Electronic device including antenna

Abstract

This electronic device includes: a first housing; a second housing; a hinge structure; and a wireless communication circuit. The second housing includes: a sixth side portion including a first conductive portion; a fifth side portion opposite to the sixth side portion and including a second conductive portion; a fourth side portion opposite to the hinge structure and including a third conductive portion; and a third corner portion disposed between the sixth side portion and the fourth side portion and including a fifth conductive portion; and a second corner portion including a sixth conductive portion. The electronic device includes a first matching circuit unit for inducing a second surface current having a second phase opposite to a first phase of a first surface current which is induced to the first housing, the second housing, and the hinge structure while the electronic device is folded.

Description

Electronic device including an antenna

[0001] Embodiments of the present disclosure relate to an electronic device including an antenna.

[0002] A foldable electronic device may include a first housing and a second housing rotatably connected to the first housing via a hinge device. At least a portion of a metal frame (e.g., a metal bezel) disposed on a side of the first housing and / or the second housing may be used as an antenna. The antenna may be designed so that its radiation performance is not degraded as the electronic device folds and unfolds.

[0003] An electronic device may include a foldable electronic device comprising a first housing and a second housing foldably connected to the first housing via a hinge device. The electronic device may include a flexible display that is used in an unfolded state and is arranged to receive support from at least a portion of the second housing via the hinge device from the first housing. The foldable electronic device may include at least one antenna (e.g., a metal frame antenna) that is arranged in an interior space of at least one of the housings or uses at least a portion of a conductive side. The volume and number of such antennas provided by the electronic device may be determined according to a frequency, bandwidth, and / or type for each service.

[0004] Foldable electronic devices may utilize a metal frame to reinforce rigidity, and when folded, the metal frames of the first housing and the second housing may form a "U" shape. However, planar parasitic resonance may occur through the conductive sheet (e.g., Cu sheet) of the flexible display disposed therein. Such parasitic resonance may deteriorate the radiation performance of the antenna of the foldable electronic device.

[0005] Here, the first housing, and the conductive support member disposed in the first housing and capable of generating parasitic resonance according to a radiation current, the ground of the flexible display, the conductive side, and / or the conductive portion included in the first housing, such as a metal frame, may be collectively referred to as the first housing. Similarly, the second housing, and the conductive portion included in the second housing, such as the conductive support member disposed in the second housing and capable of generating parasitic resonance according to a radiation current, the ground of the flexible display, the conductive side, and / or the conductive portion included in the second housing, may be collectively referred to as the second housing.

[0006] Various embodiments of the present disclosure can provide an electronic device including an antenna that can help improve radiation performance by inducing a parasitic resonant frequency generated in a folded state to a band other than an operating frequency band of the antenna (e.g., out band).

[0007] An electronic device according to one aspect of the present disclosure comprises: a first housing; a second housing including a second support member; a hinge structure coupled to the first housing and the second housing and foldable using the hinge structure as a central axis; and a wireless communication circuit disposed on the second support member of the second housing, wherein the second housing comprises: a sixth side portion including a first conductive portion; a fifth side portion opposite the sixth side portion and including a second conductive portion; a fourth side portion opposite the hinge structure and including a third conductive portion; a third edge portion disposed between the sixth side portion and the fourth side portion and including a fifth conductive portion; a second edge portion disposed between the fifth side portion and the fourth side portion and including a sixth conductive portion; And a first matching circuit portion disposed on the second support member and electrically coupled to the sixth side portion, wherein the electronic device induces a second surface current having a second phase opposite to the first phase of the first surface current (J1) induced in the first housing, the second housing, and the hinge structure when the first housing and the second housing are in a folded state in which the first housing and the second housing are folded together.

[0008] An electronic device according to one aspect of the present disclosure comprises: a first housing; a second housing including a second support member; a hinge structure coupled to the first housing and the second housing and foldable using the hinge structure as a central axis; and a wireless communication circuit disposed on the second support member of the second housing, wherein the second housing comprises: a sixth side portion including a first conductive portion; a fifth side portion opposite the sixth side portion and including a second conductive portion; a fourth side portion opposite the hinge structure and including a third conductive portion; a third edge portion disposed between the sixth side portion and the fourth side portion and including a fourth conductive portion; a fourth edge portion disposed between the fifth side portion and the fourth side portion and including a fifth conductive portion; And a first matching circuit portion disposed on the second support member and electrically coupled to the sixth side portion and the third corner portion, and inducing a second surface current having a second phase opposite to a first phase of a first surface current induced in the first housing, the second housing, and the hinge structure when the electronic device is in a folded state in which the first housing and the second housing are folded with each other about the hinge structure as a central axis.

[0009] In addition, various effects may be provided, either directly or indirectly, through this document.

[0010] The effects that can be obtained from the present disclosure are not limited to the effects mentioned above, and other effects that are not mentioned can be clearly understood by a person having ordinary skill in the art to which the present disclosure belongs from the description below.

[0011] The above and other aspects, features, and advantages of specific embodiments of the present disclosure will become more apparent from the following description taken in conjunction with the accompanying drawings, in which:

[0012] FIG. 1 is a block diagram of an electronic device within a network environment according to various embodiments.

[0013] FIG. 2A is a perspective view of an electronic device illustrating a flat state or unfolded state according to various embodiments.

[0014] FIG. 2b is a plan view illustrating the front of an electronic device in an unfolded state according to various embodiments.

[0015] FIG. 2c is a plan view illustrating the rear surface of an electronic device in an unfolded state according to various embodiments.

[0016] FIG. 3A is a perspective view of an electronic device illustrating a folded state according to various embodiments.

[0017] FIG. 3b is a perspective view of an electronic device illustrating an intermediate state according to various embodiments.

[0018] FIG. 4 is an exploded perspective view of an electronic device according to various embodiments.

[0019] FIG. 5A is a perspective view illustrating an electronic device in a folded state according to various embodiments.

[0020] FIG. 5b is a conceptual diagram illustrating a simplified version of an electronic device in a folded state according to various embodiments as a shielded parallel plate model.

[0021] FIG. 6A is a conceptual diagram illustrating the mode of an electric field for a portion of a second housing and hinge structure of an electronic device in a folded state according to various embodiments in a shielded parallel plate model.

[0022] FIG. 6b is a conceptual diagram illustrating the mode of an electric field for an electronic device in a folded state according to various embodiments in a shielded parallel plate model.

[0023] FIG. 7A is a conceptual diagram illustrating current distribution for a portion of a second housing and hinge structure of an electronic device in a folded state according to various embodiments in a shielded parallel plate model.

[0024] FIG. 7b is a conceptual diagram illustrating current distribution for an electronic device in a folded state according to various embodiments in a shielded parallel plate model.

[0025] FIG. 8A is a conceptual diagram illustrating a simplified version of an electronic device in a folded state according to various embodiments as a shielded parallel plate model.

[0026] FIG. 8b is a conceptual diagram illustrating current distribution for an electronic device in a folded state according to various embodiments in a shielded parallel plate model.

[0027] FIG. 9A is a conceptual diagram illustrating a shielded parallel plate model corresponding to an electronic device in a folded state that does not include a conductive portion on the side according to various embodiments.

[0028] FIG. 9b is a graph illustrating the reflection coefficient of a resonant frequency formed in an electronic device in a folded state that does not include a conductive portion on the side according to various embodiments.

[0029] FIG. 9c is a conceptual diagram illustrating the mode of the electric field of the second housing of an electronic device in a folded state without including a conductive portion on the side according to various embodiments of the present disclosure in a shielded parallel plate model.

[0030] FIG. 10A is a conceptual diagram illustrating a shielded parallel plate model corresponding to an electronic device in a folded state including a conductive portion on a side according to various embodiments.

[0031] FIG. 10b is a graph illustrating the reflection coefficient of a resonant frequency formed in an electronic device in a folded state that does not include a conductive portion on the side according to various embodiments.

[0032] FIG. 10c is a conceptual diagram illustrating the mode of the electric field of an electronic device in a folded state including a conductive portion on the side according to various embodiments in a shielded parallel plate model.

[0033] FIG. 11A is a conceptual diagram illustrating a shielded parallel plate model corresponding to an electronic device in a folded state in which a conductive portion included on a side surface is grounded according to various embodiments.

[0034] FIG. 11b is a graph illustrating a reflection coefficient of a resonant frequency formed in an electronic device in a folded state in which a conductive portion included in a side surface is grounded according to various embodiments.

[0035] FIG. 11c is a conceptual diagram illustrating the mode of the electric field of an electronic device in a folded state in which a conductive portion included in a side surface is grounded according to various embodiments, in a shielded parallel plate model.

[0036] FIG. 12A is a conceptual diagram illustrating the current distribution of an electronic device in a folded state in which a conductive portion included in a side surface is grounded according to various embodiments, in a shielded parallel plate model.

[0037] FIG. 12b is a conceptual diagram illustrating the current distribution of an electronic device in a folded state in which a conductive portion included in a side surface is grounded according to various embodiments, in a shielded parallel plate model.

[0038] FIG. 13A is a conceptual diagram illustrating the electric field modes of the second housing and the sixth side of an electronic device according to various embodiments in a shielded parallel plate model.

[0039] FIG. 13b is a conceptual diagram illustrating surface current of a second housing and surface current of a sixth side of an electronic device according to various embodiments in a shielded parallel plate model.

[0040] FIG. 14A is a top view of a shielded parallel plate model corresponding to an electronic device in which a first parasitic resonance is formed according to various embodiments.

[0041] FIG. 14b is a perspective view of a shielded parallel plate model corresponding to an electronic device in which a first parasitic resonance is formed according to various embodiments.

[0042] FIG. 14c is a graph showing the reflection coefficient of the first parasitic resonance frequency of an electronic device in which a first parasitic resonance is formed according to various embodiments.

[0043] FIG. 14d is a conceptual diagram illustrating the mode of the electric field of an electronic device in which a first parasitic resonance is formed according to various embodiments on a shielded parallel plate model.

[0044] FIG. 15A is a top view of a shielded parallel plate model corresponding to an electronic device in which first parasitic resonance and second parasitic resonance are formed according to various embodiments.

[0045] FIG. 15b is a perspective view of a shielded parallel plate model corresponding to an electronic device in which first parasitic resonance and second parasitic resonance are formed according to various embodiments.

[0046] FIG. 15c is a graph showing the reflection coefficient of the second resonance frequency and the reflection coefficient of the first parasitic resonance frequency of an electronic device in which the first parasitic resonance and the second parasitic resonance are formed according to various embodiments.

[0047] FIG. 15d is a conceptual diagram illustrating an electric field mode of an electronic device in which a first parasitic resonance is formed in a shielded parallel plate model according to various embodiments.

[0048] FIG. 15e is a conceptual diagram illustrating the mode of the electric field of an electronic device in which a first parasitic resonance is formed in a shielded parallel plate model according to various embodiments.

[0049] FIG. 16A is a conceptual diagram illustrating the current distribution of an electronic device in which a first parasitic resonance and a second parasitic resonance are formed according to various embodiments in a shielded parallel plate model.

[0050] FIG. 16b is a conceptual diagram illustrating the current distribution of an electronic device in which a first parasitic resonance and a second parasitic resonance are formed according to various embodiments in a shielded parallel plate model.

[0051] FIG. 17a is a conceptual diagram illustrating the current distribution of an electronic device in which a first parasitic resonance is formed according to various embodiments in a shielded parallel plate model.

[0052] FIG. 17b is a conceptual diagram illustrating the current distribution of an electronic device in which a first parasitic resonance is formed according to various embodiments in a shielded parallel plate model.

[0053] FIG. 18 is a conceptual diagram illustrating one side of an electronic device according to various embodiments.

[0054] FIG. 19A is a conceptual diagram illustrating one side of an electronic device according to various embodiments.

[0055] FIG. 19b is a conceptual diagram illustrating the distribution of surface current of an electronic device according to various embodiments.

[0056] FIG. 19c is a conceptual diagram illustrating the distribution of surface current on one side of an electronic device according to various embodiments.

[0057] FIG. 19d is a conceptual diagram illustrating the distribution of surface current on one side of an electronic device according to various embodiments.

[0058] FIG. 20A is a conceptual diagram illustrating one side of an electronic device according to various embodiments.

[0059] FIG. 20b is a conceptual diagram illustrating the distribution of surface current on one side of an electronic device according to various embodiments.

[0060] FIG. 20c is a conceptual diagram illustrating the distribution of surface current on one side of an electronic device according to various embodiments.

[0061] FIG. 20d is a conceptual diagram illustrating the distribution of surface current on one side of an electronic device according to various embodiments.

[0062] FIG. 21 is a graph illustrating a shift in the frequency band of a first parasitic resonance due to a second parasitic resonance formed in an electronic device according to various embodiments.

[0063] FIG. 22 is a graph showing the efficiency of radiation performance according to the resonance splitting phenomenon caused by the second parasitic resonance formed in an electronic device according to various embodiments.

[0064] FIG. 23 is a conceptual diagram illustrating one side of an electronic device according to various embodiments.

[0065] FIG. 24 is a conceptual diagram illustrating one side of an electronic device according to various embodiments.

[0066] FIG. 25 is a conceptual diagram illustrating one side of an electronic device according to various embodiments.

[0067] FIG. 26 is a conceptual diagram illustrating one side of an electronic device according to various embodiments.

[0068] FIG. 27 is a conceptual diagram illustrating one side of an electronic device according to various embodiments.

[0069] FIG. 28 is a conceptual diagram illustrating one side of an electronic device according to various embodiments.

[0070] FIG. 29A is a conceptual diagram illustrating one side of an electronic device according to various embodiments.

[0071] FIG. 29b is a graph illustrating a shift in the frequency band of a first parasitic resonance according to a second parasitic resonance formed in an electronic device according to various embodiments.

[0072] FIG. 30A is a conceptual diagram illustrating an electronic device according to various embodiments.

[0073] FIG. 30b is a conceptual diagram illustrating one side of an electronic device according to various embodiments.

[0074] FIG. 30c is a conceptual diagram illustrating the distribution of surface current of an electronic device according to various embodiments.

[0075] FIG. 30d is a graph illustrating the frequency of parasitic resonance formed in an electronic device in a folded state according to various embodiments.

[0076] FIG. 31A is a conceptual diagram illustrating an electronic device according to various embodiments.

[0077] FIG. 31b is a conceptual diagram illustrating one side of an electronic device according to various embodiments.

[0078] FIG. 31c is a conceptual diagram illustrating the distribution of surface current of an electronic device according to various embodiments.

[0079] FIG. 31d is a graph illustrating the frequency of parasitic resonance formed in an electronic device in a folded state according to various embodiments.

[0080] FIG. 32a is a conceptual diagram illustrating an electronic device according to various embodiments.

[0081] FIG. 32b is a conceptual diagram illustrating one side of an electronic device according to various embodiments.

[0082] FIG. 32c is a conceptual diagram illustrating the distribution of surface current of an electronic device according to various embodiments.

[0083] FIG. 32d is a graph illustrating the frequency of parasitic resonance formed in an electronic device in a folded state according to various embodiments.

[0084] FIG. 33A is a conceptual diagram illustrating a connection structure between a matching circuit, a sixth side, a third corner, and / or a wireless communication circuit in an electronic device according to various embodiments.

[0085] FIG. 33b is a circuit diagram illustrating a matching circuit in an electronic device according to various embodiments.

[0086] Hereinafter, embodiments of the present disclosure will be described with reference to the drawings so that those skilled in the art can easily implement the present disclosure. However, the present disclosure may be implemented in various different forms and is not limited to the embodiments described herein. In connection with the description of the drawings, the same or similar reference numerals may be used for identical or similar components. Furthermore, in the drawings and related descriptions, descriptions of well-known functions and configurations may be omitted for clarity and conciseness.

[0087] It should be understood that the singular form of a noun corresponding to an item may include more than one thing unless the context clearly indicates otherwise. As used herein, phrases such as "A or B," "at least one of A and B," "at least one of A or B," "A, B, or C," "at least one of A, B, and C," and "at least one of A, B, or C" may include one or all possible combinations of the items listed together in that phrase. Terms such as "first" and "second" or "primary" and "secondary" as used herein may be used merely to distinguish one component from another and do not limit the component in any other respect (such as importance or order). When an element (e.g., a first element) is referred to as being "coupled with," "coupled to," "connected with," or "connected to" another element (e.g., a second element), with or without the terms "operatively" or "communicatively," this means that the element can be coupled to the other element directly (e.g., wired), wirelessly, or via a third element.

