Photosensitive resin composition, photosensitive resin film using same, display device, and method for manufacturing photosensitive resin film

Abstract

Provided are a photosensitive resin composition, a photosensitive resin film manufactured by using same, a display device comprising the photosensitive resin film, and a method for manufacturing the photosensitive resin film, wherein the photosensitive resin composition comprises: (A) a binder resin; (B) a photopolymerizable monomer; (C) a photopolymerization initiator; (D) an antioxidant; and (E) a solvent, wherein the binder resin and the photopolymerizable monomer have a weight ratio of 80:20 to 90:10 based on the total solid content of the photosensitive resin composition, and the antioxidant is contained in an amount of 2 wt% to 4 wt% based on the total solid content of the photosensitive resin composition.

Description

Photosensitive resin composition, photosensitive resin film using the same, display device, and method for manufacturing photosensitive resin film

[0001] The present invention relates to a photosensitive resin composition, a photosensitive resin film using the same, a display device, and a method for manufacturing the photosensitive resin film.

[0002]

[0003] Recently, interest in self-luminous micro OLED display panels that emit light on their own has been increasing as display panels applied to VR (Virtual Reality), AR (Augmented Reality), and MR (Mixed Reality) devices.

[0004] For micro OLED display panels, which have pixels about 10 times smaller than those of typical OLED display panels, it's difficult to precisely form red (R), green (G), and blue (B) emission layers using existing Fine Metal Mask (FMM) technology. In other words, the large pattern size of the color filter makes it difficult to increase resolution when applying existing liquid crystal displays to devices like VR and AR.

[0005] Recently, OLEDos (OLED on Silicon) technology has been introduced to achieve high resolutions of over 4000ppi. This technology uses OLEDs deposited on a silicon wafer as a backlight and patterns color filters on top of them. While color filters used in conventional liquid crystal displays are cured through exposure and a post-baking process at high temperatures of over 230℃, color filters on OLEDos cannot undergo high-temperature processes due to the OLED, so they must be cured at low temperatures. Micropatterning is also important to increase resolution. Due to the small size of VR and AR devices, micropatterning is essential to achieve the desired resolution within them.

[0006] However, because curing occurs only at low temperatures (below 100°C), color filters made from existing materials suffer from weak adhesion and residue generation. Therefore, research is ongoing into low-temperature curable, transparent materials with superior color filter adhesion and minimal residue.

[0007]

[0008] One embodiment is to provide a photosensitive resin composition that is sufficiently cured even at low temperatures, is transparent, has excellent adhesion to a color filter, and leaves little residue.

[0009] Another embodiment is to provide a photosensitive resin film manufactured using the photosensitive resin composition.

[0010] Another embodiment is to provide a display device including the photosensitive resin film.

[0011] Another embodiment is to provide a method for manufacturing the photosensitive resin film.

[0012]

[0013] One embodiment provides a photosensitive resin composition comprising (A) a binder resin; (B) a photopolymerizable monomer; (C) a photopolymerization initiator; (D) an antioxidant; and (E) a solvent, wherein the binder resin and the photopolymerizable monomer have a weight ratio of 80:20 to 90:10 based on the total solid content of the photosensitive resin composition, and the antioxidant is contained in an amount of 2 wt% to 4 wt% based on the total solid content of the photosensitive resin composition.

[0014] The above photosensitive resin composition may be transparent.

[0015] The above photosensitive resin composition may have a colorant-free composition.

[0016] The above binder resin may include an acrylic binder resin.

[0017] The above binder resin may have an acid value of 30 KOHmg / g to 180 KOHmg / g and a weight average molecular weight of 5000 g / mol to 20000 g / mol.

[0018] The above binder resin may be included in an amount of 20% to 40% by weight based on the total solid content of the photosensitive resin composition.

[0019] The above antioxidant can be represented by the following chemical formula 1.

[0020] [Chemical Formula 1]

[0021]

[0022] In the above chemical formula 1,

[0023] R 1 is a substituted or unsubstituted C1 to C20 alkyl group,

[0024] n and m are each independently integers from 1 to 4, provided that n+m = 3.

[0025] In the above chemical formula 1, n may be an integer of 2, and m may be an integer of 1.

[0026] The photosensitive resin composition may include, based on the total amount of the photosensitive resin composition, 10 to 30 wt% of the (A) binder resin; 0.1 to 10 wt% of the (B) photopolymerizable monomer; 0.01 to 5 wt% of the (C) photopolymerization initiator; 0.01 to 3 wt% of the (D) antioxidant; and the remainder of the (E) solvent.

[0027] The above photosensitive resin composition may further include an additive of malonic acid, 3-amino-1,2-propanediol, a silane coupling agent, a leveling agent, a surfactant, a polymerization inhibitor, or a combination thereof.

[0028] Another embodiment provides a photosensitive resin film manufactured using the photosensitive resin composition.

[0029] The above photosensitive resin film may be transparent.

[0030] Another embodiment provides a display device including the photosensitive resin film.

[0031] The display device may be a micro OLED display device including an OLED substrate deposited on a silicon wafer and a color filter layer positioned on the OLED substrate and converting white light generated from the OLED substrate into a plurality of color lights, wherein the photosensitive resin film of claim 11 is positioned between the OLED substrate and the color filter layer, and the color filter layer includes a red color filter, a green color filter, and a blue color filter.

[0032] Another embodiment provides a method for manufacturing a photosensitive resin film, comprising the steps of: applying the photosensitive resin composition; prebaking at a temperature of 100°C or lower after the application; exposing with an i-line after the prebaking; and developing.

[0033] Specific details of other aspects of the present invention are included in the detailed description below.

[0034]

[0035] [Beneficial Effects]

[0036] A photosensitive resin composition according to one embodiment is a transparent photosensitive resin composition that can be cured at a low temperature of 100°C or less, has excellent adhesion to a color filter, and generates little residue. Since the aforementioned effect can be achieved only with a pre-bake temperature of 100°C or less and photocuring (i-line exposure), the photosensitive resin composition can be suitably applied as a protective adhesive layer in a micro OLED display device capable of implementing a fine pattern.

[0037]

[0038] Figure 1 is an optical microscope photograph that can confirm the pattern straightness of a photosensitive resin film manufactured using a photosensitive resin composition according to Example 1.

[0039] Figure 2 is an optical microscope photograph that can confirm the pattern straightness of a photosensitive resin film manufactured using a photosensitive resin composition according to Comparative Example 1.

