Light emitting element and distance measurement device

Abstract

The present invention prevents returning light from intruding into a drive circuit while preventing an increase in manufacturing costs.　The present technology provides a light-emitting element and the like, with said light-emitting element comprising a first substrate that has a drive circuit, and a second substrate that is mounted on one surface side of the first substrate and that has a light-emitting unit which is driven by the drive circuit. The first substrate has two or more wiring layers that are electrically connected. Some of the wiring layers that are adjacent to each other in the thickness direction are arranged staggered with each other so as to cover at least a portion of the drive circuit when viewed in plan view from the second substrate side.

Description

Light emitting element and distance measuring device

[0001] The technology according to the present disclosure (hereinafter also referred to as "the technology") relates to a light-emitting element and a distance measuring device.

[0002] Conventionally, light-emitting elements such as vertical cavity surface-emitting lasers (VCSELs) that emit light perpendicular to a semiconductor substrate have been used in a wide variety of fields, including optical communications, optoelectronic devices, and optical sensing.

[0003] For example, Patent Document 1 discloses a vertical cavity surface emitting laser in which a laser chip is arranged on a laser driver IC.

[0004] International Publication No. 2020 / 100572

[0005] However, the light emitted by the light-emitting element is diffusely reflected and becomes returned light, which may enter the drive circuit (laser driver IC). When this returned light enters the drive circuit, the drive current fluctuates due to the photoelectric effect, which may cause fluctuations in the output intensity that is set to the desired output value.

[0006] One possible solution to this problem is to provide a light-shielding film, but in a configuration in which the laser chip is disposed on a laser driver IC, as in Patent Document 1, it is difficult to provide a light-shielding film around the laser chip. Furthermore, providing a light-shielding film increases manufacturing costs.

[0007] Therefore, a main object of the present technology is to provide a light emitting element and a distance measuring device that suppresses return light from entering a drive circuit while suppressing an increase in manufacturing costs.

[0008] The present technology provides a light-emitting element including: a first substrate having a drive circuit; and a second substrate having a light-emitting unit driven by the drive circuit and mounted on one surface of the first substrate, wherein the first substrate has two or more electrically connected wiring layers, and some of the wiring layers adjacent in a thickness direction are arranged in a staggered pattern so as to cover at least a portion of the drive circuit when viewed in a plan view from the second substrate side. The staggered wiring layer may be arranged near the second substrate. The second substrate, the staggered wiring layer, and the drive circuit may be stacked. The staggered wiring layer may be arranged in an upper layer. The staggered wiring layer may be arranged in a lower layer. The first substrate may have three or more wiring layers arranged in a staggered pattern. The staggered wiring layer may be arranged so as to cover the entire drive circuit when viewed in a plan view from the second substrate side. The wiring layer may include a material that blocks infrared rays. The wiring layer may contain at least one material selected from aluminum (Al), copper (Cu), tungsten (W), and gold (Au). The device may further include a light-shielding portion that shields at least a portion of the drive circuit from light emitted by the light-emitting portion. The light-shielding portion may be disposed on the second substrate side of the first substrate. The light-shielding portion may be disposed in a ring shape along the outer periphery of the first substrate. The light-emitting portion may include a vertical-cavity surface-emitting laser. The light emitted by the light-emitting portion may be infrared light. The present technology also provides a light-emitting element comprising: a first substrate having a drive circuit; and a second substrate having a light-emitting section driven by the drive circuit and mounted on one surface of the first substrate, wherein the first substrate has two or more electrically connected wiring layers, and when some of the wiring layers adjacent in the thickness direction are a first wiring layer and a second wiring layer, the second wiring layer is arranged to protrude from an end of the first wiring layer so as to cover at least a portion of the drive circuit when viewed in a plane from the second substrate side.The present technology also provides a distance measuring device comprising: a light-emitting element; and a light-receiving element; the light-emitting element comprises: a first substrate having a drive circuit; and a second substrate having a light-emitting portion driven by the drive circuit and mounted on one surface of the first substrate; the first substrate has two or more electrically connected wiring layers; some of the wiring layers adjacent in the thickness direction are arranged in a staggered pattern so as to cover at least a portion of the drive circuit when viewed in a plane from the second substrate side; and the light-receiving element has a light-receiving portion that receives light emitted by the light-emitting portion.

[0009] According to the present technology, it is possible to provide a light emitting element and a distance measuring device that suppress the intrusion of return light into a drive circuit while suppressing an increase in manufacturing costs. Note that the effects described herein are not necessarily limited to those described herein, and may be any of the effects described in the present disclosure.

[0010] 1 is a schematic perspective view showing a configuration example of a light-emitting device 100 according to an embodiment of the present technology; FIG. 2 is a schematic perspective view showing a comparative example of the light-emitting device 100 according to an embodiment of the present technology; FIG. 3 is a schematic cross-sectional view showing a comparative example of the light-emitting device 100 according to an embodiment of the present technology; FIG. 4 is a schematic cross-sectional view showing a configuration example of a simulation model of the light-emitting device 100 according to an embodiment of the present technology; FIG. 5 is a graph showing simulation results of the light-emitting device 100 according to an embodiment of the present technology; FIG. 6 is a schematic cross-sectional view showing a configuration example of the light-emitting device 100 according to an embodiment of the present technology; FIG. 7 is a schematic cross-sectional view showing a configuration example of the light-emitting device 100 according to an embodiment of the present technology; FIG. 8 is a schematic cross-sectional view showing a configuration example of the light-emitting device 100 according to an embodiment of the present technology; FIG. 9 is a schematic cross-sectional view showing a configuration example of the light-emitting device 100 according to an embodiment of the present technology; FIG. 10 is a schematic cross-sectional view showing a configuration example of the light-emitting device 100 according to an embodiment of the present technology; Fig. 1 is a schematic cross-sectional view showing a configuration example of a light-emitting element 100 according to an embodiment of the present technology. Fig. 2 is a schematic cross-sectional view showing a configuration example of a light-emitting element 100 according to an embodiment of the present technology. Fig. 3 is a schematic view showing a configuration example of a distance measuring device 1 according to an embodiment of the present technology. Fig. 4 is an explanatory diagram of an STL system. Fig. 5 is a block diagram showing a schematic configuration example of an electronic device including a light-emitting element 100 according to an embodiment of the present technology. Fig. 6 is a block diagram showing a schematic configuration example of a vehicle control system that is an example of a mobile object control system to which the present technology can be applied. Fig. 7 is a diagram showing an example of an installation position of a distance measuring device 12031 according to an embodiment of the present technology.

[0011] Hereinafter, preferred embodiments for implementing the present technology will be described with reference to the drawings. Note that the embodiment described below shows an example of a typical embodiment of the present technology, and does not limit the scope of the present technology. In addition, the present technology can be combined with any of the following examples and their modifications.

[0012] In the following description of the embodiments, configurations may be described using terms including "approximately," such as "approximately parallel" and "approximately perpendicular." For example, "approximately parallel" does not only mean completely parallel, but also means substantially parallel, i.e., including a state where the orientation is deviated from the completely parallel state by, for example, a few percent. The same applies to other terms including "approximately." Furthermore, each figure is a schematic diagram and is not necessarily an accurate depiction. The scale of the drawings has been exaggerated to make the features of the technology easier to understand. Therefore, it should be noted that the scale of the drawings and the scale of the actual device are not necessarily the same.

