Cooling assembly, control device and control device system

Abstract

The present invention relates to a cooling assembly comprising: at least one component to be cooled, in particular disposed on a circuit carrier; at least one steam chamber (11, 31, 216a, 216b) which, on one side, is disposed on the component to be cooled, such that said steam chamber is thermally conductively coupled to the component to be cooled; a first cooling device which is in the form of a fluid cooler and is disposed on the steam chamber (11, 31, 216a, 216b) in order to remove heat from the steam chamber (11, 31, 216a, 216b); and a second cooling device which is in the form of an air cooler and is disposed on the steam chamber (11, 31, 216a, 216b) in order to remove heat from the steam chamber (11, 31, 216a, 216b).

Description

[0001] Description

[0002] Cooling arrangement, control device and control device system

[0003] The present invention relates to a novel cooling arrangement, in particular for a sensor or a control device, as well as a corresponding sensor or a corresponding control device, which has a cooling arrangement according to the invention, and a control device system or rack system, comprising at least one cooling arrangement according to the invention or at least one control device according to the invention, as well as a further embodiment of a control device.

[0004] Technological background

[0005] Modern means of transport such as motor vehicles, motorcycles, and aircraft are increasingly equipped with control units or control devices. For example, in the automotive sector, generic electronic control units (ECUs) or

[0006] Control devices are used to control actuators (brakes, engine, transmission, etc.) and / or sensors, as well as to calculate and control driving and assistance functions. For example, such control devices are part of driver assistance systems, which use sensors or sensor systems to detect the environment, recognize traffic situations, and support the driver, e.g., by braking or steering intervention or by issuing a visual or acoustic warning. Sensors or sensor systems for environmental detection are regularly used.

[0007] Radar sensors, lidar sensors, camera sensors or the like are used. Conclusions about the environment can then be drawn from the sensor data acquired by the sensors, which can be used, for example, to classify objects and / or the environment or to create an environment model. Furthermore, environmental detection is almost indispensable in the field of (partially) autonomous driving, so there is particular interest in the further development of such systems. An important aspect of electronic control units or control devices is heat dissipation or cooling. The heat to be dissipated from the electronic control unit can, for example, be led to the outside through a thermally highly conductive housing, e.g. a metal housing. On the surface or at least on, for example, one side of the housing or

[0008] With the high power dissipation of a control unit housing, the challenge is to dissipate the heat as effectively as possible to protect the components inside the housing from overheating. Various types of cooling systems or cooling methods exist for this purpose, e.g., air cooling, possibly with cooling fins or cooling knobs, or a closed coolant circuit that can be connected to the control unit housing and flows coolant over a housing wall or its surface.

[0009] Generic electronic control units and control devices, which are increasingly being used in modern vehicles and in aviation, are increasingly becoming so-called high-performance computer systems (HPC). These systems generally have to function in ambient temperatures or with coolant temperatures of, for example, -40 to 80°C or more. In contrast, however, some electronic components in the control devices, in particular data storage modules such as RAM (Random Access Memory) or Flash modules or EEPROMs (Electrically Erasable Programmable Read-Only Memory), are often subject to very limited upper permissible temperatures. Furthermore, due to ever increasing data transfer speeds, but also to the need to avoid voltage drops or oscillations, fast data storage modules should be located as close as possible to the microprocessors or processors that control them.

[0010] High-performance processors (especially CPUs, GPUs, switches, ICs, or the like) are placed close to the high-performance processors, as this placement is usually what enables the required fast write and read speeds or communication speeds. These high-performance processors typically generate considerable waste heat, which in typical applications can significantly heat up much more heat-sensitive components in the immediate vicinity of the high-performance processors, and therefore the heat must be dissipated. With ever-increasing power dissipation, especially in high-performance processors, neighboring components are subjected to ever greater thermal stress, and the cooling systems must be increasingly complex to dissipate the resulting heat from the heat generators and the neighboring, sometimes more sensitive, components.

[0011] Such electronic control units or control systems are expediently subject to various requirements. These requirements, particularly for ADAS (Advanced Driver Assistance Systems) functions, but also for braking and steering functions, for example, must be designed in such a way that, in the event of a single fault in a control unit or the power supply or cooling system, at least a fallback function maintains operation or remains in operation until the vehicle is transferred to a safe state. This requirement means, for example, that in vehicles with extended autonomous capabilities, duplicate (redundant) control units and power supplies would have to be installed for the important functions.In the event of a single fault, full functionality is often no longer guaranteed at the fallback level. Rather, it is usually sufficient if the remaining sensors, control units, actuators, and power supplies, and of course the associated data communication paths, can still bring the vehicle into a safe state or to the safest possible location with sufficient reliability, for example, if the driver cannot take control of the vehicle or if the vehicle is autonomous. In the vast majority of cases, 90 or even 120 seconds are sufficient to bring a vehicle into a safe state after a failure. Longer bridging times, such as 15 or 30 minutes, are rarely required.In addition to the components mentioned, cooling is also a critical aspect, and its functional reliability must be guaranteed even during these bridging times. Generic control units are usually designed in such a way that components must still demonstrate (full) functionality at the highest ambient temperature, highest power loss, and highest coolant temperature, while simultaneously maintaining the lowest coolant flow. This means that if the cooling system fails, control units often have to shut down after just a few seconds (e.g., 3 to 6 seconds) due to excessive temperatures or overheating of individual components. Furthermore, modern control units for vehicles are usually designed in such a way that full functionality must be ensured within the defined temperature and voltage ranges.For fully or partially automated vehicles, for example, there are situations in which automated ferry operation is not possible, or in which the system must suspend automated ferry operation with advance notice, e.g., if the vehicle must be automatically brought into a safe state without the driver taking over. If, for example, fog or black ice or certain vehicle limitations / defects are detected, a vehicle will refuse entry into automated ferry operation. An insufficient battery charge or fuel supply can also prevent entry into automated ferry operation, as the vehicle would likely break down.