[0040] Figure 3 is an optical microscope photograph that can confirm the pattern straightness of a photosensitive resin film manufactured using a photosensitive resin composition according to Comparative Example 2.

[0041] Figure 4 is an optical microscope photograph that can confirm the pattern straightness of a photosensitive resin film manufactured using a photosensitive resin composition according to Comparative Example 3.

[0042] FIG. 5 is an optical microscope photograph that can confirm the residue characteristics of a photosensitive resin film manufactured using a photosensitive resin composition according to Example 1.

[0043] Figure 6 is an optical microscope photograph that can confirm the residue characteristics of a photosensitive resin film manufactured using a photosensitive resin composition according to Comparative Example 1.

[0044] Figure 7 is an optical microscope photograph that can confirm the residue characteristics of a photosensitive resin film manufactured using a photosensitive resin composition according to Comparative Example 2.

[0045] Figure 8 is an optical microscope photograph that can confirm the residue characteristics of a photosensitive resin film manufactured using a photosensitive resin composition according to Comparative Example 3.

[0046] Fig. 9 is a schematic diagram showing the structure of a micro OLED display device according to one embodiment.

[0047]

[0048] Hereinafter, embodiments of the present invention will be described in detail. However, these are presented as examples and are not intended to limit the present invention. The present invention is defined solely by the scope of the claims set forth below.

[0049] Unless otherwise specified herein, "alkyl group" means a C1 to C20 alkyl group, "alkenyl group" means a C2 to C20 alkenyl group, "cycloalkenyl group" means a C3 to C20 cycloalkenyl group, "heterocycloalkenyl group" means a C3 to C20 heterocycloalkenyl group, "aryl group" means a C6 to C20 aryl group, "arylalkyl group" means a C6 to C20 arylalkyl group, "alkylene group" means a C1 to C20 alkylene group, "arylene group" means a C6 to C20 arylene group, "alkylarylene group" means a C6 to C20 alkylarylene group, "heteroarylene group" means a C3 to C20 heteroarylene group, and "alkoxylene group" means a C1 to C20 It refers to an alkoxylene group.

[0050] Unless otherwise specified herein, "substitution" means that at least one hydrogen atom is substituted with a halogen atom (F, Cl, Br, I), a hydroxy group, a C1 to C20 alkoxy group, a nitro group, a cyano group, an amine group, an imino group, an azido group, an amidino group, a hydrazino group, a hydrazono group, a carbonyl group, a carbamyl group, a thiol group, an ester group, an ether group, a carboxyl group or a salt thereof, a sulfonic acid group or a salt thereof, a phosphoric acid or a salt thereof, a C1 to C20 alkyl group, a C2 to C20 alkenyl group, a C2 to C20 alkynyl group, a C6 to C20 aryl group, a C3 to C20 cycloalkyl group, a C3 to C20 cycloalkenyl group, a C3 to C20 cycloalkynyl group, a C2 to C20 heterocycloalkyl group, a C2 to C20 heterocycloalkenyl group, a C2 It means substituted with a C20 heterocycloalkynyl group, a C3 to C20 heteroaryl group, or a combination thereof.

[0051] Additionally, unless otherwise specified herein, “hetero” means that the chemical formula contains at least one heteroatom of at least one of N, O, S, and P.

[0052] Additionally, unless otherwise specified herein, “(meth)acrylate” means both “acrylate” and “methacrylate”, and “(meth)acrylic acid” means both “acrylic acid” and “methacrylic acid”.

[0053] Unless otherwise defined herein, "combination" means a mixture or copolymerization. In addition, "copolymerization" means a block copolymerization or a random copolymerization, and "copolymer" means a block copolymer or a random copolymer.

[0054] Unless otherwise defined in the chemical formulas herein, if a chemical bond is not drawn at a position where a chemical bond should be drawn, it means that a hydrogen atom is bonded at that position.

[0055] Unless otherwise defined herein, “*” means a part connected to the same or different atoms or chemical formulas.

[0056]

[0057] A photosensitive resin composition according to one embodiment comprises (A) a binder resin; (B) a photopolymerizable monomer; (C) a photopolymerization initiator; (D) an antioxidant; and (E) a solvent, wherein the binder resin and the photopolymerizable monomer have a weight ratio of 80:20 to 90:10 based on the total solid content of the photosensitive resin composition, and the antioxidant is contained in an amount of 2 wt% to 4 wt% based on the total solid content of the photosensitive resin composition.

[0058] Conventional color photoresists are negative-type photosensitive liquid materials that are implemented with color patterns of red, green, and blue. Technological development has been carried out toward slightly modifying the composition of the liquid material. For example, efforts have been continuously made to improve color purity by modifying the type or content of pigment dispersions, which are color materials that implement the color pattern, to improve patternability by modifying the composition of binder resins or photopolymerization initiators, and to improve coatability or color uniformity by using other additives such as leveling agents.

[0059] The present invention is not an invention for a color photoresist used in the manufacture of conventional color filters as described above, but rather an invention for an adhesive protection layer applicable to a micro OLED display device. The adhesive protection layer has excellent adhesive strength to a low-temperature curing color filter, and thus can be applied to a display device including the low-temperature curing color filter.

[0060] Micro Display is a technology that transmits image information through an optical system on a display with a screen size of 1 inch or less. Because high resolution must be achieved in a very small area, a CMOS backplane on a Si wafer substrate is used. Micro OLED Displays, on the other hand, rely on OLEDs for backlighting, requiring low-temperature curing color filters. Meanwhile, as pixel sizes decrease, high-sensitivity materials are required for accurate color reproduction.

[0061] In the existing semiconductor CMOS process, HDMS deposition was used for color filter adhesion, but since this is not a low-temperature curing process, much research has been conducted on alternative materials to solve this problem. After extensive research, the inventors of the present invention developed a low-temperature curing type protective adhesive layer (APL; adhesion & Protective Layer) and completed the present invention.

[0062] Specifically, the photosensitive resin composition according to one embodiment is a low-temperature curable transparent material, has high adhesion to a color filter, and leaves little residue. In particular, because it is a transparent material, it is suitable for application to next-generation displays such as VR (Virtual Reality), AR (Augmented Reality), and MR (Mixed Reality), which require transparency (crack prevention) and precise patterning to fit a required area, such as micro OLED display devices. That is, the photosensitive resin composition according to one embodiment may be a colorant-free composition, such as a transparent photosensitive resin composition, and thus may also have excellent transmittance.

