Electronic device comprising antenna

Abstract

According to various embodiments, an electronic device comprises: a housing; an antenna structure which is disposed in the inner space of the housing, and which includes a substrate having a first substrate surface, a second substrate surface facing the direction opposite to that of the first substrate surface and a ground layer disposed between the first substrate surface and the second substrate surface, a first conductive patch having a plurality of sub-patches disposed to correspond to the ground layer, and a second conductive patch disposed between a first sub-patch and a second sub-patch from among the plurality of sub-patches when the first substrate surface is viewed from above; and a wireless communication circuit for transmitting or receiving a first wireless signal in a first frequency band through the plurality of sub-patches, and transmitting or receiving a second wireless signal in a second frequency band through the second conductive patch, and may comprise a first non-conductive region disposed at a position overlapping at least a part of the second conductive patch when the first substrate surface is viewed from above.

Description

Electronic device including an antenna

[0001] Embodiments of the present disclosure relate to an electronic device including an antenna.

[0002] Electronic devices can communicate with external electronic devices using various wireless communication technologies. For example, the wireless communication technologies can include at least one of ultra-wideband (UWB) communication, wireless fidelity (Wi-Fi) communication, long term evolution (LTE) communication, 5G communication (or new radio (NR) communication), or Bluetooth communication. For example, an electronic device supporting ultra-wideband (UWB) communication can measure the location of at least one external electronic device or the distance to at least one external electronic device using a UWB antenna including at least two antenna elements (e.g., conductive patches or antenna radiators).

[0003] The above information may be provided as background art to aid in understanding the present disclosure. No claim or determination is made as to whether any of the above is applicable as prior art related to the present disclosure.

[0004] The electronic device may include at least one antenna (e.g., an antenna structure or an antenna module). The at least one antenna may include a legacy antenna operating in a frequency band ranging from about 600 MHz to 6000 MHz, a 5G antenna operating in a frequency band ranging from about 3 GHz to 300 GHz, or an antenna for measuring the location of an external electronic device located in close proximity. For example, the antenna for measuring the location of an external electronic device located in close proximity may include an ultra wide band (UWB) antenna comprising at least two antenna elements operating in a frequency band ranging from about 6 GHz to 8.5 GHz.

[0005] In one embodiment, the UWB antenna may include a dual-band antenna that operates in a first frequency band (e.g., Ch 9, a frequency band ranging from about 7.75 GHz to about 8.25 GHz) via first conductive patches and second conductive patches arranged side by side along a first direction on a dielectric substrate (e.g., FPCB, flexible printed circuit board), and operates in a second frequency band (e.g., Ch 5, a frequency band ranging from about 6.25 GHz to about 6.75 GHz) different from the first frequency band via third conductive patches arranged side by side with the first conductive patches along a second direction different (e.g., perpendicular) to the first direction.

[0006] Due to the design constraints of circular polarization (CP) antennas, which must be formed to have a symmetrical shape, linear polarization (LP) antennas, which are easy to design for dual-band, can be mainly used.

[0007] However, linearly polarized antennas can exhibit significant performance variations depending on the alignment between the transmitter and receiver of the electronic device and the external electronic device. For example, if the polarization direction between the transmitter and receiver of the electronic device and the external electronic device approaches 90 degrees (e.g., if the antenna's radiation planes are misaligned), transmission and reception sensitivity may deteriorate, causing discomfort to the user.

[0008] An aspect of the present disclosure addresses at least the problems and / or disadvantages mentioned above, and provides at least the advantages described below. Various embodiments of the present disclosure provide an antenna and an electronic device including the same that can help improve the radiation performance of a UWB antenna.

[0009] Various embodiments provide antennas and electronic devices including the same that can help improve isolation between antennas.

[0010] However, the problem to be solved in this disclosure is not limited to the problem mentioned above, and may be expanded in various ways without departing from the spirit and scope of this disclosure.

[0011] According to various embodiments, an electronic device may include a housing, an antenna structure disposed in an interior space of the housing, the substrate including a first substrate surface, a second substrate surface facing in an opposite direction to the first substrate surface, and a ground layer disposed in a space between the first substrate surface and the second substrate surface, an antenna structure including a first plurality of conductive patches disposed in correspondence with the ground layer on the substrate, and a second conductive patch disposed between a first sub-patch and a second sub-patch among the first plurality of conductive patches on the substrate, and a wireless communication circuit configured to transmit or receive a wireless signal in a first frequency band through the first plurality of conductive patches and to transmit or receive a wireless signal in a second frequency band through the second conductive patch, and a first non-conductive region disposed at a position overlapping at least a portion of the second conductive patch when the first substrate surface is viewed from above.

[0012] An electronic device according to exemplary embodiments of the present disclosure may be used for UWB and may include a second conductive patch operating in a second frequency band disposed between a first plurality of conductive patches operating in a first frequency band, and a non-conductive region formed in at least a portion of an area overlapping the second conductive patch, thereby helping to improve isolation between the first plurality of conductive patches, and the second conductive patch may be operated as a diversity antenna with other surrounding antennas, thereby helping to improve radiation performance of the antenna.

[0013] In addition, various effects may be provided, either directly or indirectly, through this document.

[0014] The effects that can be obtained from the present disclosure are not limited to the effects mentioned above, and other effects that are not mentioned can be clearly understood by a person having ordinary skill in the art to which the present disclosure belongs from the description below.

[0015] In connection with the description of the drawings, the same or similar reference numerals may be used for the same or similar components.

[0016] FIG. 1 is a block diagram of an electronic device in a network environment according to various embodiments of the present disclosure.

[0017] FIG. 2A is a front view of an electronic device in an unfolded state according to various embodiments of the present disclosure.

[0018] FIG. 2b is a drawing illustrating the rear side of an electronic device in an unfolded state according to various embodiments of the present disclosure.

[0019] FIG. 3A is a drawing illustrating the front side of an electronic device in a folded state according to various embodiments of the present disclosure.

[0020] FIG. 3b is a drawing illustrating the rear side of an electronic device in a folded state according to various embodiments of the present disclosure.

[0021] FIG. 4 is an exploded perspective view of an electronic device according to various embodiments of the present disclosure.

[0022] FIG. 5A is a configuration diagram of an antenna structure according to various embodiments of the present disclosure.

[0023] FIG. 5b is a perspective view of an antenna structure according to various embodiments of the present disclosure.

[0024] FIG. 5c is a cross-sectional view of an antenna structure taken along line 5c-5c of FIG. 5a according to various embodiments of the present disclosure.

[0025] FIG. 5d is a configuration diagram of a second challenging patch according to various embodiments of the present disclosure.

[0026] FIGS. 6A and 6B are drawings comparing the radiation performance of a second antenna with or without a non-conductive region according to various embodiments of the present disclosure.

[0027] FIGS. 7A and 7B are graphs comparing the radiation performance of a second antenna with or without a non-conductive region according to various embodiments of the present disclosure.

[0028] FIG. 8 is a graph comparing the performance of the first antenna according to the rotation of the opposing terminal according to various embodiments of the present disclosure.

[0029] FIG. 9 is a graph comparing the isolation of the first sub-patch and the second sub-patch according to the presence or absence of non-conductivity according to various embodiments of the present disclosure.

[0030] FIG. 10 is a graph comparing the radiation performance of a second antenna according to a second length of a non-conductive region according to various embodiments of the present disclosure.

[0031] FIG. 11 is a cross-sectional view of a portion of an electronic device taken along line 11-11 of FIG. 2b according to various embodiments of the present disclosure.

[0032] FIGS. 12A and 12B are schematic diagrams illustrating operation scenarios of an electronic device according to various embodiments of the present disclosure.

[0033] FIG. 13 is a configuration diagram of an antenna structure according to various embodiments of the present disclosure.

[0034] FIGS. 14A and 14B are configuration diagrams of antenna structures according to various embodiments of the present disclosure.

[0035] FIGS. 15A to 15C are configuration diagrams of antenna structures according to various embodiments of the present disclosure.

[0036] FIG. 16A is a front perspective view of an electronic device according to various embodiments of the present disclosure.

[0037] FIG. 16b is a rear perspective view of an electronic device according to various embodiments of the present disclosure.

[0038] FIG. 17A is a front perspective view of an electronic device according to various embodiments of the present disclosure.

[0039] FIG. 17b is a rear perspective view of an electronic device according to various embodiments of the present disclosure.

[0040] Hereinafter, embodiments of the present disclosure will be described in detail with reference to the drawings so that those skilled in the art can easily implement the present disclosure. However, the present disclosure may be implemented in various different forms and is not limited to the embodiments described herein. In connection with the description of the drawings, the same or similar reference numerals may be used for identical or similar components. Furthermore, in the drawings and related descriptions, descriptions of well-known functions and configurations may be omitted for clarity and conciseness.

[0041] FIG. 1 is a block diagram of an electronic device in a network environment according to various embodiments of the present disclosure.

[0042] Referring to FIG. 1, in a network environment (100), an electronic device (101) may communicate with an electronic device (102) via a first network (198) (e.g., a short-range wireless communication network), or may communicate with at least one of an electronic device (104) or a server (108) via a second network (199) (e.g., a long-range wireless communication network). In one embodiment, the electronic device (101) may communicate with the electronic device (104) via the server (108). According to one embodiment, the electronic device (101) may include at least one processor (120), memory (130), input module (150), audio output module (155), display module (160), audio module (170), sensor module (176), interface (177), connection terminal (178), haptic module (179), camera module (180), power management module (188), battery (189), communication module (190), subscriber identification module (196), antenna module (197), or drive control module (181). In some embodiments, the electronic device (101) may omit at least one of these components (e.g., connection terminal (178)), or may have one or more other components added. In some embodiments, some of these components (e.g., sensor module (176), camera module (180), or antenna module (197)) may be integrated into one component (e.g., display module (160)).

[0043] The processor (120) may, for example, execute software (e.g., a program (140)) to control at least one other component (e.g., a hardware or software component) of the electronic device (101) connected to the processor (120) and perform various data processing or operations. According to one embodiment, as at least a part of the data processing or operations, the processor (120) may store commands or data received from other components (e.g., a sensor module (176) or a communication module (190)) in a volatile memory (132), process the commands or data stored in the volatile memory (132), and store result data in a non-volatile memory (134). According to one embodiment, the processor (120) may include a main processor (121) (e.g., a central processing unit or an application processor) or an auxiliary processor (123) (e.g., a graphics processing unit, a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor) that can operate independently or together with the main processor (121). For example, when the electronic device (101) includes the main processor (121) and the auxiliary processor (123), the auxiliary processor (123) may be configured to use less power than the main processor (121) or to be specialized for a given function. The auxiliary processor (123) may be implemented separately from the main processor (121) or as a part thereof.

[0044] The auxiliary processor (123) may control at least a portion of functions or states associated with at least one component (e.g., a display module (160), a sensor module (176), or a communication module (190)) of the electronic device (101), for example, on behalf of the main processor (121) while the main processor (121) is in an inactive (e.g., sleep) state, or together with the main processor (121) while the main processor (121) is in an active (e.g., application execution) state. In one embodiment, the auxiliary processor (123) (e.g., an image signal processor or a communication processor) may be implemented as a part of another functionally related component (e.g., a camera module (180) or a communication module (190)). In one embodiment, the auxiliary processor (123) (e.g., a neural network processing unit) may include a hardware structure specialized for processing artificial intelligence models. The artificial intelligence models may be generated through machine learning. This learning can be performed, for example, on the electronic device (101) itself where the artificial intelligence model is executed, or can be performed through a separate server (e.g., server (108)). The learning algorithm can include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model can include multiple artificial neural network layers.The artificial neural network may be one of a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to, or alternatively to, a hardware structure, an artificial intelligence model may include a software structure.

[0045] The memory (130) can store various data used by at least one component (e.g., processor (120) or sensor module (176)) of the electronic device (101). The data can include, for example, software (e.g., program (140)) and input data or output data for commands related thereto. The memory (130) can include a volatile memory (132) or a non-volatile memory (134). The non-volatile memory (134) can include at least one of an internal memory (136) or an external memory (138).

[0046] The program (140) may be stored as software in the memory (130) and may include, for example, an operating system (142), middleware (144), or an application (146).

