Electronic device

Abstract

This electronic device comprises: a housing within which a space is formed and which has a heat dissipation passage formed at one surface thereof; an electronic component which is disposed in the space; a heat dissipation member which is disposed in the heat dissipation passage and within which a refrigerant flows; and a cover which is coupled to one surface of the housing and covers the heat dissipation passage, wherein the heat dissipation passage includes a hole opposite to the electronic component, and the heat dissipation member is disposed such that at least a part thereof overlaps the electronic component in the vertical direction through the hole.

Description

electronic devices

[0001] This embodiment relates to an electronic device.

[0002]

[0003] The most common electronic devices in automobiles are engine electrical devices (starter, ignition, charging) and lighting devices, but recently, as vehicles have become more electronically controlled, most systems, including chassis electrical devices, are becoming more electronic.

[0004] Various electronic devices installed in automobiles, such as lamps, audio, heaters, and air conditioners, are supplied with power from the battery when the automobile is stopped and from the generator when the automobile is running. In this case, the power generation capacity of the 14V power system is used as the normal power voltage.

[0005] Recently, with the development of the information technology industry, various new technologies (motorized power steering, the Internet, etc.) aimed at increasing the convenience of automobiles are being incorporated into vehicles, and it is expected that the development of new technologies that can make the most of the current automobile systems will continue in the future.

[0006] An electronic device's exterior is formed by a housing. Inside the housing, a number of electronic components for operation are arranged. These electronic components generate heat when operated.

[0007]

[0008] The present embodiment provides an electronic device that can improve heat dissipation efficiency while reducing weight.

[0009]

[0010] An electronic device according to the present embodiment comprises: a housing having a space formed therein and a heat dissipation passage formed on one surface; an electronic component disposed in the space; a heat dissipation member disposed in the heat dissipation passage and having a refrigerant flowing therein; and a cover coupled to one surface of the housing and covering the heat dissipation passage, wherein the heat dissipation passage includes a hole facing the electronic component, and the heat dissipation member is disposed such that at least a portion overlaps the electronic component in a vertical direction through the hole.

[0011] The material of the above housing may be plastic, and the material of the above heat dissipation member may be metal.

[0012] The above cover can be hook-attached to the housing.

[0013] The above cover can be screwed to the above housing.

[0014] The surface of the heat dissipation member facing the electronic component is a flat surface, and the flat surface can overlap with the hole.

[0015] A rib having a shape that protrudes more than other areas is arranged on the inner surface of the heat dissipation passage, and by contact between the rib and the heat dissipation member, at least a portion of the surface of the heat dissipation member can be spaced apart from the inner surface of the heat dissipation passage.

[0016] A first gap is formed between the surface of the heat dissipation member and the inner surface of the heat dissipation passage, and a heat transfer material can be placed in the first gap.

[0017] A second gap is formed between the inner surface of the cover and the surface of the heat dissipation member, and a heat transfer material can be placed in the second gap.

[0018] On the inner surface of the heat dissipation passage, a plurality of first guides and a first guide groove formed between the plurality of first guides may be arranged, and on the outer surface of the heat dissipation member, a second guide protruding outward from other areas and coupled to the first guide groove may be arranged.

[0019] The heat dissipation member has a region that is bent at least once, the heat dissipation member includes a refrigerant inlet disposed at one end, a refrigerant discharge disposed at the other end, and a contact portion disposed between the refrigerant inlet and the refrigerant discharge, and one side of the housing where the refrigerant inlet is disposed and the other side of the housing where the refrigerant discharge is disposed may be adjacent to each other.

[0020]

[0021] This embodiment has the advantage of making the electronic device lighter and lowering the manufacturing cost through a plastic housing.

[0022] In addition, it has the advantage of being able to firmly bond housings and heat dissipation members of different materials together through the cover, and of improving production efficiency through a simple assembly process.

[0023] In addition, there is an advantage in that heat dissipation efficiency can be improved by the arrangement structure of the housing, electronic components, and heat dissipation members.

