Preparation method for display panel, and display panel and display apparatus

Abstract

A preparation method for a display panel, and a display panel and a display apparatus. The preparation method for a display panel comprises: performing deposition on a substrate to form an insulating layer; performing deposition on the side of the insulating layer that is away from the substrate, so as to form a wiring layer; etching the wiring layer that is located in a non-display area and part of the insulating layer, so as to form at least two area isolation columns close to the boundary between a display area and the non-display area; performing deposition on the side of the wiring layer that is away from the substrate, so as to form a planarization layer, and removing the part of the planarization layer that is located in the non-display area, so as to form a first intermediate structure; performing deposition on the side of the first intermediate structure that is away from the substrate, so as to form a barrier material layer, coating a photoresist, and then providing a first mask to perform an etching process; etching the barrier material layer, so as to form a barrier structure on the part of the first intermediate structure that is located in the display area; and removing the first mask, and providing a second mask to perform the etching process, so as to remove the barrier material layer of the first intermediate structure that is located in the non-display area.

Description

Display panel manufacturing method, display panel and display device Technical Field

[0001] The present application relates to the field of display technology, and in particular to a preparation method, a display panel, and a display device. Background Art

[0002] In related technologies, with the development of display technology, the application scope of displays is becoming increasingly broad. As displays are used in various life scenarios, people's requirements for displays are also increasing, and higher requirements are being placed on the display's color gamut, viewing angle, contrast, response, power consumption and other performance.

[0003] Currently, the structure of organic light-emitting diode (OLED) devices is mainly a single-layer light-emitting material (Single EL) device structure. However, as customers' requirements for the lifespan and power consumption of medium and large-sized products are becoming increasingly stringent, the current single-layer light-emitting material devices can no longer meet the needs of long life and low power consumption. Therefore, the advantages of double-layer light-emitting material devices are gradually becoming apparent. Double-layer light-emitting material devices are equivalent to two layers of light-emitting material connected in series, which greatly improves the luminous efficiency of the device, thereby extending the service life and reducing power consumption. However, the charge generation layer (CGL) in the double-layer light-emitting material device has strong lateral conductivity. In order to avoid crosstalk between the RGB pixels, a partition structure needs to be set between the pixels to reduce crosstalk between pixels, thereby improving the display effect of the product.

[0004] However, the provision of the partition structure may easily cause packaging failure in the non-luminous area of ​​the display panel.

[0005] Summary of the Invention

[0006] According to a first aspect of an embodiment of the present application, a method for manufacturing a display panel is provided. The display panel includes a display area and a non-display area, wherein the display area is adjacent to the non-display area and at least partially surrounds the non-display area; the display panel located in the display area is configured to perform a light-emitting function; and the manufacturing method includes:

[0007] providing a substrate;

[0008] Depositing an insulating layer on the substrate; depositing a wiring layer on a side of the insulating layer away from the substrate; and etching the wiring layer and a portion of the insulating layer located in the non-display area in the thickness direction of the display panel to form at least two regional isolation pillars; the regional isolation pillars are also located close to the boundary between the display area and the non-display area;

[0009] Depositing a planar layer on a side of the wiring layer away from the substrate, and removing a portion of the planar layer located in the non-display area to form a first intermediate structure;

[0010] Depositing a partition material layer on a side of the first intermediate structure away from the substrate, and coating a photoresist on a side of the first intermediate structure away from the substrate; after coating the photoresist, providing a first mask; performing an etching process using the first mask to etch the partition material layer to form a partition structure at a portion of the first intermediate structure located in the display area; the partition structure is used to isolate current crosstalk between the light-emitting layers;

[0011] After forming the partition structure, the first mask is removed, and a second mask is set on a side of the first intermediate structure away from the substrate; an etching process is performed through the second mask to remove the partition material layer of the first intermediate structure located in the non-display area.