[0047] The input module (150) can receive commands or data to be used in a component of the electronic device (101) (e.g., a processor (120)) from an external source (e.g., a user) of the electronic device (101). The input module (150) can include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0048] The audio output module (155) can output audio signals to the outside of the electronic device (101). The audio output module (155) can include, for example, a speaker or a receiver. The speaker can be used for general purposes, such as multimedia playback or recording playback. The receiver can be used to receive incoming calls. In one embodiment, the receiver can be implemented separately from the speaker or as part of the speaker.

[0049] The display module (160) can visually provide information to an external party (e.g., a user) of the electronic device (101). The display module (160) may include, for example, a display, a holographic device, or a projector and a control circuit for controlling the device. According to one embodiment, the display module (160) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of a force generated by the touch.

[0050] The audio module (170) can convert sound into an electrical signal, or vice versa, convert an electrical signal into sound. According to one embodiment, the audio module (170) can acquire sound through the input module (150), output sound through the sound output module (155), or an external electronic device (e.g., electronic device (102)) (e.g., speaker or headphone) directly or wirelessly connected to the electronic device (101).

[0051] The sensor module (176) can detect the operating status (e.g., power or temperature) of the electronic device (101) or the external environmental status (e.g., user status) and generate an electrical signal or data value corresponding to the detected status. According to one embodiment, the sensor module (176) can include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0052] The interface (177) may support one or more designated protocols that may be used to directly or wirelessly connect the electronic device (101) with an external electronic device (e.g., the electronic device (102)). In one embodiment, the interface (177) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0053] The connection terminal (178) may include a connector through which the electronic device (101) may be physically connected to an external electronic device (e.g., electronic device (102)). According to one embodiment, the connection terminal (178) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0054] The haptic module (179) can convert electrical signals into mechanical stimuli (e.g., vibration or movement) or electrical stimuli that a user can perceive through tactile or kinesthetic sensations. According to one embodiment, the haptic module (179) can include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

[0055] The camera module (180) can capture still images and moving images. According to one embodiment, the camera module (180) may include one or more lenses, image sensors, image signal processors, or flashes.

[0056] The power management module (188) can manage power supplied to the electronic device (101). According to one embodiment, the power management module (188) can be implemented as, for example, at least a part of a power management integrated circuit (PMIC).

[0057] A battery (189) may power at least one component of the electronic device (101). In one embodiment, the battery (189) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0058] The communication module (190) may support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device (101) and an external electronic device (e.g., electronic device (102), electronic device (104), or server (108)), and the performance of communication through the established communication channel. The communication module (190) may operate independently from the processor (120) (e.g., application processor) and may include one or more communication processors that support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (190) may include a wireless communication module (192) (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module (194) (e.g., a local area network (LAN) communication module, or a power line communication module). Among these communication modules, the corresponding communication module can communicate with an external electronic device (104) via a first network (198) (e.g., a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network (199) (e.g., a long-range communication network such as a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN)). These various types of communication modules can be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (192) can verify or authenticate the electronic device (101) within a communication network such as the first network (198) or the second network (199) by using subscriber information (e.g., an international mobile subscriber identity (IMSI)) stored in the subscriber identification module (196).

[0059] The wireless communication module (192) can support 5G networks and next-generation communication technologies following the 4G network, such as NR access technology (new radio access technology). The NR access technology can support high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimization of terminal power and connection of multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low-latency communications)). The wireless communication module (192) can support, for example, a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate. The wireless communication module (192) can support various technologies for securing performance in a high-frequency band, such as beamforming, massive multiple-input and multiple-output (MIMO), full dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large scale antenna. The wireless communication module (192) can support various requirements specified in the electronic device (101), an external electronic device (e.g., the electronic device (104)), or a network system (e.g., the second network (199)). According to one embodiment, the wireless communication module (192) can support a peak data rate (e.g., 20 Gbps or more) for eMBB realization, a loss coverage (e.g., 164 dB or less) for mMTC realization, or a U-plane latency (e.g., 0.5 ms or less for downlink (DL) and uplink (UL), or 1 ms or less for round trip) for URLLC realization.

[0060] The antenna module (197) can transmit or receive signals or power to or from an external device (e.g., an external electronic device). In one embodiment, the antenna module (197) may include an antenna including a radiator formed of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). In one embodiment, the antenna module (197) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as the first network (198) or the second network (199), may be selected from the plurality of antennas, for example, by the communication module (190). A signal or power may be transmitted or received between the communication module (190) and an external electronic device via the at least one selected antenna. In some embodiments, in addition to the radiator, another component (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as a part of the antenna module (197).

[0061] According to various embodiments, the antenna module (197) may form a mmWave antenna module. In one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent a first side (e.g., a bottom side) of the printed circuit board and capable of supporting a designated high-frequency band (e.g., a mmWave band), and a plurality of antennas (e.g., an array antenna) disposed on or adjacent a second side (e.g., a top side or a side side) of the printed circuit board and capable of transmitting or receiving signals in the designated high-frequency band.

[0062] At least some of the above components can be interconnected and exchange signals (e.g., commands or data) with each other via a communication method between peripheral devices (e.g., a bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)).

[0063] According to one embodiment, commands or data may be transmitted or received between the electronic device (101) and an external electronic device (104) via a server (108) connected to a second network (199). Each of the external electronic devices (102 or 104) may be the same or a different type of device as the electronic device (101). According to one embodiment, all or part of the operations executed in the electronic device (101) may be executed in one or more of the external electronic devices (102, 104, or 108). For example, when the electronic device (101) is to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device (101) may, instead of or in addition to executing the function or service itself, request one or more external electronic devices to perform the function or at least a part of the service. One or more external electronic devices that receive the request may execute at least a portion of the requested function or service, or an additional function or service related to the request, and transmit the result of the execution to the electronic device (101). The electronic device (101) may process the result as is or additionally and provide it as at least a portion of a response to the request. For this purpose, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used, for example. The electronic device (101) may provide an ultra-low latency service by using distributed computing or mobile edge computing, for example. In another embodiment, the external electronic device (104) may include an Internet of Things (IoT) device. The server (108) may be an intelligent server utilizing machine learning and / or a neural network. According to one embodiment, the external electronic device (104) or the server (108) may be included in the second network (199).The electronic device (101) can be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

[0064] FIG. 2A is a drawing illustrating a front side of an electronic device in an unfolded state according to various embodiments of the present disclosure. FIG. 2B is a drawing illustrating a rear side of an electronic device in an unfolded state according to various embodiments of the present disclosure.

[0065] FIG. 3A is a diagram illustrating the front side of an electronic device in a folded state according to various embodiments of the present disclosure. FIG. 3B is a diagram illustrating the rear side of an electronic device in a folded state according to various embodiments of the present disclosure.

[0066] Referring to FIGS. 2A to 3B, the electronic device (200) may include a first housing (210) (e.g., a first housing portion or a first housing structure) and a second housing (220) (e.g., a second housing portion or a second housing structure) that are rotatably coupled to each other about a folding axis (F) through at least one hinge module (e.g., hinge modules (400, 400-1, 400-2) of FIG. 4) (e.g., a hinge device or a hinge structure). In one embodiment, the first housing (210) and the second housing (220) may be configured as a housing (e.g., a foldable housing) of the electronic device (200). In one embodiment, the electronic device (200) may include a first display (230) (e.g., a flexible display, a foldable display, or a main display) that is arranged to be supported by being accommodated in the first housing and the second housing. In one embodiment, the electronic device (200) may include a second display (300) (e.g., a sub-display) that is arranged through the second housing (220). In one embodiment, the electronic device (200) may include a hinge housing (410) (e.g., a hinge cover) that is arranged so as to be at least partially invisible from the outside through the first housing (210) and the second housing (220) when in an unfolded state, and that covers at least one hinge module (e.g., hinge modules (400, 400-1, 400-2) of FIG. 4) so ​​as to be invisible from the outside while in a folded state or while being folded. In this document, the surface on which the first display (230) is placed may be defined as the front surface of the electronic device (200), and the surface opposite the front surface may be defined as the back surface of the electronic device (200). In addition, the surface surrounding the space between the front surface and the back surface may be defined as the side surface of the electronic device (200).

[0067] According to various embodiments, the first housing (210) and the second housing (220) are arranged on both sides with respect to the folding axis (F), have an overall symmetrical shape with respect to the folding axis (F), and can be folded to match each other. According to some embodiments, the first housing (210) and the second housing (220) may be folded asymmetrically with respect to the folding axis (F). In one embodiment, the angle or distance between the first housing (210) and the second housing (220) may be different depending on whether the electronic device (200) is in an unfolded state, a folded state, or an intermediate state.

[0068] According to various embodiments, the first housing (210) may be connected to at least one hinge module (e.g., hinge modules (400, 400-1, 400-2) of FIG. 4) and may include, in an unfolded state, a first surface (211) arranged to face the front of the electronic device (200), a second surface (212) facing in an opposite direction to the first surface (211), and / or a first side member (213) surrounding at least a portion of a first space (2101) between the first surface (211) and the second surface (212). In one embodiment, the second housing (220) may be connected to at least one hinge module (e.g., hinge modules (400, 400-1, 400-2) of FIG. 4) and may include a third side member (221) arranged to face the front of the electronic device (200) in an unfolded state, a fourth side member (222) oriented in an opposite direction to the third side member (221), and / or a second side member (223) surrounding at least a portion of a second space (2201) between the third side member (221) and the fourth side member (222). In one embodiment, the first side member (211) may face substantially the same direction as the third side member (221) in an unfolded state and at least partially face the third side member (221) in a folded state. In one embodiment, the electronic device (200) may include a recess (201) formed to accommodate a first display (230) through a structural combination of a first housing (210) and a second housing (220). In one embodiment, the recess (201) may have substantially the same size as the first display (230). In one embodiment, the first housing (210) may include a first protective frame (213a) (e.g., a first decorative member) that is combined with a first side member (213) and overlaps an edge of the first display (230) when the first display (230) is viewed from above, thereby covering an edge of the first display (230) so that the edge is not visible from the outside. In one embodiment, the first protective frame (213a) may be formed integrally with the first side member (213).In one embodiment, the second housing (220) may include a second protective frame (223a) (e.g., a second decorative member) that is coupled to the second side member (223) and overlaps with the edge of the first display (230) when the first display (230) is viewed from above, thereby covering the edge of the first display (230) so that it is not visible from the outside. In one embodiment, the second protective frame (223a) may be formed integrally with the second side member (223). In some embodiments, the first protective frame (213a) and the second protective frame (223a) may be omitted.

[0069] According to various embodiments, the hinge housing (410) (e.g., hinge cover) may be disposed between the first housing (210) and the second housing (220) and may be disposed to cover a portion of at least one hinge module (e.g., hinge modules (400, 400-1, 400-2) of FIG. 4). In one embodiment, the hinge housing (410) may be covered by portions of the first housing (210) and the second housing (220) or exposed to the outside, depending on whether the electronic device (200) is in an unfolded state, a folded state, or an intermediate state. For example, when the electronic device (200) is in an unfolded state, at least a portion of the hinge housing (410) may be disposed to be covered by the first housing (210) and the second housing (220) and substantially not visible from the outside. In one embodiment, when the electronic device (200) is in a folded state, at least a portion of the hinge housing (410) may be positioned so as to be visible from the outside between the first housing (210) and the second housing (220). In one embodiment, when the first housing (210) and the second housing (220) are in an intermediate state where they are folded at a certain angle, the hinge housing (410) may be positioned so as to be at least partially visible from the outside of the electronic device (200) between the first housing (210) and the second housing (220). For example, the area of ​​the hinge housing (410) exposed to the outside may be less than that in a completely folded state. In one embodiment, the hinge housing (410) may include a curved surface.

[0070] According to various embodiments, the electronic device (200) may include at least one of a display (230, 300), an input device (215), an audio output device (227, 228), a sensor module (217a, 217b, 226), a camera module (216a, 216b, 225), a key input device (219), an indicator (not shown), or a connector port (229) disposed in the first housing (210) and / or the second housing (220). In some embodiments, the electronic device (200) may additionally include at least one other component. In some embodiments, at least one of the above-described components may be omitted.

[0071] According to various embodiments, at least one display (230, 300) may include a first display (230) (e.g., a flexible display) that is arranged to be supported by a third surface (221) of a second housing (220) from a first surface (211) of a first housing (210), and a second display (300) that is arranged to be at least partially visible from the outside through a fourth surface (222) in an internal space of the second housing (220). In some embodiments, the second display (300) may be arranged to be visible from the outside through the second surface (212) in an internal space of the first housing (210). In one embodiment, the first display (230) may be primarily used in an unfolded state of the electronic device (200), and the second display (300) may be primarily used in a folded state of the electronic device (200). In one embodiment, the electronic device (200) can control the first display (230) and / or the second display (300) to be usable based on the folding angles of the first housing (210) and the second housing (220) when in an intermediate state.