[0013] Unless otherwise specified, in the drawings, "top" means the top or upper side in the drawing, "bottom" means the bottom or lower side in the drawing, "left" means the left or left side in the drawing, and "right" means the right or right side in the drawing. Furthermore, in the drawings, the same or equivalent elements or members are given the same reference numerals, and redundant explanations will be omitted.

[0014] The description will be given in the following order: 1. First Embodiment of the Present Technology (Example 1 of Light-Emitting Element) (1) Overview (2) Configuration Example of Light-Emitting Element 100 (3) Arrangement of Wiring Layer 13 (4) Simulation (5) Vertical-Cavity Surface-Emitting Laser 2. Second Embodiment of the Present Technology (Example 2 of Light-Emitting Element) 3. Third Embodiment of the Present Technology (Example 3 of Light-Emitting Element) 4. Fourth Embodiment of the Present Technology (Example 4 of Light-Emitting Element) 5. Fifth Embodiment of the Present Technology (Example 5 of Light-Emitting Element) 6. Sixth Embodiment of the Present Technology (Example of Distance Measuring Device) (1) Configuration of Distance Measuring Device 1 (2) Distance Measuring Method 7. Seventh Embodiment of the Present Technology (Example 1 of Electronic Device) 8. Eighth Embodiment of the Present Technology (Example 2 of Electronic Device)

[0015] [1. First Embodiment of the Present Technology (Example 1 of Light-Emitting Device)] [(1) Overview] A configuration example of a light-emitting device according to an embodiment of the present technology will be described with reference to Fig. 1. Fig. 1 is a schematic perspective view showing a configuration example of a light-emitting device 100 according to an embodiment of the present technology. As shown in Fig. 1, the light-emitting device 100 includes a first substrate 10, a second substrate 20, and a substrate 11.

[0016] The first substrate 10 has a drive circuit 12. The drive circuit 12 is an electric circuit that drives the light emitting unit 21. The drive circuit 12 is provided, for example, in a substrate called an LDD (Laser Diode Driver) substrate.

[0017] The second substrate 20 has a light-emitting unit 21 driven by the drive circuit 12, and is mounted on one surface of the first substrate 10. That is, the second substrate 20 is arranged by being stacked on the first substrate 10. This shortens the wiring connecting the first substrate 10 and the second substrate 20, thereby enabling high-speed driving of the light-emitting element 100. Furthermore, since the arrangement area is smaller than in a configuration in which the first substrate 10 and the second substrate 20 are arranged side by side, the light-emitting element 100 can be miniaturized. This will be described with reference to FIG. 2. FIG. 2 is a schematic perspective view showing a comparative example of the light-emitting element 100 according to an embodiment of the present technology.

[0018] As shown in Fig. 2, this comparative example has a configuration in which the first substrate 10 and the second substrate 20 are arranged side by side. Therefore, the wiring connecting the first substrate 10 and the second substrate 20 is long, which may result in a lower driving speed than in a configuration in which the first substrate 10 and the second substrate 20 are stacked (see Fig. 1). Furthermore, in the comparative example shown in Fig. 2, the area in which the first substrate 10 and the second substrate 20 are arranged is larger than in a configuration in which the first substrate 10 and the second substrate 20 are stacked (see Fig. 1). Therefore, there is a risk that the light-emitting element 100 may become larger.

[0019] Incidentally, light emitted from the light-emitting unit 21 may be diffused by components constituting the device, become returned light, and enter the drive circuit 12. This will be described with reference to Fig. 3. Fig. 3 is a schematic cross-sectional view showing a comparative example of the light-emitting element 100 according to an embodiment of the present technology.

[0020] 3 , in this comparative example, the light emitting element 101 includes a first substrate 10 having a drive circuit 12, and a second substrate 20 having a light emitting unit 21 driven by the drive circuit 12 and mounted on one surface of the first substrate 10. The first substrate 10 and the second substrate 20 are electrically connected via bump electrodes 22.

[0021] The first substrate has a wiring layer 13 electrically connected to a power supply circuit (not shown), a drive circuit 12, etc. The light emitted by the light emitting unit 21 is diffusely reflected to become return light L, which passes through gaps between the wiring layers 13 and enters the substrate 11.

[0022] The returning light L that has entered the substrate 11 may further enter the drive circuit 12. When the returning light L enters the drive circuit 12, the drive current fluctuates due to the photoelectric effect, which may cause fluctuations in the output intensity that has been set to the desired output value.

[0023] As a countermeasure against the intrusion of the return light L, a light-shielding film may be formed from, for example, a resin material or a metal material and disposed on the first substrate 10 having the drive circuit 12, thereby making it possible to suppress the intrusion of the return light L.

[0024] However, due to the structure of the light-emitting element 100, it is difficult to bring the second substrate 20 into contact with the light-shielding film, and a gap of several μm must be formed around the periphery of the second substrate 20. As a result, there is a risk that the returning light L may enter through this gap. Furthermore, if the light-shielding film is made of a metal material, there is a risk that the light-shielding film may come into contact with the wiring layer 13, causing a short circuit. Furthermore, since a light-shielding film cannot be formed between the first substrate 10 and the second substrate 20, there is a risk that the returning light L may penetrate the second substrate 20 and enter the first substrate 10.

[0025] [(2) Configuration Example of Light-Emitting Device 100] Therefore, in the present technology, the arrangement of the electrically connected wiring layer 13 is devised to suppress the intrusion of the returning light L. This will be described with reference to Fig. 4. Fig. 4 is a schematic cross-sectional view showing a configuration example of the light-emitting device 100 according to an embodiment of the present technology.

[0026] As shown in Figure 4, the light-emitting element 100 comprises a first substrate 10 having a drive circuit 12, and a second substrate 20 having a light-emitting section 21 driven by the drive circuit and mounted on one side of the first substrate 10.

[0027] The first substrate 10 has an insulating layer 15 and two or more electrically connected wiring layers 13 on a substrate 11. The wiring layers 13 are electrically connected to a power supply circuit (not shown), a drive circuit 12, and the like.

[0028] The light-emitting element 100 is configured by stacking a second substrate 20, a staggered wiring layer 13, and a drive circuit 12. The first substrate 10 and the second substrate 20 are electrically connected via bump electrodes 22 and pad electrodes 14. This configuration shortens the wiring connecting the drive circuit 12 and the second substrate 20, enabling high-speed drive of the light-emitting element 100. Furthermore, the layout area is smaller than in a configuration in which the first substrate 10 and the second substrate 20 are arranged side by side, allowing the light-emitting element 100 to be made smaller.

[0029] Each of the multiple wiring layers 13 is disposed on an upper layer 13a, which is a layer on the second substrate 20 side, and a lower layer 13b, which is a layer on the substrate 11 side. The wiring layer 13 disposed on the upper layer 13a is formed to have a thickness in the vertical direction that is thicker than the wiring layer 13 disposed on the lower layer 13b. Specifically, the wiring layer 13 disposed on the upper layer 13a is formed to be about 10 times thicker than the wiring layer 13 disposed on the lower layer 13b.