[0063] More specifically, the photosensitive resin composition according to one embodiment can improve residue characteristics and adhesive strength by controlling the solid content ratio of the binder resin and the photopolymerizable monomer, and further, can control the patterning sensitivity difference by using an antioxidant as an essential component for precise patterning and controlling the amount of the antioxidant used.

[0064] Each component is described in detail below.

[0065]

[0066] (A) Binder resin

[0067] As described above, the photosensitive resin composition according to one embodiment includes a binder resin and a photopolymerizable monomer, and by controlling the solid content weight ratio of the two, the residue characteristics and adhesion to the color filter can be significantly improved. Specifically, based on the total solid content of the photosensitive resin composition, the binder resin and the photopolymerizable monomer can have a weight ratio of 80:20 to 90:10, for example, a weight ratio of 85:25 to 90:10.

[0068] The above binder resin may include an acrylic binder resin.

[0069] The above acrylic binder resin is a copolymer of a first ethylenically unsaturated monomer and a second ethylenically unsaturated monomer copolymerizable therewith, and is a resin containing one or more acrylic repeating units.

[0070] The above first ethylenically unsaturated monomer is an ethylenically unsaturated monomer containing one or more carboxyl groups, and specific examples thereof include acrylic acid, methacrylic acid, maleic acid, itaconic acid, fumaric acid, or a combination thereof.

[0071] The first ethylenically unsaturated monomer may be included in an amount of 5 wt% to 50 wt%, for example, 10 wt% to 40 wt%, based on the total amount of the acrylic binder resin.

[0072] The second ethylenically unsaturated monomer is an aromatic vinyl compound such as styrene, α-methylstyrene, vinyltoluene, vinylbenzylmethylether, etc.; an unsaturated carboxylic acid ester compound such as methyl(meth)acrylate, ethyl(meth)acrylate, butyl(meth)acrylate, 2-hydroxyethyl(meth)acrylate, 2-hydroxybutyl(meth)acrylate, benzyl(meth)acrylate, cyclohexyl(meth)acrylate, phenyl(meth)acrylate, etc.; an unsaturated carboxylic acid aminoalkyl ester compound such as 2-aminoethyl(meth)acrylate, 2-dimethylaminoethyl(meth)acrylate, etc.; a carboxylic acid vinyl ester compound such as vinyl acetate, vinyl benzoate, etc.; an unsaturated carboxylic acid glycidyl ester compound such as glycidyl(meth)acrylate, etc. Examples include cyanide vinyl compounds such as (meth)acrylonitrile; unsaturated amide compounds such as (meth)acrylamide; etc., and these may be used alone or in combination of two or more.

[0073] Specific examples of the above acrylic binder resin include, but are not limited to, (meth)acrylic acid / benzyl methacrylate copolymer, (meth)acrylic acid / benzyl methacrylate / styrene copolymer, (meth)acrylic acid / benzyl methacrylate / 2-hydroxyethyl methacrylate copolymer, (meth)acrylic acid / benzyl methacrylate / styrene / 2-hydroxyethyl methacrylate copolymer, etc., and these may be used alone or in combination of two or more.

[0074] The above acrylic binder resin may have an acid value of 30 KOHmg / g to 180 KOHmg / g and a weight average molecular weight of 3,000 g / mol to 20,000 g / mol. When the acid value and weight average molecular weight of the acrylic binder resin are within the above ranges, the acrylic binder resin has excellent pattern forming properties, and the produced thin film may have excellent mechanical and thermal properties.

[0075] The above binder resin may further include an epoxy-based binder resin.

[0076] The above binder resin can improve heat resistance by further including an epoxy-based binder resin. Examples of the epoxy-based binder resin include, but are not limited to, phenol novolac epoxy resin, tetramethyl biphenyl epoxy resin, bisphenol A-type epoxy resin, bisphenol F-type epoxy resin, alicyclic epoxy resin, or combinations thereof.

[0077] Furthermore, the binder resin including the above epoxy-based binder resin ensures dispersion stability of a coloring agent such as a pigment, which will be described later, and helps form pixels of a desired resolution during the developing process.

[0078] The above epoxy-based binder resin may be included in an amount of 1 wt% to 10 wt%, for example, 5 wt% to 10 wt%, based on the total amount of the binder resin. When the epoxy-based binder resin is included in the above range, the film remaining rate and chemical resistance can be significantly improved.

[0079] The epoxy equivalent weight of the above epoxy binder resin may be 150 g / eq to 200 g / eq. When an epoxy binder resin having an epoxy equivalent weight within the above range is included in the binder resin, there is a beneficial effect of improving the curing degree of the formed pattern and fixing the colorant within the structure in which the pattern is formed.

[0080] The above binder resin can be dissolved in a solvent described below in a solid form to form a photosensitive resin composition. In this case, the binder resin in solid form may be present in an amount of about 0.1 wt% to 30 wt%, for example, 20 wt% to 30 wt%, based on the total amount of the binder resin solution dissolved in the solvent.

[0081] In addition, the binder resin may be included in an amount of 10 wt% to 30 wt%, specifically 15 wt% to 25 wt%, based on the total amount of the photosensitive resin composition, and may be included in an amount of 20 wt% to 40 wt%, specifically 25 wt% to 35 wt%, based on the total solid content of the photosensitive resin composition. When the binder resin is included within the above range, excellent sensitivity, developability, resolution, and straightness of a pattern can be obtained.

[0082]

[0083] (B) Photopolymerizable monomer

[0084] The photopolymerizable monomer in the photosensitive resin composition according to one embodiment may be a single compound or a mixture of two different compounds.

[0085] When the above photopolymerizable monomer is a mixture of two different compounds, one of the two compounds may be a compound containing at least two functional groups represented by the following chemical formula 2.

[0086] [Chemical Formula 2]

[0087]

[0088] In the above chemical formula 2,

[0089] R 6 is a hydrogen atom or a substituted or unsubstituted C1 to C10 alkyl group,

[0090] L 8 is a single bond or a substituted or unsubstituted C1 to C10 alkylene group.

[0091] For example, a compound containing at least two functional groups represented by the above chemical formula 2 may contain two to six functional groups represented by the above chemical formula 2. In this case, sufficient polymerization can occur upon exposure in the pattern forming process, thereby forming a pattern having excellent heat resistance, light resistance, and chemical resistance.

[0092] For example, a compound containing at least two functional groups represented by the above chemical formula 2 may be a compound represented by the following chemical formula 3 or the following chemical formula 4.

