Electronic device

Abstract

Provided is an electronic device capable of improving the cooling capacity of a heating element built in the electronic device, which is disposed in a plurality of orientations. A heat pipe (50) includes: heat dissipation parts (51) connected to heat sinks (61, 62); and a pipe lower part (52) which includes an outer surface (53) in contact with a heat transfer member (70), and which, when a device body (11) is in a vertical orientation, is positioned below the heat dissipation parts (51) and extends in a direction intersecting the vertical direction. The pipe lower part (52) includes an extension part (55) that extends outside the outer edge of the heat transfer member (70).

Description

electronic equipment

[0001] The present disclosure relates to electronic devices.

[0002] Electronic devices are sometimes used in a variety of positions. For example, the electronic device described in Patent Document 1 below can be used in both a vertical and horizontal position. A heat dissipation device including a heat pipe and a heat sink is used to cool a heat-generating element such as an IC chip built into the electronic device.

[0003] Japanese Patent Application Laid-Open No. 2021-158287

[0004] In recent years, there has been a demand for structures with higher cooling performance even in electronic devices that are arranged in multiple positions.

[0005] An object of the present disclosure is to provide an electronic device and a heat dissipation device that can improve the cooling capacity of a heat generating body built into the electronic device that is arranged in a plurality of positions.

[0006] An electronic device according to the present disclosure may include a substrate on which a heat generating element is mounted, a housing housing the substrate, a heat pipe housed in the housing and extending along the substrate, a heat sink housed in the housing and positioned above the heat generating element when the housing is in a first position, and a heat transfer member positioned between the heat generating element and the heat pipe and in contact with both. The heat pipe may include a heat dissipation portion connected to the heat sink and a lower pipe portion including an outer surface in contact with the heat transfer member, positioned below the heat dissipation portion when the housing is in the first position and extending in a direction intersecting the vertical direction. The lower pipe portion may include a tapered portion including a tip of the heat pipe and gradually tapering toward the tip, and an extension portion located outside the outer edge of the heat transfer member and extending to the tapered portion. A space may be provided on the opposite side of the lower pipe portion from the heat transfer member, with the outer surface of the extension portion exposed. This improves the cooling capacity of a heat generating element built into an electronic device that can be placed in a variety of positions.

[0007] An electronic device according to the present disclosure may include a substrate on which a heating element is mounted, a housing housing the substrate, a heat pipe housed in the housing and extending along the substrate, a heat sink housed in the housing and positioned above the heating element when the housing is in a first position, and a heat transfer member positioned between the heating element and the heat pipe and in contact with both the heating element and the heat pipe. The heat pipe may include a heat dissipation portion connected to the heat sink and a pipe lower portion having an outer surface in contact with the heat transfer member, positioned below the heat dissipation portion when the housing is in the first position, and extending in a direction intersecting the vertical direction. The pipe lower portion may include a heat receiving portion having an outer surface in contact with the heat transfer member and positioned inside the outer edge of the heat transfer member, and an extension portion positioned between the heat receiving portion and the heat dissipation portion, and positioned below the heat receiving portion when the housing is in the first position. This improves the cooling capacity of a heat generating element built into an electronic device that can be placed in a variety of positions.

[0008] 3B is a cross-sectional view of a heat pipe taken along a line VB-VB in FIG. 3B; FIG. 4 is a cross-sectional view of a heat pipe incorporated in an electronic device according to another embodiment; and FIG. 5 is a cross-sectional view of a heat pipe incorporated in an electronic device according to another embodiment.

[0009] Hereinafter, an electronic device 10, which is an example of an electronic device proposed in the present disclosure, will be described with reference to the drawings. Fig. 1A is a perspective view showing the electronic device 10 in a vertical position (first position). Fig. 1B is a perspective view showing the electronic device 10 in a horizontal position (second position). In the following description, the arrow G shown in each figure indicates the direction in which gravity acts, and is referred to as the gravity direction G.

[0010] 1. Overview of Electronic Device The electronic device 10 may be a computer such as a game device, a personal computer, or a server computer. As shown in Figures 1A and 1B, the electronic device 10 may have a device main body 11 and a first cover 12 and a second cover 13 that cover the device main body 11. The first cover 12 and the second cover 13 may be sized to cover the entire device main body 11, as shown in Figures 1A and 1B, or may be sized to cover only a portion of the device main body 11.

