Electrical connection device

Abstract

This electrical connection device comprises a probe, a flexible wiring sheet connected to the probe, and a wiring board. The probe has a tip part arranged so as to be capable of coming into contact with an inspection object and a base end part connected to the tip part. Both surfaces of the wiring sheet are defined by a first sheet surface and a second sheet surface, a first connection part connected to the base end part of the probe is arranged on the first sheet surface, and a second connection part is arranged on the second sheet surface. An internal circuit connecting the first connection part and the second connection part is formed between the first sheet surface and the second sheet surface. The wiring board has a first main surface on which a first electrode connected to the second connection part is arranged and which faces the second sheet surface, and a second main surface on which a second electrode electrically connected to the first electrode is arranged.

Description

Electrical Connection Device

[0001] The present invention relates to an electrical connecting device used for testing electrical characteristics of an object to be tested.

[0002] 2. Description of the Related Art Electrical connection devices having testing terminals that come into contact with an object under test (DUT) such as an integrated circuit are used to measure the electrical characteristics of the object under test. In measurements using the electrical connection device, the object under test is electrically connected to a testing device such as a tester via the testing terminals.

[0003] In order to measure the characteristics of an object under test with high accuracy, it is important to transmit an electrical signal to the electrical connection device with reduced loss and noise, etc. For example, in order to measure high-frequency characteristics with high accuracy, an electrical connection device equipped with electronic components such as capacitors that are connected to the signal wiring through which the electrical signal propagates is being considered.

[0004] Japanese Patent Application Laid-Open No. 2004-233155

[0005] An object of the present invention is to provide an electrical connecting device that can measure the characteristics of an object to be inspected with high accuracy.

[0006] An electrical connection device according to one aspect of the present invention includes terminals for inspection, a flexible wiring sheet connected to the terminals for inspection, and a wiring board. The terminals for inspection have a tip end portion arranged so as to be able to contact an object under inspection and a base end portion connected to the tip end. The wiring sheet has two surfaces defined by a first sheet surface and a second sheet surface, and a first connection portion connected to the base end of the terminal for inspection is arranged on the first sheet surface, and a second connection portion is arranged on the second sheet surface. An internal circuit connecting the first connection portion and the second connection portion is formed between the first sheet surface and the second sheet surface. The wiring board has a first main surface facing the second sheet surface, on which a first electrode connected to the second connection portion is arranged, and a second main surface on which a second electrode electrically connected to the first electrode is arranged.

[0007] According to the present invention, it is possible to provide an electrical connecting device that can measure the characteristics of an object to be inspected with high precision.

[0008] FIG. 1 is a schematic diagram showing the configuration of an electrical connection device according to an embodiment. FIG. 2 is a schematic plan view showing the configuration of an electrical connection device according to an embodiment. FIG. 3 is a schematic cross-sectional view showing an example of the structure of a wiring sheet of an electrical connection device according to an embodiment. FIG. 4 is a schematic diagram showing an example of an internal circuit of a wiring sheet of an electrical connection device according to an embodiment. FIG. 5 is a schematic diagram showing another example of an internal circuit of a wiring sheet of an electrical connection device according to an embodiment. FIG. 6 is a schematic diagram showing an example of the arrangement of electronic circuits arranged in an electrical connection device according to an embodiment.

[0009] Next, embodiments of the present invention will be described with reference to the drawings. In the following description of the drawings, identical or similar parts are designated by identical or similar reference numerals. However, it should be noted that the drawings are schematic, and the thickness ratios of the various parts may differ from those in reality. Furthermore, it goes without saying that the dimensional relationships and ratios of parts included in the drawings may differ from one another. The embodiments shown below exemplify devices and methods for embodying the technical ideas of the present invention, and the materials, shapes, structures, arrangements, etc. of the components of the embodiments of the present invention are not limited to those described below.