[0030] In this case, it is preferable that some of the wiring layers 13 adjacent to each other in the thickness direction are arranged in a staggered pattern so as to cover at least a part of the drive circuit 12 when viewed in plan from the second substrate 20 side.

[0031] In other words, when some of the wiring layers 13 adjacent in the thickness direction arranged on the upper layer 13a are a first wiring layer 131 and a second wiring layer 132, it is preferable that the second wiring layer 132 is arranged to protrude from the end of the first wiring layer 131 so as to cover at least a portion of the drive circuit 12 when viewed in a plane from the second substrate 20 side.

[0032] Similarly, when some of the wiring layers 13 adjacent in the thickness direction arranged on the lower layer 13b are a first wiring layer 133 and a second wiring layer 134, it is preferable that the second wiring layer 134 is arranged to protrude from the end of the first wiring layer 133 so as to cover at least a portion of the drive circuit 12 when viewed in a plane from the second substrate 20 side.

[0033] According to the present technology, the wiring layers 13 arranged in a staggered pattern attenuate the returning light, thereby preventing it from entering the driving circuit.

[0034] According to this technology, in the existing wiring layer formation process, it is only necessary to devise the arrangement of the wiring layer, and the formation of a light-shielding film is not necessary. Therefore, the process of forming the light-shielding film is not necessary, and a decrease in manufacturing efficiency can be prevented. Furthermore, since the light-shielding film is not required, manufacturing costs can be reduced and electromagnetic noise generation when the light-shielding film is made of a metal material can be prevented.

[0035] 2, in a configuration in which the first substrate 10 and the second substrate 20 are arranged side by side, the drive circuit 12 of the first substrate 10 can be shielded from light by, for example, extending a wiring layer (not shown) to the vicinity of the drive circuit 12. Since the drive circuit 12 is arranged at a position far from the light-emitting section 21, it is relatively easy to extend the wiring layer.

[0036] 4 , in a configuration in which the second substrate 20 is stacked on the first substrate 10, the wiring density around the power supply circuit significantly affects characteristics such as impedance, making it difficult to simply extend the wiring layer 13. As a result of extensive research, the inventors have succeeded in suppressing changes in characteristics such as impedance while achieving a light-blocking effect by devising a staggered arrangement of the wiring layer 13.

[0037] The above-described effects are also achieved in other embodiments described below, and therefore, repeated description of the other embodiments may be omitted.

[0038] [(3) Arrangement of wiring layer 13] As shown in Figure 4, if the areas of the second wiring layers 132 and 134 that extend beyond the ends of the first wiring layers 131 and 133 are arranged to cover at least a portion of the drive circuit 12, the return light L can be sufficiently attenuated.

[0039] However, when viewed in plan from the second substrate 20 side, it is more preferable that the staggered wiring layers 13 are arranged so as to cover the entire drive circuit 12. In other words, it is more preferable that the areas of the second wiring layers 132, 134 that extend beyond the ends of the first wiring layers 131, 133 are arranged so as to cover the entire drive circuit 12.

[0040] Furthermore, it is preferable that the wiring layers 13 arranged in a staggered pattern are arranged near the second substrate 20. This allows the wiring layers 13 arranged in a staggered pattern to attenuate the returning light that penetrates the second substrate 20. Furthermore, due to the structure of the light-emitting element 100, it is necessary to form a gap of at least several μm around the periphery 23 of the second substrate 20, making it difficult to form a light-shielding portion around the periphery 23 of the second substrate 20. Therefore, the wiring layers 13 arranged in a staggered pattern can attenuate the returning light that enters through this gap.

[0041] As shown in Fig. 5, which will be described later, at least two wiring layers 13 arranged in a staggered pattern are effective in attenuating the returning light. As shown in Fig. 4, when the first substrate 10 has three or more wiring layers 13 arranged in a staggered pattern, the effect of attenuating the returning light is further enhanced.

[0042] While the positional relationship between the wiring layers 13 has been described above, the same can be said for the positional relationship between the wiring layers 13 and the pad electrodes 14. As shown in Fig. 4, some pad electrodes 14 and wiring layers 13 adjacent to each other in the thickness direction may be arranged in a staggered pattern so as to cover at least a portion of the drive circuit 12 when viewed in plan from the second substrate 20 side. In other words, the wiring layers 13 may be arranged to protrude from the ends of the pad electrodes 14 so as to cover at least a portion of the drive circuit 12 when viewed in plan from the second substrate 20 side.

[0043] [(4) Simulation] Because the second wiring layer 132 is disposed so as to protrude beyond the end of the first wiring layer 131, the returning light L collides with this protruding region and is attenuated. A simulation was performed to confirm this. This simulation will be described with reference to FIGS. 5 and 6. FIG. 5 is a schematic cross-sectional view showing an example configuration of a simulation model of the light-emitting element 100 according to an embodiment of the present technology. FIG. 6 is a graph showing a simulation result of the light-emitting element 100 according to an embodiment of the present technology.

[0044] As shown in FIG. 5, in this simulation model, a first wiring layer 131, a second wiring layer 132, and an insulating layer 15 are formed on a substrate 11.

[0045] A light-emitting section 41 is disposed above the wiring layer 13. A light-receiving section 42 is disposed on one surface of the substrate 11. Light emitted from the light-emitting section 41 collides with the first wiring layer 131 and / or the second wiring layer 132 and is received by the light-receiving section 42.

[0046] The first wiring layer 131 and the second wiring layer 132 are adjacent to each other in the thickness direction. When viewed from above, the second wiring layer 132 is arranged to protrude from the end of the first wiring layer 131. The protruding length is defined as x [μm].

[0047] In this simulation, the transmittance was calculated based on the intensity of light emitted by the light-emitting unit 41 and the intensity of light received by the light-receiving unit 42. In Fig. 6, the vertical axis represents the transmittance [%] of light received by the light-receiving unit 42. The greater the effect of the wiring layer 13 in attenuating light, the lower the light transmittance.

[0048] The horizontal axis represents the length x [μm] of the second wiring layer 132 that protrudes from the end of the first wiring layer 131. The light transmittance is plotted against the protruding length x.

[0049] In the first state S1, the wiring layer 13 is not formed, and therefore light is not attenuated. That is, in this state, the intensity of the light emitted by the light-emitting portion 41 is the same as the intensity of the light received by the light-receiving portion 42. The light transmittance in this first state S1 is defined as 100%.

[0050] The second state S2 is a state in which the wiring layer 13 is formed and the second wiring layer 132 does not protrude from the end of the first wiring layer 131. In other words, the first wiring layer 131 and the second wiring layer 132 completely overlap each other. In the second state S2, light is attenuated by colliding with the wiring layer 13. Therefore, the light transmittance in the second state S2 is lower than the light transmittance in the first state S1.

[0051] As the protruding length x is gradually increased, the light receiving section 42 is covered by the protruding area, and the transmittance decreases rapidly. This shows that even if the protruding length x is small, a sufficient effect is produced.

[0052] In the third state S3, the wiring layer 13 is formed, and the second wiring layer 132 protrudes from the end of the first wiring layer 131. Furthermore, the left end 131a of the first wiring layer 131 and the right end 132a of the second wiring layer 132 are arranged side by side in the thickness direction. In the third state S3, the transmittance is 0.1% or less.