[0012] If several control units or systems are cooled together, for example, by a common airflow or fluid circuit (e.g., in a so-called rack system), a failure of the necessary fluid flow (coolant flow, airflow, or similar) can result in the failure of several control units at once. The problem here is that a second, truly independent (liquid) cooling circuit often seems impractical due to the considerable effort involved. In contrast, simple air cooling for control units with increased power dissipation often cannot generate the required power. This can, on the one hand, generate strong and undesirable noise and, on the other hand, requires a large amount of fluid or air volume.As a result, there is increased interest in solutions that make it possible to dispense with, for example, a second complete cooling system in the area of ​​high-performance computers (HPC) and other devices for manageable periods of time, usually in the small single-digit minute range or even double-digit minute range.

[0013] Printed state of the art

[0014] From DE 10 2020 104 614 A1, a device for a motor vehicle is known, comprising at least one component to be cooled, which has at least one semiconductor, and comprising a cooling device, by means of which the component to be cooled can be at least partially cooled and heat provided by the component can be dissipated to a heat sink. The cooling device is designed as a gravity-based vapor chamber, through which the heat can be dissipated to the heat sink using the two-phase thermosiphon effect. For this purpose, the gravity-based vapor chamber has a base element, which has a first side facing the component and a second side facing away from the first side and the component and facing an interior of the vapor chamber, whereby particularly advantageous cooling can be achieved. Furthermore, between the vapor chamber and the component to be cooled, if necessary.a ceramic layer, a contact layer, a sintered layer and several solder layers are provided.

[0015] Object of the present invention

[0016] The object of the present invention is to provide a cooling arrangement of the type mentioned, which achieves good heat transfer between a component to be cooled (or the assembly components to be cooled) and the heat-dissipating components or thermal components, even during a bridging period, and overcomes the disadvantages resulting from the prior art in a simple and cost-effective manner.

[0017] The above object is achieved by the entire teaching of claim 1 and the subordinate claims. Advantageous embodiments of the invention are claimed in the subclaims.

[0018] The cooling arrangement according to the invention comprises at least one component to be cooled, in particular arranged on a circuit carrier (e.g. printed circuit board, circuit board, substrate or the like), as a thermal component, firstly a vapor chamber which is arranged on one side of the component to be cooled in such a way that it is thermally conductively coupled to the component to be cooled, and a first cooling device which is designed as a fluid cooling device and which is arranged on the vapor chamber in order to dissipate heat from the vapor chamber, and a second cooling device which is designed as an air cooling device and which is arranged on the vapor chamber in order to dissipate heat from the vapor chamber. The first cooling device and the second cooling device can be operated in parallel, or one of the cooling devices can be used as a redundant orA backup or fallback cooling device can be provided which takes over the cooling task of the first cooling device in the event of a fault, particularly during a bridging period. The dimensioning of the fallback cooling device can advantageously be based on the tasks still to be performed in the event of a fault (for example, comfort functions no longer necessarily have to be carried out in the event of a fault). The cooling medium for the fluid cooling can be glycol, water, glycol-water or another coolant liquid. Furthermore, gaseous fluids such as air, nitrogen or carbon dioxide can also be used for cooling. The second cooling device or the air cooling can have a powerful or more powerful (and therefore noisy) fan, the likes of which are not usually used in passenger compartments, but can be used as a fallback cooling device and, for example,is controlled by the control device or another (redundant) controller. The present invention shows, among other things, an advantageous embodiment of a cooling arrangement, e.g. for control units, in particular high-performance computers, so-called high-performance computers (HPC), or high-performance control units, without having to make major changes to the control unit structure, which on the one hand improves the general cooling effect (e.g. also because both cooling devices can dissipate heat simultaneously) and on the other hand sufficient cooling can be ensured, e.g. even for a short bridging period, since one of the cooling devices is always present as a fallback level cooling, so to speak. The fallback level cooling can be designed to be relatively smaller or less powerful, since this, e.g.It also means that less heat needs to be dissipated once a fault occurs in a vehicle, and only functions that bring the vehicle into a safe state are required. The extension of the bridging time can also be influenced to a certain extent by the technical design or additional measures, e.g., in the software.

[0019] The vapor chamber can be made, for example, from a metal, in particular copper and / or aluminum and / or an alloy thereof. According to a particularly preferred embodiment, the vapor chamber can also be made from an aluminum-copper composite material and, for example, as a so-called extruded part or impact-formed part, e.g., in conjunction with stamped parts. Such a configuration can be particularly suitable because aluminum is particularly versatile (e.g., compatible with the aluminum components used in cooling water circuits) and copper has excellent thermal conduction properties, allowing the advantages of both materials to be combined. Aluminum or aluminum alloys are preferably used here.Depending on the metal and the set negative pressure, the liquids inside the vapor chamber can be water, acetone, but also refrigerants such as those used in air conditioning systems and other media. The vapor chamber comprises an inner volume made up of internal channels or areas in which some liquid is arranged under negative pressure. This liquid evaporates at the operating temperatures of the component to be cooled, so that the heat can be dissipated as long as liquid is available to evaporate. Within the scope of the invention, a vapor chamber is preferably used which, in a preferably hermetically sealed vapor chamber housing (external soldering or welding), can have a capillary structure on the inside. Depending on the installation position, this structure contributes not only to gravity but also to the conveyance or transport of condensed liquid, in particular due to the capillary effect.The capillary effect can be achieved through surface structures or materials inserted into the inner wall of the steam chamber. This causes the liquid contained therein to reach the warmest points of the steam chamber housing, where the liquid evaporates during operation. This fluid transport creates and maintains a cycle of physical state changes (liquid to gas to liquid, etc.). The housing of such steam chambers can be realized with a cover and a base section, but can also preferably be manufactured from extruded parts or impact-molded parts as a one-piece semi-finished product or in one piece.