[0012] According to the above embodiment, since the partition material layer remaining on the surface of the regional isolation column is removed by the etching process using the second mask, the partition material layer can be prevented from affecting the etching effect on the surface of the regional isolation column, so that the etching amount meets the preset value. Furthermore, the problem of water vapor entering the display panel due to packaging failure at the regional isolation column can be avoided.

[0013] Moreover, by setting a second mask for the etching process, it is possible to avoid using a lateral etching gas to remove the partition material layer remaining on the surface of the regional isolation column. Thus, the partition material layer remaining on the surface of the regional isolation column can be removed while avoiding damage to the partition structure. Furthermore, it is possible to avoid damaging the partition structure while avoiding the problem of packaging failure of the display panel at the regional isolation column, which causes water vapor to enter the display panel.

[0014] In some embodiments, forming the partition structure at a portion of the first intermediate structure located in the display area further comprises:

[0015] The partition material layer of the first intermediate structure located in the display area is etched through the first mask to form the partition structure in the first intermediate structure located in the display area.

[0016] In some embodiments, removing the partition material layer on the surface of the first intermediate structure located in the non-display area further includes:

[0017] The first mask is removed, and a second mask is set on a side of the first intermediate structure away from the substrate; an etching process is performed on a portion of the first intermediate structure located in the non-display area using the second mask to remove the partition material layer on a surface of the first intermediate structure located in the non-display area.

[0018] In some embodiments, forming the partition structure at a portion of the first intermediate structure located in the display area further comprises:

[0019] An etching process is performed on the surface of the first intermediate structure away from the substrate through the first mask to form the partition structure on the portion of the first intermediate structure located in the display area, and partially remove the partition material layer on the surface of the first intermediate structure located in the non-display area.

[0020] In some embodiments, removing the partition material layer on the surface of the first intermediate structure located in the non-display area further includes:

[0021] The first mask is removed, and a second mask is set on a side of the first intermediate structure away from the substrate; an etching process is performed on a portion of the first intermediate structure located in the non-display area using the second mask to remove the remaining partition material layer on the surface of the first intermediate structure located in the non-display area.

[0022] In some embodiments, the routing layer comprises a metal material;

[0023] After removing the partition material layer on the surface of the first intermediate structure located in the non-display area, the method further includes:

[0024] Performing a wet etching process to form a first electrode on a side of the planar layer away from the substrate, the first electrode being used to electrically connect to the light-emitting layer of the display panel; and etching the metal portion of the region isolation column so that the metal portion of the region isolation column forms a three-layer structure in the thickness direction of the display panel;

[0025] The three-layer structure includes a first layer, a second layer and a third layer, the second layer is located between the first layer and the third layer, and the third layer is located on the side of the second layer close to the substrate; the width of the second layer is smaller than the width of the first layer and the third layer.

[0026] In some embodiments, during a wet etching process, the material of the second layer is corroded at a faster rate than the materials of the first layer and the third layer.

[0027] In some embodiments, the width of the first layer is greater than or equal to 0.5 micrometers.

[0028] In some embodiments, a minimum distance from a junction of the first layer and the second layer to an edge of the first layer is greater than or equal to 0.25 micrometers.

[0029] In some embodiments, the display panel includes a light-emitting layer; the light-emitting layer includes at least two layers of light-emitting materials.

[0030] According to a second aspect of an embodiment of the present application, a display panel is provided, which is formed using any of the above-mentioned methods for preparing a display panel.

[0031] According to a third aspect of the embodiments of the present application, a display device is provided, comprising the aforementioned display panel.

[0032] It should be understood that the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present application and, together with the description, serve to explain the principles of the present application.

[0034] FIG1 is a schematic diagram of a display panel according to an embodiment of the present application.

[0035] FIG2 is a flow chart of a method for manufacturing a display panel according to an embodiment of the present application.

[0036] FIG3 is a schematic structural diagram of a first intermediate structure according to an embodiment of the present application.

[0037] FIG4 shows another intermediate structure according to an embodiment of the present application.

[0038] FIG5 shows another intermediate structure according to an embodiment of the present application.

[0039] FIG6 shows another intermediate structure according to an embodiment of the present application.

