Heating plate and coater oven

Abstract

The present invention belongs to the technical field of heating plates, and specifically relates to a heating plate and a coater oven. The heating plate comprises a lower base plate (1), an electric heating layer (2), a packaging layer (3) and an upper cover plate (4), wherein the lower base plate (1), the electric heating layer (2) and the upper cover plate (4) are sequentially stacked; the electric heating layer (2) is provided with a lead-out portion (222); the packaging layer (3) is arranged between the lower base plate (1) and the upper cover plate (4) in the stacking direction; the packaging layer (3) at least surrounds the electric heating layer (2) so as to seal the electric heating layer (2) between the lower base plate (1) and the upper cover plate (4); and the lead-out portion (222) is exposed from the upper cover plate (4). Since the packaging layer (3) is arranged between the lower substrate (1) and the upper cover plate (4) and surrounds the electric heating layer (2), the electric heating layer (2) is sealed in a sealing cavity to completely isolate the electric heating layer (2) from oxygen, such that the electric heating layer (2) does not oxidize, which avoids power attenuation of a heating unit; and the packaging layer (3) can also isolate water vapor or solvents to prevent water vapor or solvents from entering the sealing cavity and thus eroding the electric heating layer (2).

Description

Heating plate and coating machine oven

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application claims priority to the Chinese patent application filed on August 7, 2023, with application number: 202322110590.0, and invention name: "A heating plate and coating machine oven", all contents of which are incorporated by reference into this application. Technical Field

[0003] The present application belongs to the technical field of heating plates, and in particular to a heating plate and a coating machine oven. Background Art

[0004] In the manufacturing process of lithium-ion battery electrodes, the main production processes include wet batching, coating and baking, among which the baking process is mainly carried out using a coating machine oven.

[0005] At present, the coating machine oven uses a plate-type heating element to dry the electrode. When the heating element works for a long time and exceeds a certain temperature, the heating layer of the heating element will slowly oxidize, causing the power of the heating element to decay, and the heating function to weaken or even disappear.

[0006] Summary of the Invention

[0007] The technical problem to be solved by the present application is to provide a heating plate and a coating machine oven to address the problem that the heating layer of the existing heating body will slowly oxidize, resulting in power attenuation of the heating body.

[0008] To solve the above technical problems, on the one hand, an embodiment of the present application provides a heating plate, comprising a lower substrate, an electric heating layer, a packaging layer and an upper cover plate, wherein the lower substrate, the electric heating layer and the upper cover plate are stacked in sequence along a first direction, a lead-out portion is provided on the electric heating layer, and the packaging layer is arranged between the lower substrate and the upper cover plate in the first direction, the packaging layer at least surrounds the electric heating layer to seal the electric heating layer between the lower substrate and the upper cover plate, and the lead-out portion is exposed from the upper cover plate.

[0009] Optionally, the electric heating layer includes a heating layer and an electrode, the heating layer covers at least a portion of the electrode, the electrode includes an electrode body and the lead-out portion, the electrode body is connected to the heating layer, and the lead-out portion is connected to the electrode body.

[0010] Optionally, the encapsulation layer surrounds the electric heating layer and the lead-out portion, and the encapsulation layer is a closed structure and is connected between opposite surfaces of the lower substrate and the upper cover.

[0011] Optionally, the projection area of ​​the upper cover plate and the projection area of ​​the lower substrate are consistent in the first direction, the lead portion is located in the middle of the electrode, and a through hole for exposing the lead portion is provided on the upper cover plate.

[0012] Optionally, the encapsulation layer surrounds the electric heating layer, the lead-out portion is located outside the encapsulation layer, and the encapsulation layer includes a first encapsulation layer connected between the opposite surfaces of the lower substrate and the upper cover plate, and a second encapsulation layer connected between the opposite surfaces of the lead-out portion and the upper cover plate, and the first encapsulation layer and the second encapsulation layer are connected to form a closed structure.

[0013] Optionally, the projection area of ​​the upper cover plate and the projection area of ​​the lower substrate partially overlap in the first direction, and at least one end of the electrode can be exposed from the non-overlapping portion of the upper cover plate and the lower substrate to form the lead-out portion.

[0014] Optionally, a groove is provided on at least one of the lower substrate and the upper cover plate, and the encapsulation layer is provided in the groove.