[0053] From the second state S2 to the third state S3, a part of the light receiving portion 42 is covered by the wiring layer 13, and a part of the light receiving portion 42 is exposed. On the other hand, in the third state S3, the light receiving portion 42 is completely covered by the wiring layer 13, and is not exposed. From this, it can be seen that it is preferable that the drive circuit 12 is completely covered by the wiring layer 13, and is not exposed.

[0054] In the fourth state S4, the wiring layer 13 is formed, and the second wiring layer 132 protrudes from the end of the first wiring layer 131. Furthermore, the left region 131b of the first wiring layer 131 and the right region 132b of the second wiring layer 132 are arranged to overlap in the thickness direction. In the fourth state S4, the transmittance is 0.1% or less, similar to the third state S3.

[0055] From the above simulation results, it was confirmed that when the wiring layer 13 is arranged in a staggered pattern (the second wiring layer 132 extends beyond the end of the first wiring layer 131), and the exposed area of ​​the substrate 11 is reduced, it is possible to sufficiently attenuate light.

[0056] [(5) Vertical Cavity Surface Emitting Laser] The light emitting unit 21 according to an embodiment of the present technology may include, for example, a vertical cavity surface emitting laser (VCSEL). The VCSEL may be electrically connected to the drive circuit 12 via bump electrodes 22 (see FIG. 4, etc.).

[0057] VCSELs feature multi-channel emission, which allows multiple emitters to emit light simultaneously. Furthermore, VCSELs can be implemented in array and stacked structures. However, because VCSELs have higher light intensity than, for example, LEDs (Light Emitting Diodes), the intensity of the returned light, which is the emitted laser light that is diffusely reflected and returned, tends to be higher. Therefore, it is preferable that the light-emitting element 100 have some kind of light-shielding function. According to this technology, the returned light can be attenuated by devising the arrangement of the wiring layer 13.

[0058] When the light-emitting element 100 includes a VCSEL, the light emitted from the light-emitting portion 21 is infrared, and the return light may also be infrared. Therefore, it is preferable that the wiring layer 13 contains a material that blocks infrared. Furthermore, since the wiring layer 13 is electrically connected to a power supply circuit, a drive circuit, etc., it is preferable that the wiring layer 13 contains a conductive material.

[0059] Specifically, it is preferable that the wiring layer 13 contains at least one material selected from aluminum (Al), copper (Cu), tungsten (W), and gold (Au), which allows the wiring layer 13 to attenuate returning light while maintaining electrical conductivity.

[0060] The above description of the light emitting device 100 according to the first embodiment of the present technology can be applied to other embodiments of the present technology unless there is a particular technical contradiction.

[0061] 2. Second Embodiment of the Present Technology (Example 2 of Light-Emitting Device)] A configuration example of a light-emitting device 100 according to an embodiment of the present technology will be described with reference to Fig. 7. Fig. 7 is a schematic cross-sectional view showing a configuration example of a light-emitting device 100 according to an embodiment of the present technology.

[0062] 7, it is preferable that the staggered wiring layers 13 are arranged on the upper layer 13a. The wiring layers 13 arranged on the upper layer 13a are easier to change the arrangement of than the wiring layers 13 arranged on the lower layer 13b. Furthermore, when the staggered wiring layers 13 are arranged on the upper layer 13a, the effect of attenuating the returning light is enhanced.

[0063] The wiring layers 13 arranged in the lower layer 13b are preferably arranged in a staggered pattern, but they do not have to be arranged in a staggered pattern as shown in this figure.

[0064] The staggered arrangement pattern will be further described with reference to Figures 8 to 11. Figures 8 to 11 are schematic cross-sectional views showing configuration examples of a light-emitting device 100 according to an embodiment of the present technology.

[0065] 8 , a left end 131a of the first wiring layer 131 and a right end 132a of the second wiring layer 132 disposed on the upper layer 13a may be arranged side by side in the thickness direction (the up-down direction in the figure) of the light emitting element 100. Also, a right region 131b of the first wiring layer 131 and a left region 132b of the second wiring layer 132 may be arranged to overlap each other in the thickness direction of the light emitting element 100.

[0066] 9 , a left region 131 a of the first wiring layer 131 and a right region 132 a of the second wiring layer 132 disposed on the upper layer 13 a may be disposed so as to overlap each other in the thickness direction (the up-down direction in the figure) of the light emitting element 100. Also, a right region 131 b of the first wiring layer 131 and a left region 132 b of the second wiring layer 132 may be disposed so as to overlap each other in the thickness direction of the light emitting element 100.

[0067] 10 , the length of the second wiring layer 132 in the radial direction of the light emitting element 100 (the left-right direction in the figure) may be at least twice the length of the first wiring layer 131. Although not limited thereto, a length of at least three times, and more preferably at least four times, can be exemplified.

[0068] In this configuration example, the left end of the first wiring layer 131 and the right end of the second wiring layer 132 are arranged side by side in the thickness direction (the up-down direction in the figure) of the light emitting element 100. A part of the first wiring layer 131 and a part of the second wiring layer 132 may be arranged to overlap each other in the thickness direction of the light emitting element 100.

[0069] 11 , some of the wiring layers 13 may be arranged in a staggered pattern, and some may be arranged to overlap each other. In this configuration example, the first wiring layer 131 and the second wiring layer 132 are arranged in a staggered pattern, and the second wiring layer 132 and the third wiring layer 135 are arranged to overlap each other.

[0070] The above description of the light emitting device 100 according to the second embodiment of the present technology can be applied to other embodiments of the present technology unless there is a particular technical contradiction.

[0071] 3. Third Embodiment of the Present Technology (Example 3 of Light-Emitting Device)] A configuration example of a light-emitting device 100 according to an embodiment of the present technology will be described with reference to Fig. 12. Fig. 12 is a schematic cross-sectional view showing a configuration example of a light-emitting device 100 according to an embodiment of the present technology.

[0072] As shown in FIG. 12, the wiring layers 13 arranged in a staggered pattern may be arranged on the lower layer 13b.

[0073] The wiring layers 13 arranged on the upper layer 13a are preferably arranged in a staggered pattern, but they do not have to be arranged in a staggered pattern as shown in this figure.

[0074] The staggered arrangement pattern will be further described with reference to Fig. 13 to Fig. 15. Fig. 13 to Fig. 15 are schematic cross-sectional views showing configuration examples of a light-emitting device 100 according to an embodiment of the present technology.

[0075] 13 , a left end 133a of the first wiring layer 133 and a right end 134a of the second wiring layer 134, which are disposed on the lower layer 13b, may be disposed side by side in the thickness direction (the up-down direction in the figure) of the light emitting element 100. Also, a right region 133b of the first wiring layer 133 and a left region 134b of the second wiring layer 134 may be disposed so as to overlap each other in the thickness direction of the light emitting element 100.

[0076] 14, the length of the second wiring layer 134 in the radial direction of the light emitting element 100 (the left-right direction in the figure) may be at least twice the length of the first wiring layer 133. Although not limited thereto, a length of at least three times, and more preferably at least four times, can be exemplified.

