Electronic device comprising antenna

Abstract

In embodiments, an antenna module is provided. The antenna module may comprise: an insulating plate including at least one conductive pattern; and a plurality of radiation structures disposed on one surface of the insulating plate. Each of the plurality of radiation structures may comprise a substrate part and a support part disposed between the substrate part and the insulating plate. The substrate part may comprise a non-conductive substrate and a metal pattern arranged on the non-conductive substrate to radiate signals. The support part may comprise a plurality of side-surface regions and a feed region. The at least one conductive pattern may be electrically connected to a first feed portion for first polarization and a second feed portion for second polarization.

Description

Electronic device including an antenna

[0001] The present disclosure relates to an electronic device including an antenna.

[0002] Beamforming is one of the technologies used to mitigate propagation loss and increase the transmission range of radio waves. Beamforming typically utilizes multiple antennas to focus the coverage area of ​​radio waves or enhance the directivity of reception sensitivity in a specific direction. To utilize beamforming technology, a communication node may be equipped with multiple antennas.

[0003] The above information may be provided as background art to aid in understanding the present disclosure. No claim or determination is made as to whether any of the above is applicable as prior art related to the present disclosure.

[0004] In some embodiments, an antenna module is provided. The antenna module may include an insulating plate including at least one conductive pattern, and a plurality of radiating structures disposed on one surface of the insulating plate. Each radiating structure of the plurality of radiating structures may include a substrate portion and a support portion disposed between the substrate portion and the insulating plate. The substrate portion may include a non-conductive substrate and a metal pattern formed on the non-conductive substrate and configured to radiate signals. The support portion may include a plurality of side regions and a feed region. The at least one conductive pattern may be electrically connected to a first feed region for a first polarization and a second feed region for a second polarization. The first feed region may be disposed along at least one first side region and the feed region among the plurality of side regions of the support portion. The second feed region may be disposed along at least one second side region and the feed region among the plurality of side regions of the support portion.

[0005] In some embodiments, a communication device is provided. The communication device may include an antenna module including a processor, at least one wireless communication circuit, and a plurality of sub-arrays. The antenna module may include, for each sub-array, an insulating plate including at least one conductive pattern, and a plurality of radiating structures disposed on one surface of the insulating plate. Each radiating structure of the plurality of radiating structures may include a substrate portion and a support portion disposed between the substrate portion and the insulating plate. The substrate portion may include a non-conductive substrate and a metal pattern formed on the non-conductive substrate and configured to radiate signals. The support portion may include a plurality of side regions and a feed region. The at least one conductive pattern may be electrically connected to a first feed region for a first polarization and a second feed region for a second polarization. The first feed region may be disposed along at least one first side region and the feed region among the plurality of side regions of the support portion. The second feeding portion may be arranged along at least one of the second side regions among the plurality of side regions of the support portion and the feeding region.

[0006] Figure 1 shows a wireless communication system.

[0007] Figures 2a to 2c show examples of radiating structures for dipole antennas.

[0008] Figures 3a to 3c show other examples of radiating structures for dipole antennas.

[0009] Fig. 4 shows an example of a radiation pattern of an antenna module using a dipole antenna.

[0010] Fig. 5a shows a cross-section of a radiating structure for a dipole antenna.

[0011] Figure 5b shows an example of feed lines of a radiating structure for a dipole antenna.

[0012] Figure 6a shows examples of vias for a radiating structure for a dipole antenna.

[0013] Figure 6b shows an example of a method for creating a radiating structure for a dipole antenna.

[0014] Figure 7 shows an example of a metal pattern for a dipole antenna.

[0015] Figures 8a to 8c illustrate examples of antenna elements including a column structure for beamforming control.

[0016] Figure 9 shows an example of the performance of an antenna element including a column structure for beamforming control.

[0017] Fig. 10 shows an example of a conductive portion of a column structure for beamforming control.

[0018] Figure 11 is a drawing for explaining the principle of beamforming control using a pillar structure.

[0019] Figures 12a to 12c show examples of the performance of sub-arrays for dipole antennas.

[0020] Figures 13a to 13d illustrate examples of antenna modules including a radiating structure for a dipole antenna.

[0021] Figure 14 illustrates an example of functional components of an electronic device including a radiating structure for a dipole antenna.

[0022] Throughout the drawings, it will be understood that the same reference numbers refer to the same parts, components and structures.

[0023] The terms used in this disclosure are used only to describe specific embodiments and may not be intended to limit the scope of other embodiments. The singular expression may include plural expressions unless the context clearly indicates otherwise. Terms used herein, including technical or scientific terms, may have the same meaning as commonly understood by those of ordinary skill in the art described in this disclosure. Terms defined in general dictionaries among the terms used in this disclosure may be interpreted as having the same or similar meaning in the context of the relevant technology, and shall not be interpreted in an idealized or overly formal sense unless explicitly defined in this disclosure. In some cases, even if a term is defined in this disclosure, it cannot be interpreted to exclude embodiments of the present disclosure.

[0024] The various embodiments of the present disclosure described below illustrate a hardware-based approach as an example. However, since the various embodiments of the present disclosure include techniques utilizing both hardware and software, the various embodiments of the present disclosure do not exclude a software-based approach.

[0025] In the following description, terms referring to components of electronic devices (e.g., insulating plate, substrate, PCB (printed circuit board), FPCB (flexible PCB), module, antenna, antenna element, antenna element, circuit, amplifier circuit, processor, chip, component, device), terms referring to the shape of components (e.g., opening, structure, structure, support, contact, protrusion), terms referring to connections between structures (e.g., connection, contact, support, contact structure, conductive member, assembly), terms referring to circuits (e.g., PCB, FPCB, signal line, feeding line, data line, RF signal line, antenna line, amplifier circuit, RF path, RF module, RF circuit, splitter, divider, coupler, combiner), etc. are examples for convenience of description. Therefore, the present disclosure is not limited to the terms described below, and other terms having equivalent technical meanings may be used. In addition, the terms '...bu', '...gi', '...mul', '...che', etc. used below may mean at least one shape structure or a unit that processes a function.

[0026] In addition, in the present disclosure, expressions such as "more than" or "less than" may be used to determine whether a specific condition is satisfied or fulfilled, but this is merely a description for expressing an example and does not exclude descriptions such as "more than" or "less than." A condition described as "more than" may be replaced with "more than," a condition described as "less than" may be replaced with "less than," and a condition described as "more than and less than" may be replaced with "more than and less than." In addition, hereinafter, "A" to "B" mean at least one of elements from A (including A) to B (including B). hereinafter, "C" and / or "D" mean at least one of "C" or "D," that is, including {"C", "D", "C" and "D"}.

[0027] Figure 1 illustrates a wireless communication system. The wireless communication environment of Figure 1 exemplifies a base station (110) and a terminal (120) (e.g., a first terminal (120-1), a second terminal (120-2), and a third terminal (120-3)) as part of nodes utilizing a wireless channel.

[0028] Referring to FIG. 1, a base station (110) is a network infrastructure that provides wireless access to a terminal (120). The base station (110) has coverage based on the distance at which a signal can be transmitted. In addition to a base station, the base station (110) may be referred to as an 'access point (AP)', 'eNodeB (eNB)', '5th generation node', '5G NodeB (NB)', 'wireless point', 'transmission / reception point (TRP)', 'access unit', 'distributed unit (DU)', 'transmission / reception point (TRP)', 'radio unit (RU), remote radio head (RRH)' or other terms having equivalent technical meanings. The base station (110) can transmit a downlink signal or receive an uplink signal.

[0029] The terminal (120) is a device used by a user and performs communication with the base station (110) via a wireless channel. In some cases, the terminal (120) may be operated without the involvement of the user. That is, the terminal (120) is a device that performs machine type communication (MTC) and may not be carried by the user. The terminal (120) may be referred to as a 'user equipment (UE)', a 'mobile station', a 'subscriber station', a 'customer premises equipment (CPE)', a 'remote terminal', a 'wireless terminal', an 'electronic device', a 'vehicle terminal', a 'user device', or other terms having an equivalent technical meaning thereto.

[0030] Beamforming technology is being used as one of the technologies to mitigate propagation path loss and increase the transmission distance of radio waves. Beamforming generally focuses the reception area of ​​radio waves by using multiple antennas or increases the directivity of reception sensitivity for a specific direction. Therefore, in order to form a beamforming coverage instead of forming a signal in an isotropic pattern using a single antenna, the base station (110) may be equipped with multiple antennas. According to one embodiment, the base station (110) may include an MMU (Massive MIMO (multiple input multiple output) Unit). A form in which multiple antennas are gathered may be referred to as an antenna array (130), and each antenna included in the array may be referred to as an array element or antenna element. The antenna array (130) may be configured in various forms, such as a linear array or a planar array. The antenna array (130) may be referred to as a massive antenna array.

[0031] A key technology for improving the data capacity of 5G communications is beamforming, which utilizes antenna arrays connected to multiple RF paths. To achieve higher data capacity, either the number of RF paths or the power per RF path must increase. Increasing RF paths increases product size, and space constraints for actual base station equipment installation currently limit further expansion. To increase antenna gain through higher output power without increasing the number of RF paths, dividers (or splitters) can be used to connect multiple antenna elements in the RF paths. Here, the antenna elements corresponding to each RF path can be referred to as sub-arrays.

[0032] To improve communication performance, the number of antennas (or antenna elements) of equipment (e.g., base stations (110)) performing wireless communication is increasing. Furthermore, the number of RF components (e.g., amplifiers, filters) and components for processing RF signals received or transmitted through antenna elements is also increasing, and thus, when configuring communication equipment, it is essential to ensure spatial gains and cost efficiency while satisfying communication performance.

[0033] In FIG. 1, the base station (110) of FIG. 1 is described as an example to explain an electronic device including an antenna, but the embodiments of the present disclosure are not limited thereto. As an electronic device according to the embodiments of the present disclosure, in addition to the base station (110), a wireless device performing a function equivalent to a base station, a wireless device (e.g., TRP) connected to the base station, a terminal (120) of FIG. 1, or any other communication device used for 5G communication may be of course possible. Hereinafter, in the present disclosure, an antenna array composed of sub-arrays is described as an example as a structure of a plurality of antennas for communication in a MIMO (Multiple Input Multiple Output) environment, but it is of course possible to easily change it for beamforming in some embodiments.

[0034] Figures 2a to 2c illustrate examples of radiating structures for dipole antennas. An electronic device according to embodiments may include an antenna array. The antenna array may include a plurality of antenna elements. The radiating structure described in Figures 2a to 2c may correspond to an antenna element (200) among the plurality of antenna elements. The antenna element (200) may be used as a dipole antenna.