[0010] An electrical connection device 1 according to the embodiment shown in Fig. 1 is used to inspect an object under test 2. The electrical connection device 1 includes probes 10, a flexible wiring sheet 20 connected to the probes 10, a wiring board 30 laminated on the wiring sheet 20, and a printed circuit board 40 laminated on the wiring board 30. In the following description, the direction in which the electrical connection device 1 is located as viewed from the object under test 2 will be referred to as the upward direction, and the direction in which the object under test 2 is located as viewed from the electrical connection device 1 will be referred to as the downward direction. Furthermore, for each of the components of the electrical connection device 1, the surface facing upward will also be referred to as the upper surface, and the surface facing downward will also be referred to as the lower surface.

[0011] The probe 10 functions as a testing terminal that electrically connects the test object 2 and a testing device (not shown). The probe 10 has one end (hereinafter referred to as the "tip end") that is arranged so as to be able to come into contact with the test object 2, and the other end (hereinafter referred to as the "base end") that is connected to the tip end. The probe 10 may be supported by a probe head 60 through which the probe 10 passes. The probe head 60 may be a housing with a space provided inside. The probe head 60 is fixed to the wiring sheet 20, for example.

[0012] The wiring sheet 20 has two surfaces defined by a first sheet surface 211 and a second sheet surface 212. A first connection portion 21 that connects to the base end of the probe 10 is disposed on the first sheet surface 211, which is the lower surface of the wiring sheet 20. The second sheet surface 212, which is the upper surface of the wiring sheet 20, faces the wiring board 30 and has a second connection portion 22 disposed thereon. Although not shown in FIG. 1 , an internal circuit that connects the first connection portion 21 and the second connection portion 22 is formed between the first sheet surface 211 and the second sheet surface 212.

[0013] A first electrode 31 that connects to the second connection portion 22 of the wiring sheet 20 is disposed on a first main surface of the wiring board 30 that faces the second sheet surface 212. A second electrode 32 that electrically connects to the first electrode 31 is disposed on a second main surface of the wiring board 30 that faces the printed circuit board 40. The second electrode 32 is electrically connected to the first electrode 31 via a connection wiring 300. The connection wiring 300 may be, for example, an internal wiring disposed inside the wiring board 30. A multilayer wiring board such as an MLO (multi-layer organic) or an MLC (multi-layer ceramic) may be used for the wiring board 30.

[0014] A printed circuit board 40 is disposed opposite the second main surface of the wiring board 30, and has a wiring pattern 400 arranged thereon, the wiring pattern 400 connecting to the second electrode 32 of the wiring board 30. The wiring pattern 400 arranged inside and on the surface of the printed circuit board 40 electrically connects the second connection portion 22 of the wiring board 30 to an inspection device. For example, a first end 41 of the wiring pattern 400 is connected to the second electrode 32 of the wiring board 30, and a second end 42 of the wiring pattern 400 is electrically connected to an inspection device (not shown). The first end 41 is arranged on the lower surface of the printed circuit board 40, and the second end 42 is arranged on the upper surface of the printed circuit board 40.

[0015] The object under test 2 is mounted on a stage 3. The electrical connecting device 1 is movable vertically relative to the stage 3. When inspecting the object under test 2, the distance between the electrical connecting device 1 and the stage 3 is narrowed so that the tip of the probe 10 comes into contact with a signal terminal (not shown) of the object under test 2. Fig. 1 shows a state in which the probe 10 and the object under test 2 are spaced apart.

[0016] The wiring board 30 may be a space transformer that converts the spacing between the base ends of the probes 10 as viewed from the normal direction of the main surface of the wiring board 30 into the spacing between first ends 41 of the printed circuit board 40. By using the wiring board 30 as a space transformer, the base ends of the probes 10, which correspond to the spacing between the signal terminals arranged on the test object 2, can be electrically connected to the wiring pattern 400 of the printed circuit board 40, which is arranged at a wider spacing than the spacing between the base ends. Widening the spacing between the second ends 42 of the wiring pattern 400 by the space transformer facilitates connection of the wiring pattern 400 of the printed circuit board 40 with the testing device.

[0017] 1, a stiffener 50 may be laminated on the printed circuit board 40. The stiffener 50 has higher rigidity than the printed circuit board 40, and prevents the printed circuit board 40 from bending, thereby ensuring the mechanical strength of the electrical connection device 1. Furthermore, the stiffener 50 may be used as a support for fixing each of the components of the electrical connection device 1. The printed circuit board 40 may be fixed to the stiffener 50 by, for example, screws.