[0020] The first cooling device is preferably a liquid cooling system. For example, the first cooling device can be a high-performance liquid cooling system, e.g., water cooling or based on another cooling medium or coolant liquid. The second cooling device can, for example, be a less powerful air cooling system, implemented, for example, via cooling fins in combination with appropriately arranged fans. However, other cooling devices, such as cooling channels with internal cooling structures, heat pipes, cooling tubes, or the like, can also be provided as cooling devices. Liquid cooling has the advantage that it can dissipate heat particularly effectively, thereby further improving the cooling performance.

[0021] >According to a preferred embodiment, the fluid cooling of the first cooling device and / or the second cooling device can be at least partially an integral part of the vapor chamber. This can be achieved, for example, by the vapor chamber, which is manufactured, for example, as an extruded part, simultaneously comprising parts of the first cooling device and / or the second cooling device. For example, cooling channels for a gas or liquid flow, cooling structures such as cooling fins or cooling nubs could be arranged directly on the vapor chamber during the manufacturing process, or they could be joined to it, for example, by soldering or welding, to form a workpiece.

[0022] According to a particular embodiment, the fluid cooling system can also be a liquid cooling system, which has an outlet and an inlet via which the liquid cooling system can be connected to a coolant circuit of the vehicle. Advantageously, the cooling arrangement can thus be connected to the generally already existing cooling circuit of the vehicle and use this as a fallback cooling system or second cooling device, or use it in parallel with the first cooling device.

[0023] Advantageously, an elastic bellows or a cooling pad can be provided as the first cooling device or second cooling device, which is made at least partially from flexible material and is arranged in such a way that the elastic bellows or the cooling pad conforms to the steam chamber and optionally to the housing or other components of the control device or the control device system, wherein metal foil, in particular aluminum foil or copper foil, and / or plastic foil and / or a laminate and / or a composite foil, which in particular comprises a metal foil and a plastic foil, is provided as the flexible material.

[0024] Furthermore, the cooling arrangement according to the invention can be provided with a housing, which is preferably made of metal or plastic. The housing can be, for example, a control device housing or a sensor housing for surroundings or environmental detection, in which the component to be cooled is arranged, for example, on a circuit carrier (e.g., circuit board, substrate, or printed circuit board). According to an advantageous embodiment of the present invention, the vapor chamber can be at least partially part of the housing, in particular of the control device housing or the sensor housing. In practical terms, the vapor chamber can be an integral component of the housing.

[0025] For example, this can be a side wall of the housing, a lid, a base, or the like. The steam chamber is preferably plate-shaped and can preferably be manufactured or produced as an extruded part or impact-molded part.

[0026] Advantageously, the steam chamber can have cooling structures, such as cooling ribs and / or cooling knobs and / or cooling pins and / or cooling fins, which are preferably part of the first cooling device and / or second cooling device (e.g. air cooling) and are thus arranged as an integral component directly on the steam chamber, so that the steam chamber and the first and / or second cooling device can also be present in one piece or can be manufactured as a single part (e.g. extruded part). The cooling structures serve, for example, to have a cooling medium (e.g. air, water, coolant or the like) flowing around them, so that heat can be dissipated. This allows effective cooling to be implemented in a particularly practical structural manner, which significantly simplifies the manufacturing process.

[0027] The steam chamber and the first cooling device and / or the second cooling device are preferably designed as a single piece, so that one component can also comprise all thermal components. For example, the fluid cooling system(s) can be attached to the steam chamber or they can also be manufactured as a single workpiece. Furthermore, additional channels could be attached to the steam chamber, e.g. by manufacturing the steam chamber as an extruded part. The vehicle's cooling water supply, for example, could then be connected to the additional channels, which then directly cools the steam chamber wall. The thermal coupling can thereby be further increased. Furthermore, as already described, cooling structures can of course be arranged on the steam chamber, which are part of an air cooling system and are, for example, surrounded by an air flow.

[0028] According to a preferred embodiment of the invention, a TIM or a TIM layer can be arranged between the vapor chamber and the component to be cooled. The arrangement according to the invention allows the thickness of the TIM layer(s) and / or the number of TIM layers to be reduced, significantly improving heat transfer from the component to be cooled to the vapor chamber. Furthermore, with this cooling arrangement, the TIM layer only needs to be applied very thinly, or can even be omitted entirely.

[0029] According to a particular embodiment of the present invention, the vapor chamber can be bent so that it has a deformation, in particular a curved or L-shaped or U-shaped deformation, which protrudes, for example, from the dimension of the housing (ie a part of the vapor chamber is located at least partially outside the housing or control device housing) in order to thereby achieve improved cooling performance by arranging structures (e.g. cooling ribs and / or cooling knobs and / or cooling pins and / or cooling fins and / or the like) in the area, which protrude into a fluid flow (e.g. air or liquid cooling).

[0030] Furthermore, the present invention claims a control device or a sensor (for example a radar sensor, lidar sensor, camera sensor, ultrasonic sensor or the like) which comprises a cooling arrangement according to the invention.