[0024]

[0025] FIG. 1 is a perspective view showing the appearance of an electronic device according to an embodiment of the present invention.

[0026] FIG. 2 is a plan view showing the upper surface of an electronic device according to an embodiment of the present invention.

[0027] Figure 3 is a plan view showing the bottom surface of an electronic device according to an embodiment of the present invention.

[0028] Figure 4 is an exploded perspective view of an electronic device according to an embodiment of the present invention.

[0029] Figure 5 is a drawing showing Figure 4 from a different angle.

[0030] FIG. 6 is a drawing showing a combined structure of a housing, a heat dissipation member, and a cover according to an embodiment of the present invention.

[0031] FIG. 7 is a drawing showing a modified example of a housing, heat dissipation member, and cover combination structure according to an embodiment of the present invention.

[0032] Figure 8 is a plan view showing the arrangement structure of electronic components and heat dissipation members according to an embodiment of the present invention.

[0033] Fig. 9 is a cross-sectional view showing the arrangement structure of electronic components and heat dissipation members according to an embodiment of the present invention.

[0034] Figures 10 to 12 are drawings illustrating an assembly process of an electronic device according to an embodiment of the present invention.

[0035]

[0036] Hereinafter, a preferred embodiment of the present invention will be described in detail with reference to the attached drawings.

[0037] However, the technical idea of ​​the present invention is not limited to some of the embodiments described, but can be implemented in various different forms, and within the scope of the technical idea of ​​the present invention, one or more of the components between the embodiments can be selectively combined or substituted for use.

[0038] In addition, terms (including technical and scientific terms) used in the embodiments of the present invention may be interpreted as having a meaning that can be generally understood by a person of ordinary skill in the technical field to which the present invention belongs, unless explicitly and specifically defined and described, and terms that are commonly used, such as terms defined in a dictionary, may be interpreted in consideration of the contextual meaning of the relevant technology.

[0039] In addition, the terms used in the embodiments of the present invention are for the purpose of describing the embodiments and are not intended to limit the present invention. In this specification, the singular may also include the plural unless specifically stated in the phrase, and when it is described as “A and / or at least one (or more) of B, C,” it may include one or more of all combinations that can be combined with A, B, and C.

[0040] Additionally, in describing components of embodiments of the present invention, terms such as first, second, A, B, (a), (b), etc. may be used.

[0041] These terms are intended only to distinguish one component from another, and are not intended to limit the nature, order, or sequence of the component.

[0042] And, when a component is described as being 'connected', 'coupled' or 'connected' to another component, it may include not only cases where the component is directly connected, coupled or connected to the other component, but also cases where the component is 'connected', 'coupled' or 'connected' by another component between the component and the other component.

[0043] Additionally, when it is described as being formed or arranged "above or below" each component, "above" or "below" includes not only cases where the two components are in direct contact with each other, but also cases where one or more other components are formed or arranged between the two components. Also, when it is expressed as "above" or "below", it can include the meaning of the downward direction as well as the upward direction based on one component.

[0044] The electronic device according to the present embodiment is installed in a vehicle and may include a converter, a pump, and an electronic control unit (ECU). However, this is merely exemplary, and the electronic device may include various devices that include at least one electronic component arranged within a housing and are electrically connected through external terminals and connectors.

[0045] FIG. 1 is a perspective view illustrating an exterior of an electronic device according to an embodiment of the present invention, FIG. 2 is a plan view illustrating an upper surface of an electronic device according to an embodiment of the present invention, FIG. 3 is a plan view illustrating a lower surface of an electronic device according to an embodiment of the present invention, FIG. 4 is an exploded perspective view of an electronic device according to an embodiment of the present invention, FIG. 5 is a view illustrating FIG. 4 from a different angle, FIG. 6 is a view illustrating a combined structure of a housing, a heat dissipation member, and a cover according to an embodiment of the present invention, FIG. 7 is a view illustrating a modified example of a combined structure of a housing, a heat dissipation member, and a cover according to an embodiment of the present invention, FIG. 8 is a plan view illustrating an arrangement structure of electronic components and heat dissipation members according to an embodiment of the present invention, and FIG. 9 is a cross-sectional view illustrating an arrangement structure of electronic components and heat dissipation members according to an embodiment of the present invention.