[0018] 2 is a plan view of the laminated structure of the wiring sheet 20, the wiring board 30, the printed circuit board 40, and the stiffener 50, as viewed from the Z direction (hereinafter also referred to as "plan view"), in which the Z direction is the depth direction of the paper, the X direction is the left-right direction of the paper, and the Y direction is the up-down direction of the paper.

[0019] A stiffener 50 is disposed on the upper surface of a printed circuit board 40 that is circular in plan view. As shown in Fig. 2, for example, the stiffener 50 has a shape in which an outer circular ring and an inner rectangular ring are connected by spokes. A wiring board 30 and a wiring sheet 20 are disposed near the center of the lower surface of the printed circuit board 40. The wiring sheet 20, wiring board 30, printed circuit board 40, and stiffener 50 are fixed together with screws, for example.

[0020] A flexible material is used for the wiring sheet 20. Therefore, when the first connection portions 21 receive a pressing force from the base ends of the probes 10, the wiring sheet 20 elastically deforms to bias the first connection portions 21 toward the base ends. For example, when the tip ends of the probes 10 contact the test object 2, a pressing force is generated from the base ends of the probes 10 toward the first connection portions 21. In response to this pressing force, the wiring sheet 20 biases the first connection portions 21 toward the base ends. In this way, the electrical connection device 1 has a preload function that presses the probes 10 against the first connection portions 21 of the wiring sheet 20 during testing of the test object 2. Therefore, in the electrical connection device 1, contact between the probes 10 and the test object 2 is stable, and the accuracy of measurement of the test object 2 can be improved.

[0021] The wiring sheet 20 may have a structure in which a conductive film and an insulating film are laminated. For example, an internal circuit may be formed by a conductive pattern formed on the conductive film. FIG. 3 shows an example of the configuration of the wiring sheet 20. The wiring sheet 20 shown in FIG. 3 has a structure in which a laminate of a conductive film 202 and an insulating film 203 is sandwiched between a pair of cover films 201 made of an insulating material. The number of laminates of conductive films 202 and insulating films 203 can be set as desired. The conductive film 202 may be made of a metal material such as copper foil. The insulating film 203 may be made of an insulating material such as a polyimide sheet. The cover film 201 may be made of an insulating material such as solder resist. An adhesive may be used to bond the conductive film 202, the insulating film 203, and the cover film 201 to each other. The wiring sheet 20 may also have a structure in which an insulating film (also referred to as a "base film") is further sandwiched between the laminates including the conductive film 202 and the insulating film 203.

[0022] 3 provides flexibility due to the material of the wiring sheet 20, as well as elasticity in the stacking direction due to the laminated structure of a conductive film and an insulating film. Therefore, with the electrical connection device 1 including the wiring sheet 20, a preload function is achieved that presses the first connection portion 21 of the wiring sheet 20 against the probe 10 during testing of the test object 2. As a result, contact between the probe 10 and the test object 2 is stabilized, and the accuracy of measurement of the test object 2 can be improved.

[0023] The internal circuit of wiring sheet 20 may include, for example, a circuit (hereinafter also referred to as an "interposer circuit") that electrically connects first connection portion 21 and second connection portion 22. For example, when an interposer circuit is formed on wiring sheet 20 having the structure shown in Fig. 3, wiring is formed that penetrates cover film 201, conductive film 202, and insulating film 203 from first sheet surface 211 to second sheet surface 212.

[0024] When the internal circuit of the wiring sheet 20 includes an interposer circuit, the internal circuit of the wiring sheet 20 may include a short-circuiting wiring 231 that shorts the first connection portion 21 and the second connection portion 22, as shown in FIG. 4 . In the electrical connection device 1 having the wiring sheet 20 with the internal circuit shown in FIG. 4 , the DUT 2 and the inspection device are electrically connected via the probe 10, the internal circuit of the wiring sheet 20, the connection wiring 300 of the wiring board 30, and the wiring pattern 400 of the printed circuit board 40. This allows an electrical signal to propagate between the inspection device, such as an IC tester, and the DUT 2, thereby measuring the characteristics of the DUT 2. For example, the internal circuit of the wiring sheet 20 may connect the first connection portion 21 and the second connection portion 22 one-to-one. Alternatively, the internal circuit may connect one first connection portion 21 to multiple second connection portions 22, or multiple first connection portions 21 to one second connection portion 22.