[0088] When an element or layer is referred to as being "over," "above," "on," "below," "under," "beneath," "connected to," or "coupled to" another element or layer, this can mean that it is directly over, directly above, directly on, directly below, directly under, directly beneath, directly connected to, or directly coupled to the other element or layer, or that there may be intervening elements or layers. In contrast, when an element is referred to as being “directly over,” “directly above,” “directly on,” “directly below,” “directly under,” “directly beneath,” “directly beneath,” “directly connected to,” or “directly coupled to” another element or layer, there may be no intervening elements or layers present.

[0089] The terms "upper," "middle," "lower," etc. may be replaced with the terms "first," "second," "third," etc., which are used to describe the relative positions of elements. The terms "first," "second," "third," etc. may be used to describe various elements, but the elements are not limited by the terms, and a "first element" may be referred to as a "second element." Alternatively or additionally, the terms "first," "second," "third," etc. may be used to distinguish elements from one another and do not limit the disclosure. For example, the terms "first," "second," "third," etc. may not necessarily imply an order or any form of numerical meaning.

[0090] Throughout this disclosure, references to "one embodiment," "an embodiment," "an example embodiment," or similar language may indicate that a particular feature, structure, or characteristic described in connection with the indicated embodiment is included in at least one embodiment of the present solution. Thus, throughout this disclosure, appearances of the phrases "in one embodiment," "in an embodiment," "in an example embodiment," and similar language may all refer to the same embodiment, but do not necessarily. The embodiments described herein are exemplary embodiments, and the present disclosure is not limited thereto and may be embodied in various other forms.

[0091] Embodiments described herein may be described and illustrated in terms of blocks that perform the described function or functions as shown in the drawings. Such blocks may be referred to herein as units or modules or the like, or as devices, logic, circuits, controllers, counters, comparators, generators, converters or the like, and may be physically implemented by analog and / or digital circuits that include one or more of logic gates, integrated circuits, microprocessors, microcontrollers, memory circuits, passive electronic components, active electronic components, optical components, and the like.

[0092] In this disclosure, the articles "a" and "an" are intended to include one or more items, and can be used interchangeably with "one or more." When only one item is intended, the term "a" or similar language is used. For example, the term "processor" can refer to a single processor or multiple processors. When a processor is described as performing a task and the processor is referred to as performing additional tasks, the multiple tasks can be performed by a single processor or any combination of one or more processors.

[0093] Hereinafter, various embodiments of the present disclosure will be described with reference to the attached drawings.

[0094] FIG. 1 is a block diagram of an electronic device (101) within a network environment (100) according to various embodiments.

[0095] Referring to FIG. 1, in a network environment (100), an electronic device (101) may communicate with an electronic device (102) via a first network (198) (e.g., a short-range wireless communication network), or may communicate with an electronic device (104) or a server (108) via a second network (199) (e.g., a long-range wireless communication network). In one embodiment, the electronic device (101) may communicate with the electronic device (104) via the server (108). According to one embodiment, the electronic device (101) may include a processor (120), a memory (130), an input module (150), an audio output module (155), a display module (160), an audio module (170), a sensor module (176), an interface (177), a connection terminal (178), a haptic module (179), a camera module (180), a power management module (188), a battery (189), a communication module (190), a subscriber identification module (196), or an antenna module (197). In some embodiments, the electronic device (101) may omit at least one of these components (e.g., the connection terminal (178)), or may have one or more other components added. In some embodiments, some of these components (e.g., the sensor module (176), the camera module (180), or the antenna module (197)) may be integrated into one component (e.g., the display module (160)).

[0096] The processor (120) may, for example, execute software (e.g., a program (140)) to control at least one other component (e.g., a hardware or software component) of the electronic device (101) connected to the processor (120) and perform various data processing or operations. According to one embodiment, as at least a part of the data processing or operations, the processor (120) may store commands or data received from other components (e.g., a sensor module (176) or a communication module (190)) in a volatile memory (132), process the commands or data stored in the volatile memory (132), and store result data in a non-volatile memory (134). According to one embodiment, the processor (120) may include a main processor (121) (e.g., a central processing unit or an application processor) or an auxiliary processor (123) (e.g., a graphics processing unit, a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor) that can operate independently or together with the main processor (121). For example, when the electronic device (101) includes the main processor (121) and the auxiliary processor (123), the auxiliary processor (123) may be configured to use less power than the main processor (121) or to be specialized for a given function. The auxiliary processor (123) may be implemented separately from the main processor (121) or as a part thereof.

[0097] The auxiliary processor (123) may control at least a portion of functions or states associated with at least one component (e.g., a display module (160), a sensor module (176), or a communication module (190)) of the electronic device (101), for example, on behalf of the main processor (121) while the main processor (121) is in an inactive (e.g., sleep) state, or together with the main processor (121) while the main processor (121) is in an active (e.g., application execution) state. In one embodiment, the auxiliary processor (123) (e.g., an image signal processor or a communication processor) may be implemented as a part of another functionally related component (e.g., a camera module (180) or a communication module (190)). In one embodiment, the auxiliary processor (123) (e.g., a neural network processing unit) may include a hardware structure specialized for processing artificial intelligence models. The artificial intelligence models may be generated through machine learning. This learning can be performed, for example, in the electronic device (101) itself where artificial intelligence is performed, or can be performed through a separate server (e.g., server (108)). The learning algorithm can include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model can include multiple artificial neural network layers.The artificial neural network may be, or may include, a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. The artificial intelligence model may additionally or alternatively include a software structure in addition to or in place of a hardware structure. That is, the artificial intelligence model may be implemented in software, hardware, and / or a combination thereof.

[0098] The memory (130) can store various data used by at least one component (e.g., processor (120) or sensor module (176)) of the electronic device (101). The data can include, for example, software (e.g., program (140)) and input data or output data for commands related thereto. The memory (130) can include volatile memory (132) or non-volatile memory (134).

[0099] The program (140) may be stored as software in the memory (130) and may include, for example, an operating system (142), middleware (144), or an application (146).

[0100] The input module (150) can receive commands or data to be used in a component of the electronic device (101) (e.g., a processor (120)) from an external source (e.g., a user) of the electronic device (101). The input module (150) can include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0101] The audio output module (155) can output audio signals to the outside of the electronic device (101). The audio output module (155) can include, for example, a speaker or a receiver. The speaker can be used for general purposes, such as multimedia playback or recording playback. The receiver can be used to receive incoming calls. In one embodiment, the receiver can be implemented separately from the speaker or as part of the speaker.

[0102] The display module (160) can visually provide information to an external party (e.g., a user) of the electronic device (101). The display module (160) may include, for example, a display, a holographic device, or a projector and a control circuit for controlling the device. According to one embodiment, the display module (160) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of a force generated by the touch.

[0103] The audio module (170) can convert sound into an electrical signal, or vice versa, convert an electrical signal into sound. According to one embodiment, the audio module (170) can acquire sound through the input module (150), output sound through the sound output module (155), or an external electronic device (e.g., electronic device (102)) (e.g., speaker or headphone) directly or wirelessly connected to the electronic device (101).

[0104] The sensor module (176) can detect the operating status (e.g., power or temperature) of the electronic device (101) or the external environmental status (e.g., user status) and generate an electrical signal or data value corresponding to the detected status. According to one embodiment, the sensor module (176) can be or include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0105] The interface (177) may support one or more designated protocols that may be used to directly or wirelessly connect the electronic device (101) with an external electronic device (e.g., the electronic device (102)). In one embodiment, the interface (177) may be or include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, an audio interface, or the like.

[0106] The connection terminal (178) may be or may include a connector through which the electronic device (101) may be connected to an external electronic device (e.g., the electronic device (102)). In one embodiment, the connection terminal (178) may be or may include, for example, an HDMI connector, a USB connector, an SD card connector, an audio connector (e.g., a headphone connector), or the like.

[0107] A haptic module (179) can convert electrical signals into mechanical stimuli (e.g., vibration or movement) or electrical stimuli that a user can perceive through tactile or kinesthetic sensations. According to one embodiment, the haptic module (179) can be or include, for example, a motor, a piezoelectric element, an electrical stimulation device, or the like.

[0108] The camera module (180) can capture still images and moving images. According to one embodiment, the camera module (180) may be or include one or more lenses, image sensors, image signal processors, flashes, or the like.

[0109] The power management module (188) can manage power supplied to the electronic device (101). According to one embodiment, the power management module (188) can be implemented as, for example, at least a part of a power management integrated circuit (PMIC).

[0110] A battery (189) may power at least one component of the electronic device (101). In one embodiment, the battery (189) may be or include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, a fuel cell, or the like.

[0111] The communication module (190) can support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device (101) and an external electronic device (e.g., electronic device (102), electronic device (104), or server (108)), and the performance of communication through the established communication channel. The communication module (190) can operate independently from the processor (120) (e.g., application processor) and can include one or more communication processors capable of supporting direct (e.g., wired) communication and / or wireless communication. According to one embodiment, the communication module (190) can include a wireless communication module (192) (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module (194) (e.g., a local area network (LAN) communication module, or a power line communication module). Any of these communication modules may communicate with an external electronic device (104) via a first network (198) (e.g., a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network (199) (e.g., a long-range communication network such as, but not limited to, a legacy cellular network, a 5G network, a next-generation communication network, the Internet, and / or a computer network (e.g., a LAN or WAN)). These various types of communication modules may be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (192) may use subscriber information (e.g., an international mobile subscriber identity (IMSI)) that may be stored in the subscriber identification module (196) to identify or authenticate the electronic device (101) within a communication network such as the first network (198) or the second network (199).

[0112] The wireless communication module (192) can support 5G networks and next-generation communication technologies following the 4G network, such as NR access technology (new radio access technology). The NR access technology can support high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimization of terminal power and connection of multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low-latency communications)). The wireless communication module (192) can support, for example, a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate. The wireless communication module (192) may support various technologies for securing performance in a high-frequency band, such as beamforming, massive multiple-input and multiple-output (MIMO), full dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, large scale antenna, or similar technologies. The wireless communication module (192) may support various requirements specified in the electronic device (101), an external electronic device (e.g., the electronic device (104)), or a network system (e.g., the second network (199)). According to one embodiment, the wireless communication module (192) can support a peak data rate (e.g., 20 Gbps or more) for eMBB realization, a loss coverage (e.g., 164 dB or less) for mMTC realization, or a U-plane latency (e.g., 0.5 ms or less for downlink (DL) and uplink (UL), or 1 ms or less for round trip) for URLLC realization.

[0113] The antenna module (197) can transmit signals and / or power to or receive signals and / or power from an external device (e.g., an external electronic device). In one embodiment, the antenna module (197) may include an antenna including a radiator formed of a conductor and / or a conductive pattern formed on a substrate (e.g., a PCB). In one embodiment, the antenna module (197) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as the first network (198) or the second network (199), may be selected from the plurality of antennas, for example, by the communication module (190). Signals and / or power may be transmitted and / or received between the communication module (190) and the external electronic device via the selected at least one antenna. In some embodiments, in addition to the radiator, another component (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as a part of the antenna module (197).

[0114] According to various embodiments, the antenna module (197) may form a mmWave antenna module. In one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent a first side (e.g., a bottom side) of the printed circuit board and capable of supporting a designated high-frequency band (e.g., a mmWave band), and a plurality of antennas (e.g., an array antenna) disposed on or adjacent a second side (e.g., a top side or a side side) of the printed circuit board and capable of transmitting or receiving signals in the designated high-frequency band.

[0115] At least some of the above components can be interconnected and exchange signals (e.g., commands or data) with each other via a communication method between peripheral devices (e.g., a bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)).

[0116] According to one embodiment, commands and / or data may be transmitted and / or received between the electronic device (101) and an external electronic device (104) via a server (108) connected to a second network (199). Each of the external electronic devices (102 or 104) may be or may include the same or a different type of device as the electronic device (101). According to one embodiment, all or part of the operations executed by the electronic device (101) may be executed by one or more of the external electronic devices (102, 104, or 108). For example, when the electronic device (101) is to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device (101) may, instead of or in addition to executing the function or service itself, request one or more external electronic devices to perform the function or at least a part of the service. One or more external electronic devices that receive the request may execute at least a portion of the requested function or service, or an additional function or service related to the request, and transmit the result of the execution to the electronic device (101). The electronic device (101) may process the result as is or additionally and provide it as at least a portion of a response to the request. For this purpose, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used, for example. The electronic device (101) may provide an ultra-low latency service by using distributed computing or mobile edge computing, for example. In another embodiment, the external electronic device (104) may include an Internet of Things (IoT) device. The server (108) may be or include an intelligent server utilizing machine learning and / or a neural network.According to one embodiment, an external electronic device (104) or server (108) may be included in the second network (199). The electronic device (101) may be applied to intelligent services (e.g., smart homes, smart cities, smart cars, or healthcare) based on 5G communication technology and IoT-related technology.

[0117] FIG. 2A is a perspective view of an electronic device (300) in a flat state according to various embodiments. FIG. 2B is a plan view illustrating a front side of the electronic device (300) in a flat state according to various embodiments. FIG. 2C is a plan view illustrating a rear side of the electronic device (300) in a flat state according to various embodiments. FIG. 3A is a perspective view of an electronic device (300) in a folded state according to various embodiments. FIG. 3B is a perspective view of an electronic device (300) in an intermediate state according to various embodiments.

[0118] Referring to FIGS. 2A and 3B, the electronic device (300) may include a pair of housings (e.g., a first housing (310) and a second housing (320)) (e.g., a foldable housing) that are rotatably coupled to face each other and foldable based on a hinge structure (e.g., a hinge device or a hinge module) of FIG. 2B. In some embodiments, the hinge structure (340) may be arranged in the x-axis direction or the y-axis direction. In some embodiments, two or more hinge structures (340) may be arranged so as to be folded in the same direction or in different directions. In one embodiment, the electronic device (300) may include a first display (330) (e.g., a flexible display) arranged in an area formed by a pair of housings (310, 320). In one embodiment, the first housing (310) and The second housing (320) is arranged on both sides with the folding axis (axis F) as the center, and may have a shape that is substantially symmetrical with respect to the folding axis (axis F). In one embodiment, the angle or distance between the first housing (310) and the second housing (320) may vary depending on whether the state of the electronic device (300) is a flat state (or unfolded state), a folded state, or an intermediate state.

[0119] According to various embodiments, a pair of housings (310, 320) may include a first housing (310) (e.g., a first housing structure) coupled with a hinge structure (340) and a second housing (320) (e.g., a second housing structure) coupled with the hinge structure (340). In one embodiment, the first housing (310) may include, in an unfolded state, a first surface (311) facing a first direction (e.g., a front direction) (z-axis direction) and a second surface (312) facing a second direction (e.g., a rear direction) (-z-axis direction) opposite to the first surface (311). In one embodiment, the second housing (320) may include, in an unfolded state, a third surface (321) facing a first direction (z-axis direction) and a fourth surface (322) facing a second direction (-z-axis direction). In one embodiment, the electronic device (300) can be operated in such a way that, in an unfolded state, the first surface (311) of the first housing (310) and the third surface (321) of the second housing (320) can face substantially the same first direction (z-axis direction), and in a folded state, the first surface (311) and the third surface (321) face each other. In one embodiment, the electronic device (300) can be operated in such a way that, in an unfolded state, the second surface (312) of the first housing (310) and the fourth surface (322) of the second housing (320) can face substantially similar or the same second direction (-z-axis direction), and in a folded state, the second surface (312) and the fourth surface (322) face opposite directions. For example, in the folded state, the second side (312) can face the first direction (z-axis direction), and the fourth side (322) can face the second direction (-z-axis direction).

[0120] According to various embodiments, the first housing (310) may include a first side member (313) that at least partially forms an exterior of the electronic device (300) and a first rear cover (314) that is coupled to the first side member (313) and forms at least a portion of a second side (312) of the electronic device (300). In one embodiment, the first side member (313) may include a first side surface (313a), a second side surface (313b) that extends from one end of the first side surface (313a), and a third side surface (313c) that extends from the other end of the first side surface (313a). In one embodiment, the first side member (313) may be formed into a rectangular (e.g., square or rectangular) shape through the first side surface (313a), the second side surface (313b), and the third side surface (313c).

[0121] According to various embodiments, the second housing (320) may include a second side member (323) that at least partially forms an exterior of the electronic device (300) and a second rear cover (324) that is coupled to the second side member (323) and forms at least a portion of a fourth side (322) of the electronic device (300). In one embodiment, the second side member (323) may include a fourth side member (323a), a fifth side member (323b) that extends from one end of the fourth side member (323a), and a sixth side member (323c) that extends from the other end of the fourth side member (323a). In one embodiment, the second side member (323) may be formed into a rectangular shape through the fourth side member (323a), the fifth side member (323b), and the sixth side member (323c).

[0122] According to various embodiments, the pair of housings (310, 320) may not be limited to the illustrated shapes and combinations, and may be implemented by other shapes or combinations and / or combinations of parts. For example, in some embodiments, the first side member (313) may be formed integrally with the first rear cover (314), and the second side member (323) may be formed integrally with the second rear cover (324).