[0046] Referring to FIGS. 1 to 9, an electronic device (10) according to an embodiment of the present invention may include a housing (100), a heat dissipation member (200), a cover (300), and an electronic component (500).

[0047] The housing (100) may form the outer shape of the electronic device (10). The housing (100) may have a rectangular cross-sectional shape. The housing (100) may be formed in a box shape. At least one component for driving the electronic device (10), including the electronic component (500), may be arranged in a space (102) within the housing (100). The space (102) within the housing (100) may be opened downward. A base (not shown) may be coupled to a lower surface of the housing (100) to cover the lower surface of the space (102).

[0048] The housing (100) may include a top plate (110) and a side plate (120). The top plate (110) may form the top surface of the housing (100). The top plate (110) may include a plurality of regions that are arranged in a stepped manner in the vertical direction. For example, the top surface of the top plate (110) may include a first surface (111) and a second surface (112). The first surface (111) and the second surface (112) may be arranged in a stepped manner relatively upward compared to other regions. The area where the first surface (111) and the second surface (112) are arranged on the lower surface of the housing (100) may be formed to be concave upward compared to other regions. Accordingly, a wider space for arranging components within the housing (100) may be secured.

[0049] The side plate (120) may extend downwardly from the edge of the upper plate (110). There may be four side plates (120). The side plates (120) may include a first side plate, a second side plate facing the first side plate, a third side plate connecting the first side plate and the second side plate, and a fourth side plate facing the third side plate and connecting the first side plate and the second side plate. The third side plate and the fourth side plate may be arranged perpendicularly to the first side plate and the second side plate, respectively.

[0050] The housing (100) may include a heat dissipation passage (130). The heat dissipation passage (130) may be formed concavely downward from the upper surface of the housing (100). The heat dissipation passage (130) may have a groove shape. The heat dissipation passage (130) may be formed in the upper plate (110). Both ends of the heat dissipation passage (130) may be arranged in the side plate (120). For example, both ends of the heat dissipation passage (130) may be arranged in the first side plate and the third side plate, respectively.

[0051] At least a portion of the heat dissipation member (200) may be coupled to the heat dissipation passage (130). The heat dissipation passage (130) may include one end formed on one side of the housing (100) and the other end formed on the other side adjacent to the one side of the housing (100). A first opening forming one end of the heat dissipation passage (130) may be arranged on one side of the housing (100), and a second opening forming the other end of the heat dissipation passage (130) may be arranged on the other side of the housing (100). The heat dissipation passage (130) may be formed as a single line from the one end to the other end. A first side portion (122) forming one end of the heat dissipation passage (130) and a second side portion (124) forming the other end of the heat dissipation passage (130) may be arranged on the side of the housing (100).

[0052] The area corresponding to the formation area of ​​the heat dissipation passage (130) among the lower surfaces of the upper surface plate (110) may protrude downwards more than other areas. A protrusion (139, see FIG. 5) may be formed in the area corresponding to the lower surface of the heat dissipation passage (130) among the lower surfaces of the upper surface plate (110).

[0053] The inner surface of the heat dissipation passage (130) may be a curved surface having a predetermined curvature. The heat dissipation passage (130) may have a cross-sectional shape that is approximately semicircular. The heat dissipation passage (130) may have a region that is bent at least once. The heat dissipation passage (130) may be arranged to overlap the electronic component (500) in the vertical direction.

[0054] A rib (150) may be formed in the heat dissipation passage (130). The rib (150) may have a shape that protrudes inward from the inner surface of the heat dissipation passage (130). The rib (150) may have an arc-shaped cross-section. The rib (150) may be provided in plurality, one of which may be disposed adjacent to one end of the heat dissipation passage (130), and the other of which may be disposed adjacent to the other end of the heat dissipation passage (130). The rib (150) may be in contact with the outer surface of the heat dissipation member (200). When the heat dissipation member (200) is coupled within the heat dissipation passage (130), the outer surface of the heat dissipation member (200) may be spaced apart from the inner surface of the heat dissipation passage (130) by a predetermined distance in the vertical direction through the rib (150).