[0015] Optionally, there is a gap between the outer edge of the heat-generating layer and the inner edge of the packaging layer.

[0016] Optionally, the electrodes include a positive electrode and a negative electrode, and the positive electrode and the negative electrode are arranged on opposite sides of the heat-generating layer.

[0017] On the other hand, an embodiment of the present application provides a coating machine oven, comprising the heating plate as described above.

[0018] The heating plate provided in the embodiment of the present application forms a sealed cavity between the upper cover plate and the lower substrate by arranging the packaging layer between the lower substrate and the upper cover plate and surrounding the electric heating layer. The electric heating layer is sealed in the sealed cavity, so that the electric heating layer is completely isolated from oxygen. Even if it works at a temperature exceeding 400°C, the electric heating layer will not be oxidized, thereby avoiding power attenuation of the heating body. At the same time, the packaging layer can also isolate water vapor or solvents, preventing water vapor or solvents from entering the sealed cavity and corroding the electric heating layer. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] FIG1 is a schematic diagram of a heating plate provided in Example 1 of the present application;

[0020] FIG2 is an exploded view of the heating plate provided in Example 1 of the present application;

[0021] FIG3 is a schematic diagram of a heating plate provided in Example 2 of the present application;

[0022] FIG4 is an exploded view of the heating plate provided in Example 2 of the present application;

[0023] FIG5 is an exploded view of the heating plate provided in Example 3 of the present application;

[0024] FIG6 is a schematic diagram of a heating plate provided in an oven of a coating machine according to an embodiment of the present application.

[0025] The reference numerals in the specification are as follows:

[0026] 1. Lower substrate; 2. Electric heating layer; 21. Heating layer; 22. Electrode; 221. Electrode body; 222. Lead-out portion; 3. Packaging layer; 4. Upper cover; 41. Through hole; 42. Groove; 5. Box; 6. Nozzle; 7. Roller; 8. Heating plate. DETAILED DESCRIPTION

[0027] In order to make the technical problems, technical solutions and beneficial effects solved by this application more clearly understood, this application is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain this application and are not intended to limit this application.

[0028] Among existing ovens, some use hot air to dry electrodes, but this has low energy efficiency, low baking rate, and poor electrode quality. Some ovens use a combination of hot air drying and infrared radiation heating to dry electrodes. Currently, infrared lamps are mainly used as infrared radiation sources. A large number of infrared lamps need to be arranged in the coating machine oven. Infrared lamps have a short lifespan and high temperature. They also need to be equipped with cooling devices and devices to monitor the temperature of the infrared lamps, which increases the cost of the coating machine oven. When a conventional plate-shaped heating plate is used as an infrared heat source, the heating layer of the heating plate will be exposed to the air or a layer of packaging material will be sprayed or printed on the surface of the heating layer. After the heating temperature exceeds 400°C, slow oxidation will occur, causing the power of the heating body to decay and the heating function to weaken or even disappear.

[0029] As shown in Figures 1 to 5, a heating plate provided in one embodiment of the present application includes a lower substrate 1, an electric heating layer 2, an encapsulation layer 3 and an upper cover plate 4. The lower substrate 1, the electric heating layer 2 and the upper cover plate 4 are stacked in sequence along a first direction, and the electric heating layer 2 is located between the lower substrate 1 and the upper cover plate 4. The first direction is the thickness direction of the lower substrate. A lead-out portion 222 is provided on the electric heating layer 2, and the electric heating layer 2 is connected to a power source through the lead-out portion 222 for infrared heating. The encapsulation layer 3 is arranged between the lower substrate 1 and the upper cover plate 4 in the stacking direction, separating the space between the lower substrate 1 and the upper cover plate 4 into a sealed cavity. The encapsulation layer 3 at least surrounds the electric heating layer 2. The electric heating layer 2 is arranged in the sealed cavity to seal the electric heating layer 2 between the lower substrate 1 and the upper cover plate 4 and isolate the electric heating layer 2. The lead-out portion 222 is arranged in the sealed cavity or extends out of the sealed cavity. The lead-out portion 222 is exposed to the upper cover plate 4 and is connected to the power source.