[0093] [Chemical Formula 3]

[0094]

[0095] [Chemical Formula 4]

[0096]

[0097] In the above chemical formulas 3 and 4,

[0098] p, q, r and s are each independently integers from 1 to 10.

[0099] When the above photopolymerizable monomer is a mixture of two different compounds, the other one of the two compounds may be a monofunctional or polyfunctional ester compound of (meth)acrylic acid having at least one ethylenically unsaturated double bond.

[0100] The monofunctional or polyfunctional ester compound of (meth)acrylic acid having at least one ethylenically unsaturated double bond is, for example, ethylene glycol di(meth)acrylate, diethylene glycol di(meth)acrylate, triethylene glycol di(meth)acrylate, propylene glycol di(meth)acrylate, neopentyl glycol di(meth)acrylate, 1,4-butanediol di(meth)acrylate, 1,6-hexanediol di(meth)acrylate, bisphenol A di(meth)acrylate, pentaerythritol di(meth)acrylate, pentaerythritol tri(meth)acrylate, pentaerythritol tetra(meth)acrylate, pentaerythritol hexa(meth)acrylate, dipentaerythritol di(meth)acrylate, It may be dipentaerythritol tri(meth)acrylate, dipentaerythritol penta(meth)acrylate, dipentaerythritol hexa(meth)acrylate, bisphenol A epoxy(meth)acrylate, ethylene glycol monomethyl ether (meth)acrylate, trimethylolpropane tri(meth)acrylate, tris(meth)acryloyloxyethyl phosphate, novolac epoxy (meth)acrylate, or a combination thereof.

[0101] Examples of commercially available products of monofunctional or polyfunctional ester compounds of (meth)acrylic acid having at least one ethylenically unsaturated double bond are as follows. An example of the monofunctional ester of (meth)acrylic acid is Aronix M-101 from Toagosei Chemical Industry Co., Ltd. ® , East M-111 ® , East M-114 ® KAYARAD TC-110S from Nihon Kayaku Co., Ltd. ® , Dong TC-120S ® Back; V-158 of Osaka Yukigaku Kogyo Co., Ltd. ® , V-2311 ® Examples of the bifunctional ester of the above (meth)acrylic acid include Aronix M-210 from Toagosei Chemical Co., Ltd. ® , East M-240 ® , East M-6200 ®KAYARAD HDDA from Nihonga Kayaku Co., Ltd. ® , Dong HX-220 ® , East R-604 ® Back; V-260 from Osaka Yukigaku Kogyo Co., Ltd. ® , V-312 ® , V-335 HP ® Examples of the trifunctional ester of the above (meth)acrylic acid include Aronix M-309 from Toagosei Chemical Co., Ltd. ® , East M-400 ® , East M-405 ® , East M-450 ® , East M-7100 ® , East M-8030 ® , East M-8060 ® KAYARAD TMPTA from Nihonga Kayaku Co., Ltd. ® , East DPCA-20 ® , East-30 ® , East-60 ® , East-120 ® Back; V-295 of Osaka Yukigayaku Kogyo Co., Ltd. ® , East-300 ® , East-360 ® , Dong-GPT ® , Dong-3PA ® , East-400 ® The above products can be used alone or in combination of two or more.

[0102] The above photopolymerizable monomer may be used after being treated with an acid anhydride to provide better developing properties.

[0103] The photopolymerizable monomer may be included in an amount of 0.1 wt% to 10 wt%, for example 0.1 wt% to 5 wt%, for example 0.5 wt% to 3 wt%, based on the total amount of the photosensitive resin composition. When the photopolymerizable monomer is included within the above range, sufficient curing occurs upon exposure in the pattern forming process, resulting in excellent reliability, excellent heat resistance, light resistance, and chemical resistance of the pattern, and also excellent resolution and adhesion.

[0104]

[0105] (C) Photopolymerization initiator

[0106] A photosensitive resin composition according to one embodiment includes a photopolymerization initiator. The photopolymerization initiator may be an acetophenone-based compound, a benzophenone-based compound, a thioxanthone-based compound, a benzoin-based compound, a triazine-based compound, an oxime-based compound, or the like.

[0107] Examples of the above acetophenone compounds include 2,2'-diethoxy acetophenone, 2,2'-dibutoxy acetophenone, 2-hydroxy-2-methylpropiophenone, pt-butyltrichloro acetophenone, pt-butyldichloro acetophenone, 4-chloro acetophenone, 2,2'-dichloro-4-phenoxy acetophenone, 2-methyl-1-(4-(methylthio)phenyl)-2-morpholinopropan-1-one, 2-benzyl-2-dimethylamino-1-(4-morpholinophenyl)-butan-1-one, etc.

[0108] Examples of the above benzophenone compounds include benzophenone, benzoyl benzoate, methyl benzoyl benzoate, 4-phenyl benzophenone, hydroxy benzophenone, acrylated benzophenone, 4,4'-bis(dimethylamino)benzophenone, 4,4'-bis(diethylamino)benzophenone, 4,4'-dimethylaminobenzophenone, 4,4'-dichlorobenzophenone, 3,3'-dimethyl-2-methoxybenzophenone, etc.

[0109] Examples of the above thioxanthone compounds include thioxanthone, 2-chlorothioxanthone, 2-methylthioxanthone, isopropyl thioxanthone, 2,4-diethyl thioxanthone, 2,4-diisopropyl thioxanthone, etc.

[0110] Examples of the above benzoin compounds include benzoin, benzoin methyl ether, benzoin ethyl ether, benzoin isopropyl ether, benzoin isobutyl ether, benzyldimethyl ketal, etc.

[0111] Examples of the above triazine compounds include 2,4,6-trichloro-s-triazine, 2-phenyl 4,6-bis(trichloromethyl)-s-triazine, 2-(3',4'-dimethoxystyryl)-4,6-bis(trichloromethyl)-s-triazine, 2-(4'-methoxynaphthyl)-4,6-bis(trichloromethyl)-s-triazine, 2-(p-methoxyphenyl)-4,6-bis(trichloromethyl)-s-triazine, 2-(p-tolyl)-4,6-bis(trichloromethyl)-s-triazine, 2-biphenyl 4,6-bis(trichloromethyl)-s-triazine, bis(trichloromethyl)-6-styryl-s-triazine, Examples include 2-(naphtho-1-yl)-4,6-bis(trichloromethyl)-s-triazine, 2-(4-methoxynaphtho-1-yl)-4,6-bis(trichloromethyl)-s-triazine, 2-4-bis(trichloromethyl)-6-piperonyl-s-triazine, and 2-4-bis(trichloromethyl)-6-(4-methoxystyryl)-s-triazine.