[0040] FIG. 7 shows another intermediate structure according to an embodiment of the present application. DETAILED DESCRIPTION

[0041] Exemplary embodiments will be described in detail herein, with examples illustrated in the accompanying drawings. In the following description, when referring to the drawings, identical numerals in different figures represent identical or similar elements, unless otherwise indicated. The embodiments described in the following exemplary embodiments are not intended to represent all embodiments consistent with the present application. Rather, they are merely examples of apparatus and methods consistent with certain aspects of the present application, as detailed in the appended claims.

[0042] In existing display technologies, in order to meet the requirements of long life and low power consumption, it is necessary to use a stacked display technology in the display panel, that is, to make the light-emitting layer of the display panel include a double layer of light-emitting material, or more layers of light-emitting material. When providing a double layer of light-emitting material, or more layers of light-emitting material, the light-emitting materials of different layers need to be connected to each other through a charge generation layer. Since the charge generation layer has strong lateral conductivity, it is easy to cause crosstalk of current between pixels, affecting the light-emitting display of the pixels. In order to avoid crosstalk of current between pixels, it is necessary to form a partition structure in the display area of ​​the display panel. Therefore, after forming the flat layer, it is necessary to deposit a partition material on the surface of the intermediate structure, apply photoresist, and then set a mask to form a partition structure through an etching process.

[0043] However, since the partition material layer is formed by depositing a whole layer of partition material, and the etching glue is applied as a whole layer, the portion of the intermediate structure located in the non-display area will also have a partition material layer and etching glue. When forming the partition structure, the portion of the intermediate structure located in the display area is mainly etched. Therefore, after the partition structure is formed, the portion of the intermediate structure located in the non-display area will still retain the partition material layer. Therefore, the surface of the regional isolation column located in the non-display area will also retain the partition material layer. When the surface of the regional isolation column is subsequently etched, the remaining partition material layer will be etched first, and then the regional isolation column will be etched, thereby affecting the etching effect on the surface of the regional isolation column, so that the etching amount does not reach the preset value, and further, the display panel is prone to packaging failure at the regional isolation column, resulting in water vapor entering the display panel.

[0044] An embodiment of the present application provides a method for manufacturing a display panel. FIG1 shows a schematic diagram of a display panel 10. As shown in FIG1 , the display panel 10 includes a display area 102 and a non-display area 101. The display area 102 is adjacent to the non-display area 101 and at least partially surrounds the non-display area 101. The display panel 10 in the display area 102 is configured to emit light.

[0045] Fig. 2 is a flow chart of the method for manufacturing the display panel. As shown in Fig. 2 , the method for manufacturing the display panel includes steps S110 to S140.

[0046] In step S110, a substrate 110 is provided. An insulating layer 120 is deposited on the substrate 110. A wiring layer 130 is deposited on the side of the insulating layer 120 facing away from the substrate 110. The wiring layer 130 and a portion of the insulating layer 120 located in the non-display area 1101 are etched in the thickness direction of the display panel 10 to form at least two regional isolation pillars 140. The regional isolation pillars 140 are also located near the boundary between the display area 102 and the non-display area 101.

[0047] Specifically, referring to FIG. 1 , the non-display area 101 further includes a barrier area 1012 and a hollow area 1011. The barrier area 1012 surrounds the hollow area 1011 and is located between the hollow area 1011 and the display area 102. The regional isolation pillars 140 are located in the barrier area 1012. During the encapsulation process, the structures within the barrier area 1012 are encapsulated together with the structures within the display area 102. The regional isolation pillars 140 are used to improve the encapsulation reliability of the display panel 10 after the encapsulation layer is subsequently formed, thereby preventing defects caused by moisture entering the display panel 10 due to encapsulation failure.

[0048] The portion located in the hollow area 1011 is removed in a subsequent process to form a hollow structure in the hollow area 1011 .

