513.

[0113] Optionally, the guide plate 710 and the flow limiting member 513 are detachably connected, which can improve the flexibility of assembling the guide plate 710 and the flow limiting member 513, thereby improving the flexibility of adjusting the flow channel in the cooling chamber, and further improving the heat dissipation effect.

[0114] Optionally, this embodiment further includes other independently provided flow limiting members 513 , which can be independently provided corresponding to high heat dissipation areas of the circuit board to form turbulence in the high heat dissipation areas and improve the heat dissipation effect.

[0115] In other embodiments, the flow restricting member and the flow guide plate may be independently or combined, or the two may be combined.

[0116] Optionally, as shown in Figure 5, the flow limiting member 513 includes a connecting portion 610 and a flow limiting portion 620 arranged along a first direction x, and a limiting hole 630 is provided on the side of the cover body 212 close to the cooling chamber. The limiting hole 630 is a blind hole and does not penetrate the cover body 212, and the connecting portion 610 is arranged in the limiting hole 630; wherein, the first direction x is the same as the stacking direction of the cover body 212 and the bottom shell 211.

[0117] In this embodiment, the connection portion 610 of the flow limiting member 513 is connected by setting a limiting hole 630 on the side of the cover body 212 close to the cooling chamber, which not only improves the sealing of the cover body 212, but also reduces the height of the flow limiting member 513 and realizes a detachable connection between the flow limiting member 513 and the cover body 212.

[0118] Optionally, the dimension of the limiting portion 620 along the second direction y is greater than the dimension of the connecting portion 610 along the second direction y, and the end face of the limiting portion 620 close to the cover body 212 abuts against the end face of the limiting hole 630; wherein the second direction y is perpendicular to the first direction x.

[0119] The end surface of the flow limiting portion 620 close to the cover body 212 abuts against the end surface of the limiting hole 630 , which can reduce the gap between the end surface of the flow limiting portion 620 and the cover body 212 and improve the flow limiting effect of the flow limiting portion 620 .

[0120] Optionally, a notch 640 is provided on the side of the flow limiting portion 620 , the notch 640 extends along the first direction, and one end of the guide plate 710 is embedded in the notch 640 .

[0121] The notch 640 extends along the stacking direction of the cover 212 and the bottom shell 211 . Since the end of the guide plate 710 extends along the stacking direction, the guide plate 710 and the flow limiting portion 620 can be detachably connected.

[0122] Optionally, the slot 640 passes through the side of the limiting portion 620 along the first direction, so that the end of the guide plate 710 can be embedded behind the slot 640, and its side close to the cover body 212 can abut against the cover body 212, thereby reducing the gap between the guide plate 710 and the cover body 212, thereby improving the guide effect of the guide plate 710.

[0123] Furthermore, the side of the guide plate 710 and the flow limiting portion 620 facing away from the cover body 212 also abuts against the bottom shell 211, which can reduce the gap between the guide plate 710 and the flow limiting portion 620 and the bottom shell 211, thereby improving the guide effect of the guide plate 710.

[0124] A plurality of notches 640 are provided on the side of the flow limiting portion 620 . Different notches 640 on the flow limiting portion 620 can be connected to the guide plates 710 arranged at different positions of the flow limiting member 513 .

[0125] A plurality of slots 640 extending along the first direction are provided on the side of the flow limiting portion 620, which can be connected to the guide plates 710 in different directions, so that the same flow limiting member 513 can limit multiple flow channels; and after the flow limiting member 513 is connected to the cover body 212, the flow channel can be adjusted by simply adjusting the connection between the guide plate 710 and different slots 640 on the flow limiting member 513, which can improve the efficiency and flexibility of the flow channel adjustment.

[0126] Specifically, the cover body 212 of this embodiment is provided with a plurality of limiting holes 630 arranged in an array, such as a nine-square grid, and the side of the flow limiting portion 620 is provided with eight equally spaced slots 640, so that the flow limiting member 513 can be connected to the guide plate 710 with other flow limiting members 513 located in eight directions around it, thereby realizing an eight-direction guide structure.

[0127] Optionally, the cover 212 is provided with an inlet A and an outlet B connected to the cooling chamber, so that the inlet A and the outlet B are away from the heat absorbing side of the bottom shell 211, that is, the bottom shell 211 is away from the side of the cover 212, thereby reducing the erosion of the cooling liquid on the heat-generating components arranged on the heat absorbing side.