[0112] Examples of the above oxime compounds include O-acyloxime compounds, 2-(O-benzoyloxime)-1-[4-(phenylthio)phenyl]-1,2-octanedione, 1-(O-acetyloxime)-1-[9-ethyl-6-(2-methylbenzoyl)-9H-carbazol-3-yl]ethanone, O-ethoxycarbonyl-α-oxyamino-1-phenylpropan-1-one, etc. Specific examples of the O-acyl oxime compounds include 1,2-octanedione, 2-dimethylamino-2-(4-methylbenzyl)-1-(4-morpholin-4-yl-phenyl)-butan-1-one, 1-(4-phenylsulfanylphenyl)-butane-1,2-dione-2-oxime-O-benzoate, 1-(4-phenylsulfanylphenyl)-octane-1,2-dione-2-oxime-O-benzoate, 1-(4-phenylsulfanylphenyl)-octane-1-one oxime-O-acetate, and 1-(4-phenylsulfanylphenyl)-butan-1-one oxime-O-acetate.

[0113] In addition to the above compound, the photopolymerization initiator may also include a carbazole compound, a diketone compound, a sulfonium borate compound, a diazo compound, an imidazole compound, a biimidazole compound, etc.

[0114] The photopolymerization initiator may be included in an amount of 0.01 wt% to 5 wt%, for example, 0.1 wt% to 3 wt%, based on the total amount of the photosensitive resin composition. When the photopolymerization initiator is included within the above range, sufficient photopolymerization occurs upon exposure in the pattern formation process for manufacturing a color filter, resulting in excellent sensitivity and improved transmittance.

[0115] (D) Antioxidant

[0116] A photosensitive resin composition according to one embodiment includes an antioxidant, and specifically, by controlling the content (weight) of the antioxidant, the patternability of the transparent photosensitive resin composition can be significantly improved.

[0117] For example, the antioxidant may be represented by the following chemical formula 1.

[0118] [Chemical Formula 1]

[0119]

[0120] In the above chemical formula 1,

[0121] R1 is a substituted or unsubstituted C1 to C20 alkyl group,

[0122] n and m are each independently integers from 1 to 4, provided that n+m = 3.

[0123] For example, in the above chemical formula 1, n may be an integer of 2, and m may be an integer of 1.

[0124] For example, the compound represented by the above chemical formula 1 may be hydroquinone, methyl hydroquinone, methoxyhydroquinone, t-butyl hydroquinone, 2,5-di-t-butyl hydroquinone, 2,5-bis(1,1-dimethylbutyl) hydroquinone, 2,5-bis(1,1,3,3-tetramethylbutyl) hydroquinone, etc., but is not necessarily limited thereto.

[0125] When the compound represented by the above chemical formula 1 is used as an antioxidant, a very excellent effect in improving pattern properties can be obtained compared to when a compound not represented by the above chemical formula 1 is used as an antioxidant, and in particular, in the case of a transparent photosensitive resin composition, the effect of improving pattern properties can be maximized.

[0126]

[0127] (E) solvent

[0128] The solvent may be a material that is compatible with, but does not react with, the binder resin, the photopolymerizable monomer, the photopolymerization initiator, and the antioxidant.

[0129] Examples of the solvent include alcohols such as methanol and ethanol; ethers such as dichloroethyl ether, n-butyl ether, diisoamyl ether, methylphenyl ether, and tetrahydrofuran; glycol ethers such as ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, and ethylene glycol dimethyl ether; cellosolve acetates such as methyl cellosolve acetate, ethyl cellosolve acetate, and diethyl cellosolve acetate; carbitols such as methyl ethyl carbitol, diethyl carbitol, diethylene glycol monomethyl ether, diethylene glycol monoethyl ether, diethylene glycol dimethyl ether, diethylene glycol ethyl methyl ether, and diethylene glycol diethyl ether; propylene glycol alkyl ether acetates such as propylene glycol methyl ether acetate and propylene glycol propyl ether acetate; aromatic hydrocarbons such as toluene and xylene; Ketones such as methyl ethyl ketone, cyclohexanone, 4-hydroxy-4-methyl-2-pentanone, methyl-n-propyl ketone, methyl-n-butyl ketone, methyl-n-amyl ketone, and 2-heptanone; Saturated aliphatic monocarboxylic acid alkyl esters such as ethyl acetate, n-butyl acetate, and isobutyl acetate; Lactic acid esters such as methyl lactate and ethyl lactate; Oxyacetic acid alkyl esters such as methyl oxyacetate, ethyl oxyacetate, and butyl oxyacetate; Alkoxyacetic acid alkyl esters such as methyl methoxyacetate, ethyl methoxyacetate, butyl methoxyacetate, methyl ethoxyacetate, and ethyl ethoxyacetate; 3-oxypropionic acid alkyl esters such as methyl 3-oxypropionate and ethyl 3-oxypropionate; 3-Alkoxypropionic acid alkyl esters such as methyl 3-methoxypropionate, ethyl 3-methoxypropionate, ethyl 3-ethoxypropionate, and methyl 3-ethoxypropionate; 2-oxypropionic acid alkyl esters such as methyl 2-oxypropionate, ethyl 2-oxypropionate, and propyl 2-oxypropionate; 2-alkoxypropionic acid alkyl esters such as methyl 2-methoxypropionate, ethyl 2-methoxypropionate, ethyl 2-ethoxypropionate, and methyl 2-ethoxypropionate;2-oxy-2-methylpropionic acid esters such as methyl 2-oxy-2-methylpropionate, ethyl 2-oxy-2-methylpropionate, etc., monooxymonocarboxylic acid alkyl esters of 2-alkoxy-2-methylpropionic acid alkyls such as methyl 2-methoxy-2-methylpropionate, ethyl 2-ethoxy-2-methylpropionate, etc.; esters such as ethyl 2-hydroxypropionate, ethyl 2-hydroxy-2-methylpropionate, ethyl hydroxyacetate, and methyl 2-hydroxy-3-methylbutanoate; Ketone esters such as ethyl pyruvate, etc., and also high boiling point solvents such as N-methylformamide, N,N-dimethylformamide, N-methylformanilide, N-methylacetamide, N,N-dimethylacetamide, N-methylpyrrolidone, dimethyl sulfoxide, benzyl ethyl ether, dihexyl ether, acetylacetone, isophorone, caproic acid, caprylic acid, 1-octanol, 1-nonanol, benzyl alcohol, benzyl acetate, ethyl benzoate, diethyl oxalate, diethyl maleate, γ-butyrolactone, ethylene carbonate, propylene carbonate, and phenyl cellosolve acetate can be mentioned.;

[0130] Among these, glycol ethers such as ethylene glycol monoethyl ether, ethylene glycol dimethyl ether, ethylene glycol diethyl ether, and diethylene glycol ethyl methyl ether, taking compatibility and reactivity into consideration; ethylene glycol alkyl ether acetates such as ethyl cellosolve acetate; esters such as ethyl 2-hydroxypropionate; carbitols such as diethylene glycol monomethyl ether; and propylene glycol alkyl ether acetates such as propylene glycol monomethyl ether acetate and propylene glycol propyl ether acetate can be used.