[0055] A first guide (160) may be formed in the heat dissipation passage (130). The first guide (160) may have a shape that protrudes inward from the inner surface of the heat dissipation passage (130). A plurality of first guides (160) may be provided, and may be arranged to be spaced apart from each other along the length direction of the heat dissipation passage (130). Accordingly, a guide groove (162) may be formed between the plurality of first guides (160). The first guide (160) may be arranged adjacent to one of one end and the other end of the heat dissipation passage (130). For example, the first guide (160) may be arranged adjacent to the other end of the heat dissipation passage (130) corresponding to the arrangement area of ​​the discharge portion (240) of the heat dissipation member (200) described later. The second guide (242) of the heat dissipation member (200), which will be described later, is coupled to the guide groove (162) formed between the plurality of first guides (160), so that the coupling state of the heat dissipation member (200) can be firmly maintained within the heat dissipation passage (130).

[0056] The housing (100) may include a first coupling portion (140). The first coupling portion (140) may be disposed on the upper plate (110). The first coupling portion (140) may be disposed on the outer side of the heat dissipation passage (130) on the upper surface of the housing (100). A first protrusion (142) may be formed on the first coupling portion (140). The first protrusion (142) has a shape that protrudes upward more than other areas, and may be coupled with a coupling hole (342) of the cover (300) to be described later.

[0057] However, this is exemplary, and a screw hole may be formed in the first connecting portion (140) instead of the first protrusion (142). Accordingly, the housing (100) and the cover (300) may be screw-connected through a screw that is connected to the connecting hole (342) and the screw hole of the cover (300).

[0058] The above first connecting portion (140) may be provided in multiple numbers and arranged along the length of the heat dissipation passage (130).

[0059] The housing (100) may include a second coupling portion (170). The second coupling portion (170) is for coupling with the cover (300) and may have a shape that protrudes upward from the upper surface of the housing (100). The second coupling portion (170) may be arranged on the outside of the heat dissipation passage (130). The second coupling portion (170) includes a plurality of protruding regions, and the plurality of protruding regions may be arranged to face each other in a direction perpendicular to the longitudinal direction of the heat dissipation passage (130). An inwardly protruding catch portion (172) may be formed on the inner surface of the plurality of protruding regions arranged to face each other. The catch portion (172) may be hook-coupled to a flange portion (320) of the cover (300) to be described later. To facilitate the connection of the cover (300), an inclined surface may be formed on the inner surface of the catch (172). The second connection portion (170) may be provided in multiple numbers and may be arranged at one end and the other end of the heat dissipation passage (130).

[0060] The heat dissipation passage (130) may include a hole (135). The hole (135) may be formed on the lower surface of the heat dissipation passage (130). The hole (135) may be formed to penetrate the inner surface of the heat dissipation passage (130). The hole (135) may be arranged in an area overlapping with the electronic component (500). At least a portion of the heat dissipation member (200) may be exposed to the space (102) within the housing (100) through the hole (135). At least a portion of the heat dissipation member (200) may be arranged to face the electronic component (500) through the hole (135).

[0061] The material of the above housing (100) may be plastic. Accordingly, the electronic device (10) can be made lighter.

[0062] A reinforcing member (not shown) having a shape that protrudes outward from other areas may be formed on the outer surface of the housing (100). For example, the reinforcing member may be formed on the upper or lower surface of the upper plate (110) or the surface of the side plate (120). The strength of the housing (100) may be reinforced through the reinforcing member.

[0063] At least one electronic component may be placed in the space (102) within the housing (100). A printed circuit board (not shown) may be placed in the space (102) within the housing (100). The printed circuit board is formed in a plate shape, and at least one component for driving may be placed (mounted) on one or the other surface.