[0123] According to various embodiments, the electronic device (300) may be positioned such that, in the unfolded state, the second side (313b) of the first side member (313) and the fifth side (323b) of the second side member (323) extend from each other. In one embodiment, the electronic device (300) may be positioned such that, in the unfolded state, the third side (313c) of the first side member (313) and the sixth side (323c) of the second side member (323) extend from each other. In one embodiment, the electronic device (300) may be configured such that, in the unfolded state, the combined length of the second side (313b) and the fifth side (323b) is longer than the length of the first side (313a) and / or the fourth side (323a). Additionally, the combined length of the third side (313c) and the sixth side (323c) may be configured to be longer than the length of the first side (313a) and / or the fourth side (323a).

[0124] According to various embodiments, the first side member (313) and / or the second side member (323) may further comprise a polymer formed of metal or injected into metal. In one embodiment, the first side member (313) and / or the second side member (323) may also comprise at least one conductive portion (e.g., the first conductive portion (316) and / or the second conductive portion (326)) that may be electrically conductive via at least one segment formed of polymer (e.g., the first segment (3161), the second segment (3162), and / or the first segment (3261), the second segment (3262)). In such a case, at least one conductive portion (316 and / or 326) may be electrically connected to a wireless communication circuit included in the electronic device (300) and may be used as an antenna capable of operating in at least one designated band (e.g., about 400 MHz to about 6000 MHz).

[0125] According to various embodiments, the first rear cover (314) and / or the second rear cover (324) may be formed of, for example, at least one or a combination of two of coated or colored glass, ceramic, polymer, or metal (e.g., aluminum (Al), stainless steel (STS), or magnesium (Mg)).

[0126] According to various embodiments, the first display (330) may be arranged to extend from the first surface (311) of the first housing (310) across the hinge structure (340) to at least a portion of the third surface (321) of the second housing (320). For example, the first display (330) may include a first portion (330a) substantially corresponding to the first surface (311), a second portion (330b) substantially corresponding to the third surface (321), and a third portion (330c) (e.g., a bendable region) connecting the first portion (330a) and the second portion (330b) and corresponding to the hinge structure (340). In one embodiment, the electronic device (300) may include a first protective cover (315) (e.g., a first protective frame or a first decorative member) coupled along an edge of the first housing (310). In one embodiment, the electronic device (300) may include a second protective cover (325) (e.g., a second protective frame or a second decorative member) coupled along an edge of the second housing (320). In one embodiment, the first protective cover (315) and / or the second protective cover (325) may be formed of a metal and / or polymer material. In one embodiment, the first protective cover (315) and / or the second protective cover (325) may be used as a decoration member. In one embodiment, the first display (330) may be positioned such that an edge of the first portion (330a) may be interposed between the first housing (310) and the first protective cover (315). In one embodiment, the first display (330) may be positioned such that an edge of the second portion (330b) may be interposed between the second housing (320) and the second protective cover (325). In one embodiment, the first display (330) may be positioned so that the edge of the first display (330) corresponding to the protective cap (335) is protected by a protective cap (335) positioned in an area corresponding to the hinge structure (340). Accordingly, the edge of the first display (330) may be substantially protected from the outside.In one embodiment, the electronic device (300) may include a hinge housing (341) (e.g., a hinge cover) that supports a hinge structure (340) and is exposed to the outside when the electronic device (300) is in a folded state, and is positioned so as to be invisible from the outside by being introduced into a first space (e.g., an internal space of the first housing (310)) and a second space (e.g., an internal space of the second housing (320)) when the electronic device (300) is in an unfolded state. In some embodiments, the first display (330) may be positioned to extend from at least a portion of the second surface (312) to at least a portion of the fourth surface (322). In this case, the electronic device (300) may be folded (e.g., in an outfolding manner) so that the first display (330) is exposed to the outside.

[0127] According to various embodiments, the electronic device (300) may include a second display (400) (e.g., a sub-display) that is arranged separately from the first display (330). In one embodiment, the second display (400) is arranged so as to be at least partially exposed on the second side (312) of the first housing (310), so that when in a folded state, it can replace the display function of the first display (330) and display status information of the electronic device (300). In one embodiment, the second display (400) may be arranged so as to be visible from the outside through at least a portion of the first rear cover (314). In some embodiments, the second display (400) may be arranged on the fourth side (322) of the second housing (320). In such a case, the second display (400) may be arranged so as to be visible from the outside through at least a portion of the second rear cover (324).

[0128] According to various embodiments, the electronic device (300) may include at least one of an input device (303) (e.g., a microphone), an audio output device (e.g., a first audio output device (301), a second audio output device (302)), a sensor module (304), a camera device (305, 308), a key input device (306), or a connector port (307). In one embodiment, the input device (303) (e.g., a microphone), the first and second audio output devices (301, 302), the sensor module (304), the first and second camera devices (e.g., the first camera device (305), the second camera device (308)), the key input device (306), or the connector port (307) may refer to holes and / or shapes formed in the first housing (310) or the second housing (320), but may also include actual electronic components (e.g., input devices, audio output devices, sensor modules, or camera devices) that can be disposed inside the electronic device (300) and operate through the holes and / or shapes.

[0129] According to various embodiments, the input device (303) may include at least one microphone (303) disposed in the second housing (320). In some embodiments, the input device (303) may include a plurality of microphones (303) disposed so as to detect the direction of sound. In some embodiments, the plurality of microphones (303) may be disposed at appropriate locations in the first housing (310) and / or the second housing (320). In one embodiment, the first and second audio output devices (301, 302) may include speakers (301, 302). In one embodiment, the first speaker (301) and the second speaker (302) may include a call receiver (301) disposed in the first housing (310) and a second speaker (302) disposed in the second housing (320). In some embodiments, the input device (303), the first and second audio output devices (301, 302), and the connector port (307) are disposed in a space provided in the first housing (310) and / or the second housing (320) of the electronic device (300) and can be exposed to the external environment through at least one hole formed in the first housing (310) and / or the second housing (320). In one embodiment, at least one connector port (307) can be used to transmit and receive power and / or data with an external electronic device. In some embodiments, at least one connector port (e.g., an ear jack hole) may also accommodate a connector (e.g., an ear jack) for transmitting and receiving audio signals with the external electronic device. In some embodiments, the holes formed in the first housing (310) and / or the second housing (320) may be shared for the input device (303) and the first and second sound output devices (301, 302). In some embodiments, the first and second sound output devices (301, 302) may include a speaker (e.g., a piezo speaker) that can operate by generating sound through the holes formed in the first housing (310) and / or the second housing (320).

[0130] According to various embodiments, the sensor module (304) may generate electrical signals and / or data values ​​corresponding to an internal operating state of the electronic device (300) and / or an external environmental state. The sensor module (304) may detect an external environment, for example, through a first surface (311) of the first housing (310). In some embodiments, the electronic device (300) may further include at least one sensor module arranged to detect the external environment through a second surface (312) of the first housing (310). In one embodiment, the sensor module (304) (e.g., an illuminance sensor) may be arranged under the first display (330) to detect the external environment through the first display (330). In one embodiment, the sensor module (304) may include at least one of a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an IR sensor, a biometric sensor, a temperature sensor, a humidity sensor, an ambient light sensor, a proximity sensor, a biometric sensor, an ultrasonic sensor, an ambient light sensor, or the like.

[0131] According to various embodiments, the first and second camera devices (305, 308) may include a first camera device (305) (e.g., a front camera device) disposed on a first side (311) of the first housing (310) and a second camera device (308) disposed on a second side (312) of the first housing (310). The electronic device (300) may further include a flash (309) disposed near the second camera device (308). In one embodiment, the first and second camera devices (305, 308) may include one or more lenses, an image sensor, and / or an image signal processor. The flash (309) may include, for example, a light emitting diode or a xenon lamp. In one embodiment, the first and second camera devices (305, 308) may be arranged such that two or more lenses (e.g., a wide-angle lens, an ultra-wide-angle lens, or a telephoto lens) and image sensors may be positioned on one side of the electronic device (300) (e.g., the first side (311), the second side (312), the third side (321), or the fourth side (322)). In some embodiments, the first and second camera devices (305, 308) may also include lenses and / or image sensors for time of flight (TOF).

[0132] According to various embodiments, the key input device (306) (e.g., a key button) may be disposed on the third side (313c) of the first side member (313) of the first housing (310). In some embodiments, the key input device (306) may also be disposed on at least one of the other sides of the first housing (310) (e.g., the first side portion (313a), the second side portion (313b)) and / or the sides of the second housing (320) (e.g., the fourth side portion (323a), the fifth side portion (323b), the sixth side portion (323c)). In some embodiments, the electronic device (300) may not include some or all of the key input devices (306), and the key input devices (306) that are not included may be implemented in other forms, such as soft keys, on the first display (330), but are not limited thereto. In some embodiments, the key input device (306) may be implemented using a pressure sensor included in the first display (330).

[0133] According to various embodiments, some of the camera devices (e.g., the first camera device (305)) and / or the sensor module (304) among the first camera device (305) and the second camera device (308) may be arranged to be exposed through the first display (330). For example, the first camera device (305) and / or the sensor module (304) may be arranged to be in contact with the external environment through an opening (e.g., a through hole) at least partially formed in the first display (330) in the internal space of the electronic device (300). In another embodiment, some of the sensor modules (304) may be arranged to perform their functions without being visually exposed through the first display (330) in the internal space of the electronic device (300). For example, in some embodiments, an opening may be omitted from a region of the first display (330) that faces the sensor module (304).

[0134] Referring to FIG. 3B, the electronic device (300) may be operated to maintain an intermediate state through the hinge structure (340). For example, the electronic device (300) may control the first display (330) so that different contents may be displayed on the display area corresponding to the first side (311) and the display area corresponding to the third side (321). In one embodiment, the electronic device (300) may be operated in a substantially unfolded state (e.g., the unfolded state of FIG. 2A) and / or a substantially folded state (e.g., the folded state of FIG. 3A) based on a certain inflection angle (e.g., the angle between the first housing (310) and the second housing (320) when in the intermediate state) through the hinge structure (340). For another example, the electronic device (300) may be operated to transition to an unfolded state (e.g., the unfolded state of FIG. 2a) when a pressure is applied in the unfolding direction (R1 direction) from an intermediate state unfolded at a certain inflection angle through the hinge structure (340). For example, the electronic device (300) may be operated to transition to a closed state (e.g., the folded state of FIG. 3a) when a pressure is applied in the folding direction (R2 direction) from an intermediate state unfolded at a certain inflection angle through the hinge structure (340). In one embodiment, the electronic device (300) may be operated to maintain an unfolded state at various angles through the hinge structure (340).

[0135] FIG. 4 is an exploded perspective view of an electronic device according to various embodiments.

[0136] Referring to FIG. 4, the electronic device (300) may include a first side member (313) (e.g., a first side frame), a second side member (323) (e.g., a second side frame), and a hinge structure (340) that rotatably connects the first side member (213) and the second side member (223). In one embodiment, the electronic device (300) may include a first support member (3131) that extends at least partially from the first side member (313), and a second support member (3231) that extends at least partially from the second side member (323). In one embodiment, the first support member (3131) may be formed integrally with the first side member (313) or may be structurally coupled with the first side member (313). In one embodiment, the second support member (3231) may be formed integrally with the second side member (323), or may be structurally coupled with the second side member (323). In one embodiment, the electronic device (300) may include a first display (330) that is arranged to be supported by the first support member (3131) and the second support member (3231). In one embodiment, the electronic device (300) may include a first rear cover (314) coupled with the first side member (313) and providing a first space between the first support member (3131) and the second side member (323), and a second rear cover (324) coupled with the second side member (323) and providing a second space between the second support member (3231). In one embodiment, the first side member (313) and the first rear cover (314) may be formed integrally. In one embodiment, the second side member (323) and the second rear cover (324) may be formed integrally. In one embodiment, the electronic device (300) may include a first housing (e.g., the first housing (310) of FIG. 2A) (e.g., the first housing structure) provided through the first side member (313), the first support member (3131), and the first rear cover (314).In one embodiment, the electronic device (300) may include a second housing (e.g., the second housing (320) of FIG. 2A) (e.g., a second housing structure) provided through a second side member (323), a second support member (3231), and a second rear cover (324). In one embodiment, the electronic device (300) may include a second display (400) arranged to be visible from the outside through at least a portion of the first rear cover (314).

[0137] According to various embodiments, the electronic device (300) may include a first substrate assembly (361) (e.g., a first substrate or a main printed circuit board), a camera assembly (363), a first battery (371), or a first bracket (351) disposed in a first space between a first side member (313) and a first rear cover (314). In one embodiment, the camera assembly (363) may include a plurality of camera devices (e.g., the first and second camera devices (305, 308) of FIGS. 2A and 3A) and may be electrically connected to the first substrate assembly (361). In one embodiment, the first bracket (351) may provide a support structure and enhanced rigidity for supporting the first substrate assembly (361) and / or the camera assembly (363). In one embodiment, the electronic device (300) may include a second substrate assembly (362) (e.g., a second substrate or sub-printed circuit board), an antenna (390) (e.g., a coil member), a second battery (372), or a second bracket (352) disposed in a second space between the second side member (323) and the second rear cover (324). In one embodiment, the electronic device (300) may include a wiring member (380) (e.g., a flexible printed circuit board (FPCB)) that extends from the first substrate assembly (361) across the hinge structure (340) to a plurality of electronic components (e.g., a second substrate assembly (362), a second battery (372), or an antenna (390)) disposed between the second side member (323) and the second rear cover (324) and provides an electrical connection. In one embodiment, the antenna (390) may be or include a near field communication (NFC) antenna, a wireless charging antenna, and / or a magnetic secure transmission (MST) antenna. The antenna (390) may, for example, perform short-range communication with an external device or wirelessly transmit and receive power required for charging.

[0138] According to various embodiments, the electronic device (300) may include a hinge housing (341) (e.g., a hinge cover) that supports a hinge structure (340) and is positioned so as to be exposed to the outside when the electronic device (300) is in a folded state (e.g., the folded state of FIG. 3A) and inserted into the first space and / or the second space when the electronic device (300) is in an unfolded state (e.g., the unfolded state of FIG. 2A), thereby being invisible from the outside.

[0139] According to various embodiments, the electronic device (300) may include a first protective cover (315) coupled along an edge of the first side member (313). In one embodiment, the electronic device (300) may include a second protective cover (325) coupled along an edge of the second side member (323). In one embodiment, the first display (330) may have an edge of a first flat portion (e.g., the first portion (330a) of FIG. 3B) protected by the first protective cover (315). In one embodiment, the first display (330) may have an edge of a second flat portion (e.g., the second portion (330b) of FIG. 3B) protected by the second protective cover (325). In one embodiment, the electronic device (300) may include a protective cap (335) positioned to protect an edge of a third portion (e.g., the third portion (330c) of FIG. 3B) corresponding to a hinge structure (340) of the first display (330). In some embodiments, the protective cap (335) and / or the first and second protective covers (315, 325) may be omitted.

[0140] FIG. 5A is a perspective view illustrating an electronic device in a folded state according to various embodiments. FIG. 5B is a conceptual diagram illustrating a simplified version of an electronic device in a folded state as a shielded parallel plate model according to various embodiments. FIG. 6A is a conceptual diagram illustrating an electric field mode for a part of a second housing (320) and a hinge structure (340) of an electronic device (300) in a folded state according to various embodiments on a shielded parallel plate model. FIG. 6B is a conceptual diagram illustrating an electric field mode for an electronic device (300) in a folded state according to various embodiments on a shielded parallel plate model. FIG. 7A is a conceptual diagram illustrating a current distribution for a part of a second housing (320) and a hinge structure (340) of an electronic device (300) in a folded state according to various embodiments on a shielded parallel plate model. FIG. 7b is a conceptual diagram illustrating current distribution for an electronic device (300) in a folded state according to various embodiments in a shielded parallel plate model. FIG. 8a is a conceptual diagram illustrating a simplified version of an electronic device (300) in a folded state according to various embodiments in a shielded parallel plate model. FIG. 8b is a conceptual diagram illustrating current distribution for an electronic device (300) in a folded state according to various embodiments in a shielded parallel plate model.

[0141] Referring to FIGS. 5A to 8B , the electronic device (300) may include the electronic device (300) described above with reference to FIGS. 2A to 4 , or may be similar in many aspects thereto. Accordingly, a repeated description of the electronic device (300) described above with reference to FIGS. 2A to 4 may be omitted for brevity.