[0011] 2 is an exploded perspective view showing some of the components of the device main body 11. In the following description, the X1 and X2 directions of the X axis shown in FIG. 2 and elsewhere are defined as the rightward and leftward directions, respectively. The Y1 and Y2 directions of the Y axis perpendicular to the X axis are defined as the forward and backward directions, respectively. The Z1 and Z2 directions of the Z axis perpendicular to the X and Y axes are defined as the upward and downward directions, respectively. However, these directions are defined to explain the shapes and relative positional relationships of the elements (components, members, and sections) of the electronic device 10, and do not limit the orientation of the electronic device 10 relative to the installation surface, such as a desk or floor.

[0012] The device body 11 may be a box-shaped housing. The device body 11 may have a first case 14 shown in FIG. 2 that forms the outer surface of the housing, and a second case (not shown) that also forms part of the outer surface. As shown in FIG. 2, the device body 11 may also have a circuit board 20, a heat dissipation device 30, and a power supply device 40. The circuit board 20, the heat dissipation device 30, and the power supply device 40 may be housed inside the box-shaped housing formed by the first case 14 and the second case.

[0013] The electronic device 10 may be placed on an installation surface such as a desk or floor in a vertical position (first position) shown in FIG. 1A or a horizontal position (second position) shown in FIG. 1B . The vertical position is, for example, a position in which the circuit board 20 housed inside the device body 11 stands upright relative to the installation surface. The horizontal position is, for example, a position in which the circuit board 20 housed inside the device body 11 is disposed along the installation surface. When the electronic device 10 is in the vertical position shown in FIG. 1A , the circuit board 20 may be disposed along the direction of gravity G. When the electronic device 10 is in the vertical position shown in FIG. 1A , the direction of the X-axis shown in FIG. 2 and the like may coincide with the direction of gravity G. For this reason, the X1 direction and X2 direction shown in FIG. 2 and the like may also be referred to as the upward and downward directions.

[0014] As shown in Fig. 2, an electronic component that generates heat may be mounted on the circuit board 20. For example, an IC chip 21 may be mounted on the circuit board 20 as the heat generating element. The IC chip 21 may be a flat semiconductor such as silicon called a die. The IC chip 21 may be a chip such as an SoC that integrates a CPU (Central Processing Unit), a GPU (Graphics Processing Unit), and I / O functions. The IC chip 21 may also include memory functions such as a ROM (Read Only Memory) and a RAM (Random Access Memory).

[0015] The heat dissipation device 30 is for cooling the IC chip 21, which is a heat generating body, and may be in contact with the IC chip 21. As shown in Fig. 2, the heat dissipation device 30 may be disposed above the IC chip 21 (in the direction indicated by Z1 in Fig. 2).

[0016] The circuit board 20 may be housed inside a circuit board shield (not shown) made of a conductive material such as iron or aluminum. An opening that exposes the IC chip 21 may be formed in the circuit board shield, and the heat dissipation device 30 may be connected to the IC chip 21 inside this opening. In the example shown in Fig. 2, the circuit board shield has a shield plate 80 with an opening H1 formed in a part thereof, and the heat dissipation device 30 may be in contact with the IC chip 21 inside this opening H1.

[0017] The power supply device 40 may use current supplied from an external power source to supply drive power to various components included in the device body 11, such as the IC chip 21. The power supply device 40 may have a case 41. A circuit board 42 (see FIG. 4) having a transformer, a rectifier circuit, etc. may be housed inside the case 41. As shown in FIG. 2, the power supply device 40 may be disposed above the IC chip 21 and a plurality of heat pipes 50 (described later) (in the direction indicated by Z1 in FIG. 2).

[0018] [2. Overview of Heat Dissipation Device] Fig. 3A is a plan view of the heat dissipation device 30. Fig. 3B is a side view of the heat dissipation device 30, looking at the heat dissipation device 30 in the direction of arrow L in Fig. 3A. Fig. 4 is a cross-sectional view of the circuit board 20, the heat dissipation device 30, and the power supply device 40. Fig. 4 is a cross-section of the electronic device 10 incorporating the heat dissipation device 30 shown in Fig. 3A, taken along a cut plane including line IV-IV in Fig. 3A.

[0019] 3A, the heat dissipation device 30 may include a plurality of rod-shaped heat pipes 50 (50A to 50E), heat sinks 61 and 62, and a heat transfer member 70. These members may be made of metals with high thermal conductivity such as aluminum or copper, or may be made of iron.