[0031] The component to be cooled can expediently be a microcontroller and / or a processor and / or a chip and / or an integrated circuit (IC) and / or a system-on-chip (SoC) and / or a semiconductor component and / or a circuit carrier and / or a battery and / or other electronic component parts or compositions thereof, which are arranged, for example, on at least one circuit carrier or printed circuit board and / or printed circuit board (PCB) and / or substrate.

[0032] The present invention also claims, in a secondary or subordinate manner, a control device system or a rack system comprising at least one cooling arrangement according to the invention or a plurality of control devices according to the invention. The control devices can expediently be arranged side by side in a rack or stack and each have a first cooling device and a second cooling device, wherein the first cooling device and / or the second cooling device of the control devices is a common cooling device. In this case, the rack / stack comprises, for example, a plurality of cooling devices of the control devices (e.g., fluid cooling devices arranged, for example, between the control devices, or cooling pads or elastic cooling elements arranged between the control devices and conforming to their control device housings or their damping chambers).

[0033] Advantageously, a fluid cooling system or a cooling pad can also "serve" two or more steam chambers, so that cooling can be carried out particularly effectively and with reduced material consumption. For this purpose, the control devices each have one or more steam chamber(s), which are provided, for example, with cooling structures that are part of an air cooling system. In addition, a liquid cooling system is provided, on which the steam chambers are arranged in a thermally conductive manner, wherein the liquid cooling system is the first cooling device and the air cooling system is the second cooling device. Expediently, the control devices can each have a control device housing, and the control device housings can be mechanically connected to one another, in particular by adhesive bonding, welding, screwing, riveting, or the like.

[0034] In addition, the present invention also comprises a control device for a vehicle, which has at least one component to be cooled, which is preferably arranged on a circuit carrier inside a control device housing of the control device. Furthermore, the control device has a vapor chamber, which is arranged on one side on the component to be cooled in such a way that it is thermally conductively coupled to the component to be cooled, wherein the vapor chamber preferably comprises a capillary structure arranged inside. In addition, a liquid cooling system is provided as the cooling device, which is arranged on the vapor chamber in order to dissipate heat from the vapor chamber, wherein the liquid cooling system has an inlet and an outlet via which the liquid cooling system can be connected to a coolant circuit of the vehicle, so that this is used to cool the control device.In practical terms, the vapor chamber can be part of the control device housing (e.g., a cover, inlay, wall, or the like) and can be thermally conductively coupled to the component to be cooled via a TIM. In addition, the vapor chamber is preferably manufactured as an extruded part or a flow-formed part, with the liquid cooling being manufactured at the same time, so that the vapor chamber and liquid cooling are present as a one-piece component that can be inserted, glued, soldered, or welded into the control device housing. The interior of the vapor chamber and the interior of the liquid cooling are separated in a fluid-tight manner, but the vapor chamber and liquid cooling at least partially share a wall, so that the vapor chamber and liquid cooling are thermally conductively coupled to one another. Optionally, this design of the control device can also include a second cooling device (e.g., a cooling pad or air cooling with cooling fins and, if applicable,fans) arranged on the steam chamber to dissipate heat from the steam chamber and is preferably, like the liquid cooling, at least partially an integral part of the steam chamber.

[0035] Description of the invention based on exemplary embodiments

[0036] The invention is explained in more detail below using practical examples. They show:

[0037] Fig. 1: a simplified schematic representation of an embodiment of a vehicle with a control device according to the invention; Fig. 2: a simplified sectional representation of an embodiment of a control device according to the invention (fans were not shown for reasons of simplification);

[0038] Fig. 3A-3D: a simplified representation of embodiments of a steam chamber of a cooling arrangement according to the invention;

[0039] Fig. 4: a simplified sectional view of a further embodiment of a control device according to the invention with an extended steam chamber;

[0040] Fig. 5: a simplified sectional view of a further embodiment of a control device according to the invention with an extended steam chamber;

[0041] Fig. 6A: a simplified sectional view of a further embodiment of a control device according to the invention with additional fluid cooling;

[0042] Fig. 6B: a simplified plan view of the control device from Fig. 6A;

[0043] Fig. 7: a simplified sectional view of an embodiment of a control device system according to the invention with two control devices;

[0044] Fig. 8: a simplified sectional view of an embodiment of a control device system according to the invention with two control devices;

[0045] Fig. 9A-9C: simplified representations from different viewing directions of an embodiment of a control unit (ECU) according to the invention with four separate damping chambers, each with a rib-like cooling structure;

[0046] Fig. 10A-10C: simplified representations from different viewing directions of the control device from 9A-9C with attached fluid cooling device (plate), and Fig. 11A-11B: simplified representations from different viewing directions of a control device system, comprising four control devices on two liquid cooling plates, wherein two control devices according to the invention have liquid and air cooling properties and two (standard) control devices are only cooled by the liquid circuit and additionally two fans are provided which support the air cooling of the air- and liquid-cooled control devices with regard to air cooling.

[0047] Reference numeral 1 in Fig. 1 denotes a vehicle with various actuators (steering 3, engine 4, brake 5), which has a control device 2 according to the invention (ECU, Electronic Control Unit or ADCU, Assisted and Automated Driving Control Unit), by means of which a (partially) automated control of the vehicle 1 can take place, e.g. by the control device 2 being able to access the actuators of the vehicle 1. In addition, the control device 2 has a memory unit, for example to store an algorithm, control instructions or patterns. Furthermore, the vehicle 1 has sensors for detecting the environment: a radar sensor 6, a lidar sensor 7 and a front camera 8 as well as several ultrasonic sensors 9a-9d, the sensor data from which are used for environment and object detection, so that various assistance functions, such as emergency braking assistant (EBA, Electronic Brake Assist), distance control (ACC, Adaptive Cruise Control), lane keeping control orA lane keeping assistant (LKA), parking assistant, or the like, can be implemented. The assistance functions are executed, for example, via the control device 2 or the algorithm stored therein. The cooling arrangement according to the invention can, in principle, be implemented in any of the sensors or control units or in the control device 2.