[0064] An electronic component (500) may be placed in a space (102) within the housing (100). The electronic component (500) may be mounted on the surface of the printed circuit board. The electronic component (500) may include a core (502, see FIG. 8) and a plurality of pins (505) extending from the core (502) and for coupling with the printed circuit board. The electronic component (500) may generate heat by driving. The electronic component (500) may be placed on the lower surface of the upper plate (110) of the housing (100).

[0065] The electronic component (500) may be arranged to overlap vertically with the heat dissipation passage (130). The electronic component (500) may be arranged to overlap vertically with at least a portion of the heat dissipation member (200). The electronic component (500) may be arranged to overlap vertically with the hole (135) of the heat dissipation passage (130).

[0066] The electronic component (500) may be screw-coupled to the lower surface of the upper plate (110). The electronic component (500) may include a plurality of screw holes (510). The screw holes (510) may be formed to penetrate from one surface to the other surface of the core (502). The screw may be screw-coupled to the lower surface of the housing (100) by penetrating the screw holes (510). The plurality of screw holes (510) may be arranged to be spaced apart from each other along the first direction.

[0067] The electronic device (10) may include a heat dissipation member (200). The heat dissipation member (200) may include a passage (202) through which a refrigerant flows therein. The heat dissipation member (200) may be formed in a pipe shape. The heat dissipation member (200) may have a circular cross-section. When the heat dissipation member (200) is coupled to the heat dissipation passage (130), a portion of the heat dissipation member (200) may protrude upward from the upper plate (110) due to the semicircular cross-section shape of the heat dissipation passage (130).

[0068] The heat dissipation member (200) may be arranged within the heat dissipation passage (130). Both ends of the heat dissipation member (200) may protrude outward from both ends of the heat dissipation passage (160). At least a portion of the heat dissipation member (200) may be exposed to the space (102) within the housing (100) through the hole (135). The heat dissipation member (200) may be arranged to face the electronic component (500) through the hole (135).

[0069] The above heat dissipation member (200) can be formed of a metal material.

[0070] A refrigerant inlet (210) for introducing refrigerant into the passage may be formed at one end of the heat dissipation member (200), and a refrigerant discharge (240) for discharging the refrigerant circulated through the passage may be formed at the other end of the heat dissipation member (200). The refrigerant inlet (210) and the refrigerant discharge (240) may be arranged in parallel. The heat dissipation member (200) may be formed as a single line defined from the refrigerant inlet (210) to the refrigerant discharge (240). Among the side surfaces of the housing (100), the side surface on which the refrigerant inlet (210) is arranged and the side surface on which the refrigerant discharge (240) is arranged may be perpendicular to each other.

[0071] Meanwhile, the flow direction of the refrigerant in the heat dissipation member (200) described above is exemplary, and the refrigerant is introduced through the refrigerant discharge portion (240), and the introduced refrigerant can be discharged to the outside through the refrigerant inlet portion (210).

[0072] The above heat dissipation member (200) may have a region that is bent at least once.

[0073] A vertical portion (220) and a contact portion (230) may be arranged between the refrigerant inlet portion (210) and the refrigerant discharge portion (240). The vertical portion (220) may be bent from an end of the refrigerant inlet portion (210) and may extend toward the housing (100). A first bent portion (215) may be formed between the refrigerant inlet portion (210) and the vertical portion (220). The vertical portion (220) may be arranged perpendicular to the refrigerant inlet portion (210) and the refrigerant discharge portion (240).

[0074] The heat dissipation member (200) may include a contact portion (230) disposed between the refrigerant inlet portion (210) and the refrigerant discharge portion (240). The contact portion (230) may be bent from an end of the vertical portion (220) and may extend toward the refrigerant discharge portion (220). The contact portion (230) may be disposed to form an obtuse angle with the refrigerant inlet portion (210) or the refrigerant discharge portion (240). A second bent portion (225) may be formed between the vertical portion (220) and the contact portion (230). A third bent portion (235) may be formed between the vertical portion (220) and the refrigerant discharge portion (240). The contact portion (230) may be disposed to connect one side surface and the other side surface of the housing (100) that are disposed adjacent to each other.