[0035] Referring to FIG. 2A, a perspective view of an antenna element (200) is illustrated. The antenna element (200) may include a radiating structure. The radiating structure may be disposed on one surface of an insulating plate (205). The radiating structure may include a structure used as a radiator. The radiating structure may include a dielectric and a conductive portion added to the dielectric. The radiating structure may include a substrate portion (201). The substrate portion may include a non-conductive substrate (210) and a metal pattern (215) formed on the non-conductive substrate (210). The non-conductive substrate (210) and the metal pattern (215) may be composed of different materials. For example, the non-conductive substrate (210) may be a dielectric. The metal pattern (215) may be a metal. The metal pattern (215) may be configured to radiate signals to which it is supplied. In other words, the metal pattern (215) can be used as a radiator.

[0036] The above-described radiating structure may include a support portion (202). The support portion (202) may be used to support a substrate portion (201) of the radiating structure. The support portion (202) may be positioned such that a non-conductive substrate (210) of the substrate portion (201) is spaced a predetermined distance from an insulating plate (205). The support portion (202) may be used to supply signals to a metal pattern (215) of the radiating structure. For example, the support portion (202) may supply signals through supply portions formed on the support portion (202). The signals may be coupled and excited to the metal pattern (215). The excited signals may be radiated through the metal pattern (215). A specific description of the supply of signals is described in detail with reference to FIGS. 2B to 2C.

[0037] The support portion (202) may include a plurality of side regions (220) and a feeding region (230). The plurality of side regions (220) may include a first side region (220a), a second side region (220b), a third side region (220c), and a fourth side region (220d). The feeding region (230) may be coupled with the plurality of side regions (220) and may correspond to the uppermost surface in the shape of the support portion (202). For example, the shape of the support portion (202) may be a square pillar or a square pyramid. Hereinafter, the support portion (202) includes four side regions (e.g., a first side region (220a), a second side region (220b), a third side region (220c), and a fourth side region (220d)), and although a shape of a square pillar or a square pyramid is described as an example, the embodiments of the present disclosure are not limited thereto. Any structure including the feeding structure and the radiating structure described through the embodiments can be understood as embodiments of the present disclosure. The plurality of side regions (220) may include inner sides facing the inside of the support portion (202) and outer sides facing the outside of the support portion (202). The inner sides represent side surfaces facing the center of the support portion (202), and the outer sides represent side surfaces facing outward from the center of the support portion (202). According to one embodiment, a signal line (e.g., a first power supply portion (231), a second power supply portion (232)) may be formed on at least a portion of the inner surfaces. The signal line represents a path along which a signal is supplied. According to one embodiment, a ground region may be arranged on at least a portion of the outer surfaces. For example, the ground region may include a plating pattern formed on an outer surface of the dielectric. Through the ground region, noise components of RF signals supplied through the signal line may be reduced, and stable transmission of the RF signals may be provided.

[0038] A conductive pattern may be formed on an insulating plate (205). The conductive pattern may be configured to transmit electrical signals provided from a wireless communication circuit (e.g., RFIC, wireless communication chip, communication chip) to a radiator (e.g., metal pattern (215)). The conductive pattern may include a first conductive pattern for a first polarization. It may include a second conductive pattern for a second polarization. The first polarization and the second polarization may be substantially perpendicular. For example, the first polarization may be a V (vertical) polarization (vertical polarization) and the second polarization may be an H (horizontal) polarization (horizontal polarization). For example, the first polarization may be a (+) approximately 45 degree polarization and the second polarization may be a (-) approximately 45 degree polarization. The first conductive pattern may include a first feed portion (231). The first power supply portion (231) may be a signal path for providing signals of the first conductive pattern (e.g., signals of the first polarization) to the metal pattern (215). The second power supply portion (232) may be a signal path for providing signals of the second conductive pattern (e.g., signals of the second polarization) to the metal pattern (215).

[0039] The first feed portion (231) may be formed along at least one surface of the support portion (202). The first feed portion (231) may be divided into a plurality of segments so as to be arranged along at least one surface of the support portion (202) starting from the first conductive pattern on one surface of the insulating plate (205). For example, the first feed portion (231) may include a first feed segment (231a) and a second feed segment (231b). The first feed segment (231a) may be a portion of the first feed portion (231) formed on one surface of the insulating plate (205). The second feed segment (231b) may be a portion of the first feed portion (231) formed across the one surface of the insulating plate (205) and the surface opposite to the one surface. As an example, the second feed segment (232a) may be a conductive via. The detailed structure of the first power supply section (231) is described through FIGS. 2b to 2c.

[0040] The second feed portion (232) may be formed along at least one surface of the support portion (202). The second feed portion (232) may be divided into a plurality of segments so as to be arranged along at least one surface of the support portion (202) starting from the second conductive pattern on one surface of the insulating plate (205). For example, the second feed portion (232) may include a first feed segment (232a) and a second feed segment (232b). The first feed segment (232a) may be a portion of the second feed portion (232) formed on one surface of the insulating plate (205). The second feed segment (232b) may be a portion of the second feed portion (232) formed across the one surface of the insulating plate (205) and the surface opposite to the one surface. For example, the second feed segment (232b) may be a conductive via. The detailed structure of the second power supply section (232) is described through FIGS. 2b to 2c.

[0041] Referring to FIG. 2B, a cross-section of the antenna element (200) of FIG. 2A is illustrated when viewed in one direction (e.g., in the (-) y-axis direction). In FIG. 2B, an example of a feeding structure of the first feeding portion (231) is described. A supporting portion (202) may be disposed on one surface of an insulating plate (205). A substrate portion (201) may be disposed on the supporting portion (202). A non-conductive substrate (210) of the substrate portion (201) may be disposed on the supporting portion (202). A metal pattern (215) may be formed on one surface of the non-conductive substrate (210). According to one embodiment, the non-conductive substrate (210) and the supporting portion (202) may be formed integrally.

[0042] The first feed portion (231) may be formed along at least one side region (e.g., the first side region (220a), the third side region (220c)) and the feed region (230) among the plurality of side regions (220) of the support portion (202). For example, the first feed portion (231) may include a first feed segment (231a), a second feed segment (231b), a third feed segment (231c), a fourth feed segment (231d), a fifth feed segment (231e), and a sixth feed segment (231f). The first feed segment (231a) may be disposed on one surface (e.g., a surface facing the (+) z-axis) of the insulating plate (205). The second feed segment (231b) may include a via formed across one side (e.g., the side facing the (+) z-axis) and the opposite side (e.g., the side facing the (-) z-axis) of the insulating plate (205). The third feed segment (231c) may be disposed on one side (e.g., the side facing the (-) z-axis) of the insulating plate (205). The fourth feed segment (231d) may be disposed on one side of a first side region (220a) among the plurality of side regions (220). For example, the side may be an inner surface of the first side region (220a). The fifth feed segment (231e) may be disposed on one side of the feed region (230). For example, the side may be a side facing the (+) z-axis direction (hereinafter, referred to as an outer surface). In order for the feed line extending from the inner surface of the support portion (202) to be arranged on one surface of the feed region (230), the first feed portion (231) may further include connecting structures (e.g., conductive vias). For example, the first feed portion (231) may further include a first connecting structure (e.g., conductive via) for connecting the fourth feed segment (231d) and the fifth feed segment (231e) and / or a second connecting structure (e.g., conductive via) for connecting the fifth feed segment (231e) and the sixth feed segment (231f).The sixth power supply segment (231f) may be positioned on one side of the third side region (220c) among the plurality of side regions (220). For example, the one side may be the inner surface of the third side region (220c).

[0043] A first ground region (227a) may be arranged on one side of a first side region (220a) of the support portion (202). For example, the side may be an outer surface of the first side region (220a). A third ground region (227c) may be arranged on one side of a third side region (220c) of the support portion (202). For example, the side may be an outer surface of the third side region (220c). Through the first ground region (227a) and the third ground region (227c), the noise component of the first signals of the first polarization of the first power supply portion (231) is reduced, and the first signals can be stably powered. Although FIG. 2B illustrates an example in which the ground region is formed on the outer surface of the side region (e.g., the first side region (220a), the third side region (220c)) and the signal-transmitting feed portion is disposed on the inner surface of the side region (e.g., the first side region (220a), the third side region (220c)), the embodiments of the present disclosure are not limited thereto. In one embodiment, the ground region may be formed on the inner surface of the side region of the support portion (202) and the signal-transmitting feed portion may be disposed on the outer surface of the side region.

[0044] Although FIG. 2B illustrates an example in which the first feed portion (231) is divided into six segments, embodiments of the present disclosure are not limited thereto. The example of division in FIG. 2B merely illustrates portions of the feed line divided along the support portion (202), and is not to be construed as limiting other embodiments. According to another embodiment, the first feed portion (231) may include a first feed segment (231a), a second feed segment (231b), a third feed segment (231c), a fourth feed segment (231d), and a fifth feed segment (231e), and may not include a sixth feed segment (231f). According to another embodiment, the first feed segment (231a) of the first feed portion (231) may be disposed on a surface (hereinafter, the second surface) opposite to one surface (hereinafter, the first surface) of the insulating plate (205) on which the antenna element (200) is disposed. For example, a conductive pattern may be formed on the second surface of the insulating plate (205). As the conductive pattern is disposed on the second surface, the first feed segment (231a) of the first feed portion (231) may also be formed on the second surface. Accordingly, a conductive via connected across the first surface and the second surface of the insulating plate (205) may be omitted. The first feed segment (231) includes a first feed segment (231a), a third feed segment (231c), a fourth feed segment (231d), a fifth feed segment (231e), and a sixth feed segment (231f), and may not include a second feed segment (231b).

[0045] Referring to FIG. 2C, a cross-section of the antenna element (200) of FIG. 2A is illustrated when viewed in one direction (e.g., in the (-) x-axis direction). In FIG. 2C, an example of a feeding structure of the second feeding portion (232) is described. A supporting portion (202) may be disposed on one surface of an insulating plate (205). A substrate portion (201) may be disposed on the supporting portion (202). A non-conductive substrate (210) of the substrate portion (201) may be disposed on the supporting portion (202). A metal pattern (215) may be formed on one surface of the non-conductive substrate (210). According to one embodiment, the non-conductive substrate (210) and the supporting portion (202) may be formed integrally.