[0142] Referring to FIG. 5A, the electronic device (300) can be folded so that one side of the first housing (310) (e.g., the first side (311) of FIG. 2A) and one side of the second housing (320) (e.g., the second side (312) of FIG. 2A) face each other with the hinge structure (340) as the central axis. When one side (e.g., first side (311)) of the first housing (310) and one side (e.g., second side (312)) of the second (320) are folded to face each other with the hinge structure (340) as the central axis in the electronic device (10), the first housing (310), the hinge structure (340), and the second housing (320) can be electrically connected, and the first housing (310) and the second housing (320) can be adjacent to each other, so that electromagnetic coupling can occur between the first housing (310) and the second housing (320).

[0143] Referring to FIGS. 5B and 7A, the first housing (310), the hinge structure (340), and the second housing (320) of the folded electronic device (300) can be equivalentized in the form of a shielded parallel plate. For example, the electronic device (300) equivalentized in the form of a shielded parallel plate can be referred to as a shielded parallel plate model (300). Hereinafter, the first housing (310) can be referred to as a first substrate (plate), and the second housing (320) can be referred to as a second substrate.

[0144] Referring to FIGS. 6A, 6B, and 7B, the electric field (E-Field) of the electronic device (300) in the folded state is proportional to the potential, so the potential is zero (0) at the hinge (340) where the first substrate (310) and the second substrate (320) are grounded, and thus the magnitude of the electric field may be zero (0). On the other hand, in the electronic device (300) that may be in the folded state, the potential may increase as it moves away from the hinge (340), and thus the magnitude of the electric field may also increase.

[0145] Referring to FIGS. 8A and 8B, in the shielded parallel plate model (300), a first surface current (J1) can be formed on the surfaces of the first substrate (310), the hinge (340), and the second substrate (320). The first surface current (J1) can circulate through the first substrate (310), the hinge (340), and the second substrate (320). For example, the first surface current (J1) may be formed in the form of a current that circulates from one side of the second substrate (320) (e.g., the fourth side (323a) of the second housing (320)) to the hinge (340), from the hinge (340) to one side of the first substrate (310) (e.g., the first side (313a) of the first housing (310)), and then to one side of the second substrate (320) (e.g., the fourth side (323a) of the second housing (320)). For another example, the direction of the surface current induced in the first substrate (310) and the direction of the surface current induced in the second substrate (320) may be opposite to each other.

[0146] FIG. 9A is a conceptual diagram illustrating a shielded parallel plate model corresponding to an electronic device (300-1) in a folded state that does not include a conductive portion on a side according to various embodiments. FIG. 9B is a graph (1110) illustrating a reflection coefficient (S1,1) (1111) of a resonant frequency formed in an electronic device (300-1) in a folded state that does not include a conductive portion on a side according to various embodiments. FIG. 9C is a conceptual diagram illustrating a mode of an electric field of a second housing (320) of an electronic device (300-1) in a folded state that does not include a conductive portion on a side according to various embodiments, using a shielded parallel plate model.

[0147] Referring to FIG. 9a, a shielded parallel plate model corresponding to an electronic device (300-1) in a folded state that does not include a conductive portion on the side may be identical to or similar to the shielded parallel plate model (300) of FIG. 5b or the shielded parallel plate model (300) of FIG. 8a.

[0148] Referring to FIG. 9b, the first parasitic resonant frequency (1) formed in the folded electronic device (300-1) that does not include a conductive portion on the side can be operated at about 888.1253 MHz. (Example: 1111 graph)

[0149] Referring to FIG. 9c, the mode of the electric field illustrated in the shielded parallel plate model corresponding to the folded electronic device (300-1) that does not include a conductive portion on the side is as shown in FIGS. 6a and 6b, since the electric field (E-Field) of the folded electronic device (300-1) is proportional to the potential, the potential is zero (0) at the hinge (340) where the first substrate (310) and the second substrate (320) are grounded, and thus the magnitude of the electric field may be zero (0). On the other hand, since the potential may increase as the distance from the hinge (340) in the folded electronic device (300-1) increases, the magnitude of the electric field may also increase. An electromagnetic field (e.g., a first parasitic resonance) may be generated by the first surface current (J1) formed on the surface of the folded electronic device (300-1). The mode of the electric field of the electronic device (300-1) due to the first parasitic resonance may be referred to as the first mode.

[0150] FIG. 10A is a conceptual diagram illustrating a shielded parallel plate model corresponding to an electronic device (300) in a folded state, including a first side member (313) and a second side member (323) including conductive side portions, according to various embodiments. FIG. 10B is a graph (1120) illustrating a reflection coefficient (S1,1) (1121) of a resonant frequency formed in an electronic device (300) in a folded state, including a first side member (313) and a second side member (323) not including conductive portions, according to various embodiments. FIG. 10C is a conceptual diagram illustrating a mode of an electric field of an electronic device (300) in a folded state, including a first side member (313) and a second side member (323) including conductive side portions, according to various embodiments, on a shielded parallel plate model.

[0151] Referring to FIG. 10A, the first substrate (310) may include a first side member (313) including conductive side portions. For example, the first side member (313) may include a first side portion (313a), a first edge portion (313d) disposed between the first side portion (313a) and a third side portion (313c), and a second edge portion (313e) disposed between the first side portion (313a) and the second side portion (313b). At least one of the first side portion (313a), the second side portion (313b), the third side portion (313c), the first edge portion (313d), and the second edge portion (313e) may be formed of a conductive material. The first side portion (313a) may include a first segment (3161) and / or a second segment (3162) formed of a non-conductive material. The second side portion (313b) may include a third segment (3163) and a fourth segment (3164). The third side portion (313c) may include a fifth segment (3165) and / or a sixth segment (3166).

[0152] According to one embodiment, the second substrate (320) can be physically coupled to the fourth side portion (323a), the fifth side portion (323b), and the sixth side portion (323c). The second substrate (320) can be physically coupled to the third edge portion (323d) disposed between the fourth side portion (323a) and the sixth side portion (323c), and the fourth edge portion (323e) disposed between the fourth side portion (323a) and the fifth side portion (323b). At least one of the fourth side portion (323a), the fifth side portion (323b), the sixth side portion (323c), the third edge portion (323d), and the fourth edge portion (323e) can be formed of a conductive material. The fourth side portion (323a) may include a first segment (3261) and a second segment (3262) formed of a non-conductive material. The fifth side portion (323b) may include a third segment (3263) and a fourth segment (3264). The sixth conductive side portion (323c) may include a fifth segment (3265) and a sixth segment (3266).

[0153] Referring to FIG. 10b, it can be seen that the resonant frequency (1) formed in the folded electronic device (300) including a plurality of side portions (e.g., a first side portion (313a), a second side portion (313b), a third side portion (313c), a fourth side portion (323a), a fifth side portion (323b), and a sixth side portion (323c)) is 872 MHz, which is a downward shift compared to the resonant frequency described with reference to FIG. 9b (e.g., graph 1121).

[0154] Referring to FIG. 10c, the fourth side portion (323a), the fifth side portion (323b), the sixth side portion (323c), the third edge portion (323d), and the fourth edge portion (323e) may not be electrically connected to the ground of the second substrate (320). For example, the mode of the electric field of the second substrate (320) may be substantially the same as and / or similar to the first mode, which is the mode of the electric field shown in the second substrate (320) of the shielded parallel plate model (300) described with reference to FIG. 9c, where the fourth side portion (323a), the fifth side portion (323b), the sixth side portion (323c), the third edge portion (323d), and the fourth edge portion (323e) may not be electrically connected to the ground.

[0155] FIG. 11A is a conceptual diagram illustrating a shielded parallel plate model corresponding to an electronic device (300) in a folded state in which a plurality of side portions (313a to 323c) formed of a conductive material are grounded, according to various embodiments. FIG. 11B is a graph (1130) illustrating a reflection coefficient (S1,1) (1131) of a resonant frequency formed in an electronic device (300) in a folded state in which a plurality of side portions (313a to 323c) formed of a conductive material are grounded, according to various embodiments. FIG. 11C is a conceptual diagram illustrating an electric field mode of an electronic device (300) in a folded state in which a plurality of side portions (313a to 323c) formed of a conductive material are grounded, according to various embodiments, in a shielded parallel plate model.

[0156] Referring to FIG. 11a, the first side (313a) may be electrically connected to the ground (411) of the first substrate (310). The second side (313b) may be electrically connected to the ground (414) of the first substrate (310). The third side (313c) may be electrically connected to the ground (412) of the first substrate (310). The second edge (313e) may be electrically connected to the ground (413) of the first substrate (310).

[0157] Referring to Fig. 11b, when the plurality of side portions (313a to 323c) are grounded, the resonant frequency (1) formed in the electronic device (300) in the folded state may operate at approximately 840 MHz, which may be lower than the resonant frequencies described with reference to Figs. 9b and 10b. For example, the position of the resonant frequency (1) of Fig. 11b on the graph may shift downward compared to the position of the resonant frequency (1) of Fig. 9b and the position of the resonant frequency (1) of Fig. 10b. This may mean that in the foldable electronic device (300), when in the folded state, the operating frequency band may be affected by the grounding of the plurality of side portions (313a to 323c).

[0158] Referring to FIG. 11c, the fourth side portion (323a), the fifth side portion (323b), the sixth side portion (323c), the third corner portion (323d), and the fourth corner portion (323e) formed of a conductive material may be electrically connected to the ground of the second substrate (320). For example, the fourth side portion (323a) may be electrically connected to the ground (421) of the second substrate (320). The fifth side portion (313b) may be electrically connected to the ground (424) of the second substrate (320). The sixth side portion (313c) may be electrically connected to the ground (422) of the second substrate (320). The third corner portion (313d) may be electrically connected to the ground (423) of the first substrate (310). For example, the mode of the overall electric field of the second substrate (320) including the fourth side portion (323a), the fifth side portion (323b), the sixth side portion (323c), the third corner portion (323d), and the fourth corner portion (323e) may be substantially the same as and / or similar to the first mode, which is the mode of the electric field of the second substrate (300), as described with reference to FIG. 9c.

[0159] FIG. 12a is a conceptual diagram illustrating the current distribution of an electronic device (300) in a folded state in which a plurality of side portions (313a to 323c) formed of a conductive material according to various embodiments are grounded, using a shielded parallel plate model. FIG. 12b is a conceptual diagram illustrating the current distribution of an electronic device (300) in a folded state in which a plurality of side portions (313a to 323c) formed of a conductive material according to various embodiments are grounded, using a shielded parallel plate model.

[0160] Referring to FIG. 12a, a surface current formed on the surface of the second substrate (320) based on the XY plane may be formed in a form that flows from the hinge (340) to one side of the second substrate (320) (e.g., the fourth side portion (313a) of the second housing (320)). The direction of the surface current induced on the surface at the cavity parasitic resonance frequency in each of the fourth side portion (313a), the fifth side portion (323b), the sixth side portion (323c), the third corner portion (323d), and the fourth corner portion (323e) may be substantially the same as and / or similar to the direction of the surface current formed on the surface of the second substrate (320).

[0161] Referring to FIG. 12b, the direction of the second surface current (J2) induced on the surface at the cavity parasitic resonance frequency in the sixth side portion (323c) may be substantially the same as and / or similar to the direction of the first surface current (J1) formed on the surface of the second substrate (320).

[0162] FIG. 13A is a conceptual diagram illustrating the electric field modes of the second housing (320) and the sixth side portion (323c) of an electronic device (300) according to various embodiments, in a shielded parallel plate model. FIG. 13B is a conceptual diagram illustrating the surface current of the second housing (320) and the surface current of the sixth side portion (323c) of an electronic device (300) according to various embodiments, in a shielded parallel plate model.

[0163] Referring to Fig. 13a, in the shielded parallel plate model, the sixth side portion (323c) may be grounded to the second substrate (320) via the grounding member (420). A second parasitic resonance having a frequency whose wavelength is approximately λ / 4 may be generated at the sixth side portion (323c) grounded to the second substrate (320) via the grounding member (420). The mode of the electric field due to the second parasitic resonance formed at the grounded sixth side portion (323c) may be referred to as the second mode.

[0164] Referring to FIG. 13b, in the shielded parallel plate model, the sixth side portion (323c) grounded to the second substrate (320) through the grounding member (420) may have a direction of a second surface current (J2) induced on the surface at the frequency of the second parasitic resonance having a frequency whose wavelength is approximately λ / 4, which may be opposite to the direction of a first surface current (J1) induced on the surface of the second substrate (320). In the case where the sixth side portion (323c) of the folded electronic device (300) is electrically connected to the ground of the second substrate (320), the electronic device (300) may generate an electric field corresponding to a first mode by a first surface current (J1) induced on the surface of the second substrate (320) and an electric field corresponding to a second mode by a second parasitic resonance formed by a second surface current (J2) induced in the sixth side portion (323c) electrically connected to the ground of the second substrate (320). In other words, electric fields of different first modes and electric fields of different second modes may be generated in the electronic device (300). For example, the frequency of the first parasitic resonance may be referred to as a cavity resonance frequency or a PPW (parallel plate waveguide) resonance frequency. The frequency of the second parasitic resonance may be referred to as a line resonance frequency.

[0165] The phenomenon in which the direction of the surface current (J2) induced on the surface of the sixth side surface (323c) by the parasitic resonance frequency having a length of λ / 4 is opposite to the direction of the surface current (J1) induced on the surface of the second substrate (320) may be referred to as the reverse current effect. The present disclosure seeks to provide a structure capable of controlling the first parasitic resonance formed in an electronic device (300) in a folded state by using the second parasitic resonance according to the reverse current effect. In other words, the present disclosure seeks to provide an electronic device (300) for improving antenna performance in a target band by shifting the frequency band of the first parasitic resonance by using the second parasitic resonance.

[0166] FIG. 14A is a top view of a shielded parallel plate model corresponding to an electronic device (300) in which a PPW resonance is formed, according to various embodiments. FIG. 14B is a perspective view of a shielded parallel plate model corresponding to an electronic device (300) in which a PPW resonance is formed, according to various embodiments. FIG. 14C is a graph (1140) illustrating a reflection coefficient (1141) of a PPW resonance frequency of an electronic device (300) in which a PPW resonance is formed, according to various embodiments. FIG. 14D is a conceptual diagram illustrating a mode of an electric field of an electronic device (300) in which a PPW resonance is formed, according to various embodiments, on a shielded parallel plate model.

[0167] Referring to FIGS. 14A and 14B, a shielded parallel plate model corresponding to a folded electronic device (300) that does not include side portions or in which side portions are not formed of a conductive material may be the same as or similar to the shielded parallel plate model (300) of FIG. 5B or the shielded parallel plate model (300) of FIG. 8A or the shielded parallel plate model (300) of FIG. 9A. According to various embodiments, for example, with respect to the XY plane, the horizontal length of each of the first substrate (310) and the second substrate (320) may be approximately 72 millimeters (mm). According to various embodiments, for example, with respect to the XY plane, the vertical length of each of the first substrate (310) and the second substrate (320) may be approximately 82 mm.

[0168] Referring to FIG. 14c, the resonant frequency (1) formed in the folded electronic device (300) that does not include side portions or in which side portions are not formed of a conductive material can be located at approximately -8.89351 dB at 888 MHz.

[0169] Referring to FIG. 14d, the mode of the electric field illustrated in the shielded parallel plate model corresponding to the folded electronic device (300) that does not include side portions or in which the side portions are not formed of a conductive material is as shown in FIGS. 6a to 6b and FIG. 9c, the electric field (E-Field) of the folded electronic device (300) is proportional to the potential, so that the potential is zero (0) at the hinge (340) where the first substrate (310) and the second substrate (320) are grounded, and thus the magnitude of the electric field may be zero (0). On the other hand, the magnitude of the electric field may also increase as the potential increases further from the hinge (340) in the folded electronic device (300). A first parasitic resonance may be generated by a first surface current (J1) formed on the surface of the folded electronic device (300). The mode of the electric field of the electronic device (300) due to the first parasitic resonance may be referred to as the first mode.

[0170] FIG. 15A is a top view of a shielded parallel plate model corresponding to an electronic device (300) in which a first parasitic resonance and a second parasitic resonance are formed, according to various embodiments. FIG. 15B is a perspective view of a shielded parallel plate model corresponding to an electronic device (300) in which a first parasitic resonance and a second parasitic resonance are formed, according to various embodiments. FIG. 15C is a graph illustrating a reflection coefficient at a line resonance frequency and a reflection coefficient at a PPW resonance frequency of an electronic device (300) in which a first parasitic resonance and a second parasitic resonance are formed, according to various embodiments. FIG. 15D is a conceptual diagram illustrating a second mode corresponding to an electric field formed by a second parasitic resonance in an electronic device (300) in accordance with various embodiments, in a shielded parallel plate model. FIG. 15e is a conceptual diagram illustrating a first mode corresponding to an electric field formed according to a first parasitic resonance in an electronic device (300) according to various embodiments, in a shielded parallel plate model.