[0048] An important aspect of generic cooling arrangements is that any thermal tolerance ranges and maximum limits of the components to be cooled must always be observed to avoid damage to the respective component. For example, when entering the automated driving function, the components should have a thermal distance of several degrees Celsius or Kelvin from the shutdown temperature, e.g., 5 Kelvin, 10 Kelvin, 15 Kelvin, or 20 Kelvin. This can be achieved by only initiating automated driving when the cooling medium of the cooling system is not at or close to the upper limit (= maximum temperature or

[0049] maximum system temperature) or the components (which is often not possible) still have a few Kelvin reserves down to the maximum temperature. Designing for an actually lower starting temperature is unproblematic, as this rarely occurs anyway. When the ambient temperature is high and the vehicle is simultaneously subjected to high or extreme loads due to challenging ferry operations, autonomous operation is generally not initiated, and vehicles in autonomous operation generally do not (often) operate at their performance limits. However, a difference of a few degrees / Kelvin generally only extends the shutdown time very slightly, as the gradient of the temperature rise is very steep. In addition, the buffer capacities as well as the thermally low-impedance connection to heat sinks or heat spreaders or cooling fins or fluid coolers located on components that generate a lot of waste heat often only increase the time until the maximum temperature is exceeded by a few seconds.Therefore, in addition to the previously described procedure for further extending the run-on time after cooling failure, the invention also proposes reducing the power loss of the affected heat-generating components (e.g. switching off or downclocking).

[0050] According to the invention, as shown in Fig. 2 using a control device 2 according to the invention with a control device housing 10, the connection of thermally critical components is provided by means of a so-called "vapor chamber" or steam chamber 11 (where the internal channels of the steam chamber 11 are not shown in Fig. 2), which is preferably arranged close to the thermally critical components to be cooled or components to be cooled by one or more elevations or projections 11a. The steam chamber 11 can be designed as an extruded part, impact-formed part, or deep-drawn part and / or can have, for example, cooling fins on the outside or outside (outside the chamber area), which can be produced during the cover production process (extruded part with fins, or fins or pins by impact-forming process) or can be subsequently applied (e.g., produced via laser or soldered on or the like), which ensure good heat dissipation.

[0051] In Fig. 2, a processor 12 and an IC component 13 are provided as examples of components to be cooled. A layer of TIM 14 (Thermal Interface Material) is arranged between the vapor chamber 11 and the processor 12 or IC component 13, respectively. For the sake of clarity, however, this layer is shown in the figures as much thicker than it actually is. The TIM 14 allows the components that dissipate the most thermal power to be connected or contacted as directly as possible. Other components to be cooled can also be connected either directly or using thermally conductive materials, e.g., aluminum or copper components (e.g., "copper blocks" or the like), using an additional TIM. Furthermore, so-called high-performance SOCs (System-on-Chip), which are often used in modern HPCs, can also be provided as components to be cooled.

[0052] The vapor chamber 11 is connected to the control device housing 10 or is designed as a side wall, cover, or inlay of the control device housing 10, and is thus an integral part of the control device housing 10. The vapor chamber 11 can be screwed, glued, rented, or the like to the housing (not shown in the figures for the sake of clarity). Furthermore, the components to be cooled are located on a circuit board 15, which is arranged or fastened within the control device housing 10. In addition, further circuit boards 16 can also be arranged in the control device housing 10 (in Fig. 2, the circuit boards 15, 16 are designed as a so-called SOM (System on Module) comprising a circuit board 16 and an additional board (circuit board 15).The circuit boards 15, 16 can, for example, be clamped between two parts of the control device housing 10 and additionally fastened by a sealing adhesive 17, as shown for circuit board 16. The circuit board 16 also has a connector plug 18, which is used to connect the circuit board 16 or the control device 2. Both circuit boards 15, 16 are also connected to one another via a connecting plug (shown as a rectangle between the circuit boards). In addition, a fluid cooling system 20 is provided, which is connected to a fluid circuit or coolant circuit (shown in Fig. 2 as an upwardly directed fluid filling channel) in order to dissipate heat from the steam chamber 11. The steam chamber 11 has integrated cooling fins 21 for the fluid cooling system 20 and an integrated air cooling channel, comprising cooling fins 22. The cooling fins 21, 22 can preferably either be manufactured as an extruded part together with the steam chamber 11 orbe created or soldered / welded on or, in the case of a multi-part steam chamber 11, be manufactured as part of a cover or cover plate in an extrusion process.

[0053] Accordingly, the heat-generating components are connected via the steam chamber 11 simultaneously to a first cooling circuit and a second cooling circuit, in particular to a fluid circuit (or water circuit or coolant circuit) and to a separately controllable air cooling system, e.g., to an air duct controlled by fans. Known air cooling systems are used in the automotive sector, especially in

[0054] Interior space for the respective power losses of generic control devices or high-performance computers (HPC) of over 100 or 200 W and more is generally not used because the air volume and noise generation as well as the size are too large. According to the invention, an unusual dimensioning is deliberately chosen here by using a very strong air flow of preferably several cubic meters per minute and very powerful fans to draw air from the interior (passenger compartment / luggage compartment or protected electric motor compartment). These generate a high speed and a correspondingly high pressure, with the air flow being guided or forced through a fine-fin cooling arrangement (e.g. cooling fins, cooling knobs or the like). The fine-fin cooling arrangement, which comprises, for example, several cooling fins or cooling knobs, is attached directly to the vapor chamber.The intake and exhaust air ducts are designed in such a way that they are difficult to close accidentally. For example, air can be drawn in from under the dashboard or between the dashboard and the center tunnel and then exit from the center tunnel, for example, between the driver and passenger seats or even in the rear of the vehicle. Areas under the hood or in the rear of the vehicle are also conceivable. Of course, air can also be transported to the outside, in whole or in part, for example, through vent flaps used to reduce pressure when the doors are closed.