[0046] The second feed portion (232) may be formed along at least one side region (e.g., the second side region (220b), the fourth side region (220d)) and the feed region (230) among the plurality of side regions (220) of the support portion (202). For example, the second feed portion (232) may include a first feed segment (232a), a second feed segment (232b), a third feed segment (232c), a fourth feed segment (232d), a fifth feed segment (232e), and a sixth feed segment (232f). The first feed segment (232a) may be disposed on one surface (e.g., a surface facing the (+) z-axis) of the insulating plate (205). The second feed segment (232b) may include a via formed across one side (e.g., the side facing the (+) z-axis) and the opposite side (e.g., the side facing the (-) z-axis) of the insulating plate (205). The third feed segment (232c) may be disposed on one side (e.g., the side facing the (-) z-axis) of the insulating plate (205). The fourth feed segment (232d) may be disposed on one side of a first side region (220a) among the plurality of side regions (220). For example, the side may be an inner surface of the first side region (220a). The fifth feed segment (232e) may be disposed on one side of the feed region (230). For example, the side may be a side facing the (-) z-axis direction (hereinafter, referred to as an inner surface). The fifth feed segment (232e) disposed on the inner surface of the feed region (230) can be distinguished from the fifth feed segment (231e) disposed on the outer surface of the feed region (230). The sixth feed segment (232f) can be disposed on one surface of the third side region (220c) among the plurality of side regions (220). For example, the one surface can be the inner surface of the third side region (220c).

[0047] A second ground region (227b) may be disposed on one side of the second side region (220b) of the support portion (202). For example, the side may be an outer surface of the second side region (220b). A fourth ground region (227d) may be disposed on one side of the fourth side region (220d) of the support portion (202). For example, the side may be an outer surface of the fourth side region (220d). Through the second ground region (227b) and the fourth ground region (227d), the noise component of the second signals of the second polarization of the second power supply portion (232) is reduced, and the second signals can be stably powered. Although FIG. 2C illustrates an example in which the ground region is formed on the outer surface of the side region (e.g., the second side region (220b), the fourth side region (220d)) and the signal-transmitting feed portion is disposed on the inner surface of the side region (e.g., the second side region (220b), the fourth side region (220d)), the embodiments of the present disclosure are not limited thereto. According to one embodiment, the ground region may be formed on the inner surface of the side region of the support portion (202) and the signal-transmitting feed portion may be disposed on the outer surface of the side region.

[0048] Although FIG. 2C illustrates an example in which the second feed portion (232) is divided into six segments, embodiments of the present disclosure are not limited thereto. The example of division in FIG. 2C merely illustrates portions of the feed line divided along the support portion (202) and is not to be construed as limiting other embodiments. According to another embodiment, the second feed portion (232) may include a first feed segment (232a), a second feed segment (232b), a third feed segment (232c), a fourth feed segment (232d), and a fifth feed segment (232e), and may not include a sixth feed segment (232f). According to another embodiment, the first feed segment (232a) of the second feed portion (232) may be disposed on a surface (hereinafter, the second surface) opposite to one surface (hereinafter, the first surface) of the insulating plate (205) on which the antenna element (200) is disposed. For example, a conductive pattern may be formed on the second surface of the insulating plate (205). As the conductive pattern is disposed on the second surface, the first feed segment (232a) of the second feed portion (232) may also be formed on the second surface. Accordingly, a conductive via connected across the first surface and the second surface of the insulating plate (205) may be omitted. The second feed segment (232) includes a first feed segment (232a), a third feed segment (232c), a fourth feed segment (232d), a fifth feed segment (232e), and a sixth feed segment (232f), and may not include a second feed segment (232b).

[0049] The injection-molded article used to describe embodiments in the present disclosure may include a substrate portion (201) and a support portion (202). In addition to the substrate portion, the substrate portion (201) may be termed a substrate region, a dielectric substrate, a substrate injection portion, a first injection-molded article, a substrate structure, an upper substrate portion, an upper patch portion, a patch portion, a patch area, a radiating portion, and / or terms having equivalent technical / structural meanings thereto. The support portion (202) may be termed a support region, a pillar portion, a pillar injection portion, a support injection portion, a second injection-molded article, a support structure, a feed structure, a feed portion, a feed area, and / or terms having equivalent technical / structural meanings thereto. The patch used to describe embodiments in the present disclosure may represent a metal pattern (215) of a non-conductive substrate (210). In addition to the metal pattern (215), terms such as conductive pattern, metal pattern, conductive portion, metal area, plated portion, metal portion, radiation pattern, radiation portion, radiation area, and / or having equivalent technical / structural meanings may be used.

[0050] Figures 3a to 3c illustrate other examples of radiating structures for dipole antennas. In Figures 2a to 2c, a shape is described in which side regions (220) of a support portion (202) having a shape of a square pillar are arranged substantially perpendicular to one surface (e.g., xy plane) of an insulating plate (205) and / or one surface (e.g., xy plane) of a non-conductive substrate (210). Figures 3a to 3c illustrate an example in which the side regions (220) of the antenna element (200) of Figures 2a to 2c are inclined with respect to the one surface (e.g., xy plane) of the insulating plate (205).

[0051] Referring to FIG. 3A, a perspective view of an antenna element (200) is illustrated. The antenna element (200) may include a radiating structure. The radiating structure may be disposed on one surface of an insulating plate (205). The radiating structure may include a substrate portion (201). The substrate portion may include a non-conductive substrate (210) and a metal pattern (215) formed on the non-conductive substrate (210). The radiating structure may include a support portion (202). The support portion (202) may include a plurality of side regions (220) and a feeding region (230).

[0052] In one embodiment, at least a portion of a feed portion (e.g., a first feed portion (231), a second feed portion (232)) may be disposed on the inner surface of each side region (e.g., a first side region (220a), a second side region (220b), a third side region (220c), and a fourth side region (220d)) of the side regions (220) and a ground region (e.g., a first ground region (227a), a second ground region (227b), a third ground region (227c), and a fourth ground region (227d)) may be disposed on the outer surface. In order to form a pattern (hereinafter, a feed pattern) made of metal on the inner surface (i.e., the inner surface of the side region) of the support portion (202) (e.g., the fourth feed segment (231d), the fourth feed segment (232d), the fifth feed segment (232e), the sixth feed segment (231f), the sixth feed segment (232f)), an additional plating process may be required. In order to easily form the feed pattern, the volume of the space formed through the side regions (220) of the support portion (202) may be required to be sufficient. The support portion (202) may be used to support the substrate portion (201) (e.g., the non-conductive substrate (210)) from the insulating plate (205). The support portion (202) may include a structure having a constant slope. Due to the above constant inclination, the width of the area where the side regions are coupled to the insulating plate (205) may be different from the width of the feeding area (230). For example, the width of the area where the side regions are coupled to the insulating plate (205) may be wider than the width of the feeding area (230). For example, the shape of the supporting portion (202) may be a square pyramid. As the internal space of the supporting portion (202) is sufficiently secured, the feeding pattern corresponding to the signal line can be formed more accurately and stably (e.g., with low process error) on the inner surface of the side region.

[0053] Referring to FIG. 3b, a cross-section of the antenna element (200) of FIG. 3a is illustrated when viewed in one direction (e.g., the (-) y-axis direction). A first feed portion (231) may be formed along at least one side region (e.g., the first side region (220a), the third side region (220c)) and the feed region (230) among the plurality of side regions (220) of the support portion (202). Refer to FIG. 2b for a description of the feed segments constituting the first feed portion (231). A fourth feed segment (231d) of the first feed portion (231) may be disposed on one surface (e.g., the inner surface) of the first side region (220a) among the plurality of side regions (220). The sixth feed segment (231f) of the first feed section (231) may be positioned on one side (e.g., the inner surface) of the third side region (220c) among the plurality of side regions (220). Since the fourth feed segment (231d) and the sixth feed segment (231f) are formed along one side of the corresponding side region, the fourth feed segment (231d) and the sixth feed segment (231f) may be positioned to have a constant incline with respect to the insulating plate (205).

[0054] Referring to FIG. 3c, a cross-section of the antenna element (200) of FIG. 3a is illustrated when viewed in one direction (e.g., the (-) x-axis direction). The second feed portion (232) may be formed along at least one side region (e.g., the second side region (220b), the fourth side region (220d)) and the feed region (230) among the plurality of side regions (220) of the support portion (202). Refer to FIG. 2c for a description of the feed segments constituting the second feed portion (232). The fourth feed segment (232d) of the second feed portion (232) may be disposed on one surface (e.g., the inner surface) of the second side region (220b) among the plurality of side regions (220). The sixth feed segment (232f) of the second feed section (232) may be positioned on one side (e.g., inner side) of the fourth side region (220d) among the plurality of side regions (220). Since the fourth feed segment (232d) and the sixth feed segment (232f) are formed along one side of the corresponding side region, the fourth feed segment (232d) and the sixth feed segment (232f) may be positioned to have a constant inclination with respect to the insulating plate (205).

[0055] Fig. 4 illustrates an example of a radiation pattern of an antenna module using a dipole antenna. An electronic device according to embodiments may include an antenna array. The antenna array may include a plurality of sub-arrays. Each sub-array of the plurality of sub-arrays may include antenna elements. The radiating structure described in Figs. 2a to 2c may correspond to the antenna element (200) of Fig. 2a among the plurality of antenna elements. Hereinafter, Fig. 4 illustrates an example of a radiation pattern of a sub-array using the antenna element (200) of Fig. 2a.

[0056] To support various services and meet the high data rates required for these services, wideband support is required. However, compared to narrowband antennas, wideband antennas have difficulty providing a consistent beamwidth across frequencies. Beam squint can be used as an indicator of beamforming performance. Beam squint refers to a phenomenon in which the beam direction of an antenna is directed differently from the antenna's radiation direction. Beam squint can occur in array antennas where multiple antenna elements are densely packed. For example, beam squint can occur because each antenna element is located at a different position and the phase components of the signals radiated from each antenna element are different. For example, signals radiated from a sub-array can couple to antenna elements adjacent to the sub-array and re-radiate from the antenna elements, resulting in a difference between the intended and actual beam directions. Beam squint can degrade the antenna's directivity and reduce its gain.

[0057] Referring to FIG. 4, a graph (400) represents radiation patterns of different sub-arrays of an array antenna. Each antenna element of the sub-arrays may be the antenna element (200) of FIGS. 2A to 3C. The coupling feed through the feed region (230) of the support portion (202) and the metal pattern (215) formed on one surface of the non-conductive substrate (210) may enable the antenna element (200) to operate as a dipole antenna. Although not shown in FIG. 4, a microstrip patch radiator may be used for comparison with a dipole antenna including an antenna element (200) according to embodiments of the present disclosure. For a sub-array including the microstrip patch, the radiation pattern in the grating lobe may vary depending on the position of the sub-array. Due to the difference in the radiation pattern between the sub-arrays, beam squat may be observed. For sub-arrays including microstrip patches, the standard deviation of the peak gain is approximately 0.37. Referring to the first region (410) of the graph (400), it can be confirmed that the shapes of the radiation patterns of the sub-arrays are similar. It can be confirmed that the beam squat is reduced through the dipole antenna according to embodiments of the present disclosure. Referring to the second region (420) of the graph (400), it can be confirmed that the standard deviation of the peak gain between the sub-arrays is approximately 0.16. It can be confirmed that the deviation of the peak gain between the sub-arrays is reduced through the dipole antenna according to embodiments of the present disclosure.