[0072] According to various embodiments, the first display (230) may be disposed in a receiving space formed by a pair of housings (210, 220). For example, the first display (230) may be disposed in a recess (201) formed by the pair of housings (210, 220), and may be disposed to occupy substantially most of the front surface of the electronic device (200) when unfolded. In one embodiment, the first display (230) may include a flexible display in which at least a portion of the display may be transformed into a flat or curved surface. In one embodiment, the first display (230) may include a first region (230a) corresponding to the first housing (210) and a second region (230b) corresponding to the second housing (220). In one embodiment, the first display (230) may include a folding area (230c) that includes a portion of the first area (230a) and a portion of the second area (230b) with respect to the folding axis (F). In one embodiment, at least a portion of the folding area (230c) may include an area corresponding to at least one hinge module (e.g., hinge modules (400, 400-1, 400-2) of FIG. 4). In one embodiment, the area division of the first display (230) is merely a division by a pair of housings (210, 220) and at least one hinge module (e.g., hinge modules (400, 400-1, 400-2) of FIG. 4), and the first display (230) can be displayed as a seamless, full screen substantially through the pair of housings (210, 220) and at least one hinge module (e.g., hinge modules (400, 400-1, 400-2) of FIG. 4). In one embodiment, the first area (230a) and the second area (230b) may have an overall symmetrical shape or a partially asymmetrical shape with respect to the folding area (230c) and / or the folding axis (F).

[0073] According to various embodiments, the electronic device (200) may include a first rear cover (240) disposed on a second surface (212) of the first housing (210) and a second rear cover (250) disposed on a fourth surface (222) of the second housing (220). In some embodiments, at least a portion of the first rear cover (240) may be formed integrally with the first side member (213). In some embodiments, at least a portion of the second rear cover (250) may be formed integrally with the second side member (223). In one embodiment, at least one of the first rear cover (240) and the second rear cover (250) may be formed of a substantially transparent plate (e.g., a glass plate including various coating layers, or a polymer plate) or an opaque plate. In one embodiment, the first rear cover (240) may be formed by an opaque plate, such as, for example, coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the foregoing materials. In one embodiment, the second rear cover (250) may be formed by a substantially transparent plate, such as, for example, glass or polymer. Accordingly, the second display (300) may be arranged so as to be visible from the outside through the second rear cover (250) in the internal space of the second housing (220).

[0074] According to various embodiments, the input device (215) may include a microphone. In some embodiments, the input device (215) may include a plurality of microphones arranged to detect the direction of sound. In one embodiment, the audio output device (227, 228) may include speakers. In one embodiment, the audio output device (227, 228) may include a call receiver (227) arranged through the fourth side (222) of the second housing (220) and an external speaker (228) arranged through at least a portion of the second side member (223) of the second housing (220). In some embodiments, the input device (215), the audio output device (227, 228), and the connector (229) are disposed in spaces of the first housing (210) and / or the second housing (220) and can be exposed to the external environment through at least one hole formed in the first housing (210) and / or the second housing (220). In some embodiments, the holes formed in the first housing (210) and / or the second housing (220) can be used in common for the input device (215) and the audio output device (227, 228). In some embodiments, the audio output device (227, 228) may include a speaker (e.g., a piezo speaker) that operates without the holes formed in the first housing (210) and / or the second housing (220).

[0075] According to various embodiments, the camera modules (216a, 216b, 225) may include a first camera module (216a) disposed on a first surface (211) of the first housing (210), a second camera module (216b) disposed on a second surface (212) of the first housing (210), and / or a third camera module (225) disposed on a fourth surface (222) of the second housing (220). In one embodiment, the electronic device (200) may include a flash (218) disposed near the second camera module (216b). In one embodiment, the flash (218) may include, for example, a light emitting diode or a xenon lamp. In one embodiment, the camera modules (216a, 216b, 225) may include one or more lenses, an image sensor, and / or an image signal processor. In some embodiments, at least one of the camera modules (216a, 216b, 225) includes two or more lenses (e.g., wide-angle and telephoto lenses) and image sensors, and may be arranged together on either side of the first housing (210) and / or the second housing (220).

[0076] According to various embodiments, the sensor modules (217a, 217b, 226) may generate electrical signals or data values ​​corresponding to an internal operating state of the electronic device (200) or an external environmental state. In one embodiment, the sensor modules (217a, 217b, 226) may include a first sensor module (217a) disposed on a first surface (211) of the first housing (210), a second sensor module (217b) disposed on a second surface (212) of the first housing (210), and / or a third sensor module (226) disposed on a fourth surface (222) of the second housing (220). In some embodiments, the sensor module (217a, 217b, 226) may include at least one of a gesture sensor, a grip sensor, a color sensor, an infrared (IR) sensor, a light sensor, an ultrasonic sensor, an iris recognition sensor, or a distance detection sensor (e.g., a time of flight (TOF) sensor or a light detection and ranging (LiDAR) sensor).

[0077] According to various embodiments, the electronic device (200) may further include at least one sensor module not shown, for example, a pressure sensor, a magnetic sensor, a biometric sensor, a temperature sensor, a humidity sensor, or a fingerprint recognition sensor. In some embodiments, the fingerprint recognition sensor may be disposed through at least one of the first side member (213) of the first housing (210) and / or the second side member (223) of the second housing (220).

[0078] According to various embodiments, the key input device (219) may be arranged to be exposed to the outside through the first side member (213) of the first housing (210). In some embodiments, the key input device (219) may also be arranged to be exposed to the outside through the second side member (223) of the second housing (220). In some embodiments, the electronic device (200) may not include some or all of the key input devices (219), and the key input devices (219) that are not included may be implemented in another form, such as a soft key, on at least one display (230, 300). In one embodiment, the key input device (219) may be implemented using a pressure sensor included in at least one display (230, 300).

[0079] According to various embodiments, the connector port (229) may include a connector (e.g., a USB connector or an IF module (interface connector port module)) for transmitting and receiving power and / or data with an external electronic device. In some embodiments, the connector port (229) may also perform a function for transmitting and receiving audio signals with an external electronic device, or may further include a separate connector port (e.g., an ear jack hole) for performing a function for transmitting and receiving audio signals.

[0080] According to various embodiments, at least one of the camera modules (216a, 216b, 225), at least one of the sensor modules (217a, 217b, 226), and / or an indicator may be arranged to be exposed through at least one display (230, 300). For example, at least one of the camera modules (216a, 225), at least one of the sensor modules (217a, 226), and / or an indicator may be arranged to be exposed through at least one display (230, 300) in the interior space of at least one housing (210, 220), below an active area of ​​at least one display (230, 300), and may be arranged to be in contact with the external environment through an opening or transparent area perforated through a cover member (e.g., a window layer) and / or a second rear cover (250). In one embodiment, the area where at least one display (230, 300) and at least one camera module (216a, 225) face each other may be formed as a transparent area having a certain transmittance as part of the area displaying content. In one embodiment, the transparent area may be formed to have a transmittance in the range of about 5% to about 20%. This transparent area may include an area overlapping with an effective area (e.g., a field of view area) of at least one camera module (216a, 225) through which light passes to be imaged by an image sensor to create an image. For example, the transparent area of ​​at least one display (230, 300) may include an area where the pixel density is lower than the surrounding area. For example, the transparent area may replace an opening. For example, at least one camera module (216a, 225) may include an under-display camera (UDC) or an under-panel camera (UPC).In one embodiment, some camera modules (216a, 225) or sensor modules (217a, 226) may be arranged to perform their functions without being visually exposed through the display. For example, an area facing a camera module (216a, 225) and / or a sensor module (217a, 226) arranged under a display (230, 300) (e.g., a display panel) may have an under-display camera (UDC) structure, eliminating the need for a perforated opening.

[0081] According to various embodiments, when the electronic device (200) is in an unfolded state (e.g., the state of FIGS. 2A and 2B), the first housing (210) and the second housing (220) form an angle of about 180 degrees, and the first region (230a), the second region (230b), and the folding region (230c) of the first display (230) may be arranged to form substantially the same plane and face the same direction (e.g., the z-axis direction). In one embodiment, when the electronic device (200) is in an unfolded state, the first housing (210) may be rotated at an angle of about 360 degrees with respect to the second housing (220) so that the second side (212) and the fourth side (222) face each other and may be folded in the opposite direction (out folding method).

[0082] According to various embodiments, when the electronic device (200) is in a folded state (e.g., the state of FIGS. 3A and 3B), the first surface (211) of the first housing (210) and the third surface (221) of the second housing (220) may be arranged to face each other. In this case, the first region (230a) and the second region (230b) of the first display (230) may be arranged to face each other while forming a narrow angle (e.g., in the range of 0 to about 10 degrees) with respect to each other through the folding region (230c). In one embodiment, the folding region (230c) may be deformed into a curved shape having at least a certain curvature. In one embodiment, when the electronic device (200) is in an intermediate state, the first housing (210) and the second housing (220) may be arranged at a certain angle with respect to each other. In this case, the first region (230a) and the second region (230b) of the first display (230) may form an angle that is larger than the folded state and smaller than the unfolded state, and the curvature of the folding region (230c) may be smaller than the folded state and larger than the unfolded state. In some embodiments, the first housing (210) and the second housing (220) may form an angle that can stop at a specified folding angle between the folded state and the unfolded state through at least one hinge module (e.g., hinge modules (400, 400-1, 400-2) of FIG. 4) (free stop function). In some embodiments, the first housing (210) and the second housing (220) may be continuously operated while being pressed in the unfolding or folding direction based on a specified inflection angle through at least one hinge module (e.g., hinge modules (400, 400-1, 400-2) of FIG. 4).

[0083] According to various embodiments, the electronic device (200) may include an antenna structure (500) disposed in an internal space and configured to measure a location of an external electronic device and / or a distance from the external electronic device. In one embodiment, the antenna structure (500) may be disposed in a first space (2101) of the first housing (210) and configured to transmit or receive a wireless signal in a direction in which the first rear cover (240) faces (e.g., the -z-axis direction in FIG. 2B). For example, a wireless communication circuit (e.g., the wireless communication module (192) in FIG. 1) may be disposed to transmit or receive a wireless signal in a direction in which the first rear cover (240) faces (e.g., the -z-axis direction in FIG. 2B) via the antenna structure (500). In one embodiment, the antenna structure (500) may include a first plurality of conductive patches configured to operate in a first frequency band (e.g., sub-patches (510, 520, 530) of FIG. 5A), a pair of conductive patches (e.g., the first sub-patch (510) and the second sub-patch (520) of FIG. 5A) among the first plurality of conductive patches (e.g., the sub-patches (510, 520, 530) of FIG. 5A), and a second conductive patch (e.g., the second conductive patch (540) of FIG. 5A) configured to operate in a second frequency band different from the first frequency band. Accordingly, the electronic device (200) may include a first antenna (A1) operating in a first frequency band via a first plurality of conductive patches (e.g., sub-patches (510, 520, 530) of FIG. 5A) and a second antenna (A2) operating in a second frequency band via a second conductive patch (e.g., the second conductive patch (540) of FIG. 5A). In one embodiment, the first frequency band may include a frequency band in a range of about 7.75 GHz to 8.25 GHz (e.g., Ch 9). In one embodiment, the second frequency band may include a frequency band in a range of about 6.25 GHz to 6.75 GHz (e.g., Ch 5).

[0084] In various embodiments, the electronic device (200) may include a conductive portion (310) disposed on at least a portion of the first side member (213) and used as an antenna radiator. In one embodiment, the conductive portion (310) may be segmented through a first segment (311) (e.g., a first non-conductive portion) and a second segment (312) (e.g., a second non-conductive portion) that are spaced apart from each other in the conductive first side member (213). In one embodiment, a wireless communication circuit (e.g., a wireless communication module (192) of FIG. 1) may be configured to transmit or receive a wireless signal in a first frequency band and / or a second frequency band through the conductive portion (310). Accordingly, the electronic device (200) may include a third antenna (A3) that operates in the first frequency band and / or the second frequency band through the conductive portion (310).