[0049] Furthermore, the insulating layer 120 may include an interlayer dielectric layer, a gate insulating layer, a buffer layer, etc. Etching a portion of the insulating layer 120 may include etching the interlayer dielectric layer and a portion of the gate insulating layer, but is not limited thereto. The amount of etching the insulating layer 120 may be adjusted according to actual needs.

[0050] It should be noted that the ranges of the display area 102, the blocking area 1012 and the hollow area 1011 in the figure are only schematic, and their specific ranges can be flexibly set on the basis of satisfying the relative relationship between the aforementioned display area 102, the blocking area 1012 and the hollow area 1011.

[0051] In step S120 , a planarization layer 150 is deposited on a side of the wiring layer 130 away from the substrate 110 , and a portion of the planarization layer 150 located in the non-display area 101 is removed to form a first intermediate structure 103 .

[0052] FIG3 is a schematic structural diagram of the first intermediate structure 103 . The structures formed in the aforementioned steps may refer to the contents shown in FIG3 .

[0053] In step S130, a partition material layer 160 is deposited on the side of the first intermediate structure 103 facing away from the substrate 110, and a photoresist PR is applied to the side of the first intermediate structure 103 facing away from the substrate 110. After applying the photoresist PR, a first mask M1 is provided. An etching process is performed using the first mask M1 to etch the partition material layer 160, thereby forming a partition structure in the portion of the first intermediate structure 103 located in the display area 102. The partition structure is used to block current crosstalk between the light-emitting layers.

[0054] Referring to another intermediate structure shown in FIG. 4 , this is an intermediate structure obtained by depositing a partition material layer 160 on the first intermediate structure 103 , coating a photoresist PR, and setting a first mask M1 .

[0055] Specifically, the etching process performed using the first mask M1 can involve exposing and developing the partition material layer 160 coated with the photoresist PR, and then injecting a vertical etching gas for etching. The material of the partition material layer 160 can include, but is not limited to, silicon nitride. The vertical etching gas is a gas that is highly corrosive in the thickness direction of the display panel, i.e., in the first direction Z shown in the figure. By injecting the vertical etching gas, the partition material layer 160 can be etched into a partition structure.

[0056] This raises another question. Referring to FIG. 5 , regarding another intermediate structure, the barrier material layer 160 is deposited on the surface of the first intermediate structure 103 away from the substrate 110. Consequently, at the area isolation pillars 140, a portion of the deposited barrier material layer 160 extends along the surface of the area isolation pillars 140 in the first direction Z. However, since the etching gas is injected vertically, even if the etching gas is injected simultaneously into both the non-display area 101 and the display area 102, this portion of the barrier material layer 160 extending along the first direction Z cannot be effectively etched. Consequently, a considerable portion of the barrier material layer 160 remains on the side surfaces of the area isolation pillars 140. This is the barrier material layer 160 remaining on the surface of the area isolation pillars 140 mentioned above.

[0057] In order to address the above problem, if lateral etching gas is filled in at this time, although the isolation material layer 160 remaining on the surface of the regional isolation column 140 can be removed, it will also corrode the side of the isolation structure, thereby affecting the isolation effect of the isolation structure on the current crosstalk between the light-emitting layers.

[0058] In step S140, after forming the partition structure, the first mask M1 is removed, and a second mask M2 is placed on a side of the first intermediate structure 103 away from the substrate 110. An etching process is performed using the second mask M2 to remove the partition material layer 160 in the portion of the first intermediate structure 103 located in the non-display area 101.

[0059] After setting the second mask M2, an etching process is performed using the second mask M2 to remove the partitioning material layer 160 located in the non-display area 101 of the first intermediate structure 103, that is, to remove the partitioning material layer 160 remaining on the surface of the regional isolation pillars 140. The etching process performed using the second mask M2 can be a photolithography process. Because the etching process performed using the second mask M2 removes the partitioning material layer 160 remaining on the surface of the regional isolation pillars 140, the partitioning material layer 160 is prevented from affecting the etching effect on the surface of the regional isolation pillars 140, ensuring that the etching amount meets the preset value. Furthermore, the problem of water vapor entering the display panel due to packaging failure at the regional isolation pillars 140 can be avoided.