[0058] Fig. 5a shows a cross-section of a radiating structure for a dipole antenna. Fig. 5a shows a cross-section of a radiating structure corresponding to the antenna element (200) of Figs. 3a to 3c, viewed in one direction (e.g., along the (-) y-axis).

[0059] Referring to FIG. 5A, the substrate portion (201) may be positioned on top of the support portion (202). The non-conductive substrate (210) of the substrate portion (201) may be positioned on top of the support portion (202). At least one upper via may be used to stably couple the non-conductive substrate (210) to the support portion (202). For example, the upper via (510a) may be positioned to connect the second side region (220b) or the feed region (230) of the support portion (202) to the non-conductive substrate (210). Although not shown in FIG. 5A, the antenna element (200) may include a plurality of upper vias. The plurality of upper vias may be used to couple the substrate portion (201) and the support portion (202).

[0060] A support portion (202) may be disposed on one surface of an insulating plate (205). The support portion (202) may include a plurality of side regions (220) and a power supply region (230). The plurality of side regions (220) may include a first side region (220a), a second side region (220b), a third side region (220c), and a fourth side region (220d). In FIG. 5A, the second side region (220b) and other side regions are not illustrated to illustrate the relationship of the stacking direction (e.g., the (+) z-axis direction). The second side region (220b) may be coupled with the insulating plate (205). At least one lower via may be used to ensure stable coupling between the second side region (220b) of the support portion (202) and the insulating plate (205). For example, each of the first lower via (521a) and the second lower via (521b) may be positioned to connect a portion (e.g., a groove) of the second side region (220b) with the insulating plate (205). Although not shown in FIG. 5A, the antenna element (200) may include a plurality of lower vias. The plurality of lower vias may be used to couple the support portion (202) and the insulating plate (205). According to one embodiment, the plurality of lower vias may be used to connect a ground region (e.g., the second ground region (227b)) to the ground of the insulating plate (205). The lower vias may be conductive vias.

[0061] Although FIG. 5A illustrates an example in which two lower vias are arranged to connect the side region and the insulating plate (205), embodiments of the present disclosure are not limited thereto. For example, two lower vias may be arranged in one side region, while one lower via may be arranged in another side region. For another example, among the antenna elements of the sub-array, one antenna element may include two lower vias per side region, while another antenna element may include one lower via per side region.

[0062] In FIG. 5a, an example is described in which vias are used for stable bonding between a substrate of a dielectric material (e.g., a non-conductive substrate (510)) and a dielectric structure (e.g., a support portion (202)), or for bonding between the dielectric structure and an insulating plate (205). In addition to the connection between structures, vias may also be used as part of a feed line. For example, as described in FIGS. 2b, 2c, 3b, and 3c, a feed line extending from a conductive pattern may be formed by penetrating the insulating plate (205) through a conductive via (e.g., the second feed segment (231b), the second feed segment (232b)). In another example, feed lines for different polarizations may be

[0063] The vias (e.g., upper via (510a), first lower via (521a), and second lower via (521b)) used to describe embodiments in the present disclosure are used for connecting two structures, and other terms such as connecting portion, connecting part, conductive via, vertical via, connecting area, and / or having equivalent technical / structural meanings may be used in addition to via.

[0064] Fig. 5b shows an example of feed lines of a radiating structure for a dipole antenna (e.g., antenna element (200) of Figs. 2a to 2c).

[0065] Referring to FIG. 5b, the feed lines may include a first feed line for a first polarization (e.g., a first feed portion (231)) and a second feed line for a second polarization (e.g., a second feed portion (232)). The first polarization and the second polarization may be substantially perpendicular. For example, the first polarization may be a V-polarization and the second polarization may be an H-polarization. For example, the first polarization may be a (+) approximately 45 degree polarization and the second polarization may be a (-) approximately 45 degree polarization.

[0066] The support portion (202) may be a dielectric. The support portion (202) may be a three-dimensional shape composed of a dielectric. The support portion (202) may include a plurality of side regions (220) and a feed region (230) connected to the side regions (220). The feed region (230) may be supported by the side regions (220) and may be arranged to face one direction (e.g., the (+) z-axis direction). As illustrated in FIGS. 2A to 3C, the feed region (230) may be arranged close to the substrate portion (201). The first feed portion (231) may be arranged such that at least a portion (e.g., the fifth feed segment (231e)) of the first feed portion (231) passes through the feed region (230). The second feed portion (232) may be arranged so that at least a portion of the second feed portion (232) (e.g., the fifth feed segment (232e)) passes through the feed region (230). However, signal lines of different polarizations may be arranged to have different heights (e.g., with respect to the z-axis direction) so that performance degradation is not caused by overlapping. For example, the height at which at least a portion of the first feed portion (231) is arranged along the feed region (230) of the support portion (202) may be higher than the height at which at least a portion of the second feed portion (232) is arranged along the feed region (230) of the support portion (202). For example, the height (e.g., position on the z-axis from the insulating plate (205)) of the fifth feeding segment (231e) of the first feeding portion (231) may be higher than the height (e.g., position on the z-axis from the insulating plate (205)) of the fifth feeding segment (231e) of the second feeding portion (232).

[0067] The signals provided through the first feed portion (231) and the signals provided through the second feed portion (232) may have different phases. At this time, the difference in height between the fifth feed segment (231e) and the fifth feed segment (232e) may be used as a balun of a folded dipole (e.g., at least a part of the metal pattern (215) of FIG. 7) described below. The dipole antenna corresponding to the metal pattern (215) is a balanced circuit, whereas the feed points (e.g., the fifth feed segment (231e) and the fifth feed segment (232e)) correspond to an unbalanced circuit. The feeding patterns formed along one side of the support portion (202) (e.g., the fourth feeding segment (231d), the fifth feeding segment (231e), and the sixth feeding segment (231f) of the first feeding portion (231), and the fourth feeding segment (232d), the fifth feeding segment (232e), and the sixth feeding segment (232f) of the second feeding portion (232)) can be understood as a balun circuit for a wideband dipole antenna.

[0068] The feed region (230) may include a first surface (e.g., an outer surface) facing one direction (e.g., the (+) z-axis) and a second surface (e.g., an inner surface) facing an opposite direction (e.g., the (-) z-axis). At least a portion of the first feed portion (231) (e.g., the fifth feed segment (231e)) may be formed along the first surface of the feed region (230). At least a portion of the second feed portion (232) (e.g., the fifth feed segment (232e)) may be formed along the second surface of the feed region (230). Conductive vias may be used to implement different heights in the feed region (230) of the support portion (202). Since a portion of the first feed portion (231) (e.g., the fourth feed segment (231d), the sixth feed segment (231f)) is arranged along the inner surface of the support portion (202), conductive vias may be used to position the feed pattern on the first surface of the feed region (230). For example, the first feed portion (231) may include a first conductive via (531a) for connecting the fourth feed segment (231d) and the fifth feed segment (231e). The first feed portion (231) may include a second conductive via (531b) for connecting the fifth feed segment (231e) and the sixth feed segment (231f). Each of the first conductive via (531a) and the second conductive via (531b) may be arranged to penetrate the feed region (230).

[0069] FIG. 6A illustrates examples of vias for a radiating structure for a dipole antenna (e.g., antenna element (200) of FIG. 3A). The vias may be used for bonding between a support portion (202) and an insulating plate (205). For example, the vias may include the lower vias illustrated in FIG. 5A.

[0070] Referring to FIG. 6a, examples of lower vias for coupling between the first side area (220a) and the insulating plate (205) in the antenna element (200) of FIG. 3a are shown.

[0071] For example, an antenna module including an antenna element (200) may include a connection structure (611) (e.g., a groove, an opening) for coupling between a first side area (220a) and an insulating plate (205). A lower via (612) may be arranged in the connection structure (611) for coupling between the first side area (220a) and the insulating plate (205). For example, the shape of the connection structure (611) may be a three-dimensional shape having a surface that is perpendicular to one direction (e.g., the (+) y-axis and / or the (-) y-axis). Instead of a generally used circular via, the shape of the lower via (612) may be an angular shape (e.g., a square pillar, a polygonal pillar with angular corners). Through the lower via (612), the robustness of the mating surface (contact surface) can be secured when manufacturing the support portion (202) through the dielectric. An example of a manufacturing process using a via having an angular shape is described in detail with reference to FIG. 6b.

[0072] FIG. 6B illustrates an example of a method for producing a radiating structure for a dipole antenna (e.g., the antenna element (200) of FIG. 3A). In order to produce a dielectric structure in an antenna module including the antenna element (200), an injection molding technique may be used. Injection molding is a process of injecting hot plastic into a mold to produce a product of a desired shape. The process may be used to mass-produce plastic products. In one embodiment, the non-conductive substrate (210) and the support portion (202) of the substrate portion (201) in the antenna element (200) may be formed integrally as a dielectric (e.g., plastic).

[0073] Referring to FIG. 6B, instead of the non-conductive substrate (210) being joined after the support portion (202) is formed, the support portion (202) and the non-conductive substrate (210) may be formed integrally. To form the non-conductive substrate (210) and the support portion (202), a plurality of cores may be used. The core refers to a mold frame for forming a space for an injection molded product in injection molding. In the injection molding process, a sliding core may be used to prevent undercuts from occurring during injection. For example, the plurality of cores may include an upper core (621), a first sliding core (631), and a second sliding core (632). The upper core (621) may include a connecting structure (622) for a via (e.g., an upper via (510a)). The connecting structure (622) can be used for coupling between the non-conductive substrate (210) and the support portion (202). The movement direction of the first sliding core (631) and the movement direction of the second sliding core (632) can be limited. For example, the first sliding core (631) can move in one direction (e.g., the (+) y-axis direction). The second sliding core (632) can move in one direction (e.g., the (-) y-axis direction). Since each of the first sliding core (631) and the second sliding core (632) does not move in the (+) z-axis direction or the (-) z-axis direction, but only moves in the direction within the xy plane, an undercut may not occur during injection.