[0131] The solvent may be included as a remainder, for example, 50 wt% to 90 wt%, for example, 60 wt% to 80 wt%, for example, 70 wt% to 80 wt%, based on the total amount of the photosensitive resin composition. When the solvent is included within the above range, the photosensitive resin composition has an appropriate viscosity, thereby providing excellent processability in the production of the photosensitive resin film.

[0132]

[0133] (F) Other additives

[0134] Meanwhile, the photosensitive resin composition may further include an additive such as malonic acid, 3-amino-1,2-propanediol, a silane coupling agent, a leveling agent, a surfactant, a polymerization inhibitor, or a combination thereof.

[0135] The above silane coupling agent may have a reactive substituent such as a vinyl group, a carboxyl group, a methacryloxy group, an isocyanate group, or an epoxy group to improve adhesion to a substrate, etc. However, even if a silane coupling agent is used, since the photosensitive resin composition according to one embodiment is a colorant-free composition, i.e., a transparent photosensitive resin composition, if the mixing weight ratio between the binder resin and the photopolymerizable monomer is not controlled as described above, the effect of improving adhesion to the color filter may not be obtained.

[0136] Examples of the above silane coupling agent include trimethoxysilylbenzoic acid, γ-methacryloxypropyltrimethoxysilane, vinyltriacetoxysilane, vinyltrimethoxysilane, γ-isocyanatepropyltriethoxysilane, γ-glycidoxypropyltrimethoxysilane, β-(3,4-epoxycyclohexyl)ethyltrimethoxysilane, etc., and these may be used alone or in combination of two or more.

[0137] The above silane coupling agent may be included in an amount of 0.01 to 10 parts by weight per 100 parts by weight of the photosensitive resin composition. When the silane coupling agent is included within the above range, adhesion, storability, etc. are excellent.

[0138] In addition, the photosensitive resin composition may further include a surfactant, such as a fluorine-based surfactant and / or a silicone-based surfactant, to improve coating properties and prevent defects, if necessary.

[0139] As the above fluorinated surfactant, BM Chemie's BM-1000 ® , BM-1100 ®Mecha Pack F 142D from Dai Nippon Ink Kagaku Kogyo Co., Ltd. ® , East F 172 ® , East F 173 ® , East F 183 ® , East F 554 ® , East F 556 ® Back; Prorad FC-135 from Sumitomo Reem Co., Ltd. ® , East FC-170C ® , East FC-430 ® , East FC-431 ® Saffron S-112 from Asahi Glass Co., Ltd. ® , East S-113 ® , East S-131 ® , East S-141 ® , East S-145 ® SH-28PA from Toray Silicone Co., Ltd. ® , East-190 ® , East-193 ® , SZ-6032 ® , SF-8428 ® You can use products sold under the names of etc.

[0140] As the above silicone-based surfactant, those commercially available under the names BYK-307, BYK-333, BYK-361N, BYK-051, BYK-052, BYK-053, BYK-067A, BYK-077, BYK-301, BYK-322, BYK-325, etc. from BYK Chem can be used.

[0141] The above surfactant may be used in an amount of 0.001 to 5 parts by weight per 100 parts by weight of the photosensitive resin composition. When the above surfactant is included within the above range, coating uniformity is ensured, no staining occurs, and wetting on an IZO substrate or glass substrate is excellent.

[0142] The above polymerization inhibitor may include, but is not necessarily limited to, a catechol-based compound. Since the photosensitive resin composition according to one embodiment further includes the catechol-based compound, crosslinking at room temperature can be prevented during exposure after coating the photosensitive resin composition.

[0143] For example, the catechol compound may include, but is not necessarily limited to, catechol, t-butyl catechol, 4-methoxyphenol, pyrogallol, 2,6-di-t-butyl-4-methylphenol, 2-naphthol, and tris(N-hydroxy-N-nitrosophenylaminato-O,O')aluminium.

[0144] The catechol compound may be used in the form of a dispersion, and the polymerization inhibitor in the form of the dispersion may be included in an amount of 0.001 wt% to 3 wt%, for example, 0.01 wt% to 1 wt%, based on the total amount of the photosensitive resin composition. When the polymerization inhibitor is included within the above range, the problem of aging at room temperature can be solved, while at the same time preventing a decrease in sensitivity and surface peeling.

[0145] In addition, the photosensitive resin composition may have a certain amount of other additives, such as stabilizers, added to it within a range that does not impair the physical properties.

[0146] The photosensitive resin composition according to one embodiment may be of a positive type or a negative type, but it is more preferable to be of a negative type in order to more completely remove residues in the area where the pattern is exposed after exposure and development of the composition having light-blocking properties.

[0147]

[0148] Another embodiment provides a photosensitive resin film manufactured by low-temperature curing, exposure, and development of the aforementioned photosensitive resin composition. Compared to conventional LCD or semiconductor processes, this film differs in that a post-curing (post-baking) process is not required.

[0149] The method for manufacturing the above photosensitive resin film is as follows.

[0150] (1) Application and film formation stage (low temperature curing)

[0151] The photosensitive resin composition is applied to a substrate such as a glass substrate or an ITO substrate that has undergone a predetermined pretreatment using a spin or slit coating method, a roll coating method, a screen printing method, an applicator method, or the like to a desired thickness, and then heated at 100°C for 1 to 10 minutes to remove the solvent, thereby forming a photosensitive resin film. This step can improve image quality and spotting, etc.