[0020] The heat pipes 50 and the heat transfer member 70 may be used to transfer heat from the IC chip 21, which is a heat-generating body, to the heat sinks 61 and 62. As shown in Fig. 4, the heat transfer member 70 may be located between the IC chip 21 and the heat pipes 50 and may be in contact with both the IC chip 21 and the heat pipes 50. The heat pipes 50 may be connected to one or both of the heat sinks 61 and 62. This allows the heat from the IC chip 21 to be transferred to the heat sinks 61 and 62 via the heat transfer member 70 and the heat pipes 50.

[0021] The heat sinks 61 and 62 may be thermally connected to the IC chip 21, which is a heat-generating body, via the heat transfer member 70 and the heat pipe 50. The heat sinks 61 and 62 may include a plurality of heat dissipation fins. This allows the heat from the IC chip 21, which is transferred via the heat transfer member 70 and the heat pipe 50, to be efficiently dissipated to the outside of the electronic device 10, etc. As shown in FIG. 3A , when the device main body 11 (housing) is in a vertical position (first position), the heat sinks 61 and 62 may be disposed above (in the direction indicated by X1 in FIG. 3A ) the IC chip 21, which is a heat-generating body (see FIG. 4 ), and the heat transfer member 70 in contact therewith.

[0022] 2, each of the multiple heat pipes 50 (50A to 50E) may extend along the circuit board 20. Also, as shown in FIG. 3A, each heat pipe 50 may have a heat dissipation portion 51 connected to a heat sink 61 or a heat sink 62. The outer surface of the heat dissipation portion 51 may be in contact with the fins of the heat sink 61 or the heat sink 62. The heat dissipation portion 51 may be located between the fins located at one end and the fins located at the other end of the heat sink 61 (or the heat sink 62).

[0023] Each heat pipe 50 may have a lower pipe portion 52. When the device main body 11, which is the housing, is in a vertical position (first position), the lower pipe portion 52 may be located below the heat dissipation portion 51 (in the direction indicated by X2 in FIG. 3A ) and may extend in a direction intersecting the up-down direction (indicated by the X-axis in FIG. 3A ). As shown in FIG. 4 , the lower pipe portion 52 of each heat pipe 50 may have an outer surface 53 in contact with the heat transfer member 70.

[0024] Figure 5A is an enlarged view of the heat pipe 50 (heat pipe 50C shown in Figure 3A) and heat transfer member 70 in the cross-sectional view of Figure 4. Figure 5B is a cross-sectional view of the heat pipe 50 (heat pipe 50C shown in Figure 3A) and the ...section including line VB-VB in Figure 3B. Figure 5A shows the device body 11 in a horizontal position. Figure 5B shows the device body 11 in a vertical position.

[0025] 4, 5A, and 5B, the lower pipe portion 52 of each heat pipe 50 may include a tip portion E of the heat pipe 50 and may have a tapered portion 54 that gradually tapers toward the tip portion E. The lower pipe portion 52 of each heat pipe 50 may have an extension portion 55 that is located outside the outer edge of the heat transfer member 70 and extends to the tapered portion 54. The cross-sectional area of ​​the extension portion 55 (the area of ​​a cross section perpendicular to the extension portion 55) may be substantially uniform.

[0026] 4, 5A, and 5B, the lower pipe portion 52 of each heat pipe 50 may include an outer surface 53 in contact with the heat transfer member 70 and may have a heat receiving portion 56 located inside the outer edge of the heat transfer member 70. When the device body 11 is in the vertical position (first position), the extension portion 55 of each heat pipe 50 may be located at the same position as the heat receiving portion 56 in the up-down direction (the direction indicated by the X axis in FIGS. 3A and 5B) or below the heat receiving portion 56. In the example shown in FIGS. 3A and 5B, the extension portion 55 is located at the same position as the heat receiving portion 56 in the up-down direction.

[0027] Furthermore, when the device body 11 is in a vertical position, the heat receiving portion 56 of each heat pipe 50 may extend in the direction indicated by the Y axis in each figure (a first direction intersecting the up-down direction indicated by the X axis in FIG. 5B ). Here, the extension portion 55 of each heat pipe 50 may include a portion extending from the heat receiving portion 56 in the front-to-rear direction (the left-to-right direction in FIG. 5B ) or in both the front-to-rear direction and a downward diagonal direction. In the example shown in FIG. 5B , the entire extension portion 55 extends forward (in the Y2 direction, or to the left in FIG. 5B ) from the heat receiving portion 56.