[0030] The heating plate provided in the embodiment of the present application forms a sealed cavity between the upper cover plate 4 and the lower substrate 1 by arranging the encapsulation layer 3 between the lower substrate 1 and the upper cover plate 4 and surrounding the electric heating layer 2. The electric heating layer 2 is sealed in the sealed cavity, so that the electric heating layer 2 is completely isolated from oxygen. Even if working at a temperature exceeding 400°C, the electric heating layer 2 will not be oxidized, thereby avoiding power attenuation of the heating body. At the same time, the encapsulation layer 3 can also isolate water vapor or solvents, preventing water vapor or solvents from entering the sealed cavity and corroding the electric heating layer 2.

[0031] In one embodiment, the electric heating layer 2 includes a heating layer 21 and an electrode 22. The heating layer 21 covers at least a portion of the electrode 22. The heating layer 21 is in contact with the electrode 22, and when the electrode 22 is energized, the heating layer 21 can be stimulated to generate heat. The electrode 22 includes an electrode body 221 and a lead portion 222. The electrode body 221 is connected to the heating layer 21, and the lead portion 222 is connected to the electrode body 221. The lead portion 222 is connected to a power source, and current is sequentially conducted to the heating layer 21 via the lead portion 222 and the electrode body 221. In the extension direction of the electrode 22, the length of the electrode body 221 is consistent with the length of the heating layer 21, so that the heating layer 21 can generate heat evenly, increasing the heating area.

[0032] In one embodiment, the lead portion 222 and the electrode body 221 are integrally formed.

[0033] The encapsulation layer 3 can surround the electric heating layer 2, or surround the electric heating layer 2 and the lead-out portion 222 at the same time. The structures of the encapsulation layer 3 are different in the two cases and need to be described separately.

[0034] In one embodiment, as shown in Figures 3 and 4, the packaging layer 3 surrounds the electric heating layer 2 and the lead-out portion 222. The packaging layer 3 is a closed structure and is connected between the relative surfaces of the lower substrate 1 and the upper cover plate 4. The packaging material is coated or sprayed on the surface of the lower substrate 1, and the upper cover plate 4 is attached to the lower substrate 1. The packaging material is sintered and solidified to obtain the packaging layer 3, and the packaging layer 3 can connect the upper cover plate 4 and the lower substrate 1 together, so that a sealed cavity is formed between the upper cover plate 4 and the lower substrate 1, and the packaging material is attached to the surface of the upper cover plate 4 and the surface of the lower substrate 1, and has good connection strength after curing and molding.

[0035] In one embodiment, as shown in Figures 3 and 4, the projection area of ​​the upper cover plate 4 and the projection area of ​​the lower substrate 1 are consistent in the first direction, the upper cover plate 4 and the lower substrate 1 are of the same size and are completely aligned, the lead-out portion 222 is located in the middle of the electrode 22, and a through hole 41 is provided on the upper cover plate 4 for exposing the lead-out portion 222. The portion exposed from the through hole 41 is the lead-out portion 222, and the remaining portion is the electrode body 221. A wire is connected to the lead-out portion 222 at the through hole 41 for power supply.

[0036] When the heating range of the heating plate does not meet the requirements, multiple heating plates need to be spliced ​​together. There will be a cold area at the joint of adjacent heating plates. By setting the lead-out portion 222 in the middle of the electrode 22 instead of the end, the cold area at the joint can be reduced, thereby increasing the heating area.

[0037] In one embodiment, as shown in Figures 3 and 4, the electrode 22 includes a positive electrode and a negative electrode, which are arranged on opposite sides of the heat-generating layer 21 to increase the heat-generating area. The encapsulation layer 3 surrounds the positive and negative electrodes, and the through-hole 41 includes a first through-hole and a second through-hole. The first through-hole is arranged at a position on the upper cover plate 4 corresponding to the positive electrode, exposing the lead-out portion 222 of the positive electrode. The second through-hole is arranged at a position on the upper cover plate 4 corresponding to the negative electrode, exposing the lead-out portion 222 of the negative electrode.

[0038] It can be understood that there is at least one first through hole and at least one second through hole, which are provided according to the area of ​​the heating layer 21 and the heating range.