[0171] Referring to FIG. 15a, in a shielded parallel plate model corresponding to an electronic device (300) according to one embodiment, a third side (313c) can be grounded to the ground of the first substrate (310) through a connecting member (420).

[0172] Referring to FIG. 15b, according to various embodiments, for example, based on the XY plane, the horizontal length of each of the first substrate (310) and the second substrate (320) may be approximately 72 mm. According to various embodiments, for example, based on the XY plane, the vertical length of each of the first substrate (310) and the second substrate (320) may be approximately 82 mm. According to various embodiments, for example, based on the XY plane, the horizontal length of the sixth side surface (323c) may be approximately 67 mm. For example, the connecting member (420) may be or include an inductor having an inductance value of approximately 2.7 nanohenry (nH).

[0173] Referring to FIG. 15c, a first parasitic resonance (existing PPW resonance (2)) formed by a first surface current (J1) of a second housing (320) may be formed in the electronic device (300) in a folded state. In the electronic device (300) in a folded state, the first parasitic resonance (existing PPW resonance (2)) may be formed by a second parasitic resonance (Line resonance (1)) by a second surface current (J2) induced in the sixth side (323c) that is grounded to the second substrate (320) through the connecting member (420). The frequency of the first parasitic resonance (existing PPW resonance (2)) may be shifted in a frequency band by the second parasitic resonance (Line resonance (1)). For example, the frequency band of the first parasitic resonance (shifted PPW resonance (3)) may be approximately -9.1914061 dB at approximately 940 MHz. The shape of the shifted frequency band may be referred to as a resonance split phenomenon.

[0174] Referring to FIG. 15d, a second parasitic resonance may occur due to a second surface current (J2) induced in the sixth side (323c) grounded to the second substrate (320) through the connecting member (420) in the folded electronic device (300). The mode of the electric field of the electronic device (300) due to the second parasitic resonance may be referred to as a second mode.

[0175] Referring to FIG. 15e, a first parasitic resonance may be generated by a first surface current (J1) formed on the surface of an electronic device (300) in a folded state. The mode of the electric field of the electronic device (300) due to the first parasitic resonance may be referred to as a first mode.

[0176] In other words, an electric field of a first mode and an electric field of a second mode that are different from each other can be formed in the electronic device (300).

[0177] FIG. 16A is a conceptual diagram illustrating a current distribution of an electronic device (300) in which a first parasitic resonance and a second parasitic resonance are formed, according to various embodiments, in a shielded parallel plate model. FIG. 16B is a conceptual diagram illustrating a current distribution of an electronic device (300) in which a first parasitic resonance and a second parasitic resonance are formed, according to various embodiments, in a shielded parallel plate model.

[0178] Referring to FIGS. 16A and 16B, the direction of the second surface current (J2) induced in the grounded sixth side portion (323c) of the second substrate (320) through the connecting member (420) may be formed in the opposite direction to the direction of the second surface current (J2) induced in the surface of the second substrate (320) due to the grounding. For example, in a shielded parallel plate model corresponding to the electronic device (300), the second surface current (J1) formed on the surface of the second substrate (320) may be formed in the -Y-axis direction with respect to the XY plane. In the shielded parallel plate model, the second surface current (J2) induced in the grounded sixth side portion (323c) of the second substrate (320) through the connecting member (420) may be formed in the +Y-axis direction, which is the opposite direction to the direction of the surface current (J1).

[0179] In the shielded parallel plate model, the second surface current (J2) induced in the ground and the grounded sixth side portion (323c) of the second substrate (320) through the connecting member (420) is formed in a direction opposite to the direction of the surface current (J1) induced in the surface of the second substrate (320), so that a resonance split phenomenon may occur between the frequency of the first parasitic resonance due to the first surface current (J1) formed in the surface of the second substrate (320) in the shielded parallel plate model and the frequency of the second parasitic resonance due to the second surface current (J2) induced in the ground and the grounded sixth side portion (323c) of the second substrate (320) through the connecting member (420). For example, the resonance splitting phenomenon may mean a phenomenon in which the frequency of the first parasitic resonance formed by the first surface current (J1) formed on the surface of the second substrate (320) is affected by the second parasitic resonance formed by the second surface current (J2) induced in the sixth side portion (323c) grounded with the second substrate (320), and thus cannot maintain the existing frequency band and shifts to a specific frequency band, as illustrated in FIG. 15c.

[0180] FIG. 17a is a conceptual diagram illustrating the current distribution of an electronic device (300) in which a first parasitic resonance is formed, according to various embodiments, in a shielded parallel plate model. FIG. 17b is a conceptual diagram illustrating the current distribution of an electronic device (300) in which a first parasitic resonance is formed, according to various embodiments, in a shielded parallel plate model.

[0181] Referring to FIGS. 17a and 17b, the direction of the second surface current (J2) induced in the sixth side portion (323c) that is not grounded to the ground of the second substrate (320) may be formed in the same direction as the direction of the second surface current (J2) induced in the surface of the second substrate (320), so that it may be different from the direction of the second surface current (J2) induced in the sixth side portion (323c) that is grounded to the ground of the second substrate (320) through the connecting member (420) illustrated in FIGS. 16a and 16b. For example, when the sixth side portion (323c) is not grounded to the ground of the second substrate (320), the resonance splitting phenomenon may not occur.

[0182] FIG. 18 is a top view illustrating an electronic device (300) according to various embodiments.

[0183] Referring to FIG. 18, the second housing (320) of the electronic device (300) may include a second support member (3231), a plurality of side portions (323a to 323c) formed of a conductive material, and a plurality of corner portions (323d, 323e). For example, the fourth side portion (323a) may be arranged in the Y-axis direction of the second housing (320) with respect to the XY plane. For example, the fourth side portion (323a) may be arranged to face the hinge structure (340) with respect to the X-axis in the second housing (320). For example, the fourth side portion (323a) may include a first segment portion (3261) and a second segment portion (3262) formed of a non-conductive material.

[0184] The second side (323b) may be arranged in the -X-axis direction of the second housing (320) with respect to the XY plane. The fifth side portion (323b) may include a third segment (3263) and a fourth segment (3264) formed of a non-conductive material. For example, the fifth side portion (323b) may be electrically separated from the hinge structure (340) through the third segment (3263).

[0185] The sixth side portion (323c) may be arranged in the +X-axis direction of the second housing (320) with respect to the XY plane. For example, the sixth side portion (323c) may be arranged symmetrically with respect to the fifth side portion (323b) with respect to the Y-axis in the second housing (320). The sixth side portion (323c) may include a fifth segment (3265) and a sixth segment (3266) formed of a non-conductive material. For example, the sixth side portion (323c) may be electrically separated from the hinge structure (340) through the sixth segment (3266).

[0186] The third edge portion (323d) may be disposed between the fourth side portion (323a) and the sixth side portion (323c). The third edge portion (323d) may be electrically isolated from the fourth side portion (323a) through the second segment (3262). The third edge portion (323d) may be electrically isolated from the sixth side portion (323c) through the fifth segment (3265). The fourth edge portion (323e) may be disposed between the fourth side portion (323a) and the fifth side portion (323b). The fourth edge portion (323e) may be electrically isolated from the fourth side portion (323a) through the first segment (3261). The fourth edge portion (323e) may be electrically isolated from the fifth side portion (323b) through the fourth segment (3264).

[0187] FIG. 19A is a conceptual diagram illustrating the top surface of an electronic device (300) in a wireless communication system according to various embodiments.

[0188] Referring to FIG. 19A, in one embodiment, a fourth side portion (323a) of a second housing (320) of an electronic device (300) may be grounded to a second support member (3231) via a first ground portion (421). For example, the first ground member (421) may electrically connect the fourth side portion (323a) and the second support member (3231). For example, the first ground member (421) may electrically connect the fourth side portion (323a) and the second support member (3231) via a printed circuit board (e.g., the second board assembly (362)).

[0189] The electronic device (300) may include a wireless communication circuit (600). The fourth side portion (323a) may be electrically connected to the wireless communication circuit (600). In one embodiment, the fourth side portion (323a) may be electrically connected to the third corner portion (323d) via a first connection portion (821) including a first switch (821a) and a first conductive line (821b). One end of the first connection portion (821) may be electrically connected to the fourth side portion (323a). The other end of the first connection portion (821) may be electrically connected to the third corner portion (323d). For example, the first connection portion (821) may be a logical connection as a connection line for connecting the fourth side portion (323a) and the third corner portion (323d). For example, the first switch (821a) and the first conductive line (821b) may be formed on a printed circuit board (e.g., the second board assembly (362)). For another example, the fourth side portion (323a) and the third corner portion (323d) may operate as a radiator (720). For another example, the fourth side portion (323a) may operate as a radiator (720) together with the third corner portion (323d) through the first switch (821a). For example, the fourth side portion (323a) may operate as a radiator solely through the first switch (821a).

[0190] In one embodiment, the sixth side portion (323c) may be grounded to the second support member (3231) via a first matching circuit portion (921). For example, the first matching circuit portion (921) may include a second switch (922a) and at least one first inductor (921b). For another example, the first matching circuit portion (921) may electrically connect the sixth side portion (323c) and the second support member (3231). For yet another example, the first matching circuit portion (921) may electrically connect the sixth side portion (323c) and the second support member (3231) via a printed circuit board (e.g., the second board assembly (362)). For example, one end of the first matching circuit portion (921) may be electrically connected to the sixth side portion (323c). The other end of the second grounding portion (422) may be electrically connected to the second support member (3231). A second parasitic resonance (521) may be formed in the first matching circuit portion (921) and the sixth side portion (323c).

[0191] In one embodiment, the first matching circuit (921) may be a tunable matching circuit including a plurality of inductors having various inductance values. For example, the number of first inductors (921b) included in the first matching circuit (921) may be plural (e.g., a positive integer greater than 1). For example, the plurality of first inductors (921b) may be connected in parallel with the second switch (921a). The second switch (921a) may be selectively connected to one of the plurality of first inductors (921b). For example, the inductance value of the first matching circuit (921) may be determined based on the frequency of a transmission signal of the electronic device (300). For another example, the inductance value of the first matching circuit (921) may be sufficiently large to operate close to open at the frequency of the transmission signal of the electronic device (300). For example, the inductance value of the first matching circuit (921) may be set to exceed a predetermined threshold value so that the sixth side portion (323c) is not electromagnetically coupled with the radiator (720). In other words, the electronic device (300) can control the second parasitic resonant frequency (521) while minimizing the influence on the radiator (720) through the first matching circuit (921). For example, the inductance value of the first matching circuit (921) may have various values, such as, but not limited to, about 39 nH, about 56 nH, or about 100 nH.

[0192] FIG. 19b is a conceptual diagram illustrating the distribution of surface current of an electronic device (300) in a wireless communication system according to various embodiments.

[0193] Referring to FIG. 19b, in the folded electronic device (300), the current distribution formed on the surface of the second housing (320) may be formed to face the fourth side portion (323a) from the hinge structure (340). For example, in the electronic device (300), the current distribution formed on the surface of the second housing (320) may be formed to face the ground point of the fourth side portion (323a) electrically connected to the second support member (3231) from the hinge structure (340). For example, in the electronic device (300), the current distribution formed on the surface of the second housing (320) may be formed to face the ground point connected to the fourth side portion (323a) and the first ground member (421) from the hinge structure (340).

[0194] The electric field distribution of the sixth side portion (323c) and a portion (a) of the second housing (320) adjacent to the sixth side portion (323c) in the electronic device (300) may be the same as the electric field distribution described with reference to FIGS. 19c and 19d, or may be similar in various aspects.

[0195] FIG. 19c is a conceptual diagram illustrating the distribution of surface current on one side of an electronic device (300) according to various embodiments.

[0196] FIG. 19d is a conceptual diagram illustrating the distribution of surface current on one side of an electronic device (300) according to various embodiments.

[0197] Referring to FIGS. 19c and 19d, the direction of the second surface current (J2) induced in the second support member (3231) and the grounded sixth side portion (323c) through the first matching circuit portion (921) may be formed in a direction opposite to the direction of the second surface current (J2) induced in the surface of the second housing (320) (e.g., the second rear cover (234)) due to the grounding. For example, in the electronic device (300), the first surface current (J1) formed on the surface of the second housing (320) may be formed in the -Y axis direction based on the XY plane. A second surface current (J2) induced in the second housing (320) of the electronic device (300) to the second support member (3231) and the grounded sixth side portion (323c) through the first matching circuit portion (921) can be formed in the +Y-axis direction, which is opposite to the direction of the first surface current (J1).

[0198] Since the second surface current (J2) induced in the second support member (3231) and the grounded sixth side portion (323c) through the first matching circuit portion (921) in the electronic device (300) is formed in a direction opposite to the direction of the first surface current (J1) induced in the surface of the second housing (320), a resonance split phenomenon may occur between the frequency of the first parasitic resonance due to the first surface current (J1) formed in the surface of the second housing (320) in the electronic device (300) and the frequency (521) of the second parasitic resonance due to the second surface current (J2) induced in the second support member (3231) of the second housing (320) and the grounded sixth side portion (323c) through the second grounding member (422). For example, the resonance splitting phenomenon may mean a phenomenon in which the frequency of the first parasitic resonance formed by the first surface current (J1) formed on the surface of the second housing (320) is shifted to a specific frequency band under the influence of the second parasitic resonance (521) formed by the second surface current (J2) induced in the second support member (3231) and the grounded sixth side portion (323c).

[0199] A portion of the electronic device (300) where no surface current is displayed may be ground. For example, the ground may be ground included in a support member (e.g., a first support member (3131) or a second support member (3231), ground included in a printed circuit board (e.g., a first substrate assembly (361) or a second substrate assembly (362)), or ground included in a display (e.g., a first display (330) or a second display (400)). FIG. 20A is a conceptual diagram illustrating an upper surface of the electronic device (300) according to various embodiments.

[0200] Referring to FIG. 20A, the fourth side portion (323a) of the second housing (320) of the electronic device (300) can be grounded to the second support member (3231) via the first ground member (421). For example, the first ground member (421) can electrically connect the fourth side portion (323a) and the second support member (3231). For example, the first ground member (421) can electrically connect the fourth side portion (323a) and the second support member (3231) via a printed circuit board (e.g., the second board assembly (362)).

[0201] The electronic device (300) may include a wireless communication circuit (600). The fourth side portion (323a) may be electrically connected to the wireless communication circuit (600). In one embodiment, the fourth side portion (323a) may be electrically connected to the third corner portion (323d) via a first connection portion (821) including a first switch (821a) and a first conductive line (821b). One end of the first connection portion (821) may be electrically connected to the fourth side portion (323a). The other end of the first connection portion (821) may be electrically connected to the third corner portion (323d). For example, the first connection portion (821) may be a logical connection as a connection line for connecting the fourth side portion (323a) and the third corner portion (323d). For another example, the first switch (821a) and the first conductive line (821b) may be formed on a printed circuit board (e.g., the second board assembly (362)). For another example, the fourth side portion (323a) and the third corner portion (323d) may operate as a radiator (720). For another example, the fourth side portion (323a) may operate as a radiator (720) together with the third corner portion (323d) via the first switch (821a). For example, the fourth side portion (323a) may operate as a radiator solely via the first switch (821a).

[0202] In one embodiment, the sixth side portion (323c) may be electrically connected to the third corner portion (323d) via the second matching circuit portion (922). For example, the second matching circuit portion (922) may include a third switch (922a) and at least one second inductor (922b). The second matching circuit portion (922) may electrically connect the sixth side portion (323c) and the third corner portion (323d). In another example, the second matching circuit portion (922) may electrically connect the sixth side portion (323c) and the third corner portion (323d) via a printed circuit board (e.g., the second board assembly (362)). For example, one end of the second matching circuit portion (922) may be electrically connected to the sixth side portion (323c). The other end of the second matching circuit portion (922) may be electrically connected to the third corner portion (323d). A second parasitic resonance (522) may be formed from the first ground member (421) connected to the fourth side portion (323a) to the third corner portion (323d), the second matching circuit portion (922), and the sixth side portion (323c).

[0203] In one embodiment, the second matching circuit (922) may be a tunable matching circuit including a plurality of inductors having various inductance values. For example, the second inductors (922b) included in the second matching circuit (922) may be plural. For example, the plurality of second inductors (922b) may be connected in parallel with the third switch (922a). The third switch (922a) may be selectively connected to one of the plurality of second inductors (922a).