[0074] Referring to the enlarged view (651), the support portion (202) corresponding to the injection molded product may include a connecting structure (661) for a lower via (e.g., lower via (612)) in some areas. Referring to the enlarged view (651), the second sliding core (632) may be configured to form the injection molded product up to the boundary portion where the first sliding core (631) and the second sliding core (632) meet. The connecting structure (661) may be positioned at the boundary portion. In other words, the first sliding core (631) may contact the connecting structure (661), and the connecting structure (661) may contact the second sliding core (632). Through the connecting structure (661) corresponding to the square via, robustness between contact surfaces may be secured in a molding process using the sliding core.

[0075] Fig. 7 illustrates an example of a metal pattern for a dipole antenna. The metal pattern (215) illustrated in Fig. 7 is exemplary, and the metal pattern (215) of Fig. 7 is not to be construed as limiting the shape of a radiator for a dipole antenna according to embodiments of the present disclosure. An electronic device according to embodiments may include an antenna array. The antenna array may include a plurality of antenna elements. The radiating structure described in Figs. 2a to 2c may correspond to an antenna element (200) among the plurality of antenna elements. The antenna element (200) may be used as a dipole antenna. For a description of the antenna element (200), reference may be made to Figs. 2a to 3c.

[0076] Referring to FIG. 7, the substrate portion (201) of the antenna element (200) may include a non-conductive substrate (210) and a metal pattern (215) formed on the non-conductive substrate (210). The metal pattern (215) may be configured to radiate signals excited based on coupling feeding in the feeding region (230) described through FIGS. 2A to 5B.

[0077] The metal pattern (215) may include a plurality of folded dipoles. For example, the metal pattern (215) may include a first pattern portion (215a), a second pattern portion (215b), a third pattern portion (215c), and a fourth pattern portion (215d). The folded dipole has a shape in which a loop is formed to connect both ends of the dipoles. The folded dipole may be configured to radiate signals coupled through the first feed portion (231) and / or the second feed portion (232). For example, the first pattern portion (215a) may be a radiator having the first end of the fifth feed segment (232e) of the second feed portion (232) as a feed point. The loop of the first pattern portion (215a) may include a loop from the feeding point to the first end of the fifth feeding segment (231e) of the first feeding portion (231). For example, the second pattern portion (215b) may be a radiator having the second end (opposite the first end) of the fifth feeding segment (231e) of the first feeding portion (231) as a feeding point. The loop of the second pattern portion (215b) may include a loop from the feeding point to the first end of the fifth feeding segment (232e) of the second feeding portion (232). For example, the third pattern portion (215c) may be a radiator having the second end (opposite the first end) of the fifth feeding segment (232e) of the second feeding portion (232) as a feeding point. The loop of the third pattern portion (215c) may include a loop from the feeding point to the second end of the fifth feeding segment (231e) of the first feeding portion (231). For example, the fourth pattern portion (215d) may be a radiator having the first end of the fifth feeding segment (231e) of the first feeding portion (231) as a feeding point. The loop of the fourth pattern portion (215d) may include a loop from the feeding point to the second end of the fifth feeding segment (232e) of the second feeding portion (232).In the side regions (220) and the feed region (230) of the support portion (202), the arrangement of the first feed portion (231) and the second feed portion (232) can be configured to form a balun circuit for the folded dipole. The first feed portion (231) and the second feed portion (232) can have different electrical lengths so that the phases of the start point (e.g., the feed point of the first feed portion (231)) and the end point (e.g., the feed point of the second feed portion (232)) of the loop of each folded dipole are aligned.

[0078] FIGS. 8A to 8C illustrate examples of antenna elements including a pillar structure for beamforming control (e.g., the antenna element (200) of FIGS. 3A to 3C ). FIGS. 8A and 8B illustrate perspective views of an antenna element (200) including the pillar structure. FIG. 8C illustrates a plan view of an antenna element (200) including the pillar structure. FIG. 8A illustrates an antenna element (200) with the non-conductive substrate (210) and the conductive pattern (215) of the antenna element (200) omitted to more clearly represent the pillar structures in three-dimensional space, and FIG. 8B illustrates an antenna element (200) including the pillar structures, the non-conductive substrate (210), and the conductive pattern (215) of FIG. 8A. The descriptions for FIG. 8A can be applied to FIG. 8B in the same manner. Figure 8c is a plan view corresponding to Figure 8a.

[0079] Referring to FIGS. 8a, 8b, and 8c, the substrate portion (201) may include a non-conductive substrate (210) and a metal pattern (215). As described in FIG. 7, the metal pattern (215) may include one or more folded dipoles (e.g., a first pattern portion (215a), a second pattern portion (215b), a third pattern portion (215c), and a fourth pattern portion (215d)). A typical dipole antenna may form a radiation pattern that is symmetrical about a feed point. Additional pillar structures may be used to adjust the direction and beamwidth of the radiation pattern.

[0080] In one embodiment, an antenna element (e.g., antenna element (200) of FIGS. 3A to 3C) may include a plurality of column structures (820). The plurality of column structures (820) may include a first column structure (820a), a second column structure (820b), a third column structure (820c), and a fourth column structure (820d). In one embodiment, the plurality of column structures (820) may be disposed below a dipole antenna, i.e., a non-conductive substrate (210). For example, the plurality of column structures (820) may be disposed between the non-conductive substrate (210) and an insulating plate (205). In one embodiment, each column structure of the plurality of column structures (820) may be used to support the non-conductive substrate (210). Each pillar structure of the plurality of pillar structures (820) can be arranged so that the non-conductive substrate (210) is spaced a certain distance from the insulating plate (205).

[0081] In one embodiment, each of the plurality of pillar structures (820) may be coupled to the support portion (202) as a dielectric. For example, each of the plurality of pillar structures (820) may be coupled to a corner region between side regions of the support portion (202). A first pillar structure (820a) may be coupled to a corner region between a first side region (220a) and a second side region (220b). A second pillar structure (820b) may be coupled to a corner region between a second side region (220b) and a third side region (220c). A third pillar structure (820c) may be coupled to a corner region between a third side region (220c) and a fourth side region (220d). A fourth pillar structure (820d) may be coupled to a corner region between a fourth side region (220d) and the first side region (220a).

[0082] In one embodiment, each of the plurality of column structures (820) may include a conductive portion. For example, a first column structure (820a) may include a first conductive portion (821a). For example, a second column structure (820b) may include a second conductive portion (821b). For example, a third column structure (820c) may include a third conductive portion (821c). For example, a fourth column structure (820d) may include a fourth conductive portion (821d). The conductive portions may be used to control the pattern of a beam formed in the folded dipole.

[0083] In one embodiment, beamforming elements (e.g., beam width, beam gain) may be controlled based on the shape of the conductive portion of each of the plurality of pillar structures (820). For example, the beamforming elements may be controlled based on the length of the conductive portion along the height direction (e.g., the (+) z-axis direction). When the pillar structure is a dielectric, the conductive portion may be used to control the radiation pattern of the metal pattern (215). In one embodiment, beamforming elements (e.g., beam width, beam gain) may be controlled based on the arrangement of the plurality of pillar structures (820). For example, the beam pattern of the metal pattern (215) may vary depending on the spacing between the first pillar structure (820a) and the third pillar structure (820c). For example, as the distance between the first column structure (820a) and the third column structure (820c) becomes narrower, the beam width of the beam pattern may become narrower and the beam gain in the aiming direction may become higher. For example, the beam pattern of the metal pattern (215) may change depending on the distance between the second column structure (820b) and the fourth column structure (820d). For example, as the distance between the second column structure (820b) and the fourth column structure (820d) becomes narrower, the beam width of the beam pattern may become narrower and the beam gain in the aiming direction may become higher. The technical principle for controlling the beam pattern of the dipole antenna is described in detail through FIG. 11.

[0084] Although FIGS. 8A to 8C illustrate examples of forming metallic conductive portions on dielectric pillar structures, the embodiments of the present disclosure are not limited thereto. As a technical principle for controlling beamforming elements in FIG. 11, which will be described later, metallic pillar structures may also be utilized. For example, instead of pillar structures and conductive portions formed separately on each pillar structure, metallic pillar structures may be utilized to control beamforming elements.

[0085] The column structures used to describe embodiments in the present disclosure (e.g., the first column structure (820a), the second column structure (820b), the third column structure (820c), and the fourth column structure (820d)) may be termed column structures, column portions, additional column portions, additional structures, additional structures, column structures, monopole-shaped structures, radiation control structures, radiation pattern control structures, beam pattern control structures, beam control structures, monopole-like shapes, monopole-like structures, and / or terms having equivalent technical / structural meanings.

[0086] FIG. 9 illustrates an example of the performance of an antenna element (e.g., the antenna element (300) of FIGS. 3A to 3C) including a column structure for beamforming control. The factors for beamforming control may include beamwidth and / or gain. FIG. 9 illustrates an antenna element (200) including the column structures of FIGS. 8A to 8C (e.g., a first column structure (820a), a second column structure (820b), a third column structure (820c), and a fourth column structure (820d)).

[0087] Referring to FIG. 9, a graph (900) represents a radiation pattern of a pillar structure for beamforming control. The horizontal axis of the graph (900) represents the antenna direction (unit: degree) with respect to the boresight (or front direction). The vertical axis of the graph (900) represents the antenna gain (unit: dB (decibel)). The graph (900) represents the radiation pattern of the antenna element (200) for different cases in which the length of the conductive portion (e.g., the first conductive portion (821a), the second conductive portion (821b), the third conductive portion (821c), and the fourth conductive portion (821d)) of the pillar structure for beamforming control is different in the height direction (e.g., the z-axis direction). It can be confirmed that as the conductive portion of the pillar structure changes, the beam width of the formed beam and the antenna gain change. According to one embodiment, the beam width and antenna gain of the beam may be determined based on the length of the conductive portion of the column structure in the height direction. For example, as the length of the conductive portion of the column structure increases, the beam width of the beam may narrow and the antenna gain in the aiming direction may increase. In another example, as the length of the conductive portion of the column structure decreases, the beam width of the beam may widen and the antenna gain in the aiming direction may decrease. The technical principles for the beam width and antenna gain are described in detail with reference to FIG. 11.

[0088] FIG. 10 shows examples of conductive portions (e.g., first conductive portion (821a), second conductive portion (821b), third conductive portion (821c), and fourth conductive portion (821d)) of column structures (e.g., first column structure (820a), second column structure (820b), third column structure (820c), and fourth column structure (820d)) for beamforming control.