[0085] According to various embodiments, the electronic device (200) may include an ultra wide band (UWB) antenna that uses at least two antennas among a first antenna (A1), a second antenna (A2), and a third antenna (A3) and is used to detect a distance to an external electronic device or a location of the external electronic device through a phase difference of received signals of each antenna (e.g., angle of arrival (AoA) positioning technique). In one embodiment, the second antenna (A2) and the third antenna (A3) and / or the first antenna (A1) and the third antenna (A3) may be configured to operate in diversity, thereby helping to improve the reception sensitivity of the UWB antenna.

[0086] FIG. 4 is an exploded perspective view of an electronic device according to various embodiments of the present disclosure.

[0087] Referring to FIG. 4, the electronic device (200) may include a first display (230) (e.g., a flexible display), a second display (300), at least one hinge module (400, 400-1, 400-2), a pair of support members (261, 262), at least one substrate (270) (e.g., a printed circuit board (PCB)), a first housing (210), a second housing (220), a first rear cover (240), and / or a second rear cover (250).

[0088] According to various embodiments, the first display (230) may include a display panel (430) (e.g., a flexible display panel) and a support plate (450) disposed under the display panel (430). In one embodiment, the first display (230) may include reinforcing plates (462) disposed under the support plate (450). In some embodiments, the reinforcing plates (462) may be omitted. In one embodiment, the display panel (430) may include a first panel area (430a) corresponding to a first area of ​​the first display (230) (e.g., the first area (230a) of FIG. 2A), a second panel area (430b) extending from the first panel area (430a) and corresponding to a second area of ​​the first display (230) (e.g., the second area (230b) of FIG. 2A), and a third panel area (430c) connecting the first panel area (430a) and the second panel area (430b) and corresponding to a folding area of ​​the first display (230) (e.g., the folding area (230c) of FIG. 2A). In one embodiment, the support plate (450) is disposed between the display panel (430) and a pair of support members (261, 262), and may be formed to have a material and shape to provide a planar support structure for the first panel area (430a) and the second panel area (430b) and a bendable structure to aid in bendability for the third panel area (430c). In one embodiment, the support plate (450) may be formed of a conductive material (e.g., metal) or a non-conductive material (e.g., polymer or fiber reinforced plastics (FRP)). In one embodiment, the reinforcing plates (462) may include a first reinforcing plate (4621) positioned between the support plate (450) and the pair of support members (261, 262) to correspond with at least a portion of the first panel area (430a) and the third panel area (430c), and a second reinforcing plate (4622) positioned to correspond with at least a portion of the second panel area (430b) and the third panel area (430c).In one embodiment, the reinforcing plate (462) may be formed of a metal material (e.g., SUS) to help reinforce the ground connection structure and rigidity for the first display (230). In some embodiments, the electronic device (200) may include a digitizer (e.g., digitizer (461) of FIG. 4) disposed under the support plate (450) and replaced with the reinforcing plate (462) or added between the support plate (450) and the reinforcing plate (462).

[0089] According to various embodiments, the second display (300) may be positioned in the space between the second housing (220) and the second rear cover (250). In one embodiment, the second display (300) may be positioned in the space between the second housing (220) and the second rear cover (250) so as to be visible from the outside through substantially the entire area of ​​the second rear cover (250).

[0090] According to various embodiments, at least a portion of the first support member (261) may be foldably coupled to the second support member (262) via at least one hinge module (400, 400-1, 400-2). In one embodiment, the electronic device (200) may include at least one wiring member (263) (e.g., a flexible printed circuit board (FPCB)) that extends from at least a portion of the first support member (261) across at least one hinge module (400, 400-1, 400-2) to a portion of the second support member (262). In one embodiment, the first support member (261) may be disposed in a manner that extends from the first side member (213) or is structurally coupled with the first side member (213). In one embodiment, the electronic device (200) may include a first space (e.g., the first space (2101) of FIGS. 2A and 2B) provided through a first support member (261) and a first rear cover (240). In one embodiment, the first housing (210) (e.g., the first housing structure) may be configured through a combination of a first side member (213), a first support member (261), and a first rear cover (240). In one embodiment, the second support member (262) may be arranged in a manner that extends from the second side member (223) or is structurally coupled with the second side member (223). In one embodiment, the electronic device (200) may include a second space (e.g., the second space (2201) of FIGS. 2A and 2B) provided through a second support member (262) and a second rear cover (250). In one embodiment, the second housing (220) (e.g., the second housing structure) may be configured by combining a second side member (223), a second support member (262), and a second rear cover (250). In one embodiment, at least one wiring member (263) and / or at least a portion of at least one hinge module (400, 400-1, 400-2) may be arranged to be supported by at least a portion of a pair of support members (261, 262).In one embodiment, at least one wiring member (263) may be arranged to extend from the first support member (261) across the folding axis (e.g., the folding axis (F) of FIG. 2A) to the second support member (262). In one embodiment, at least one wiring member (263) may be arranged to have a length in a direction substantially perpendicular to the folding axis (e.g., the y-axis or the folding axis (F) of FIGS. 2A and 2B) (e.g., the x-axis direction).

[0091] According to various embodiments, at least one substrate (270) may include a first substrate (271) disposed in a first space (2101) and a second substrate (272) disposed in a second space (2201). The first substrate (271) or the second substrate (272) may be a board. In one embodiment, the first substrate (271) and the second substrate (272) may include a plurality of electronic components disposed to implement various functions of the electronic device (200). In one embodiment, the first substrate (271) and the second substrate (272) may be electrically connected through at least one wiring member (263).

[0092] According to various embodiments, the electronic device (200) may include at least one battery (291, 292). In one embodiment, the at least one battery (291, 292) may include a first battery (291) disposed in a first space (2101) of a first housing (210) and electrically connected to a first substrate (271) and a second battery disposed in a second space (2201) of a second housing (220) and electrically connected to a second substrate (272). In one embodiment, the first support member (261) and the second support member (262) may further include at least one swelling hole for the first battery (291) and the second battery (292).

[0093] According to various embodiments, the first housing (210) may include a first rotation support surface (214), and the second housing (220) may include a second rotation support surface (224) corresponding to the first rotation support surface (214). In one embodiment, the first rotation support surface (214) and the second rotation support surface (224) may include curved surfaces corresponding to (naturally connected to) the curved outer surface of the hinge housing (410). In one embodiment, the first rotation support surface (214) and the second rotation support surface (224) may cover the hinge housing (410) when the electronic device (200) is in an unfolded state, thereby not exposing the hinge housing (410) to the rear surface of the electronic device (200) or exposing only a portion of the hinge housing (410). In one embodiment, the first rotational support surface (214) and the second rotational support surface (224) can rotate along the outer surface of the curve of the hinge housing (410) when the electronic device (200) is in a folded state, thereby exposing at least a portion of the hinge housing (410) to the rear surface of the electronic device (200).

[0094] According to various embodiments, the electronic device (200) may include at least one antenna (276) disposed in the first space (2201). In one embodiment, the at least one antenna (276) may be disposed in the first space (2201), on the first battery (291) and the first rear cover (240). In one embodiment, the at least one antenna (276) may include, for example, a near field communication (NFC) antenna, a wireless charging antenna, and / or a magnetic secure transmission (MST) antenna. In one embodiment, the at least one antenna (276) may, for example, perform short-range communication with an external device or wirelessly transmit and receive power required for charging. In some embodiments, the antenna structure may be formed by at least a portion of the first side member (213) or the second side member (223) and / or a portion of the first support member (261) and the second support member (262), or a combination thereof.

[0095] According to various embodiments, the electronic device (200) may further include at least one electronic component assembly (274, 275) and / or additional support members (263, 273) disposed in a first space (e.g., the first space (2101) of FIGS. 2A and 2B) and / or a second space (e.g., the second space (2201) of FIGS. 2A and 2B). For example, the at least one electronic component assembly may include an interface connector port assembly (274) or a speaker assembly (275).

[0096] According to various embodiments, the electronic device (200) may include a first waterproof member (WP1) disposed between a first reinforcing plate (4621) and a first support member (261) and a second waterproof member (WP2) disposed between a second reinforcing plate (4622) and a second support member (262). In one embodiment, the first waterproof member (WP1) may provide at least one first waterproof space between the first reinforcing plate (4621) and the first support member (261). In one embodiment, the at least one first waterproof space may accommodate an area corresponding to at least one electronic component (e.g., a camera module or a sensor module) disposed to be supported by the first support member (261). In one embodiment, the second waterproof member (WP2) may provide a second waterproof space between the second reinforcing plate (4622) and the second support member (262). In one embodiment, the second waterproof space can accommodate at least a portion of the bending portion that folds toward the back of the first display (230). For example, the second waterproof space can be arranged to extend from the display panel (430) of the first display (230) and surround at least a portion of the bending portion that folds toward the back (e.g., the bending portion (432) of FIG. 4). Accordingly, the control circuit (e.g., the display driver IC (DDI)) and / or a plurality of electrical components) arranged in the bending portion (432) can be protected from external moisture and / or foreign substances by being arranged in the second waterproof space.

[0097] According to various embodiments, the electronic device (200) may include a waterproof tape (241) disposed between the first rear cover (240) and the first housing (210). In one embodiment, the electronic device (200) may include a bonding member (251) disposed between the second rear cover (250) and the second housing (220). In some embodiments, the bonding member (251) may be disposed between the second display (300) and the second housing (220). In some embodiments, the waterproof tape (241) may be replaced with the bonding member (251), and the bonding member (251) may be replaced with the waterproof tape (241).

[0098] According to various embodiments, at least one hinge module (400, 400-1, 400-2) may include a first hinge module (400) arranged at one end in a direction parallel to a folding axis (e.g., the folding axis (F) of FIG. 2a), a second hinge module (400-1) arranged at the other end, and a third hinge module (400-2) arranged between the first hinge module (400) and the second hinge module (400-1). In one embodiment, the first hinge module (400), the second hinge module (400-1), and the third hinge module (400-2) may have substantially the same configuration. In some embodiments, the third hinge module (400-2) may be replaced with a connecting module. In this case, the connecting module may be arranged through a combination of at least one gear and / or a combination of at least one link. In one embodiment, the electronic device (200) may include a first hinge plate (411) and a second hinge plate (412) connected via at least one hinge module (400, 400-1, 400-2). In one embodiment, the first hinge plate (411) and the second hinge plate (412) may form the same plane as the first housing (210) and the second housing when in an unfolded state.

[0099] According to various embodiments, the electronic device (200) may include an antenna structure (500) disposed in an internal space of the first housing (210) (e.g., the first space (2101) of FIGS. 2A and 2B). In one embodiment, the antenna structure (500) may be disposed in a space between the first rear cover (240) and the first support member (261) to transmit or receive a wireless signal in a direction (e.g., in the -z-axis direction) toward the first rear cover (240). In some embodiments, if the placement space permits, the antenna structure (500) may also be disposed in a space between the second rear cover (250) and the second support member (262) to transmit or receive a wireless signal in a direction (e.g., in the -z-axis direction) toward the second rear cover (250).

[0100] FIG. 5A is a schematic diagram of an antenna structure according to various embodiments of the present disclosure. FIG. 5B is a perspective view of an antenna structure according to various embodiments of the present disclosure. FIG. 5C is a cross-sectional view of an antenna structure taken along line 5C-5C of FIG. 5A according to various embodiments of the present disclosure.