[0204] For example, the inductance value of the second matching circuit unit (922) can be determined based on the frequency of the transmission signal of the electronic device (300). For example, the inductance value of the second matching circuit unit (922) can have a sufficient size to operate close to open at the frequency of the transmission signal of the electronic device (300). For example, the inductance value of the second matching circuit unit (922) can be set to exceed a predetermined threshold value so that the sixth side portion (323c) is not electromagnetically coupled with the radiator (720). In other words, the electronic device (300) can control the second parasitic resonant frequency (521) while minimizing the influence on the radiator (720) through the second matching circuit unit (922). For example, the inductance value of the second matching circuit (922) may have various values ​​such as about 39 nH, about 56 nH, or about 100 nH, but is not limited thereto.

[0205] FIG. 20b is a conceptual diagram illustrating the distribution of surface current on one side of an electronic device (300) according to various embodiments.

[0206] Referring to FIG. 20b, in the folded electronic device (300), the current distribution formed on the surface of the second housing (320) may be formed to face the fourth side portion (323a) from the hinge structure (340). For example, the current distribution formed on the surface of the second housing (320) in the electronic device (300) may be formed to face the grounding point of the fourth side portion (323a) from the hinge structure (340). As another example, the current distribution formed on the surface of the second housing (320) in the electronic device (300) may be formed to face the grounding point where the fourth side portion (323a) and the first grounding member (421) are connected from the hinge structure (340).

[0207] The electric field distribution of the fourth side portion (323a) and a portion (a) of the second housing (320) adjacent to the fourth side portion (323a) in the electronic device (300) may include the electric field distribution described with reference to FIG. 20c, or may be similar in various aspects.

[0208] FIG. 20c is a conceptual diagram illustrating the distribution of surface current on one side of an electronic device (300) according to various embodiments.

[0209] Referring to FIG. 20c, the first surface current (J1) formed on the surface of the second housing (320) in the electronic device (300) is formed in the -Y-axis direction based on the XY plane, and may be formed in the +X-axis direction and the -X-axis direction toward the grounding point at a portion adjacent to the grounding point. The second surface current (J2) induced in the fourth side portion (323a) grounded to the second support member (3231) of the second housing (320) through the first grounding member (421) in the electronic device (300) may be formed in the -X-axis direction and the +X-axis direction, which are opposite directions to the direction of the first surface current (J1) formed in the +X-axis direction and the -X-axis direction on the surface of the second housing (320) adjacent to the fourth side portion (323a).

[0210] FIG. 20d is a conceptual diagram illustrating the distribution of surface current on one side of an electronic device (300) according to various embodiments.

[0211] Referring to FIG. 20d, a first surface current (J1) formed on the surface of the second housing (320) in the electronic device (300) may be formed in the -Y-axis direction based on the XY plane. A second surface current (J2) induced in the sixth side portion (323c) electrically connected to the third corner portion (323d) through the second matching circuit portion (922) in the electronic device (300) may be formed in the +Y-axis direction, which is the opposite direction to the direction of the first surface current (J1) formed on the surface of the second housing (320) based on the XY plane.

[0212] In the electronic device (300), the second surface current (J2) induced in the second supporting member (3231) of the second housing (320) and the grounded sixth side portion (323c) through the second matching circuit unit (922) is formed in a direction opposite to the direction of the first surface current (J1) formed on the surface of the second housing (320) based on the XY plane, so that a resonance split phenomenon identical to or similar to the resonance split phenomenon described with reference to FIGS. 19a to 19d may occur between the first parasitic resonance caused by the first surface current (J1) formed on the surface of the second housing (320) in the electronic device (300) and the second parasitic resonance (522) caused by the second surface current (J2) induced in the second supporting member (3231) of the second housing (320) and the grounded sixth side portion (323c) through the second matching circuit unit (922).

[0213] FIG. 21 is a graph (1160) illustrating that the frequency band of the first parasitic resonance shifts due to the second parasitic resonance formed in the electronic device (300) in a folded state according to various embodiments.

[0214] Referring to FIG. 21, the second parasitic resonance (1161) caused by the second surface current (J2) induced in the second support member (3231) of the second housing (320) and the grounded sixth side portion (323c) through the second matching circuit portion (922) in the electronic device (300) can shift the frequency band of the first parasitic resonance caused by the first surface current (J1) induced in the surface of the electronic device (300) in the folded state from the first frequency band (1162) to the second frequency band (1163).

[0215] FIG. 22 is a graph showing the efficiency of radiation performance according to the resonance splitting phenomenon caused by the second parasitic resonance in an electronic device (300) in a folded state according to various embodiments.

[0216] Referring to FIG. 22, in the folded electronic device (300), the first radiation graph (1171) due to the first parasitic resonance can be changed to the second radiation graph (1172) due to the resonance splitting phenomenon due to the second parasitic resonance. For example, the folded electronic device (300) can improve the radiation performance of an antenna including a radiator by moving the first parasitic resonance through the resonance splitting phenomenon due to the second parasitic resonance.

[0217] FIG. 23 is a conceptual diagram illustrating the upper surface of an electronic device (300) according to various embodiments.

[0218] Referring to FIG. 23, in the electronic device (300), the fourth side portion (323a) may be grounded to the second support member (3231) via the first ground member (421). For example, the first ground member (421) may electrically connect the fourth side portion (323a) and the second support member (3231). For example, the first ground member (421) may electrically connect the fourth side portion (323a) and the second support member (3231) via a printed circuit board (e.g., the second board assembly (362)).

[0219] The electronic device (300) may include a wireless communication circuit (e.g., the wireless communication module (192) of FIG. 1). The fourth side portion (323a) may be electrically connected to the wireless communication circuit via the first power supply unit (621). The fourth side portion (323a) and the third corner portion (323d) may function as a radiator (720).

[0220] In one embodiment, the sixth side portion (323c) may be grounded to the second support member (3231) via the first matching circuit portion (921). For example, the first matching circuit portion (921) may include a second switch (921a) and at least one first inductor (921b). For example, the first matching circuit portion (921) may electrically connect the sixth side portion (323c) and the second support member (3231). For example, the first matching circuit portion (921) may electrically connect the sixth side portion (323c) and the second support member (3231) via a printed circuit board (e.g., the second board assembly (362)). For example, one end of the first matching circuit portion (921) may be electrically connected to the sixth side portion (323c). For example, one end of the first matching circuit portion (921) may be electrically connected to the sixth side portion (323c). The other end of the first matching circuit portion (921) may be electrically connected to the second support member (3231). A second parasitic resonance (521) may be formed between the first matching circuit portion (921) and the sixth side portion (323c). In one embodiment, the fifth side portion (323b) may be grounded to the second support member (3231) via the third matching circuit portion (923). For example, the third matching circuit portion (923) may include a fourth switch (923a) and at least one third inductor (923b). For example, the third matching circuit portion (923) may electrically connect the fifth side portion (323b) and the second support member (3231). One end of the third connecting member (423) may be electrically connected to the fifth side portion (323b). For example, the third matching circuit portion (923) may electrically connect the fifth side portion (323d) and the second support member (3231) via a printed circuit board (e.g., the second board assembly (362)). For example, one end of the third matching circuit portion (923) may be electrically connected to the fifth side portion (323d).The other end of the third matching circuit portion (923) may be electrically connected to the second support member (3231). A third parasitic resonance (523) may be formed in the third matching circuit portion (923) and the fifth side portion (323b). For example, the third matching circuit portion (923) may be arranged to be substantially symmetrical with respect to the first matching circuit portion (921) with respect to the Y-axis.

[0221] FIG. 24 is a conceptual diagram illustrating one side of an electronic device (300) according to various embodiments.

[0222] Referring to FIG. 24, in the electronic device (300), the fourth side portion (323a) may be grounded to the second support member (3231) via the first ground member (421). For example, the first ground member (421) may electrically connect the fourth side portion (323a) and the second support member (3231). As another example, the first ground member (421) may electrically connect the fourth side portion (323a) and the second support member (3231) via a printed circuit board (e.g., the second board assembly (362)).

[0223] The electronic device (300) may include a wireless communication circuit (e.g., a wireless communication module (192) of FIG. 1). The fourth side portion (323a) may be electrically connected to the wireless communication circuit via the first power supply portion (621). The fourth side portion (323a) may be electrically connected to the first edge portion (313d) via a first connection portion (821) including a first switch (821a) and a first conductive line (821b). For example, one end of the first connection portion (821) may be electrically connected to the fourth side portion (323a). The other end of the first connection portion (821) may be electrically connected to the third edge portion (323d). For another example, the first connection portion (821) may be a logical connection as a connection line for connecting the fourth side portion (323a) and the third corner portion (323d). For example, the first switch (821a) and the first conductive line (821b) may be formed on a printed circuit board (e.g., the second board assembly (362)). The fourth side portion (323a) and the third corner portion (323d) may operate as a radiator (700).

[0224] In one embodiment, the sixth side portion (323c) may be grounded to the second support member (3231) via the first matching circuit portion (921). For example, the first matching circuit portion (921) may include a second switch (921a) and at least one first inductor (921b). As another example, the first matching circuit portion (921) may electrically connect the sixth side portion (323c) and the second support member (3231). One end of the first matching circuit portion (921) may be electrically connected to the sixth side portion (323c). One end of the first matching circuit portion (921) may be electrically connected to the sixth side portion (323c). The other end of the first matching circuit portion (921) may be electrically connected to the second support member (3231). A second parasitic resonance (521) may be formed in the first matching circuit portion (921) and the sixth side portion (323c). In one embodiment, the fifth side portion (323b) may be grounded to the second support member (3231) via the fourth matching circuit portion (924). For example, the fourth matching circuit portion (924) may include a fifth switch (924a) and at least one fourth inductor (924b). In another example, the fourth matching circuit portion (924) may electrically connect the fifth side portion (323b) and the second support member (3231). One end of the fourth matching circuit portion (924) may be electrically connected to the fifth side portion (323b). The other end of the fourth matching circuit portion (924) may be electrically connected to the second support member (3231). A fourth parasitic resonance (524) may be formed in the fourth matching circuit portion (924) and the fifth side portion (323b). For example, the fourth matching circuit portion (924) may be arranged to be substantially symmetrical with the first matching circuit portion (921) with respect to the X-axis and the Y-axis.

[0225] According to one embodiment, the fifth side portion (323b) and the sixth side portion (323c) may function as additional radiators. For example, the electronic device (300) may further include a second feed portion (622) and a third feed portion (623). The sixth side portion (323c) may be electrically connected to a wireless communication circuit via the second feed portion (622). The fifth side portion (323b) may be electrically connected to a wireless communication circuit via the third feed portion (623).

[0226] FIG. 25 is a conceptual diagram illustrating one side of an electronic device (300) according to various embodiments.

[0227] Referring to FIG. 25, in the electronic device (300), the fourth side portion (323a) may be grounded to the second support member (3231) via the first ground member (421). For example, the first ground member (421) may electrically connect the fourth side portion (323a) and the second support member (3231). As another example, the first ground member (421) may electrically connect the fourth side portion (323a) and the second support member (3231) via a printed circuit board (e.g., the second board assembly (362)).

[0228] The electronic device (300) may include a wireless communication circuit (e.g., a wireless communication module (192) of FIG. 1). The fourth side portion (323a) may be electrically connected to the wireless communication circuit via the first power supply unit (621).

[0229] In one embodiment, the sixth side portion (323c) may be grounded to the second support member (3231) via the first matching circuit portion (921). For example, the first matching circuit portion (921) may electrically connect the sixth side portion (323c) and the second support member (3231). One end of the first matching circuit portion (921) may be electrically connected to the sixth side portion (323c). One end of the first matching circuit portion (921) may be electrically connected to the sixth side portion (323c). The other end of the first matching circuit portion (921) may be electrically connected to the second support member (3231).

[0230] In one embodiment, the sixth side portion (323c) may be electrically connected to the third corner portion (323d) via the second connection portion (822). One end of the second connection portion (822) may be electrically connected to the sixth side portion (323c). The other end of the second connection portion (822) may be electrically connected to the third corner portion (323d). The second connection portion (822) may include a sixth switch (822a) and a second conductive line (822b). For example, the sixth switch (822a) may be turned on when the electronic device (300) is in a folded state and may be turned off when the electronic device (300) is in an unfolded state.

[0231] A fifth parasitic resonance (525) can be formed in the first matching circuit portion (921), the sixth side portion (323c), the second connection portion (822), and the third corner portion (323d).

[0232] FIG. 26 is a conceptual diagram illustrating one side of an electronic device (300) according to various embodiments.

[0233] Referring to FIG. 26, in the electronic device (300), the fourth side portion (323a) can be grounded to the second support member (3231) via the first ground member (421). For example, the first ground member (421) can electrically connect the fourth side portion (323a) and the second support member (3231).

[0234] The electronic device (300) may include a wireless communication circuit (e.g., the wireless communication module (192) of FIG. 1). The fourth side portion (323a) may be electrically connected to the wireless communication circuit via the first power supply unit (621). The fourth side portion (323a) may function as a radiator (700).

[0235] In one embodiment, the third edge portion (323d) may be grounded to the second support member (3231) via the fifth matching circuit portion (925). For example, the fifth matching circuit portion (925) may electrically connect the first edge portion (313d) and the second support member (323d). The fifth matching circuit portion (925) may include a seventh switch (925a) and at least one fifth inductor (822b). For example, the seventh switch (925a) may be turned on when the electronic device (300) is in a folded state and may be turned off when the electronic device (300) is in an unfolded state. For example, the fifth matching circuit portion (925) may electrically connect the fourth side portion (323a) and the second support member (3231) via a printed circuit board (e.g., the second board assembly (362)). For example, one end of the fifth matching circuit portion (925) may be electrically connected to the first corner portion (313d). The other end of the fifth matching circuit portion (925) may be electrically connected to the second support member (3231).

[0236] In one embodiment, the sixth side portion (323c) may be electrically connected to the third corner portion (323d) via the second connection portion (822). The second connection portion (822) may include a sixth switch (822a) and a second conductive line (822b). For example, the sixth switch (822a) may be turned on when the electronic device (300) is in a folded state and may be turned off when the electronic device (300) is in an unfolded state. One end of the second connection portion (822) may be electrically connected to the sixth side portion (323c). The other end of the second connection portion (822) may be electrically connected to the third corner portion (323d).

[0237] A sixth parasitic resonance (526) may be formed in the fifth matching circuit portion (925), the third corner portion (323d), the second connection portion (822), and the sixth side portion (323c). For example, the frequency length of the fifth parasitic resonance (525) may be approximately λ / 4.

[0238] FIG. 27 is a conceptual diagram illustrating one side of an electronic device (300) according to various embodiments.

[0239] Referring to FIG. 27, in the electronic device (300), the fourth side portion (323a) can be grounded to the second support member (3231) via the first ground member (421). For example, the first ground member (421) can electrically connect the fourth side portion (323a) and the second support member (3231).

[0240] The electronic device (300) may include a wireless communication circuit (e.g., a wireless communication module (192) of FIG. 1). The fourth side portion (323a) may be electrically connected to the wireless communication circuit via the first power supply portion (621). The fourth side portion (323a) may be electrically connected to the first corner portion (313d) via the first connection portion (821). For example, the first connection portion (821) may include a first switch (821a) and a first conductive line (821b). The first switch (821a) may be turned on when the electronic device (300) is in a folded state and may be turned off when the electronic device (300) is in an unfolded state. One end of the first connection portion (821) may be electrically connected to the fourth side portion (323a). The other end of the first connecting portion (821) can be electrically connected to the first corner portion (313d). The fourth side portion (323a) and the first corner portion (313d) can function as a radiator (700).

[0241] In one embodiment, the sixth side portion (323c) may be electrically connected to the third corner portion (323d) via the second matching circuit portion (922). The second matching circuit portion (922) may include a third switch (922a) and at least one second inductor (922b). For example, the third switch (922a) may be turned on when the electronic device (300) is in a folded state and turned off when the electronic device (300) is in an unfolded state. One end of the second matching circuit portion (922) may be electrically connected to the sixth side portion (323c). The other end of the second matching circuit portion (922) may be electrically connected to the third corner portion (323d).

[0242] In one embodiment, the third edge portion (323d) may be electrically connected to the second support member (3231) through the fifth matching circuit portion (925). For example, the fifth matching circuit portion (925) may include a sixth switch (925a) and at least one fifth inductor (925b). The third edge portion (323d) may be grounded to the second support member (3231) through the fifth matching circuit portion (925). One end of the fifth matching circuit portion (925) may be electrically connected to the third edge portion (323d). The other end of the fifth matching circuit portion (925) may be electrically connected to the second support member (3231).

[0243] A seventh parasitic resonance (527) can be formed in the fifth matching circuit portion (925), the third corner portion (323d), the second matching circuit portion (922), and the sixth side portion (323c).

[0244] FIG. 28 is a conceptual diagram illustrating one side of an electronic device (300) according to various embodiments.