[0075] As illustrated in FIG. 8, the contact portion (230) can be arranged in a second direction perpendicular to the first direction, which is the arrangement direction of the plurality of screw holes (510).

[0076] The length of the above contact portion (230) may be longer than the lengths of the refrigerant inlet portion (210), the refrigerant discharge portion (240), and the vertical portion (220).

[0077] The contact portion (230) may be arranged within the heat dissipation passage (230). In some cases, at least a portion of the vertical portion (220) and the refrigerant discharge portion (240) may also be arranged within the heat dissipation passage (230). The contact portion (230) may have its lower surface exposed to the space (102) within the housing (100) through the hole (135). The lower surface of the contact portion (230) may be arranged to face the electronic component (500).

[0078] A flat surface (235, see FIG. 5) may be formed on the lower surface of the contact portion (230) exposed downward from the heat dissipation passage (130) through the hole (135). The heat dissipation member (200) excluding the contact portion (230) has a circular cross-sectional shape, but at least a part of the cross-section of the contact portion (230) formation area may not be circular due to the flat surface (235). The flat surface (235) may be formed to be stepped upward compared to other areas of the lower surface of the heat dissipation member (200). Based on the lower surface of the heat dissipation member (200), the formation area of ​​the flat surface (232) may have a groove shape that is concave upward compared to other areas. The flat surface (232) may be formed through press processing.

[0079] The flat surface (235) may be formed in an area of ​​the lower surface of the contact portion (230) that faces the electronic component (170). The flat surface (235) may be a surface parallel to the upper or lower surface of the upper surface plate (110) of the housing (100). The flat surface (235) may be in contact with the electronic component (500). Alternatively, a metal plate (not shown) or a heat-conducting member (not shown) made of a material with excellent heat conductivity may be placed between the flat surface (235) and the electronic component (500). An inclined surface (237) may be formed in an area of ​​the lower surface of the heat-dissipating member (200) that connects the flat surface (235) and another surface.

[0080] The outer surface of the heat dissipation member (200) may be spaced apart from the inner surface of the heat dissipation passage (130). When the heat dissipation member (200) and the housing (100) are coupled, the outer surface of the heat dissipation member (200) may come into contact with the rib (150). Accordingly, a surface of the outer surface of the heat dissipation member (200) that does not come into contact with the rib (150) may be spaced apart from the inner surface of the heat dissipation passage (130). A first gap (410, see FIG. 6) may be formed between the outer surface of the heat dissipation member (200) and the inner surface of the heat dissipation passage (130). A heat transfer material (180, see FIG. 10) may be disposed in the first gap (410). The above heat transfer material (180) can be applied to the outer surface of the heat dissipation member (200) or the inner surface of the heat dissipation passage (130).

[0081] The heat dissipation member (200) may include a second guide (242). The second guide (242) may be arranged on the outer surface of the refrigerant discharge portion (240). The second guide (242) may have a shape that protrudes outward from other areas of the outer surface of the heat dissipation member (200). The second guide (242) may have a ring-shaped cross-section. The second guide (242) may be coupled to a guide groove (162, see FIG. 4) of the housing (100). By coupling the second guide (242) and the guide groove (162), the coupling of the heat dissipation member (200) within the heat dissipation passage (130) is primarily guided, and at the same time, the coupling state with the housing (100) may be firmly maintained.

[0082] The electronic device (10) may include a cover (300). The cover (300) may be coupled to the upper surface of the housing (100). The cover (300) may be coupled to the heat dissipation passage (130). By coupling the cover (300), a portion of the upper surface of the heat dissipation member (200) may be covered. A space in which the heat dissipation member (200) is arranged may be formed by the inner surface of the heat dissipation passage (130) and the lower surface of the cover (300) facing the inner surface of the heat dissipation passage (130).

[0083] The above cover (300) can be formed of plastic or metal material.