[0101] Referring to FIGS. 5A to 5C, an antenna structure (500) (e.g., an antenna module or an antenna) may include a plurality of insulating layers (550) arranged in a stacked manner, and may include a dielectric substrate (590) (e.g., a substrate) including a first substrate surface (5901) and a second substrate surface (5902) facing in an opposite direction to the first substrate surface (5901). In one embodiment, the dielectric substrate (590) may be a flexible substrate (e.g., a flexible printed circuit board, FPCB). In one embodiment, the dielectric substrate (590) may be a rigid substrate (e.g., a printed circuit board, PCB). In one embodiment, the antenna structure (500) may include a ground layer (G) (ground plane) arranged on a first insulating layer (551) of the plurality of insulating layers (550). In one embodiment, the antenna structure (500) may include a first plurality of conductive patches (510, 520, 530) disposed on a second insulating layer (552) that is different from a first insulating layer (551) among a plurality of insulating layers (550) and a second conductive patch (540) disposed between a pair of conductive patches (510, 520) among the first plurality of conductive patches (510, 520, 530). In one embodiment, the second insulating layer (552) may be disposed between the first insulating layer (551) and the first substrate surface (5901). In one embodiment, the second insulating layer (552) may also include the first substrate surface (5901). In one embodiment, the first plurality of conductive patches (510, 520, 530) and the second conductive patch (540) may be disposed in different insulating layers between the first substrate surface (5901) and the first insulating layer (552). In one embodiment, the first plurality of conductive patches (510, 520, 530) and the second conductive patch (540) may be disposed to transmit or receive a wireless signal in a direction in which the first substrate surface (5901) faces (e.g., in the -z-axis direction).In one embodiment, the ground layer (G) may be arranged to overlap the first plurality of conductive patches (510, 520, 530) when the first substrate surface is viewed from above, and may be arranged to overlap a portion of the second conductive patch (540). In one embodiment, the first plurality of conductive patches (510, 520, 530) may be used as a first antenna (A1) (e.g., an array antenna) operating in circular polarization (CP). In some embodiments, the first plurality of conductive patches (510, 520, 530) may be operated as a linear polarization (LP) antenna. In one embodiment, the second conductive patch (540) may be used as a second antenna (A2) (e.g., a monopole antenna). In one embodiment, the first antenna (A1) may operate in a first frequency band (e.g., Ch 9, a frequency band in the range of about 7.75 GHz to 8.25 GHz), and the second antenna (A2) may operate in a second frequency band (e.g., Ch 5, a frequency band in the range of about 6.25 GHz to 6.75 GHz) that is different from the first frequency band.

[0102] According to various embodiments, the first plurality of conductive patches (510, 520, 530) may include a first sub-patch (510) and a second sub-patch (520) spaced apart at a specified interval along a first direction (e.g., direction ①). In one embodiment, the first plurality of conductive patches (510, 520, 530) may include a third sub-patch (530) spaced apart at a specified interval from the first sub-patch (510) in a second direction (e.g., direction ②) perpendicular to the first direction (e.g., direction ①). For example, the spacing distance between the first sub-patch (510) and the second sub-patch (520) may be substantially the same as the spacing distance between the first sub-patch (510) and the third sub-patch (530). In one embodiment, the second challenging patch (540) may be positioned at least partially in the space between the first sub-patch (510) and the second sub-patch (520).

[0103] According to various embodiments, the first sub-patch (510) may be electrically connected to the connector portion (C) via a first wiring (511) (e.g., a first electrical path or a first wiring structure) disposed on the dielectric substrate (590). In one embodiment, the second sub-patch (520) may be electrically connected to the connector portion (C) via a second wiring (521) (e.g., a second electrical path or a second wiring structure) disposed on the dielectric substrate (590). In one embodiment, the third sub-patch (530) may be electrically connected to the connector portion (C) via a third wiring (531) (e.g., a third electrical path or a third wiring structure) disposed on the dielectric substrate (590). In one embodiment, the second conductive patch (540) may be electrically connected to the connector portion (C) via a fourth wiring (541) (e.g., a fourth electrical path or a fourth wiring structure) disposed on the dielectric substrate (590). In one embodiment, when the antenna structure (500) is disposed in the first housing (e.g., the first housing (210) of FIG. 4), the connector portion (C) may be electrically connected to a first substrate (e.g., the first substrate (271) of FIG. 4) disposed in the first housing (e.g., the first housing (210) of FIG. 4), thereby being electrically connected to a wireless communication circuit (e.g., the wireless communication module (192) of FIG. 1) of the first substrate (e.g., the first substrate (271) of FIG. 4).

[0104] According to various embodiments, the second conductive patch (540) is positioned in a narrow space between the first sub-patch (510) and the second sub-patch (520), and the radiation performance may be reduced due to the limitation of the vertical distance from the ground layer (G). To solve this problem, the antenna structure (500) may include a non-conductive region (561) positioned to overlap at least a portion of the second conductive patch (540) when the first substrate surface (5901) is viewed from above. In one embodiment, the non-conductive region (561) may be formed in such a way that the ground layer (G) is removed or omitted. In one embodiment, the second conductive patch (540) may operate as a monopole antenna through the non-conductive region (561). In one embodiment, the non-conductive region (561) is formed in a rectangular shape formed in a second direction (e.g., direction ②) perpendicular to the edge along the first direction (e.g., direction ①) of the dielectric substrate (590), but is not limited thereto. For example, the non-conductive region (561) may be formed in various shapes that overlap with the second conductive patch (540).

[0105] According to various embodiments, the non-conductive region (561) may be formed to have a first length (L1) at an edge of the dielectric substrate (590) along a first direction (e.g., direction ①) in which the first sub-patch (510) and the second sub-patch (520) are arranged, and to have a second length (L2) along a second direction (e.g., direction ②) perpendicular to the first direction (direction ①). In one embodiment, the first length (L1) may be shorter than the second length (L2). In some embodiments, the first length (L1) and the second length (L2) may be substantially the same. In some embodiments, the first length (L1) may be longer than the second length (L2). In one embodiment, the second length (L2) may be formed to have a length of about λ / 4 based on the operating frequency band of the first antenna (A1). In some embodiments, the second length (L2) may be formed to have a length greater than λ / 4 based on the operating frequency band of the first antenna (A1). This definition of the length may help improve the isolation between the first sub-patch (510) and the second sub-patch (520).

[0106] FIG. 5d is a configuration diagram of a second challenging patch according to various embodiments of the present disclosure.

[0107] Referring to FIG. 5d, the second conductive patch (540) may include at least one slot (542, 543). In one embodiment, the at least one slot (542, 543) may include a first slot (542) formed in a first direction (e.g., direction ①) along a first edge (540a) formed in a second direction (e.g., direction ②) of the second conductive patch (540), and a second slot (543) formed in a first direction (e.g., direction ①) along a second edge (540b) formed in a second direction (e.g., direction ②) of the second conductive patch (540) and opposite to the first edge (540a). In one embodiment, the second antenna (A2) using the second conductive patch (540) can be configured to have a resonant frequency adjusted through the shape and length of the first slot (542) and / or the second slot (543). In some embodiments, the slots (542, 543) may be formed to have a shape and / or length specified in the second direction (e.g., direction ②) from the third edge (540c) formed in the first direction (e.g., direction ①) between the first edge (540a) and the second edge (540b).

[0108] According to various embodiments, the antenna structure (500) can be used as a UWB antenna operating in a dual band through a first antenna (A1) using a first plurality of conductive patches (510, 520, 530) and a second antenna (A2) using a second plurality of conductive patches (540). In one embodiment, the UWB antenna can be used to measure the location of an external electronic device and the distance to the external electronic device through a phase difference of a signal received from the external electronic device using the first antenna (A1) and the second antenna (A2).

[0109] FIGS. 6A and 6B are drawings comparing the radiation performance of a second antenna with or without a non-conductive region according to various embodiments of the present disclosure.

[0110] FIG. 6a and FIG. 6b are drawings comparing the field distribution (e.g., electric field distribution (heat map)) in the vertical direction (e.g., ± z-axis direction) of a first antenna (A1) using a first plurality of conductive patches (510, 520, 530) and a second antenna (A2) using a second conductive patch (540), depending on the presence or absence of a non-conductive region (561).

[0111] In the comparative example where the non-conductive region (561) of FIG. 6A does not exist, it can be seen that most of the fields of the first antenna (A1) and the second antenna (A2) are implemented between the conductive patches (510, 520, 530, 540) and the ground layer (G), and hardly any field is generated behind the ground layer (G) (e.g., in the z-axis direction). This may mean that in the case of a low-height dielectric substrate (590), the field is confined in a narrower space, which reduces the performance of the antenna (particularly, the second antenna).

[0112] When the second antenna (A2) includes a non-conductive region (561) according to an exemplary embodiment of the present disclosure of FIG. 6b, it can be confirmed that a field is formed up to the rear (e.g., in the z-axis direction) of the dielectric substrate (590). This may mean that even if the second conductive patch (540) is placed in a narrow space between the low-height dielectric substrate (590) and the first and second sub-patches (510, 520), the performance of the second antenna (A2) can be improved.

[0113] FIGS. 7A and 7B are graphs comparing the radiation performance of a second antenna with or without a non-conductive region according to various embodiments of the present disclosure.

[0114] Referring to FIG. 7a, in the second frequency band (e.g., about 6.7 GHz), it can be confirmed that the efficiency of the second antenna (A2) is improved by about 7 dB or more when the non-conductive region (561) is arranged (e.g., graph 7002) compared to when the non-conductive region (561) is not arranged (e.g., graph 7001).

[0115] Referring to Fig. 7a, in the second frequency band (e.g., approximately 6.7 GHz), based on the operable -6 dB, it can be confirmed that the bandwidth of the second antenna (A2) is relatively expanded when the non-conductive region (561) is arranged (e.g., graph 7004) compared to when the non-conductive region (561) is not arranged (e.g., graph 7003).

[0116] This may mean that the radiation performance of the second antenna (A2) including the second conductive patch (540) arranged to overlap with the non-conductive region (561) in the corresponding operating frequency band (e.g., the second frequency band) is relatively improved compared to the comparative example.

[0117] Furthermore, the following shows the results of comparing the performance changes (e.g., TIS) of the first antenna (A1) using the first plurality of conductive patches (510, 520, 530) when the second antenna (A2) using the second conductive patch (540) operates in diversity with a surrounding antenna (e.g., the third antenna (A3) of FIG. 2b) or operates alone, as the radiation performance is improved through the non-conductive region (561).

[0118] TIS (dBm) 1st sub-patch 2nd sub-patch 3rd sub-patch 4th sub-patch Comparison example - 87.4 - 90.4 - 86.9 - main disclosure - 87.0 - 90.2 - 87.3 - 83.9

[0119] As shown in , in the comparative example where the non-conductive region (561) and the second conductive patch (540) do not exist, the first antenna (A1) can have a reception sensitivity of about -90.4 dBm to -86.9 dBm. In one embodiment, when the non-conductive region (561) of the present disclosure and the second conductive patch (540) overlapping therewith exist, the second antenna (A2) exhibits a reception sensitivity of about -83.9 dBm, and the first antenna (A1) exhibits a reception sensitivity of about -90.2 dBm to -87.0 dBm, thereby maintaining a level equivalent to that of the comparative example. This may mean that, according to an exemplary embodiment of the present disclosure, even if a second antenna (A2) is used in which the second conductive patch (540) is positioned between the first plurality of conductive patches (510, 520) to overlap with the non-conductive region (561), the radiation performance of the first antenna (A1) using the first plurality of conductive patches (510, 520, 530) is not deteriorated.

[0120] FIG. 8 is a graph comparing the performance of the first antenna according to the rotation of the opposing terminal according to various embodiments of the present disclosure.

[0121] Referring to FIG. 8, when the first antenna (A1) receives a wireless signal with a first plurality of conductive patches (510, 520, 530) in circular polarization (CP) and the second antenna (A2) operates alone or in diversity with a surrounding antenna (e.g., the third antenna (A3) of FIG. 2b), it can be seen that a constant AoA performance measurement result is always expressed depending on various rotation angles (e.g., 90 degrees, 45 degrees, 135 degrees, or 0 degrees) of the counterpart terminal.

[0122] FIG. 9 is a graph comparing the isolation of the first sub-patch and the second sub-patch according to the presence or absence of non-conductivity according to various embodiments of the present disclosure.

[0123] Referring to FIG. 9, when the second length (L2) of the non-conductive region (561) arranged to overlap with the second conductive patch (540) is formed to be λ / 4 or more based on the first frequency band of the first antenna (A1) (e.g., a frequency band in the range of about 7.75 GHz to 8.25 GHz (e.g., Ch 9)), it can be confirmed that the isolation between the two sub-patches (510, 520) is improved when the non-conductive region (561) exists (e.g., graph 9002) compared to when the non-conductive region (561) does not exist (e.g., graph 9001). This may mean that when the non-conductive region (561) is formed to have a second length (L2) of λ / 4 or more based on the first frequency band of the first antenna (A1), it can be used as a band stop filter for the first sub-patch (510) and the second sub-patch (520) of the first antenna (A1).

[0124] FIG. 10 is a graph comparing the radiation performance of a second antenna according to a second length of a non-conductive region according to various embodiments of the present disclosure.