[0245] Referring to FIG. 28, the second housing (320) of the electronic device (300) may include a second support member (3231), a fifth side portion (323b), a sixth side portion (323c), a fourth corner portion (323e), and a third corner portion (323d). The fifth side portion (323b) and the sixth side portion (323c) may be arranged to be substantially symmetrical with respect to the Y axis on the XY plane. The third corner portion (323d) and the fourth corner portion (323e) may be arranged to be substantially symmetrical with respect to the Y axis on the XY plane. The fifth side portion (323b), the sixth side portion (323c), the fourth corner portion (323e), and the third corner portion (323d) may each be formed of a conductive material and / or a non-conductive material.

[0246] The second housing (320) may include a first segment (3261), a third segment (3263), a fourth segment (3264), a fifth segment (3265), and a sixth segment (3266). For example, the first segment (3261) may be disposed between a fourth edge portion (323e) and a third edge portion (323d). The fourth edge portion (323e) and the third edge portion (323d) may be electrically separated from each other through the first segment (3261). The third segment (3263) may be disposed between a fifth side portion (323b) and a hinge structure (340). The fifth side portion (323b) and the hinge structure (340) may be electrically separated from each other through the third segment (3263). The fourth segment (3264) may be disposed between the fifth side portion (323b) and the fourth side portion (323a). The fifth side portion (323b) and the fourth side portion (323a) may be electrically separated from each other by the fourth segment (3264). The fifth segment (3265) may be disposed between the sixth side portion (323c) and the first edge portion (313d). The sixth side portion (323c) and the first edge portion (313d) may be electrically separated from each other by the fifth segment (3265). The sixth segment (3266) may be disposed between the sixth side portion (323c) and the hinge structure (340). The sixth side portion (323c) and the hinge structure (340) may be electrically separated from each other by the sixth segment (3266).

[0247] In one embodiment, the third corner portion (323d) of the electronic device (300) may be grounded to the second support member (3231) via the second grounding member (422). For example, the second grounding member (422) may electrically connect the third corner portion (323d) and the second support member (3231). For example, the second grounding member (422) may electrically connect the third corner portion (323d) and the second support member (3231) via a printed circuit board (e.g., the second board assembly (362)).

[0248] The electronic device (300) may include a wireless communication circuit (e.g., a wireless communication module (192) of FIG. 1). The third edge portion (323d) may be electrically connected to the wireless communication circuit via the fourth power supply portion (624). The third edge portion (323d) may be connected to a radiator (700).

[0249] In one embodiment, the sixth side portion (323c) may be electrically connected to the third corner portion (323d) via the sixth matching circuit portion (926). For example, the sixth matching circuit portion (926) may include a seventh switch (926a) and at least one sixth inductor (926b). For another example, the seventh switch (926a) may be turned on when the electronic device (300) is in a folded state and may be turned off when the electronic device (300) is in an unfolded state. One end of the sixth matching circuit portion (926) may be electrically connected to the sixth side portion (323c). The other end of the sixth matching circuit portion (926) may be electrically connected to the third corner portion (323d).

[0250] An eighth parasitic resonance (528) can be formed in the second grounding member (422), the third corner portion (323d), the sixth matching circuit portion (926), and the sixth side portion (323c).

[0251] FIG. 29a is a conceptual diagram illustrating one side of an electronic device (300) according to various embodiments.

[0252] Referring to FIG. 29a, the second housing (320) may include a second support member (3231), a fourth side portion (323a) disposed in the -Y-axis direction with respect to the XY plane, a fifth side portion (323b) disposed in the -X-axis direction of the second housing (320), a sixth side portion (323c) disposed in the +X-axis direction of the second housing (320), a fourth corner portion (323e) disposed between the fourth side portion (323a) and the fifth side portion (323b), and a third corner portion (323d) disposed between the fourth side portion (323a) and the sixth side portion (323c). The fourth side portion (323a), the fifth side portion (323b), the sixth side portion (323c), the third corner portion (323d), and the fourth corner portion (323e) may each be made of a conductive material.

[0253] In one embodiment, the third edge portion (323d) of the electronic device (300) may be grounded to the second support member (3231) via the third grounding member (423). For example, the third grounding member (423) may electrically connect the third edge portion (323d) and the second support member (3231). For example, the third grounding member (423) may electrically connect the third edge portion (323d) and the second support member (3231) via a printed circuit board (e.g., the second board assembly (362)). The electronic device (300) may include a wireless communication circuit (e.g., the wireless communication module (192) of FIG. 1). The third edge portion (323d) may be electrically connected to the wireless communication circuit via the fifth power supply unit (625). The third edge portion (323d) may operate as a radiator (700).

[0254] In one embodiment, the sixth side portion (323c) may be electrically connected to the second support member (3231) via the first matching circuit portion (921). A ninth parasitic resonance (529) may be formed in the first matching circuit portion (921) and the sixth side portion (323c).

[0255] In one embodiment, the fifth side portion (323b) may be electrically connected to the fourth corner portion (323e) via the seventh matching circuit portion (927). The seventh matching circuit portion (927) may include an eighth switch (927a) and at least one seventh inductor (927b). For example, the eighth switch (927a) may be turned on when the electronic device (300) is in a folded state and may be turned off when the electronic device (300) is in an unfolded state. One end of the seventh matching circuit portion (927) may be electrically connected to the fifth side portion (323b). The other end of the seventh matching circuit portion (927) may be electrically connected to the fourth corner portion (323e).

[0256] In one embodiment, the fourth corner portion (323e) may be grounded to the second support member (3231) via the eighth matching circuit portion (928). For example, the eighth grounding member (928) may electrically connect the fourth corner portion (323e) and the second support member (3231). For example, the eighth matching circuit portion (928) may electrically connect the fourth corner portion (323e) and the second support member (3231) via a printed circuit board (e.g., the second board assembly (362)). The eighth matching circuit portion (928) may include a ninth switch (928a) and at least one eighth inductor (928b). For example, the ninth switch (928a) may be turned on when the electronic device (300) is in a folded state and turned off when the electronic device (300) is in an unfolded state. One end of the eighth matching circuit portion (928) may be electrically connected to the fourth corner portion (323e). The other end of the eighth matching circuit portion (928) may be electrically connected to the second support member (3231).

[0257] FIG. 29b is a graph illustrating a shift in the frequency band of a first parasitic resonance according to a second parasitic resonance formed in an electronic device (300) according to various embodiments.

[0258] Referring to FIG. 29b, if the frequency of the second parasitic resonance in the graph (1180) is a frequency in a higher band than the frequency of the first parasitic resonance, the second parasitic resonance can move the frequency of the first parasitic resonance to the left, thereby restoring the radiation performance of the antenna including the radiator (700).

[0259] FIG. 30A is a conceptual diagram illustrating an electronic device (3000) according to various embodiments.

[0260] FIG. 30b is a conceptual diagram illustrating a side view of an electronic device (3000) according to various embodiments.

[0261] Referring to FIGS. 30A and 30B , the electronic device (3000) may include, or may be identical and / or similar to, the electronic device (101) of FIG. 1 and the electronic device (300) of FIGS. 2A to 29B in many aspects, and may include additional features not described above. For example, the electronic device (3000) may be a G-type multi-foldable terminal. For example, the electronic device (3000) may include a first housing (1011), a first hinge structure (1021) coupled with one side of the first housing (1011), a second housing (1012) coupled with one side of the first hinge structure (1021), a second hinge structure (1022) coupled with one side of the second housing (1012), and a third housing (1013) coupled with one side of the second hinge structure (1022).

[0262] For example, the second housing (1012) and the third housing (1013) can be folded so that their first sides face each other with the second hinge structure (1022) as the central axis. The first housing (1011) can be folded so that the first side of the first housing (1011) faces the second side of the third housing (1013) with the first hinge structure (1021) as the central axis.

[0263] FIG. 30c is a conceptual diagram illustrating the distribution of surface current of an electronic device (3000) according to various embodiments.

[0264] Referring to FIG. 30c, when the first surface of the second housing (1012) and the first surface of the third housing (1013) are folded to face each other with the second hinge structure (1022) as the central axis, and the first surface of the first housing (1011) and the second surface of the third housing (1013) are folded to face each other with the first hinge structure (1021) as the central axis, the first housing (1011), the first hinge structure (1021), the second housing (1012), the second hinge structure (1022), and the third housing (1013) can be electrically coupled.

[0265] For example, in an electronic device (3000) in a folded state, surface current may flow from one side of the third housing (1013) to the second hinge structure (1022), from the second hinge structure (1022) to one side of the second housing (1012), from one side of the second housing (1012) to the first hinge structure (1021), and from the first hinge structure (1021) to one side of the first housing (1011).

[0266] The electronic device (3000) may be a foldable terminal having or including conductive sides or a metal frame (e.g., a first side (313a), a second side (313b), a third side (313c), a first edge (313d), a second edge (313e), a fourth side (323a), a fifth side (323b), a sixth side (323c), a third edge (323d), a fourth edge (323e)). For example, the first housing (1011), the second housing (1012), and the third housing (1013) may each include conductive sides. At least one of the conductive sides may be grounded to a support member of at least one of the first housing (1011), the second housing (1012), or the third housing (1013). When the electronic device (3000) is in a folded state, at least one of the conductive sides may have a surface current induced electromagnetically as part of at least one of the first housing (1011), the second housing (1012), or the third housing (1013). The direction of the surface current induced in the at least one conductive side may be the same as the direction of the surface current induced in the first housing (1011) or the direction of the surface current induced in at least one of the second housing (1012) or the third housing (1013). The surface current induced in the surface of the electronic device (3000) in the folded state may generate a first parasitic resonance. The first parasitic resonance may be referred to as a PPW resonance.

[0267] In the folded electronic device (3000), when at least one of the conductive side surfaces is grounded to a support member of at least one of the first housing (1011), the second housing (1012), or the third housing (1013), the direction of a surface current (e.g., a first surface current (J1)) induced on the surface of the electronic device (3000) and the direction of a surface current (e.g., a second surface current (J2)) induced on the at least one grounded conductive side surface may be opposite to each other. The second surface current (J2) induced on the at least one grounded conductive side surface may generate a second parasitic resonance. The second parasitic resonance may shift the frequency band of the first parasitic resonance. For example, the second parasitic resonance may generate a resonance splitting phenomenon with respect to the first parasitic resonance.

[0268] FIG. 30d is a graph (1210) illustrating the frequency (1211) of a first parasitic resonance formed by a surface current induced on the surface of an electronic device (3000) in a folded state according to various embodiments.

[0269] Referring to FIG. 30d, the X-axis may represent a frequency band (frequency band / MHz), and the Y-axis may represent a reflection coefficient (dB) of a mode of an electric field formed in an electronic device (3000) in a folded state. The first graph (1211) may represent a frequency of a first parasitic resonance formed by a surface current induced on the surface of a G-type foldable terminal (1) in a folded state. In the electronic device (3000) in a folded state according to the present disclosure, when at least one of the conductive side surfaces is grounded to a support member of at least one of the first housing (1011), the second housing (1012), or the third housing (1013), the frequency band of the first parasitic resonance may shift according to a resonance splitting phenomenon. For example, the first graph (1211) may shift to a frequency band that does not overlap with the frequency band of a transmission signal of a radiator of the electronic device (3000). Accordingly, the communication performance and efficiency of the electronic device (3000) can be improved.

[0270] FIG. 31A is a conceptual diagram illustrating an electronic device (3100) according to various embodiments.

[0271] FIG. 31A is a conceptual diagram illustrating one side of an electronic device (3100) according to various embodiments.

[0272] Referring to FIGS. 31A and 31B , the electronic device (3100) may include the electronic device (101) of FIG. 1 and the electronic device (300) of FIGS. 2A to 29B , or may be identical and / or similar thereto in various aspects, and may include additional features not described above. For example, the electronic device (3100) may be a Z-type multi-foldable terminal. For example, the electronic device (3100) may include a first housing (1031), a first hinge structure (1041) coupled with one side of the first housing (1031), a second housing (1032) coupled with one side of the first hinge structure (1041), a second hinge structure (1042) coupled with one side of the second housing (1032), and a third housing (1033) coupled with one side of the second hinge structure (1042).

[0273] The first housing (1031) and the second housing (1042) can be folded so that their respective first sides face each other with the first hinge structure (1041) as the central axis. The second housing (1032) and the third housing (1033) can be folded so that their respective second sides face each other with the second hinge structure (1042) as the central axis.

[0274] FIG. 31c is a conceptual diagram illustrating the distribution of surface current induced on the surface of an electronic device (3100) according to various embodiments.

[0275] Referring to FIG. 31c, when the first surface of the first housing (1031) and the second surface of the second housing (1032) are folded to face each other with the first hinge structure (1041) as the central axis, and the second surface of the second housing (1032) and the second surface of the third housing (1033) are folded to face each other with the second hinge structure (1042) as the central axis, the first housing (1031), the first hinge structure (1041), the second housing (1032), the second hinge structure (1042), and the third housing (1033) can be electrically coupled.

[0276] A surface current (e.g., a first surface current (J1)) induced on the surface of the electronic device (3100) in a folded state can flow from one side of the third housing (1033) to the second hinge structure (1042), from the second hinge structure (1042) to one side of the second housing (1032), from one side of the second housing (1032) to the first hinge structure (1041), and from the first hinge structure (1041) to one side of the first housing (1031).

[0277] The electronic device (3100) may be a foldable terminal having conductive sides or a metal frame (e.g., a first side (313a), a second side (313b), a third side (313c), a first edge (313d), a second edge (313e), a fourth side (323a), a fifth side (323b), a sixth side (323c), a third edge (323d), a fourth edge (323e)). For example, the first housing (1031), the second housing (1032), and the third housing (1033) may each include conductive sides. At least one of the conductive sides may be grounded to a support member of at least one of the first housing (1031), the second housing (1032), or the third housing (1033). At least one of the conductive sides may be a part of the first housing (1031), the second housing (1032), or the third housing (1033) through which a surface current may be induced. The direction of the surface current induced in at least one of the conductive sides may be the same as the direction of the surface current induced in the first housing (1031) or the direction of the surface current induced in at least one of the second housing (1032) or the third housing (1033). The surface current induced in the surface of the electronic device (3100) in the folded state may generate a first parasitic resonance. The first parasitic resonance may be referred to as a PPW resonance.

[0278] In the folded electronic device (3100), when at least one of the conductive sides is grounded to a support member of at least one of the first housing (1031), the second housing (1032), or the third housing (1033), the direction of a surface current (e.g., the first surface current (J1)) induced on the surface of the electronic device (1) and the direction of a surface current (e.g., the second surface current (J2)) induced on the at least one grounded conductive side may be opposite to each other. The surface current (e.g., the second surface current (J2)) induced on the at least one grounded conductive side may generate a second parasitic resonance. The second parasitic resonance may shift the frequency band of the first parasitic resonance. For example, the second parasitic resonance may generate a resonance splitting phenomenon with respect to the first parasitic resonance.

[0279] FIG. 31d is a graph (1220) illustrating the frequency of a first parasitic resonance formed by a surface current of an electronic device (3100) in a folded state according to various embodiments.

[0280] Referring to FIG. 31D, the X-axis may represent a frequency band (frequency band / MHz), and the Y-axis may represent a reflection coefficient (dB) of an electric field mode of an electronic device (3100) in a folded state. The first graph (1221) represents a frequency of a first parasitic resonance formed by a surface current induced on the surface of a Z-type foldable terminal (3100) in a folded state. In the electronic device (3100) in a folded state according to the present disclosure, when at least one of the conductive side surfaces is grounded to a support member of at least one of the first housing (1031), the second housing (1032), or the third housing (1033), the frequency band of the first parasitic resonance may shift according to a resonance splitting phenomenon. For example, the first graph (1211) may shift to a frequency band that does not overlap with the frequency band of a transmission signal of a radiator of the electronic device (3100). Accordingly, the communication performance and efficiency of the electronic device (3100) can be improved.

[0281] FIG. 32A is a conceptual diagram illustrating an electronic device (3200) according to various embodiments.

[0282] FIG. 32b is a conceptual diagram illustrating one side of an electronic device (3200) according to various embodiments.

[0283] Referring to FIGS. 32A and 32B , an electronic device (3200) may include the electronic device (101) of FIG. 1 and the electronic device (300) of FIGS. 2A to 29B , or may be identical and / or similar thereto in various aspects, and may include additional features not described above. For example, the electronic device (3200) may be a wide foldable terminal. The electronic device (3200) may include a first housing (1051), a hinge structure (1061) coupled with one side of the first housing (1051), and a second housing (1052) coupled with one side of the hinge structure (1061). In the electronic device (3200), the hinge structure (1061) may be aligned in the X-axis direction with respect to the XY plane. Accordingly, the first housing (1051) or the second housing (1052) can be folded in the Y-axis direction with the hinge structure (1061) aligned in the X-axis direction as the central axis. For example, the electronic device (3200) can be folded with the hinge structure (1061) as the central axis so that the first surface of the first housing (1051) and the first surface of the second housing (1052) face each other.