[0025] As shown in FIG. 5 , the internal circuit of the wiring sheet 20 may include a matching circuit 232 having a first terminal connected to the first connection portion 21 and a second terminal connected to the second connection portion 22. The matching circuit 232 may be a circuit that matches impedance between the first connection portion 21 and the second connection portion 22. For example, the matching circuit 232 may include a π-type filter. By forming the matching circuit in the internal circuit of the wiring sheet 20, the wiring length between the test object 2 and the matching circuit can be shortened. This allows, for example, high-frequency measurements of the test object 2 to be performed stably.

[0026] Of course, the configuration of the internal circuit of the wiring sheet 20 is not limited to the above. For example, the internal circuit may include electronic components such as capacitors or inductors. The electronic components included in the internal circuit of the wiring sheet 20 may be formed using, for example, a MEMS (Micro Electro Mechanical Systems) process. By using the MEMS process, miniaturized elements can be formed integrally with the wiring sheet 20. Furthermore, the internal circuit may include a circuit (loopback circuit) that electrically connects one of the first connection portions 21 to another of the first connection portions 21. Alternatively, the internal circuit of the wiring sheet 20 may include a circuit that switches, for any first connection portion 21, either an interposer circuit that connects to any of the second connection portions 22 or a loopback circuit that connects to another first connection portion 21.

[0027] In the electrical connection device 1, electronic components electrically connected to the internal circuit can be arranged on the surface of the wiring sheet 20. For example, as shown in FIG. 6 , electronic components 100 connected to the internal circuit of the wiring sheet 20 may be arranged on each of the first sheet surface 211 and the second sheet surface 212. The electronic components 100 may be, for example, capacitors, inductors, or resistors. While FIG. 6 shows an example in which electronic components 100 are arranged on each of the first sheet surface 211 and the second sheet surface 212, the electronic components 100 may also be arranged on either the first sheet surface 211 or the second sheet surface 212. By arranging the electronic components 100 on the surface of the wiring sheet 20, it is possible to reduce or divide the electronic components arranged on, for example, the wiring board 30 or the printed circuit board 40. Furthermore, by arranging the electronic components on the surface of the wiring sheet 20, it is possible to shorten the wiring length between the test object 2 and the electronic components. Therefore, for example, by arranging electronic components such as capacitors that reduce power supply noise on the wiring sheet 20, measurements of the test object 2 can be performed stably.

[0028] Furthermore, by making the area of ​​the wiring sheet 20 larger than that of the wiring board 30 in a plan view, it is possible to place electronic components 100 in the remaining area of ​​the second sheet surface 212 excluding the area bonded to the wiring board 30, as shown in Figure 6. On the other hand, in an electrical connection device that does not include the wiring sheet 20, it is not possible to place electronic components on the second main surface of the wiring board 30 that faces the printed circuit board 40. In this way, the electrical connection device 1 can increase the number of electronic components that can be mounted.

[0029] As described above, the electrical connection device 1 according to the embodiment has a configuration in which the flexible wiring sheet 20 is disposed between the probes 10 and the wiring board 30. According to the electrical connection device 1, the preload function provided by the wiring sheet 20 stabilizes the contact between the probes 10 and the test object 2. As a result, the accuracy of measurement of the test object 2 can be improved.

[0030] Furthermore, the electrical connecting device 1 can increase the number of electronic components that can be mounted. Furthermore, the electrical connecting device 1 can shorten the wiring length between the inspection object 2 and the electronic components by arranging the electronic components near the inspection object 2. As a result, the accuracy of measurement of the inspection object 2 can be improved.