[0028] As shown in FIG. 4 , a space S may be provided on the opposite side of the heat transfer member 70 across the lower pipe portion 52 of each heat pipe 50, where the outer surface of the extension portion 55 of the heat pipe 50 is exposed. In the examples shown in FIGS. 3A and 4 , the extension portion 55 does not contact the heat sinks 61, 62. In the example shown in FIG. 4 , the power supply device 40 is disposed inside the device main body 11, which is a housing, and a space S is provided between the power supply device 40 and the extension portion 55. In the example shown in FIG. 4 , the extension portion 55 does not contact the power supply device 40. The extension portion 55 may be disposed away from all members and components housed in the device main body 11 and may not contact these members and components. This prevents the heat pipe 50 from being pressed by components and members, such as the power supply device 40, from the opposite side of the circuit board 20, thereby preventing external force from being applied to the circuit board 20.

[0029] 5A and 5B , each heat pipe 50 may have a sintered body layer 58 formed by sintering a powder of metal or the like laminated on the inner wall surface of a tube 50a, including the outer surface 53. The sintered body layer 58 may be formed in a cylindrical shape inside the tube 50a, and a cavity 59 may be formed inside the sintered body layer 58. A working fluid may be sealed inside the tube 50a. The working fluid may be selected appropriately depending on the material of the tube 50a, and may be, for example, water.

[0030] The sintered body layer 58 may include numerous voids according to the shape and particle size of the sintered metal or other powder. The working fluid may be absorbed into the voids in the sintered body layer 58 and may move within the sintered body layer 58 due to the capillary force of the sintered body layer 58. The working fluid present in the sintered body layer 58 may be heated and vaporized by receiving heat from the heat transfer member 70. In this way, the working fluid vaporizes in the heat receiving portion 56 that contacts the heat transfer member 70 of each heat pipe 50, absorbing heat from the heat transfer member 70 and cooling the IC chip 21 that is in contact with the heat transfer member 70.

[0031] Furthermore, the vapor of the evaporated working fluid may be able to move within the cavity 59. The vapor of the working fluid present in the cavity 59 may be able to condense and liquefy due to the heat dissipation effect of the heat sink 61 and / or the heat sink 62. The liquefied working fluid may move within the sintered body layer 58, receive heat from the heat transfer member 70 in the heat receiving portion 56, and be heated and vaporized. By circulating the working fluid inside each heat pipe 50 in this way, the heat of the heat transfer member 70 can be efficiently absorbed, and the IC chip 21 in contact with the heat transfer member 70 can be cooled.

[0032] When the device body 11 is in a horizontal position, as shown in FIG. 2 , each heat pipe 50 extends along the circuit board 20, allowing the working fluid to permeate a relatively wide area of ​​the sintered body layer 58. That is, the working fluid spreads substantially uniformly throughout the entire length of each heat pipe 50. In contrast, when the device body 11 is in a vertical position, as shown in FIG. 3A , the lower pipe portion 52 of each heat pipe 50 is positioned below the heat dissipation portion 51 in contact with the heat sink 61 or 62, increasing the amount of working fluid that accumulates in the lower pipe portion 52. Therefore, the water level of the working fluid in the lower pipe portion 52 when the device body 11 is in a vertical position (see W2 in FIG. 5B ) is higher than the water level of the working fluid in the lower pipe portion 52 when the device body 11 is in a horizontal position (see W1 in FIG. 5A ).

[0033] In order for the working fluid to evaporate in the heat receiving portion 56 of each heat pipe 50, it is preferable that the water level of the working fluid in the heat receiving portion 56 does not exceed the height of the sintered body layer 58 (i.e., the water level of the working fluid does not reach the cavity 59). To lower the water level of the working fluid in the pipe lower portion 52 when the device body 11 is in a vertical position, as described above, the pipe lower portion 52 may be formed with an extension portion 55 extending from the heat receiving portion 56 in contact with the heat transfer member 70 to the tapered portion 54. Forming the extension portion 55 in this manner ensures that the sintered body layer 58 of the pipe lower portion 52 has a sufficient capacity for the working fluid to accumulate when the device body 11 is in a vertical position, thereby lowering the water level W2 (see FIG. 5B ) of the working fluid in the heat receiving portion 56. This allows the working fluid inside each heat pipe 50 to be efficiently evaporated, even when the device body 11 is in a vertical position, thereby efficiently cooling the IC chip 21, which is a heat-generating element mounted on the circuit board 20.