[0284] FIG. 32c is a conceptual diagram illustrating the distribution of surface current induced on the surface of an electronic device (3200) in a folded state according to various embodiments.

[0285] Referring to FIG. 32c, when the first surface of the first housing (1051) and the first surface of the second housing (1052) are folded to face each other with the hinge structure (1061) as the central axis in the electronic device (3200), the first housing (1051), the hinge structure (1061), and the second housing (1051) can be electrically coupled.

[0286] For example, the first housing (1051), the hinge structure (1061), and the second housing (1052) of the electronic device (3200) in the folded state can be equivalentized in the form of shielded parallel plates. Since the electric field (E-Field) of the electronic device (3200) in the folded state is proportional to the electric potential, the potential is zero (0) at the hinge structure (1061) where the first housing (1051) and the second housing (1052) are grounded, and thus the magnitude of the electric field can be zero (0). On the other hand, since the electric potential increases as one moves away from the hinge structure (1061) in the electronic device (3200) in the folded state, the magnitude of the electric field can also increase.

[0287] The surface current induced on the surface of the electronic device (3200) in the folded state can flow circulatingly from the hinge structure (1061) to one side of the first housing (1051), from one side of the first housing (1051) to the other side of the first housing (1051), from the other side of the first housing (1051) to the other side of the second housing (1051), from the other side of the second housing (1052) to one side of the second housing (1052), and from one side of the second housing (1052) back to the hinge structure (1061).

[0288] In one embodiment, the electronic device (3200) may be a foldable terminal having or including conductive sides or a metal frame (e.g., a first side (313a), a second side (313b), a third side (313c), a first edge (313d), a second edge (313e), a fourth side (323a), a fifth side (323b), a sixth side (323c), a third edge (323d), a fourth edge (323e)). For example, the first housing (1051) and the second housing (1052) may each include conductive sides. At least one of the conductive sides may be a part of at least one of the first housing (1051) or the second housing (1052) such that a surface current may be induced. The direction of the surface current induced in at least one of the conductive sides may be the same as the direction of the surface current induced in the first housing (1051) or the direction of the surface current induced in the second housing (1052). The surface current induced in the first housing (1051) or the second housing (1052) may generate a first parasitic resonance. At least one of the conductive sides may be grounded to a support member of at least one of the first housing (1051) or the second housing (1052). When at least one of the conductive sides is grounded to the support member of at least one of the first housing (1051) or the second housing (1052), a surface current (e.g., a second surface current (J2)) may be induced on the surface of the grounded conductive side, the surface current flowing in the opposite direction to the surface current (e.g., the first surface current (J1)) induced in the first housing (1051) or the second housing (1052). Surface currents induced on the surface of the grounded conductive side can generate a second parasitic resonance. The second parasitic resonance can change the frequency band of the first parasitic resonance. For example, a resonance splitting phenomenon can occur between the frequency of the second parasitic resonance and the frequency of the first parasitic resonance.

[0289] FIG. 32d is a graph (1230) illustrating the frequency (1231) of a first parasitic resonance formed by a surface current induced on the surface of an electronic device (3200) in a folded state according to various embodiments.

[0290] Referring to FIG. 32d, the X-axis may represent a frequency band (frequency band / MHz), and the Y-axis may represent a reflection coefficient (dB) of a mode of an electric field formed in an electronic device (3200) in a folded state. The first graph (1231) represents a frequency of a first parasitic resonance formed by a surface current induced on the surface of a wide foldable terminal (3200) in a folded state. When at least one of the conductive side surfaces in the electronic device (3200) in a folded state according to the present disclosure is grounded to a support member of at least one of the first housing (1051) and the second housing (1052), the frequency band of the second parasitic resonance may shift according to the resonance splitting phenomenon. For example, the first graph (1231) may shift to a frequency band that does not overlap with the frequency band of a transmission signal of a radiator of the wide foldable terminal (3200). Therefore, the communication performance and efficiency of the wide foldable terminal (3200) may be improved.

[0291] FIG. 33a is a conceptual diagram illustrating a connection structure between a matching circuit (1400), a sixth side (323c), a third corner (323d), and / or a wireless communication circuit (600) in an electronic device (300) according to various embodiments.

[0292] Referring to FIG. 33A, a matching circuit (1400) may be disposed on a second substrate assembly (362) (e.g., a second substrate or a sub-printed circuit board). The matching circuit (1400) may include a high-pass filter (1300). For example, the high-pass filter (1300) may be electrically connected to a wireless communication circuit (600). The matching circuit (1400) may include a capacitor (1410), a first inductor (1420), a second inductor (1430), a switch (1440), a first grounding element (1450), a second grounding element (1460), and a conductive line (1480). For example, the matching circuit (1400) may be identical to or similar to the second matching circuit (922) of FIG. 20A. For example, the switch (1440) may be identical to or similar to the third switch (922a) of FIG. 20a. The first inductor (1420) and the second inductor (1430) may be identical to or similar to the plurality of third inductors (922b) of FIG. 20a. For example, the first end of the matching circuit (1400) may be electrically connected to a wireless communication circuit (e.g., the wireless communication module (192) of FIG. 1). The second end of the matching circuit (1400) may be electrically connected to the sixth side (323c). The third end of the matching circuit (1400) may be electrically connected to the first edge (323d).

[0293] FIG. 33b is a circuit diagram illustrating a matching circuit (1400) of an electronic device (300) according to various embodiments.

[0294] Referring to FIG. 33b, the matching circuit (1400) may include a high-pass filter (1300), a capacitor (1410), a first inductor (1420), a second inductor (1430), a switch (1440), a first grounding element (1450), a second grounding element (1460), a first connection element (1471), and a second connection element (1472). The switch (1440) may include a first port (1441), a second port (1442), a third port (1443), and a fourth port (1444).

[0295] One end of the high-pass filter (1300) may be electrically connected to a feeder (e.g., Main3 Feed) of the second housing (320). For example, the feeder may include the wireless communication circuit (600) of FIG. 20A, or may be similar thereto in various aspects, and may include additional features not described above. The other end of the high-pass filter (1300) may be electrically connected to one end of the capacitor (1410) and one end of the first inductor (1420).

[0296] One end of the capacitor (1410) may be electrically connected to the other end of the high-pass filter (1500) and one end of the first inductor (1420). The other end of the capacitor (1410) may be electrically connected to one end of the second inductor (143) and one end of the first connecting element (1471).

[0297] One end of the first inductor (1420) may be electrically connected to the other end of the high-pass filter (1500) and one end of the capacitor (1410). The other end of the first inductor (1420) may be electrically connected to the first port (1441).

[0298] One end of the second inductor (1430) may be electrically connected to the other end of the capacitor (1410) and one end of the first connecting element (1471). The other end of the second inductor (1430) may be electrically connected to the second port (1442).

[0299] One end of the first connecting element (1471) may be electrically connected to the other end of the capacitor (1410) and one end of the second inductor (1430). The other end of the first connecting element (1471) may be electrically connected to the fifth side (323b).

[0300] One end of the first grounding element (1450) can be electrically connected to the third port (1443). The other end of the first grounding element (1450) can be grounded to the second substrate assembly (362) of the second housing (320).

[0301] One end of the second grounding element (1460) may be electrically connected to the fourth port (1444). The other end of the second grounding element (1460) may be grounded to the second substrate assembly (362) of the second housing (320).

[0302] One end of the second connecting element (1472) may be electrically connected to the switch (1440). For example, the other end of the second connecting element (1472) may be electrically connected to the first edge (323d).

[0303] An electronic device (300) according to one embodiment of the present disclosure may include: a first housing (310); a hinge structure (340) coupled to one side of the first housing (310); a second housing (320) coupled to the hinge structure (340) and facing the first housing (310) with the hinge structure (340) as a central axis; and a wireless communication circuit (192) disposed on a second support member (3231) disposed in the second housing (320). The second housing (320) may include: a sixth side portion (323c) including a conductive portion; a fifth side portion (323b) disposed opposite the sixth side portion (323c) and including a conductive portion; a fourth side portion (323a) disposed opposite the hinge structure (340) and including a conductive portion; The electronic device (300) may include a first edge portion (323d) disposed between the sixth side portion (323c) and the fourth side portion (323a) and including a conductive portion; a second edge portion (323e) disposed between the fifth side portion (323b) and the fourth side portion (323a) and including a conductive portion; and a first matching circuit portion (921) disposed on the second support member (3231) and electrically connected to the sixth side portion (323c) to induce a second surface current (J2) that is opposite in phase to a first surface current (J1) induced in the first housing (310), the second housing (320), and the hinge structure (340) when the first housing (310) and the second housing (320) are folded with each other about the hinge structure (340) as a central axis.

[0304] The second parasitic resonance formed by the second surface current (J2) can change the frequency band of the first parasitic resonance induced by the first surface current.

[0305] It may further include a first grounding member (421) that grounds the fourth side portion (323a) to the second support member (3231).

[0306] It may further include a first connecting portion (821) that electrically connects the fourth side portion (323a) and the first corner portion (323d).

[0307] The first connecting portion (821) may include a first switch (821a) disposed on the second support member (3231).

[0308] The first switch (821a) may be turned on when the electronic device (300) is in the folded state and may be turned off when the electronic device (300) is not in the folded state.

[0309] The fourth side portion (323a) can receive an electric signal from the wireless communication circuit (192) and operate as a radiator (700) together with the first corner portion (313d).

[0310] One end of the first matching circuit portion (921) may be electrically connected to the first point of the second support member (3231). The other end of the first matching circuit portion (921) may be electrically connected to the first point of the sixth side portion (323c).

[0311] The first matching circuit (921) includes a second switch (921a) and at least one first inductor (921b), and the second switch (921a) can be turned on when the electronic device (300) is in the folded state and can be turned off when the electronic device (300) is not in the folded state.

[0312] The frequency of the second parasitic resonance (521) may have an electrical length from one end of the sixth side (323c) to the other end of the first matching circuit (921).

[0313] An electronic device (300) according to one embodiment of the present disclosure may include: a first housing (310); a hinge structure (340) coupled to one side of the first housing (310); a second housing (320) coupled to the hinge structure (340) so as to face the first housing (310) with the hinge structure (320) as a central axis; and a wireless communication circuit (192) disposed on a second support member (3231) disposed in the second housing (320). The second housing (320) may include: a sixth side portion (323c) including a conductive portion; a fifth side portion (323b) disposed opposite the sixth side portion (323c) and including a conductive portion; a fourth side portion (323a) disposed opposite the hinge structure (340) and including a conductive portion; The electronic device (300) may include a first edge (313d) disposed between the sixth side portion (323c) and the fourth side portion (323a) and including a conductive portion; a second edge portion (313e) disposed between the fifth side portion (323b) and the fourth side portion (323a) and including a conductive portion; and a first matching circuit portion (921) disposed on the second support member (3231) and electrically connected to the sixth side portion (323c) and the first edge portion (313d) to induce a second surface current (J2) having an opposite phase to a first surface current (J1) induced in the first housing (310), the second housing (320), and the hinge structure (340) when the first housing (310) and the second housing (320) are folded with each other about the hinge structure (340) as a central axis.

[0314] The second parasitic resonance formed by the second surface current (J2) can change the frequency band of the first parasitic resonance induced by the first surface current.

[0315] It may further include a first grounding member (421) that grounds the fourth side portion (323a) to the second support member (3231).

[0316] It may further include a first connecting portion (821) that electrically connects the fourth side portion (323a) and the first corner portion (313d).

[0317] The first connecting portion (821) may include a first switch (821a) disposed on the second support member (3231).

[0318] The first switch (821a) may be turned on when the electronic device (300) is in the folded state and may be turned off when the electronic device (300) is not in the folded state.

[0319] The fourth side portion (323a) can receive an electric signal from the wireless communication circuit (192) and operate as a radiator (700) together with the first corner portion (323d).

[0320] One end of the first matching circuit portion (921) may be electrically connected to the second point of the sixth side portion (323c). The other end of the first matching circuit portion (921) may be electrically connected to the second point of the first corner portion (323d).

[0321] The above first matching circuit (921) may include a second switch (921a) and at least one first inductor (821b).

[0322] The second switch (921a) may be turned on when the electronic device (300) is in the folded state and turned off when the electronic device (300) is not in the folded state.

[0323] While the present invention has been described with reference to exemplary embodiments, this description is not intended to be construed in a limiting sense. Various modifications and combinations of the exemplary embodiments, as well as other embodiments of the invention, will become apparent to those skilled in the art upon review of the description. Accordingly, the appended claims are intended to encompass all such modifications and embodiments.

[0324] The present disclosure can be used in the electronics industry and the information and communication industry.

Claims

1. In electronic devices, 1st housing; A second housing comprising a second support member; The hinge structure is foldable by being combined with the first housing and the second housing using the hinge structure as a central axis; and Including a wireless communication circuit arranged in the second support member of the second housing, The above second housing, A sixth side portion including a first challenging portion; A fifth side portion opposite to the sixth side portion and including a second conductive portion; A fourth side portion opposite to the hinge structure and including a third conductive portion; A third edge portion disposed between the sixth side portion and the fourth side portion and including a fifth conductive portion; a second edge portion disposed between the fifth side portion and the fourth side portion and including a sixth conductive portion; and An electronic device, comprising a first matching circuit portion disposed on the second support member and electrically coupled to the sixth side portion, the first matching circuit portion inducing a second surface current having a second phase opposite to a first phase of a first surface current (J1) induced in the first housing, the second housing, and the hinge structure when the first housing and the second housing are in a folded state in which the electronic device is folded relative to each other.

2. In paragraph 1, An electronic device wherein the second parasitic resonance formed by the second surface current changes the frequency band of the first parasitic resonance induced by the first surface current.

3. In paragraph 1, An electronic device further comprising a first grounding member electrically grounding the fourth side portion to the second support member.

4. In paragraph 1, An electronic device further comprising a first connecting portion electrically connecting the fourth side portion and the third corner portion.

5. In paragraph 4, An electronic device (300), wherein the first connecting portion includes a first switch disposed on the second supporting member.

6. In paragraph 5, The above first connecting part: Turning on the first switch based on the case where the electronic device is in the folded state; An electronic device that turns off the first switch based on the electronic device not being in the folded state.

7. In paragraph 4, An electronic device in which the fourth side portion receives an electric signal from the wireless communication circuit and operates as a radiator together with the third corner portion.

8. In paragraph 1, The first end of the first matching circuit part is electrically coupled to the first point of the second support member, An electronic device wherein the second end of the first matching circuit portion is electrically coupled to the first point of the sixth side portion.

9. In paragraph 8, The above first matching circuit part includes a second switch and at least one first inductor, The above first matching circuit part: Turning on the second switch based on the case where the electronic device is in the folded state; and An electronic device that turns off the second switch based on the case where the electronic device is not in a folded state.

10. In paragraph 7, An electronic device having an electrical length from one end of the sixth side to the other end of the first matching circuit section, the frequency of the second parasitic resonance being equal to.

11. In electronic devices, 1st housing; A second housing comprising a second support member; The hinge structure is foldable by being combined with the first housing and the second housing using the hinge structure as a central axis; and Including a wireless communication circuit arranged in the second support member of the second housing, The above second housing, A sixth side portion including a first challenging portion; A fifth side portion opposite to the sixth side portion and including a second conductive portion; A fourth side portion opposite to the hinge structure and including a third conductive portion; A third edge disposed between the sixth side portion and the fourth side portion and including a fourth conductive portion; a fourth edge portion disposed between the fifth side portion and the fourth side portion and including a fifth conductive portion; and An electronic device (300) comprising a first matching circuit portion disposed on the second support member and electrically coupled to the sixth side portion and the third corner portion, the first matching circuit portion inducing a second surface current having a second phase opposite to a first phase of a first surface current induced in the first housing, the second housing, and the hinge structure when the electronic device is in a folded state in which the first housing and the second housing are folded with each other about the hinge structure as a central axis.

12. In paragraph 11, An electronic device wherein the second parasitic resonance formed by the second surface current changes the frequency band of the first parasitic resonance induced by the first surface current.

13. In paragraph 11, An electronic device further comprising a first grounding member electrically grounding the fourth side portion to the second support member.

14. In paragraph 11, An electronic device further comprising a first connecting portion electrically connecting the fourth side portion and the first edge portion.

15. In paragraph 14, An electronic device, wherein the first connecting member comprises a first switch disposed on the second supporting member.

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