[0077] In this configuration example, the left end of the first wiring layer 133 and the right end of the second wiring layer 134 are arranged side by side in the thickness direction (the up-down direction in the figure) of the light emitting element 100. A part of the first wiring layer 133 and a part of the second wiring layer 134 may be arranged to overlap each other in the thickness direction of the light emitting element 100.

[0078] 15, some of the wiring layers 13 may be arranged in a staggered pattern, and some may be arranged to overlap each other. In this configuration example, the first wiring layer 133 and the second wiring layer 134 arranged in the lower layer 13b are arranged in a staggered pattern, and the first wiring layer 133 and the third wiring layer 136 are arranged to overlap each other.

[0079] The above description of the light emitting device 100 according to the third embodiment of the present technology can be applied to other embodiments of the present technology unless there is a particular technical contradiction.

[0080] [4. Fourth Embodiment of the Present Technology (Light-Emitting Element Example 4)] As described above, the wiring layers 13 are arranged in a staggered pattern to attenuate the returning light, but a light-shielding portion may be further provided to further enhance the attenuation effect. This will be described with reference to Fig. 16. Fig. 16 is a schematic cross-sectional view showing a configuration example of a light-emitting element 100 according to an embodiment of the present technology.

[0081] 16 , the light-emitting element 100 according to an embodiment of the present technology further includes a light-shielding portion 30 that shields at least a part of the drive circuit 12 from light emitted by the light-emitting portion 21. The light-shielding portion 30 is preferably disposed on the first substrate 10 having the drive circuit 12, on the side of the second substrate 20 where a large amount of returning light penetrates. In this configuration example, the light-shielding portion 30 is formed on the surface of the first substrate 10, but the position where the light-shielding portion 30 is disposed is not particularly limited. The light-shielding portion 30 may be disposed inside the first substrate 10 or on the second substrate 20, for example.

[0082] The light-shielding portion 30 preferably includes a metal material that blocks infrared rays when in a thin film state. The light-shielding portion 30 preferably includes a material that blocks infrared rays, such as aluminum (Al), copper (Cu), tungsten (W), or gold (Au). Alternatively, the light-shielding portion 30 may include a resin material that blocks infrared rays. The light-shielding portion 30 may include, for example, a black resin material to block infrared rays.

[0083] The above description of the light emitting device 100 according to the fourth embodiment of the present technology can be applied to other embodiments of the present technology unless there is a particular technical contradiction.

[0084] 5. Fifth Embodiment of the Present Technology (Fifth Example of Light-Emitting Device)] Another arrangement pattern of the light-shielding portion will be described with reference to Fig. 17 and Fig. 18. Fig. 17 and Fig. 18 are schematic cross-sectional views showing configuration examples of the light-emitting device 100 according to an embodiment of the present technology.

[0085] 17, the light-shielding portion 31 is arranged in a ring shape along the outer periphery of the first substrate 10. This allows the light-shielding portion 31 to attenuate the return light entering from the side surface of the light-emitting element 100.

[0086] In this configuration example, the light-shielding portion 31 is disposed inside the first substrate 10, but there are no particular limitations on the location of the light-shielding portion 31. The light-shielding portion 31 may be disposed on the surface of the first substrate 10 or on the second substrate 20, for example.

[0087] 18, dummy wiring layers 32 may be arranged as an example of the light-shielding portion 31. The dummy wiring layers are preferably arranged in a staggered pattern. Since the dummy wiring layers 32 are not electrically connected, they are unlikely to affect characteristics such as impedance. Therefore, they can be easily arranged.

[0088] Although not shown in the drawings, an electrically connected wiring layer 13 may be arranged as an example of the light-shielding portion 31. The electrically connected wiring layers are preferably arranged in a staggered pattern.

[0089] Alternatively, although not shown, an example of the light-shielding portion 31 may be configured by combining the dummy wiring layer 32 and the wiring layer 13 electrically connected thereto.

[0090] The above description of the light emitting device 100 according to the fifth embodiment of the present technology can be applied to other embodiments of the present technology unless there is a particular technical contradiction.

[0091] [6. Sixth Embodiment of the Present Technology (Example of Distance Measuring Device)] [(1) Configuration of Distance Measuring Device 1] The present technology provides a distance measuring device including a light-emitting element 100 according to any one of the first to fifth embodiments of the present technology. That is, this distance measuring device includes a light-emitting element and a light-receiving element, and the light-emitting element includes a first substrate having a drive circuit and a second substrate having a light-emitting unit driven by the drive circuit and mounted on one surface of the first substrate. The first substrate has two or more electrically connected wiring layers, and some of the wiring layers adjacent in the thickness direction are arranged in a staggered pattern so as to cover at least a portion of the drive circuit when viewed in a plan view from the second substrate side. The light-receiving element includes a light-receiving unit that receives light emitted by the light-emitting unit.

[0092] An example of the configuration of a distance measuring device according to an embodiment of the present technology will be described with reference to Fig. 19. Fig. 19 is a schematic diagram showing an example of the configuration of a distance measuring device 1 according to an embodiment of the present technology.

[0093] As shown in FIG. 19, the distance measuring device 1 includes a light emitting unit 2, a driving unit 3, a power supply circuit 4, a light emitting side optical system 5, a light receiving side optical system 6, a light receiving unit 7, a signal processing unit 8, a control unit 9, and a temperature detection unit 10.

[0094] The light emitting unit 2 emits light from a plurality of light sources. As will be described later, the light emitting unit 2 in this example has light emitting elements 100, such as vertical cavity surface emitting lasers (VCSELs), as light sources, and the light emitting elements 100 are arranged in a predetermined pattern, such as a matrix.

[0095] The driver 3 is configured to have a power supply circuit for driving the light-emitting unit 2. The power supply circuit 4 generates a power supply voltage (a driving voltage Vd, which will be described later) for the driver 3 based on an input voltage (an input voltage Vin, which will be described later) from, for example, a battery (not shown) or the like provided in the distance measuring device 1. The driver 3 drives the light-emitting unit 2 based on the power supply voltage.

[0096] Light emitted from the light-emitting unit 2 is irradiated onto a subject S, which is the object of distance measurement, via a light-emitting optical system 5. The light thus irradiated is reflected from the subject S and enters the light-receiving surface of a light-receiving unit 7 via a light-receiving optical system 6.

[0097] The light receiving unit 7 is a light receiving element such as a CCD (Charge Coupled Device) sensor or a CMOS (Complementary Metal Oxide Semiconductor) sensor, and receives reflected light from the subject S that enters through the light receiving side optical system 6 as described above, converts it into an electrical signal, and outputs it.

[0098] The light receiving unit 7 performs processes such as CDS (Correlated Double Sampling) and AGC (Automatic Gain Control) on the electrical signal obtained by photoelectrically converting the received light, and then performs A / D (Analog / Digital) conversion on the electrical signal, and outputs the resulting digital data to the signal processing unit 8 at the downstream side.

[0099] Furthermore, the light receiving unit 7 in this example outputs a frame synchronization signal Fs to the driving unit 3. This enables the driving unit 3 to cause the light emitting element 100 in the light emitting unit 2 to emit light at a timing according to the frame period of the light receiving unit 7.

[0100] The signal processing unit 8 is configured as a signal processor, for example, a DSP (Digital Signal Processor), etc. The signal processing unit 8 performs various signal processes on the digital signal input from the light receiving unit 7.