[0060] Furthermore, by setting a second mask M2 for the etching process, it is possible to avoid using a lateral etching gas to remove the partition material layer 160 remaining on the surface of the regional isolation column 140. Thus, the partition material layer 160 remaining on the surface of the regional isolation column 140 can be removed while avoiding damage to the partition structure. Furthermore, it is possible to avoid damaging the partition structure while avoiding the problem of packaging failure of the display panel at the regional isolation column 140, which causes water vapor to enter the display panel.

[0061] In some embodiments, referring to the schematic diagram of another intermediate structure shown in FIG6 , a partition structure is formed in the portion of the first intermediate structure 103 located in the display area 102 , further comprising:

[0062] The partition material layer 160 of the portion of the first intermediate structure 103 located in the display area 102 is etched through the first mask M1 to form a partition structure in the portion of the first intermediate structure 103 located in the display area 102 .

[0063] Because, when setting the first mask M1, only the partitioning material layer 160 of the first intermediate structure 103 located in the display area 102 is etched, while the partitioning material layer 160 of the first intermediate structure 103 located in the non-display area 101 is not etched, the partitioning material layer 160 located in the non-display area 101 remains intact. The intact partitioning material layer 160 has a larger structure, and the larger partitioning material layer 160 facilitates the design of the second mask M2. The partitioning material layer 160 located in the non-display area 101 is etched through the second mask M2. This reduces the difficulty of designing the second mask M2, and further reduces the difficulty of the process, thereby reducing process costs.

[0064] In some embodiments, as shown in FIG6 , removing the partition material layer 160 on the surface of the first intermediate structure 103 located in the non-display area 101 further includes:

[0065] The first mask M1 is removed, and a second mask M2 is placed on a side of the first intermediate structure 103 away from the substrate 110. An etching process is performed on the portion of the first intermediate structure 103 located in the non-display area 101 using the second mask M2 to remove the partition material layer 160 on the surface of the first intermediate structure 103 located in the non-display area 101.

[0066] Because in the previous steps, only the partition material layer 160 of the first intermediate structure 103 located in the display area 102 was etched, while the partition material layer 160 of the first intermediate structure 103 located in the non-display area 101 was not etched. Therefore, the partition material layer 160 located in the non-display area 101 remains intact. The intact partition material layer 160 has a larger structure, and the larger partition material layer 160 is easier to etch. Therefore, the difficulty of designing the second mask M2 and the difficulty of etching the partition material layer 160 can be reduced. In turn, the process difficulty can be further reduced, thereby further reducing the process cost.

[0067] In some embodiments, referring to FIG. 5 , a partition structure is formed in the portion of the first intermediate structure 103 located in the display area 102 , further comprising:

[0068] An etching process is performed on the surface of the first intermediate structure 103 away from the substrate 110 using the first mask M1 to form a partition structure on the portion of the first intermediate structure 103 located in the display area 102 and partially remove the partition material layer 160 on the surface of the first intermediate structure located in the non-display area 101.

[0069] Specifically, an etching process is performed on the surface of the first intermediate structure 103 away from the substrate 110 through the first mask M1, that is, after setting the first mask M1, the isolation material layer 160 on the surface of the first intermediate structure 103 located in the display area 102 and the non-display area 101 is simultaneously etched through the first mask M1.

[0070] By simultaneously etching the partition material layer 160 on the surfaces of the first intermediate structure 103 located in the display area 102 and the non-display area 101, the portion of the partition material layer 160 located in the non-display area 101 can be etched first while etching to form the partition structure. Therefore, before subsequently setting the second mask M2, the portion of the partition material layer 160 located in the non-display area 101 can be etched once, and then, the portion of the partition material layer 160 that is difficult to etch that remains on the surface of the regional isolation column 140 can be left. The second mask M2 can be specifically designed according to these difficult-to-etch portions to more thoroughly remove the portion of the partition material layer 160 that is difficult to etch that remains on the surface of the regional isolation column 140.