[0152] (2) Exposure stage

[0153] To form the necessary pattern on the photosensitive resin film obtained above, a mask is interposed, and then the active line of the i-line is irradiated. Light sources used for the irradiation include low-pressure mercury lamps, high-pressure mercury lamps, ultra-high-pressure mercury lamps, metal halide lamps, and argon gas lasers. In some cases, X-rays and electron beams can also be used.

[0154] The exposure dose varies depending on the type, mixing amount, and dry film thickness of each component of the composition, but is 500 mJ / cm when using a high-pressure mercury lamp. 2 (based on a 365 nm sensor) below. This step allows for fine adjustment of pixel size, enabling high resolution implementation.

[0155] (3) Phenomenon stage

[0156] The development method involves using an alkaline solution as a developer following the above exposure step to dissolve and remove unnecessary elements, leaving only the exposed portion to form a pattern. This step allows for the formation of a profile, achieving high resolution and ensuring color uniformity, thereby improving clarity.

[0157]

[0158] Another embodiment provides a display device including the photosensitive resin film.

[0159] The above display device may be a micro organic light emitting diode (OLED) display device.

[0160] The above micro organic light emitting diode (OLED) display device includes an OLED substrate deposited on a silicon wafer and a color filter layer positioned on the OLED substrate and converting white light generated from the OLED substrate into a plurality of color lights, wherein the color filter layer may include a red color filter, a green color filter, and a blue color filter. In addition, the photosensitive resin film, i.e., an adhesive protection layer, is positioned between the OLED substrate and the color filter layer.

[0161] For example, the micro organic light emitting diode (OLED) display device includes an OLED substrate deposited on a silicon wafer, an inorganic layer laminated on the OLED substrate, an adhesive protection layer laminated on the inorganic layer, and a color filter layer laminated on the adhesive protection layer and converting white light generated from the OLED substrate into a plurality of color lights, and the color filter layer may include a red color filter, a green color filter, and a blue color filter.

[0162] Conventionally, OLED substrates were used, in which OLEDs were deposited on glass or polyimide substrates. However, according to one embodiment, a micro OLED display device deposits OLEDs on a silicon wafer, which may be more advantageous for implementing micro displays. Such micro displays are attracting attention as next-generation displays and are expected to be applied to devices such as MR. In fact, Apple, Meta, and LG Display have all entered or announced their entry into the next-generation MR device market.

[0163] For example, the micro OLED display device may further include a micro lens array. The micro lens array may be positioned on the adhesive protection layer and may surround the color filter layer.

[0164] A micro OLED display device having the above structure can be driven on a pixel basis by depositing WOLEDs on a high-density silicon wafer, and since it is easy to control the transmission wavelength through a color filter layer patterned with a resolution of 3㎛ or less, it can be advantageous in securing high color reproducibility and high resolution.

[0165] For example, the thickness of the adhesive protection layer may be 1 μm or less. In this case, the aforementioned effects, namely improved adhesion to color filters and improved residue characteristics, can be further maximized.

[0166] For example, the thickness of the color filter layer may be 1.1 μm to 1.6 μm.

[0167] If the thickness of the color filter layer is controlled as above, it may be more advantageous for implementing a micro OLED display device.

[0168] For example, the thickness of the inorganic layer may be 2㎛ or less. Even in the case of WOLED, since light does not always diffuse only in a direction perpendicular to the OLED substrate, color mixing of red, green, and blue inevitably occurs. Therefore, in the past, an inorganic layer was deposited on the OLED substrate to prevent such color mixing. However, even by depositing the inorganic layer, color mixing is not completely prevented. Therefore, in one embodiment, the inorganic layer is made thin, for example, the thickness of the inorganic layer is controlled to 2㎛ or less, thereby preventing a slight light leakage phenomenon.

[0169] Ultimately, the photosensitive resin composition according to one embodiment can produce a cured film only through low-temperature (100°C) curing and i-line photocuring during prebaking as described above, so there is bound to be a very large difference in the achievable resolution compared to a conventional display device.

[0170]

[0171] Hereinafter, preferred embodiments of the present invention are described. However, the following examples are merely preferred embodiments of the present invention, and the present invention is not limited to the following examples.

[0172]

[0173] (Example)

[0174] (Manufacture of photosensitive resin composition)

[0175] Examples 1 to 5 and Comparative Examples 1 to 5

[0176] According to the composition shown in Table 1 below, a photopolymerization initiator was dissolved in a solvent and stirred at room temperature for 2 hours. A binder resin and a photopolymerizable monomer were added thereto and stirred at room temperature for 1 hour. Other additives were added thereto and stirred at room temperature for 1 hour, after which the entire solution was stirred for 2 hours. The solution was filtered three times to remove impurities, thereby producing a photosensitive resin composition.

[0177]

[0178] (Unit: wt%) Example 1 Example 2 Example 3 Example 4 Example 5 Comparative Example 1 Comparative Example 2 Comparative Example 3 Comparative Example 4 Comparative Example 5 (A) Binder resin 18.87 17.82 16.77 18.87 18.87 18.66 18.29 14.67 18.87 18.87 (B) Photopolymerizable monomer 0.8 1.85 2.9 0.8 0.8 1.0 1 1.38 5 0.8 0.8 (C) Photopolymerization initiator 0.56 0.56 0.56 0.56 0.56 0.70 55 0.55 0.56 0.56 (D) Antioxidant 0.180.180.180.270.3600.540.360.090.45(E) Solvent 79.1979.1979.1979.179.0179.2378.8479.0579.2878.92(F) Other additives (F-1) 0.20.20.20.20.20.20.20.20.20.20.2(F-2) 0.20.20.20.20.20.20.20.170.20.2Binder resin based on total solids: Photopolymerizable monomer 90:1085:1580:2090:1090:1094:687:1370:3090:1090:10By total solids Antioxidant2223406415

[0179] (A) Binder resin

[0180] Acrylic binder resin (SP-RY38; resonac)

[0181] (B) Photopolymerizable monomer

[0182] Dipentaerythritol hexa(meth)acrylate (DPHA, Nippon Gunyakusha)

[0183] (C) Photopolymerization initiator

[0184] Oxime initiator (SPI-03, Samyang Corporation)

[0185] (D) Antioxidant

[0186] Methylhydroquinone (JHChem)

[0187] (E) solvent

[0188] Propylene glycol monomethyl ether acetate (PGMEA, Daicel)

[0189] (F) Other additives

[0190] (F-1) Leveling agent (F-556, DIC)

[0191] (F-2) Silane coupling agent (KBM-503, Shinetsu)

[0192]

[0193] Rating 1

[0194] After confirming that the photosensitive resin compositions according to Examples 1 to 5 and Comparative Examples 1 to 5 were all transparent, each of them was coated on an 8-inch wafer using a SEMES K-SPIN at an rpm capable of exhibiting a similar thickness, followed by soft baking on a 100°C hot plate, and pattern exposure was performed under the exposure conditions of (Dose: 200 ms / Focus: -0.3) on a Nikon i-line stepper. After measuring the thickness using TENCOR in the exposure process, development was performed to exhibit a pattern. EHD-100S solution (TMAH) was used as the developer, and the time (seconds) (BP) for the pattern to appear was measured.