[0039] In another embodiment, as shown in Figures 1 and 2, the encapsulation layer 3 surrounds the electric heating layer 2, and the lead portion 222 is located outside the encapsulation layer 3. The encapsulation layer 3 includes a first encapsulation layer connected between the opposing surfaces of the lower substrate 1 and the upper cover plate 4, and a second encapsulation layer connected between the opposing surfaces of the lead portion 222 and the upper cover plate 4. The first encapsulation layer and the second encapsulation layer are connected to form a closed structure. When the lead portion 222 extends beyond the encapsulation layer 3, a portion of the encapsulation material is coated or sprayed on the end of the lead portion 222 close to the heating layer 21. The end of the lead portion 222 away from the heating layer 21 extends out of the encapsulation layer 3 and is not covered by the upper cover plate 4, allowing it to be connected to a power source. After curing, a second encapsulation layer is formed, which seals the gap between the lead portion 222 and the upper cover plate 4. The remaining portion of the encapsulation material is coated or sprayed on the surface of the lower substrate 1. After curing, it forms the first encapsulation layer, which seals the gap between the upper cover plate 4 and the lower substrate 1.

[0040] In another embodiment, as shown in Figures 1 and 2, the projection area of ​​the upper cover plate 4 and the projection area of ​​the lower substrate 1 partially overlap in the first direction, the area of ​​the upper cover plate 4 is smaller than the area of ​​the lower substrate 1, and the lower substrate 1 cannot be completely covered by the upper cover plate 4, or the upper cover plate 4 and the lower substrate 1 have the same area and are offset from each other, so that the upper cover plate 4 and the lower substrate 1 form a partially overlapping structure. In the extension direction of the electrode 22, the length dimension of the electrode 22 is greater than the length dimension of the heating layer 21, and at least one end of the electrode 22 can be exposed from the non-overlapping portion of the upper cover plate 4 and the lower substrate 1 to form a lead-out portion 222. The lead-out portion 222 is located at the end of the electrode 22 and is not covered by the upper cover plate 4.

[0041] When the heating range of the heating plate is sufficient, the lead-out portion 222 is exposed from the non-overlapping portion of the upper cover plate 4 and the lower substrate 1 for heating. The lead-out portion 222 is conveniently connected to a power source.

[0042] In one embodiment, as shown in FIG5 , an annular groove 42 is provided on at least one of the lower substrate 1 and the upper cover plate 4. The groove 42 at least surrounds the electric heating layer 2. The packaging material is filled in the groove 42 and forms the packaging layer 3 after sintering and curing. By arranging the packaging layer 3 in the groove 42, the contact area between the packaging layer 3 and the lower substrate 1 or the upper cover plate 4 can be increased, thereby improving the connection strength and the sealing.

[0043] Specifically, one of the lower substrate 1 and the upper cover plate 4 is provided with a groove 42, and the side of the encapsulation layer 3 away from the groove 42 is connected to the other of the lower substrate 1 and the upper cover plate 4. Alternatively, the groove 42 is provided on both the lower substrate 1 and the upper cover plate 4, and the groove 42 of the lower substrate 1 and the groove 42 of the upper cover plate 4 are aligned in the stacking direction to form a receiving cavity, and the encapsulation layer 3 is received in the receiving cavity. Alternatively, the groove 42 is provided on both the lower substrate 1 and the upper cover plate 4, and the groove 42 of the lower substrate 1 and the groove 42 of the upper cover plate 4 are offset in the stacking direction. In this case, the encapsulation layer 3 has two rings, one of which is located between the electric heating layer 2 and the other ring.

[0044] In one embodiment, the cross-sectional shape of the groove 42 is U-shaped, arc-shaped, or polygonal.

[0045] In one specific embodiment, grooves 42 are provided on the upper cover plate 4. After the encapsulation material is filled in the grooves 42, the upper cover plate 4 is attached to the lower substrate 1. When the encapsulation layer 3 surrounds the electric heating layer 2 and the lead-out portion 222, the encapsulation material is cured and formed, and then adheres to the opposing surfaces of the lower substrate 1 and the upper cover plate 4. When the encapsulation layer 3 only surrounds the electric heating layer 2, the portion of the groove 42 that is attached to the opposing surfaces of the lower substrate 1 and the upper cover plate 4 is formed to form a first encapsulation layer, and the portion that is attached to the lead-out portion 222 is formed to form a second encapsulation layer.