[0071] In some embodiments, as shown in FIG5 , removing the partition material layer on the surface of the first intermediate structure 103 located on the non-display area 101 further includes:

[0072] The first mask M1 is removed, and a second mask M2 is placed on a side of the first intermediate structure 103 away from the substrate 110. An etching process is performed on the portion of the first intermediate structure 103 located in the non-display area 101 using the second mask M2 to remove the remaining partition material layer 160 on the surface of the first intermediate structure 103 located in the non-display area 101.

[0073] By simultaneously etching the partitioning material layer 160 on the surfaces of the first intermediate structure 103 located in the display area 102 and the non-display area 101, the portion of the partitioning material layer 160 located in the non-display area 101 can be etched first while the partitioning structure is being formed. Thus, the portion of the partitioning material layer 160 located in the non-display area 101 can be etched once before the second mask M2 is subsequently set. Then, by setting the second mask M2, the portion of the partitioning material layer 160 located in the non-display area 101 is etched again to remove the portion of the partitioning material layer 160 remaining on the surface of the regional isolation column 140 that is difficult to etch. This allows for more thorough removal of the portion of the partitioning material layer 160 remaining on the surface of the regional isolation column 140 that is difficult to etch.

[0074] In some embodiments, referring to another intermediate structure shown in FIG. 7 , the routing layer 130 includes a metal material.

[0075] After removing the partition material layer 160 on the surface of the first intermediate structure 103 located in the non-display area 101, the method further includes:

[0076] A wet etching process is performed to form a first electrode on the side of the planar layer 150 away from the substrate 110. The first electrode is used to electrically connect to the light-emitting layer of the display panel. The metal portion 141 of the region isolation column 140 is also etched, forming a three-layer structure along the thickness direction of the display panel.

[0077] Specifically, after etching the portion of the wiring layer 130 located in the non-display area 101 , the metal portion 141 of the area isolation column 140 is formed.

[0078] The three-layer structure includes a first layer 142, a second layer 143, and a third layer 144. The second layer 143 is located between the first layer 142 and the third layer 144. The third layer 144 is located on the side of the second layer 143 close to the substrate 110. The width of the second layer 143 is smaller than that of the first layer 142 and the third layer 144.

[0079] Specifically, the routing layer 130 itself includes three metal layers. Therefore, the metal portion 141 of the area isolation pillar 140 also includes three metal layers. The three-layer structure formed by the wet etching process specifically refers to a three-layer structure described below in which the width of the second layer 143 is smaller than the widths of the first layer 142 and the third layer 144.

[0080] By forming the metal part 141 into a three-layer structure in which the width of the second layer 143 is smaller than the widths of the first layer 142 and the third layer 144, the regional isolation column 140 after forming the structure can improve the packaging reliability of the display panel 10 located in the barrier area 1012 after the subsequent formation of the packaging layer, thereby avoiding defects caused by packaging failure and water vapor entering the display panel 10.

[0081] In some embodiments, during a wet etching process, the material of the second layer 143 is eroded at a faster rate than the materials of the first layer 142 and the third layer 144 .

[0082] Specifically, the material used for the first layer 142 and the third layer 144 may include titanium, and the material used for the second layer 143 may include lithium, but the present invention is not limited thereto.

[0083] Since the material used in the second layer 143 is corroded at a higher rate than the materials used in the first layer 142 and the third layer 144, a recessed structure can be formed on the side of the metal part 141, that is, on the surface of the metal part 141 in the second direction Z. Thus, a three-layer structure can be formed in which the width of the second layer 143 is smaller than the width of the first layer 142 and the third layer 144. Furthermore, the packaging reliability of the display panel 10 in the barrier area 1012 can be improved to avoid defects caused by water vapor entering the display panel 10 due to packaging failure.

[0084] In some embodiments, as shown in FIG. 7 , the width of the first layer 142 is greater than or equal to 0.5 micrometers.