[0089] Referring to FIG. 10, a first example (1010) shows a conductive portion (1011) formed on an outer surface of a column structure. The outer surface may refer to a surface of the column structure that faces in an opposite direction from a support portion (e.g., support portion (202)). A second example (1020) shows a conductive portion (1021) formed on a plurality of surfaces of the column structure. The plurality of surfaces may include the outer surface and side surfaces of the outer surface. A third example (1030) shows a conductive portion (1031) formed on a plurality of side surfaces of the column structure. The conductive portion (1031) may have a 'T' shape on each side surface of the column structure. A fourth example (1040) shows a conductive portion (1031) formed on a plurality of axial surfaces of the column structure. The conductive portion (1031) may have an 'I' shape on each side surface of the column structure. Example 5 (1050) illustrates a conductive portion (1031) formed on multiple side surfaces of a column structure. The conductive portion (1031) may have a '7' shape on each side surface of the column structure.

[0090] Although various shapes are illustrated in FIG. 10, embodiments of the present disclosure are not limited thereto. In addition to the shape illustrated in FIG. 10, if the conductive portion has a shape having a constant length in the height direction (e.g., z-axis direction), the conductive portion can be used to change the radiation pattern of the folded dipole of the metal pattern (215).

[0091] In FIG. 10, a conductive portion formed on at least one surface of a column structure is described as an example, but embodiments of the present disclosure are not limited thereto. In addition to the column structure, an additional conductive portion may be formed on the edge of the region where the support portion (202) and the insulating plate (205) are joined. The additionally formed conductive portion and the conductive portion formed on the column structure may be used together to change the radiation pattern of the folded dipole.

[0092] FIG. 11 is a drawing for explaining the principle of beamforming control using column structures (e.g., first column structure (820a), second column structure (820b), third column structure (820c), and fourth column structure (820d)).

[0093] Referring to FIG. 11, the metal pattern (215) may form a first radiation pattern (1110) and a second radiation pattern (1120) as a radiator of a folded-dipole antenna. The first radiation pattern (1110) and the second radiation pattern (1120) may be symmetrical with respect to one surface of the metal pattern (215). For example, the first radiation pattern (1110) may be formed in one direction of the metal pattern (215) (e.g., the (+) z-axis direction). For example, the second radiation pattern (1120) may be formed in a direction opposite to the one direction of the metal pattern (215) (e.g., the (-) z-axis direction).

[0094] Based on the second radiation pattern (1120) and the first conductive portion (821a) of the first pillar structure (820a), a first parasitic pattern (1121a) and a second parasitic pattern (1122a) can be formed. Based on the second radiation pattern (1120) and the third conductive portion (821c) of the third pillar structure (820c), a third parasitic pattern (1121c) and a fourth parasitic pattern (1122c) can be formed. Based on one side of the first conductive portion (821a) and the third conductive portion (821c), each of the second parasitic pattern (1122a) and the fourth parasitic pattern (1122c) can be understood as a radiation pattern of an antenna element. The radiation pattern of the array antenna can be formed through constructive interference and destructive interference according to the phase difference of the radiation patterns of a plurality of antenna elements included in the array antenna. According to the same technical principle, a radiation pattern (1130) can be formed based on the phase difference between the second parasitic pattern (1122a) and the fourth parasitic pattern (1122c). The radiation pattern (1130), together with the first radiation pattern (1110) and the second radiation pattern (1120), can affect the final radiation pattern of the metal pattern (215).

[0095] In one embodiment, the distance between the first conductive portion (821a) and the third conductive portion (821c) affects the beamwidth of the final radiation pattern of the metal pattern (215). For example, just as a shorter spacing between antenna elements in an array antenna forms a narrower and higher-gain beam, a shorter distance between the first conductive portion (821a) and the third conductive portion (821c) may result in a narrower beamwidth. Instead of a narrower beamwidth, the shorter the distance, the greater the beam gain in the center direction (or boresight direction). In other words, the shorter the distance, the sharper the beam may be formed. For another example, a wider beam may be formed as the distance between the first conductive portion (821a) and the third conductive portion (821c) increases. Instead of a wider beamwidth, the beam gain in the center direction may decrease.

[0096] Figures 12a to 12c illustrate examples of the performance of a sub-array for a dipole antenna. The sub-array may include a plurality of antenna elements (e.g., antenna element (300) of Figures 3a to 3c).

[0097] Referring to FIG. 12a, a graph (1200) shows radiation performance according to the presence or absence of a pillar structure for beamforming control. The horizontal axis of the graph (1200) represents the antenna direction (unit: degree) with respect to the boresight (or front direction). The vertical axis of the graph (1200) represents the antenna gain (unit: dB (decibel)). In the graph (1200), a solid line represents a radiation pattern of a sub-array in which the pillar structure is arranged on each antenna element. In the graph (1200), a dotted line represents a radiation pattern of a sub-array in which the pillar structure is not arranged on each antenna element. Comparing the solid line and the dotted line, it can be confirmed that the beamwidth is different. For example, as the beamwidth becomes narrower, the antenna gain in the front direction may increase. For example, as the beamwidth becomes wider, the antenna gain in the front direction may decrease.

[0098] Referring to FIG. 12b, a graph (1230) represents antenna gain depending on the presence or absence of a pillar structure for beamforming control. The horizontal axis of the graph (1230) represents frequency (unit: GHz (gigahertz)), and the vertical axis of the graph (1230) represents antenna gain (unit: dB). In the graph (1230), a first line (1231) represents the antenna gain of a sub-array in which the pillar structure is arranged on each antenna element. A second line (1232) represents the antenna gain of a sub-array in which the pillar structure is not arranged on each antenna element. A third line (1233) represents the antenna gain of a sub-array in which a microstrip patch is used as a radiator. Referring to the first line (1231), the second line (1232), and the third line (1233), it can be confirmed that the antenna gain of the first line (1231) is higher than the antenna gains of the other sub-arrays in the target frequency band (about 3.4 to about 4 GHz).

[0099] Referring to Fig. 12c, a graph (1260) represents the s-parameter of a sub-array in which a column structure for beamforming control is arranged. The horizontal axis of the graph (1260) represents the frequency (unit: GHz (gigahertz)), and the vertical axis of the graph (1260) represents the gain (unit: dB). In the graph (1260), a first line (1261) represents the reflection coefficient (e.g., S) for a first polarization (e.g., vertical polarization). 11 ) represents the reflection coefficient (e.g. S) for the second polarization (e.g. horizontal polarization). The second line (1262) represents the reflection coefficient (e.g. S) for the second polarization (e.g. horizontal polarization). 11 ) represents. For example, the reflection coefficient threshold for radiation may be about -14 dB. Referring to the first line (1261), the frequency values ​​corresponding to -14 dB may be about 3.30 GHz and about 4.09 GHz. Referring to the second line (1262), the frequency values ​​corresponding to -14 dB may be about 3.29 GHz and about 4.21 GHz. Referring to the first line (1261) and the second line (1262), it can be confirmed that a bandwidth of about 600 MHz or more is secured in the target frequency band (about 3.4 to about 4 GHz). The third line (1263) represents the isolation between the first polarization and the second polarization (e.g., S 21 ) is shown. If the isolation is below the reference value (e.g., approximately -18 dB), the polarization performance can be confirmed as normal. Referring to the third line (1233), normal isolation performance can be confirmed in the target frequency band (approximately 3.4 to approximately 4 GHz).

[0100] Figures 13a to 13d illustrate examples of antenna modules including a radiating structure for a dipole antenna. Figures 13a to 13d illustrate examples of antenna modules having an array antenna including the antenna elements described with reference to Figures 2a to 12c (e.g., the antenna elements (200) of Figures 2a to 2c, the antenna elements (200) of Figures 3a to 3c, and the antenna elements (200) of Figures 8a to 8c). The base station (110), the terminal (120), and / or other communication equipment (e.g., the MMU) of Figure 1 may include the antenna modules.

[0101] Referring to FIG. 13A, the antenna module may include an array antenna (1300). The array antenna (1300) may include a plurality of sub-arrays. For example, the array antenna (1300) may include a plurality of sub-arrays arranged in a horizontal direction (e.g., x-axis direction) and a vertical direction (e.g., y-axis direction). For example, the array antenna (1300) may include 8 sub-arrays arranged in the horizontal direction and 4 sub-arrays arranged in the vertical direction, for a total of 32 sub-arrays. The array antenna (1300) may include a sub-array (1310). The sub-array (1310) may include a plurality of antenna elements. For example, the sub-array (1310) may include three antenna elements. The three antenna elements may be arranged in one direction (e.g., y-axis direction).

[0102] Referring to FIG. 13b, a perspective view of a sub-array (1310) is illustrated. Referring to FIG. 13c, a plan view of the sub-array (1310) is illustrated. The sub-array (1310) may include a plurality of antenna elements. For example, the plurality of antenna elements may include a first antenna element (1331), a second antenna element (1332), and a third antenna element (1333). By way of example, the second antenna element (1332) is described as a reference. The second antenna element (1332) may include a support portion (202) and a substrate portion (201, e.g., a non-conductive substrate (210) and a metal pattern (215)). For a description of each antenna element of the plurality of antenna elements, reference may be made to the radiating structure for the antenna element (200) described in FIGS. 2a to 3c.

[0103] The sub-array (1310) may include at least one conductive pattern formed on the insulating plate (205). The at least one conductive pattern may include a first conductive pattern (1320a) and a second conductive pattern (1320b). The first conductive pattern (1320a) may be associated with a first polarization. A wireless communication circuit (e.g., an RFIC, a communication chip) may be configured to feed signals of the first polarization to the first conductive pattern (1320a). The second conductive pattern (1320b) may be associated with the second polarization. The wireless communication circuit may be configured to feed signals of the first polarization to the first conductive pattern (1320a). For example, the first polarization may be a V (vertical) polarization (vertical polarization) and the second polarization may be H (horizontal) polarization (horizontal polarization). For example, the first polarization may be a (+) approximately 45 degree polarization, and the second polarization may be a (-) approximately 45 degree polarization.

[0104] The first conductive pattern (1320a) may include three branches. Each branch may be provided as a feeding portion of an antenna element (e.g., a first antenna element (1331), a second antenna element (1332), and a third antenna element (1333)). For example, the first conductive pattern (1320a) may include a first branch (1321a) for the first polarization and the first antenna element (1331), a second branch (1322a) for the first polarization and the second antenna element (1332), and a third branch (1323a) for the first polarization and the third antenna element (1333). The second conductive pattern (1320b) may include three branches. Each branch may be provided as a feeding portion of an antenna element (e.g., a first antenna element (1331), a second antenna element (1332), and a third antenna element (1333)). For example, the second conductive pattern (1320b) may include a first branch (1321b) for the second polarization and the first antenna element (1331), a second branch (1322b) for the second polarization and the second antenna element (1332), and a third branch (1323b) for the second polarization and the third antenna element (1333). For the purposes of the descriptions of the radiating structure for the antenna element (200) described in FIGS. 2A to 3C, the second antenna element (1332) is exemplified. The second branch (1322b) of the second challenge pattern (1320b) can be connected to the second feed portion (232) for the second antenna element (1332).