[0055] The vapor chamber 11 is generally designed such that, during normal operation, heat is dissipated from the surface opposite the connected components, e.g., via a fluid cooling system or a flexible cooling pad through which fluid flows. The vapor chamber side, to which the components to be cooled are connected (e.g., via thermal conductive paste or TIM), is designed to have a comparatively large area, and increased distances to other electronic components are preferably created. The vapor chamber can preferably also protrude beyond the circuit carrier of the thermally very critical printed circuit board. With a suitable technical design, the vapor chamber 11 can be flat on the surface or form a type of step with the control device housing 10, i.e., it can either be raised compared to the control device housing 10 or be sunk into it. Different design variants of the vapor chamber 11 are shown in Figs. 3A-3D.The steam chamber 11 is shown in section, with the inner channels of the steam chamber 11 visible. Fig. 3A shows an embodiment of the steam chamber 11 which has no cooling structures on the surface. Fig. 3B shows an embodiment of the steam chamber which has cooling fins 21 on one side, whereas the steam chamber 11 in Fig. 3C has cooling fins 21 on both sides. Fig. 3D shows an embodiment of the steam chamber 11 in which an additional cooling component, in particular a fluid cooling system comprising a plurality of cooling chambers, which can be connected, for example, to a cooling water circuit of the vehicle 1 or an additional coolant system, whereby the steam chamber 11 can be cooled. Instead of cooling fins 21, cooling fins, cooling pins, cooling spikes, cooling pyramid structures or the like can also be provided in all embodiments, which are intended to enable improved heat dissipation.

[0056] The steam chamber 11 shown in Fig. 4 is also a cover of the

[0057] Control device housing 10. In addition, the steam chamber 11 is designed such that it extends out of the control device housing 10 as an extension or formed portion 19. Cooling fins 22, cooling fins, cooling pins, or the like can be attached to one, both, or more sides and can be arranged on the extension or formed portion 19. In such designs, the formed portion 19 does not necessarily have to be positioned parallel to the control device housing 10, but can also be arranged in a different manner, as shown by way of example in Fig. 5. Accordingly, the formed portion 19 can protrude from the control device housing 10 in any desired shape.

[0058] Fig. 6A shows a sectional view and Fig. 6B a plan view of a control device 2 according to the invention, in which the steam chamber 11 has an integrated liquid cooling system 26 and cooling fins 22 for air cooling. The steam chamber 11 is manufactured in one piece and forms the cover part of the control device housing 10. The steam chamber 11 is preferably designed as a single housing part, wherein the ends, in particular the deflections for fluids, are removed (in particular milled out or cut out) and then the ends are closed after filling and vacuum introduction. Furthermore, parts of the usual ventilation or air conditioning lines can also be used. For example, the cooling water cooling of the vehicle can be connected to the inlet 26a and outlet 26b of the liquid cooling system 26 and existing air intake ducts of the air conditioning system can be used as air supply for the air-cooled area. In this case, for example,Partitions can be provided by simple passive rubber flap valves or similar, which open the air path when the fallback air cooling for the high-performance control units is switched on. The interior of the vapor chamber 11 and the interior of the liquid cooling 26 are separated from one another in a fluid-tight manner, but the vapor chamber 11 and liquid cooling 26 share at least one wall, so that they are coupled to one another with good thermal conductivity. The high-performance air cooling, which can be attached to the control unit or to the vehicle, is not shown in the figures. Fig. 7 shows an embodiment of a control device system according to the invention, in which a stack comprising two control units or control devices 2, 30 with fluid cooling 20 or

[0059] Water cooling and glued or welded damping chambers 11, 31. The damping chambers 11, 31 are designed as covers of the respective control device housing 10 and at the same time are an integral part of the respective control device housing 10. The control device 30 has a control device housing 30a, a steam chamber 31, a component to be cooled 32 on a circuit board 33, and a connecting piece 34.

[0060] In addition, all other components can also be part of the control device 30 (which, however, are not described in detail for the sake of clarity).

[0061] In addition, the damping chambers 11, 31 each have cooling fins 22, 35, which are part of an air cooling system 24 that can be used as a fallback cooling system. Furthermore, the control device housings 10 are inserted into one another and, in particular, glued or welded together, so that the control device system forms a single unit that cannot be easily removed. As in other figures, the high-performance air cooling system using a powerful fan is not shown.

[0062] Fig. 8 shows a similar embodiment to Fig. 7, wherein a flexible cooling pad 25 is provided as the second cooling device, which is arranged between the steam chambers 11, 31 and can thus dissipate heat from both steam chambers 11, 31. Furthermore, the steam chamber 11 has cooling fins 22 on both sides, each of which can be part of an air cooling system and can thus be used jointly or separately as fallback cooling.