[0125] Referring to FIG. 10, when the non-conductive region (561) does not exist (e.g., graph 1001), the second antenna (A2) operates in a band of about 6.6 GHz, and when the second length (L2) of the non-conductive region (561) is about 3 mm (e.g., graph 1002), the operating frequency band of the second antenna (A2) is low-shifted to a band of about 6.38 GHz, and when the second length of the non-conductive region (561) is about 6 mm (e.g., graph 1003), the operating frequency band of the second antenna (A2) is low-shifted to a band of about 6.18 GHz. This may mean that the second length (L2) of the non-conductive region (561) can be used as a resonance element that can determine the resonance frequency of the second antenna (A2). In some embodiments, the first length (L1) of the non-conductive region (561) may also be used as a resonant element that can determine the resonant frequency of the second antenna (A2).

[0126] FIG. 11 is a cross-sectional view of a portion of an electronic device taken along line 11-11 of FIG. 2b according to various embodiments of the present disclosure.

[0127] Referring to FIG. 11, the electronic device (200) may include a first housing (210), a second housing (e.g., the second housing (220) of FIG. 2b), at least one hinge module (e.g., hinge modules (400, 400-1, 400-2) of FIG. 4) that rotatably couples the first housing (210) and the second housing (220) with respect to each other, and a flexible display (230) that is arranged to be supported by the first housing (210) and the second housing (220). In one embodiment, the electronic device (200) may include an antenna structure (500) that is arranged in a first space (2101) of the first housing (210) through an antenna carrier (570) (e.g., an injection-molded material or a dielectric carrier). In one embodiment, the antenna carrier (570) may be positioned to be supported by a first support member (261) extending from the first side member (213) to the first space (2101). In one embodiment, the antenna structure (500) may be electrically connected to a first substrate (271) (e.g., a main printed circuit board) positioned between the antenna carrier (570) and the first support member (261) in the first space (2101) of the first housing (210). In one embodiment, the flexible display (230) may be positioned to be supported by the first support member (261).

[0128] According to various embodiments, the antenna carrier (570) may include a first side (5701) facing the first rear cover (240) and a second side (5702) facing in an opposite direction from the first side (5701). In one embodiment, the antenna structure (500) may be disposed on the first side (5701) between the first side (5701) and the first rear cover (240). In one embodiment, the antenna structure (500) may be disposed on the antenna carrier (570) to transmit or receive a wireless signal in a direction (e.g., in the -z-axis direction) toward the first rear cover (240) via the first plurality of conductive patches (510, 520) and the second conductive patch (540).

[0129] According to various embodiments, the antenna structure (500) may include a second conductive patch (540) disposed between a first sub-patch (510) and a second sub-patch (520) on a dielectric substrate (590). In one embodiment, the antenna structure (500) may include a non-conductive region (561) disposed in at least a portion of an area overlapping the second conductive patch (540) when the first surface (5701) is viewed from above. In one embodiment, the non-conductive region (561) may be formed by removing or omitting a ground layer (G) disposed on the dielectric substrate (590). In one embodiment, the second conductive patch (540) of the antenna structure (500) may be affected by the influence of surrounding electronic components due to the non-conductive region (561) located on the lower side thereof (e.g., in the -z-axis direction). In one embodiment, to reduce this performance degradation, the electronic device (200) may include a shielding member (571) disposed at a position overlapping at least the non-conductive region (561) when the first surface (5701) is viewed from above, and overlapping the non-conductive region (561). In one embodiment, the shielding member (571) may be made of a conductive material and may be disposed on the second surface (5702) of the antenna carrier (570). In one embodiment, the shielding member (571) may include at least one of a conductive plate, a conductive pattern, or a conductive paint disposed on the second surface (5702). In some embodiments, the shielding member (571) may be embedded in an injection-molded manner between the first surface (5701) and the second surface (5702).

[0130] FIGS. 12A and 12B are schematic diagrams illustrating operation scenarios of an electronic device according to various embodiments of the present disclosure.

[0131] According to various embodiments, as illustrated in FIG. 2B, the electronic device (200) may include a conductive portion (310) disposed on a conductive first side member (213) via a pair of segments (311, 312) and used as a third antenna (e.g., a metal bezel antenna). In one embodiment, a wireless communication circuit (e.g., a wireless communication module (192) of FIG. 1) may be configured to transmit or receive a wireless signal via the conductive portion (310) in a first frequency band (e.g., Ch9) and / or a second frequency band (e.g., Ch5).

[0132] Referring to FIG. 12A, the electronic device (200) may be configured to operate in 2Rx specifications via the first plurality of conductive patches (510, 520, 530), the second conductive patch (540), and the conductive portion (310). For example, the wireless communication circuit (192) (e.g., the wireless communication module (192) of FIG. 1) may be configured to be connected to at least one of the conductive portion (310) or the first sub-patch (510) at one Tx end via the first switching circuit (S1) (the first switching device or the first switch) (e.g., a double pole double throw (DPDT) switch). In one embodiment, the wireless communication circuit (192) may be configured to be electrically connected to at least one of the conductive portion (310) or the first sub-patch (510) at the Rx1 end via the first switching circuit (S1). In one embodiment, the wireless communication circuit (192) may be configured to be electrically connected to at least one of the second sub-patch (520), the third sub-patch (530), or the second conductive patch (540) through a second switching circuit (S2) (e.g., a second switching device or a second switch) (e.g., a single pole 4-throw (SP4T) switch) at the Rx2 terminal. In one embodiment, the first switching circuit (S1) and / or the second switching circuit (S2) may be configured to be controlled through a processor of the electronic device (200) (e.g., the processor (120) of FIG. 1) or the wireless communication circuit (192) (e.g., the wireless communication module (192) of FIG. 1).

[0133] According to various embodiments, the wireless communication circuit (192) may be configured to compare the phase of a wireless signal received based on 2Rx (angle of arrival (AoA) operation) by connecting the Rx1 terminal to the first sub-patch (510) and the Rx2 terminal to the second sub-patch (520) or the third sub-patch (540) in a first frequency band (e.g., Ch 9). In one embodiment, the wireless communication circuit (192) may be configured to operate in diversity by connecting the Rx1 terminal to the conductive portion (310) and the Rx2 terminal to the second conductive patch (540) in a second frequency band (e.g., Ch 5).

[0134] Referring to FIG. 12B, the electronic device (200) may be configured to operate in 3Rx specifications through the first plurality of conductive patches (510, 520, 530), the second conductive patch (540), and the conductive portion (310). For example, the wireless communication circuit (192) (e.g., the wireless communication module (192) of FIG. 1) may be configured to be electrically connected to at least one of the conductive portion (310) or the first sub-patch (510) at one Tx terminal through the first switching circuit (S1) (the first switching device or the first switch) (e.g., the double pole double throw (DPDT) switch). In one embodiment, the wireless communication circuit (192) may be configured to be electrically connected, at the Rx1 terminal, to at least one of the conductive portion (310) or the first sub-patch (510) via the first switching circuit (S1). In one embodiment, the wireless communication circuit (192) may be configured to be electrically connected, at the Rx3 terminal, to at least one of the third sub-patch (530) or the second conductive patch (540) via the second switching circuit (S2) (e.g., a second switching device or a second switch) (e.g., a single pole double throw (SPDT) switch). In one embodiment, the first switching circuit (S1) and / or the second switching circuit (S2) may be configured to be controlled by a processor (e.g., processor (120) of FIG. 1) or a wireless communication circuit (192) (e.g., wireless communication module (192) of FIG. 1) of the electronic device (200).

[0135] According to various embodiments, the wireless communication circuit (192) may be configured to compare the phase of a wireless signal received based on 3Rx (AoA (angle of arrival) operation) by connecting the Rx1 terminal to the first sub-patch (510) and the Rx3 terminal to the third sub-patch (530) in a first frequency band (e.g., Ch 9). In one embodiment, the wireless communication circuit (192) may be configured to operate in diversity by connecting the Rx1 terminal to the conductive portion (310) and the Rx3 terminal to the second conductive patch (540) in a second frequency band (e.g., Ch 5).

[0136] FIG. 13 is a configuration diagram of an antenna structure according to various embodiments of the present disclosure.

[0137] In describing the antenna structure (500-1) of FIG. 13, the same symbols are given to components that are substantially the same as those of the antenna structure (500) of FIG. 5a, and a detailed description thereof may be omitted.

[0138] Referring to FIG. 13, the non-conductive region (561) formed into a slot structure by removing the ground layer (G) may also be operated as another antenna via a wireless communication circuit (e.g., the wireless communication module (192) of FIG. 1). In one embodiment, the antenna structure (500-1) may include a feed portion (F1) extending from the connector (C) via the fifth wiring (542a) in the dielectric substrate (590) and electrically connected to at least a portion of the ground layer (G) in a manner that crosses the slot of the non-conductive region (561). In one embodiment, the feed unit (F1) may be electrically connected to a wireless communication circuit (e.g., a wireless communication module (192) of FIG. 1) disposed on a first substrate (e.g., a first substrate (271) of FIG. 4) of a first housing (e.g., a first housing (210) of FIG. 4) via a fifth wiring (542a) (e.g., a fifth electrical path or a fifth wiring structure) and a connector (C). In one embodiment, the wireless communication circuit (e.g., a wireless communication module (192) of FIG. 1) may be configured to operate as a slot antenna configured to transmit or receive a wireless signal in a third frequency band via the feed unit (F1) of the fifth wiring (542a) that crosses a slot of a non-conductive area (561) and is electrically connected to a ground layer (G) around the non-conductive area (561). In such a case, the third frequency band may include a frequency band that is substantially the same as or different from at least one of the first and second frequency bands.

[0139] FIGS. 14A and 14B are configuration diagrams of antenna structures according to various embodiments of the present disclosure.

[0140] In describing the antenna structures (500-2, 500-3) of FIGS. 14a and 14b, the same symbols are given to components that are substantially the same as those of the antenna structure (500) of FIG. 5a, and a detailed description thereof may be omitted.

[0141] Referring to FIG. 14A, the antenna structure (500-2) may include a third conductive patch (550) positioned between the first sub-patch (510) and the third sub-patch (530). In one embodiment, the third conductive patch (550) may have substantially the same structure as the second conductive patch (540) of FIG. 5A. In one embodiment, the antenna structure (500-2) may include a non-conductive region (562) positioned to overlap at least a portion of the third conductive patch (550) when the first substrate surface (5901) is viewed from above. In one embodiment, the third conductive patch (550) may benefit from improved radiation performance through the non-conductive region (562) positioned underneath it. In one embodiment, a wireless communication circuit (e.g., a wireless communication module (192) of FIG. 1) may be configured to transmit or receive a wireless signal in a second frequency band (e.g., Ch 5) via a third conductive patch (550).

[0142] Referring to FIG. 14b, the antenna structure (500-3) may include a second conductive patch (540) positioned between the first sub-patch (510) and the second sub-patch (520) and a third conductive patch (550) positioned between the first sub-patch (510) and the third sub-patch (530). In one embodiment, the antenna structure (500-3) may include a first non-conductive region (561) positioned to overlap at least a portion of the second conductive patch (540) and a second non-conductive region (562) positioned to overlap at least a portion of the third conductive patch (550) when the first substrate surface (5901) is viewed from above. In one embodiment, the second conductive patch (540) and the third conductive patch (550) may help improve radiation performance through the first non-conductive region (561) and the second non-conductive region (562) respectively disposed on their lower sides (e.g., in the -z-axis direction). In one embodiment, a wireless communication circuit (e.g., the wireless communication module (192) of FIG. 1) may be configured to operate in a second frequency band (e.g., Ch 5) through the second conductive patch (540) and the third conductive patch (550). In one embodiment, the second conductive patch (540) and the third conductive patch (550) may be disposed in a state of being rotated 90 degrees with respect to each other, and thus may have different phases and may be used as a diversity antenna.

[0143] FIGS. 15A to 15C are configuration diagrams of antenna structures according to various embodiments of the present disclosure.

[0144] In describing the antenna structures (500-4, 500-5, 500-6) of FIGS. 15a to 15c, the same reference numerals are given to components that are substantially the same as those of the antenna structure (500) of FIG. 5a, and a detailed description thereof may be omitted.

[0145] Referring to FIGS. 15A to 15C, the antenna structures (500-4, 500-5, 500-6) may include a second conductive patch (540) positioned between the first sub-patch (510) and the second sub-patch (520). In one embodiment, the antenna structures (500-4, 500-5, 500-6) may include non-conductive regions (563, 564, 565, 567) of various shapes that may help improve the radiation performance of the second conductive patch (540) and / or surrounding patches (e.g., the first sub-patch (510) and / or the second sub-patch (520)) by positioning the second conductive patch (540) to overlap at least a portion of the second conductive patch (540) when viewed from above.