[0101] The control unit 9 is configured with, for example, a microcomputer having a CPU (Central Processing Unit), ROM (Read Only Memory), RAM (Random Access Memory), etc., or an information processing device such as a DSP, and controls the drive unit 3 for controlling the light emission operation by the light emitting unit 2, and controls the light receiving operation by the light receiving unit 7.

[0102] The control unit 9 has a function as a distance measuring unit 9a. The distance measuring unit 9a measures the distance to the subject S based on a signal input via the signal processing unit 8 (i.e., a signal obtained by receiving reflected light from the subject S). The distance measuring unit 9a in this example measures the distance to each part of the subject S in order to be able to identify the three-dimensional shape of the subject S. Note that the specific distance measuring method in the distance measuring device 1 will be described again later.

[0103] The temperature detection unit 10 detects the temperature of the light-emitting unit 2. The temperature detection unit 10 may be configured to detect temperature using, for example, a diode. In this example, information about the temperature detected by the temperature detection unit 10 is supplied to the drive unit 3, which enables the drive unit 3 to drive the light-emitting unit 2 based on the temperature information.

[0104] (2) Distance Measurement Method As a distance measurement method in the distance measuring device 1, for example, a distance measurement method based on the STL (Structured Light) method or the ToF (Time of Flight) method can be adopted.

[0105] The STL method is a method for measuring distance based on an image of a subject S illuminated with light having a predetermined light / dark pattern, such as a dot pattern or a grid pattern. The STL method will be described with reference to Fig. 20. Fig. 20 is an explanatory diagram of the STL method.

[0106] In the STL method, pattern light Lp having a dot pattern such as that shown in Fig. 20A is irradiated onto a subject S. The pattern light Lp is divided into a plurality of blocks BL, and a different dot pattern is assigned to each block BL (dot patterns are arranged so as not to overlap between blocks BL).

[0107] 20B is an explanatory diagram of the distance measurement principle of the STL method. In this example, a wall W and a box BX placed in front of it are considered as the subject S, and pattern light Lp is irradiated onto the subject S. "G" in the figure schematically represents the angle of view of the light receiving unit 7.

[0108] In addition, in the drawing, "BLn" denotes the light of a certain block BL in the pattern light Lp, and "dn" denotes the dot pattern of the block BLn projected on the light-receiving image by the light-receiving unit 7.

[0109] Here, if there is no box BX in front of the wall W, the dot pattern of the block BLn is projected at the position "dn'" in the figure in the received light image. In other words, the position at which the pattern of the block BLn is projected in the received light image differs depending on whether the box BX is present or not, and specifically, the pattern is distorted.

[0110] The STL method utilizes the fact that the irradiated pattern is distorted by the object shape of the subject S to determine the shape and depth of the subject S. Specifically, this method determines the shape and depth of the subject S from the way the pattern is distorted.

[0111] When the STL system is adopted, for example, an infrared (IR) light receiving unit using a global shutter system is used as the light receiving unit 7. In the case of the STL system, the distance measuring unit 9 a controls the driving unit 3 so that the light emitting unit 2 emits pattern light, detects distortion of the pattern in the image signal obtained via the signal processing unit 8, and calculates the distance based on the distortion of the pattern.

[0112] Next, the ToF method is a method for measuring the distance to an object by detecting the time of flight (time difference) of light emitted from the light-emitting unit 2, reflected by the object, and reaching the light-receiving unit 7.

[0113] When the so-called direct ToF (dToF) method is adopted as the ToF method, a SPAD (Single Photon Avalanche Diode) is used as the light receiving unit 7, and the light emitting unit 2 is pulse-driven. In this case, the distance measuring unit 9a calculates the time difference between the light emitted by the light emitting unit 2 and the light received by the light receiving unit 7, based on a signal input via the signal processing unit 8, and calculates the distance to each part of the subject S based on the time difference and the speed of light.

[0114] When the so-called indirect ToF (iToF) method (phase difference method) is adopted as the ToF method, a light receiving unit capable of receiving, for example, IR light is used as the light receiving unit 7 .

[0115] The above description of the distance measuring device according to the sixth embodiment of the present technology can be applied to other embodiments of the present technology unless there is a particular technical contradiction.

[0116] 7. Seventh Embodiment of the Present Technology (First Example of Electronic Device)] The present technology provides an electronic device including the light-emitting element 100 according to any one of the first to fifth embodiments of the present technology.

[0117] An example of the electronic device is a distance measuring device. Fig. 21 is a block diagram showing a schematic configuration example of an electronic device including a light-emitting element 100 according to an embodiment of the present technology. A distance measuring device 1000, which is an example of this electronic device, measures the distance to a subject S using a ToF (Time of Flight) method. The distance measuring device 1000 includes the light-emitting element 100 as a light source. The distance measuring device 1000 includes, for example, the light-emitting element 100, a light-receiving device 125, lenses 117 and 130, a signal processing unit 140, a control unit 150, a display unit 160, and a storage unit 170.

[0118] The light emitting element 100 is driven by a laser driver (driver). The laser driver has an anode terminal and a cathode terminal connected to the anode electrode and cathode electrode of the light emitting element 100 via wiring or conductive bumps, respectively. The laser driver is configured to include circuit elements such as capacitors and transistors.

[0119] The light receiving device 125 detects the light reflected by the subject S. The lens 117 is a collimating lens that converts the light emitted from the light emitting element 100 into parallel light. The lens 130 is a condensing lens that collects the light reflected by the subject S and guides it to the light receiving device 125.

[0120] The signal processing unit 140 is a circuit for generating a signal corresponding to the difference between the signal input from the light receiving device 125 and the reference signal input from the control unit 150. The control unit 150 is configured to include, for example, a time-to-digital converter (TDC). The reference signal may be a signal input from the control unit 150 or an output signal from a detection unit that directly detects the output of the light emitting element 100. The control unit 150 is, for example, a processor that controls the light emitting element 100, the light receiving device 125, the signal processing unit 140, the display unit 160, and the storage unit 170. The control unit 150 is a circuit that measures the distance to the subject S based on the signal generated by the signal processing unit 140. The control unit 150 generates a video signal for displaying information about the distance to the subject S and outputs it to the display unit 160. The display unit 160 displays the information about the distance to the subject S based on the video signal input from the control unit 150. The control unit 150 stores the information about the distance to the subject S in the storage unit 170.

[0121] The above description of the electronic device according to the seventh embodiment of the present technology can be applied to other embodiments of the present technology unless there is a particular technical contradiction.

[0122] 8. Eighth Embodiment of the Present Technology (Example 8 of Electronic Device) FIG. 22 is a block diagram showing a schematic configuration example of a vehicle control system, which is an example of a mobile body control system to which the present technology can be applied.

[0123] The vehicle control system 12000 includes a plurality of electronic control units connected via a communication network 12001. In the example shown in Fig. 22, the vehicle control system 12000 includes a drive system control unit 12010, a body system control unit 12020, an outside-vehicle information detection unit 12030, an inside-vehicle information detection unit 12040, and an integrated control unit 12050. Also shown as functional components of the integrated control unit 12050 are a microcomputer 12051, an audio / video output unit 12052, and an in-vehicle network I / F (interface) 12053.