[0128] In other embodiments, an inlet and an outlet may be provided on the side panels of the bottom housing.

[0129] Optionally, the cooling mechanism 21 of this embodiment may further include a heat dissipation layer, which is arranged on the side of the cover 212 away from the cooling chamber, wherein the side of the bottom shell 211 away from the cover 212 is configured to be provided with a heat generating component.

[0130] The cooling liquid in the cooling chamber absorbs heat from the heat-generating components arranged on the side of the bottom shell 211 away from the cover body 212, and takes away the heat through the circulation of the cooling liquid, thereby achieving the effect of cooling the heat-generating components; at the same time, the cooling liquid and / or the shell of the cooling mechanism can also transfer heat to the heat dissipation layer arranged on the side of the cover body 212 away from the cooling chamber, so as to dissipate the heat through the heat dissipation layer. Therefore, this embodiment can improve the heat dissipation effect of the cooling mechanism 21 through the heat dissipation layer.

[0131] The shape of the flow limiting element of the present application is not limited to a columnar shape.

[0132] In one application scenario, the cooling mechanism 21 of the present application can be used as a heat dissipation verification device for heat-generating components such as circuit boards. The flow channel and / or flow rate of the coolant of the cooling mechanism 21 can be quickly adjusted based on the heat dissipation requirements of the circuit board, thereby improving the efficiency of the heat dissipation verification of the circuit board. A cooling mechanism with high heat dissipation effect can be designed and produced for the circuit board based on the verification results and the corresponding flow channel and / or flow rate.

[0133] In another application scenario, the cooling mechanism of the present application can be used as an actual liquid cooling device for heat-generating components such as circuit boards, and can be directly installed and used with the circuit boards.

[0134] The present application can quickly adjust the flow channel structure and / or flow rate of the coolant through the guide mechanism, and can solve the problems of the existing circuit board cooling mechanism having a single water channel structure, being difficult to adjust, and not being able to dissipate heat efficiently, as well as the problems of a long water channel structure adjustment cycle and high cost. The cooling mechanism can be constructed simply, efficiently, and quickly to adapt to a variety of different heating components, such as circuit boards; and the present application can also shorten the heat dissipation verification cycle of the circuit board.

[0135] The present application further proposes an electrical component, as shown in FIG2 , which includes a cooling mechanism 21 and a circuit board 22 , wherein the circuit board 22 is provided with a circuit, especially a power distribution circuit, and the cooling mechanism 21 and the circuit board 22 are stacked to dissipate heat from the circuit board 22 .

[0136] The power distribution system 2 of this embodiment includes electrical components, which are equipped with a cooling mechanism 21. This cooling mechanism 21 dissipates heat generated by the power distribution circuit. The stacking of the cooling mechanism 21 with the circuit board 22 on which the power distribution circuit is mounted improves the heat dissipation efficiency of the cooling mechanism 21. Therefore, this embodiment improves the heat dissipation performance of the power distribution system 2 and mitigates issues such as abnormalities in the power distribution circuit caused by heat accumulation, thereby enhancing the reliability of the power distribution system 2 and the safety of the vehicle.

[0137] Although in the above embodiment, the limiting hole is provided on the inner side of the cover body, and the flow limiting member is connected to the limiting hole on the inner side of the cover body so that the flow guide mechanism is connected to the inner side of the cover body, the present application is not limited thereto. The limiting hole may also be provided on the inner side of the bottom shell, for example, on the inner side surface or side surface of the bottom shell opposite to the cover body. The limiting hole is not limited to being provided on only one surface, and may also be provided on at least two surfaces.

[0138] For further introduction to the power distribution system, please refer to the above embodiments.

[0139] In other embodiments, the heat generating component may also be a battery to improve the heat dissipation control of the battery and enhance the heat dissipation effect, thereby improving the reliability of the electrical component.

[0140] Alternatively, the heat-generating components may also include other components that generate heat, such as electric motors, gearboxes, chargers, controllers, battery management systems, air-conditioning systems, heating systems, and cooling systems.

[0141] The cooling mechanism of the present application can be used not only in power distribution systems, but also in other circuit systems.

[0142] The present application further provides a vehicle, as shown in Figure 1, the vehicle includes: an electrical load 1, a power distribution system 2 and a controller 3, the power distribution system 2 is connected to the electrical load 1 and the controller 3 respectively, and the power distribution system 2 distributes power to the electrical load 1 under the control of the controller 3.