[0031] Furthermore, according to the electrical connecting device 1, by disposing the flexible wiring sheet 20 between the probe head 60 and the wiring board 30, the warping and unevenness of the surfaces of the probe head 60 and the wiring board 30 can be absorbed by the wiring sheet 20. This makes it possible to suppress rattles and poor contacts of the electrical connecting device 1 caused by gaps that occur between the probe head 60 and the wiring board 30.

[0032] Although the present invention has been described above by way of the embodiments, the descriptions and drawings that form part of this disclosure should not be understood to limit the present invention. Various alternative embodiments, examples, and operating techniques will become apparent to those skilled in the art from this disclosure.

[0033] For example, FIG. 1 shows a case where electrical connection device 1 equipped with wiring sheet 20 includes probes 10 that contact signal terminals of DUT 2. With electrical connection device 1 shown in FIG. 1 , it is possible to measure the electrical characteristics of DUT 2, for example, in a state where it is not separated from a wafer or in a state where it is formed into a chip. Meanwhile, wiring sheet 20 may be mounted on an electrical connection device including a test socket to measure the electrical characteristics of DUT 2 mounted in a package or the like. For example, instead of probes 10 and probe head 60 of electrical connection device 1 shown in FIG. 1 , a test socket having test terminals connectable to external terminals of a package on which DUT 2 is mounted may be disposed on wiring board 30.

[0034] As such, the present invention naturally includes various embodiments not described above. Therefore, the technical scope of the present invention is defined only by the invention-specifying matters according to the scope of the claims that are appropriate from the above description.

[0035] REFERENCE SIGNS LIST 1 Electrical connecting device 2 Test object 10 Probe 20 Wiring sheet 21 First connecting portion 22 Second connecting portion 30 Wiring board 31 First electrode 32 Second electrode 40 Printed circuit board 41 First end 42 Second end 50 Stiffener 60 Probe head 100 Electronic component 201 Cover film 202 Conductive film 203 Insulating film 211 First sheet surface 212 Second sheet surface 300 Connection wiring 400 Wiring pattern

Claims

1. An electrical connection device used for inspecting an object to be inspected, comprising: an inspection terminal having a tip portion arranged so as to be in contact with the object to be inspected and a base portion connected to the tip portion; a flexible wiring sheet whose opposite surfaces are defined by a first sheet surface and a second sheet surface, a first connection portion connected to the base portion of the inspection terminal being arranged on the first sheet surface, a second connection portion being arranged on the second sheet surface, and an internal circuit connecting the first connection portion and the second connection portion being formed between the first sheet surface and the second sheet surface; and a wiring board having a first main surface facing the second sheet surface, on which a first electrode connecting to the second connection portion is arranged, and a second main surface on which a second electrode electrically connecting to the first electrode is arranged.

2. The electrical connection device according to claim 1, further comprising an electronic component disposed on at least one of said first sheet surface and said second sheet surface of said wiring sheet and electrically connected to said internal circuit.

3. The electrical connection device according to claim 1, wherein the wiring sheet has a structure in which a laminate of a conductive film and an insulating film is sandwiched between cover films made of an insulating material.

4. An electrical connection device as described in any one of claims 1 to 3, wherein the wiring sheet elastically deforms so as to urge the first connection portion toward the base end when the first connection portion receives a pressing force from the base end.

5. The electrical connecting device according to claim 4, wherein the pushing force is generated from the base end toward the first connecting portion when the tip end of the inspection terminal comes into contact with the object to be inspected.

6. The electrical connection device according to any one of claims 1 to 3, further comprising a printed circuit board arranged opposite said wiring board and on which a wiring pattern connected to said second electrodes is arranged.

7. The electrical connecting device according to claim 6, wherein said wiring board is a space transformer that converts the spacing between said inspection terminals into the spacing between said wiring patterns of said printed circuit board when viewed in the normal direction of the main surface of said wiring board.

8. An electrical connection device according to any one of claims 1 to 3, wherein the inspection terminal is a probe having one end arranged so as to be in contact with a signal terminal of the object to be inspected and the other end connected to the first connection portion of the wiring sheet.

9. The electrical connecting device according to any one of claims 1 to 3, wherein the terminals for inspection are arranged in a test socket that connects with external terminals of a package in which the device under test is mounted.

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