[0084] The cover (300) may include a curved portion (310) and flange portions (320) disposed at both ends of the curved portion (310). The curved portion (310) may have a semicircular cross-section. The lower surface of the curved portion (310) may be disposed to face the upper surface of the heat dissipation member (200). A portion of the heat dissipation member (200) may be disposed within the heat dissipation passage (130), and another portion of the heat dissipation member (200) may be disposed within the space within the curved portion (310).

[0085] The lower surface of the above-mentioned curved portion (310) may be spaced apart from at least a portion of the upper surface of the above-mentioned heat dissipation member (200). A second gap (420, see FIG. 6) may be formed between the lower surface of the above-mentioned curved portion (310) and the upper surface of the above-mentioned heat dissipation member (200) so that a heat transfer material may be applied.

[0086] The flange portion (320) may have a shape that protrudes outward from the side surface of the curved portion (310). The lower surface of the flange portion (320) may be arranged parallel to the upper surface of the housing (100). The flange portion (320) may be formed along the longitudinal direction of the cover (300). The flange portion (320) may be hook-coupled to the housing (100).

[0087] As illustrated in Fig. 6, when the housing (100) and the cover (300) are coupled, the upper surface of the flange portion (320) can be supported by the lower surface of the catch portion (172) of the second coupling portion (170). The lower surface of the catch portion (172) can be in contact with the upper surface of the flange portion (320).

[0088] Meanwhile, in the present embodiment, the second coupling portion (170) is formed on the housing (100), and the flange portion (320) is formed on the cover (300) to be hook-coupled as an example, but this is not limited thereto, and as illustrated in FIG. 7, the second coupling portion (390) may be disposed on the cover (300), and a groove (190) formed on the upper surface of the housing (100) to which the second coupling portion (390) is coupled may be formed, so that the cover (300) and the housing (100) may be hook-coupled. In this case, the second coupling portion (390) formed on the cover (300) may have a shape that protrudes downward from the lower surface of the flange portion (320), and a hook portion (392) may be formed at the lower end. In addition, a groove (190) for coupling the second coupling part (390) and a groove for coupling the catch part (392) may be formed on the upper surface of the housing (100).

[0089] The cover (300) may include a third coupling portion (340). The third coupling portion (340) has a shape that protrudes outward from the outer surface of the flange portion (320) more than other areas, and may include a coupling hole (342). When the cover (300) is coupled to the housing (100), the first protrusion (142) may be coupled to the coupling hole (342). As described above, the housing (100) and the cover (300) may be screw-coupled, and in this case, a screw may penetrate the screw hole of the housing (100) and be screw-coupled to the coupling hole (342).

[0090] A reinforcing portion having a shape that protrudes outward more than other areas may be formed on the outer surface of the cover (300), and the strength of the cover (300) may be reinforced through the reinforcing portion.

[0091] Below, the assembly process of an electronic device according to an embodiment of the present invention will be described.

[0092] Figures 10 to 12 are drawings illustrating an assembly process of an electronic device according to an embodiment of the present invention.

[0093] Referring to FIG. 10, an electronic device (10) according to an embodiment of the present invention can first manufacture a housing (100) through an injection molding process and apply the heat transfer material (180) to the inner surface of the heat dissipation passage (130).

[0094] Next, as shown in Fig. 11, the heat dissipation member (200) can be combined into the space within the heat dissipation passage (130). In this case, the first gap (410) can be formed between the inner surface of the heat dissipation passage (130) and the surface of the heat dissipation member (200), and the heat transfer material (180) can be placed in the first gap (140).

[0095] In a state where the heat dissipation member (200) is coupled to the heat dissipation passage (130), a heat transfer material (180) can be applied to the surface of the heat dissipation member (200) exposed upward from the housing (100).

[0096] Next, as shown in Fig. 12, the cover (300) can be coupled to the housing (100). Accordingly, the coupling state between the heat dissipation member (200) and the housing (100) can be firmly maintained. The cover (300) can be screw-coupled to the housing (100).