[0105] Referring to FIG. 13d, a front view of a sub-array (1310) is illustrated. The sub-array (1310) may include a plurality of antenna elements. For example, the plurality of antenna elements may include a first antenna element (1331), a second antenna element (1332), and a third antenna element (1333). For a description of each antenna element of the plurality of antenna elements, reference may be made to the radiating structure for the antenna element (200) described in FIGS. 2a to 3c.

[0106] According to one embodiment, the second antenna element (1332) may include a support portion (202) for supporting a non-conductive substrate (210) of the substrate portion (201). The support portion (202) may be configured to support the non-conductive substrate (210) so as to be spaced apart from the insulating plate (205) in one direction (e.g., in the (+) z-axis direction). The second antenna element (1332) may include, in addition to the support portion (202), pillar structures (e.g., a first pillar structure (820a), a second pillar structure (820b), and a third pillar structure (820c)) as structures for controlling a beam width and / or beam gain.

[0107] In one embodiment, the second antenna element (1332) may include connecting structures (1372) (e.g., conductive vias) for connecting the support portion (202) and the insulating plate (205). The connecting structures (1372) may include a first connecting structure (1372a), a second connecting structure (1372b), a third connecting structure (1372c), and a fourth connecting structure (1372d). For example, the first connecting structure (1372a) and the second connecting structure (1372b) may be configured to connect the first side area (220a) of the support portion (202) and the insulating plate (205). For example, the third connecting structure (1372c) and the fourth connecting structure (1372d) may be configured to connect the second side area (220a) of the support portion (202) and the insulating plate (205). Each connecting structure may be configured to electrically connect the ground area of ​​the support portion (202) and the ground of the insulating plate (205). For example, the first connecting structure (1372a) and the second connecting structure (1372b) may be configured to electrically connect the first ground area (227a) and the ground of the insulating plate (205). For example, the third connecting structure (1372c) and the fourth connecting structure (1372d) may be configured to electrically connect the second ground area (227b) and the ground of the insulating plate (205).

[0108] FIG. 14 illustrates an example of functional components of an electronic device including a radiating structure for a dipole antenna. The electronic device (1410) may be the base station (110) of FIG. 1 or an MMU of the base station (110). However, unlike the illustration, it is not excluded that the electronic device (1410) of the present disclosure may be implemented in the terminal (120) of FIG. 1.

[0109] Referring to FIG. 14, an exemplary functional configuration of an electronic device (1410) is illustrated. The electronic device (1410) may include an antenna unit (1411), a filter unit (1412), an RF (radio frequency) processing unit (1413), and a processor (1414).

[0110] The antenna unit (1411) may include a plurality of antennas (e.g., the antenna elements (200) of FIGS. 2A to 2C, 3A to 3C, and 8A to 8C). The antenna performs functions for transmitting and receiving signals via a wireless channel. The antenna may include a radiator formed of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). The antenna may radiate an upconverted signal on a wireless channel or acquire a signal radiated by another device. Each antenna may be referred to as an antenna element or antenna element. In some embodiments, the antenna unit (1411) may include an antenna array in which a plurality of antenna elements form an array. The antenna unit (1411) may be electrically connected to the filter unit (1412) via RF signal lines. The antenna unit (1411) may be mounted on a PCB including a plurality of antenna elements. The PCB may include a plurality of RF signal lines connecting each antenna element and the filter of the filter unit (1412). These RF signal lines may be referred to as a feeding network.

[0111] The filter unit (1412) can perform filtering to transmit a signal of a desired frequency. The filter unit (1412) can perform a function to selectively identify a frequency by forming a resonance. The filter unit (1412) can include at least one of a band pass filter, a low pass filter, a high pass filter, or a band reject filter. That is, the filter unit (1412) can include RF circuits for obtaining a signal of a frequency band for transmission or a frequency band for reception. The filter unit (1412) according to various embodiments can electrically connect the antenna unit (1411) and the RF processing unit (1413).

[0112] The RF processing unit (1413) may include multiple RF paths. An RF path may be a unit of a path through which a signal received through an antenna or a signal radiated through an antenna passes. At least one RF path may be referred to as an RF chain. The RF chain may include multiple RF components. The RF components may include amplifiers, mixers, oscillators, DACs, ADCs, etc. For example, the RF processing unit (1413) may include an up converter that up-converts a baseband digital transmission signal to a transmission frequency, and a digital-to-analog converter (DAC) that converts the up-converted digital transmission signal to an analog RF transmission signal. The up converter and the DAC form part of a transmission path. The transmission path may further include a power amplifier (PA) or a coupler (or combiner). Also, for example, the RF processing unit (1413) may include an analog-to-digital converter (ADC) that converts an analog RF reception signal into a digital reception signal and a down converter that converts the digital reception signal into a baseband digital reception signal. The ADC and the down converter form part of a receiving path. The receiving path may further include a low-noise amplifier (LNA) or a coupler (or divider). The RF components of the RF processing unit (1413) may be implemented on a PCB. The base station (1410) may include a structure in which an antenna unit (1411) - a filter unit (1412) - an RF processing unit (1413) are stacked in that order. The antennas and the RF components of the RF processing unit (1413) may be implemented on a PCB, and filters may be repeatedly connected between PCBs to form a plurality of layers.For example, the RF processing unit (1413) may include a communication chip (e.g., RFIC).

[0113] The processor (1414) can control the overall operations of the electronic device (1410). The processor (1414) may be referred to as a control unit, a controller, or a control unit. The processor (1414) may include various modules for performing communication. The processor (1414) may include at least one processor, such as a modem. The processor (1414) may include modules for digital signal processing. For example, the processor (1414) may include a modem. When transmitting data, the processor (1414) generates complex symbols by encoding and modulating a transmission bit stream. In addition, for example, when receiving data, the processor (1414) restores a reception bit stream by demodulating and decoding a baseband signal. The processor (1414) may perform functions of a protocol stack required by a communication standard.

[0114] In FIG. 14, functional components of an electronic device (1410) are described as communication equipment including a dipole antenna according to embodiments of the present disclosure. However, the example illustrated in FIG. 14 is merely an exemplary configuration for the radiating structure of the antenna module described through FIGS. 1 to 13d and the utilization of the radiating structure, and embodiments of the present disclosure are not limited to the components of the equipment illustrated in FIG. 14. Accordingly, an antenna module including a radiating structure for a dipole antenna, communication equipment, and the radiating structure itself can also be understood as embodiments of the present disclosure.

[0115] In embodiments, an antenna module is provided. The antenna module may include an insulating plate (205) including at least one conductive pattern, and a plurality of radiating structures disposed on one surface of the insulating plate (205). Each radiating structure of the plurality of radiating structures may include a substrate portion (201) and a support portion (202) disposed between the substrate portion (201) and the insulating plate (205). The substrate portion (201) may include a non-conductive substrate (210) and a metal pattern (215) formed on the non-conductive substrate (210) and configured to radiate signals. The support portion (202) may include a plurality of side regions (220) and a feed region (230). The at least one conductive pattern may be electrically connected to a first feed portion (231) for a first polarization and a second feed portion (232) for a second polarization. The first power supply portion (231) may be arranged along at least one first side region among the plurality of side regions (220) of the support portion (202) and the power supply region (230). The second power supply portion (232) may be arranged along at least one second side region among the plurality of side regions (220) of the support portion (202) and the power supply region (230).

[0116] According to one embodiment, the plurality of side regions (220) of the support portion (202) may include a plurality of inner side surfaces and a plurality of outer side surfaces. The plurality of inner side surfaces may include at least one first side region and at least one second side region. A conductive portion for grounding may be formed on each outer surface of the plurality of outer side surfaces.

[0117] In one embodiment, at least a portion of the first power supply portion (231) may be disposed on a first surface of the power supply area (230) of the support portion (202). At least a portion of the second power supply portion (232) may be disposed on a second surface opposite to the first surface of the power supply area (230) of the support portion (202).

[0118] According to one embodiment, the plurality of side regions (220) may be arranged to connect between the substrate portion (201) and the insulating plate (205) in an inclined position according to a certain incline.

[0119] In one embodiment, the at least one conductive pattern may include a first conductive pattern for the first polarization and a second conductive pattern for the second polarization. The first conductive pattern may be electrically connected to the first feed portion (231). The second conductive pattern may be electrically connected to the second feed portion (232). The first polarization and the second polarization may be substantially perpendicular.

[0120] According to one embodiment, the first feed portion (231) may include a first feed segment formed on the one surface of the insulating plate (205), a second feed segment connecting the one surface of the insulating plate (205) and the other surface opposite to the one surface, a third feed segment formed on the other surface of the insulating plate (205), a fourth feed segment formed along one side area of ​​the at least one first side area of ​​the supporting portion (202), a fifth feed segment formed along the feed area (230) of the supporting portion (202), and a sixth feed segment formed along the other side area of ​​the at least one first side area of ​​the supporting portion (202).

[0121] According to one embodiment, the device may further include a first conductive via for electrically connecting the fourth power supply segment and the fifth power supply segment, and a second conductive via for electrically connecting the fifth power supply segment and the sixth power supply segment. Each of the first conductive via and the second conductive via may be arranged across the power supply region (230).

[0122] According to one embodiment, the second feed portion (232) may include a first feed segment formed on the one surface of the insulating plate (205), a second feed segment connecting the one surface and the other surface of the insulating plate (205), a third feed segment formed on the other surface of the insulating plate (205), a fourth feed segment formed along one side area of ​​the at least one second side area of ​​the supporting portion (202), a fifth feed segment formed along the feed area (230) of the supporting portion (202), and a sixth feed segment formed along the other side area of ​​the at least one second side area of ​​the supporting portion (202).

[0123] According to one embodiment, at least one via may be further included for connecting each side region of the plurality of side regions (220) to the insulating plate (205). The shape of the at least one via may include a rectangular cross-section.

[0124] According to one embodiment, the shape of the support portion (202) may be a frustum of a quadrangular pyramid. The area of ​​the power supply area (230) of the support portion (202) may be smaller than the area of ​​the area where the support portion (202) is coupled to the insulating plate (205).

[0125] According to one embodiment, the non-conductive substrate (210) of the substrate portion (201) and the support portion (202) may be formed integrally as a dielectric of the same material.

[0126] According to one embodiment, each side portion of the side regions of the support portion (202) may be arranged so that the substrate portion (201) maintains a constant distance from the insulating plate (205). The power supply region (230) of the support portion (202) may be arranged to be substantially parallel to the substrate portion (201).