[0195] The sensitivity of the completed pattern on the developed pattern substrate and the residue around the pattern were checked using a Hitachi CD-SEM. The pattern was confirmed to be a 96㎛ negative pattern, and a large-area residue was checked using an Olympus optical microscope, and the results are shown in Table 2 and Figures 1 to 8 below.

[0196]

[0197] Example 1 Example 2 Example 3 Example 4 Example 5 Comparative Example 1 Comparative Example 2 Comparative Example 3 Comparative Example 4 Comparative Example 5 Straightness ◎○○○○ⅩⅩⅩⅩ Residue (Lifting) ◎○○○○ⅩⅩⅩⅩ

[0198] metewand

[0199] ◎: Excellent straightness and residue characteristics under an optical microscope

[0200] ○: Excellent straightness and residue characteristics under an optical microscope

[0201] Ⅹ: Poor straightness and residue characteristics under an optical microscope

[0202]

[0203] Rating 2

[0204] In order to confirm the adhesion of the photosensitive resin film of Evaluation 1 to the color filter, each was coated on an 8-inch wafer at an rpm that can exhibit a similar thickness using SEMES K-SPIN, followed by soft baking on a 100℃ hot plate, and pattern exposure was performed under low exposure conditions (Dose: 100ms / Focus: -0.3) using Nikon i-line stepper. After measuring the thickness using TENCOR during the exposure process, development was performed to exhibit the pattern. EHD-100S solution (TMAH) was used as the developer, and the time (seconds) (BP) for the pattern to appear was measured. The adhesion of the completed pattern on the developed pattern substrate was evaluated using an Olympus optical microscope, and the results are shown in Table 3 below.

[0205]

[0206] Example 1 Example 2 Example 3 Example 4 Example 5 Comparative Example 1 Comparative Example 2 Comparative Example 3 Comparative Example 4 Comparative Example 5 Adhesive strength ◎○○○○ⅩⅩⅩⅩ

[0207] metewand

[0208] ◎: Excellent adhesion

[0209] ○: Excellent adhesion

[0210] Ⅹ: Poor adhesion

[0211]

[0212] Through evaluations 1 and 2, it can be seen that the photosensitive resin composition according to one embodiment is a transparent photosensitive resin composition, which has excellent straightness, residue characteristics, and adhesive strength even with low-temperature curing, and has excellent adhesive strength to a color filter, making it suitable for use as a lower layer of a color filter in a micro OLED.

[0213]

[0214] The present invention is not limited to the above-described embodiments, but can be manufactured in a variety of different forms. Those skilled in the art will appreciate that the present invention can be implemented in other specific forms without altering the technical spirit or essential characteristics of the present invention. Therefore, the embodiments described above should be understood as illustrative in all respects and not restrictive.

Claims

1. (A) Binder resin; (B) Photopolymerizable monomer; (C) Photopolymerization initiator; (D) antioxidants; and (E) containing a solvent, Based on the total solid content of the photosensitive resin composition, the binder resin and the photopolymerizable monomer have a weight ratio of 80:20 to 90:10, A photosensitive resin composition in which the antioxidant is contained in an amount of 2% to 4% by weight based on the total solid content of the photosensitive resin composition.

2. In paragraph 1, The above photosensitive resin composition is a transparent photosensitive resin composition.

3. In paragraph 1, The above photosensitive resin composition is a photosensitive resin composition having a colorant-free composition.

4. In paragraph 1, The above binder resin is a photosensitive resin composition containing an acrylic binder resin.

5. In paragraph 1, A photosensitive resin composition wherein the binder resin has an acid value of 30 KOHmg / g to 180 KOHmg / g and a weight average molecular weight of 5000 g / mol to 20000 g / mol.

6. In paragraph 1, A photosensitive resin composition in which the binder resin is included in an amount of 20% to 40% by weight based on the total solid content of the photosensitive resin composition.

7. In paragraph 1, The above antioxidant is a photosensitive resin composition represented by the following chemical formula 1: [Chemical Formula 1] In the above chemical formula 1, R 1 is a substituted or unsubstituted C1 to C20 alkyl group, n and m are each independently integers from 1 to 4, provided that n+m = 3.

8. In paragraph 7, A photosensitive resin composition wherein the above n is an integer of 2 and the above m is an integer of 1.

9. In paragraph 1, The above photosensitive resin composition, with respect to the total amount of the photosensitive resin composition 10 wt% to 30 wt% of the above (A) binder resin; 0.1 wt% to 10 wt% of the above (B) photopolymerizable monomer; 0.01 wt% to 5 wt% of the above (C) photopolymerization initiator; 0.01 wt% to 3 wt% of the above (D) antioxidant; and Above (E) solvent residue A photosensitive resin composition comprising:

10. In paragraph 1, The photosensitive resin composition further comprises an additive selected from the group consisting of malonic acid, 3-amino-1,2-propanediol, a silane coupling agent, a leveling agent, a surfactant, a polymerization inhibitor, or a combination thereof.

11. A photosensitive resin film manufactured using the photosensitive resin composition of any one of claims 1 to 10.

12. In paragraph 11, The above photosensitive resin film is a transparent photosensitive resin film.

13. A display device including the photosensitive resin film of Article 11.

14. In paragraph 13, The display device includes an OLED substrate deposited on a silicon wafer and a color filter layer positioned on the OLED substrate and converting white light generated from the OLED substrate into a plurality of color lights. The photosensitive resin film of claim 11 is positioned between the OLED substrate and the color filter layer, A micro OLED display device wherein the color filter layer includes a red color filter, a green color filter, and a blue color filter.

15. A step of applying a photosensitive resin composition of any one of claims 1 to 10; A step of prebaking at a temperature of 100°C or lower after the above application; Step of exposing to i-line after the above prebaking and Developing stage A method for manufacturing a photosensitive resin film comprising:

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