[0046] In one embodiment, there is a gap between the outer edge of the heating layer 21 and the inner edge of the packaging layer 3, and the gap is 5 to 50 mm. Preferably, the gap is 5 to 20 mm. The packaging material is coated at a certain distance from the outer edge of the heating layer 21. When the lower substrate 1 or the upper cover plate 4 is attached, the packaging material is prevented from being squeezed and covering the heating layer 21, thereby affecting the sealing effect of the packaging layer 3.

[0047] The structure of the heating plate is described below through specific embodiments.

[0048] The material of the lower substrate 1 includes but is not limited to glass-ceramics, quartz glass, and borosilicate glass.

[0049] The material of the electrode 22 includes but is not limited to sintered silver paste, sintered silver palladium paste, sintered palladium paste, and sintered rhodium paste.

[0050] The material of the heating layer 21 includes but is not limited to graphene, carbon nanotubes, carbon black, carbon fiber, tin oxide, antimony tin oxide, indium oxide, and indium tin oxide.

[0051] The material of the encapsulation layer 3 includes but is not limited to organic silicon sealant, silicone sealant, epoxy sealant, polyimide sealant, inorganic sealant, and glass powder encapsulation material.

[0052] The material of the upper cover plate 4 includes but is not limited to glass-ceramic, quartz glass, and borosilicate glass.

[0053] Example 1

[0054] As shown in Figures 1 and 2, silver paste is printed and sintered on the lower substrate 1 and sintered at 800°C for 20 minutes to form the electrode 22. After sintering, graphene is printed on the lower substrate 1 and sintered at 600°C to form the heating layer 21. The electrode 22 includes a positive electrode and a negative electrode. The positive electrode and the negative electrode are located on opposite sides of the heating layer 21, and the heating layer 21 covers at least a portion of the positive electrode and at least a portion of the negative electrode.

[0055] After sintering, the glass powder encapsulation material is coated around the graphene heating layer 21 of the lower substrate 1 to form an encapsulation layer 3. The distance between the glass powder encapsulation material and the graphene heating layer 21 is 5 to 50 mm, and the encapsulation layer 3 surrounds the electric heating layer 2. After coating, the upper cover plate 4 is attached to the lower substrate, and the upper cover plate 4 and the lower substrate partially overlap. One end of the positive electrode and one end of the negative electrode can be exposed and connected to the power supply as the lead-out portion 222. After the attachment is completed, sintering is carried out at 400°C for 20 minutes to obtain a double-sided glass-encapsulated heating plate.

[0056] Example 2

[0057] As shown in Figures 3 and 4, silver paste is printed and sintered on the surface of the lower substrate 1 and sintered at 800°C for 20 minutes to form electrodes 22. After sintering, an antimony tin oxide solution is sprayed on the lower substrate 1 to form a heating layer 21. The positive electrode and the negative electrode are located on opposite sides of the heating layer 21, and the heating layer 21 covers at least part of the positive electrode and at least part of the negative electrode.

[0058] A silicone sealant is applied to the lower substrate 1 as the encapsulation layer 3. The sealant is applied around the heating area, in the direction of the electrode 22. The length of the electrode 22 is consistent with the length of the heating layer 21. The encapsulation layer 3 surrounds the electric heating layer 2 and the lead-out portion 222. The distance between the encapsulation layer 3 and the heating layer 21 is 5-50mm. After the coating is completed, the upper cover 4 is bonded to the lower substrate. After the bonding is completed, the sealant is allowed to cure for 24 hours. This completes the double-sided glass encapsulated heating plate.

[0059] In this embodiment, the upper cover plate 4 and the lower substrate 1 are aligned, and the lead portion 222 of the electrode 22 cannot be exposed from the non-overlapping portion of the upper cover plate 4 and the lower substrate 1. Therefore, a hole must be punched in the upper cover plate 4 so that the lead portion 222 is exposed from the through hole 41.

[0060] Example 3

[0061] As shown in Figure 5, silver palladium paste is printed and sintered on the surface of the lower substrate 1 and sintered at 900°C for 15 minutes to form an electrode 22. After sintering, graphene is printed on the lower substrate 1 and cured to obtain a heating layer 21. The electrode 22 includes a positive electrode and a negative electrode, which are located on opposite sides of the heating layer 21. The heating layer 21 covers at least a portion of the positive electrode and at least a portion of the negative electrode.