[0063] According to Fig. 8, at least one elastic bellows or cooling pad 25 can be provided as a second cooling device, which is made at least partially of flexible material, so that the elastic bellows or the flexible cooling pad 25 conforms to the damping chambers 11, 31 and possibly also to the housing. The cooling pad 25 can thus compensate for slightly different positional alignments of the vapor chamber and / or housing due to tolerances. In particular, this can be a cooling pad, as already described in DE 10 2021 209 640 A1. Due to the flexible properties of the material of the flexible cooling pad 25, it conforms to the damping chambers 11, 31, particularly when expanding (e.g., when it is then filled with fluid).Metal foil, in particular aluminum foil or copper foil, and / or plastic foil and / or a laminate and / or a composite foil, which in particular comprises a metal foil and at least one plastic foil, can expediently be provided as the flexible material, since such foils can be produced and processed simply and cost-effectively. By providing a composite foil or a laminate as the flexible material, the durability and stability of the cooling arrangement can be easily improved. In addition, the heat sink can be adapted to the properties of the respective cooling medium or to the ambient conditions. Furthermore, the flexible material can also have a coating, in particular an aluminum coating, in order to improve the properties with regard to stability, tightness, aging, and durability.In particular, anoxal coatings (anoxal process = an aluminum oxide layer is created on the surface of the aluminum by anodic polarization of the aluminum) or anodal coatings (anodal process = electrolytic oxidation of aluminum, whereby a protective oxide layer on aluminum is created by anodic oxidation) are also suitable for coating an aluminum foil. Furthermore, the cooling pad 25 can be filled with a cooling medium or have a cooling medium flowing through it, with a fluid, in particular water, glycol, a water-glycol mixture, air, CO2, or the like, being provided as the cooling medium.

[0064] Fig. 9A-9C show a control device 2 with a housing 10 and four damping chambers 11 with cooling fins 23 attached thereto. Furthermore, a liquid cooling system 205 with an inlet 205a and an outlet 205b for connection to a cooling liquid circuit can be provided as the first cooling device or as the usual operating cooling system, as shown in Fig. 10A-10C. As the second cooling device, for example, air cooling is provided, which is carried out via fans (not shown) in that an air flow is guided past the cooling fins 203, which serves to dissipate heat from the cooling fins 203. Fig. 11A-11B show a control device system 200 that includes four control devices 210, 211, 212, 213 and a liquid cooling system 214 as well as air cooling, which is realized by the fans 215a, 215b.The control devices 210, 211 further comprise damping chambers 216a, 216b, which protrude from the control devices and, via a deformation at the ends of which are provided with cooling fins 217a, 217b, are guided into an air flow generated by the fans 215a, 215b. In order to create sufficient cooling fin surface area, only every second control device is provided with air cooling fins, which is why the control device system shown comprises two control units equipped with a fallback cooling system. Generic compact fans or coolers, which require a very high air throughput, would become dirty relatively quickly during extended operation or generally require complex filtering, which is counterproductive for a high air throughput. The fan cooling unit is therefore not designed for continuous use orand can therefore be cleaned during maintenance or inspections if necessary, especially if a vehicle has previously been in cooling fallback mode.

[0065] Optionally, the fallback air cooling system can be controlled directly or indirectly by at least one of the performance control units provided for fallback operation (e.g., control for maintaining the driving functions required to bring the vehicle into a safe state). The fallback air cooling system is cyclically tested during normal operation, i.e., without fallback cooling operation actually being necessary. For example, at least the fan can be activated and tested for functionality or for blockages in the ventilation circuit, e.g., by monitoring the current / voltage characteristic curve. Furthermore, automatic passive rubber air flaps, which only open when a sufficient back pressure / volume is reached, can also be used to detect the functionality of the fallback air cooling system.In addition, the fan(s) of the fallback cooling system can optionally be operated in reverse, at least temporarily, to provide self-cleaning and increase availability. Such control devices or

[0066] Control systems are installed in the vehicle close to the passenger compartment (e.g. underneath the center console or behind the dashboard or similar). In practical terms, the noise generated by the fallback cooling can be many times higher than the noise generated by conventional control unit cooling and ventilation systems installed in the surrounding area. In autonomously operated vehicles, the noise generated can be used in a practical way as the sole or additional acoustic signal for a potential driver to encourage them to manually take over control of the vehicle or to wake them up. The certainly annoying noise / signal and the strong air movement can, for example, help to wake the driver up or attract the driver's attention if a driver is present. If there is no driver orSince it is a driverless (personless) vehicle, the noise is generally not disturbing.

[0067] Of course, the cooling arrangement according to the invention can also be used to heat a component to be heated (as a heating device, so to speak), by filling it with a medium which transfers heat to a component to be heated. For this purpose, the cooling device can be easily connected to a heating circuit via the connections in order to be supplied with heating medium, which then flows through the cooling arrangement or heating device. For example, the rack according to the invention or the cooling arrangement according to the invention could also be used to heat one or more assemblies, in particular in the automotive sector. Since the cooling device according to the invention dissipates waste heat, e.g.into the passenger compartment, it is also possible to use the cooling device according to the invention as a heater or heating support for the passenger compartment. In this case, the air speed and thus the noise level should be significantly reduced, especially when vehicle occupants remain in the vehicle. List of reference symbols.