[0085] Specifically, the width of the first layer 142 is greater than or equal to 0.5 micrometers, that is, the width L1 in FIG. 7 is greater than or equal to 0.5 micrometers.

[0086] This configuration can improve the packaging reliability of the portion of the display panel 10 located in the barrier area 1012 , thereby preventing defects caused by moisture entering the display panel 10 due to packaging failure.

[0087] In some embodiments, as shown in FIG. 7 , the minimum distance from the boundary between the first layer 142 and the second layer 143 to the edge of the first layer 142 is greater than or equal to 0.25 micrometers.

[0088] Specifically, the minimum distance from the boundary between the first layer 142 and the second layer 143 to the edge of the first layer 142 is greater than or equal to 0.25 micrometers, that is, the width L2 in FIG. 7 is greater than or equal to 0.25 micrometers.

[0089] The inventors have discovered through experiments that ensuring width L2 is greater than or equal to 0.25 microns effectively ensures the packaging reliability of the portion of the display panel 10 located in the barrier region 1012. If width L2 is less than 0.25 microns, the probability of packaging failure gradually increases, with a higher probability of packaging failure occurring at a width L2 of 0.2 microns. This effectively prevents defects caused by moisture entering the display panel 10 due to packaging failure.

[0090] In some embodiments, the display panel 10 includes a light emitting layer, which includes at least two layers of light emitting materials.

[0091] When the light-emitting layer includes at least two layers of light-emitting material, the light-emitting materials of different layers need to be interconnected through a charge generation layer. Because the charge generation layer has strong lateral conductivity, it can easily cause crosstalk between pixel currents, affecting the pixel's luminous display. To prevent crosstalk between pixel currents, a partitioning material layer 160 is deposited and etched in the display area 102 of the display panel to form a partitioning structure. The need for a partitioning structure is even greater when the light-emitting layer includes at least two layers of light-emitting material.

[0092] Therefore, when the light-emitting layer includes at least two layers of light-emitting materials, the above-mentioned method for preparing the display panel can prevent the partition material layer 160 from affecting the etching effect on the surface of the regional isolation column 140, so that the etching amount meets the preset value. Therefore, the problem of packaging failure of the display panel at the regional isolation column 140 causing water vapor to enter the display panel can be avoided.

[0093] The present application also provides a display panel formed using any of the above-mentioned display panel preparation methods.

[0094] The present application also provides a display device, comprising the aforementioned display panel.

[0095] The above embodiments of the present application can complement each other if no conflict occurs.

[0096] It should be noted that in the accompanying drawings, the sizes of layers and regions may be exaggerated for clarity of illustration. It will also be understood that when an element or layer is referred to as being "on" another element or layer, it may be directly on the other element, or there may be an intermediate layer. In addition, it will be understood that when an element or layer is referred to as being "under" another element or layer, it may be directly under the other element, or there may be more than one intermediate layer or element. In addition, it will also be understood that when a layer or element is referred to as being "between" two layers or elements, it may be the only layer between the two layers or elements, or there may also be more than one intermediate layer or element. Similar reference numerals throughout the text indicate similar elements.

[0097] The term "plurality" refers to two or more than two, unless expressly limited otherwise.

[0098] Those skilled in the art will readily appreciate other embodiments of the present application after considering the specification and practicing the disclosure disclosed herein. This application is intended to cover any variations, uses, or adaptations of the present application that follow the general principles of the present application and include common knowledge or customary techniques in the art not disclosed herein. The description and examples are to be considered as exemplary only, and the true scope and spirit of the present application are indicated by the following claims.

[0099] It should be understood that the present application is not limited to the exact structures described above and shown in the drawings, and that various modifications and changes may be made without departing from the scope thereof. The scope of the present application is limited only by the appended claims.