[0127] According to one embodiment, the metal pattern (215) may include a first pattern portion, a second pattern portion, a third pattern portion, and a fourth pattern portion. Each of the first pattern portion, the second pattern portion, the third pattern portion, and the fourth pattern portion may be used as a radiator of a folded dipole antenna through the first feeding portion (231) and the second feeding portion (232) of the feeding region (230).

[0128] According to one embodiment, a plurality of pillar structures may be further included, which are arranged between the insulating plate (205) and the substrate portion (201). A conductive portion may be formed on at least a portion of each pillar structure of the plurality of pillar structures.

[0129] According to one embodiment, the plurality of pillar structures may be arranged to surround the support portion (202). The shape of the conductive portion may have a longest length in the direction from the insulating plate (205) to the substrate portion (201).

[0130] According to one embodiment, one side region of the plurality of side regions (220) of the support portion (202) and the insulating plate (205) may be coupled via at least one conductive via. The at least one conductive via may be configured to electrically connect a ground region formed on one surface of the one side region and a ground of the insulating plate (205).

[0131] In some embodiments, a communication device is provided. The communication device may include an antenna module including a processor (1414), at least one wireless communication circuit (1413), and a plurality of sub-arrays (1300). The antenna module may include, for each sub-array (1310), an insulating plate (205) including at least one conductive pattern, and a plurality of radiating structures disposed on one surface of the insulating plate (205). Each radiating structure of the plurality of radiating structures may include a substrate portion (201) and a support portion (202) disposed between the substrate portion (201) and the insulating plate (205). The substrate portion (201) may include a non-conductive substrate (210) and a metal pattern (215) formed on the non-conductive substrate (210) and configured to radiate signals. The support portion (202) may include a plurality of side regions (220) and a feed region (230). The at least one conductive pattern may be electrically connected to a first feed portion (231) for a first polarization and a second feed portion (232) for a second polarization. The first feed portion (231) may be arranged along at least one first side region (220) of the plurality of side regions (220) of the support portion (202) and the feed region (230). The second feed portion (232) may be arranged along at least one second side region (220) of the plurality of side regions (220) of the support portion (202) and the feed region (230).

[0132] According to one embodiment, each wireless communication circuit (1413) of the at least one wireless communication circuit (1413) may be configured to supply signals to two or more of the plurality of radiating structures.

[0133] According to one embodiment, the plurality of side regions (220) of the support portion (202) may include a plurality of inner side surfaces and a plurality of outer side surfaces. The plurality of inner side surfaces may include at least one first side region and at least one second side region. A conductive portion for grounding may be formed on each outer surface of the plurality of outer side surfaces.

[0134] In one embodiment, at least a portion of the first power supply portion (231) may be disposed on a first surface of the power supply area (230) of the support portion (202). At least a portion of the second power supply portion (232) may be disposed on a second surface opposite to the first surface of the power supply area (230) of the support portion (202).

[0135] The methods according to the embodiments described in the claims or specification of the present disclosure may be implemented in the form of hardware, software, or a combination of hardware and software.

[0136] When implemented in software, a computer-readable storage medium storing one or more programs (software modules) may be provided. The one or more programs stored in the computer-readable storage medium are configured to be executed by one or more processors in an electronic device. The one or more programs include instructions that cause the electronic device to execute methods according to embodiments described in the claims or specification of the present disclosure. The one or more programs may be provided as a computer program product. The computer program product may be traded between a seller and a buyer as a commodity. The computer program product may be distributed in the form of a machine-readable storage medium (e.g., compact disc read only memory (CD-ROM)), or may be distributed online (e.g., downloaded or uploaded) via an application store (e.g., Play Store™) or directly between two user devices (e.g., smart phones). In the case of online distribution, at least a portion of the computer program product may be temporarily stored or temporarily created in a device-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or an intermediary server.

[0137] These programs (software modules, software) may be stored in random access memory, non-volatile memory including flash memory, read only memory (ROM), electrically erasable programmable read only memory (EEPROM), magnetic disc storage devices, compact disc-ROMs (CD-ROMs), digital versatile discs (DVDs) or other forms of optical storage devices, magnetic cassettes, or may be stored in memories formed by a combination of some or all of these. In addition, each configuration memory may include multiple copies.

[0138] Additionally, the program may be stored on an attachable storage device that is accessible via a communication network, such as the Internet, an intranet, a local area network (LAN), a wide area network (WAN), a storage area network (SAN), or a combination thereof. Such a storage device may be connected to a device implementing an embodiment of the present disclosure via an external port. Additionally, a separate storage device on the communication network may be connected to a device implementing an embodiment of the present disclosure.

[0139] In the specific embodiments of the present disclosure described above, components included in the disclosure are expressed singularly or plurally, depending on the specific embodiment presented. However, the singular or plural expressions are selected to suit the presented situation for convenience of explanation, and the present disclosure is not limited to singular or plural components. Components expressed in plural may be composed of singular elements, or components expressed in singular may be composed of plural elements.

[0140] According to embodiments, one or more of the components or operations of the aforementioned components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (e.g., modules or programs) may be integrated into a single component. In such a case, the integrated component may perform one or more functions of each of the plurality of components identically or similarly to those performed by the corresponding component among the plurality of components prior to the integration. According to embodiments, the operations performed by a module, program, or other component may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

[0141] Meanwhile, although the detailed description of the present disclosure has described specific embodiments, it is obvious that various modifications are possible within the scope of the present disclosure.

Claims

1. In the antenna module, the antenna module, An insulating plate comprising at least one challenging pattern; and It comprises a plurality of radiating structures arranged on one surface of the above insulating plate, Each of the plurality of radiating structures includes a substrate portion and a support portion arranged between the substrate portion and the insulating plate, The above substrate portion includes a non-conductive substrate and a metal pattern formed on the non-conductive substrate and configured to radiate signals, The above support portion includes a plurality of side regions and a feeding region, The at least one of the above-mentioned challenging patterns is electrically connected to a first feed portion for a first polarization and a second feed portion for a second polarization, The first power supply portion is arranged along at least one first side region among the plurality of side regions of the support portion and the power supply region, The second power supply portion is arranged along at least one of the second side regions among the plurality of side regions of the support portion and the power supply region. Antenna module.

2. In claim 1, The plurality of side regions of the above support portion include a plurality of inner side surfaces and a plurality of outer side surfaces, The above plurality of inner side surfaces include at least one first side region and at least one second side region, A conductive portion for grounding is formed on each outer surface of the plurality of outer surfaces. Antenna module.

3. In claim 1, At least a portion of the first power supply portion is disposed on the first surface of the power supply area of ​​the support portion, At least a portion of the second power supply portion is disposed on a second surface opposite to the first surface of the power supply area of ​​the support portion. Antenna module.

4. In claim 1, the plurality of side regions are arranged to connect between the substrate portion and the insulating plate in an inclined position according to a constant incline. Antenna module.

5. In claim 1, wherein said at least one conductive pattern comprises a first conductive pattern for said first polarization and a second conductive pattern for said second polarization, The above first challenging pattern is electrically connected to the first power supply portion, The second conductive pattern is electrically connected to the second power supply portion, The first polarization and the second polarization are substantially perpendicular, Antenna module.

6. In claim 1, The above first power supply part: A first power supply segment formed on the above-mentioned one surface of the above-mentioned insulating plate, A second power supply segment connecting between said one side of said insulating plate and the other side opposite to said one side; A third power supply segment formed on the other surface of the insulating plate; A fourth feed segment formed along one of the side regions of the at least one first side region of the above support portion; A fifth feed segment formed along the feed area of ​​the above support portion; and Including a sixth feed segment formed along another side region among the at least one first side regions of the above support portion; Antenna module.

7. In claim 6, a first conductive via for electrically connecting the fourth power supply segment and the fifth power supply segment; and Further comprising a second conductive via for electrically connecting the fifth power supply segment and the sixth power supply segment; Each of the first conductive via and the second conductive via is arranged across the power supply region. Antenna module.

8. In claim 7, The second power supply part is: A first power supply segment formed on the above-mentioned one surface of the above-mentioned insulating plate, A second power supply segment connecting between said one side and said other side of said insulating plate; A third power supply segment formed on the other surface of the insulating plate; A fourth feed segment formed along one of the side regions of the at least one second side region of the above support portion; A fifth feed segment formed along the feed area of ​​the above support portion; and Including a sixth feed segment formed along another side region among the at least one second side regions of the above support portion; Antenna module.

9. In claim 1, Further comprising at least one via for connecting each side region of the plurality of side regions to the insulating plate, The shape of at least one of the vias comprises a rectangular cross-section, Antenna module.

10. In claim 1, The shape of the above support portion is a frustum of a quadrangular pyramid, The area of ​​the power supply region of the above support portion is smaller than the area of ​​the region where the support portion is combined with the insulating plate. Antenna module.

11. In claim 1, The non-conductive substrate of the above substrate portion and the support portion are formed integrally as a dielectric of the same material. Antenna module.

12. In claim 1, Each side portion of the side regions of the above support portion is arranged so that the substrate portion maintains a constant distance from the insulating plate, The power supply area of ​​the above support portion is arranged to be substantially parallel to the substrate portion. Antenna module.

13. In claim 1, The above metal pattern includes a first pattern portion, a second pattern portion, a third pattern portion, and a fourth pattern portion, Each of the first pattern portion, the second pattern portion, the third pattern portion, and the fourth pattern portion is used as a radiator of a folded dipole antenna through the first feed portion and the second feed portion of the feed region. Antenna module.

14. In claim 1, Further comprising a plurality of pillar structures arranged between the insulating plate and the substrate portion, A conductive portion is formed on at least a portion of each column structure of the plurality of column structures, The above plurality of pillar structures are arranged to surround the support portion, The shape of the above-mentioned conductive portion has the longest length in the direction from the insulating plate to the substrate portion. Antenna module.

15. In a communication device, the communication device, processor; At least one wireless communication circuit; and An antenna module comprising a plurality of sub-arrays, The above antenna module, for each sub-array: An insulating plate comprising at least one challenging pattern; and It comprises a plurality of radiating structures arranged on one surface of the above insulating plate, Each of the plurality of radiating structures includes a substrate portion and a support portion arranged between the substrate portion and the insulating plate, The above substrate portion includes a non-conductive substrate and a metal pattern formed on the non-conductive substrate and configured to radiate signals, The above support portion includes a plurality of side regions and a feeding region, The at least one of the above-mentioned challenging patterns is electrically connected to a first feed portion for a first polarization and a second feed portion for a second polarization, The first power supply portion is arranged along at least one first side region among the plurality of side regions of the support portion and the power supply region, The second power supply portion is arranged along at least one of the second side regions among the plurality of side regions of the support portion and the power supply region. Communication device.

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