[0034] 4 , a space S may be provided on the opposite side of the heat transfer member 70 across the lower pipe portion 52 of each heat pipe 50 (more specifically, between the power supply device 40 and the extension portion 55 of the heat pipe 50), exposing the outer surface of the lower pipe portion 52 (more specifically, the outer surface of the extension portion 55). By providing the space S between the heat pipe 50 and components or members such as the power supply device 40, it is possible to prevent the heat pipe 50 from being pushed from the opposite side of the circuit board 20, thereby preventing external force from being applied to the circuit board 20.

[0035] [4. Modifications] The present invention is not limited to the above-described embodiments.

[0036] (1) FIG. 6 is a cross-sectional view of a lower pipe portion 52 of a heat pipe 50 built into an electronic device according to another embodiment. FIG. 6 illustrates a state in which the device body 11 is in a vertical position (first position). As shown in FIG. 6 , when the device body 11 is in a vertical position, the extension portion 55 of the heat pipe 50 may be positioned lower (in the direction indicated by X2 in FIG. 6 ) than the heat receiving portion 56 in the up-down direction (the direction indicated by the X axis in FIG. 6 ). Also, as shown in FIG. 6 , when the device body 11 is in a vertical position, the heat receiving portion 56 of the heat pipe 50 may extend in the front-rear direction (first direction, the direction indicated by the Y axis in FIG. 6 ), and the extension portion 55 may include a portion that extends in both the front-rear direction and a downward diagonal direction.

[0037] This also ensures that the working fluid can be stored in the sintered body layer 58 in the lower pipe portion 52 when the device body 11 is in a vertical position, and the position of the water surface W3 (see FIG. 6) of the working fluid in the heat receiving portion 56 can be lowered. As a result, even when the device body 11 is in a vertical position, the working fluid inside the heat receiving portion 56 can be efficiently vaporized, and the IC chip 21 can be efficiently cooled.

[0038] (2) FIG. 7 is a plan view showing a portion of a heat dissipation device 30 built into an electronic device according to another embodiment. In the heat dissipation device 30 shown in FIG. 7 , the heat pipe 50 has an extension 57 located between the heat receiving portion 56 and the heat dissipation portion 51. As shown in FIG. 7 , when the device body 11 is in a vertical position (first position), the extension 57 may be located below the heat receiving portion 56 (in the direction indicated by X2 in FIG. 7 ). That is, the bottom surface of the extension 57 (the surface facing the X2 direction) may be lower than the bottom surface of the heat receiving portion 56. As shown in FIG. 7 , when the device body 11 is in a vertical position, the heat receiving portion 56 may extend in the front-to-rear direction (first direction, the direction indicated by the Y axis in FIG. 7 ). Furthermore, the extension 57 may include a portion extending diagonally downward from the heat receiving portion 56 in the front-to-rear direction.

[0039] This also ensures that the sintered body layer 58 in the extension portion 57 has a sufficient capacity for storing the working fluid when the device body 11 is in a vertical position. This allows the level of the working fluid in the heat receiving portion 56 to be lowered, allowing the working fluid inside the heat receiving portion 56 to be efficiently vaporized. As a result, the IC chip 21 can be efficiently cooled.

[0040] [5. Summary] (1) As described above, the electronic device described in the present disclosure may include a substrate on which a heat generating element is mounted, a housing housing the substrate, a heat pipe housed in the housing and extending along the substrate, a heat sink housed in the housing and positioned above the heat generating element when the housing is in a first position, and a heat transfer member positioned between the heat generating element and the heat pipe and in contact with both the heat generating element and the heat pipe. The heat pipe may include a heat dissipation portion connected to the heat sink and a pipe lower portion including an outer surface in contact with the heat transfer member, positioned below the heat dissipation portion when the housing is in the first position and extending in a direction intersecting the up-down direction. The pipe lower portion may include a tapered portion including a tip of the heat pipe and gradually tapering toward the tip, and an extension portion positioned outside the outer edge of the heat transfer member and extending to the tapered portion. The heat transfer member may be disposed on the lower portion of the pipe, and a space may be provided on the opposite side of the pipe from the heat transfer member, where the outer surface of the extension is exposed. This improves the cooling capacity of a heat-generating body built into an electronic device that is arranged in a variety of positions.