Claims

1. A method for preparing a display panel, wherein: The display panel comprises a display area and a non-display area, the display area is adjacent to the non-display area, and the display area at least partially surrounds the non-display area; the display panel located in the display area is used to perform a light-emitting function; and the preparation method comprises: providing a substrate; Depositing an insulating layer on the substrate; depositing a wiring layer on a side of the insulating layer away from the substrate; and etching the wiring layer and a portion of the insulating layer located in the non-display area in the thickness direction of the display panel to form at least two regional isolation columns; the regional isolation columns are also close to the junction of the display area and the non-display area; Depositing a flat layer on a side of the wiring layer away from the substrate, and removing a portion of the flat layer located in the non-display area to form a first intermediate structure; Depositing a partition material layer on the side of the first intermediate structure away from the substrate, and coating a photoresist on the side of the first intermediate structure away from the substrate; after coating the photoresist, setting a first mask; performing an etching process through the first mask to etch the partition material layer to form a partition structure at the portion of the first intermediate structure located in the display area; the partition structure is used to isolate current crosstalk between light-emitting layers; After forming the partition structure, the first mask is removed, and a second mask is arranged on a side of the first intermediate structure away from the substrate; an etching process is performed through the second mask to remove the partition material layer of the first intermediate structure located in the non-display area.

2. The method for preparing a display panel according to claim 1, characterized in that: The partition structure is formed at a portion of the first intermediate structure located in the display area, further comprising: The partition material layer of the first intermediate structure located in the display area is etched through the first mask to form the partition structure in the first intermediate structure located in the display area.

3. The method for preparing a display panel according to claim 2, characterized in that: Removing the partition material layer on the surface of the first intermediate structure located in the non-display area further includes: The first mask is removed, and a second mask is disposed on a side of the first intermediate structure away from the substrate; an etching process is performed on a portion of the first intermediate structure located in the non-display area through the second mask to remove the partition material layer on a surface of the first intermediate structure located in the non-display area.

4. The method for preparing a display panel according to claim 1, characterized in that: The partition structure is formed at a portion of the first intermediate structure located in the display area, further comprising: An etching process is performed on the surface of the first intermediate structure away from the substrate through the first mask to form the partition structure on the portion of the first intermediate structure located in the display area, and partially remove the partition material layer on the surface of the first intermediate structure located in the non-display area.

5. The method for preparing a display panel according to claim 4, characterized in that: Removing the partition material layer on the surface of the first intermediate structure located in the non-display area further includes: The first mask is removed, and a second mask is set on a side of the first intermediate structure away from the substrate; an etching process is performed on a portion of the first intermediate structure located in the non-display area using the second mask to remove the remaining partition material layer on the surface of the first intermediate structure located in the non-display area.

6. The method for preparing a display panel according to claim 1, characterized in that: The routing layer includes a metal material; After removing the partition material layer on the surface of the first intermediate structure located in the non-display area, the method further includes: Performing a wet etching process to form a first electrode on a side of the planar layer away from the substrate, wherein the first electrode is used to be electrically connected to the light-emitting layer of the display panel; and etching the metal portion of the region isolation column so that the metal portion of the region isolation column forms a three-layer structure in the thickness direction of the display panel; The three-layer structure includes a first layer, a second layer and a third layer, the second layer is located between the first layer and the third layer, and the third layer is located on the side of the second layer close to the substrate; the width of the second layer is smaller than the width of the first layer and the third layer.

7. The method for preparing a display panel according to claim 6, characterized in that: During the wet etching process, the material used in the second layer is corroded at a higher speed than the materials used in the first layer and the third layer.

8. The method for preparing a display panel according to claim 7, characterized in that: The width of the first layer is greater than or equal to 0.5 micrometers.

9. The method for preparing a display panel according to claim 7, characterized in that: The minimum distance from the junction of the first layer and the second layer to the edge of the first layer is greater than or equal to 0.25 micrometers.

10. The method for manufacturing a display panel according to claim 1, characterized in that: The display panel includes a light-emitting layer; the light-emitting layer includes at least two layers of light-emitting materials.

11. A display panel, characterized in that: The display panel is formed by the method for preparing the display panel according to any one of claims 1 to 10.

12. A display device, characterized in that: Includes the display panel as claimed in claim 11.

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