[0124] The drivetrain control unit 12010 controls the operation of devices related to the drivetrain of the vehicle in accordance with various programs. For example, the drivetrain control unit 12010 functions as a control device for a drive force generating device for generating a drive force of the vehicle, such as an internal combustion engine or a drive motor, a drive force transmission mechanism for transmitting the drive force to the wheels, a steering mechanism for adjusting the steering angle of the vehicle, and a braking device for generating a braking force of the vehicle.

[0125] The body system control unit 12020 controls the operation of various devices equipped in the vehicle body according to various programs. For example, the body system control unit 12020 functions as a control device for a keyless entry system, a smart key system, a power window device, or various lamps such as headlamps, backup lamps, brake lamps, turn signals, and fog lamps. In this case, radio waves transmitted from a portable device that serves as a key or signals from various switches can be input to the body system control unit 12020. The body system control unit 12020 receives these radio waves or signals and controls the vehicle's door lock device, power window device, lamps, etc.

[0126] The outside-vehicle information detection unit 12030 detects information outside the vehicle equipped with the vehicle control system 12000. For example, a distance measurement device 12031 is connected to the outside-vehicle information detection unit 12030. The distance measurement device 12031 includes the distance measuring device 1 described above. The outside-vehicle information detection unit 12030 causes the distance measurement device 12031 to measure the distance to an object outside the vehicle (subject S) and acquires the distance data obtained thereby. The outside-vehicle information detection unit 12030 may perform object detection processing for people, cars, obstacles, signs, etc. based on the acquired distance data.

[0127] The in-vehicle information detection unit 12040 detects information inside the vehicle. For example, a driver state detection unit 12041 that detects the state of the driver is connected to the in-vehicle information detection unit 12040. The driver state detection unit 12041 includes, for example, a camera that captures an image of the driver, and the in-vehicle information detection unit 12040 may calculate the degree of fatigue or concentration of the driver based on the detection information input from the driver state detection unit 12041, or may determine whether the driver is dozing off.

[0128] The microcomputer 12051 can calculate control target values ​​for the driving force generating device, steering mechanism, or braking device based on the information inside and outside the vehicle acquired by the outside-vehicle information detection unit 12030 or the inside-vehicle information detection unit 12040, and output control commands to the drive system control unit 12010. For example, the microcomputer 12051 can perform cooperative control aimed at realizing the functions of an ADAS (Advanced Driver Assistance System), including vehicle collision avoidance or impact mitigation, following driving based on the distance between vehicles, maintaining vehicle speed, vehicle collision warning, vehicle lane departure warning, etc.

[0129] In addition, the microcomputer 12051 can perform cooperative control for the purpose of autonomous driving, which allows the vehicle to travel autonomously without relying on driver operation, by controlling the driving force generating device, steering mechanism, braking device, etc. based on information about the surroundings of the vehicle obtained by the outside vehicle information detection unit 12030 or the inside vehicle information detection unit 12040.

[0130] Furthermore, the microcomputer 12051 can output a control command to the body system control unit 12020 based on the information outside the vehicle acquired by the outside information detection unit 12030. For example, the microcomputer 12051 can control the headlamps according to the position of a preceding vehicle or an oncoming vehicle detected by the outside information detection unit 12030, and perform cooperative control aimed at preventing glare, such as switching from high beams to low beams.

[0131] The audio / video output unit 12052 transmits at least one of audio and video output signals to an output device capable of visually or audibly notifying information to vehicle occupants or the outside of the vehicle. In this example, the output devices are exemplified by an audio speaker 12061, a display unit 12062, and an instrument panel 12063. The display unit 12062 may include, for example, at least one of an on-board display and a head-up display.

[0132] 23 is a diagram showing an example of installation positions of distance measurement devices 12031 according to an embodiment of the present technology. In FIG. 23, a vehicle 12100 has distance measurement devices 12101, 12102, 12103, 12104, and 12105 as the distance measurement devices 12031.

[0133] Distance measuring devices 12101, 12102, 12103, 12104, and 12105 are provided, for example, at positions such as the front nose, side mirrors, rear bumper, back door, and the top of the windshield inside the vehicle cabin of vehicle 12100. Distance measuring device 12101 provided on the front nose and distance measuring device 12105 provided on the top of the windshield inside the vehicle cabin mainly acquire data ahead of vehicle 12100. Distance measuring devices 12102 and 12103 provided on the side mirrors mainly acquire data on the sides of vehicle 12100. Distance measuring device 12104 provided on the rear bumper or back door mainly acquires data behind vehicle 12100. The forward data acquired by distance measuring devices 12101 and 12105 is mainly used to detect preceding vehicles, pedestrians, obstacles, traffic lights, traffic signs, etc.

[0134] 23 shows an example of the detection ranges of the distance measuring devices 12101 to 12104. Detection range 12111 indicates the detection range of the distance measuring device 12101 provided on the front nose, detection ranges 12112 and 12113 indicate the detection ranges of the distance measuring devices 12102 and 12103 provided on the side mirrors, respectively, and detection range 12114 indicates the detection range of the distance measuring device 12104 provided on the rear bumper or back door.

[0135] For example, based on the distance data obtained from the distance measuring devices 12101 to 12104, the microcomputer 12051 can calculate the distance to each three-dimensional object within the detection ranges 12111 to 12114 and the change in this distance over time (relative speed with respect to the vehicle 12100), thereby extracting as a preceding vehicle, in particular, the three-dimensional object that is the closest three-dimensional object on the path of the vehicle 12100 and traveling in approximately the same direction as the vehicle 12100 at a predetermined speed (e.g., 0 km / h or higher). Furthermore, the microcomputer 12051 can set a vehicle-to-vehicle distance to be maintained in advance in front of the preceding vehicle, and perform automatic braking control (including follow-up stop control), automatic acceleration control (including follow-up start control), etc. In this way, cooperative control can be performed for the purpose of autonomous driving, which runs autonomously without relying on driver operation.

[0136] For example, based on the distance data obtained from the distance measuring devices 12101 to 12104, the microcomputer 12051 classifies and extracts three-dimensional object data regarding three-dimensional objects into two-wheeled vehicles, ordinary vehicles, large vehicles, pedestrians, utility poles, and other three-dimensional objects, and can use the data for automatic obstacle avoidance. For example, the microcomputer 12051 distinguishes obstacles around the vehicle 12100 into obstacles that are visible to the driver of the vehicle 12100 and obstacles that are difficult to see. The microcomputer 12051 then determines the collision risk, which indicates the risk of collision with each obstacle, and when the collision risk is equal to or greater than a set value and a collision is possible, the microcomputer 12051 can provide driving assistance for collision avoidance by outputting an alarm to the driver via the audio speaker 12061 or the display unit 12062, or by performing forced deceleration or avoidance steering via the drive system control unit 12010.

[0137] The above description of the electronic device according to the eighth embodiment of the present technology can be applied to other embodiments of the present technology unless there is a particular technical contradiction.

[0138] It should be noted that the embodiments of the present technology are not limited to the above-described embodiments, and various modifications are possible within the scope of the present technology. The specific numerical values, shapes, materials (including compositions), etc. described in each embodiment are merely examples, and the present technology is not limited to these.