[0041] (4) An electronic device according to the present disclosure may include a substrate on which a heating element is mounted, a housing housing the substrate, a heat pipe housed in the housing and extending along the substrate, a heat sink housed in the housing and positioned above the heating element when the housing is in a first position, and a heat transfer member positioned between the heating element and the heat pipe and in contact with both the heating element and the heat pipe. The heat pipe may include a heat dissipation portion connected to the heat sink and a pipe lower portion including an outer surface in contact with the heat transfer member, positioned below the heat dissipation portion when the housing is in the first position, and extending in a direction intersecting the vertical direction. The pipe lower portion may include a heat receiving portion including an outer surface in contact with the heat transfer member and positioned inside the outer edge of the heat transfer member, and an extension portion positioned between the heat receiving portion and the heat dissipation portion and positioned below the heat receiving portion when the housing is in the first position. This improves the cooling capacity of a heat generating element built into an electronic device that can be placed in a variety of positions.

[0042] (2) In the electronic device of (1) or (4), the lower pipe portion may include an outer surface in contact with the heat transfer member and a heat receiving portion located inside an outer edge of the heat transfer member. When the housing is in a first position, the extension portion may be disposed at the same position as the heat receiving portion in the vertical direction or below the heat receiving portion.

[0043] (3) In the electronic device of (2) above, when the housing is in a first position, the heat receiving portion may extend in a first direction intersecting the up-down direction, and the extension portion may include a portion extending from the heat receiving portion in the first direction or in the first direction and a downward diagonal direction.

[0044] (5) In any of the electronic devices described in (2) to (4) above, when the housing is in a first position, the heat receiving portion may extend in a first direction intersecting the vertical direction, and the extension portion may include a portion extending from the heat receiving portion in the first direction and diagonally downward.

Claims

1. An electronic device comprising: a board on which a heating element is mounted; a housing that houses the board; a heat pipe that is housed in the housing and extends along the board; a heat sink that is housed in the housing and is positioned above the heating element when the housing is in a first position; and a heat transfer member that is located between the heating element and the heat pipe and in contact with both the heating element and the heat pipe, wherein the heat pipe includes a heat dissipation portion connected to the heat sink and an outer surface that is in contact with the heat transfer member, and a pipe lower portion that is located below the heat dissipation portion when the housing is in the first position and extends in a direction intersecting a vertical direction, wherein the pipe lower portion includes a tapered portion that includes a tip of the heat pipe and gradually tapers toward the tip, and an extension portion that is located outside the outer edge of the heat transfer member and extends to the tapered portion, and a space is provided on the opposite side of the pipe lower portion from the heat transfer member, where the outer surface of the extension portion is exposed.

2. The electronic device described in claim 1, wherein the lower part of the pipe includes an outer surface in contact with the heat transfer member and a heat receiving portion located inside the outer edge of the heat transfer member, and when the housing is in a first position, the extension portion is positioned at the same position as the heat receiving portion in the vertical direction or lower than the heat receiving portion.

3. The electronic device described in claim 2, wherein when the housing is in a first position, the heat receiving portion extends in a first direction intersecting the up-down direction, and the extension portion includes a portion extending from the heat receiving portion in the first direction or in the first direction and a downward diagonal direction.

4. An electronic device comprising: a board on which a heating element is mounted; a housing that houses the board; a heat pipe that is housed in the housing and extends along the board; a heat sink that is housed in the housing and is positioned above the heating element when the housing is in a first position; and a heat transfer member that is located between the heating element and the heat pipe and in contact with both the heating element and the heat pipe, wherein the heat pipe includes a heat dissipation portion connected to the heat sink and a pipe lower portion that includes an outer surface in contact with the heat transfer member, is located below the heat dissipation portion when the housing is in the first position and extends in a direction intersecting the up-down direction, wherein the pipe lower portion includes a heat receiving portion that includes an outer surface in contact with the heat transfer member and is located inside the outer edge of the heat transfer member, and an extension portion that is located between the heat receiving portion and the heat dissipation portion and is located below the heat receiving portion when the housing is in the first position.

5. The electronic device described in claim 4, wherein when the housing is in a first position, the heat receiving portion extends in a first direction intersecting the up-down direction, and the extension portion includes a portion extending from the heat receiving portion in the first direction and diagonally downward.

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