[0146] Referring to FIG. 15A, the antenna structure (500-4) may include a first non-conductive region (563) overlapping at least a portion of the second conductive patch (540) when the second conductive patch (540) is viewed from above, and a second non-conductive region (564) overlapping at least a portion of the second conductive patch (540) and disposed on one side of the first non-conductive region (563). In one embodiment, the length of the slot of the first non-conductive region (563) and the length of the slot of the second non-conductive region (564) may be different from each other. In one embodiment, through the different slot lengths, the first sub-patch (510) and / or the second sub-patch (520) may be used as band stop filters for low band and high band blocking, respectively.

[0147] Referring to FIG. 15B, the antenna structure (500-5) may include a non-conductive region (565) positioned to overlap at least a portion of the second conductive patch (540) when the second conductive patch (540) is viewed from above. In one embodiment, at least a portion of the non-conductive region (565) may be positioned to overlap a portion of the first sub-patch (510) and / or the second sub-patch (520), thereby helping to improve the radiation performance of the first sub-patch (510) and / or the second sub-patch (520).

[0148] Referring to FIG. 15c, the antenna structure (500-6) may include a non-conductive region (567) positioned to overlap at least a portion of the second conductive patch (540) when the second conductive patch (540) is viewed from above. In one embodiment, the non-conductive region (567) may be formed in a closed opening shape in the dielectric substrate (590), thereby helping to reinforce the rigidity of the dielectric substrate and / or improve the radiation performance of the second conductive patch (540).

[0149] FIG. 16A is a front perspective view of an electronic device according to various embodiments of the present disclosure. FIG. 16B is a rear perspective view of an electronic device according to various embodiments of the present disclosure.

[0150] Referring to FIGS. 16A and 16B , the electronic device (600) may include a housing (610) (e.g., a first housing or a base housing) and a slide structure (660) (e.g., a second housing or a slide housing) that is at least partially movably coupled from the housing (610) and supports at least a portion of the flexible display (630). In one embodiment, the slide structure (660) may include a bendable member (not shown) (e.g., a multi-joint hinge or a multi-bar assembly) that is coupled to one end and supports at least a portion of the flexible display (630). For example, when the slide structure (660) performs a sliding motion in the housing (610), the bendable member may be at least partially retracted into the interior space of the housing (610) while supporting the flexible display (630). In one embodiment, the electronic device (600) may include a housing (610) (e.g., a housing structure) that includes a front surface (610a) facing a first direction (e.g., the Z-axis direction), a back surface (610b) facing a second direction opposite to the first direction (- the Z-axis direction), and a side surface (610c) that surrounds a space between the front surface (610a) and the back surface (610b) and is at least partially exposed to the outside. In one embodiment, the back surface (610b) may be formed by a back cover (621) coupled to the housing (610). In one embodiment, the back cover (621) may be formed by a polymer, a coated or colored glass, a ceramic, a metal (e.g., aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the foregoing materials. In some embodiments, the back cover (621) may be formed integrally with the housing (610). In one embodiment, at least a portion of the side (610c) may be positioned to be exposed externally through the housing (610).

[0151] According to various embodiments, the side member (640) may include a first side (641) having a first length, a second side (642) extending in a direction perpendicular to the first side (641) to have a second length longer than the first length, a third side (643) extending from the second side (642) parallel to the first side (641) and having the first length, and a fourth side (644) extending from the third side (643) parallel to the second side (642) and having the second length. In one embodiment, the slide structure (660) supports the flexible display (630) and can expand the display area of ​​the flexible display (630) by being pulled out from the second side (642) toward the fourth side (644) (e.g., in the X-axis direction), or can reduce the display area of ​​the flexible display (630) by being pulled in from the fourth side (644) toward the second side (642) (e.g., in the X-axis direction). In one embodiment, the electronic device (600) can include a first side cover (640a) and a second side cover (640b) for covering the first side (641) and the third side (643). In one embodiment, the first side (641) and the third side (643) may be positioned so as not to be exposed to the outside through the first side cover (640a) and the second side cover (640b).

[0152] According to various embodiments, the electronic device (600) may include a flexible display (630) arranged to be supported by a slide structure (660). In one embodiment, the flexible display (630) may include a first portion (630a) (e.g., a flat portion) supported by the slide structure (660) and a second portion (630b) (e.g., a bendable portion or a bendable portion) extending from the first portion (630a) and at least partially supported by a bendable member. In one embodiment, at least a portion of the second portion (630b) may be arranged to be inserted into the internal space of the housing (610) and not exposed to the outside when the electronic device (600) is in a slide-in state (e.g., at least a portion of the slide structure (660) is inserted into the housing (610), and may be at least partially exposed to the outside when the electronic device (600) is in a slide-out state (e.g., at least a portion of the slide structure (660) is pulled out from the housing (610)) so as to extend from the first portion (630a) while being supported by at least a portion of the bendable member. Accordingly, the electronic device (600) may include a rollable type or slidable type electronic device in which the display area of ​​the flexible display (630) changes according to the movement of the slide structure (660) from the housing (610).

[0153] According to various embodiments, the slide structure (660) may be movably coupled to slide in or out at least partially from the housing (610). For example, the flexible display (630) may be configured to have a display area corresponding to a first width (W1) from the second side (642) to the fourth side (644) in the retracted state. In one embodiment, the flexible display (630) may be deformed to have a display area corresponding to a third width (W3) larger than the first width (W1) by moving at least a portion of the bendable member retracted into the interior of the housing (610) outwardly of the electronic device to additionally have a second width (W2) in the retracted state of the slide structure (660). Accordingly, the flexible display (630) may have a display area that varies in accordance with the width of the electronic device that varies according to the sliding motion of the slide structure (660).

[0154] According to various embodiments, the electronic device (600) may include at least one of an input module (603), an audio output module (606, 607), a sensor module (604, 617), a camera module (605, 616), a connector port (608), a key input module (not shown), or an indicator (not shown). In other embodiments, the electronic device (600) may omit at least one of the above-described components or may additionally include other components.

[0155] In various embodiments, the input module (603) may include a microphone. In some embodiments, the input module (603) may include multiple microphones arranged to detect the direction of sound. The audio output module (606, 607) may include speakers. The audio output module (606, 607) may include an external speaker (606) and a call receiver (607). In other embodiments, the audio output module (606, 607) may include a speaker (e.g., a piezo speaker) that operates without a separate speaker hole.

[0156] According to various embodiments, the sensor modules (604, 617) may generate electrical signals or data values ​​corresponding to the internal operating state of the electronic device (600) or the external environmental state. The sensor modules (604, 617) may include, for example, a first sensor module (604) (e.g., a proximity sensor or an illuminance sensor) disposed on the front (610a) of the electronic device (600) and / or a second sensor module (617) (e.g., an HRM sensor) disposed on the rear (610b) of the electronic device (600). In one embodiment, the first sensor module (604) may be disposed on the front (610a) of the electronic device (600), below the flexible display (630). In one embodiment, the first sensor module (604) may further include at least one of a proximity sensor, an ambient light sensor, a time of flight (TOF) sensor, an ultrasonic sensor, a fingerprint recognition sensor, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, or a humidity sensor.

[0157] According to various embodiments, the camera modules (605, 616) may include a first camera module (605) disposed on the front (610a) of the electronic device (600), and a second camera module (616) disposed on the back (610b). In one embodiment, the electronic device (600) may include a flash (618) positioned near the second camera module (616). In one embodiment, the camera modules (605, 616) may include one or more lenses, an image sensor, and / or an image signal processor. In one embodiment, the first camera module (605) may be disposed under the flexible display (630) and configured to capture an object through a portion of an active area of ​​the flexible display (630). In one embodiment, the flash (618) may include, for example, a light emitting diode or a xenon lamp. In some embodiments, two or more lenses (wide-angle and telephoto lenses) and image sensors may be arranged on one side of the electronic device (600).

[0158] According to various embodiments, the electronic device (600) may include an antenna structure (500) arranged to form a wireless signal in a direction (e.g., -z-axis direction) toward the rear surface (610b) in the interior space of the housing (610). In one embodiment, the antenna structure (500) may be replaced with or additionally arranged as at least one of the antenna structure (500) of FIG. 5A, the antenna structure (500-1) of FIG. 13, and the antenna structures (500-2, 500-3, 500-4, 500-5, 500-6) of FIGS. 14A to 15C, thereby assisting in measuring a distance to an external electronic device or a position of the external electronic device.

[0159] FIG. 17A is a front perspective view of an electronic device according to various embodiments of the present disclosure. FIG. 17B is a rear perspective view of an electronic device according to various embodiments of the present disclosure.

[0160] Referring to FIGS. 17A and 17B , an electronic device (900) may include a housing (910) that includes a first side (or front side) (910A), a second side (or back side) (910B), and a side surface (910C) that encloses a space between the first side (910A) and the second side (910B). In another embodiment (not shown), the housing (910) may refer to a structure that forms a portion of the first side (910A), the second side (910B), and the side surface (910C) of FIG. 17A . In one embodiment, the first side (910A) may be formed by a front plate (902) that is at least partially substantially transparent (e.g., a glass plate or a polymer plate including various coating layers). The second side (910B) may be formed by a substantially opaque back plate (911). The rear plate (911) may be formed of, for example, coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the foregoing materials. The side (910C) may be formed by a side bezel structure (or “side member”) (918) that is coupled to the front plate (902) and the rear plate (911) and comprises a metal and / or polymer. In some embodiments, the rear plate (911) and the side bezel structure (918) may be formed integrally and comprise the same material (e.g., a metal material such as aluminum).

[0161] In the illustrated embodiment, the front plate (902) may include a first region (910D) extending seamlessly from the first side (910A) toward the rear plate, at both ends of a long edge of the front plate (902). In the illustrated embodiment (see FIG. 16B), the rear plate (911) may include a second region (910E) extending seamlessly from the second side (910B) toward the front plate (902), at both ends of a long edge. In some embodiments, the front plate (902) or the rear plate (911) may include only one of the first region (910D) or the second region (910E). In some embodiments, the front plate (902) may not include the first region and the second region, but may only include a flat surface that is arranged parallel to the second side (910B). In these embodiments, when viewed from the side of the electronic device (900), the side bezel structure (918) may have a first thickness (or width) on the side that does not include the first region (910D) or the second region (910E), and may have a second thickness that is thinner than the first thickness on the side that includes the first region (910D) or the second region (910E).

[0162] According to one embodiment, the electronic device (900) may include at least one of a display (901) (e.g., a first display), an input device (903), an audio output device (907, 914), a sensor module (904, 919), a camera module (905, 912, 913), a key input device (917), an indicator (not shown), and a connector (908, 909). In some embodiments, the electronic device (900) may omit at least one of the components (e.g., the key input device (917) or the indicator) or may additionally include other components.

[0163] The display (901) may be exposed, for example, through a substantial portion of the front plate (902). In some embodiments, at least a portion of the display (901) may be exposed through the front plate (902), which forms the first side (910A) and the first region (910D) of the side surface (910C). For example, the display (901) may be coupled to or disposed adjacent to a touch sensing circuit, a pressure sensor capable of measuring the intensity (pressure) of a touch, and / or a digitizer for detecting a magnetic stylus pen. In some embodiments, at least a portion of the sensor modules (904, 919), and / or at least a portion of the key input device (917), may be disposed in the first region (910D), and / or the second region (910E).

[0164] In one embodiment, the input device (903) may include a microphone. In some embodiments, the input device (903) may include multiple microphones arranged to detect the direction of sound. The audio output device (907, 914) may include speakers. The audio output device (907, 914) may include an external speaker (907) and a call receiver (914). In some embodiments, the input device (903), the audio output device (907, 914), and the connectors (908, 909) may be arranged in the space of the electronic device (900) and may be exposed to the external environment through at least one hole formed in the housing (910). In some embodiments, the hole formed in the housing (910) may be used jointly for the input device (903) and the audio output device (907, 914). In some embodiments, the audio output device (907, 914) may include a speaker (e.g., a piezo speaker) that operates without the hole formed in the housing (910).