[0139] The present technology can also have the following configurations. [1] A light-emitting device including a first substrate having a drive circuit; and a second substrate having a light-emitting unit driven by the drive circuit and mounted on one surface of the first substrate, wherein the first substrate has two or more electrically connected wiring layers, and some of the wiring layers adjacent in a thickness direction are arranged in a staggered pattern so as to cover at least a portion of the drive circuit when viewed in a plan view from the second substrate side. [2] A light-emitting device according to [1], wherein the staggered wiring layers are arranged near the second substrate. [3] A light-emitting device according to [1] or [2], wherein the second substrate, the staggered wiring layers, and the drive circuit are stacked. [4] A light-emitting device according to any one of [1] to [3], wherein the staggered wiring layers are arranged in an upper layer. [5] A light-emitting device according to any one of [1] to [4], wherein the staggered wiring layers are arranged in a lower layer. [6] The light-emitting device according to any one of [1] to [5], wherein the first substrate has three or more wiring layers arranged in a staggered pattern. [7] The light-emitting device according to any one of [1] to [6], wherein the wiring layers arranged in a staggered pattern are arranged to cover the entire driving circuit when viewed in a plan view from the second substrate side. [8] The light-emitting device according to any one of [1] to [7], wherein the wiring layer contains a material that blocks infrared rays. [9] The light-emitting device according to any one of [1] to [8], wherein the wiring layer contains at least one material selected from aluminum (Al), copper (Cu), tungsten (W), and gold (Au).

[10] The light-emitting device according to any one of [1] to [9], further comprising a light-shielding portion that shields at least a portion of the driving circuit from light emitted by the light-emitting portion.

[11] The light-emitting device according to

[10] , wherein the light-shielding portion is arranged on the second substrate side of the first substrate.

[12] The light-emitting element according to

[10] or

[11] , wherein the light-shielding portion is arranged in a ring shape along the outer periphery of the first substrate.

[13] The light-emitting device according to any one of [1] to

[12] , wherein the light-emitting unit has a vertical-cavity surface-emitting laser.

[14] The light-emitting device according to any one of [1] to

[13] , wherein the light emitted by the light-emitting unit is infrared.

[15] A light-emitting device comprising: a first substrate having a drive circuit; and a second substrate having a light-emitting unit driven by the drive circuit and mounted on one surface of the first substrate, wherein the first substrate has two or more wiring layers that are electrically connected, and when some of the wiring layers adjacent in a thickness direction are a first wiring layer and a second wiring layer, the second wiring layer is arranged to protrude from an end of the first wiring layer so as to cover at least a part of the drive circuit when viewed in a plan view from the second substrate side.

[16] A distance measuring device comprising: a light-emitting element; and a light-receiving element, wherein the light-emitting element comprises: a first substrate having a drive circuit; and a second substrate having a light-emitting portion driven by the drive circuit and mounted on one surface of the first substrate, wherein the first substrate has two or more wiring layers electrically connected to each other, wherein some of the wiring layers adjacent to each other in a thickness direction are arranged in a staggered pattern so as to cover at least a portion of the drive circuit when viewed in a plan view from the second substrate side, and the light-receiving element has a light-receiving portion that receives light emitted by the light-emitting portion.

[17] An electronic device comprising: a first substrate having a drive circuit; and a second substrate having a light-emitting portion driven by the drive circuit and mounted on one surface of the first substrate, wherein the first substrate has two or more wiring layers electrically connected to each other, wherein some of the wiring layers adjacent to each other in a thickness direction are arranged in a staggered pattern so as to cover at least a portion of the drive circuit when viewed in a plan view from the second substrate side.

[0140] REFERENCE SIGNS LIST 100 Light emitting element 10 First substrate 11 Substrate 12 Drive circuit 13 Wiring layer 131 First wiring layer 132 Second wiring layer 13a Upper layer 13b Lower layer 14 Pad electrode 15 Insulating layer 20 Second substrate 21 Light emitting portion 22 Bump electrode 30, 31 Light shielding portion 32 Dummy wiring layer 1 Distance measuring device L Return light

Claims

1. A light-emitting element comprising: a first substrate having a drive circuit; and a second substrate having a light-emitting section driven by the drive circuit and mounted on one surface of the first substrate, wherein the first substrate has two or more electrically connected wiring layers, and wherein adjacent portions of the wiring layers in the thickness direction are arranged in a staggered pattern so as to cover at least a portion of the drive circuit when viewed in a plan view from the second substrate side.

2. The light-emitting element according to claim 1, wherein the wiring layers arranged in a staggered pattern are arranged in the vicinity of the second substrate.

3. The light-emitting element according to claim 1, wherein the second substrate, the wiring layer arranged in a staggered pattern, and the drive circuit are laminated.

4. The light-emitting element according to claim 1, wherein the wiring layer arranged in a staggered pattern is arranged in an upper layer.

5. The light-emitting element according to claim 1, wherein the wiring layer arranged in a staggered pattern is arranged in a lower layer.

6. The light-emitting element according to claim 1, wherein the first substrate has three or more wiring layers arranged in a staggered pattern.

7. The light-emitting element according to claim 1, wherein the wiring layers arranged in a staggered pattern are arranged so as to cover the entire driving circuit when viewed in a plan view from the second substrate side.

8. The light-emitting element according to claim 1, wherein the wiring layer contains a material that is light-shielding to infrared rays.

9. The light-emitting element according to claim 1, wherein the wiring layer contains at least one material selected from the group consisting of aluminum (Al), copper (Cu), tungsten (W) and gold (Au).

10. The light-emitting element according to claim 1, further comprising a light-shielding section that shields at least a part of the drive circuit from the light emitted by the light-emitting section.

11. The light-emitting element according to claim 10, wherein the light-shielding portion is disposed on the first substrate on the side of the second substrate.

12. The light-emitting element according to claim 10, wherein the light-shielding portion is arranged in a ring shape along the outer periphery of the first substrate.

13. The light-emitting device according to claim 1, wherein the light-emitting portion comprises a vertical-cavity surface-emitting laser.

14. The light-emitting element according to claim 1, wherein the light emitted by the light-emitting portion is infrared light.

15. A light-emitting element comprising: a first substrate having a drive circuit; and a second substrate having a light-emitting portion driven by the drive circuit and mounted on one surface of the first substrate, wherein the first substrate has two or more wiring layers electrically connected to each other, and when some of the wiring layers adjacent in the thickness direction are a first wiring layer and a second wiring layer, the second wiring layer is arranged to protrude from an end of the first wiring layer so as to cover at least a portion of the drive circuit when viewed in a plane from the second substrate side.

16. A distance measuring device comprising: a light-emitting element; and a light-receiving element, wherein the light-emitting element comprises: a first substrate having a drive circuit; and a second substrate having a light-emitting portion driven by the drive circuit and mounted on one surface of the first substrate, wherein the first substrate has two or more wiring layers electrically connected to each other, and wherein some of the wiring layers adjacent in the thickness direction are arranged in a staggered pattern so as to cover at least a portion of the drive circuit when viewed in a plane from the second substrate side, and the light-receiving element has a light-receiving portion that receives light emitted by the light-emitting portion.

Images