[0097] According to the above structure, there is an advantage in that the electronic device can be made lighter and the manufacturing cost can be lowered through the plastic material housing.

[0098] In addition, it has the advantage of being able to firmly bond housings and heat dissipation members of different materials together through the cover, and of improving production efficiency through a simple assembly process.

[0099] In addition, there is an advantage in that heat dissipation efficiency can be improved by the arrangement structure of the housing, electronic components, and heat dissipation members.

[0100] Although all components constituting the embodiments of the present invention have been described above as being combined or operating in combination, the present invention is not necessarily limited to these embodiments. That is, within the scope of the purpose of the present invention, all components may be selectively combined and operated one or more times. In addition, terms such as "include," "comprise," or "have" described above, unless specifically stated to the contrary, mean that the corresponding component may be inherent, and therefore should be interpreted as including other components rather than excluding other components. All terms, including technical or scientific terms, have the same meaning as generally understood by a person of ordinary skill in the art to which the present invention pertains, unless otherwise defined. Commonly used terms, such as terms defined in a dictionary, should be interpreted as being consistent with the contextual meaning of the related technology, and shall not be interpreted in an ideal or excessively formal sense, unless explicitly defined in the present invention.

[0101] The above description is merely an illustrative description of the technical idea of ​​the present invention, and those skilled in the art will appreciate that various modifications and variations may be made without departing from the essential characteristics of the present invention. Therefore, the embodiments disclosed in the present invention are intended to illustrate rather than limit the technical idea of ​​the present invention, and the scope of the technical idea of ​​the present invention is not limited by these embodiments. The scope of protection of the present invention should be interpreted by the following claims, and all technical ideas within a scope equivalent thereto should be interpreted as being included in the scope of the rights of the present invention.

Claims

1. A housing having a space formed inside and a heat dissipation passage formed on one side; Electronic components placed in the above space; A heat dissipation member arranged in the above heat dissipation passage and having a refrigerant flowing therein; and It is coupled to one side of the housing and includes a cover that covers the heat dissipation passage, The above heat dissipation passage includes a hole facing the electronic component, An electronic device in which the heat dissipation member is arranged to overlap the electronic component in the vertical direction at least partially through the hole.

2. In paragraph 1, The material of the above housing is plastic, An electronic device in which the material of the above heat dissipation member is metal.

3. In paragraph 1, The above cover is an electronic device that is hook-connected to the above housing.

4. In paragraph 1, The above cover is an electronic device that is screw-connected to the above housing.

5. In paragraph 1, The surface of the heat dissipation member facing the electronic component is a flat surface, An electronic device in which the above flat surface overlaps the above hole.

6. In paragraph 5, On the inner surface of the above heat dissipation passage, ribs having a shape that protrudes more than other areas are arranged, An electronic device in which at least a portion of the surface of the heat dissipation member is spaced apart from the inner surface of the heat dissipation passage by contact between the rib and the heat dissipation member.

7. In paragraph 6, A first gap is formed between the surface of the heat dissipation member and the inner surface of the heat dissipation passage, An electronic device in which a heat transfer material is placed in the first gap.

8. In paragraph 1, A second gap is formed between the inner surface of the cover and the surface of the heat dissipation member, An electronic device in which a heat transfer material is placed in the second gap.

9. In paragraph 1, On the inner surface of the above heat dissipation passage, a plurality of first guides and a first guide groove formed between the plurality of first guides are arranged, An electronic device in which a second guide is arranged on the outer surface of the heat dissipation member to protrude outward from other areas and to be coupled to the first guide groove.

10. In paragraph 1, The above heat dissipation member has an area that is bent at least once, The above heat dissipation member includes a refrigerant inlet portion arranged at one end, a refrigerant discharge portion arranged at the other end, and a contact portion arranged between the refrigerant inlet portion and the refrigerant discharge portion. An electronic device in which one side of the housing where the refrigerant inlet is arranged and the other side of the housing where the refrigerant outlet is arranged are adjacent to each other.

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