[0165] According to one embodiment, the sensor modules (904, 919) may generate electrical signals or data values ​​corresponding to an internal operating state of the electronic device (900) or an external environmental state. The sensor modules (904, 919) may include, for example, a first sensor module (904) (e.g., a proximity sensor) and / or a second sensor module (not shown) (e.g., a fingerprint sensor) disposed on a first surface (910A) of the housing (910), and / or a third sensor module (919) (e.g., an HRM sensor) disposed on a second surface (910B) of the housing (910). The fingerprint sensor may be disposed on the first surface (910A) of the housing (910). The fingerprint sensor (e.g., an ultrasonic or optical fingerprint sensor) may be disposed under the display (901) on the first surface (910A). The electronic device (900) may further include at least one of a sensor module not shown, for example, a gesture sensor, a gyro sensor, a pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor (904).

[0166] In one embodiment, the camera modules (905, 912, 913) may include a first camera module (905) disposed on a first side (910A) of the electronic device (900), and / or a second camera module (912) disposed on a second side (910B), and / or a flash (913). The camera modules (905, 912) may include one or more lenses, an image sensor, and / or an image signal processor. The flash (913) may include, for example, a light emitting diode or a xenon lamp. In some embodiments, two or more lenses (a wide-angle and a telephoto lens) and image sensors may be disposed on one side of the electronic device (900).

[0167] In one embodiment, the key input device (917) may be positioned on a side surface (910C) of the housing (910). In another embodiment, the electronic device (900) may not include some or all of the key input devices (917), and the key input devices (917) that are not included may be implemented in another form, such as soft keys, on the display (901). In another embodiment, the key input device (917) may be implemented using a pressure sensor included in the display (901).

[0168] The indicator may be disposed, for example, on the first side (910A) of the housing (910). The indicator may provide, for example, status information of the electronic device (900) in the form of light. In another embodiment, the light-emitting element may provide a light source that is linked to the operation of, for example, the camera module (905). The indicator may include, for example, an LED, an IR LED, and / or a xenon lamp.

[0169] According to one embodiment, the connector holes (908, 909) may include a first connector hole (908) that can accommodate a connector (e.g., a USB connector or an IF module (interface connector port module)) for transmitting and receiving power and / or data with an external electronic device, and / or a second connector hole (or earphone jack) (909) that can accommodate a connector for transmitting and receiving audio signals with an external electronic device.

[0170] In one embodiment, some of the camera modules (905, 912), some of the sensor modules (904, 919), or indicators may be arranged to be exposed through the display (901). For example, the camera module (905), the sensor module (904), or the indicator may be arranged to be in contact with the external environment through an opening perforated from the internal space of the electronic device (900) to the front plate (902) of the display (901). In another embodiment, some of the sensor modules (904) may be arranged to perform their functions without being visually exposed through the front plate (902) in the internal space of the electronic device. For example, in this case, an area of ​​the display (901) facing the sensor modules may not require a perforated opening.

[0171] According to various embodiments, the electronic device (900) may include an antenna structure (500) arranged to form a wireless signal in the direction (e.g., -z-axis direction) toward the rear plate (911) in the interior space of the housing (910). In one embodiment, the antenna structure (500) may be replaced with or additionally arranged as at least one of the antenna structure (500) of FIG. 5A, the antenna structure (500-1) of FIG. 13, and the antenna structures (500-2, 500-3, 500-4, 500-5, 500-6) of FIGS. 14A to 15C, thereby assisting in measuring a distance to an external electronic device or a position of the external electronic device.

[0172] An antenna structure according to exemplary embodiments of the present disclosure (e.g., antenna structure (500) of FIG. 5A) may also be applied to tablet PCs, notebook PCs, or other electronic devices having wireless communication capabilities.

[0173] According to various embodiments, an electronic device (e.g., an electronic device (200) of FIG. 4) comprises a housing (e.g., a first housing (210) of FIG. 4) and an antenna structure (e.g., an antenna structure (500) of FIG. 4) disposed in the housing, the substrate (e.g., a dielectric substrate (590) of FIG. 5A) including a first substrate surface (e.g., a first substrate surface (5901) of FIG. 5A), a second substrate surface (e.g., a second substrate surface (5902) of FIG. 5A) facing in an opposite direction to the first substrate surface, and a ground layer (e.g., a ground layer (G) of FIG. 5A) disposed in a space between the first substrate surface and the second substrate surface, and a first conductive patch including a plurality of sub-patches (e.g., sub-patches (510, 520, 530) of FIG. 5A) disposed to correspond to the ground layer, and the first substrate surface is formed from above. When viewed, the antenna structure includes a second conductive patch (e.g., a second conductive patch (540) of FIG. 5A) disposed between a first sub-patch (e.g., a first sub-patch (510) of FIG. 5A) and a second sub-patch (e.g., a second sub-patch (520) of FIG. 5A) among the first plurality of conductive patches, and a wireless communication circuit (e.g., a wireless communication module (192) of FIG. 1) configured to transmit or receive a first wireless signal in a first frequency band through the plurality of sub-patches and to transmit or receive a second wireless signal in a second frequency band through the second conductive patch, and when the first substrate surface is viewed from above, may include a first non-conductive region (e.g., a non-conductive region (561) of FIG. 5A) disposed at a position overlapping at least a portion of the second conductive patch.

[0174] According to various embodiments, the first non-conductive region may be formed by omission of a portion of the ground layer.

[0175] According to various embodiments, the first non-conductive region may be formed to have a first length (e.g., the first length (L1) of FIG. 5A) along an edge of the substrate and a second length (e.g., the second length (L2) of FIG. 5A) in a direction perpendicular to the first length.

[0176] According to various embodiments, the second length may be formed to have a length greater than λ / 4 based on the first frequency band.

[0177] According to various embodiments, the second frequency band may be determined by the second length of the first non-conductive region.

[0178] According to various embodiments, the second frequency band may be determined by the first length of the first non-conductive region.

[0179] According to various embodiments, the first conductive patch may include a circular polarization antenna.

[0180] According to various embodiments, the second conductive patch includes at least one slot (e.g., slots (542, 543) of FIG. 5d), and the second frequency band can be determined through the shape of the at least one slot.

[0181] According to various embodiments, the housing (e.g., housing (910) of FIG. 17a) includes a front cover (e.g., front plate (902) of FIG. 17a), a rear cover (e.g., rear plate (911) of FIG. 17b) facing in an opposite direction from the front cover, and a side member (e.g., side member (918) of FIG. 17a) surrounding a space between the front cover and the rear cover and at least partially exposed to the exterior of the electronic device, and the antenna structure may be arranged in such a way that the first substrate surface faces the rear cover.

[0182] According to various embodiments, at least a portion of the side member (e.g., the first side member (213) of FIG. 2B) includes a conductive portion (e.g., the conductive portion (310) of FIG. 2B), and the wireless communication circuit can be configured to transmit or receive the first wireless signal of the first frequency band or the second wireless signal of the second frequency band through the conductive portion.

[0183] According to various embodiments, the second conductive patch and the conductive portion can be operated as a diversity antenna in the second frequency band through the wireless communication circuit.

[0184] According to various embodiments, the first plurality of conductive patches and the conductive portion can be operated as a diversity antenna in the first frequency band through the wireless communication circuit.

[0185] According to various embodiments, the first sub-patch and the second sub-patch are arranged side by side along a first direction (e.g., direction ① of FIG. 5A), and the first conductive patch may further include a third sub-patch (530) that is arranged spaced apart from the first sub-patch in a second direction (e.g., direction ② of FIG. 5A) perpendicular to the first direction.

[0186] According to various embodiments, the antenna structure further includes a third conductive patch (e.g., the third conductive patch (550) of FIG. 14b) disposed between the first sub-patch and the third sub-patch,

[0187] The above wireless communication circuit may be configured to transmit or receive the second wireless signal in the second frequency band via the third conductive patch.

[0188] According to various embodiments, when the first substrate surface is viewed from above, it may include a second non-conductive region (e.g., the second non-conductive region (562) of FIG. 14b) positioned to overlap the third conductive patch.

[0189] According to various embodiments, the second conductive patch and the third conductive patch can be operated as a diversity antenna in the second frequency band through the wireless communication circuit.

[0190] According to various embodiments, the first frequency band may include a frequency band in the range of 7.75 GHz to 8.25 GHz.

[0191] According to various embodiments, the second frequency band may include a frequency band in the range of 6.25 GHz to 6.75 GHz.

[0192] According to various embodiments, the wireless communication circuit may be electrically connected to a feed portion (e.g., feed portion (F1) of FIG. 13) located across the non-conductive region and at least a portion of the ground layer.

[0193] According to various embodiments, the wireless communication circuit may be configured to transmit or receive a wireless signal in a third frequency band different from the first frequency band and / or the second frequency band through the power supply.

[0194] In addition, the embodiments of the present disclosure disclosed in this specification and drawings are merely specific examples to easily explain the technical contents according to the embodiments of the present disclosure and to help understand the embodiments of the present disclosure, and are not intended to limit the scope of the embodiments of the present disclosure. Therefore, the scope of the various embodiments of the present disclosure should be interpreted as including all changes or modified forms derived based on the technical ideas of the various embodiments of the present disclosure in addition to the embodiments disclosed herein.

Claims

1. In an electronic device (200), Housing (210); As an antenna structure (500) placed in the above housing, A substrate (590) including a first substrate surface (5901), a second substrate surface (5902) facing in an opposite direction to the first substrate surface, and a ground layer (G) disposed between the first substrate surface and the second substrate surface; A first conductive patch comprising a plurality of sub-patches (510, 520, 530) arranged to correspond to the ground layer; and An antenna structure including a second conductive patch (540) positioned between a first sub-patch (510) and a second sub-patch (520) among the plurality of sub-patches when the first substrate surface is viewed from above; and A wireless communication circuit (192) configured to transmit or receive a first wireless signal in a first frequency band through the plurality of sub-patches and to transmit or receive a second wireless signal in a second frequency band through the second conductive patch, An electronic device including a first non-conductive region (561) positioned so as to overlap at least a portion of the second conductive patch when the first substrate surface is viewed from above.

2. In paragraph 1, An electronic device wherein the first non-conductive region is formed by omission of a portion of the ground layer.

3. In paragraph 1 or 2, An electronic device in which the first non-conductive region has a first length (L1) along an edge of the substrate and a second length (L2) in a direction perpendicular to the first length.

4. In any one of paragraphs 1 to 3, An electronic device in which the second length is formed to have a length greater than λ / 4 based on the first frequency band.

5. In any one of paragraphs 1 to 4, An electronic device wherein the second frequency band is determined by the second length of the first non-conductive region.

6. In any one of paragraphs 1 to 5, An electronic device wherein the second frequency band is determined by the first length of the first non-conductive region.

7. In any one of paragraphs 1 to 6, The above first challenge patch is an electronic device including a circular polarization antenna.

8. In any one of paragraphs 1 to 7, The above second challenge patch comprises at least one slot (542, 543), An electronic device wherein the second frequency band is determined through the shape of at least one slot.

9. In any one of paragraphs 1 to 8, The above housing (910) is, Front cover (902); A rear cover (911) facing in the opposite direction to the front cover; and A side member (918) surrounding the space between the front cover and the rear cover and at least partially exposed to the outside of the electronic device, An electronic device in which the antenna structure is arranged such that the first substrate surface faces the rear cover.

10. In paragraph 9, At least a portion of the above side member (213) includes a conductive portion (310), An electronic device in which the wireless communication circuit is configured to transmit or receive the first wireless signal of the first frequency band or the second wireless signal of the second frequency band through the conductive portion.

11. In clause 9 or 10, An electronic device in which the second conductive patch and the conductive portion operate as a diversity antenna in the second frequency band through the wireless communication circuit.

12. In any one of paragraphs 9 to 11, An electronic device in which the first plurality of conductive patches and the conductive portion operate as a diversity antenna in the first frequency band through the wireless communication circuit.

13. In any one of paragraphs 1 to 12, The above first sub-patch and the above second sub-patch are arranged side by side along the first direction (① direction), An electronic device wherein the first challenging patch further includes a third sub-patch (530) spaced apart from the first sub-patch in a second direction (② direction) perpendicular to the first direction.

14. In paragraph 13, The above antenna structure further includes a third conductive patch (550) arranged between the first sub-patch and the third sub-patch, An electronic device wherein the wireless communication circuit is configured to transmit or receive the second wireless signal in the second frequency band via the third conductive patch.

15. In paragraph 14, An electronic device including a second non-conductive region (562) positioned so as to overlap the third conductive patch when the first substrate surface is viewed from above.

Images