[0143] Furthermore, the vehicle also includes a thermal management system 4, which includes a cooling mechanism, a heating mechanism, and valves.

[0144] The electrical components are also connected to a refrigeration mechanism through valves and pipelines, and the refrigeration mechanism is used to provide cooling liquid for the electrical components.

[0145] In some embodiments, the vehicle further includes a battery, and the thermal management system 4 is configured to exchange heat with the battery. The cooling mechanism is in fluid communication with the thermal management system. To this end, the cooling mechanism can transfer heat absorbed from the heat-generating components to the battery via the thermal management system 4, thereby heating the battery and at least improving the battery's performance in low-temperature environments.

[0146] For other introductions of the vehicle, please refer to the above embodiments.

[0147] The power distribution system of the present application can be used not only in vehicles but also in other electronic devices.

[0148] The above description is only an implementation method of the present application and does not limit the patent scope of the present application. Any equivalent structure or equivalent process transformation made using the contents of the description and drawings of this application, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present application.

Claims

1. A cooling mechanism, characterized in that: include: A bottom shell is provided with a cooling chamber having an opening; A cover body, which is arranged on the opening; The flow guiding mechanism is arranged in the cooling bin and is detachably connected to the cover body and / or the bottom shell. The flow guiding mechanism is configured to adjust the flow path and / or flow rate of the coolant in the cooling bin.

2. The cooling mechanism according to claim 1, characterized in that: At least one limiting hole is provided on the side wall of the cover body close to the cooling bin and / or on the inner side wall of the bottom shell, and at least a part of the flow guiding mechanism is connected to the limiting hole.

3. The cooling mechanism according to claim 2, characterized in that: The flow guiding mechanism comprises: The flow limiting component comprises a connecting portion and a flow limiting portion, wherein the connecting portion is arranged in the limiting hole.

4. The cooling mechanism according to claim 3, characterized in that: The flow guiding mechanism further comprises: A guide plate is connected to the flow limiting member in a detachable manner.

5. The cooling mechanism according to claim 4, characterized in that: A notch is provided on the side of the flow limiting portion, and one end of the guide plate is arranged in the notch so that the guide plate is connected to the flow limiting member in a detachable manner.

6. The cooling mechanism according to claim 5, characterized in that: The notch penetrates through a side surface of the restrictor.

7. The cooling mechanism according to claim 5 or 6, characterized in that: A plurality of the notches are provided on the side of the flow limiting portion, and different notches on the flow limiting portion can be connected to the guide plates arranged at different positions of the flow limiting member.

8. The cooling mechanism according to any one of claims 3 to 7, characterized in that: The connection part and the flow limiting part of the flow limiting member are arranged along the first direction, the cover body is provided with a limiting hole on a side close to the cooling bin, and the connection part is provided in the limiting hole; wherein the first direction is the same as the stacking direction of the cover body and the bottom shell; the size of the flow limiting part along the second direction is larger than the size of the connection part along the second direction, and the end face of the flow limiting part close to the cover body abuts against the end face of the limiting hole; The second direction is perpendicular to the first direction.

9. The cooling mechanism according to claim 8, characterized in that: The notch of the flow restricting portion extends along the first direction, and the notch penetrates through a side surface of the flow restricting portion along the first direction.

10. The cooling mechanism according to any one of claims 1 to 9, characterized in that: The cover body is provided with an inlet and an outlet communicated with the cooling chamber.

11. The cooling mechanism according to any one of claims 1 to 9, characterized in that: The side of the air guide mechanism facing away from the cover body abuts against the bottom wall of the cooling bin.

12. The cooling mechanism according to any one of claims 1 to 9, characterized in that: The cooling mechanism also includes: The heat dissipation layer is arranged on a side of the cover body away from the cooling chamber, wherein a side of the bottom shell away from the cover body is configured as a heat generating component.

13. An electrical component, characterized in that: include: A cooling mechanism according to any one of claims 1 to 12; A heat generating component is arranged on a side of the bottom shell away from the cooling chamber; The cooling mechanism is configured to cool the heat generating component.

14. The electrical component according to claim 13, characterized in that The heat generating component is a circuit board or a battery.

15. A vehicle, characterized in that: Comprising an electrical assembly as claimed in claim 13 or 14.

16. The vehicle according to claim 15, characterized in that The vehicle further includes a battery and a thermal management system, wherein the thermal management system is configured to perform heat exchange with the battery, and the cooling mechanism is in fluid communication with the thermal management system.

Images