[0068] 1 vehicle

[0069] 2 Control device

[0070] 3 Steering

[0071] 4 Engine

[0072] 5 Brake

[0073] 6 radar sensor

[0074] 7 Lidar sensor

[0075] 8 front camera

[0076] 9a-9d Ultrasonic sensor

[0077] 10 control unit housing

[0078] 11 Steam chamber

[0079] 11a lead

[0080] 12 processors

[0081] 13 IC component

[0082] 14 TIM

[0083] 15 circuit board

[0084] 16 circuit board

[0085] 17 Sealing adhesive

[0086] 18 connectors

[0087] 19 Forming

[0088] 20 Liquid cooling

[0089] 20a Entrance

[0090] 20b Exit

[0091] 21 cooling fin

[0092] 22 cooling fins

[0093] 23 cooling fin

[0094] 24 Air cooling

[0095] 25 cooling pads

[0096] 26 Liquid cooling

[0097] 26a Input 26b Output

[0098] 27 Liquid cooling

[0099] 27a Entrance

[0100] 27b Output 30 Control device

[0101] 30a Control unit housing

[0102] 31 Steam chamber

[0103] 32 processor

[0104] 33 Circuit board 34 Connector

[0105] 35 cooling fins

[0106] 200 control system

[0107] 210 Control device

[0108] 211 Control device 212 Control device

[0109] 213 Control device

[0110] 214 Liquid cooling

[0111] 215a fan

[0112] 215b Fan 216a Steam chamber

[0113] 216b Steam chamber

[0114] 217a Cooling fin

[0115] 217b Cooling fin

Claims

Patent claims 1. Cooling arrangement, comprising at least one component to be cooled, in particular arranged on a circuit carrier, at least one vapor chamber (11, 31, 216a, 216b) which is arranged on one side of the component to be cooled in such a way that it is thermally conductively coupled to the component to be cooled, and a first cooling device which is designed as a fluid cooling device and is arranged on the vapor chamber (11, 31, 216a, 216b) in order to dissipate heat from the vapor chamber (11, 31, 216a, 216b), and a second cooling device which is designed as an air cooling device and is arranged on the vapor chamber (11, 31, 216a, 216b) in order to dissipate heat from the vapor chamber (11, 31, 216a, 216b).

2. Cooling arrangement according to claim 1, characterized in that the vapor chamber (11, 31, 216a, 216b) comprises a capillary structure arranged in the interior.

3. Cooling arrangement according to claim 1 or 2, characterized in that the first cooling device is a liquid cooling device (20, 26, 27, 214).

4. Cooling arrangement according to claim 3, characterized in that the fluid cooling of the first cooling device and / or the second cooling device is at least partially an integral part of the steam chamber (11, 31, 216a, 216b).

5. Cooling arrangement according to claim 3, characterized in that the fluid cooling is a liquid cooling (26) and has an outlet (26a) and an inlet (26b) via which the liquid cooling can be connected to a coolant circuit of a vehicle.

6. Cooling arrangement according to one of the preceding claims, characterized in that the steam chamber (11, 31, 216a, 216b) and the first cooling device and / or the second cooling device are designed in one piece.

7. Cooling arrangement according to one of the preceding claims, characterized in that an elastic bellows or a cooling pad (25) is provided as the first cooling device or second cooling device, which is made at least partially from flexible material and is arranged such that the elastic bellows or the cooling pad (25) conforms to the steam chamber (11, 31, 216a, 216b), wherein metal foil, in particular aluminum foil or copper foil, and / or plastic foil and / or a laminate and / or a composite foil, which in particular comprises a metal foil and a plastic foil, is provided as the flexible material.

8. Cooling arrangement according to one of the preceding claims, characterized in that a housing is provided, in particular a control device housing (10, 30a) or sensor housing, in which the component to be cooled is arranged.

9. Cooling arrangement according to claim 8, characterized in that the steam chamber (11, 31, 216a, 216b) is at least partially an integral part of the housing, in particular is designed as a housing cover.

10. Cooling arrangement according to one of the preceding claims, characterized in that the steam chamber (11, 31, 216a, 216b) has cooling structures, in particular cooling ribs (21, 22, 23, 35, 217a, 217b) and / or cooling knobs and / or cooling pins and / or cooling fins, which are preferably part of the first cooling device and / or the second cooling device.

11. Cooling arrangement according to one of the preceding claims, characterized in that a TIM (14) is arranged between the steam chamber (11, 31, 216a, 216b) and the component to be cooled.

12. Cooling arrangement according to one of the preceding claims, characterized in that the steam chamber (11, 31, 216a, 216b) has a, in particular curved or L-shaped or U-shaped, deformation (19) which protrudes from the dimension of the housing and cooling fins (23, 217a, 217b) are preferably provided on the deformation (19).

13. Control device (2, 30, 210, 211, 212, 213) or sensor comprising a cooling arrangement according to one of the preceding claims.

14. Control device system (200), comprising at least one cooling arrangement according to one of claims 1-12 or at least two control devices (2, 30, 210, 211, 212, 213) according to claim 13, wherein at least one of the control devices (210, 211, 212, 213) each has a first cooling device and a second cooling device, and the first cooling device and / or the second cooling device of the control devices (210, 211, 212, 213) is a common cooling device.

15. Control device system (200) according to claim 14, characterized in that at least one of the control devices (210, 211, 212, 213) has at least one steam chamber (216a, 216b) with cooling structures which are part of an air cooling system, and a liquid cooling system (214) is provided, on which the steam chamber(s) (216a, 216b) are arranged in a thermally conductive manner, wherein the liquid cooling system (214) is the first cooling device and the air cooling system is the second cooling device.

16. Control device (2) for a vehicle (1), comprising at least one component to be cooled, in particular arranged on a circuit carrier, a steam chamber (11) which is arranged on one side on the component to be cooled, such that it is thermally conductively coupled to the component to be cooled, wherein the steam chamber (11) preferably comprises a capillary structure arranged in the interior, and a liquid cooling system (26) arranged on the steam chamber (11) to dissipate heat from the steam chamber (11), the liquid cooling system (26) having an outlet (26a) and an inlet (26b) via which the liquid cooling system (26) can be connected to a coolant circuit of the vehicle.

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