[0062] Use equipment to carve a circular groove 42 on the upper cover plate 4 for placing sealant. The width of the groove 42 is 2 to 10 mm and the depth is 0.5 to 3 mm. Apply silicone sealant to the groove 42 of the upper cover plate 4, and press the upper cover plate 4 onto the lower substrate 1. The groove 42 is 5 to 50 mm away from the heating layer. Apply pressure of 10 to 1000 N to the upper cover plate 4 and the lower substrate, and maintain the pressure for 2 hours. After the silicone sealant is cured, the encapsulation layer 3 is formed, and a double-sided glass-encapsulated heating plate can be obtained.

[0063] On the other hand, as shown in Figure 6, an embodiment of the present application provides a coating machine oven, comprising a housing, multiple air nozzles, multiple rollers, and multiple heating plates of the above-described embodiment. The housing has a cavity, and multiple rollers are spaced apart within the cavity. Each air nozzle is positioned above a corresponding roller, and a heating plate is positioned between adjacent air nozzles to bake the electrode.

[0064] The above description is only a preferred embodiment of the present application and is not intended to limit the present application. Any modifications, equivalent replacements and improvements made within the spirit and principles of the present application should be included in the scope of protection of the present application.

Claims

1. A heating plate, characterized in that: The invention comprises a lower substrate (1), an electric heating layer (2), a packaging layer (3) and an upper cover plate (4); the lower substrate (1), the electric heating layer (2) and the upper cover plate (4) are stacked in sequence along a first direction; a lead-out portion (222) is provided on the electric heating layer (2); the packaging layer (3) is arranged between the lower substrate (1) and the upper cover plate (4) in the first direction; the packaging layer (3) at least surrounds the electric heating layer (2) so as to seal the electric heating layer (2) between the lower substrate (1) and the upper cover plate (4); and the lead-out portion (222) is exposed from the upper cover plate (4).

2. The heating plate according to claim 1, characterized in that The electric heating layer (2) comprises a heating layer (21) and an electrode (22), wherein the heating layer (21) covers at least a portion of the electrode (22), and the electrode (22) comprises an electrode body (221) and a lead-out portion (222), wherein the electrode body (221) is connected to the heating layer (21), and the lead-out portion (222) is connected to the electrode body (221).

3. The heating plate according to claim 2, characterized in that The packaging layer (3) surrounds the electric heating layer (2) and the lead-out portion (222); the packaging layer (3) is a closed structure and is connected between the relative surfaces of the lower substrate (1) and the upper cover plate (4).

4. The heating plate according to claim 3, characterized in that The projection area of ​​the upper cover plate (4) and the projection area of ​​the lower substrate (1) are consistent in the first direction, the lead-out portion (222) is located in the middle of the electrode (22), and a through hole (41) for exposing the lead-out portion (222) is provided on the upper cover plate (4).

5. The heating plate according to claim 2, characterized in that The encapsulation layer (3) surrounds the electric heating layer (2), the lead-out portion (222) is located outside the encapsulation layer (3), and the encapsulation layer (3) comprises a first encapsulation layer connected between the relative surfaces of the lower substrate (1) and the upper cover plate (4), and a second encapsulation layer connected between the relative surfaces of the lead-out portion (222) and the upper cover plate (4), wherein the first encapsulation layer and the second encapsulation layer are connected to form a closed structure.

6. The heating plate according to claim 5, characterized in that The projection area of ​​the upper cover plate (4) and the projection area of ​​the lower substrate (1) partially overlap in the first direction, and at least one end of the electrode (22) can be exposed from the non-overlapping portion of the upper cover plate (4) and the lower substrate (1) to form the lead-out portion (222).

7. The heating plate according to claim 3 or 5, characterized in that: At least one of the lower substrate (1) and the upper cover plate (4) is provided with a groove (42), and the packaging layer (3) is arranged in the groove (42).

8. The heating plate according to claim 2, characterized in that There is a gap between the outer edge of the heat-generating layer (21) and the inner edge of the packaging layer (3).

9. The heating plate according to claim 2, characterized in that The electrode (22) includes a positive electrode and a negative electrode, and the positive electrode and the negative electrode are arranged on opposite sides of the heat generating layer (21).

10. A coating machine oven, characterized in that: The heating plate comprises the heating plate according to any one of claims 1 to 9.

Images